201000885 六、發明說明： 【發明所屬之技術領域】 本發明係一種檢査各種電子零件有無微小缺陷或異物的方 法’以及用於該方法中之裝置。 【先前技術】 近年來，隨著液晶顯示器（LCD)、光學褒置或半導體裝置等 電子零件的處理能力的大容量化、高積航，安裝技術也^高度 技術化、細密化飛躍地進展。因此，在該等高密度下進行安裝的 電子零件製造產線中，迅速且正確地檢査電子電路圖案或各構件201000885 VI. Description of the Invention: [Technical Field] The present invention is a method for inspecting various electronic parts for the presence or absence of minute defects or foreign matter, and a device for use in the method. [Prior Art] In recent years, with the increase in capacity of high-capacity processing of electronic components such as liquid crystal displays (LCDs), optical devices, and semiconductor devices, the mounting technology has been highly technologically advanced and fine-tuned. Therefore, in the manufacturing line of electronic parts mounted at such high density, the electronic circuit pattern or components are quickly and correctly inspected.
之間的連接是否正確無誤，或是否有異物混入等，是曰 技術問題。 文J 例如，吾人可在液晶面板的玻璃基板的端緣 晶片㈣P on glaSS ; C0G)*式安裝驅動用晶片，並 刷基板（flexibleprimedcircuit ;FPC)等構件使其連接外部電路， iff 寻模組，此時，如圖12所示的，形成於玻璃基 性導電膜6二墓If ΐ動用晶片3的電極4’隔著凸塊5與異向 U電膜6内的導電粒子7，沿厚度方向形成可通電狀態，是很重 a㈤然後」上述凸塊5，在被數量充分*足料電的導電粒子7 ^圍的狀||下，是碰合著㈣基板H ^ ^ ^ 察’如圖13所示的，嵌入上焊 Ϊΐί，「觀細觀_，故可藉由計算·痕8 例如，上述專利文獻1揭示一種梦署，产政泳pm # i 分干涉顯微鏡以台下側設置微 檢查凸塊與電極焊墊 201000885 ίίί壓ίϊ驟後，立即檢查其壓合情況是否良好’♦有不Μ 產生蚧，也忐立刻修正壓合步驟的動作。 田有不良。口 又，上述專利文獻2揭示，與 鏡與相機的檢錄置中，根微分干涉顯微 定部分，峨縮短檢査日^據汾像貝㈣檢査區域分割限定出特 [專利文獻丨]日本特開2006—186179公報 [專利文獻2]曰本特開2005—227217公報 【發明内容】 [發明所欲解決的問題] 使其^ ，都是將電子零件載置於檢査用平台上， 使其沿水行向鑛並妨齡 向 2 越大^㈣纖_是觸的 是也 祕ί者:户錢光學_微鏡時，在賴之前，必須先ίί拍 選項的隹=」’ίίί利^建於顯微鏡或是作為附加 是利_攝心計】=焦=微 表面_離，或是到從透明:板的底面細ΐ ’是报難正確測量出的。於是，最近，為了因 二ίϊίαΐ有文，揭示—種自動對焦功能，其使用特殊的雷射 式4移感應裔，但是其價格太高，而且調整很費工夫，故 査ί序^物體而言，每次攝影都計算焦點距離， 目·事’本發贿供—魏触迅速、正確、低廉 且簡早的方式’對電子零件微細部分進行檢㈣優異檢查方法， 201000885 以及用於該方法中的裝置。 [解決問題之技術手段] 為了達成上述目的，本發明提供一種電子零件檢査方法，豆 依序重複町步驟：似步驟，其將電子零件魅於檢査用平^ i丄ίϊί:步驟’其讓具備顯微鏡功能與影像資料輸出功能： 並就定位於適當位置上’以拍攝該電子零件的既 护二㈣驟’其賴攝影機構巾具備顯微鏡功能的對物透 子零件的既定部位前進或後退，並就定位於適當的焦點 構拍摄行對焦；以及檢查步驟’其彻經過對焦的攝影機 構，以=杏兮i件的既定部位，並將該影像資料輸入資訊處理機 部位的良窥，該電子零件檢査方法的特徵為： 改變鱗物透麟奸料蚊雜之間的距離 姆郷賴料，在該纽纽機射進行精 3 佳焦點距離，重複改變該距離w與拍攝動作，直到 ;情隹5離為止;初次，對_於平台上的電子零件進 對物透鏡與電子零件既定部位之間的距離⑹ ϊ、、^ fir讀的既定距離’重複改變該距離無攝動作，直 記 離為止，同時將該決定好的最佳焦點距離 憶之最 成相對平零件檢査方法，其中，將該攝影機構安農 方向以及γ方向中的至少—方隨意移動，一邊 冉Ϊ在^個相異位置上依序進行對焦以及攝影。 •VL V ^ 述電子零件檢査方法’其中，設置可相對平A品 /σ °移動的第1攝影機構以及可相對平台面沿Υ方向移&的 201000885 第2攝影機構作為該攝影機構，一 置在平台上的單一或是複數電子零件^ ^機構相對於載 =丫方向移動，-邊在複數健異位置上依 圍第Ht發明提供一種電子零件檢査震置’用於申社直利r 包含:平 置上就定位’以拍攝載置於該平:上適當的位 =2的;;定到的影‘位檢: 設定成對=鏡 s所rs=r到該資訊處 _-邊以改===== 點距離’然後重複改變該距焱)以及拍攝 的舰，係先賴職聽與電子零魏定部位ί i動作，ί)奴ί預先設餅的蚊轉，重複改變該距離與拍 離，vi# ί5ϊ定最佳焦點麟’同峡所权好的最佳焦點距 離圮憶在該資訊處理機構中；第二次以後，對載置於平Α 進行的對焦’係在該資訊處理機構中，根據上i以前 π思、彔佳焦點距離導出最佳焦點距離的預測値，將該對物透 ^與，子零件岐雜之關_(L)先狀成該酬最佳焦點距 ，L重複改變該距離與拍攝動作，直到決定最佳焦點距離為止， 同時將所決定好的最佳焦點距離，記憶在該資訊處理機構中。 又，如上述電子零件檢査裝置，其中，該攝影機構，安裝成 可相對平台面沿X方向以及γ方向的至少一方隨意移動，相對於 ，置在平台上的單一或是複數電子零件，該攝影機構一邊移動， 一邊在複數個相異位置上依序進行對焦以及攝影。 201000885 再者，如上述電子零件檢査裝置，其中，讲 面沿x方向移動的第1攝影機構以及可相對平 的第2攝影機構作為該攝影機構，對於载置在 異位置上依序進行對焦以及攝影，同時，數個相 Y方向移動，在複數個減位置上依序g 一邊沿 [對照先前技術之功效] ^仃職从攝影。 讓载置於平台㈡象㊁技術那樣， 件的檢査對象部位以進行檢査，零 置，同時讓動作的速度更快。特別是，藉义心計裝 夠根據-邊改變攝影機構的對物透對焦，而能 所得到的影像資料，求出最佳焦點距1離 7^複攝影動作 就能從預先狀好的既定距_求出最佳^^的一1次’ ，，記憶上次以前的最健點輯 ;，纟^-次以 出預測最佳焦點距離，以此作為起 圭焦點距離導 料正確進行對焦，故_==1根而 的最2;點=:差欠=;=二頃：據=;:纽前所記 為重複檢査而產生的差異，也能=二：象 201000885 進而大幅縮短整個流程的時間。 雷早i丛因為是根據影像資料進行對焦，故即使作為檢査對象的 =v件的種類，突然改變，也無須停 = 對焦，-邊繼續進行檢査。 ％曰勒詞整 率而Iff Ξ本發明的電子零件檢錄置，便能夠以更有效 廉的方式’實施上述電子零件檢査方法。尤ί ;該裝置並非讓載置於平台面上的電子零件的檢査對象办 動構的攝影部並就定位’而是讓攝影機構本身移 士 H零件的檢査f子象部位以進行檢査，故彳台沒有必要作 ’整體，夠精簡’節省空間，並讓動作的速度更快。 ^ 本㈣的1子零件檢錄置，則由於在對舞時， ΐΓίΐί價的轉感應11 ’而是利用攝影機構所拍攝的^像資 鶴或偏移: 【實施方式】 接著，說明本發明最佳實施態樣。 圖1係表示本發明之電子零件檢査 t體圖。該檢査裝置10 ’設置在連結LCD 卜 ^入檢査裝置ω⑽平台上進行檢査，之制 Ϊ21係本體部，其内建有用來控:符 及用來進行檢査的資訊處理機構。 機構Μ 台12然工ί該檢査装置中’用來檢査的2個平 口 12 I3 &者搬運輸送帶u的輸送方:十 下的動作，對2個LCD模組同時進行檢査。排叹置並可藉由以 亦即’魏，被搬運輸送㈣輸送到位置點p的lcd模組 201000885Whether the connection between the two is correct or not, or whether there is any foreign matter, is a technical problem. For example, we can install the driver wafer on the edge of the glass substrate of the liquid crystal panel (4) P on glaSS; C0G)*, and brush the substrate (flexibleprimedcircuit; FPC) to connect the external circuit, iff to find the module, At this time, as shown in FIG. 12, the electrode 4' formed on the glass-based conductive film 6 is implanted between the electrode 4' and the conductive particles 7 in the anisotropic U-electrode film 6 in the thickness direction. Forming an energizable state, it is very heavy a (five) and then the above-mentioned bump 5, under the shape of a sufficient number of full-charged conductive particles 7 ^, is the coincidence (four) substrate H ^ ^ ^ As shown in Fig. 13, the upper welding wire 嵌入, the "viewing view", can be calculated by the calculation. For example, the above Patent Document 1 discloses a dream system, and the production swimming pm # i sub-interference microscope is set to the lower side of the stage. Check the bump and electrode pad 201000885 ίίί 压 , , , , , , 20 20 20 ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ 2 reveals that with the mirror and camera's record placement, root differential interference The micro-definite portion, the 峨 shortening inspection date, the 汾 汾 ( ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 专利 专利 专利 2006 2006 2006 2006 2006 2006 2006 2006 The problem to be solved by the invention] is to place the electronic components on the inspection platform so that they are along the water to the mine and the age is larger. 2 (four) fiber _ is the touch is also the secret : Household money optics _ micro-mirror, before Lai, must first ί 选项 选项 选项 」 」 」 」 」 」 」 」 」 」 」 」 」 」 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建 建From the transparent: the bottom of the board is fine ΐ 'It is difficult to measure correctly. So, recently, in order to reveal the autofocus function, it uses a special laser type 4 shift sensor, but its price is too high, and the adjustment is very laborious, so check the object The focus distance is calculated for each photography, and the subject matter is 'the bribe of the bribe—the Wei touch is quick, correct, inexpensive, and simple way to check the fine parts of the electronic parts (4) excellent inspection method, 201000885 and used in the method s installation. [Technical means for solving the problem] In order to achieve the above object, the present invention provides an electronic component inspection method in which a bean repeats a step in a step similar to a step in which an electronic component is enchanted by a check. Microscope function and image data output function: and positioning in the appropriate position 'to take the electronic part of the two (four) step's photographic mechanism towel with a microscope function of the objective part of the object through the forward or backward, and Positioning at the appropriate focus frame; and checking the step of 'focusing on the photographic mechanism to determine the predetermined part of the apricot, and input the image data into the information processing machine, the electronic part inspection The method is characterized by: changing the distance between the scales and the stalking material, and the distance between the mosquitoes and the mosquitoes, in the New Zealand machine, the fine focus distance is fine, and the distance w and the shooting action are repeatedly changed until; The first time, the distance between the objective lens of the electronic component on the platform and the predetermined part of the electronic component (6) ϊ, ^, the predetermined distance read by the fir 'repeated Change the distance without taking a motion, and keep track of it, and at the same time, recall the determined best focus distance to the most flat part inspection method, wherein at least one of the photographic mechanism Annon direction and the γ direction is freely moved. While focusing on the different positions, focus and photograph. • VL V ^ describes the electronic component inspection method, in which a first photographing mechanism that can move relative to the flat product A/σ° and a second photographing mechanism that can move relative to the deck surface in the x direction are used as the photographing mechanism, A single or multiple electronic components placed on the platform ^ ^ mechanism moves relative to the load = 丫 direction, - the edge at the complex position is provided by the Ht invention to provide an electronic component inspection shock 'for Shenshe Zhili r contains : Positioning on the flat position to take the shot on the flat: the appropriate bit = 2;; the determined shadow 'position check: set the pair = mirror s rs = r to the information _ - Change ===== point distance 'and then change the distance 焱) and the ship that was shot, the first line of the game and the electronic zero Weiding part ί i action, ί) slave Distance and shoot away, vi# ί5 最佳 最佳 最佳 最佳 最佳 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' In the information processing mechanism, according to the previous π, 彔 good focus distance, the best focus distance is derived.値, the object is permeable, and the sub-parts are noisy _(L) first to form the best focus distance, L repeatedly changes the distance and the shooting action until the best focus distance is determined, and at the same time Determine the best focus distance and remember it in the information processing organization. Further, in the electronic component inspection device described above, the image pickup mechanism is mounted so as to be freely movable with respect to at least one of the X direction and the γ direction with respect to the land surface, with respect to the single or plural electronic components placed on the stage, the photographing The mechanism moves and simultaneously focuses and photographs at a plurality of different positions. In the above-described electronic component inspection device, the first imaging mechanism that moves in the x direction and the second imaging mechanism that can be relatively flat are used as the imaging mechanism, and the focus is sequentially placed on the different positions. Photography, at the same time, several phases move in the Y direction, and in the plural subtraction positions, sequentially along the side of the side [control against the efficacy of the prior art] ^ dereliction of duty from photography. Let the inspection object placed on the platform (2) like the second technology to check and zero, and let the action be faster. In particular, it is possible to change the focus of the photographic mechanism according to the meaning of the ambition, and to obtain the best focus distance from the image data obtained from the image. From the _ to find the best ^ ^ 1 time ', remember the last most important point of the series; 纟 ^- times to predict the best focus distance, as the focus of the focus distance guide correctly focus , so _==1 root and the most 2; point =: difference owe =; = two are: according to =;: the difference between the new record recorded as a duplicate check, can also = two: like 201000885 and then greatly shorten the whole The time of the process. Because the type of the v member to be inspected suddenly changes, there is no need to stop = focus, and continue to check. The electronic component inspection method of the present invention enables the electronic component inspection method to be implemented in a more efficient manner.尤ί; The device does not allow the inspection object of the electronic component placed on the platform surface to operate the photographic portion of the moving body and locates it, but allows the photographic mechanism itself to check the sub-image of the H-part for inspection. There is no need to make 'holistic, lean enough' to save space and make movements faster. ^ The first sub-parts of this (4) are placed, and because of the dance, the 感应 ΐ ΐ 的 转 11 ' ' ' ' ' ' 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或 或Good implementation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the inspection of an electronic component of the present invention. The inspection device 10' is placed on a platform connected to the LCD inspection device ω(10) for inspection. The system 21 is a body portion having an information processing mechanism for controlling the symbol and for performing inspection. In the inspection unit, the two flats that are used for inspection are in the inspection device. 12 I3 & The conveyer of the conveyor belt u: Ten operations are performed, and two LCD modules are simultaneously inspected. The sneak can be placed and can be transported to the location point p by means of the "Wei", which is transported (4).
(Ο ’被設罢* l -1— 裝置前侧之 査位置點R(Ο ‘ is set to set * l -1— Check position on the front side of the device
移載機構18移載到搬運輸送帶11上。 1)，被 配置在裏側 在前階段， 接著，如圖2 (b)所示的，The transfer mechanism 18 is transferred to the transport conveyor belt 11. 1), is placed in the inner side in the previous stage, then, as shown in Figure 2 (b),
第2 = n如的，完成檢査的LCD模組⑻，在載置於 ΐ Λ 的狀態下向前侧的位置點T ’在下—個步驟（圖2 、L/J的步驟I中，送出到搬運輸送帶11該側。然後，空的第2 平台13回到裏側的檢査位置點s，LCD模組（1)移載於其上。 =下二重複上述一連串的動作，LCD模組的檢査係2個2個地連 作為上述檢査對象的LCD模組’如圖4所示的，係由LCD30、 j L^D30的上侧邊緣部（在將LCD3〇水平放置的狀態下的裏側 邊緣部）横向並排成一列的丨〇個源極晶片31、同樣在1^；1)3〇的 左侧邊緣部縱向並排成一列的4個的閘極晶片32、連接該等晶片 31、、32與控制基板33的驅動電路基板（FPC)34所構成的。然後， 上述各晶片31、32，與圖12所示的情況相同，其凸塊隔著異向性 導電膜’與LCD30側的電極焊墊壓合（圖示省略）。 然後，上述LCD模組的驅動電路基板34的檢査，在該檢査 褒置的第1平台12上進行，上述LCD模組的晶片31、32的安褒 部位的檢査，在該第2平台13上進行。 —首先，在上述第1平台12上的檢査，在圖2之檢査位置點R 所不的位置上，如圖5 (a)以及其A—線之剖面圖的圖7所示 201000885 裏進行的。該攝影機構4。， 機45所組合而成，可相對貝料輸出功能的CCD相 底面側，-邊沿X方^動，一 的1 動電路基板料，自其 像。 邊對各既疋位置點拍攝其放大影 又’上述微分干涉顯微鏡44具備藉 將被拍攝物體的折射率或厚声的鐵H由=刀干涉棱鏡幻而可 係使用青色發光二極體。因古刀干f員微鏡44的照明， 係用來讓上述攝影機構仙沿X方向移動k ίί 係使用可高速停止的線性 =器 對焦的ζ方向調整機構來讓具;:二向=並f 位調整攝賴構40高度的線性步進致(㈣早 方向ί整機構4G的細G在_部分強穩地固定在z f，1故即使上述攝影機構4G沿x方向重移 ' / Γ7 ' Τ 也不會產生振動或光轴偏移，而對拍摄造成·2^ 以及配置在下端部的CCD相機 ^ 固定住，故移動時不會搖動。 门丨則導&塊48a、48b 其支撐並承受包含第1平台U以及 ，種檢査用構成要件，宜使用厚度㈣m以上， 特別疋16mm以上的超剛性鋼板，其相對攝影機 度變化、濕度變錄敎，讓射_ —直在穩Ϊ的 相二H影If 4。的微分干涉顯纖44所得到，由CCD =^處理為雜雜，輸^制本料a (參照圖〇 上述資訊處理機構’將上述攝影機構4〇輸入之影像資料，利 201000885 用，先設定好且對應檢査項目親定演算程式進行轉 換成以256階之輝度階段作為基礎的輝度分布資料），並 盥 檢査項目設定好的基準資料進行比較，偵測出未達基準者 判定為不良品。然後，該比較資料可定期的列印出來 ^ 再列印。 4 β而戈' ^，在檢査期間，輸人上述資訊處理機構的雜資料，跟檢 査…果一起，逐次地顯示在裝置的螢幕畫面2〇 (參昭圖 ’檢査對象部位的放大影像’在與基準#料‘對 用 = 實施標記的狀態下顯示，將偵測到不良情二二 綠色的框圍繞，不良時以紅色的框圍繞顯示之^將特疋£域以 ^者，上述資訊處理機構’設置有最健顧轉出部㈣ 取佳焦點距離記憶部，如以下所述，係作為對㈣ 續的 7環°亦即’若利用該系統’當依序檢査該LCD模^， =LCD模組’在檢査之前’於同一個檢査位置點 進行 ，，焦攝影’根據所得到的影像資料，算出最佳焦 ^照运健値，讓攝影機構4〇 (的對物透鏡41) a ^、 祐 態 同^ :後_ 中:=二 離，而是根據所記憶的最佳焦點距離，按昭 出預測的最佳输雜，織_這個則^ 廷是因為，作為檢査對象的LCD 圖’、、 會因為製造時的加熱或拉力而有趣、6雜表不的， 位置點⑽如，在圖6巾雜^1^斜餘況，故將各檢査 會改變這件事考廣進去，根不&地方）的適當焦點距離 的適當焦點距焦時所記憶的12個地方 點距離，錄據其位置更纽點轉_測最佳焦 +叫仃對焦，並在短時間内進入 12 201000885 攝影動作。 焦點i離在mu檢ί的過程中’每次都記憶對焦時的最佳 對象的LCD ^根據所雜的最餘謎離，便鮮握作為檢査 預測=ίί=出—定的傾向’加入對應該差異的修正以導出 象的電子零件產Ϊ差;樣使因為重複檢査使作為檢查對 而大幅縮短整個過程的時^因應該差異傾向迅速進行對焦，進 ,最佳ί點==前;;預測第二次以後的 次的最佳焦點距離，當作如 ====:、當作本次= 摆箱期、裝置時，因應檢査對象物品的特性，選 擇預=度最快的方法，建構出對焦的校m 則一 據在求出各檢査位置點之最佳焦點距離，可根 算出來。亦即，係的關係式計 在特定距離前後，變，變化的輝度， 大變化量Δα以及該斜^，變化曲線的最 ：ΐίΐ~.2"J ^ 的適田,、、、點距離祕的過程，在極短的時間内求出。 設置了從搬而会載置^^模組的第1平台12的下側， i使其就組彻模組， 動機構、”向移動機=讓而平 = 工 旋轉機構（這些圖示被省略）。 。千面方向鉍轉的Θ軸 13 201000885 另外，在上述第2平台13上的檢査，於圖2中的檢査位置點 S所示的位置上，如圖5 (b)所示的，係利用設置在其左側的‘γ 方向攝影機構 —50，以及並排設置在其裏側的2個X方向攝影機構 上述X方向攝影機構51、52，可用來檢查在作為檢査對象 LCD模組中横向並排成一列的源極晶片31與^^^如之壓合部的 良窳，其並排設置之間隔與各晶片31間之間隔相同，這樣同 時檢查2個相隣晶片31。然後，各攝影機構51、52，跟該 構40 (參照圖7) 一樣，透過對焦用的乙方向調整機構47，^ fX方向移動機構46上，藉由跟該攝影機構40同樣的動作， ，沿X方向移動，一邊同時對2個晶片31，拍攝 更具體而言，在圖4中，ai、所示之晶片31 = f 51所拍攝’ bl〜b5所示之晶片31，被上述攝影機構52 而同，逸些拍攝動作’是讓攝影機構51、52同時並排移動， 攝以動作因此整體而言，在非常短的時間内，就能完成拍 —Υ方向攝影機構5G，可絲檢4在_ LCD模組 i攝極晶片32與lcd3〇的壓合部的良窳，跟 方向調整機構ί，安〜樣，透過對焦用的z 移動，一邊#曰片方向移動機構53上，一邊沿Y方向 方向攝影機攝各既定位置點的放大影像。由於上述γ 動作ΐ時=m動作，也跟上繼彡麟51、52的拍攝 攝以及檢査動作 而言’在非常短的時間内，就能完成拍 本處5=5^_彡_，也會被輸入裝置的 査同樣的處理，^ ^籌’然後進行跟在該第1平纟12上的檢 果一起，逐出不良品。該影像資料，也會跟該檢査結 台η的的$幕晝面2〇 (參照圖υ上，第1平 觀察之。惟以^第2平台13的檢査影像，可用開關切換 顯村式並無特別限定，可適當設定之。 14 201000885 又，在上述檢査中，也跟在第！ 初的LCD模組，在檢査之前，於1丄口 12，檢査：樣，對最 次對焦用攝影，並根據所得到的与^點上重複進行複數 然後按照該數値，職影機構f佳焦點距離， 的預測最佳焦點“自^^^己杳隐之最佳焦點距離所導出 〜的Z方_定位，上賴频構50 預先被定上組义二台12上， 未設置定位用的移動‘。准°為了^; 平台12那樣’並 !=圖2、_該::：==:送 权置Y方向移動機構（圖示省略）。 卞口 J的下側’ 先，査裝置’以如下方式，對LCD模組進行檢査。首 ί=)從搬運輸送帶11 (參照圖2)上移ΐ 俜使用攝：機槿4Π並Ϊ確地就定位於檢査位置點尺上。該定位， ‘ 12 3以設置在LCD模組上的對準標記作為目 ϊίί: 方向、γ方向、θ(_方向移動 上，謓LCD模組的驅動電路基板34的檢査開始位置 就定位於適當的檢査位置上，之後為了進行對焦 次’再根據所得到的影像資料計算“ 然後根據該數値’賴影機構4G (的嶋透鏡41) 口 ^動以進行對焦，並在該狀態下實施檢査用的攝影動口 2^^ 述的，在第一次以後的對焦時，根據從上述所兮己 ^之最佳焦點距離導出預測最佳焦點距離’以更有: …、’進而提高整個檢査處理的速度。 、 然後，本體部21 (參照圖υ内的資訊處理機構，將上述攝 15 201000885 40輸人的影像資料，與預先設定 ，，基準的不良品。此時，輸人上述資訊處理像Ϊ ;、，該檢査結果-起，逐次顯示在褒置 圖 ^良=偵測到不良纽的部位而言，以—目商方尨= 另外，對上，驅動電路基板34 (參照圖4)、挾著異向 膜的LCD30的壓合部中的上述驅動電路美 =30電極之間’檢査是否偏移而產生不；情況時』査= 如圖9 (a)所示的。此時，以既定間距 _ =中沿縱方向並排的導電粒子61的數量，触導電 差檢查出凸塊60與lcd3〇電極的偏移（圖中 以N表不之>當該情況在一定的比例以上時，便顯示其 -入Lit檢査上述驅動電路基板34與LCD30的壓合部中〈是口否 檢査影像，如圖9⑻所示的。此時，當壓合部 物63時，將該異物63存在的範圍，沿上下方向作4等份 的W ’並根據其面積、雜、輝度等⑽，靖其 的數値以上而為導電粒子61以外的雜物時，顯示其為不良·^疋 杳表7F ’在上述第1平台12上對咖模組進行檢 :、Z方向調整機構（在0 10中記載為「z轴」）47、CCD^ 45以及在資訊處理機構中的影像處理機構（在圖1〇 = 「CPU」）的運轉模式圖的一個實施例。 °戰為 接著，將在上述第1平台12上完成檢査的LCD模袓 片）’從檢査位置點R (參照圖2)，移载到配置於檢査位、置點V『J 的第2平台13上。然後，同時驅動X方向攝影機構5ι、52， 及Y方向攝影機構50，以同時對LCD模組的源極晶片31、 ^ 晶片32與LCD30的壓合部進行檢査。藉此，便能夠以 & 晶片31、32進行檢査。又，此時也是，因為是對第1片[ 模組進行檢査，在進行檢査用攝影之前，得到對焦用的影 故在相同檢査位置上一邊改變Z軸方向高度一邊進行複數次攝 16 201000885 ^隹並2 最健、難離，錢根制數値進行 在i㈣^述最錄點距離記憶在資贿理機射。然後， 時’娜從上述嫌之最縣點距離所導出 位，並精確聚構51等構件在ζ方向上就定 健、點雜，藉此讓對线有鱗地進行。 LCD30 片31(32)的凸塊，以及LCD3()電極之間， ίΓ充足數量的料粒子61時，其檢査影像如圖11 (a) 在各凸塊的壓合部64上’壓合於該部分上的導電 粒子，壓痕65顯示為約略_的陰影，故如圖u⑻ ^四圍各凸塊的壓合部64的區域框起來，該四角框内所 ί:的ί電粒'子的壓痕65，將其陰影圖案特定並標示起來（以小 紐量。麟，#魏紅絲設定的基 準値以下時，顯示其為不良品。 致其由於湘上述檢査裝置，在檢^LCD^組的驅動電In the second = n, the LCD module (8) that has been inspected is placed in the state of ΐ 向前 in the forward position T' in the next step (in step I of Figure 2, L/J, sent to The side of the conveyor belt 11 is transported. Then, the empty second platform 13 returns to the inspection position point s on the inner side, and the LCD module (1) is transferred thereon. = The second series repeats the above-mentioned series of operations, and the LCD module is inspected. The two LCD modules which are the two inspection objects to be inspected as shown in FIG. 4 are the upper edge portions of the LCDs 30 and j L^D30 (the inner edge portions in the state where the LCDs are horizontally placed) a plurality of source wafers 31 which are arranged side by side in a row, four gate wafers 32 which are vertically aligned in a row at the left edge portion of the first, third, and third sides, and which are connected to the wafers 31, 32 is formed by a drive circuit board (FPC) 34 of the control board 33. Then, the wafers 31 and 32 are pressed in the same manner as in the case shown in Fig. 12, and the bumps are pressed against the electrode pads on the LCD 30 side via the anisotropic conductive film ′ (not shown). Then, the inspection of the drive circuit board 34 of the LCD module is performed on the first stage 12 of the inspection unit, and the inspection of the mounting portions of the wafers 31 and 32 of the LCD module is performed on the second stage 13. get on. - First, the inspection on the first stage 12 is performed at a position other than the inspection position point R in Fig. 2, as shown in Fig. 5 (a) and its A-line sectional view shown in Fig. 7 201000885. . The photographing mechanism 4. The machine 45 is combined to form a CCD phase on the bottom side of the beaker output function, and the edge of the X-axis is moved, and one of the movable circuit substrate materials is self-imaged. The magnifying light-emitting diode is used to capture the magnified image of each of the respective position points. The above-described differential interference microscope 44 is provided with a blue light-emitting diode by using the refractive index of the object to be photographed or the thick iron H. Because the illumination of the micro-mirror 44 is used to make the above-mentioned camera mechanism move in the X direction, k ίί uses a linear direction adjustment mechanism that can be stopped at a high speed to make the device; two directions = and f The linear adjustment of the height of the 40-degree adjustment frame ((4) The fine G of the early direction tidying mechanism 4G is strongly fixed at zf in the _ portion, so even if the above-mentioned photographic mechanism 4G is re-shifted in the x direction ' / Γ7 ' Τ There is no vibration or optical axis shift, and the camera is fixed to the camera and fixed at the lower end of the CCD camera ^, so it does not shake when moving. The threshold is guided by & blocks 48a, 48b. For the first platform U and the components for inspection, it is advisable to use ultra-rigid steel plates with a thickness of (4) m or more, especially 疋16 mm or more. The relative camera degree changes and the humidity changes, so that the radiation is stable. The differential interference interference of the second H-image If 4. is obtained by the CCD = ^, and the input material a (refer to the information processing mechanism of the above-mentioned information processing mechanism to input the image data of the above-mentioned imaging mechanism 4 ,, Lee 201000885, first set and corresponding check project pro-calculation program The line is converted into a luminance distribution data based on the luminance stage of 256 steps, and the reference data set by the inspection item is compared for comparison, and the non-standard is detected as a defective product. Then, the comparison data can be periodically listed. Printed out ^ Reprinted. 4 β and Ge ' ^, during the inspection, the input of the information processing agency's miscellaneous materials, together with the inspection ... fruit, displayed on the device screen 2 逐 (see the map 'check The magnified image of the target part is displayed in the state where the mark is applied with the reference material, and the frame of the green color is detected. If it is bad, the frame surrounded by the red frame will be displayed. In the case of ^, the above information processing mechanism 'is provided with the most vital care transfer part (4) to take the best focus distance memory part, as described below, as a pair of (4) continued 7-rings, that is, 'if using the system' Check the LCD module ^, = LCD module 'before inspection' at the same inspection position, and focus photography 'According to the obtained image data, calculate the best focus, and let the photography organization 4〇 ( Opposite lens 4 1) a ^, the same state with ^: after _ medium: = two away, but according to the best focus distance that is remembered, according to the best prediction of the mixed transmission, weaving _ this is because the inspection is because The object's LCD diagram ', will be interesting because of the heating or pulling force during manufacturing, 6 miscellaneous, the position point (10), for example, in Figure 6, the miscellaneous ^1^ oblique condition, so each inspection will change this matter Kao Guangjin, the root of the appropriate focus distance of the appropriate focus distance from the 12 points of the memory when the focus is recorded, the position of the record is more pointy _ Measure the best focus + call 仃 focus, and in the short Enter the 12 201000885 photography action within the time. The focus i is in the process of mu inspection ί 'the LCD of the best object every time the memory is focused ^ according to the most mystery of the miscellaneous, the fresh grip as the inspection prediction = ίί = out - the tendency to 'join the pair The difference should be corrected to derive the difference between the electronic parts of the image; the result is that the time of the whole process is greatly shortened because of the repeated inspection, and the difference should be directed to quickly focus, enter, and the best ί point == before; Predict the best focus distance after the second time, as if ====:, as this time = the boxing period, the device, according to the characteristics of the object to be inspected, choose the method with the fastest degree, The school m that constructs the focus is calculated based on the best focus distance at each inspection position. That is, the relational expression of the system is measured before and after a certain distance, the change, the brightness of the change, the large change amount Δα, and the maximum of the change curve: ΐίΐ~.2"J ^ The process is found in a very short time. The lower side of the first platform 12 from which the ^^ module is placed is placed, i is set to form a module, the moving mechanism, "to the mobile machine = let and flat = the rotating mechanism (these icons are Omitted). The xenon axis 13 in the direction of the thousand faces 201000885 In addition, the inspection on the second stage 13 is at the position shown by the inspection position point S in Fig. 2, as shown in Fig. 5(b). The X-direction photographing mechanism 51, 52, which is disposed on the left side of the 'gamma-direction photographing mechanism', and the two X-direction photographing mechanisms disposed on the inner side thereof, can be used to check the lateral direction of the LCD module as the inspection object. The source wafers 31 are arranged side by side in a row, and the nips of the embossing portions are arranged side by side at the same interval as that between the wafers 31, so that two adjacent wafers 31 are simultaneously inspected. Then, each of the photographs is photographed. Similarly to the configuration 40 (see FIG. 7), the mechanisms 51 and 52 are moved in the X direction by the same operation as the imaging mechanism 40 through the B-direction adjustment mechanism 47 for focusing, and the fX-direction moving mechanism 46. While photographing two wafers 31 at the same time, more specifically, in Fig. 4, ai, The wafer 31 of the wafer 31 = f 51 is photographed by the above-mentioned photographing mechanism 52, and the photographing operation is performed by moving the photographing mechanisms 51 and 52 side by side at the same time. In a very short period of time, you can complete the shooting-Υ 摄影 photographic mechanism 5G, which can be used to check the nip of the _ LCD module i, the photo chip 32 and the lcd3 窳, and the direction adjustment mechanism ί, 安In the case of the z-focus movement, the camera moves the camera at a position in the Y direction, and the camera zooms in at the predetermined position. In the above-mentioned gamma action = = m action, it also follows. In the shooting of Lin 51, 52 and the inspection movements, 'in a very short period of time, you can complete the photo 5=5^_彡_, and the same processing will be performed by the input device. ^^ The result of the inspection on the first flat 12 is used to drive out the defective product. The image data is also 2 昼 昼 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 However, there is no particular limitation on the type of inspection image of the second platform 13 that can be switched by the switch. 14 201000885 In addition, in the above-mentioned inspection, the LCD module in the beginning of the first inspection, before the inspection, in the 1st port 12, check: the sample, the photography for the most focus, and according to the obtained Repeat the plural with the ^ point and then follow the number, the best focus of the professional focus of the camera, f, the best focus of the prediction, "Z-party _ positioning derived from the best focus distance of ^^^ 杳 杳 , , The frequency structure 50 is pre-set on the second set of 12, and the movement for positioning is not set. The standard is for ^; the platform 12 is like 'and!=Fig. 2, _ the:::==: the right to set the Y direction Movement mechanism (illustrated omitted). The lower side of the mouth J is first checked, and the LCD module is inspected as follows. The first ί=) is moved from the transport conveyor belt 11 (refer to Fig. 2). 俜 Use the camera: 槿 4Π and accurately position it on the inspection position. The positioning, '12 3 is set with the alignment mark set on the LCD module as the direction ίί: direction, γ direction, θ (the direction of movement, the inspection start position of the drive circuit substrate 34 of the LCD module is positioned appropriately In the inspection position, after that, in order to perform the focusing time, 'the image data is calculated based on the image data, and then the image is moved according to the number of the image sensor 4G (the lens 41), and the inspection is performed in this state. According to the photographic opening 2^^, in the first and subsequent focusing, the prediction of the best focus distance is derived from the best focus distance of the above-mentioned 以 ^ to further improve the entire inspection. The speed of the processing. Then, the main body unit 21 (refer to the information processing unit in the figure 将, the image data of the above-mentioned camera, 201000885 40 input, and the predetermined defective product. At this time, the above information processing is input. Like Ϊ ; , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ), the LC of the anomalous membrane The drive circuit in the nip of D30 is beautiful = 30 between the electrodes 'Check if it is offset and not generated; when it is checked 』 = as shown in Figure 9 (a). At this time, at a given pitch _ = middle edge The number of conductive particles 61 arranged side by side in the longitudinal direction, the difference in the contact conductivity is checked for the offset of the bump 60 and the lcd3 electrode (in the figure, N is not shown); when the case is above a certain ratio, it is displayed. Lit checks whether the image is detected in the nip portion of the drive circuit board 34 and the LCD 30, as shown in Fig. 9 (8). At this time, when the portion 63 is pressed, the range in which the foreign matter 63 exists is in the up and down direction. When four parts of W' are used, and the amount of impurities, such as the area, the impurity, the brightness, etc. (10), is more than the number of particles of the conductive particles 61, it is shown to be defective. The coffee module is inspected on the platform 12: a Z-direction adjustment mechanism (denoted as "z-axis" in 0 10) 47, a CCD 45, and an image processing mechanism in the information processing mechanism (in Figure 1 〇 = "CPU An embodiment of the operation mode diagram of the operation of the above-mentioned first platform 12 The mold piece "from the inspection position point R (refer to FIG. 2) is transferred to the second stage 13 disposed at the inspection position and the position V"J. Then, the X-direction imaging mechanisms 5, 52, and Y are simultaneously driven. The directional imaging unit 50 simultaneously inspects the nip portions of the source wafer 31, the dies 32, and the LCD 30 of the LCD module. Thereby, the wafers 31 and 32 can be inspected. Because it is the first film [the module is inspected, before the inspection is performed, the focus is used for the shooting. When the height of the Z-axis direction is changed at the same inspection position, the number of times is taken. 16 201000885 ^ 2 and the most robust, Difficult to leave, the money root system is carried out in the i (four) ^ said the most recorded point distance memory in the bribe. Then, when Na Na is derived from the distance from the most prefecture of the above-mentioned county, and precisely, the members such as 51 are fixed and mixed in the direction of the ,, so that the line is scaled. When the bumps of the LCD 30 piece 31 (32) and the LCD 3 () electrode are a sufficient number of material particles 61, the inspection image is as shown in Fig. 11 (a) on the nip portion 64 of each bump. The conductive particles on the portion, the indentation 65 is shown as a shadow of about _, so as shown in Figure u (8) ^ surrounding the embossed portion 64 of each bump is framed, the 电 电 电 内 该Indentation 65, the shadow pattern is specified and marked (in small increments. Lin, #魏红丝 set the benchmark below ,, it is displayed as a defective product. To the above inspection device, in the inspection ^ LCD ^ group Drive power
叶算出對隹的^ 3卜％的良糾’個細象資料 ίΐ 距離並記憶起來，對第二&_ LCD 核、'且’根擬上次以前記憶之最佳焦點距離所導出 mm ^ 動並停止’賴進人攝職勢，並以高速紅絲麵進行移 而且，由於並非一邊讓LCD模組移動一邊進行檢査，The leaves calculate the correctness of the ^ 3 b% of the ' 个 细 细 细 细 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ 第二 第二 第二 第二 第二 第二 第二Move and stop 'Lai Jin people take the job, and move with high-speed red silk surface. And because it is not one side to let the LCD module move while checking,
機構40、5G〜52移動並對各既定部位連續轉影像資料以進行^ 査’故即使LCD模組是大型的’也能夠精簡裝置的整體空間 使跟LCD模組的製造生產線組合使用，也不會太佔空間。 P 又，在上述的實施例中，攝影機構40、/〇〜52 ^二 「40等」）、沿X方向、γ方向的移動速度，可根據裝置所要求^ 檢査速度、檢査精確度等，適當設定之，惟通常多設定在1〇〇〇 <秒以下/中也有奴在應醒/秒以下者，這對實施高速 査而言，疋比較適當的。 又，如上所述，即使讓攝影機構4〇等高迷移動、高速停止， 17 201000885 影像資料，在上述的實施例中，以穩 在下端部^ 構47上’該對物透鏡41與配置 限制l #彳抑制該細g的移動即可，並無特別 的構造，會時^當妙施_卩樣，形成_抑制絲方向偏移 相機=====，微鏡-與⑽ ，度宜在30〇_以下:其中， 筒的直徑宜在5G〜3()咖左右比較適當。 台ΐ2、ι第例中’為了提高檢査的效率’將第1平 數目，二，並排设置，以同時進行2種檢査’惟平台的 要酉己人^特別的限制。單—個也可以，3個以上也可以，只 等^"ί，同樣也能進行檢査。惟若考慮與搬運輪送帶11同步 述實施例，宜組合2個平台，是最佳的作法。 構40㈣j ^實賴巾，設置祕備沿x柯鑛的攝影機 盥、;12,以及組合沿X方向移動的攝影機構51、52 攝雜構5G的第2平台13,惟就攝影機構的 象二並無特別限制，若相對就定位於初期位置上的對 务在母-人檢査之後都會移動的話，就沒有特別的限制。 —i1ΐ上述實施例中，係設置x方向移動機構、γ方向移動 轉機構，以在第1平台12上決UCD模組的^ 之外Φ此，在檢査LCD模組時，除了上述攝影機構40的移動 置ΐί整更可利用上述第1平台12該側的移動機構，作進一步的位 再者，上述實施例，係將本發明用於]1(:1)模組的檢査，惟 ^檢査對象並無制關，亦可應職個影 的 各種電子零件（包含製成產品）。 ㈣置的 又，在本發明的裝置中，根據每次檢査所記憶的最佳焦點距 201000885 時Γ分析最佳焦點距離的變化以提取出其傾 向，並根據该傾向，導出預測最佳焦點距離， ==，糊繼雜、咖 以更尚的速度與精確度取得影像資料。 、、 取出用之裝置的檢査中，分析該檢査結果以提 :=:;!_不良傾向的資訊，回饋給製造生產線 佳焦點距離的累積資料的分析，提取‘例如「工= 過種檢査對象的不良傾向，並將根據該不 良悄⑽_給製造生產線該侧，以活用生產管理。 宜安裝振動感應器等構件，當在檢査中檢 ΐϋ便能夠立即判斷是否受到外部振動的影響。 於何i項目、由ri資料便能夠進行檢測的項目，無論是關 特別限制。、，^多句使用本發明，檢査項目的種類，並無 【圖式簡單說明】 圖1係本發明的一個實施例的外觀立體圖。 =2 \a)、（b)係上述實施例的動作説明圖。 圖3係上述實施例的動作説明圖。 =係用於上述，例之LCD模組的説明圖。 圖5平台上所進行之檢_兑明圖， '、义貫施例在第2平台上所進杆之於杏沾％日目国 =6係LCD模組產生細等情況的説 、"。 :”著严5⑷…物i面圖 圖9 (Λ 3 f上述實施例之校正系統的説明圖。 放大影像#增_如他繼麟使用之 在第1平台上進行檢査時的運轉模式圖。 圖^ (小〇〇係上述實施例在第2平台進行檢査所使用之 19 201000885 放大影像的説明圖。 圖12係LCD模組安裝部位的説明圖。 圖13上述安裝部位之檢査方法的説明圖。 【主要元件符號說明】 1玻璃基板 2電極焊墊 3驅動用晶片 4電極 5凸塊 6異向性導電膜 7導電粒子 8壓痕 10電子零件檢査裝置 11搬運輸送帶 12平台 13平台 16移載機構 17移載機構 18移載機構 20螢幕晝面 21本體部 30 LCD 31源極晶片 32閘極晶片 33控制基板 34驅動電路基板 40攝影機構 41對物透鏡 42微分干涉稜鏡 20 201000885 43附設同轴落射照明之鏡體 44微分干涉顯微鏡 45 CCD相機 46 X方向移動機構 47 Z方向調整機構 48a、48b引導區塊 49底板 50、 53 Y方向攝影機構 51、 52 X方向攝影機構 60凸塊 61導電粒子 63異物 64壓合部 65壓痕 66小框 D檢查點 G重心 N偏移 P、Q、R、S、T位置點 a!〜％ 、bi〜b5晶片 A—面線 X、Z軸 Αα最大變化量 21The mechanism 40, 5G~52 moves and continuously rotates the image data for each predetermined part to perform the inspection. Therefore, even if the LCD module is large, the overall space of the device can be simplified and used in combination with the manufacturing line of the LCD module. Will take up too much space. Further, in the above-described embodiment, the moving speeds of the photographing mechanism 40, /〇~52^2 "40, etc.", and the X-direction and the γ-direction can be checked according to the requirements of the apparatus, the inspection speed, the inspection accuracy, and the like. If it is set properly, it is usually set to 1 〇〇〇 < seconds or less, and there are also slaves who should wake up / second or less. This is more appropriate for the implementation of high-speed inspection. Further, as described above, even if the photographing mechanism 4 is moved or stopped at a high speed, 17 201000885 image data, in the above-described embodiment, the target lens 41 and the configuration restriction are stabilized on the lower end portion 47. l #彳 suppresses the movement of the fine g, there is no special structure, when the time is ^ 妙 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ At 30 〇 _ or less: Among them, the diameter of the cylinder should be about 5G ~ 3 () coffee is more appropriate. In the case of the ΐ2, ι, in order to improve the efficiency of the inspection, the first level, the second, and the second, are arranged side by side to perform two types of inspections at the same time. Single-one can also be used, and more than three can be used. Only ^"ί can also be checked. However, it is preferable to combine two platforms in consideration of the embodiment described in connection with the transporting belt 11 . Structure 40 (four) j ^ real Lai towel, set the secret along the x ke mine camera ;, 12, and combine the photographic mechanism 51, 52 moving in the X direction, the second platform 13 of the 5G, but the image of the camera There is no particular limitation, and if the relative position is relatively moved after the parent-person inspection, there is no particular restriction. - i1 ΐ In the above embodiment, the x-direction moving mechanism and the γ-direction moving and rotating mechanism are disposed to be outside the UCD module on the first platform 12, and when the LCD module is inspected, in addition to the above-described photographing mechanism 40 The moving mechanism can be further utilized by the moving mechanism on the side of the first platform 12, and the above embodiment is used for the inspection of the 1(:1) module. The object has no control, and can also apply for various electronic parts (including finished products). (4) Further, in the apparatus of the present invention, the change of the optimal focus distance is analyzed according to the optimal focal distance of 201000885 memorized each time to extract the tendency, and according to the tendency, the predicted optimal focus distance is derived. , ==, paste the same, coffee to obtain image data with more speed and accuracy. In the inspection of the device for taking out, analyze the result of the inspection to: =:;! _ information on the bad tendency, feedback to the analysis of the accumulated data of the good focus distance of the manufacturing line, and extract 'for example, 'work = over-examined object The bad tendency will be based on the bad (10) _ to the side of the manufacturing line to use production management. It is advisable to install components such as vibration sensors, and when checked during inspection, it can immediately determine whether it is affected by external vibration. The i item and the item that can be detected by the ri data are not limited. However, the present invention is used in a plurality of sentences, and the type of the item to be inspected is not described in the drawings. FIG. 1 is an embodiment of the present invention. Fig. 3 is an explanatory view of the operation of the above embodiment. Fig. 3 is an explanatory view of the operation of the above-described embodiment. Fig. 5 is an explanatory view of the above-described example of the LCD module. The inspections carried out on the platform _ the clear map, ', the example of the application of the second platform on the second platform, the apricot dip % Niu country = 6 series LCD module produced fine, etc.. "Strictly 5 (4)... i surface map Figure 9 (Λ 3 f is an explanatory diagram of the correction system of the above embodiment. The enlarged image #增_ is an operation mode diagram when the inspection is performed on the first platform by the use of the same. Figure 2 (The small embodiment is performed on the second platform in the above embodiment) Fig. 12 is an explanatory view of the mounting position of the LCD module. Fig. 12 is an explanatory view of the mounting portion of the LCD module. Fig. 13 is an explanatory diagram of the inspection method of the mounting portion. [Description of main components] 1 Glass substrate 2 electrode pad 3 Driving wafer 4 electrode 5 bump 6 anisotropic conductive film 7 conductive particle 8 indentation 10 electronic component inspection device 11 transport conveyor belt 12 platform 13 platform 16 transfer mechanism 17 transfer mechanism 18 transfer mechanism 20 screen surface 21 Main body portion 30 LCD 31 source wafer 32 gate wafer 33 control substrate 34 drive circuit substrate 40 photographing mechanism 41 differential lens interference with object lens 42 201000885 43 mirror body with coaxial epi-illumination 44 differential interference microscope 45 CCD camera 46 X-direction moving mechanism 47 Z-direction adjusting mechanism 48a, 48b guiding block 49 bottom plate 50, 53 Y-direction photographing mechanism 51, 52 X-direction photographing mechanism 60 bump 61 conductive particles 63 foreign matter 64 Engagement portion 65 of small indentations 66 housing the center of gravity G N D checkpoint offset P, Q, R, S, T the position of the point a! ~%, Bi~b5 A- wafer surface line X, Z-axis maximum amount of change Αα 21