WO2020087865A1 - 曝边机及曝光方法 - Google Patents

曝边机及曝光方法 Download PDF

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Publication number
WO2020087865A1
WO2020087865A1 PCT/CN2019/081185 CN2019081185W WO2020087865A1 WO 2020087865 A1 WO2020087865 A1 WO 2020087865A1 CN 2019081185 W CN2019081185 W CN 2019081185W WO 2020087865 A1 WO2020087865 A1 WO 2020087865A1
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Prior art keywords
support surface
substrate
irradiation
side wall
support
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PCT/CN2019/081185
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English (en)
French (fr)
Inventor
王威
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武汉华星光电技术有限公司
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Publication of WO2020087865A1 publication Critical patent/WO2020087865A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus

Definitions

  • This application relates to the field of display technology, and in particular to an edge exposure machine and an exposure method.
  • edge exposure machines need to be used to wash the long and short sides of the substrate and remove edge conductive materials such as metals.
  • the traditional edge exposure machine is prone to electrostatic discharge (ESD) damage, which leads to the occurrence of bright and dark spots at fixed points.
  • ESD electrostatic discharge
  • the edge exposure machine The outlet is connected to the deionization rod, but the effect is not good.
  • the embodiments of the present application provide an edge exposure machine and an exposure method, which can eliminate static electricity generated by the contact between the substrate and the exposure machine during the internal exposure process of the edge exposure machine.
  • an embodiment of the present application provides an edge exposure machine, including:
  • a supporting surface and a first side wall and a second side wall opposite to each other on the supporting surface, wherein,
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall, the plurality of irradiation sources are used to irradiate the support surface when exposing the substrate to eliminate Static electricity generated when the substrate contacts the support surface.
  • the support surface is composed of a plurality of support pins, and the top lines of the plurality of support pins form the support surface, and the plurality of support pins are used when exposing the substrate The contact area between the supporting surface and the substrate is reduced.
  • the plurality of irradiation sources on the first side wall and the second side wall are at the same vertical height as the tops of the plurality of support pins.
  • the support surface is a square support surface, and the plurality of irradiation sources are disposed at corners of the square support surface.
  • the light irradiated by the plurality of irradiation sources forms an irradiation surface, and the irradiation surface is used to irradiate the support surface when exposing the substrate.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • an embodiment of the present application further provides an exposure method, including:
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall opposite to each other on the support surface;
  • the support surfaces are irradiated by the plurality of irradiation sources to eliminate static electricity generated by the contact between the substrate and the support surface.
  • the support surface is composed of a plurality of support pins, the top connection lines of the plurality of support pins form the support surface, and the plurality of support pins are used to reduce the exposure of the substrate The contact area between the supporting surface and the substrate.
  • the light emitted by the plurality of irradiation sources forms an irradiation surface
  • the irradiation of the support surface by the plurality of irradiation sources when exposing the substrate includes:
  • the support surface is irradiated by the irradiation.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • an embodiment of the present application further provides an edge exposure machine, including:
  • a supporting surface and a first side wall and a second side wall opposite to each other on the supporting surface, wherein,
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall, the plurality of irradiation sources are used to irradiate the support surface when exposing the substrate to eliminate The static electricity generated by the contact between the substrate and the support surface, wherein the support surface is composed of a plurality of support pins, the top lines of the plurality of support pins form the support surface, and the plurality of support pins are used When the substrate is exposed, the contact area between the supporting surface and the substrate is reduced, and openings are provided on the third side wall and the fourth side wall perpendicular to the first side wall.
  • the plurality of irradiation sources on the first side wall and the second side wall are at the same vertical height as the tops of the plurality of support pins.
  • the support surface is a square support surface, and the plurality of irradiation sources are disposed at corners of the square support surface.
  • the light irradiated by the plurality of irradiation sources forms an irradiation surface, and the irradiation surface is used to irradiate the support surface when exposing the substrate.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • the edge exposure machine provided by the embodiment of the present application includes a support surface, and first and second side walls that are oppositely disposed on both sides of the support surface, wherein the first surface and the first side wall of the first side wall A plurality of irradiation sources are provided on the second surface of the two side walls, the plurality of irradiation sources are used to irradiate the support surface when exposing the substrate, so as to eliminate static electricity generated by the contact between the substrate and the support surface .
  • the edge exposure machine provided by the embodiment of the present application irradiates the support surface with multiple irradiation sources on the side walls to eliminate static electricity generated by the substrate placed on the support surface during subsequent processing.
  • FIG. 1 is a schematic structural diagram of an edge exposure machine provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the contact between the substrate and the support pin during the exposure process provided by the embodiment of the present application.
  • FIG. 3 is another schematic structural diagram of an edge exposure machine provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of light irradiation inside an edge exposure machine provided by an embodiment of the present application.
  • FIG. 5 is another schematic diagram of light irradiation inside the edge exposure machine provided by the embodiment of the present application.
  • edge exposure machines need to be used.
  • traditional edge exposure machines are prone to electrostatic discharge.
  • Static discharge (ESD) explosion resulting in a group of bright and dark spots at fixed points.
  • ESD Static discharge
  • a deionization rod is connected to the outlet of the edger, but it cannot solve the problem caused by the substrate after entering the machine ESD was injured. Therefore, the embodiments of the present application provide an edge exposure machine and an exposure method, which can eliminate the static electricity generated by the contact between the substrate and the exposure machine during the internal exposure process of the edge exposure machine.
  • An embodiment of the present application provides an edge exposure machine, including:
  • a supporting surface and a first side wall and a second side wall opposite to each other on the supporting surface, wherein,
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall, the plurality of irradiation sources are used to irradiate the support surface when exposing the substrate to eliminate Static electricity generated when the substrate contacts the support surface.
  • the support surface is composed of a plurality of support pins, and the top connection lines of the plurality of support pins form the support surface, and the plurality of support pins are used to reduce the support surface and the substrate when exposing the substrate Contact area.
  • the plurality of irradiation sources on the first side wall and the second side wall are at the same vertical height as the tops of the plurality of support pins.
  • the support surface is a square support surface, and the plurality of irradiation sources are disposed at corners of the square support surface.
  • the light irradiated from the plurality of irradiation sources forms an irradiation surface, and the irradiation surface is used to irradiate the support surface when exposing the substrate.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • the third side wall and the fourth side wall perpendicular to the first side wall are provided with openings.
  • FIG. 1 is a schematic structural diagram of an edge exposure machine provided by an embodiment of the present application.
  • An embodiment of the present application provides an edge exposure machine 100, including:
  • a plurality of irradiation sources 40 are provided on the first surface 201 of the first side wall 20 and the second surface 301 of the second side wall 30.
  • the plurality of irradiation sources 40 are used to expose the substrate 200 when the substrate 200 is exposed.
  • the supporting surface 10 is irradiated to eliminate static electricity generated when the substrate 200 contacts the supporting surface 10.
  • the exposure machine 100 may be a rectangular parallelepiped as shown in FIG. 1, but it is not limited to a rectangular parallelepiped.
  • the first side wall 20 and the second side wall 30 are two opposite surfaces of the rectangular parallelepiped.
  • the supporting surface 10 is perpendicular to the first side wall 20 and the second side wall 30.
  • a plurality of irradiation sources 40 are provided on the first surface 201 of the first side wall 20 and the second surface 301 of the second side wall 30, wherein the first surface 201 and the second surface 301 are surfaces facing the center of the rectangular parallelepiped .
  • the irradiation source 40 may be an X-ray or other irradiator capable of eliminating static rays, which will not be repeated here.
  • an opening is provided on the third side wall 60 and the fourth side wall 70 perpendicular to the first side wall 20 in the edge exposure machine 100, for the actual production to pass through the opening
  • the operation of the substrate 200 is carried out.
  • an ion rod is provided at the opening, and the ion rod is used to remove static electricity of the substrate 200.
  • the edge exposure machine 100 provided in the embodiment of the present application includes a supporting surface 10, and first and second side walls 20 and 30 disposed oppositely on both sides of the supporting surface 10, wherein the first side wall 20
  • the first surface 201 and the second surface 301 of the second side wall 30 are provided with a plurality of irradiation sources 40 for irradiating the support surface 10 when the substrate 200 is exposed to eliminate The static electricity generated when the substrate 200 contacts the support surface 10.
  • the edge exposure machine 100 provided in the embodiment of the present application irradiates the support surface 10 with multiple irradiation sources 40 on the side walls to eliminate static electricity generated by the substrate 200 placed on the support surface 10 during subsequent processing.
  • FIG. 2 is a schematic diagram of the contact between the substrate and the support pin during the exposure process provided by the embodiment of this application
  • FIG. 3 is Another structural diagram.
  • the surface of the support 10 is composed of a plurality of support pins 50, and the tops 501 of the plurality of support pins 50 are connected to form the support surface 10.
  • the plurality of support pins 50 are used to reduce the support when the substrate 200 is exposed The contact area between the surface 10 and the substrate 200.
  • the plurality of illumination sources 40 on the first side wall 20 and the second side wall 30 are at the same vertical height as the tops 501 of the plurality of support pins 50.
  • the support surface 10 is an imaginary surface formed by a plurality of support pins 50.
  • the support surface 10 is an imaginary surface formed by connecting the tops 501 of the plurality of support pins 50 and can support the substrate 200.
  • Each support pin The height of the top portion 501 of 50 is at the same vertical height, so that the formed imaginary surface can stably carry the substrate 200.
  • the contact area between the substrate 200 and the edge exposure machine 100 is the contact area between the substrate 200 and the plurality of support pins 50, which can effectively reduce the contact area between the support surface 10 and the substrate 200.
  • the installation height of the irradiation source 40 should be at the same vertical height as the top 501 of the support pin 50. In this way, the light emitted from the irradiation source 40 can be irradiated to the top 501 so that no static electricity is generated when the substrate 200 contacts the top 501.
  • FIG. 4 is a schematic diagram of the internal light irradiation of the edge exposure machine provided by the embodiment of this application
  • FIG. 5 is another schematic diagram of the internal light irradiation of the edge exposure machine provided by the embodiment of the application.
  • the support surface 10 is a square support surface 10
  • the plurality of illumination sources 40 are disposed at corners of the square support surface 10.
  • the light emitted by the plurality of irradiation sources 40 forms an irradiation surface 401, which is used to irradiate the support surface 10 when the substrate 200 is exposed.
  • the irradiation area of the irradiation surface 401 is larger than the area of the support surface 10, so that the light emitted by the plurality of irradiation sources 40 can cover the support surface 10 when the substrate 200 is exposed.
  • the support surface 10 formed by the plurality of support pins 50 is determined by the placement position of the support pins 50, such as a square. Rectangular, round, etc. No limitation here.
  • a plurality of irradiation sources provided on the side wall of the edge exposure machine 100 should be irradiated to the top 501 of all the support pins 50. Therefore, the plurality of irradiation sources 40 need to form an irradiation surface 401 so that the irradiation surface 401 can cover the entire supporting surface 10.
  • the area of the formed irradiation surface 401 should also be larger than the area of the support surface 10.
  • the corner of the irradiation source 40 with respect to the square support surface 10 is set as long as the irradiation surface 401 formed by the plurality of irradiation sources 40 can cover the support surface 10.
  • the edge exposure machine 100 provided in the embodiment of the present application includes a supporting surface 10, and first and second side walls 20 and 30 disposed oppositely on both sides of the supporting surface 10, wherein the first side wall 20
  • the first surface 201 and the second surface 301 of the second side wall 30 are provided with a plurality of irradiation sources 40 for irradiating the support surface 10 when the substrate 200 is exposed to eliminate The static electricity generated when the substrate 200 contacts the support surface 10.
  • the edge exposure machine 100 provided by the embodiment of the present application irradiates the support surface 10 formed by the support pins 50 by covering multiple irradiation sources 40 on the side walls to eliminate static electricity generated by the substrate 200 placed on the support surface 10 during subsequent processing .
  • An embodiment of the present application also provides an exposure method, including:
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall opposite to each other on the support surface;
  • the support surfaces are irradiated by the plurality of irradiation sources to eliminate static electricity generated by the contact between the substrate and the support surface.
  • the edge exposure machine provided by the embodiment of the present application irradiates the support surface with multiple irradiation sources on the side walls to eliminate static electricity generated by the substrate placed on the support surface during subsequent processing.
  • An embodiment of the present application also provides an exposure method, which includes:
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall opposite to each other on the support surface;
  • the support surfaces are irradiated by the plurality of irradiation sources to eliminate static electricity generated by the contact between the substrate and the support surface.
  • the support surface is composed of a plurality of support pins, and the top connection lines of the plurality of support pins form the support surface, and the plurality of support pins are used to reduce the support surface and the substrate when exposing the substrate Contact area.
  • the light emitted by the plurality of irradiation sources forms an irradiation surface
  • the irradiation of the support surface by the plurality of irradiation sources when exposing the substrate includes:
  • the support surface is irradiated by the irradiation.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • An embodiment of the present application further provides an edge exposure machine, which includes:
  • a supporting surface and a first side wall and a second side wall opposite to each other on the supporting surface, wherein,
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall, the plurality of irradiation sources are used to irradiate the support surface when exposing the substrate to eliminate The static electricity generated by the contact between the substrate and the support surface, wherein the support surface is composed of a plurality of support pins, the top lines of the plurality of support pins form the support surface, and the plurality of support pins are used When the substrate is exposed, the contact area between the supporting surface and the substrate is reduced, and openings are provided on the third side wall and the fourth side wall perpendicular to the first side wall.
  • the plurality of irradiation sources on the first side wall and the second side wall are at the same vertical height as the tops of the plurality of support pins.
  • the support surface is a square support surface, and the plurality of irradiation sources are disposed at corners of the square support surface.
  • the light irradiated from the plurality of irradiation sources forms an irradiation surface, and the irradiation surface is used to irradiate the support surface when exposing the substrate.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • the support surface is composed of a plurality of support pins, the top connection lines of the plurality of support pins form the support surface, and the plurality of support pins are used to reduce the support surface when exposing the substrate Contact area with the substrate.
  • the light irradiated by the plurality of irradiation sources forms an irradiation surface
  • the irradiating the support surface by the plurality of irradiation sources when exposing the substrate includes:
  • the support surface is irradiated by the irradiation.
  • the irradiation area of the irradiation surface is larger than the area of the support surface, so that the light emitted by the plurality of irradiation sources can cover the support surface when the substrate is exposed.
  • the exposure method provided in the embodiment of the present application is applied to an edge exposure machine.
  • the edge exposure machine includes a support surface, and first and second side walls that are oppositely disposed on both sides of the support surface.
  • a plurality of irradiation sources are provided on the first surface of the first side wall and the second surface of the second side wall, the plurality of irradiation sources are used to irradiate the support surface when exposing the substrate to eliminate the Static electricity generated when the substrate contacts the support surface.
  • the edge exposure machine provided by the embodiment of the present application irradiates the support surface formed by the support pins with a plurality of irradiation sources on the side walls to cover the irradiation, so as to eliminate static electricity generated by the substrate placed on the support surface during subsequent processing.

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Abstract

一种曝边机及曝光方法，包括：支撑面（10），以及在支撑面两侧相对设置的第一侧壁（20）以及第二侧壁（30），在第一侧壁的第一表面（201）以及第二侧壁的第二表面（301）上设置有多个照射源（40），多个照射源用于在曝光基板（200）时对支撑面进行照射，以消除基板与支撑面接触而产生的静电。

Description

曝边机及曝光方法 技术领域
本申请涉及显示技术领域，具体涉及一种曝边机及曝光方法。
 背景技术
近年来，中小尺寸液晶显示器发展迅猛，制备过程中在使用到精密光学仪器曝光机的基础上，还需要使用到曝边机，对基板长短边进行洗边，取出金属等边缘导电物质。
现有技术中，传统的曝边机易出现静电放电（electro static discharge，ESD）炸伤，导致产品在固定点位出现群亮暗点，目前为了解决机台内ESD炸伤，在曝边机出口连接去离子棒，但是效果不佳。
因此，现有技术存在缺陷，急需改进。
 技术问题
本申请实施例提供一种曝边机及曝光方法，可以消除在曝边机内部曝光过程中基板与曝光机接触产生的静电。
 技术解决方案
第一方面，本申请实施例提供一种曝边机，包括：
支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，
在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电。
在本申请所述的曝边机中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
在本申请所述的曝边机中，所述第一侧壁以及所述第二侧壁上的所述多个照射源与所述多个支撑针的顶部处于同一竖直高度。
在本申请所述的曝边机中，所述支撑面为方形的支撑面，所述多个照射源相对于所述方形的支撑面的拐角设置。
在本申请所述的曝边机中，所述多个照射源照射出的光线形成一照射面，所述照射面用于在曝光基板时对所述支撑面进行照射。
在本申请所述的曝边机中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
第二方面，本申请实施例还提供一种曝光方法，包括：
在支撑面两侧相对设置的第一侧壁的第一表面以及第二侧壁的第二表面上设置多个照射源；
在曝光基板时通过所述多个照射源对所述支撑面进行照射，以消除所述基板与所述支撑面接触产生的静电。
在本申请所述的曝光方法中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
在本申请所述的曝光方法中，所述多个照射源照射出的光线形成一照射面，所述在曝光基板时通过所述多个照射源对所述支撑面进行照射，包括：
在曝光基板时通过所述照射面对所述支撑面进行照射。
在本申请所述的曝光方法中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
第三方面，本申请实施例还提供一种曝边机，包括：
支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，
在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电，其中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积，垂直所述第一侧壁的第三侧壁及第四侧壁上设置有开口处。
在本申请所述的曝边机中，所述第一侧壁以及所述第二侧壁上的所述多个照射源与所述多个支撑针的顶部处于同一竖直高度。
在本申请所述的曝边机中，所述支撑面为方形的支撑面，所述多个照射源相对于所述方形的支撑面的拐角设置。
在本申请所述的曝边机中，所述多个照射源照射出的光线形成一照射面，所述照射面用于在曝光基板时对所述支撑面进行照射。
在本申请所述的曝边机中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
 有益效果
本申请实施例提供的曝边机包括，支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电。本申请实施例提供的曝边机通过在侧壁设置多个照射源对支撑面进行覆盖式照射，以消除后续加工时基板放置在支撑面上产生的静电。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的曝边机的结构示意图。
图2为本申请实施例提供的曝光过程中基板与支撑针接触的示意图。
图3为本申请实施例提供的曝边机的另一结构示意图。
图4为本申请实施例提供的曝边机内部光线照射示意图。
图5为本申请实施例提供的曝边机内部光线照射的另一示意图。
 本发明的实施方式
近年来，中小尺寸液晶显示器发展迅猛，制备过程中在使用到精密光学仪器曝光机的基础上，还需要使用到曝边机，但是传统的曝边机易出现静电放电（electro static discharge，ESD）炸伤，导致产品在固定点位出现群亮暗点，目前为解决机台内ESD问题，在曝边机出口连接去离子棒，但是无法解决基板在进入机台后导致的ESD炸伤。因而，本申请实施例提供一种曝边机及曝光方法，可以消除在曝边机内部曝光过程中基板与曝光机接触产生的静电。
本申请实施例提供一种曝边机，其包括：
支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，
在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电。
其中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
其中，所述第一侧壁以及所述第二侧壁上的所述多个照射源与所述多个支撑针的顶部处于同一竖直高度。
其中，所述支撑面为方形的支撑面，所述多个照射源相对于所述方形的支撑面的拐角设置。
其中，所述多个照射源照射出的光线形成一照射面，所述照射面用于在曝光基板时对所述支撑面进行照射。
其中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
其中，垂直所述第一侧壁的第三侧壁及第四侧壁上设置有开口处。
请参阅图1，图1为本申请实施例提供的曝边机的结构示意图。
本申请实施例提供一种曝边机100，包括：
支撑面10，以及在所述支撑面10两侧相对设置的第一侧壁20以及第二侧壁30，其中，
在所述第一侧壁20的第一表面201以及第二侧壁30的第二表面301上设置有多个照射源40，所述多个照射源40用于在曝光基板200时对所述支撑面10进行照射，以消除所述基板200与所述支撑面10接触而产生的静电。
具体的，曝光机100可以为图1所示的长方体，但不仅限于长方体，第一侧壁20以及第二侧壁30为该长方体的两个相对面。支撑面10垂直于该第一侧壁20以及第二侧壁30。在该第一侧壁20的第一表面201以及该第二侧壁30的第二表面301上设置有多个照射源40，其中，第一表面201以及第二表面301为朝向长方体中心的表面。照射源40可以为射出X光线（X-ray）或者其他可以消除静电光线的照射器，在此不做赘述。
其中，在所述曝边机100中垂直所述第一侧壁20的第三侧壁60及第四侧壁70上设置有开口处，以用于在实际生产中可通过所述开口处进行基板200的运放工作。
其中，在所述开口处设置有离子棒，所述离子棒用于清除所述基板200的静电。
本申请实施例提供的曝边机100包括，支撑面10，以及在所述支撑面10两侧相对设置的第一侧壁20以及第二侧壁30，其中，在所述第一侧壁20的第一表面201以及第二侧壁30的第二表面301上设置有多个照射源40，所述多个照射源40用于在曝光基板200时对所述支撑面10进行照射，以消除所述基板200与所述支撑面10接触而产生的静电。本申请实施例提供的曝边机100通过在侧壁设置多个照射源40对支撑面10进行覆盖式照射，以消除后续加工时基板200放置在支撑面10上产生的静电。
在一些实施例中，请参阅图1、图2及图3，图2为本申请实施例提供的曝光过程中基板与支撑针接触的示意图，图3为本申请实施例提供的曝边机的另一结构示意图。所述支撑10面由多个支撑针50组成，所述多个支撑针50的顶部501连线形成所述支撑面10，所述多个支撑针50用于在曝光基板200时减少所述支撑面10与所述基板200的接触面积。
在一些实施例中，所述第一侧壁20以及所述第二侧壁30上的所述多个照射源40与所述多个支撑针50的顶部501处于同一竖直高度。
具体的，支撑面10是由多个支撑针50形成的一假想面，该支撑面10是由多个支撑针50的顶部501连线形成的一个可以承载基板200的假想面，每一支撑针50的顶部501的高度处于同一竖直高度，以使得形成的假想面可以稳定的承载基板200。在曝光基板200时，基板200与曝边机100的接触面积为基板200与多个支撑针50的接触面积，可以有效的减少支撑面10与基板200的接触面积。
并且，为了消除基板200与支撑针50的顶部501接触时产生静电的现象，照射源40的设置高度应与该支撑针50的顶部501处于同一竖直高度。以使照射源40发出的光线可以照射到顶部501，从而在基板200与顶部501接触时不会产生静电。
请参阅图4以及图5，图4为本申请实施例提供的曝边机内部光线照射示意图，图5为本申请实施例提供的曝边机内部光线照射的另一示意图。在一些实施例中，所述支撑面10为方形的支撑面10，所述多个照射源40相对于所述方形的支撑面10的拐角设置。
在一些实施例中，所述多个照射源40照射出的光线形成一照射面401，所述照射面401用于在曝光基板200时对所述支撑面10进行照射。
在一些实施例中，所述照射面401的照射面积大于所述支撑面10的面积，以使在曝光基板200时所述多个照射源40照射出的光线可以覆盖所述支撑面10。
具体的，由多个支撑针50形成的支撑面10由支撑针50的摆放位置确定，如正方形。长方形，圆形等。这里不作限定。以支撑面10为方形的支撑面10为例，在曝边机100侧壁设置的多个照射源为了照射支撑面10，应照射到所有的支撑针50的顶部501。因此该多个照射源40需形成一照射面401，以使照射面401可以覆盖整个支撑面10。并且因为多个照射源40设置在曝边机100的侧壁上，因此，形成的照射面401的面积也应大于支撑面10的面积。这里照射源40相对于方形的支撑面10的拐角设定，只要保证多个照射源40形成的照射面401可以覆盖支撑面10即可。
本申请实施例提供的曝边机100包括，支撑面10，以及在所述支撑面10两侧相对设置的第一侧壁20以及第二侧壁30，其中，在所述第一侧壁20的第一表面201以及第二侧壁30的第二表面301上设置有多个照射源40，所述多个照射源40用于在曝光基板200时对所述支撑面10进行照射，以消除所述基板200与所述支撑面10接触而产生的静电。本申请实施例提供的曝边机100通过在侧壁设置多个照射源40对支撑针50形成的支撑面10进行覆盖式照射，以消除后续加工时基板200放置在支撑面10上产生的静电。
为了进一步描述本申请，下面从曝光方法的方向进行描述。
本申请实施例还提供一种曝光方法，包括：
在支撑面两侧相对设置的第一侧壁的第一表面以及第二侧壁的第二表面上设置多个照射源；
在曝光基板时通过所述多个照射源对所述支撑面进行照射，以消除所述基板与所述支撑面接触产生的静电。
本申请实施例提供的曝边机通过在侧壁设置多个照射源对支撑面进行覆盖式照射，以消除后续加工时基板放置在支撑面上产生的静电。
本申请实施例还提供一种曝光方法，其包括：
在支撑面两侧相对设置的第一侧壁的第一表面以及第二侧壁的第二表面上设置多个照射源；
在曝光基板时通过所述多个照射源对所述支撑面进行照射，以消除所述基板与所述支撑面接触产生的静电。
其中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
其中，所述多个照射源照射出的光线形成一照射面，所述在曝光基板时通过所述多个照射源对所述支撑面进行照射，包括：
在曝光基板时通过所述照射面对所述支撑面进行照射。
其中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
本申请实施例还提供一种曝边机，其包括：
支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，
在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电，其中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积，垂直所述第一侧壁的第三侧壁及第四侧壁上设置有开口处。
其中，所述第一侧壁以及所述第二侧壁上的所述多个照射源与所述多个支撑针的顶部处于同一竖直高度。
其中，所述支撑面为方形的支撑面，所述多个照射源相对于所述方形的支撑面的拐角设置。
其中，所述多个照射源照射出的光线形成一照射面，所述照射面用于在曝光基板时对所述支撑面进行照射。
其中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
在一些实施例中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
在一些实施例中，所述多个照射源照射出的光线形成一照射面，所述在曝光基板时通过所述多个照射源对所述支撑面进行照射，包括：
在曝光基板时通过所述照射面对所述支撑面进行照射。
在一些实施例中，所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
本申请实施例提供的曝光方法，应用于曝边机中，该曝边机包括，支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电。本申请实施例提供的曝边机通过在侧壁设置多个照射源对支撑针形成的支撑面进行覆盖式照射，以消除后续加工时基板放置在支撑面上产生的静电。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (16)

  1. 一种曝边机，其包括：
    支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，
    在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电。
  2. 如权利要求1 所述的曝边机，其中所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
  3. 如权利要求2所述的曝边机，其中所述第一侧壁以及所述第二侧壁上的所述多个照射源与所述多个支撑针的顶部处于同一竖直高度。
  4. 如权利要求2所述的曝边机，其中所述支撑面为方形的支撑面，所述多个照射源相对于所述方形的支撑面的拐角设置。
  5. 如权利要求1所述的曝边机，其中所述多个照射源照射出的光线形成一照射面，所述照射面用于在曝光基板时对所述支撑面进行照射。
  6. 如权利要求5所述的曝边机，其中所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
  7. 如权利要求1所述的曝边机，其中垂直所述第一侧壁的第三侧壁及第四侧壁上设置有开口处。
  8. 一种曝光方法，其包括：
    在支撑面两侧相对设置的第一侧壁的第一表面以及第二侧壁的第二表面上设置多个照射源；
    在曝光基板时通过所述多个照射源对所述支撑面进行照射，以消除所述基板与所述支撑面接触产生的静电。
  9. 如权利要求8所述的曝光方法，其中所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积。
  10. 如权利要求8所述的曝光方法，其中所述多个照射源照射出的光线形成一照射面，所述在曝光基板时通过所述多个照射源对所述支撑面进行照射，包括：
    在曝光基板时通过所述照射面对所述支撑面进行照射。
  11. 如权利要求10所述的曝光方法，其中所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
  12. 一种曝边机，其包括：
    支撑面，以及在所述支撑面两侧相对设置的第一侧壁以及第二侧壁，其中，
    在所述第一侧壁的第一表面以及第二侧壁的第二表面上设置有多个照射源，所述多个照射源用于在曝光基板时对所述支撑面进行照射，以消除所述基板与所述支撑面接触而产生的静电，其中，所述支撑面由多个支撑针组成，所述多个支撑针的顶部连线形成所述支撑面，所述多个支撑针用于在曝光基板时减少所述支撑面与所述基板的接触面积，垂直所述第一侧壁的第三侧壁及第四侧壁上设置有开口处。
  13. 如权利要求12所述的曝边机，其中所述第一侧壁以及所述第二侧壁上的所述多个照射源与所述多个支撑针的顶部处于同一竖直高度。
  14. 如权利要求12所述的曝边机，其中所述支撑面为方形的支撑面，所述多个照射源相对于所述方形的支撑面的拐角设置。
  15. 如权利要求12所述的曝边机，其中所述多个照射源照射出的光线形成一照射面，所述照射面用于在曝光基板时对所述支撑面进行照射。
  16. 如权利要求15所述的曝边机，其中所述照射面的照射面积大于所述支撑面的面积，以使在曝光基板时所述多个照射源照射出的光线可以覆盖所述支撑面。
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