WO2021035741A1 - 力感应装置、力感应方法及设备 - Google Patents

力感应装置、力感应方法及设备 Download PDF

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Publication number
WO2021035741A1
WO2021035741A1 PCT/CN2019/103863 CN2019103863W WO2021035741A1 WO 2021035741 A1 WO2021035741 A1 WO 2021035741A1 CN 2019103863 W CN2019103863 W CN 2019103863W WO 2021035741 A1 WO2021035741 A1 WO 2021035741A1
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WIPO (PCT)
Prior art keywords
force
force sensors
axis
rigid structure
measured object
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PCT/CN2019/103863
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English (en)
French (fr)
Inventor
李灏
林学朋
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深圳纽迪瑞科技开发有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳纽迪瑞科技开发有限公司 filed Critical 深圳纽迪瑞科技开发有限公司
Priority to CN201980099343.9A priority Critical patent/CN114270157A/zh
Priority to PCT/CN2019/103863 priority patent/WO2021035741A1/zh
Priority to US17/639,230 priority patent/US20220326101A1/en
Publication of WO2021035741A1 publication Critical patent/WO2021035741A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • G01L1/2262—Measuring circuits therefor involving simple electrical bridges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • This application belongs to the field of pressure sensing technology, and relates to a force sensing device, a force sensing method using the force sensing device, and a device having the force sensing device.
  • pressure sensing technologies in the pressure sensing field. These technologies use different types of sensors, combined with specific structures and circuits, to detect a certain degree of deformation of the measured object.
  • common resistance strain gauges pressure capacitance technology, pressure inductance technology, piezoelectric ceramic technology, MEMS (micro electromechanical system) pressure sensor technology, etc.
  • these technologies are not only complicated in structure and installation, but also have low sensitivity, low anti-drop coefficient and easy error.
  • the reliability of pressure detection is not high.
  • One of the objectives of the embodiments of the present application is to provide a force sensing device, a force sensing method, and equipment to solve the technical problem that the existing pressure sensing technology structure is complicated to install or can only accurately detect the deformation in one-dimensional direction.
  • a force sensing device including:
  • a rigid structure used to fit the object under test and follow the deformation of the object under test includes rigid blocks arranged at intervals along the X axis.
  • a strain amplification zone is formed between two adjacent rigid blocks.
  • Four mounting surfaces are formed around the strain amplification zone; and
  • a number of force sensors arranged in the strain amplification zone wherein two force sensors in each of the four force sensors constitute a group, and the two groups of force sensors are selectively correspondingly arranged in two of the installations
  • the four force sensors are connected to form different bridge circuits, and the different bridge circuits are electrically connected to the signal processing circuit to detect the deformation of the rigid structure in different directions and obtain the corresponding direction of the measured object. Force.
  • a force sensing method which adopts the above-mentioned force sensing device, and includes the following steps:
  • the four force sensors in the same strain amplification zone are connected to form different bridge circuits, and the different bridge circuits are electrically connected to the signal processing circuit to detect the deformation of the rigid structure in different directions and obtain The force corresponding to the direction of the measured object.
  • a device which includes a measured object and the aforementioned force sensing device, and the rigid structure is attached to the measured object.
  • the rigid structure includes rigid blocks arranged at intervals, a strain amplification zone is formed between two adjacent rigid blocks, and two of the four force sensors are One group and two groups of force sensors are selectively correspondingly arranged on two of the mounting surfaces of the strain amplification zone, and the four force sensors are connected to form different bridge circuits.
  • the rigid structure is attached to the measured object, and different bridge circuits are electrically connected to the signal processing circuit, and then the deformation of the rigid structure in different directions is detected respectively and the force in the corresponding direction of the measured object is obtained.
  • the force sensing device is an integrated structure, easy to install, simple in circuit, and low cost.
  • the force sensing device, the force sensing method and the equipment with the force sensing device can very sensitively detect the small deformation of the measured object in multi-dimensional directions, accurately identify the pressure, and meet the requirements of no false touch, high sensitivity, high anti-fall coefficient, and high resistance. Performance indicators such as reliability.
  • FIG. 1 is a schematic diagram of an assembly of a force sensing device provided by an embodiment of the application
  • Figure 2 is a front view of the force sensing device of Figure 1;
  • FIG. 3 is a three-dimensional structural diagram of a force sensing device provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a force sensor used in the force sensing device of FIG. 3;
  • FIG. 5 is a schematic diagram of the connection of an analog switch used in the force sensing device of FIG. 3;
  • Fig. 6 is a schematic diagram of a bridge circuit provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of a bridge circuit provided by another embodiment of the application.
  • FIG. 8 is a schematic diagram of a bridge circuit provided by another embodiment of the application.
  • FIG. 9 is a three-dimensional structural diagram of a force sensing device provided by another embodiment of the application.
  • FIG. 10 is a three-dimensional structural diagram of a force sensing device provided by another embodiment of the application.
  • FIG. 11 is a three-dimensional structural diagram of a force sensing device provided by another embodiment of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying the importance of phase groups or implicitly indicating the number of technical features indicated. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • a plurality of means two or more than two, unless otherwise specifically defined.
  • the terms “installation”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense.
  • it may be a fixed connection or a fixed connection.
  • Those of ordinary skill in the art can understand the specific meanings of the above-mentioned terms in the embodiments of the present application according to specific circumstances.
  • an embodiment of the present application provides a force sensing device, which includes a rigid structure 10 and force sensors R1, R2, R3, R4.
  • the rigid structure 10 is used to fit the measured object (not shown) and follow the deformation of the measured object.
  • the rigid structure 10 includes rigid blocks 11 spaced apart along the X axis, and a strain amplification zone is formed between two adjacent rigid blocks 11 12.
  • the rigid structure 10 forms four mounting surfaces 10a, 10b, 10c, and 10d around the strain amplification zone 12; a number of force sensors are arranged in the strain amplification zone 12.
  • Each of the four force sensors R1, R2, R3, R4 Two force sensors are used as a group, and the two groups of force sensors are selectively correspondingly arranged on two of the mounting surfaces.
  • the four force sensors are connected to form different bridge circuits (see Figure 6 to Figure 8), and different bridge circuits It is electrically connected to the signal processing circuit to detect the deformation of the rigid structure 10 in different directions and obtain the force in the corresponding direction of the
  • the rigid structure 10 includes rigid blocks 11 arranged at intervals, a strain amplification zone 12 is formed between two adjacent rigid blocks 11, four force sensors R1, R2, R3, R4 are set as a group, and the two groups of force sensors are selectively
  • the ground is correspondingly arranged on two of the mounting surfaces 10a, 10b, 10c, 10d of the strain amplification zone 12, and the four force sensors are connected to form different bridge circuits.
  • the rigid structure 10 is attached to the measured object, and different bridge circuits are electrically connected to the signal processing circuit, and the deformation of the rigid structure 10 in different directions is detected respectively and the force in the corresponding direction of the measured object is obtained.
  • the force sensing device is a one-piece structure, easy to install, simple in circuit, low cost, can very sensitively detect the small deformation of the measured object in multi-dimensional directions, accurately identify the pressure, meet the requirements of no false touch, high sensitivity, high anti-fall coefficient, Performance indicators such as high reliability.
  • the signal processing circuit is electrically connected with the bridge circuit, analyzes and processes the electrical signal of the force sensor, and converts the force analog signal into a force digital signal. This part belongs to the prior art.
  • the rigid structure 10 is attached to the surface of the object to be measured by glue (not shown), which is easy to assemble.
  • glue (not shown), which is easy to assemble.
  • the rigid structure 10 follows the deformation of the measured object, the deformation of the strain amplification zone 12 is amplified, and the impedance of the force sensor changes accordingly.
  • the force sensor is electrically connected to the signal processing circuit to generate a pressure signal for analysis
  • the characteristics of the pressure signal can identify the direction, size and location of the force.
  • the glue can be VHB, double-sided tape, 502 glue, thermosetting glue, etc., which can be selected as required.
  • the rigid structure 10 has certain rigidity
  • the strain amplification area 12 is a hollow area
  • the force sensor is provided in the strain amplification area 12.
  • the rigid structure 10 deforms following the measured object, and the deformation of the strain amplification zone 12 is amplified, which facilitates the detection of the deformation of the rigid structure 10 by the force sensor.
  • the rigid structure 10 can be steel sheet, aluminum sheet, glass sheet, FR4 sheet or other composite rigid materials, which can be selected as required.
  • two mounting surfaces of the rigid structure 10 corresponding to two sets of force sensors are provided with a flexible substrate 21, and the two sets of force sensors are respectively mounted on the corresponding flexible substrate 21.
  • the flexible substrate 21 with the force sensor is pressed onto the discrete rigid block 11 of a certain size through the glue 30, and the four force sensors are arranged directly or adjacently between two adjacent discrete rigid blocks 11
  • the strain amplification zone 12 constitutes a force sensing device, and the structure is easy to form.
  • the flexible substrate 21 can be FPC (flexible circuit board), PET (high temperature resistant polyester film), PI film (polyimide film) or other flexible substrates with good flatness, which can be selected as required.
  • two flexible substrates 21 are formed by bending a mother substrate 20.
  • the sensor is installed on two adjacent mounting surfaces or two opposite mounting surfaces. Both the force sensor can be attached to a mother substrate 20, and then the center of the mother substrate 20 is folded and the two inner surfaces are bonded to the two inner surfaces.
  • a mounting surface simple processing and low cost.
  • the flexible substrate 21 and the surface of the rigid structure 10 are bonded by a glue 30.
  • This structure facilitates the connection between the rigid structure 10 and the flexible substrate 21, and allows the flexible substrate 21 and the rigid structure 10 to follow the object to be measured when the object is deformed by force.
  • the glue 30 can be epoxy glue film, 502 glue, thermosetting glue, silica gel and other materials, which can be selected as required.
  • the four force sensors R1, R2, R3, R4, the power supply terminal VCC, the ground terminal GND and the detection terminals Vp, Vn of the same bridge circuit pass through Analog switch connection.
  • the solution is easy to assemble, four force sensors can be connected to form different bridge circuits by using an analog switch, and the on-off switching of the bridge circuit can be controlled, which is easy to operate.
  • the analog switch may be a single-pole single-throw analog switch.
  • the single-pole single-throw analog switch has the NO terminal, the COM terminal and the IN terminal. Connect the lines that need to be short-circuited (the two ends of the four force sensors R1, R2, R3, R4) to the COM terminal and the IN terminal in a predetermined connection mode.
  • Each COM terminal is respectively connected to the power terminal VCC, the ground terminal GND, and the detection terminals Vp and Vn, and a predetermined bridge circuit can be obtained.
  • Each IN terminal is used to receive an enable signal to control SPST.
  • each COM terminal is connected to the power terminal VCC, the ground terminal GND, and the detection terminal Vp, Vn respectively.
  • the IN terminal receives the enable signal
  • the corresponding NO terminal and COM terminal are conducted to form a predetermined bridge circuit.
  • the IN terminal does not receive the enable signal
  • the corresponding NO terminal is disconnected from the COM terminal.
  • the single-pole single-throw analog switch can be TS3A4751, which is a bidirectional, 4-channel, normally open (NO) single-pole single-throw (SPST) analog switch.
  • the analog switch can be used to connect four force sensors to form different electrical circuits. Bridge circuit, and control the on-off switching of the bridge circuit.
  • the length directions of the force sensors R1, R2, R3, and R4 are parallel to the X axis; the four mounting surfaces are divided into the first spaced along the Z axis.
  • One surface 10a and the second surface 10b, as well as the third surface 10c and the fourth surface 10d spaced along the Y axis, the first surface 10a is used as the bonding surface with the measured object, the X axis, the Y axis and the Z axis are in pairs Perpendicular to each other.
  • the structure is easy to assemble a force sensor, and the force sensor can detect forces in different directions.
  • the first surface 10a and the second surface 10b of the rigid structure 10 are both parallel to the XY plane
  • the third surface 10c and the fourth surface 10d are both parallel to the XZ plane.
  • two sets of force sensors are correspondingly disposed on the first surface 10a and the first surface 10a and the first surface 10a and the first surface 10a.
  • the planes of the two force sensors R1 and R2 located close to the third surface 10c are perpendicular to the Y axis
  • the planes of the two force sensors R3 and R4 located close to the fourth surface 10d are perpendicular to the Y axis.
  • Four force sensors are connected to form different bridge circuits.
  • the bridge circuit is electrically connected to the signal processing circuit. Through different signal characteristics, the force of different dimensions felt by the measured object can be identified, and multi-dimensional force sensing can be realized.
  • two embodiments of bridge circuits will be used to expand the description.
  • the bridge circuit is electrically connected
  • the signal processing circuit is used to detect the deformation of the rigid structure 10 on the Z axis and obtain the Z axis pressure of the measured object.
  • Vp R2Ui/(R1+R2)
  • Vn R4Ui/(R3+R4)
  • R1 and R4 are on the same plane, and R2 and R3 are on the same plane.
  • the rigid structure 10 When the measured object receives a force from top to bottom, the rigid structure 10 will follow the measured object to undergo a bending deformation from top to bottom. Affected by the curvature, the force sensors R2 and R3 will be stretched to lengthen the length of the force sensor, and R1 and R4 will be squeezed to reduce the length of the sensor.
  • the characteristic is the force sensor whose length is lengthened and the resistance increases. As an example, so R2 and R3 will increase, and R1 and R4 will decrease. In short, when pressing from top to bottom, R2 and R3 increase, R1 and R4 decrease. From the above conclusion, we can see that Uo will increase in the positive direction. In the same way, when the measured force is from bottom to top, Uo will increase in the negative direction.
  • R1 and R2 are on the same plane, and R3 and R4 are on the same plane.
  • embodiment 1 of the bridge circuit can identify the pressure in the Z-axis (up and down) direction of the measured object based on the signal characteristics generated by Uo.
  • the bridge circuit It is electrically connected to the signal processing circuit to detect the deformation of the rigid structure 10 on the Y axis and obtain the Y axis pressure of the measured object.
  • Vp R4Ui/(R1+R4)
  • Vn R2Ui/(R3+R2)
  • R1 and R4 are on the same plane, and R2 and R3 are on the same plane.
  • R1 and R2 are on the same plane, and R3 and R4 are on the same plane.
  • the rigid structure 10 When the measured object receives a force from the front to back direction, the rigid structure 10 will follow the measured object to undergo a bending deformation from top to bottom. Affected by the curvature, the force sensors R3 and R4 will be stretched to lengthen the length of the sensor, and R1 and R2 will be squeezed to reduce the length of the sensor. So R3 and R4 will increase, and R1 and R2 will decrease.
  • the second embodiment of the bridge circuit can identify the pressure in the Y-axis (forward and backward) direction based on the signal characteristics generated by Uo.
  • the force sensing device In addition to detecting multi-dimensional deformation, the force sensing device also has the advantages of small temperature and humidity drift, high sensitivity, and convenient installation.
  • two sets of force sensors are correspondingly disposed on the third surface 10c and the third surface.
  • the planes of the two force sensors R1 and R4 arranged close to the first surface 10a are perpendicular to the Z axis
  • the planes of the two force sensors R2, R3 arranged close to the second surface 10b are perpendicular to the Z axis.
  • Four force sensors are connected to form different bridge circuits.
  • the bridge circuit is electrically connected to the signal processing circuit. Through different signal characteristics, the force of different dimensions felt by the measured object can be identified, and multi-dimensional force sensing can be realized.
  • the bridge circuit It is electrically connected to the signal processing circuit to detect the deformation of the rigid structure 10 on the Z axis and obtain the Z axis pressure of the measured object.
  • Vp R2Ui/(R1+R2)
  • Vn R4Ui/(R3+R4)
  • R1 and R4 are on the same plane, and R2 and R3 are on the same plane.
  • the rigid structure 10 When the measured object receives a force from top to bottom, the rigid structure 10 will follow the measured object to undergo a bending deformation from top to bottom. Affected by the curvature, the force sensors R2 and R3 will be stretched to increase the length of the sensor, and R1 and R4 will be squeezed to reduce the length of the sensor.
  • the force sensor whose characteristic is that the length increases and the resistance increases are For example, so R2 and R3 will increase, and R1 and R4 will decrease.
  • R2 and R3 increase, R1 and R4 decrease. From the above conclusion, it can be seen that Uo will increase in the positive direction. In the same way, when the measured force is from bottom to top, Uo will increase in the negative direction.
  • R1 and R2 are on the same plane, and R3 and R4 are on the same plane.
  • the third embodiment of the bridge circuit can identify the pressure in the Z-axis (up and down) direction of the measured object based on the signal characteristics generated by Uo.
  • the bridge circuit When a group of force sensors R1 and R2 arranged on the third surface 10c serve as a group of opposite bridge arms, and a group of force sensors R3 and R4 arranged on the fourth surface 10d as another group of opposite bridge arms, the bridge circuit is electrically connected
  • the signal processing circuit detects the deformation of the rigid structure 10 on the Y axis and obtains the Y axis pressure of the measured object.
  • Vp R4Ui/(R1+R4)
  • Vn R2Ui/(R3+R2)
  • R1 and R4 are on the same plane, and R2 and R3 are on the same plane.
  • R1 and R2 are on the same plane, and R3 and R4 are on the same plane.
  • the rigid structure 10 When the measured object receives a force from the front to back direction, the rigid structure 10 will follow the measured object to undergo a bending deformation from top to bottom. Affected by the curvature, the force sensors R3 and R4 will be stretched to lengthen the length of the sensor, and R1 and R2 will be squeezed to reduce the length of the force sensor. So R3 and R4 will increase, and R1 and R2 will decrease.
  • embodiment 4 of the bridge circuit can identify the pressure in the Y-axis (forward and backward) direction based on the signal generated by Uo.
  • the force sensing device In addition to detecting multi-dimensional deformation, the force sensing device also has the advantages of small temperature and humidity drift, high sensitivity, and convenient installation.
  • At least two bridge circuits are provided in the same strain amplification area 12.
  • four force sensors to form different bridge circuits, or real-time selection of lines through analog switches to form different bridge circuits, different signal characteristics are analyzed to identify the forces of different dimensions felt by the measured object, and multi-dimensionality is realized. Force sensing.
  • 8 resistors such as R1, R2, R3, R4, R5, R6, R7, and R8 are provided on the 4 mounting surfaces of the strain amplification zone 12.
  • One embodiment is selected from bridge circuit embodiments 1 and 2, and one embodiment is selected from bridge circuit embodiments 3 and 4. Combining these two embodiments can obtain multi-dimensional force sensing under different layouts.
  • adding 4 resistors in the same area can obtain a richer pressure signal and ensure the accuracy of the test. It can also meet the performance requirements when part of the force sensor is damaged, which improves the reliability of the product. It should be pointed out that the number of sensors is not limited to 4 or 8, but can be one channel or multiple channels. In addition to voltage measurement, current or resistance measurement can also be used to achieve pressure detection.
  • two sets of force sensors are correspondingly arranged on two adjacent mounting surfaces ,
  • the plane of the two force sensors R2 and R3 set close to one of the mounting surfaces is perpendicular to the Y axis, and the plane of the two force sensors R1, R4 set close to the other mounting surface is perpendicular to the Z axis; four forces
  • the sensors are connected to form different bridge circuits, and the bridge circuit is electrically connected to the signal processing circuit. Through different signal characteristics, the force of different dimensions felt by the measured object can be recognized, and multi-dimensional force sensing can be realized.
  • the bridge circuit is electrically connected to the signal processing circuit to detect that the rigid structure 10 is in Deformation on the Z axis and obtain the Z axis pressure of the measured object;
  • Vp R2Ui/(R1+R2)
  • Vn R4Ui/(R3+R4)
  • R1 and R4 are on the same plane, and R2 and R3 are on the same plane.
  • the rigid structure 10 When the measured object receives a force from top to bottom, the rigid structure 10 will follow the measured object to undergo a bending deformation from top to bottom. Affected by the curvature, the force sensors R2 and R3 will be stretched to lengthen the length of the sensor, and R1 and R4 will be squeezed to reduce the length of the force sensor.
  • the characteristic is the force sensor whose length is lengthened and the resistance increases. As an example, so R2 and R3 will increase, and R1 and R4 will decrease. In short, when pressing from top to bottom, R2 and R3 increase, R1 and R4 decrease. From the above conclusion, we can see that Uo will increase in the positive direction. In the same way, when the measured force is from bottom to top, Uo will increase in the negative direction.
  • R1 and R4, R2 and R3 are all on the same plane.
  • the impedance changes of the four force sensors are similar, and Uo is basically unchanged.
  • the above-mentioned embodiment 5 can be used to identify the deformation in a certain direction, one or more bridge circuits are added to identify the Y-axis deformation, and the comprehensive judgment can identify the multi-dimensional deformation.
  • the bridge circuit is electrically connected to the signal processing circuit to detect the rigid structure 10 Deformation on the Z axis and get the Y axis pressure of the measured object.
  • the force sensor is a strain sensing resistor.
  • the strain sensing resistor is composed of polycrystalline semiconductor materials, amorphous semiconductor materials, polysilicon, graphene, copper-nickel alloys, carbon nanotubes, and metal thinners. It is made of at least one material of wire and conductor insulator composite material. The above schemes can all realize pressure sensing, which can be selected according to needs.
  • a force sensing method which adopts the above force sensing device, and includes the following steps:
  • the rigid structure 10 includes rigid blocks 11 arranged at intervals, a strain amplification zone 12 is formed between two adjacent rigid blocks 11, four force sensors R1, R2, R3, R4 are set as a group, and the two groups of force sensors are selectively
  • the ground is correspondingly arranged on two of the mounting surfaces of the strain amplification zone 12, and the four force sensors are connected to form different bridge circuits.
  • the rigid structure 10 is attached to the measured object, and different bridge circuits are electrically connected to the signal processing circuit, and the deformation of the rigid structure 10 in different directions is detected respectively and the force in the corresponding direction of the measured object is obtained.
  • the force sensing device is an integrated structure, easy to install, simple in circuit, and low cost.
  • the force sensing method can very sensitively detect the small deformation of the measured object in multi-dimensional directions, accurately identify the pressure, and meet the performance indicators such as no false touch, high sensitivity, high anti-fall coefficient, and high reliability.
  • the impedance changes of the force sensors are detected to identify forces in different directions.
  • the following takes the force sensor shown in Figure 3 as an example:
  • the measured object is subjected to the force of the Z axis:
  • the acting force is from top to bottom, R1 decreases, R2 increases, R3 increases, and R4 decreases.
  • the acting force is from bottom to top, R1 increases, R2 decreases, R3 decreases, and R4 increases.
  • the measured object is subjected to Y-axis force:
  • the acting force is from front to back, R1 decreases, R2 decreases, R3 increases, and R4 increases.
  • the acting force is from back to front, R1 increases, R2 increases, R3 decreases, and R4 decreases.
  • the measured object is subjected to torsion force around the X axis:
  • the impedance change characteristics of each force sensor can identify the forces of different dimensions.
  • the other embodiments are similar and will not be repeated here.
  • the impedance change of each force sensor can be monitored in real time through the peripheral circuit, and then the force in different directions can be identified.
  • a device which includes a measured object and the aforementioned force sensing device, and a rigid structure 10 is attached to the measured object. Since this device adopts all the technical solutions of all the foregoing embodiments, it also has all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be repeated here.
  • the object to be measured is a panel or a frame.
  • the panel or frame can be made of glass, plastic, ceramic and other non-metallic materials.
  • the panel may be a touch screen, a display or other electronic terminal with a rigid structure 10.
  • the frame can be the frame of various electronic terminals.

Abstract

一种力感应装置，其包括刚性结构(10)与力传感器(R1、R2、R3、R4)，刚性结构(10)包括间隔设置的刚性块(11)，相邻两个刚性块(11)之间形成应变放大区(12)，四个力传感器(R1、R2、R3、R4)以两个为一组，两组力传感器选择性地对应设置于应变放大区(12)的其中两个安装面，该四个力传感器(R1、R2、R3、R4)连接形成不同的电桥电路。在使用时将刚性结构(10)贴合在被测物体上，不同电桥电路电连接于信号处理电路，进而分别检测刚性结构(10)在不同方向上的形变并得出被测物体对应方向的作用力。该力感应装置为一体式结构，容易安装，电路简单，低成本。该力感应装置、力感应方法及具有该力感应装置的设备，可以非常灵敏地检测被测物体在多维度方向上的微小形变，精准识别压力。

Description

力感应装置、力感应方法及设备 技术领域
本申请属于压力感应技术领域，涉及力感应装置、应用该力感应装置的力感应方法及具有该力感应装置的设备。
背景技术
压力感应领域有着多种压力感应技术，这些技术使用不同类型的传感器，结合特定的结构和电路，可以检测被测物体在一定程度的形变。目前常见的有电阻应变片、压力电容技术、压力电感技术、压电陶瓷技术、MEMS(微机电系统)压力传感器技术等，这些技术除了结构安装复杂，还存在灵敏度低、抗跌系数低和易误触等缺点之外，而且只可以准确检测一维方向上的形变，压力检测的可靠性不高。
发明概述
技术问题
本申请实施例的目的在于之一在于：提供一种力感应装置、力感应方法及设备，以解决现有压力感应技术结构安装复杂或者只可以准确检测一维方向上的形变的技术问题。
问题的解决方案
技术解决方案
为解决上述技术问题，本申请实施例采用的技术方案是：
第一方面，提供一种力感应装置，包括：
用于与被测物体贴合且跟随被测物体变形的刚性结构，其包括沿X轴间隔设置的刚性块，相邻两个所述刚性块之间形成应变放大区，所述刚性结构在所述应变放大区的周围形成四个安装面；以及
设置于所述应变放大区的若干力传感器，其中四个所述力传感器中的每两个所述力传感器作为一组，两组所述力传感器选择性地对应设置于其中两个所述安装面，该四个力传感器连接形成不同的电桥电路，不同的所述电桥电路电连接 于信号处理电路以分别检测所述刚性结构在不同方向上的形变并得出被测物体对应方向的作用力。
第二方面，提供一种力感应方法，其采用上述的力感应装置，包括以下步骤：
将所述刚性结构贴合在被测物体上；
将同一所述应变放大区的所述四个力传感器连接形成不同的电桥电路，不同的所述电桥电路电连接于信号处理电路以分别检测所述刚性结构在不同方向上的形变并得出被测物体对应方向的作用力。
第三方面，提供一种设备，包括被测物体及上述的力感应装置，所述刚性结构贴合在所述被测物体上。
本申请实施例提供的力感应装置、力感应方法及设备的有益效果在于：刚性结构包括间隔设置的刚性块，相邻两个刚性块之间形成应变放大区，四个力传感器以两个为一组，两组力传感器选择性地对应设置于应变放大区的其中两个安装面，该四个力传感器连接形成不同的电桥电路。在使用时将刚性结构贴合在被测物体上，不同电桥电路电连接于信号处理电路，进而分别检测刚性结构在不同方向上的形变并得出被测物体对应方向的作用力。该力感应装置为一体式结构，容易安装，电路简单，低成本。该力感应装置、力感应方法及具有该力感应装置的设备，可以非常灵敏地检测被测物体在多维度方向上的微小形变，精准识别压力，满足无误触、灵敏度高、抗跌系数高、高可靠性等性能指标。
发明的有益效果
对附图的简要说明
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将组实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的力感应装置的装配示意图；
图2为图1的力感应装置的正视图；
图3为本申请实施例提供的力感应装置的立体结构图；
图4为图3的力感应装置中应用的力传感器的示意图；
图5为图3的力感应装置中应用的模拟开关的连接示意图；
图6为本申请实施例提供的电桥电路的示意图；
图7为本申请另一实施例提供的电桥电路的示意图；
图8为本申请另一实施例提供的电桥电路的示意图；
图9为本申请另一实施例提供的力感应装置的立体结构图；
图10为本申请另一实施例提供的力感应装置的立体结构图；
图11为本申请另一实施例提供的力感应装置的立体结构图。
具体实施方式
为了使本申请所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，组本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
在本申请实施例的描述中，需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为组本申请实施例的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相组重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请实施例中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。组于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
请参阅图1至图3，本申请实施例提供一种力感应装置，其包括刚性结构10与力 传感器R1、R2、R3、R4。刚性结构10用于与被测物体(图未示)贴合且跟随被测物体变形，刚性结构10包括沿X轴间隔设置的刚性块11，相邻两个刚性块11之间形成应变放大区12，刚性结构10在应变放大区12的周围形成四个安装面10a、10b、10c、10d；若干力传感器设置于应变放大区12，其中四个力传感器R1、R2、R3、R4中的每两个力传感器作为一组，两组力传感器选择性地对应设置于其中两个安装面，该四个力传感器连接形成不同的电桥电路(如图6至图8)，不同的电桥电路电连接于信号处理电路以分别检测刚性结构10在不同方向上的形变并得出被测物体对应方向的作用力。
刚性结构10包括间隔设置的刚性块11，相邻两个刚性块11之间形成应变放大区12，四个力传感器R1、R2、R3、R4以两个为一组，两组力传感器选择性地对应设置于应变放大区12的其中两个安装面10a、10b、10c、10d，该四个力传感器连接形成不同的电桥电路。在使用时将刚性结构10贴合在被测物体上，不同电桥电路电连接于信号处理电路，进而分别检测刚性结构10在不同方向上的形变并得出被测物体对应方向的作用力。该力感应装置为一体式结构，容易安装，电路简单，低成本，可以非常灵敏地检测被测物体在多维度方向上的微小形变，精准识别压力，满足无误触、灵敏度高、抗跌系数高、高可靠性等性能指标。
需要说明的是，信号处理电路与电桥电路电连接，对力传感器的电信号进行分析处理，并将力模拟信号转换为力数字信号，这部分属于现有技术。
在本申请另一实施例中，刚性结构10通过胶体(图未示)贴合到被测物体的表面，容易装配。被测物体在受到作用力时，刚性结构10跟随被测物体变形，应变放大区12的变形放大，力传感器的阻抗随之发生改变，力传感器电连于信号处理电路，进而产生压力信号，分析压力信号的特征便可识别作用力的方向、大小和位置。具体地，胶体可以为VHB、双面胶、502胶、热固胶等，按需选用。
在本申请另一实施例中，刚性结构10具有一定刚性，应变放大区12为镂空区域，力传感器设于应变放大区12。被测物体在受到作用力时，刚性结构10跟随被测物体变形，应变放大区12的变形放大，便于由力传感器检测刚性结构10的变形。具体地，刚性结构10可以为钢片、铝片、玻璃片、FR4片或其他复合刚性材 料，按需选用。
在本申请另一实施例中，刚性结构10对应设置两组力传感器的两个安装面上均设有柔性基材21，该两组力传感器分别安装于对应的柔性基材21。将附有力传感器的柔性基材21，通过胶体30压合到一定尺寸大小的分立的刚性块11上，4个力传感器正对或相邻设于两相邻的分立的刚性块11体之间的应变放大区12，组成力感应装置，该结构容易成型。具体地，柔性基材21可以是FPC(柔性电路板)、PET(耐高温聚酯薄膜)、PI膜(聚酰亚胺薄膜)或其它平整度较好的柔性基材，按需选用。
请参阅图1，在本申请另一实施例中，两个柔性基材21通过一个母基材20弯折形成。传感器设置于相邻两个安装面或相对两个安装面，都可以将力传感器附于一张母基材20上，然后将母基材20的中心翻折后将两个内表面黏合到两个安装面，加工简单，成本低。
在本申请另一实施例中，柔性基材21与刚性结构10的表面之间通过胶体30粘接。该结构便于刚性结构10与柔性基材21的连接，并且在被测物体受作用力而变形时让柔性基材21与刚性结构10跟随被测物体变形。该胶体30可以是环氧胶膜、502胶、热固胶、硅胶等材料，按需选用。
请参阅图4、图5，在本申请另一实施例中，同一电桥电路的四个力传感器R1、R2、R3、R4、电源端VCC、接地端GND与检测端Vp、Vn之间通过模拟开关连接。该方案容易装配，利用模拟开关能够将四个力传感器连接形成不同的电桥电路，并控制电桥电路的通断切换，容易操作。
具体地，模拟开关可以采用单刀单掷模拟开关。单刀单掷模拟开关具有NO端、COM端与IN端，将需要短路的线路(四个力传感器R1、R2、R3、R4的两端)按预定的连接方式连接到COM端与IN端，将各个COM端分别连接至电源端VCC、接地端GND与检测端Vp、Vn，即可得到预定的电桥电路。各个IN端用于接收使能信号以控制SPST。
比如，如果要形成图6所示的电桥电路，需要将图4所示的四个力传感器R1、R2、R3、R4的两端参照图5的连接方式连接至单刀单掷模拟开关的NO端与COM端，并将各个COM端分别连接至电源端VCC、接地端GND与检测端Vp、Vn。在 IN端收到使能信号时，对应的NO端与COM端导通，形成预定的电桥电路。在IN端没有收到使能信号时，对应的NO端与COM端断开。可以理解地，如果要形成如图7或图8所示的电桥电路，需要将四个力传感器R1、R2、R3、R4的两端，采用相应的连接方式连接至单刀单掷模拟开关的NO端与COM端，即可得到图7或图8所示的电桥电路。
具体地，单刀单掷模拟开关可以选用TS3A4751，这是一款双向、4通道、常开(NO)单刀单掷(SPST)模拟开关，利用该模拟开关能够将四个力传感器连接形成不同的电桥电路，并控制电桥电路的通断切换。
请参阅图3、图9至11，在本申请另一实施例中，力传感器R1、R2、R3、R4的长度方向与X轴相互平行；四个安装面分为沿Z轴间隔分布的第一面10a与第二面10b，以及沿Y轴间隔分布的第三面10c与第四面10d，第一面10a作为与被测物体的贴合面，X轴、Y轴与Z轴两两相互垂直。该结构容易装配力传感器，并通过力传感器检测不同方向的作用力。具体地，刚性结构10的第一面10a、第二面10b均与XY平面相互平行，第三面10c、第四面10d均与XZ平面相互平行。
请参阅图3，在本申请另一实施例中，对于同一电桥电路，两组力传感器(其中一组为R1、R4，另外一组为R2、R3)对应设置于第一面10a与第二面10b，靠近于第三面10c设置的两个力传感器R1、R2所在平面与Y轴相互垂直，靠近于第四面10d设置的两个力传感器R3、R4所在平面与Y轴相互垂直。四个力传感器连接形成不同的电桥电路，电桥电路电连于信号处理电路，通过不同的信号特征可识别被测物体感受到的不同维度的作用力，实现多维度的力感应。下面以两个电桥电路的实施例来展开说明。
电桥电路实施例1：
当设于第一面10a的一组力传感器R1、R4作为一组相对桥臂，设于第二面10b的一组力传感器R2、R3作为另一组相对桥臂时，电桥电路电连接于信号处理电路以检测刚性结构10在Z轴上的形变并得出被测物体的Z轴压力。
具体地，参阅图4、图5，通过模拟开关进行选择后，分别将a和e短接到VCC，b和c短接到Vp，f和g短接到Vn，d和h短接到GND。得到图6所示的电桥电路。
设VCC＝Ui，得：
Vp＝R2Ui/(R1+R2)；
Vn＝R4Ui/(R3+R4)；
Uo＝Vp-Vn＝(R2R3-R1R4)Ui/[(R1+R2)(R3+R4)]......式组1
对R1、R2、R3和R4分别求导，可知Uo随R2和R3的增大而增大，随R1和R4的增大而减小。
Z轴形变：
从Z轴(上下)方向看，R1和R4在同一平面，R2和R3在同一平面。
当被测物体受到从上往下方向的力时，刚性结构10会跟随被测物体发生一个从上往下的弯曲形变。受曲率的影响，力传感器R2和R3会受到拉伸而使力传感器的长度加长，R1和R4会受到挤压而使传感器的长度减小，这里以特性为长度加长使电阻增大的力传感器为例，所以R2和R3将会增大，R1和R4将减小。简言之，从上往下按压时，R2和R3变大，R1和R4减小，由上面结论可知Uo将往正方向变大。同理，当被测受到从下往上方向的力时，Uo将往负方向变大。
Y轴形变：
从Y轴(前后)方向看，R1和R2在同一平面，R3和R4在同一平面。
当被测物体受到从前往后的力时，刚性结构10会发生一个由前往后的弯曲形变，R4和R3发生近似相同的拉伸而使力传感器的长度加长，R1和R2发生近似相同的挤压而使力传感器的长度减小，即是R3和R4同时增大且增大的比例接近，R1和R2同时减小且减小的比例接近，所以Vp和Vn都基本保持不变。简言之，所以从前往后按压时，Uo＝Vp-Vn基本保持不变。同理，当被测受到从后往前方向的力时，Uo也基本保持不变。
所以电桥电路实施例1根据Uo产生的信号特征，可以识别被测物体受到的Z轴(上下)方向的压力。
电桥电路实施例2：
当靠近于第三面10c设置的两个力传感器R1、R2作为一组相对桥臂，靠近于第四面10d设置的两个力传感器R3、R4作为另一组相对桥臂时，电桥电路电连接于信号处理电路以检测刚性结构10在Y轴上的形变并得出被测物体的Y轴压力。
具体地，参阅图4，通过模拟开关进行选择后，分别将a和e短接到VCC，b和g 短接到Vp，f和c短接到Vn，d和h短接到GND。得到图7所示的电桥电路。
设VCC＝Ui，得
Vp＝R4Ui/(R1+R4)；
Vn＝R2Ui/(R3+R2)；
Uo＝Vp-Vn＝(R3R4-R1R2)Ui/[(R1+R4)(R3+R2)]......式组2
对R1、R2、R3和R4分别求导，可知Uo随R4和R3的增大而增大，随R1和R2的增大而减小。
Z轴形变：
从Z轴(上下)方向看，R1和R4在同一平面，R2和R3在同一平面。
当被测物体受到从上往下的力时，刚性结构10会相对应发生一个由上往下的弯曲形变，R2和R3发生近似相同的拉伸而使力传感器的长度加长，R1和R4发生近似相同的挤压而使力传感器的长度减小，即是R2和R3同时增大且增大比例接近，R1和R4同时减小且减小比例接近，将变化前后的数据代入式组2，Vp和Vn都基本保持不变。所以从上往下按压时，Uo＝Vp-Vn基本保持不变。同理，当被测物体受到从下往上方向的力时，Uo也基本保持不变。
Y轴形变：
从Y轴(前后)方向看，R1和R2在同一平面，R3和R4在同一平面。
当被测物体受到从前往后方向的力时，刚性结构10会跟随被测物体发生一个从上往下的弯曲形变。受曲率的影响，力传感器R3和R4会受到拉伸而使传感器的长度加长，R1和R2会受到挤压而使传感器的长度减小。所以R3和R4将会增大，R1和R2将减小。从上往下按压时，将R的前后变化量代入式组2，Uo＝Vp-Vn将往正方向变大。同理，当被测物体受到从后往前方向的力时，Uo将往负方向变大。
所以电桥电路实施例2根据Uo产生的信号特征，可以识别Y轴(前后)方向的压力。
上述表明，通过将四个力传感器连接形成不同的电桥电路，或者通过模拟开关对线路实时选择形成不同的电桥电路，根据信号就可以识别被测物体感受到的不同维度的作用力，实现多维度的力感应。该力感应装置除了能检测多维度的 变形，还具有温湿度漂移小、灵敏度高、安装方便等优点。
请参阅图9，在本申请另一实施例中，对于同一电桥电路，两组力传感器(其中一组为R1、R2，另外一组为R3、R4)对应设置于第三面10c与第四面10d，靠近于第一面10a设置的两个力传感器R1、R4所在平面与Z轴相互垂直，靠近于第二面10b设置的两个力传感器R2、R3所在平面与Z轴相互垂直。四个力传感器连接形成不同的电桥电路，电桥电路电连于信号处理电路，通过不同的信号特征可识别被测物体感受到的不同维度的作用力，实现多维度的力感应。
将力传感器放置于第三面10c与第四面10d，避免于其中一面力传感器与胶体全面接触，保证4个力传感器所处的环境状态相同或十分接近，有利于消除或降低由温度、湿度、电磁干扰等环境因素造成的不良影响。被测物体受到正向的严重撞击时，力传感器并没有跟随被测物体承受正向的冲击，增强了装置的可靠性。下面以两个电桥电路的实施例来展开说明。
电桥电路实施例3：
当靠近于第一面10a设置的两个力传感器R1、R4作为一组相对桥臂，靠近于第二面10b设置的两个力传感器R2、R3作为另一组相对桥臂时，电桥电路电连接于信号处理电路以检测刚性结构10在Z轴上的形变并得出被测物体的Z轴压力。
具体地，针对图9所示的4个力传感器，参阅图4，通过模拟开关进行选择后，分别将a和e短接到VCC，b和c短接到Vp，f和g短接到Vn，d和h短接到GND。得到图6所示的电桥电路。
设VCC＝Ui，得：
Vp＝R2Ui/(R1+R2)；
Vn＝R4Ui/(R3+R4)；
Uo＝Vp-Vn＝(R2R3-R1R4)Ui/[(R1+R2)(R3+R4)]......式组3
对R1、R2、R3和R4分别求导，可知Uo随R2和R3的增大而增大，随R1和R4的增大而减小。
Z轴形变：
从Z轴(上下)方向看，R1和R4在同一平面，R2和R3在同一平面。
当被测物体受到从上往下方向的力时，刚性结构10会跟随被测物体发生一个从 上往下的弯曲形变。受曲率的影响，力传感器R2和R3会受到拉伸而使传感器的长度加长，R1和R4会受到挤压而使传感器的长度减小，这里以特性为长度加长使电阻增大的力传感器为例，所以R2和R3将会增大，R1和R4将减小。简言之，从上往下按压时，R2和R3变大，R1和R4减小，由上面结论可知Uo将往正方向变大。同理，当被测受到从下往上方向的力时，Uo将往负方向变大。
Y轴形变：
从Y轴(前后)方向看，R1和R2在同一平面，R3和R4在同一平面。
当被测物体受到从前往后的力时，刚性结构10的会发生一个由前往后的弯曲形变，R4和R3发生近似相同的拉伸而使传感器的长度加长，R1和R2发生近似相同的挤压而使传感器的长度减小，即是R3和R4同时增大且增大的比例接近，R1和R2同时减小且减小的比例接近，所以Vp和Vn都基本保持不变。简言之，所以从前往后按压时，Uo＝Vp-Vn基本保持不变。同理，当被测受到从后往前方向的力时，Uo也基本保持不变。
所以电桥电路实施例3根据Uo产生的信号特征，可以识别被测物体受到的Z轴(上下)方向的压力。
电桥电路实施例4：
当设于第三面10c的一组力传感器R1、R2作为一组相对桥臂，设于第四面10d的一组力传感器R3、R4作为另一组相对桥臂时，电桥电路电连接于信号处理电路以检测刚性结构10在Y轴上的形变并得出被测物体的Y轴压力。
具体地，针对图9所示的4个力传感器，参阅图4，通过模拟开关进行选择后，分别将a和e短接到VCC，b和g短接到Vp，f和c短接到Vn，d和h短接到GND。得到图7所示的电桥电路。
设VCC＝Ui，得：
Vp＝R4Ui/(R1+R4)；
Vn＝R2Ui/(R3+R2)；
Uo＝Vp-Vn＝(R3R4-R1R2)Ui/[(R1+R4)(R3+R2)]......式组4
对R1、R2、R3和R4分别求导，可知Uo随R4和R3的增大而增大，随R1和R2的增大而减小。
Z轴形变：
从Z轴(上下)方向看，R1和R4在同一平面，R2和R3在同一平面。
当被测物体受到从上往下的力时，刚性结构10的会相对应发生一个由上往下的弯曲形变，R2和R3发生近似相同的拉伸而使力传感器的长度加长，R1和R4发生近似相同的挤压而使力传感器的长度减小，即是R2和R3同时增大且增大比例接近，R1和R4同时减小且减小比例接近，将变化前后的数据代入式组4，Vp和Vn都基本保持不变。所以从上往下按压时，Uo＝Vp-Vn基本保持不变。同理，当被测物体受到从下往上方向的力时，Uo也基本保持不变。
Y轴形变：
从Y轴(前后)方向看，R1和R2在同一平面，R3和R4在同一平面。
当被测物体受到从前往后方向的力时，刚性结构10会跟随被测物体发生一个从上往下的弯曲形变。受曲率的影响，力传感器R3和R4会受到拉伸而使传感器的长度加长，R1和R2会受到挤压而使力传感器的长度减小。所以R3和R4将会增大，R1和R2将减小。从上往下按压时，将R的前后变化量代入式组4，Uo＝Vp-Vn将往正方向变大。同理，当被测物体受到从后往前方向的力时，Uo将往负方向变大。
所以电桥电路实施例4根据Uo产生的信号，可以识别Y轴(前后)方向的压力。
上述表明，通过将四个力传感器连接形成不同的电桥电路，或者通过模拟开关对线路实时选择形成不同的电桥电路，根据信号就可以识别被测物体感受到的不同维度的作用力，实现多维度的力感应。该力感应装置除了能检测多维度的变形，还具有温湿度漂移小、灵敏度高、安装方便等优点。
请参阅图10，在本申请另一实施例中，同一应变放大区12设置至少两个电桥电路。通过将四个力传感器连接形成不同的电桥电路，或者通过模拟开关对线路实时选择形成不同的电桥电路，分析不同的信号特征识别被测物体感受到的不同维度的作用力，实现多维度的力感应。
具体地，将R1、R2、R3、R4、R5、R6、R7、R8等8个电阻设于应变放大区12的4个安装面。在电桥电路实施例1、2中选取一个实施例，在电桥电路实施例3 、4中选取一个实施例，将这两个实施例结合，可以得到不同布局下的多维度的力感应。
在本申请另一实施例中，在同一个区域增加4个电阻，可获得更丰富的压力信号，保证了测试的精确度。也可以在部分力传感器损坏的情况下满足性能需求，提高了产品的可靠性。需要指出的是，传感器的数量并不限于4或8个，可以是1通道或多通道，除了电压测量，也可以利用电流或电阻测量的方法实现压力检测。
请参阅图11，在本申请另一实施例中，对于同一电桥电路，两组力传感器(其中一组为R1、R4，另外一组为R2、R3)对应设置于相邻两个安装面，靠近于其中一个安装面设置的两个力传感器R2、R3所在平面与Y轴相互垂直，靠近于另外一个安装面设置的两个力传感器R1、R4所在平面与Z轴相互垂直；四个力传感器连接形成不同的电桥电路，电桥电路电连于信号处理电路，通过不同的信号特征可识别被测物体感受到的不同维度的作用力，实现多维度的力感应。下面以一个电桥电路的实施例来展开说明。
电桥电路实施例5：
当所有力传感器同时靠近于第三面10c(或第四面10d)设置，分别位于两个安装面的力传感器呈预定距离间隔时，电桥电路电连接于信号处理电路以检测刚性结构10在Z轴上的形变并得出被测物体的Z轴压力；
具体地，通过简单设置4个力传感器在刚性结构10的第一面10a和第三面10c，电连接后，假定组成图6所示的电桥电路。
设VCC＝Ui，得：
Vp＝R2Ui/(R1+R2)；
Vn＝R4Ui/(R3+R4)；
Uo＝Vp-Vn＝(R2R3-R1R4)Ui/[(R1+R2)(R3+R4)]......式组5
对R1、R2、R3和R4分别求导，可知Uo随R2和R3的增大而增大，随R1和R4的增大而减小。
从Z轴(上下)方向看，R1和R4在同一平面，R2和R3在相近于一平面。
当被测物体受到从上往下方向的力时，刚性结构10会跟随被测物体发生一个从 上往下的弯曲形变。受曲率的影响，力传感器R2和R3会受到拉伸而使传感器的长度加长，R1和R4会受到挤压而使力传感器的长度减小，这里以特性为长度加长使电阻增大的力传感器为例，所以R2和R3将会增大，R1和R4将减小。简言之，从上往下按压时，R2和R3变大，R1和R4减小，由上面结论可知Uo将往正方向变大。同理，当被测受到从下往上方向的力时，Uo将往负方向变大。
Y轴方向看，R1和R4、R2和R3均在相近于一平面。发生Y轴形变时，4个力传感器阻抗变化量相接近，Uo基本不变。
所以应用上述实施例5可以识别某一方向的形变，增加一个或多个电桥电路，用于识别Y轴形变，综合判断，即可识别多维形变。
可以理解地，当所有力传感器同时靠近于第一面10a或第二面10b设置，分别位于两个安装面的力传感器呈预定距离间隔时，电桥电路电连接于信号处理电路以检测刚性结构10在Z轴上的形变并得出被测物体的Y轴压力。
请参阅图1，在本申请另一实施例中，力传感器为应变感应电阻，应变感应电阻由多晶半导体材料、非晶半导体材料、多晶硅、石墨烯、铜镍合金、碳纳米管、金属细线、导体绝缘体复合材料中的至少一种材料制作。上述方案均能实现压力感应，按需选用。
请参阅图1至图3，在本申请另一实施例中，提供一种力感应方法，其采用上述的力感应装置，包括以下步骤：
将刚性结构10贴合在被测物体上；
将同一应变放大区12的四个力传感器R1、R2、R3、R4连接形成不同的电桥电路(如图6至图8)，不同的电桥电路电连接于信号处理电路以分别检测刚性结构10在不同方向上的形变并得出被测物体对应方向的作用力。
刚性结构10包括间隔设置的刚性块11，相邻两个刚性块11之间形成应变放大区12，四个力传感器R1、R2、R3、R4以两个为一组，两组力传感器选择性地对应设置于应变放大区12的其中两个安装面，该四个力传感器连接形成不同的电桥电路。在使用时将刚性结构10贴合在被测物体上，不同电桥电路电连接于信号处理电路，进而分别检测刚性结构10在不同方向上的形变并得出被测物体对应方向的作用力。该力感应装置为一体式结构，容易安装，电路简单，低成本。 力感应方法可以非常灵敏地检测被测物体在多维度方向上的微小形变，精准识别压力，满足无误触、灵敏度高、抗跌系数高、高可靠性等性能指标。
在本申请另一实施例中，对于同一电桥电路的四个力传感器R1、R2、R3、R4，通过检测力传感器的阻抗变化来识别不同方向的作用力。下面以图3所示力传感器为例说明：
被测物体受Z轴作用力：
作用力为从上往下，R1减小，R2增大，R3增大，R4减小。
作用力为从下往上，R1增大，R2减小，R3减小，R4增大。
被测物体受Y轴作用力：
作用力为从前往后，R1减小，R2减小，R3增大，R4增大。
作用力为从后往前，R1增大，R2增大，R3减小，R4减小。
被测物体受绕X轴扭转力：
以从左往右方向看，发生顺时针扭转或逆时针扭转，R1、R2、R3和R4均增大。
所以根据各个力传感器的阻抗变化特征，组合起来分析，可以识别不同维度的作用力。其它实施例是类似的，不再赘述。具体地，可通过外设电路实时监测各个力传感器的阻抗变化，进而识别不同方向的作用力。
在本申请另一实施例中，提供一种设备，包括被测物体及上述的力感应装置，刚性结构10贴合在被测物体上。由于本设备采用了上述所有实施例的全部技术方案，因此同样具有上述实施例的技术方案所带来的所有有益效果，在此不再一一赘述。
在本申请另一实施例中，被测物体为面板或边框。实现面板或边框的作用力感应。面板或边框可以采用玻璃、塑料、陶瓷等非金属材料制作。面板可以为具有刚性结构10的触摸屏、显示器或其他电子终端。边框可以为各种电子终端的边框。通过将力传感器与面板或边框连接，能够在实现精准识别触控压力的大小，为电子终端在产品应用、人机交互及消费体验上扩展了应用空间。用户通过触按触摸屏、显示器或电子终端，可以直接获得精确地作用力级别及量数。通过校正之后，可以获得精确作用力。
以上仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (15)

  1. 力感应装置，其特征在于，包括：
    用于与被测物体贴合且跟随被测物体变形的刚性结构，其包括沿X轴间隔设置的刚性块，相邻两个所述刚性块之间形成应变放大区，所述刚性结构在所述应变放大区的周围形成四个安装面；以及设置于所述应变放大区的若干力传感器，其中四个所述力传感器中的每两个所述力传感器作为一组，两组所述力传感器选择性地对应设置于其中两个所述安装面，该四个力传感器连接形成不同的电桥电路，不同的所述电桥电路电连接于信号处理电路以分别检测所述刚性结构在不同方向上的形变并得出被测物体对应方向的作用力。
  2. 如权利要求1所述的力感应装置，其特征在于，所述刚性结构对应设置两组所述力传感器的两个所述安装面上均设有柔性基材，该两组力传感器分别安装于对应的所述柔性基材。
  3. 如权利要求2所述的力感应装置，其特征在于，两个所述柔性基材通过一个母基材弯折形成。
  4. 如权利要求2所述的力感应装置，其特征在于，所述柔性基材与所述刚性结构的表面之间通过胶体粘接。
  5. 如权利要求1所述的力感应装置，其特征在于，同一所述电桥电路的四个所述力传感器、电源端、接地端与检测端之间通过模拟开关连接。
  6. 如权利要求1所述的力感应装置，其特征在于，所述力传感器的长度方向与X轴相互平行；四个所述安装面分为沿Z轴间隔分布的第一面与第二面，以及沿Y轴间隔分布的第三面与第四面，所述第一面作为与被测物体的贴合面，X轴、Y轴与Z轴两两相互垂直。
  7. 如权利要求6所述的力感应装置，其特征在于，对于同一所述电桥电路，两组所述力传感器对应设置于所述第一面与所述第二面，靠近于所述第三面设置的两个所述力传感器所在平面与Y轴相互垂 直，靠近于所述第四面设置的两个所述力传感器所在平面与Y轴相互垂直；
    当设于所述第一面的一组所述力传感器作为一组相对桥臂，设于所述第二面的一组所述力传感器作为另一组相对桥臂时，所述电桥电路电连接于信号处理电路以检测所述刚性结构在Z轴上的形变并得出被测物体的Z轴压力；
    当靠近于所述第三面设置的两个所述力传感器作为一组相对桥臂，靠近于所述第四面设置的两个所述力传感器作为另一组相对桥臂时，所述电桥电路电连接于信号处理电路以检测所述刚性结构在Y轴上的形变并得出被测物体的Y轴压力。
  8. 如权利要求6所述的力感应装置，其特征在于，对于同一所述电桥电路，两组所述力传感器对应设置于所述第三面与所述第四面，靠近于所述第一面设置的两个所述力传感器所在平面与Z轴相互垂直，靠近于所述第二面设置的两个所述力传感器所在平面与Z轴相互垂直；
    当靠近于所述第一面设置的两个所述力传感器作为一组相对桥臂，靠近于所述第二面设置的两个所述力传感器作为另一组相对桥臂时，所述电桥电路电连接于信号处理电路以检测所述刚性结构在Z轴上的形变并得出被测物体的Z轴压力；
    当设于所述第三面的一组所述力传感器作为一组相对桥臂，设于所述第四面的一组所述力传感器作为另一组相对桥臂时，所述电桥电路电连接于信号处理电路以检测所述刚性结构在Y轴上的形变并得出被测物体的Y轴压力。
  9. 如权利要求6所述的力感应装置，其特征在于，对于同一所述电桥电路，两组所述力传感器对应设置于相邻两个所述安装面，靠近于其中一个所述安装面设置的两个所述力传感器所在平面与Y轴相互垂直，靠近于另外一个所述安装面设置的两个所述力传感器所在平面与Z轴相互垂直；
    当所有所述力传感器同时靠近于所述第三面或所述第四面设置，分别位于两个所述安装面的所述力传感器呈预定距离间隔时，所述电桥电路电连接于信号处理电路以检测所述刚性结构在Z轴上的形变并得出被测物体的Z轴压力；
    当所有所述力传感器同时靠近于所述第一面或所述第二面设置，分别位于两个所述安装面的所述力传感器呈预定距离间隔时，所述电桥电路电连接于信号处理电路以检测所述刚性结构在Z轴上的形变并得出被测物体的Y轴压力。
  10. 如权利要求1所述的力感应装置，其特征在于，同一所述应变放大区设置至少两个所述电桥电路。
  11. 如权利要求1所述的力感应装置，其特征在于，所述力传感器为应变感应电阻，所述应变感应电阻由多晶半导体材料、非晶半导体材料、多晶硅、石墨烯、铜镍合金、碳纳米管、金属细线、导体绝缘体复合材料中的至少一种材料制作。
  12. 如权利要求1所述的力感应装置，其特征在于，所述刚性结构为钢片、铝片、玻璃片或FR4片。
  13. 力感应方法，其特征在于，其采用如权利要求1所述的力感应装置，包括以下步骤：
    将所述刚性结构贴合在被测物体上；
    将同一所述应变放大区的所述四个力传感器连接形成不同的电桥电路，不同的所述电桥电路电连接于信号处理电路以分别检测所述刚性结构在不同方向上的形变并得出被测物体对应方向的作用力。
  14. 如权利要求13所述的力感应方法，其特征在于，对于同一所述电桥电路的四个所述力传感器，通过检测所述力传感器的阻抗变化来识别不同方向的作用力。
  15. 设备，其特征在于，包括被测物体及如权利要求1所述的力感应装置，所述刚性结构贴合在所述被测物体上。
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