WO2022047738A1 - 压力感应装置及电子设备 - Google Patents

压力感应装置及电子设备 Download PDF

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Publication number
WO2022047738A1
WO2022047738A1 PCT/CN2020/113537 CN2020113537W WO2022047738A1 WO 2022047738 A1 WO2022047738 A1 WO 2022047738A1 CN 2020113537 W CN2020113537 W CN 2020113537W WO 2022047738 A1 WO2022047738 A1 WO 2022047738A1
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WO
WIPO (PCT)
Prior art keywords
substrate
pressure sensing
sensing device
panel
pressure
Prior art date
Application number
PCT/CN2020/113537
Other languages
English (en)
French (fr)
Inventor
李灏
刘伟治
Original Assignee
深圳纽迪瑞科技开发有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳纽迪瑞科技开发有限公司 filed Critical 深圳纽迪瑞科技开发有限公司
Priority to CN202080103576.4A priority Critical patent/CN116097074A/zh
Priority to PCT/CN2020/113537 priority patent/WO2022047738A1/zh
Priority to US18/024,462 priority patent/US20230325021A1/en
Publication of WO2022047738A1 publication Critical patent/WO2022047738A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G06F3/04144—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position using an array of force sensing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • G01L1/2262—Measuring circuits therefor involving simple electrical bridges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches

Definitions

  • the present application relates to the technical field of pressure sensing, and more particularly, to a pressure sensing device and electronic equipment.
  • the pressure realization scheme of the full-touch tablet computer includes cantilever beam load cells and piezoelectric ceramic pressure sensors for pressure sensing feedback.
  • the microprocessor of the bus interface is combined into a cantilever beam load cell system.
  • the signal conditioning circuit is used to condition the signal output by the cantilever beam load cell.
  • the output signal of the cantilever beam load cell is amplified and converted into a digital signal before being sent to the microprocessor.
  • the cantilever beam load cell is in use.
  • One of the objectives of the embodiments of the present application is to provide a pressure sensing device and an electronic device, aiming to solve the problems of high structural dependence, inconvenient assembly and high cost of the cantilever beam load cell in the prior art.
  • a pressure sensing device comprising:
  • the pressure sensor is disposed on the upper surface and/or the lower surface of the substrate, and the pressure sensor is electrically connected to the detection circuit;
  • a pad which is arranged on the upper surface of the substrate and can be soldered to the panel of the electronic device, the pad is electrically connected to the electronic device, and the pad is used to withstand force signals and electrical Signal transmission;
  • a support member which is arranged on the lower surface of the base plate and is used for supporting the base plate.
  • the number of the pressure sensors is multiple, and the multiple sensors are electrically connected.
  • the pressure sensor is provided with at least one channel.
  • a plurality of the pads are provided, and the plurality of the pads are arranged at intervals along the edge of the upper surface.
  • the bonding pads can be soldered to the panel through a patch.
  • the cross-section of the substrate is any one of a rectangle, a triangle or a cross.
  • the substrate is a flexible circuit board, an aluminum substrate, a ceramic substrate or an FR-4 circuit board.
  • an electronic device including a panel and the pressure sensing device according to any one of the above embodiments, wherein a pad of the pressure sensing device is welded to the panel, and the pad is connected to the electronic device. electrical connection.
  • the electronic device further includes a base connected to the support of the pressure sensing device.
  • the panel is a touch pad or touch screen.
  • the beneficial effects of the pressure sensing device provided by the embodiments of the present application are: compared with the prior art, the pressure sensing device of the present application, by arranging the pressure sensor on the substrate and disposing the pad on the substrate, can communicate with the electronic equipment through the pad.
  • the panel is welded, and the substrate is supported by the support, so that the pressure sensor is directly installed under the panel.
  • the entire pressure sensing device is directly installed with the panel to be tested, avoiding the cantilever beam weighing sensor only One end is installed with the product to be tested, which leads to the problem of high dependence on the structure, which improves the installation versatility of the pressure sensing device.
  • the pressure sensing device of the present application is a standard product, which can be compatible with different customer usage requirements, reduces the production cost of the product, and makes the product cost low.
  • FIG. 1 is a schematic structural diagram of a pressure sensing device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a pressure sensing device provided by an embodiment of the present application installed on an electronic device;
  • FIG. 3 is a schematic diagram of an installation of a pressure sensor and a substrate of a pressure sensing device provided by an embodiment of the present application;
  • FIG. 4 is another schematic diagram of installation of a pressure sensor and a substrate of a pressure sensing device provided by an embodiment of the present application;
  • FIG. 5 is a schematic diagram of an installation of a pressure sensor and a substrate of a pressure sensing device provided by an embodiment of the present application;
  • FIG. 6 is a schematic diagram of a single channel of a pressure sensor of a pressure sensing device provided by an embodiment of the present application
  • FIG. 7 is a schematic diagram of a dual channel of a pressure sensor of a pressure sensing device provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a structure of a substrate of a pressure sensing device provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of another structure of a substrate of a pressure sensing device provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of another Y-shaped structure of the substrate of the pressure sensing device provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of another structure of the substrate of the pressure sensing device provided by an embodiment of the present application.
  • FIG. 12 is a partial schematic diagram of a pressure sensing device provided on an electronic device according to an embodiment of the present application.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • plurality means two or more, unless otherwise expressly and specifically defined.
  • an embodiment of the present application provides a pressure sensing device 100 , which can be used on an electronic device 200 , including a substrate 10 , a pressure sensor 20 , a pad 30 and a support 40 , and the substrate has A detection circuit for detecting the resistance value change of the bridge circuit, the pressure sensor 20 is arranged on the upper surface 11 and/or the lower surface 12 of the substrate 10, and the pressure sensor 20 is electrically connected to the detection circuit;
  • the pads 30 are disposed on the upper surface 11 of the substrate 10 and can be soldered to the panel 201 of the electronic device 200 .
  • the pads 30 are electrically connected to the electronic device 200 .
  • the pads 30 are connected to the substrate. 10 is electrically connected, the substrate 10 is electrically connected to the electronic device 200, and the pads 30 are used for bearing force signals and electrical signal transmission; the support member 40 is arranged on the lower surface 12 of the substrate 10 for supporting all The substrate 10 is described.
  • the pressure sensor 20 is arranged on the substrate 10, and the pad 30 is arranged on the substrate 10, and the pad 30 is welded with the panel 201 of the electronic device 200, and the substrate is supported by the support 40 at the same time.
  • the pressure sensor 20 is directly installed under the panel 201, and the entire pressure sensing device 100 is directly installed with the panel 201 to be measured through the mounting structure of the pad 30, avoiding that the cantilever beam weighing sensor can only pass through its one end. Mounting with the product to be tested leads to the problem of high dependence on the structure.
  • the panel 201 is used.
  • the sensing device 100 is a standard product, which can be compatible with different customer usage requirements and is low in cost.
  • the number of the pressure sensors 20 is multiple, and the multiple sensors are electrically connected.
  • a plurality of pressure sensors 20 may be provided, and a plurality of pressure sensors 20 may be provided on the upper surface 11 of the substrate 10 , or a plurality of pressure sensors 20 may be provided on the lower surface 12 of the substrate 10 .
  • a plurality of sensors are evenly arranged on the upper surface 11 and the lower surface 12 of the substrate 10 to increase the sensitivity of the pressure sensing device 100 during measurement.
  • a pressure sensor 20 can also be arranged on the substrate 10 on the upper surface 11 , or a pressure sensor 20 is provided on the lower surface 12 of the substrate 10 .
  • the pressure sensor 20 in addition to the NDT (Non-destructive testing) micro pressure strain sensor, can also use wire strain gauges, silicon wafer strain gauges, polycrystalline or amorphous semiconductors, Copper-nickel alloys, carbon nanotubes, graphene, piezoelectric ceramics, and other pressure-sensitive materials such as conductor-insulator composite materials, etc., between the pressure sensors 20, CU (copper), AG (silver), carbon paste, etc. can be used for all conductive materials. materials for electrical connections.
  • the pressure sensor 20 is provided with at least one channel.
  • the channel of the pressure sensor 20 can be set to a single-channel signal transmission mode, as shown in FIG. 7 , a dual-channel signal transmission mode can also be set, or the pressure sensor 20 can be set to multiple As for the signal transmission mode of the channel, the number of channels can be set according to the needs of the electronic device 200 to be tested.
  • a plurality of the pads 30 are provided, and the plurality of the pads 30 are provided along the edge of the upper surface 11 .
  • a plurality of pads 30 may be provided.
  • the cross-section of the substrate 10 is a rectangle, that is, the substrate 10 is a cube.
  • Four pads 30 are provided, and two pads 30 of the four pads 30 are arranged on On the left side of the upper surface 11 of the substrate 10, the two pads 30 are arranged on the right side of the upper surface 11 of the substrate 10, so that when the pads 30 are soldered with the panel 201 of the electronic device 200, the panel 201 is connected to the pressure sensing device 100. It is more stable, and at the same time, when the panel 201 is touched, the pad 30 can withstand force signal and electrical signal transmission through the connection solder joint with the panel 201 .
  • the pad 30 is welded on the panel 201 by SMT.
  • the bonding pads 30 may be welded with the panel 201 through a patch.
  • the bonding pads 30 and the panel 201 can be soldered to the bonding pads 30 and the panel 201 by using a surface mount technology, so as to fix the pressure sensing device 100 on the panel 201 of the electronic device 200 .
  • the cross section of the substrate 10 is any one of a rectangle, a triangle, a cross or a Y shape.
  • the base plate 10 can be set in any shape of a rectangle, a triangle or a cross. Of course, the base plate 10 can also be in other shapes. As shown in FIG. 120°, which may be matched and set according to the shape of the panel 201 of the electronic device 200 .
  • the substrate 10 is a flexible circuit board, an aluminum substrate, a ceramic substrate, or an FR-4 circuit board.
  • the substrate 10 can be selected from a flexible circuit board, an aluminum substrate, a ceramic substrate or an FR-4 circuit board.
  • the substrate 10 is made of a metal material circuit board, such as an aluminum substrate, or a plastic, ceramic , thin glass and other materials.
  • another embodiment of the present application further provides an electronic device 200 , including a panel 201 and the pressure sensing device 100 described in any of the above embodiments.
  • the pad 30 is soldered to the panel 201 , and the pad 30 is electrically connected to the electronic device 200 .
  • the pad 30 of the pressure sensing device 100 is welded on the panel 201 by SMT, and the pad 30 bears force signals and transmits electrical signals at the same time.
  • multiple pressures can be welded on the panel 201 by SMT through the pad 30 Induction device 100 .
  • the pressure sensing device 100 is installed on the panel 201 of the Track Pad, the panel 201 and the substrate 10 are welded by the pads 30 (not shown in the figure), and a plurality of pressure sensors 20 are arranged on the substrate 10 , the number of pressure sensors 20 on the substrate 10 is configured according to actual needs.
  • the panel 201 By pressing the panel 201, the actual pressure value, pressure position and gesture information can be obtained through the electrical signal output of each pressure sensor 20.
  • the specific output algorithm is the same as that in the prior art.
  • the algorithm of the pressure sensor is the same, and will not be repeated here.
  • the electronic device 200 may be a full-touch tablet computer, an electronic display screen, a smart phone, or the like, and the panel 201 may be a touch panel or a touch screen.
  • the electronic device 200 further includes a base 202 , and the base 202 is connected to the support 40 of the pressure sensing device 100 .
  • the pads 30 of the pressure sensing device 100 and the panel 201 are welded by the patch mounting technology, and then connected to the base 202 through the support member 40, so that the pressure sensing device 100 is installed on the electronic device 200, wherein the support
  • the component 40 may be a connector made of a flexible material or a connector made of a rigid material.
  • the nut is welded to the lower surface 12 of the substrate 10 by SMT, or it can be directly glued, VHB (Very High Bond) Acrylic double-sided foam tape, double-sided tape, and various dispensing glues are attached to the base 202.
  • the pressure sensing device 100 provided in this application can be used on a product to be tested, and the product to be tested can be an electronic device 200, which works as follows:
  • the pressure sensing device 100 can be arranged between the panel 201 and the base 202, and can also be a pressure sensing device 100. When the pressure is applied, all the pressures will act on the pressure sensing device 100 in an all-round way, thereby improving the sensitivity of the measurement.
  • the implementation of the pressure sensing device provided by this embodiment has at least the following beneficial technical effects compared with the prior art: the pressure sensing device of the present application is provided with a pressure sensor on the substrate, and a solder joint is arranged on the substrate.
  • the plate is welded to the panel of the electronic equipment through the pad, and the substrate is supported by the support, so that the pressure sensor is directly installed under the panel, and the entire pressure sensing device is directly installed with the panel to be tested through the installation structure of the pad, avoiding
  • the cantilever beam load cell can only be installed with the product to be tested through its one end, which leads to the problem of high dependence on the structure.
  • all the pressure will fully act on the pressure sensing device, and then Improved measurement sensitivity.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

一种压力感应装置(100)及电子设备(200)，该压力感应装置(100)包括基板(10)、压力传感器(20)、焊盘(30)和支撑件(40)，压力传感器(20)设于基板(10)上，焊盘(30)设置于基板(10)上，焊盘(30)可与电子设备(200)的面板(201)焊接，焊盘(30)用于承受力信号和电信号传输；支撑件(40)设于基板(10)的下表面。该压力感应装置(100)通过在基板(10)上设压力传感器(20)，并在基板(10)上设焊盘(30)，通过焊盘(30)与面板(201)焊接，使压力传感器(20)直接安装在面板(201)的下方，通过焊盘(30)的安装结构，使整个压力感应装置(100)直接与面板(201)安装，提高了安装通用性。

Description

压力感应装置及电子设备 技术领域
本申请涉及压力传感技术领域，更具体地说，是涉及一种压力感应装置及电子设备。
 背景技术
目前，全触控平板电脑(Track Pad)的压力实现方案，有悬臂梁称重传感器和压电陶瓷压力传感器等方式进行压力传感反馈，其中，悬臂梁称重传感器通过信号调理电路、带数字总线接口的微处理器组合为一整体而构成的一个悬臂梁称重传感器系统。信号调理电路是用来调理悬臂梁称重传感器输出的信号的，将悬臂梁称重传感器输出信号进行放大并转换为数字信号后送人微处理器，同时，悬臂梁式称重传感器在使用时，通过使悬臂梁式称重传感器的一端固定，悬臂梁式称重传感器的另一端加载待测产品，使悬臂梁称重传感器只能与安装待测产品的一端进行安装，对结构有着高度的依赖性，不便于待测产品的装配，而且成本高昂，不便于普及。
技术问题
本申请实施例的目的之一在于：提供一种压力感应装置及电子设备，旨在解决现有技术中悬臂梁称重传感器的结构依赖性高，不便于装配以及成本高昂的问题。
 技术解决方案
为解决上述技术问题，本申请实施例采用的技术方案是：
第一方面，提供了一种压力感应装置，包括：
基板，所述基板上具有用于检测电桥电路的电阻值变化的检测电路；
压力传感器，所述压力传感器设置于所述基板的上表面和/或下表面，且所述压力传感器与所述检测电路电连接；
焊盘，所述焊盘设置于所述基板的上表面，可与所述电子设备的面板焊接，所述焊盘与所述电子设备电连接，且所述焊盘用于承受力信号和电信号传输；
支撑件，所述支撑件设置于所述基板的下表面上，用于支撑所述基板。
在一个实施例中，所述压力传感器的数量为多个，且多个所述传感器之间电连接。
在一个实施例中，所述压力传感器至少设置有一个通道。
在一个实施例中，所述焊盘设置有多个，多个所述焊盘沿所述上表面的边沿间隔设置。
在一个实施例中，所述焊盘可与所述面板通过贴片相焊接。
在一个实施例中，所述基板的横截面呈矩形、三角形或十字形中的任意一种。
在一个实施例中，所述基板为挠性线路板、铝基板、陶瓷基板或FR-4线路板。
第二方面，提供了一种电子设备，包括面板和上述任一实施例所述的压力感应装置，所述压力感应装置的焊盘与所述面板相焊接，所述焊盘与所述电子设备电连接。
在一个实施例中，所述电子设备还包括底座，所述底座与所述压力感应装置的支撑件相连接。
在一个实施例中，所述面板为触摸板或触摸屏。
 有益效果
本申请实施例提供的压力感应装置的有益效果在于：与现有技术相比，本申请的压力感应装置，通过在基板上设置压力传感器，并在基板上设置焊盘，通过焊盘与电子设备的面板焊接，同时通过支撑件支撑基板，使压力传感器直接安装在面板的下方，通过焊盘的安装结构，使整个压力感应装置直接与待测的面板安装，避免了悬臂梁称重传感器只能通过其一端与待测产品进行安装，导致对结构高度依赖性的问题，提高了压力感应装置的安装通用性，另外，由于传统悬臂梁称重传感器需要根据不同客户进行定制，导致成本高昂，而本申请的压力感应装置是标准产品，可以兼容不同的客户使用需求，降低了产品的生产制造成本，使产品成本低廉。
 附图说明
图1是本申请的一个实施例提供的压力感应装置的结构示意图；
图2是本申请的一个实施例提供的压力感应装置安装在电子设备上的示意图；
图3是本申请的一个实施例提供的压力感应装置的压力传感器与基板的一种安装示意图；
图4是本申请的一个实施例提供的压力感应装置的压力传感器与基板的另一种安装示意图；
图5是本申请的一个实施例提供的压力感应装置的压力传感器与基板的一种安装示意图；
图6本申请的一个实施例提供的压力感应装置的压力传感器的单通道示意图；
图7本申请的一个实施例提供的压力感应装置的压力传感器的双通道示意图；
图8本申请的一个实施例提供的压力感应装置的基板一种结构的示意图；
图9本申请的一个实施例提供的压力感应装置的基板另一种结构的示意图；
图10本申请的一个实施例提供的压力感应装置的基板又一种结构Y形的示意图；
图11本申请的一个实施例提供的压力感应装置的基板再一种结构的示意图；
图12是本申请的一个实施例提供的压力感应装置安装在电子设备上的局部示意图。
上述附图所涉及的标号明细如下：
100-压力感应装置；
10-基板；20-压力传感器；30-焊盘；40-支撑件；
11-上表面；12-下表面；
200-电子设备；201-面板；202-底座。
 本发明的实施方式
为了使本申请所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
为了说明本申请所述的技术方案，以下结合具体附图及实施例进行详细说明。
如图1至图5所示，本申请的一个实施例提供了压力感应装置100，可用于电子设备200上，包括基板10、压力传感器20、焊盘30和支撑件40，所述基板上具有用于检测电桥电路的电阻值变化的检测电路，所述压力传感器20设置于所述基板10的上表面11和/或下表面12，且所述压力传感器20与所述检测电路电连接；所述焊盘30设置于所述基板10的上表面11，可与所述电子设备200的面板201焊接，所述焊盘30与所述电子设备200电连接，具体地，焊盘30与基板10电连接，基板10与电子设备200电连接，且所述焊盘30用于承受力信号和电信号传输；所述支撑件40设置于所述基板10的下表面12上，用于支撑所述基板10。
本实施例提供的压力感应装置100，通过在基板10上设置压力传感器20，并在基板10上设置焊盘30，通过焊盘30与电子设备200的面板201焊接，同时通过支撑件40支撑基板10，使压力传感器20直接安装在面板201的下方，通过焊盘30的安装结构，使整个压力感应装置100直接与待测的面板201安装，避免了悬臂梁称重传感器的只能通过其一端与待测产品进行安装，导致对结构高度依赖性的问题，另外，通过在基板10上安装压力传感器20，并通过焊盘30与电子设备200的面板201焊接，使用时，在对面板201进行施加压力时，使所有压力均会全面作用在压力感应装置100上，进而提高了测量的灵敏度，另外，由于传统悬臂梁称重传感器需要根据不同客户进行定制，导致成本高昂，而本申请的压力感应装置100是标准产品，可以兼容不同的客户使用需求，成本低廉。
在本申请的一些实施例中，可选地，如图1、图3至图5所示，所述压力传感器20的数量为多个，且多个所述传感器之间电连接。
在该实施例中，压力传感器20可以设置多个，将多个压力传感器20设置在基板10的上表面11，或将多个压力传感器20设置在基板10的下表面12，同时还可以同时在基板10的上表面11和下表面12均布设置多个传感器，使其测量时增加了压力感应装置100的灵敏度，当然，根据待测的电子设备200需要，还可以设置一个压力传感器20在基板10的上表面11，或设置一个压力传感器20在基板10的下表面12。
需要说明的是，压力传感器20,除了NDT（Non-destructive testing）的微压力应变传感器之外，也可以在此结构上是使用金属丝应变片、硅片应变片、多晶或非晶半导体、铜镍合金、碳纳米管、石墨烯、压电陶瓷、以及导体绝缘体复合材料等其他压感材料等,压力传感器20之间可以用CU（铜）、AG（银）、碳浆等一切具有导电性的材料进行电路连接。
在本申请的一些实施例中，可选地，如图6和图7所示，所述压力传感器20至少设置有一个通道。
在该实施例中，如图6所示，压力传感器20的通道可以设置单通道的信号传输模式，如图7所示，还可以设置双通道的信号传输模式，或者使压力传感器20设置成多通道的信号传输模式，具体可以根据配合待测电子设备200的需要，进而设置通道的数量。
在本申请的一些实施例中，可选地，如图1至图5所示，所述焊盘30设置有多个，多个所述焊盘30沿所述上表面11的边沿设置。
在该实施例中，焊盘30可以设置多个，例如基板10的横截面为矩形，也就是基板10为立方体，设置四个焊盘30，四个焊盘30中两个焊盘30设置在基板10的上表面11左边位置，两个焊盘30设置在基板10的上表面11右边位置，这样在焊盘30与电子设备200的面板201焊接时，使面板201与压力感应装置100的连接更加稳固，同时，在触碰面板201时，焊盘30可以通过与面板201的连接焊点承受力信号和电信号传输，可选地，焊盘30通过SMT方式焊接在面板201上。
在本申请的上述实施例中，可选地，所述焊盘30可与所述面板201通过贴片相焊接。焊盘30与面板201可以通过表面贴装技术用贴片使焊盘30与面板201焊接，以将压力感应装置100固定在电子设备200的面板201上。
在本申请的一些实施例中，可选地，如图8至图11所示，所述基板10的横截面为矩形、三角形、十字形或Y形中的任意一种。
在该实施例中，基板10可以设置成矩形、三角形或十字形中的任意一种形状，当然基板10还可以是其他形状，如图10所示，基板10的三个支板之间互相呈120°，具体可以根据电子设备200的面板201的形状进行匹配设置。
在本申请的一些实施例中，可选地，所述基板10为挠性线路板、铝基板、陶瓷基板或FR-4线路板。
在该实施例中，基板10可以选择挠性线路板、铝基板、陶瓷基板或FR-4线路板，具体地，基板10由金属材料线路板制成，如铝制基板，或者由塑料、陶瓷、薄片玻璃等材料制成。
如图2和图12所示，本申请的另一个实施例还提供了一种电子设备200，包括面板201和上述任一实施例所述的压力感应装置100，所述压力感应装置100的焊盘30与所述面板201相焊接，所述焊盘30与所述电子设备200电连接。
具体地，压力感应装置100的焊盘30通过SMT方式焊接在面板201上，焊盘30同时承受力信号和传输电信号，另外，在面板201上可以通过焊盘30用SMT方式焊接多个压力感应装置100。
如图12所示，将压力感应装置100安装在Track Pad的面板201上，面板201与基板10通过焊盘30相焊接，（图中未示出），多个压力传感器20设置在基板10上，基板10上压力传感器20的数量根据实际需要进行配置，通过按压面板201，实际压力值及压力位置和手势信息可以通过各个压力传感器20的电信号输出得出，具体输出算法与现有技术中压力传感器的算法相同，在此就不一一赘述。
需要说明的是，电子设备200可以是全触控平板电脑，还可以是电子显示屏，还可以是智能手机等，面板201可以为触摸板或触摸屏。
在本申请的一些实施例中，可选地，如图2所示，所述电子设备200还包括底座202，所述底座202与所述压力感应装置100的支撑件40相连接。
在该实施例中，压力感应装置100的焊盘30与面板201通过贴片安装技术焊接，再通过支撑件40与底座202连接，进而将压力感应装置100安装在电子设备200上，其中，支撑件40可以是柔性材料制成的连接件，还可以是刚性材料制成的连接件，譬如螺帽通过SMT焊接在基板10的下表面12，也可以直接通过胶水，VHB（Very High Bond）聚丙烯酸酯双面泡绵胶带、双面胶、各种点胶和底座202相连。
本申请提供的压力感应装置100，可用在待测产品上，待测产品可以是电子设备200，是这样工作的：
通过在基板10的上表面11和/或下表面12设置压力传感器20，形成检测电路，并在基板10的上表面11连接焊盘30，焊盘30通过SMT方式与电子设备200的面板201焊接，再通过支撑件40与电子设备200的底座202连接，其中，压力感应装置100可以在面板201与底座202之间设置多个，也可以是一个压力感应装置100，使用时，在对面板201进行施加压力时，使所有压力均会全面作用在压力感应装置100上，进而提高了测量的灵敏度。
综上所述，实施本实施例提供的压力感应装置，与现有技术相比，至少具有以下有益技术效果：本申请的压力感应装置，通过在基板上设置压力传感器，并在基板上设置焊盘，通过焊盘与电子设备的面板焊接，同时通过支撑件支撑基板，使压力传感器直接安装在面板的下方，通过焊盘的安装结构，使整个压力感应装置直接与待测的面板安装，避免了悬臂梁称重传感器的只能通过其一端与待测产品安装导致对结构高度依赖性的问题，另外，在对面板进行施加压力时，使所有压力均会全面作用在压力感应装置上，进而提高了测量的灵敏度。
以上所述仅为本申请的可选实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种压力感应装置，可用于电子设备上，其特征在于，所述压力感应装置包括：
    基板，所述基板上具有用于检测电桥电路的电阻值变化的检测电路；
    压力传感器，所述压力传感器设置于所述基板的上表面和/或下表面，且所述压力传感器与所述检测电路电连接；
    焊盘，所述焊盘设置于所述基板的上表面，可与所述电子设备的面板焊接，所述焊盘与所述电子设备电连接，且所述焊盘用于承受力信号和电信号传输；
    支撑件，所述支撑件设置于所述基板的下表面上，用于支撑所述基板。
  2. 如权利要求1所述的压力感应装置，其特征在于，
    所述压力传感器的数量为多个，且多个所述传感器之间电连接。
  3. 如权利要求1所述的压力感应装置，其特征在于，
    所述压力传感器至少设置有一个通道。
  4. 如权利要求1所述的压力感应装置，其特征在于，
    所述焊盘设置有多个，多个所述焊盘沿所述上表面的边沿间隔设置。
  5. 如权利要求1所述的压力感应装置，其特征在于，
    所述焊盘可与所述面板通过贴片相焊接。
  6. 如权利要求1所述的压力感应装置，其特征在于，
    所述基板的横截面呈矩形、三角形或十字形中的任意一种。
  7. 如权利要求1所述的压力感应装置，其特征在于，
    所述基板为挠性线路板、铝基板、陶瓷基板或FR-4线路板。
  8. 一种电子设备，其特征在于，包括面板和如权利要求1至7中任一项所述的压力感应装置，所述压力感应装置的焊盘与所述面板相焊接，所述焊盘与所述电子设备电连接。
  9. 如权利要求8所述的电子设备，其特征在于，
    所述电子设备还包括底座，所述底座与所述压力感应装置的支撑件相连接。
  10. 如权利要求8所述的电子设备，其特征在于，
    所述面板为触摸板或触摸屏。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205562089U (zh) * 2016-02-22 2016-09-07 厦门乃尔电子有限公司 超薄压力传感器
CN106301324A (zh) * 2015-06-05 2017-01-04 深圳纽迪瑞科技开发有限公司 压力感应按键结构及具有该压力感应按键结构的终端设备
WO2019014866A1 (zh) * 2017-07-19 2019-01-24 深圳纽迪瑞科技开发有限公司 一种压力感应装置及压力感应设备
WO2020129346A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 押圧センサおよび押圧検出装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106301324A (zh) * 2015-06-05 2017-01-04 深圳纽迪瑞科技开发有限公司 压力感应按键结构及具有该压力感应按键结构的终端设备
CN205562089U (zh) * 2016-02-22 2016-09-07 厦门乃尔电子有限公司 超薄压力传感器
WO2019014866A1 (zh) * 2017-07-19 2019-01-24 深圳纽迪瑞科技开发有限公司 一种压力感应装置及压力感应设备
WO2020129346A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 押圧センサおよび押圧検出装置

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