WO2020124477A1 - 压力感应装置、压力感应方法及电子终端 - Google Patents

压力感应装置、压力感应方法及电子终端 Download PDF

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Publication number
WO2020124477A1
WO2020124477A1 PCT/CN2018/122314 CN2018122314W WO2020124477A1 WO 2020124477 A1 WO2020124477 A1 WO 2020124477A1 CN 2018122314 W CN2018122314 W CN 2018122314W WO 2020124477 A1 WO2020124477 A1 WO 2020124477A1
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WIPO (PCT)
Prior art keywords
pressure
pressure sensing
sensing device
substrate
sensor
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PCT/CN2018/122314
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English (en)
French (fr)
Inventor
李灏
林学朋
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深圳纽迪瑞科技开发有限公司
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Application filed by 深圳纽迪瑞科技开发有限公司 filed Critical 深圳纽迪瑞科技开发有限公司
Priority to US17/416,384 priority Critical patent/US11940337B2/en
Priority to CN201880100307.5A priority patent/CN113227954A/zh
Priority to PCT/CN2018/122314 priority patent/WO2020124477A1/zh
Publication of WO2020124477A1 publication Critical patent/WO2020124477A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • G01L1/2262—Measuring circuits therefor involving simple electrical bridges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Definitions

  • the invention belongs to the technical field of pressure sensing, and relates to a pressure sensing device, a pressure sensing method using the pressure sensing device, and an electronic terminal with the pressure sensing device.
  • the pressure sensor is a device that can sense the pressure signal and convert the pressure signal into a usable output electrical signal according to a certain rule.
  • the pressure-sensing device mainly composed of strain gauges on the market, such as a typical electronic scale, requires relatively large structural space and low sensitivity.
  • the purpose of the present invention is to provide a pressure sensing device, a pressure sensing method and an electronic terminal, in order to solve the technical problem that the pressure sensing device in the prior art requires relatively large structural space and low sensitivity.
  • An embodiment of the present invention provides a pressure sensing device, which includes a substrate for resisting an object to be measured, and a pressure sensor provided on the substrate; the pressure sensor includes at least one thin film piezoresistive sensor and at least four The signal lines drawn from the four corners of the thin film piezoresistive sensor, one side of the thin film piezoresistive sensor is attached to the substrate and the resistivity distribution of the thin film piezoresistive sensor follows when the substrate is deformed The deformation changes and the two opposite signal lines are the power line and the ground line respectively, and the other two opposite signal lines are the differential lines; by detecting the voltage drop between the two differential lines to detect Measure the pressure of the object.
  • An embodiment of the present invention provides a pressure sensing method using the above pressure sensing device, including the following steps:
  • the thin film piezoresistive sensor is equivalent to a first equivalent circuit
  • the first equivalent circuit includes an electric bridge circuit having two pairs of bridge arms, a first resistor connected between the two differential lines, and A second resistor connected between the power line and the ground line, two ends of the bridge circuit are respectively connected to the power line and the ground line, and the other two ends of the bridge circuit are respectively Connected to the two differential lines;
  • the second resistor in the first equivalent circuit has negligible influence on the signal quantity, and the second resistor is deleted to obtain a second equivalent circuit;
  • the second equivalent circuit includes an electric bridge with two pairs of bridge arms A circuit and a first resistor connected between the two differential lines, two ends of the bridge circuit are respectively connected to the power line and the ground line, and the other two ends of the bridge circuit are respectively Connected to the two differential lines;
  • An embodiment of the present invention provides an electronic terminal, including an object to be measured, the above-mentioned pressure sensing device, and a pressure sensing detection circuit electrically connected to the pressure sensor, and the substrate is pressed against the object to be tested.
  • the pressure sensor used is a thin-film piezoresistive sensor with a certain area, and the power line, the ground wire and the two differential lines are respectively drawn out at the ends of the thin-film piezoresistive sensor, and the pressure sensors are arranged and distributed on the substrate.
  • the pressure sensor has the advantages of small area, small initial pressure difference, high sensitivity, small temperature drift, strong anti-interference ability, high anti-drop coefficient, and stable reliability.
  • the substrate is simply pressed against the object under pressure.
  • the pressure sensor is connected to the pressure sensing detection circuit.
  • the object is deformed by the pressure.
  • the substrate produces a deformation.
  • the thin film piezoresistive sensor follows the deformation, by detecting between the two differential lines To detect the deformation of the substrate, convert the pressure of the measured object, and realize the pressure-sensitive touch function.
  • the pressure sensing method using the pressure sensing device and the electronic terminal with the pressure sensing device can realize the pressure sensing touch function.
  • FIG. 1 is a front view of a pressure sensing device provided by an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of an electronic terminal provided by an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of an electronic terminal provided by another embodiment of the present invention.
  • FIG. 4 is a first equivalent circuit diagram of a thin film piezoresistive sensor used in the pressure sensing device of FIG. 1;
  • FIG. 5 is a second equivalent circuit diagram equivalent to the first equivalent circuit of FIG. 4;
  • FIG. 6 is a graph showing the change of the equivalent resistance of the second equivalent circuit of FIG. 5 after the object under test is pressed;
  • FIG. 7 is a third equivalent circuit diagram obtained by equating the second equivalent circuit of FIG. 5;
  • Figure 9 is a simulation diagram of the voltage drop between the two differential lines when the bridge arms Rm1 and Rm2 change.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • the terms “installation”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or may be Disassembly connection or integration; it can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediary, it can be the connection between two components or the interaction between two components.
  • An embodiment of the present invention provides a pressure sensing device 100.
  • the pressure sensing device 100 includes a substrate 10 for resisting an object under test 200 and a pressure sensor 20 provided on the substrate 10 ;
  • the pressure sensor 20 includes at least one thin film piezoresistive sensor 21 and at least four signal lines drawn from the four corners of the thin film piezoresistive sensor 21, one side of the thin film piezoresistive sensor 21 is attached to the substrate 10 and on the substrate 10 During the deformation, the resistivity distribution of the thin film piezoresistive sensor 21 changes along with the deformation.
  • the two opposite signal lines are the power line VCC and the ground line GND, and the other two opposite signal lines are the differential lines Vm+ and Vm-;
  • the voltage drop ⁇ V between the two differential lines Vm+ and Vm- to detect the pressure of the object under test 200.
  • the pressure sensor 20 used is a thin film piezoresistive sensor 21 with a certain area, and the power line VCC, the ground GND and the two differential lines Vm+ and Vm- are respectively drawn out at the end of the thin film piezoresistive sensor 21. ⁇ 10 ⁇ 10 to the substrate.
  • the pressure sensor 20 has the advantages of small area, small initial pressure difference, high sensitivity, small temperature drift, strong anti-interference ability, high anti-drop coefficient, and stable reliability.
  • the base material 10 is simply pressed against the object 200 under pressure, the pressure sensor 20 is connected to the pressure sensing detection circuit, the object 200 is deformed by the pressure, and the substrate 10 generates a deformation.
  • the thin film piezoresistive sensor 21 follows the deformation and passes the detection
  • the voltage drop ⁇ V between the two differential lines Vm+ and Vm- is used to detect the deformation of the substrate 10, convert the pressure of the object under test 200, and realize the pressure-sensitive touch function.
  • the object under test 200 may be a panel or a side of a mobile phone or other.
  • the base material 10 has a long shape, and the pressure sensor 20 is provided on the base material 10, which can reduce consumables.
  • the elongated substrate 10 has two outer edges 10a and two inner edges 10b located inside the two outer edges 10a.
  • the thin film piezoresistive sensor 21 of the pressure sensor 20, the signal line and the pad 22 at the end of the signal line are located in the area between the two inner edges 10b, and the structure is compact.
  • the base material 10 is a circuit board, and the pressure sensor 20 is mounted on the circuit board, which is easy to assemble, so that the thin film piezoresistive sensor 21 follows the deformation of the base material 10.
  • the circuit board has circuit traces connected to the pressure sensing detection circuit to perform signal processing and realize pressure touch control.
  • the pressure sensor 20 may be an NDT pressure sensor.
  • the thin film piezoresistive sensor 21 of the pressure sensor 20 has an integrated structure with a certain area.
  • the curvature of the thin-film piezoresistive sensor 21 in the long-side direction increases due to the influence of the tangential strain force, and the curvature of the thin-film piezoresistive sensor 21 in the short-side direction does not change significantly.
  • the characteristics of the pressure sensor 20 that is, the characteristics of the resistance, the resistance curvature becomes larger and the resistance value increases; the resistance curvature becomes smaller and the resistance value decreases.
  • the object under test 200 is deformed by the pressure, and the base material 10 generates a deformed thin film piezoresistive sensor 21 to follow the deformation.
  • the voltage drop ⁇ V between the two differential lines Vm+ and Vm- is used as the signal quantity, and the pressure of the object under test 200 is obtained after data processing by the pressure sensing detection circuit.
  • the pressure sensing device 100 can be made relatively small and compact in structure, and can be applied to different pressure sensing occasions.
  • the width of the pressure sensing device 100 can be 2 mm or more.
  • the number of pressure sensors 20 is one; when using multiple channels, the number of pressure sensors 20 is at least two, and the pressure sensors 20 are arranged in an array or Uneven distribution.
  • the pressure-sensing device 100 is in the shape of a long strip, and will undergo one-dimensional deformation after being pressed.
  • the thin film piezoresistive sensor 21 may be any type of strain sensor, including polycrystalline or amorphous semiconductor materials, polycrystalline silicon, graphene, copper-nickel alloy, Carbon nanotubes, metal thin wires, and conductor insulator composite materials. All of the above solutions can achieve pressure sensing.
  • the thin film piezoresistive sensor 21 is a pressure sensor with a certain area, which may be a regular polygon, an irregular polygon, an ellipse, a circle, and the like. All of the above solutions can achieve pressure sensing.
  • the present invention is illustrated by taking a square resistor as an example.
  • the substrate 10 is a printed circuit board 11, and the ends of the four signal lines are connected to the printed circuit board 11; the pressure sensor 20 is printed to Printed circuit board 11.
  • the printed circuit board 11 may be a paper substrate, a metal substrate, a composite substrate, a glass cloth substrate, a ceramic substrate, or the like.
  • the base material 10 includes a flexible circuit board 12 and a reinforcing sheet 13 provided on the flexible circuit board 12. The ends of the four signal lines are connected to the flexible circuit board 12.
  • the pressure sensor 20 is printed onto the flexible circuit board 12.
  • the reinforcing sheet 13 may be a stainless steel sheet, a glass fiber epoxy resin copper-clad sheet (FR-4), an aluminum sheet, or other materials with certain rigidity. Both of the above solutions are easy to assemble, so that the thin film piezoresistive sensor 21 follows the deformation of the base material 10 and is selected as needed.
  • the signal line may be various conductors, such as Cu (copper), Ni (nickel), Ag (silver), Au ( Metals or metal compounds such as gold) may also be C (carbon) powder or conductive nanotubes, or oxide powder.
  • a side of the base material 10 facing away from the pressure sensor 20 is provided with a glue for bonding with the object under test 200 30.
  • the use of the gel 30 facilitates the assembly of the pressure sensing device 100 against the surface of the object under test 200.
  • the colloid 30 may be VHB tape or other colloids.
  • the width of the pressure sensing device 100 is greater than or equal to 1 mm.
  • the pressure sensing device 100 can be applied to a situation where the space is relatively small (less than 1 mm).
  • one side of the thin film piezoresistive sensor 21 and the arrangement direction of the pressure sensor 20 are parallel to each other.
  • the structure is compact and takes up little space.
  • the thin film piezoresistive sensor 21 can be equivalent to the following first equivalent circuit, second equivalent circuit, and third equivalent circuit, and the longitudinal direction and pressure of the bridge arms Rm1, Rm2 in the first equivalent circuit
  • the arrangement directions of the sensors 20 are parallel to each other, and the longitudinal directions of the bridge arms Rf1 and Rf2 are perpendicular to the arrangement direction of the pressure sensors 20.
  • the deformation direction of the pressure sensor 20 and the longitudinal direction of the pressure sensing device 100 are parallel to each other.
  • the pressure-sensing device 100 is in the shape of a long strip, and will undergo one-dimensional deformation after being pressed.
  • the thin-film piezoresistive sensor 21 can be equivalent to the following first equivalent circuit, second equivalent circuit, and third equivalent circuit.
  • the longitudinal direction of the signal line and the arrangement direction of the pressure sensors 20 are parallel to each other. The structure is compact and takes up little space.
  • an embodiment of the present invention provides a pressure sensing method, which uses the pressure sensing device 100 of any of the above embodiments, including the following steps:
  • the thin film piezoresistive sensor 21 leads out four lines at four corners, and there is a certain impedance between each two lines.
  • the thin film piezoresistive sensor 21 is equivalent to the first equivalent circuit (shown in FIG. 4).
  • the first equivalent circuit includes two The bridge circuit to the bridge arm, the first resistor Rx connected between the two differential lines Vm+, Vm-, and the second resistor Ry connected between the power line VCC and the ground line GND, two of the bridge circuits The terminal is connected to the power line VCC and the ground line GND, and the other two ends of the bridge circuit are respectively connected to the two differential lines Vm+ and Vm-;
  • the second resistance in the first equivalent circuit Ry is deleted to obtain a second equivalent circuit (shown in FIG. 5);
  • the second equivalent circuit includes a bridge circuit with two pairs of bridge arms, and a first resistor Rx connected between the two differential lines Vm+ and Vm- , The two ends of the bridge circuit are respectively connected to the power line VCC and the ground line GND, and the other two ends of the bridge circuit are respectively connected to the two differential lines Vm+ and Vm-;
  • the voltage drop ⁇ V between the two differential lines Vm+ and Vm- is used as the signal amount
  • the second resistor Ry is connected between the power supply line VCC and the ground line GND. Since the signal amount is equal to the difference between the potentials of the two differential lines Vm+ and Vm-, the resistance value of the second resistor Ry changes without affecting the signal amount. Therefore, the second resistor Ry can be deleted and the first equivalent circuit can be equivalent to the second equivalent circuit.
  • the delta-shaped circuit composed of the first resistor Rx in the second equivalent circuit and the two bridge arms Rf1 and Rm2 connected to the power supply line VCC is equivalent to a Y-shaped circuit to obtain a third equivalent circuit ( Figure 7) );
  • the width of the pressure sensing device 100 can be 2 mm or more.
  • the pressure sensor 20 used is a thin film piezoresistive sensor 21 with a certain area, and the power line VCC, ground GND and GND The two differential lines Vm+ and Vm-, and the pressure sensor 20 are provided on the base material 10.
  • the pressure sensor 20 has the advantages of small area, small initial pressure difference, high sensitivity, small temperature drift, strong anti-interference ability, high anti-drop coefficient, and stable reliability.
  • the base material 10 is simply pressed against the object 200 under pressure, the pressure sensor 20 is connected to the pressure sensing detection circuit, the object 200 is deformed by the pressure, and the substrate 10 generates a deformation.
  • the thin film piezoresistive sensor 21 follows the deformation and passes the detection
  • the voltage drop ⁇ V between the two differential lines Vm+ and Vm- is used to detect the deformation of the substrate 10, convert the pressure of the object under test 200, and realize the pressure-sensitive touch function.
  • the pressure sensing method using the pressure sensing device 100 can realize the pressure sensitive touch function.
  • the pressure sensing method provided by the present invention, please refer to FIG. 4, in the first equivalent circuit, two pairs of bridge arms of the bridge circuit, one of the bridge arms is denoted as Rf1 Rf2, the other pair of bridge arms are denoted as Rm1, Rm2, the first resistance is denoted as Rx, and the second resistance is denoted as Ry; the longitudinal direction of the bridge arms Rm1, Rm2 and the arrangement direction of the pressure sensor 20 are parallel to each other, the bridge arm Rf1 The longitudinal direction of Rf2 and the arrangement direction of the pressure sensor 20 are perpendicular to each other;
  • the three equivalent resistances of the Y-shaped circuit in the third equivalent circuit are respectively denoted as Ra, Rb, and Rc; comparing the voltage-current relationship between the delta-shaped circuit and the Y-shaped circuit, we can obtain:
  • ⁇ [ ⁇ V, Rm1] is a positive number.
  • ⁇ V is a monotonically increasing function of Rm1.
  • ⁇ [ ⁇ V, Rm2] is a positive number.
  • ⁇ V is a monotonically increasing function of Rm2.
  • ⁇ [ ⁇ V, Rf1] is a negative number.
  • ⁇ V is a monotonically decreasing function of Rf1.
  • ⁇ [ ⁇ V, Rf2] is a negative number.
  • ⁇ V is a monotonically decreasing function of Rf2.
  • FIG. 6 is a graph showing the change of the equivalent resistance of the second equivalent circuit after the object under test 200 is pressed.
  • the above voltage drop formula also has Rx variable, and the change of Rx has little effect on the voltage drop ⁇ V.
  • an embodiment of the present invention provides an electronic terminal, including an object under test 200, the pressure sensing device 100 of any of the above embodiments, and a pressure sensing detection circuit electrically connected to the pressure sensor 20, a substrate 10 offsets on the object under test 200.
  • the width of the pressure sensing device 100 can be 2 mm or more.
  • the pressure sensor 20 used is a thin film piezoresistive sensor 21 with a certain area, and the power line VCC, ground GND and GND The two differential lines Vm+ and Vm-, and the pressure sensor 20 are provided on the base material 10.
  • the pressure sensor 20 has the advantages of small area, small initial pressure difference, high sensitivity, small temperature drift, strong anti-interference ability, high anti-drop coefficient, and stable reliability.
  • the base material 10 is simply pressed against the object 200 under pressure, the pressure sensor 20 is connected to the pressure sensing detection circuit, the object 200 is deformed by the pressure, and the substrate 10 generates a deformation.
  • the thin film piezoresistive sensor 21 follows the deformation and passes the detection
  • the voltage drop ⁇ V between the two differential lines Vm+ and Vm- is used to detect the deformation of the substrate 10, convert the pressure of the object under test 200, and realize the pressure-sensitive touch function.
  • the electronic terminal with the pressure sensing device 100 can realize the pressure sensitive touch function.
  • the pressure sensing detection circuit serves as a signal processing circuit, analyzes and processes the electrical signal of the pressure sensor 20, and transmits it to the main controller of the electronic terminal together with the touch position information detected by the panel. Therefore, the precise pressure of the touch is obtained while the touch position is recognized.
  • the pressure sensing detection circuit is used to detect the electrical signal obtained by the pressure sensing component, and process and analyze the electrical signal.
  • the thin-film piezoresistive sensor 21 of the pressure sensor 20 is connected to the pressure-sensing detection circuit through a signal line.
  • the signal line only describes the combination of the thin-film piezoresistive sensor 21 and the pressure-sensing detection circuit.
  • the pressure sensor 20 It can also be directly or indirectly electrically connected to the detection circuit in other ways.
  • the pressure sensing detection circuit can be used as a control center, which receives the control information transmitted by the pressure sensor 20, and then controls the electronic terminal, etc., which is generally described as a combination of hardware and software with various processing methods.
  • the hardware and software are configured to communicate the control information input by the pressure sensor 20 through feedback or a system associated with the customer and perform additional related tasks or functions.
  • the pressure-sensing detection circuit can be implemented as a general-purpose processor, content-addressable memory, digital signal processor, digital-to-analog conversion switch, programmable logic device, discrete hardware component, or other combinations; at the same time, it is also embedded with a pressure touch screen / Algorithm and software information related to pressure sensing system.
  • the hardware and software in the pressure sensing detection circuit are configured to perform various functions, technologies, feedback, and processing tasks associated with the customer's system.
  • the object under test 200 is a panel or a frame. Realize the pressure-sensitive touch function of the panel or frame.

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

压力感应装置(100)包括基材(10)及压力传感器(20)，所使用的压力传感器(20)为具有一定面积的薄膜压阻传感器(21)，并在薄膜压阻传感器(21)的端部分别引出电源线VCC、地线GND与两条差分线Vm+、Vm-，压力传感器(20)设于基材(10)。该压力传感器(20)具有面积小，初始压差小，灵敏度高，温漂小，抗干扰能力强，抗跌系数高，可靠性稳定等优点。将基材(10)简单相抵到承受压力的被测物件(200)上，压力传感器(20)接上压力感应检测电路，被测物件(200)受到压力产生形变，基材(10)产生形变薄膜压阻传感器(21)跟随形变，通过检测两条差分线Vm+、Vm-之间的电压降以检测基材(10)的形变，换算得到被测物件(200)的压力，实现压感触控功能。应用该压力感应装置(100)的压力感应方法、具有该压力感应装置(100)的电子终端均能实现压感触控功能。

Description

压力感应装置、压力感应方法及电子终端 技术领域
本发明属于压力感应技术领域，涉及压力感应装置、采用该压力感应装置的压力感应方法及具有该压力感应装置的电子终端。
背景技术
压力传感器是能感受压力信号，并能按照一定的规律将压力信号转换成可用的输出的电信号的装置。目前，市场上主要由应变片组成的压感装置，比如典型的电子秤，对结构空间要求相对较大，灵敏度不高。
技术问题
本发明的目的在于提供压力感应装置、压力感应方法及电子终端，以解决现有技术中压感装置对结构空间要求相对较大、灵敏度不高的技术问题。
技术解决方案
本发明实施例提供一种压力感应装置，包括用于与被测物件相抵的基材、及设于所述基材的压力传感器；所述压力传感器包括至少一块薄膜压阻传感器及至少四条分别由所述薄膜压阻传感器的四个角部引出的信号线，所述薄膜压阻传感器的一侧面附着于所述基材且在所述基材形变时所述薄膜压阻传感器的电阻率分布跟随形变而改变，其中两条相对的所述信号线分别为电源线和地线，另外两条相对的所述信号线为差分线；通过检测两条所述差分线之间的电压降以检测被测物件的压力。
本发明实施例提供一种压力感应方法，其采用上述的压力感应装置，包括以下步骤：
将所述基材相抵在被测物件上；
将所述薄膜压阻传感器等效为第一等效电路，所述第一等效电路包括具有两对桥臂的电桥电路、连接于两条所述差分线之间的第一电阻、及连接于所述电源线和所述地线之间的第二电阻，所述电桥电路的其中两端分别连接于所述电源线和所述地线，所述电桥电路的另外两端分别连接于两条所述差分线；
所述第一等效电路中的所述第二电阻对信号量影响可忽略，删除所述第二电阻得到第二等效电路；所述第二等效电路包括具有两对桥臂的电桥电路、及连接于两条所述差分线 之间的第一电阻，所述电桥电路的其中两端分别连接于所述电源线和所述地线，所述电桥电路的另外两端分别连接于两条所述差分线；
将所述第二等效电路中的所述第一电阻及与所述电源线相连接的两个所述桥臂组成的△形电路等效为Y形电路，得到第三等效电路；
根据基尔霍夫定律得到Y形电路的中心点的电压方程、两条所述差分线的电压方程；进而得到两条所述差分线之间的电压降公式；通过所述电压降公式经过换算得到所述基材的形变，换算得到被测物件的压力。
本发明实施例提供一种电子终端，包括被测物件、上述的压力感应装置、及与所述压力传感器电连接的压力感应检测电路，所述基材相抵在所述被测物件上。
有益效果
所使用的压力传感器为具有一定面积的薄膜压阻传感器，并在薄膜压阻传感器的端部分别引出电源线、地线与两条差分线，压力传感器排列分布于基材。该压力传感器具有面积小，初始压差小，灵敏度高，温漂小，抗干扰能力强，抗跌系数高，可靠性稳定等优点。将基材简单相抵到承受压力的被测物件上，压力传感器接上压力感应检测电路，被测物件受到压力产生形变，基材产生形变薄膜压阻传感器跟随形变，通过检测两条差分线之间的电压降以检测基材的形变，换算得到被测物件的压力，实现压感触控功能。应用该压力感应装置的压力感应方法、具有该压力感应装置的电子终端均能实现压感触控功能。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的压力感应装置的主视图；
图2为本发明实施例提供的电子终端的剖视图；
图3为本发明另一实施例提供的电子终端的剖视图；
图4为图1的压力感应装置中应用的薄膜压阻传感器的第一等效电路图；
图5为由图4的第一等效电路等效得到的第二等效电路图；
图6为图5的第二等效电路在被测物件按压后的等效电阻变化图；
图7为由图5的第二等效电路等效得到的第三等效电路图；
图8是两条差分线之间电压降在第一电阻Rx变化时的仿真图；
图9是两条差分线之间电压降在桥臂Rm1和Rm2变化时的仿真图。
本发明的实施方式
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
在本发明实施例的描述中，需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明实施例的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明实施例中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明实施例中的具体含义。
请一并参阅图1至图3，本发明实施例提供一种压力感应装置100，压力感应装置100包括用于与被测物件200相抵的基材10、及设于基材10的压力传感器20；压力传感器20包括至少一块薄膜压阻传感器21及至少四条分别由薄膜压阻传感器21的四个角部引出的信号线，薄膜压阻传感器21的一侧面附着于基材10且在基材10形变时薄膜压阻传感器21的电阻率分布跟随形变而改变，其中两条相对的信号线分别为电源线VCC和地线GND，另外两条相对的信号线为差分线Vm+、Vm-；通过检测两条差分线Vm+、Vm-之间的电压降△V以检测被测物件200的压力。
所使用的压力传感器20为具有一定面积的薄膜压阻传感器21，并在薄膜压阻传感器21的端部分别引出电源线VCC、地线GND与两条差分线Vm+、Vm-，压力传感器20设于基材10。该压力传感器20具有面积小，初始压差小，灵敏度高，温漂小，抗干扰能力 强，抗跌系数高，可靠性稳定等优点。将基材10简单相抵到承受压力的被测物件200上，压力传感器20接上压力感应检测电路，被测物件200受到压力产生形变，基材10产生形变薄膜压阻传感器21跟随形变，通过检测两条差分线Vm+、Vm-之间的电压降△V以检测基材10的形变，换算得到被测物件200的压力，实现压感触控功能。
被测物件200可以是面板或手机侧面或其它。基材10呈长条形，让压力传感器20设于基材10，能降低耗材。呈长条形的基材10具有两条外边10a及位于两条外边10a内侧的两条内边10b。压力传感器20的薄膜压阻传感器21、信号线及信号线末端的焊盘22位于两条内边10b之间的区域，结构紧凑。基材10为电路板，压力传感器20安装于电路板，容易装配，便于薄膜压阻传感器21跟随基材10形变。电路板具有与压力感应检测电路连接的电路走线，进行信号处理，实现压力触控。
压力传感器20可以为NDT压力传感器。压力传感器20的薄膜压阻传感器21为具有一定面积的一体结构。当力作用于被测物件200时，由于切向应变力的影响，使得薄膜压阻传感器21在长边方向的曲率增大，薄膜压阻传感器21短边方向的曲率变化不明显。根据压力传感器20的特性，即电阻的特性，电阻曲率变大，阻值增大；电阻曲率变小，阻值减小。被测物件200受到压力产生形变，基材10产生形变薄膜压阻传感器21跟随形变。两条差分线Vm+、Vm-之间的电压降△V作为信号量，经过压力感应检测电路数据处理，得到被测物件200的压力。
压力感应装置100可以制作得比较小，结构紧凑，可应用于不同的压力感应场合。比如压力感应装置100宽度可做到2mm或2mm以上。
进一步地，作为本发明提供的压力感应装置100的一种具体实施方式，压力传感器20的数量为一；在多通道使用时，压力传感器20的数量至少为二，压力传感器20呈排列状分布或者不均匀分布。压力感应装置100呈长条形，受到压力后将产生一维形变。
进一步地，作为本发明提供的压力感应装置100的一种具体实施方式，薄膜压阻传感器21可以是任何类型的应变传感器，包括多晶或非晶半导体材料、多晶硅、石墨烯、铜镍合金、碳纳米管、金属细线、以及导体绝缘体复合材料等。上述方案均能实现压力感应。
进一步地，作为本发明提供的压力感应装置100的一种具体实施方式，薄膜压阻传感器21为具有一定面积的压力传感器，可以是正多边形、异多边形、椭圆形、圆形等等形状。上述方案均能实现压力感应。本发明以正方形电阻为例说明。
进一步地，请参阅图3，作为本发明提供的压力感应装置100的一种具体实施方式，基材10为印刷电路板11，四条信号线的末端连接于印刷电路板11；压力传感器20印刷到印刷电路板11。印刷电路板11可以是纸基板、金属基板、复合基板、玻纤布基板、陶瓷 基板等。或者，请参阅图2，基材10包括柔性电路板12及设于柔性电路板12的补强片13，四条信号线的末端连接于柔性电路板12。压力传感器20印刷到柔性电路板12。补强片13可以是不锈钢片、玻璃纤维环氧树脂覆铜片(FR-4)、铝片或其它具有一定刚性的材料。上述两种方案均容易装配，便于薄膜压阻传感器21跟随基材10形变，按需选用。
进一步地，请参阅图1，作为本发明提供的压力感应装置100的一种具体实施方式，信号线可以是各种导体，如Cu(铜)、Ni(镍)、Ag(银)、Au(金)等金属或金属化合物，也可以是C(碳)粉或导电纳米管，还可以是氧化物粉末等。上述结构容易成型，便于将薄膜压阻传感器21的四个端部连接于电路板。
进一步地，请参阅图2、图3，作为本发明提供的压力感应装置100的一种具体实施方式，基材10背离于压力传感器20的一侧面设有用于与被测物件200粘接的胶体30。采用胶体30便于压力感应装置100装配相抵于被测物件200的表面。胶体30可以为VHB胶带或其它胶体。
进一步地，作为本发明提供的压力感应装置100的一种具体实施方式，压力感应装置100的宽度大于或等于1mm。压力感应装置100可以应用于空间相对较小(小于1mm)的场合。
进一步地，请参阅图1，作为本发明提供的压力感应装置100的一种具体实施方式，薄膜压阻传感器21的其中一条侧边与压力传感器20的排列方向相互平行。该结构紧凑，占用空间小。让薄膜压阻传感器21能等效为下述的第一等效电路、第二等效电路、第三等效电路，而且第一等效电路中的桥臂Rm1、Rm2的长边方向与压力传感器20的排列方向相互平行，桥臂Rf1、Rf2的长边方向与压力传感器20的排列方向相互垂直。
进一步地，作为本发明提供的压力感应装置100的一种具体实施方式，压力传感器20的形变方向与压力感应装置100的长边方向相互平行。压力感应装置100呈长条形，受到压力后将产生一维形变。薄膜压阻传感器21能等效为下述的第一等效电路、第二等效电路、第三等效电路。信号线的长度方向与压力传感器20的排列方向相互平行。该结构紧凑，占用空间小。
请参阅图1至图3，本发明实施例提供一种压力感应方法，其采用上述任一实施例的压力感应装置100，包括以下步骤：
将基材10相抵在被测物件200上；
薄膜压阻传感器21四角引出四条线，每两条线之间存在一定的阻抗，将薄膜压阻传感器21等效为第一等效电路(图4所示)，第一等效电路包括具有两对桥臂的电桥电路、连接于两条差分线Vm+、Vm-之间的第一电阻Rx、及连接于电源线VCC和地 线GND之间的第二电阻Ry，电桥电路的其中两端分别连接于电源线VCC和地线GND，电桥电路的另外两端分别连接于两条差分线Vm+、Vm-；
第二电阻Ry的大小变化不会影响Vm+和Vm-的电压值，信号量为Vm+和Vm-的差值，方便计算，对信号量影响可以忽略，将第一等效电路中的第二电阻Ry删除，得到第二等效电路(图5所示)；第二等效电路包括具有两对桥臂的电桥电路、及连接于两条差分线Vm+、Vm-之间的第一电阻Rx，电桥电路的其中两端分别连接于电源线VCC和地线GND，电桥电路的另外两端分别连接于两条差分线Vm+、Vm-；
其中，在第一等效电路中，两条差分线Vm+、Vm-之间的电压降△V作为信号量，第二电阻Ry连接于电源线VCC和地线GND之间。由于信号量等于两条差分线Vm+、Vm-的电势之差，第二电阻Ry的电阻值发生变化，并不影响信号量。所以可以删除第二电阻Ry，将第一等效电路等效为第二等效电路。
将第二等效电路中的第一电阻Rx及与电源线VCC相连接的两个桥臂Rf1、Rm2组成的△形电路等效为Y形电路，得到第三等效电路(图7所示)；
根据基尔霍夫定律得到Y形电路的中心点的电压方程、两条差分线Vm+、Vm-的电压方程；进而得到两条差分线Vm+、Vm-之间的电压降公式；通过电压降公式经过换算得到基材10的形变，换算得到被测物件200的压力。
压力感应装置100宽度可做到2mm或2mm以上，所使用的压力传感器20为具有一定面积的薄膜压阻传感器21，并在薄膜压阻传感器21的端部分别引出电源线VCC、地线GND与两条差分线Vm+、Vm-，压力传感器20设于基材10。该压力传感器20具有面积小，初始压差小，灵敏度高，温漂小，抗干扰能力强，抗跌系数高，可靠性稳定等优点。将基材10简单相抵到承受压力的被测物件200上，压力传感器20接上压力感应检测电路，被测物件200受到压力产生形变，基材10产生形变薄膜压阻传感器21跟随形变，通过检测两条差分线Vm+、Vm-之间的电压降△V以检测基材10的形变，换算得到被测物件200的压力，实现压感触控功能。应用该压力感应装置100的压力感应方法能实现压感触控功能。
进一步地，作为本发明提供的压力感应方法的一种具体实施方式，薄膜压阻传感器21为正方形电阻，每一桥臂(Rf1、Rf2、Rm1、Rm2)的电阻值相等，即Rf1＝Rm1＝Rm2＝Rf2；第一电阻Rx与第二电阻Ry的电阻值相等，即Rx＝Ry；这是依据电阻的对称性得到的。可以理解地，薄膜压阻传感器21还可以为其它的正多边形、异多边形、椭圆形或圆形或其它形状，这些结构均能采用上述压力感应方法进行压力感应。
进一步地，作为本发明提供的压力感应方法的一种具体实施方式，请参阅图4，在第 一等效电路中，电桥电路的两对桥臂，将其中一对桥臂记为Rf1、Rf2，另外一对桥臂记为Rm1、Rm2，第一电阻记为Rx，第二电阻记为Ry；桥臂Rm1、Rm2的长边方向与压力传感器20的排列方向相互平行，桥臂Rf1、Rf2的长边方向与压力传感器20的排列方向相互垂直；
请参阅图7，在第三等效电路中的Y形电路的三个等效电阻分别记为Ra、Rb、Rc；比较△形电路和Y形电路的电压-电流关系，可得：
Figure PCTCN2018122314-appb-000001
Figure PCTCN2018122314-appb-000002
Figure PCTCN2018122314-appb-000003
根据基尔霍夫定律得到以下方程，
Y形电路的中心点的电压方程为：
Figure PCTCN2018122314-appb-000004
其中一条差分线Vm+的电压方程为：
Figure PCTCN2018122314-appb-000005
另外一条差分线Vm-的电压方程为：
Figure PCTCN2018122314-appb-000006
两条差分线Vm+、Vm-之间的电压降公式为：
Figure PCTCN2018122314-appb-000007
在上述电压降公式中，具有Rm1、Rm2、Rf1、Rf2多个变量。为了研究各个变量对电压降△V的影响，下面分别求电压降△V相对于各个变量的偏导，考察各个变量对电压降△V的单调性。
(1)△V对Rm1求偏导，得：
Figure PCTCN2018122314-appb-000008
∵
Figure PCTCN2018122314-appb-000009
[ΔV,Rm1]是个正数。
∴ΔV对Rm1的函数是单调递增的。
(2)△V对Rm2求偏导，得：
Figure PCTCN2018122314-appb-000010
∵
Figure PCTCN2018122314-appb-000011
[ΔV,Rm2]是个正数。
∴ΔV对Rm2的函数是单调递增的。
(3)△V对Rf1求偏导，得：
Figure PCTCN2018122314-appb-000012
∵
Figure PCTCN2018122314-appb-000013
[ΔV,Rf1]是个负数。
∴ΔV对Rf1的函数是单调递减的。
(4)△V对Rf2求偏导，得：
Figure PCTCN2018122314-appb-000014
∵
Figure PCTCN2018122314-appb-000015
[ΔV,Rf2]是个负数。
∴ΔV对Rf2的函数是单调递减的。
请参阅图1至图3，当力F作用于被测物件200时，由于切向应变力的影响，使得薄膜压阻传感器21在长边方向的曲率增大，薄膜压阻传感器21短边方向的曲率变化不明显。根据压力传感器20的特性，薄膜压阻传感器21曲率变大，阻值增大；薄膜压阻传感器21曲率变小，阻值减小。被测物件200受到压力产生形变，基材10产生形变薄膜压阻传感器21跟随形变。
桥臂Rm1、Rm2的长边方向与压力传感器20的排列方向相互平行，桥臂Rf1、Rf2的长边方向与压力传感器20的排列方向相互垂直。图6是第二等效电路在被测物件200按压后的等效电阻变化图。
根据对称性，假设Rm1和Rm2的电阻变化量均为△R1，Rx的电阻变化量为△R2。Rf1和Rf2由于曲率变化很小，此处假设Rf1和Rf2保持不变。
由上面可知，两条差分线Vm+、Vm-之间的电压降△V(信号量)与电桥电阻的关系为：
Figure PCTCN2018122314-appb-000016
并且ΔV对Rm1的函数和ΔV对Rm2的函数都是单调递增的。
上述电压降公式还具有Rx变量，Rx的改变对电压降ΔV的影响非常小。
下面通过仿真验证，Rx的改变对电压降ΔV的影响非常小。举一实例，按压时，设定Rf1＝Rf2＝5kΩ，Rm1＝Rm2＝5000.5Ω，Rx由5k以1Ω为一个间隔往上递增，仿真可得ΔV的曲线如图8所示，横轴为电阻(单位为Ω)。上面实例Rx的阻值变化千分之一，ΔV的变化量不超过千分之一，对Rx用其他阻值进行仿真，对ΔV的影响也非常小。可见，由压变效应Rx产生的变化量对ΔV影响非常小。
下面通过仿真验证，Rm1和Rm2的阻值变大可使电压降ΔV单调递增。设定Rf1＝Rf2＝5kΩ，Rm1和Rm2都以0.5Ω的阻值增大，仿真可得ΔV的曲线如图9所示，横轴为电阻(单位为Ω)。可见，由压变效应使Rm1和Rm2的阻值变大可使ΔV单调递增。
所以当对压力感应装置100施加力时，Rm1和Rm2变大，Rf1或Rf2基本不变的情况下，信号量△V是会正向增大。而且，施加力度越大，信号量△V越大，通过信号处理之后，即可实现压力触控。
请参阅图1至图3，本发明实施例提供一种电子终端，包括被测物件200、上述任一实施例的压力感应装置100、及与压力传感器20电连接的压力感应检测电路，基材10相抵在被测物件200上。
压力感应装置100宽度可做到2mm或2mm以上，所使用的压力传感器20为具有一定面积的薄膜压阻传感器21，并在薄膜压阻传感器21的端部分别引出电源线VCC、地线GND与两条差分线Vm+、Vm-，压力传感器20设于基材10。该压力传感器20具有面积小，初始压差小，灵敏度高，温漂小，抗干扰能力强，抗跌系数高，可靠性稳定等优点。将基材10简单相抵到承受压力的被测物件200上，压力传感器20接上压力感应检测电路，被测物件200受到压力产生形变，基材10产生形变薄膜压阻传感器21跟随形变，通过检测两条差分线Vm+、Vm-之间的电压降△V以检测基材10的形变，换算得到被测物件200的压力，实现压感触控功能。具有该压力感应装置100的电子终端能实现压感触控功能。
压力感应检测电路作为信号处理电路，对压力传感器20的电信号进行分析处理后结合面板检测到的触按位置信息一起传递给电子终端的主控制器。从而实现在识别触按位置的同时获得触按的精确压力。
压力感应检测电路是用于检测压力感应组件所获得的电信号，并对电信号进行处理分 析。压力传感器20的薄膜压阻传感器21通过信号线与该压力感应检测电路连接，当然，该信号线仅仅在于描述薄膜压阻传感器21和压力感应检测电路的结合方式，作为其它实施例，压力传感器20还可以通过其它方式直接或间接地与检测电路电性连接。
压力感应检测电路可以作为控制中心，其接受压力传感器20传递的控制信息，进而对电子终端等进行控制，其通常被描述为具有多种处理方法的硬件、软件的组合。硬件、软件被配置成将压力传感器20输入的控制信息通过反馈或与客户相关联的系统进行通讯并执行附加的相关任务或功能。
压力感应检测电路可实现为通用处理器、内容可寻址存储器、数字信号处理器、数模转换开关、可编程逻辑器件、分立的硬件组成或其他组合；同时其内部还内嵌有与压力触摸屏/压力感应系统相关的算法、软件信息。
压力感应检测电路中的硬件、软件被配置成执行多种功能、技术、反馈以及与客户系统相关联的处理任务。
进一步地，作为本发明提供的电子终端的一种具体实施方式，被测物件200为面板或边框。实现面板或边框的压感触控功能。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (17)

  1. 压力感应装置，其特征在于，包括用于与被测物件相抵的基材、及设于所述基材的压力传感器；所述压力传感器包括至少一块薄膜压阻传感器及至少四条分别由所述薄膜压阻传感器的四个角部引出的信号线，所述薄膜压阻传感器的一侧面附着于所述基材且在所述基材形变时所述薄膜压阻传感器的电阻率分布跟随形变而改变，其中两条相对的所述信号线分别为电源线和地线，另外两条相对的所述信号线为差分线；通过检测两条所述差分线之间的电压降以检测被测物件的压力。
  2. 如权利要求1所述的压力感应装置，其特征在于，所述压力传感器的数量为一；或者，所述压力传感器的数量至少为二，所述压力传感器呈排列状分布；或者，所述压力传感器的数量至少为二，所述压力传感器不均匀分布。
  3. 如权利要求1所述的压力感应装置，其特征在于，所述薄膜压阻传感器是由多晶半导体材料、非晶半导体材料、多晶硅、石墨烯、铜镍合金、碳纳米管、金属细线、导体绝缘体复合材料中的至少一种材料制作；
    和/或，所述信号线为金属、金属化合物、碳粉、导电纳米管、氧化物粉末中的至少一种材料制作。
  4. 如权利要求1所述的压力感应装置，其特征在于，所述薄膜压阻传感器呈正多边形、异多边形、椭圆形或圆形。
  5. 如权利要求1所述的压力感应装置，其特征在于，所述基材为印刷电路板，四条所述信号线的末端连接于所述印刷电路板。
  6. 如权利要求5所述的压力感应装置，其特征在于，所述印刷电路板是纸基板、金属基板、复合基板、玻纤布基板或陶瓷基板。
  7. 如权利要求1所述的压力感应装置，其特征在于，所述基材包括柔性电路板及设于所述柔性电路板的补强片，四条所述信号线的末端连接于所述柔性电路板。
  8. 如权利要求7所述的压力感应装置，其特征在于，所述补强片是不锈钢片、玻璃纤维环氧树脂覆铜片或铝片。
  9. 如权利要求1所述的压力感应装置，其特征在于，所述基材背离于所述压力传感器的一侧面设有用于与被测物件粘接的胶体。
  10. 如权利要求1所述的压力感应装置，其特征在于，所述压力感应装置的宽度 大于或等于1mm。
  11. 如权利要求1所述的压力感应装置，其特征在于，所述薄膜压阻传感器的其中一条侧边与所述压力传感器的排列方向相互平行。
  12. 如权利要求1所述的压力感应装置，其特征在于，所述压力传感器的形变方向与所述压力感应装置的长边方向相互平行。
  13. 压力感应方法，其特征在于，其采用如权利要求1至12任一项所述的压力感应装置，包括以下步骤：
    将所述基材相抵在被测物件上；
    将所述薄膜压阻传感器等效为第一等效电路，所述第一等效电路包括具有两对桥臂的电桥电路、连接于两条所述差分线之间的第一电阻、及连接于所述电源线和所述地线之间的第二电阻，所述电桥电路的其中两端分别连接于所述电源线和所述地线，所述电桥电路的另外两端分别连接于两条所述差分线；
    所述第一等效电路中的所述第二电阻对信号量影响可忽略，删除所述第二电阻，得到第二等效电路；所述第二等效电路包括具有两对桥臂的电桥电路、及连接于两条所述差分线之间的第一电阻，所述电桥电路的其中两端分别连接于所述电源线和所述地线，所述电桥电路的另外两端分别连接于两条所述差分线；
    将所述第二等效电路中的所述第一电阻及与所述电源线相连接的两个所述桥臂组成的△形电路等效为Y形电路，得到第三等效电路；
    根据基尔霍夫定律得到Y形电路的中心点的电压方程、两条所述差分线的电压方程；进而得到两条所述差分线之间的电压降公式；通过所述电压降公式经过换算得到所述基材的形变，换算得到被测物件的压力。
  14. 如权利要求13所述的压力感应方法，其特征在于，在所述第一等效电路中，所述电桥电路的两对桥臂，将其中一对所述桥臂记为Rf1、Rf2，另外一对所述桥臂记为Rm1、Rm2，第一电阻记为Rx，第二电阻记为Ry；所述桥臂Rm1、Rm2的长边方向与所述压力传感器的排列方向相互平行，所述桥臂Rf1、Rf2的长边方向与所述压力传感器的排列方向相互垂直；
    在第三等效电路中的Y形电路的三个等效电阻分别记为Ra、Rb、Rc；
    Figure PCTCN2018122314-appb-100001
    Figure PCTCN2018122314-appb-100002
    Figure PCTCN2018122314-appb-100003
    Y形电路的中心点的电压方程为：
    Figure PCTCN2018122314-appb-100004
    其中一条所述差分线的电压方程为：
    Figure PCTCN2018122314-appb-100005
    另外一条所述差分线的电压方程为：
    Figure PCTCN2018122314-appb-100006
    两条所述差分线之间的电压降公式为：
    Figure PCTCN2018122314-appb-100007
  15. 如权利要求13或14所述的压力感应方法，其特征在于，所述薄膜压阻传感器为正方形电阻，每一所述桥臂的电阻值相等，所述第一电阻与所述第二电阻的电阻值相等。
  16. 电子终端，其特征在于，包括被测物件、如权利要求1至12任一项所述的压力感应装置、及与所述压力传感器电连接的压力感应检测电路，所述基材相抵在所述被测物件上。
  17. 如权利要求16所述的电子终端，其特征在于，所述被测物件为面板或边框。
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