WO2020101030A1 - 樹脂組成物及び光ファイバ - Google Patents

樹脂組成物及び光ファイバ Download PDF

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Publication number
WO2020101030A1
WO2020101030A1 PCT/JP2019/044951 JP2019044951W WO2020101030A1 WO 2020101030 A1 WO2020101030 A1 WO 2020101030A1 JP 2019044951 W JP2019044951 W JP 2019044951W WO 2020101030 A1 WO2020101030 A1 WO 2020101030A1
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Prior art keywords
meth
acrylate
resin composition
resin layer
inorganic oxide
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Ceased
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PCT/JP2019/044951
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English (en)
French (fr)
Japanese (ja)
Inventor
勝史 浜窪
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to US17/040,200 priority Critical patent/US20210009854A1/en
Priority to CN201980069815.6A priority patent/CN113039225B/zh
Priority to JP2020556199A priority patent/JP7367698B2/ja
Priority to KR1020217017387A priority patent/KR20210093279A/ko
Priority to EP19883978.9A priority patent/EP3882286B1/en
Publication of WO2020101030A1 publication Critical patent/WO2020101030A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • G02B6/02395—Glass optical fibre with a protective coating, e.g. two layer polymer coating deposited directly on a silica cladding surface during fibre manufacture
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/104—Coating to obtain optical fibres
    • C03C25/1065—Multiple coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/48—Coating with two or more coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
    • C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
    • C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
    • C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/002—Priming paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/68—Particle size between 100-1000 nm
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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Definitions

  • the present disclosure relates to a resin composition and an optical fiber.
  • This application claims priority based on Japanese application No. 2018-215711 filed on November 16, 2018, and incorporates all the contents described in the Japanese application.
  • the optical fiber has a coating resin layer for protecting the glass fiber, which is an optical transmission body.
  • the optical fiber is required to have excellent lateral pressure characteristics in order to reduce an increase in transmission loss induced by minute bending that occurs when lateral pressure is applied to the optical fiber.
  • the coating resin layer includes, for example, a primary resin layer and a secondary resin layer.
  • the primary resin layer is required to have a low Young's modulus and excellent flexibility (for example, refer to Patent Document 1). Further, it has been studied to improve the lateral pressure characteristic of an optical fiber by forming a resin layer using an ultraviolet curable resin composition containing a filler made of synthetic quartz as a raw material (see, for example, Patent Document 2). ..).
  • a resin composition according to an aspect of the present disclosure is a base resin containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator and a silane coupling agent, and a surface-modified inorganic oxide having a UV-curable functional group.
  • the surface modified amount of the surface modified inorganic oxide particles is 0.2 mg / m 2 or more.
  • FIG. 1 is a schematic sectional view showing an example of an optical fiber according to this embodiment.
  • the strength of the primary resin layer is increased by forming the primary resin layer using the resin composition containing the filler.
  • the resin composition used in the primary resin layer usually contains a silane coupling agent, addition of a filler tends to increase the viscosity of the resin composition and shorten the pot life.
  • the present disclosure aims to provide an optical fiber including a resin composition having a long pot life, and a primary resin layer formed from the resin composition.
  • an optical fiber including a resin composition for coating an optical fiber having a long pot life, and a primary resin layer formed from the resin composition.
  • a resin composition according to an aspect of the present disclosure is a base resin containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator and a silane coupling agent, and a surface-modified inorganic oxide having a UV-curable functional group.
  • the surface modified amount of the surface modified inorganic oxide particles is 0.2 mg / m 2 or more.
  • the silane coupling agent When preparing a resin composition, when a base resin containing a silane coupling agent and a sol containing unmodified inorganic oxide particles are mixed, the silane coupling agent is hydrolyzed, and the silane coupling agents and A condensation reaction with a hydroxyl group existing on the surface of the inorganic oxide particles may occur to impair the stability of the resin composition.
  • the resin composition of the present embodiment by using the specific surface-modified inorganic oxide particles, hydrolysis and condensation reaction is suppressed, and the pot life of the resin composition can be kept long, We are thinking.
  • the amount of surface modification in the surface modified inorganic oxide particles may be 0.2 mg / m 2 or more and 2.8 mg / m 2 or less. ..
  • the functional group may be at least one group selected from the group consisting of an acryloyl group, a methacryloyl group and a vinyl group. This facilitates formation of a resin layer having sufficient strength.
  • the average primary particle size of the inorganic oxide particles may be 650 nm or less from the viewpoint of excellent dispersibility in the resin composition and further improving pot life.
  • a primary coating material for an optical fiber according to an aspect of the present disclosure includes the resin composition described above.
  • the resin composition according to this embodiment for the primary resin layer, an optical fiber having excellent void resistance can be manufactured.
  • An optical fiber according to an aspect of the present disclosure includes a glass fiber including a core and a clad, a primary resin layer that is in contact with the glass fiber and covers the glass fiber, and a secondary resin layer that covers the primary resin layer.
  • the resin layer is made of a cured product of the above resin composition.
  • the resin composition according to the present embodiment includes a base resin containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator and a silane coupling agent, and surface-modified inorganic oxide particles having an ultraviolet curable functional group. including.
  • (meth) acrylate means acrylate or corresponding methacrylate.
  • (meth) acrylic acid means acrylate or corresponding methacrylate.
  • the surface of the inorganic oxide particles is treated with a silane compound having a UV-curable functional group, the UV-curable functional group is introduced on the surface of the inorganic oxide particles. ing. That is, the surface-modified inorganic oxide particles are composed of an inorganic component and an organic component.
  • the functional group may be an acryloyl group, a methacryloyl group or a vinyl group. By having such a functional group, it becomes easy to form a resin layer having high void resistance.
  • silane compound having a UV-curable functional group examples include 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltriethoxysilane. , 8-methacryloxyoctyltrimethoxysilane, 8-acryloxyoctyltrimethoxysilane, 7-octenyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrimethoxysilane and vinyltriethoxysilane.
  • the surface-modified inorganic oxide particles according to this embodiment are dispersed in a dispersion medium.
  • the surface-modified inorganic oxide particles can be uniformly dispersed in the resin composition, and the storage stability of the resin composition can be improved.
  • the dispersion medium is not particularly limited as long as it does not inhibit the curing of the resin composition.
  • the dispersion medium may be reactive or non-reactive.
  • a monomer such as a (meth) acryloyl compound or an epoxy compound may be used.
  • the (meth) acryloyl compound include 1,6-hexanediol di (meth) acrylate, EO-modified bisphenol A di (meth) acrylate, polyethylene glycol di (meth) acrylate, PO-modified bisphenol A di (meth) acrylate, Polypropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, (meth) acrylic acid adduct of propylene glycol diglycidyl ether, tripropylene glycol diglycidyl Examples include (meth) acrylic acid adducts of ethers and (meth) acrylic acid adducts of glycerin diglycidyl ether.
  • the (meth) acryloyl compound include 1,6-hexane
  • a ketone solvent such as methyl ethyl ketone (MEK), an alcohol solvent such as methanol (MeOH), propylene glycol monomethyl ether (PGME), or an ester solvent such as propylene glycol monomethyl ether acetate (PGMEA).
  • MEK methyl ethyl ketone
  • MeOH methanol
  • PGME propylene glycol monomethyl ether
  • PMEA propylene glycol monomethyl ether acetate
  • the resin composition may be prepared by mixing the base resin and the surface-modified inorganic oxide particles dispersed in the dispersion medium and then removing a part of the dispersion medium.
  • the dispersion medium containing the surface-modified inorganic oxide particles is measured by the X-ray small angle scattering method and the aggregated particles are not measured, it can be said that the surface-modified inorganic oxide particles are dispersed as the primary particles.
  • the above surface-modified inorganic oxide particles include silicon dioxide (silica), zirconium dioxide (zirconia), aluminum oxide (alumina), and oxide. It is preferable that the particles are surface-treated with at least one selected from the group consisting of magnesium (magnesia), titanium oxide (titania), tin oxide and zinc oxide. From the viewpoints of excellent cost-effectiveness, easy surface treatment, ultraviolet ray transparency, and easy provision of appropriate hardness to the resin layer, surface-modified silica particles are used as the surface-modified inorganic oxide particles according to the present embodiment. Is more preferably used.
  • the average primary particle size of the surface-modified inorganic oxide particles may be 650 nm or less, preferably 600 nm or less, more preferably 500 nm or less, still more preferably 400 nm or less.
  • the average primary particle diameter of the surface-modified inorganic oxide particles is preferably 5 nm or more, more preferably 10 nm or more.
  • the average primary particle size can be measured by, for example, image analysis of electron micrograph, light scattering method, BET method, or the like.
  • the dispersion medium in which the primary particles of the inorganic oxide particles are dispersed looks visually transparent when the particle size of the primary particles is small. When the particle size of the primary particles is relatively large (40 nm or more), the dispersion medium in which the primary particles are dispersed appears cloudy, but no sediment is observed.
  • the content of the surface-modified inorganic oxide particles is preferably 1% by mass or more and 45% by mass or less, and 2% by mass or more and 40% by mass, based on the total amount of the resin composition (the total amount of the base resin and the surface-modified inorganic oxide particles).
  • the following is more preferable, 3 mass% or more and 35 mass% or less is further preferable, and 5 mass% or more and 30 mass% or less is particularly preferable.
  • the content of the surface-modified inorganic oxide particles is 1% by mass or more, it becomes easy to form a tough resin layer.
  • the content of the surface-modified inorganic oxide particles is 45% by mass or less, a resin layer having a low Young's modulus can be formed.
  • the total amount of the resin composition and the total amount of the cured product of the resin composition may be considered to be the same.
  • the content of the surface-modified inorganic oxide particles is preferably 1% by mass or more and 45% by mass or less, based on the total amount of the primary resin layer (the total amount of the cured product of the resin composition forming the primary resin layer), and 2% by mass or more. 40 mass% or less is more preferable, 3 mass% or more and 35 mass% or less is further preferable, and 5 mass% or more and 30 mass% or less is particularly preferable.
  • the amount of surface modification in the surface-modified inorganic oxide particles is 0.2 mg / m 2 or more, preferably 0.2 mg / m 2 or more and 2.8 mg / m 2 or less, and 0.3 mg / m 2 or more 2 more preferably .6mg / m 2 or less, further preferably 0.4 mg / m 2 or more 2.4 mg / m 2 or less, is 0.6 mg / m 2 or more 2.2 mg / m 2 or less Is particularly preferable.
  • the amount of surface modification is within the above range, the viscosity of the resin composition can be easily adjusted.
  • the “surface modification amount” in the present specification can be calculated from the specific surface area of the surface modified inorganic oxide particles and the ratio of the organic component.
  • the organic component is a component derived from the UV-curable functional group introduced into the inorganic oxide particles before surface modification.
  • the components other than SiO 2 are organic components.
  • the specific surface area can be measured by the nitrogen adsorption BET method, and the ratio of the organic component can be measured by suggestive thermogravimetric analysis (TG / DTA).
  • the amount of surface modification in the surface-modified inorganic oxide particles may be measured by isolating the particles from the dispersion medium before preparing the resin composition, or by measuring the particles from the resin composition after preparing the resin composition. You may measure it separately.
  • the base resin according to this embodiment contains a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator, and a silane coupling agent.
  • urethane (meth) acrylate oligomer an oligomer obtained by reacting a polyol compound, a polyisocyanate compound and a hydroxyl group-containing (meth) acrylate compound can be used.
  • polyol compound examples include polytetramethylene glycol, polypropylene glycol, and bisphenol A / ethylene oxide addition diol.
  • the number average molecular weight (Mn) of the polyol compound is preferably 1000 or more and 10000 or less, more preferably 1500 or more and 8000 or less, and further preferably 2000 or more and 6000 or less.
  • polyisocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and dicyclohexylmethane 4,4'-diisocyanate.
  • hydroxyl group-containing (meth) acrylate compound examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 1,6-hexanediol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, 2-Hydroxypropyl (meth) acrylate and tripropylene glycol mono (meth) acrylate are mentioned.
  • Organotin compounds are generally used as catalysts when synthesizing urethane (meth) acrylate oligomers.
  • organotin compound examples include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin malate, dibutyltin bis (2-ethylhexyl mercaptoacetate), dibutyltin bis (isooctyl mercaptoacetate) and dibutyltin oxide. From the viewpoint of easy availability and catalytic performance, it is preferable to use dibutyltin dilaurate or dibutyltin diacetate as a catalyst.
  • a lower alcohol having 5 or less carbon atoms may be used during the synthesis of the urethane (meth) acrylate oligomer.
  • the lower alcohol include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, Mention may be made of 2-methyl-1-butanol, 3-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-2-butanol and 2,2-dimethyl-1-propanol.
  • a silane coupling agent eg, 3-mercaptopropyltrimethoxysilane
  • the silane coupling agent may be added when synthesizing the urethane (meth) acrylate oligomer or when preparing the base resin.
  • the base resin according to this embodiment may further contain an epoxy (meth) acrylate oligomer as an oligomer.
  • an epoxy (meth) acrylate oligomer an oligomer obtained by reacting an epoxy resin having two or more glycidyl groups with a compound having a (meth) acryloyl group can be used.
  • a monofunctional monomer having one polymerizable group and a polyfunctional monomer having two or more polymerizable groups can be used.
  • the monomers may be used as a mixture of two or more kinds.
  • a monomer having a phenoxy group may be used as the monomer because a tough resin layer is easily formed.
  • a (meth) acrylate compound having a phenoxy group can be used as the monomer having a phenoxy group.
  • the (meth) acrylate compound having a phenoxy group include phenol EO-modified (meth) acrylate, nonylphenol EO-modified (meth) acrylate, phenol PO-modified (meth) acrylate, nonylphenol PO-modified (meth) acrylate, and phenoxyethyl (meth).
  • Acrylate 2-hydroxy-3-phenoxypropyl (meth) acrylate, and 3-phenoxybenzyl (meth) acrylate.
  • EO-modified means having an ethylene oxide group represented by (C 2 H 4 O) n
  • PO-modified is a propylene oxide group represented by (C 3 H 6 O) n.
  • n is an integer of 1 or more.
  • the monomer having a phenoxy group comprises phenol EO-modified acrylate, nonylphenol EO-modified acrylate, phenoxyethyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 3-phenoxybenzyl acrylate. It may be at least one selected from the group.
  • the monomers having a phenoxy group may be used as a mixture of two or more kinds.
  • the content of the phenoxy group-containing monomer is preferably 1% by mass or more and 60% by mass or less, more preferably 5% by mass or more and 50% by mass or less, and 10% by mass or more based on the total amount of the base resin. It is more preferably 40% by mass or less.
  • the resin composition contains a monomer having a phenoxy group in such a range, a resin layer having a Young's modulus suitable as a primary coating material for an optical fiber can be formed.
  • the monomer a monomer having no phenoxy group may be used.
  • the monomer having no phenoxy group may be a monofunctional monomer or a polyfunctional monomer having two or more polymerizable groups.
  • Examples of the monofunctional monomer having no phenoxy group include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, s-butyl (meth) acrylate and tert-butyl.
  • N-substituted amide monomers aminoethyl (meth) acrylate, (meth) acrylic Aminoalkyl (meth) acrylate monomers such as aminopropyl acrylate, N, N-dimethylaminoethyl (meth) acrylate, tert-butylaminoethyl (meth) acrylate; N- (meth) acryloyloxymethylenesuccinimide, N Examples thereof include succinimide-based monomers such as-(meth) acryloyl-6-oxyhexamethylenesuccinimide and N- (meth) acryloyl-8-oxyoctamethylenesuccinimide.
  • polyfunctional monomer having no phenoxy group examples include ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, tripropylene glycol di.
  • (Meth) acrylate bisphenol A alkylene oxide adduct di (meth) acrylate, tetraethylene glycol di (meth) acrylate, hydroxypivalic acid neopentyl glycol di (meth) acrylate, 1,4-butanediol di (meth) Acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, 1,14-tetradecanediol di (meth) acrylate, 1,16-hexadecanediol di (meth) acrylate, 1,20-eicosanediol di (meth) acrylate, isopentyldiol di (meth) acrylate, 3-ethyl-1,8-octanediol di (meth) acryl
  • the photopolymerization initiator can be appropriately selected and used from known radical photopolymerization initiators.
  • the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone (Omnirad 184, manufactured by IGM Resins), 2,2-dimethoxy-2-phenylacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2- Methylpropan-1-one, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1 -One (Omnirad 907, manufactured by IGM Resins), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO, manufactured by IGM Resins) and bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (Omn
  • the silane coupling agent is not particularly limited as long as it does not hinder the curing of the resin composition.
  • Examples of the silane coupling agent include tetramethyl silicate, tetraethyl silicate, mercaptopropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxy-ethoxy) silane, ⁇ - (3,4-epoxycyclohexyl).
  • -Ethyltrimethoxysilane dimethoxydimethylsilane, diethoxydimethylsilane, 3-acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -methacryloxypropyl Trimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethyldimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, ⁇ -chloropropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltrimethoxysilane, bis- [3- (triethoxysilyl) prop
  • the resin composition may further contain a leveling agent, a defoaming agent, an antioxidant and the like.
  • the Young's modulus of the cured product of the resin composition is preferably 4 MPa or less at 23 ° C. ⁇ 2 ° C., and more preferably 0.05 MPa or more and 4.0 MPa or less, in order to suppress generation of voids in the optical fiber. It is more preferably 0.1 MPa or more and 3.5 MPa or less, and particularly preferably 0.3 MPa or more and 3.0 MPa or less.
  • the resin composition according to this embodiment can be suitably used as a primary coating material for an optical fiber.
  • an optical fiber having excellent void resistance and lateral pressure characteristics can be produced.
  • FIG. 1 is a schematic sectional view showing an example of the optical fiber according to the present embodiment.
  • the optical fiber 10 includes a glass fiber 13 including a core 11 and a clad 12, and a coating resin layer 16 including a primary resin layer 14 and a secondary resin layer 15 provided on the outer periphery of the glass fiber 13.
  • the clad 12 surrounds the core 11.
  • the core 11 and the clad 12 mainly include glass such as quartz glass.
  • the core 11 may be made of germanium-added quartz glass
  • the clad 12 may be made of pure quartz glass or fluorine-added quartz. Glass can be used.
  • the outer diameter (D2) of the glass fiber 13 is about 125 ⁇ m, and the diameter (D1) of the core 11 constituting the glass fiber 13 is about 7 to 15 ⁇ m.
  • the thickness of the coating resin layer 16 is usually about 60 to 70 ⁇ m.
  • the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 to 50 ⁇ m.
  • the thickness of the primary resin layer 14 is 35 ⁇ m and the thickness of the secondary resin layer 15 is 25 ⁇ m. May be.
  • the outer diameter of the optical fiber 10 may be about 245 to 265 ⁇ m.
  • the thickness of the coating resin layer 16 may be about 27 to 48 ⁇ m.
  • the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 to 38 ⁇ m.
  • the thickness of the primary resin layer 14 is 25 ⁇ m and the thickness of the secondary resin layer 15 is 10 ⁇ m.
  • the outer diameter of the optical fiber 10 may be about 179 to 221 ⁇ m.
  • the outer diameter (D2) of the glass fiber 13 may be about 100 ⁇ m, and the thickness of the coating resin layer 16 may be about 22 to 37 ⁇ m.
  • the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 5 to 32 ⁇ m.
  • the thickness of the primary resin layer 14 is 25 ⁇ m and the thickness of the secondary resin layer 15 is 10 ⁇ m.
  • the outer diameter of the optical fiber 10 may be about 144 to 174 ⁇ m.
  • the Young's modulus of the secondary resin layer is preferably 1300 MPa or more at 23 ° C., more preferably 1300 MPa or more and 2600 MPa or less, still more preferably 1300 MPa or more and 2500 MPa or less.
  • the Young's modulus of the secondary resin layer is 1300 MPa or more, the lateral pressure characteristics are easily improved, and when it is 2600 MPa or less, the secondary resin layer can be provided with appropriate toughness, so that the secondary resin layer is less likely to be cracked.
  • the secondary layer can be formed, for example, by curing a resin composition containing a urethane (meth) acrylate oligomer, a monomer and a photopolymerization initiator.
  • a conventionally known technique can be used for the resin composition for the secondary resin layer.
  • the urethane (meth) acrylate oligomer, the monomer and the photopolymerization initiator may be appropriately selected from the compounds exemplified as the above base resin.
  • the resin composition for the secondary resin layer may include hydrophobic inorganic oxide particles.
  • the hydrophobic inorganic oxide particles may be the surface-modified inorganic oxide particles described above.
  • the resin composition forming the secondary resin layer has a different composition from the resin composition forming the primary resin layer. From the viewpoint of increasing the Young's modulus of the secondary resin layer, Mn of the polyol compound used when synthesizing the urethane (meth) acrylate oligomer may be 400 or more and 2000 or less.
  • Nonylphenol EO-modified acrylate (trade name “Aronix M-113”, n ⁇ 4 by Toagosei Co., Ltd.), N-vinylcaprolactam and 1,6-hexanediol diacrylate were prepared as monomers.
  • silane coupling agent 3-Mercaptopropyltrimethoxysilane was prepared as a silane coupling agent.
  • Base resin 60 parts by mass of urethane acrylate oligomer, 22.8 parts by mass of nonylphenol EO-modified acrylate, 4.8 parts by mass of N-vinylcaprolactam, 1.6 parts by mass of 1,6-hexanediol diacrylate, 2,4,6-trimethylbenzoyldiphenyl
  • a base resin was prepared by mixing 2.7 parts by mass of phosphine oxide and 0.8 part by mass of 3-mercaptopropyltrimethoxysilane.
  • silica sol MEK dispersion liquid containing silica particles surface-treated with 3-methacryloxypropyltrimethoxysilane (hereinafter simply referred to as “silica particles”) was prepared.
  • a silica sol (MEK dispersion liquid) containing unmodified silica particles was prepared.
  • Chloroform was added to the resin composition and the mixture was centrifuged to collect the precipitate. Acetone was added to the precipitate and the mixture was centrifuged to remove the supernatant. Then, acetone was added to the precipitate again to perform centrifugation and removal of the supernatant, which was repeated four times to extract silica particles.
  • the silica particles ground in a mortar were vacuum dried at room temperature for 12 hours to remove volatile components. The centrifugation was performed at 30,000 rpm for 120 minutes. The dried silica particles were subjected to a reduced pressure treatment at 80 ° C.
  • a specific surface area (m 2 / m 2 ) of the silica particles was measured by a nitrogen adsorption BET method using a pore distribution measuring device (“ASAP-2020” manufactured by Micromeritics). g) was measured.
  • the ratio (mass%) of the organic components contained in the silica particles was measured using a differential thermogravimetric simultaneous analysis device (“TG / DTA6300” manufactured by Hitachi High-Tech Science Co., Ltd.). The measurement was performed by heating the weight-measured silica particles from room temperature to 850 ° C. under nitrogen (300 mL / min), then cooling from 850 ° C. to 200 ° C., and 200 ° C. to 1000 ° C. under air (100 mL / min). It was heated to and the weight change was measured. The ratio of the organic component was calculated from the weight change of silica particles.
  • TG / DTA6300 manufactured by Hitachi High-Tech Science Co., Ltd.
  • the surface modification amount of the silica particles was calculated from the specific surface area of the silica particles and the ratio of the organic component by the following formula.
  • Surface modification amount (mg / m 2 ) ratio of organic component / specific surface area
  • the resin composition was applied onto a polyethylene terephthalate (PET) film using a spin coater, and then cured using an electrodeless UV lamp system (D bulb) (manufactured by Heraeus) under the condition of 1000 ⁇ 100 mJ / cm 2.
  • a resin layer having a thickness of 200 ⁇ 20 ⁇ m was formed on the PET film. The resin layer was peeled off from the PET film to obtain a resin film.
  • a resin film was punched out into a JIS K 7127 type 5 dumbbell shape and pulled under conditions of 23 ⁇ 2 ° C. and 50 ⁇ 10% RH using a tensile tester at a pulling speed of 1 mm / min and a distance between marked lines of 25 mm. , A stress-strain curve was obtained. Young's modulus was determined by the tangent line.
  • Reference numeral 10 Optical fiber, 11 ... Core, 12 ... Clad, 13 ... Glass fiber, 14 ... Primary resin layer, 15 ... Secondary resin layer, 16 ... Coating resin layer.

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022075050A1 (https=) * 2020-10-05 2022-04-14
JPWO2022190693A1 (https=) * 2021-03-11 2022-09-15
JP2023056662A (ja) * 2021-10-08 2023-04-20 デンカ株式会社 組成物
EP4265659A4 (en) * 2020-12-16 2024-06-19 Sumitomo Electric Industries, Ltd. RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBERS, OPTICAL FIBER AND METHOD FOR MANUFACTURING OPTICAL FIBERS
EP4265660A4 (en) * 2020-12-16 2024-06-19 Sumitomo Electric Industries, Ltd. Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber
US20240392155A1 (en) * 2021-10-26 2024-11-28 Sumitomo Electric Industries, Ltd. Resin composition for optical fiber coating, colored coating material for optical fiber, and optical fiber
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814811B (zh) 2018-04-16 2023-09-11 日商住友電氣工業股份有限公司 光纖
WO2020101030A1 (ja) * 2018-11-16 2020-05-22 住友電気工業株式会社 樹脂組成物及び光ファイバ
US20210053870A1 (en) * 2018-11-16 2021-02-25 Sumitomo Electric Industries, Ltd. Resin composition, optical fiber and method for manufacturing optical fiber
WO2023281692A1 (ja) * 2021-07-08 2023-01-12 昭和電工マテリアルズ株式会社 樹脂組成物、樹脂フィルム、多層プリント配線板及び半導体パッケージ
WO2023074296A1 (ja) * 2021-10-26 2023-05-04 住友電気工業株式会社 光ファイバ被覆用の樹脂組成物、光ファイバの着色被覆材料、及び光ファイバ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134156A (ja) * 1994-11-02 1996-05-28 Sumitomo Chem Co Ltd 光硬化性樹脂組成物
JP2005213453A (ja) * 2004-01-30 2005-08-11 Mitsubishi Chemicals Corp 放射線硬化性樹脂組成物及び放射線硬化性樹脂組成物の製造方法
JP2007131698A (ja) * 2005-10-11 2007-05-31 Mitsubishi Chemicals Corp 放射線硬化性組成物及びその硬化物、並びにその積層体
JP2013197163A (ja) 2012-03-16 2013-09-30 Toppan Printing Co Ltd 積層基板およびその製造方法
JP2014219550A (ja) 2013-05-08 2014-11-20 住友電気工業株式会社 光ファイバ心線

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004217836A (ja) * 2003-01-16 2004-08-05 Mitsubishi Chemicals Corp 放射線硬化性組成物、放射線硬化性組成物の製造方法、硬化物及び光学材料
US7297731B2 (en) * 2003-03-11 2007-11-20 3M Innovative Properties Company Coating dispersions for optical fibers
EP1740663A1 (en) * 2004-04-22 2007-01-10 JSR Corporation Low refractive index coating composition
JP2006137795A (ja) * 2004-11-10 2006-06-01 Mitsubishi Chemicals Corp 放射線硬化性組成物及びその硬化物、並びにその積層体
JP2006188659A (ja) * 2004-12-07 2006-07-20 Mitsubishi Chemicals Corp 放射線硬化性樹脂組成物およびその硬化物
EP2261289B1 (en) * 2008-03-27 2012-08-15 Fujikura Kasei Co., Ltd. Composition for coating a plastic substrate, coating film formed therefrom, and formed body
CN102037035A (zh) * 2008-05-23 2011-04-27 昭和电工株式会社 含有反应性(甲基)丙烯酸酯聚合物的固化性组合物及其固化物
WO2011063838A1 (en) * 2009-11-26 2011-06-03 Prysmian S.P.A. Optical fiber with double coating
WO2018003880A1 (ja) * 2016-07-01 2018-01-04 三菱ケミカル株式会社 活性エネルギー線硬化性樹脂組成物、樹脂成形品および樹脂成形品の製造方法
US11345606B2 (en) * 2017-02-17 2022-05-31 David Brown Deposition particles and a method and apparatus for producing the same
CN107083159B (zh) * 2017-05-16 2019-06-07 华中科技大学 一种光纤用高导热光固化涂料、及其制备与应用
KR20210093280A (ko) * 2018-11-16 2021-07-27 스미토모 덴키 고교 가부시키가이샤 수지 조성물, 광 파이버 및 광 파이버의 제조 방법
WO2020101030A1 (ja) * 2018-11-16 2020-05-22 住友電気工業株式会社 樹脂組成物及び光ファイバ
TWI706012B (zh) * 2019-09-12 2020-10-01 明基材料股份有限公司 高硬度可撓硬塗層膜

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08134156A (ja) * 1994-11-02 1996-05-28 Sumitomo Chem Co Ltd 光硬化性樹脂組成物
JP2005213453A (ja) * 2004-01-30 2005-08-11 Mitsubishi Chemicals Corp 放射線硬化性樹脂組成物及び放射線硬化性樹脂組成物の製造方法
JP2007131698A (ja) * 2005-10-11 2007-05-31 Mitsubishi Chemicals Corp 放射線硬化性組成物及びその硬化物、並びにその積層体
JP2013197163A (ja) 2012-03-16 2013-09-30 Toppan Printing Co Ltd 積層基板およびその製造方法
JP2014219550A (ja) 2013-05-08 2014-11-20 住友電気工業株式会社 光ファイバ心線

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022075050A1 (https=) * 2020-10-05 2022-04-14
JP7852503B2 (ja) 2020-10-05 2026-04-28 住友電気工業株式会社 樹脂組成物、光ファイバ及び光ファイバの製造方法
EP4265659A4 (en) * 2020-12-16 2024-06-19 Sumitomo Electric Industries, Ltd. RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBERS, OPTICAL FIBER AND METHOD FOR MANUFACTURING OPTICAL FIBERS
EP4265660A4 (en) * 2020-12-16 2024-06-19 Sumitomo Electric Industries, Ltd. Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber
US12528926B2 (en) 2020-12-16 2026-01-20 Sumitomo Electric Industries, Ltd. Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber
JPWO2022190693A1 (https=) * 2021-03-11 2022-09-15
WO2022190693A1 (ja) * 2021-03-11 2022-09-15 住友電気工業株式会社 光ファイバ及び光ファイバリボン
JP7852623B2 (ja) 2021-03-11 2026-04-28 住友電気工業株式会社 光ファイバ及び光ファイバリボン
JP2023056662A (ja) * 2021-10-08 2023-04-20 デンカ株式会社 組成物
JP7780292B2 (ja) 2021-10-08 2025-12-04 デンカ株式会社 組成物
US20240392155A1 (en) * 2021-10-26 2024-11-28 Sumitomo Electric Industries, Ltd. Resin composition for optical fiber coating, colored coating material for optical fiber, and optical fiber

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US20210009854A1 (en) 2021-01-14
JPWO2020101030A1 (ja) 2021-10-07
EP3882286A4 (en) 2022-03-02
CN113039225A (zh) 2021-06-25
JP7367698B2 (ja) 2023-10-24
TW202028383A (zh) 2020-08-01
EP3882286B1 (en) 2024-09-11
EP3882286A1 (en) 2021-09-22
CN113039225B (zh) 2023-08-29
KR20210093279A (ko) 2021-07-27

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