WO2020151448A1 - 蒸镀方法、蒸镀掩膜模组、显示面板及显示装置 - Google Patents

蒸镀方法、蒸镀掩膜模组、显示面板及显示装置 Download PDF

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Publication number
WO2020151448A1
WO2020151448A1 PCT/CN2019/128286 CN2019128286W WO2020151448A1 WO 2020151448 A1 WO2020151448 A1 WO 2020151448A1 CN 2019128286 W CN2019128286 W CN 2019128286W WO 2020151448 A1 WO2020151448 A1 WO 2020151448A1
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WIPO (PCT)
Prior art keywords
mask
vapor deposition
opening area
base substrate
pattern
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PCT/CN2019/128286
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English (en)
French (fr)
Inventor
胡许武
刘阳升
孔梦夏
司东辉
牟山
崔艳
王钰
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/960,672 priority Critical patent/US11889743B2/en
Publication of WO2020151448A1 publication Critical patent/WO2020151448A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/15Hole transporting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers

Definitions

  • the present disclosure relates to the field of display technology, and in particular to an evaporation method, an evaporation mask module, a display panel and a display device.
  • Full-screen displays usually adopt ultra-narrow bezels around the design, and set light-transmitting areas in the display area (Active Area, AA). This light-transmitting area is used for the placement of components such as cameras and earpieces.
  • some film layers of the display panel may need to be dug, that is, the film layer is first arranged on the base substrate, and the film layer is dug by means such as laser or etching.
  • the laser or etching process is more complicated and the equipment requirements are large, and the laser cutting film may damage the film, resulting in a decrease in the yield of the display panel, and etching will cause particle pollution.
  • the embodiments of the present disclosure provide an evaporation method, an evaporation mask module, a display panel and a display device, which can reduce the complexity of the processing technology of the display panel and improve the yield of the display panel.
  • embodiments of the present disclosure provide an evaporation method, which includes:
  • the base substrate is vapor-deposited sequentially using the opening regions of at least two mask plates, and the vapor deposition sub-patterns formed on the base substrate in the opening regions of each mask form a complementary pattern, and each of the The vapor deposition pattern formed by splicing the vapor deposition sub-patterns corresponds to the display area with the isolated hollow pattern.
  • the base substrate is vapor-deposited by sequentially using the opening regions of at least two mask plates, wherein the vapor deposition sub-patterns formed on the base substrate by the opening regions of each mask form a complementary pattern, and the complementary pattern Corresponding to the display area with the isolated hollow pattern, so the purpose of making the light-transmitting area on the display panel can be achieved, and no additional process is required, thereby reducing the complexity of the processing process of the display panel.
  • the vapor deposition sources corresponding to each mask plate have different vapor deposition angles.
  • the vapor deposition source and The angle between the masks is to ensure that the thickness of the vapor deposited material is consistent.
  • the embodiments of the present disclosure provide an evaporation mask module, the evaporation mask module includes at least two mask plates, wherein each of the mask plates is arranged in an array A plurality of opening areas corresponding to the display area one-to-one, each opening area corresponding to the same opening area constitutes a complementary pattern, and the pattern formed by splicing each opening area corresponds to a display area with an isolated hollow pattern.
  • the mask includes a first mask and a second mask; the first mask has a first type of opening area corresponding to the display area one-to-one, and the first mask The two masks have a second type of opening area one-to-one corresponding to the display area, the first type of opening area and the second type of opening area corresponding to the same opening area form a complementary pattern, and the first type of opening area and the second type of opening area
  • the pattern formed by area splicing corresponds to the display area with the isolated hollow pattern.
  • the thickness of the first type of opening area and the second type of opening area corresponding to the same opening area at adjacent edges is greater than the thickness at other edges.
  • the first type of opening area and the second type of opening area corresponding to the same opening area have opposite patterns.
  • embodiments of the present disclosure provide a display panel, including a base substrate and an evaporated film layer formed on the base substrate, wherein the evaporated film layer adopts any one of the evaporated films described in the first aspect.
  • the plating method is formed.
  • the vapor-deposited film layer includes: a light-emitting layer, an electron transport layer, and a hole transport layer.
  • the vapor-deposited film layer has at least one isolated hollow pattern.
  • embodiments of the present disclosure provide a display device including the display panel according to any one of the third aspect.
  • the base substrate is vapor-deposited by sequentially using the opening regions of at least two mask plates, wherein the vapor deposition sub-patterns formed on the base substrate by the opening regions of each mask form a complementary pattern, and the complementary pattern Corresponding to the display area with the isolated hollow pattern, so the purpose of making the light-transmitting area on the display panel can be achieved, and no additional process is required, thereby reducing the complexity of the processing process of the display panel.
  • an evaporation method including: performing a first evaporation on a base substrate using a first mask to form a first evaporation sub-pattern on the base substrate, wherein The first mask has a first opening area; and a second mask is used to perform a second vapor deposition on the base substrate to form a second vapor deposition sub-pattern on the base substrate, wherein The second mask has a second opening area; wherein the first and second vapor deposition sub-patterns are combined to form a vapor deposition pattern.
  • the first and second vapor deposition sub-patterns constitute complementary patterns.
  • the vapor deposition pattern formed by the combination of the first and second vapor deposition sub-patterns corresponds to a display area with an isolated hollow pattern.
  • the vertical projection of the first mask on the base substrate during the first evaporation is different from the vertical projection of the second mask on the base substrate during the second evaporation.
  • the vertical projection on the base substrate has overlapping parts, and the overlapping parts are respectively associated with the first opening area and the second opening area.
  • the vapor deposition pattern formed by the combination of the first and second vapor deposition sub-patterns has isolated openings, and at least a part of the isolated openings corresponds to the overlapped portion.
  • the vapor deposition angle of the vapor deposition source corresponding to the first mask during the first vapor deposition is different from the vapor deposition source corresponding to the second mask during the second vapor deposition The evaporation angle.
  • the vapor deposition method further includes: performing a third vapor deposition on the base substrate by using a third mask to form a third vapor deposition sub-pattern on the base substrate, wherein The third mask has a third opening area; wherein the first, second and third vapor deposition sub-patterns are combined to form a vapor deposition pattern.
  • an evaporation mask module including at least two mask plates, wherein each of the mask plates is provided with at least one opening area of and, wherein the at least two The corresponding opening areas of the mask plate constitute a complementary pattern, and the combination of the corresponding opening areas of the at least two mask plates can be used to form an evaporation layer with an isolated hollow pattern.
  • the at least two masks include a first mask and a second mask; the first mask has a first opening area, and the second mask has a The first opening area corresponds to the second opening area, the first opening area and the second opening area constitute a complementary pattern, and the combination of the first opening area and the second opening area can be used to form an isolated hollow pattern Evaporation layer.
  • the thickness of each of the corresponding opening regions of the at least two mask plates at the edges adjacent to each other is greater than the thickness of each at the other edges.
  • the corresponding first and second opening regions have opposite patterns.
  • the vapor deposition mask module is configured such that when the vapor deposition mask module is used to vaporize a base substrate, the first mask is on the base substrate.
  • the vertical projection of and the vertical projection of the second mask on the base substrate have overlapping parts, and the overlapping parts are respectively associated with the first opening area and the second opening area.
  • the overlapped portion is such that the vapor deposition pattern formed by vapor deposition of the base substrate using the vapor deposition mask module has isolated openings.
  • a display panel including a base substrate and an evaporated film layer formed on the base substrate, wherein the evaporated film layer adopts the evaporation film layer according to any embodiment of the present disclosure.
  • the plating method is formed.
  • the vapor-deposited film layer includes one or more of the following: a light-emitting layer, an electron transport layer, and a hole transport layer.
  • the evaporated film layer has at least one isolated hollow pattern.
  • a display device including the display panel according to any embodiment of the present disclosure.
  • FIG. 1 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • FIG. 3 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • FIG. 4 is a schematic diagram of an evaporation process provided by an embodiment of the disclosure.
  • FIG. 5 is a schematic diagram of an evaporation process provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic structural diagram of a mask module provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic structural diagram of a mask module provided by an embodiment of the disclosure.
  • FIG. 9 is a schematic structural diagram of a mask module provided by an embodiment of the disclosure.
  • FIG. 10 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • FIG. 11 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • FIG. 12 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • FIG. 13 is a schematic diagram of a structure of a mask module provided by an embodiment of the disclosure.
  • the embodiments of the present disclosure provide an evaporation method.
  • an opening area of at least two mask plates is sequentially used to evaporate a base substrate. That is, first use the first mask to form the vapor deposition sub-pattern corresponding to the opening area of the first mask on the base substrate through the vapor deposition process, and then continue to use the second mask or other masks
  • the board forms part of the vapor deposition sub-pattern on the base substrate through multiple vapor deposition processes, thereby forming the vapor deposition pattern on the base substrate.
  • the vapor deposition sub-patterns formed on the base substrate in the opening area of each mask used constitute a complementary pattern
  • the vapor deposition pattern formed by splicing each vapor deposition sub-pattern corresponds to a display with an isolated hollow pattern Area
  • the isolated hollow pattern can correspond to the light-transmitting area of the display panel, so the purpose of making the light-transmitting area on the display panel can be achieved without adding a process, thereby reducing the complexity of the processing process of the display panel.
  • the vapor deposition patterns formed on the base substrate in the embodiments of the present disclosure are complementary patterns formed by the vapor deposition sub-patterns formed on the base substrate through the opening regions of the mask plates, in the specific vapor deposition, the base substrate needs The vapor-deposited area is only masked once in the vapor deposition process, and the area to be masked is masked, that is, there are two masks, so the thickness of the vapor-deposited material at the edge of each mask opening area is similar The thickness of the material may be thicker than that of other areas.
  • the vapor deposition angle between the vapor deposition source and each mask plate can be adjusted so that each mask
  • the vapor deposition sources corresponding to the template have different vapor deposition angles to ensure that the thickness of the vapor-deposited material is as consistent as possible.
  • an embodiment of the present disclosure also provides an evaporation mask module.
  • the evaporation mask module includes at least two mask plates, wherein each mask plate A plurality of opening regions corresponding to the display regions are arranged in an array, each opening region corresponding to the same opening region forms a complementary pattern, and the pattern formed by splicing each opening region corresponds to a display region with an isolated hollow pattern.
  • At least two mask plates included in the vapor deposition mask module can be used for vapor deposition on the base substrate.
  • the following describes in detail the technical solutions provided by the embodiments of the present disclosure by taking the mask including the first mask 10 and the second mask 20, that is, two masks as examples.
  • the mask may include a first mask 10 and a second mask 20, wherein the first mask 10 has The area corresponds to the first type of opening area one-to-one ( Figure 2 is shown as a blank area), and the second mask 20 has a second type of opening area corresponding to the display area one-to-one ( Figure 2 is shown as a shaded area), and
  • the first type of opening area and the second type of opening area corresponding to the same opening area constitute complementary patterns, and the pattern formed by the splicing of the first type of opening area and the second type of opening area corresponds to a display area with an isolated hollow pattern.
  • the pattern formed by the first type of opening area and the second type of opening area is circular, such as As shown in Figure 2.
  • the first type of opening area and the second type of opening area in Figure 2 are the areas that need to be shielded, and the area on the mask plate that is not the first type of opening area or the second type of opening area is the vapor deposition area, that is, the vapor deposition material is required. area.
  • FIG. 3 in combination with FIG. 4 and FIG. 5, the embodiment of the present disclosure shown in FIG. 3 adopts the method of vapor-depositing the base substrate with the mask as shown in FIG. 2, and the specific process is described as follows:
  • step S301 the first mask 10 is set above the base substrate, and the base substrate is vapor-deposited through an evaporation process to form the first vapor deposition sub-pattern 30.
  • the arrow direction represents the incident direction of light from the evaporation source.
  • step S302 the second mask 20 is set above the base substrate, and the base substrate is vapor-deposited through an evaporation process to form a second vapor deposition sub-pattern 40.
  • the arrow direction represents the incident direction of light from the evaporation source.
  • the first type of opening area of the first mask 10 and the second type of opening area of the second mask 20 are arranged oppositely to form a complementary pattern, and the pattern formed by the splicing of the first type of opening area and the second type of opening area is a circle
  • the shape 50 corresponds to the display area with the isolated hollow pattern and forms a light-transmitting area, which realizes the purpose of fabricating the light-transmitting area on the display panel without adding a process, thereby reducing the complexity of the processing process of the display panel.
  • the embodiment of the present disclosure does not limit the shape of the first type of opening area of the first mask 10 and the shape of the second type of opening area of the second mask 20, as long as the first type of opening area and the second type of opening area
  • the complementary pattern formed by the second type of opening area may correspond to the display area with the isolated hollow pattern.
  • the first type of opening area and the second type of opening area corresponding to the same opening area have opposite patterns.
  • the area to be vaporized on the base substrate is only masked once in the vapor deposition process, and the area to be shielded is masked, that is, there are two masks, which may result in the second mask corresponding to the same opening area.
  • the thickness of the vapor-deposited material at the adjacent edges of the first type of opening area and the second type of opening area may be thicker than the thickness of the material in other areas. Therefore, the lengths of the first type opening area and the second type opening area corresponding to the same opening area at the adjacent edges are as short as possible.
  • FIG. 6 provides a possible implementation of the first mask 10 and the second mask 20.
  • the first type of opening area may be the first mask as shown on the left side of FIG.
  • the opening area on the diaphragm 10 correspondingly, the second type of opening area is the opening area on the second mask 20 as shown on the right in FIG. 6.
  • the first mask 10 and the second mask 20 shown in FIG. 6 are due to the first type of openings.
  • the length of the adjacent edge of the area and the second type of opening area is shorter.
  • the evaporation mask modules corresponding to the first mask 10 and the second mask 20 shown in FIG. 6 are shown in FIG. 7.
  • FIG. 8 provides another possible implementation of the first mask 10 and the second mask 20.
  • the first type of opening area may be the first as shown on the left side of FIG.
  • the opening area on the mask 10 correspondingly, the second type of opening area is the opening area on the second mask 20 as shown on the right in FIG. 8.
  • the first mask 10 and the second mask 20 shown in FIG. 8 are due to the first type of openings.
  • the length of the adjacent edge of the area and the second type of opening area is shorter.
  • FIG. 9 provides another possible implementation manner of the first mask 10 and the second mask 20.
  • the first type of opening area may be the first as shown on the left side of FIG.
  • the opening area on the mask 10 correspondingly, the second type of opening area is the opening area on the second mask 20 as shown on the right in FIG. 9.
  • the first mask 10 and the second mask 20 shown in FIG. 8 are due to the first type of openings.
  • the length of the adjacent edge of the area and the second type of opening area is shorter.
  • the same opening The thickness of the first type of opening area and the second type of opening area corresponding to the area at adjacent edges is greater than the thickness at other edges.
  • FIG. 10 is a cross-sectional view of the first mask plate 10 in the first type of opening area and the second mask plate 20 in the thickness direction of the second type of opening area. It can be seen from FIG. 10 that when the thickness of the first type of opening area and the second type of opening area at adjacent edges is greater than the thickness at other edges, the material on which the base substrate 100 is repeatedly evaporated is indicated by the dotted line in FIG. 10 Part, in order to avoid repeated evaporation in the dotted area as much as possible, where the arrow direction in FIG. 10 indicates the incident angle of light from the evaporation source.
  • first type of opening area of the first mask 10 has only one opening area.
  • second type of opening area on the second mask 20 also has only one opening area.
  • first type of opening area The opening areas on the mask plate 10 and the second mask plate 20 may include multiple, as long as the opening areas on the first mask plate 10 and the opening areas on the second mask plate 20 form a complementary pattern that has isolated hollows. The display area of the pattern can correspond.
  • the first mask 10 and the second mask 20 include the following possible implementations during specific implementation.
  • the first type of opening area may be an opening on the first mask 10 as shown on the left side of FIG. Area, correspondingly, the second type of opening area is the opening area on the second mask 20 as shown on the right side of FIG. 11.
  • the first type of opening area may be an opening on the first mask 10 as shown on the left side of FIG.
  • the area, correspondingly, the second type of opening area is the opening area on the second mask 20 as shown on the right side of FIG. 12.
  • the first type of opening area may be an opening on the first mask 10 as shown on the left side of FIG. Area, correspondingly, the second type of opening area is the opening area on the second mask 20 as shown on the right side of FIG. 13.
  • the base substrate is vapor-deposited by sequentially using the opening regions of at least two mask plates, wherein the vapor deposition sub-patterns formed on the base substrate in the opening regions of each mask plate constitute complementary patterns.
  • the complementary pattern corresponds to a display area with an isolated hollow pattern, so the purpose of fabricating a light-transmitting area on the display panel can be achieved without adding a process, thereby reducing the complexity of the processing process of the display panel.
  • an evaporation method including: performing a first evaporation on a base substrate using a first mask to form a first evaporation sub-pattern on the base substrate, wherein The first mask has a first opening area; and a second mask is used to perform a second vapor deposition on the base substrate to form a second vapor deposition sub-pattern on the base substrate, wherein The second mask has a second opening area; wherein the first and second vapor deposition sub-patterns are combined to form a vapor deposition pattern.
  • the first and second vapor deposition sub-patterns constitute complementary patterns.
  • the vapor deposition pattern formed by the combination of the first and second vapor deposition sub-patterns corresponds to a display area with an isolated hollow pattern.
  • the vertical projection of the first mask on the base substrate during the first evaporation is different from the vertical projection of the second mask on the base substrate during the second evaporation.
  • the vertical projection on the base substrate has overlapping parts, and the overlapping parts are respectively associated with the first opening area and the second opening area.
  • the vapor deposition pattern formed by the combination of the first and second vapor deposition sub-patterns has isolated openings, and at least a part of the isolated openings corresponds to the overlapped portion.
  • the vapor deposition angle of the vapor deposition source corresponding to the first mask during the first vapor deposition is different from the vapor deposition source corresponding to the second mask during the second vapor deposition The evaporation angle.
  • the vapor deposition method further includes: performing a third vapor deposition on the base substrate by using a third mask to form a third vapor deposition sub-pattern on the base substrate, wherein The third mask has a third opening area; wherein the first, second and third vapor deposition sub-patterns are combined to form a vapor deposition pattern.
  • an evaporation mask module including at least two mask plates, wherein each of the mask plates is provided with at least one opening area of and, wherein the at least two The corresponding opening areas of the mask plate constitute a complementary pattern, and the combination of the corresponding opening areas of the at least two mask plates can be used to form an evaporation layer with an isolated hollow pattern.
  • the at least two masks include a first mask and a second mask; the first mask has a first opening area, and the second mask has a The first opening area corresponds to the second opening area, the first opening area and the second opening area constitute a complementary pattern, and the combination of the first opening area and the second opening area can be used to form an isolated hollow pattern Evaporation layer.
  • the thickness of each of the corresponding opening regions of the at least two mask plates at the edges adjacent to each other is greater than the thickness of each at the other edges.
  • the corresponding first and second opening regions have opposite patterns.
  • the vapor deposition mask module is configured such that when the vapor deposition mask module is used to vaporize a base substrate, the first mask is on the base substrate.
  • the vertical projection of and the vertical projection of the second mask on the base substrate have overlapping parts, and the overlapping parts are respectively associated with the first opening area and the second opening area.
  • the overlapped portion is such that the vapor deposition pattern formed by vapor deposition of the base substrate using the vapor deposition mask module has isolated openings.
  • a display panel including a base substrate and an evaporated film layer formed on the base substrate, wherein the evaporated film layer adopts the evaporation film layer according to any embodiment of the present disclosure.
  • the plating method is formed.
  • the vapor-deposited film layer includes one or more of the following: a light-emitting layer, an electron transport layer, and a hole transport layer.
  • the evaporated film layer has at least one isolated hollow pattern.
  • a display device including the display panel according to any embodiment of the present disclosure.
  • the embodiments of the present disclosure also provide a display panel, including a base substrate and an evaporated film layer formed on the base substrate, wherein the evaporated film layer is formed by the above-mentioned evaporation method.
  • the vapor-deposited film layer includes a light-emitting layer, an electron transport layer, and a hole transport layer, and the vapor-deposited film layer has at least one isolated hollow pattern.
  • the display area of the display panel may include at least one pixel unit, so that the display panel can be applied to both the conventional display field and the microdisplay technology field.
  • the display area of the display panel has an isolated hollow pattern, It can be used to make light-transmitting areas, such as installing cameras, etc.; and the display panel can be: mobile phones, tablets, TVs, monitors, laptops, digital cameras, navigators, smart watches, fitness wristbands, personal digital assistants, Any product or component with display function such as self-service deposit/cash machine.
  • Other indispensable components of the display panel are understood by those of ordinary skill in the art, and will not be repeated here, nor should they be used as a limitation to the present disclosure.
  • the implementation of the display panel can refer to the following embodiments of the package structure.
  • embodiments of the present disclosure also provide a display device, including any of the above-mentioned display panels provided by the embodiments of the present disclosure.
  • the display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • the implementation of the display device can refer to the embodiment of the above-mentioned display panel, and the repetition is not repeated here.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

一种蒸镀方法,包括:采用第一掩膜板(10)对衬底基板(100)进行第一蒸镀,以在衬底基板(100)上形成第一蒸镀子图案(30),其中第一掩膜板具有第一开口区域;以及采用第二掩膜板(20)对衬底基板(100)进行第二蒸镀,以在衬底基板(100)上形成第二蒸镀子图案(40),其中第二掩膜板(20)具有第二开口区域;其中第一蒸镀子图案(30)和第二蒸镀子图案(40)组合形成蒸镀图案。还包括一种蒸镀掩膜模组、显示面板及显示装置。

Description

蒸镀方法、蒸镀掩膜模组、显示面板及显示装置
相关申请的交叉引用
本申请要求于2019年1月22递交的中国申请201910057935.6的优先权,并通过引用将其全文并入在此。
技术领域
本公开涉及显示技术领域,特别涉及一种蒸镀方法、蒸镀掩膜模组、显示面板及显示装置。
背景技术
目前,全面屏设计的显示面板因为屏占比较高而越来越深得消费者的欢迎,全面屏通常采用四周超窄边框设计,并在显示区域(Active Area,AA)中设置透光区域,该透光区域用于诸如摄像头、听筒等部件的放置。
目前在透光区域,显示面板有的膜层可能需要进行挖孔,也就是先将膜层设置在衬底基板上,在采用例如激光或刻蚀等方式在膜层上进行挖孔。而激光或刻蚀等工艺较为复杂且设备需求较大,且激光切割膜层可能会损坏膜层,导致显示面板的良率降低,刻蚀会带来颗粒污染。
发明内容
本公开实施例提供一种蒸镀方法、蒸镀掩膜模组、显示面板及显示装置,能够降低显示面板的加工工艺的复杂度,提高显示面板的良率。
第一方面,本公开实施例提供了一种蒸镀方法,该蒸镀方法包括:
依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀,各所述掩模板的开口区域在所述衬底基板上形成的各蒸镀子图案构成互补图案,且各所述蒸镀子图案拼接形成的蒸镀图案对应具有孤立镂空图案的显示区域。
本公开实施例通过依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀,其中,各个掩膜板开口区域在衬底基板形成的蒸镀子图案构成互补图案,该互补图案对应具有孤立镂空图案的显示区域,所以即可实现在显示面板制作透光区域的目的,且不需要增加工艺,从而降低了显示面板的加工工艺的复杂度。
一种可能的实施方式中,依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀时,各掩模板对应的蒸镀源具有不同的蒸镀角度。
本公开实施例在采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀时,为了避免至少两个掩膜板相交的边缘处蒸镀的材料较厚,可以调整蒸镀源与各掩膜板之间的角度,以尽量保证所蒸镀的材料的厚度一致。
第二方面,本公开实施例提供了一种蒸镀掩膜模组,该蒸镀掩膜模组包括至少两个掩膜板,其中,每个所述掩膜板上设置有呈阵列排布的多个与显示区域一一对应的开口区域,与同一开口区域对应的各开口区域构成互补图案,且各开口区域拼接形成的图案对应具有孤立镂空图案的显示区域。
一种可能的实施方式中,所述掩膜板包括第一掩膜板和第二掩膜板;所述第一掩膜板具有与显示区域一一对应的第一类开口区域,所述第二掩膜板具有与显示区域一一对应的第二类开口区域,与同一开口区域对应的第一类开口区域和第二类开口区域构成互补图案,且第一类开口区域和第二类开口区域拼接形成的图案对应具有孤立镂空图案的显示区域。
一种可能的实施方式中,与同一开口区域对应的第一类开口区域和第二类开口区域在相邻边缘处的厚度大于其他边缘处的厚度。
一种可能的实施方式中,与同一开口区域对应的第一类开口区域和第二类开口区域具有相反的图案。
第三方面,本公开实施例提供了一种显示面板,包括衬底基板和形成于所述衬底基板上的蒸镀膜层,其中,所述蒸镀膜层采用第一方面任一所述的蒸镀方法形成。
一种可能的实施方式中,所述蒸镀膜层包括:发光层、电子传输层、空穴传输层。
一种可能的实施方式中,所述蒸镀膜层具有至少一个孤立镂空图案。
第四方面,本公开实施例提供了一种显示装置,该显示装置包括如第三方面任一项所述的显示面板。
本公开实施例通过依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀,其中,各个掩膜板开口区域在衬底基板形成的蒸镀子图案构成互补图案,该互补图案对应具有孤立镂空图案的显示区域,所以即可实现在显示面板制作透光区域的目的,且不需要增加工艺,从而降低了显示面板的加工工艺的复杂度。
根据本公开一个方面,提供了一种蒸镀方法,包括:采用第一掩膜板对衬底基板进行第一蒸镀,以在所述衬底基板上形成第一蒸镀子图案,其中所述第一掩膜板具有第一开口区域;以及采用第二掩膜板对所述衬底基板进行第二蒸镀,以在所述衬底基板上形成第二蒸镀子图案,其中所述第二掩膜板具有第二开口区域;其中所述第一和第二蒸镀子图案组合形成蒸镀图案。
在一些实施例中,所述第一和第二蒸镀子图案构成互补图案。
在一些实施例中,所述第一和第二蒸镀子图案组合形成的蒸镀图案对应具有孤立镂空图案的显示区域。
在一些实施例中,在进行所述第一蒸镀时所述第一掩膜板在所述衬底基板上的垂直投影与在进行所述第二蒸镀时所述第二掩膜板在所述衬底基板上的垂直投影具有重叠的部分,所述重叠的部分分别与所述第一开口区域和所述第二开口区域关联。
在一些实施例中,所述第一和第二蒸镀子图案组合形成的蒸镀图案具有孤立开口,所述孤立开口的至少一部分与所述重叠的部分对应。
在一些实施例中,在进行第一蒸镀时与所述第一掩模板对应的蒸镀源的蒸镀角度不同于在进行第二蒸镀时与所述第二掩模板对应的蒸镀源的蒸镀角度。
在一些实施例中,所述蒸镀方法还包括:采用第三掩膜板对所述衬底基板进行第三蒸镀,以在所述衬底基板上形成第三蒸镀子图案,其中所述第三掩膜板具有第三开口区域;其中所述第一、第二和第三蒸镀子图案组合形成蒸镀图案。
根据本公开一个方面,提供了一种蒸镀掩膜模组,包括至少两个掩膜板,其中,每个所述掩膜板设置有至少一个与的开口区域,其中,所述至少两个掩膜板的对应的开口区域构成互补图案,且所述至少两个掩膜板的对应的开口区域的组合能够用于形成具有孤立镂空图案的蒸镀层。
在一些实施例中,所述至少两个掩膜板包括第一掩膜板和第二掩膜板;所述第一掩膜板具有第一开口区域,所述第二掩膜板具有与所述第一开口区域对应的第二开口区域,所述第一开口区域和第二开口区域构成互补图案,且所述第一开口区域和第二开口区域的组合能够用于形成具有孤立镂空图案的蒸镀层。
在一些实施例中,所述至少两个掩膜板的对应的开口区域各自的在彼此相邻的边缘处的厚度大于各自的在其他边缘处的厚度。
在一些实施例中,对应的第一开口区域和第二开口区域具有相反的图案。
在一些实施例中,所述蒸镀掩膜模组被配置为在利用所述蒸镀掩膜模组对衬底基板进行蒸镀时,所述第一掩膜板在所述衬底基板上的垂直投影与所述第二掩膜板在所述衬底基板上的垂直投影具有重叠的部分,所述重叠的部分分别与所述第一开口区域和所述第二开口区域关联。
在一些实施例中,所述重叠的部分使得:利用所述蒸镀掩膜模组对衬底基板进行蒸镀而形成的蒸镀图案具有孤立开口。
根据本公开一个方面,提供了一种显示面板,包括衬底基板和形成于所述衬底基板上的蒸镀膜层,其中,所述蒸镀膜层采用根据本公开任一实施例所述的蒸镀方法形成。
在一些实施例中,所述蒸镀膜层包括下列中的一种或多种:发光层、电子传输层、空穴传输层。
在一些实施例中,所述蒸镀膜层具有至少一个孤立镂空图案。
根据本公开一个方面,提供了一种显示装置,包括根据本公开任意实施例所述的显示面板。
附图说明
图1为本公开实施例提供的掩膜模组的一种结构示意图;
图2为本公开实施例提供的掩膜模组的一种结构示意图;
图3为本公开实施例提供的掩膜模组的一种结构示意图;
图4为本公开实施例提供的蒸镀工艺的一种示意图;
图5为本公开实施例提供的蒸镀工艺的一种示意图;
图6为本公开实施例提供的掩膜模组的一种结构示意图;
图7为本公开实施例提供的掩膜模组的一种结构示意图;
图8为本公开实施例提供的掩膜模组的一种结构示意图;
图9为本公开实施例提供的掩膜模组的一种结构示意图;
图10为本公开实施例提供的掩膜模组的一种结构示意图;
图11为本公开实施例提供的掩膜模组的一种结构示意图;
图12为本公开实施例提供的掩膜模组的一种结构示意图;
图13为本公开实施例提供的掩膜模组的一种结构示意图。
具体实施方式
为使本公开的目的、技术方案和优点更加清楚明白,下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述。
下面结合附图,对本公开实施例提供的蒸镀方法、蒸镀掩膜模组、显示面板及显示装置的具体实施方式进行详细地说明。
附图中各膜层的厚度和形状不反映真实比例,目的只是示意说明本公开内容。
本公开实施例提供了一种蒸镀方法,该蒸镀方法在具体执行时,依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀。也就是先采用第一个掩膜板通过蒸镀工艺在衬底基板上形成与第一个掩膜板的开口区域对应的蒸镀子图形,再继续采用第二个掩膜板或者其他掩膜板通过多次蒸镀工艺在衬底基板上形成部分蒸镀子图形,从而在衬底基板上形成蒸镀图形。
本公开实施例中,所采用的各个掩模板的开口区域在衬底基板上形成的各蒸镀子图案构成互补图案,且各个蒸镀子图案拼接形成的蒸镀图案对应具有孤立镂空图案的显示区域,孤立镂空图案可以对应显示面板的透光区域,所以可实现在显示面板制作透光区域的目的,且不需要增加工艺,从而降低了显示面板的加工工艺的复杂度。
由于本公开实施例在衬底基板形成的蒸镀图形是通过各个掩模板的开口区域在衬底基板上形成的各蒸镀子图案构成的互补图案,在具体蒸镀时,衬底基板上需要蒸镀的区域在蒸镀工艺中仅有一次掩膜,而需遮挡的区域均被掩膜,也就是有两次掩膜,所以各个掩膜板开口区域的边缘处蒸镀的材料的厚度相较于其他区域的材料的厚度可能较厚。为此,本公开实施例在依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀时,可以调整蒸镀源与各掩膜板之间的蒸镀角度,以使得各掩模板对应的蒸镀源具有不同的蒸镀角度,以尽量保证所蒸镀的材料的厚度一致。
相应地,请参见图1和图2,本公开实施例还提供了一种蒸镀掩膜模组,该蒸镀掩膜模组包括至少两个掩膜板,其中,每个掩膜板上设置有呈阵列排布的多个与显示区域一一对应的开口区域,与同一开口区域对应的各开口区域构成互补图案,且各开口区域拼接形成的图案对应具有孤立镂空图案的显示区域。该蒸镀掩膜模组包括的至少两个掩膜板可用于对衬底基板进行蒸镀。
为了便于理解,下面通过掩膜板包括第一掩膜板10和第二掩膜板20,即两个掩膜板为例详细介绍本公开实施例提供的技术方案。
请参见图2,本公开实施例的上述掩膜板在具体实施时,该掩膜板可以包括第一掩膜板10和第二掩膜板20,其中,第一掩膜板10具有与显示区域一一对应的第一类开口区域(图2以空白区域进行示意),第二掩膜板20具有与显示区域一一对应的第二类开口区域(图2以阴影区域进行示意),与同一开口区域对应的第一类开口区域和第二类开口区域构成互补图案,且第一类开口区域和第二类开口区域拼接形成的图案对应具有孤立镂空图案的显示区域。
以第一类开口区域和第二类开口区域拼接形成的图案为显示区域中透光区域的通孔图案为例,第一类开口区域和第二类开口区域拼接形成的图案为圆形,如图2所示。图2中第一类开口区域和第二类开口区域是需要遮挡的区域,掩膜板上非第一类开口区域或第二类开口区域的区域是蒸镀区域,也就是需要蒸镀材料的区域。
请参见图3,结合图4和图5,图3所示本公开实施例采用如图2所示的掩膜板对衬底基板进行蒸镀的方法,具体流程描述如下:
如图4所示,步骤S301、将第一掩膜板10设置于衬底基板的上方,并通过蒸镀工艺 对衬底基板进行蒸镀,形成第一蒸镀子图案30。其中,图4中,箭头方向代表蒸镀源的光照入射方向。
如图5所示,步骤S302、将第二掩膜板20设置于衬底基板的上方,并通过蒸镀工艺对衬底基板进行蒸镀,形成第二蒸镀子图案40。其中,图5中,箭头方向代表蒸镀源的光照入射方向。
第一掩膜板10的第一类开口区域和第二掩膜板20的第二类开口区域相对设置,构成互补图案,且第一类开口区域和第二类开口区域拼接形成的图案为圆形50,与具有孤立镂空图案的显示区域对应,形成透光区域,实现了在显示面板制作透光区域的目的,且不需要增加工艺,从而降低了显示面板的加工工艺的复杂度。
需要说明的是,本公开实施例对第一掩膜板10的第一类开口区域的形状和第二掩膜板20的第二类开口区域的形状不作限制,只要第一类开口区域和第二类开口区域形成的互补图案与具有孤立镂空图案的显示区域对应即可。本公开实施例中,与同一开口区域对应的第一类开口区域和第二类开口区域具有相反的图案。
由于衬底基板上需要蒸镀的区域在蒸镀工艺中仅有一次掩膜,而需遮挡的区域均被掩膜,也就是有两次掩膜,这就可能导致与同一开口区域对应的第一类开口区域和第二类开口区域在相邻边缘处所蒸镀的材料的厚度相较于其他区域的材料的厚度可能较厚。因此,与同一开口区域对应的第一类开口区域和第二类开口区域在相邻边缘的长度尽量较短。
可能的实施方式中,请参见图6,提供了第一掩膜板10和第二掩膜板20的一种可能的实施方式,第一类开口区域可以是如图6左边示意的第一掩膜板10上的开口区域,对应地,第二类开口区域是如图6右边示意的第二掩膜板20上的开口区域。优选地,相较于图2所示的第一掩膜板10和第二掩膜板20来说,图6所示的第一掩膜板10和第二掩膜板20由于第一类开口区域和第二类开口区域相邻边缘的长度更短。与图6所示的第一掩膜板10和第二掩膜板20对应的蒸镀掩膜模组如图7所示。
可能的实施方式中,请参见图8,提供了第一掩膜板10和第二掩膜板20的另一种可能的实施方式,第一类开口区域可以是如图8左边示意的第一掩膜板10上的开口区域,对应地,第二类开口区域是如图8右边示意的第二掩膜板20上的开口区域。优选地,相较于图7所示的第一掩膜板10和第二掩膜板20来说,图8所示的第一掩膜板10和第二掩膜板20由于第一类开口区域和第二类开口区域相邻边缘的长度更短。
可能的实施方式中,请参见图9,提供了第一掩膜板10和第二掩膜板20的又一种可能的实施方式,第一类开口区域可以是如图9左边示意的第一掩膜板10上的开口区域,对应地,第二类开口区域是如图9右边示意的第二掩膜板20上的开口区域。优选地,相 较于图8所示的第一掩膜板10和第二掩膜板20来说,图8所示的第一掩膜板10和第二掩膜板20由于第一类开口区域和第二类开口区域相邻边缘的长度更短。
为了尽量使得与同一开口区域对应的第一类开口区域和第二类开口区域在相邻边缘处所蒸镀的材料的厚度与其他区域的材料的厚度一致,在本公开实施例中,与同一开口区域对应的第一类开口区域和第二类开口区域在相邻边缘处的厚度大于其他边缘处的厚度。
例如,请参见图10,图10为第一掩膜板10在第一类开口区域和第二掩膜板20在第二类开口区域沿厚度方向的截面图。从图10可以看出,第一类开口区域和第二类开口区域在相邻边缘处的厚度大于其他边缘处的厚度时,衬底基板100被重复蒸镀的材料如图10中虚线示意的部分,以尽量避免虚线区域重复蒸镀,其中,图10中箭头方向表示蒸镀源的光照入射角度。
需要说明的是,上述第一掩膜板10的第一类开口区域只有一个开口区域,同样地,第二掩膜板20上的第二类开口区域也是只有一个开口区域,实际上,第一掩膜板10和第二掩膜板20上的开口区域可以包括多个,只要第一掩膜板10上的开口区域和第二掩膜板20上的开口区域形成的互补图案与具有孤立镂空图案的显示区域对应即可。
例如,假设显示区域具有的孤立镂空图案是两个圆孔,则第一掩膜板10和第二掩膜板20在具体实施时,包括如下的可能实施方式。
请参见图11,提供了第一掩膜板10和第二掩膜板20的一种可能的实施方式,第一类开口区域可以是如图11左边示意的第一掩膜板10上的开口区域,对应地,第二类开口区域是如图11右边示意的第二掩膜板20上的开口区域。
请参见图12,提供了第一掩膜板10和第二掩膜板20的一种可能的实施方式,第一类开口区域可以是如图12左边示意的第一掩膜板10上的开口区域,对应地,第二类开口区域是如图12右边示意的第二掩膜板20上的开口区域。
请参见图13,提供了第一掩膜板10和第二掩膜板20的一种可能的实施方式,第一类开口区域可以是如图13左边示意的第一掩膜板10上的开口区域,对应地,第二类开口区域是如图13右边示意的第二掩膜板20上的开口区域。
综上,本公开实施例通过依次采用至少两个掩膜板具有的开口区域对衬底基板进行蒸镀,其中,各个掩膜板开口区域在衬底基板形成的蒸镀子图案构成互补图案,该互补图案对应具有孤立镂空图案的显示区域,所以即可实现在显示面板制作透光区域的目的,且不需要增加工艺,从而降低了显示面板的加工工艺的复杂度。
还应理解,本公开还构思了以下实现方式。
根据本公开一个方面,提供了一种蒸镀方法,包括:采用第一掩膜板对衬底基板进行 第一蒸镀,以在所述衬底基板上形成第一蒸镀子图案,其中所述第一掩膜板具有第一开口区域;以及采用第二掩膜板对所述衬底基板进行第二蒸镀,以在所述衬底基板上形成第二蒸镀子图案,其中所述第二掩膜板具有第二开口区域;其中所述第一和第二蒸镀子图案组合形成蒸镀图案。
在一些实施例中,所述第一和第二蒸镀子图案构成互补图案。
在一些实施例中,所述第一和第二蒸镀子图案组合形成的蒸镀图案对应具有孤立镂空图案的显示区域。
在一些实施例中,在进行所述第一蒸镀时所述第一掩膜板在所述衬底基板上的垂直投影与在进行所述第二蒸镀时所述第二掩膜板在所述衬底基板上的垂直投影具有重叠的部分,所述重叠的部分分别与所述第一开口区域和所述第二开口区域关联。
在一些实施例中,所述第一和第二蒸镀子图案组合形成的蒸镀图案具有孤立开口,所述孤立开口的至少一部分与所述重叠的部分对应。
在一些实施例中,在进行第一蒸镀时与所述第一掩模板对应的蒸镀源的蒸镀角度不同于在进行第二蒸镀时与所述第二掩模板对应的蒸镀源的蒸镀角度。
在一些实施例中,所述蒸镀方法还包括:采用第三掩膜板对所述衬底基板进行第三蒸镀,以在所述衬底基板上形成第三蒸镀子图案,其中所述第三掩膜板具有第三开口区域;其中所述第一、第二和第三蒸镀子图案组合形成蒸镀图案。
根据本公开一个方面,提供了一种蒸镀掩膜模组,包括至少两个掩膜板,其中,每个所述掩膜板设置有至少一个与的开口区域,其中,所述至少两个掩膜板的对应的开口区域构成互补图案,且所述至少两个掩膜板的对应的开口区域的组合能够用于形成具有孤立镂空图案的蒸镀层。
在一些实施例中,所述至少两个掩膜板包括第一掩膜板和第二掩膜板;所述第一掩膜板具有第一开口区域,所述第二掩膜板具有与所述第一开口区域对应的第二开口区域,所述第一开口区域和第二开口区域构成互补图案,且所述第一开口区域和第二开口区域的组合能够用于形成具有孤立镂空图案的蒸镀层。
在一些实施例中,所述至少两个掩膜板的对应的开口区域各自的在彼此相邻的边缘处的厚度大于各自的在其他边缘处的厚度。
在一些实施例中,对应的第一开口区域和第二开口区域具有相反的图案。
在一些实施例中,所述蒸镀掩膜模组被配置为在利用所述蒸镀掩膜模组对衬底基板进行蒸镀时,所述第一掩膜板在所述衬底基板上的垂直投影与所述第二掩膜板在所述衬底基板上的垂直投影具有重叠的部分,所述重叠的部分分别与所述第一开口区域和所述第二开 口区域关联。
在一些实施例中,所述重叠的部分使得:利用所述蒸镀掩膜模组对衬底基板进行蒸镀而形成的蒸镀图案具有孤立开口。
根据本公开一个方面,提供了一种显示面板,包括衬底基板和形成于所述衬底基板上的蒸镀膜层,其中,所述蒸镀膜层采用根据本公开任一实施例所述的蒸镀方法形成。
在一些实施例中,所述蒸镀膜层包括下列中的一种或多种:发光层、电子传输层、空穴传输层。
在一些实施例中,所述蒸镀膜层具有至少一个孤立镂空图案。
根据本公开一个方面,提供了一种显示装置,包括根据本公开任意实施例所述的显示面板。
基于同一发明思想,本公开实施例还提供了一种显示面板,包括衬底基板和形成于衬底基板上的蒸镀膜层,其中,蒸镀膜层采用上述所述的蒸镀方法形成。可能的实施方式中,蒸镀膜层包括发光层、电子传输层、空穴传输层,蒸镀膜层具有至少一个孤立镂空图案。可以理解的是,该显示面板的显示区域可以包括至少一个像素单元,使得该显示面板既可以应用于常规显示领域,又可以应用于微显示技术领域,该显示面板的显示区域具有孤立镂空图案,可以用来制作透光区域,例如安装摄像头等;并且该显示面板可以为:手机、平板电脑、电视机、显示器、笔记本电脑、数码相机、导航仪、智能手表、健身腕带、个人数字助理、自助存/取款机等任何具有显示功能的产品或部件。对于显示面板的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的,在此不做赘述,也不应作为对本公开的限制。该显示面板的实施可以参见下述封装结构的实施例。
基于同一发明思想,本公开实施例还提供了一种显示装置,包括本公开实施例提供的上述任一种的显示面板。该显示装置可以为:手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。该显示装置的实施可以参见上述显示面板的实施例,重复之处不再赘述。
显然,本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样,倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内,则本公开也意图包含这些改动和变型在内。

Claims (17)

  1. 一种蒸镀方法,包括:
    采用第一掩膜板对衬底基板进行第一蒸镀,以在所述衬底基板上形成第一蒸镀子图案,其中所述第一掩膜板具有第一开口区域;以及
    采用第二掩膜板对所述衬底基板进行第二蒸镀,以在所述衬底基板上形成第二蒸镀子图案,其中所述第二掩膜板具有第二开口区域;
    其中所述第一和第二蒸镀子图案组合形成蒸镀图案。
  2. 如权利要求1所述的蒸镀方法,所述第一和第二蒸镀子图案构成互补图案。
  3. 如权利要求1所述的蒸镀方法,其中所述第一和第二蒸镀子图案组合形成的蒸镀图案对应具有孤立镂空图案的显示区域。
  4. 如权利要求1所述的蒸镀方法,其中,在进行所述第一蒸镀时所述第一掩膜板在所述衬底基板上的垂直投影与在进行所述第二蒸镀时所述第二掩膜板在所述衬底基板上的垂直投影具有重叠的部分,所述重叠的部分分别与所述第一开口区域和所述第二开口区域关联。
  5. 如权利要求4所述的蒸镀方法,其中所述第一和第二蒸镀子图案组合形成的蒸镀图案具有孤立开口,所述孤立开口的至少一部分与所述重叠的部分对应。
  6. 如权利要求1所述的蒸镀方法,其中在进行第一蒸镀时与所述第一掩模板对应的蒸镀源的蒸镀角度不同于在进行第二蒸镀时与所述第二掩模板对应的蒸镀源的蒸镀角度。
  7. 如权利要求1所述的蒸镀方法,还包括:
    采用第三掩膜板对所述衬底基板进行第三蒸镀,以在所述衬底基板上形成第三蒸镀子图案,其中所述第三掩膜板具有第三开口区域;
    其中所述第一、第二和第三蒸镀子图案组合形成蒸镀图案。
  8. 一种蒸镀掩膜模组,包括至少两个掩膜板,
    其中,每个所述掩膜板设置有至少一个与的开口区域,
    其中,所述至少两个掩膜板的对应的开口区域构成互补图案,且所述至少两个掩膜板的对应的开口区域的组合能够用于形成具有孤立镂空图案的蒸镀层。
  9. 如权利要求8所述的蒸镀掩膜模组,所述至少两个掩膜板包括第一掩膜板和第二掩膜板;
    所述第一掩膜板具有第一开口区域,所述第二掩膜板具有与所述第一开口区域对应的第二开口区域,
    所述第一开口区域和第二开口区域构成互补图案,且所述第一开口区域和第二开口区域的组合能够用于形成具有孤立镂空图案的蒸镀层。
  10. 如权利要求8所述的蒸镀掩膜模组,其中所述至少两个掩膜板的对应的开口区域各自的在彼此相邻的边缘处的厚度大于各自的在其他边缘处的厚度。
  11. 如权利要求9所述的蒸镀掩膜模组,其中对应的第一开口区域和第二开口区域具有相反的图案。
  12. 如权利要求9所述的蒸镀掩膜模组,其中,所述蒸镀掩膜模组被配置为在利用所述蒸镀掩膜模组对衬底基板进行蒸镀时,所述第一掩膜板在所述衬底基板上的垂直投影与所述第二掩膜板在所述衬底基板上的垂直投影具有重叠的部分,所述重叠的部分分别与所述第一开口区域和所述第二开口区域关联。
  13. 如权利要求12所述的蒸镀掩膜模组,其中所述重叠的部分使得:利用所述蒸镀掩膜模组对衬底基板进行蒸镀而形成的蒸镀图案具有孤立开口。
  14. 一种显示面板,包括衬底基板和形成于所述衬底基板上的蒸镀膜层,其中,所述蒸镀膜层采用上述权利要求1-7中任一所述的蒸镀方法形成。
  15. 如权利要求14所述的显示面板,所述蒸镀膜层包括下列中的一种或多种:发光层、电子传输层、空穴传输层。
  16. 如权利要求14所述的显示面板,所述蒸镀膜层具有至少一个孤立镂空图案。
  17. 一种显示装置,包括14-16任一项所述的显示面板。
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