WO2020130008A1 - Matériau composite, son procédé de fabrication, préimprégné, panneau stratifié, carte de circuit imprimé et boîtier de semi-conducteur - Google Patents

Matériau composite, son procédé de fabrication, préimprégné, panneau stratifié, carte de circuit imprimé et boîtier de semi-conducteur Download PDF

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Publication number
WO2020130008A1
WO2020130008A1 PCT/JP2019/049510 JP2019049510W WO2020130008A1 WO 2020130008 A1 WO2020130008 A1 WO 2020130008A1 JP 2019049510 W JP2019049510 W JP 2019049510W WO 2020130008 A1 WO2020130008 A1 WO 2020130008A1
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Prior art keywords
composite material
group
warp
weft
glass cloth
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PCT/JP2019/049510
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English (en)
Japanese (ja)
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芳克 白男川
辰徳 金子
周治 合津
垣谷　稔
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日立化成株式会社
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Priority to JP2020561478A priority Critical patent/JPWO2020130008A1/ja
Publication of WO2020130008A1 publication Critical patent/WO2020130008A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D1/00—Woven fabrics designed to make specified articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Definitions

  • the present invention relates to a composite material and its manufacturing method, a prepreg, a laminated board, a printed wiring board, and a semiconductor package.
  • a multilayer printed wiring board it is important to have high electrical connection reliability between wiring patterns of multiple layers formed with a fine wiring pitch and excellent high-frequency characteristics, and high connection reliability with semiconductor chips. Sex is required.
  • a laser via used for the interlayer connection is required to have a small diameter.
  • dimensional stability of the substrate is one of important characteristics.
  • Patent Document 1 discloses a core made of a base material having a first surface and a second surface, which includes a thermosetting resin that is pre-cured for the purpose of improving the conformity between layers in a multilayer printed wiring board.
  • a prepreg characterized by comprising a first adhesive layer and a second adhesive layer formed on each of the first surface and the second surface of the core.
  • the prepreg of Patent Document 1 has a problem that it is inferior in wiring embedding property and the like because it contains a thermosetting resin that has been cured in advance as a core. Further, the prepreg of Patent Document 1 requires a plurality of layers having different degrees of curing, and thus requires a complicated production process, and a prepreg having a small variation in dimensional change obtained by a simpler method is desired. There is.
  • the present invention is used for a composite material having a small variation in dimensional change and a method for manufacturing the same, a laminated board and a method for manufacturing the same, a printed wiring board and a semiconductor package, and a method for manufacturing the composite material.
  • the purpose is to provide prepreg.
  • a method for producing a composite material which comprises a step of heating a prepreg containing a glass cloth and a thermosetting resin composition to 200° C. or higher,
  • the average filament diameter ratio (weft/warp) of the weft and warp constituting the glass cloth is more than 1.00, and the weave density ratio of warp and weft (warp/weft) is more than 1.00.
  • thermosetting resin composition is derived from (A) a maleimide compound having an N-substituted maleimide group, (B) an epoxy resin, and (C) a structural unit derived from an aromatic vinyl compound and maleic anhydride.
  • the method for producing a composite material according to the above [2], wherein the thermosetting resin composition further contains (D) silica treated with an aminosilane coupling agent.
  • [11] A printed wiring board obtained by using the laminated board as described in [10] above.
  • [12] A semiconductor package in which a semiconductor element is mounted on the printed wiring board according to [11].
  • thermosetting resin composition is derived from (A) a maleimide compound having an N-substituted maleimide group, (B) an epoxy resin having at least two epoxy groups in one molecule, and (C) an aromatic vinyl compound.
  • a composite material having a small variation in dimensional change and a method for manufacturing the same a laminated board using the composite material, a method for manufacturing the same, a printed wiring board and a semiconductor package, and a prepreg used for the method for manufacturing the composite material are provided.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples. Further, the lower limit value and the upper limit value of the numerical range are arbitrarily combined with the lower limit value and the upper limit value of the other numerical range, respectively. Further, each component and material exemplified in the present specification may be used alone or in combination of two or more unless otherwise specified. In the present specification, the content of each component in the composition is the total amount of the plurality of substances present in the composition, unless a plurality of substances corresponding to each component are present in the composition. Means The present invention also includes an embodiment in which the items described in the present specification are arbitrarily combined.
  • the method for producing a composite material of the present embodiment is a method for producing a composite material having a step of heating a prepreg containing a glass cloth and a thermosetting resin composition to 200° C. or higher, In the glass cloth, the average filament diameter ratio of the weft and the warp (weft/warp) is more than 1.00, and the weave density ratio of the warp and the weft (warp/weft) is more than 1.00.
  • a method for manufacturing a composite material is referred to as “glass cloth (g)”, and the prepreg will be referred to as “prepreg (p)” to distinguish them from other objects.
  • the glass cloth (g) used in the manufacturing method of the present embodiment has an average filament diameter ratio (weft/warp) of more than 1.00 and a weave density ratio of warp and weft (warp/weft) of 1. It has a characteristic of more than 00, which makes it possible to increase the strength in the weft direction while maintaining an appropriate thickness. It is presumed that this suppresses the generation of stress due to the tension applied in the warp direction during the production of the glass cloth, and makes the dimensional change in the composite material production process uniform.
  • the degree of uniformity of the amount of dimensional change tends to be significantly increased by combining the glass cloth (g) and the thermosetting resin composition and performing high temperature curing at 200° C. or higher.
  • the degree of uniforming of the dimensional change amount due to high temperature curing in the present embodiment is larger than that in the case of using a glass cloth other than the glass cloth (g).
  • the thermosetting resin tends to undergo uniform curing shrinkage when cured at high temperature and reduce dimensional variation, but the glass cloth containing the uneven stress is heated at high temperature. Then, the dimensions change nonuniformly in order to release the stress.
  • the prepreg (p) used in the manufacturing method of the present embodiment contains glass cloth (g) and a thermosetting resin composition.
  • the glass cloth (g) has an average filament diameter ratio (weft/warp) of the weft and the warp of more than 1.00 and a weaving density ratio of the warp and the weft (warp/weft) of more than 1.00. It is a thing.
  • the physical properties of the glass cloth such as the average filament diameter of the warp and the weft, the woven density, and the thickness of the glass cloth described later can be measured in accordance with JIS R3240.
  • the average filament diameter ratio (weft/warp) of the weft and the warp in the glass cloth (g) is more than 1.00 and preferably 1.02 to 1.30 from the viewpoint of reducing the variation in the dimensional change amount. , 1.05 to 1.20 are more preferable, and 1.10 to 1.15 are further preferable.
  • the average filament diameter of the warp in the glass cloth (g) is 2.0 to 2.0 in a state where the above average filament diameter ratio (weft/warp) is satisfied from the viewpoint of keeping the strength of the glass cloth good and reducing the thickness. 10 ⁇ m is preferable, 3.0 to 8.0 ⁇ m is more preferable, 3.5 to 6.0 ⁇ m is further preferable, and 4.0 to 5.0 ⁇ m is particularly preferable.
  • the average filament diameter of the weft in the glass cloth (g) is 2.0 to 2.0 in a state where the above average filament diameter ratio (weft/warp) is satisfied, from the viewpoint of thinning while maintaining the strength of the glass cloth good. 10 ⁇ m is preferable, 3.0 to 8.0 ⁇ m is more preferable, 4.0 to 6.0 ⁇ m is further preferable, and 4.5 to 5.5 ⁇ m is particularly preferable.
  • the number of filaments per warp and weft of the glass cloth (g) is preferably 40 to 400, more preferably 50 to 300, and more preferably 60 to 400 from the viewpoint of thinning while maintaining good strength of the glass cloth. 200 is more preferable, and 80 to 150 is particularly preferable.
  • the weaving density ratio of the warp to the weft (warp/weft) in the glass cloth (g) is more than 1.00, preferably 1.10 to 1.50, from the viewpoint of reducing variation in the dimensional change. 20 to 1.35 is more preferable, and 1.25 to 1.30 is further preferable.
  • the weaving density of the warp in the glass cloth (g) is 40 to 100 yarns/25 mm in a state where the above weaving density ratio (warp/weft) is satisfied from the viewpoint of keeping the strength of the glass cloth good and making it thin. Is preferable, 50 to 90 lines/25 mm is more preferable, 60 to 85 lines/25 mm is further preferable, and 70 to 80 lines/25 mm is particularly preferable.
  • the weaving density of the glass cloth (g) is 40 to 90 yarns/25 mm in a state where the above weaving density ratio (warp/weft) is satisfied from the viewpoint of keeping the strength of the glass cloth good and making it thin. Is preferable, 45 to 80 lines/25 mm is more preferable, 50 to 70 lines/25 mm is further preferable, and 55 to 65 lines/25 mm is particularly preferable.
  • the thickness of the glass cloth (g) is preferably 3 to 80 ⁇ m, more preferably 5 to 50 ⁇ m, further preferably 10 to 40 ⁇ m, and 15 to 30 ⁇ m from the viewpoint of making the glass cloth thinner while keeping the strength of the glass cloth good. Particularly preferred, 20 to 28 ⁇ m is most preferred.
  • the glass cloth that is surface-treated with a silane coupling agent or the like or is mechanically opened is suitable in terms of reduction of variation in dimensional change, heat resistance, moisture resistance, workability, and the like.
  • the type of filament (single fiber) forming the glass cloth is not particularly limited, and examples thereof include E glass, S glass, C glass, D glass, T glass, NE glass, A glass, H glass, and quartz glass.
  • thermosetting resin composition The thermosetting resin composition contained in the prepreg (p) used in the manufacturing method of the present embodiment is not particularly limited, and may be appropriately selected from conventionally known insulating resin materials according to desired characteristics.
  • the thermosetting resin composition is not particularly limited as long as it contains a thermosetting resin, and as the thermosetting resin, a maleimide compound, an epoxy resin, a phenol resin, a cyanate resin, an isocyanate resin, a benzoxazine resin, Examples thereof include oxetane resin, amino resin, unsaturated polyester resin, allyl resin, dicyclopentadiene resin, silicone resin, triazine resin and melamine resin. These may be used alone or in combination of two or more. Among these, maleimide compounds and epoxy resins are preferable from the viewpoints of heat resistance, moldability and electric insulation.
  • the thermosetting resin composition preferably contains (A) a maleimide compound having an N-substituted maleimide group, from the viewpoint of obtaining excellent copper foil adhesion, low thermal expansion, dielectric properties, and the like.
  • A a maleimide compound having an N-substituted maleimide group, from the viewpoint of obtaining excellent copper foil adhesion, low thermal expansion, dielectric properties, and the like.
  • the maleimide compound (A) is preferably a maleimide compound (a1) having at least two N-substituted maleimide groups (hereinafter, also referred to as “maleimide compound (a1)”).
  • maleimide compound (a1) a maleimide compound having an aliphatic hydrocarbon group (provided that an aromatic hydrocarbon group does not exist) between any two maleimide groups among a plurality of maleimide groups (hereinafter, referred to as " (Also referred to as "aliphatic hydrocarbon group-containing maleimide"), a maleimide compound containing an aromatic hydrocarbon group between any two maleimide groups of a plurality of maleimide groups (hereinafter referred to as "aromatic hydrocarbon group-containing maleimide”).
  • the aromatic hydrocarbon group-containing maleimide is preferable from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness, and the like.
  • the maleimide compound (a1) is preferably a maleimide compound having 2 to 5 N-substituted maleimide groups in one molecule, and a maleimide compound having 2 N-substituted maleimide groups in one molecule.
  • an aromatic hydrocarbon group-containing maleimide represented by any of the following general formulas (a1-1) to (a1-4) is more preferable, and an aromatic hydrocarbon represented by the following general formula (a1-2) Hydrocarbon group-containing maleimides are particularly preferred.
  • the maleimide compound (A) may be used alone or in combination of two or more.
  • R A1 to R A3 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms.
  • X A1 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, —O—, —C( ⁇ O)—, —S—, —SS— or a sulfonyl group.
  • p, q, and r are each independently an integer of 0 to 4.
  • s is an integer of 0 to 10.
  • Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R A1 to R A3 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n- Examples thereof include a pentyl group.
  • the aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably a methyl group, from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness, and the like. It is an ethyl group.
  • alkylene group having 1 to 5 carbon atoms represented by X A1 examples include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4-tetramethylene group, and 1,5-pentamethylene group.
  • the alkylene group is preferably an alkylene group having 1 to 3 carbon atoms, and more preferably a methylene group, from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness and the like.
  • Examples of the alkylidene group having 2 to 5 carbon atoms represented by X A1 include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group and an isopentylidene group.
  • an isopropylidene group is preferable from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness, and the like.
  • X A1 is preferably an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms. More preferable ones are as described above.
  • p, q, and r are each independently an integer of 0 to 4, and from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness, etc., each is preferably an integer of 0 to 2; It is preferably 0 or 1, and more preferably 0.
  • s is an integer of 0 to 10, and from the viewpoint of easy availability, it is preferably an integer of 0 to 5, and more preferably an integer of 0 to 3.
  • maleimide compound (a1) examples include N,N'-ethylene bismaleimide, N,N'-hexamethylene bismaleimide, bis(4-maleimidocyclohexyl)methane, and 1,4-bis(maleimidomethyl).
  • Maleimides containing aliphatic hydrocarbon groups such as cyclohexane; N,N'-(1,3-phenylene)bismaleimide, N,N'-[1,3-(2-methylphenylene)]bismaleimide, N,N' -[1,3-(4-Methylphenylene)]bismaleimide, N,N'-(1,4-phenylene)bismaleimide, bis(4-maleimidophenyl)methane, bis(3-methyl-4-maleimidophenyl) ) Methane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bis(4-maleimidophenyl) ether, bis(4-maleimidophenyl) sulfone, bis(4-maleimidophenyl) ) Sulfide, bis(4-maleimidophenyl)ketone, 1,4-bis(4-maleimid
  • bis(4-maleimidophenyl)methane, bis(4-maleimidophenyl)sulfone, bis(4-maleimidophenyl)sulfide, bis(4 -Maleimidophenyl)disulfide, N,N'-(1,3-phenylene)bismaleimide and 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane are preferable, and bis is preferable from the viewpoint of being inexpensive.
  • (4-maleimidophenyl)methane and N,N′-(1,3-phenylene)bismaleimide are preferred.
  • the (A) maleimide compound is a compound obtained by reacting the maleimide compound (a1) with at least one member selected from the group consisting of a monoamine compound (a2) and a diamine compound (a3) (hereinafter, referred to as “modified maleimide compound”). Also referred to as "compound”), a compound obtained by reacting a maleimide compound (a1), a monoamine compound (a2) and a diamine compound (a3), a maleimide compound (a1) and a diamine compound (a3). The compound obtained by the reaction is more preferable.
  • the monoamine compound (a2) is not particularly limited as long as it is a compound having one amino group, but from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness, etc., a monoamine compound having an acidic substituent is preferable.
  • a monoamine compound represented by general formula (a2-1) shown below is more preferable.
  • R A4 represents an acidic substituent selected from a hydroxyl group, a carboxy group and a sulfonic acid group.
  • R A5 represents an alkyl group having 1 to 5 carbon atoms or a halogen atom.
  • t is an integer of 1 to 5
  • u is an integer of 0 to 4, and satisfies 1 ⁇ t+u ⁇ 5.
  • t is an integer of 2 to 5
  • a plurality of R A4 may be the same or different.
  • u is an integer of 2 to 4
  • a plurality of R A5 may be the same or different.
  • the acidic substituent represented by R A4 is preferably a hydroxyl group or a carboxy group from the viewpoint of solubility and reactivity, and more preferably a hydroxyl group in consideration of heat resistance.
  • t is an integer of 1 to 5, and is preferably an integer of 1 to 3, more preferably 1 or 2, and further preferably 1 from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness, and the like. ..
  • Examples of the alkyl group having 1 to 5 carbon atoms represented by R A5 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group and an n-pentyl group. ..
  • the alkyl group is preferably an alkyl group having 1 to 3 carbon atoms.
  • Examples of the halogen atom represented by R A5 include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
  • u is an integer of 0 to 4, and is preferably an integer of 0 to 3, more preferably an integer of 0 to 2 and still more preferably 0 from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesiveness and the like. Alternatively, it is 1, and particularly preferably 0.
  • Examples of the monoamine compound (a2) include o-aminophenol, m-aminophenol, p-aminophenol, o-aminobenzoic acid, m-aminobenzoic acid, p-aminobenzoic acid, o-aminobenzenesulfonic acid, m- Aminobenzenesulfonic acid, p-aminobenzenesulfonic acid, 3,5-dihydroxyaniline, 3,5-dicarboxyaniline and the like can be mentioned.
  • o-aminophenol, m-aminophenol, and p-aminophenol are preferable from the viewpoint of heat resistance, and p-aminophenol is more preferable in view of dielectric properties, low thermal expansion, and manufacturing cost.
  • the monoamine compound (a2) may be used alone or in combination of two or more.
  • the diamine compound (a3) is not particularly limited as long as it is a compound having two amino groups, but from the viewpoint of high heat resistance, low relative dielectric constant, high copper foil adhesion, etc., the following general formula (a3-1) It is preferable that it is a diamine compound represented by or a modified siloxane compound having an amino group at the molecular end described later.
  • X A2 represents an aliphatic hydrocarbon group having 1 to 3 carbon atoms or —O—.
  • R A6 and R A7 each independently represent an alkyl group having 1 to 5 carbon atoms, a halogen atom or a hydroxyl group. , Carboxy group or sulfonic acid group.
  • v and w are each independently an integer of 0 to 4.
  • Examples of the aliphatic hydrocarbon group having 1 to 3 carbon atoms represented by X A2 include methylene group, ethylene group, propylene group and propylidene group. As X A2 , a methylene group is preferable.
  • Examples of the alkyl group having 1 to 5 carbon atoms represented by R A6 and R A7 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, etc. Are listed.
  • the alkyl group is preferably an alkyl group having 1 to 3 carbon atoms.
  • v and w are preferably integers of 0 to 2, more preferably 0 or 1, and even more preferably 0.
  • modified siloxane compound having an amino group at the molecular end examples include a diamine compound represented by the following general formula (a3-2).
  • R A8 to R A11 each independently represent an alkyl group having 1 to 5 carbon atoms, a phenyl group, or a phenyl group having a substituent.
  • R A12 and R A13 are Each independently represents a divalent organic group, and m is an integer of 2 to 100.
  • Examples of the alkyl group having 1 to 5 carbon atoms represented by R A8 to R A11 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group and the like. Are listed.
  • As the alkyl group an alkyl group having 1 to 3 carbon atoms is preferable, and a methyl group is more preferable.
  • Examples of the substituent in the phenyl group having a substituent include an alkyl group having 1 to 5 carbon atoms, an alkenyl group having 2 to 5 carbon atoms, an alkynyl group having 2 to 5 carbon atoms, and the like.
  • Examples of the alkyl group having 1 to 5 carbon atoms include those mentioned above.
  • Examples of the alkenyl group having 2 to 5 carbon atoms include vinyl group and allyl group.
  • Examples of the alkynyl group having 2 to 5 carbon atoms include ethynyl group and propargyl group.
  • Examples of the divalent organic group represented by R A12 and R A13 include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, —O—, and a divalent linking group in which these are combined.
  • Examples of the alkylene group include alkylene groups having 1 to 10 carbon atoms such as methylene group, ethylene group and propylene group.
  • alkenylene group examples include alkenylene groups having 2 to 10 carbon atoms.
  • alkynylene group examples include alkynylene groups having 2 to 10 carbon atoms.
  • arylene group examples include arylene groups having 6 to 20 carbon atoms such as phenylene group and naphthylene group.
  • R A12 and R A13 are preferably an alkylene group or an arylene group.
  • m is preferably an integer of 2 to 50, more preferably an integer of 3 to 40, further preferably an integer of 5 to 30.
  • diamine compound (a3) examples include 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylethane, 4,4′-diaminodiphenylpropane and 2,2′-bis(4,4′).
  • the diamine compound (a3) may be used alone or in combination of two or more.
  • the reaction of the maleimide compound (a1) with at least one selected from the group consisting of the monoamine compound (a2) and the diamine compound (a3) is preferably carried out in the presence of an organic solvent at a reaction temperature of 70 to 200° C. It is preferable to carry out the reaction by reacting for 1 to 10 hours.
  • the reaction temperature is more preferably 70 to 160° C., further preferably 70 to 130° C., and particularly preferably 80 to 120° C.
  • the reaction time is more preferably 1 to 8 hours, further preferably 2 to 6 hours.
  • the amounts of the three used are the components (a2) and (The relationship between the sum of —NH 2 group equivalents (primary amino group equivalents) possessed by at least one selected from the group consisting of a3) and the maleimide group equivalent of (a1) satisfies the following formula: Is preferred.
  • the modified maleimide compound is a compound obtained by reacting the component (a1) with the component (a2) and the component (a3), it is derived from the structural unit derived from the component (a2) and the component (a3).
  • the ratio [(a3) component/(a2) component] (molar ratio) with the structural unit is preferably 0.9 to 5.0, more preferably 1.0 to 4.5, and further preferably 1.0 to It is 4.0.
  • the weight average molecular weight (Mw) of the modified maleimide compound is preferably 400 to 3,500, more preferably 600 to 2,000, and further preferably 800 to 1,500.
  • the weight average molecular weight in the present specification is a value measured by a gel permeation chromatography (GPC) method (standard polystyrene conversion) using tetrahydrofuran as an eluent, and more specifically described in Examples. It is the value measured by the method.
  • Epoxy resin examples include glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, and glycidyl ester type epoxy resins. Among these, a glycidyl ether type epoxy resin is preferable.
  • Epoxy resin is classified into various epoxy resins depending on the difference in the main skeleton, and among the above types of epoxy resins, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, etc.
  • Bisphenol epoxy resin bisphenol A novolac type epoxy resin and bisphenol F novolac type epoxy resin
  • stilbene type epoxy resin triazine skeleton containing epoxy resin
  • fluorene skeleton containing epoxy resin fluorene skeleton containing epoxy resin
  • naphthalene type epoxy resin anthracene type epoxy resin
  • triphenylmethane Type epoxy resin biphenyl type epoxy resin
  • xylylene type epoxy resin alicyclic epoxy resin such as dicyclopentadiene type epoxy resin.
  • the epoxy resin (B) one type may be used alone, or two or more types may be used in combination.
  • the epoxy equivalent of the (B) epoxy resin is preferably 100 to 500 g/eq, more preferably 120 to 400 g/eq, further preferably 140 to 300 g/eq, and particularly preferably 170 to 240 g/eq.
  • the epoxy equivalent is the mass of the resin per epoxy group (g/eq), and can be measured according to the method specified in JIS K 7236 (2001). Specifically, using an automatic titrator "GT-200 type" manufactured by Mitsubishi Chemical Analytech Co., Ltd., 2 g of epoxy resin was weighed in a 200 ml beaker, 90 ml of methyl ethyl ketone was added dropwise, and the mixture was dissolved in an ultrasonic cleaner and iced. It is determined by adding 10 ml of acetic acid and 1.5 g of cetyltrimethylammonium bromide and titrating with a 0.1 mol/L perchloric acid/acetic acid solution.
  • the component (C) is a copolymer resin having a structural unit derived from a substituted vinyl compound and a structural unit derived from maleic anhydride (hereinafter, also referred to as “(C) copolymer resin”).
  • the substituted vinyl compound include aromatic vinyl compounds, aliphatic vinyl compounds and functional group-substituted vinyl compounds.
  • the aromatic vinyl compound include styrene, 1-methylstyrene, vinyltoluene, dimethylstyrene and the like.
  • Examples of the aliphatic vinyl compound include propylene, butadiene, isobutylene and the like.
  • Examples of the functional group-substituted vinyl compound include acrylonitrile; compounds having a (meth)acryloyl group such as methyl acrylate and methyl methacrylate. Among these, aromatic vinyl compounds are preferable, and styrene is more preferable.
  • a structural unit derived from a substituted vinyl compound is represented by the following general formula (Ci)
  • a structural unit derived from maleic anhydride is represented by the following formula (C-ii):
  • R C1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms
  • R C2 is an alkyl group having 1 to 5 carbon atoms, an alkenyl group having 2 to 5 carbon atoms, or an alkyl group having 6 to 20 carbon atoms. It is an aryl group, a hydroxyl group or a (meth)acryloyl group, and x is an integer of 0 to 3. However, when x is 2 or 3, a plurality of R C2 's may be the same or different. May be.
  • Examples of the alkyl group having 1 to 5 carbon atoms represented by R C1 and R C2 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group and the like. Are listed.
  • the alkyl group is preferably an alkyl group having 1 to 3 carbon atoms.
  • Examples of the alkenyl group having 2 to 5 carbon atoms represented by R C2 include an allyl group and a crotyl group.
  • the alkenyl group is preferably an alkenyl group having 3 or 4 carbon atoms.
  • Examples of the aryl group having 6 to 20 carbon atoms represented by R C2 include a phenyl group, a naphthyl group, an anthryl group and a biphenylyl group.
  • the aryl group is preferably an aryl group having 6 to 10 carbon atoms.
  • x is preferably 0 or 1, more preferably 0.
  • the above molar ratio is at least the above lower limit, the effect of improving the dielectric properties tends to be sufficient, and when it is at most the above upper limit, the compatibility tends to be good.
  • the total content of the structural unit derived from the substituted vinyl compound and the structural unit derived from maleic anhydride in the copolymer resin is preferably 50% by mass or more, more preferably 70% by mass or more, and further preferably Is 90% by mass or more, particularly preferably substantially 100% by mass.
  • the weight average molecular weight (Mw) of the (C) copolymer resin is preferably 4,500 to 18,000, more preferably 6,000 to 17,000, further preferably 8,000 to 16,000, particularly preferably It is 8,000 to 15,000.
  • the thermosetting resin composition may further contain (D) an inorganic filler.
  • an inorganic filler silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate. , Calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay such as calcined clay, talc, aluminum borate, silicon carbide, quartz powder, short glass fibers, glass fine powder, hollow glass, etc. ..
  • Preferable examples of the glass include E glass, T glass, and D glass.
  • silica is preferable from the viewpoint of dielectric properties, heat resistance and low thermal expansion.
  • examples of the silica include, for example, precipitated silica having a high water content produced by a wet method, and dry method silica produced by a dry method containing almost no bound water, and the like, as the dry method silica, due to a difference in production method. , Crushed silica, fumed silica, fused spherical silica, etc.
  • fused spherical silica is preferable from the viewpoint of low thermal expansion and fluidity when filled in a resin.
  • the average particle size of the inorganic filler (D) is preferably 0.1 to 10 ⁇ m, more preferably 0.3 to 8 ⁇ m, and further preferably 0.5 to 2 ⁇ m.
  • the average particle size is 0.1 ⁇ m or more, the fluidity at the time of highly filling the resin can be kept good, and when the average particle size is 10 ⁇ m or less, the probability of inclusion of coarse particles is reduced, and defects due to the coarse particles are reduced. Occurrence can be suppressed.
  • the average particle diameter is a particle diameter at a point corresponding to a volume of 50% when the cumulative frequency distribution curve based on the particle diameter is calculated with the total volume of the particles being 100%, and the laser diffraction scattering method is used. It can be measured with a conventional particle size distribution measuring device.
  • the aminosilane-based coupling agent may have one amino group, may have two amino groups, or may have three or more amino groups, but usually one amino group or I have two.
  • Examples of the aminosilane coupling agent having one amino group include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane and 3-triethoxysilyl-N- (1,3-Dimethyl-butylidene)propylamine, 2-propynyl[3-(trimethoxysilyl)propyl]carbamate and the like can be mentioned.
  • aminosilane coupling agent having two amino groups examples include N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 1- Examples include [3-(trimethoxysilyl)propyl]urea and 1-[3-(triethoxysilyl)propyl]urea.
  • the aminosilane coupling agent may be used alone or in combination of two or more.
  • the thermosetting resin composition may further contain (E) a curing agent.
  • a curing agent dicyandiamide; chain aliphatic amines other than dicyandiamide, such as ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, diethylaminopropylamine, tetramethylguanidine, and triethanolamine; Isophoronediamine, diaminodicyclohexylmethane, bis(aminomethyl)cyclohexane, bis(4-amino-3-methyldicyclohexyl)methane, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8 Cyclic aliphatic amines such as 10-tetraoxaspiro[5.5]undecane; aromatic amines such as xylenediamine
  • the thermosetting resin composition may further contain (F) thermoplastic elastomer.
  • thermoplastic elastomer examples include styrene elastomer, olefin elastomer, urethane elastomer, polyester elastomer, polyamide elastomer, acrylic elastomer, silicone elastomer, and derivatives thereof. Of these, styrene elastomers are preferable.
  • the thermoplastic elastomer (F) one type may be used alone, or two or more types may be used in combination. However, in this embodiment, the component (C) is not included in the definition of the thermoplastic elastomer (F).
  • the thermoplastic elastomer preferably has a reactive functional group at the molecular end or in the molecular chain.
  • the reactive functional group include epoxy group, hydroxyl group, carboxy group, amino group, amide group, isocyanate group, acryl group, methacryl group, vinyl group and the like.
  • styrene elastomer examples include styrene-butadiene copolymers such as styrene-butadiene-styrene block copolymers; styrene-isoprene copolymers such as styrene-isoprene-styrene block copolymers; styrene-ethylene-butylene-styrene block copolymers, styrene- Examples thereof include ethylene-propylene-styrene block copolymer.
  • styrene derivatives such as ⁇ -methylstyrene, 3-methylstyrene, 4-propylstyrene, 4-cyclohexylstyrene and the like can be used in addition to styrene.
  • styrene-butadiene copolymers and styrene-isoprene copolymers are preferable, and hydrogenated styrene-butadiene copolymer resins and hydrogenated styrene-isoprene copolymers obtained by hydrogenating the double bond portion of these copolymers.
  • Hydrogenated styrene thermoplastic elastomers such as resins are more preferable.
  • the thermosetting resin composition may further contain (G) a curing accelerator from the viewpoint of accelerating the curing reaction.
  • a curing accelerator an organic phosphorus compound such as triphenylphosphine; imidazoles and derivatives thereof; nitrogen-containing compounds such as secondary amines, tertiary amines and quaternary ammonium salts; dicumyl Peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3,2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, ⁇ , ⁇ '- Examples thereof include organic peroxides such as bis(t-butylperoxy)diisopropylbenzene; organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, and cobalt octylate. Among these, organic phosphorus compounds are preferable. As
  • the content of each component in the thermosetting resin composition is not particularly limited, but may be in the range described below, for example.
  • the thermosetting resin composition contains the component (A)
  • its content is preferably 10 to 90 parts by mass, based on 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition, It is preferably 20 to 85 parts by mass, more preferably 40 to 80 parts by mass.
  • the content of the component (A) is at least the above lower limit, heat resistance, relative dielectric constant, glass transition temperature and low thermal expansion tend to be excellent.
  • the fluidity and moldability tend to be excellent.
  • thermosetting resin composition contains the component (B)
  • its content is preferably 5 to 50 parts by mass, based on 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition. It is preferably 10 to 40 parts by mass, more preferably 20 to 35 parts by mass.
  • the content of the component (B) is at least the above lower limit, heat resistance, glass transition temperature and low thermal expansion tend to be excellent.
  • the thermosetting resin composition contains the component (C)
  • its content is preferably 2 to 40 parts by mass, based on 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition.
  • the amount is preferably 5 to 35 parts by mass, more preferably 10 to 30 parts by mass.
  • the content of the component (C) is at least the above lower limit, heat resistance and relative permittivity tend to be excellent.
  • heat resistance, copper foil adhesiveness and low thermal expansion tend to be excellent.
  • the thermosetting resin composition contains the component (D)
  • its content is preferably 30 to 200 parts by mass, more preferably 30 to 200 parts by mass, based on 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition. It is preferably 40 to 150 parts by mass, more preferably 45 to 120 parts by mass.
  • the content of the component (D) is at least the above lower limit, the low thermal expansion tends to be excellent.
  • thermosetting resin composition contains the component (E)
  • its content is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition. , More preferably 0.5 to 5 parts by mass, further preferably 1 to 3 parts by mass.
  • the content of the component (E) is at least the above lower limit, the copper foil adhesiveness and low thermal expansion tend to be excellent.
  • the heat resistance tends to be excellent.
  • thermosetting resin composition contains the component (F)
  • its content is preferably 2 to 30 parts by mass, based on 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition.
  • the amount is preferably 5 to 20 parts by mass, more preferably 7 to 15 parts by mass.
  • the content of the component (F) is at least the above lower limit value, the relative dielectric constant tends to be excellent.
  • heat resistance and copper foil adhesiveness tend to be excellent.
  • the thermosetting resin composition contains the component (G)
  • its content is preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the total amount of the resin components contained in the thermosetting resin composition. , More preferably 0.1 to 3 parts by mass, still more preferably 0.2 to 1 part by mass.
  • thermosetting resin composition is a flame retardant, a colorant, an antioxidant, a reducing agent, a UV absorber, an optical brightener, an adhesion improver, and an organic filler within a range that does not impair the effects of the present invention. It may contain other components such as. For each of these, one kind may be contained alone, or two or more kinds may be contained.
  • thermosetting resin composition used in the production method of the present embodiment is not particularly limited, but for example, the above thermosetting resin composition is impregnated or coated on a glass cloth (g) and semi-cured by heating or the like ( It can be manufactured in the B stage).
  • the thermosetting resin composition may be in the form of a varnish diluted with an organic solvent such as methyl ethyl ketone.
  • concentration of nonvolatile components in the varnish is, for example, 40 to 80% by mass, preferably 50 to 75% by mass.
  • the drying conditions after impregnation are not particularly limited, but the heating temperature is, for example, 120 to 200° C., preferably 140 to 180° C., and the heating time is, for example, 30 seconds to 30 minutes, preferably 1 to 10 minutes. is there.
  • the thickness of the prepreg (p) is preferably 3 to 80 ⁇ m, more preferably 5 to 50 ⁇ m, further preferably 10 to 40 ⁇ m, and particularly preferably 15 to 30 ⁇ m, from the viewpoint of keeping the strength good and thinning.
  • the content of the thermosetting resin composition in the prepreg (p) is preferably 50 to 90% by mass, more preferably 60 to 80% by mass, and more preferably 65 to 75% by mass in terms of the solid content of the thermosetting resin composition. % Is more preferable.
  • the solid content in the present embodiment refers to components in the composition other than volatile substances such as water and a solvent described later. That is, the solid content does not necessarily mean that it is solid, including liquid, starch syrup and wax at room temperature around 25°C.
  • the method for manufacturing the composite material of the present embodiment has a step of heating the prepreg (p) containing the glass cloth (g) and the thermosetting resin composition to 200° C. or higher.
  • the “step of heating to 200° C. or higher” means that the product temperature (that is, prepreg) becomes 200° C. or higher.
  • the heating device to be used may be set to 200° C. or higher.
  • the heating temperature in the heating step is preferably 202° C. or higher, more preferably 205° C. or higher. Further, the heating temperature is preferably 300° C. or lower, and more preferably 250° C.
  • the heating time in the heating step is not particularly limited, but from the viewpoint of productivity and dimensional stability, it is preferably 15 to 300 minutes, more preferably 30 to 200 minutes, and further preferably 60 to 90 minutes.
  • the pressing pressure in the heating step is preferably 0.2 to 10 MPa, more preferably 1 to 6 MPa, and further preferably 2 to 4 MPa from the viewpoint of productivity and dimensional stability.
  • a known molding method for a laminated plate for electric insulating material and a multilayer plate can be applied, and for example, a multi-stage press, a multi-stage vacuum press, continuous molding, an autoclave molding machine or the like can be used. ..
  • the composite material of the present embodiment is a composite material manufactured by the method of manufacturing the composite material of the present embodiment. That is, the composite material of the present embodiment is manufactured through a step of heating the prepreg (p) containing the glass cloth (g) and the thermosetting resin composition to 200° C. or higher, and, for example, Examples include a cured product obtained by heating one or two or more layers of prepreg (p) to 200° C. or higher, a laminated plate containing these cured products, and the like.
  • the manufacturing method of the laminated board of the present embodiment A method for producing a laminate having two or more insulating layers, or a laminate having one or more insulating layers and one or more metal foils,
  • the insulating layer is a composite material, It is a method for manufacturing a laminated plate, in which the composite material is formed by the method for manufacturing a composite material according to the present embodiment.
  • the laminated board of the present embodiment may be one in which at least one prepreg (p) is laminated, and examples thereof include the following aspects (1) to (5).
  • a metal-clad laminate obtained by laminating and molding a metal foil on one surface or both surfaces of one layer of a prepreg (p).
  • the metal of the metal foil is not particularly limited as long as it is used for an electric insulating material, but from the viewpoint of conductivity, preferably copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, It is preferably tungsten, iron, titanium, chromium, or an alloy containing at least one of these metal elements, more preferably copper or amylnium, and further preferably copper.
  • the thickness of the metal foil is not particularly limited and can be appropriately selected depending on the application of the printed wiring board.
  • the thickness of the metal foil is preferably 0.5 to 150 ⁇ m, more preferably 1 to 100 ⁇ m, further preferably 5 to 50 ⁇ m, and particularly preferably 5 to 30 ⁇ m.
  • the plurality of prepregs may be only prepreg (p), or prepreg (p) and a prepreg other than prepreg (p) may be used in combination.
  • the prepreg (p) is used from the viewpoint of dimensional stability.
  • the morphology and composition of the plurality of prepregs (p) may be the same or different.
  • the laminated plate of the present embodiment is obtained by stacking one or more layers of prepreg (p) and a metal foil or the like so as to have a desired structure, and laminating and molding.
  • Various conditions such as a heating temperature, a heating time, a press pressure, and an apparatus used for the lamination molding are the same as the above-mentioned manufacturing conditions of the composite material.
  • the thickness of the laminated plate of the present embodiment is not particularly limited and may be appropriately determined depending on the application of the laminated plate, but is, for example, 0.03 to 1.6 mm.
  • the printed wiring board of this embodiment is a printed wiring board using the laminated board of this embodiment.
  • the printed wiring board of the present embodiment can be manufactured, for example, by subjecting the copper foil of the copper-clad laminate, which is one aspect of the laminate of the present embodiment, to circuit processing.
  • Circuit processing for example, after forming a resist pattern on the surface of the copper foil, remove unnecessary portions of the copper foil by etching, after removing the resist pattern, to form the necessary through holes by drilling, after forming the resist pattern again, It can be performed by performing plating for electrical connection to the through hole and finally removing the resist pattern.
  • the step of laminating and circuit-processing a copper clad laminate on the surface of the obtained printed wiring board under the same conditions as above can be repeated a necessary number of times to obtain a multilayer printed wiring board.
  • the semiconductor package of the present embodiment has a semiconductor element mounted on the printed wiring board of the present embodiment.
  • the semiconductor package of this embodiment can be manufactured by mounting a semiconductor chip, a memory, etc. at a predetermined position on the printed wiring board of this embodiment.
  • the above-mentioned three hole distances in the warp direction X of the glass cloth and the three hole holes in the weft direction Y of the glass cloth were performed in the same procedure as described above. The respective distances were measured, and this was designated as "dimensional value after lamination”. Further, for each interhole distance, "initial dimension value"-"post-stacking dimension value” was obtained, and this was set as "dimension change amount S" of each interhole distance. Then, the average value S(x) ave , the maximum value S(x) max, and the minimum value S( of the dimensional change amounts of the three hole distances (1-7, 2-6, 3-5) in the warp direction X are calculated.
  • the values S(y) min are calculated respectively, and the difference between the maximum value and the average value (maximum value-average value) and the difference between the average value and the minimum value (average value-minimum) are obtained for each of the warp direction X and the weft direction Y. Value), and the difference between the maximum value and the minimum value (maximum value-minimum value) was used as an index for evaluation of dimensional variation.
  • Preparation of prepreg Production example 1 (Prepreg 1) In producing the prepreg 1, the following components were prepared.
  • Component (B) Cresol novolac type epoxy resin (manufactured by DIC Corporation)
  • the above component (A) is 45 parts by mass
  • the component (B) is 30 parts by mass
  • the component (C) is 25 parts by mass
  • the component (D) is the total amount of the resin components [(A) to (C) Total] 50 parts by mass with respect to 100 parts by mass
  • 2 parts by mass of the component (E) are blended with 100 parts by mass of the total amount of the resin components, and methyl ethyl ketone is added so that the nonvolatile content of the solution becomes 67% by mass.
  • a resin varnish was prepared.
  • the blending amount of each of the above-mentioned components is all parts by mass of a solid content, and in the case of a solution (excluding an organic solvent) or a dispersion liquid, a solid content conversion amount.
  • the obtained resin varnish was impregnated in glass cloth 1 shown in Table 1 and dried at 160° C. for 4 minutes to obtain prepreg 1.
  • Production example 2 (Prepreg 2) A prepreg 2 was produced in the same manner as in Production Example 1, except that the glass cloth in Production Example 1 was changed from the glass cloth 1 shown in Table 1 to the glass cloth 2.
  • Example 1 Comparative Examples 1 to 3 (Preparation of double-sided copper clad laminate) 18 ⁇ m copper foil “3EC-VLP-18” (manufactured by Mitsui Kinzoku Co., Ltd.) was overlaid on both surfaces of the prepreg shown in Table 2 and heat-pressed under the molding conditions shown in Table 2 to give a thickness of 0.05 mm. A double-sided copper clad laminate was prepared.
  • the laminated body of Example 1 manufactured by the manufacturing method of the present embodiment has a small variation in dimensional change.
  • the laminated plates of Comparative Examples 1 and 2 using the glass cloth 2 that does not satisfy the average filament diameter ratio and the weave density ratio, and the laminated plate of Comparative Example 3 in which the molding temperature is less than 200° C. was great.
  • the glass cloth 2 that does not satisfy the average filament diameter ratio and the weave density ratio is used, by changing from the low temperature condition (Comparative Example 1) to the high temperature condition (Comparative Example 2), the variation in the dimensional change amount in the X direction is varied.

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Abstract

La présente invention concerne un procédé de fabrication d'un matériau composite, le procédé comprenant une étape consistant à chauffer un préimprégné contenant un tissu de verre et une composition de résine thermodurcissable à 200 °C ou plus, un rapport de diamètre de filament moyen (chaîne/trame) de chaîne et de trame constituant le tissu de verre étant supérieur à 1,00, et un rapport de densité de tissage (chaîne/trame) de chaîne et de trame étant supérieur à 1,00. L'invention concerne également un matériau composite obtenu par le procédé de fabrication, un panneau stratifié utilisant le matériau composite et un procédé de fabrication du panneau stratifié, une carte de circuit imprimé et un boîtier de semi-conducteur, et un préimprégné destiné à être utilisé dans un procédé de fabrication du matériau composite.
PCT/JP2019/049510 2018-12-18 2019-12-18 Matériau composite, son procédé de fabrication, préimprégné, panneau stratifié, carte de circuit imprimé et boîtier de semi-conducteur WO2020130008A1 (fr)

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WO2022255141A1 (fr) * 2021-06-02 2022-12-08 信越ポリマー株式会社 Composition adhésive
WO2022255137A1 (fr) * 2021-06-02 2022-12-08 信越ポリマー株式会社 Composition d'agent adhésif

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JPS63267514A (ja) * 1987-04-24 1988-11-04 Unitika Ltd フレキシブルプリント配線板用材料
JPH055243A (ja) * 1991-05-16 1993-01-14 Nitto Boseki Co Ltd ガラス織布およびそれを用いた積層板
JPH07252747A (ja) * 1994-03-11 1995-10-03 Nitto Boseki Co Ltd プリント配線基板用ガラス織布及びそれを用いたプリント配線基板
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022255141A1 (fr) * 2021-06-02 2022-12-08 信越ポリマー株式会社 Composition adhésive
WO2022255137A1 (fr) * 2021-06-02 2022-12-08 信越ポリマー株式会社 Composition d'agent adhésif

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