WO2020133839A1 - 一种真空贴合机 - Google Patents

一种真空贴合机 Download PDF

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Publication number
WO2020133839A1
WO2020133839A1 PCT/CN2019/084022 CN2019084022W WO2020133839A1 WO 2020133839 A1 WO2020133839 A1 WO 2020133839A1 CN 2019084022 W CN2019084022 W CN 2019084022W WO 2020133839 A1 WO2020133839 A1 WO 2020133839A1
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WIPO (PCT)
Prior art keywords
position state
laminating machine
base plate
vacuum laminating
cover plate
Prior art date
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Ceased
Application number
PCT/CN2019/084022
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English (en)
French (fr)
Inventor
王宗海
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Publication of WO2020133839A1 publication Critical patent/WO2020133839A1/zh
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Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements

Definitions

  • the invention relates to the technical field of display panel manufacturing, in particular to a vacuum laminating machine.
  • vacuum bonding equipment In the packaging process of the TFT-LCD industry, vacuum bonding equipment (Vacuum Aligner System (VAS for short) turns two substrates into a box into a whole.
  • VAS Vauum Aligner System
  • one substrate is adsorbed on the upper cover plate
  • another substrate is adsorbed on the lower cover plate
  • a vacuum pump is used to evacuate, and then the alignment box is pressed under a vacuum environment.
  • glue is applied on the substrate to bond the upper and lower substrates.
  • the work of the machine is to suck the upper and lower substrates through the adsorption device on the upper and lower cover plates, and then perform the positioning and pressing.
  • the adsorption force of the adsorption device on the substrate will become weak, which will cause the substrate adsorbed by the upper cover plate to fall onto the substrate of the lower cover plate in the vacuuming stage, thereby causing the position of the upper and lower substrates If the deviation continues, the subsequent step of pressing between the upper and lower substrates may even cause the problem of scrapping the upper and lower substrates.
  • the purpose of the present invention is to provide a vacuum laminating machine which can solve the problem that the substrate adsorbed by the upper cover plate falls to the lower cover during the vacuuming stage due to the weakening of the adsorption force of the substrate by the adsorption device existing in the prior art On the substrate of the board, the position deviation of the upper and lower substrates is caused, which may even cause the problem of scrapping the upper and lower substrates.
  • the present invention provides a vacuum laminating machine, including a mainframe, which is provided with an upper cover plate and a lower cover plate arranged opposite each other for absorbing the upper substrate and the lower substrate to be bonded respectively;
  • a first support tip is also provided in the mainframe, which has a first position state and a second position state;
  • the first support tip is located between the opposite surfaces of the upper and lower cover plates, and can receive the upper base plate dropped from the upper cover plate;
  • the first support tip is located outside the area between the opposing surfaces of the upper and lower cover plates, so that the upper and lower cover plates can come closer to each other to attract the Laminate the upper and lower substrates.
  • the first support tip is provided with a pressure sensor, and it is known whether there is a dropped upper substrate on the first support tip through a pressure change.
  • control unit which is connected to the pressure sensor and can receive its data, and when it learns that the pressure change data of the pressure sensor changes, it will stop the up and down The cover plates operate close to each other.
  • control unit is further connected with an alarm unit for issuing an alarm instruction to it.
  • the control unit when the control unit finds that the upper cover plate has insufficient suction force on the substrate due to the pressure change data of the pressure sensor and a "chip drop" problem occurs, it will notify the alarm unit to make an alarm to remind the external operation Personnel perform corresponding component maintenance or replacement.
  • the alarm unit may be an audible and visual alarm unit or a voice alarm unit, and the specific may be determined according to needs without limitation.
  • control unit is further connected with a manipulator for removing the upper base plate dropped on the first support tip.
  • the first support tip is switched between the first position state and the second position state by rotating.
  • the angle of rotation of the first support tip ranges from 0 to 180 degrees.
  • the first support tip is switched between the first position state and the second position state by telescoping.
  • the material of the first support tip is stainless steel material, organic composite material, or organic material, which may be determined according to needs, and is not limited to these three materials.
  • it further includes a second support tip, which is disposed opposite to the first support tip, and also has a first position state and a second position state, which are used to communicate with the first support tip Collect the dropped upper substrate together.
  • the second support tip is provided with a pressure sensor.
  • the shape, the number of installation, and the movement method of the support tip may be determined according to needs, and are not limited, as long as it can securely catch the upper substrate dropped due to insufficient suction force That's it.
  • the present invention provides a vacuum laminating machine, which is provided with a pair of oppositely disposed support tips inside the mainframe, which have a first position state and a second position state; In the first position state, the first support tip is located between the opposite surfaces of the upper and lower cover plates, and can catch the upper substrate dropped from the upper cover plate, which solves the problem of falling of the upper substrate Going to the lower substrate makes the position deviation between the two, and then the upper and lower substrates are scrapped after being bonded due to the position deviation of the two and then further bonding.
  • Example 1 is a schematic cross-sectional view of a vacuum laminating machine provided in Example 1 of the present invention
  • FIG. 2 is a schematic cross-sectional view of the state where the support tip is located at the first position in Embodiment 1 of the present invention
  • FIG. 3 is a schematic cross-sectional view of the supporting base catching the dropped upper substrate in Embodiment 1 of the present invention
  • FIG. 4 is a schematic cross-sectional view of the state where the supporting tip is located at the second position in Embodiment 1 of the present invention.
  • Example 5 is a schematic plan view of a vacuum laminating machine provided in Example 2 of the present invention.
  • FIG. 6 is a schematic plan view of a state in which the supporting tip is in the first position in Embodiment 2 of the present invention.
  • FIG. 7 is a top schematic view of the support pin of Embodiment 3 of the present invention catching the dropped upper substrate;
  • FIG. 8 is a schematic plan view of a state in which the supporting tip is located at the second position in Embodiment 2 of the present invention.
  • connection should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or connected integrally; either mechanically or electrically; directly connected, or indirectly connected through an intermediary, or internally connected between two components.
  • installation should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or connected integrally; either mechanically or electrically; directly connected, or indirectly connected through an intermediary, or internally connected between two components.
  • the present invention provides a vacuum laminating machine, which includes a main base 1, an upper cover 21, a lower cover 22, a first supporting pin 41 and a second supporting pin 42, an upper cover 21 and a lower cover
  • the board 22 is arranged to face each other vertically, and respectively adsorbs the upper substrate 31 and the lower substrate 32 to be bonded.
  • the first support tip 41 and the second support tip 42 have a first position state and a second position state, please refer to FIG. 2.
  • FIG. 2 shows that the first support tip 41 and the second support tip 42 are located at the A cross-sectional view of a position state. In the first position state, the first support pin 41 and the second support pin 42 are located between the opposing surfaces of the upper cover plate 21 and the lower cover plate 22.
  • FIG. 3 shows the first supporting pin 41 and the second supporting pin 42 of this embodiment catching the dropped upper substrate 21 Sectional view.
  • the first supporting pin 41 and the second supporting pin 42 rotate to move to the second position state, please refer to FIG. 4, the first supporting pin 41 and the second supporting pin in this embodiment shown in FIG. 4 42 is a cross-sectional view of the state of the second position.
  • Both the first supporting tip 41 and the second supporting tip 42 are provided with a pressure sensor, which can be used to know whether there is a "drop" on the pressure.
  • the main platform 1 is also provided with a control unit, which is connected to the pressure sensor and can receive its data. When it learns that the pressure change data of the pressure sensor changes, it will stop the close operation between the upper and lower cover plates.
  • control unit is also connected with an alarm unit for issuing an alarm instruction to it.
  • the control unit finds that the upper cover plate has insufficient suction force on the substrate due to the pressure change data of the pressure sensor, it will notify the alarm unit to give an alarm to remind the external operator to perform corresponding component maintenance or replacement.
  • the control unit is also connected with a manipulator for removing the upper base plate 31 dropped on the first supporting pin 41.
  • the upper substrate 31 is adsorbed on the upper cover 21 and the lower substrate 32 is adsorbed on the lower substrate 22, and then the first support pin 41 and the second support pin 42 are rotated 90 degrees to move to the first position state.
  • the main platform 1 is evacuated. If the upper substrate 21 falls, the first support pin 41 and the second support pin 42 can catch the dropped upper substrate 21, the pressure data of the pressure sensor will change, and then the control unit stops The close operation between the upper and lower cover plates, then the main table 1 stops evacuation, the chamber is opened, the robot removes the upper substrate 31 on the first support pin 41 and the second support pin 42; The alarm unit issues an alarm instruction, and the alarm unit issues an alarm to remind the external operator to replace the adsorption device.
  • the first supporting pin 41 and the second supporting pin 42 will rotate and move to the second position state, and then the two cover plates are relatively close, and the upper substrate 32 and the lower substrate 33 to be bonded are bonded . Circulate in order to prevent the substrate from falling and scrapping.
  • the present invention provides a vacuum laminating machine, including a main platform 1, an upper cover plate 21, a lower cover plate 22, a first support pin 43 and a second support pin 44, the upper cover plate 21 and the lower cover
  • the board 22 is arranged to face each other vertically, and respectively adsorbs the upper substrate 31 and the lower substrate 32 to be bonded.
  • first support pin 43 and the second support pin 44 have a first position state and a second position state
  • FIG. 6 shows that the first support pin 43 and the second support pin 44 are located in the first A top view of the one-position state.
  • first support pin 43 and the second support pin 44 are located between the opposing surfaces of the upper cover plate 21 and the lower cover plate 22.
  • FIG. 7 shows that the first supporting pin 43 and the second supporting pin 44 of this embodiment catch the dropped upper substrate 21 Top view.
  • the first support pin 43 and the second support pin 44 telescopically move to the second position state, please refer to FIG. 8, the first support pin 43 and the second support pin in this embodiment shown in FIG. 8 44 is a plan view of the state where it is in the second position.
  • Both the first supporting pin 43 and the second supporting pin 44 are provided with a pressure sensor, which can be used to know whether there is a "drop" on the pressure.
  • the main platform 1 is also provided with a control unit, which is connected to the pressure sensor and can receive its data. When it learns that the pressure change data of the pressure sensor changes, it will stop the close operation between the upper and lower cover plates.
  • the control unit is also connected with an alarm unit for issuing alarm instructions to it. When the control unit finds that the upper cover plate has insufficient suction force to the substrate due to the pressure change data of the pressure sensor, it will notify the alarm unit to give an alarm to remind the external operator to perform corresponding component maintenance or replacement.
  • the control unit is also connected with a manipulator for removing the upper base plate 31 dropped on the first support pin 41.
  • the upper substrate 31 is adsorbed on the upper cover 21 and the lower substrate 32 is adsorbed on the lower substrate 22, and then the first support pin 43 and the second support pin 44 are telescopically moved to the first position state.
  • the main platform 1 is evacuated. If the upper substrate 21 falls, the first support pin 43 and the second support pin 44 can catch the dropped upper substrate 21, the pressure data of the pressure sensor will change, and then the control unit stops The close operation between the upper and lower cover plates, then the main table 1 stops vacuuming, the chamber is opened, the robot removes the upper substrate 31 on the first support pin 43 and the second support pin 44; The alarm unit issues an alarm instruction, and the alarm unit issues an alarm to remind the external operator to replace the adsorption device.
  • the first support pin 43 and the second support pin 44 will telescopically move to the second position state, and then the two cover plates are relatively close, and the upper substrate 32 and the lower substrate 33 to be bonded are bonded together . Circulate in order to prevent the substrate from falling and scrapping.
  • the shape of the support tip, the number of installations, and the movement method can be determined according to needs, and are not limited, as long as it can securely catch the upper substrate dropped due to insufficient suction force.
  • the material of the first support tip may be stainless steel, or may be an organic composite material or an organic material, which may be determined according to needs, and is not limited to these three materials.
  • the beneficial effects of the present invention are as follows:
  • the present invention provides a vacuum laminating machine, which is provided with a pair of oppositely disposed support tips inside the mainframe, which have a first position state and a second position state; wherein in the first position state , The first supporting tip is located between the opposite surfaces of the upper and lower cover plates, and can catch the upper base plate dropped from the upper cover plate, which solves the problem that the upper base plate falls onto the lower base plate so that the two There is a problem of position deviation between the two, and then the upper and lower substrates are scrapped due to the position deviation between the two and then further bonding.

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种真空贴合机，包括主机台(1)，其内设有上下相对设置的上盖板(21)和下盖板(22)用于分别吸附待贴合的上基板(31)和下基板(32)；其中主机台(1)内还设有第一支撑梢(41)，其具有第一位置状态和第二位置状态；其中在第一位置状态，第一支撑梢(41)位于上盖板(21)、下盖板(22)相对的表面之间，并能接住从上盖板(21)掉落的上基板(31)；在第二位置状态，第一支撑梢(41)位于在上盖板(21)、下盖板(22)相对的表面之间的区域之外，以使上盖板(21)、下盖板(22)能够相互靠近进而将其各自吸附的上基板(31)、下基板(32)进行贴合。真空贴合机解决了上基板掉落到下基板上使得两者之间出现位置偏差、进而由于两者位置偏差再做进一步的贴合后导致的上、下基板贴合后报废的问题。

Description

一种真空贴合机 技术领域
本发明涉及显示面板制造技术领域，特别涉及一种真空贴合机。
 背景技术
在TFT-LCD行业的封装工艺中，通常采用真空贴合设备（Vacuum Aligner System，简称VAS）将两片基板成盒变为一个整体。现有技术中的真空贴合设备上盖板上吸附一片基板，下盖板上吸附另一片基板，然后利用真空泵进行抽真空，再在真空环境下进行对位盒压合。通常基板上涂布胶类用于粘合上下基板。
机台工作是通过上下盖板上的吸附装置来吸附上下基板，然后进行对位压合。但随着机台的使用，吸附装置对基板的吸附力便会变弱，这将会导致由上盖板吸附的基板在抽真空阶段掉落到下盖板的基板上，进而引发上下基板位置偏差，若继续进行后续上、下基板间的压合步骤，甚至会导致上下基板报废的问题。
因此，确有必要来开发一种新型的真空贴合机，以克服现有技术的缺陷。
 技术问题
本发明的目的是提供一种真空贴合机，其能够解决现有技术中存在的由于吸附装置对基板的吸附力变弱，导致的上盖板吸附的基板在抽真空阶段掉落到下盖板的基板上，进而引发上、下基板位置偏差，甚至会导致上、下基板报废的问题。
 技术解决方案
为实现上述目的，本发明提供一种真空贴合机，包括主机台，其内设有上下相对设置的上盖板和下盖板用于分别吸附待贴合的上基板和下基板；其中所述主机台内还设有第一支撑梢，其具有第一位置状态和第二位置状态；
其中在所述第一位置状态，所述第一支撑梢位于所述上、下盖板相对的表面之间，并能接住从所述上盖板掉落的所述上基板；在所述第二位置状态，所述第一支撑梢位于在所述上、下盖板相对的表面之间的区域之外，以使所述上、下盖板能够相互靠近进而将其各自吸附的所述上、下基板进行贴合。
进一步的，在不同实施方式中，其中所述第一支撑梢设置有压力传感器，通过压力变化获知其上是否存有掉落的所述上基板。
进一步的，在不同实施方式中，其还包括控制单元，其与所述压力传感器连接并能接收其数据，当其获知所述压力传感器的压力变化数据变化后，其会停止所述上、下盖板之间的相互靠近操作。
进一步的，在不同实施方式中，其中所述控制单元还连接有报警单元，用于向其发出报警指令。
例如，当所述控制单元根据所述压力传感器的压力变化数据发现所述上盖板对于基板吸附力不足而出现“掉片”问题时，其会通知所述报警单元进行报警，以便提醒外部操作人员进行相应的部件维护或是更换。其中所述报警单元可以是声光报警单元，也可以是语音报警单元，具体可随需要而定，并无限定。
进一步的，在不同实施方式中，其中所述控制单元还连接有机械手，用于移除所述第一支撑梢上掉落的所述上基板。
进一步的，在不同实施方式中，其中所述第一支撑梢通过旋转的方式在所述第一位置状态和所述第二位置状态之间转换。
进一步的，在不同实施方式中，其中所述第一支撑梢旋转的角度范围为0～180度。
进一步的，在不同实施方式中，其中所述第一支撑梢通过伸缩的方式在所述第一位置状态和所述第二位置状态之间转换。
进一步的，在不同实施方式中，其中所述第一支撑梢的材料采用不锈钢材料、有机复合材料或者有机材料，具体可以随需要而定，并不限定于这三种材料。
进一步的，在不同实施方式中，其还包括第二支撑梢，其与所述第一支撑梢相对设置，其也具有第一位置状态和第二位置状态，用于与所述第一支撑梢共同接住掉落的所述上基板。
进一步的，在不同实施方式中，其中所述第二支撑梢设置有压力传感器。
进一步的，在不同实施方式中，所述支撑梢的形状、设置数量以及移动方式可随需要而定，并无限定，只要能保证稳妥的接住因吸附力不足而掉落的所述上基板即可。
 有益效果
相对于现有技术，本发明的有益效果在于：本发明提供一种真空贴合机，在主机台内部设置一对相对设置的支撑梢，其具有第一位置状态和第二位置状态；其中在所述第一位置状态，所述第一支撑梢位于所述上、下盖板相对表面之间，并能接住从所述上盖板掉落的所述上基板，解决了上基板掉落到下基板上使得两者之间出现位置偏差、进而由于两者位置偏差再做进一步的贴合后导致的上、下基板贴合后报废的问题。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例1提供的真空贴合机的剖视示意图；
图2为本发明实施例1中支撑梢位于第一位置状态的剖视示意图；
图3为本发明实施例1中支撑梢接住掉落的上基板的剖视示意图；
图4为本发明实施例1中支撑梢位于第二位置状态的剖视示意图；
图5为本发明实施例2提供的真空贴合机的俯视示意图；
图6为本发明实施例2中支撑梢位于第一位置状态的俯视示意图；
图7为本发明实施例3的支撑梢接住掉落的上基板的俯视示意图；
图8为本发明实施例2中支撑梢位于第二位置状态的俯视示意图。
 本发明的最佳实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
这里所公开的具体结构和功能细节仅仅是代表性的，并且是用于描述本发明的示例性实施例的目的。但是本发明可以通过许多替换形式来具体实现，并且不应当被解释成仅仅受限于这里所阐述的实施例。
在本发明的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，属于“第一”“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定由“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”及其任何变形，意图在于覆盖不排他的包含。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
这里所使用的术语仅仅是为了描述具体实施例而不意图限制示例性实施例。除非上下文明确地另有所指，否则这里所使用的单数形式“一个”、“一项”还意图包括复数。还应当理解的是，这里所使用的术语“包括”和/或“包含”规定所述的特征、整数、步骤、操作、单元和/或组件的存在，而不排除存在或添加一个或更多其他特征、整数、步骤、操作、单元、组件和/或其组合。
实施例1
请参阅图1，本发明提供了一种真空贴合机，包括主机台1、上盖板21、下盖板22、第一支撑梢41和第二支撑梢42，上盖板21和下盖板22上下相对设置，分别吸附待贴合的上基板31和下基板32。
其中第一支撑梢41和第二支撑梢42具有第一位置状态和第二位置状态，请参阅图2，图2所示为本实施例中第一支撑梢41和第二支撑梢42位于第一位置状态的剖视图，在第一位置状态，第一支撑梢41和第二支撑梢42位于上盖板21和下盖板22相对表面之间。
当由于上盖板21的吸附力不足上基板31掉落时，请参阅图3，图3所示为本实施例第一支撑梢41和第二支撑梢42接住掉落的上基板21的剖视图。
当上基板没有掉落时，第一支撑梢41和第二支撑梢42旋转移动至第二位置状态，请参阅图4，图4所示本实施例中第一支撑梢41和第二支撑梢42位于第二位置状态的剖视图。
第一支撑梢41和第二支撑梢42上都设置有压力传感器，可通过压力变化获知其上是否有“掉片”。主机台1上还设置有控制单元，其与压力传感器连接并能接收其数据，当其获知压力传感器的压力变化数据变化后，其会停止上、下盖板之间的相互靠近操作。
进一步的，控制单元还连接有报警单元，用于向其发出报警指令。当控制单元根据压力传感器的压力变化数据发现上盖板对于基板吸附力不足而出现“掉片”问题时，其会通知报警单元进行报警，以便提醒外部操作人员进行相应的部件维护或是更换。且控制单元还连接有机械手，用于移除第一支撑梢41上掉落的上基板31。
以下说明本发明优选实施例中的真空贴合机的贴合作业过程：
在进行贴合作业时，首先上盖板21上吸附上基板31，下基板22上吸附下基板32，然后第一支撑梢41和第二支撑梢42旋转90度移动至第一位置状态。
接着主机台1抽真空，如果上基板21掉落，第一支撑梢41和第二支撑梢42便可接住掉落的上基板21，压力传感器的压力数据便会发生变化，接着控制单元停止上、下盖板之间的相互靠近操作，然后主机台1停止抽真空，腔室打开，机械手移除第一支撑梢41和第二支撑梢42上掉落的上基板31；同时控制单元向报警单元发出报警指令，报警单元进行报警，提醒外部操作人员进行更换吸附装置。
如果上基板21没有掉落，第一支撑梢41和第二支撑梢42便会旋转移动至第二位置状态，接着两盖板相对靠近，将待贴合的上基板32和下基板33贴合。依次循环，防止基板掉落报废。
实施例2
请参阅图5，本发明提供了一种真空贴合机，包括主机台1、上盖板21、下盖板22、第一支撑梢43和第二支撑梢44，上盖板21和下盖板22上下相对设置，分别吸附待贴合的上基板31和下基板32。
其中第一支撑梢43和第二支撑梢44具有第一位置状态和第二位置状态，请参阅图6，图6所示为本实施例中第一支撑梢43和第二支撑梢44位于第一位置状态的俯视图，在第一位置状态，第一支撑梢43和第二支撑梢44位于上盖板21和下盖板22相对表面之间。
当由于上盖板21的吸附力不足上基板31掉落时，请参阅图7，图7所示为本实施例第一支撑梢43和第二支撑梢44接住掉落的上基板21的俯视图。
当上基板没有掉落时，第一支撑梢43和第二支撑梢44伸缩移动至第二位置状态，请参阅图8，图8所示本实施例中第一支撑梢43和第二支撑梢44位于第二位置状态的俯视图。
第一支撑梢43和第二支撑梢44上都设置有压力传感器，可通过压力变化获知其上是否有“掉片”。主机台1上还设置有控制单元，其与压力传感器连接并能接收其数据，当其获知压力传感器的压力变化数据变化后，其会停止上、下盖板之间的相互靠近操作。控制单元还连接有报警单元，用于向其发出报警指令。当控制单元根据压力传感器的压力变化数据发现上盖板对于基板吸附力不足而出现“掉片”问题时，其会通知报警单元进行报警，以便提醒外部操作人员进行相应的部件维护或是更换。控制单元还连接有机械手，用于移除第一支撑梢41上掉落的上基板31。
以下说明本发明优选实施例中的真空贴合机的贴合作业过程：
在进行贴合作业时，首先上盖板21上吸附上基板31，下基板22上吸附下基板32，然后第一支撑梢43和第二支撑梢44伸缩移动至第一位置状态。
接着主机台1抽真空，如果上基板21掉落，第一支撑梢43和第二支撑梢44便可接住掉落的上基板21，压力传感器的压力数据便会发生变化，接着控制单元停止上、下盖板之间的相互靠近操作，然后主机台1停止抽真空，腔室打开，机械手移除第一支撑梢43和第二支撑梢44上掉落的上基板31；同时控制单元向报警单元发出报警指令，报警单元进行报警，提醒外部操作人员进行更换吸附装置。
如果上基板21没有掉落，第一支撑梢43和第二支撑梢44便会伸缩移动至第二位置状态，接着两盖板相对靠近，将待贴合的上基板32和下基板33贴合。依次循环，防止基板掉落报废。
在其他实施方式中，支撑梢的形状、设置数量以及移动方式可随需要而定，并无限定，只要能保证稳妥的接住因吸附力不足而掉落的上基板即可。
在不同实施方式中，其中所述第一支撑梢的材料可以采用不锈钢材料，也可以采用有机复合材料或者有机材料，具体可以随需要而定，并不限定于这三种材料。
本发明的有益效果在于：本发明提供一种真空贴合机，在主机台内部设置一对相对设置的支撑梢，其具有第一位置状态和第二位置状态；其中在所述第一位置状态，所述第一支撑梢位于所述上、下盖板相对表面之间，并能接住从所述上盖板掉落的所述上基板，解决了上基板掉落到下基板上使得两者之间出现位置偏差、进而由于两者位置偏差再做进一步的贴合后导致的上、下基板贴合后报废的问题。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种真空贴合机，其中，包括主机台，其内设有上下相对设置的上盖板和下盖板用于分别吸附待贴合的上基板和下基板；其中所述主机台内还设有第一支撑梢，其具有第一位置状态和第二位置状态；其中在所述第一位置状态，所述第一支撑梢位于所述上、下盖板相对的表面之间，并能接住从所述上盖板掉落的所述上基板；在所述第二位置状态，所述第一支撑梢位于在所述上、下盖板相对的表面之间的区域之外，以使所述上、下盖板能够相互靠近进而将其各自吸附的所述上、下基板进行贴合。
  2. 根据权利要求1所述的一种真空贴合机，其中，所述第一支撑梢设置有压力传感器，通过压力变化获知其上是否存有掉落的所述上基板。
  3. 根据权利要求2所述的一种真空贴合机，其中，还包括控制单元，其与所述压力传感器连接并能接收其数据，当其获知所述压力传感器的压力变化数据变化后，其会停止所述上、下盖板之间的相互靠近操作。
  4. 根据权利要求3所述的一种真空贴合机，其中，所述控制单元还连接有报警单元，用于向其发出报警指令。
  5. 根据权利要求3所述的一种真空贴合机，其中，所述控制单元还连接有机械手，用于移除所述第一支撑梢上掉落的所述上基板。
  6. 根据权利要求1所述的一种真空贴合机，其中，所述第一支撑梢通过旋转的方式在所述第一位置状态和所述第二位置状态之间转换。
  7. 根据权利要求3所述的一种真空贴合机，其中，所述第一支撑梢旋转的角度范围为0～180度。
  8. 根据权利要求1所述的一种真空贴合机，其中，所述第一支撑梢通过伸缩的方式在所述第一位置状态和所述第二位置状态之间转换。
  9. 根据权利要求1所述的一种真空贴合机，其中，还包括第二支撑梢，其与所述第一支撑梢相对设置，其也具有第一位置状态和第二位置状态，用于与所述第一支撑梢共同接住掉落的所述上基板。
  10. 根据权利要求1所述的一种真空贴合机，其中，所述第二支撑梢设置有压力传感器。
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