CN104280398A - Electronic component automatic testing device - Google Patents
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- CN104280398A CN104280398A CN201310282351.1A CN201310282351A CN104280398A CN 104280398 A CN104280398 A CN 104280398A CN 201310282351 A CN201310282351 A CN 201310282351A CN 104280398 A CN104280398 A CN 104280398A
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Abstract
The embodiment of the invention provides an electronic component automatic testing method and device; the method is as follows: a to-be-tested electronic component is inserted onto a universal test socket array of an electronic switch tooling plate, precision position movement of an image acquisition module is driven by a mechanical arm movement platform, the image acquisition module is on the mechanical arm movement platform; when the image acquisition module reaches above a certain to-be-tested electronic component, a control circuit on the electronic switch tooling plate is started to work to control communication of the to-be-tested electronic component and the control circuit and an electrical performance measurement circuit on the electronic switch tooling plate by an electrical electronic switch matrix, and meanwhile the to-be-tested electronic component enters into the operation state; the image acquisition module photographs the to-be-tested electronic component in the position to acquire an appearance image of the to-be-tested electronic component and a light emitting image of a to-be-tested light emitting device, the acquired images are analyzed and processed by an image processing module in a main control module, a defect product is recognized; electrical performance of the to-be-tested electronic component in the position can be performed by the electrical performance measurement circuit, measured results are analyzed and processed by a measured result analysis module in the main control module, and the defect product is recognized.
Description
Technical field
The present invention relates to industrial automation, particularly relate to the automatic test of electronic devices and components, industrial robot, image set, electronic surveying.
Background technology
In field of electronic components manufacturing, need the production test components and parts manufactured being carried out to mass, the electric property, functional parameter, outward appearance etc. of test components and parts, for the electronic devices and components of luminescence display, except test aforementioned functional energy, also need to test the optical property parameter of light-emitting display device.
Under current technical situation, front end operation in electronic devices and components manufacture process, as the welding etc. of fixing, the wafer of wafer, all come by automatic machinery, and the detection operation of electronic devices and components, automaticity is lower, especially for the electronic devices and components of certain fields or the electronic devices and components of non-standard encapsulation.
The main cause that the electronic devices and components of non-standard encapsulation are difficult to realize automatic test is, profile and the pin size of these electronic devices and components are irregular, between different types of device, bin differences is large, and automatic machinery needs first to refine the feature of measurand and learn, could realize the test action of standardization and repeatability, but the uncertainty of measurand feature makes the difficulty of refinement and study greatly increase.
Manual testing's method is mostly adopted to the electronic devices and components of non-standard encapsulation, namely carry out craft by tester to components and parts to test one by one, the process of test is loaded into successively in test jack by each components and parts, electric performance test parameter is read in conjunction with instrument and meter, and the optical property parameter of the outward appearance of device and light-emitting display device, artificial judgment is carried out with eyes, to distinguish defective device by tester.Rely on test event that is artificial and naked-eye observation, there is the inconsistency of subjectivity and test result, meanwhile, these test events are very high to the skill set requirements of tester, and tester needs could be on duty through longer study and training.
This method of testing testing efficiency is low, the poor accuracy of test, and the manpower expended is large, high to the skill set requirements of personnel, and test duration long fatigue damage and the reduction test mass easily causing tester.
Summary of the invention
For solving the problem large for dependency degree artificial in the test of electronic devices and components especially non-standard packaging electronic parts, testing efficiency is low, test accuracy rate is low.Embodiments provide the automatic test approach of a kind of automatic testing equipment of electronic devices and components, a kind of electronic devices and components.
Embodiments provide a kind of automatic testing equipment of electronic devices and components, comprising:
Manipulator motion platform, manipulator motion platform is also referred to as industrial robot, one of them embodiment is the Cartesian robot being made up of a two-dimensions or three dimensionality two or three line straightening machine mechanical arm, can realize high-precision position and move in covered two dimension or three dimensions.The slide block of manipulator motion platform loads onto topworks, and topworks just can move in the region that manipulator motion platform covers, and in the present embodiment, the topworks be arranged on the slide block of manipulator motion platform is image collection module;
Image collection module, image collection module comprises industrial camera, light source, miniature hair-dryer, the below that industrial camera is installed on the top of light source, miniature hair-dryer is arranged on light source, industrial camera, light source, miniature hair-dryer reach all can cover measured device surface; When image collection module moves to above tested components and parts by manipulator motion platform, light source is responsible for illuminating tested components and parts, industrial camera is responsible for taking tested components and parts, the dust blowing away tested component surface is responsible for by miniature hair-dryer, the image processing module that the image that image collection module obtains is supplied in main control module carries out analyzing and processing, thus realizes the test to tested components and parts outward appearance and optical property;
Electronics switches working plate, electronics switches working plate and automatic testing equipment of electronic component agent structure can quick separating or joint, its function is that the components and parts disposable loading to be measured of some switches after on working plate to electronics, electronics is switched working plate to combine with the agent structure of automatic testing equipment of electronic component, electronics switches working plate and switches carried measured device pin, manipulator motion platform drives image collection module to move at diverse location simultaneously, under collaborative control, realize automatic test electronics being switched to diverse location components and parts to be measured on working plate, after being loaded in that all device under tests on working plate are tested and completing, working plate is separated with the agent structure of automatic testing equipment of electronic component, i.e. the components and parts to be measured of replaceable next batch, electronics switches working plate and comprises universal test receptacle array, electronics switching matrix, electrical property metering circuit, control circuit, working plate communication interface,
Main control module, described main control module comprises Host Process Module, image processing module, manipulator motion platform control module, measurement result analysis module, Master Communications interface; Main control module switches working plate by cable with manipulator motion platform, image collection module, electronics and is connected, and main control module realizes to the control of said modules and to obtained image and institute's collecting test data analysis process.
The embodiment of the present invention additionally provides a kind of automatic test approach of electronic devices and components, comprising:
Be inserted into by electronic devices and components to be measured in universal test receptacle array on electronics switching working plate, manipulator motion platform drives the image collection module on it to move in the region that manipulator motion platform can reach; When image collection module arrives above some components and parts to be tested, electronics switches the control circuit startup work on working plate, control electronics switching matrix and the universal test socket at this device under test place and described electronics are switched control circuit on working plate and electrical property metering circuit is communicated with, control measured device enters running status simultaneously; The device under test of image collection module to described position is taken pictures, and the image obtained carries out analyzing and processing by the image processing module in main control module; Electrical property metering circuit carries out electric performance test to the device under test of described position, and test result carries out analyzing and processing by the measurement result analysis module in main control module.
When the test jack at device under test place is positioned at below image collection module, light illuminating measured device surface in image collection module, the photo of the industrial camera shooting device surface in image collection module, the image the obtained image processing module delivered in described main control module carries out the analyzing and processing of outward appearance and surface imperfection.
For the electronic devices and components of luminescence display class, when the universal test socket at device under test place is communicated to the control circuit on described active working plate by electronics switching matrix, the described electronics control circuit switched on working plate produces pumping signal simultaneously and lights tested light-emitting display device, photo after industrial camera shooting device luminescence in described image collection module, the image the obtained image processing module be sent in described main control module carries out the analyzing and processing of optical property.
The photo of the measured device captured by image collection module is after image processing module is analyzed, if the result instruction existing defects analyzed, miniature hair-dryer then in image collection module is activated operation, brush the surface of device, re-start after blowing and take pictures and analyzing and processing, the defect as same position still exists, be then judged to be device defects, defect as same position disappears, be then judged to be the measurements interference that dust appended by device surface causes.
After the test completing a device, image collection module moves on to above next measured device by master control module controls manipulator motion platform, and electronics switches working plate and carries out corresponding switching simultaneously, and repeats the test process of previous device.The all devices switched on working plate when electronics all tested complete after, electronics is switched working plate and be separated from the agent structure of automatic testing equipment, unloading electronics switches the device of survey on working plate, loads new device under test, can start the test of new a batch.
Accompanying drawing explanation
Fig. 1 automatic testing equipment of electronic component one-piece construction schematic diagram;
Fig. 2 manipulator motion platform schematic diagram;
Fig. 3 image collection module schematic diagram;
Fig. 4 electronics switches working plate entity structure schematic diagram;
Fig. 5 electronics switches working plate high-level schematic functional block diagram;
Fig. 6 main control module schematic diagram.
Embodiment
Below in conjunction with figure, the apparatus and method that the embodiment of the present invention provides are described in detail.
As shown in Figure 1, as seen from Figure 1, automatic testing equipment of electronic component is formed primarily of following youngster's part the System's composition of the embodiment of the present invention: manipulator motion platform 101, and image collection module 102, electronics switches working plate 103, main control module 104.
Manipulator motion platform 101, manipulator motion platform is also referred to as industrial robot, what Fig. 2 stated is one of them embodiment, it is the Cartesian robot being made up of a three dimensionality three line straightening machine mechanical arm, such industrial robot can realize high-precision position and move in covered three dimensions, generally, the precision of location can reach more than 0.02mm.The slide block of manipulator motion platform loads onto topworks, and topworks just can move in the region that manipulator motion platform covers, and in the present embodiment, the topworks be arranged on the slide block of manipulator motion platform is image collection module.
The detailed formation of manipulator motion platform as shown in Figure 2, is formed primarily of following and part: X-axis mechanical arm 201, Y-axis mechanical arm 202, Z axis mechanical arm 203, every bar mechanical arm all comprises a slide block 204, drive motor 205, and the crawler belt 206 of constraint cable running orbit.The effect of slide block 204 is, mechanical arm, under the effect of drive motor 205, promotes slide block and produces accurate displacement, thus it is mobile that the topworks be fixed on slide block is produced.In an embodiment of this programme, Y-axis mechanical arm is fixed on the slide block of X-axis mechanical arm, and Z axis mechanical arm is fixed on the slide block of Y-axis mechanical arm, and image collection module is fixed on the slide block of Z axis mechanical arm.In another embodiment of this programme, do not need the movement of Z-direction, then Y-axis mechanical arm is fixed on the slide block of X-axis mechanical arm, and image collection module is fixed on the slide block of Y-axis mechanical arm, and three-dimensional motion is reduced to two dimensional motion.
Except being undertaken except the manipulator motion platform of displacement by rectangular coordinate direction, a kind of motion platform that can realize three dimensions displacement is also had to be multi-joint mechanical arm, the feature of this mechanical arm is the rotation by multiple joint, drives the topworks on least significant end joint to move in three dimensions.With Cartesian robot arm motion platform unlike, multi-joint mechanical arm motion platform can realize the motion of arbitrary trajectory.
Image collection module 102, image collection module 102 is arranged on the slide block 204 of institute's manipulator motion platform, can be driven by manipulator motion platform, arrive the top will carrying out the device under test tested, under the control of main control module 104, complete the acquisition to tested components and parts image, the detailed formation of image collection module 102 as shown in Figure 3, comprise industrial camera 301, light source 302, miniature hair-dryer 303, industrial camera 301 is installed on the top of light source 302, miniature hair-dryer 303 is arranged on the below of light source 302, industrial camera 301, light source 302, miniature hair-dryer 303 reach all can cover measured device surface, when manipulator motion platform 101 drives image collection module 102 to arrive above tested components and parts, the light source 302 in image collection module 102 illuminates measured device surface, and the industrial camera 301 in image collection module takes the picture of device surface, for the electronic devices and components of luminescence display class, the light source 302 in image collection module 102 is closed, and industrial camera 301 takes the picture of device under test luminescence, miniature hair-dryer 303 in image collection module 102, when tested component surface has dust, can blow away the dust of component surface, have influence on to avoid the dust of component surface the quality of acquisition image.
Electronics switches working plate 103, and electronics switches the entity structure of working plate as shown in Figure 4, is made up of universal test socket 401, PCB 402, circuit 403, bearing structure 404, handle more than 405 part.The entity structure of universal test socket 401 is 406, it there is slot 407, slot 407 has certain width, therefore can the device of adaptive different pin trestle column, there is check lock lever 408 universal test socket 401 upper end, after device pin puts into slot, pressure check lock lever can compress device pin, ensures good contact.
The functional module that electronics switches working plate 103 is formed as shown in Figure 5, is made up of universal test receptacle array 501, electronics switching matrix 502, electrical property metering circuit 503, control circuit 504, working plate communication interface 505; Electronics is switched working plate 103 and the whole pin on any one the universal test socket in universal test receptacle array 501 can be connected with electrical property metering circuit 503 and control circuit 504 by the electronics switching matrix 502 on it.Control circuit 504 applies pumping signal to the measured device on the universal test socket be communicated with, the output signal of measured device is measured by electrical property metering circuit 503, according to the difference of device detection content, the electrical quantity of test can be current value, magnitude of voltage, resistance value, capacitance, inductance value, frequency values, performance number, in another embodiment, electrical property metering circuit 503 also can be replaced by the test instrumentation of commercialization.
Main control module 104, main control module 104 is control and the data processing centre (DPC) of automatic testing equipment of electronic component, the hardware carrier of main control module 104 is industrial computers, as shown in Figure 6, main control module 104 comprises Host Process Module 601, image processing module 602, manipulator motion platform control module 603, measurement result analysis module 604, Master Communications interface 605; Host Process Module 601 is control and the data processing core of whole automatic testing equipment of electronic component, is responsible for the Collaborative Control to image processing module 602, manipulator motion platform control module 603, measurement result analysis module 604; Manipulator motion platform control module 603 realizes control to manipulator motion platform 101 and driving, electronics is switched the component locations coordinate to be measured on working plate, convert the pulse drive signal that manipulator motion platform 101 can identify to, the image collection module 102 on driving machine mechanical arm motion platform 101 moves to the top of these tested components and parts.The image that image processing module 602 realizes image collection module 102 obtains is analyzed, and provides the analysis result of tested component surface defect and the optical property analysis result of tested light-emitting display device; All test gained information is carried out analysis contrast by test result analysis module 604, and provides defect statistics and analysis result.
The working plate communication interface 505 that Master Communications interface 605 and electronics switch on working plate 103 is connected, realize main control module 104 and electronics and switch data interaction between working plate 103, the order that control measured device carries out switching and measure is issued to electronics by this interface and switches working plate 103 by main control module 104, and electronics switches working plate 103 and command response and test result are uploaded to main control module 104 by this interface; The attached cable connection that is connected with between Master Communications interface 605 and working plate communication interface 505 is connected two kinds with separable cable, be fixedly connected with and namely with connector, Master Communications interface 605 be connected with working plate communication interface 505 with cable, can not be disconnected this in automatic testing equipment of electronic component use procedure to connect, simultaneously, cable link length is longer, to be easy to when not disconnecting mobile electron within the specific limits and to switch working plate 103; Separable cable connection refers to, switch working plate 103 to make electronics can be separated from the agent structure of electronic devices and components proving installation and combine flexibly and easily, separable joint unit is increased in the middle of stube cable between Master Communications interface 605 and working plate communication interface 505, according to the difference of this joint unit structure, separable cable connection is divided into again connector to connect, thimble-type connects, and photoelectric coupling connects three kinds of implementations; The advantage of connector connected mode realizes simply, but because being contact connection, it is more that electronics switching working plate 103 plugs number of times, the wearing and tearing of connector are larger, the mode that thimble-type connected mode adopts elastic probe and electric conductor to contact carrys out communication cable, because elastic probe has certain stroke, therefore electronics switching working plate 103 and the structural failure of automatic testing equipment of electronic component agent structure when engaging can be absorbed; Photoelectric coupling connected mode adopts photoelectric coupling to transmit the signal between Master Communications interface 605 and working plate communication interface 505 to pipe, thus can realize contactless connection, and its reliability does not switch by electronics the restriction that working plate 103 plugs number of times.
Method of testing based on as above device is as follows:
Be inserted into by electronic devices and components to be measured in universal test receptacle array 501 on electronics switching working plate 103, manipulator motion platform 101 drives the image collection module 102 on it to move in the region that manipulator motion platform 101 can reach; When above image collection module 102 arrives some components and parts to be tested, the control circuit 504 that electronics switches on working plate 103 starts work, control the electronics electronics switching matrix 502 switched on working plate 103 and this device under test place universal test socket and electronics are switched control circuit 504 on working plate 103 and electrical property metering circuit 503 is communicated with, control measured device enters running status simultaneously; Light source 302 in image collection module 102 illuminates measured device surface, industrial camera 301 in image collection module 102 takes the photo of device surface, and the image the obtained image processing module 602 delivered in main control module 104 carries out the analyzing and processing of outward appearance and surface imperfection; Electrical property metering circuit 503 carries out electric performance test to the device under test of described position, and test result carries out analyzing and processing by the measurement result analysis module 604 in main control module 104.
For the electronic devices and components of luminescence display class, when the test jack at device under test place is communicated to the control circuit 504 on described electronics switching working plate 103 by electronics switching matrix, control circuit 504 produces pumping signal simultaneously and lights tested light-emitting display device, industrial camera 301 in image collection module 102 takes the photo after device luminescence, and the image the obtained image processing module 602 be sent in main control module 104 carries out the analyzing and processing of optical property.
The photo of the measured device captured by image collection module 102 is after the image processing module 602 in main control module 104 is analyzed, if analysis result instruction existing defects, miniature hair-dryer 303 then in image collection module 102 is activated operation, brush the surface of device, re-start after blowing and take pictures and analyzing and processing, the defect as same position still exists, be then judged to be device defects, defect as same position disappears, be then judged to be the measurements interference that dust appended by device surface causes.
After the test completing a device, image collection module 102 moves on to above next measured device by main control module 104 controller mechanical arm motion platform 101, and repeats the test process of previous device.The all devices switched on working plate 103 when electronics all tested complete after, electronics is switched working plate 103 to be separated from the agent structure of automatic testing equipment of electronic component, the device of survey on unloading working plate, loads new device under test, can start the test of a new batch of devices.
The workflow of further elaboration the present embodiment:
The first step, measured device is loaded on the universal test socket on electronics switching working plate 103, put in the respective regions of automatic testing equipment of electronic component by the working plate loaded, the working plate communication interface 505 that electronics switches on working plate 103 is communicated with the Master Communications interface 605 on main control module 104;
Second step, after software interface completes the setting of corresponding test parameter to main control module 104, starts test;
3rd step, the position that each mechanical arm of manipulator motion platform 101 carries out working in coordination with is moved, and the image collection module 102 on driving mechanical arm slide block moves to the top of first components and parts to be measured;
4th step, control circuit 504 pairs of electronics switching matrix 502 that electronics switches on working plate 103 control, and make whole pins of in universal test receptacle array 501 first universal test socket be communicated to control circuit 505 and electrical property metering circuit 503;
5th step, start electric performance test, related excitation signal is applied on device under test by universal test socket by control circuit 504, the output signal of device under test is sent to electrical property metering circuit 503 by universal test socket and electronics switching matrix simultaneously, is completed the test of electrical property by electrical property metering circuit 503;
6th step, light source 302 in image collection module 102 is unlocked, taken pictures to components and parts to be measured by the industrial camera 301 in image collection module 102, captured image is sent to the image processing module 602 in main control module 104, carries out the analysis of physical dimension and surface imperfection;
7th step, for the device of luminescence display, as light-emitting component or luminescence display module, image collection module 102 closes the light source 302 on it, apply pumping signal by control circuit 504 and light luminescent device to be measured, industrial camera 301 takes the picture of device luminescence, and the image the obtained image processing module 602 delivered in main control module 104 carries out the test analysis of optical property; The content of test to comprise in luminosity homogeneity, luminophor implicit impurity and the characteristic such as whether reliably to be lighted;
8th step, is presented at the test result of this device in computer interface, and is stored in the database of computing machine simultaneously, for observation and the statistical study of test result;
9th step, after individual devices has been tested, image collection module 102 moves to above the position at next measured device place by manipulator motion platform 101, and repeats the step of the 4th step to the 8th step;
Tenth step, after the electronics device under test switched on working plate 103 has all been tested, initial position got back to by manipulator motion platform 101, now electronics can be switched working plate 103 to shift out from the agent structure of automatic testing equipment of electronic component, the device that unloading and classification have been tested, electronics switching working plate 103 loads the device under test of new a batch, the test of a new batch of devices can be carried out.
Claims (9)
1. an automatic testing equipment for electronic devices and components, is characterized in that, comprising:
Manipulator motion platform, image collection module, electronics switch working plate, main control module, and wherein said image collection module is arranged on described manipulator motion platform; Described manipulator motion platform is connected with described main control module; Described electronics switches working plate and is connected with described main control module; Described image collection module is connected with described main control module.
2. the automatic testing equipment of a kind of electronic devices and components according to claim 1, is characterized in that, described electronics switches working plate and comprises universal test receptacle array, electronics switching matrix, electrical property metering circuit, control circuit, working plate communication interface.
3. the automatic testing equipment of a kind of electronic devices and components according to claim 1, it is characterized in that, described main control module comprises Host Process Module, image processing module, manipulator motion platform control module, measurement result analysis module, Master Communications interface.
4. a kind of automatic testing equipment of electronic devices and components according to claims 1 to 3, it is characterized in that, described working plate communication interface is connected with described Master Communications interface, and concrete connected mode can be divided into the mode of being fixedly connected with and separable connected mode two kinds; Separable connected mode can be divided into connector connected mode, probe connected mode, photoelectric coupling connected mode.
5. the automatic testing equipment of a kind of electronic devices and components according to claim 1, it is characterized in that, described image collection module comprises industrial camera, light source, miniature hair-dryer, the below that industrial camera is installed on the top of light source, miniature hair-dryer is arranged on light source, industrial camera, light source, miniature hair-dryer reach all can cover measured device surface.
6. an automatic test approach for electronic devices and components, is characterized in that, comprising:
Be inserted into by electronic devices and components to be measured in universal test receptacle array on electronics switching working plate, manipulator motion platform drives the image collection module on it to move in the region that manipulator motion platform can reach; When image collection module arrives above some components and parts to be tested, electronics switches the control circuit startup work on working plate, control electronics switching matrix and the universal test socket at this device under test place and described electronics are switched control circuit on working plate and electrical property metering circuit is communicated with, control measured device enters running status simultaneously; The device under test of image collection module to described position is taken pictures, and the image obtained carries out analyzing and processing by the image processing module in main control module; Electrical property metering circuit carries out electric performance test to the device under test of described position, and test result carries out analyzing and processing by the measurement result analysis module in main control module.
7. method as claimed in claim 6, it is characterized in that, when the test jack at device under test place is positioned at below image collection module, light illuminating measured device surface in image collection module, the photo of the industrial camera shooting device surface in image collection module, the image the obtained image processing module delivered in described main control module carries out the analyzing and processing of outward appearance and surface imperfection.
8. method as claimed in claim 6, it is characterized in that, for the electronic devices and components of luminescence display class, when the test jack at device under test place is communicated to the control circuit on described active working plate by electronics switching matrix, the described electronics control circuit switched on working plate produces pumping signal simultaneously and lights tested light-emitting display device, photo after industrial camera shooting device luminescence in described image collection module, the image the obtained image processing module be sent in described main control module carries out the analyzing and processing of optical property.
9. the method as described in claim 6 to 8, it is characterized in that, the photo of the measured device captured by image collection module is after image processing module is analyzed, if the result instruction existing defects analyzed, miniature hair-dryer then in image collection module is activated operation, brush the surface of device, re-start after blowing and take pictures and analyzing and processing, defect as same position still exists, then be judged to be device defects, defect as same position disappears, be then judged to be the measurements interference that dust appended by device surface causes.
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