WO2020113385A1 - 显示面板以及显示模组 - Google Patents

显示面板以及显示模组 Download PDF

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Publication number
WO2020113385A1
WO2020113385A1 PCT/CN2018/118986 CN2018118986W WO2020113385A1 WO 2020113385 A1 WO2020113385 A1 WO 2020113385A1 CN 2018118986 W CN2018118986 W CN 2018118986W WO 2020113385 A1 WO2020113385 A1 WO 2020113385A1
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WO
WIPO (PCT)
Prior art keywords
display panel
bonding pad
bonding
bonding pads
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/118986
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English (en)
French (fr)
Inventor
张祖强
吴焕达
谭桂财
邱昌明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2018/118986 priority Critical patent/WO2020113385A1/zh
Priority to CN201880097608.7A priority patent/CN113169147A/zh
Publication of WO2020113385A1 publication Critical patent/WO2020113385A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Definitions

  • the invention relates to the field of display technology, in particular to a display panel and a display module.
  • the display module mainly includes a display panel and a corresponding driving circuit.
  • an external driving chip or FPC Flexible Printed Circuit
  • This process is generally called This is bonding, and the external driver chip or FPC and the like bound to the display panel are bonding objects.
  • the conductive medium can be ACF adhesive.
  • ACF adhesive is that the electrical conduction direction of the Z-axis is significantly different from the resistance characteristics of the XY insulation plane, that is, the on-resistance value of the Z-axis Far less than the insulation resistance of the XY plane.
  • ACF glue contains many conductive particles. Place the ACF glue between the parts that need to be electrically connected and then pressurize. Due to the action of the conductive particles, it will conduct in the direction of pressure, thereby turning on the parts that need to be electrically connected.
  • the conductive particles in the conductive medium make the first bonding pad 101 (pad) located on the bonding area of the display panel 100 and the second bonding pad located on the bonding object 200 201 (pad) is turned on, thereby turning on the display panel 100 and the binding object 200.
  • the wire 102 passes next to the first bonding pad 101 of the display panel 100 (the distance is only a few um), it may be due to the deviation of the binding alignment or the proximity of two or more conductive particles 300, such as As shown in FIG. 2, poor insulation of the insulating film of the lead 102 may occur (may be caused by process or defects) or the conductive particles 300 crush the insulating film due to the pressure during pressing (for example, the flexible substrate of the flexible panel is soft and may require a large Bonding pressure, etc.), it will cause short circuit or leakage of panel wiring.
  • the present invention provides a display panel and a display module capable of avoiding short circuit or leakage of wires in the binding area.
  • the present invention provides a display panel provided with a plurality of spaced-apart first bonding pads and wires disposed adjacent to the first bonding pads.
  • the height of the first bonding pads is greater than the height of the wires.
  • the first bonding pad includes a body portion and at least one extension portion provided on the body portion and extending sideways, the extension portion is at least partially shielded above the wire.
  • the extending portions on two adjacent first bonding pads extend toward each other.
  • each of the first bonding pads is provided with at least one extending portion that extends one-to-one to the adjacent first bonding pads.
  • the extension portion on each first bonding pad has a ring shape surrounding the periphery of the first bonding pad.
  • the extended portion of the first bonding pad extends laterally along the top surface of the first bonding pad.
  • the wire includes a first wire disposed between the first bonding pad and the display panel.
  • the wire further includes a second wire disposed between two adjacent first wires.
  • a high-low drop is formed between the plurality of first bonding pads.
  • a height difference is formed between every two adjacent first bonding pads.
  • the display panel is a flexible display panel.
  • the present invention provides a display module including a binding object and the above-mentioned display panel, the binding object is provided with a plurality of second bonding pads corresponding to the plurality of first bonding pads in one-to-one correspondence, The binding area and the binding object are bound by ACF glue, so that the first bonding pad and the second bonding pad are connected.
  • the plurality of first bonding pads form a high-low drop
  • the plurality of second bonding pads form a high-low drop opposite to that of the first bonding pad.
  • each adjacent first bonding pad forms a high-low drop
  • each adjacent second bonding pad forms a high-low drop
  • the conductive medium is ACF glue.
  • the display panel of the present invention through the unique structure of the first bonding pad of the display panel and the second bonding pad of the binding object, can effectively prevent the conductive particles in the conductive medium from directly pressing on the wires, and avoid causing short circuit or short circuit of the display panel Electric leakage.
  • FIG. 1 is a cross-sectional view of a display module in the prior art.
  • FIG. 2 is a schematic cross-sectional view of a display module in the prior art.
  • FIG. 3 is a schematic cross-sectional view of a display module in an embodiment of the invention.
  • FIG. 4 is a schematic cross-sectional view of a display module in an embodiment of the invention.
  • FIG. 5 is a schematic cross-sectional view of a display module in an embodiment of the invention.
  • FIG. 6 is a schematic cross-sectional view of a display module in an embodiment of the invention.
  • FIG. 7 is a schematic cross-sectional view of a display module in an embodiment of the invention.
  • FIG. 8 is a schematic cross-sectional view of a display module in an embodiment of the invention.
  • FIG. 3 is a display module provided in the first embodiment of the present invention, which includes a display panel 1 and a binding object 2.
  • the display panel 1 is provided with a binding area for binding with the binding object 2.
  • a plurality of spaced-apart first bonding pads 11 (pad) and wires 12 adjacent to the first bonding pad 11 are provided on the binding area, and a plurality of spaced-apart second bondings are provided on the binding object 2 Pad 21.
  • the conductive medium may be selected from but not limited to ACF glue, wherein the conductive particles 3 in the ACF make the first bonding pad 11 and the second bonding pad 21 conduct.
  • the conductive medium may be other conductive materials, which does not limit the protection scope of the present invention.
  • the height of the first bonding pad 11 is greater than the height of the wire 12, that is, there is a break between the two, so that the conductive particles 3 in the conductive medium can be subjected to the first bonding pad 11 when being pressed
  • the limitation on the top surface prevents the conductive particles 3 from directly pressing on the wires and causing the display panel 1 to have a short circuit or leakage.
  • the display panel of the present invention may be a flexible display panel, because the flexible substrate is relatively soft, which may require a large binding pressure, and it is easier to cause the wire insulation film described in the background art to be crushed to cause a short circuit or leakage, Therefore, the technical solution for preventing line short circuit and electric leakage of the present invention is of great significance to the flexible display panel.
  • the display panel 1 is provided with a binding area for binding with the binding object 2, and the binding area is provided with There are a plurality of first bonding pads 11 (pad) arranged at intervals, and wires 12 arranged adjacent to the first bonding pad 11, and a plurality of second bonding pads 21 arranged at intervals are arranged on the binding object 2.
  • first bonding pads 11 pad
  • wires 12 arranged adjacent to the first bonding pad 11
  • second bonding pads 21 arranged at intervals are arranged on the binding object 2.
  • the conductive medium may be selected from but not limited to ACF glue, wherein the conductive particles 3 in the ACF make the first bonding pad 11 and the second bonding pad 21 conduct.
  • the conductive medium may be other conductive materials, which does not limit the protection scope of the present invention.
  • the height of the first bonding pad 11 is greater than the height of the wire 12.
  • the first bonding pad 11 further includes a main body 111 and at least provided on the main body 111 and extending laterally
  • An extension 112 is at least partially shielded above the wire 12, that is, the projection of the extension 112 in the horizontal direction at least partially overlaps the projection of the wire 12 in the horizontal direction.
  • each first bonding pad 11 is provided with a At least one extending portion 112 corresponding to the extension; or, the extending portion 112 on each first bonding pad 11 has a ring shape surrounding the periphery of the first bonding pad 11, similar to a flange.
  • the extension portion 112 can prevent the conductive particles 3 from directly pressing on the wire 12, and more reliably avoid causing a short circuit or leakage of the circuit of the display panel 1; in addition, both the body portion 111 and the extension portion 112 can be connected to the second bonding pad 21 through the conductive medium Therefore, the extension 112 increases the area of the top surface of the first bonding pad 11, thereby increasing the alignment area of the first bonding pad 11 and the second bonding pad 21 (that is, increasing the bonding alignment window), reducing the alignment Bit difficulty.
  • the extension 112 of the first bonding pad 11 extends sideways along the top surface of the first bonding pad 11, that is, the first bonding pad 11 is coplanar with the top surface of the extension 112, and there is no drop, so that the extension The top surface of 112 can make good contact with the conductive particles 3 in the conductive medium, and will not cause poor contact due to the drop.
  • FIG. 6 it is a display module provided by a third embodiment of the present invention.
  • the display panel 1 is provided with a binding area for binding with the binding object 2.
  • a bonding pad 11 (pad).
  • the bonding object 2 is provided with a plurality of second bonding pads 21 arranged at intervals.
  • a conductive is provided between the bonding area and the bonding object 2
  • the first bonding pad 11 and the second bonding pad 21 are aligned, thereby combining the display panel 1, the binding object 2 and the conductive medium.
  • the conductive medium may be selected from but not limited to ACF glue, wherein the conductive particles 3 in the ACF glue make the first bonding pad 11 and the second bonding pad 21 conduct.
  • the conductive medium may be other conductive materials, which does not limit the protection scope of the present invention.
  • the wire 12 includes a plurality of first wires 121 disposed between the first bonding pad 11 and the display panel 1, the first wire 121 and the first bonding pad 11 Are insulated from each other.
  • each first wire 121 completely overlaps with the projection of the corresponding first bonding pad 11 in the horizontal direction.
  • the wire 12 further includes a second wire 122 disposed between two adjacent first wires 121.
  • the first wire 121 and the second wire 122 disposed under the first bonding pad 11 will not contact the conductive particles 3, which can more reliably prevent the conductive particles 3 in the conductive medium from directly pressing on the wire 12 and causing a short circuit or leakage.
  • the arrangement density of the pad or the wire 12 can also be increased.
  • FIG. 8 is a display module according to a fourth embodiment of the present invention.
  • the display panel 1 is provided with a binding area for binding with the binding object 2, and a plurality of intervals are provided on the binding area
  • the arranged first bonding pads 11 (pads) and the conductive wires 12 adjacent to the first bonding pads 11 are provided with a plurality of second bonding pads 21 arranged at intervals.
  • the conductive medium may be selected from but not limited to ACF glue, wherein the conductive particles 3 in the ACF make the first bonding pad 11 and the second bonding pad 21 conduct.
  • the conductive medium may be other conductive materials, which does not limit the protection scope of the present invention.
  • the plurality of first bonding pads 11 and/or the plurality of second bonding pads 21 may form a high-low drop, or That is, the heights of the respective first bonding pads 11 and/or the respective second bonding pads 21 are unequal, and a height difference is formed between them.
  • the high and low drop can make the adjacent conductive particles 3 in the lateral direction (perpendicular to the compression direction of the ACF glue, that is, the distribution direction of the first bonding pad 11 on the binding area) be misaligned with each other to avoid short circuit.
  • each adjacent first bonding pad 11 and/or second bonding pad 21 forms a high-low drop, so that the effect of avoiding a short circuit is the best.
  • the two conductive particles 3 are staggered due to the height difference of the bonding pads at this place, to avoid conducting the bonding pads that do not correspond to each other, and to avoid short circuit or leakage.
  • the plurality of first bonding pads 11 form a high-low drop
  • the plurality of second bonding pads 21 form a high-low drop opposite to the high-low drop of the first bonding pad 11, or
  • the height difference between the second bonding pad 21 and the first bonding pad 11 is complementary, wherein the high first bonding pad 11 corresponds to the low second bonding pad 21, and the low first bonding pad 11 and the high second bonding pad 21 correspond.
  • the high and low drop can make the adjacent conductive particles 3 in the lateral direction (perpendicular to the compression direction of the ACF glue, that is, the distribution direction of the first bonding pad 11 on the binding area) be misaligned with each other to avoid short circuit.
  • each adjacent first bonding pad 11 forms a high-low drop
  • each adjacent second bonding pad 21 forms a high-low drop, so that the effect of avoiding a short circuit is the best.
  • the display panel 1 of the present invention through its unique structure of the first bonding pad 11, can effectively prevent the conductive particles 3 in the conductive medium from directly pressing on the wires, and avoid short circuit or leakage of the circuit of the display panel 1.
  • a display module provided by the present invention includes the display panel 1 and the binding object 2 described above, and the binding object 2 is provided with a plurality of second bonds corresponding to the plurality of first bonding pads 11 in one-to-one correspondence On the pad 21, the display panel 1 and the binding object 2 are bound by a conductive medium, so that the first bonding pad 11 and the second bonding pad 21 are conducted.
  • the binding object 2 described in this article may be different in different binding situations, such as an external driver chip or FPC, which is the corresponding binding structure of a flip chip in the COF (chip on film) process, and is COG ( chip on glass) The corresponding binding structure in the process.
  • an external driver chip or FPC which is the corresponding binding structure of a flip chip in the COF (chip on film) process, and is COG ( chip on glass) The corresponding binding structure in the process.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板和显示模组，显示面板上设有用于与绑定对象绑定的绑定区，绑定区上设有多个第一接合垫，绑定区上设有导线，第一接合垫的高度大于导线的高度。通过显示面板的第一接合垫以及绑定对象的第二接合垫的结构，能够有效地避免导电介质中的导电粒子直接压在导线上，避免造成显示面板线路短路或漏电。

Description

显示面板以及显示模组 技术领域
本发明涉及显示技术领域，尤其是涉及一种显示面板及显示模组。
 背景技术
显示模组主要包括显示面板和对应的驱动电路，当显示面板制作完成后，需要在显示面板上通过导电介质连接外部驱动芯片或FPC（Flexible Printed Circuit，柔性电路板）等等，这个过程一般称之为绑定(bonding)，与显示面板绑定的上述外部驱动芯片或FPC等即为绑定对象。
导电介质可选为ACF胶，ACF胶（Anisotropic Conductive Film，各项异性导电胶）特点在于Z轴电气导通方向与XY绝缘平面的电阻特性具有明显的差异性，即Z轴的导通电阻值远小于XY平面的绝缘电阻值。ACF胶中含有很多导电粒子，将ACF胶置于需要电连接的部件之间然后加压，由于导电粒子的作用，在加压方向就会导通，从而导通需要电连接的部件。
请参照图1，当对显示面板100绑定区进行COF（chip on film，晶
Figure f9f9
薄膜覆晶封装）、FPC或COG等绑定时, 导电介质中的导电粒子使得位于显示面板100绑定区上的第一接合垫101（pad）与位于绑定对象200上的第二接合垫201（pad）导通，从而导通显示面板100与绑定对象200。
然而，当显示面板100的第一接合垫101旁有导线102紧邻而过(距离仅数um)时，可能会由于绑定对位有偏差或有两颗以上导电粒子300相邻等情况，如图2所示,导致发生导线102绝缘膜保护不良（可能为工艺或缺陷造成）或导电粒子300因压合时压力将绝缘膜压坏(例如柔性面板的柔性基材较软, 可能需要较大的绑定压力等), 就会造成面板线路短路或漏电。
 技术问题
针对现有技术中的上述缺陷，本发明提供一种能够避免绑定区线路短路或漏电的的显示面板及显示模组。
 技术解决方案
为了实现上述目的，本发明实施方式提供如下技术方案：
第一方面，本发明提供一种显示面板，显示面板上设有多个间隔排列的第一接合垫，以及与第一接合垫相邻设置的导线，第一接合垫的高度大于导线的高度。
优选地，第一接合垫包括主体部以及设在主体部上并向侧面延伸的至少一个延伸部，延伸部至少部分遮挡在导线的上方。
优选地，相邻两个第一接合垫上的延伸部相向延伸。
优选地，每个第一接合垫上设有向相邻的第一接合垫一一对应延伸的至少一个延伸部。
优选地，每个第一接合垫上的延伸部呈环绕第一接合垫外围的环状。
优选地，第一接合垫的延伸部沿第一接合垫的顶面向侧面延伸。
优选地，导线包括设置在第一接合垫与显示面板之间的第一导线。
优选地，导线还包括设置在相邻两第一导线之间的第二导线。
优选地，多个第一接合垫之间形成高低落差。
优选地，每相邻的两个第一接合垫之间形成高低落差。
优选地，显示面板为柔性显示面板。
第二方面，本发明提供了一种显示模组，包括绑定对象以及上述的显示面板，绑定对象上设有与多个第一接合垫相向的一一对应的多个第二接合垫，绑定区与绑定对象通过ACF胶绑定，以使第一接合垫与第二接合垫导通。
优选地，多个第一接合垫形成高低落差，多个第二接合垫形成与第一接合垫的高低落差相反的高低落差。
优选地，每相邻的第一接合垫形成高低落差，每相邻的第二接合垫形成高低落差。
优选地，导电介质为ACF胶。
 有益效果
本发明的显示面板，通过显示面板的第一接合垫以及绑定对象的第二接合垫的特有结构，能够有效地避免导电介质中的导电粒子直接压在导线上，避免造成显示面板线路短路或漏电。
 附图说明
下面将结合附图及实施例对本发明作进一步说明，附图中：
图1是现有技术中的显示模组的横截面视图。
图2是现有技术中的显示模组的横截面示意图。
图3是本发明一实施例中的显示模组的横截面示意图。
图4是本发明一实施例中的显示模组的横截面示意图。
图5是本发明一实施例中的显示模组的横截面示意图。
图6是本发明一实施例中的显示模组的横截面示意图。
图7是本发明一实施例中的显示模组的横截面示意图。
图8是本发明一实施例中的显示模组的横截面示意图。
 本发明的实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图详细说明本发明的具体实施方式。在本发明的显示面板以及显示模组的描述中，需要理解的是，“上”、“下”、“正面”、“背面”等术语仅是为了便于描述本发明的技术方案，而不是指示所指的装置或元件必须具有特定的方位，因此不能理解为对本发明的限制。
请参阅图3，图3所示为本发明第一实施例提供的显示模组，包括显示面板1和绑定对象2，显示面板1上设有用于与绑定对象2绑定的绑定区，绑定区上设有多个间隔排列的第一接合垫11（pad），以及与第一接合垫11相邻设置的导线12，绑定对象2上设置有多个间隔排列的第二接合垫21。当对显示面板1进行绑定时，在绑定区与绑定对象2之间通过设置导电介质，使第一接合垫11与第二接合垫21对位，从而使显示面板1、绑定对象2和导电介质三者结合。本实施例中，导电介质可选为但不局限于ACF胶，其中，ACF中的导电粒子3使第一接合垫11与第二接合垫21导通。在其它实施例中，导电介质可选择为其它导电材料，在此并不限制本发明的保护范围。
在本实施例中，第一接合垫11的高度大于导线12的高度，也即两者之间存在断差，从而可以使得导电介质中的导电粒子3在被挤压时受到第一接合垫11顶面的限制，避免导电粒子3直接压在导线上而造成显示面板1线路短路或漏电。
本发明的显示面板可以为柔性显示面板，因为柔性基材较软, 可能需要较大的绑定压力，更容易导致背景技术中所述的导线绝缘膜被压坏进而发生短路或漏电的情况，所以本发明的防止线路短路和漏电的技术方案对于柔性显示面板具有重要意义。
如图4所示，为本发明第二实施例提供的显示模组，与第一实施例相同，显示面板1上设有用于与绑定对象2绑定的绑定区，绑定区上设有多个间隔排列的第一接合垫11（pad），以及与第一接合垫11相邻设置的导线12，绑定对象2上设置有多个间隔排列的第二接合垫21。当对显示面板1进行绑定时，在绑定区与绑定对象2之间通过设置导电介质，使第一接合垫11与第二接合垫21对位，从而使显示面板1、绑定对象2和导电介质三者结合。本实施例中，导电介质可选为但不局限于ACF胶，其中，ACF中的导电粒子3使第一接合垫11与第二接合垫21导通。在其它实施例中，导电介质可选择为其它导电材料，在此并不限制本发明的保护范围。
在本实施例中，第一接合垫11的高度大于导线12的高度，与实施例一不同的是，第一接合垫11还包括主体部111以及设在主体部111上并向侧面延伸的至少一个延伸部112，延伸部112至少部分遮挡在导线12的上方，即延伸部112在水平方向的投影与导线12在水平方向的投影至少部分重叠。
可选地，如图5所示，相邻两个第一接合垫11上的延伸部112相向延伸，例如，每个第一接合垫11上设有向相邻的第一接合垫11一一对应延伸的至少一个延伸部112；或者，每个第一接合垫11上的延伸部112呈环绕第一接合垫11外围的环状，类似凸缘一般。延伸部112能够避免导电粒子3直接压在导线12上，更可靠地避免造成显示面板1线路短路或漏电；此外，主体部111和延伸部112都可通过导电介质与第二接合垫21导通，所以延伸部112增大了第一接合垫11的顶面面积，从而增大了第一接合垫11与第二接合垫21的对位面积（也即增加bonding对位window），降低了对位难度。
可选地，第一接合垫11的延伸部112沿第一接合垫11的顶面向侧面延伸，也即第一接合垫11与其延伸部112的顶面共面，不存在落差，以使延伸部112顶面能与导电介质中的导电粒子3良好接触，不会因落差而导致接触不良。
如图6所示，为本发明第三实施例提供的显示模组，显示面板1上设有用于与绑定对象2绑定的绑定区，绑定区上设有多个间隔排列的第一接合垫11（pad），绑定对象2上设置有多个间隔排列的第二接合垫21，当对显示面板1进行绑定时，在绑定区与绑定对象2之间通过设置导电介质，使第一接合垫11与第二接合垫21对位，从而使显示面板1、绑定对象2和导电介质三者结合。本实施例中，导电介质可选为但不局限于ACF胶，其中，ACF胶中的导电粒子3使第一接合垫11与第二接合垫21导通。在其它实施例中，导电介质可选择为其它导电材料，在此并不限制本发明的保护范围。
与前面两个实施例不同的是，本实施例中，导线12包括设置在第一接合垫11与显示面板1之间的多个第一导线121，第一导线121与第一接合垫11之间是相互绝缘的。在一实施例中，如图6所示，每一第一导线121与对应的第一接合垫11在水平方向上的投影完全重叠。在其它实施例中，如图7所示，导线12还包括设置在相邻两第一导线121之间的第二导线122，如此，由于第一接合垫11的顶面与导电粒子3接触，所以设置在第一接合垫11下方的第一导线121与第二导线122不会与导电粒子3接触，能够更可靠地避免导电介质中的导电粒子3直接压在导线12上导致短路或漏电，同时，还能增大pad或导线12的布置密度。
请参照图8，图8所示为本发明第四实施例提供的显示模组，显示面板1上设有用于与绑定对象2绑定的绑定区，绑定区上设有多个间隔排列的第一接合垫11（pad），以及与第一接合垫11相邻设置的导线12，绑定对象2上设置有多个间隔排列的第二接合垫21。当对显示面板1进行绑定时，在绑定区与绑定对象2之间通过设置导电介质，使第一接合垫11与第二接合垫21对位，从而使显示面板1、绑定对象2和导电介质三者结合。本实施例中，导电介质可选为但不局限于ACF胶，其中，ACF中的导电粒子3使第一接合垫11与第二接合垫21导通。在其它实施例中，导电介质可选择为其它导电材料，在此并不限制本发明的保护范围。在本实施例中，为了更可靠地避免导电介质中的导电粒子3直接压在导线12上，所述多个第一接合垫11和/或多个第二接合垫21可以形成高低落差，也即各个第一接合垫11和/或各个第二接合垫21的高度不等、相互之间形成高低落差。高低落差可以使得横向（垂直于ACF胶的受压方向，也即绑定区上的第一接合垫11的分布方向）上的相邻的导电粒子3相互错位，避免造成短路。优选地，每相邻的第一接合垫11和/或第二接合垫21都形成高低落差，这样避免短路的效果最好。如图8中的虚线圈出位置所示，在该处由于接合垫的高低落差，使得两个导电粒子3错开，避免了将非相互对应的接合垫导通，避免了短路或漏电。
可以理解的，在一实施例中，所述多个第一接合垫11形成高低落差，所述多个第二接合垫21形成与第一接合垫11的高低落差相反的高低落差，或者说第二接合垫21与第一接合垫11的高低落差是互补的，其中高的第一接合垫11与低的第二接合垫21对应，低的第一接合垫11与高的第二接合垫21对应。高低落差可以使得横向（垂直于ACF胶的受压方向，也即绑定区上的第一接合垫11的分布方向）上的相邻的导电粒子3相互错位，避免造成短路。优选地，每相邻的第一接合垫11都形成高低落差，每相邻的所述第二接合垫21都形成高低落差，这样避免短路的效果最好。
本发明的显示面板1，通过其第一接合垫11特有的结构，能够有效地避免导电介质中的导电粒子3直接压在导线上，避免造成显示面板1线路短路或漏电。
本发明提供的一种显示模组，包括前文所述的显示面板1和绑定对象2，绑定对象2上设有与多个第一接合垫11相向的一一对应的多个第二接合垫21，显示面板1与绑定对象2通过导电介质绑定，以使第一接合垫11与第二接合垫21导通。
本文中所述的绑定对象2在不同绑定情况下可以是不同的，例如是外部驱动芯片或FPC，是COF（chip on film）工艺中的覆晶薄膜等对应绑定结构，是COG（chip on glass）工艺中对应绑定结构。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改、组合和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (15)

  1. 一种显示面板（1），其特征在于，所述显示面板（1）上设有多个间隔排列的第一接合垫（11），以及与第一接合垫（11）相邻设置的导线（12），所述第一接合垫（11）的高度大于所述导线（12）的高度。
  2. 如权利要求1所述的显示面板（1），其特征在于，所述第一接合垫（11）包括主体部（111）以及设在所述主体部（111）上并向侧面延伸的至少一个延伸部（112），所述延伸部（112）至少部分遮挡在所述导线（12）的上方。
  3. 如权利要求2所述的显示面板（1），其特征在于，相邻两个第一接合垫（11）上的所述延伸部（112）相向延伸。
  4. 如权利要求3所述的显示面板（1），其特征在于，每个所述第一接合垫（11）上设有向相邻的所述第一接合垫（11）一一对应延伸的至少一个所述延伸部（112）。
  5. 如权利要求3所述的显示面板（1），其特征在于，每个所述第一接合垫（11）上的所述延伸部（112）呈环绕所述第一接合垫（11）外围的环状。
  6. 如权利要求3所述的显示面板（1），其特征在于，所述第一接合垫（11）的所述延伸部（112）沿所述第一接合垫（11）的顶面向侧面延伸。
  7. 如权利要求1所述的显示面板（1），其特征在于，所述导线（12）包括设置在所述第一接合垫（11）与显示面板（1）之间的第一导线（121）。
  8. 如权利要求7所述的显示面板（1），其特征在于，所述导线（12）还包括设置在相邻两第一导线（121）之间的第二导线（122）。
  9. 如权利要求1所述的显示面板（1），其特征在于，所述多个第一接合垫（11）之间形成高低落差。
  10. 如权利要求9所述的显示面板（1），其特征在于，每相邻的两个所述第一接合垫（11）之间形成高低落差。
  11. 如权利要求1所述的显示面板（1），其特征在于，所述显示面板（1）为柔性显示面板。
  12. 一种显示模组，其特征在于，包括绑定对象（2）以及根据权利要求1-11任一项所述的显示面板（1），所述绑定对象（2）上设有与所述多个第一接合垫（11）相向的且一一对应的多个第二接合垫（21），所述显示面板（1）与所述绑定对象（2）通过导电介质绑定，以使所述第一接合垫（11）与所述第二接合垫（21）导通。
  13. 如权利要求12所述的显示模组，其特征在于，所述多个第一接合垫（11）之间形成高低落差，所述多个第二接合垫（21）形成与所述第一接合垫（11）的高低落差相反的高低落差。
  14. 如权利要求13所述的显示模组，其特征在于，每相邻的两个所述第一接合垫（11）之间形成高低落差，每相邻的两个所述第二接合垫（21）之间形成高低落差。
  15. 如权利要求12所述的显示模组，其特征在于，所述导电介质为ACF胶。
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