1278793 九、發明說明： 【發明所屬之技術領域】 合裝地的基板貼 _ 【先前技術】 液晶的封入有 、液晶顯示板是在玻璃基板間封入液晶製造的， 注入式和滴下式。 液晶滴下型的液晶顯示板的製造經 由密封劑來貼合二塊基丄 其貼s後的谷室内壓力返回至大氣壓的 = 板間隔的工程即間隙產生卫程。 α刀蘇七成所疋基 在釗者真空環境中的基板貼合工程中，由且 士 ΐ，將二塊基板貼合’但若在密封劑和基:之在 J接，處或㈣劑的壓碎不充分之處，則在其後的間隙 ^ 中’存在不能形成合適的顯示面的可能。 壬 6即’雖然在_產生卫程中爲了將容室内返回 室内供給空氣或惰性氣體，但是若在密封劑 門 σ = ，等因而產生貼合狀態不恰當，則容室 攸其非接觸處進入被密封劑包圍的顯示區域内，因而產生1、包I 不良。 —ϋ提案了將貼合的二塊基板間的間隙由距離測定器測 疋，檢測其距離測定值進入了規定範圍内，並判 A— 了恰當地貼合的基板貼合裝置（參照專利文獻i所;^基板進订 2002-229471 號公報）。 1 在該基板貼合裝置中，在二塊基板間的間隙沒進入 情況下，基於其間隙檢測信號來進行間隙控制以進入規^範 1278793 - 如上所述，在現有基板貼合裝置中，其構成爲：當將二塊基 • 板由框狀地塗抹的密封劑貼合時，二塊基板間的間隔由距離測定 器測定，當檢測其測定值進入了規定範圍内時，判斷出上下基板 由密封劑已恰當地貼合，繼而由容室内壓力回至大氣壓而進行産 生間隙。 可是，如果成爲大型基板，則因爲密封劑的塗抹長度理所當 然地變長，所以不易在密封劑的整個塗抹區域範圍内正確地檢測 出二塊基板之間的間隔已進入規定範圍内。 另外，在現有基板貼合裝置中，爲了檢測二塊基板是否由密 Φ 封劑進行了恰當地貼合，需要沿貼合基板的外周緣設置多個距離 測定器，因而不能避免構造的複雜化。 【發明内容】 因此，本發明的目的在於提供一種能正確且即時地判斷二塊 基板是否由密封劑進行了恰當地貼合的基板貼合判定方法。 另外，本發明的目的還在於提供一種能以簡易的構成來正確 且即時地判斷二塊基板是否由密封劑進行了恰當地貼合，由此可 以縮短貼合工程的生産流程週期的基板貼合裝置及基板貼合方1278793 IX. Description of the Invention: [Technical Field of the Invention] A substrate attached to a joint _ [Prior Art] A liquid crystal display panel is formed by encapsulating a liquid crystal between glass substrates, and an injection type and a drip type. The liquid crystal display type liquid crystal display panel is manufactured by laminating the two bases by the sealant. The pressure in the valley after the paste is returned to the atmospheric pressure = the interval between the plates, that is, the gap generation process. In the substrate bonding project in the vacuum environment of the latter, the two substrates are bonded together by the gentry, but if the sealant and the base are in the J joint, or the (four) agent If the crushing is insufficient, there is a possibility that a suitable display surface cannot be formed in the subsequent gaps.壬6 means 'although in order to return the chamber to the room to supply air or inert gas during the process of generating the valve, if the sealant door σ = , etc., the resulting fitting state is not appropriate, the chamber enters the non-contact portion. In the display area surrounded by the sealant, 1, the package I is defective. - ϋ Proposed that the gap between the two substrates to be bonded is measured by a distance measuring device, and the distance measurement value is detected within a predetermined range, and A - a properly bonded substrate bonding device is referred to (refer to the patent document). i;; substrate ordering 2002-229471). 1 In the substrate bonding apparatus, when the gap between the two substrates does not enter, the gap control is performed based on the gap detection signal to enter the specification 1278793 - as described above, in the conventional substrate bonding apparatus, When the two base plates are bonded together by a sealant applied in a frame shape, the interval between the two substrates is measured by a distance measuring device, and when the measured value is detected within a predetermined range, the upper and lower substrates are judged. The gap is formed by the sealant having been properly fitted and then returned to atmospheric pressure by the pressure in the chamber. However, if it is a large substrate, since the application length of the sealant naturally becomes long, it is difficult to accurately detect that the interval between the two substrates has entered the predetermined range within the entire application area of the sealant. Further, in the conventional substrate bonding apparatus, in order to detect whether or not the two substrates are properly bonded by the sealing agent, it is necessary to provide a plurality of distance measuring devices along the outer periphery of the bonding substrate, and thus it is not possible to avoid complication of the structure. . SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a substrate bonding determination method capable of accurately and immediately determining whether or not two substrates are properly bonded by a sealant. Further, another object of the present invention is to provide a substrate assembly which can accurately and instantaneously determine whether or not two substrates are properly bonded by a sealant with a simple configuration, thereby shortening the production cycle of the bonding process. Device and substrate bonding
本發明第一方案爲一種基板貼合裝置，將相對配置的二 板收納在可以減壓的容室内，使各基板的 ^土 動，由至少在任意-邊的基板上呈框狀地塗抹的密封劑，使^述 二塊基板在賴環境下貼合，其特徵在於，具有：制器，其檢 ，上，容室2壓力的感測器；控制器，其連接在該感測器上，由 來自該感測的信號，而取得上祕縣置的相對接近移動的 j序，該控制n在上述停止時序停止上述保持裝置的相對接近 谨。 本發明第一方案爲一種基板貼合裝置，其具有：保持一 板的第-保縣置、以與上述—邊基板相對的狀祕持另一= 1278793 ΐ: ^纖置相對接 被上述第二_錢伴縣置保持的—邊基板和 上述移動裳置1的可以減壓的容室，利用 動，由至少在任音、一邊的二一保持裝置相對接近移 塊基板在減壓環;下3基的;_使上述二 測器的信號，控制_^^動^接在該感測器上，基於來自該感 地配方= 二塊基板相對 狀態，其特徵在ί 下判斷貼合時的貼合 變化，以該檢測出的變化來進中’欢測上述容室内壓力的 地配ίίΐί=2：：種基板貼合判打法，將二塊基板相對 狀態，其特徵 :=ί生的曲變點，判斷上述二塊基板由上述密封劑進行了 置在ΐί、ΐί 一^板貼合方法，將二塊基板相對地配 的谷室内’使兩塊基板間的間隔變窄，由至少在任 ίΐίϊί地塗抹的密封劑使上述二塊基板在減壓環 六的料I =特被在於，至少在貼合過程中，檢測上述容室内壓 點的情況下’將使兩 本發明的基板貼合裝置、基板貼合判定方 法’著祕在賴觀T齡基㈣絲板2 密封劑等放現S。 U抹在絲板上的 在由框狀地塗抹的密封劑將二塊基板貼合時，從在容室内露 1278793 出的基板面放出氣體，該放出氣體進行作用使由排氣形成的減壓 環境的容室内的真空度降低。 可是，在二塊基板貼合之際，當二塊基板接近並由框狀地塗 抹的密封劑恰當地貼合時，其後因爲沒有在該密封劑包圍的範圍 産生氣體或產生極少氣體，所以放出氣體引起的容室内真空度降 低會停止或停滯。 即，若觀察容室内壓力的變化，則以二塊基板由密封劑恰當 地貼合的時序爲界’因爲形成曲變點或折曲部，所以由取得該曲 變點或折曲部而能夠來判斷該二塊基板是否由密封劑恰當地貼 合。 因此，本發明的基板貼合裝置及基板貼合方法，設置有檢測 容室内壓力的的感測器及基於來自該感測器的信號控制二塊基板 的貼合之控制器而構成，所以能以簡單的構成，正確且即時地判 斷二塊基板由密封劑是否進行了恰當地貼合，由此，可以縮短貼 合工程中的流程生產週期。 另外，本發明的基板貼合判定方法，因爲至少基於來自容室 内壓力檢測感測器的信號來判斷容室内的二塊基板是否由密封劑 恰當地貼合，所以能正確且即時地判斷是否進行了恰當地貼合， 即二塊基板的貼合狀態。 【實施方式】 以下，參照圖1至圖4詳細地說明本發明的一實施例。 即，圖1是表示根據本發明的基板貼合裝置的一實施例的構成圖。 圖1所示的基板貼合裝置是在液晶顯示板的製造中採用的裝 置，其構成爲：在由上容室1A及下容室1B構成的容室1内，上 載物台21及下載物台22相對配置，爲使作爲貼合物件的玻璃製 上基板31及下基板32在該上載物台21及下載物台22上分別由 靜電卡盤等保持。這裏，上載物台21構成第一保持裝置，下载物 台22構成第二保持裝置。 1278793 相對配置的二塊基板31、32中， 巧隨液晶4滴下_後置卩轉在下基板32的顯示面上預 閉並包圍，將由紫外線硬化構 =)以將其顯示面封 抹爲框狀。 件構成且具有枯結性的密封劑6塗According to a first aspect of the present invention, in a substrate bonding apparatus, two opposing plates are housed in a chamber that can be decompressed, and the substrate is smeared by at least an arbitrary-side substrate. a sealing agent for bonding two substrates in a immersed environment, characterized in that: a sensor, a detector for detecting, pressing, and a pressure of the chamber 2; a controller connected to the sensor From the signal from the sensing, the j-order of the relatively close movement of the upper secret county is obtained, and the control n stops the relative proximity of the holding device at the stop timing. The first aspect of the present invention is a substrate bonding apparatus, which has: a first holding of a plate, and a shape opposite to the above-mentioned side substrate; another one; 1278793 ΐ: The second _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 3 base; _ make the signal of the above two detectors, control _^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Fit changes, with the detected changes into the 'feeling the pressure inside the room's room ίίΐί=2:: kind of substrate bonding judgment, the two substrates relative state, its characteristics: = ί 生At the meandering point, it is judged that the two substrates are placed on the slab, and the two substrates are oppositely arranged in the valley to narrow the interval between the two substrates, at least Applying the sealant in any of the two substrates in the decompression ring I = is characterized in that, at least in the case of detecting the pressure point in the chamber during the bonding process, 'the substrate bonding apparatus and the substrate bonding determination method of the two inventions are secreted in the Lai Guan T-age base (four) wire. Plate 2 sealant and so on are released S. When the two substrates are bonded to each other by the sealant applied by the frame on the wire, gas is released from the surface of the substrate exposed in the chamber 1279973, and the evolved gas acts to decompress the exhaust gas. The degree of vacuum in the environment's chamber is reduced. However, when the two substrates are bonded together, when the two substrates approach and the sealant applied in a frame shape is properly bonded, since no gas is generated or a small amount of gas is generated in the range surrounded by the sealant, The decrease in vacuum in the chamber caused by the release of gas will stop or stagnate. In other words, when the change in the pressure in the chamber is observed, the timing at which the two substrates are properly bonded by the sealant is defined as the "deformation point" or the bent portion, so that the curved point or the bent portion can be obtained. It is judged whether or not the two substrates are properly bonded by the sealant. Therefore, the substrate bonding apparatus and the substrate bonding method of the present invention are configured such that a sensor that detects the pressure in the chamber and a controller that controls the bonding of the two substrates based on the signal from the sensor are provided. With a simple configuration, it is possible to accurately and immediately judge whether or not the two substrates are properly bonded by the sealant, whereby the process cycle in the bonding process can be shortened. Further, in the substrate bonding determination method of the present invention, it is determined whether or not the two substrates in the chamber are properly bonded by the sealant based on at least the signal from the pressure detecting sensor in the chamber, so that it is possible to accurately and immediately determine whether or not to proceed. It is properly bonded, that is, the bonding state of the two substrates. [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to Figs. 1 to 4 . That is, Fig. 1 is a configuration diagram showing an embodiment of a substrate bonding apparatus according to the present invention. The substrate bonding apparatus shown in FIG. 1 is a device used in the manufacture of a liquid crystal display panel, and is configured such that a loading stage 21 and a download object are provided in a chamber 1 composed of an upper chamber 1A and a lower chamber 1B. The stage 22 is disposed to face each other, and the glass upper substrate 31 and the lower substrate 32 as the bonding material are respectively held by the electrostatic chuck or the like on the loading stage 21 and the download stage 22. Here, the loading stage 21 constitutes a first holding means, and the download stage 22 constitutes a second holding means. 1278793 In the two substrates 31 and 32 which are disposed opposite each other, the liquid crystal 4 is dripped and the rear turn is pre-closed and surrounded on the display surface of the lower substrate 32, and is cured by ultraviolet light to seal the display surface into a frame shape. . Sealing agent 6 composed of pieces and having a dry knot
B 2U 7的控制’可以上下移動上載物台 92的 91 *該攝像機… 上下基板31、犯上的對準標記攝像將附著在 再者，在圖1中，記赛咖0 便具攝像域供給控制器7。 其指設置在下載物台^及下^對準標記之攝影， 下載物台22連接在可將下載物a 2 孔及透光玻璃窗， 0移動機構10上。 口在水平方向移動調整的X-Y一 氣管 η: ====使設置在該配管= 以下說明上述構成的基板貼合裝置的動作。 首先，控制器7打開開關閥ilb，由直空| r容室1内之排氣，進行控=容室 適於貼合基板31、32的壓力的真空度。 ，而丄基於由真空泵U的容室i内的排氣，容室1内隨時間的 2而減壓’真空度上升’但伴隨容室丨内高真空化的進行，從 至1内相對配置的二塊基板3卜32及滴在下基板32上的密 封诏6和液晶4放出氣體。再者，在以下的說明中，將 密封劑或液晶等放出的氣體總稱爲“來自基板的氣體，，'。土 1278793 現在，來自該基板等的氣體的 圖1所示地維持在離開的狀態 ^將一塊基板3卜32如 其壓力變化，就描繪出例如如圖2的壓力降低，伴隨 32等放出氣體的情況下，控；^ 7 在沒有從基板3卜 内真空抽取的情況下的經過時了相對將容室i 線的一個實例。 妁谷至1内的真空度的特性曲 即基板31、32在容室1内實際上相 容室1内，若考慮來自基板31、32 空抽取的 制’將上載物台μ τ降設定量而使上驅動控 二塊基板的對位。 1上下基板31、32接近，進行 該對=係從位置識別用攝像機9卜92供給的攝像信號 =進灯控制以驅動控制χ-γ_0移動機構 的上下基板3卜32之間的對位。 木進仃在基板面方向 ^上^ 31 _情6處於不接觸狀態。 =機構8，使上載物台21進-步下降，並進行 上美狀的密封劑6的整個區域内，在密封劑6與 上基板31的下面接觸的狀態下’因爲容室j内的壓力 齊 =6 ^圍，區域（封閉空間），所以沒有從密封劑6包圍$ 的上下基板3卜⑽等纽《，或者産生紐極少。 即，在二塊基板31、32由密封劑6恰當地貼合時，苴貼a ± 序以後’因爲沒發生從密封劑6包_封閉空間向容室厂内口守 體放出，所以容室1内的真空度暫時急劇地增高。 予 11 V:.: 1278793 性曲=所示的實線D是表示實際的容室1内真空度的變化的特 (τ〇) 的對位操作，在經過時間T2中，塗=真二裱丨兄中，進行貼合 基板31的下面接觸，二塊基板31、32 U6,整個區域與上 以經過時間T2爲界，因爲以後從S = 貼合的點。 下基板3卜32相對容室丨沒放出空間内的上 :劇上升，結果實線,進行變化 因而，一塊基板31、32的對位一曰& 士 4 制上下移動機構8，並進-步降低雜，Qf 就驅動老 12 ", 绝晨，對曲變點Ρ的捕捉方面進 — 片止 對位-旦完成，控繼7就將由 卜32 ¥ 檢測信號每隔預先設定的時中内的壓力 變點p 此般基於來自麼力檢測器12的信號捕捉到曲 1=可以將捕捉曲變點p的時序作爲停止時序，也 ί停序進—步將上載物台21下降設定距離的位置作 載物取得辦縣‘魏上τ移械構8，而停止上 ρ ’如圖1所示，將射檢測器（感測器^ 爲佳。在仏里接近對位時的二塊基板31、32的所在位置的位置上 12 1278793 另外，在本έ兒明書中，二塊基板3i、32的對位+点始 到貼合完成的過程稱爲“貼合過程”。 凡成以後，將 在接續基板貼合工程的間隙形成工程中，控 pq 口 21上升到原點位置。並且打開設置在配管13a上的Η奶 給源13向容室1内供給氮氣輸生氣^ 狀=出將上容室1A上升，打開容室1，將貼合 間受332^^回至大氣壓時，貼合的兩基板31、％之 間又内外μ力差而被加壓’由隔離物形成所定的單位 上述所說明的基板完成貼合，將顯示 單位間隔的板3卜32移送人到以㈣成了 化的密封劑硬化工程。 到兔外線㈣而使密封劑6硬 穿詈上f明，_制了圖1所示的該實施例的基板貼合 動作爹照圖4所示的流程圖進—步說明基板貼合方法 32 室1内相對的載物台21、22將供給的基板3卜 心由靜電卡盤等保持（步驟知）。 其次’在控制器7將容室！内由真空抽取減壓，並隨著形成 境的同時’驅動控制上下移動機構8，將上載物台21下 疋里並使上基板31接近下基板32 (步驟牝）。此時，上基板 31和密封劑6處於不接觸的狀態。 ^器7基於來自位置識別攝像機9卜92的攝像信號，驅動 ^ X-Υ-θ移動機構1〇 ’使上下基板3卜32之間 控制（步驟4c)。 -?制器7隨著接受來自壓力檢測器（感測器）12的容 \内壓力資料的供給的同時，驅動上下移動機構8並將上載物 口 21緩^降下，讓上基板31緩緩地下降（步驟4d)。 此日守接文了來自壓力檢測器12的容室1内壓力資料的供給的 13 1278793 ^制器7 ’每隔預先設定的時間間隔 士 ^麵壓力罐和本次檢測_力=^^ 基準ΪΪ。，前進到步驟^ ’判斷上述差Μ是否超過預先設定的The control of B 2U 7 can move up and down 91 of the loading platform 92. * The camera... The upper and lower substrates 31 and the aligning mark images will be attached. In Fig. 1, the game area is supplied with control. 7. It refers to the photography set on the download station ^ and the lower ^ alignment mark, and the download stage 22 is connected to the downloadable object a 2 hole and the light transmissive glass window, 0 moving mechanism 10. X-Y-air pipe in which the port is moved in the horizontal direction η: ==== The pipe is placed in the pipe = The operation of the substrate bonding apparatus having the above configuration will be described below. First, the controller 7 opens the opening and closing valve ilb, and controls the vacuum of the pressure suitable for the substrates 31, 32 by the exhaust gas in the chamber 1 by the straight space.丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 ' ' ' ' ' ' ' ' ' ' The two substrates 3b and the sealing crucible 6 and the liquid crystal 4 dropped on the lower substrate 32 emit gas. In the following description, the gas emitted from the sealant, the liquid crystal, or the like is collectively referred to as "a gas from the substrate,". Soil 1278793 The gas from the substrate or the like is maintained in a state of being separated as shown in FIG. ^When a substrate 3b is changed in pressure, for example, a pressure drop as shown in FIG. 2 is drawn, and in the case where gas is released by 32 or the like, the control is performed in the case where there is no vacuum extraction from the substrate 3 An example of the relative room i-line. The characteristic curve of the degree of vacuum in the valley to 1 is that the substrates 31, 32 are actually in the chamber 1 in the chamber 1 if empty extraction from the substrates 31, 32 is considered. The system "puts the upper stage μ τ down by a set amount to align the upper substrate with the upper substrate. 1 The upper and lower substrates 31 and 32 are close to each other, and the pair of images is supplied from the position recognition camera 9 92. The lamp is controlled to drive the alignment between the upper and lower substrates 3 and 32 of the χ-γ_0 moving mechanism. The wood entrance is in the direction of the substrate surface ^ 31 _ 6 is in a non-contact state. = Mechanism 8, the loading stage 21 is provided. Step-down, and carry out the esthetic sealant 6 In the region where the sealant 6 is in contact with the lower surface of the upper substrate 31, 'the upper and lower substrates 3 are not surrounded by the sealant 6 because the pressure in the chamber j is equal to 6 ^, the area (closed space).卜(10)等纽", or generate a small number of ridges. That is, when the two substrates 31, 32 are properly bonded by the sealant 6, the 苴 a a ± sequence after 'because the sealant 6 package_closed space does not occur The inside of the chamber is released, so the vacuum in the chamber 1 is temporarily increased sharply. To 11 V:.: 1278793 The solid line D shown is the actual change in the degree of vacuum in the chamber 1. The alignment operation of the special (τ〇), in the elapsed time T2, in the coating = true two brothers, the lower surface of the bonded substrate 31 is contacted, the two substrates 31, 32 U6, the entire area and the upper elapsed time T2 For the boundary, because the point from the S = fit later. The lower substrate 3 32 relative to the chamber is not released in the space: the rise, the result of the solid line, change, thus the alignment of a substrate 31, 32 & Shi 4 system up and down moving mechanism 8, and step by step to reduce miscellaneous, Qf drives the old 12 ", the morning, the right song The capture aspect of the click is entered - the stop is aligned - once completed, the control 7 will be used by the Bu 32 ¥ detection signal every time the pressure change point p in the preset time is based on the signal capture from the force detector 12 To the song 1 = the timing of capturing the curve point p can be used as the stop timing, and the step of lowering the set distance of the loading stage 21 as the load is obtained as the load of the county. Stopping on ρ ' As shown in Fig. 1, the detector (the sensor ^ is better. The position of the two substrates 31, 32 in the vicinity of the alignment is 12 1278793. In addition, in this case In the book, the process from the alignment + point of the two substrates 3i, 32 to the completion of the bonding is called a "fitting process". After the completion of the process, in the gap forming process of the subsequent substrate bonding project, the control pq port 21 rises to the original position. Further, the milk supplied to the pipe 13a is opened to the source 13 to supply nitrogen gas into the chamber 1. The upper chamber 1A is raised, the chamber 1 is opened, and the fitting chamber is subjected to 332^^ back to atmospheric pressure. The two substrates 31 and % are combined with each other to make a difference between the internal and external μ forces, and the substrate described above is formed by the spacers. The substrate shown in the above-mentioned substrate is bonded, and the plate 3 showing the unit interval is transferred to (4). The sealant hardening project. The sealing agent 6 is hard-wired to the outer line (4) of the rabbit, and the substrate bonding operation of the embodiment shown in FIG. 1 is prepared. The substrate bonding method 32 will be described with reference to the flowchart shown in FIG. The substrates 3 and 22 that are opposed to each other in the chamber 1 are held by an electrostatic chuck or the like (steps are known). Secondly, in the controller 7 will be the room! The inside of the inside is vacuum-extracted, and the upper and lower moving mechanisms 8 are driven and controlled, and the loading stage 21 is lowered and the upper substrate 31 is brought close to the lower substrate 32 (step 牝). At this time, the upper substrate 31 and the sealant 6 are in a state of no contact. The controller 7 drives the X-Υ-θ moving mechanism 1〇' based on the image pickup signal from the position recognition camera 9 to control the upper and lower substrates 3 to 32 (step 4c). The controller 7 drives the up-and-down moving mechanism 8 and lowers the load port 21 while receiving the supply of pressure data from the pressure detector (sensor) 12, so that the upper substrate 31 is slowly lowered. Ground drops (step 4d). On the same day, the supply of the pressure data from the chamber 1 of the pressure detector 12 is 13 1278793. The controller 7 'every predetermined time interval is the pressure tank and the current test _ force = ^ ^ Hey. , proceed to step ^ ’ to determine if the above-mentioned rate exceeds the preset
^ ^ mm R 止上載物台2i的降下的同時，著在該時序停 吸附保持，其後使上載物;21，對上基板31的 打開開關13b並隨著向容室i 3關/=關閥11b 搬出貼合的基板，移送入下—個a $ 至1内 硬化工程（步驟4g)，而、ί束们工關如由料線照射的密封劑 降下上載物△ 21。 /、 、β由上下移動機構8的驅動 緊，η-^也t〇 *此月匕防止將上基板31相對密封劑6壓得過 點係 d單構成，織毅率地魏 14 1278793 :郎ί夕卜广ίί述，在貼合之際，因爲能防止使上載物台21過 • 上載物台21的下降距離(行程長度) 1 了止在而要的取小限度。由此，能極力防止上載物台21下 上=31相對下基板32的位置錯移，能提高上下基 板31、32的貼合精度。 ^ 則fi 1内的壓力變化來檢測二塊基板31、32以密封 二—進仃〇虽貼5的時間點，所以即使在塗抹於例如下基板32上 和;^板、31的非接觸處所引起的、在密封劑6包圍的區域内 ιίΐί 氣泡的發生，從而可以製造品質優良的液晶 士认，ί ’在上述的實施例中’雖然使用在容室1内壓力的變化 之際，上次的讀取時間中檢測出的壓力檢測值和 檢測出的壓力檢測值的差μ的例子做了說明，但 in丄例如也可以由比較本次讀取時間中檢測出的壓力檢測 值和預先存儲在存儲部等中的壓力特性曲線來檢測曲變點P。 3卜it姓!^2所示特性曲線c的數據，也就是將二塊基板 1内；^B士圖1所不的狀態下，預先由實驗等求出在降低容室 預室内壓力與經過時間的關叙壓力雛曲線，將其 部。然後，在實際進行基板的貼合時，將容室内 測器母隔預先設定的時間間隔檢測出來，將其檢測 ==¾儲3力特性曲線中的對應的時間壓力值比較。並 測出兩者之差比預先設定的基準值大的時序檢 / ^ ϋ在上述實施例中，其構成爲：二塊基板3卜32對位後， ρ檢挤停止上齡纟21的下降，或者在曲變點 ^才双測出末後進一步下降規定的距離的時序使之停止。可 。又定在對位後的上載物台21的下降距離，且使上載物台Μ只下 15 1278793 :^該設定峡離舰合触置的情況下，可以由上 -否f則出曲變點p以控制器1來^斷貼合 疋否f口田地進仃。鱗，在沒檢測出曲變‘點p的情況下，:二 沒進行恰當地貼合，在檢測出曲變點p的情況判^ ^^ 也貼合。若在沒檢測出曲變點？的情況下，亦 口 卜斧叹疋里且如刖一個實施例般使上載物么 到檢測出曲變财，這樣，將兩基板關_下降 的情二I使上載物台21以賴下降的構成 其難於均⑽的液晶或密封劑賴度變化而使 i的距離下降貝由上下21只以設 力將受該難於均自壓_液晶或㈣^ ^21 這些密封舰綠上财日_下降。&種 上===也 ’力增加。這樣，即使液晶或密封劑的枯度存在^動轉工 二卜要的處理時間過長’且能進行高效率地貼合。並且， =曲變點p’則基於其檢測信號就得到停止 女ίr 下移動機構8的下降，就能防止施加 護基板避免基板受較忿彳::防止保 位也可以在使上基板接觸 總士 ϊΐ ’雖ί在下基板上的密封劑在整個範圍内與上基板31接 日2谷至2，/、空度最初急劇上升’但最好將讀取壓力檢測器的 堅力檢齡號的時間間隔設定爲比該上升需要的時間更長。 16 1278793 的上板3卜32之際，雖紐縣上基板31 的上，物σ 21下降，但也可使下載物台22侧上升。 ，有’雖然使用壓力檢測器（感㈣器）12來檢測貼合 =谷至内壓力的變化’但也可以從開始容室内真空抽取的時 又有’密封劑可塗抹在上下基板的任意一個上。 *減恰§地貼合這段期間係由真空泵繼續直 但本㈣亦可在到達貼合需要的真空度姐貼合需要的 真工^出設定量的真空度的時間點停止由真空泵的真空抽取的 這時’例如如果借助圖3說明，則在經過時間T1就停直 ，泵的真空抽取。停止由真空泵的真空抽取後，容室_力由於、 來自基板等的氣體放出，緩緩地上升。並且，上基板31和下^ 32在由密封劑貼合的時間點（經過時間T2) ^ 等的氣體«，所峨碰過日節2断容㈣ 或者變緩慢。因此，若觀察容室内壓力的變化，則在經過 $ 附近産生折曲部。因此，與上述的實施例的檢測曲變點ρ 檢測出該折曲部，只要能得到上載物台Μ的停止時序即可。 另外，雖然以在二塊基板間存在液晶的裝置做了說明，但 叙明也可以適用於一塊基板僅由密封劑貼合的裝置，這可做為 晶顯示板之適用例。 U 构收 把=法在上述的，說明了將本發明適用於液晶顯示 板k的情況’因下基板32上塗抹的密賴6在整個範圍内與上 基板31接觸，二塊基板由密封劑進行恰當地貼合。在液晶顯示 中’因爲極爲忌諱面板顯示區域内混入氣泡，所以需要使封^ 在整個區域内與上基板31接觸，沒有非接觸處。可是，^將^晶 顯示板用以外的二塊基板僅由密封劑貼合的裝置中，配合貼人Z 板做為對稱物，所配合適切之精確度當然不同，例如只&在^ 設定的接觸狀態允許範圍内就能恰當地判斷亦可適用。' 、 17 1278793 圖1是夺【圖式簡單說明】 圖2是务曰月的基板貼合裳置的一實補的構成圖。 出的氣體的放容室内真空度特性圖及從基板等放 圖3是說明圖性圖。 圖^ ^ mm R At the same time as the lowering of the loading stage 2i, the suction holding is stopped at the timing, and thereafter the load is carried; 21, the opening switch 13b of the upper substrate 31 is turned off and the closing is performed to the chamber i3. The valve 11b carries out the bonded substrate and transfers it to the next a$ to 1 hardening process (step 4g), and the stalks are lowered as the sealant irradiated by the feed line lowers the load Δ21. /, , β is driven by the up-and-down moving mechanism 8, and η-^ is also t〇* this month, the upper substrate 31 is prevented from being pressed against the sealant 6 by a single point d, and the weaving rate is Wei 14 1278793 : Lang In the case of the bonding, it is possible to prevent the lowering distance (stroke length) of the loading stage 21 from being over the loading stage 21 by a small amount. Thereby, the positional shift of the lower surface of the upper stage 31 with respect to the lower substrate 32 can be prevented as much as possible, and the bonding precision of the upper and lower substrates 31 and 32 can be improved. ^ Then the pressure change in the fi 1 is used to detect the two substrates 31, 32 to seal the time point when the two-in-one is pasted 5, so even if it is applied to, for example, the lower substrate 32 and the non-contact area of the board, 31 The occurrence of air bubbles in the area surrounded by the sealant 6 makes it possible to manufacture a liquid crystal of good quality, ί 'in the above embodiment, although the pressure in the chamber 1 is changed, the last time An example of the difference μ between the detected pressure detection value and the detected pressure detection value is described, but in example, the pressure detection value detected in the current reading time may be compared and stored in advance. The curve point P is detected by a pressure characteristic curve in a storage unit or the like. 3b it surname! ^2 The characteristic curve c data shown in the figure 2, that is, in the state of the two substrates 1; The closing curve of time is the pressure curve, and its part. Then, when the substrate is actually bonded, the indoor detector is detected at a predetermined time interval, and the corresponding time pressure value in the detection ==3⁄4 storage force characteristic curve is compared. And measuring the difference between the two is larger than the preset reference value / ^ ϋ In the above embodiment, the configuration is: after the two substrates 3 32 32, the ρ squeeze stops the decline of the upper age 纟 21 Or, at the curve change point, the timing of further dropping the specified distance is stopped and stopped. Yes. Also set the drop distance of the loading stage 21 after the alignment, and make the uploading platform only 15 1278793 : ^ When the setting of the gorge is off the ship, the curve can be changed from the upper to the negative f p is controlled by the controller 1 and is not attached to the field. In the case where the curve is not detected as the point p, the second is not properly bonded, and the case where the curve point p is detected is judged to be ^^^. If no distortion point is detected? In the case of the case, the axe sighs and, as in the case of an embodiment, causes the uploading object to detect the change of the money, so that the two substrates are turned off, and the falling object is lowered. It is difficult to change the liquid crystal or sealant of the average (10) and the distance of i decreases. From the upper and lower 21, the force will be affected by the hardening of the liquid crystal or (4) ^ ^ 21 . & kind of === also ‘force increases. Thus, even if the dryness of the liquid crystal or the sealant is too long, the processing time is too long, and the bonding can be performed efficiently. Moreover, the = curvature point p' is based on the detection signal to obtain the lowering of the lowering of the moving mechanism 8 by the female ίr, thereby preventing the substrate from being applied to prevent the substrate from being smashed: the prevention of the retention can also make the upper substrate contact the total Gentry 'Although the sealant on the lower substrate is connected to the upper substrate 31 over the entire range to 2, /, the vacancy initially rises sharply 'but it is better to read the pressure detector's strength aging number The time interval is set to be longer than the time required for the rise. On the upper plate 3b of 32 1278793, although the object σ 21 is lowered on the upper substrate 31 of New County, the side of the download stage 22 can be raised. There is a 'pressure detector (sensing (four)) 12 to detect the change of the fit = valley to the internal pressure 'but can also be extracted from the beginning of the chamber vacuum when there is a 'sealant can be applied to any of the upper and lower substrates on. *There is a vacuum pump that continues to straighten during this period. However, the vacuum can be stopped by the vacuum pump at the time when the required vacuum is reached. At this point of extraction, for example, if illustrated by means of Fig. 3, it is stopped at the elapse of time T1 and the vacuum of the pump is drawn. After the vacuum pumping of the vacuum pump is stopped, the chamber_force is gradually increased due to the release of gas from the substrate or the like. Further, the upper substrate 31 and the lower surface 32 are smashed by the gas « at the time point (elapsed time T2) ^ which is bonded by the sealant, and the surface of the lower substrate 31 is broken (4) or becomes slow. Therefore, if the change in the pressure in the chamber is observed, the bent portion is generated in the vicinity of $. Therefore, the bent portion is detected in the detected bending point ρ of the above-described embodiment as long as the stop timing of the loaded object can be obtained. Further, although an apparatus having liquid crystal between the two substrates has been described, it is also applicable to a device in which one substrate is bonded only by a sealant, and this can be applied as an example of a crystal display panel. The U-construction method is described above, and the case where the present invention is applied to the liquid crystal display panel k is described. 'Since the smear 6 applied on the lower substrate 32 is in contact with the upper substrate 31 over the entire range, the two substrates are made of a sealant. Make appropriate fits. In the liquid crystal display, since it is extremely difficult to mix air bubbles in the display area of the panel, it is necessary to make the sealing contact with the upper substrate 31 in the entire area, and there is no non-contact. However, in the device in which the two substrates other than the crystal display panel are only bonded by the sealant, the Z-plate is used as a symmetrical object, and the accuracy of the appropriate cutting is of course different, for example, only & The contact state can be properly judged within the allowable range. ', 17 1278793 Fig. 1 is a simplified diagram of the drawing. Fig. 2 is a structural diagram of a real complement of the substrate bonding of the month. The vacuum degree characteristic map of the gas in the discharge chamber and the substrate or the like are shown in Fig. 3 to explain the schematic diagram. Figure
圖4是表示jln斤不裝置說明其作動的容室内真空度特性 衣下圖1所示装置的動作的流程圖。 1A上容室 【主要元件記號說明】 1B下容室 1容室 la記號 1下室 4液晶 6密封劑 7控制器 8上下移動裝置 10移動機構 11真空泵 11a排氣管 lib開關閱 12檢測器 13惰氣供給源 13a配管 13b開關閥 18 1278793 21上載物台 22a記號 22下載物台 31基板 32基板 91攝像機 92攝像機Fig. 4 is a flow chart showing the operation of the apparatus shown in Fig. 1 under the clothes in the chamber. 1A upper chamber [main component description] 1B lower chamber 1 chamber la mark 1 lower chamber 4 liquid crystal 6 sealant 7 controller 8 up and down moving device 10 moving mechanism 11 vacuum pump 11a exhaust pipe lib switch read 12 detector 13 Inert gas supply source 13a piping 13b switching valve 18 1278793 21 loading stage 22a mark 22 download stage 31 substrate 32 substrate 91 camera 92 camera