WO2020133228A1 - 可拉伸基材及其制造方法 - Google Patents
可拉伸基材及其制造方法 Download PDFInfo
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- WO2020133228A1 WO2020133228A1 PCT/CN2018/124922 CN2018124922W WO2020133228A1 WO 2020133228 A1 WO2020133228 A1 WO 2020133228A1 CN 2018124922 W CN2018124922 W CN 2018124922W WO 2020133228 A1 WO2020133228 A1 WO 2020133228A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0046—Elastic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/695—Organic materials
Definitions
- the present application relates to the field of stretchable substrates, and in particular, to a stretchable substrate and a method of manufacturing the same.
- the stretchable sensor device is gradually gaining attention, however, the existing stretchable sensor device substrates have corresponding defects. For example, for a full-surface stretchable substrate, during the stretching process, tensile deformation will occur in the entire surface area, and the stretchability of the lines in the area is high, and it is not conducive to the placement of external hard components.
- This application proposes a new stretchable substrate and a method of manufacturing the same.
- the same material is continuously distributed in regions with different stretch rates.
- the same material is continuously distributed at the boundary between adjacent regions of different stretch ratios.
- the tensile strengths of the regions with different stretch ratios are the same.
- the weight ratio of the same material is different in the two adjacent regions with different stretch ratios.
- the stretchable substrate includes a first material and a second material, and the first material and the second material are mixed in different stretch ratio regions.
- the first material is a stretchable material
- the second material is a non-stretchable material
- the first material is a first stretchable material
- the second material is a second stretchable material
- the first stretchable material and the second stretchable material The stretch rate is different.
- the first stretchable material is at least one selected from the group consisting of vinyl polysiloxane and polydimethylsiloxane.
- the vinyl polysiloxane is based on a silicone chain.
- the main chain and side chains have vinyl groups and/or vinyl group-terminated polymers.
- the second stretchable material is selected from polyurethane, styrene-butadiene-styrene block copolymer, styrene-ethylene-butene-styrene block copolymer, adipic acid At least one of a copolymer of butanediol and butylene terephthalate, and nanoparticle-doped vinyl polysiloxane, the vinyl polysiloxane is mainly based on a silicone chain Chains, side chains have vinyl groups and/or vinyl group-terminated polymers.
- the first stretchable material is polydimethylsiloxane
- the second stretchable material is nanoparticle-doped vinyl polysiloxane
- the vinyl polysilicon The oxane is a polymer whose main chain is a siloxane chain, and whose side chains have vinyl groups and/or vinyl groups.
- the mass ratio between the raw material of the polydimethylsiloxane and the raw material of the nanoparticle-doped vinyl polysiloxane is 1: (0.05-2).
- the stretchable substrate is a one-dimensional stepped stretchable material, and regions with different stretch rates are symmetrically distributed on both sides of the region with the highest or lowest stretch rate.
- the stretch rate of other regions gradually decreases from the region with the highest stretch rate to both sides, or the stretch rate of other regions gradually increases from the region with the lowest stretch rate to both sides.
- the stretchable substrate is a two-dimensional stepped stretchable material, and a region with a relatively low stretch rate is surrounded by a region with a relatively high stretch rate.
- At least one of the regions includes a non-stretchable material.
- the non-stretchable material is selected from inorganic oxide particles.
- the inorganic oxide is selected from at least one of silica, alumina, hafnium dioxide, zirconium dioxide, titanium dioxide, and calcium oxide.
- the non-stretchable material is a sheet material, and the sheet material is wrapped in the stretchable material.
- the raw materials in each of the regions are cured and shaped.
- the raw materials for each of the regions are blended in advance, and then the raw materials for the regions with different stretch ratios are injected into the corresponding regions in the mold, respectively.
- different raw materials conveyed through different conveying paths are injected into the corresponding area after the injection head is mixed.
- a partition is provided between each of the regions, and the partition is evacuated after the raw materials are completely injected and before the solidification and molding board.
- any two adjacent regions include at least the same material, the difference in mechanical properties between the regions is reduced, and it is not easy to appear at the junction of the adjacent regions Problems such as stretch notch and offset.
- FIG. 1 shows a schematic diagram of an example of a stretchable substrate of the present application.
- FIG. 2 shows a schematic diagram of another example of a stretchable substrate of the present application.
- FIG. 3 shows a schematic diagram of another example of a stretchable substrate of the present application.
- FIG. 4 shows a test schematic diagram of the tensile fracture performance of the three-region material of an example of a stretchable material of the present application.
- FIG. 6 shows a schematic diagram of another method of preparing a stretchable substrate of the present application.
- FIG. 7 shows a schematic diagram of another method of preparing a stretchable substrate of the present application.
- An embodiment of the present application provides a stretchable substrate, the stretchable substrate including at least two regions having different stretch ratios, and at least including in any two adjacent regions of different stretch ratios The same material.
- the stretchable substrate includes first, second, and third regions, both the first and second regions may include at least material A, and the second and third regions may include at least material B.
- Material A and material B may be the same material or different materials.
- the stretchable substrate includes four or more regions, the same material contained in two different adjacent regions may be the same or different.
- the weight ratio of the same material in the two adjacent regions may be the same or different.
- the weight ratio of the materials A and B in the two regions may be different to obtain different stretch ratios.
- the first region in the two phase regions includes materials A, B, and C
- the second region includes materials A, D, and E
- the content of material A in the two regions may be the same, and material B may pass And C and materials D and E to adjust the stretch rate of the two regions.
- the same material is continuously distributed in regions with different stretch rates. For example, taking a stretchable substrate including the first to third regions described above as an example, material A is continuously distributed in the first region and the second region, and material B is continuously distributed in the second region and the third region. In some embodiments, the same material is continuously distributed at the boundary between adjacent regions of different stretch ratios. For example, material A is continuously distributed at the boundary between the first region and the second region, and material B is continuously distributed at the boundary between the second region and the third region.
- the tensile strengths of the regions with different stretch ratios are the same.
- materials A and B are included in the first area, the second area, and the third area, but the ratio of materials A and B is different in each area, which can result in different stretch rates and basically the same tensile strength.
- the first material is a stretchable material
- the second material is a non-stretchable material.
- the first material is a first stretchable material
- the second material is a second stretchable material
- the first stretchable material and the second stretchable material The stretch rate is different.
- each zone contains at least the same stretchable material and the same stretchable material is continuously distributed in each zone.
- the stretchable substrate of the embodiment of the present application may be a sheet-like material, and is particularly suitable for use as a stretchable substrate of a stretchable form sensor.
- the above regions with different stretch ratios have different stretch ratios for each region. Therefore, when stretching is performed, different elastic deformations occur between the regions arranged in parallel.
- each area of contains at least the same stretchable material and the same stretchable material is continuously distributed in each area.
- the above-mentioned stretchable base material is particularly suitable for use as a stretchable substrate for arranging circuit components and circuits.
- a stretchable substrate for arranging circuit components and circuits.
- different stretch ratio regions can be obtained on the same stretch substrate;
- the tensile performance of the tensile device can be improved by optimizing the layout of the circuit; for example, placing dense lines or component areas in areas with low stretching rates can reduce the failure of dense line stretching, and reduce the difficulty of component fixing and selection (( At present, there are few stretchable resistors, capacitors, ICs and other components).
- the distribution manner of the regions with different stretch ratios in this application may be in various ways, for example, it may be a one-dimensional step distribution manner or a two-dimensional step distribution manner.
- the one-dimensional step distribution method is to set areas with different stretch ratios in a straight direction.
- the stretch ratio may gradually increase in one direction and then gradually decrease; or the stretch ratio may gradually decrease in one direction.
- the stretch ratio in the S1, S2, and S3 regions can be gradually reduced, or the stretch ratio in the S1, S2, and S3 regions can also be gradually increased.
- areas with different stretch ratios may be symmetrically distributed on both sides of the S1 area with the highest or lowest stretch ratio.
- the stretch rate of the S1, S2, and S3 regions in FIG. 1 decreases gradually
- the S1 region with the highest stretch rate is located in the middle
- the S2 region and the S2 region with gradually decreasing stretch rates are symmetrically distributed on both sides of the S1 region S3 area
- the S1 area has a high stretch rate and the largest stretch deformation
- the main stretch area the S3 area has a low stretch rate and the minimum stretch deformation is the main non-stretch area
- the two-dimensional stepped stretchable material forms a surrounding structure, that is, the area with a low stretch rate is surrounded by the area with a high stretch rate, and the stretch rate gradually increases from the inside to the outside.
- the stretching rate of each area from the inside to the outside gradually increases to become the preferred way of the two-dimensional stepped stretchable material.
- the stretch rate of the S2 region is the highest, and the stretch rate of the S1 and S3 regions is lower than that of the S2 region. You can also use the S1, S2, and S3 areas to gradually reduce the stretch rate as needed.
- each region preferably contains at least the same stretchable material and the same stretchable material is continuously distributed in each region.
- the strength required to stretch to break in each area is the same, the tensile deformation is different, that is, the elastic modulus is different.
- all regions include the same kind of elastic rubber, some regions include inorganic oxide particles as non-stretchable materials, and some regions do not contain inorganic oxide particles.
- the stretch rate is different between two different regions.
- the hardness of the area including the inorganic oxide particles increases.
- the inorganic oxide particles may be included in all regions, and the content, type, and/or particle size of the oxides included in different regions are different, and thus, the hardness and elongation between the different regions are also different.
- the non-stretchable material may also be a sheet material, and the sheet material is coated in the stretchable material. External rigid components can be provided in the corresponding areas of the sheet-shaped non-stretchable material. Since the non-stretchable sheet material is covered by the stretchable material, it is not prone to stretch notch or even breakage.
- the non-stretchable sheet material can be, for example, cloth, rigid plastic, or the like.
- the stretchable material may be, for example, polyurethane, styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butene-styrene block copolymer (SEBS), butanediol adipate Copolymer of ester and butylene terephthalate (PBAT), silicone rubber, etc.
- the silicone rubber can be, for example, vinyl polysiloxane, nanoparticle-doped vinyl polysiloxane, polydimethyl silicon Oxyalkyl, the vinyl polysiloxane is a polymer whose silicone chain is the main chain, and the side chain has vinyl groups and/or vinyl group termination.
- the non-stretchable material may be, for example, phenolic resin, polystyrene, polymethyl methacrylate, or the like.
- Each area may include two sets of stretchable materials, each set of stretchable materials may include multiple stretchable materials, and the stretch rate of one set of stretchable materials is lower than that of another set of stretchable materials .
- the stretchable material with a low stretch rate can be selected from at least one of vinyl polysiloxane and polydimethylsiloxane; the stretchable material with a high stretch rate can be selected from doped nanoparticles Vinyl polysiloxane, polyurethane, styrene-butadiene-styrene block copolymer, styrene-ethylene-butene-styrene block copolymer, butanediol adipate and terephthalic acid At least one of copolymers of butanediol formate.
- the hardness is about 30-60A Shore, and the elongation at break is about 100-200%.
- Doping nano-inorganic oxide particles in vinyl polysiloxane can improve the elongation at break. For example, adding 10-60 parts of nano silica to the above raw materials can increase the breaking elongation to 300-600%.
- the nano silica is preferably fumed silica, and the particle size may be 5-100 nm, preferably 10-50 nm.
- each region includes polydimethylsiloxane and nanoparticle-doped vinyl polysiloxane, the raw material of polydimethylsiloxane and nanoparticle-doped vinyl polysiloxane
- the mass ratio between the two raw materials of siloxane can be 1: (0.05-2), for example, 1:0.1, 1:0.5, 1:1, 1:1.2, 1:1.5, 1:1.8, preferably both
- a mold with a closed cavity may also be used, or instead of using only one set of input paths and injection heads, each area has its own independent material delivery path and injection head .
- a partition may be provided between each of the regions, and the partitions may be evacuated after the raw materials are completely injected and before curing and molding.
- each region includes two stretchable materials, one stretchable material is polydimethylsiloxane, and the other is nanoparticle-doped vinyl polysiloxane.
- the raw material of polydimethylsiloxane is, for example, Dow Corning 184; the raw material of nanoparticle-doped vinyl polysiloxane is: 90 parts of divinyl polydimethylsiloxane (vinyl mass fraction 0.2%), 15 parts vinyl silicone resin (vinyl mass fraction 5%), 3 parts crosslinking curing system methylhydrogen silicone resin (hydrogen mass fraction 2%), adding a trace of platinum catalyst and alkynyl alcohol inhibitor, 10 parts nano Silica.
- Example 2 The difference from Example 2 is that the raw materials of polydimethylsiloxane and nanoparticle-doped vinyl polysiloxane are respectively transported to the injection head through different raw material delivery paths, and then injected into the mold after the injection head is blended Cured in the cavity.
- the sample is smoother, the thickness is more uniform, and a larger injection pressure can be applied, and the production efficiency is improved by more than 40%.
- Example 1 The difference from Example 1 is that the raw materials of Dow Corning 184 and nanoparticle-doped vinyl polysiloxane were pre-mixed at a mass ratio of 1:0.2 and 1:1.2, respectively, to form the regions S1 and S3 in FIG. 1 raw material. That is, in this embodiment, the intermediate transition area S2 in FIG. 1 is omitted, and the areas S1 and S3 are directly connected.
- Example 1 The difference from Example 1 is that the raw materials of polydimethylsiloxane Dow Corning 184 and the raw materials of polyurethane are pre-mixed at a mass ratio of 1:0.2, 1:0.8, and 1:1.2, respectively, to form S1 in FIG. 1 Raw materials in S2 and S3 areas.
- the raw material of polyurethane uses polyether-MDI (4,4'-diphenylmethane diisocyanate) prepolymer and trimethylolpropane in tetrahydrofuran.
- Polyether-MDI is an isocyanate-terminated PU prepolymer prepared by the reaction of 4,4'-diphenylmethane diisocyanate and polybutylene glycol (molecular weight 2000).
- Example 1 The difference from Example 1 is that the raw materials of polydimethylsiloxane Dow Corning 184 and the raw materials of SEBS are pre-mixed at a mass ratio of 1:0.2, 1:0.8, and 1:1.2, respectively, to form S1 in FIG. 1.
- the raw material of SEBS is, for example, MP1580M of TPE branch of Teknorpex.
- Example 2 The difference from Example 1 is that the raw material of vinyl polysiloxane is ⁇ , ⁇ -hydroxy poly (dimethyl-methyl vinyl) siloxane (PDM-MVS), and it is not stretchable material benzene Ethylene and a small amount of benzoyl peroxide form a blend.
- the mass ratios of PDM-MVS (1.5% vinyl content) and styrene are 1:0.3, 1:0.1, 1:0.03, respectively, which are used for curing to form the S1, S2, and S3 regions in FIG. 1, respectively.
- each area includes SBS as a stretchable material and aluminum oxide as a non-stretchable material.
- SBS stretchable material
- aluminum oxide as a non-stretchable material.
- 60, 20 and 0 parts of three are added to 100 parts of SBS
- Aluminum oxide is used to form the regions S1, S2, and S3 in FIG. 1, respectively, and the average particle size of aluminum oxide is about 100 microns.
- Example 4 The difference from Example 4 is that the S1 region is formed using nanoparticle-doped vinyl polysiloxane as a stretchable material and sheet polystyrene as a non-stretchable material.
- the raw material of Dow Corning 184 and nanoparticle-doped vinyl polysiloxane was injected into the S3 area of the mold cavity, and the raw material of vinyl polysiloxane doped with nanoparticles was injected into the S1 area. ; Then add the polystyrene sheet in the S1 area, and finally inject the corresponding raw materials in the S3 and S1 areas again, so that the polystyrene sheet is covered by the stretchable material.
- Example 1 The difference from Example 1 is that the raw materials of Dow Corning 184 and the nanoparticle-doped vinyl polysiloxane were pre-mixed at a mass ratio of 1:0.2, 1:0.8, and 1:1.2, respectively, to form S1 in FIG. 3 , S2 and S3 area raw materials.
- test sample
- 100 samples (length, width, and thickness are 100 mm, 20 mm, and 1 mm, respectively) were prepared using the methods of the respective examples, and they were stretched to the maximum deformation with 90 kPa, held for 5 seconds, the stretch was released, and then the above stretching, Release the action 1000 times, observe whether there are defects such as gaps, offsets or breaks between the various areas of the sample, and count the sample integrity rate.
- Example 1 99%
- Example 2 100%
- Example 3 100%
- Example 4 85%
- Example 5 92%
- Example 6 96%
- Example 7 89%
- Example 8 95%
- Example 9 80%
- Example 10 100% Comparative Example 1 70% Comparative Example 2 48%
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Abstract
一种可拉伸基材,包括至少两个具有不同拉伸率的区域(S1,S2,S3),在任意两个相邻的不同拉伸率的区域(S1,S2,S3)中至少包括同一种材料。该可拉伸基材的制造方法,包括:将用于具有不同拉伸率的区域(S1,S2,S3)的原料分别注入模具中的对应区域,各个不同拉伸率区域(S1,S2,S3)的原料包含的所述同一种材料的原料的质量比例不同;使各个所述区域的原料固化成型。
Description
本申请涉及可拉伸基底领域,具体而言,涉及一种可拉伸基材及其制造方法。
可拉伸形态的传感器件目前正逐渐获得人们的关注,然而,现有的可拉伸传感器件的基底都存在相应的缺陷。比如,对于整面式可拉伸基底,在拉伸过程中,整面区域都会出现拉伸形变,对于区域内线路的拉伸性较高,而且不利于外部硬质元器件的放置。
对于局部硬化的可拉伸基底,在拉伸过程中,在硬质区域和拉伸区域的交界位置,机械特性存在显著差异,容易出现拉伸缺口、偏移甚至断裂的情况。
发明内容
本申请提出了一种新的可拉伸基材及其制造方法。
本申请的一个实施方案提供一种可拉伸基材,所述可拉伸基材包括至少两个具有不同拉伸率的区域,在任意两个相邻的不同拉伸率的区域中至少包括同一种材料。
在部分实施例中,所述同一种材料在不同拉伸率区域中连续分布。
在部分实施例中,所述同一种材料在相邻的不同拉伸率区域的交界处 连续分布。
在部分实施例中,不同拉伸率区域的拉伸强度一致。
在部分实施例中,所述同一种材料为可拉伸材料。
在部分实施例中,在所述两个相邻的不同拉伸率的区域中所述同一种材料的重量比例不同。
在部分实施例中,所述可拉伸基材包括第一材料和第二材料,所述第一材料和所述第二材料混合于各不同拉伸率区域。
在部分实施例中,不同拉伸率区域中,所述第一材料的重量比例越高,所述第二材料的重量比例越低。
在部分实施例中,所述第一材料为可拉伸材料,所述第二材料为不可拉伸材料。
在部分实施例中,所述第一材料为第一可拉伸材料,所述第二材料为第二可拉伸材料,并且所述第一可拉伸材料和所述第二可拉伸材料的拉伸率不同。
在部分实施例中,所述第一可拉伸材料选自乙烯基聚硅氧烷和聚二甲基硅氧烷中的至少一种,所述乙烯基聚硅氧烷是以硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。
在部分实施例中,所述第二可拉伸材料选自聚氨酯、苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物、己二酸丁二醇酯和对苯二甲酸丁二醇酯的共聚物、以及掺杂纳米粒子的乙烯基聚硅氧烷中的至少一种,所述乙烯基聚硅氧烷是以硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。
在部分实施例中,所述第一可拉伸材料为聚二甲基硅氧烷,所述第二可拉伸材料为掺杂纳米粒子的乙烯基聚硅氧烷,所述乙烯基聚硅氧烷是以 硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。
在部分实施例中,所述聚二甲基硅氧烷的原料和所述掺杂纳米粒子的乙烯基聚硅氧烷的原料之间的质量比为1:(0.05~2)。
在部分实施例中,所述可拉伸基材为一维阶梯式可拉伸材料,不同拉伸率的区域在具有最高或最低拉伸率的区域两侧呈对称分布。
在部分实施例中,其他区域的拉伸率从最高拉伸率的区域向两侧逐渐降低,或者其他区域的拉伸率从最低拉伸率的区域向两侧逐渐增大。
在部分实施例中,所述可拉伸基材为二维阶梯式可拉伸材料,拉伸率相对低的区域被拉伸率相对高的区域包围。
在部分实施例中,至少一个所述区域中包括不可拉伸材料。
在部分实施例中,所述不可拉伸材料选自无机氧化物颗粒。
在部分实施例中,所述无机氧化物选自二氧化硅、三氧化二铝、二氧化铪、二氧化锆、二氧化钛和氧化钙中的至少一种。
在部分实施例中,所述不可拉伸材料为片状材料,所述片状材料被包覆于所述可拉伸材料中。
本申请的另一个实施方案提供一种制造可拉伸基材的方法,所述可拉伸基材为上述的可拉伸基材,所述方法包括:
将用于具有不同拉伸率的区域的原料分别注入模具中的对应区域,各个不同拉伸率区域的原料包含的所述同一种材料的原料的质量比例不同;
使各个所述区域的原料固化成型。
在部分实施例中,预先将用于各个所述区域的原料共混,然后将用于具有不同拉伸率的区域的原料分别注入模具中的对应区域。
在部分实施例中,将通过不同的输送路径输送的不同原料在注入头混合后注入相应的区域。
在部分实施例中,对不同的输送路径施加不同的压力。
在部分实施例中,不同的输送路径的内径不同。
在部分实施例中,在将用于不同所述区域的原料分别注入模具中的对应区域之前,各个所述区域之间设置有隔板,并且在完全注入原料后、固化成型前撤离所述隔板。
在本申请实施例的可拉伸基材中,由于任意两个相邻的区域中至少包括同一种材料,减少了各个区域之间的机械特性差异,不容易在各个相邻区域的交界处出现拉伸缺口、偏移等问题。
为了更清楚地说明本申请的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本申请的某些实施例,因此不应被看作是对本申请保护范围的限定。
图1示出了本申请的一种可拉伸基材示例的示意图。
图2示出了本申请的另一可拉伸基材示例的示意图。
图3示出了本申请的又一可拉伸基材示例的示意图。
图4中示出了本申请的一种可拉伸材料示例的三个区域材料的拉伸断裂性能的测试示意图。
图5示出了本申请的一种制备可拉伸基材的方法的示意图。
图6示出了本申请的另一制备可拉伸基材的方法的示意图。
图7示出了本申请的又一制备可拉伸基材的方法的示意图。
下面将结合本申请实施例中附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。
在下文中,可在本申请的各种实施例中使用的术语“包括”、“具有”及其同源词仅意在表示特定特征、数字、步骤、操作、元件、组件或前述项的组合,并且不应被理解为首先排除一个或更多个其它特征、数字、步骤、操作、元件、组件或前述项的组合的存在或增加一个或更多个特征、数字、步骤、操作、元件、组件或前述项的组合的可能性。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
除非另有限定,否则在这里使用的所有术语(包括技术术语和科学术语)具有与本申请的各种实施例所属领域普通技术人员通常理解的含义相同的含义。所述术语(诸如在一般使用的词典中限定的术语)将被解释为具有与在相关技术领域中的语境含义相同的含义并且将不被解释为具有理想化的含义或过于正式的含义,除非在本申请的各种实施例中被清楚地限定。
本申请的一个实施方案提供一种可拉伸基材,所述可拉伸基材包括至少两个具有不同拉伸率的区域,在任意两个相邻的不同拉伸率的区域中至少包括同一种材料。例如,若可拉伸基材包括第一、第二和第三区域,则第一和第二区域可以都至少包含材料A,第二和第三区域可以都至少包含 材料B。材料A和材料B可以是相同的材料或不同的材料。同样,在可拉伸基材包括四个或更多区域时,不同的两个相邻区域中所包含的同一种材料可以是相同或不同的。在所述两个相邻的区域中所述同一种材料的重量比例可以相同或不同。例如,在两个相邻区域中包括材料A和B,此时,材料A与材料B在这两个区域中的重量比例可以是不同的,以获得不同的拉伸率。此外,例如,在两个相区域中的第一区域包括材料A、B和C,第二区域包括材料A、D和E时,材料A在两个区域中的含量可以相同,可通过材料B和C以及材料D和E来调整两个区域的拉伸率。
在部分实施例中,所述同一种材料在不同拉伸率区域中连续分布。比如,以包括上述第一至第三区域的可拉伸基材为例,材料A在第一区域和第二区域中连续分布,材料B在第二区域和第三区域中连续分布。在部分实施例中,所述同一种材料在相邻的不同拉伸率区域的交界处连续分布。例如,材料A在第一区域和第二区域之间的交界处连续分布,材料B第二区域和第三区域的交界处连续分布。
在部分实施例中,不同拉伸率区域的拉伸强度一致。例如,在第一区域、第二区域和第三区域中均包含有材料A和B,但是材料A和B的比例在各个区域中不同,则可形成拉伸率不同,拉伸强度基本一致的三个区域。
所述同一种材料优选为可拉伸材料。在部分实施例中,所述可拉伸基材包括第一材料和第二材料,所述第一材料和所述第二材料混合于各不同拉伸率区域。在部分实施例中,不同拉伸率区域中,所述第一材料的重量比例越高,所述第二材料的重量比例越低。
在部分实施例中,所述第一材料为可拉伸材料,所述第二材料为不可拉伸材料。在部分实施例中,所述第一材料为第一可拉伸材料,所述第二材料为第二可拉伸材料,所述第一可拉伸材料和所述第二可拉伸材料的拉 伸率不同。
在部分实施例中,每个区域包含至少同一种可拉伸材料并且所述同一种可拉伸材料连续分布于每个区域。
本申请实施例的可拉伸基材可为片状材料,尤其适合用作可拉伸形态的传感器的可拉伸基底。上述具有不同拉伸率的区域,由于每个区域具有不同的拉伸率,因此,在进行拉伸时,并列排列的各区域之间产生不同的弹性变形。
通过不同的原料共混、固化后形成上述的具有不同拉伸率的区域,为了减少了各个区域之间的机械特性差异,以降低出现拉伸缺口、偏移等问题,本申请部分实施例中的每个区域包含至少同一种可拉伸材料并且所述同一种可拉伸材料连续分布于每个区域。
上述的可拉伸基材尤其适合用作布置电路元器件和线路的可拉伸基底,通过拉伸率阶梯式渐变分布的基底设计,在同一拉伸基底上,可获得不同拉伸率区域;由此可以通过优化线路布局,提升拉伸器件的拉伸性能;比如将密集线路或元件区放置在拉伸率低区域,减少密集线路拉伸失效情况,同时降低元件固定难度和选型难度(目前几乎没有可拉伸的电阻、电容、IC等元器件)。
本申请中具有不同拉伸率的区域的分布方式可以多种方式,例如,可以为一维阶梯分布方式,或者二维阶梯分布方式。
一维阶梯分布方式是在直线方向上设置具有不同拉伸率的区域,例如,可以是沿一个方向拉伸率逐渐变高,然后逐渐变低;也可以是沿一个方向拉伸率逐渐变低,然后逐渐变高;还可以是沿一个方向拉伸率逐渐增大或降低;也可以是拉伸率高的区域和拉伸率低的区域间隔交替设置。例如,在图1的一维阶梯式可拉伸材料中,S1、S2和S3区域的拉伸率可以逐步 降低,或者S1、S2和S3区域的拉伸率也可以逐步增高。在一维阶梯式可拉伸材料中,不同拉伸率的区域在具有最高或最低拉伸率的S1区域两侧可呈对称分布。
例如,在图1中的S1、S2和S3区域的拉伸率逐步降低时,拉伸率最高的S1区域位于中间,在S1区域的两侧分别对称分布有拉伸率逐渐降低的S2区域和S3区域,此时,S1区域拉伸率高,拉伸形变量最大,作为主要拉伸区域,S3区域拉伸率低,拉伸形变量最小,作为主要非拉伸区域;S2区域拉伸率居中,拉伸形变量介于S1区域和S3区域之间,作为过渡区域。
虽然,在图1中仅示出了具有三种拉伸率的区域,但也可以根据需要设置具有更多拉伸率的区域,比如可以设置具有四种、五种拉伸率的区域,设置的具有不同拉伸率的区域越多,区域之间的拉伸率差异越小,由此,各个区域之间的特性差异大大减小,进一步降低出现拉伸缺口、偏移等问题的可能性。当然,也可以仅设置具有两种不同拉伸率的区域。在图1的例子中,具有不同拉伸率的区域具有不同的面积,然而,也可以具有相同的面积,而且,即使是具有相同拉伸率的区域(比如两个S2区域或两个S3区域)也可以根据需要具有不同的面积,在其他示例中也同样如此。
二维阶梯方式排列可以是在横向方向和竖直方向上均设置具有不同拉伸率的区域。参见例如图2,S1、S2和S3区域的拉伸率逐步增高。当然,可以仅设置两种拉伸率区域或者多于三种的不同拉伸率区域。
图2中二维阶梯式可拉伸材料形成了包围式结构,即拉伸率低的区域被拉伸率高的区域包围,由内至外拉伸率逐步增高。由内至外各区域的拉伸率逐步增高为二维阶梯式可拉伸材料的优选方式。
当然,也可以根据特定需要使用其他结构,比如,S2区域的拉伸率最 高,S1和S3区域的拉伸率低于S2区域。也可以根据需要采用S1、S2和S3区域的拉伸率逐步降低。
此外,也可以根据需要,采用不同于图2中的一些其他结构,比如S2区域可以不是环形,而仅仅位于S1区域的两侧或一侧。此外,在S3区域内可布置有多个S1区域和S2区域,例如,如图3所示,S1区域和S2区域一起在S3区域内呈矩阵分布,由此,可以适用于更加复杂的电路布局。
本申请的部分实施例中,每个区域优选包含至少同一种可拉伸材料并且所述同一种可拉伸材料连续分布于每个区域。在各区域拉伸至断裂所需要的力度相同时,拉伸形变量不同,即弹性模量不同。例如,在所有区域中都包括同一种弹性橡胶,部分区域中包括作为不可拉伸材料的无机氧化物颗粒,而部分区域不包含无机氧化物颗粒,两种不同区域之间的拉伸率不同,而且包括无机氧化物颗粒的区域硬度增加。当然,也可以在所有区域中都包括无机氧化物颗粒,不同的区域包括的氧化物的含量、类型和/或粒径不同,由此,不同区域之间的硬度、拉伸率也不同。
无机氧化物颗粒可选自二氧化硅、三氧化二铝、二氧化铪、二氧化锆、二氧化钛和氧化钙中的至少一种。无机氧化物颗粒可增加区域的硬度,可以降低区域的拉伸率。无机氧化物也可以添加到每个区域中,通过改变添加类型、添加量、粒径等来改变拉伸率。无机氧化物颗粒可以为微米级,甚至是纳米级的粒子,纳米粒子经过适当改性后添加到可拉伸材料中能够提高材料的拉伸强度和拉伸率。
不可拉伸材料也可以是为片状材料,所述片状材料被包覆于所述可拉伸材料中。片状的不可拉伸材料的对应区域可以设置外部硬质元器件。由于不可拉伸的片状材料被可拉伸材料包覆,因此,也不容易出现拉伸缺口、甚至断裂的情况。不可拉伸的片状材料可以例如布料、硬质塑料等。
由于可拉伸材料连续分布,各个区域包含至少一种相同的材料,增强了不同区域之间的结合力,由此降低低拉伸率区域与高拉伸率区域之间的边界出现缺口的风险。在使用片状材料作为不可拉伸材料时,本申请中将断裂伸长率(根据国标GB/T 1040测试)小于5%的材料称为不可拉伸材料。相应地,大于等于5%的材料称为可拉伸材料。本申请的可拉伸基材中至少一个区域的拉伸率大于等于5%。
本申请的部分实施例中,每个区域包括至少两种主要材料,所述至少两种主要材料在各个区域中均连续分布,至少一种主要材料为可拉伸材料,另外一种或多种主要材料可为可拉伸材料或不可拉伸材料。这里的主要材料是指能够为基材提供可拉伸性和/或提高强度的材料,而不是辅助材料,例如增塑剂、偶联剂、引发剂等,换言之,可拉伸材料或不可拉伸材料不包括这些助剂。可拉伸材料可以为例如聚氨酯、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)、己二酸丁二醇酯和对苯二甲酸丁二醇酯的共聚物(PBAT)、硅橡胶等,硅橡胶可以是例如乙烯基聚硅氧烷、掺杂纳米粒子的乙烯基聚硅氧烷、聚二甲基硅氧烷,所述乙烯基聚硅氧烷是以硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。不可拉伸材料可以为例如酚醛树脂、聚苯乙烯、聚甲基丙烯酸甲酯等。
每个区域可包括两组可拉伸材料,每组可拉伸材料中可包括多个可拉伸材料,一组可拉伸材料的拉伸率低于另一组拉伸材料的拉伸率。拉伸率较低的可拉伸材料可选自乙烯基聚硅氧烷和聚二甲基硅氧烷中的至少一种;拉伸率较高的可拉伸材料可选自掺杂纳米粒子的乙烯基聚硅氧烷、聚氨酯、苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物、己二酸丁二醇酯和对苯二甲酸丁二醇酯的共聚物中的至少一种。
以质量份数计,形成乙烯基聚硅氧烷的原料可以是包括以下组分的原料:80-100份二乙烯基聚二甲基硅氧烷(乙烯基质量分数0.05-0.5%,例如0.1%、0.2%、0.3%、0.4%)、10-25份乙烯基硅树脂(乙烯基质量分数0.1-10%,例如0.5%、1.0%、2.0%、5.0%、7.0%、9.0%)、2-5份交联固化体系甲基氢硅树脂(氢的质量分数0.1-6%,例如0.5%、1.0%、2.0%、3.0%、4.0%、5.0%)。此外,可加入微量的铂类催化剂和炔醇类抑制剂。硫化后,硬度约为邵氏硬度30-60A,断裂拉伸率约为100-200%。在乙烯基聚硅氧烷中掺杂纳米无机氧化物粒子,可以提高断裂拉伸率。例如在上述原料中加入10-60份纳米二氧化硅,可将断裂拉伸率提高至300-600%。纳米二氧化硅优选为气相二氧化硅,粒径可为5-100nm,优选10-50nm。
本申请发明人发现,将单种或多种可拉伸材料A(A1、A2…)和单种或多种不可拉伸材料B(B1、B2…)(无机氧化物和片状材料除外)按不同比例共混,或者将两种或多种可拉伸材料A(A1、A2…)按不同比例共混时,至少两种主要材料在各个区域中连续分布,表现出以下的机械物理性能:拉伸强度基本一致,断裂拉伸率会有明显差别,也即是不同配比下,拉断所需的力是基本一致的,但是相同拉力下,形变量是不同的。在多种主要材料共混并且至少一种主要材料在各个区域中连续分布,另外的主要材料也均匀分布时,大大降低了出现拉伸缺口、偏移甚至断裂的情况。
本申请的部分实施例中,每个区域包括聚二甲基硅氧烷与掺杂纳米粒子的乙烯基聚硅氧烷,聚二甲基硅氧烷的原料与掺杂纳米粒子的乙烯基聚硅氧烷的原料两者之间的质量比可为1:(0.05~2),例如1:0.1、1:0.5、1:1、1:1.2、1:1.5、1:1.8,优选两者之间的质量比1:(0.1~1.5),例如1:0.2、1:0.5、1:0.8、1:1.0、1:1.2,聚二甲基硅氧烷含量越高,断裂伸长率越小,但是拉伸强度基本相同。
例如,将聚二甲基硅氧烷的原料与掺杂纳米粒子的乙烯基聚硅氧烷的原料分别以质量比1:0.2、1:0.8、1:1.2进行混合以用作图1中的S1、S2和S3区域。将这三种共混材料固化后进行拉伸断裂测试,图4中示出了这三种共混材料形成的可拉伸材料的拉伸断裂测试结果。拉伸强度均为约100kPa,而断裂伸长率则有明显差异,用于S1区域的可拉伸材料约为130%,用于S2区域的可拉伸材料约为170%,用于S3区域的可拉伸材料约为235%。
本申请的一个实施方式是制造上述可拉伸基材的方法,该方法包括:将用于具有不同拉伸率的区域的原料分别注入模具中的对应区域,各个不同拉伸率区域的原料包含的所述同一种材料的原料的质量比例不同;使各个所述区域的原料固化成型。
在本申请的部分实施例中,可以预先将用于各个所述区域的原料共混,然后将用于具有不同拉伸率的区域的原料分别注入模具中的对应区域。例如,可以将以预定配比混合的原料通过点胶方式、或者浇筑自流平方式依次注入模具中的对应区域,固化成型后获得可拉伸材料。如图5所示,混合后的原料通过点胶头200注入到模具100的模具腔110中,可以从模具腔的一侧向另一侧依次注入不同原料配比的原料以获得具有不同拉伸率的区域,在图5中,从左向右依次注入不同的混合原料,原料自动扩散,从而形成了S3、S2和S1区域。
为了更为精确地控制各个区域的大小和形状,在将用于不同所述区域的原料分别注入模具中的对应区域之前,可在各个区域之间设置隔板,并且在完全注入原料后、未固化成型之前撤离隔板。
图5中利用一个点胶头200进行原料的注入,也可以同时利用多个点胶头分别在不同的区域进行原料注入,从而提高生产效率。
此外,图5中利用了开放式的模具进行原料的注入,也可以向封闭的模具腔中注入混合原料。例如,可以相对设置上模和下模,从其中一个模具注入封闭模具腔中,优选每一个区域对应一个原料注入头,由此,可以一次性完成所有原料的注入。相对于开放式模具的生产方式,不仅可以大幅提高生产效率,而且可以使片状的可拉伸基材的厚度更厚,而且各个区域的厚度也更加均匀。
在本申请的部分实施例中,也可以不用预先对原料进行共混,而是在注入过程中进行共混,由此可以大大提高生产效率。例如,可以通过点胶或注塑方式向所述模具中注入原料,并且将通过不同的输送路径输送的不同原料在点胶头或注塑头混合后注入相应的区域。以双组份为例,如图6所示,可以将两种混合原料分别通过输送路径610和620输入至注入头630中,在注入头630中将两种原料混合后注入至相应的区域。图6中的输送路径610和620的容积大小相同,至注入头630的开口大小相同,从而可以控制调节输送路径610和620的输送压力来控制不同的原料比例。
当然,输送路径的容积大小也可以不同,如图7所示,输送路径710的容积小于输送路径720的容积,至注入头730的开口大小与容积大小成比例,从而,可以在对两个输送路径施加相同压力的情况下,将不同比例的原料输入至注入头730中。为了在注入头中使各种原料充分地混合,可以将注入头设置为一定的长度,并且在内部设置螺杆,通过螺杆的转动使原料充分混合。在三组分或更多组分时,各输送路径和注入头可以类似地设置。
此外,在如图6和7所示的示例中,也可以采用具有封闭腔的模具,也可以不用仅使用一组输入路径和注入头,而是各个区域有各自独立的原料输送路径和注入头。而且,在将用于不同区域的原料注入模具中的对应 区域之前,也可在各个所述区域之间设置有隔板,并且在完全注入原料后、固化成型前撤离隔板。
实施例1
在此实施例中,每个区域包括两种可拉伸材料,一种可拉伸材料是聚二甲基硅氧烷,另一种是掺杂纳米粒子的乙烯基聚硅氧烷。聚二甲基硅氧烷的原料采用例如道康宁184;掺杂纳米粒子的乙烯基聚硅氧烷的原料采用:90份二乙烯基聚二甲基硅氧烷(乙烯基质量分数0.2%)、15份乙烯基硅树脂(乙烯基质量分数5%)、3份交联固化体系甲基氢硅树脂(氢的质量分数2%),加入微量铂类催化剂和炔醇类抑制剂,10份纳米二氧化硅。掺杂纳米粒子的乙烯基聚硅氧烷的原料可以自制,也可以购买市售的原料。将道康宁184与掺杂纳米粒子的乙烯基聚硅氧烷的原料分别以质量比为1:0.2、1:0.8、1:1.2预先混合,作为形成图1中S1、S2和S3区域的原料。
将预混后的原料利用点胶方式注入开放式模具中,固化成型形成图1所示的可拉伸基材。
实施例2
与实施例1不同的是:利用上模和下模,将原料注入封闭的模具腔中形成图1所示的可拉伸基材。相比实施例1的样品更为平整,厚度更为均匀,而且可以施加更大的注入压力,生产效率提高20%以上。
实施例3
与实施例2不同的是:聚二甲基硅氧烷和掺杂纳米粒子的乙烯基聚硅氧烷的原料分别通过不同的原料输送路径输送至注入头后,在注入头共混 后注入模具腔中固化成型。相比实施例1的样品更为平整,厚度更为均匀,而且可以施加更大的注入压力,生产效率提高40%以上。
实施例4
与实施例1不同的是:将道康宁184与掺杂纳米粒子的乙烯基聚硅氧烷的原料分别以质量比为1:0.2、1:1.2预先混合,作为形成图1中S1和S3区域的原料。即,在本实施例中,省去了图1中的中间过渡区S2,S1和S3区域直接相连。
实施例5
与实施例1不同的是:将聚二甲基硅氧烷的原料道康宁184与聚氨酯的原料分别以质量比为1:0.2、1:0.8、1:1.2预先混合,作为形成图1中S1、S2和S3区域的原料。聚氨酯的原料采用聚醚-MDI(4,4’-二苯基甲烷二异氰酸酯)预聚体和三羟甲基丙烷的四氢呋喃溶液。聚醚-MDI是采用4,4’-二苯基甲烷二异氰酸酯和聚丁二醇(分子量2000)反应制得的以异氰酸酯封端的PU预聚体。
实施例6
与实施例1不同的是:将聚二甲基硅氧烷的原料道康宁184与SEBS的原料分别以质量比为1:0.2、1:0.8、1:1.2预先混合,作为形成图1中S1、S2和S3区域的原料。SEBS的原料采用例如Teknor pex公司TPE分公司的MP1580M。
实施例7
与实施例1不同的是:乙烯基聚硅氧烷的原料为α,ω-羟基聚(二甲基-甲基乙烯基)硅氧烷(PDM-MVS),将其与不可拉伸材料苯乙烯和少量过氧化苯甲酰形成共混物。PDM-MVS(乙烯基的含量1.5%)和苯乙烯质量比分别为1:0.3、1:0.1、1:0.03,分别用于固化形成图1中的S1、S2和S3区域。
实施例8
与实施例1不同的是:每个区域包括作为可拉伸材料的SBS和作为不可拉伸材料的三氧化二铝,以质量份数计,在100份SBS中添加60、20和0份三氧化二铝用于分别形成图1中S1、S2和S3区域,三氧化二铝的平均粒径为约100微米。
实施例9
与实施例4不同的是:S1区域使用作为可拉伸材料的掺杂纳米粒子的乙烯基聚硅氧烷和作为不可拉伸材料的片状聚苯乙烯形成。此外,在制作时,在模具腔的S3区域注入1:1.2的道康宁184与掺杂纳米粒子的乙烯基聚硅氧烷的原料,S1区域注入掺杂纳米粒子的乙烯基聚硅氧烷的原料;然后在S1区域中加入聚苯乙烯薄片,最后在S3和S1区域再次注入对应的原料,使得聚苯乙烯薄片被可拉伸材料包覆。
实施例10
与实施例1不同的是:将道康宁184与掺杂纳米粒子的乙烯基聚硅氧烷的原料分别以质量比为1:0.2、1:0.8、1:1.2预先混合,作为形成图3中S1、S2和S3区域的原料。
样品测试:
利用各个实施例的方法各制作100个样品(长、宽和厚度分别为100mm、20mm和1mm),将其用90kPa拉伸至最大变形,保持5秒,释放拉伸,然后重复上述拉伸、释放动作1000次,观测样品的各个区域之间是否存在缺口、偏移或断裂等缺陷,统计样品完整率。
此外,将现有的局部可拉伸基底和线路可拉伸基底分别作为对比例1和2进行了测试。
| 编号 | 样品完整率 |
| 实施例1 | 99% |
| 实施例2 | 100% |
| 实施例3 | 100% |
| 实施例4 | 85% |
| 实施例5 | 92% |
| 实施例6 | 96% |
| 实施例7 | 89% |
| 实施例8 | 95% |
| 实施例9 | 80% |
| 实施例10 | 100% |
| 对比例1 | 70% |
| 对比例2 | 48% |
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。
Claims (27)
- 一种可拉伸基材,其特征在于:所述可拉伸基材包括至少两个具有不同拉伸率的区域,在任意两个相邻的不同拉伸率的区域中至少包括同一种材料。
- 根据权利要求1所述的可拉伸基材,其特征在于:所述同一种材料在不同拉伸率区域中连续分布。
- 根据权利要求1所述的可拉伸基材,其特征在于:所述同一种材料在相邻的不同拉伸率区域的交界处连续分布。
- 根据权利要求1所述的可拉伸基材,其特征在于:不同拉伸率区域的拉伸强度一致。
- 根据权利要求1所述的可拉伸基材,其特征在于:所述同一种材料为可拉伸材料。
- 根据权利要求1所述的可拉伸基材,其特征在于:在所述两个相邻的不同拉伸率的区域中所述同一种材料的重量比例不同。
- 根据权利要求1所述的可拉伸基材,其特征在于:所述可拉伸基材包括第一材料和第二材料,所述第一材料和所述第二材料混合于各不同拉伸率区域。
- 根据权利要求7所述的可拉伸基材,其特征在于:不同拉伸率区域中,所述第一材料的重量比例越高,所述第二材料的重量比例越低。
- 根据权利要求7所述的可拉伸基材,其特征在于:所述第一材料为可拉伸材料,所述第二材料为不可拉伸材料。
- 根据权利要求7所述的可拉伸基材,其特征在于:所述第一材料为第一可拉伸材料,所述第二材料为第二可拉伸材料,所述第一可拉伸材料 和所述第二可拉伸材料的拉伸率不同。
- 根据权利要求10所述的可拉伸基材,其特征在于:所述第一可拉伸材料选自乙烯基聚硅氧烷和聚二甲基硅氧烷中的至少一种,所述乙烯基聚硅氧烷是以硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。
- 根据权利要求10所述的可拉伸基材,其特征在于:所述第二可拉伸材料选自聚氨酯、苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物、己二酸丁二醇酯和对苯二甲酸丁二醇酯的共聚物、以及掺杂纳米粒子的乙烯基聚硅氧烷中的至少一种,所述乙烯基聚硅氧烷是以硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。
- 根据权利要求10所述的可拉伸基材,其特征在于:所述第一可拉伸材料为聚二甲基硅氧烷,所述第二可拉伸材料为掺杂纳米粒子的乙烯基聚硅氧烷,所述乙烯基聚硅氧烷是以硅氧链为主链,侧链具有乙烯基基团和/或乙烯基基团封端的聚合物。
- 根据权利要求13所述的可拉伸基材,其特征在于:所述聚二甲基硅氧烷的原料和所述掺杂纳米粒子的乙烯基聚硅氧烷的原料之间的质量比为1:(0.05~2)。
- 根据权利要求1所述的可拉伸基材,其特征在于:所述可拉伸基材为一维阶梯式可拉伸材料,不同拉伸率的区域在具有最高或最低拉伸率的区域两侧呈对称分布。
- 根据权利要求15所述的可拉伸基材,其特征在于:其他区域的拉伸率从最高拉伸率的区域向两侧逐渐降低,或者其他区域的拉伸率从最低拉伸率的区域向两侧逐渐增大。
- 根据权利要求1所述的可拉伸基材,其特征在于:所述可拉伸基材 为二维阶梯式可拉伸材料,拉伸率相对低的区域被拉伸率相对高的区域包围。
- 根据权利要求1所述的可拉伸基材,其特征在于:至少一个所述区域中包括不可拉伸材料。
- 根据权利要求18所述的可拉伸基材,其特征在于:所述不可拉伸材料选自无机氧化物颗粒。
- 根据权利要求19所述的可拉伸基材,其特征在于:所述无机氧化物选自二氧化硅、三氧化二铝、二氧化铪、二氧化锆、二氧化钛和氧化钙中的至少一种。
- 根据权利要求18所述的可拉伸基材,其特征在于:所述不可拉伸材料为片状材料,所述片状材料被包覆于所述可拉伸材料中。
- 一种制造可拉伸基材的方法,其特征在于:所述可拉伸基材为权利要求1至21中任一项所述的可拉伸基材,所述方法包括:将用于具有不同拉伸率的区域的原料分别注入模具中的对应区域,各个不同拉伸率区域的原料包含的所述同一种材料的原料的质量比例不同;使各个所述区域的原料固化成型。
- 根据权利要求22所述的制造可拉伸基材的方法,其特征在于:预先将用于各个所述区域的原料共混,然后将用于具有不同拉伸率的区域的原料分别注入模具中的对应区域。
- 根据权利要求22所述的制造可拉伸基材的方法,其特征在于:将通过不同的输送路径输送的不同原料在注入头混合后注入相应的区域。
- 根据权利要求24所述的制造可拉伸基材的方法,其特征在于:对不同的输送路径施加不同的压力。
- 根据权利要求24所述的制造可拉伸基材的方法,其特征在于:不 同的输送路径的内径不同。
- 根据权利要求22所述的制造可拉伸基材的方法,其特征在于:在将用于不同所述区域的原料分别注入模具中的对应区域之前,各个所述区域之间设置有隔板,并且在完全注入原料后、固化成型前撤离所述隔板。
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| CN201880095904.3A CN112740400A (zh) | 2018-12-28 | 2018-12-28 | 可拉伸基材及其制造方法 |
| PCT/CN2018/124922 WO2020133228A1 (zh) | 2018-12-28 | 2018-12-28 | 可拉伸基材及其制造方法 |
| US17/358,359 US20210316529A1 (en) | 2018-12-28 | 2021-06-25 | Stretchable substrate and fabricating method therefor |
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| PCT/CN2018/124922 WO2020133228A1 (zh) | 2018-12-28 | 2018-12-28 | 可拉伸基材及其制造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103959396A (zh) * | 2012-11-21 | 2014-07-30 | 东海橡塑工业株式会社 | 柔性导电构件以及使用其的转换器 |
| CN104471131A (zh) * | 2012-06-22 | 2015-03-25 | 泰米凯尔有限公司 | 包含各种层和区域的可拉伸片材以及生产这种产品的方法 |
| CN106872083A (zh) * | 2017-03-07 | 2017-06-20 | 扬州大学 | 一种聚苯胺/弹性体拉伸型电容传感器的制备方法 |
| US20170245362A1 (en) * | 2016-02-22 | 2017-08-24 | Nippon Mektron, Ltd. | Stretchable circuit board and method for manufacturing the same |
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| CN104497229B (zh) * | 2014-12-10 | 2017-02-01 | 华东理工大学 | 一种可拉伸柔性超级电容器及其制备方法 |
| JP6823472B2 (ja) * | 2016-02-22 | 2021-02-03 | 日本メクトロン株式会社 | 伸縮性配線基板及びその製造方法 |
-
2018
- 2018-12-28 WO PCT/CN2018/124922 patent/WO2020133228A1/zh not_active Ceased
- 2018-12-28 CN CN201880095904.3A patent/CN112740400A/zh active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104471131A (zh) * | 2012-06-22 | 2015-03-25 | 泰米凯尔有限公司 | 包含各种层和区域的可拉伸片材以及生产这种产品的方法 |
| CN103959396A (zh) * | 2012-11-21 | 2014-07-30 | 东海橡塑工业株式会社 | 柔性导电构件以及使用其的转换器 |
| US20170245362A1 (en) * | 2016-02-22 | 2017-08-24 | Nippon Mektron, Ltd. | Stretchable circuit board and method for manufacturing the same |
| CN106872083A (zh) * | 2017-03-07 | 2017-06-20 | 扬州大学 | 一种聚苯胺/弹性体拉伸型电容传感器的制备方法 |
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