TW201820967A - Surface mounting apparatus and levelness adjusting method for surface mounting apparatus - Google Patents

Abstract

A surface mounting apparatus 10 disclosed in the description of the present invention comprises: a back-up plate 51 on which a printed substrate P is placed, the printed substrate having an electronic component E mounted thereon; a height adjusting unit 64 which is provided so as to have a rotatable screw part 69, and which causes the screw part 69 to rotate to thereby adjust the levelness of the back-up plate 51 via a holding member 60; and a head unit 30 for mounting the electronic component E on the printed substrate P. The head unit 30 has a rotary shaft 33 capable of rotating in the same direction as the rotation of the screw part 69. An adjusting nozzle 80 which is capable of fitting with the screw part 69 of the height adjusting unit 64 can be mounted on the distal end of the rotary shaft 33. The adjusting nozzle 80 rotates the screw part 69 to adjust the levelness of the back-up plate 51.

Description

Surface mounting machine and level adjustment method of surface mounting machine

The technology disclosed in this specification relates to a surface mounting machine and a method for leveling the surface mounting machine.

For example, as an electronic component mounting apparatus that operates a substrate positioned on a positioning portion on a base, there is known a device described in Japanese Patent Laid-Open No. 2004-235518 (Patent Document 1 below). Before the electronic component mounting device starts to be installed and operated, an operator operates a level adjustment mechanism provided at four corners of the base table, and adjusts such that the upper surface of the base table becomes horizontal. [Preceding Technical Documents] [Patent Documents] [Patent Documents 1] Japanese Patent Laid-Open No. 2004-235518

[Problems to be Solved by the Invention] In addition, according to the above-mentioned device for mounting electronic parts, the operator adjusts the abutment by manual operation, which causes a difference in adjustment caused by the operator, and places a burden on the operator. In this specification, a technique is disclosed that eliminates the difference in adjustment caused by the operator and reduces the burden on the operator. [Technical means to solve the problem] The technology disclosed in this specification is a surface mounting machine including: a back plate on which a substrate for mounting electronic parts is mounted; and an adjustment member provided as a rotary operation part capable of rotating operation State, and adjust the level of the back plate by rotating the rotation operation portion; and a head unit that mounts the electronic component on the substrate; the head unit includes a rotation shaft that can be rotated toward the rotation operation portion The rotation direction is the same as the rotation direction; and the fastening member is detachably provided at the front end of the rotation shaft and can be fastened to the rotation operation portion of the adjustment member; the rotation shaft is used to utilize the above The engaging member rotates the rotation operation portion to adjust the level of the back plate. In addition, the technology disclosed in the present specification is a level adjustment method of a surface mounting machine including a back plate on which a substrate for mounting electronic components is mounted, and an adjustment member provided with a rotation capable of rotating operation. The state of the operation unit, and the level of the back plate is adjusted by rotating the rotation operation unit; and a head unit that mounts the electronic component on the substrate; the head unit is provided to the The front end of the rotating shaft rotating in the same direction of rotation is provided with a fastening member that can be fastened to the rotating operation portion of the adjustment member. The rotating operation portion is rotated by the rotating shaft by rotating the rotating shaft. Thereby, the level of the backplane is adjusted. According to the surface mounting machine and the level adjustment method of such a configuration, since the rotation shaft is provided with the fastening member, the rotation operation part of the adjustment member can be rotated by the fastening member along with the rotation of the rotation shaft. You can also adjust the level of the back plate by operating the rotary operation section. Thereby, it is possible to suppress the difference in adjustment caused by the operator, and reduce the burden on the operator to adjust the level of the backplane. The surface mounter disclosed in this manual may have the following configuration. The rotation operation portion and the fastening member may be configured to be fastened by being unevenly fitted in the direction in which the axis of the rotation operation portion extends. According to such a configuration, the rotation operation portion and the engaging member are concavely and convexly fitted, so that the mounting operation head can reliably rotate the rotation operation portion to adjust the level of the back plate. Furthermore, it may be configured as follows: it has a control section having a memory for storing data. When the level of the control board exceeds the allowable level of the level stored in the memory, The rotation operation part is rotated to adjust the level of the back plate. According to this configuration, the level of the backplane is adjusted by the control section until the level of the backplane does not exceed the level tolerance. That is, since the level of the back plate is automatically adjusted by the control unit, the burden on the operator can be reduced. A configuration may also be adopted in which a supply path is provided on the rotation shaft, and the supply path is provided to hold or release the negative or positive pressure of the electronic component, and the back path is used to block the supply path to measure the back. Level of the board. According to this configuration, the level of the back plate can be measured based on the supply path of the mounting head by changing the supply pressure of the negative pressure or the positive pressure by clogging the back plate, and the level of the back plate can be adjusted. That is, since the processes from the level measurement to the level adjustment can be fully automated, the burden on the operator can be further reduced. It is also possible to have a configuration in which the engaging member has an insertion path, one end of which is in communication with the supply path, and the other end is blocked by the back plate when abutting on the back plate. According to this configuration, since the insertion member is provided with the insertion path, two operations, namely, the measurement of the level and the operation of the rotation operation unit can be performed by the engagement member. As a result, compared with a case where the back plate is adjusted horizontally by replacing the member for levelness measurement and the engaging member for the rotation operation portion, the work efficiency can be improved. [Effects of the Invention] According to the technology disclosed in this specification, the difference in adjustment caused by the operator can be eliminated, and the burden on the operator can be reduced.

<Embodiment> An embodiment of the technology disclosed in this specification will be described with reference to FIGS. 1 to 15. In the present embodiment, a surface mounter 10 for mounting an electronic component E on a printed circuit board (an example of a “substrate”) P is illustrated. As shown in FIG. 1, the surface mounting machine 10 includes a base 11 that is substantially rectangular in plan view, a transporting conveyor 12 that transports the printed circuit board P to the base 11, and a component mounting device 20 that is used to mount electronic components. E is mounted on the printed circuit board P; the back unit 50 supports the printed circuit board P at the mounting position; and a component supply device 14 for supplying the electronic component E to the component mounting device 20. In the following description, the left-right direction is based on the left-right direction in FIG. 1 (the long-side direction of the base 11 and the conveying direction of the conveying belt 12) and the left-right direction in FIG. The front-rear direction is the up-down direction (the short-side direction of the base 11) in FIG. 1 and the left-right direction in FIG. 4 as a reference. In FIG. For illustration, in FIG. 3, the left side of the illustration is set to the front side, and the right side of the illustration is set to the rear side. As shown in FIG. 1, the base 11 is a base on which a conveying belt 12, a component mounting device 20, a back unit 50 and the like are arranged. As shown in FIG. 1, the conveyance belt 12 is disposed at a substantially central portion in the front-rear direction of the base 11 and conveys the printed circuit board P in the left-right direction. In addition, the conveyance conveyor belt 12 includes a pair of conveyor belt belts 13 that are cyclically driven in the left-right direction, and a printed circuit board P is installed on the pair of conveyor belt belts 13 in an erected manner. Moreover, the printed circuit board P is carried into the back unit 50 along the conveyor belt 13 from the right side in the left-right direction, and after the electronic component E is installed, it is carried out along the conveyor belt 13 to the left-right direction. Left. As shown in FIG. 1, the parts supply device 14 is of a feeder type, and is arranged at a total of four locations by arranging two of the conveying belt 12 in both the upper and lower sides and the left and right directions. A plurality of feeders 16 are mounted on the parts supply device 14 in a state of being aligned in the left-right direction. Each feeder 16 is provided with an electric feeding device (not shown) that pulls out a component supply tape containing a plurality of electronic components E from a reel, and the like, and an end portion on the conveyor belt 12 side from each feeder 16 The electronic parts E are supplied one by one. As shown in FIG. 1, the component mounting device 20 includes: a pair of support frames 21 that are disposed on both sides in the left-right direction of the base 11; a head unit 30; and a head driving device 22 that moves the head unit 30. Each support frame 21 has an elongated shape extending in the front-rear direction, and is disposed on both sides of the base 11 in the left-right direction. The head driving device 22 includes a Y-axis servo mechanism 23 and an X-axis servo mechanism 27, and is provided to be mounted on a pair of support frames 21. As shown in FIG. 1, the Y-axis servo mechanism 23 includes: a pair of Y-axis guides 24 which are arranged along each support frame 21 in a form extending in the left-right direction; and a Y-axis servo motor 25 which is arranged on the Y-axis The ends of the guide rails 24 are mounted on the pair of Y-axis guide rails 24 in a erected manner. When the Y-axis servo motor 25 is electrically controlled, the head support 26 and the head unit 30 mounted on the head support 26 move along the Y-axis guide 24 in the front-rear direction. As shown in FIG. 2, the X-axis servo mechanism 27 includes: an X-axis guide 29 that is provided on the head support 26 in a form extending in the left-right direction; and an X-axis servo motor 28 that is provided on an end of the X-axis guide 29 . A head unit 30 is movably mounted on the X-axis guide rail 29 in the left-right direction. When the X-axis servo motor 28 is controlled by being energized, the head unit 30 moves in the left-right direction along the X-axis guide 29. Thereby, the head unit 30 can move on the base 11 in the horizontal direction which is the front-back, left-right, and left-right direction. The head unit 30 is a unit that takes out the electronic parts E supplied from the parts supply device 14 to the base 11 and mounts them on the printed circuit board P. As shown in FIGS. 1 to 3, the head unit 30 includes a head unit body 31, which is a box. Shape; and a plurality of mounting heads 32, which perform the mounting action of the electronic component E. As shown in FIG. 2 and FIG. 3, the plurality of mounting heads 32 are arranged side by side in the left-right direction in a form protruding downward from the head unit body 31, and each mounting head 32 has: a rotation shaft 33 extending in the up-down direction; and suction The nozzle 34 can be attached to or detached from the front end, that is, the lower end portion of the rotation shaft 33. A Z-axis servo motor 31A and an R-axis servo motor 31B provided in the head unit body 31 are mounted on the rotation shaft 33. The rotation shaft 33 can be moved up and down by the Z-axis servo motor 31A, and can be servoed by the R-axis. The motor 31B rotates around the shaft centering on the shaft center 33A of the rotation shaft 33 extending in the vertical direction. As shown in FIGS. 3 and 10, a pair of clamping portions 36 are provided at the lower end portion of the rotation shaft 33, which can be opened and closed on both sides in the left-right direction with the pair of shaft portions 35 as the center; and a pair of leaf springs. 37, which is pushed in the direction of bringing the pair of clamping portions 36 closer to each other; and the suction nozzle 34 is pressed into and held between the pair of clamping portions 36 from below. As shown in FIG. 3 and FIG. 8, the suction nozzle 34 has a form having a flange portion 39 at a substantially central portion in the up-down direction of a cylindrical nozzle body 34A extending vertically. The upper end portion of the adsorption nozzle 34 is a head portion 40 that is clamped between a pair of clamping portions 36 of the rotating shaft 33, and the head portion 40 is clamped by the pair of clamping portions 36 to hold the adsorption nozzle 34. It is fixed to the lower end of the rotating shaft 33. In the nozzle body 34A, an air passage (not shown) communicating with a supply path 38 provided in the rotation shaft 33 is provided. A negative or positive pressure is supplied to the air passage from an air supply device (not shown) connected to the supply path 38 of the rotating shaft 33. The suction nozzle 34 holds the electronic component E by the negative pressure and releases the electrons by the positive pressure. Part E. Therefore, with the suction nozzle 34 holding the electronic component E, the electronic component E can be positioned corresponding to the printed circuit board P by rotating the rotating shaft 33 to one side in the axial direction or the other in the axial direction. position. That is, in the surface mounting machine 10, it is controlled by driving of various servo motors so that the adsorption of the electronic component E supplied from the component supply device 14 and the mounting of the electronic component E to the printed circuit board P become optimal. position. Further, as shown in FIG. 2, the component mounting device 20 is provided with a substrate recognition camera 20A that moves with the head unit 30. The substrate recognition camera 20A photographs the printed circuit board P and performs image recognition on the printed circuit board P. As shown in FIG. 1, a pair of component recognition cameras 15 are provided on both sides of the front and rear directions of the conveying belt 12 on the base 11. The pair of component recognition cameras 15 are attached to and held by the mounting head 32 of the head unit 30. The front electronic part E is photographed. The back unit 50 is used for backing the printed circuit board P when the electronic component E is mounted on the printed circuit board P. As shown in FIG. 1, the back unit 50 is disposed below the conveying belt 12 in the base 11. As shown in FIGS. 3, 4 and 7, the back unit 50 includes a back plate 51 which is formed in a box shape that is horizontally long in the left-right direction and holds the printed circuit board P at the mounting position; a flat-plate-shaped holding member 60, which is disposed below the back plate 51; and a flat support member 70, which is disposed further below the holding member 60. The back plate 51 is made of metal and is placed on the holding member 60. The back plate 51 includes an upper side plate 52 on which the printed circuit board P is placed, and a flat rectangular lower side plate 53 in a substantially rectangular shape in plan view, which is disposed below the upper side plate 52. . As shown in FIGS. 5 and 7, the plate thickness of the upper side plate 52 is thinner than that of the lower side plate 53, and has a substantially rectangular flat plate shape having substantially the same size as the lower side plate 53. In addition, the upper surface 52A of the upper plate 52 is set to have a high flatness. A plurality of the upper surface 52A of the upper plate 52 are arranged in a state of penetrating the upper plate 52 in the up-down direction and arranged in front, back, left, and right, and can be inserted. The degree of air is smaller than the adsorption holes 54. As shown in FIG. 5, on the lower surface 52B of the upper side plate 52, a fastened portion 55 through which the fixing screw 56 can be screwed in from below is protruded downward, and is screwed into the fastened portion 55 and penetrates from below. The fixing screws 56 of the lower side plate 53 fix the upper side plate 52 and the lower side plate 53 to each other. In addition, a support frame 57 protruding downward is provided over the entire periphery of the outer peripheral portion of the upper side plate 52, and the protruding size of the support frame 57 is set to be approximately the same as that of the fastened portion 55. Therefore, if the upper side plate 52 and the lower side plate 53 are fixed to each other, as shown in FIG. 5, the upper side plate 52 is disposed at a position away from the lower side plate 53 and formed between the upper side plate 52 and the lower side plate 53. The negative pressure supply source supplies negative pressure supply space 58. When a negative pressure is supplied to the negative pressure supply space 58, the negative pressure is supplied to each suction hole 54, so that the printed circuit board P placed on the upper plate 52 is held and fixed to the back plate by the negative pressure. 51. The holding member 60 is made of metal, as shown in FIG. 7, and is formed into a generally rectangular flat plate shape slightly larger than the back plate 51 in the left-right direction. As shown in FIGS. 3 and 4, the holding member 60 includes an upper holding member 61 on which it is placed. The back plate 51 and the lower holding member 62 are disposed below the upper holding member 61. The upper holding member 61 has a substantially rectangular flat plate shape, and is fixed to the lower side plate 53 and the lower holding member 62 of the back plate 51 by fixing bolts (not shown). The lower holding member 62 is formed in a substantially rectangular flat plate shape having substantially the same size as the upper holding member 61. As shown in FIG. 7, the lower holding member 62 is supported with respect to the support member 70 at three positions as follows. These three positions refer to the center of the left and right edges 62A of the lower holding member 62. And a pair of height adjusting portions (an example of "height adjusting portions") 64 provided at the end portions on both sides in the left-right direction in the front edge portion 62B of the lower holding member 62. The support member 70 is configured to support and fix a substantially rectangular flat plate-shaped support plate 73 above the support columns 72 provided on the four corners of the substantially rectangular support base 71. As shown in Figs. 4 and 5, spherical sliding The bearing portion 63 is disposed at a substantially central portion in the left-right direction in the rear edge portion 73A of the support plate 73. As shown in FIGS. 4 and 6, a pair of heights are disposed at the end portions in the left-right direction in the front edge portion 73B of the support plate 73. Adjusting section 64. As shown in FIG. 5, the spherical plain bearing portion 63 includes a spherical inner wheel portion 75 that is fixed to the support plate 73 by a bolt 74 and an outer wheel portion 65 that is movably disposed on the spherical inner wheel portion 75. The spherical inner wheel portion 75 is made of metal and is formed into a substantially cylindrical shape having a convex spherical outer peripheral surface 75A. The bolt 74 is inserted into the spherical inner wheel portion 75 and screwed into the support member 70. The spherical inner wheel portion 75 is fixed to the upper surface 73C of the support plate 73 in the support member 70. The outer ring portion 65 is formed in a substantially cylindrical shape in which the inner peripheral surface 65A has a concave spherical shape. The outer wheel portion 65 is fixed in a recessed portion 66 recessed in the lower holding member 62 in the holding member 60, and a spherical inner wheel portion 75 is held in the outer wheel portion 65 in a freely sliding state. Therefore, the holding member 60 can swing about the spherical sliding bearing portion 63 with respect to the support member 70, and can adopt not only a posture parallel to the support member 70 but also a posture inclined to the support member 70. On the other hand, the pair of height adjustment sections 64 are those that adjust the height dimension of the holding member 60 in small units with respect to the support member 70, as shown in Figs. 3, 4 and 6, and are provided with bolts that are longer in the up-down direction. shape. Each height adjustment portion 64 is provided in a state where the height adjustment portion 64 penetrates the holding member 60 in the up-down direction with respect to the holding member 60, and the lower end portion of the height adjustment portion 64 abuts from above on the support member 70.台 座 部 77。 77. The height adjustment portion 64 is configured such that the contact portion 68 projects downward from the lower end portion of the main body portion 67 fixed to the holding member 60. The abutment portion 68 is a shaft portion of the screw portion 69 shown in FIGS. 4 and 6 by a screw portion (an example of a “rotation operation portion”) 69 that is rotatably provided protruding from an end portion above the main body portion 67. 69B is rotated toward one side in the axis direction from the center, and the abutment portion 68 gradually protrudes downward from the main body portion 67, and the abutment portion 68 is gradually accommodated by rotating the screw portion 69 to the other side in the axis direction. Within the body portion 67. On the other hand, as shown in FIG. 6, the pedestal portion 77 is configured such that the abutted plate 79 is inserted into the support recessed portion 78 recessed from the support plate 73 from above, and the upper surface 79A of the abutted plate 79 is It is assumed that the flatness of the abutting portion 68 abuts from above is high. Therefore, by rotating the screw portion 69 of each height adjustment portion 64 and adjusting the protruding size of the abutment portion 68, the inclination angle of the holding member 60 and even the upper side plate 52 in the back plate 51 can be performed by the spherical sliding bearing portion 63 as a fulcrum Fine adjustment. Further, as shown in FIG. 6, on the sides of the height adjustment portion 64 and the pedestal portion 77, a pushing member 90 is provided to push the holding member 62 and the support plate 73 downward toward each other in a direction in which the holding member 62 and the support plate 73 approach each other. . The pushing member 90 is a helical tension spring, and by hooking one end of the pushing member 90 to the holding side hooking portion 62C provided on the lower holding member 62, the other end is hooked on the supporting plate. The support side hook portion 73D of 73 is installed between the lower holding member 62 and the support plate 73. That is, the holding member 60 is pushed and held so that the holding member 60 does not float upward with respect to the supporting member 70, and the setting state of the height dimension adjusted by the height adjusting unit 64 is stably maintained. In addition, as shown in FIGS. 4, 6 and 7, the upper surface of the screw portion 69 of the height adjustment portion 64 in the back unit 50 is provided with a notch groove 69A recessed downward, on the rotation axis of the head unit 30. An adjustment nozzle (an example of a “snap-fitting member”) 80 that can be concave-convexly fitted in the up-down direction (the extending direction of the axial center 69B of the screw portion 69) with respect to the notch groove 69A of the screw portion 69 can be installed at the lower end of 33. As shown in FIG. 6, the notch groove 69A has a shape that is linearly recessed so as to pass through the axis 69B of the screw portion 69. On the other hand, as shown in FIG. 3 and FIG. 10, the adjustment nozzle 80 has the same shape as the suction nozzle 34 including the upper half of the flange portion 81 and is clamped by a head 82 provided on the upper end of the nozzle body 80A. It is held between a pair of clamping portions 36 of one of the rotating shafts 33 and can be mounted on the lower end portion of the rotating shaft 33. The lower portion of the adjustment nozzle 80 than the flange portion 81 is a flat plate-shaped fitting piece 83 as shown in FIGS. 10 to 12. The notch groove 69A is unevenly fitted from above to engage the screw portion 69 with the adjustment nozzle 80. Further, as shown in FIGS. 8 and 9, the fitting piece portion 83 of the adjustment nozzle 80 installed at the lower end portion of the rotation shaft 33 is fitted into the cutout groove 69A in the screw portion 69 of the height adjustment portion 64, and The R-axis servo motor 31B rotates the rotation shaft 33 around the shaft, whereby the height adjustment of the left and right end portions of the holding member 60 of the support member 70 can be performed by the height adjustment portion 64. That is, the operator does not rotate the screw portion 69 of the height adjustment portion 64, and the screw portion 69 of the height adjustment portion 64 is directed in the same direction as the rotation shaft 33 by the adjustment nozzle 80 installed on the rotation shaft 33 of the head unit 30 By rotating, the inclination angle of the back plate 51 can be adjusted. In addition, as shown in FIGS. 10 to 12, the adjustment nozzle 80 is provided with an insertion path 84 penetrating in the up-down direction, and is set such that if the adjustment nozzle 80 is installed at the lower end of the rotation shaft 33, as shown in FIG. 10. As shown in FIG. 13, the supply path 38 of the rotary shaft 33 and the insertion path 84 of the adjustment nozzle 80 are in communication with each other. The insertion path 84 is provided from the position slightly above the lower end portion of the flange portion 81 to the head portion 82, and is provided with a larger diameter than the plate thickness of the fitting piece portion 83, and from the lower end portion of the flange portion 81 to the fitting portion. The lower end portion of the sheet portion 83 is provided with a smaller diameter than the plate thickness dimension of the fitting sheet portion 83. When negative or positive pressure is supplied to the supply path 38 of the rotating shaft 33, negative or positive pressure is supplied to the lower end opening 80B of the adjustment nozzle 80. Next, the electrical configuration of the surface mounter 10 will be described with reference to FIG. 14. The surface mounter 10 controls the entirety of the entire surface by the control unit 110. The control unit 110 includes an arithmetic processing unit 111 including a CPU (Central Processing Unit) and a memory 112. In the memory 112, various data such as an installation program or a back unit adjustment program executed by the arithmetic processing unit 111, or a level tolerance value as an allowance value of the level of the back plate 51 are stored in the memory 112. The memory 112 stores data obtained by various programs. The arithmetic processing unit 111 controls the surface mounting machine 10 according to various programs stored in the memory 112, for example, drives the conveying conveyor 12 and the component mounting device 20 according to the mounting processing of the installation program, and controls each process mounted on the component supply device 14.料器 16. In addition, the arithmetic processing unit 111 takes in the imaging signals output from the substrate recognition camera 20A and the component recognition camera 15 respectively, and analyzes the component image and the substrate image based on the imaging signals. In addition, the calculation processing unit 111 executes a back unit adjustment program for making the back plate 51 in the back unit 50 horizontal to execute the upper side plate 52 in the back plate 51 before starting the mounting process of the electronic component E by the installation program. The upper surface 52A is subjected to a level adjustment process. Hereinafter, the level adjustment processing of the back plate 51 will be described with reference to the flow shown in FIG. 15. In the horizontal adjustment process, in order to measure the level of the back plate 51 in the back unit 50 disposed on the base 11, first, the head unit 30 is moved in the XY direction and disposed at any one of the four corners of the back plate 51. Up (S11). In addition, the adjustment nozzle 80 previously replaces the suction nozzle 34 mounted on the lower end of the rotating shaft 33 in a nozzle replacement device (not shown). Next, while supplying negative pressure to the lower end opening 80B of the adjustment nozzle 80, the rotary shaft 33 is lowered downward, and the lower end portion of the fitting piece portion 83 of the adjustment nozzle 80 abuts against the back plate 51 from above. Then, when the lower end opening 80B of the adjustment nozzle 80 is blocked by the upper surface 52A of the upper side plate 52 in the back plate 51 and the leakage of the negative pressure disappears, the height position of the back plate 51 is measured based on the amount of fall of the rotation shaft 33. Then, the height positions of all four corners (four measurement points) of the back plate 51 are measured, and the height positions of the pair of height adjustment sections 64 are calculated based on the height positions of the four measurement points (S12). Then, it is confirmed whether the difference between the height positions of the pair of height adjustment sections 64, that is, the offset amount does not exceed the level tolerance value stored in the memory 112 (S13). When the calculated offset does not exceed the horizontality tolerance value (S13: NO), the back plate 51 is horizontal, and the horizontal adjustment processing is terminated. On the other hand, when the offset exceeds the allowable level (S13: YES), the screw portion 69 of the pair of height adjustment portions 64 is rotated by adjusting the nozzle 80 to adjust the distance between the pair of height adjustment portions 64. The offset (S14). Then, the steps S12 to S14 are repeatedly performed to adjust the offset amount until the offset amount between the pair of height adjustment sections 64 does not exceed the level tolerance value. Specifically, as shown in FIG. 7, in the coordinate system of (X, Y, Z) where the position of the spherical plain bearing portion 63 is set to the origin (P0 (X_0, Y_0, Z_0)), a pair of heights is set. The positions of the adjustment section 64 are set to M1 (X_1, Y_1, Z_1) and M2 (X_2, Y_2, Z_2), and the four measurement points of the back plate 51 for height measurement are set to PA (X_A, Y_A, Z_A), PB (X_B, Y_B, Z_B), PC (X_C, Y_C, Z_C), PD (X_D, Y_D, Z_D). Therefore, the plane of the (X, Y, Z) coordinate system can be expressed by the following equation, ie, equation (1). In addition, the positions of each X and Y are fixed, and only Z changes the height. aX ＋ bY ＋ cZ ＋ d = 0 (1) Then, a, b, c, and d can be obtained by using equations (2) to (5), and the height positions of a pair of height adjusting portions 64 can be obtained by (6 ) And (7). a = (Y_B-Y_A) × (Z_C-Z_A)-(Y_C-Y_A) × (Z_B-Z_A) ... (2) b = (Z_B-Z_A) × (X_C-X_A)-(Z_C-Z_A ) × (X_B-X_A) ... (3) c = (X_B-X_A) × (Y_C-Y_A)-(X_C-X_A) × (Y_B-Y_A) ... (4) d =-( a × X_A + b × A_Y + c × Z_A) ... (5) Z_1 =-(a × X_1 + b × Y_1 + d) ÷ c ... (6) Z_2 =-(a × X_2 + b × Y_2 + d) ÷ c ... (7) Then, calculate the difference between Z_1 and Z_2 as the offset Zd. When the offset Zd exceeds the level tolerance, use the formula (8) And formula (9), calculate the adjustment amount Zm1 of the height adjustment section 64 in M1 (X_1, Y_1, Z_1) and the adjustment amount Zm2 of the height adjustment section 64 in M2 (X_2, Y_2, Z_2). Zm1 = Z_1-Z_0 ... (8) Zm2 = Z_2-Z_0 ... (9) Also, the memory 112 stores the offset when the screw portion 69 of each height adjustment portion 64 is rotated once. The amount of protrusion of the contact portion 68 is calculated by dividing the adjustment amount of Zm1 and Zm2 by the amount of protrusion of the contact portion 68 per one rotation of the screw portion 69, thereby calculating the rotation amount of the screw portion 69 in each height adjustment portion 64. Then, the screw portion 69 of each height adjustment portion 64 is rotated only by the calculated amount of rotation, thereby quickly and accurately adjusting the pair of height adjustment portions 64. Thereby, the adjustment of the level of the back plate 51 can be performed quickly and correctly, the difference in adjustment caused by the operator can be suppressed, and the burden on the operator to adjust the height of the back plate 51 can be reduced. Then, when the level adjustment processing of the back plate 51 is completed by the back unit adjustment program, the printed circuit board P is carried on the back unit 50 by the conveying belt 12, and the mounting of the electronic component E is performed by the part mounting device 20. operation. As described above, according to the present embodiment, notch grooves 69A can be provided in the screw portions 69 of the pair of height adjustment portions 64, and the lower end of the rotating shaft 33 in the head unit 30 of the component mounting device 20 can be provided with a notch. The groove 69A adjusts the nozzle 80 in a concave-convex manner, so that the rotating shaft 33 rotates around the axis and the screw portion 69 is rotated by adjusting the nozzle 80. Therefore, the operator does not adjust the screw portion 69 of the height adjustment portion 64, but can use a surface mounting machine. The control unit 110 of 10 quickly and accurately adjusts the level of the back plate 51 automatically. That is, it is possible to suppress a difference in adjustment caused by the operator, and reduce the burden on the operator to adjust the height of the back plate 51. In addition, according to this embodiment, the height adjustment of the back plate 51 is repeatedly and automatically performed until the level of the back plate 51 does not exceed the level tolerance value. Therefore, for example, the adjustment operation is performed once with the height adjustment unit 64. Compared with the situation where the staff has to confirm the level, the burden on the operator can be further reduced. Furthermore, according to this embodiment, the adjustment nozzle 80 is provided with an insertion path 84 that communicates with the supply path 38 of the rotary shaft 33. Therefore, even if the operator does not separately measure the level, the control unit 110 of the surface mounting machine 10 can be one side One adjustment nozzle 80 is used for both the level measurement and the level adjustment of the back plate 51, and the level of the back plate 51 is measured at the same time. That is, for example, the leveling of the backing plate is adjusted by changing the leveling adjustment nozzle and the leveling measurement measuring nozzle, or the leveling adjustment nozzle and the leveling measurement are installed on two rotating shafts. Compared with the case of the nozzle, the operation time of the level adjustment process can be shortened and the operation efficiency can be improved. <Other Embodiments> The technology disclosed in this specification is not limited to the embodiments described in the above description and drawings, and includes, for example, the following various aspects. (1) In the above embodiment, a configuration is provided in which one spherical plain bearing portion 63 and a pair of height adjustment portions 64 are provided between the holding member 60 and the support member 70. However, the present invention is not limited to this, and a configuration in which three or more height adjustment sections are provided between the holding member and the support member may be employed, and the height adjustment section may be configured between the holding member and the support member. . (2) In the above embodiment, a cutout groove 69A is provided in the screw portion 69, and a lower end portion of the adjustment nozzle 80 is configured as a fitting piece portion 83 that can be fitted into the cutout groove 69A from above. However, it is not limited to this, as long as a plurality of clamping pieces are provided at the lower end portion of the adjustment nozzle, and the screw portion is clamped by the plurality of clamping pieces, etc., adjusting the lower end portion of the nozzle can make the screw The degree of rotation of the portion and the configuration of the screw portion may be sufficient. (3) In the above embodiment, the plurality of mounting heads 32 are arranged on the head unit 30 in a row in the left-right direction. However, the invention is not limited to this, and the head unit may be configured as a so-called rotary head in which the mounting head is arranged in a circle.

10‧‧‧Surface Mounting Machine

11‧‧‧ abutment

12‧‧‧ Conveying conveyor

13‧‧‧Conveyor belt

14‧‧‧ Parts supply device

15‧‧‧Part recognition camera

16‧‧‧Feeder

20‧‧‧Part mounting device

20A‧‧‧Substrate Identification Camera

21‧‧‧ Support Framework

22‧‧‧head drive

23‧‧‧Y-axis servo mechanism

24‧‧‧Y-axis guide

25‧‧‧Y-axis servo motor

26‧‧‧ head support

27‧‧‧X-axis servo

28‧‧‧X-axis servo motor

29‧‧‧X-axis guide

30‧‧‧head unit

31‧‧‧head unit body

31A‧‧‧Z axis servo motor

31B‧‧‧R-axis servo motor

32‧‧‧Mounting head

33‧‧‧rotation axis

34‧‧‧ adsorption nozzle

34A‧‧‧Nozzle body

35‧‧‧ Shaft

36‧‧‧Clamping section

37‧‧‧ leaf spring

38‧‧‧ Supply Path

40‧‧‧Head

50‧‧‧back unit

51‧‧‧back

52‧‧‧ Upper side plate

52A‧‧‧Upper surface of upper side plate 52

52B‧‧‧The lower surface of the upper side plate 52

53‧‧‧Lower side plate

54‧‧‧ adsorption hole

55‧‧‧ fastened

56‧‧‧ set screw

57‧‧‧Support box

58‧‧‧Negative pressure supply space

60‧‧‧ holding member

61‧‧‧Upper holding member

62‧‧‧Lower side holding member

62A‧‧‧Back edge

62B‧‧‧ leading edge

62C‧‧‧Hold side hook

63‧‧‧ Spherical plain bearing section

64‧‧‧Height adjustment section (an example of `` adjustment member '')

65‧‧‧Outer wheel department

65A‧‧‧Inner peripheral surface

66‧‧‧ Recess

67‧‧‧Body

68‧‧‧Abutment Department

69‧‧‧Screw section (an example of `` rotation operation section '')

69A‧‧‧Notch groove

69B‧‧‧Axis

70‧‧‧ supporting components

71‧‧‧ Support abutment

72‧‧‧ support column

73‧‧‧ support board

73A‧‧‧back edge

73B‧‧‧ Leading edge

73C‧‧‧Support board 73 upper surface

73D‧‧‧Support side hook

74‧‧‧ Bolt

75‧‧‧ spherical inner wheel

75A‧‧‧outer surface

77‧‧‧ pedestal

78‧‧‧ Support recess

79‧‧‧ abutted board

80‧‧‧Adjusting the nozzle (an example of `` fastening member '')

80A‧‧‧Nozzle body

80B‧‧‧Bottom opening

81‧‧‧ flange

82‧‧‧Head

83‧‧‧ Fitting piece section

84‧‧‧pass-through path

90‧‧‧ Bomb pusher

110‧‧‧Control Department

111‧‧‧ Computing Processing Department

112‧‧‧Memory

Positions of M1, M2‧‧‧‧ pair of height adjustment sections 64

E‧‧‧Electronic parts

P‧‧‧printed circuit board (an example of "substrate")

P0‧‧‧ origin

PA‧‧‧Measurement point

PB‧‧‧Measurement point

PC‧‧‧Measurement point

PD‧‧‧Measurement point

FIG. 1 is a plan view of a surface mounting machine according to an embodiment. Fig. 2 is a front view showing a state in which the component mounting device is viewed from the front. FIG. 3 is a front view showing the head unit and the back unit in a state where an adjustment nozzle is disposed above the height adjustment portion. 4 is a side view showing a head unit and a back unit in a state where an adjustment nozzle is arranged above a height adjustment unit. Fig. 5 is a sectional view taken along the line A-A in Fig. 3. Fig. 6 is a sectional view taken along the line B-B in Fig. 3. Figure 7 is a top view of the back unit. FIG. 8 is a front view showing the head unit and the back unit in a state where the screw portion of the height adjustment portion is fitted into the adjustment nozzle. FIG. 9 is a side view showing the head unit and the back unit in a state where the screw portion of the height adjustment portion is fitted into the adjustment nozzle. FIG. 10 is a front view showing a state where the adjustment nozzle is installed at the lower end of the rotation shaft. Fig. 11 is a side view of the adjusting nozzle. Fig. 12 is a bottom view of the adjustment nozzle. FIG. 13 is a front view of the head unit and the back unit in a state where the adjustment nozzle is brought into contact with the upper surface of the back plate. Fig. 14 is a block diagram showing the electrical configuration of a surface mounter. FIG. 15 is a flowchart of a horizontal adjustment process.

Claims (6)

A surface mounting machine comprising: a back plate on which a substrate for mounting electronic parts is mounted; an adjustment member provided in a state having a rotary operation portion capable of rotating operation, and adjusting the above by rotating the rotary operation portion The level of the back plate; and a head unit that mounts the electronic components on the substrate; the head unit includes a rotation shaft that can rotate in the same direction as the rotation direction of the rotation operation portion; and a fastening member that It is detachably provided at the front end of the rotation shaft, and can be fastened to the rotation operation portion of the adjustment member; the rotation operation portion is rotated, and the rotation operation portion is rotated by the fastening member to adjust the back plate. Level. The surface mounting machine according to claim 1, wherein the rotation operation portion and the fastening member are fastened by being concave-convexly fitted in a direction in which the axis of the rotation operation portion extends. If the surface mounting machine of claim 1 or 2 further has a control section having a memory for storing data, the level of the control section above the backplane exceeds the allowable level of the level stored in the memory. In this case, the level of the back plate is adjusted by rotating the rotation operation portion. The surface mounting machine according to any one of claims 1 to 3, wherein a supply path is provided on the rotation shaft, and the supply path supplies a negative pressure or a positive pressure for maintaining or releasing the electronic component, by using the back plate. The supply path is closed, and the level of the back plate is measured. The surface mounting machine according to claim 4, wherein the fastening member has an insertion path, one end of which is in communication with the supply path, and the other end is blocked by the back plate when it abuts against the back plate. A method for adjusting the level of a surface-mounting machine, the surface-mounting machine includes: a back plate on which a substrate for mounting electronic components is mounted; and an adjusting member provided in a state of a rotary operation part capable of rotary operation, and by using The rotation operation part rotates to adjust the level of the back plate; and a head unit that mounts the electronic components on the substrate; the head unit is on a rotation shaft capable of rotating in the same direction as the rotation direction of the rotation operation part The front end is provided with a fastening member that can be fastened to the rotation operation portion of the adjustment member. The rotation axis is rotated, and the rotation operation portion is rotated by the fastening member to adjust the level of the back plate.