WO2024009861A1 - Stratifié recouvert de cuivre, carte nue et boîtier à semi-conducteurs - Google Patents

Stratifié recouvert de cuivre, carte nue et boîtier à semi-conducteurs Download PDF

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Publication number
WO2024009861A1
WO2024009861A1 PCT/JP2023/023907 JP2023023907W WO2024009861A1 WO 2024009861 A1 WO2024009861 A1 WO 2024009861A1 JP 2023023907 W JP2023023907 W JP 2023023907W WO 2024009861 A1 WO2024009861 A1 WO 2024009861A1
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WIPO (PCT)
Prior art keywords
copper
clad laminate
copper foil
group
insulating layer
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PCT/JP2023/023907
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English (en)
Japanese (ja)
Inventor
廉 佐々木
成行 八木
真一 鴨志田
稔 垣谷
隆雄 谷川
彩香 竹口
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株式会社レゾナック
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Publication of WO2024009861A1 publication Critical patent/WO2024009861A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present disclosure relates to a copper-clad laminate, a printed wiring board, and a semiconductor package.
  • Copper-clad laminates are made by laminating an insulating layer and copper foil, and are generally made by laminating prepreg made of glass cloth impregnated with resin and copper foil, and then heating and pressurizing them. Manufactured. The obtained copper-clad laminate is then formed with a circuit, and then subjected to heat treatment such as annealing treatment and reflow treatment to produce a printed wiring board using the copper-clad laminate.
  • an insulating layer such as prepreg and copper foil are laminated and subjected to multiple heat treatments.
  • blisters hereinafter also referred to as "blisters"
  • the blisters may occur, making heat resistance an issue. Since the blisters cause deterioration in the yield of copper-clad laminates, deterioration in reliability of printed wiring boards, etc., it is desired that the blisters have sufficient heat resistance to suppress their occurrence.
  • Patent Document 1 discloses a copper-clad laminate including an insulating layer containing a resin and a copper foil disposed on at least one surface of the insulating layer, the copper foil containing zinc.
  • a copper-clad laminate is disclosed, which is a surface-treated copper foil having a metal treatment layer, and the metal treatment layer has a zinc content of 10 to 2,500 ⁇ g/dm 2 .
  • an object of the present disclosure is to provide a copper-clad laminate that has excellent heat resistance and low transmission loss, and a printed wiring board and semiconductor package that include the copper-clad laminate.
  • a copper-clad laminate including an insulating layer containing a resin and a copper foil disposed on at least one surface of the insulating layer,
  • the copper foil is a surface-treated copper foil having a surface roughness Rz of 0.30 to 0.60 ⁇ m on the surface facing the insulating layer and a metal treatment layer containing 80 to 300 ⁇ g/ dm2 of silicon. , copper clad laminate.
  • the metal treatment layer further contains one or more metals selected from the group consisting of zinc, nickel, cobalt, and molybdenum.
  • Example 2 is a graph showing transmission loss test results in Example 1 and Comparative Example 1.
  • the upper limit or lower limit of the numerical range may be replaced with the values shown in the Examples. Further, the lower limit value and upper limit value of the numerical range can be arbitrarily combined with the lower limit value and upper limit value of other numerical ranges, respectively.
  • the numerical values AA and BB at both ends are included in the numerical range as the lower limit value and upper limit value, respectively.
  • the description "10 or more” means 10 and a numerical value exceeding 10, and this applies even if the numerical values are different. Further, for example, the description "10 or less” means a numerical value of 10 and less than 10, and this applies even if the numerical values are different.
  • each component and material illustrated in this disclosure may be used alone, or two or more types may be used in combination, unless otherwise specified.
  • the content of each component in the composition refers to the total amount of the multiple substances present in the composition. means.
  • the term "resin component” refers to all components of the solid content constituting the resin composition, excluding inorganic compounds such as inorganic fillers described below.
  • solid content refers to components other than the organic solvent described below, and components that are liquid at 25° C. are also considered to be solid content.
  • the expression “contains XX” refers to either containing XX in a reacted state when XX can react, or simply containing XX. It means that it is possible. Aspects in which the items described in this disclosure are arbitrarily combined are also included in the present disclosure and embodiments.
  • the present disclosure is a copper-clad laminate including an insulating layer containing a resin (hereinafter also simply referred to as an "insulating layer") and a copper foil disposed on at least one surface of the insulating layer,
  • the copper foil is a surface-treated copper foil having a surface roughness Rz of 0.30 to 0.60 ⁇ m on the surface facing the insulating layer and a metal treatment layer containing 80 to 300 ⁇ g/ dm2 of silicon.
  • the copper-clad laminate of this embodiment has "a surface roughness Rz of 0.30 to 0.60 ⁇ m on the surface facing the insulating layer, and a silicon content of 80 to 300 ⁇ g/dm.
  • a surface-treated copper foil having a metal treatment layer containing 2 is sometimes referred to as a ⁇ surface-treated copper foil (I)''.
  • the surface facing the insulating layer is a roughened surface, and the roughened surface is sometimes referred to as a "matte surface.”
  • the matte surface is present on the metallization layer.
  • the structure of the copper-clad laminate of this embodiment is not particularly limited as long as it includes an insulating layer and a surface-treated copper foil (I) disposed on at least one surface of the insulating layer.
  • the copper-clad laminate of this embodiment includes two or more sheets of copper foil, the two or more sheets of copper foil may be only the surface-treated copper foil (I), or the surface-treated copper foil (I) and the surface A combination with a copper foil other than the treated copper foil (I) may be used.
  • the copper-clad laminate may have a structure in which copper foil is laminated on one or both sides of an insulating layer, and one or more insulating layers and one or more copper foil layers are alternately formed. It may be something that has been done. Alternatively, one or more insulating layers and one or more copper foils may be alternately formed on one or both sides of a core substrate having copper foils on both sides.
  • the number of insulating layers included in the copper-clad laminate of this embodiment may be one or more, and may be appropriately selected from, for example, 2 to 20, depending on the application.
  • the number of copper foils included in the copper-clad laminate of this embodiment is one or more, and may be appropriately selected from, for example, 2 to 20, depending on the application.
  • a circuit may be formed in the copper foil of the copper-clad laminate of this embodiment by a method described later.
  • the term is used as "surface-treated copper foil (I)" in the case where the copper-clad laminate includes only “surface-treated copper foil (I)".
  • the copper-clad laminate includes "surface-treated copper foil (I)” and “copper foil other than surface-treated copper foil (I),""surface-treated copper foil (I)” and “"copper foil other than surface-treated copper foil (I)".
  • the thickness of the copper-clad laminate of this embodiment is not particularly limited, and may be appropriately determined depending on the use of the copper-clad laminate, but is preferably 0.03 to 1.6 mm.
  • the surface-treated copper foil (I) and the insulating layer included in the copper-clad laminate of this embodiment will be explained.
  • the surface-treated copper foil (I) of the copper-clad laminate of this embodiment has a surface roughness Rz of 0.30 to 0.60 ⁇ m on the surface facing the insulating layer (matte surface), and has a silicon content of 80 ⁇ m. It has a metal treatment layer containing ⁇ 300 ⁇ g/dm 2 .
  • the silicon content is a value analyzed by fluorescent X-ray analysis, and in detail, it is measured according to the method described in Examples.
  • the surface roughness is a ten-point average roughness Rz measured using a contact roughness meter in accordance with JIS B0601 (2013), and in detail, as described in Examples.
  • the content of a specific element in the metal treatment layer means the content of the specific element in the metal treatment layer per layer. Therefore, when the surface-treated copper foil (I) has metal-treated layers on both sides, the content of a specific element in the metal-treated layer is defined as the content of a specific element in the metal-treated layer on one side of the metal-treated layers on both sides. Refers to the content of a specific element.
  • the metal treatment layer contains 80 to 300 ⁇ g/dm 2 of silicon, preferably 90 to 250 ⁇ g/dm 2 , and more preferably 100 to 200 ⁇ g/dm 2 of silicon.
  • the silicon content is more preferably 100 to 150 ⁇ g/dm 2 , and particularly preferably 105 to 135 ⁇ g/dm 2 .
  • the method of bringing the silicon content in the metal treatment layer within the predetermined range there is no particular restriction on the method of bringing the silicon content in the metal treatment layer within the predetermined range.
  • the surface facing the insulating layer may be coated with a silane coupling agent while adjusting the amount of the silane coupling agent. Examples include a method of surface treatment.
  • a commercially available copper foil in which the silicon content in the metal treatment layer is within the above-mentioned predetermined range can also be used.
  • Such copper foil can be selected from, for example, copper foil manufactured by Mitsui Kinzoku Co., Ltd.
  • the surface roughness Rz of the surface facing the insulating layer (matte surface) is 0.30 ⁇ m or more, the adhesion between the insulating layer and the copper foil increases, resulting in good heat resistance. By satisfying the following, it is possible to reduce transmission loss. From this point of view, the surface roughness Rz of the surface facing the insulating layer (matte surface) is 0.30 to 0.60 ⁇ m, preferably 0.35 to 0.55 ⁇ m, more preferably 0.40 to 0.55 ⁇ m. , more preferably 0.45 to 0.55 ⁇ m. Examples of a method for producing a copper foil having the surface roughness Rz include a method of roughening the surface of the copper foil that faces the insulating layer.
  • the method and conditions of the roughening treatment are not particularly limited as long as the surface roughness Rz is within the above range, and conventionally known methods and conditions may be adjusted as appropriate.
  • a method of attaching a film having fine irregularities to the surface of copper foil can be mentioned.
  • a pretreatment such as acid washing may be performed as appropriate.
  • the metal treatment layer may further contain one or more metals selected from the group consisting of zinc, nickel, cobalt, and molybdenum.
  • the content of zinc in the metal treatment layer is not particularly limited, but is preferably from 10 to 2,500 ⁇ g/dm 2 , more preferably from 15 to 1,000 ⁇ g/dm 2 , even more preferably from 20 to 1,000 ⁇ g/dm 2 500 ⁇ g/dm 2 , particularly preferably 25-300 ⁇ g/dm 2 , most preferably 30-200 ⁇ g/dm 2 .
  • the method of forming the metal treatment layer containing zinc is not particularly limited, but plating treatment using zinc is preferred.
  • the plating treatment using zinc may be either zinc plating treatment or zinc alloy plating treatment, and preferably zinc alloy plating treatment.
  • the metal that forms an alloy with zinc includes one or more metals selected from the group consisting of nickel, cobalt, and molybdenum.
  • Specific examples of zinc alloys include zinc-nickel alloy, zinc-cobalt alloy, zinc-molybdenum alloy, zinc-cobalt-molybdenum alloy, etc. Among these, zinc-nickel alloy and zinc-cobalt-molybdenum alloy are preferable.
  • the resulting copper-clad laminate has even better blister resistance and further heat resistance. It tends to be better.
  • the metal treatment layer contains zinc, the heat resistance may be insufficient.
  • it contains metal.
  • the total content of one or more metals selected from the group consisting of nickel, cobalt and molybdenum in the metal treatment layer is preferably 10 to 2,500 ⁇ g/dm 2 , more preferably 40 to 1,000 ⁇ g/dm 2 , more preferably 60 to 500 ⁇ g/dm 2 , particularly preferably 100 to 300 ⁇ g/dm 2 , and most preferably 150 to 200 ⁇ g/dm 2 .
  • the metal treatment layer preferably contains nickel from among one or more metals selected from the group consisting of nickel, cobalt, and molybdenum, and contains nickel and does not contain cobalt or molybdenum. Good too.
  • the metal treatment layer may further contain chromium from the viewpoint of rust prevention treatment and improvement of adhesion to the resin.
  • the chromium content is preferably 10 to 200 ⁇ g/dm 2 , more preferably 20 to 150 ⁇ g/dm 2 , even more preferably 30 to 100 ⁇ g/dm 2 , particularly preferably 40 ⁇ g/dm 2 . ⁇ 80 ⁇ g/dm 2 , most preferably 50-80 ⁇ g/dm 2 .
  • the method for forming a metal treatment layer containing chromium is not particularly limited, and examples thereof include chromate treatment (rust prevention treatment) and the like.
  • the chromate treatment can suppress oxidation of the copper foil, and tends to facilitate the formation of fine wiring during circuit formation.
  • the chromate treatment may be either electrolytic chromate treatment or immersion chromate treatment, but electrolytic chromate treatment is preferred from the viewpoint of stability of the amount of adhesion.
  • the copper foil included in the copper-clad laminate of this embodiment is not particularly limited, and may be rolled copper foil or electrolytic copper foil, but electrolytic copper foil is preferable.
  • the thickness of the surface-treated copper foil (I) may be determined as appropriate depending on the use of the copper-clad laminate, but preferably 1 to 120 ⁇ m, more preferably 3 to 60 ⁇ m, even more preferably 5 to 40 ⁇ m, especially Preferably it is 10 to 25 ⁇ m. Further, from the viewpoint of making the semiconductor package thinner, the thickness is preferably 35 ⁇ m or less, more preferably 25 ⁇ m or less, and still more preferably 20 ⁇ m or less.
  • the resin-containing insulating layer of the copper-clad laminate of this embodiment is not particularly limited, and may be appropriately selected from conventionally known insulating resin materials depending on desired characteristics.
  • the insulating layer preferably contains a cured product of a thermosetting resin composition, and may be a cured prepreg formed by impregnating a sheet-like reinforcing base material such as glass cloth with the thermosetting resin composition. It is more preferable that
  • thermosetting resin composition is not particularly limited as long as it contains a thermosetting resin.
  • Thermosetting resins include maleimide compounds, epoxy resins, phenol resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins, and triazine resins. , melamine resin, etc. These may be used alone or in combination of two or more.
  • maleimide compounds, epoxy resins, and phenol resins are preferred, and maleimide compounds are more preferred, from the viewpoints of heat resistance, moldability, and low thermal expansion.
  • the thermosetting resin composition contains a polyphenylene ether derivative (A), a curing accelerator, from the viewpoint of further increasing heat resistance and low transmission loss, and from the viewpoint of obtaining excellent copper foil adhesion, low thermal expansion, etc. (B), maleimide compound (C), inorganic filler (D), flame retardant (E), and thermoplastic elastomer (F) [hereinafter referred to as (A) component, (B) component, (C) component, ( They may be referred to as D) component, (E) component, and (F) component. ] It is preferable to contain.
  • An insulating layer containing the thermosetting resin composition tends to have good adhesion to the copper foil, improve heat resistance, and tend to reduce transmission loss.
  • preferred embodiments of each component will be explained.
  • the polyphenylene ether derivative (A) preferably has a structural unit represented by the following general formula (I), and has high frequency properties, high adhesion to conductors, high glass transition temperature, low thermal expansion, and high difficulty. From the viewpoint of flammability, it is more preferable to have an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I).
  • each R 1 is independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom.
  • x is an integer of 0 to 4.
  • Examples of the aliphatic hydrocarbon group represented by R 1 in the general formula (I) include methyl group, ethyl group, n-propyl group, and isopropyl group.
  • the aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, and preferably a methyl group.
  • examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, and the like.
  • R 1 is preferably an aliphatic hydrocarbon group having 1 to 5 carbon atoms.
  • x is an integer of 0 to 4, preferably an integer of 0 to 2, and preferably 2.
  • R 1 may be substituted at the ortho position on the benzene ring (however, based on the substitution position of the oxygen atom).
  • the plurality of R 1s may be the same or different.
  • the number of the N-substituted maleimide structure-containing groups may be one or more, and is not particularly limited, but may be one or two. It is preferable that there be one, and more preferably one.
  • the N-substituted maleimide structure-containing group is selected from the viewpoints of high frequency properties, adhesion to conductors, heat resistance, glass transition temperature, low thermal expansion, and flame retardancy, in which the nitrogen atoms of two maleimide groups form an organic group. bismaleimide structure (however, structures derived from this structure are also included).
  • the structure derived from this structure means that the carbon-carbon double bond of the maleimide group is connected to a functional group (amino group). etc.) is preferable.
  • the N-substituted maleimide structure-containing group is more preferably a group represented by the following general formula (Z).
  • R 2 is each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom.
  • y is an integer of 0 to 4.
  • a 1 is the general formula (II) described below, (III), (IV) or (V).)
  • y is an integer of 0 to 4, preferably an integer of 0 to 2, and more preferably 0.
  • y is an integer of 2 or more, the plurality of R 2 's may be the same or different.
  • each R 3 is independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom.
  • p is an integer of 0 to 4.
  • the aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R 3 are explained in the same manner as in the case of R 1 .
  • p is an integer of 0 to 4, preferably an integer of 0 to 2 from the viewpoint of availability, more preferably 0 or 1, and even more preferably 0.
  • the plurality of R 3 's may be the same or different.
  • R 4 and R 5 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom.
  • a 2 is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, group, ether group, sulfide group, sulfonyl group, carbonyloxy group, keto group, single bond, or a group represented by the following general formula (III-1).
  • q and r are each independently an integer of 0 to 4. be.
  • the aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R 4 and R 5 include the same ones as in the case of R 1 .
  • the aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably an ethyl group.
  • Examples of the alkylene group having 1 to 5 carbon atoms represented by A 2 include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. It will be done.
  • the alkylene group is preferably an alkylene group having 1 to 3 carbon atoms from the viewpoint of high frequency characteristics, adhesion with conductors, heat resistance, glass transition temperature, low thermal expansion and flame retardancy, and methylene groups are preferable. It is more preferable that there be.
  • Examples of the alkylidene group having 2 to 5 carbon atoms represented by A 2 include ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, and isopentylidene group.
  • isopropylidene groups are preferred from the viewpoints of high frequency properties, adhesion to conductors, heat resistance, glass transition temperature, low thermal expansion, and flame retardancy.
  • a 2 is preferably an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms.
  • q and r are each independently an integer of 0 to 4, and from the viewpoint of availability, both are preferably integers of 0 to 2, more preferably 0 or 2.
  • q or r is an integer of 2 or more, the plurality of R 4s or R 5s may be the same or different.
  • the group represented by the general formula (III-1) represented by A 2 is as follows.
  • R 6 and R 7 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom.
  • a 3 is an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, A sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond.
  • s and t are each independently an integer of 0 to 4.
  • the aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R 6 and R 7 are explained in the same manner as in the case of R 4 and R 5 .
  • the alkylene group having 1 to 5 carbon atoms represented by A 3 is the same as the alkylene group having 1 to 5 carbon atoms represented by A 2 .
  • a 3 is preferably an alkylidene group having 2 to 5 carbon atoms.
  • s and t are integers of 0 to 4, and from the viewpoint of availability, both are preferably integers of 0 to 2, more preferably 0 or 1, and even more preferably 0. .
  • s or t is an integer of 2 or more, the plurality of R 6 or R 7 may be the same or different.
  • n is an integer from 0 to 15.
  • n is preferably 0 to 5, more preferably 0 to 3.
  • R 8 and R 9 are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. u is an integer of 1 to 8.
  • u is an integer of 1 to 8, preferably an integer of 1 to 3, and preferably 1.
  • the polyphenylene ether derivative (A) is preferably a polyphenylene ether derivative represented by the following general formula (A'). (In the formula, A 1 , R 1 , R 2 , x and y are as defined above. m is an integer of 1 or more.)
  • m is preferably an integer of 1 to 300, more preferably an integer of 10 to 300, even more preferably an integer of 30 to 200, particularly preferably an integer of 50 to 150.
  • polyphenylene ether derivative (A) is more preferably a polyphenylene ether derivative represented by any of the following formulas (A'-1) to (A'-4).
  • polyphenylene ether derivatives of the above formula (A'-1) are preferred, and from the viewpoint of excellent dielectric properties and low water absorption, polyphenylene ether derivatives of the above formula (A'-2) are preferred.
  • Polyphenylene ether derivatives are preferable, and from the viewpoint of excellent adhesion with conductors and mechanical properties (elongation, breaking strength, etc.), polyphenylene ethers of the above formula (A'-3) or the above formula (A'-4) Derivatives are preferred. Therefore, depending on the desired characteristics, one type of polyphenylene ether derivative represented by any of the above formulas (A'-1) to (A'-4) may be used alone, or two or more types may be used in combination. can do.
  • the number average molecular weight of the polyphenylene ether derivative (A) is preferably 4,000 to 14,000, more preferably 5,000 to 12,000, and more preferably 7,000 to 12,000. is more preferable, and particularly preferably 7,000 to 10,000. Further, the number average molecular weight of the polyphenylene ether derivative (A) may be from 4,000 to 8,000, or from 4,000 to 6,500. When the number average molecular weight is 4,000 or more, a better glass transition temperature tends to be obtained in the resin composition of the present invention, prepregs and laminates using the same. Moreover, when the number average molecular weight is 14,000 or less, better moldability tends to be obtained when the resin composition of the present invention is used for a laminate.
  • the number average molecular weight is a value calculated from a calibration curve using standard polystyrene by gel permeation chromatography (GPC), and more specifically, the number average molecular weight measurement method described in Examples. This is the value obtained by GPC.
  • the curing accelerator (B) preferably contains at least one selected from the group consisting of organic peroxides, imidazole curing accelerators, and phosphorus curing accelerators. By containing component (B), heat resistance etc. can be further improved. Component (B) may be used alone or in combination of two or more.
  • organic peroxides include, but are not limited to, t-butylperoxyisopropyl monocarbonate, 1,1-di(t-hexylperoxy)cyclohexane, bis(1-phenyl-1-methylethyl)peroxide, and diisopropylbenzene. It is preferable to contain at least one member selected from the group consisting of hydroperoxide and ⁇ , ⁇ '-bis(t-butylperoxy)diisopropylbenzene.
  • imidazole curing accelerators include, but are not limited to, imidazole compounds such as methylimidazole, phenylimidazole, and 2-undecylimidazole; isocyanate masks such as addition reaction products of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; Examples include imidazole.
  • Examples of the phosphorus-based curing accelerator include tertiary phosphines such as triphenylphosphine; and quaternary phosphonium compounds such as tri-n-butylphosphine addition reaction products of p-benzoquinone.
  • thermosetting resin (C) is preferably at least one selected from the group consisting of an epoxy resin, a cyanate resin, and a maleimide compound, and more preferably a maleimide compound. Note that the maleimide compound does not include the polyphenylene ether derivative (A).
  • the epoxy resin is preferably an epoxy resin having two or more epoxy groups.
  • the epoxy resin is classified into glycidyl ether type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, and the like. Among these, glycidyl ether type epoxy resins may be selected.
  • Epoxy resins are classified into various epoxy resins depending on the main skeleton, and in each of the above types of epoxy resins, there are also bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, etc.
  • novolak epoxy resin such as phenol novolak epoxy resin, cresol novolak epoxy resin, bisphenol A novolak epoxy resin, bisphenol F novolak epoxy resin; phenol aralkyl type epoxy resin; stilbene type epoxy resin; dicyclopenta
  • One type of epoxy resin may be used alone, or two or more types may be used in combination.
  • naphthalene skeleton-containing epoxy resins and biphenylaralkyl epoxy resins are preferred from the viewpoints of high frequency properties, heat resistance, glass transition temperature, low thermal expansion, flame retardance, and the like.
  • Cyanate resins are not particularly limited, but include 2,2-bis(4-cyanatophenyl)propane, bis(4-cyanatophenyl)ethane, and bis(3,5-dimethyl-4-cyanatophenyl). Methane, 2,2-bis(4-cyanatophenyl)-1,1,1,3,3,3-hexafluoropropane, ⁇ , ⁇ '-bis(4-cyanatophenyl)-m-diisopropylbenzene, Examples include cyanate compounds of phenol-added dicyclopentadiene polymers, phenol novolak-type cyanate compounds, and cresol novolac-type cyanate compounds.
  • One type of cyanate resin may be used alone, or two or more types may be used in combination.
  • 2,2-bis(4-cyanatophenyl)propane is preferably used from the viewpoint of production cost and overall balance of high frequency properties and other properties.
  • the maleimide compound is not particularly limited, but at least one of a maleimide compound having at least two N-substituted maleimide structure-containing groups and an amino-modified bismaleimide compound is preferred.
  • the maleimide compound is preferably an amino-modified bismaleimide compound from the viewpoints of solubility in organic solvents, high frequency properties, adhesion to conductors, and prepreg moldability.
  • maleimide compounds include, but are not limited to, bis(4-maleimidophenyl)methane, polyphenylmethanemaleimide, bis(4-maleimidophenyl)ether, bis(4-maleimidophenyl)sulfone, 3,3'-dimethyl-5 , 5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide, m-phenylene bismaleimide, 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane , bis(4-maleimidophenyl) sulfide, bis(4-maleimidophenyl)ketone, bis(4-(4-maleimidophenoxy)phenyl)sulfone, 4,4'-bis(3-maleimidophenoxy)biphenyl, 1,6 -bismaleimide-(2,2,4-trimethyl)hexane and
  • Amino-modified bismaleimide compounds are obtained by reacting a bismaleimide compound with an amine compound.
  • the amine compound is not particularly limited, but it has high solubility in organic solvents and a high reaction rate during synthesis.
  • Inorganic filler (D) Inorganic fillers (D) include, but are not limited to, silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, and hydroxide.
  • Component (D) may be used alone or in combination of two or more.
  • the particle diameter refers to the average particle diameter, and refers to the particle diameter at a point corresponding to 50% of the volume when a cumulative frequency distribution curve according to the particle diameter is calculated with the total volume of the particles as 100%. be. It can be measured using a particle size distribution measuring device using a laser diffraction scattering method.
  • a coupling agent in combination for the purpose of improving the dispersibility of component (D) and the adhesion between component (D) and the organic component in the resin composition.
  • the coupling agent is not particularly limited, and for example, various silane coupling agents and titanate coupling agents can be used. These may be used alone or in combination of two or more.
  • flame retardant (E) examples include phosphorus-based flame retardants, metal hydrates, halogen-based flame retardants, and the like.
  • component (E) is preferably at least one selected from the group consisting of phosphorus-based flame retardants and metal hydrates, and it is preferable to use phosphorus-based flame retardants and metal hydrates together. More preferred.
  • the flame retardant (E) may be used alone or in combination of two or more.
  • thermoplastic elastomer (F) examples include styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, acrylic elastomers, silicone elastomers, and derivatives thereof. Among these, styrene elastomers are preferred.
  • Component (F) may be used alone or in combination of two or more.
  • the thermoplastic elastomer (F) may or may not have a reactive functional group at the molecular end or in the molecular chain.
  • the reactive functional group include an epoxy group, a hydroxyl group, a carboxy group, an amino group, an amide group, an isocyanate group, an acrylic group, a methacryl group, and a vinyl group.
  • Styrene-based elastomers include styrene-butadiene-styrene block copolymers (SBS), hydrides of styrene-butadiene-styrene block copolymers (e.g., SEBS, SBBS), and styrene-isoprene-styrene block copolymers (SIS).
  • SBS styrene-butadiene-styrene block copolymers
  • SIS styrene-isoprene-styrene block copolymers
  • SEPS styrene-isoprene-styrene block copolymers
  • SEEPS styrene-(isoprene and butadiene)-styrene block copolymers
  • SMA styrene-maleic anhydride copolymers
  • SEBS styrenic thermoplastic elastomers
  • SEPS styrene-maleic anhydride copolymer
  • SMA acid copolymer
  • SEBS is a styrene-butadiene-styrene block copolymer (SBS) in which all butadiene units are hydrogenated, and is named after the initial letters of styrene-ethylene-butylene-styrene.
  • the SBBS is a styrene-butadiene-styrene block copolymer (SBS) in which the 1,2-bond units in the butadiene units are selectively hydrogenated, and the SBBS is a styrene-(1,4-
  • SBS styrene-(1,4-
  • the name is derived from the initial letters of (butadiene), butylene, and styrene.
  • styrene derivatives such as ⁇ -methylstyrene, 3-methylstyrene, 4-propylstyrene, and 4-cyclohexylstyrene can be used as raw material monomers for the styrene-based elastomer.
  • SEBS is preferred as the styrene elastomer.
  • the content of each component in the thermosetting resin composition is not particularly limited, but may be within the ranges described below, for example.
  • the thermosetting resin composition contains component (A)
  • the content thereof is preferably 2 to 40 parts by mass, more preferably 2 to 40 parts by mass, based on 100 parts by mass of the total amount of resin components in the thermosetting resin composition.
  • the amount is 5 to 35 parts by weight, more preferably 10 to 30 parts by weight.
  • the content of component (A) is equal to or higher than the lower limit, the dielectric constant tends to be excellent.
  • heat resistance, moldability, and processability tend to be excellent.
  • the content is preferably 0.1 to 10 parts by mass, more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the total amount of resin components in the thermosetting resin composition.
  • the amount is preferably 0.3 to 5 parts by weight, more preferably 0.5 to 3 parts by weight.
  • the content of component (B) is within the above range, good heat resistance, storage stability, and moldability tend to be obtained.
  • the thermosetting resin composition contains component (C)
  • the content is preferably 10 to 90 parts by mass, more preferably 10 to 90 parts by mass, based on 100 parts by mass of the total amount of resin components in the thermosetting resin composition.
  • the amount is 20 to 85 parts by weight, more preferably 30 to 70 parts by weight.
  • thermosetting resin composition contains component (D)
  • the content thereof is preferably 30 to 200 parts by mass, more preferably 30 to 200 parts by mass, based on 100 parts by mass of the total amount of resin components in the thermosetting resin composition.
  • the amount is 40 to 150 parts by weight, more preferably 45 to 120 parts by weight, particularly preferably 60 to 100 parts by weight.
  • the content of component (D) is equal to or higher than the lower limit, low thermal expansion properties tend to be excellent.
  • heat resistance, fluidity and moldability tend to be excellent.
  • thermosetting resin composition contains component (E), the content thereof is preferably 2 to 40 parts by mass, more preferably 2 to 40 parts by mass, based on 100 parts by mass of the total amount of resin components in the thermosetting resin composition.
  • the amount is 5 to 35 parts by weight, more preferably 10 to 30 parts by weight.
  • the content of component (E) is at least the lower limit, sufficient flame retardancy tends to be obtained.
  • the thermosetting resin composition contains component (F)
  • the content thereof is preferably 1 to 40 parts by mass, more preferably 1 to 40 parts by mass, based on 100 parts by mass of the total amount of resin components in the thermosetting resin composition.
  • the amount is 3 to 30 parts by weight, more preferably 5 to 25 parts by weight.
  • the content of component (F) is equal to or higher than the lower limit, the dielectric constant tends to be excellent.
  • it is below the upper limit good heat resistance, moldability, workability, and flame retardancy tend to be obtained.
  • thermosetting resin composition may further contain colorants, antioxidants, reducing agents, ultraviolet absorbers, optical brighteners, adhesion improvers, organic fillers, etc., within a range that does not impair the effects of the present embodiment. It may also contain other ingredients. Each of these may be used alone or in combination of two or more.
  • organic solvent The resin composition of the present invention preferably contains an organic solvent to adjust the solid content concentration from the viewpoint of dielectric properties, ease of handling, and ease of manufacturing the prepreg described below.
  • organic solvents include alcohol solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether solvents such as tetrahydrofuran; toluene,
  • aromatic solvents such as xylene and mesitylene
  • nitrogen atom-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone
  • sulfur atom-containing solvents such as dimethyl sulfoxide
  • ester solvents such as ⁇ -butyrolactone.
  • the prepreg is obtained by, for example, impregnating or coating a sheet-like reinforcing base material with the thermosetting resin composition, and semi-curing (B stage) by heating or the like.
  • B-staging refers to making a B-stage state defined in JIS K6900 (1994).
  • the thermosetting resin composition may be in the form of a varnish diluted with an organic solvent such as methyl ethyl ketone.
  • the concentration of nonvolatile matter in the varnish is, for example, 40 to 80% by mass, preferably 50 to 75% by mass.
  • the drying conditions after impregnation are not particularly limited, but the heating temperature is preferably 120 to 200°C, more preferably 140 to 180°C, and the heating time is preferably 30 seconds to 30 minutes, more preferably 1 to 10 minutes. It is a minute.
  • the prepreg sheet-like reinforcing base material well-known materials used in various electrically insulating material laminates can be used.
  • Materials for the sheet-like reinforcing base material include natural fibers such as paper and cotton linters; inorganic fibers such as glass fiber and asbestos; organic fibers such as aramid, polyimide, polyvinyl alcohol, polyester, tetrafluoroethylene, and acrylic; mixtures thereof. Examples include. Among these, glass fiber is preferred from the viewpoint of flame retardancy.
  • the glass fiber base material include glass cloth using E glass, C glass, D glass, S glass, etc.; glass cloth made by bonding short fibers with an organic binder; and a mixture of glass fiber and cellulose fiber. .
  • These sheet-like reinforcing base materials have a shape such as a woven fabric, a non-woven fabric, a raw binder, a chopped strand mat, or a surfacing mat.
  • the material and shape are selected depending on the purpose, performance, etc. of the intended molded product, and one type can be used alone, or two or more types of materials and shapes can be combined as necessary.
  • the thickness of the prepreg is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably 0.05 to 0.2 mm, from the viewpoint of moldability and enabling high-density wiring. It is.
  • the thickness of the insulating layer included in the copper-clad laminate is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably is 0.05 to 0.2 mm.
  • the copper-clad laminate of this embodiment is a laminate containing the prepreg of the present invention and metal foil.
  • the laminate of the present invention can be manufactured, for example, by laminating the prepreg obtained by the prepreg manufacturing method of the present invention and metal foil, and curing the prepreg by heating and pressurizing using a pressing method.
  • the metal of the metal foil is not particularly limited as long as it is used for electrical insulating materials, but from the viewpoint of conductivity copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium , chromium, or an alloy containing at least one of these metal elements, preferably copper or aluminum, and preferably copper.
  • the conditions for heat and pressure molding are not particularly limited, but for example, it may be carried out at a temperature of 100 to 300°C, a pressure of 0.2 to 10.0 MPa, and a time of 0.1 to 5 hours. can. Further, the heating and pressure molding can be carried out by using a vacuum press or the like and maintaining a vacuum state for 0.5 to 5 hours.
  • the printed wiring board of this embodiment is a printed wiring board having the copper-clad laminate of this embodiment.
  • the printed wiring board of this embodiment can be manufactured by performing circuit processing on the copper foil of the copper-clad laminate of this embodiment. For circuit processing, for example, after forming a resist pattern on the surface of the copper foil, removing unnecessary parts of the copper foil by etching, removing the resist pattern, forming the necessary through holes with a drill, forming the resist pattern again, This can be done by applying plating to make the through holes conductive, and finally removing the resist pattern.
  • a multilayer printed wiring board can be obtained by repeating the steps of laminating a copper clad laminate on the surface of the obtained printed wiring board under the same conditions as described above and processing the circuit as many times as necessary.
  • the semiconductor package of this embodiment is a semiconductor package that includes the printed wiring board of this embodiment and a semiconductor element.
  • the semiconductor package of this embodiment can be manufactured by mounting semiconductor elements such as semiconductor chips and memories at predetermined positions on the printed wiring board of this embodiment.
  • the copper-clad laminate, printed wiring board, and semiconductor package of this embodiment have excellent heat resistance and low transmission loss, so they can be suitably used for electronic equipment that handles high-frequency signals of 10 GHz or higher, for example.
  • Copper foil 1 or copper foil 2 listed in Table 1 is installed on both sides of the prepreg produced in Production Example 1 (however, the copper foils installed on both sides of the prepreg are the same. In other words, "Copper foil 1/Prepreg” / copper foil 1" mode or “copper foil 2/prepreg/copper foil 2" mode), and then laminated and integrated at a temperature of 185°C, a pressure of 3.9 MPa, and a time of 60 minutes. By doing so, a double-sided copper-clad laminate (thickness: 0.1 mm) was produced. Next, using a drill with a diameter of 0.15 mm, a through hole was made in the double-sided copper-clad laminate produced above.
  • a double-sided copper-clad laminate with through holes was plated with copper to connect the front and back sides, and then the copper foil on the surface of the double-sided copper-clad laminate was removed by etching to form a desired circuit pattern.
  • a high frequency probe "ACP65-A-GSG250" manufactured by Form Factor
  • a network analyzer "N5227A” connected via a coaxial cable "SUCOFLEX102” (manufactured by HUBER+SUHNER) ” (manufactured by Keysight Technologies, Inc.) and measured the transmission loss when passing through the transmission line.
  • the results are shown in FIG. 1, and the transmission loss at a frequency of 80 GHz is shown in Table 2. Note that the transmission loss is a negative value, and the smaller the absolute value, the smaller the transmission loss.
  • peel strength of copper foil> Using the two-layer copper-clad laminate produced in the example or comparative example, the peel strength of the copper foil (adhesion strength between the copper foil and the insulating layer) was measured in accordance with IPC-TM-650 2.4.8C. did.
  • Production example 1 (preparation of prepreg) In producing the prepreg, first, each component shown below was prepared.
  • Component (A) polyphenylene ether derivative produced by the following method In a reaction vessel equipped with a thermometer, a stirring device, and a moisture meter with a reflux condenser, polyphenylene ether compound "XYRON (registered trademark) S202A" (manufactured by Asahi Kasei Chemicals Co., Ltd.) was placed. ), 1.3 parts by mass of p-aminophenol, 2 parts by mass of t-butylperoxyisopropyl monocarbonate, 1.5 parts by mass of manganese octylate, 530 parts by mass of toluene and 28 parts by mass of propylene glycol monomethyl ether, The reaction was carried out at 90°C for 6 hours.
  • component (A) 100 parts by mass of component (A), 4 parts by mass of each component (B), 310 parts by mass of component (C), 518 parts by mass of component (D), and component (E) (dialkyl phosphinate aluminum salt) and 46 parts by mass of the phosphorus flame retardant 2) and 112 parts by mass of component (F) (13 parts by mass of styrenic elastomer 1 and 99 parts by mass of styrene elastomer 2), and further added toluene.
  • a resin varnish was prepared by adding 206 parts by weight and 36 parts by weight of cyclohexanone.
  • a prepreg was obtained by impregnating glass cloth (thickness: 0.080 mm) of IPC standard #2013 with each of the obtained resin varnishes and drying at 160° C. for about 5 minutes.
  • Example 1 and Comparative Example 1 (Production of copper-clad laminate)
  • a two-layer copper-clad laminate and a four-layer copper-clad laminate were produced by the method shown below.
  • Copper foil shown in Table 1 was layered on both sides of a sheet of prepreg, with the metal treatment layer facing the prepreg side, and heat and pressure molded for 60 minutes at a temperature of 200°C and a pressure of 40 kgf/cm 2 (3.90 MPa). Then, a two-layer copper-clad laminate was produced. Using the two-layer copper-clad laminate, the peel strength of the copper foil was measured. The results are shown in Table 2.
  • one sheet of prepreg was layered on the copper foil on both sides of the double-sided copper-clad laminate as a core material, and then the copper foil shown in Table 1 was placed on each prepreg so that the metal treatment layer was on the prepreg side. I put one on top of the other. Thereafter, a four-layer copper-clad laminate was produced by heating and press-molding at a temperature of 200° C. and a pressure of 30 kgf/cm 2 (2.90 MPa) for 80 minutes. Each evaluation was performed using the four-layer copper-clad laminate. The results are shown in Table 2.
  • Table 2 shows that the copper-clad laminate of Example 1 using the surface-treated copper foil (I) of this embodiment has excellent heat resistance and low transmission loss.
  • the copper-clad laminate of Example 1 has excellent peel strength of the copper foil (adhesion strength between the copper foil and the insulating layer) and peel strength between the prepreg layers (adhesion strength between the inner layer copper foil and the prepreg). There is also a tendency for the strength to improve.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un stratifié recouvert de cuivre qui présente une excellente résistance à la chaleur et réduit la perte de transmission, une carte nue ayant le stratifié recouvert de cuivre, et un boîtier à semi-conducteurs. Spécifiquement, la présente invention concerne un stratifié recouvert de cuivre ou similaire qui comprend une couche isolante contenant une résine, et une feuille de cuivre disposée sur au moins une surface de la couche isolante. La feuille de cuivre est une feuille de cuivre à surfaces traitées qui a une rugosité de surface Rz de 0,30 à 0,60 µm sur sa surface opposée à la couche isolante, et qui a une couche de traitement de métal contenant du silicium de 80 à 300 μg/dm2.
PCT/JP2023/023907 2022-07-04 2023-06-28 Stratifié recouvert de cuivre, carte nue et boîtier à semi-conducteurs WO2024009861A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010202891A (ja) * 2009-02-27 2010-09-16 Nippon Steel Chem Co Ltd 表面処理銅箔及びその製造方法
JP2016056452A (ja) * 2012-03-29 2016-04-21 Ｊｘ金属株式会社 表面処理銅箔
WO2020017551A1 (fr) * 2018-07-18 2020-01-23 日立化成株式会社 Stratifié cuivré, carte de circuit imprimé, boîtier de semi-conducteur et procédé de production de stratifié cuivré
WO2021132191A1 (fr) * 2019-12-26 2021-07-01 ナミックス株式会社 Élément en cuivre composite traité à l'aide d'un agent de couplage au silane

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010202891A (ja) * 2009-02-27 2010-09-16 Nippon Steel Chem Co Ltd 表面処理銅箔及びその製造方法
JP2016056452A (ja) * 2012-03-29 2016-04-21 Ｊｘ金属株式会社 表面処理銅箔
WO2020017551A1 (fr) * 2018-07-18 2020-01-23 日立化成株式会社 Stratifié cuivré, carte de circuit imprimé, boîtier de semi-conducteur et procédé de production de stratifié cuivré
WO2021132191A1 (fr) * 2019-12-26 2021-07-01 ナミックス株式会社 Élément en cuivre composite traité à l'aide d'un agent de couplage au silane

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