WO2020101030A1 - 樹脂組成物及び光ファイバ - Google Patents
樹脂組成物及び光ファイバ Download PDFInfo
- Publication number
- WO2020101030A1 WO2020101030A1 PCT/JP2019/044951 JP2019044951W WO2020101030A1 WO 2020101030 A1 WO2020101030 A1 WO 2020101030A1 JP 2019044951 W JP2019044951 W JP 2019044951W WO 2020101030 A1 WO2020101030 A1 WO 2020101030A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- meth
- acrylate
- resin composition
- resin layer
- inorganic oxide
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 70
- 239000013307 optical fiber Substances 0.000 title claims description 30
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 105
- 229920005989 resin Polymers 0.000 claims abstract description 92
- 239000011347 resin Substances 0.000 claims abstract description 92
- 239000002245 particle Substances 0.000 claims abstract description 51
- 229910052809 inorganic oxide Inorganic materials 0.000 claims abstract description 48
- 239000000178 monomer Substances 0.000 claims abstract description 37
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 18
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 125000000524 functional group Chemical group 0.000 claims abstract description 13
- -1 methacryloyl group Chemical group 0.000 claims description 42
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000003365 glass fiber Substances 0.000 claims description 13
- 239000003999 initiator Substances 0.000 claims description 12
- 238000012986 modification Methods 0.000 claims description 12
- 230000004048 modification Effects 0.000 claims description 12
- 239000011164 primary particle Substances 0.000 claims description 10
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 26
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 239000002612 dispersion medium Substances 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 12
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 6
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 3
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- 238000004438 BET method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- PGMMMHFNKZSYEP-UHFFFAOYSA-N 1,20-Eicosanediol Chemical compound OCCCCCCCCCCCCCCCCCCCCO PGMMMHFNKZSYEP-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- GJBXIPOYHVMPQJ-UHFFFAOYSA-N hexadecane-1,16-diol Chemical compound OCCCCCCCCCCCCCCCCO GJBXIPOYHVMPQJ-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- BXSPZNVFEYWSLZ-UHFFFAOYSA-N (3-phenoxyphenyl)methyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 BXSPZNVFEYWSLZ-UHFFFAOYSA-N 0.000 description 1
- WNZDHZFCPBAPMK-UHFFFAOYSA-N (3-trimethoxysilylpropyltrisulfanyl) n,n-dimethylcarbamodithioate Chemical compound CO[Si](OC)(OC)CCCSSSSC(=S)N(C)C WNZDHZFCPBAPMK-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- RESPXSHDJQUNTN-UHFFFAOYSA-N 1-piperidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCCC1 RESPXSHDJQUNTN-UHFFFAOYSA-N 0.000 description 1
- WLPAQAXAZQUXBG-UHFFFAOYSA-N 1-pyrrolidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCC1 WLPAQAXAZQUXBG-UHFFFAOYSA-N 0.000 description 1
- GGSRTHRSSCWGGK-UHFFFAOYSA-L 2,2-dibutyl-5-hydroxy-1,3,2-dioxastannepane-4,7-dione Chemical compound CCCC[Sn]1(CCCC)OC(=O)CC(O)C(=O)O1 GGSRTHRSSCWGGK-UHFFFAOYSA-L 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- PRIUALOJYOZZOJ-UHFFFAOYSA-L 2-ethylhexyl 2-[dibutyl-[2-(2-ethylhexoxy)-2-oxoethyl]sulfanylstannyl]sulfanylacetate Chemical compound CCCCC(CC)COC(=O)CS[Sn](CCCC)(CCCC)SCC(=O)OCC(CC)CCCC PRIUALOJYOZZOJ-UHFFFAOYSA-L 0.000 description 1
- HHKAGFTWEFVXET-UHFFFAOYSA-N 2-heptyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCCCCCC(CO)(CO)CO HHKAGFTWEFVXET-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RASDUGQQSMMINZ-UHFFFAOYSA-N 2-methyl-1-piperidin-1-ylprop-2-en-1-one Chemical compound CC(=C)C(=O)N1CCCCC1 RASDUGQQSMMINZ-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- OTKLRHWBZHQJOP-UHFFFAOYSA-N 3-aminopropyl prop-2-enoate Chemical compound NCCCOC(=O)C=C OTKLRHWBZHQJOP-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SEGKJLWPIPSYSC-UHFFFAOYSA-N 3-ethyloctane-1,8-diol Chemical compound OCCC(CC)CCCCCO SEGKJLWPIPSYSC-UHFFFAOYSA-N 0.000 description 1
- XPFCZYUVICHKDS-UHFFFAOYSA-N 3-methylbutane-1,3-diol Chemical compound CC(C)(O)CCO XPFCZYUVICHKDS-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- CCOQPGVQAWPUPE-UHFFFAOYSA-N 4-tert-butylcyclohexan-1-ol Chemical compound CC(C)(C)C1CCC(O)CC1 CCOQPGVQAWPUPE-UHFFFAOYSA-N 0.000 description 1
- 229940091886 4-tert-butylcyclohexanol Drugs 0.000 description 1
- GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 1
- JOVCTEPPTIOAPX-UHFFFAOYSA-N 8-trimethoxysilyloctyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C=C JOVCTEPPTIOAPX-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- MBXULDRFQBQSSK-UHFFFAOYSA-N N'-[3-[methoxy-[(2-methylpropan-2-yl)oxy]silyl]propyl]ethane-1,2-diamine Chemical compound NCCNCCC[SiH](OC(C)(C)C)OC MBXULDRFQBQSSK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- YSCDKUPSJMMGGT-UHFFFAOYSA-L [dibutyl-[2-(6-methylheptylsulfanyl)acetyl]oxystannyl] 2-(6-methylheptylsulfanyl)acetate Chemical compound CC(C)CCCCCSCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CSCCCCCC(C)C YSCDKUPSJMMGGT-UHFFFAOYSA-L 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLKZJJVNBQCVIX-UHFFFAOYSA-N tetradecane-1,14-diol Chemical compound OCCCCCCCCCCCCCCO XLKZJJVNBQCVIX-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
- G02B6/02395—Glass optical fibre with a protective coating, e.g. two layer polymer coating deposited directly on a silica cladding surface during fibre manufacture
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/104—Coating to obtain optical fibres
- C03C25/1065—Multiple coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/24—Coatings containing organic materials
- C03C25/26—Macromolecular compounds or prepolymers
- C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/48—Coating with two or more coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/751—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring
- C08G18/752—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group
- C08G18/753—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group
- C08G18/755—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing only one cycloaliphatic ring containing at least one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group containing one isocyanate or isothiocyanate group linked to the cycloaliphatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate group and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/68—Particle size between 100-1000 nm
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
Definitions
- the present disclosure relates to a resin composition and an optical fiber.
- This application claims priority based on Japanese application No. 2018-215711 filed on November 16, 2018, and incorporates all the contents described in the Japanese application.
- the optical fiber has a coating resin layer for protecting the glass fiber, which is an optical transmission body.
- the optical fiber is required to have excellent lateral pressure characteristics in order to reduce an increase in transmission loss induced by minute bending that occurs when lateral pressure is applied to the optical fiber.
- the coating resin layer includes, for example, a primary resin layer and a secondary resin layer.
- the primary resin layer is required to have a low Young's modulus and excellent flexibility (for example, refer to Patent Document 1). Further, it has been studied to improve the lateral pressure characteristic of an optical fiber by forming a resin layer using an ultraviolet curable resin composition containing a filler made of synthetic quartz as a raw material (see, for example, Patent Document 2). ..).
- a resin composition according to an aspect of the present disclosure is a base resin containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator and a silane coupling agent, and a surface-modified inorganic oxide having a UV-curable functional group.
- the surface modified amount of the surface modified inorganic oxide particles is 0.2 mg / m 2 or more.
- FIG. 1 is a schematic sectional view showing an example of an optical fiber according to this embodiment.
- the strength of the primary resin layer is increased by forming the primary resin layer using the resin composition containing the filler.
- the resin composition used in the primary resin layer usually contains a silane coupling agent, addition of a filler tends to increase the viscosity of the resin composition and shorten the pot life.
- the present disclosure aims to provide an optical fiber including a resin composition having a long pot life, and a primary resin layer formed from the resin composition.
- an optical fiber including a resin composition for coating an optical fiber having a long pot life, and a primary resin layer formed from the resin composition.
- a resin composition according to an aspect of the present disclosure is a base resin containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator and a silane coupling agent, and a surface-modified inorganic oxide having a UV-curable functional group.
- the surface modified amount of the surface modified inorganic oxide particles is 0.2 mg / m 2 or more.
- the silane coupling agent When preparing a resin composition, when a base resin containing a silane coupling agent and a sol containing unmodified inorganic oxide particles are mixed, the silane coupling agent is hydrolyzed, and the silane coupling agents and A condensation reaction with a hydroxyl group existing on the surface of the inorganic oxide particles may occur to impair the stability of the resin composition.
- the resin composition of the present embodiment by using the specific surface-modified inorganic oxide particles, hydrolysis and condensation reaction is suppressed, and the pot life of the resin composition can be kept long, We are thinking.
- the amount of surface modification in the surface modified inorganic oxide particles may be 0.2 mg / m 2 or more and 2.8 mg / m 2 or less. ..
- the functional group may be at least one group selected from the group consisting of an acryloyl group, a methacryloyl group and a vinyl group. This facilitates formation of a resin layer having sufficient strength.
- the average primary particle size of the inorganic oxide particles may be 650 nm or less from the viewpoint of excellent dispersibility in the resin composition and further improving pot life.
- a primary coating material for an optical fiber according to an aspect of the present disclosure includes the resin composition described above.
- the resin composition according to this embodiment for the primary resin layer, an optical fiber having excellent void resistance can be manufactured.
- An optical fiber according to an aspect of the present disclosure includes a glass fiber including a core and a clad, a primary resin layer that is in contact with the glass fiber and covers the glass fiber, and a secondary resin layer that covers the primary resin layer.
- the resin layer is made of a cured product of the above resin composition.
- the resin composition according to the present embodiment includes a base resin containing a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator and a silane coupling agent, and surface-modified inorganic oxide particles having an ultraviolet curable functional group. including.
- (meth) acrylate means acrylate or corresponding methacrylate.
- (meth) acrylic acid means acrylate or corresponding methacrylate.
- the surface of the inorganic oxide particles is treated with a silane compound having a UV-curable functional group, the UV-curable functional group is introduced on the surface of the inorganic oxide particles. ing. That is, the surface-modified inorganic oxide particles are composed of an inorganic component and an organic component.
- the functional group may be an acryloyl group, a methacryloyl group or a vinyl group. By having such a functional group, it becomes easy to form a resin layer having high void resistance.
- silane compound having a UV-curable functional group examples include 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-acryloxypropyltriethoxysilane. , 8-methacryloxyoctyltrimethoxysilane, 8-acryloxyoctyltrimethoxysilane, 7-octenyltrimethoxysilane, p-styryltrimethoxysilane, vinyltrimethoxysilane and vinyltriethoxysilane.
- the surface-modified inorganic oxide particles according to this embodiment are dispersed in a dispersion medium.
- the surface-modified inorganic oxide particles can be uniformly dispersed in the resin composition, and the storage stability of the resin composition can be improved.
- the dispersion medium is not particularly limited as long as it does not inhibit the curing of the resin composition.
- the dispersion medium may be reactive or non-reactive.
- a monomer such as a (meth) acryloyl compound or an epoxy compound may be used.
- the (meth) acryloyl compound include 1,6-hexanediol di (meth) acrylate, EO-modified bisphenol A di (meth) acrylate, polyethylene glycol di (meth) acrylate, PO-modified bisphenol A di (meth) acrylate, Polypropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, (meth) acrylic acid adduct of propylene glycol diglycidyl ether, tripropylene glycol diglycidyl Examples include (meth) acrylic acid adducts of ethers and (meth) acrylic acid adducts of glycerin diglycidyl ether.
- the (meth) acryloyl compound include 1,6-hexane
- a ketone solvent such as methyl ethyl ketone (MEK), an alcohol solvent such as methanol (MeOH), propylene glycol monomethyl ether (PGME), or an ester solvent such as propylene glycol monomethyl ether acetate (PGMEA).
- MEK methyl ethyl ketone
- MeOH methanol
- PGME propylene glycol monomethyl ether
- PMEA propylene glycol monomethyl ether acetate
- the resin composition may be prepared by mixing the base resin and the surface-modified inorganic oxide particles dispersed in the dispersion medium and then removing a part of the dispersion medium.
- the dispersion medium containing the surface-modified inorganic oxide particles is measured by the X-ray small angle scattering method and the aggregated particles are not measured, it can be said that the surface-modified inorganic oxide particles are dispersed as the primary particles.
- the above surface-modified inorganic oxide particles include silicon dioxide (silica), zirconium dioxide (zirconia), aluminum oxide (alumina), and oxide. It is preferable that the particles are surface-treated with at least one selected from the group consisting of magnesium (magnesia), titanium oxide (titania), tin oxide and zinc oxide. From the viewpoints of excellent cost-effectiveness, easy surface treatment, ultraviolet ray transparency, and easy provision of appropriate hardness to the resin layer, surface-modified silica particles are used as the surface-modified inorganic oxide particles according to the present embodiment. Is more preferably used.
- the average primary particle size of the surface-modified inorganic oxide particles may be 650 nm or less, preferably 600 nm or less, more preferably 500 nm or less, still more preferably 400 nm or less.
- the average primary particle diameter of the surface-modified inorganic oxide particles is preferably 5 nm or more, more preferably 10 nm or more.
- the average primary particle size can be measured by, for example, image analysis of electron micrograph, light scattering method, BET method, or the like.
- the dispersion medium in which the primary particles of the inorganic oxide particles are dispersed looks visually transparent when the particle size of the primary particles is small. When the particle size of the primary particles is relatively large (40 nm or more), the dispersion medium in which the primary particles are dispersed appears cloudy, but no sediment is observed.
- the content of the surface-modified inorganic oxide particles is preferably 1% by mass or more and 45% by mass or less, and 2% by mass or more and 40% by mass, based on the total amount of the resin composition (the total amount of the base resin and the surface-modified inorganic oxide particles).
- the following is more preferable, 3 mass% or more and 35 mass% or less is further preferable, and 5 mass% or more and 30 mass% or less is particularly preferable.
- the content of the surface-modified inorganic oxide particles is 1% by mass or more, it becomes easy to form a tough resin layer.
- the content of the surface-modified inorganic oxide particles is 45% by mass or less, a resin layer having a low Young's modulus can be formed.
- the total amount of the resin composition and the total amount of the cured product of the resin composition may be considered to be the same.
- the content of the surface-modified inorganic oxide particles is preferably 1% by mass or more and 45% by mass or less, based on the total amount of the primary resin layer (the total amount of the cured product of the resin composition forming the primary resin layer), and 2% by mass or more. 40 mass% or less is more preferable, 3 mass% or more and 35 mass% or less is further preferable, and 5 mass% or more and 30 mass% or less is particularly preferable.
- the amount of surface modification in the surface-modified inorganic oxide particles is 0.2 mg / m 2 or more, preferably 0.2 mg / m 2 or more and 2.8 mg / m 2 or less, and 0.3 mg / m 2 or more 2 more preferably .6mg / m 2 or less, further preferably 0.4 mg / m 2 or more 2.4 mg / m 2 or less, is 0.6 mg / m 2 or more 2.2 mg / m 2 or less Is particularly preferable.
- the amount of surface modification is within the above range, the viscosity of the resin composition can be easily adjusted.
- the “surface modification amount” in the present specification can be calculated from the specific surface area of the surface modified inorganic oxide particles and the ratio of the organic component.
- the organic component is a component derived from the UV-curable functional group introduced into the inorganic oxide particles before surface modification.
- the components other than SiO 2 are organic components.
- the specific surface area can be measured by the nitrogen adsorption BET method, and the ratio of the organic component can be measured by suggestive thermogravimetric analysis (TG / DTA).
- the amount of surface modification in the surface-modified inorganic oxide particles may be measured by isolating the particles from the dispersion medium before preparing the resin composition, or by measuring the particles from the resin composition after preparing the resin composition. You may measure it separately.
- the base resin according to this embodiment contains a urethane (meth) acrylate oligomer, a monomer, a photopolymerization initiator, and a silane coupling agent.
- urethane (meth) acrylate oligomer an oligomer obtained by reacting a polyol compound, a polyisocyanate compound and a hydroxyl group-containing (meth) acrylate compound can be used.
- polyol compound examples include polytetramethylene glycol, polypropylene glycol, and bisphenol A / ethylene oxide addition diol.
- the number average molecular weight (Mn) of the polyol compound is preferably 1000 or more and 10000 or less, more preferably 1500 or more and 8000 or less, and further preferably 2000 or more and 6000 or less.
- polyisocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, isophorone diisocyanate, and dicyclohexylmethane 4,4'-diisocyanate.
- hydroxyl group-containing (meth) acrylate compound examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 1,6-hexanediol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, 2-Hydroxypropyl (meth) acrylate and tripropylene glycol mono (meth) acrylate are mentioned.
- Organotin compounds are generally used as catalysts when synthesizing urethane (meth) acrylate oligomers.
- organotin compound examples include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin malate, dibutyltin bis (2-ethylhexyl mercaptoacetate), dibutyltin bis (isooctyl mercaptoacetate) and dibutyltin oxide. From the viewpoint of easy availability and catalytic performance, it is preferable to use dibutyltin dilaurate or dibutyltin diacetate as a catalyst.
- a lower alcohol having 5 or less carbon atoms may be used during the synthesis of the urethane (meth) acrylate oligomer.
- the lower alcohol include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-2-propanol, 1-pentanol, 2-pentanol, 3-pentanol, Mention may be made of 2-methyl-1-butanol, 3-methyl-1-butanol, 2-methyl-2-butanol, 3-methyl-2-butanol and 2,2-dimethyl-1-propanol.
- a silane coupling agent eg, 3-mercaptopropyltrimethoxysilane
- the silane coupling agent may be added when synthesizing the urethane (meth) acrylate oligomer or when preparing the base resin.
- the base resin according to this embodiment may further contain an epoxy (meth) acrylate oligomer as an oligomer.
- an epoxy (meth) acrylate oligomer an oligomer obtained by reacting an epoxy resin having two or more glycidyl groups with a compound having a (meth) acryloyl group can be used.
- a monofunctional monomer having one polymerizable group and a polyfunctional monomer having two or more polymerizable groups can be used.
- the monomers may be used as a mixture of two or more kinds.
- a monomer having a phenoxy group may be used as the monomer because a tough resin layer is easily formed.
- a (meth) acrylate compound having a phenoxy group can be used as the monomer having a phenoxy group.
- the (meth) acrylate compound having a phenoxy group include phenol EO-modified (meth) acrylate, nonylphenol EO-modified (meth) acrylate, phenol PO-modified (meth) acrylate, nonylphenol PO-modified (meth) acrylate, and phenoxyethyl (meth).
- Acrylate 2-hydroxy-3-phenoxypropyl (meth) acrylate, and 3-phenoxybenzyl (meth) acrylate.
- EO-modified means having an ethylene oxide group represented by (C 2 H 4 O) n
- PO-modified is a propylene oxide group represented by (C 3 H 6 O) n.
- n is an integer of 1 or more.
- the monomer having a phenoxy group comprises phenol EO-modified acrylate, nonylphenol EO-modified acrylate, phenoxyethyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 3-phenoxybenzyl acrylate. It may be at least one selected from the group.
- the monomers having a phenoxy group may be used as a mixture of two or more kinds.
- the content of the phenoxy group-containing monomer is preferably 1% by mass or more and 60% by mass or less, more preferably 5% by mass or more and 50% by mass or less, and 10% by mass or more based on the total amount of the base resin. It is more preferably 40% by mass or less.
- the resin composition contains a monomer having a phenoxy group in such a range, a resin layer having a Young's modulus suitable as a primary coating material for an optical fiber can be formed.
- the monomer a monomer having no phenoxy group may be used.
- the monomer having no phenoxy group may be a monofunctional monomer or a polyfunctional monomer having two or more polymerizable groups.
- Examples of the monofunctional monomer having no phenoxy group include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, s-butyl (meth) acrylate and tert-butyl.
- N-substituted amide monomers aminoethyl (meth) acrylate, (meth) acrylic Aminoalkyl (meth) acrylate monomers such as aminopropyl acrylate, N, N-dimethylaminoethyl (meth) acrylate, tert-butylaminoethyl (meth) acrylate; N- (meth) acryloyloxymethylenesuccinimide, N Examples thereof include succinimide-based monomers such as-(meth) acryloyl-6-oxyhexamethylenesuccinimide and N- (meth) acryloyl-8-oxyoctamethylenesuccinimide.
- polyfunctional monomer having no phenoxy group examples include ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, tripropylene glycol di.
- (Meth) acrylate bisphenol A alkylene oxide adduct di (meth) acrylate, tetraethylene glycol di (meth) acrylate, hydroxypivalic acid neopentyl glycol di (meth) acrylate, 1,4-butanediol di (meth) Acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, 1,14-tetradecanediol di (meth) acrylate, 1,16-hexadecanediol di (meth) acrylate, 1,20-eicosanediol di (meth) acrylate, isopentyldiol di (meth) acrylate, 3-ethyl-1,8-octanediol di (meth) acryl
- the photopolymerization initiator can be appropriately selected and used from known radical photopolymerization initiators.
- the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone (Omnirad 184, manufactured by IGM Resins), 2,2-dimethoxy-2-phenylacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2- Methylpropan-1-one, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1 -One (Omnirad 907, manufactured by IGM Resins), 2,4,6-trimethylbenzoyldiphenylphosphine oxide (Omnirad TPO, manufactured by IGM Resins) and bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (Omn
- the silane coupling agent is not particularly limited as long as it does not hinder the curing of the resin composition.
- Examples of the silane coupling agent include tetramethyl silicate, tetraethyl silicate, mercaptopropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxy-ethoxy) silane, ⁇ - (3,4-epoxycyclohexyl).
- -Ethyltrimethoxysilane dimethoxydimethylsilane, diethoxydimethylsilane, 3-acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -methacryloxypropyl Trimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethoxysilane, N- ( ⁇ -aminoethyl) - ⁇ -aminopropyltrimethyldimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane, ⁇ -chloropropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltrimethoxysilane, bis- [3- (triethoxysilyl) prop
- the resin composition may further contain a leveling agent, a defoaming agent, an antioxidant and the like.
- the Young's modulus of the cured product of the resin composition is preferably 4 MPa or less at 23 ° C. ⁇ 2 ° C., and more preferably 0.05 MPa or more and 4.0 MPa or less, in order to suppress generation of voids in the optical fiber. It is more preferably 0.1 MPa or more and 3.5 MPa or less, and particularly preferably 0.3 MPa or more and 3.0 MPa or less.
- the resin composition according to this embodiment can be suitably used as a primary coating material for an optical fiber.
- an optical fiber having excellent void resistance and lateral pressure characteristics can be produced.
- FIG. 1 is a schematic sectional view showing an example of the optical fiber according to the present embodiment.
- the optical fiber 10 includes a glass fiber 13 including a core 11 and a clad 12, and a coating resin layer 16 including a primary resin layer 14 and a secondary resin layer 15 provided on the outer periphery of the glass fiber 13.
- the clad 12 surrounds the core 11.
- the core 11 and the clad 12 mainly include glass such as quartz glass.
- the core 11 may be made of germanium-added quartz glass
- the clad 12 may be made of pure quartz glass or fluorine-added quartz. Glass can be used.
- the outer diameter (D2) of the glass fiber 13 is about 125 ⁇ m, and the diameter (D1) of the core 11 constituting the glass fiber 13 is about 7 to 15 ⁇ m.
- the thickness of the coating resin layer 16 is usually about 60 to 70 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 to 50 ⁇ m.
- the thickness of the primary resin layer 14 is 35 ⁇ m and the thickness of the secondary resin layer 15 is 25 ⁇ m. May be.
- the outer diameter of the optical fiber 10 may be about 245 to 265 ⁇ m.
- the thickness of the coating resin layer 16 may be about 27 to 48 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 10 to 38 ⁇ m.
- the thickness of the primary resin layer 14 is 25 ⁇ m and the thickness of the secondary resin layer 15 is 10 ⁇ m.
- the outer diameter of the optical fiber 10 may be about 179 to 221 ⁇ m.
- the outer diameter (D2) of the glass fiber 13 may be about 100 ⁇ m, and the thickness of the coating resin layer 16 may be about 22 to 37 ⁇ m.
- the thickness of each of the primary resin layer 14 and the secondary resin layer 15 may be about 5 to 32 ⁇ m.
- the thickness of the primary resin layer 14 is 25 ⁇ m and the thickness of the secondary resin layer 15 is 10 ⁇ m.
- the outer diameter of the optical fiber 10 may be about 144 to 174 ⁇ m.
- the Young's modulus of the secondary resin layer is preferably 1300 MPa or more at 23 ° C., more preferably 1300 MPa or more and 2600 MPa or less, still more preferably 1300 MPa or more and 2500 MPa or less.
- the Young's modulus of the secondary resin layer is 1300 MPa or more, the lateral pressure characteristics are easily improved, and when it is 2600 MPa or less, the secondary resin layer can be provided with appropriate toughness, so that the secondary resin layer is less likely to be cracked.
- the secondary layer can be formed, for example, by curing a resin composition containing a urethane (meth) acrylate oligomer, a monomer and a photopolymerization initiator.
- a conventionally known technique can be used for the resin composition for the secondary resin layer.
- the urethane (meth) acrylate oligomer, the monomer and the photopolymerization initiator may be appropriately selected from the compounds exemplified as the above base resin.
- the resin composition for the secondary resin layer may include hydrophobic inorganic oxide particles.
- the hydrophobic inorganic oxide particles may be the surface-modified inorganic oxide particles described above.
- the resin composition forming the secondary resin layer has a different composition from the resin composition forming the primary resin layer. From the viewpoint of increasing the Young's modulus of the secondary resin layer, Mn of the polyol compound used when synthesizing the urethane (meth) acrylate oligomer may be 400 or more and 2000 or less.
- Nonylphenol EO-modified acrylate (trade name “Aronix M-113”, n ⁇ 4 by Toagosei Co., Ltd.), N-vinylcaprolactam and 1,6-hexanediol diacrylate were prepared as monomers.
- silane coupling agent 3-Mercaptopropyltrimethoxysilane was prepared as a silane coupling agent.
- Base resin 60 parts by mass of urethane acrylate oligomer, 22.8 parts by mass of nonylphenol EO-modified acrylate, 4.8 parts by mass of N-vinylcaprolactam, 1.6 parts by mass of 1,6-hexanediol diacrylate, 2,4,6-trimethylbenzoyldiphenyl
- a base resin was prepared by mixing 2.7 parts by mass of phosphine oxide and 0.8 part by mass of 3-mercaptopropyltrimethoxysilane.
- silica sol MEK dispersion liquid containing silica particles surface-treated with 3-methacryloxypropyltrimethoxysilane (hereinafter simply referred to as “silica particles”) was prepared.
- a silica sol (MEK dispersion liquid) containing unmodified silica particles was prepared.
- Chloroform was added to the resin composition and the mixture was centrifuged to collect the precipitate. Acetone was added to the precipitate and the mixture was centrifuged to remove the supernatant. Then, acetone was added to the precipitate again to perform centrifugation and removal of the supernatant, which was repeated four times to extract silica particles.
- the silica particles ground in a mortar were vacuum dried at room temperature for 12 hours to remove volatile components. The centrifugation was performed at 30,000 rpm for 120 minutes. The dried silica particles were subjected to a reduced pressure treatment at 80 ° C.
- a specific surface area (m 2 / m 2 ) of the silica particles was measured by a nitrogen adsorption BET method using a pore distribution measuring device (“ASAP-2020” manufactured by Micromeritics). g) was measured.
- the ratio (mass%) of the organic components contained in the silica particles was measured using a differential thermogravimetric simultaneous analysis device (“TG / DTA6300” manufactured by Hitachi High-Tech Science Co., Ltd.). The measurement was performed by heating the weight-measured silica particles from room temperature to 850 ° C. under nitrogen (300 mL / min), then cooling from 850 ° C. to 200 ° C., and 200 ° C. to 1000 ° C. under air (100 mL / min). It was heated to and the weight change was measured. The ratio of the organic component was calculated from the weight change of silica particles.
- TG / DTA6300 manufactured by Hitachi High-Tech Science Co., Ltd.
- the surface modification amount of the silica particles was calculated from the specific surface area of the silica particles and the ratio of the organic component by the following formula.
- Surface modification amount (mg / m 2 ) ratio of organic component / specific surface area
- the resin composition was applied onto a polyethylene terephthalate (PET) film using a spin coater, and then cured using an electrodeless UV lamp system (D bulb) (manufactured by Heraeus) under the condition of 1000 ⁇ 100 mJ / cm 2.
- a resin layer having a thickness of 200 ⁇ 20 ⁇ m was formed on the PET film. The resin layer was peeled off from the PET film to obtain a resin film.
- a resin film was punched out into a JIS K 7127 type 5 dumbbell shape and pulled under conditions of 23 ⁇ 2 ° C. and 50 ⁇ 10% RH using a tensile tester at a pulling speed of 1 mm / min and a distance between marked lines of 25 mm. , A stress-strain curve was obtained. Young's modulus was determined by the tangent line.
- Reference numeral 10 Optical fiber, 11 ... Core, 12 ... Clad, 13 ... Glass fiber, 14 ... Primary resin layer, 15 ... Secondary resin layer, 16 ... Coating resin layer.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
本出願は、2018年11月16日出願の日本出願第2018-215711号に基づく優先権を主張し、前記日本出願に記載された全ての記載内容を援用するものである。
光ファイバの耐ボイド特性を向上する観点から、フィラーを含有する樹脂組成物を用いてプライマリ樹脂層を形成することで、プライマリ樹脂層の強度を高めることが考えられる。しかしながら、プライマリ樹脂層に用いられる樹脂組成物は、通常、シランカップリング剤を含有していることから、フィラーを添加すると、樹脂組成物が増粘し易く、ポットライフが短くなる傾向にある。
本開示によれば、ポットライフが長い光ファイバ被覆用の樹脂組成物、及び、当該樹脂組成物から形成されるプライマリ樹脂層を備える光ファイバを提供することができる。
最初に、本開示の実施形態の内容を列記して説明する。本開示の一態様に係る樹脂組成物は、ウレタン(メタ)アクリレートオリゴマー、モノマー、光重合開始剤及びシランカップリング剤を含有するベース樹脂と、紫外線硬化性の官能基を有する表面修飾無機酸化物粒子とを含み、表面修飾無機酸化物粒子における表面修飾量が、0.2mg/m2以上である。
本開示の実施形態に係る樹脂組成物及び光ファイバの具体例を、必要により図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されず、請求の範囲によって示され、請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。以下の説明では、図面の説明において同一の要素には同一の符号を付し、重複する説明を省略する。
本実施形態に係る樹脂組成物は、ウレタン(メタ)アクリレートオリゴマー、モノマー、光重合開始剤及びシランカップリング剤を含有するベース樹脂と、紫外線硬化性の官能基を有する表面修飾無機酸化物粒子とを含む。
本実施形態に係る表面修飾無機酸化物粒子は、無機酸化物粒子の表面が紫外線硬化性の官能基を有するシラン化合物により処理され、無機酸化物粒子の表面に紫外線硬化性の官能基が導入されている。すなわち、表面修飾無機酸化物粒子は、無機成分と有機成分とから構成されている。官能基は、アクリロイル基、メタクリロイル基又はビニル基であってもよい。このような官能基を有することで、耐ボイド特性の高い樹脂層を形成し易くなる。
本実施形態に係るベース樹脂は、ウレタン(メタ)アクリレートオリゴマー、モノマー、光重合開始剤及びシランカップリング剤を含有する。
図1は、本実施形態に係る光ファイバの一例を示す概略断面図である。光ファイバ10は、コア11及びクラッド12を含むガラスファイバ13と、ガラスファイバ13の外周に設けられたプライマリ樹脂層14及びセカンダリ樹脂層15を含む被覆樹脂層16とを備えている。
(オリゴマー)
オリゴマーとして、Mn4000のポリプロピレングリコール、イソホロンジイソシアネート、ヒドロキシエチルアクリレート及びメタノールを反応させることにより得られたウレタンアクリレートオリゴマーを準備した。
モノマーとして、ノニルフェノールEO変性アクリレート(東亞合成株式会社の商品名「アロニックスM-113」、n≒4)、N-ビニルカプロラクタム及び1,6-ヘキサンジオールジアクリレートを準備した。
光重合開始剤として、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキシドを準備した。
シランカップリング剤として、3-メルカプトプロピルトリメトキシシランを準備した。
ウレタンアクリレートオリゴマー60質量部、ノニルフェノールEO変性アクリレート22.8質量部、N-ビニルカプロラクタム4.8質量部、1,6-ヘキサンジオールジアクリレート1.6質量部、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキシド2.7質量部及び3-メルカプトプロピルトリメトキシシラン0.8質量部を混合して、ベース樹脂を調製した。
表面修飾無機酸化物粒子として、3-メタクリロキシプロピルトリメトキシシランで表面処理されているシリカ粒子(以下、単に「シリカ粒子」という。)を含むシリカゾル(MEK分散液)を準備した。
未修飾のシリカ粒子を含むシリカゾル(MEK分散液)を準備した。
ベース樹脂と、シリカゾルとを混合した後、MEKの大部分を除去して、樹脂組成物中のシリカ粒子の含有量が10質量%となるように、樹脂組成物を調製した。
樹脂組成物にクロロホルムを加えて遠心分離を行い、沈殿物を回収した。沈殿物にアセトンを加えて遠心分離を行い、上澄みを除去した後、沈殿物に再度アセトンを加えて遠心分離、上澄み除去を行う操作を4回行い、シリカ粒子を取り出した。乳鉢ですりつぶしたシリカ粒子を室温で12時間減圧乾燥して揮発分を除去した。遠心分離は、30000rpmで120分間の条件で行った。乾燥後のシリカ粒子を80℃で12時間減圧処理し、細孔分布測定装置(マイクロメリティクス製の「ASAP-2020」)を用いて、窒素吸着BET法によりシリカ粒子の比表面積(m2/g)を測定した。
表面修飾量(mg/m2)=有機成分の割合/比表面積
スピンコータを用いて、樹脂組成物をポリエチレンテレフタレート(PET)フィルムの上に塗布した後、無電極UVランプシステム(Dバルブ)(ヘレウス製)を用いて、1000±100mJ/cm2の条件で硬化させ、PETフィルム上に厚み200±20μmの樹脂層を形成した。樹脂層をPETフィルムから剥がし、樹脂フィルムを得た。
樹脂組成物を容器に入れて60℃で保管し、樹脂組成物が増粘して塗布できなくなる時期を調べた。
Claims (7)
- ウレタン(メタ)アクリレートオリゴマー、モノマー、光重合開始剤及びシランカップリング剤を含有するベース樹脂と、紫外線硬化性の官能基を有する表面修飾無機酸化物粒子と、を含む樹脂組成物であり、
前記表面修飾無機酸化物粒子における表面修飾量が、0.2mg/m2以上である、光ファイバ被覆用の樹脂組成物。 - 前記表面修飾量が0.2mg/m2以上2.8mg/m2以下である、請求項1に記載の樹脂組成物。
- 前記官能基が、アクリロイル基、メタクリロイル基及びビニル基からなる群より選ばれる少なくとも1種の基である、請求項1又は請求項2に記載の樹脂組成物。
- 前記表面修飾無機酸化物粒子の平均一次粒径が、650nm以下である、請求項1から請求項3のいずれか一項に記載の樹脂組成物。
- 前記表面修飾無機酸化物粒子の含有量が、前記樹脂組成物の総量を基準として1質量%以上45質量%以下である、請求項1から請求項4のいずれか一項に記載の樹脂組成物。
- 請求項1から請求項5のいずれか一項に記載の樹脂組成物を含む、光ファイバのプライマリ被覆材料。
- コア及びクラッドを含むガラスファイバと、
前記ガラスファイバに接して該ガラスファイバを被覆するプライマリ樹脂層と、
前記プライマリ樹脂層を被覆するセカンダリ樹脂層と、を備え、
前記プライマリ樹脂層が、請求項1から請求項5のいずれか一項に記載の樹脂組成物の硬化物からなる、光ファイバ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020556199A JP7367698B2 (ja) | 2018-11-16 | 2019-11-15 | 樹脂組成物及び光ファイバ |
CN201980069815.6A CN113039225B (zh) | 2018-11-16 | 2019-11-15 | 树脂组合物以及光纤 |
EP19883978.9A EP3882286A4 (en) | 2018-11-16 | 2019-11-15 | COMPOSITION OF RESIN AND OPTICAL FIBER |
US17/040,200 US20210009854A1 (en) | 2018-11-16 | 2019-11-15 | Resin composition and optical fiber |
KR1020217017387A KR20210093279A (ko) | 2018-11-16 | 2019-11-15 | 수지 조성물 및 광 파이버 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-215711 | 2018-11-16 | ||
JP2018215711 | 2018-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020101030A1 true WO2020101030A1 (ja) | 2020-05-22 |
Family
ID=70730449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/044951 WO2020101030A1 (ja) | 2018-11-16 | 2019-11-15 | 樹脂組成物及び光ファイバ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210009854A1 (ja) |
EP (1) | EP3882286A4 (ja) |
JP (1) | JP7367698B2 (ja) |
KR (1) | KR20210093279A (ja) |
CN (1) | CN113039225B (ja) |
TW (1) | TW202028383A (ja) |
WO (1) | WO2020101030A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022190693A1 (ja) * | 2021-03-11 | 2022-09-15 | 住友電気工業株式会社 | 光ファイバ及び光ファイバリボン |
EP4265659A4 (en) * | 2020-12-16 | 2024-06-19 | Sumitomo Electric Industries, Ltd. | RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBER, AND OPTICAL FIBER AND METHOD FOR MANUFACTURING THE SAME |
EP4265660A4 (en) * | 2020-12-16 | 2024-06-19 | Sumitomo Electric Industries, Ltd. | RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBERS, OPTICAL FIBER AND METHOD FOR MANUFACTURING OPTICAL FIBERS |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102669759B1 (ko) | 2018-04-16 | 2024-05-27 | 스미토모 덴키 고교 가부시키가이샤 | 광섬유 |
EP3882286A4 (en) * | 2018-11-16 | 2022-03-02 | Sumitomo Electric Industries, Ltd. | COMPOSITION OF RESIN AND OPTICAL FIBER |
US20210053870A1 (en) * | 2018-11-16 | 2021-02-25 | Sumitomo Electric Industries, Ltd. | Resin composition, optical fiber and method for manufacturing optical fiber |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08134156A (ja) * | 1994-11-02 | 1996-05-28 | Sumitomo Chem Co Ltd | 光硬化性樹脂組成物 |
JP2005213453A (ja) * | 2004-01-30 | 2005-08-11 | Mitsubishi Chemicals Corp | 放射線硬化性樹脂組成物及び放射線硬化性樹脂組成物の製造方法 |
JP2007131698A (ja) * | 2005-10-11 | 2007-05-31 | Mitsubishi Chemicals Corp | 放射線硬化性組成物及びその硬化物、並びにその積層体 |
JP2013197163A (ja) | 2012-03-16 | 2013-09-30 | Toppan Printing Co Ltd | 積層基板およびその製造方法 |
JP2014219550A (ja) | 2013-05-08 | 2014-11-20 | 住友電気工業株式会社 | 光ファイバ心線 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004217836A (ja) | 2003-01-16 | 2004-08-05 | Mitsubishi Chemicals Corp | 放射線硬化性組成物、放射線硬化性組成物の製造方法、硬化物及び光学材料 |
US7297731B2 (en) * | 2003-03-11 | 2007-11-20 | 3M Innovative Properties Company | Coating dispersions for optical fibers |
EP1740663A1 (en) | 2004-04-22 | 2007-01-10 | JSR Corporation | Low refractive index coating composition |
JP2006137795A (ja) * | 2004-11-10 | 2006-06-01 | Mitsubishi Chemicals Corp | 放射線硬化性組成物及びその硬化物、並びにその積層体 |
JP2006188659A (ja) | 2004-12-07 | 2006-07-20 | Mitsubishi Chemicals Corp | 放射線硬化性樹脂組成物およびその硬化物 |
EP2261289B1 (en) * | 2008-03-27 | 2012-08-15 | Fujikura Kasei Co., Ltd. | Composition for coating a plastic substrate, coating film formed therefrom, and formed body |
KR20110021916A (ko) * | 2008-05-23 | 2011-03-04 | 쇼와 덴코 가부시키가이샤 | 반응성 (메트)아크릴레이트 중합체를 함유한 경화성 조성물 및 그 경화물 |
CN102686528B (zh) * | 2009-11-26 | 2015-06-10 | 普睿司曼股份公司 | 具有双涂层的光学纤维 |
TWI642732B (zh) * | 2016-07-01 | 2018-12-01 | 三菱化學股份有限公司 | 活性能量線硬化性樹脂組成物、樹脂成形品及樹脂成形品的製造方法 |
US11345606B2 (en) * | 2017-02-17 | 2022-05-31 | David Brown | Deposition particles and a method and apparatus for producing the same |
CN107083159B (zh) | 2017-05-16 | 2019-06-07 | 华中科技大学 | 一种光纤用高导热光固化涂料、及其制备与应用 |
EP3882288B1 (en) * | 2018-11-16 | 2024-06-26 | Sumitomo Electric Industries, Ltd. | Resin composition, optical fiber and method for manufacturing optical fiber |
EP3882286A4 (en) * | 2018-11-16 | 2022-03-02 | Sumitomo Electric Industries, Ltd. | COMPOSITION OF RESIN AND OPTICAL FIBER |
TWI706012B (zh) * | 2019-09-12 | 2020-10-01 | 明基材料股份有限公司 | 高硬度可撓硬塗層膜 |
-
2019
- 2019-11-15 EP EP19883978.9A patent/EP3882286A4/en active Pending
- 2019-11-15 US US17/040,200 patent/US20210009854A1/en not_active Abandoned
- 2019-11-15 JP JP2020556199A patent/JP7367698B2/ja active Active
- 2019-11-15 TW TW108141673A patent/TW202028383A/zh unknown
- 2019-11-15 WO PCT/JP2019/044951 patent/WO2020101030A1/ja active Application Filing
- 2019-11-15 KR KR1020217017387A patent/KR20210093279A/ko unknown
- 2019-11-15 CN CN201980069815.6A patent/CN113039225B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08134156A (ja) * | 1994-11-02 | 1996-05-28 | Sumitomo Chem Co Ltd | 光硬化性樹脂組成物 |
JP2005213453A (ja) * | 2004-01-30 | 2005-08-11 | Mitsubishi Chemicals Corp | 放射線硬化性樹脂組成物及び放射線硬化性樹脂組成物の製造方法 |
JP2007131698A (ja) * | 2005-10-11 | 2007-05-31 | Mitsubishi Chemicals Corp | 放射線硬化性組成物及びその硬化物、並びにその積層体 |
JP2013197163A (ja) | 2012-03-16 | 2013-09-30 | Toppan Printing Co Ltd | 積層基板およびその製造方法 |
JP2014219550A (ja) | 2013-05-08 | 2014-11-20 | 住友電気工業株式会社 | 光ファイバ心線 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4265659A4 (en) * | 2020-12-16 | 2024-06-19 | Sumitomo Electric Industries, Ltd. | RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBER, AND OPTICAL FIBER AND METHOD FOR MANUFACTURING THE SAME |
EP4265660A4 (en) * | 2020-12-16 | 2024-06-19 | Sumitomo Electric Industries, Ltd. | RESIN COMPOSITION, SECONDARY COATING MATERIAL FOR OPTICAL FIBERS, OPTICAL FIBER AND METHOD FOR MANUFACTURING OPTICAL FIBERS |
WO2022190693A1 (ja) * | 2021-03-11 | 2022-09-15 | 住友電気工業株式会社 | 光ファイバ及び光ファイバリボン |
Also Published As
Publication number | Publication date |
---|---|
KR20210093279A (ko) | 2021-07-27 |
EP3882286A1 (en) | 2021-09-22 |
US20210009854A1 (en) | 2021-01-14 |
CN113039225B (zh) | 2023-08-29 |
TW202028383A (zh) | 2020-08-01 |
CN113039225A (zh) | 2021-06-25 |
EP3882286A4 (en) | 2022-03-02 |
JP7367698B2 (ja) | 2023-10-24 |
JPWO2020101030A1 (ja) | 2021-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2020101030A1 (ja) | 樹脂組成物及び光ファイバ | |
JP7136124B2 (ja) | 樹脂組成物及び光ファイバ | |
JP7255588B2 (ja) | 樹脂組成物、光ファイバのセカンダリ被覆材料及び光ファイバ | |
WO2020040223A1 (ja) | 光ファイバ | |
WO2019203236A1 (ja) | 光ファイバ | |
JP7367697B2 (ja) | 樹脂組成物、光ファイバ及び光ファイバの製造方法 | |
WO2020101028A1 (ja) | 樹脂組成物、光ファイバ及び光ファイバの製造方法 | |
WO2021019908A1 (ja) | 光ファイバリボン及び光ファイバケーブル | |
WO2020250838A1 (ja) | 樹脂組成物、光ファイバ及び光ファイバの製造方法 | |
JP7388426B2 (ja) | 光ファイバ被覆用の樹脂組成物 | |
WO2020071544A1 (ja) | 樹脂組成物及び光ファイバ | |
KR102682991B1 (ko) | 수지 조성물 및 광섬유 | |
WO2022130855A1 (ja) | 樹脂組成物、光ファイバのセカンダリ被覆材料、光ファイバ及び光ファイバの製造方法 | |
RU2788150C2 (ru) | Смоляная композиция и оптическое волокно | |
WO2022130808A1 (ja) | 樹脂組成物、光ファイバのセカンダリ被覆材料、光ファイバ及び光ファイバの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19883978 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2020556199 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20217017387 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2021113212 Country of ref document: RU |
|
ENP | Entry into the national phase |
Ref document number: 2019883978 Country of ref document: EP Effective date: 20210616 |