WO2020087755A1 - 发声装置和耳机 - Google Patents

发声装置和耳机 Download PDF

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Publication number
WO2020087755A1
WO2020087755A1 PCT/CN2018/125705 CN2018125705W WO2020087755A1 WO 2020087755 A1 WO2020087755 A1 WO 2020087755A1 CN 2018125705 W CN2018125705 W CN 2018125705W WO 2020087755 A1 WO2020087755 A1 WO 2020087755A1
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WO
WIPO (PCT)
Prior art keywords
yoke
generating device
sound generating
bearing frame
circuit system
Prior art date
Application number
PCT/CN2018/125705
Other languages
English (en)
French (fr)
Inventor
郭晓冬
王莹
刘春发
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2020087755A1 publication Critical patent/WO2020087755A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the invention belongs to the technical field of electroacoustic transduction, and in particular, relates to a sound emitting device.
  • the sound-generating device is an important electroacoustic transduction component in consumer electronic products, and it is widely used as a speaker, an earpiece, an earphone, and the like. As the performance of electronic products improves, the improvement of the acoustic performance of sound-generating devices is also an inevitable trend. In order to meet better acoustic performance, the sound-generating device often needs to be equipped with a magnetic circuit system with larger volume and stronger electromagnetic driving force. However, taking a sound-emitting device applied to an electronic product such as an earphone as an example, the outer periphery of the magnetic circuit system is provided with a plastic material housing that provides a bearing and a fixed connection. As a result, a larger magnetic circuit system cannot be designed when the product volume is limited.
  • An object of the present invention is to provide a new technical solution for a sounding device.
  • a sound emitting device including:
  • a magnetic circuit system the magnetic circuit system includes a yoke, and a plurality of flanges extending toward the periphery of the yoke are formed at the top edge of the yoke;
  • a bearing frame a hollow is formed in the center of the bearing frame, and a positioning portion is formed on the lower end surface of the bearing frame;
  • the yoke is positioned at the hollow from the side of the lower end surface of the bearing frame, and the flange extends horizontally below the bearing frame and is fixedly connected to the positioning portion.
  • the positioning portion includes a positioning groove formed on a lower end surface of the bearing frame, the positioning groove extends to the hollow, and the flange is embedded in the positioning groove.
  • the bearing frame is a plastic material
  • the positioning portion includes a hot-melt structure formed on the lower end surface of the bearing frame
  • the hot melt structure is fixedly connected to the flange by hot melt.
  • the positioning portion further includes a positioning groove formed on the lower end surface of the carrying frame, the positioning groove extends to the hollow, and the hot-melt structure is located in the positioning groove, The flange is embedded in the positioning groove;
  • the shape of the cutout matches the shape of the yoke, the upper end of the yoke is embedded in the cutout, and the depth of the yoke embedded in the cutout is equivalent to the depth of the positioning groove.
  • the hot-melt structure is located at an edge of the positioning groove away from the hollow.
  • the depth of the positioning groove is less than or equal to half the thickness of the bearing frame, and the thickness of the flange is less than or equal to the depth of the positioning groove.
  • an inwardly recessed notch is formed at the end of the flange, and the hot-melt structure is a hot-melt column integrally injection-molded with the bearing frame, and the hot-melt column is located in the notch.
  • the flange is fixed on the carrying frame by hot-melting the hot-melt column.
  • the gap is an arc-shaped gap
  • the side of the hot-melt column facing the gap is an arc-shaped surface
  • At least two of the flanges are formed on the yoke, and each of the flanges is distributed in a rotationally symmetric or center symmetrical manner with respect to the center of the yoke, and each of the bearing frames corresponds to each The flange is formed with the hot-melt structure.
  • four flanges are formed on the yoke, and two adjacent flanges are 90 degrees rotationally symmetric with respect to the center of the yoke.
  • the hollow is in the shape of a circular hole
  • the hollow is in the shape of a circular hole
  • the magnetic yoke is in the shape of a cylindrical tube including a bottom wall and a circular side wall.
  • the top surface of the flange is flush with the top surface of the side wall.
  • the yoke and the flange are integrally stamped and formed.
  • the magnetic circuit system further includes a central magnetic portion, the central magnetic portion is disposed in the yoke, the central magnetic portion includes stacked magnets and a magnetic conductive plate, the central magnetic portion and all A magnetic gap is formed between the side walls of the yoke;
  • the sound generating device further includes a vibrating component, the vibrating component includes a diaphragm and a voice coil, the voice coil is connected to one side of the diaphragm, the edge of the diaphragm is fixedly connected to the upper end surface of the carrying frame , The voice coil extends into the magnetic gap.
  • it further includes a conductive column, a through hole is formed in the center of the magnetic circuit system, the conductive column is inserted into the through hole from the bottom of the yoke and passes through the magnetic circuit system, the conductive column Two first electrical connection points are formed on the top of the electrode, and two second electrical connection points are formed on the bottom end of the conductive post, and the two second electrical connection points form an electrical connection with the two first electrical connection points, respectively connection;
  • the voice coil surrounds and surrounds the conductive column, and a lead wire is drawn out from the inner side of the voice coil, and the lead wire is connected to the first electrical connection point.
  • the conductive pillar includes a plastic body portion with an inverted T-shaped longitudinal section.
  • the plastic body portion includes a core pillar and a support portion connected to the bottom of the core pillar.
  • the core pillar passes through the magnetic circuit system. Through holes, the support portion covers the bottom surface of the magnetic circuit system;
  • the conductive post further includes two metal parts injection-molded into the plastic body part, the metal part includes a parallel first end and a second end, and a middle connecting the first end and the second end The first end is exposed at the top surface of the stem to form a first electrical connection point, and the second end is exposed at the bottom surface of the support portion to form a second electrical connection point.
  • the upper end surface of the conductive column is lower than the upper end surface of the voice coil
  • the distance between the upper end surface of the conductive column and the upper end surface of the voice coil is a first distance L1
  • the magnetic circuit The distance between the upper end face of the central magnetic part of the system and the upper end face of the voice coil is a second distance L2, the first distance L1 is greater than or equal to 0, and the first distance L1 is less than or equal to a second distance of 0.3 times L2.
  • the diameter of the outer periphery of the magnetic circuit system is the first diameter D1
  • the diameter of the portion of the conductive post located in the through hole is the second diameter D2
  • the second diameter D2 is less than or equal to 0.32 Diameter D1.
  • the diameter of the outer periphery of the magnetic circuit system is the first diameter D1
  • the diameter of the outer periphery of the sound emitting device is the third diameter D3
  • the ratio of the first diameter D1 to the third diameter D3 is greater than or equal to 0.65.
  • Another aspect of the present invention also provides an earphone, in which the above sound emitting device is provided.
  • the yoke of the magnetic circuit system is exposed, and the bearing frame does not form a surrounding assembly relationship with the yoke, saving space.
  • FIG. 1 is an exploded schematic view of some components of a sound-emitting device provided by the present invention
  • FIG. 2 is an axonometric view of a sound-generating device provided by the present invention.
  • FIG. 3 is a side cross-sectional view of the sound-generating device provided by the present invention.
  • FIG. 5 is a bottom view of the sound emitting device provided by the present invention.
  • the present invention provides a sound generating device.
  • the sound generating device includes at least a magnetic circuit system and a bearing frame 2.
  • the magnetic circuit system is used to provide electromagnetic driving force for the vibration of the sound generating device.
  • the bearing frame 2 is used to provide support and positioning for the magnetic circuit system and other components of the sound-generating device, so that each component is fixedly connected into an integrated device.
  • the magnetic circuit system includes a yoke 11 having a side wall and a bottom wall, and the yoke 11 encloses to form an accommodation space capable of carrying other components.
  • a side wall of the yoke 11 extends upward by a certain height.
  • a plurality of flanges 111 extending toward the outside of the yoke 11 are formed.
  • the flange 111 extends from the top of the side wall to the periphery of the side wall.
  • the flange 111 is used to form a fixed connection with the bearing frame 2.
  • the yoke 11 and the flange 111 are integrally formed by stamping.
  • the one-piece stamping structure has high reliability and is easier to assemble.
  • the bearing frame 2 has a ring structure, a hollow 22 is formed in the center, and a positioning portion is formed on the lower end surface 21 of the bearing frame 2.
  • the area of the central hollow 22 of the bearing frame 2 is used to place other components of the sound-emitting device.
  • the yoke 11 is disposed at the hollow 22 from one side of the lower end surface 21 of the carrying frame 2.
  • the flange 111 extends horizontally to the lower side of the bearing frame 2 corresponding to the position of the positioning portion, and the two form a fixed connection, so that the magnetic circuit system and the bearing frame are fixedly connected.
  • the flange 111 is provided with intermittent pieces, which can form a positioning on the XY plane with the positioning portion of the bottom surface of the carrier frame 2 such as a groove structure, etc., to prevent the yoke 11 from rotating relative to the carrier frame 2, and by adjusting the two Positioning in the Z direction by bonding, welding, hot-melt fixation, etc. to avoid axial displacement of the yoke 11 relative to the carrier frame 2 and finally achieve a secure assembly between the yoke 11 and the carrier frame 2.
  • the present invention designs the bearing frame 2 as a ring structure, eliminating its side walls and bottom wall used to surround the magnetic circuit system. It can be seen that the side wall and the bottom wall of the yoke 11 can be directly exposed. Through this design, the omitted structure of the bearing frame makes it reduce the occupied space. The saved space can be occupied by the yoke and the entire magnetic circuit system, thereby configuring a magnetic circuit system with a larger volume and a stronger magnetic field.
  • the present invention adopts the way that the flange is connected with the fixing part.
  • the flange is designed on the top of the yoke, and the fixing portion is provided on the lower end surface of the carrying frame.
  • the yoke only has a close connection to the bottom of the bearing frame in the area near the top, which greatly reduces the part where the two overlap and surround each other, thereby reducing the space occupied by the overlap of the two and improving This improves the space utilization rate of the sound-generating device and makes it easier to configure the sound-generating device with a larger magnetic circuit system.
  • the positioning portion includes a positioning groove 212 formed on the lower end surface 21 of the carrying frame 2, and the positioning groove 212 is formed from the lower end surface of the carrying frame 2 21 is recessed upward by a distance. Moreover, the positioning groove extends along the surface of the lower end surface 21 and extends to the hollow 22. That is, as shown in FIGS. 1 and 2, it extends to the edge of the hollow 22.
  • the flange 111 is embedded in the positioning groove 212.
  • the positioning groove By configuring the positioning groove, the positioning accuracy between the bearing frame 2 and the yoke can be improved.
  • the carrier frame is made of plastic material
  • the positioning portion includes a hot-melt structure 211 formed on the lower end surface 21 of the carrier frame 2.
  • the flange 111 is at a position corresponding to the hot-melt structure 211, and the flange 111 may be in contact with the hot-melt structure 211.
  • the hot-melt structure 211 undergoes hot-melt treatment, and the hot-melt structure covers the flange 111 to form a fixed connection with the flange 111.
  • the flange and the hot-melt structure realize a reliable fixed connection by means of hot-melt connection to ensure the structural reliability of the sound-emitting device.
  • the bearing frame is made of plastic material
  • the positioning part may include the hot-melt structure 211 and the positioning groove 212 as shown in FIGS. 1 and 2.
  • the hot-melt structure 211 is located in the positioning groove 212
  • the flange 111 is embedded in the positioning groove 212 and fixedly connected to the hot-melt structure 211 in the positioning groove 212.
  • the cooperation between the positioning groove 212 and the flange 111 can improve the positioning accuracy of the bearing frame 2 and the magnetic circuit system.
  • the hot-melt structure 211 when the hot-melt structure 211 is hot-melted, the hot-melt structure 211 can flow into the positioning groove 212 and be wrapped around the flange 111, thereby improving the carrying frame 2 and the yoke The reliability of the fixed connection between. Further, by containing the hot melt structure in the positioning groove, at least a part of the hot melt structure can be prevented from flowing to a position away from the flange after being melted, and defects such as appearance defects of the product caused by the hot melt structure flowing can be prevented.
  • the flange 111 itself is flush with the top of the side wall of the yoke 11 or slightly lower than the top of the side wall of the yoke 11, the top of the side wall of the yoke 11 will be embedded in The 22 hollows are shown in Figures 3 and 4. In this embodiment, both the positioning accuracy and the sealing performance between the yoke 11 and the carrier frame 2 can be improved.
  • the flange is matched with the lower end surface of the load-bearing frame, and the structure on the load-bearing frame that encloses the yoke is eliminated, even if the top of the side wall of the yoke faces the hollow Embedding a short distance will not cause too much overlap between the bearing frame and the yoke and take up too much space. In the design of the present invention, there is still enough space for increasing the volume of the magnetic circuit system.
  • the flange itself is flush with the top of the side wall of the yoke, and the depth of the yoke embedded in the hollow corresponds to the depth of the positioning groove.
  • the hot-melt structure 211 is located at a side edge of the positioning groove 212 away from the hollow 22.
  • the hot-melt structure 211 may be directly attached to the above-mentioned edge, or may be in a form close to the side edge, with a short distance from the side edge.
  • this design method can more easily make the flange completely embedded in the positioning groove, on the other hand, it can make the hot-melt structure smoothly move closer to the positioning groove along the positioning groove after melting
  • the hollowed-out area extends so as to cover and wrap the entire flange.
  • the depth of the positioning groove is less than or equal to one-half the thickness of the bearing frame 2, as shown in FIG. 3. If the depth of the positioning groove 212 is too deep, the structural strength of the bearing frame 2 here will be reduced.
  • the above-mentioned limited range of the depth of the positioning groove of the present invention is a preferred range, and within this range, the positioning groove generally does not cause damage to the structural strength of the bearing frame. The present invention does not strictly limit this. In practical applications, the depth of the positioning groove can also be designed according to the actual structural strength of the bearing frame and the actual thickness of the flange.
  • the thickness of the flange 111 is less than or equal to the depth of the positioning groove 212, as shown in FIG. 4.
  • the matching relationship between the thickness of the flange 111 and the depth of the positioning groove 212 will affect the connection strength between the bearing frame 2 and the yoke 11.
  • the lower surface of the flange can sink into the groove or be flush with the lower end surface of the bearing frame. This design is more convenient for the hot melt structure to cover the flange after melting So that the flange is buried in the positioning groove to improve connection reliability.
  • the invention does not limit that the thickness of the flange must be less than or equal to the depth of the positioning groove.
  • the end of the flange 111 is formed with a notch 1111 recessed inward, and the hot-melt structure 211 may be a hot-melt formed integrally with the carrier frame 2 by injection molding column. After the yoke 11 and the bearing frame 2 are assembled together, the post of the hot-melt structure 211 is located in the notch 1111. The flange 111 is fixed on the carrying frame 2 by hot-melting the hot-melt column.
  • the positioning accuracy between the flange and the hot-melt structure can be improved, thereby improving the positioning accuracy between the yoke and the load-bearing frame; the reliability of the fusion connection between the hot-melt structure and the flange can also be improved.
  • the gap 1111 is an arc-shaped gap, as shown in FIG. 1.
  • the surface of the hot melt column facing the notch 1111 is an arc-shaped surface.
  • the hot melt column may have a cylindrical or elliptical cylindrical structure.
  • the shape of the notch 1111 and the hot-melt structure 211 match each other. As shown in FIG. 5, the above shape matching design method can achieve better positioning and fixed connection effects.
  • At least two flanges are formed on the yoke, and each flange is distributed on the top end of the side wall of the yoke in a rotationally symmetric or center symmetrical manner with respect to the center of the yoke.
  • one hot melt structure is formed on the carrying frame corresponding to each flange to facilitate the flange to form a hot melt connection.
  • four yokes 111 are formed on the yoke 11, and four hot-melt structures 211 and positioning grooves 212 are also formed on the carrier frame 2.
  • the four flanges 111 are rotationally symmetric with respect to the center of the yoke 11 with a pitch of 90 degrees.
  • the four flanges 111 are evenly distributed around the yoke 11, which can effectively improve the stability of the fixed connection.
  • three other distribution modes and numbers, such as 120 degrees apart, may also be used to meet performance requirements, and the present invention does not limit this.
  • the hollow 22 has a circular hole shape
  • the yoke 11 has a cylindrical cylindrical structure.
  • the yoke includes a circular bottom wall and a circular side wall.
  • the outer shapes of the two are matched with each other to improve the degree of structural matching between the yoke 11 and the bearing frame 2.
  • the hollow and yoke may also have an elliptical structure, which is not limited by the present invention.
  • the top surface of the flange 111 is flush with the top surface of the side wall of the yoke 11, as shown in FIG. 4. This design can reduce the surrounding range of the support frame in the height direction of the yoke, and the structure design of the yoke is simple and the positioning is more convenient.
  • the magnetic circuit system may further include a central magnetic portion 12, as shown in FIGS. 3 and 4.
  • the central magnetic portion 12 is provided in a space surrounded by the yoke 11.
  • the central magnetic portion 12 includes stacked magnets and a magnetic conductive plate. A certain gap is left between the central magnetic portion 12 and the side wall of the yoke 11, and this gap is a magnetic gap 100 that can generate a magnetic field, and is used to drive the vibration component of the sound generating device to vibrate.
  • the sound generating device further includes the above-mentioned vibration assembly, and the vibration assembly includes at least two components of a diaphragm and a voice coil.
  • the voice coil is connected to one side surface of the diaphragm, the voice coil is used to receive sound signals to generate vibration, and the diaphragm is vibrated by the voice coil to generate sound.
  • the edge of the diaphragm is fixedly connected to the upper end surface 23 of the carrying frame, and the voice coil is suspended in the magnetic gap through the diaphragm.
  • the sound-emitting device may further include a conductive post 3, in which a circuit for conducting a sound signal is formed.
  • a through hole is formed in the center of the magnetic circuit system, and the conductive post 3 is inserted into the through hole from the bottom of the yoke 11 and passes through the magnetic circuit system to extend to the Above, as shown in Figures 3 and 4.
  • the voice coil surrounds the conductive post 3, and two leads for conducting signals are drawn out from the voice coil.
  • two first electrical connection points are formed on the top of the conductive post 3, and the two lead wires extend from the voice coil to the central conductive post 3, and are respectively connected to the two first electrical Connection point.
  • the lead wire receives an externally input sound signal through the conductive column 3.
  • the space occupied by the voice coil and the lead wire can be reduced, and the vibration stability of the voice coil can be improved from the inside of the voice coil, and the possibility of polarization of the voice coil can be reduced.
  • providing a conductive column in the middle of the magnetic circuit system not only does not affect the performance of the magnetic circuit system, but also makes full use of the larger space occupied by the magnetic circuit system.
  • the bottom end of the conductive pillar 3 may be formed with two second electrical connection points.
  • the two second electrical connection points are configured to form an electrical connection with an external device to introduce a sound signal from the external electronic device into the sound emitting device.
  • the two second electrical connection points form electrical connections with the two first electrical connection points, respectively.
  • the sound-generating device provided by the present invention needs to be assembled into other electronic equipment, such as mobile phones, earphones, small speakers and other equipment. Therefore, the sound-generating device usually needs to receive the sound signal from other equipment and then convert the sound signal into sound.
  • the sound signal on the external device can be introduced into the conductive column. Since the two second electrical connection points are electrically connected to the two first electrical connection points, respectively, the sound signal can be transmitted to the lead via the second electrical connection point and the first electrical connection point.
  • Another advantage of this embodiment is that the second electrical connection point is formed at the bottom end of the conductive post, and the through hole penetrates the magnetic circuit system, so when the second electrical connection point is electrically connected to an external device, It is convenient to arrange the electrical connection piece from the bottom of the magnetic circuit system, and then connect with the second electrical connection point.
  • This design method is convenient for electrical connection, and is more compatible with the way the sound-emitting device is assembled to external equipment.
  • the present invention provides a specific embodiment.
  • the conductive pillar includes a plastic body portion.
  • the plastic body portion serves as the main structure of the conductive pillar, and the side of the conductive pillar has an inverted T-shaped structure.
  • the plastic body portion includes a core post and a support portion connected to the bottom of the core post. The core post passes through the through hole of the magnetic circuit system, and the support portion covers the bottom surface of the magnetic circuit system.
  • the conductive post further includes two metal parts, and the two metal parts are injection-molded and fixed in the plastic body part.
  • the metal piece has a first end, a second end and an intermediate portion. The first end and the second end on the same metal piece may be in a relatively parallel posture, and the middle portion is connected between the first end and the second end.
  • the first end is used to form the first electrical connection point, and the second end is used to form the second electrical connection point.
  • the first end may be exposed from the top surface of the stem, and the second end may be exposed from the bottom surface of the support portion.
  • This configuration is convenient for the leads and external devices to realize signal conduction through the metal parts.
  • the middle part of the metal part is injection-molded inside the plastic body part, and it is not easy to interfere with other conductive and magnetically conductive parts in the sound emitting device.
  • the distance between the upper end surface of the conductive column and the upper end surface of the voice coil is a first distance L1
  • the distance between the upper end surface of the central magnetic portion of the magnetic circuit system and the upper end surface of the voice coil is a second distance L2.
  • the first distance L1 refers to the vertical distance between the upper end surface of the conductive column and the upper end surface of the voice coil along the axial direction of the conductive column.
  • the second distance L2 refers to the vertical distance of the central magnetic portion of the magnetic circuit system from the upper end surface of the voice coil along the axial direction of the voice coil.
  • the upper end surface of the conductive post is flush with or lower than the upper end surface of the voice coil, that is, the first distance L1 is greater than or equal to 0.
  • the upper end surface of the conductive column is lower, which can effectively avoid the collision between the diaphragm and the conductive column, and prevent the noise caused by the collision with the conductive column when the diaphragm vibrates.
  • the first distance L1 is less than or equal to 0.3 times the second distance L2. If the distance between the upper end surface of the conductive column and the upper end surface of the voice coil is too large, it will cause the lead of the voice coil to easily collide with the central magnetic part of the magnetic circuit system, resulting in collision sound. On the one hand, the generated noise will reduce the sound quality of the sounding device, on the other hand, there is also the risk of disconnecting the voice coil lead.
  • the first distance L1 is greater than or equal to 0, and the first distance L1 is less than or equal to 0.3 times the second distance L2.
  • the diameter of the outer periphery of the magnetic circuit system is the first diameter D1
  • the diameter of the portion of the conductive pillar located in the through hole is the second diameter D2.
  • the second diameter D2 is less than or equal to 0.32 times the first diameter D1.
  • the part of the magnetic circuit system close to the magnetic gap is the part that contributes the most to the generation of electromagnetic force, and the position of the through hole is far from the magnetic gap. Therefore, opening a through hole and placing a conductive post in the center of the magnetic circuit system away from the magnetic gap can effectively avoid the influence of the structural loss of the magnetic circuit system on the generation of electromagnetic fields.
  • the conductive pillar has the second diameter D2 as small as possible within the process controllable range. In the range of D2 ⁇ 0.32 * D1, it can avoid substantial negative impact on the intensity of the generated electromagnetic field, and the sensitivity loss is below 0.2dB.
  • the diameter of the outer periphery of the sounding device is the third diameter D3.
  • the ratio of the first diameter D1 to the third diameter D3 is greater than or equal to 0.65.
  • the utility model electrically connects the voice coil to the outside by using a conductive column arranged at the center of the magnetic circuit system, and no other electrical connection is needed at the periphery of the magnetic circuit system, thereby saving space at the periphery of the magnetic circuit system.
  • the size of the magnetic circuit system can be designed to be larger to improve the performance of the magnetic circuit system.
  • the ratio of the first diameter D1 to the third diameter D3 is greater than or equal to 0.65.
  • the ratio of the first diameter D1 to the third diameter D3 is 0.75.
  • the invention also provides an earphone product, the earphone is equipped with the sound generating device.
  • the sound-generating device designed by the utility model can make more effective use of space, and configure a larger magnetic circuit system to enhance the acoustic performance of the sound-generating device, thereby meeting the performance requirements of the earphone.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明公开了一种发声装置和耳机。所述发声装置包括：磁路系统，所述磁路系统包括磁轭，所述磁轭的顶部边缘处形成有向磁轭外围延伸的若干个凸缘；承载框架，所述承载框架的中心形成有镂空，所述承载框架的下端面上形成有定位部；所述磁轭从所述承载框架的下端面一侧定位设置于所述镂空处，所述凸缘在水平方向上延伸至所述承载框架的下方与所述定位部固定连接。本发明的一个技术效果在于，能够降低支撑框架占用的空间。

Description

发声装置和耳机 技术领域
本发明属于电声换能技术领域，具体地，涉及一种发声装置。
背景技术
近年来，消费类电子产品的得到快速发展，智能手机、VR设备等电子设备得到消费者的认可，得到了广泛的应用。本领域技术人员对相关的配套产品如耳机等也相应进行了改进，以满足电子产品的性能要求，满足消费者对产品性能的需要。
发声装置是消费类电子产品中重要的电声换能部件，其作为扬声器、听筒、耳机等得到广泛的应用。随着电子产品的性能改进，有关发声装置的声学性能的改进也是必然的趋势。为了满足更好的声学性能，发声装置往往需要配置体积更大、电磁驱动力更强的磁路系统。但是，以应用在耳机等电子产品上的发声装置为例，磁路系统外围设置有提供承载、固定连接作用的塑胶材料的外壳，外壳包围在所述磁路系统周围，外壳占据了一部分空间，导致在产品体积有限的情况下无法设计体积更大的磁路系统。
发明内容
本发明的一个目的是提供一种发声装置的新技术方案。
根据本发明的第一方面，提供了一种发声装置，包括：
磁路系统，所述磁路系统包括磁轭，所述磁轭的顶部边缘处形成有向磁轭外围延伸的若干个凸缘；
承载框架，所述承载框架的中心形成有镂空，所述承载框架的下端面上形成有定位部；
所述磁轭从所述承载框架的下端面一侧定位设置于所述镂空处，所述凸缘在水平方向上延伸至所述承载框架的下方与所述定位部固定连接。
可选地，所述定位部包括形成于所述承载框架的下端面上的定位凹槽，所述定位凹槽延伸至所述镂空处，所述凸缘嵌于所述定位凹槽中。
可选地，所述承载框架为塑料材料，所述定位部包括形成于所述承载框架的下端面上的热熔结构；
所述热熔结构与所述凸缘热熔固定连接。
可选地，所述定位部还包括形成于所述承载框架的下端面上的定位凹槽，所述定位凹槽延伸至所述镂空处，所述热熔结构位于所述定位凹槽中，所述凸缘嵌于所述定位凹槽中；
所述镂空的形状与所述磁轭的外形相匹配，所述磁轭的上端嵌于所述镂空中，所述磁轭嵌入所述镂空的深度相当于所述定位凹槽的深度。
可选地，所述热熔结构位于所述定位凹槽的远离所述镂空的边缘处。
可选地，所述定位凹槽的深度小于或等于所述承载框架的厚度的二分之一，所述凸缘的厚度小于或等于所述定位凹槽的深度。
可选地，所述凸缘的端部形成有向内凹陷的缺口，所述热熔结构为与所述承载框架一体注塑形成的热熔柱，所述热熔柱位于所述缺口中，所述凸缘通过将热熔柱热熔后固定在所述承载框架上。
可选地，所述缺口为弧形缺口，所述热熔柱朝向所述缺口的一面为弧形面。
可选地，所述磁轭上形成有至少两个所述凸缘，各个所述凸缘相对于所述磁轭的中心以旋转对称或中心对称的形式分布，所述承载框架上对应每一个所述凸缘形成有一个所述热熔结构。
可选地，所述磁轭上形成有四个所述凸缘，相邻的两个所述凸缘相对于所述磁轭的中心呈90度旋转对称。
可选地，所述镂空呈圆孔状，所述镂空呈圆孔状，所述磁轭呈圆柱筒形包括底壁和圆环形的侧壁。
可选地，所述凸缘的顶面与所述侧壁的顶面齐平。
可选地，所述磁轭和所述凸缘一体冲压成型。
可选地，所述磁路系统还包括中心磁部，所述中心磁部设置在所述磁轭中，所述中心磁部包括堆叠设置的磁铁和导磁板，所述中心磁部与所述 磁轭的侧壁之间形成有磁间隙；
所述发声装置还包括振动组件，所述振动组件包括振膜和音圈，所述音圈连接在所述振膜的一侧，所述振膜的边缘固定连接在所述承载框架的上端面上，所述音圈伸入所述磁间隙中。
可选地，还包括导电柱，所述磁路系统的中心形成有通孔，所述导电柱从所述磁轭的底部插入所述通孔并穿过所述磁路系统，所述导电柱的顶端形成有两个第一电连接点，所述导电柱的底端形成两个第二电连接点，两个所述第二电连接点分别与两个所述第一电连接点形成电连接；
所述音圈环绕与所述导电柱周围，所述音圈内侧引出有引线，所述引线连接在所述第一电连接点上。
可选地，所述导电柱包括纵向截面呈倒T型的塑料本体部，所述塑料本体部包括芯柱和连接于芯柱底部的支撑部，所述芯柱穿过所述磁路系统的通孔，所述支撑部覆于所述磁路系统的底面上；
所述导电柱还包括注塑于所述塑料本体部中的两个金属件，所述金属件包括平行的第一端部和第二端部，以及连接第一端部和第二端部的中间部，所述第一端部露出所述芯柱的顶面形成第一电连接点，所述第二端部露出所述支撑部的底面形成第二电连接点。
可选地，所述导电柱的上端面低于所述音圈的上端面，所述导电柱的上端面与所述音圈的上端面之间的距离为第一距离L1，所述磁路系统的中心磁部的上端面与所述音圈的上端面的距离为第二距离L2，所述第一距离L1大于或等于0，所述第一距离L1小于或等于0.3倍的第二距离L2。
所述磁路系统的外周的直径为第一直径D1，所述导电柱的位于所述通孔中的部分的直径为第二直径D2，所述第二直径D2小于或等于0.32倍的第一直径D1。
所述磁路系统的外周的直径为第一直径D1，所述发声装置的外周的直径为第三直径D3，所述第一直径D1与第三直径D3的比值大于或等于0.65。
本发明的另一方面还提供了一种耳机，该耳机中设置有上述发声装置。
根据本公开的一个实施例，所述磁路系统的磁轭暴露在外，所述承载 框架不对所述磁轭形成包围的装配关系，节省了空间。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明提供的发声装置的部分部件的爆炸示意图；
图2是本发明提供的发声装置的轴测图；
图3是本发明提供的发声装置的侧面剖视图；
图4是本发明提供的发声装置的轴测剖视图；
图5是本发明提供的发声装置的仰视图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明提供了一种发声装置，如图1所示，所述发声装置至少包括磁路系统和承载框架2。所述磁路系统用于为发声装置的振动提供电磁驱动 作用力。所述承载框架2则用于为磁路系统以及发声装置的其它部件提供支撑、定位的作用，使各个部件固定连接成一个整体的装置。
如图1-3所示，所述磁路系统包括磁轭11，所述磁轭11具有侧壁和底壁，磁轭11围合形成了一个能够承载其它部件的容纳空间。所述磁轭11的侧壁向上延伸一定高度，在所述磁轭11的顶部边缘处，形成有向磁轭11的外侧延伸的若干个凸缘111。如图1所示，所述凸缘111从所述侧壁的顶部向侧壁的外围延伸。所述凸缘111用于与所述承载框架2形成固定连接。可选地，所述磁轭11与所述凸缘111为一体冲压成型的部件。一体冲压成型的结构可靠性高，而且更便于进行装配。
如图1-3所示，所述承载框架2呈环状结构，其中心形成有镂空22，所述承载框架2的下端面21上形成有定位部。所述承载框架2中心镂空22的区域用于放置发声装置的其它部件。所述磁轭11从所述承载框架2的下端面21的一侧设置于所述镂空22处。所述凸缘111在水平方向上延伸至所述承载框架2的下方与所述定位部的位置对应，两者形成固定连接，以使所述磁路系统与承载框架固定连接。凸缘111设置断续的若干个，可以与承载框架2底面的定位部例如凹槽结构等，形成XY平面上的定位，避免磁轭11相对于承载框架2产生转动，并且通过对两者之间进行粘接、焊接、热熔固定等方式实现Z方向的定位，避免磁轭11相对于承载框架2产生轴向位移，最终实现磁轭11与承载框架2之间的牢固装配。
如图1-3所示，本发明将承载框架2设计成环状结构，取消了其用于包围磁路系统的侧壁和底壁。可见，所述磁轭11的侧壁和底壁可以直接暴露在外。通过这种设计，承载框架省略的结构使其减少了占据的空间。节省的空间可以供所述磁轭以及整个磁路系统占用，从而配置体积更大、磁场更强的磁路系统。
在承载框架与磁轭的连接部分，本发明采用凸缘与固定部连接的方式。本发明将所述凸缘设计在所述磁轭的顶部，并且所述固定部设置在所述承载框架的下端面上。通过这种设计方式，所述磁轭只有靠近顶部的区域所述承载框架的底部之间配合连接，大幅降低了两者重合、相互包围的部分，从而降低因两者重叠而占用的空间，提高了发声装置的空间利用率， 更便于给发声装置配置体积更大的磁路系统。
优选地，如图1、2所示，所述定位部包括形成于所述承载框架2的下端面21上形成有定位凹槽212，所述定位凹槽212从所述承载框架2的下端面21向上凹陷一段距离。并且，所述定位槽沿着所述下端面21的表面延伸，一直延伸至所述镂空22处。即，如图1、2所示，延伸到镂空22的边缘。
所述磁轭11与所述承载框架2相互装配后，如图2、4所示，所述凸缘111嵌于所述定位凹槽212中。通过配置所述定位槽，能够提高所述承载框架2与磁轭之间的定位准确性。
另一种可选的实施方式为，如图1、2所示，所述承载框架为塑料材料，所述定位部包括形成于所述承载框架2的下端面21上的热熔结构211。所述磁路系统与承载框架2装配在一起时，所述凸缘111处在与所述热熔结构211相对应的位置，凸缘111可以与热熔结构211接触。在所述发声装置的成品器件上，所述热熔结构211经过热熔处理，其热熔覆盖在所述凸缘111上，与所述凸缘111形成固定连接。凸缘与热熔结构通过热熔连接的方式实现可靠的固定连接，保证发声装置的结构可靠性。
优选地，所述承载框架为塑料材料，所述定位部可以包括所述热熔结构211以及上述定位凹槽212，如图1、2所示。所述热熔结构211位于所述定位凹槽212中，所述凸缘111嵌于所述定位凹槽212中，并与定位凹槽212中的热熔结构211热熔固定连接。该优选实施方式中，一方面，定位凹槽212与凸缘111的配合方式能够提高承载框架2与磁路系统的定位准确性。另一方面，在对热熔结构211进行热熔处理时，所述热熔结构211可以流入所述定位凹槽212内，并包裹在所述凸缘111周围，从而提高承载框架2与磁轭之间的固定连接可靠性。进一步地，通过所述定位槽收容热熔结构，能够避免热熔结构的至少一部分结构热熔溶化后，流淌到远离凸缘的位置，防止由于热熔结构流淌导致的产品外形出现瑕疵等问题。
进一步地，在所述承载框架的下端面上形成有定位凹槽的实施方式中，由于所述凸缘会向定位凹槽212中嵌入相当于定位凹槽212深度的距离，所以，所述磁轭的侧壁的端部会更靠近与所述镂空22处。如果所述凸 缘111自身平齐于所述磁轭11的侧壁的顶部，或者略微低于所述磁轭11的侧壁的顶部，则所述磁轭11的侧壁的顶部会嵌于所述镂空22处，如图3、4所示。在这种实施方式中，磁轭11与承载框架2之间的定位准确性和密封性都能够得到提高。而且，由于本发明的采用凸缘与承载框架的下端面配合的技术特点，并且取消了承载框架上由于包封磁轭的结构，因此，即使所述磁轭的侧壁的顶部向所述镂空处嵌入一小段距离，也不会造成承载框架与磁轭之间有过多的重叠部分、占用过多空间的情况。在本发明的设计中，仍然有足够的空间用于增大磁路系统的体积。可选地，所述凸缘自身平齐于所述磁轭的侧壁的顶部，所述磁轭嵌入到所述镂空处的深度相当于所述定位槽的深度。
可选地，如图1、4所示，所述热熔结构211位于所述定位凹槽212的远离所述镂空22的一侧边缘处。所述热熔结构211可以直接贴在上述边缘上，也可以是靠近该侧边缘的形式，距离该侧边缘有小段距离。这种设计方式一方面能够更便捷的使凸缘完整的嵌于所述定位凹槽中，另一方面能够使热熔结构在溶化后，更顺畅的沿着所述定位凹槽向靠近所述镂空的区域延伸，从而覆盖、包裹在整个所述凸缘上。
优选地，所述定位凹槽的深度小于或等于所述承载框架2的厚度的二分之一，如图3所示。如果所述定位凹槽212的深度过深，会降低承载框架2在此处的结构强度。本发明上述对定位凹槽的深度限定范围是优选的范围，定位凹槽在该范围内通常不会造成所述承载框架的结构强度受损。本发明并不对此进行严格限制，在实际应用中，还可以根据承载框架的实际结构强度以及凸缘的实际厚度对所述定位凹槽的深度进行设计。
优选地，所述凸缘111的厚度小于或等于所述定位凹槽212的深度，如图4所示。所述凸缘111的厚度与所述定位凹槽212的深度之间的配合关系会影响到承载框架2与磁轭11之间的连接强度。在这种优选的实施方式中，凸缘的下表面能够向凹槽内沉入，或者齐平于承载框架的下端面，这种设计方式更便于热熔结构溶化后覆盖在所述凸缘上，使凸缘被埋入所述定位凹槽内，提高连接可靠性。本发明并不限制所述凸缘的厚度必须小于或等于所述定位凹槽的深度。
可选地，如图1、5所示，所述凸缘111的端部形成有向内凹陷的缺口1111，所述热熔结构211可选为与所述承载框架2一体注塑形成的热熔柱。在所述磁轭11与承载框架2装配在一起后，所述热熔结构211柱位于所述缺口1111中。凸缘111通过将热熔柱热熔后固定在所述承载框架2上。通过这种设计，所述凸缘与热熔结构之间能够提高定位精确度，从而提高磁轭与承载框架之间的定位精度；也能够提高热熔结构与凸缘的熔融连接可靠性。
可选地，所述缺口1111为弧形缺口，如图1所示。上述热熔柱的朝向所述缺口1111的一面为弧形面。热熔柱可以呈圆柱形或椭圆柱形结构。优选地，所述缺口1111与所述热熔结构211的形状相互匹配。如图5所示，上述形状匹配的设计方式可以达到更好的定位、固定连接效果。
可选地，所述磁轭上至少形成有两个所述凸缘，各个凸缘相对于所述磁轭的中心以旋转对称或中心对称的形式分布在磁轭的侧壁的顶端上。相应地，所述承载框架上对应每一个所述凸缘形成有一个所述热熔结构，以便于凸缘形成热熔连接。这种设计方式能够提高磁轭连接在承载框架上的平衡性和连接可靠性。
在如图5所示的实施方式中，所述磁轭11上形成有四个所述凸缘111，承载框架2上也形成有四个热熔结构211和定位凹槽212。四个所述凸缘111相对于磁轭11的中心呈间距90度旋转对称的形式。四个凸缘111均匀分布在所述磁轭11的四周，能够有效提高固定连接的稳定性。在其它实施方式中，对于所述凸缘和热熔结构，也可以采用三个分别相距120度等其它分布方式和数量，以满足性能要求，本发明不对此进行限制。
可选地，如图1所示，所述镂空22呈圆孔状，所述磁轭11相应的呈圆柱筒形结构。所述磁轭包括圆形的底壁和呈圆环形的侧壁。两者的外形相互匹配，以提高磁轭11与承载框架2之间的结构匹配程度。例如，所述镂空和磁轭还可以呈椭圆形结构，本发明不对此进行限制。优选地，所述凸缘111的顶面与所述磁轭11的侧壁的顶面齐平，如图4所示。这种设计能够减小支撑框架在磁轭的高度方向上对磁轭的包围范围，而且磁轭的结构设计简单，定位更便捷。
可选地，所述磁路系统还可以包括中心磁部12，如图3、4所示。所述中心磁部12设置在由所述磁轭11围合形成的空间中。所述中心磁部12包括堆叠设置的磁铁和导磁板。所述中心磁部12与所述磁轭11的侧壁之间留有一定间隙，该间隙为能够产生磁场的磁间隙100，用于驱动发声装置的振动组件振动。发声装置还包括了上述振动组件，所述振动组件至少包括振膜和音圈两个部件。所述音圈连接在所述振膜的一侧表面上，所述音圈用于接收声音信号产生振动，所述振膜则在音圈的带动下振动进而发声。所述振膜的边缘固定连接在所述承载框架的上端面23上，所述音圈则通过所述振膜悬于所述磁间隙内。
优选地，所述发声装置还可以包括导电柱3，所述导电柱3中形成有用于导通声音信号的电路。所述磁路系统的中心形成有通孔，所述导电柱3从所述磁轭11的底部插入所述通孔，并从所述磁路系统中穿过，伸至所述磁路系统的上方，如图3、4所示。所述音圈环绕在所述导电柱3周围，音圈上引出有用于导通信号的两支引线。相应的，所述导电柱3的顶端形成有两个第一电连接点，两支所述引线从所述音圈上向中间的导电柱3延伸，并分别连接在两个所述第一电连接点上。所述引线通过导电柱3接收外界输入的声音信号。通过这种设计方式，一方面能够减小音圈及引线占用的空间，而且能够从音圈内侧提高音圈的振动稳定性，降低音圈发生偏振的可能性。另一方面，在所述磁路系统中间设置导电柱，既不会影响磁路系统的性能，又可以充分利用磁路系统所占据的较大空间。
进一步地，所述导电柱3的底端可以形成有两个第二电连接点。两个所述第二电连接点被配置为用于与外部设备形成电连接，以将声音信号从外部电子设备引入至发声装置中。两个所述第二电连接点分别与两个所述第一电连接点形成电连接。
在实际应用中，本发明提供的发声装置需要装配到其它电子设备中，例如装配到手机、耳机、小型扬声器等设备上。所以发声装置通常需要从其它设备上接收声音信号再将声音信号转化成声音。通过在所述导电柱的底端设置第二电连接点，能够将外部设备上的声音信号导入所述导电柱内。由于两个第二电连接点分别与两个第一电连接点形成电连接，所以声音信 号能够经第二电连接点、第一电连接点传输至所述引线上。该实施方式的另一个优点在于，第二电连接点形成在导电柱的底端，而所述通孔贯通所述磁路系统，因此在将第二电连接点与外部设备电连接时，能够方便的从磁路系统的底部配置电连接件，进而与第二电连接点连接。这种设计方式便于实现电连接，也与发声装置装配到外部设备上的方式契合度更高。
对于所述导电柱的具体结构，本发明提供了一种具体实施方式。如图3、4所示，所述导电柱包括塑料本体部，所述塑料本体部作为所述导电柱的主体结构，其侧面呈倒T型结构。所述塑料本体部包括芯柱和连接于所述芯柱底部的支撑部。所述芯柱穿过所述磁路系统的通孔，所述支撑部覆于所述磁路系统的底面上。
导电柱还包括两个金属件，两个所述金属件注塑固定在所述塑料本体部内。所述金属件上具有第一端部、第二端部和中间部。同一个金属件上的第一端部与第二端部可以呈相对平行的姿态，所述中间部连接在所述第一端部与第二端部之间。所述第一端部用于构成上述第一电连接点，所述第二端部则用于构成所述第二电连接点。所述第一端部可以从所述芯柱的顶面上露出，所述第二端部则从所述支撑部的底面上露出。这种配置方式便于引线以及外部设备通过所述金属件实现信号导通。而且，金属件的中间部注塑在塑料本体部内部，不易与发声装置内的其它导电、导磁部件发生相互干扰。
导电柱的上端面与音圈的上端面之间的距离为第一距离L1，磁路系统的中心磁部的上端面与音圈的上端面的距离为第二距离L2。所述第一距离L1指沿着导电柱的轴向，导电柱的上端面距离音圈的上端面的竖直距离。所述第二距离L2指沿着音圈的轴向，所述磁路系统的中心磁部距离音圈的上端面的竖直距离。可选地，所述导电柱的上端面齐平于或者低于所述音圈的上端面，即所述第一距离L1大于或等于0。导电柱的上端面较低，能够有效避免振膜与导电柱之间发生碰撞，防止振膜振动时因与导电柱发生碰撞而引起杂音。优选地，第一距离L1小于或等于0.3倍的第二距离L2。如果导电柱的上端面低于音圈的上端面的距离过大，则会造成音圈的引线容易与磁路系统的中心磁部发生碰撞，产生碰撞声音。一方面，产生的杂 音会降低发声装置的音质，另一方面，也会存在造成音圈引线断线的风险。优选地，所述第一距离L1大于或等于0，所述第一距离L1小于或等于0.3倍的第二距离L2。
所述磁路系统的外周的直径为第一直径D1，导电柱的位于所述通孔中的部分的直径为第二直径D2。优选地，所述第二直径D2小于或等于0.32倍的第一直径D1。所述磁路系统的靠近磁间隙的部分是对产生电磁作用力贡献最大的部分，所述通孔的位置远离所述磁间隙。因此，在磁路系统的远离磁间隙的中心部位开设通孔并放置导电柱，能够有效避免磁路系统的结构损失对产生电磁场造成的影响。优选地，导电柱在工艺可控范围尽可能缩小第二直径D2。在D2≤0.32*D1的范围内能够避免对产生电磁场的强度造成实质性的负面影响,灵敏度损失在0.2dB以下。
发声装置的外周的直径为第三直径D3。在本实用新型的优选实施方式中，所述第一直径D1与第三直径D3的比值大于或等于0.65。在现有技术中，位于磁路系统外围的框架、壳体上注塑有用于电连接的焊盘的电路器件，占据了磁路系统外围的较大空间。在发声装置整体的空间有限的情况下，导致留给磁路系统自身的可用空间较小。本实用新型利用设置于磁路系统中心的导电柱将音圈与外部电连接，磁路系统的外围无需再设置其它电连接，从而在磁路系统的外围节省了空间。相对于现有技术，可以将磁路系统的尺寸设计的更大，提高磁路系统的性能。优选地，所述第一直径D1与第三直径D3的比值大于或等于0.65。可选地，所述第一直径D1与第三直径D3的比值为0.75。
本发明还提供了一种耳机产品，该耳机中配置有上述发声装置。在耳机产品内有限的空间中，采用本实用新型设计的发声装置能够更有效的利用空间，配置体积更大的磁路系统，以增强发声装置的声学性能，进而满足耳机的性能要求。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求 来限定。

Claims (20)

  1. 一种发声装置，其特征在于，包括：
    磁路系统，所述磁路系统包括磁轭，所述磁轭的顶部边缘处形成有向磁轭外围延伸的若干个凸缘；
    承载框架，所述承载框架的中心形成有镂空，所述承载框架的下端面上形成有定位部；
    所述磁轭从所述承载框架的下端面一侧定位设置于所述镂空处，所述凸缘在水平方向上延伸至所述承载框架的下方与所述定位部固定连接。
  2. 根据权利要求1所述的发声装置，其特征在于，所述定位部包括形成于所述承载框架的下端面上的定位凹槽，所述定位凹槽延伸至所述镂空处，所述凸缘嵌于所述定位凹槽中。
  3. 根据权利要求1所述的发声装置，其特征在于，所述承载框架为塑料材料，所述定位部包括形成于所述承载框架的下端面上的热熔结构；
    所述热熔结构与所述凸缘热熔固定连接。
  4. 根据权利要求3所述的发声装置，其特征在于，所述定位部还包括形成于所述承载框架的下端面上的定位凹槽，所述定位凹槽延伸至所述镂空处，所述热熔结构位于所述定位凹槽中，所述凸缘嵌于所述定位凹槽中；
    所述镂空的形状与所述磁轭的外形相匹配，所述磁轭的上端嵌于所述镂空中，所述磁轭嵌入所述镂空的深度相当于所述定位凹槽的深度。
  5. 根据权利要求4所述的发声装置，其特征在于，所述热熔结构位于所述定位凹槽的远离所述镂空的边缘处。
  6. 根据权利要求4所述的发声装置，其特征在于，所述定位凹槽的深度小于或等于所述承载框架的厚度的二分之一，所述凸缘的厚度小于或等于所述定位凹槽的深度。
  7. 根据权利要求3所述的发声装置，其特征在于，所述凸缘的端部形成有向内凹陷的缺口，所述热熔结构为与所述承载框架一体注塑形成的热熔柱，所述热熔柱位于所述缺口中，所述凸缘通过将热熔柱热熔后固定在所述承载框架上。
  8. 根据权利要求7所述的发声装置，其特征在于，所述缺口为弧形缺口，所述热熔柱朝向所述缺口的一面为弧形面。
  9. 根据权利要求3所述的发声装置，其特征在于，所述磁轭上形成有至少两个所述凸缘，各个所述凸缘相对于所述磁轭的中心以旋转对称或中心对称的形式分布，所述承载框架上对应每一个所述凸缘形成有一个所述热熔结构。
  10. 根据权利要求9所述的发声装置，其特征在于，所述磁轭上形成有四个所述凸缘，相邻的两个所述凸缘相对于所述磁轭的中心呈90度旋转对称。
  11. 根据权利要求1所述的发声装置，其特征在于，所述镂空呈圆孔状，所述磁轭呈圆柱筒形包括底壁和圆环形的侧壁。
  12. 根据权利要求11所述的发声装置，其特征在于，所述凸缘的顶面与所述侧壁的顶面齐平。
  13. 根据权利要求1-12任意之一所述的发声装置，其特征在于，所述磁轭和所述凸缘一体冲压成型。
  14. 根据权利要求1-12任意之一所述的发声装置，其特征在于，所述磁路系统还包括中心磁部，所述中心磁部设置在所述磁轭中，所述中心磁部包括堆叠设置的磁铁和导磁板，所述中心磁部与所述磁轭的侧壁之间形成有磁间隙；
    所述发声装置还包括振动组件，所述振动组件包括振膜和音圈，所述音圈连接在所述振膜的一侧，所述振膜的边缘固定连接在所述承载框架的上端面上，所述音圈伸入所述磁间隙中。
  15. 根据权利要求14所述的发声装置，其特征在于，还包括导电柱，所述磁路系统的中心形成有通孔，所述导电柱从所述磁轭的底部插入所述通孔并穿过所述磁路系统，所述导电柱的顶端形成有两个第一电连接点，所述导电柱的底端形成两个第二电连接点，两个所述第二电连接点分别与两个所述第一电连接点形成电连接；
    所述音圈环绕与所述导电柱周围，所述音圈内侧引出有引线，所述引线连接在所述第一电连接点上。
  16. 根据权利要求15所述的发声装置，其特征在于，所述导电柱包括侧面呈倒T型的塑料本体部，所述塑料本体部包括芯柱和连接于芯柱底部的支撑部，所述芯柱穿过所述磁路系统的通孔，所述支撑部覆于所述磁路系统的底面上；
    所述导电柱还包括注塑于所述塑料本体部中的两个金属件，所述金属件包括平行的第一端部和第二端部，以及连接第一端部和第二端部的中间部，所述第一端部露出所述芯柱的顶面形成第一电连接点，所述第二端部露出所述支撑部的底面形成第二电连接点。
  17. 根据权利要求15所述的发声装置，其特征在于，所述导电柱的上端面齐平于或低于所述音圈的上端面，所述导电柱的上端面与所述音圈的上端面之间的距离为第一距离L1，所述磁路系统的中心磁部的上端面与所述音圈的上端面的距离为第二距离L2，所述第一距离L1大于或等于0，所述第一距离L1小于或等于0.3倍的第二距离L2。
  18. 根据权利要求15所述的发声装置，其特征在于，所述磁路系统的外周的直径为第一直径D1，所述导电柱的位于所述通孔中的部分的直径为第二直径D2，所述第二直径D2小于或等于0.32倍的第一直径D1。
  19. 根据权利要求15所述的发声装置，其特征在于，所述磁路系统的外周的直径为第一直径D1，所述发声装置的外周的直径为第三直径D3，所述第一直径D1与第三直径D3的比值大于或等于0.65。
  20. 一种耳机，其特征在于，所述耳机中设置有权利要求1-19任意之一所述的发声装置。
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