WO2020151423A1 - 柔性电路板、电容屏及柔性电路板加工方法 - Google Patents

柔性电路板、电容屏及柔性电路板加工方法 Download PDF

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Publication number
WO2020151423A1
WO2020151423A1 PCT/CN2019/126745 CN2019126745W WO2020151423A1 WO 2020151423 A1 WO2020151423 A1 WO 2020151423A1 CN 2019126745 W CN2019126745 W CN 2019126745W WO 2020151423 A1 WO2020151423 A1 WO 2020151423A1
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WIPO (PCT)
Prior art keywords
conductive
circuit board
flexible circuit
conductive sheet
layer
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Ceased
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PCT/CN2019/126745
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English (en)
French (fr)
Inventor
马正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Shiyuan Electronics Thecnology Co Ltd
Guangzhou Shirui Electronics Co Ltd
Original Assignee
Guangzhou Shiyuan Electronics Thecnology Co Ltd
Guangzhou Shirui Electronics Co Ltd
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Application filed by Guangzhou Shiyuan Electronics Thecnology Co Ltd, Guangzhou Shirui Electronics Co Ltd filed Critical Guangzhou Shiyuan Electronics Thecnology Co Ltd
Publication of WO2020151423A1 publication Critical patent/WO2020151423A1/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Definitions

  • the present disclosure relates to the technical field of capacitive touch screens, and in particular to a flexible circuit board, a capacitive screen and a method for processing the flexible circuit board.
  • the silver glue is not bound to the gap tightly.
  • the silver glue is likely to crack and fall off, resulting in poor contact.
  • the purpose of the present disclosure is to improve the defects of the prior art and provide a flexible circuit board, a capacitive screen, and a flexible circuit board processing method.
  • the conductive connection structure of the present disclosure is stable and can solve the problem of poor contact of the flexible circuit board.
  • a flexible circuit board includes: a base layer and a conductive layer, the conductive layer is attached to the base layer, the conductive layer has at least a conductive sheet and a conductive wire, the conductive sheet and the conductive wire are electrically connected to each other, and the conductive sheet is located on the conductive connection side.
  • the sheet has a first relief, and the opening width of the first relief gradually decreases from the outside to the inside.
  • the maximum width of the first relief gap is between 1 mm and 5 mm.
  • the width of the conductive sheet is between 2 mm and 10 mm.
  • the width of the first relief is 10% to 70% of the width of the conductive sheet.
  • the edge of the first gap is a circular arc segment.
  • arc segments There are multiple arc segments, and the multiple arc segments have at least two arc curvatures.
  • first arc segment There are three arc segments, followed by a first arc segment, a second arc segment, and a third arc segment.
  • the curvature of the first arc segment and the third arc segment are the same.
  • the curvature of the second arc segment is greater than the curvatures of the first arc segment and the third arc segment; the first arc segment and the third arc segment are respectively located in the first retreat On both sides of the gap edge, the second arc segment is located in the middle of the first gap edge.
  • conductive sheets which are arranged side by side along the conductive connection side, and there is a gap area between two adjacent conductive sheets, and the width of the gap area is greater than the width of the conductive sheet.
  • the width of the gap region is greater than 1.5 times the width of the conductive sheet.
  • the width of the gap area is between 2.5 mm and 20 mm.
  • the area of the first relief is greater than one-sixth of the area of the conductive sheet.
  • It also includes a protective layer covering the conductive layer; the conductive layer is located on the front surface of the base layer, the protective layer includes at least a front cover layer, and the front cover layer has a second gap, The second relief is positioned opposite to the conductive sheet, and at least a part of the upper surface of the conductive sheet is exposed relative to the second relief to form a first conductive surface.
  • the area of the second relief is greater than one third of the area of the conductive sheet.
  • the second vacancy has a circular arc shape.
  • the conductive layer is also provided on the back of the base layer, the protective layer further includes a back cover layer, the back cover layer has a third relief, and the third relief is positioned opposite to the conductive sheet on the back At least a part of the lower surface of the conductive sheet is exposed relative to the third gap to form a second conductive surface.
  • the exposed area of the first conductive surface of the upper surface of the conductive sheet relative to the front cover layer is larger than the exposed area of the second conductive surface of the conductive sheet relative to the back cover layer.
  • the flexible circuit board further includes a gold finger, the gold finger has a base surface and a conductive surface, the conductive surface is electrically connected to the conductive wire, and the direction of the conductive surface is opposite to the first conductive surface, The direction of the surface of the substrate is the same as that of the first conductive surface.
  • a fourth gap is provided on the base layer, and the position of the fourth gap corresponds to the position of the first gap.
  • the fourth gap is flush with the first gap.
  • a capacitive screen comprising a screen body and any one of the flexible circuit boards, the screen body has conductive contacts, and the back of the flexible circuit board and the screen body are electrically connected through a connection layer.
  • the conductive connecting body is crimped on the conductive sheet and electrically connected to the conductive contact at the first gap.
  • a method for processing a flexible circuit board comprising the following steps:
  • An opening is processed on the conductive sheet, and the width of the opening gradually becomes smaller from the outside to the inside to form the first relief.
  • a circular arc is drilled on the conductive sheet to form the first gap.
  • Drilling a circular arc on the conductive sheet to form the first relief gap includes: drilling a large circular arc segment with a small curvature and a small circular arc segment with a large curvature on the conductive sheet at least twice to form a The first gives way to the absence.
  • the aforementioned conductive sheet can be made of a metal material with good conductivity, and the conductive sheet is usually made of copper foil in the actual production process.
  • arc curvature refers to the approximate arc profile of the arc segment, not the arc segment formed by the splicing of fine arcs of each small segment.
  • the first conductive surface and the second conductive surface formed on the upper and lower surfaces of the conductive sheet have good conductivity.
  • the conductive contact at least partially extends to the second and third recesses.
  • the material of the aforementioned conductive connector is metal or non-metal with certain conductivity.
  • the conductive connector usually uses silver glue.
  • the large arc segment with small curvature drilled for the first time on the aforementioned processed conductive sheet is the first arc segment and the third arc segment, and the small arc segment with large curvature drilled for the second time is the second arc.
  • the relationship between the curvature of the aforementioned two arcs is relative.
  • the flexible circuit board, the conductive layer is attached to the base layer, the opening width of the first relief gradually decreases from the outside to the inside to the direction, so that the first relief has a V-shaped shape, and the first relief
  • the size of the gap is wider than the gap of the traditional slender strip.
  • the structure of the first gap is stable, so that the conductive sheet is not easily broken with the conductive connector under the bending action of the external force on the conductive connection side, and the conductive layer is avoided. Poor contact and open circuit binding.
  • the edge of the first gap is a circular arc segment.
  • the three arc segments There are three arc segments, and the three arc segments have two arc curvatures.
  • the curvature of the second arc segment is smaller than that of the first and third arc segments to facilitate Simplify the machining process of machining arc segments.
  • the first arc and the third arc only need to be drilled, and the second arc only needs to be drilled in the middle of the first gap.
  • the three arc segment drills only need two drills to drill, which makes the processing easier, and at the same time reduces the defective rate in the processing and manufacturing process.
  • the conductive sheet with a smaller width can also reduce the bending stress of the flexible circuit board, so that the conductive sheet is not easy to lift up when the flexible circuit board is bent.
  • the width of the gap area is greater than 1.5 times the width of the conductive sheet, so as to reduce the bending stress of the flexible circuit board, so that the flexible circuit board has a greater degree of bending, and can be produced and processed with longer length dimensions. Larger capacitive screen with better detection accuracy and sensitivity.
  • the area of the first gap is greater than one-sixth of the area of the conductive sheet, which is beneficial to increase the contact area of the conductive sheet and the conductive contact through the electrical connection of the conductive connector, thereby enhancing the stability of the flexible circuit board structure Sex.
  • the second relief on the front cover layer is opposite to the conductive sheet, so that the conductive connector is crimped and bound to the conductive sheet at the second relief via the first conductive surface, and passes through at least part of the upper surface of the conductive sheet.
  • the first conductive surface bound on the conductive sheet is crimped by the conductive connector to electrically connect the conductive sheet with the conductive contact, and the conductive sheet will then receive the conductive
  • the current signal detected by the contact is transmitted to the conductive line; the front cover layer and the back cover layer are used to cover the conductive line in the conductive layer and at least a part of the conductive sheet.
  • the area relationship between the second relief and the conductive sheet is conducive to exposing more of the first conductive surface to the conductive sheet through the second relief, which is beneficial to increase the crimping and binding of the conductive connector to the conductive
  • the area of the sheet makes the conductive sheet bonded by crimping stronger and more stable.
  • the second concession in the shape of an arc is in order to simplify the process flow of the product.
  • the back cover layer has a third gap, and a part of the lower surface of the conductive sheet forms a second conductive surface.
  • the conductive connector is crimped and bound to the conductive sheet while making the lower surface of the conductive sheet
  • the second conductive surface is electrically connected to the conductive contact. While the first conductive surface is conductive, the second conductive surface is electrically connected to the conductive contact.
  • This bidirectional conductive effect can further enhance the stability of the flexible circuit board, and the back cover
  • the third gap of the layer can expose a part of the lower surface of the conductive sheet, which is beneficial to increase the contact area between the conductive sheet and the conductive connector, so that the conductive connector can crimp the conductive sheet more stably.
  • the larger area of the first conductive surface is conductive, so that the second conductive surface avoids forming a cavity, avoiding the influence of the contact conduction, and further improving the conductive performance of the conduction.
  • the direction of the conductive surface of the gold finger is opposite to the direction of the first conductive surface, that is, the direction of the conductive surface and the conductive connecting body that is connected to the second recess in the opposite direction.
  • the conductive contacts of the capacitive screen collect current signals from the screen. Because the conductive contacts pass through the conductive connector and are electrically connected to the first conductive surface of the flexible circuit board, and because the conductive connector makes way for the second The crimping function of the defect, the conductive connector is electrically connected to the second conductive surface at the same time, and then the current signal is transmitted to the conductive sheet through the first conductive surface and the second conductive surface, and then the current signal is transmitted to the conductive wire by the conductive sheet on.
  • FIG. 1 is an enlarged cross-sectional view of the flexible circuit board according to the first embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of the structure of the conductive sheet according to the first embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of the structure of the conductive layer according to the first embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of the structure of the front cover layer according to the first embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of the structure of the back cover layer according to the first embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of the structure of the conductive layer according to the first embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of the structure of the flexible circuit board according to the first embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of the structure of the conductive sheet according to the second embodiment of the present disclosure.
  • the capacitive screen 50 includes a screen body 51 and a flexible circuit board.
  • the flexible circuit board includes: a base layer 22, a conductive layer 10, and a protective layer.
  • the conductive layer 10 is attached to the base layer 22.
  • the protective layer covers the conductive layer 10.
  • the conductive layer 10 has a conductive sheet 11 and a conductive wire 12, a conductive sheet 11 and a conductive wire 12 are electrically connected to each other.
  • the conductive sheet 11 is located on the conductive connection side.
  • the conductive sheet 11 has a first relief 16 whose opening width gradually decreases from the outside to the inside. The opening width of a relief 16 gradually increases in the direction away from the conductive line (in this embodiment, the edge of the first relief 16 is a circular arc segment).
  • the screen body 51 has conductive contacts 52, and the back of the flexible circuit board and the screen body 51 are electrically connected through the connection layer 70.
  • the conductive connection body 60 is crimped on the conductive sheet 11 and is connected to the first gap 16
  • the conductive contacts 52 are electrically connected.
  • the area of the first relief 16 is greater than one-sixth of the area of the conductive sheet 11; the area of the second relief 21 is greater than one-third of the area of the conductive sheet 11.
  • conductive sheets 11 There are dozens of conductive sheets 11, which are arranged side by side along the conductive connection side. There is a gap region 15 between two adjacent conductive sheets 11, and the width of the gap region 15 is greater than the width of the conductive sheet 11; The width of the region 15 is greater than 1.5 times the width of the conductive sheet 11.
  • the gold finger 40 has a substrate surface and a conductive surface.
  • the conductive surface is electrically connected to the conductive wire 12, and the conductive surface is opposite to the first conductive surface 13, and the substrate surface is The directions of the first conductive surface 13 are the same.
  • the three arc segments have two arc curvatures, which are the first arc segment 161, the second arc segment 162, the third arc segment 163, and the first arc segment 161
  • the curvature of the third arc segment 163 is the same, and the curvature of the second arc segment 162 is greater than that of the first arc segment 161 and the third arc segment 163; the first arc segment 161 and the third arc segment 163 are respectively Located on both sides of the edge of the first recess 16, the second arc segment 162 is located in the middle of the edge of the first recess 16.
  • the conductive layer 10 is located on the front surface of the base layer 22, and the protective layer includes a front cover layer 20.
  • the front cover layer 20 has a second relief 21, and the second relief 21 is positioned opposite to the conductive sheet 11.
  • the second gap 21 is arc-shaped.
  • a part of the upper surface of the conductive sheet 11 is exposed relative to the second relief 21 to form a first conductive surface 13; the conductive layer 10 is also provided on the back of the base layer 22, and the protective layer further includes a back cover layer 30 ,
  • the back cover layer 30 has a third relief 31, the third relief 31 is opposite to the conductive sheet 11 on the back, and at least a part of the lower surface of the conductive sheet 11 is exposed relative to the third relief 31 to form a third relief.
  • Two conductive surfaces 14; the exposed area of the first conductive surface 13 of the upper surface of the conductive sheet 11 relative to the front cover layer 20 is larger than the exposed area of the second conductive surface 14 of the conductive sheet 11 relative to the back cover layer 30.
  • the base layer 22 is provided with a fourth gap, and the fourth gap is flush with the first gap 16.
  • the maximum width of the first relief is 1.9 mm
  • the width of the conductive sheet is 3.0 mm
  • the width of the gap area is 5.3 mm.
  • the conductive sheet 11 is copper foil
  • the conductive connector 60 is silver glue
  • a plurality of conductive wires 12 are arranged between the protective layer and the base layer 22
  • the conductive sheet 11 for the conductive connection side refers to the capacitive screen 50
  • the connection layer 70 can be adhesive, or double-sided adhesive or other adhesives.
  • the flexible circuit board processing method is that the method includes the following steps: depositing copper on the base layer 22 and forming a conductive layer 10 with a conductive sheet 11 and a conductive wire 12; covering the conductive layer 10 with a protective film and forming a protective layer; A circular arc is drilled on the conductive sheet 11 and a first gap 16 is formed; a large circular arc section with a small curvature and a small circular arc section with a large curvature are drilled on the conductive sheet 11 twice, and the The first handicap is missing 16.
  • the flexible circuit board, the conductive layer 10 is attached to the base layer 22, the protective layer covers the conductive layer 10, so that the protective layer, the conductive layer 10 and the base layer 22 are crimped and bound to each other to prevent the conductive sheet 11 and the conductive wire of the conductive layer 10 12 is displaced relative to the protective layer and the base layer 22, which can increase the reliability of the flexible circuit board.
  • the conductive sheet 11 and the conductive wire 12 are electrically connected to each other, so that the conductive sheet 11 transmits the received current signal to the conductive wire 12.
  • This process processes the conductive sheet
  • the size of the first relief 16 of 11 is wider than that of the traditional slender strip.
  • the structure of the first relief 16 is stable, so that the conductive sheet 11 is not easy to interact with each other under the bending action of the external force on the conductive connection side.
  • the conductive connector 60 is broken to avoid poor contact and open bonding of the conductive layer 10, thereby enhancing the detection accuracy and sensitivity of the flexible circuit board; the screen body 51 of the capacitive screen 50 has conductive contacts 52, which are bound by crimping
  • the conductive connector 60 fixed on the conductive sheet 11 makes the conductive connector 60 not only used for crimping and bonding, but also electrically connects the first gap 16 on the conductive sheet 11 with the conductive contact 52,
  • the connection structure between the conductive contacts 52 on the screen body 51 and the flexible circuit board greatly improves the stability of the capacitive screen 50, thereby solving the accuracy and sensitivity of the capacitive screen 50 during use. Sexual decline.
  • the curvature of the second arc segment 162 is smaller than that of the first arc segment 161 and the third arc segment 163.
  • the first arc and the third arc only need to be drilled, and the second arc only needs to be drilled in the middle of the 16 edge of the first gap. With one cut, only two cuts are required to process three arc segment drills, which makes the processing easier and reduces the defective rate in the process of processing.
  • the conductive sheet 11 with a smaller width can also reduce the bending stress of the flexible circuit board, so that the conductive sheet 11 is not easy to lift up when the flexible circuit board is bent.
  • the width of the gap area 15 is greater than 1.5 times the width of the conductive sheet 11, so as to reduce the bending stress of the flexible circuit board, so that the flexible circuit board has a greater degree of bending, and can be produced and processed.
  • Capacitive screen 50 with larger size and better detection accuracy and sensitivity.
  • the area of the first relief 16 is larger than one-sixth of the area of the conductive sheet 11, which is beneficial to increase the contact area of the conductive sheet 11 and the conductive contact 52 through the conductive connection body 60, thereby enhancing the flexibility The stability of the circuit board structure.
  • the second relief 21 on the front cover layer 20 is opposite to the conductive sheet 11, so that the conductive connector 60 is crimped and bound to the conductive sheet 11 through the first conductive surface 13 at the second relief 21, and passes At least a part of the upper surface of the conductive sheet 11 is exposed to the first conductive surface 13 formed by the second recess 21.
  • the first conductive surface 13 bound to the conductive sheet 11 is crimped through the conductive connector 60 to make the conductive sheet 11 is electrically connected to the conductive contact 52, and the conductive sheet 11 further receives the current signal detected by the conductive contact 52 and transmits it to the conductive wire 12.
  • the front cover layer 20 and the back cover layer 30 are used to cover the conductive layer 10
  • the conductive wire 12 and the conductive sheet 11 in at least part of the area.
  • the area relationship between the second relief 21 and the conductive sheet 11 is beneficial to allow the conductive sheet 11 to expose more of the first conductive surface 13 through the second relief 21, which is beneficial to increase the conductive connector 60
  • the crimping and binding are on the area of the conductive sheet 11, so that the crimping and binding conductive sheet 11 is stronger and more stable.
  • the arc-shaped second vacancy 21 is in order to simplify the process flow of the product.
  • the back cover layer 30 has a third gap 31, and a partial area of the lower surface of the conductive sheet 11 forms a second conductive surface 14.
  • the conductive connector 60 is crimped and bound to the conductive sheet 11 at the same time,
  • the second conductive surface 14 on the lower surface of the conductive sheet 11 is electrically connected to the conductive contact 52. While the first conductive surface 13 is conductive, the second conductive surface 14 is electrically connected to the conductive contact 52.
  • This bidirectional conductive effect can be
  • the stability of the flexible circuit board is further enhanced, and the third relief 31 of the back cover layer 30 can expose a part of the lower surface of the conductive sheet 11, which is beneficial to increase the contact area between the conductive sheet 11 and the conductive connector 60 to make the conductive sheet 11 more conductive.
  • the connecting body 60 crimps the conductive sheet 11 more stably.
  • a larger area of the first conductive surface 13 conducts, so that the second conductive surface 14 avoids forming a cavity, avoids affecting the contact conduction, and further improves the conduction performance of the conduction.
  • the direction of the conductive surface of the gold finger 40 is opposite to the direction of the first conductive surface 13, that is, the direction in which the conductive surface and the conductive connecting body 60 are connected to the second recess 21 is opposite; the conductive surface of the gold finger 40 is opposite to the conductive wire 12 Electrical connection to facilitate the transmission of the current signal through the conductive surface.
  • the conductive surface is electrically connected to the main control board.
  • the substrate surface can play a guiding role, making the electrical connection between the conductive surface and the main control board more effective. stable.
  • the conductive contact 52 of the capacitive screen 50 collects current signals from the screen 51. Because the conductive contact 52 passes through the conductive connector 60 and is electrically connected to the first conductive surface 13 of the flexible circuit board, and because the conductive connector 60 With the crimping effect at the second recess 21, the conductive connector 60 is electrically connected to the second conductive surface 14 at the same time, and then the current signal is transmitted to the conductive sheet through the first conductive surface 13 and the second conductive surface 14 11, and then the conductive sheet 11 transmits the current signal to the conductive wire 12.
  • the flexible circuit board processing method in this embodiment is that when processing the conductive layer 10 of the flexible circuit board, the drilling of the drill is reduced from the traditional drilling of more than ten drills to only two drills.
  • One arc segment and the second arc segment, and the first arc segment and the second arc segment form the first recess 16 on the conductive sheet 11.
  • the processing technology of the first recess 16 in the conductive layer 10 Simple and further improve the production efficiency of the enterprise.
  • the processing method of the capacitive screen 50 of the present disclosure only needs to drill two holes.
  • the first arc segment and the second arc segment can be drilled with a knife, so that the first arc segment and the second arc segment form a first gap 16 on the conductive sheet 11.
  • the processing method of the capacitive screen 50 It is simple and effectively reduces the process time of processing the capacitive screen 50.
  • the first gap 16 with the edge of a circular arc segment is one, and there is one circular arc segment.
  • the drill bit when processing the conductive sheet 11, the drill bit only needs to drill a knife and drill a circular arc segment to complete the processing of the conductive sheet 11, and the process of processing the conductive sheet 11 is more convenient.

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Abstract

一种柔性电路板、电容屏（50）及柔性电路板加工方法，该柔性电路板包括基层（22）及导电层（10），导电层（10）附于基层（22）上，导电层（10）至少具有导电片（11）及导电线（12），导电片（11）与导电线（12）相互电性连接，导电片（11）位于导电连接侧，所述导电片（11）上具有第一让位缺（16），该第一让位缺（16）的开口宽度由外侧向内侧方向逐渐变小。导电连接结构稳定，可以解决柔性电路板的接触不良及绑定开路的问题，加工导电片的工艺流程时间短，且钻取简便，结构更加稳定可靠。

Description

柔性电路板、电容屏及柔性电路板加工方法
本申请要求于2019年1月23日提交至中国国家知识产权局、申请号为201910064535.8发明名称为“柔性电路板、电容屏及柔性电路板加工方法”的专利申请的优先权。
技术领域
本公开涉及电容触摸屏技术领域，具体涉及一种柔性电路板、电容屏及柔性电路板加工方法。
背景技术
近年来，由于电容式触摸屏可以基于人体直接影响电场，电子产品的电容式触控技术的应用越来越广泛，根据市场及未来的发展方向，其电子产品中电容屏的尺寸不断增大。
由于传统工艺加工中导电片开槽的缺口过窄，银胶在缺口上绑定的力度不够，当柔性电路板弯折时容易出现银胶开裂、脱落的现象，导致进而出现接触不良的情况。
发明内容
本公开的目的在于改进现有技术的缺陷，提供一种柔性电路板、电容屏及柔性电路板加工方法，本公开的导电连接结构稳定，可以解决柔性电路板的接触不良的问题。
其技术方案如下：
一种柔性电路板，包括：基层及导电层，导电层附于基层上，导电层至少具有导电片及导电线，导电片与导电线相互电性连接，导电片位于导电连接侧，所述导电片上具有第一让位缺，该第一让位缺的开口宽度由外侧向内侧向方向逐渐变小。
所述第一让位缺的最大宽度在1毫米至5毫米之间。
所述导电片的宽度在2毫米至10毫米之间。
所述第一让位缺的宽度为所述导电片宽度的10％至70％。
所述第一让位缺的边缘为圆弧段。
所述圆弧段为多个，多个所述圆弧段具有至少两个圆弧曲率。
所述圆弧段为三个，依次为第一圆弧段、第二圆弧段、第三圆弧段，所述第一圆弧段和所述第三圆弧段的曲率相同，所述第二圆弧段的曲率分别大于所述第一圆弧段和所述第三圆弧段的曲率；所述第一圆弧段和所述第三圆弧段分别位于所述第一让位缺边缘的两侧，所述第二圆弧段位于所述第一让位缺边缘的中部。
所述导电片为至少三个，沿所述导电连接侧并列设置，相邻两个所述导电片之间具有间隙区，所述间隙区的宽度大于所述导电片的宽度。
所述间隙区的宽度大于所述导电片的宽度的1.5倍。
所述间隙区的宽度在2.5毫米至20毫米之间。
所述第一让位缺的面积大于所述导电片面积的六分之一。
还包括有保护层，所述保护层覆盖所述导电层；所述导电层位于所述基层的正面，所述保护层至少包括正面覆盖层，所述正面覆盖层上具有第二让位缺，所述第二让位缺与所述导电片位置相对，所述导电片上表面的至少部分区域相对于所述第二让位缺外露而形成第一导电面。
所述第二让位缺的面积大于所述导电片面积的三分之一。
所述第二让位缺为圆弧形。
所述导电层还设于所述基层的背面，所述保护层还包括背面覆盖层，所述背面覆盖层上具有第三让位缺，所述第三让位缺与背面的导电片位置相对，所述导电片下表面的至少部分区域相对于所述第三让位缺外露而形成第二导电面。
所述导电片上表面的所述第一导电面相对于所述正面覆盖层露出的面积大于所述导电片的所述第二导电面相对于背面覆盖层露出的面积。
所述柔性电路板还包括有金手指，所述金手指具有基体表面和导电表面，所述导电表面与所述导电线电性连接，所述导电表面与所述第一导电面的方向相反，所述基体表面与所述第一导电面的方向相同。
所述基层上设有第四让位缺，所述第四让位缺的位置与所述第一让位缺的位置相对应。
所述第四让位缺与所述第一让位缺相平齐。
一种电容屏，该电容屏包括屏体和任一种所述的柔性电路板，所述屏体上具有导电触点，所述柔性电路板的背面与所述屏体之间通过连接层电性连接，导电连接体压接在导电片上并在第一让位缺处与所述导电触点电性连接。
一种柔性电路板加工方法，所述方法包括如下步骤：
在基层上敷铜并形成具有导电片及导电线的导电层；
在所述导电片上加工开口，并使所述该开口的宽度由外侧向内侧向方向逐渐变小，形成所述第一让位缺。
在所述导电片上钻取圆弧而形成所述第一让位缺。
在所述导电片上钻取圆弧而形成所述第一让位缺，包括：在所述导电片上至少分两次钻 取小曲率的大圆弧段和大曲率的小圆弧段，形成所述第一让位缺。
需要说明的是：
1、前述导电片可采用导电性良好的金属材质，该导电片在实际生产过程中通常采用铜箔。
2、前述“圆弧曲率”是针对圆弧段的大致圆弧轮廓而言，而不针对各小段的精细圆弧拼接而成的圆弧段。
3、为保证导电效果，导电片的上表面及下表面形成的第一导电面及第二导电面的导电性能良好。
4、该导电触点至少部分延伸至第二让位缺处、第三让位缺处。
5、前述导电连接体的材质为具有一定导电性能的金属或非金属，导电连接体在实际中通常采用银胶。
6、前述加工导电片上第一次钻取的小曲率的大圆弧段为第一圆弧段及第三圆弧段，第二次钻取的大曲率的小圆弧段为第二圆弧段，前述的两个圆弧曲率的大小关系是相对的。
下面对本公开的优点或原理进行说明：
1、柔性电路板，导电层附于基层上，该第一让位缺的开口宽度由外侧向内侧向方向逐渐变小，使第一让位缺呈类似于V形的形状，第一让位缺的尺寸相较于传统细长条的缺口阔，该第一让位缺的结构稳定，使导电片在导电连接侧上受到外力的弯折作用下不易与导电连接体断裂，避免导电层出现接触不良及绑定开路的情况。
2、所述第一让位缺的边缘为圆弧段，在加工导电层的导电片时，只需通过钻头将导电片钻取一至二刀，即可将导电片加工并形成边缘为圆弧段的第一让位缺，该结构使得加工工艺非常简单。
3、所述圆弧段为三个，三个圆弧段具有两个圆弧曲率，第二圆弧段的曲率相较于第一圆弧段及第三圆弧段的曲率小，以便于简化加工圆弧段的加工工艺，加工时，第一圆弧及第三圆弧只需钻取一刀，而第二圆弧也只需在第一让位缺边缘的中部处钻取一刀，加工三个圆弧段钻头只需钻取两刀即可，进而使加工变得更加简单，也同时降低了在加工制作过程中的次品率。
4、相邻两个导电片之间具有间隙区，且间隙区的宽度大于导电片的宽度，有利于增加柔性电路板的柔韧性，使柔性电路板在弯折时不易出现接触不良和绑定开路的情况，宽度更小的导电片还能减小柔性电路板的弯折应力，使导电片在柔性电路板弯折时不容易翘起。
5、所述间隙区的宽度大于所述导电片的宽度的1.5倍，以便于减小柔性电路板的弯折应力，使柔性电路板具有更大的弯折程度，能够生产加工出长度尺寸更大且检测精度及灵敏性能更好的电容屏。
6、第一让位缺的面积大于所述导电片面积的六分之一，有利于增加导电片与导电触点通 过导电连接体的电性连接的接触面积，进而增强柔性电路板结构的稳定性。
7、正面覆盖层上的第二让位缺与导电片位置相对，以便于导电连接体在第二让位缺处通过第一导电面压接绑定导电片，通过导电片上表面的至少部分区域相对于第二让位缺外露而形成的第一导电面，通过导电连接体压接绑定在导电片上的第一导电面使导电片与导电触点电性连接，导电片进而将接收到导电触点检测到的电流信号并输送至导电线；正面覆盖层与背面覆盖层以用于覆盖导电层中的导电线及至少部分区域的导电片。
8、第二让位缺与导电片之间的面积关系，有利于通过第二让位缺使导电片能够露出更多的第一导电面，有利于增大导电连接体压接绑定在导电片的面积，使压接绑定的导电片更加牢固及稳定。
9、呈圆弧形的第二让位缺以便于简化产品的工艺流程。
10、所述背面覆盖层上具有第三让位缺，而导电片下表面的部分区域形成的第二导电面，该导电连接体在压接绑定导电片的同时，使导电片下表面的第二导电面与导电触点电性连接，第一导电面导电的同时，第二导电面与导电触点电性连接，该双向导电的效果能够进一步增强柔性电路板的稳定性，且背面覆盖层的第三让位缺能够使导电片下表面的部分区域外露，有利于增加导电片与导电连接体的接触面积，使导电连接体更加稳定地压接导电片。
11、第一导电面更大的面积导通，使第二导电面避免形成空腔，避免影响接触导通，进一步提高导通的导电性能。
12、金手指的导电表面与第一导电面的方向相反，即导电表面与导电连接体导电压接在第二让位缺处的方向相反。
13、电容屏的导电触点从屏体上采集电流信号，由于导电触点通过导电连接体并与柔性电路板的第一导电面电性连接，且由于导电连接体在所述第二让位缺处的压接作用，导电连接体同时与第二导电面电性连接，进而将电流信号通过第一导电面及第二导电面输送至导电片上，再由导电片将电流信号输送至导电线上。
附图说明
图1是本公开实施例一所述柔性电路板的剖视放大图；
图2是本公开实施例一所述导电片的结构示意图；
图3是本公开实施例一所述导电层的结构示意图；
图4是本公开实施例一所述正面覆盖层的结构示意图；
图5是本公开实施例一所述背面覆盖层的结构示意图；
图6是本公开实施例一所述导电层的结构示意图；
图7是本公开实施例一所述柔性电路板的结构示意图；
图8是本公开实施例二所述所述导电片的结构示意图。
附图标记说明：
10、导电层，11、导电片，12、导电线，13、第一导电面，14、第二导电面，15、间隙区，16、第一让位缺，161、第一圆弧段，162、第二圆弧段，163、第三圆弧段，20、正面覆盖层，21、第二让位缺，22、基层，30、背面覆盖层，31、第三让位缺，40、金手指，50、电容屏，51、屏体，52、导电触点，60、导电连接体，70、连接层。
具体实施方式
下面对本公开的实施例进行详细说明。
实施例一：
如图1至图7所示，电容屏50，包括屏体51及柔性电路板。
柔性电路板包括：基层22、导电层10及保护层，导电层10附于基层22上，保护层将导电层10覆盖，导电层10具有导电片11及导电线12，导电片11与导电线12相互电性连接，导电片11位于导电连接侧，所述导电片11上具有第一让位缺16，该第一让位缺16的开口宽度由外侧向内侧向方向逐渐变小，即第一让位缺16的开口宽度沿远离导电线的方向逐渐增大，(本实施例中，该第一让位缺16的边缘为圆弧段)。
屏体51上具有导电触点52，柔性电路板的背面与屏体51之间通过连接层70电性连接，导电连接体60压接在导电片11上并在第一让位缺16处与所述导电触点52电性连接。
所述第一让位缺16的面积大于所述导电片11面积的六分之一；第二让位缺21的面积大于所述导电片11面积的三分之一。
所述导电片11为几十个，沿导电连接侧并列设置，相邻两个所述导电片11之间具有间隙区15，间隙区15的宽度大于所述导电片11的宽度；所述间隙区15的宽度大于所述导电片11的宽度的1.5倍。
还包括有金手指40，该金手指40具有基体表面、导电表面，导电表面与所述导电线12电性连接，该导电表面与所述第一导电面13的方向相反，该基体表面与所述第一导电面13的方向相同。
所述圆弧段为三个，三个圆弧段具有两个圆弧曲率，依次为第一圆弧段161、第二圆弧段162、第三圆弧段163，第一圆弧段161、第三圆弧段163的曲率相同，第二圆弧段162的曲率大于第一圆弧段161、第三圆弧段163的曲率；第一圆弧段161、第三圆弧段163分别位于所述第一让位缺16边缘的两侧，所述第二圆弧段162位于所述第一让位缺16边缘的中部。
所述导电层10位于所述基层22的正面，所述保护层包括正面覆盖层20，正面覆盖层20 上具有第二让位缺21，第二让位缺21与导电片11位置相对，所述第二让位缺21为圆弧形。
导电片11上表面的部分区域相对于第二让位缺21外露而形成第一导电面13；所述导电层10还设于所述基层22的背面，所述保护层还包括背面覆盖层30，背面覆盖层30上具有第三让位缺31，第三让位缺31与背面的导电片11位置相对，导电片11下表面的至少部分区域相对于第三让位缺31外露而形成第二导电面14；所述导电片11上表面的第一导电面13相对于正面覆盖层20露出的面积大于导电片11的第二导电面14相对于背面覆盖层30露出的面积。
所述基层22上设有第四让位缺，所述第四让位缺与所述第一让位缺16相平齐。
具体而言，本实施例中，所述第一让位缺的最大宽度为1.9毫米，所述导电片的宽度为3.0毫米，所述间隙区的宽度为5.3毫米。
本实施例中的导电片11为铜箔，导电连接体60为银胶，多条导电线12在保护层及基层22之间形成排线；导电连接侧指用导电片11与电容屏50相连接的一侧；连接层70可以为粘胶，还可以为双面胶及其它具有粘性的胶体。
经检测，本实施例的柔性电路板静态弯折50次后，无任何功能异常；柔性电路板的总体厚度小于0.12毫米，导电层10的材料为压延铜；加工工艺要求为：化学镍金，其中Au:0.03um以上，Ni:2-5um；柔性电路板的样品放置于35±2℃，NaCl＝5％,PH值6.5～7.2的盐雾环境中24h后用纯水清洗后目视，镀层表面无锈斑、锈渍。
本实施例中柔性电路板加工方法是，该方法包括如下步骤：在基层22上敷铜并形成具有导电片11及导电线12的导电层10；在导电层10外覆盖保护膜并形成保护层；在导电片11上钻取圆弧并形成第一让位缺16；在所述导电片11上分两次钻取小曲率的大圆弧段、大曲率的小圆弧段，并形成所述第一让位缺16。
本实施例具有如下优点：
1、柔性电路板，导电层10附于基层22上，保护层将导电层10覆盖，使保护层、导电层10及基层22相互压接绑定，防止导电层10的导电片11及导电线12相对于保护层及基层22发生位移，能够增加柔性电路板的可靠性，导电片11与导电线12相互电性连接，以便于导电片11将接收到的电流信号输送至导电线12，在加工导电层10的导电片11时，只需通过钻头将导电片11钻取二刀，即可将导电片11加工并形成边缘为圆弧段的第一让位缺16，该工艺加工导电片11的第一让位缺16的尺寸相较于传统细长条的缺口阔，该第一让位缺16的结构稳定，使导电片11在导电连接侧上受到外力的弯折作用下不易与导电连接体60断裂，避免导电层10出现接触不良及绑定开路的情况，进而增强柔性电路板的检测精度及灵敏性；电容屏50的屏体51上具有导电触点52，通过压接绑定在导电片11上的导电连接体60，使导电连接体60不仅用于压接绑定，还能使在导电片11上的第一让位缺16与导电触点52电性连接，在电容屏50弯折时，该屏体51上的导电触点52与柔性电路板的连接结构极大地提高了电容屏50的稳定性，进而解决了电容屏50在使用过程中出现的精度及灵敏性下降的情况。
2、所述圆弧段为三个，三个圆弧段具有两个圆弧曲率，第二圆弧段162的曲率相较于第 一圆弧段161及第三圆弧段163的曲率小，以便于简化加工圆弧段的加工工艺，加工时，第一圆弧及第三圆弧只需钻取一刀，而第二圆弧也只需在第一让位缺16边缘的中部处钻取一刀，加工三个圆弧段钻头只需钻取两刀即可，进而使加工变得更加简单，也同时降低了在加工制作过程中的次品率。
3、相邻两个导电片11之间具有间隙区15，且间隙区15的宽度大于导电片11的宽度，有利于增加柔性电路板的柔韧性，使柔性电路板在弯折时不易出现接触不良和绑定开路的情况，宽度更小的导电片11还能减小柔性电路板的弯折应力，使导电片11在柔性电路板弯折时不容易翘起。
4、所述间隙区15的宽度大于所述导电片11的宽度的1.5倍，以便于减小柔性电路板的弯折应力，使柔性电路板具有更大的弯折程度，能够生产加工出长度尺寸更大且检测精度及灵敏性能更好的电容屏50。
5、第一让位缺16的面积大于所述导电片11面积的六分之一，有利于增加导电片11与导电触点52通过导电连接体60的电性连接的接触面积，进而增强柔性电路板结构的稳定性。
6、正面覆盖层20上的第二让位缺21与导电片11位置相对，以便于导电连接体60在第二让位缺21处通过第一导电面13压接绑定导电片11，通过导电片11上表面的至少部分区域相对于第二让位缺21外露而形成的第一导电面13，通过导电连接体60压接绑定在导电片11上的第一导电面13使导电片11与导电触点52电性连接，导电片11进而将接收到导电触点52检测到的电流信号并输送至导电线12；正面覆盖层20与背面覆盖层30以用于覆盖导电层10中的导电线12及至少部分区域的导电片11。
7、第二让位缺21与导电片11之间的面积关系，有利于通过第二让位缺21使导电片11能够露出更多的第一导电面13，有利于增大导电连接体60压接绑定在导电片11的面积，使压接绑定的导电片11更加牢固及稳定。
8、呈圆弧形的第二让位缺21以便于简化产品的工艺流程。
9、所述背面覆盖层30上具有第三让位缺31，而导电片11下表面的部分区域形成的第二导电面14，该导电连接体60在压接绑定导电片11的同时，使导电片11下表面的第二导电面14与导电触点52电性连接，第一导电面13导电的同时，第二导电面14与导电触点52电性连接，该双向导电的效果能够进一步增强柔性电路板的稳定性，且背面覆盖层30的第三让位缺31能够使导电片11下表面的部分区域外露，有利于增加导电片11与导电连接体60的接触面积，使导电连接体60更加稳定地压接导电片11。
10、第一导电面13更大的面积导通，使第二导电面14避免形成空腔，避免影响接触导通，进一步提高导通的导电性能。
11、金手指40的导电表面与第一导电面13的方向相反，即导电表面与导电连接体60导电压接在第二让位缺21处的方向相反；金手指40的导电表面与导电线12电性连接，以便于将该电流信号通过导电表面输送出去，该导电表面与主控板电性连接，该基体表面可以起到 导向的作用，使导电表面与主控板的电性连接更加稳定。
12、电容屏50的导电触点52从屏体51上采集电流信号，由于导电触点52通过导电连接体60并与柔性电路板的第一导电面13电性连接，且由于导电连接体60在所述第二让位缺21处的压接作用，导电连接体60同时与第二导电面14电性连接，进而将电流信号通过第一导电面13及第二导电面14输送至导电片11上，再由导电片11将电流信号输送至导电线12上。
13、本实施例中柔性电路板加工方法是，在加工柔性电路板的导电层10时，钻头的钻取由传统的钻取十刀以上缩减为只需钻取两刀，便能钻出第一个弧段及第二个弧段，且第一个弧段、第二个弧段在导电片11上形成第一让位缺16，该导电层10中第一让位缺16的加工工艺简单，进一步提高了企业的生产效率。
14、传统钻取十刀以上的钻孔细长，在本实施例的柔性电路板弯折时容易出现接触不良或绑定开路，而本公开的电容屏50的加工方法由于只需钻取两刀，钻出第一个弧段及第二个弧段便可，使第一个弧段、第二个弧段在导电片11上形成第一让位缺16，该电容屏50的加工方法简便，有效地缩减了加工电容屏50的流程时间。
实施例二：
如图8所示，本实施例与实施例一相比，边缘为圆弧段的所述第一让位缺16，该圆弧段为一个。
本实施例具有如下优点：
本实施例中在加工导电片11时，钻头只需钻取一刀，钻出一个圆弧段即可完成对导电片11的加工，该加工导电片11的过程更加简便。
以上仅为本公开的具体实施例，并不以此限定本公开的保护范围；在不违反本公开构思的基础上所作的任何替换与改进，均属本公开的保护范围。

Claims (23)

  1. 一种柔性电路板，其特征在于，包括基层及导电层，所述导电层设置在所述基层上，所述导电层至少具有导电片及导电线，所述导电片与所述导电线相互电性连接，所述导电片位于导电连接侧，所述导电片上具有第一让位缺，该第一让位缺的开口宽度由外侧向内侧向方向逐渐变小。
  2. 如权利要求1所述柔性电路板，其特征在于，所述第一让位缺的最大宽度在1毫米至5毫米之间。
  3. 如权利要求1所述柔性电路板，其特征在于，所述导电片的宽度在2毫米至10毫米之间。
  4. 如权利要求1所述柔性电路板，其特征在于，所述第一让位缺的宽度为所述导电片宽度的10％至70％。
  5. 如权利要求1所述柔性电路板，其特征在于，所述第一让位缺的边缘为圆弧段。
  6. 如权利要求5所述柔性电路板，其特征在于，所述圆弧段为多个，多个所述圆弧段具有至少两个圆弧曲率。
  7. 如权利要求5所述柔性电路板，其特征在于，所述圆弧段为三个，依次为第一圆弧段、第二圆弧段、第三圆弧段，所述第一圆弧段和所述第三圆弧段的曲率相同，所述第二圆弧段的曲率分别大于所述第一圆弧段和所述第三圆弧段的曲率；所述第一圆弧段和所述第三圆弧段分别位于所述第一让位缺边缘的两侧，所述第二圆弧段位于所述第一让位缺边缘的中部。
  8. 如权利要求1所述柔性电路板，其特征在于，所述导电片为至少三个，沿所述导电连接侧并列设置，相邻两个所述导电片之间具有间隙区，所述间隙区的宽度大于所述导电片的宽度。
  9. 如权利要求8所述柔性电路板，其特征在于，所述间隙区的宽度大于所述导电片的宽度的1.5倍。
  10. 如权利要求1所述柔性电路板，其特征在于，所述间隙区的宽度在2.5毫米至20毫米之间。
  11. 如权利要求1至10中任一项所述柔性电路板，其特征在于，所述第一让位缺的面积大于所述导电片面积的六分之一。
  12. 如权利要求1至10中任一项所述柔性电路板，其特征在于，还包括有保护层，所述保护层覆盖所述导电层；所述导电层位于所述基层的正面，所述保护层至少包括正面覆盖层，所述正面覆盖层上具有第二让位缺，所述第二让位缺与所述导电片位置相对，所述导电片上表面的至少部分区域相对于所述第二让位缺外露而形成第一导电面。
  13. 如权利要求12所述柔性电路板，其特征在于，所述第二让位缺的面积大于所述导电片面积的三分之一。
  14. 如权利要求12所述柔性电路板，其特征在于，所述第二让位缺为圆弧形。
  15. 如权利要求12所述柔性电路板，其特征在于，所述导电层还设于所述基层的背面，所述保护层还包括背面覆盖层，所述背面覆盖层上具有第三让位缺，所述第三让位缺与所述背面的所述导电片位置相对，所述导电片下表面的至少部分区域相对于所述第三让位缺外露而形成第二导电面。
  16. 如权利要求15所述柔性电路板，其特征在于，所述导电片上表面的所述第一导电面相对于所述正面覆盖层露出的面积大于所述导电片的所述第二导电面相对于所述背面覆盖层露出的面积。
  17. 如权利要求16所述柔性电路板，其特征在于，还包括有金手指，所述金手指具有基体表面和导电表面，所述导电表面与所述导电线电性连接，所述导电表面与所述第一导电面的方向相反，所述基体表面与所述第一导电面的方向相同。
  18. 如权利要求1至10中任一项所述柔性电路板，其特征在于，所述基层上设有第四让位缺，所述第四让位缺的位置与所述第一让位缺的位置相对应。
  19. 如权利要求18所述柔性电路板，其特征在于，所述第四让位缺与所述第一让位缺相平齐。
  20. 一种电容屏，其特征在于，包括屏体和权利要求1至19中任一权利要求所述的柔性电路板，所述屏体上具有导电触点，所述柔性电路板的背面与所述屏体之间通过连接层电性连接，导电连接体压接在导电片上并在第一让位缺处与所述导电触点电性连接。
  21. 一种柔性电路板加工方法，其特征在于，所述方法包括如下步骤：
    在基层上敷铜并形成具有导电片及导电线的导电层；
    在所述导电片上加工开口，并使所述开口的宽度由外侧向内侧向方向逐渐变小，形成所述第一让位缺。
  22. 如权利要求21所述柔性电路板加工方法，其特征在于，
    在所述导电片上钻取圆弧而形成所述第一让位缺。
  23. 如权利要求22所述柔性电路板加工方法，其特征在于，在所述导电片上钻取圆弧而形成所述第一让位缺，包括：
    在所述导电片上至少分两次钻取小曲率的大圆弧段和大曲率的小圆弧段，形成所述第一让位缺。
PCT/CN2019/126745 2019-01-23 2019-12-19 柔性电路板、电容屏及柔性电路板加工方法 Ceased WO2020151423A1 (zh)

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