WO2020087572A1 - 电路板及显示装置 - Google Patents

电路板及显示装置 Download PDF

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Publication number
WO2020087572A1
WO2020087572A1 PCT/CN2018/115526 CN2018115526W WO2020087572A1 WO 2020087572 A1 WO2020087572 A1 WO 2020087572A1 CN 2018115526 W CN2018115526 W CN 2018115526W WO 2020087572 A1 WO2020087572 A1 WO 2020087572A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
ground
ground wire
wire
screw hole
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Application number
PCT/CN2018/115526
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English (en)
French (fr)
Inventor
黄北洲
Original Assignee
惠科股份有限公司
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Publication date
Application filed by 惠科股份有限公司 filed Critical 惠科股份有限公司
Priority to US17/044,147 priority Critical patent/US11638347B2/en
Publication of WO2020087572A1 publication Critical patent/WO2020087572A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0746—Protection against transients, e.g. layout adapted for plugging of connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Definitions

  • This application relates to the field of electrostatic discharge, in particular to a circuit board and a display device.
  • Electrostatic discharge (ESD) is everywhere. How to protect ESD To ensure the normal operation of equipment is the key problem that electronic products need to overcome at present.
  • the circuit board needs to be designed for ESD protection.
  • the existing ESD protection design is to discharge the resistance through the screw hole to the ground of the circuit board.
  • the components in the board and the resistance of the screw hole share the same ground line.
  • This ESD protection design does not solve the problem that ESD cannot be discharged during the assembly process of the circuit board, and during the operation of the circuit board, the inherent discharge path of ESD is likely to interfere with the working stability of the components and signals in the board. Will cause the circuit board to not work properly.
  • An embodiment of the present application provides a circuit board, including:
  • a connector configured to connect the onboard system of the circuit board to an external system; the connector is provided with a first ground terminal and connected to the first ground;
  • Screw holes connected to the first ground to discharge static electricity through the first ground
  • the first ground and the ground of the circuit board are isolated from each other.
  • the ground wire is provided with a plurality of second ground terminals, one side of the screw hole and one side of the connector are respectively provided with the second ground terminal, and the second The ground terminal is connected to the first ground through a resistor.
  • the resistance is a cross-line resistance.
  • the circuit board is provided with at least one screw hole.
  • the screw hole is provided at a corner of the circuit board.
  • the first ground is a laminated conductive structure provided in a circuit board.
  • the laminated conductive structure of the first ground extends along a straight line at the edge of the circuit board.
  • the width of the laminated conductive structure of the first ground is above 40 mils.
  • the circuit board is at least two layers of circuit boards.
  • the two-layer circuit board includes a top circuit board and a bottom circuit board, and the ground wire on the top circuit board and the ground wire on the bottom circuit board pass through the via holes on the circuit board Connected.
  • the ground wire on the top circuit board and the ground wire on the bottom circuit board form a grid frame shape, and the ground wire on the top circuit board and the ground wire on the bottom circuit board The ground wire is connected through the via hole, and the via hole is located at a position where the projection of the ground wire on the top circuit board and the ground wire on the bottom circuit board coincide.
  • the ground wire on the top circuit board is perpendicular to the ground wire on the bottom circuit board
  • the circuit board includes at least one ground wire on the top circuit board and the bottom layer
  • the ground wire on the circuit board, the ground wire on the top circuit board and the ground wire on the bottom circuit board overlap projections are provided with the via, the ground wire on the top circuit board and the The ground wire on the bottom circuit board is connected through the via.
  • the interval between the ground wires on the adjacent top circuit boards is a fixed value.
  • the interval between the ground wires on the adjacent bottom circuit boards is a fixed value.
  • An embodiment of the present application also provides a circuit board, including:
  • a connector configured to connect the onboard system of the circuit board to an external system; the connector is provided with a first ground terminal and connected to the first ground;
  • a screw hole is connected to the first ground to discharge static electricity through the first ground, and the circuit board is provided with at least one screw hole, and the screw hole is provided at a corner of the circuit board position;
  • the first ground and the ground of the circuit board are isolated from each other;
  • the ground wire is provided with a plurality of second ground terminals, one side of the screw hole and one side of the connector are respectively provided with the second ground terminal, and the second ground terminal is connected to The first ground is connected;
  • the first ground is a laminated conductive structure provided in a circuit board, and extends along a straight line at an edge position of the circuit board, and the width of the laminated conductive structure of the first ground is more than 40 mils;
  • the circuit board is a two-layer circuit board.
  • the two-layer circuit board includes a top circuit board and a bottom circuit board.
  • the ground wire on the top circuit board and the ground wire on the bottom circuit board form a grid-like frame ,
  • the ground wire on the top circuit board and the ground wire on the bottom circuit board are connected through a via on the circuit board, and the ground wire on the top circuit board on the via hole is connected to the bottom layer
  • the projection of the ground wire on the circuit board coincides.
  • An embodiment of the present application further provides a display device, including a display module and a driving module, where the driving module includes the above-mentioned circuit board.
  • the above circuit board includes a first ground that is isolated from the ground of the circuit board, and the first ground is connected to the first ground end of the connector on the circuit board and the screw hole respectively.
  • the ground wire of the board is not connected, and the ESD concentrated in the screw hole can be discharged to the external earth through the first ground in the circuit board through the first ground terminal of the connector, thereby solving the problem that the circuit board is concentrated in the screw during the assembly process.
  • the problem of hole ESD cannot be vented.
  • FIG. 1 is a schematic circuit diagram of a circuit board in an embodiment
  • FIG. 2 is a schematic circuit diagram of a circuit board in another embodiment
  • FIG. 3 is a schematic structural diagram of a circuit board in another implementation
  • FIG. 4 is a schematic diagram of the distribution of ground wires in a circuit board in an implementation.
  • FIG. 1 is a schematic circuit diagram of a circuit board in an embodiment.
  • a circuit board including:
  • the connector 10 is configured to connect the onboard system of the circuit board and the external system 40; the connector 10 is provided with a first ground terminal 100 and connected to the first ground 30; and
  • the screw hole 20 is connected to the first ground 30 to discharge static electricity through the first ground 30;
  • the first ground 30 is isolated from the ground of the circuit board.
  • the above circuit board includes the first ground 30 isolated from the ground of the circuit board, the first ground 30 is connected to the first ground 100 and the screw hole 20 of the connector 10 on the circuit board, respectively.
  • the ESD concentrated in the screw hole 20 can be discharged to the external ground through the first ground 30 in the circuit board through the first ground 100 of the connector 10, thereby solving The problem that the ESD of the circuit board concentrated on the screw hole 20 during the assembly process cannot be released.
  • FIG. 2 is a schematic circuit diagram of a circuit board in another embodiment.
  • the ground wire is provided with a plurality of second ground terminals, and the screw hole side and the connector side are provided with Two ground terminals, and the second ground terminal is connected to the first ground through a resistor.
  • the ESD concentrated on the screw hole 20 has two types of discharge paths. The first type of discharge path is concentrated on the screw hole. The ESD passes through the first ground 30 and the resistor R2 in order to reach the second ground terminal GND2.
  • the ESD reaches the second ground terminal GND2 through the second ground in turn
  • the terminal GND1, the resistor R1, and the first ground 30 are discharged to the external ground through the first ground terminal 100 of the connector 10;
  • the second type of discharge path is that the ESD concentrated in the screw hole 20 can pass through the first ground in the circuit board 30 is discharged to the external ground through the first ground terminal 100.
  • the design of the two types of discharge paths effectively improves the problem of ESD in the circuit board that can only cause the interference to important components in the board through the first type of discharge path.
  • the resistors R1 and R2 are cross-line resistors. Since the resistance of the cross-line resistors is infinitely close to 0 ohms, the ESD current can be discharged faster.
  • the circuit board is provided with at least one screw hole 20. Since ESD is basically concentrated on the screw holes 20, at least one screw hole 20 should be provided on the circuit board.
  • the screw holes 20 are provided at the corners of the circuit board.
  • the screw holes 20 are provided as close as possible to the corners of the circuit board, which facilitates the wiring design of the first ground 30 on the circuit board, so that the second type of discharge path becomes the shortest discharge path as possible, because when the circuit board has ESD At the time, ESD will find the shortest discharge path on the circuit board.
  • the second type of discharge path is the shortest discharge path, it can effectively avoid the interference of ESD on the components on the board.
  • the first ground 30 is a laminated conductive structure provided in the circuit board.
  • the first ground 30 is a laminated conductive structure provided in the circuit board. Therefore, in the process of assembling the circuit board, the first ground 30 is still connected to avoid the problem that the ESD cannot be discharged during the assembly process.
  • the laminated structure of the first ground extends along a straight line at the edge position of the circuit board.
  • the laminated conductive structure is located along the straight line of the edge of the circuit board, because the circuit board is provided with many signal lines connecting the conductive elements, in order to avoid crossing the signal line and ESD as far as possible through the second type of leakage path Therefore, the first ground 30 is placed at the edge of the circuit board as far as possible and extends in a straight line, so that the second type of discharge path is the shortest discharge path, and avoid ESD through the first type of discharge path to interfere with Components inside the board.
  • the width of the laminated conductive structure of the first ground 30 is more than 40 mils, which can effectively withstand the interference of ESD.
  • the circuit board is at least two layers of circuit boards.
  • the circuit board is set as a multi-layer board. In the multi-layer board, because there is a complete ground plane close to the trace, this can make ESD more quickly coupled to the low-impedance plane, thereby protecting the role of key signals.
  • FIG. 3 is a schematic structural diagram of a circuit board in another implementation.
  • the ground wire 150 on the top circuit board 50 is a solid line
  • the ground wire 160 on the bottom circuit board 60 is a broken line.
  • the two-layer circuit board includes a top circuit board 50 and a bottom circuit board 60.
  • the ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60 are connected through vias 70 on the circuit board.
  • the two-layer circuit board includes the top-layer circuit board 50 and the bottom-layer circuit board 60, the two layers of circuit boards can be provided with corresponding signal lines and ground lines, thereby simplifying the complex signal lines and ground lines on the single-layer circuit board, which can be convenient
  • the wiring of the first ground 30 makes the second type of discharge path the shortest discharge path.
  • FIG. 4 is a schematic diagram of the distribution of ground wires in the circuit board in an implementation,
  • the ground wire 150 on the board 50 and the ground wire 160 on the bottom circuit board 60 are connected through vias 70, and the projections of the ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60 are identical Office.
  • the ground wire 150 on the top circuit board 50 is perpendicular to the ground wire 160 on the bottom circuit board 60, and the circuit board includes at least one ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60 ,
  • the projections of the ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60 are provided with via holes 70, the ground wire 150 on the top circuit board 50 and the ground wire 150 on the bottom circuit board 60 Connected via via 70.
  • a via 70 is provided at the projection of the ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60, the ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60 Through the via 70 connection, this avoids the problem that a via 70 fails and the entire circuit cannot work normally.
  • the ground line 150 on the top circuit board 50 runs perpendicular to the ground line 160 on the bottom circuit board 60.
  • the length of each ground wire is the shortest and the impedance is the smallest.
  • the interval between the ground wires 150 on adjacent top circuit boards 50 is a fixed value.
  • the interval between the ground wires 160 on the adjacent bottom circuit boards 60 is a fixed value.
  • the distance between the ground wire 150 on the adjacent top circuit board 50 and the ground wire 160 on the bottom circuit board 60 is set to a fixed value, which is convenient for the signal line on the circuit board.
  • the signal line can be set at each Between the ground wires 150 on the two adjacent top circuit boards 50, and between the ground wires 160 on each of the two adjacent bottom circuit boards 60, to avoid the ground line caused by the crossover between different signal lines The environment is damaged, while ensuring the impedance environment of the signal line.
  • a circuit board includes:
  • the connector 10 is configured to connect the onboard system of the circuit board and the external system 40; the connector 10 is provided with a first ground terminal 100 and connected to the first ground 30; and
  • the screw hole 20 is connected to the first ground 30 to discharge static electricity through the first ground 30, and the circuit board is provided with at least one screw hole 20, and the screw hole 20 is provided at a corner of the circuit board;
  • the first ground 30 is isolated from the ground of the circuit board
  • the ground wire is provided with a plurality of second ground terminals.
  • One side of the screw hole 20 and the side of the connector 10 are respectively provided with the second ground terminal, and the second ground terminal is connected to the first ground 30 through a jumper resistor Connected
  • the first ground 30 is a laminated conductive structure provided in the circuit board, and extends along a straight line at the edge of the circuit board, and the width of the laminated conductive structure of the first ground 30 is more than 40 mils;
  • the circuit board is a two-layer circuit board.
  • the two-layer circuit board includes a top circuit board 50 and a bottom circuit board 60.
  • the ground wire 150 on the top circuit board 50 and the ground wire 160 on the bottom circuit board 60 form a grid-like frame shape.
  • the top layer The ground wire 150 on the circuit board 50 and the ground wire 160 on the bottom circuit board 60 are connected through the via hole 70 on the circuit board, and the via hole 70 is located between the ground wire 150 on the top circuit board 50 and the ground on the bottom circuit board 60
  • the projection of line 160 coincides.
  • the above circuit board not only solves the problem that the static electricity concentrated on the screw hole during the assembly process of the circuit board cannot be discharged, but also separates the discharge path during the operation of the circuit board, avoiding the components inside the board and reducing the board The possibility of internal components being disturbed by ESD.
  • the present application also provides a display device including a display module and a driving module.
  • the driving module includes the above-mentioned circuit board. Due to the design of the circuit board, ESD interference of various components of the display device is effectively prevented.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Elimination Of Static Electricity (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种电路板，包括连接器、螺孔和第一地，连接器的第一接地端和螺孔分别与第一地相连，以通过第一地泄放静电，其中，第一地与电路板上的地线相隔离。

Description

电路板及显示装置
本申请要求于2018年10月31日提交中国专利局，申请号为2018217879791，申请名称为“电路板及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及静电放电领域，特别涉及一种电路板及显示装置。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然地构成现有技术。
随着电子技术的不断发展，电子设备的应用越来越广泛，大到是高技术领域如航天航空设备，小到电子芯片，静电放电(Electro-Static Discharge，ESD)无处不在，如何防护ESD，保证设备的正常工作，是目前电子产品需要克服的关键难题。
其中，在面板行业中，电路板都需做ESD防护设计，现有ESD防护设计是通过螺孔连接电阻泄放到电路板的地线上，板内元件与连接螺孔的电阻共用同一个地线。这样的ESD防护设计未解决电路板在组装过程中，ESD无法泄放的问题，且在电路板运行过程中，ESD固有的泄放路径易干扰板内元件、信号的工作稳定性，严重时可能会导致电路板无法正常工作。
申请内容
本申请实施例提供一种电路板，包括：
连接器，设置为将电路板的板载系统和外部系统连接；所述连接器上设有第一接地端并连接至第一地；及
螺孔，所述螺孔与所述第一地相连以通过所述第一地泄放静电；
其中，所述第一地与所述电路板的地线相互隔离。
在其中一个实施例中，所述地线设有若干个第二接地端，所述螺孔的一侧与所述连接器的一侧分别设有所述第二接地端，且所述第二接地端通过电阻与所述第一地相连。
在其中一个实施例中，所述电阻为跨线电阻。
在其中一个实施例中，所述电路板设有至少一个螺孔。
在其中一个实施例中，所述螺孔设置在所述电路板的边角位置。
在其中一个实施例中，所述第一地为设置在电路板中的层压导电结构。
在其中一个实施例中，所述第一地的层压导电结构位于所述电路板的边缘位置沿直线延伸。
在其中一个实施例中，所述第一地的层压导电结构的宽度在40密耳以上。
在其中一个实施例中，所述电路板为至少两层电路板。
在其中一个实施例中，所述两层电路板包括顶层电路板和底层电路板，所述顶层电路板上的地线与所述底层电路板上的地线通过所述电路板上的过孔相连接。
在其中一个实施例中，所述顶层电路板上的地线与所述底层电路板上的地线成栅状围框形，所述顶层电路板上的地线与所述底层电路板上的地线通过所述过孔连接，所述过孔位于所述顶层电路板上的地线与所述底层电路板上的地线的投影重合处。
在其中一个实施例中，所述顶层电路板上的地线与所述底层电路板上的地线垂直设置，且所述电路板包括至少一条所述顶层电路板上的地线和所述底层电路板上的地线，所述顶层电路板上的地线与所述底层电路板上的地线的投影重合处都设有所述过孔，所述顶层电路板上的地线与所述底层电路板上的地线通过所述过孔连接。
在其中一个实施例中，相邻的所述顶层电路板上的地线之间的间隔为固定值。
在其中一个实施例中，相邻的所述底层电路板上的地线之间的间隔为固定值。
本申请实施例还提供一种电路板，包括：
连接器，设置为将电路板的板载系统和外部系统连接；所述连接器上设有第一接地端并连接至第一地；及
螺孔，所述螺孔与所述第一地相连以通过所述第一地泄放静电，且所述电路板设有至少一个螺孔，所述螺孔设置在所述电路板的边角位置；
其中，所述第一地与所述电路板的地线相互隔离；
所述地线设有若干个第二接地端，所述螺孔的一侧与所述连接器的一侧分别设有所述第二接地端，且所述第二接地端通过跨线电阻与所述第一地相连；
所述第一地为设置在电路板中的层压导电结构，且位于所述电路板的边缘位置沿直线延伸，且所述第一地的层压导电结构的宽度在40密耳以上；
所述电路板为两层电路板，所述两层电路板包括顶层电路板和底层电路板，所述顶层电路板上的地线与所述底层电路板上的地线成栅状围框形，所述顶层电路板上的地线与所述底层电路板上的地线通过所述电路板上的过孔 连接，且所述过孔位于所述顶层电路板上的地线与所述底层电路板上的地线的投影重合处。
本申请实施例还提供了一种显示装置，包括显示模块和驱动模块，所述驱动模块包括上述的电路板。
上述的电路板，由于包括与电路板的地线相互隔离的第一地，第一地分别与电路板上的连接器的第一接地端和螺孔相连，电路板在组装过程中，由于电路板的地线未接通，集中在螺孔中的ESD可通过电路板中的第一地经过连接器的第一接地端泄放到外部大地，从而解决了电路板在组装过程中集中在螺孔的ESD无法泄放的问题。
附图说明
为了更清楚地说明本申请实施例或示范性技术中的技术方案，下面将对实施例或示范性技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为一实施例中电路板的电路示意图；
图2为另一实施例中电路板的电路示意图；
图3为又一实施中电路板的结构示意图；
图4为一实施中电路板中地线的分布示意图。
具体实施方式
当一个元件被认为与另一个元件“相连”时，它可以是直接连接到另一 个元件或者可能同时存在居中元件。除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
参见图1，图1为一实施例中电路板的电路示意图。
一种电路板，包括：
连接器10，设置为将电路板的板载系统和外部系统40连接；连接器10上设有第一接地端100并连接至第一地30；及
螺孔20，螺孔20与第一地30相连以通过第一地30泄放静电；
其中，第一地30与电路板的地线相互隔离。
上述的电路板，由于包括与电路板的地线相互隔离的第一地30，第一地30分别与电路板上的连接器10的第一接地端100和螺孔20相连，电路板在组装过程中，由于电路板的地线未接通，集中在螺孔20中的ESD可通过电路板中的第一地30经过连接器10的第一接地端100泄放到外部大地，从而解决了电路板在组装过程中集中在螺孔20的ESD无法泄放的问题。
在一个实施例中，参见图2，图2为另一实施例中电路板的电路示意图，地线设有若干个第二接地端，螺孔的一侧与连接器的一侧分别设有第二接地端，且第二接地端通过电阻与第一地相连，电路板在运行过程中，集中在螺孔20的ESD有两种泄放路径，第一种泄放路径是集中在螺孔的ESD依次通过第一地30和电阻R2到达第二接地端GND2，由于电路板中的所有第二接地端都是设置在地线上的，因此ESD到达第二接地端GND2会依次经过第二接地端GND1、电阻R1、第一地30经过连接器10的第一接地端100泄放到外部大地；第二种泄放路径是集中在螺孔20中的ESD可通过电路板中的第 一地30经过第一接地端100泄放到外部大地，两种泄放路径的设计有效地改善了电路板中ESD只能通过第一种泄放路径泄放造成对板内重要元件的干扰问题。
进一步地，电阻R1和R2为跨线电阻，由于跨线电阻的阻值无限趋近于0欧姆，因此可以更快地泄放ESD电流。
进一步地，电路板设有至少一个螺孔20。由于ESD基本上集中在螺孔20，因此电路板上应至少设有一个螺孔20。
具体地，螺孔20设置在电路板的边角位置。螺孔20尽可能设置在靠近电路板边角的位置，这样便于电路板上第一地30的布线设计，使第二种泄放路径尽可能成为最短的泄放路径，因为当电路板存在ESD时，ESD会在电路板上寻找最短的泄放路径，当第二种泄放路径为最短泄放路径时，可以有效避免ESD对板内元件的干扰。
进一步地，第一地30为设置在电路板中的层压导电结构。其中，第一地30为设置在电路板中的层压导电结构，因此，在电路板组装的过程中，第一地30依然是接通的，避免了组装过程中ESD无法泄放的问题。
具体地，第一地的层压结构位于电路板的边缘位置沿直线延伸。其中，将层压导电结构位于电路板的边缘位置沿直线延伸设置，由于电路板上设有很多连接导电元件的信号线，为了避免与信号线交叉且ESD尽可能通过第二种泄放路径泄放，因此第一地30尽可能地设于电路板的边缘位置且沿直线延伸，从而使第二种泄放路径为最短的泄放路径，避免ESD通过第一种泄放路径泄放干扰到板内元件。
进一步地，第一地30的层压导电结构的宽度在40密耳以上，这样可以有效地承受ESD的干扰。
进一步地，电路板为至少两层电路板。其中，将电路板设置为多层板，在多层板中，由于有一个完整的地平面靠近走线，这样可以使ESD更加快捷的耦合到低阻抗平面上，进而保护关键信号的作用。
在一个实施例中，参见图3，图3为又一实施中电路板的结构示意图，图3中顶层电路板50上的地线150为实线，底层电路板60上的地线160为虚线，两层电路板包括顶层电路板50和底层电路板60，顶层电路板50上的地线150与底层电路板60上的地线160通过电路板上的过孔70相连接。由于两层电路板包括顶层电路板50和底层电路板60，两层电路板都可以设置相应的信号线和地线，从而简化了单层电路板上复杂的信号线和地线，这样可以方便第一地30的布线，使第二种泄放路径为最短的泄放路径。
进一步地，顶层电路板50上的地线150与底层电路板60上的地线160成栅状围框形，参见图4，图4为一实施中电路板中地线的分布示意图，顶层电路板50上的地线150与底层电路板60上的地线160通过过孔70连接，且过孔70位于顶层电路板50上的地线150与底层电路板60上的地线160的投影重合处。
具体地，顶层电路板50上的地线150与底层电路板60上的地线160垂直设置，且电路板包括至少一条顶层电路板50上的地线150和底层电路板60上的地线160，顶层电路板50上的地线150与底层电路板60上的地线160的投影重合处都设有过孔70，顶层电路板50上的地线150与底层电路板60上的地线150通过过孔70连接。
其中，在顶层电路板50上的地线150与底层电路板60上的地线160投影处都设置一个过孔70，顶层电路板50上的地线150与底层电路板60上的地线160通过过孔70连接，这样避免了一个过孔70失效导致整个电路无法 正常工作的问题，同时顶层电路板50上的地线150走向与底层电路板60上的地线160走向垂直设置，可以使各个地线的长度最短，阻抗最小。
具体地，相邻的顶层电路板50上的地线150之间的间隔为固定值。
具体地，相邻的底层电路板60上的地线160之间的间隔为固定值。
其中，将相邻的顶层电路板50上的地线150与底层电路板60上的地线160之间的间隔设置为固定值，方便电路板上信号线的设置，可以将信号线设置在每相邻的两个顶层电路板50上的地线150之间、和每相邻的两个底层电路板60上的地线160之间，避免了不同的信号线之间的交叉设置造成地线环境受到破坏的情况，同时保证了信号线的阻抗环境。
在一个实施例中，一种电路板，包括：
连接器10，设置为将电路板的板载系统和外部系统40连接；连接器10上设有第一接地端100并连接至第一地30；及
螺孔20，螺孔20与第一地30相连以通过第一地30泄放静电，且电路板设有至少一个螺孔20，螺孔20设置在电路板的边角位置；
其中，第一地30与电路板的地线相互隔离；
地线设有若干个第二接地端，螺孔20的一侧与连接器10的一侧分别设有所述第二接地端，且所述第二接地端通过跨线电阻与第一地30相连；
第一地30为设置在电路板中的层压导电结构，且位于电路板的边缘位置沿直线延伸，且第一地30的层压导电结构的宽度在40密耳以上；
电路板为两层电路板，两层电路板包括顶层电路板50和底层电路板60，顶层电路板50上的地线150与底层电路板60上的地线160成栅状围框形，顶层电路板50上的地线150与底层电路板60上的地线160通过电路板上的过孔70连接，且过孔70位于顶层电路板50上的地线150与底层电路板60 上的地线160的投影重合处。
上述的电路板，既解决了电路板在组装过程中集中在螺孔的静电无法泄放的问题，而且在电路板运行过程中，将泄放路径独立出来，避开了板内元件，减少板内元件受ESD干扰的可能性。
本申请还提供了一种显示装置，包括显示模块和驱动模块，驱动模块包括上述的电路板，由于电路板的设计，有效防止了ESD对显示装置各个元件的干扰。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本申请专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (16)

  1. 一种电路板，包括：
    连接器，设置为将电路板的板载系统和外部系统连接；所述连接器上设有第一接地端并连接至第一地；及
    螺孔，所述螺孔与所述第一地相连以通过所述第一地泄放静电；
    其中，所述第一地与所述电路板的地线相互隔离。
  2. 根据权利要求1所述的电路板，其中，所述地线设有若干个第二接地端，所述螺孔的一侧与所述连接器的一侧分别设有所述第二接地端，且所述第二接地端通过电阻与所述第一地相连。
  3. 根据权利要求2所述的电路板，其中，所述电阻为跨线电阻。
  4. 根据权利要求1所述的电路板，其中，所述电路板设有至少一个螺孔。
  5. 根据权利要求1所述的电路板，其中，所述螺孔设置在所述电路板的边角位置。
  6. 根据权利要求1所述的电路板，其中，所述第一地为设置在电路板中的层压导电结构。
  7. 根据权利要求6所述的电路板，其中，所述第一地的层压导电结构位于所述电路板的边缘位置沿直线延伸。
  8. 根据权利要求6所述的电路板，其中，所述第一地的层压导电结构的宽度在40密耳以上。
  9. 根据权利要求1所述的电路板，其中，所述电路板为至少两层电路板。
  10. 根据权利要求9所述的电路板，其中，所述两层电路板包括顶层电路板和底层电路板，所述顶层电路板上的地线与所述底层电路板上的地线通过所述电路板上的过孔相连接。
  11. 根据权利要求10所述的电路板，其中，所述顶层电路板上的地线与所述底层电路板上的地线成栅状围框形，所述顶层电路板上的地线与所述底层电路板上的地线通过所述过孔连接，所述过孔位于所述顶层电路板上的地线与所述底层电路板上的地线的投影重合处。
  12. 根据权利要求11所述的电路板，其中，所述顶层电路板上的地线与所述底层电路板上的地线垂直设置，且所述电路板包括至少一条所述顶层电路板上的地线和所述底层电路板上的地线，所述顶层电路板上的地线与所述底层电路板上的地线的投影重合处都设有所述过孔，所述顶层电路板上的地线与所述底层电路板上的地线通过所述过孔连接。
  13. 根据权利要求12所述的电路板，其中，相邻的所述顶层电路板上的地线之间的间隔为固定值。
  14. 根据权利要求12所述的电路板，其中，相邻的所述底层电路板上的地线之间的间隔为固定值。
  15. 一种电路板，包括：
    连接器，设置为将电路板的板载系统和外部系统连接；所述连接器上设有第一接地端并连接至第一地；及
    螺孔，所述螺孔与所述第一地相连以通过所述第一地泄放静电，且所述电路板设有至少一个螺孔，所述螺孔设置在所述电路板的边角位置；
    其中，所述第一地与所述电路板的地线相互隔离；
    所述地线设有若干个第二接地端，所述螺孔的一侧与所述连接器的一侧分别设有所述第二接地端，且所述第二接地端通过跨线电阻与所述第一地相连；
    所述第一地为设置在电路板中的层压导电结构，且位于所述电路板的边 缘位置沿直线延伸，且所述第一地的层压导电结构的宽度在40密耳以上；
    所述电路板为两层电路板，所述两层电路板包括顶层电路板和底层电路板，所述顶层电路板上的地线与所述底层电路板上的地线成栅状围框形，所述顶层电路板上的地线与所述底层电路板上的地线通过所述电路板上的过孔连接，且所述过孔位于所述顶层电路板上的地线与所述底层电路板上的地线的投影重合处。
  16. 一种显示装置，包括显示模块和驱动模块，所述驱动模块包括权利要求1～15任意一项所述的电路板。
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