WO2018096600A1

WO2018096600A1 - Surface mounting apparatus and levelness adjusting method for surface mounting apparatus

Info

Publication number: WO2018096600A1
Application number: PCT/JP2016/084666
Authority: WO
Inventors: 洋平岸本
Original assignee: ヤマハ発動機株式会社
Priority date: 2016-11-22
Filing date: 2016-11-22
Publication date: 2018-05-31
Also published as: JPWO2018096600A1; TWI661750B; TW201820967A; JP6831392B2

Abstract

A surface mounting apparatus 10 disclosed in the description of the present invention comprises: a back-up plate 51 on which a printed substrate P is placed, the printed substrate having an electronic component E mounted thereon; a height adjusting unit 64 which is provided so as to have a rotatable screw part 69, and which causes the screw part 69 to rotate to thereby adjust the levelness of the back-up plate 51 via a holding member 60; and a head unit 30 for mounting the electronic component E on the printed substrate P. The head unit 30 has a rotary shaft 33 capable of rotating in the same direction as the rotation of the screw part 69. An adjusting nozzle 80 which is capable of fitting with the screw part 69 of the height adjusting unit 64 can be mounted on the distal end of the rotary shaft 33. The adjusting nozzle 80 rotates the screw part 69 to adjust the levelness of the back-up plate 51.

Description

Surface mounter and method for adjusting level of surface mounter

The technology disclosed in this specification relates to a surface mounter and a method for adjusting the level of the surface mounter.

For example, as an electronic component mounting apparatus that performs an operation on a substrate positioned on a positioning portion on a base, a device described in Japanese Patent Application Laid-Open No. 2004-235518 (Patent Document 1 below) is known. In this electronic component mounting apparatus, before starting the mounting operation, an operator operates the horizontal adjustment mechanisms provided at the four corners of the base so that the upper surface of the base is adjusted to be horizontal.

JP 2004-235518 A

However, according to the above-described electronic component mounting apparatus, since the operator manually adjusts the base, there is a difference in adjustment caused by the operator and a burden on the operator.

This specification discloses a technique for eliminating the difference in adjustment by the worker and reducing the burden on the worker.

The technology disclosed in this specification is provided in a state having a backup plate on which a substrate on which an electronic component is mounted is placed, and a rotation operation unit that can be rotated, and by rotating the rotation operation unit, A surface mounter including an adjustment member for adjusting the level of a backup plate and a head unit for mounting the electronic component on the substrate, wherein the head unit rotates in the same direction as the rotation of the rotation operation unit. A rotatable shaft, and an engaging member that is detachably provided at the tip of the rotating shaft and is engageable with the rotation operation portion of the adjusting member, and by rotating the rotating shaft, The rotation operation unit is rotated by the engaging member to adjust the level of the backup plate.

Further, the technology disclosed in this specification is provided in a state having a backup plate on which a substrate on which an electronic component is mounted is placed and a rotation operation unit capable of rotation operation, and rotates the rotation operation unit. A method for adjusting the level of a surface mounter comprising: an adjustment member that adjusts the level of the backup plate; and a head unit that mounts the electronic component on the substrate, wherein the head unit includes the rotation operation unit. An engagement member that can be engaged with the rotation operation portion of the adjustment member is attached to the tip of a rotation shaft that can rotate in the same direction as the rotation of the rotation shaft, and the rotation member rotates the rotation shaft to rotate the rotation member. The level of the backup plate is adjusted by rotating the operation unit.

According to the surface mounter and the leveling adjustment method configured as described above, by attaching the engaging member to the rotating shaft, the rotating operation portion of the adjusting member can be rotated by the engaging member as the rotating shaft rotates. Therefore, the level of the backup plate can be adjusted without the operator operating the rotation operation unit. Thereby, it can suppress that the difference of the adjustment resulting from an operator arises, and can reduce the burden that an operator adjusts the level of the backup plate.

The surface mounter disclosed in this specification may have the following configuration.
The rotation operation unit and the engagement member may be configured to engage with each other by engaging the protrusions in the direction in which the axis of the rotation operation unit extends.
According to such a configuration, the rotation operation portion and the engagement member are fitted to the concave and convex portions, so that the rotation operation portion can be reliably rotated by the mounting head and the level of the backup plate can be adjusted.

And a control unit having a memory for storing data, wherein the control unit rotates the rotation operation unit when the level of the backup plate exceeds an allowable level of level stored in the memory. It is good also as a structure which adjusts the levelness of the said backup plate by doing.

According to such a configuration, the control plate adjusts the level of the backup plate until the level of the backup plate does not exceed the allowable level. That is, since the control plate automatically adjusts the level of the backup plate, the burden on the operator can be reduced.

The rotating shaft is provided with a supply path for supplying a negative pressure or a positive pressure for holding or releasing the electronic component, and the supply path is closed by the backup plate, so that the backup plate is horizontal. It is good also as a structure which measures a degree.

According to such a configuration, the level of the backup plate is measured based on the fact that the supply path of the mounting head is blocked by the backup plate and the supply pressure of the negative pressure or the positive pressure is changed. Can be adjusted. That is, since the entire flow from the measurement of the level to the adjustment of the level can be automated, the burden on the operator can be further reduced.

The engaging member may have an insertion path in which one end communicates with the supply path and the other end is closed by the backup plate when contacting the backup plate.

According to such a configuration, since the insertion path is provided in the engagement member, both the measurement of the level and the operation of the rotation operation unit can be performed by the engagement member. Thereby, work efficiency can be improved compared with the case where the member for level measurement and the engaging member for rotation operation parts are replaced, and a backup plate is adjusted horizontally.

According to the technique disclosed in this specification, it is possible to eliminate the difference in adjustment by the worker and reduce the burden on the worker.

The top view of the surface mounter concerning an embodiment Front view showing a state where the component mounting apparatus is viewed from the front Front view of the head unit and the backup unit showing a state in which the adjustment nozzle is arranged above the height adjustment unit Side view of the head unit and the backup unit showing a state in which the adjustment nozzle is disposed above the height adjustment unit AA line sectional view of FIG. BB sectional view of FIG. Top view of backup unit Front view of the head unit and the backup unit showing a state in which the screw portion of the height adjustment unit and the adjustment nozzle are fitted together Side view of head unit and backup unit showing a state in which the screw part of the height adjustment part and the adjustment nozzle are fitted together Front view of the adjustment nozzle attached to the lower end of the rotating shaft Side view of adjustment nozzle Bottom view of adjustment nozzle Front view of the head unit and backup unit showing the state where the adjustment nozzle is in contact with the upper surface of the backup plate Block diagram showing the electrical configuration of the surface mounter Flow chart of horizontal adjustment process

<Embodiment>
An embodiment of the technology disclosed in this specification will be described with reference to FIGS.
The present embodiment exemplifies a surface mounter 10 that mounts an electronic component E on a printed circuit board (an example of a “board”) P. As shown in FIG. 1, the surface mounter 10 mounts a base 11 having a substantially rectangular shape in plan view, a conveyor 12 for transporting the printed board P on the base 11, and an electronic component E on the printed board P. A component mounting apparatus 20 for supporting the printed circuit board P at the mounting position, and a component supply apparatus 14 for supplying the electronic component E to the component mounting apparatus 20.

In the following description, the horizontal direction is based on the horizontal direction in FIG. 1 (the long side direction of the base 11 and the conveyance direction of the conveyor 12) and the horizontal direction in FIG. Further, the front-rear direction is based on the up-down direction (short side direction of the base 11) in FIG. 1 and the left-right direction in FIG. 4, and in FIG. In the explanation, the left side in the figure is the front side and the right side in the figure is the rear side.

As shown in FIG. 1, the base 11 is a base on which the conveyor 12, the component mounting apparatus 20, the backup unit 50, and the like are arranged.

As shown in FIG. 1, the transport conveyor 12 is disposed at a substantially central portion in the front-rear direction of the base 11 and transports the printed circuit board P along the left-right direction. The conveyor 12 includes a pair of conveyor belts 13 that are circulated and driven in the left-right direction, and a printed circuit board P is set on the pair of conveyor belts 13 so as to be installed. The printed circuit board P is loaded onto the backup unit 50 along the conveyor belt 13 from the right side in the left-right direction, and after the electronic component E is mounted, it is carried out along the conveyor belt 13 to the left side in the left-right direction. The

As shown in FIG. 1, the component supply device 14 is a feeder type, and two parts are arranged in the left-right direction on both sides in the up-down direction of the conveyor 12, so that the parts supply device 14 is arranged in a total of four locations. A plurality of feeders 16 are attached to these component supply devices 14 so as to be aligned in the left-right direction. Each feeder 16 includes an unillustrated electric delivery device that pulls out a component supply tape containing a plurality of electronic components E from a reel, and the electronic components E are fed from the end of each feeder 16 on the side of the conveyor 12. Supplied one by one.

As shown in FIG. 1, the component mounting apparatus 20 includes a pair of support frames 21 disposed on both sides in the left-right direction of the base 11, a head unit 30, and a head driving device 22 that moves the head unit 30. Configured. Each support frame 21 has an elongated shape extending in the front-rear direction, and is disposed on both sides of the base 11 in the left-right direction.

The head drive device 22 has a Y-axis servo mechanism 23 and an X-axis servo mechanism 27 and is provided so as to be installed on a pair of support frames 21.

As shown in FIG. 1, the Y-axis servo mechanism 23 is provided at a pair of Y-axis guide rails 24 provided along the support frames 21 in the form extending in the left-right direction, and at the end of the Y-axis guide rail 24. The Y-axis servomotor 25 is attached to the pair of Y-axis guide rails 24, and a head support 26 is attached to the pair of Y-axis guide rails 24.

When the Y-axis servo motor 25 is energized and controlled, the head support 26 and the head unit 30 attached to the head support 26 move in the front-rear direction along the Y-axis guide rail 24.

As shown in FIG. 2, the X-axis servo mechanism 27 includes an X-axis guide rail 29 provided on the head support 26 in a form extending in the left-right direction, and an X-axis provided on the end of the X-axis guide rail 29. And a servo motor 28. A head unit 30 is attached to the X-axis guide rail 29 so as to be movable in the left-right direction. When the X-axis servo motor 28 is energized and controlled, the head unit 30 moves to the left and right along the X-axis guide rail 29. It is designed to move in the direction.

Thus, the head unit 30 is movable on the base 11 in the horizontal direction, which is the front / rear / right / left direction.

The head unit 30 takes out the electronic component E supplied on the base 11 from the component supply device 14 and mounts it on the printed circuit board P. As shown in FIGS. 1 to 3, the head unit 30 has a box shape. The head unit main body 31 and a plurality of mounting heads 32 for performing the mounting operation of the electronic component E are provided.

As shown in FIGS. 2 and 3, the plurality of mounting heads 32 are arranged side by side in the left-right direction so as to protrude downward from the head unit main body 31, and each mounting head 32 is a rotating shaft extending in the vertical direction. 33, and a suction nozzle 34 that can be attached to and detached from the lower end that is the tip of the rotary shaft 33.

A Z-axis servo motor 31A and an R-axis servo motor 31B provided in the head unit main body 31 are attached to the rotary shaft 33, and the rotary shaft 33 can be moved up and down by the Z-axis servo motor 31A. At the same time, the R-axis servomotor 31B can rotate around the axis about the axis 33A of the rotary shaft 33 extending in the vertical direction.

As shown in FIGS. 3 and 10, a pair of sandwiching portions 36 that can be opened and closed on both sides in the left-right direction around a pair of shaft portions 35 and a pair of sandwiching portions 36 are brought close to each other at the lower end of the rotating shaft 33. A pair of leaf springs 37 that are urged in the direction are provided, and the suction nozzle 34 is pushed and held between the pair of sandwiching portions 36 from below.

As shown in FIGS. 3 and 8, the suction nozzle 34 is configured to have a flange portion 39 at a substantially central portion in the vertical direction of a cylindrical nozzle body 34 A that extends vertically. An upper end portion of the suction nozzle 34 is a head 40 that is sandwiched between a pair of sandwiching portions 36 of the rotary shaft 33, and the head 40 is sandwiched between the pair of sandwiching portions 36, whereby the rotary shaft 33. The suction nozzle 34 is held and fixed to the lower end of the nozzle.
An air passage (not shown) that communicates with a supply passage 38 provided in the rotary shaft 33 is provided in the nozzle body 34A. Negative pressure or positive pressure is supplied to the air passage from an air supply device (not shown) connected to the supply passage 38 of the rotary shaft 33, and the suction nozzle 34 holds the electronic component E by the negative pressure. The electronic component E is released by positive pressure.

Therefore, with the suction nozzle 34 holding the electronic component E, the rotary shaft 33 rotates to one side in the axial direction or the other side in the axial direction, thereby positioning the electronic component E at a position corresponding to the printed circuit board P. Can be done.

In other words, in the surface mounter 10, by driving various servo motors, the suction of the electronic component E supplied from the component supply device 14 and the mounting of the electronic component E on the printed circuit board P are controlled to be in an optimal position. The

As shown in FIG. 2, the component mounting apparatus 20 is provided with a board recognition camera 20A that moves together with the head unit 30, and the board recognition camera 20A takes an image of the printed board P and images the printed board P. It comes to recognize. Further, as shown in FIG. 1, a pair of component recognition cameras 15 are installed on both sides in the front-rear direction of the conveyor 12 on the base 11, and the pair of component recognition cameras 15 are mounted heads of the head unit 30. The electronic component E sucked and held at the tip of 32 is photographed.

The backup unit 50 is for backing up the printed circuit board P when the electronic component E is mounted on the printed circuit board P. As shown in FIG. Has been placed.

Further, as shown in FIGS. 3, 4, and 7, the backup unit 50 has a horizontally long box shape, and includes a backup plate 51 that holds the printed circuit board P at the mounting position, and a backup plate 51. A flat holding member 60 provided below and a flat support member 70 disposed further below the holding member 60 are provided.

The backup plate 51 is made of metal and is placed on the holding member 60. The upper plate 52 on which the printed circuit board P is placed and the plan view disposed below the upper plate 52 are omitted. A rectangular flat plate-like lower plate 53 is provided.

As shown in FIGS. 5 and 7, the upper plate 52 is thinner than the lower plate 53 and has a substantially rectangular flat plate shape having substantially the same dimensions as the lower plate 53. The upper surface 52A of the upper plate 52 is set to have high flatness, and the upper surface 52A of the upper plate 52 has a state in which a small suction hole 54 that allows air to pass through the upper plate 52 in the vertical direction. It is provided side by side in front, back, left and right.

As shown in FIG. 5, a fastening portion 55 to which a fixing screw 56 can be tightened from below is projected downward on the lower surface 52 B of the upper plate 52. The upper plate 52 and the lower plate 53 are fixed to each other by tightening a fixing screw 56 penetrating the lower plate 53 from below.

In addition, a support frame 57 that protrudes downward is provided on the outer peripheral edge of the upper plate 52 over the entire circumference, and the protrusion size of the support frame 57 is substantially the same as that of the fastened portion 55. Yes.

Therefore, when the upper plate 52 and the lower plate 53 are fixed to each other, as shown in FIG. 5, the upper plate 52 is disposed at a position away from the lower plate 53. A negative pressure supply space 58 to which a negative pressure is supplied from a negative pressure supply source (not shown) is formed between the plate 53 and the plate 53. When a negative pressure is supplied to the negative pressure supply space 58, a negative pressure is supplied to each suction hole 54, so that the printed circuit board P placed on the upper plate 52 is negatively pressured by the backup plate 51. It is designed to be held and fixed.

The holding member 60 is made of metal and is formed in a substantially rectangular flat plate shape slightly larger in the left-right direction than the backup plate 51 as shown in FIG. 7, and as shown in FIGS. 3 and 4, the backup plate The upper holding member 61 on which 51 is placed and the lower holding member 62 arranged below the upper holding member 61 are configured.

The upper holding member 61 has a substantially rectangular flat plate shape, and is fixed to the lower plate 53 and the lower holding member 62 of the backup plate 51 by fixing bolts (not shown).

The lower holding member 62 is formed in a substantially rectangular flat plate having substantially the same size as the upper holding member 61. As shown in FIG. 7, the lower holding member 62 includes a spherical plain bearing portion 63 provided at a substantially central portion in the left-right direction at the rear edge portion 62 A of the lower holding member 62 with respect to the support member 70. The holding member 62 is supported at three locations with a pair of height adjusting portions (an example of a “height adjusting portion”) 64 provided at both ends of the front edge 62B of the holding member 62 in the left-right direction.

The support member 70 is configured such that a substantially rectangular flat plate-like support plate 73 is supported and fixed above support pillars 72 provided at the four corners of a substantially rectangular support base 71, as shown in FIGS. 4 and 5. As shown in FIG. 4, the spherical plain bearing portion 63 is disposed at a substantially central portion in the left-right direction at the rear edge portion 73 A of the support plate 73, and as shown in FIG. 4 and FIG. A pair of height adjustment portions 64 are disposed at the end portions of the two.

As shown in FIG. 5, the spherical plain bearing portion 63 includes a spherical inner ring portion 75 fixed to the support plate 73 by bolts 74 and an outer ring portion 65 provided on the spherical inner ring portion 75 so as to be freely movable. ing.

The spherical inner ring portion 75 is made of metal and is formed in a substantially cylindrical shape having a convex spherical outer peripheral surface 75 A, and a bolt 74 is inserted into the spherical inner ring portion 75 and tightened to the support member 70. The spherical inner ring portion 75 is fixed to the upper surface 73 C of the support plate 73 in the support member 70.

The outer ring portion 65 is formed in a substantially cylindrical shape with an inner circumferential surface 65A having a concave spherical shape. The outer ring portion 65 is fixed in a recessed portion 66 that is recessed in the lower holding member 62 of the holding member 60, and the spherical inner ring portion 75 is held in the outer ring portion 65 in a slidable state. Yes.

Therefore, the holding member 60 can swing with respect to the support member 70 around the spherical plain bearing portion 63, and can take an inclined posture as well as a parallel posture with respect to the support member 70. ing.

On the other hand, each of the pair of height adjusting portions 64 adjusts the height dimension of the holding member 60 with respect to the support member 70 in minute units, and as shown in FIGS. 3, 4, and 6, It is provided in the shape of a bolt that is long in the vertical direction.

Each height adjustment portion 64 is provided so as to penetrate the holding member 60 in the vertical direction, which is the thickness direction of the holding member 60, and a pedestal in which the lower end portion of the height adjustment portion 64 is provided on the support member 70. The part 77 is in contact with the part 77 from above.

Further, the height adjusting portion 64 is configured such that the contact portion 68 protrudes downward from the lower end portion of the main body portion 67 fixed to the holding member 60. The abutting portion 68 is a screw portion (an example of a “rotating operation portion”) 69 that protrudes from the upper end portion of the main body portion 67 and is an axial center 69B of the screw portion 69 shown in FIGS. , The contact portion 68 gradually protrudes downward from the main body portion 67, and the screw portion 69 is rotated to the other side in the axial direction. Gradually stored.

On the other hand, as shown in FIG. 6, the pedestal portion 77 is configured such that a contact plate 79 is fitted from above into a support recess 78 provided in the support plate 73. The upper surface 79A is a flat surface with high flatness with which the contact portion 68 contacts from above.

Therefore, by rotating the screw portion 69 of each height adjusting portion 64 and adjusting the projecting dimension of the abutting portion 68, the holding member 60 and thus the upper plate 52 of the backup plate 51 are supported with the spherical plain bearing portion 63 as a fulcrum. Can be finely adjusted.

Further, as shown in FIG. 6, a biasing member 90 that biases the lower holding member 62 of the holding member 60 and the support plate 73 in a direction approaching each other is provided on the side of the height adjusting unit 64 and the base 77. Is installed.

The urging member 90 is a coil-shaped tension spring, and one end of the urging member 90 is hooked on a holding side hook portion 62 C provided on the lower holding member 62, and the other end is provided on the support plate 73. It is mounted between the lower holding member 62 and the support plate 73 by being hooked on the support side hook portion 73D.
That is, the holding member 60 is biased and held so as not to float upward with respect to the support member 70, and the set state of the height dimension adjusted by the height adjusting unit 64 is stably held. It has become.

Now, as shown in FIGS. 4, 6, and 7, a notch groove 69 A that is recessed downward is provided on the upper surface of the screw portion 69 of the height adjusting portion 64 in the backup unit 50. An example of an adjustment nozzle (an example of an “engagement member”) that can be fitted into the lower end portion of the rotation shaft 33 in the vertical direction (the extending direction of the axis 69B of the screw portion 69) with respect to the notch groove 69A of the screw portion 69. 80) can be mounted.

As shown in FIG. 6, the notch groove 69 A is configured to be linearly recessed so as to pass through the axis 69 B of the screw portion 69.

On the other hand, as shown in FIGS. 3 and 10, the adjustment nozzle 80 has an upper half including the flange portion 81 having the same form as the suction nozzle 34, and a head 82 provided at the upper end of the nozzle body 80A. Is sandwiched between the pair of sandwiching portions 36 of the rotating shaft 33, so that it can be attached to the lower end portion of the rotating shaft 33.

As shown in FIGS. 10 to 12, the lower portion of the adjustment nozzle 80 than the flange portion 81 is a flat plate-like fitting piece portion 83, and this fitting piece portion 83 is a notch groove 69 A of the screw portion 69. On the other hand, the threaded portion 69 and the adjustment nozzle 80 are engaged with each other by engaging the concave and convex portions from above.

Then, as shown in FIGS. 8 and 9, the fitting piece portion 83 of the adjustment nozzle 80 attached to the lower end portion of the rotating shaft 33 is fitted into the notch groove 69 A in the screw portion 69 of the height adjustment portion 64. By rotating the rotary shaft 33 around the axis by the R-axis servo motor 31B, the height adjustment unit 64 can adjust the height of the left and right ends of the holding member 60 with respect to the support member 70. Yes.

In other words, the operator does not rotate the screw portion 69 of the height adjusting portion 64, and the screw portion 69 of the height adjusting portion 64 is made the same as the rotating shaft 33 by the adjusting nozzle 80 attached to the rotating shaft 33 of the head unit 30. The inclination angle of the backup plate 51 can be adjusted by rotating in the direction.

Further, as shown in FIGS. 10 to 12, the adjustment nozzle 80 is provided with an insertion passage 84 penetrating in the vertical direction, and when the adjustment nozzle 80 is attached to the lower end portion of the rotary shaft 33, FIG. As shown in FIG. 13, the supply path 38 of the rotary shaft 33 and the insertion path 84 of the adjustment nozzle 80 are set to communicate with each other.

The insertion path 84 is provided with a diameter larger than the thickness of the fitting piece 83 from a position slightly above the lower end of the flange 81 to the head 82, and the fitting piece extends from the lower end of the flange 81. The lower end portion of the portion 83 is provided with a smaller diameter than the thickness of the fitting piece portion 83. When negative pressure or positive pressure is supplied to the supply path 38 of the rotating shaft 33, negative pressure or positive pressure is supplied to the lower end opening 80 B of the adjustment nozzle 80.

Next, the electrical configuration of the surface mounter 10 will be described with reference to FIG.
The entire surface mounter 10 is controlled and controlled by the control unit 110. The control unit 110 includes an arithmetic processing unit 111 configured with a CPU or the like, and a memory 112.

The memory 112 stores various programs such as a mounting program executed by the arithmetic processing unit 111 and a backup unit adjustment program, and various types of data such as a horizontality allowable value that is a horizontal level allowable value of the backup plate 51. The memory 112 stores data acquired by various programs.

The arithmetic processing unit 111 controls the surface mounting machine 10 according to various programs stored in the memory 112, and drives the conveyor 12 and the component mounting apparatus 20 according to the mounting process by the mounting program, for example, and also supplies the component supply apparatus 14 Control each feeder 16 attached to the.

In addition, the arithmetic processing unit 111 receives the imaging signals output from the board recognition camera 20A and the component recognition camera 15, respectively, and performs the analysis of the component image and the analysis of the board image based on the imaging signal.

Further, the arithmetic processing unit 111 executes a backup unit adjustment program for leveling the backup plate 51 in the backup unit 50 before starting the mounting process of the electronic component E by the mounting program. A horizontal adjustment process is performed to level the upper surface 52A of 52.

Hereinafter, the horizontal adjustment processing of the backup plate 51 will be described with reference to the flowchart shown in FIG.

In the horizontal adjustment process, in order to measure the level of the backup plate 51 in the backup unit 50 arranged on the base 11, first, the head unit 30 is moved in the X and Y directions, and any of the four corners of the backup plate 51 is selected. It arrange | positions above the corner (S11). In the adjustment nozzle 80, the suction nozzle 34 attached to the lower end portion of the rotary shaft 33 is previously replaced by a nozzle exchange device (not shown).

Next, while supplying a negative pressure to the lower end opening 80B of the adjustment nozzle 80, the rotary shaft 33 is lowered to bring the lower end portion of the fitting piece portion 83 of the adjustment nozzle 80 into contact with the backup plate 51 from above. Then, the lower end opening 80B of the adjustment nozzle 80 is closed by the upper surface 52A of the upper plate 52 in the backup plate 51, and when the negative pressure is no longer leaked, the height position of the backup plate 51 is adjusted based on the descending amount of the rotary shaft 33. taking measurement.

Then, all the height positions of the four corners (four measurement points) of the backup plate 51 are measured, and the height positions of the pair of height adjustment units 64 are calculated based on the height positions at the four measurement points ( S12).

Then, it is confirmed whether or not the deviation amount, which is the difference between the height positions of the pair of height adjustment units 64, exceeds the allowable horizontality value stored in the memory 112 (S13).

When the calculated deviation amount does not exceed the allowable horizontality value (S13: NO), the backup plate 51 is assumed to be horizontal, and the horizontal adjustment process is terminated.

On the other hand, when the amount of deviation exceeds the allowable level of horizontality (S13: YES), the screw part 69 of the pair of height adjustment parts 64 is rotated by the adjustment nozzle 80, and the deviation between the pair of height adjustment parts 64 is achieved. The amount is adjusted (S14).

Then, S12 to S14 are repeatedly executed, and the shift amount is adjusted until the shift amount between the pair of height adjustment units 64 does not exceed the allowable horizontality value.

Specifically, as shown in FIG. 7, in the (X, Y, Z) coordinate system in which the position of the spherical plain bearing portion 63 is the origin (P0 (X_0, Y_0, Z_0)), a pair of height adjusting portions 64 positions are M1 (X_1, Y_1, Z_1) and M2 (X_2, Y_2, Z_2), and four measurement points of the backup plate 51 for height measurement are PA (X_A, Y_A, Z_A), PB (X_B, Y_B, Z_B), PC (X_C, Y_C, Z_C), and PD (X_D, Y_D, Z_D).
Then, the plane of the (X, Y, Z) coordinate system can be expressed by the following equation (1). In addition, the position of each X and Y is fixed, and only the height which is Z changes.

aX + bY + cZ + d = 0 (1)
Then, a, b, c, and d can be obtained from Equations (2) to (5), and the height position of the pair of height adjustment units 64 is calculated by Equations (6) and (7). it can.

a = (Y_B-Y_A) × (Z_C-Z_A) − (Y_C-Y_A) × (Z_B-Z_A) (2)
b = (Z_B-Z_A) × (X_C-X_A) − (Z_C-Z_A) × (X_B-X_A) (3)
c = (X_B-X_A) * (Y_C-Y_A)-(X_C-X_A) * (Y_B-Y_A) (4)
d =-(a × X_A + b × A_Y + c × Z_A) (5)
Z_1 =-(a × X_1 + b × Y_1 + d) ÷ c (6)
Z_2 =-(a × X_2 + b × Y_2 + d) ÷ c (7)

Then, the difference between Z_1 and Z_2 is calculated as a deviation amount Zd. When the deviation amount Zd exceeds the allowable level of horizontality, M1 (X_1, Y_1, Z_1) is obtained by the equations (8) and (9). The adjustment amount Zm1 of the height adjustment unit 64 at the height adjustment unit 64 and the adjustment amount Zm2 of the height adjustment unit 64 at M2 (X_2, Y_2, Z_2) are calculated.

Zm1 = Z_1-Z_0 (8)
Zm2 = Z_2-Z_0 (9)
Further, the memory 112 stores the protrusion amount of the contact portion 68 when the screw portion 69 of each height adjustment portion 64 is rotated once, and the adjustment amount of Zm1 and Zm2 is stored as one screw portion 69. By dividing by the protrusion amount of the contact portion 68 per rotation, the rotation amount of the screw portion 69 in each height adjustment portion 64 is calculated.

Then, by rotating the screw portion 69 of each height adjustment unit 64 by the calculated rotation amount, the pair of height adjustment units 64 are adjusted quickly and accurately.
Thereby, the adjustment of the level of the backup plate 51 is performed quickly and accurately, and it is possible to suppress the difference in adjustment caused by the operator, and the operator adjusts the height of the backup plate 51. The burden can be reduced.

When the horizontal adjustment processing of the backup plate 51 by the backup unit adjustment program is completed, the printed circuit board P is carried onto the backup unit 50 by the conveyor 12 and the mounting operation of the electronic component E is performed by the component mounting apparatus 20. Is done.

As described above, according to the present embodiment, the notched grooves 69A are provided in the threaded portions 69 of the pair of height adjusting portions 64, and the notched grooves 69A are formed in the lower end portion of the rotary shaft 33 in the head unit 30 of the component mounting apparatus 20. The adjustment nozzle 80 that can be fitted to the concave and convex portions is mounted, and the screw portion 69 can be rotated by the adjustment nozzle 80 by rotating the rotary shaft 33 around the axis. Without adjusting the level, the level of the backup plate 51 can be automatically adjusted quickly and accurately by the controller 110 of the surface mounter 10.

That is, it is possible to suppress the occurrence of the adjustment difference caused by the operator, and to reduce the burden of the operator adjusting the height of the backup plate 51.

Further, according to the present embodiment, the height adjustment of the backup plate 51 is automatically performed repeatedly until the level of the backup plate 51 does not exceed the allowable level of horizontality. As compared with the case where the operator checks the level every time the adjustment is performed, the burden on the operator can be further reduced.

Furthermore, according to the present embodiment, since the insertion passage 84 that communicates with the supply passage 38 of the rotary shaft 33 is provided in the adjustment nozzle 80, the surface mounter 10 is not required to be separately measured by the operator. The control unit 110 can measure the level of the backup plate 51 while performing the measurement of the level of the backup plate 51 and the level adjustment with the single adjustment nozzle 80.

That is, for example, the leveling adjustment nozzle and the leveling measurement nozzle are respectively replaced to adjust the leveling of the backup plate, or the leveling adjustment leveling nozzle and the leveling measurement are adjusted to two rotating shafts. Compared with the case where the measuring nozzle is attached, the working time of the horizontal adjustment process can be shortened and the working efficiency can be improved.

<Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described with reference to the above description and drawings, and includes, for example, the following various aspects.

(1) In the above embodiment, a single spherical plain bearing portion 63 and a pair of height adjusting portions 64 are provided between the holding member 60 and the support member 70. However, the present invention is not limited to this, and a configuration in which three or more height adjusting portions are provided between the holding member and the supporting member may be provided, and the height adjusting portion is formed between the holding member and the supporting member. May be.

(2) In the above embodiment, the threaded portion 69 is provided with the notch groove 69A, and the lower end portion of the adjustment nozzle 80 is configured as the fitting piece portion 83 that can be fitted into the notch groove 69A from above. However, the present invention is not limited to this, such as a configuration in which a plurality of clamping pieces are provided at the lower end portion of the adjustment nozzle and the screw portion is clamped by the plurality of clamping pieces, so that the lower end portion of the adjustment nozzle can rotate the screw portion. Any configuration that can be engaged with the screw portion is acceptable.

(3) In the above embodiment, a plurality of mounting heads 32 are arranged in the head unit 30 in the left-right direction. However, the present invention is not limited to this, and the head unit may be configured as a so-called rotary head in which mounting heads are arranged in a circle.

10: surface mounter 30: head unit 33: rotating shaft 34: suction nozzle 38: supply path 51: backup plate 64: height adjustment unit (an example of “adjustment member”)
69: Screw part (an example of a “rotation operation part”)
80: Adjustment nozzle (an example of an “engagement member”)
84: Insertion passage 110: Control unit 112: Memory E: Electronic component P: Printed circuit board (an example of “board”)

Claims

A backup plate on which a substrate for mounting electronic components is placed;
An adjustment member which is provided in a state having a rotation operation unit capable of rotating operation, and adjusts the level of the backup plate by rotating the rotation operation unit;
A surface mounting machine comprising a head unit for mounting the electronic component on the substrate,
The head unit includes a rotation shaft that can rotate in the same direction as the rotation of the rotation operation unit, and an engagement member that is detachably provided at a tip of the rotation shaft and that can be engaged with the rotation operation unit of the adjustment member. And
A surface mounting machine that adjusts the level of the backup plate by rotating the rotary operation unit by the engaging member by rotating the rotary shaft.
2. The surface mounter according to claim 1, wherein the rotation operation unit and the engagement member are engaged by engaging with each other in a direction in which an axis of the rotation operation unit extends.
Furthermore, it has a control unit having a memory for storing data,
The control unit adjusts the level of the backup plate by rotating the rotation operation unit when the level of the backup plate exceeds an allowable level of level stored in the memory. The surface mounter according to claim 1 or 2.
The rotating shaft is provided with a supply path for supplying a negative pressure or a positive pressure for holding or releasing the electronic component,
The surface mounter according to claim 1, wherein the level of the backup plate is measured by closing the supply path with the backup plate.
5. The surface according to claim 4, wherein the engagement member has an insertion path in which one end communicates with the supply path and the other end is closed by the backup plate when contacting the backup plate. Mounting machine.
A backup plate on which a substrate for mounting electronic components is placed;
An adjustment member which is provided in a state having a rotation operation unit capable of rotating operation, and adjusts the level of the backup plate by rotating the rotation operation unit;
A method for adjusting the level of a surface mounter comprising a head unit for mounting the electronic component on the substrate,
The head unit mounts an engaging member that can be engaged with the rotation operation portion of the adjustment member at a tip of a rotation shaft that can rotate in the same direction as the rotation of the rotation operation portion, and rotates the rotation shaft. The method of adjusting the level of the surface mounter, wherein the leveling of the backup plate is adjusted by rotating the rotation operation portion by the engaging member.