JP2830923B2 - Automatic setup change method and apparatus for substrate support unit - Google Patents
Automatic setup change method and apparatus for substrate support unitInfo
- Publication number
- JP2830923B2 JP2830923B2 JP2068698A JP6869890A JP2830923B2 JP 2830923 B2 JP2830923 B2 JP 2830923B2 JP 2068698 A JP2068698 A JP 2068698A JP 6869890 A JP6869890 A JP 6869890A JP 2830923 B2 JP2830923 B2 JP 2830923B2
- Authority
- JP
- Japan
- Prior art keywords
- support
- substrate
- pins
- chuck
- support pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品装着装置において、部品が装着さ
れる基板を支持するための基板サポート部の自動段取り
替え方法およびその装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for automatically changing a board support unit for supporting a board on which components are mounted in an electronic component mounting apparatus.
従来の技術 従来、電子部品装着装置に装備されて、電子部品が装
着される回路基板を下方から支持するようにした基板サ
ポート部の構造は第３図および第４図に示すとおりであ
る。22はサポートピン21が差込まれたサポートプレート
で、下方にシリンダー23が設けられ、このシリンダー23
を上下移動させて基板搬送レール24により搬送されてき
た基板を下からサポートピン21で支持したり、基板から
離したりする。2. Description of the Related Art Conventionally, the structure of a board support unit provided in an electronic component mounting apparatus to support a circuit board on which electronic components are mounted from below is shown in FIGS. 3 and 4. FIG. Reference numeral 22 denotes a support plate into which support pins 21 are inserted, and a cylinder 23 is provided below the support plate.
Is moved up and down to support the substrate transported by the substrate transport rail 24 from below with the support pins 21 or to separate the substrate from the substrate.
ここでサポートプレート22に差込まれたサポートピン
21は、支持する基板の種類、大きさ等により取付け位置
を変更しなければならない。このため、例えば第３図か
ら第４図に示すように、サポートピン21を配置替えする
には、装置の作業者がサポートピン21をサポートプレー
ト22から１本ずつ直接手で抜き取り、これを図面等を見
ながら所定位置に順次１本ずつ差し込み、基板の変更に
伴う基板サポートの段取替えを行っていた。The support pin inserted into the support plate 22 here
For 21, the mounting position must be changed according to the type and size of the substrate to be supported. Therefore, as shown in FIGS. 3 and 4, for example, in order to rearrange the support pins 21, the operator of the apparatus directly extracts the support pins 21 from the support plate 22 one by one by hand, One by one, it is inserted into a predetermined position one by one while observing the condition and the like, and the change of the board support accompanying the change of the board is performed.
発明が解決しようとする課題 このように基板が変更される度毎に、作業者がサポー
トピンを１本ずつ手で抜き差ししていたのでは、段取り
替えに時間を要し、かつ装置がその間停止されるため、
装着装置の稼働率が低下するという問題がある。Problems to be Solved by the Invention As described above, every time the board is changed, if the operator manually pulls out and inserts the support pins one by one, it takes time to change the setup and the apparatus stops during that time. To be
There is a problem that the operating rate of the mounting device is reduced.
そこで本発明ではこのような問題を解決するため、サ
ポートピンの抜き差し作業を自動操作により行えるよう
にした、基板サポート部の自動段取り替え方法およびそ
の装置を提供するものである。Therefore, in order to solve such a problem, the present invention provides a method and an apparatus for automatically setting and changing a substrate support section, in which a work of inserting and removing a support pin can be automatically performed.
課題を解決するための手段 本発明の基板サポート部の自動段取り替え方法は、基
板変更時にサポートピン配置替え情報に基づいて、基板
サポート部のサポートプレートに取付けられた複数本の
サポートピンをチャックで抜き取り、抜き取ったサポー
トピンをそのまま、前記サポートプレートの他の所定位
置に順次移し変えることを特徴とする。Means for Solving the Problems The automatic setup change method of the board support section of the present invention is based on the support pin arrangement change information at the time of board change, and a plurality of support pins attached to the support plate of the board support section are chucked. It is characterized in that the extracted support pins are sequentially transferred to other predetermined positions of the support plate as they are.
また、本発明の基板サポート部の自動段取り替え装置
は、複数本のサポートピンが挿脱可能にサポートプレー
トに取付けられてサポートピン上に基板を支持する基板
サポート部と、部品装着具を備えて上下移動可能なヘッ
ド部と、ヘッド部を水平方向に移動させるXYテーブル部
とを備えた電子部品装着装置において、前記ヘッド部に
前記サポートピンを把持し、開放するチャック部を設
け、基板変更時にサポートピン配置替え情報に基づい
て、前記チャック部によりサポートピンを把持して抜き
取り、抜き取ったサポートピンをそのままサポートプレ
ートの他の所定位置に移し替えた後、把持を開放するよ
うに構成したことを特徴とする。Further, the automatic setup change device of the substrate support unit of the present invention includes a substrate support unit that supports a substrate on the support pins by a plurality of support pins being removably attached to the support plate, and a component mounting tool. In an electronic component mounting apparatus having a vertically movable head portion and an XY table portion for moving the head portion in a horizontal direction, a chuck portion for gripping and releasing the support pins is provided on the head portion, and when a substrate is changed, Based on the support pin rearrangement information, the chuck section grips and removes the support pin, transfers the extracted support pin to another predetermined position of the support plate as it is, and releases the grip. Features.
作用 本発明の基板サポート部の自動段取り替え方法によれ
ば、サポートピンの抜き差しを自動操作できるように
し、しかも抜き取ったサポートピンを積み替えせずその
まま、所定位置に差し込むようにしたので、サポートピ
ンがすべて最短距離で差し替えすることができて、段取
り替えに要する時間を大幅に短縮することができ、装着
装置の稼働率が著しく向上する。According to the method of automatically changing the board support section of the present invention, the support pins can be automatically inserted and removed, and the extracted support pins can be inserted into the predetermined positions without reloading. All can be replaced with the shortest distance, the time required for setup change can be greatly reduced, and the operating rate of the mounting device can be significantly improved.
本発明の基板サポート部の自動段取り替え装置によれ
ば、サポートピンを把持し、開放するチャック部によっ
て、サポートピンの配置替えを自動的に行うことができ
る。そして前記チャック部は電子部品装着装置において
必須のヘッド部、XYテーブル部を利用してその位置決め
を行うことができるので、構造が簡単となる。ADVANTAGE OF THE INVENTION According to the automatic setup change apparatus of the board | substrate support part of this invention, the rearrangement of a support pin can be performed automatically by the chuck | zipper part which grips and opens a support pin. The chuck section can be positioned by using a head section and an XY table section which are indispensable in an electronic component mounting apparatus, so that the structure is simplified.
実施例 本発明の実施例を図面により説明する。Embodiment An embodiment of the present invention will be described with reference to the drawings.
第１図は基板サポート部の自動段取り替え装置を備え
た電子部品装着装置を示す。FIG. 1 shows an electronic component mounting apparatus provided with an automatic setup change device for a substrate support unit.
８はヘッド部７をＸおよびＹ方向に移動可能にしたXY
テーブルで、ヘッド部７には基板サポート部のサポート
ピン１を把持するチャック部６と、電子部品11を吸着保
持する吸着ノズル（部品装着具）９が、いずれも上下移
動可能に取り付けられている。Reference numeral 8 denotes an XY in which the head 7 can be moved in the X and Y directions.
In the table, a head portion 7 is provided with a chuck portion 6 for gripping the support pins 1 of the substrate support portion and a suction nozzle (component mounting device) 9 for sucking and holding the electronic component 11 so as to be vertically movable. .
基板サポート部はサポートピン１と、多数の保持孔を
設けてサポートピン１が差し込まれたサポートプレート
２と、サポートプレート２の下方に設けられたシリンダ
ー３とからなる。The substrate support portion includes a support pin 1, a support plate 2 provided with a large number of holding holes, into which the support pin 1 is inserted, and a cylinder 3 provided below the support plate 2.
基板搬送レール４に沿い搬送されてきた基板５が基板
サポート部の上方で停止される。シリンダー３が上昇し
て基板５がサポートプレート２のサポートピン１に載せ
られた状態で支持される。The substrate 5 transported along the substrate transport rail 4 is stopped above the substrate support unit. The cylinder 3 is raised, and the substrate 5 is supported in a state where the substrate 5 is placed on the support pins 1 of the support plate 2.
部品供給部10の電子部品11が吸着ノズル９により、順
次吸着保持されて基板５上の所定位置に装着され、装着
が終了するとシリンダー３が下降し、基板５は基板搬送
レール４により送り出される。The electronic components 11 of the component supply unit 10 are sequentially sucked and held by the suction nozzle 9 and are mounted at predetermined positions on the substrate 5. When the mounting is completed, the cylinder 3 is lowered and the substrate 5 is sent out by the substrate transport rail 4.
次に、基板サポート部の自動段取り替え装置の操作を
説明する。Next, the operation of the automatic setup changer for the substrate support unit will be described.
基板５の種類が変更されてサポートピン１を配置替え
するときは、装着装置に組込んだ段取り替えモードのサ
ポートピン配置替え情報に基いて、まずXYテーブル８が
作動する。ヘッド部７のチャック部６がサポートプレー
ト２上の位置替えすべきサポートピン１の上方に移送さ
れる。チャック部６が下降してサポートピン１を把持し
て後チャック部６が上昇し、サポートプレート２からサ
ポートピン１が抜き取られる。チャック部６は、例えば
第２図に示す構造のものでもよく、サポートピン１の上
方位置でフランジ12が下降し、開放状態の爪13が閉止さ
れサポートピン１が把持される。When the type of the substrate 5 is changed and the support pins 1 are rearranged, the XY table 8 is first activated based on the support pin rearrangement information in the setup change mode incorporated in the mounting device. The chuck section 6 of the head section 7 is transferred above the support pins 1 to be repositioned on the support plate 2. The chuck portion 6 is lowered to grip the support pin 1, the rear chuck portion 6 is raised, and the support pin 1 is removed from the support plate 2. The chuck portion 6 may have a structure shown in FIG. 2, for example, and the flange 12 descends at a position above the support pin 1, the claw 13 in the open state is closed, and the support pin 1 is gripped.
この後更にXYテーブル８が作動して、ヘッド部７のチ
ャック部６が移動し、抜取られたサポートピン１がサポ
ートプレート２の他の所定位置の上方に移送される。チ
ャック部６が下降してサポートピン１が所定位置に差し
込まれ、サポートピン１が爪13から開放され、その後チ
ャック部６が上昇する。Thereafter, the XY table 8 is further operated, the chuck 6 of the head 7 is moved, and the extracted support pin 1 is transferred above another predetermined position of the support plate 2. The chuck portion 6 descends, the support pin 1 is inserted into a predetermined position, the support pin 1 is released from the claw 13, and the chuck portion 6 thereafter moves up.
このような一連の動作が複数回繰り返されてサポート
ピン１がすべて差し替えられ、基板サポート部の段取り
替えがなされる。Such a series of operations is repeated a plurality of times, all the support pins 1 are replaced, and the setup of the board support portion is changed.
段取り替えが終了した後、電子部品11の装着作業が再
開される。After the completion of the setup change, the mounting work of the electronic component 11 is restarted.
発明の効果 本発明の基板サポート部の自動段取り替え方法によれ
ば、サポートピンの抜き差し操作を自動化し、しかもサ
ポートピンがすべて最短距離で配置替えされるので、段
取り替えに要する時間が大幅に短縮され、装着装置の稼
働率を著しく向上させることができる。Effect of the Invention According to the method for automatically changing the board support section of the present invention, the operation of removing and inserting the support pins is automated, and all the support pins are rearranged at the shortest distance. Thus, the operating rate of the mounting device can be significantly improved.
また本発明の基板サポート部の自動段取り替え装置に
よれば、通常の電子部品装着装置にチャック部を組み込
めばよいので、基板サポート部の自動段取り替えが簡単
な構造でかつ安価に実現することができる。Further, according to the automatic changeover apparatus for the substrate support section of the present invention, since the chuck section may be incorporated into a normal electronic component mounting apparatus, the automatic changeover of the substrate support section can be realized with a simple structure and at low cost. it can.
第１図は本発明の一実施例における基板サポート部の自
動段取り替え装置を備えた電子部品装着装置の斜視図、
第２図はチャック部によるサポートピンの把持状態の説
明図、第３図および第４図はそれぞれ従来の基板サポー
ト部の段取り替え前後の状態の斜視図である。 １……サポートピン ２……サポートプレート ５……基板 ６……チャック部 ７……ヘッド部 ８……XYテーブル部 ９……部品装着具 11……電子部品FIG. 1 is a perspective view of an electronic component mounting apparatus having an automatic setup change device for a substrate support unit according to an embodiment of the present invention;
FIG. 2 is an explanatory view of a holding state of a support pin by a chuck section, and FIGS. 3 and 4 are perspective views of a state before and after a setup change of a conventional substrate support section. DESCRIPTION OF SYMBOLS 1 ... Support pin 2 ... Support plate 5 ... Substrate 6 ... Chuck part 7 ... Head part 8 ... XY table part 9 ... Component mounting tool 11 ... Electronic components
フロントページの続き (72)発明者 奥田 修 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭63−44475（ＪＰ，Ａ) 実開 昭63−44480（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/02Continuation of front page (72) Inventor Osamu Okuda 1006 Odakadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-63-44475 (JP, A) JP-A-63-44480 (JP) , U) (58) Fields surveyed (Int. Cl. 6 , DB name) H05K 13/02
Claims (2)
基づいて、基板サポート部のサポートプレートに取付け
られた複数本のサポートピンをチャックで抜き取り、抜
き取ったサポートピンをそのまま、前記サポートプレー
トの他の所定位置に順次移し変えることを特徴とする基
板サポート部の自動段取り替え方法。When a substrate is changed, a plurality of support pins attached to a support plate of a substrate support portion are extracted with a chuck based on support pin rearrangement information, and the extracted support pins are directly used as other support pins. An automatic setup changeover method for a substrate support section, which is sequentially moved to a predetermined position.
トプレートに取付けられてサポートピン上に基板を支持
する基板サポート部と、部品装着具を備えて上下移動可
能なヘッド部と、ヘッド部を水平方向に移動させるXYテ
ーブル部とを備えた電子部品装着装置において、前記ヘ
ッド部に前記サポートピンを把持し、開放するチャック
部を設け、基板変更時にサポートピン配置替え情報に基
づいて、前記チャック部によりサポートピンを把持して
抜き取り、抜き取ったサポートピンをそのままサポート
プレートの他の所定位置に移し替えた後、把持を開放す
るように構成したことを特徴とする基板サポート部の自
動段取り替え装置。A plurality of support pins which are removably attached to the support plate and support the substrate on the support pins; a head part provided with a component mounting tool and capable of moving up and down; and a head part. An electronic component mounting apparatus having an XY table unit for moving the substrate in the horizontal direction, the head unit is provided with a chuck unit for gripping and releasing the support pins, and based on the support pin rearrangement information when changing the substrate, Automatic setup change of the substrate support part characterized in that the support pin is gripped and pulled out by the chuck part, and the gripped part is released after transferring the pulled out support pin to another predetermined position of the support plate as it is. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2068698A JP2830923B2 (en) | 1990-03-19 | 1990-03-19 | Automatic setup change method and apparatus for substrate support unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2068698A JP2830923B2 (en) | 1990-03-19 | 1990-03-19 | Automatic setup change method and apparatus for substrate support unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03268493A JPH03268493A (en) | 1991-11-29 |
| JP2830923B2 true JP2830923B2 (en) | 1998-12-02 |
Family
ID=13381249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2068698A Expired - Fee Related JP2830923B2 (en) | 1990-03-19 | 1990-03-19 | Automatic setup change method and apparatus for substrate support unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2830923B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW522482B (en) * | 2000-08-23 | 2003-03-01 | Tokyo Electron Ltd | Vertical heat treatment system, method for controlling vertical heat treatment system, and method for transferring object to be treated |
| JP2007029664A (en) * | 2005-07-29 | 2007-02-08 | Yasuo Kawahara | Chain-like accessary for mounting facet-cut jewel |
-
1990
- 1990-03-19 JP JP2068698A patent/JP2830923B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03268493A (en) | 1991-11-29 |
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