WO2020148980A8 - 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法 - Google Patents

半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法 Download PDF

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Publication number
WO2020148980A8
WO2020148980A8 PCT/JP2019/044141 JP2019044141W WO2020148980A8 WO 2020148980 A8 WO2020148980 A8 WO 2020148980A8 JP 2019044141 W JP2019044141 W JP 2019044141W WO 2020148980 A8 WO2020148980 A8 WO 2020148980A8
Authority
WO
WIPO (PCT)
Prior art keywords
solder
solder flattening
die bonder
flattening
supplied
Prior art date
Application number
PCT/JP2019/044141
Other languages
English (en)
French (fr)
Other versions
WO2020148980A1 (ja
Inventor
卓 松田
Original Assignee
キヤノンマシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Priority to CN201980087200.6A priority Critical patent/CN113272943B/zh
Publication of WO2020148980A1 publication Critical patent/WO2020148980A1/ja
Publication of WO2020148980A8 publication Critical patent/WO2020148980A8/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

ワークの半田供給部位に供給された半田を半田平坦化用治具の押圧面にて押圧して平坦状とする半田平坦化装置である。ワークの半田供給部位に半田が供給されていない状態で、半田平坦化用治具の半田押圧面の打痕を半田供給部位に形成する。形成した打痕を観察する。観察した打痕に基づいて、半田平坦化用治具の押圧面の水平度の調整を行う。
PCT/JP2019/044141 2019-01-15 2019-11-11 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法 WO2020148980A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201980087200.6A CN113272943B (zh) 2019-01-15 2019-11-11 焊料平坦化方法及装置、芯片接合机、以及接合方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019004577A JP6644921B1 (ja) 2019-01-15 2019-01-15 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法
JP2019-004577 2019-01-15

Publications (2)

Publication Number Publication Date
WO2020148980A1 WO2020148980A1 (ja) 2020-07-23
WO2020148980A8 true WO2020148980A8 (ja) 2020-10-15

Family

ID=69412189

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/044141 WO2020148980A1 (ja) 2019-01-15 2019-11-11 半田平坦化装置、ダイボンダ、半田平坦化方法、及びボンディング方法

Country Status (3)

Country Link
JP (1) JP6644921B1 (ja)
CN (1) CN113272943B (ja)
WO (1) WO2020148980A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022004106A1 (ja) 2020-07-01 2022-01-06 日本電気株式会社 受光装置および通信装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5088979A (ja) * 1973-12-10 1975-07-17
JPS60183733A (ja) * 1984-03-01 1985-09-19 Toshiba Corp ダイボンデイング装置
JPS63177433A (ja) * 1987-01-16 1988-07-21 Toshiba Corp ステ−ジとボンデイングツ−ルとの平行度検出方法
JP2629646B2 (ja) * 1995-05-10 1997-07-09 日本電気株式会社 ボンディングヘッド
EP0852983B1 (de) * 1997-01-08 2002-09-04 ESEC Trading SA Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
JP3794987B2 (ja) * 2002-05-29 2006-07-12 ローム株式会社 半導体発光装置
JP2007180456A (ja) * 2005-12-28 2007-07-12 Toyota Industries Corp 半田付け方法及び半導体モジュールの製造方法
JP5004549B2 (ja) * 2006-10-27 2012-08-22 新光電気工業株式会社 電子部品の基板への搭載方法及びはんだ面の形成方法
JP4949281B2 (ja) * 2007-01-24 2012-06-06 日本特殊陶業株式会社 部品付き配線基板の製造方法
JP5165303B2 (ja) * 2007-08-01 2013-03-21 キヤノンマシナリー株式会社 ハンダ形状仕上装置
JP2010194592A (ja) * 2009-02-26 2010-09-09 Canon Machinery Inc 半田平坦化用治具
CN106229277B (zh) * 2016-08-05 2019-03-26 深圳清华大学研究院 一种贴片机及贴片方法

Also Published As

Publication number Publication date
WO2020148980A1 (ja) 2020-07-23
CN113272943B (zh) 2022-04-26
JP6644921B1 (ja) 2020-02-12
CN113272943A (zh) 2021-08-17
JP2020113680A (ja) 2020-07-27

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