WO2018205802A1 - 一种显示装置及其制作方法 - Google Patents

一种显示装置及其制作方法 Download PDF

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Publication number
WO2018205802A1
WO2018205802A1 PCT/CN2018/083343 CN2018083343W WO2018205802A1 WO 2018205802 A1 WO2018205802 A1 WO 2018205802A1 CN 2018083343 W CN2018083343 W CN 2018083343W WO 2018205802 A1 WO2018205802 A1 WO 2018205802A1
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Prior art keywords
display panel
display device
common electrode
lower substrate
conductive
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PCT/CN2018/083343
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English (en)
French (fr)
Inventor
刘海峰
马小叶
王锡平
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京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Publication of WO2018205802A1 publication Critical patent/WO2018205802A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00—Carrying-off electrostatic charges
    • H05F3/02—Carrying-off electrostatic charges by means of earthing connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame

Definitions

  • the present disclosure relates to the field of fabrication of display devices, and more particularly to a display device and a method of fabricating the same.
  • a conventional destaticization method for displaying a product is to use a high-resistance diode to lead an electrode on a display substrate to a ground line of a PCB (printed wiring board). Since the display screen develops toward the ultra-thin narrow side, the layout space of the trace is very limited, and the line width of the ground line is generally made narrow, so that the resistance of the ground line in the short-side direction of the display is kilo ohm.
  • the voltage of the electrostatic discharge can reach the order of 10KV to 100KV, and the discharge path may be insufficient to break down the insulation layer (the static electricity is difficult to be transmitted and released), and this risk is more likely to occur at a position away from the PCB.
  • an embodiment of the present disclosure provides a display device including a display panel and a casing for enclosing the display panel, the display device further comprising:
  • the outer casing for supporting a metal skeleton of the outer casing, the metal skeleton connecting the ground wire;
  • a conductor unit disposed outside the sealant of the display panel, the conductor unit being connected to the upper substrate and/or the lower substrate of the display panel, and connected to the metal skeleton.
  • the lower substrate is provided with a common electrode line and an insulating layer covering the common electrode line, and the insulating layer includes a via hole located outside the frame sealant;
  • the conductor unit includes: a conductive connection line connected to the common electrode line through the via hole.
  • the conductor unit further comprises:
  • the upper substrate is provided with a black matrix, at least a portion of the black matrix is located outside the sealant, and the conductive paste is in contact with a portion of the black matrix located outside the sealant.
  • the printed circuit board is disposed in a binding manner with the lower substrate, and the conductive unit is located on a side of the lower substrate away from the printed circuit board.
  • the metal skeleton is connected to the ground through a bidirectional diode.
  • the metal skeleton is located between the display panel and the outer casing.
  • the lower substrate is provided with a common electrode line and an insulating layer covering the common electrode line, and the insulating layer includes a via hole located on a side of the frame seal rubber away from the display area;
  • the conductor unit includes: a conductive connection line connected to the common electrode line through the via hole.
  • the upper substrate is provided with a black matrix, at least a portion of the black matrix is located on a side of the frame seal rubber away from the display area, and the conductive paste and the black matrix are located at the frame seal glue away from the display. A part of the side of the area is in contact.
  • an orthographic projection of a via in the insulating layer on the lower substrate at least partially overlaps with an orthographic projection of the common electrode line on the lower substrate.
  • the conductive connecting wire extends into the via hole in the insulating layer and is in direct contact with the common electrode line.
  • the orthographic projection of the black matrix on the lower substrate at least partially overlaps with the orthographic projection of the conductive connection line on the lower substrate.
  • an embodiment of the present disclosure further provides a method of fabricating a display device, including the steps of fabricating a display panel and the step of using the outer casing to frame the display panel;
  • the step of using the outer casing to seal the display panel includes:
  • the manufacturing method further includes:
  • the steps of manufacturing the display panel include:
  • the insulating layer including a via hole located outside the sealant
  • the step of disposing a conductor unit outside the sealant of the display panel includes:
  • Conductive connecting lines are formed on the lower substrate, and the conductive connecting lines are connected to the common electrode lines through the via holes.
  • the step of disposing a conductor unit outside the sealant of the display panel further includes:
  • a conductive paste covering the conductive connecting line is formed, and the conductive paste is connected to the metal skeleton.
  • the step of manufacturing the display panel further includes:
  • the conductive paste is in contact with a portion of the black matrix located outside the sealant.
  • FIG. 1 is a schematic structural view of a display device of the present disclosure
  • FIG. 2 is a schematic structural view of a display device of the present disclosure in practical applications.
  • the present disclosure provides a solution to the problem of the destaticization scheme in the related art because the wire width of the static electricity extraction path is narrow and the resistance is large and the breakdown of the insulation layer is likely to occur.
  • some embodiments of the present disclosure provide a display device, as shown in FIG. 1, including a display panel (including a lower substrate 1 and an upper substrate 2), and a housing 3 for sealing the display panel.
  • the display device further includes:
  • the metal skeleton 4 is connected to the grounding wire 8;
  • the conductor unit 6 disposed outside the sealant 5 of the display panel is connected to the upper substrate 2 and/or the lower substrate 1 of the display panel, and is connected to the metal skeleton 4.
  • the metal skeleton 4 is located between the display panel and the outer casing 3
  • the display device of some embodiments of the present disclosure multiplexes the metal skeleton in the outer casing into an electrostatically-derived path, which does not need to be limited by the wiring space, so that the electrostatic path has a small resistance, effectively preventing the static electricity from being insufficient due to the transmission path.
  • the phenomenon of breakdown of the insulating layer occurs.
  • the conductor unit 6 of some embodiments of the present disclosure may be connected to the upper substrate 2 of the display panel, or may be connected to the lower substrate 1 of the display panel, and the upper substrate 2 may be connected to eliminate the static electricity of the upper substrate 2, and the lower substrate 1 is the same.
  • the connection can eliminate the static electricity of the lower substrate 1.
  • the conductor unit 6 should be connected to the upper substrate 2 and the lower substrate 1 at the same time, thereby achieving a better electrostatic discharge effect.
  • some embodiments of the present disclosure are provided on the lower substrate 1 with a common electrode line 11 and an insulating layer 12 covering the common electrode line 11.
  • the insulating layer 12 includes a sealant 5 outside vias (oval dotted line in the figure);
  • the conductor unit 6 includes a conductive connection line 61 connected to the common electrode line 11 through the via hole.
  • the conductor unit 6 of some embodiments of the present disclosure can eliminate static electricity on the common electrode line 11.
  • the conductor unit 6 of some embodiments of the present disclosure further includes:
  • the conductive paste 62 covering the conductive connecting wire 61 is connected to the metal skeleton 4.
  • the conductive paste 62 has a sealing function capable of sealing the via holes on the insulating layer 12, thereby preventing the common electrode line 11 and the conductive connecting line 61 from being oxidized.
  • the conductive paste 62 can be easily coated, and is particularly suitable for electrically connecting the conductive connecting wire 61 to the metal skeleton 4.
  • some embodiments of the present disclosure are not limited to the use of the conductive adhesive 62 to connect the metal skeleton 4 and the conductive connection line 61. Any electrical connection manner is within the protection scope of the present disclosure.
  • the upper substrate 2 of some embodiments of the present disclosure is provided with a black matrix 21, wherein at least a portion of the black matrix 21 is located outside the sealant 5 .
  • the conductive paste 62 is in contact with a portion of the black matrix 21 located outside the sealant 5 to electrically connect the black matrix 21 to the metal skeleton 4 to achieve a destaticizing function.
  • the lower substrate 1 is provided with a common electrode line 11 and an insulating layer 12 covering the common electrode line 11.
  • the insulating layer 12 includes a sealing glue 5 located away from the display area 9. Side via 63.
  • the conductor unit includes a conductive connection line 61 connected to the common electrode line 11 through the via 121.
  • the upper substrate 2 is provided with a black matrix 21, at least a portion of which is located on the side of the sealant 5 away from the display area 9, and the conductive paste 62 is located on the black matrix 21.
  • the sealant 5 is in contact with a portion of the side away from the display area 9.
  • the orthographic projection of the via 121 in the insulating layer 12 on the lower substrate 1 at least partially overlaps the orthographic projection of the common electrode line 11 on the lower substrate 1.
  • the conductive connection line 61 extends into the via 121 in the insulating layer 12, in direct contact with the common electrode line 11.
  • the orthographic projection of the black matrix 21 on the lower substrate 1 at least partially overlaps the orthographic projection of the conductive connection lines 61 on the lower substrate 1.
  • the biostatic electricity on the body is introduced from the black matrix 21 of the upper substrate 2 to the inside of the display panel. It can be seen that some embodiments of the present disclosure electrically connect the black matrix 21 to the metal skeleton 4 using the conductor unit 6 to effectively prevent static electricity from affecting the display screen of the display panel, thereby providing a better experience for the user.
  • the printed circuit board PCB is disposed on the lower side of the display panel, and the conductive unit 6 is located on a side of the lower substrate away from the printed circuit board PCB, thereby avoiding interference with the printed circuit.
  • the conductive unit 6 of some embodiments of the present disclosure is two disposed on the left and right sides of the display panel, and each conductive unit 6 is disposed on the insulating layer at the installation area thereof corresponding to the via hole, thereby making the conductive connection line Connected to the common electrode line through the corresponding via.
  • the destaticization scheme of some embodiments of the present disclosure can be compatible with the destaticization scheme in the related art. As can be seen from the above, generally, electrostatic breakdown is more likely to occur on the side away from the printed circuit board PCB. Therefore, when the conductive unit 6 of some embodiments of the present disclosure is disposed away from the printed wiring board PCB, the defects of the related art destaticizing scheme can be compensated for.
  • the display device of some embodiments of the present disclosure has the following advantages in the above practical applications:
  • the metal skeleton of some embodiments of the present disclosure is a frame surrounding the display area, and the ground line is connected to the metal skeleton, so that the ground line setting restriction is relaxed;
  • the conductive unit of some embodiments of the present disclosure is not necessarily limited to being connected to the upper substrate through the black matrix, and may be other feasible solutions. It is connected to the color filter and/or the insulating layer of the upper substrate; similarly, the conductive unit is not necessarily limited to being connected to the common electrode line of the lower substrate, and as another feasible solution, the scanning line of the lower substrate and/or Or data cable connection. Therefore, any technical solution for electrically connecting the functional pattern on the upper substrate and/or the lower substrate to the grounded metal skeleton using the conductive unit should fall within the protection scope of the present disclosure.
  • a path between the ground line and the common electrode line, the data line, and the scan line is further provided with a low resistance bidirectional diode.
  • the potential of the common electrode line (data line and scan line) of some displays in the related art is a reasonable value of about 7V to 8V, instead of 0V. Therefore, it is only necessary to lower the potential of the common electrode to about 7V-8V.
  • the bidirectional diode of some embodiments of the present disclosure is turned on, thereby performing electrostatic discharge from the ground.
  • the bidirectional diode is turned off, thereby ending the electrostatic discharge.
  • the bidirectional diode of some embodiments of the present disclosure may be specifically disposed between the metal bobbin and the ground. Since the metal bobbin is the outer bezel area, the bidirectional diode does not occupy the middle display area, and the layout requirement is more flexible.
  • some embodiments of the present disclosure further provide a method of fabricating a display device, including the steps of fabricating a display panel and the step of using the outer casing to frame the display panel;
  • the steps of using the outer casing to frame the display panel include:
  • a metal skeleton 4 is disposed inside the outer casing 3 for supporting the outer casing 3, and the metal skeleton 4 is connected to the grounding wire 8;
  • the conductor unit 6 is disposed outside the sealant 5 of the display panel, and the conductor unit 6 is connected to the upper substrate 2 and/or the lower substrate 1 of the display panel, and is connected to the metal skeleton 4.
  • the manufacturing method of some embodiments of the present disclosure can eliminate the static electricity of the lower substrate 1 , so in the process of manufacturing the display device, the steps of manufacturing the display panel include:
  • a common electrode line 11 and an insulating layer 12 covering the common electrode line 11 are disposed on the lower substrate 1, and the insulating layer includes a via hole located outside the frame sealant (at the elliptical dotted line in FIG. 1);
  • the step of disposing the conductor unit 6 outside the sealant 5 of the display panel comprises:
  • a conductive connection line 61 is formed on the lower substrate 1, and the conductive connection line 61 is connected to the common electrode line 11 through the via.
  • the step of disposing the conductor unit 6 on the outside of the sealant 5 of the display panel further includes:
  • the conductive paste 62 is formed to cover the conductive connecting wire 61, and the conductive adhesive 62 is connected to the metal skeleton 4, so that the common electrode wire 11 is connected to the metal skeleton 4 through the conductive connecting wire 61 and the conductive adhesive 62, and then the ground wire is connected through the metal skeleton 4. 8.
  • the conductive paste 62 of some embodiments of the present disclosure may be made of a resin material doped with conductive particles (such as silver particles), and has a certain sealing property, and the conductive connecting wire can be avoided by covering the conductive connecting wire 61.
  • the 61 is oxidized by air, and at the same time, the via hole of the insulating layer 12 can be sealed to prevent the underlying common electrode line 11 from being oxidized.
  • Some embodiments of the present disclosure may form the conductive connection line 61 by a patterning process of the pixel electrode in the related art of the lower substrate, that is, the conductive connection line 61 and the pixel electrode in the related art are patterned by the same transparent conductive material layer. Therefore, the technical solutions of some embodiments of the present disclosure can be realized without additionally adding a manufacturing process based on the manufacturing process in the related art.
  • the manufacturing method of some embodiments of the present disclosure may further remove the static electricity of the upper substrate 2, that is, as shown in FIG. 1, the step of fabricating the display panel further includes:
  • a black matrix 21 is disposed on the upper substrate 2, and at least a portion of the black matrix 21 is located outside the sealant 5;
  • the conductive paste 62 prepared by some embodiments of the present disclosure is in contact with a portion of the black matrix 21 located outside the sealant 6 so that the black matrix 21 can be electrically connected to the ground 8 through the conductive paste 62 and the metal skeleton 4.
  • some embodiments of the present disclosure may specifically connect the metal bobbin 4 to the ground line 8 through the bidirectional diode 7 in the step of connecting the metal bobbin 4 to the ground line 8.
  • the bidirectional diode 7 When the upper potential of the common electrode line is greater than a threshold, It indicates that there is static electricity, and the bidirectional diode 7 is turned on at this time, so that the ground line 8 releases the potential on the common electrode, reducing the risk of breakdown of the insulating layer; when the potential on the common electrode line is lowered to a reasonable value, then two-way The diode 7 is turned off, thereby stopping the release process.

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Abstract

一种显示装置及其制作方法。其中，显示装置包括显示面板、用于封框所述显示面板的外壳（3）；设置在所述外壳（3）内部，用于支撑所述外壳（3）的金属骨架（4），所述金属骨架（4）连接地线（8）；设置在所述显示面板的封框胶（5）外侧的导体单元（6），所述导体单元（6）与所述显示面板的上基板（2）和/或下基板（1）连接，并与所述金属骨架（4）连接。

Description

一种显示装置及其制作方法
相关申请的交叉引用
本申请主张在2017年5月12日在中国提交的中国专利申请号No.201710333946.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示装置的制作领域，特别是指一种显示装置及其制作方法。
背景技术
目前显示产品常规的去静电方法是使用高电阻的二极管将显示基板上的电极引到PCB(印刷线路板)的地线上。由于显示屏向超薄窄边的方向发展，使得走线布置空间十分有限，接地线的线幅一般被制作的较窄，这样一来显示屏短边方向上的接地线的电阻为千欧姆量级，静电放电的电压可达到为10KV～100KV量级，可能会发生放电路径不够而击穿绝缘层的情况(静电难以传输释放)，并且这种风险，在远离PCB的位置更加容易发生。
上述问题已在信赖性实验中得到了验证，会影响到显示屏的使用寿命，有鉴于此，当前亟需一种全新的去静电方案。
发明内容
为实现上述目的，一方面，本公开的实施例提供一种显示装置，包括显示面板、用于封框所述显示面板的外壳，所述显示装置还包括：
设置在所述外壳内部，用于支撑所述外壳的金属骨架，所述金属骨架连接地线；
设置在所述显示面板的封框胶外侧的导体单元，所述导体单元与所述显示面板的上基板和/或下基板连接，并与所述金属骨架连接。
其中，所述下基板设置有公共电极线和覆盖所述公共电极线的绝缘层，所述绝缘层包括有位于所述封框胶外侧的过孔；
所述导体单元包括：通过所述过孔与所述公共电极线连接的导电连接线。
其中，所述导体单元还包括：
覆盖所述导电连接线的导电胶，所述导电胶与所述金属骨架连接。
其中，所述上基板设置有黑矩阵，所述黑矩阵至少一部分位于所述封框胶的外侧，所述导电胶与所述黑矩阵位于所述封框胶外侧的一部分接触。
其中，与所述下基板绑定设置的印刷线路板，所述导电单元位于所述下基板远离所述印刷线路板的一侧。
其中，所述金属骨架通过双向二极管连接地线。
其中，所述金属骨架位于所述显示面板和所述外壳之间。
其中，所述下基板设置有公共电极线和覆盖所述公共电极线的绝缘层，所述绝缘层包括位于所述封框胶远离所述显示区域一侧的过孔；
所述导体单元包括：通过所述过孔与所述公共电极线连接的导电连接线。
其中，所述上基板设置有黑矩阵，所述黑矩阵至少一部分位于所述封框胶远离所述显示区域一侧，所述导电胶与所述黑矩阵位于所述封框胶远离所述显示区域一侧的一部分接触。
其中，所述绝缘层中的过孔在所述下基板上的正投影与所述公共电极线在所述下基板上的正投影至少部分重叠。
其中，所述导电连接线伸入所述绝缘层中的过孔，与所述公共电极线直接接触。
其中，所述黑矩阵在所述下基板上的正投影与所述导电连接线在所述下基板上的正投影至少部分重叠。
另一方面，本公开的实施例还提供一种显示装置的制作方法，包括制作显示面板的步骤和使用外壳封框所述显示面板的步骤；
其中，使用外壳封框所述显示面板的步骤，包括：
在所述外壳内部设置金属骨架，以支撑所述外壳，并将所述金属骨架连接地线；
所述制作方法还包括：
在所述显示面板的封框胶外侧设置导体单元的步骤，所述导体单元与所述显示面板的上基板和/或下基板连接，并与所述金属骨架连接。
其中，制作显示面板的步骤包括：
在下基板上设置公共电极线和覆盖所述公共电极线的绝缘层，所述绝缘层包括有位于封框胶外侧的过孔；
在所述显示面板的封框胶外侧的设置导体单元的步骤，包括：
在所述下基板上形成导电连接线，所述导电连接线通过所述过孔与所述公共电极线连接。
其中，在所述显示面板的封框胶外侧设置导体单元的步骤，还包括：
形成覆盖所述导电连接线的导电胶，所述导电胶与所述金属骨架连接。
其中，制作显示面板的步骤还包括：
在上基板设置黑矩阵，所述黑矩阵至少一部分位于所述封框胶的外侧；
其中，所述导电胶与所述黑矩阵位于所述封框胶外侧的一部分接触。
附图说明
图1为本公开的显示装置的结构示意图；
图2为本公开的显示装置在实际应用中的结构示意图。
具体实施方式
为使本公开要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
针对相关技术中的去静电方案因静电导出路径的线幅较窄使得电阻较大而容易发生击穿绝缘层的问题，本公开提供一种解决方案。
一方面，本公开的一些实施例提供一种显示装置，如图1所示，包括显示面板(包括下基板1和上基板2)、用于封框显示面板的外壳3，显示装置还包括：
设置在外壳3内部，用于支撑外壳3的金属骨架4，该金属骨架4连接地线8；
设置在显示面板的封框胶5外侧的导体单元6，所述导体单元6与显示面板的上基板2和/或下基板1连接，并与金属骨架4连接。
本公开的一些实施例中，如图1所示，金属骨架4位于显示面板和外壳3之间
本公开的一些实施例的显示装置将外壳内的金属骨架复用为静电导出的路径，可不需要受到布线空间的限制，从而使得静电路径具有较小的电阻，有效避免了静电因传输路径不够而击穿绝缘层的现象发生。
下面结合实现方式对本公开的一些实施例的显示装置进行详细介绍。
本公开的一些实施例的导体单元6可以与显示面板的上基板2连接，也可以与显示面板的下基板1连接，与上基板2连接可消除上基板2的静电，同理与下基板1连接则可以消除下基板1的静电。
本公开的一些实施例中，导体单元6应同时连接上基板2和下基板1，从而达到更好的静电导出效果。
具体地，针对下基板1的去静电方式，本公开的一些实施例在该下基板1上设置有公共电极线11和覆盖公共电极线11的绝缘层12，绝缘层12包括有位于封框胶5外侧的过孔(图中椭圆形虚线处)；
其中，导体单元6包括：通过上述过孔与公共电极线11连接的导电连接线61。
从上述结构可以看出，本公开的一些实施例的导体单元6可以消除公共电极线11上的静电。
当然，在上述基础之上，本公开的一些实施例的导体单元6还包括：
覆盖导电连接线61的导电胶62，该导电胶62与金属骨架4连接。
显然，导电胶62具有密封作用，能够密封绝缘层12上的过孔，从而防止公共电极线11以及导电连接线61被氧化。
在实际应用中，导电胶62可以很易于涂覆设置，特别适用于将导电连接线61与金属骨架4电连接。当然，本公开的一些实施例也并不限于只能是使用导电胶62连接金属骨架4与导电连接线61，任何电连接方式均应属于本公开的保护范围之内。
对于上基板2去静电方案，则本公开的一些实施例的上基板2设置有黑矩阵21，其中，该黑矩阵21至少一部分位于封框胶5的外侧。导电胶62与黑矩阵21位于封框胶5外侧的一部分接触，从而将黑矩阵21电连接金属骨架4，以达到去静电功能。
本公开的一些实施例中，如图1、2所示，下基板1设置有公共电极线11 和覆盖公共电极线11的绝缘层12，绝缘层12包括位于封框胶5远离显示区域9一侧的过孔63。导体单元包括：通过过孔121与公共电极线11连接的导电连接线61。
本公开的一些实施例中，如图1、2所示，上基板2设置有黑矩阵21，黑矩阵21至少一部分位于封框胶5远离显示区域9一侧，导电胶62与黑矩阵21位于封框胶5远离显示区域9一侧的一部分接触。
本公开的一些实施例中，如图1所示，绝缘层12中的过孔121在下基板1上的正投影与公共电极线11在下基板1上的正投影至少部分重叠。
本公开的一些实施例中，如图1所示，导电连接线61伸入绝缘层12中的过孔121，与公共电极线11直接接触。
本公开的一些实施例中，如图1所示，黑矩阵21在下基板1上的正投影与导电连接线61在下基板1上的正投影至少部分重叠。
经不断验证发现，当用户与屏幕接触的过程中，身体上的生物静电会从上基板2的黑矩阵21导入至显示面板的内部。由此可见，本公开的一些实施例使用导体单元6将黑矩阵21电连接至金属骨架4上可有效避免静电影响显示面板显示画面，从而为用户提供了更好体验效果。
下面结合实际应用对本公开的一些实施例的显示装置进行详细介绍。
如图2所示，本公开的一些实施例的显示面板中，印刷线路板PCB设置在显示面板的下侧，则导电单元6位于下基板远离印刷线路板PCB的一侧，从而避免干扰印刷线路板PCB所加载的相关技术中的信号。
本公开的一些实施例的导电单元6为两个，分别设置在显示面板左右两侧的上方，每个导电单元6在其设置区域处的绝缘层上对应过孔设置，从而使其导电连接线通过对应的过孔与公共电极线连接。
可以知道的是，本公开的一些实施例的去静电方案可以与相关技术中的去静电方案相互兼容，通过上文介绍可以知道，一般静电击穿更容易发生在远离印刷线路板PCB的一侧，因此当本公开的一些实施例的导电单元6与印刷线路板PCB远离设置可以弥补相关技术中的去静电方案的缺陷。
综上所述，本公开的一些实施例的显示装置在上述实际应用中具有以下优点：
1)增加了新的导体单元和放电路径(金属骨架作为静电导出路径，使得ESD发生风险降低；
2)本公开的一些实施例的金属骨架是围绕显示区域的框体，地线与金属骨架连接，从而使得地线设置限制得到了放宽；
3)降低静电对PCB及其附近电子器件的冲击和损害。
以上是本公开的一些实施例的显示装置的示例性介绍，需要说明的是，本公开的一些实施例的导电单元并不一定只限于通过黑矩阵与上基板连接，作为其他可行方案，还可以是与上基板的彩色滤光片和/或绝缘层连接；同理，导电单元也不一定只限于与下基板的公共电极线连接，作为其他可行方案，还可以与下基板的扫描线和/或数据线连接。因此，但凡是使用导电单元将上基板和/或下基板上的功能图形与接地的金属骨架进行电连接的技术方案，都应属于本公开的保护范围。
此外，本公开的一些实施例中，地线与上述公共电极线、数据线、扫描线之间的路径上还以进一步设置有低阻值的双向二极管。这是因为相关技术中的部分显示器的公共电极线(数据线和扫描线同理)的电位在7V至8V左右为合理取值，而非0V。因此只需要将其公共电极的电位降低至7V-8V左右即可。当公共电极上线的电位大于一定门限后(如上述的7V-8V，可根据具体情况进行合理设置)，本公开的一些实施例的双向二极管才会导通，从而由地线进行静电释放。在释放过程中，当公共电极线的电位降低至上述门限左右时，双向二极管断开，从而结束静电释放。
当然，本公开的一些实施例的双向二极管可以具体设置在金属骨架与地线之间，由于金属骨架是外边框区域，因此双向二极管不会占用中间的显示区，对于布置要求更加灵活。
另一方面，本公开的一些实施例还提供一种显示装置的制作方法，包括制作显示面板的步骤和使用外壳封框所述显示面板的步骤；
参考图1所示，其中使用外壳封框所述显示面板的步骤包括：
在外壳3内部设置金属骨架4，以用于支撑外壳3，并将该金属骨架4连接地线8；
本公开的一些实施例的制作方法还包括：
在显示面板的封框胶5外侧设置导体单元6的步骤，该导体单元6与显示面板的上基板2和/或下基板1连接，并与金属骨架4连接。
显然，本公开的一些实施例的制作方法用于制作本公开提供的上述显示装置，因此该显示装置所能实现的技术效果，本公开的一些实施例的制作方法同样也能够实现。
具体地，本公开的一些实施例的制作方法可以消除下基板1的静电，因此在显示装置制作的过程中，制作显示面板的步骤包括：
在下基板1上设置公共电极线11和覆盖公共电极线11的绝缘层12，该绝缘层包括有位于封框胶外侧的过孔(图1椭圆形虚线处)；
对应地，在显示面板的封框胶5外侧的设置导体单元6的步骤，包括：
在下基板1上形成导电连接线61，该导电连接线61通过该过孔与公共电极线11连接。
对应地，在显示面板的封框胶5外侧设置导体单元6的步骤还包括：
形成覆盖导电连接线61的导电胶62，导电胶62与金属骨架4连接，从而使得上述公共电极线11通过导电连接线61、导电胶62与金属骨架4连接，进而通过金属骨架4连接地线8。
作为示例性介绍，本公开的一些实施例的导电胶62可以是掺杂有导电颗粒(如银质颗粒)的树脂材料制成，具有一定密封性，通过覆盖导电连接线61可以避免导电连接线61被空气氧化，同时还可以密封绝缘层12过孔，防止下方的公共电极线11也被氧化。
本公开的一些实施例可以通过下基板相关技术中的像素电极的构图工艺来制作导电连接线61，即导电连接线61与相关技术中的像素电极由同一透明导电材料层经图案化处理后形成，从而在相关技术中的制作工艺基础上不需要额外增加制作工序就可实现本公开的一些实施例的技术方案。
此外，本公开的一些实施例的制作方法还可以去除上基板2的静电，即如图1所示，上述制作显示面板的步骤还包括：
在上基板2设置黑矩阵21，黑矩阵21至少一部分位于封框胶5的外侧；
其中，本公开的一些实施例制作出的导电胶62与黑矩阵21位于封框胶6外侧的一部分接触，从而使得黑矩阵21能够通过导电胶62和金属骨架4 与地线8电连接。
通过上文描述可以知道，用户在进行触控操作时，其身体的生物静电容易从上基板2的黑矩阵中进入至显示面板内部，显然，基于本公开的一些实施例的方案，可以有效避免用户的生物静电干扰显示面板的正常显示。
此外，本公开的一些实施例在将该金属骨架4连接地线8的步骤中，可以具体将金属骨架4通过双向二极管7与地线8连接，当公共电极线的上电位大于一门限时，则说明存在静电，此时双向二极管7才会导通，使得地线8释放公共电极上的电位，降低击穿绝缘层的风险；当公共电极线上的电位被降低至合理数值时，则双向二极管7断开，从而停止释放过程。
以上所述是本公开的一些实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (17)

  1. 一种显示装置，包括：显示面板；
    用于封框所述显示面板的外壳；
    设置在所述外壳内部，用于支撑所述外壳的金属骨架，其中，所述金属骨架连接地线；以及
    设置在所述显示面板的封框胶远离显示区域一侧的导体单元，其中，所述导体单元与所述显示面板的上基板和下基板中的至少一个连接，并与所述金属骨架连接。
  2. 根据权利要求1所述的显示装置，其中，
    所述下基板设置有公共电极线和覆盖所述公共电极线的绝缘层，所述绝缘层包括位于所述封框胶靠近所述金属骨架一侧的过孔；
    所述导体单元包括：通过所述过孔与所述公共电极线连接的导电连接线。
  3. 根据权利要求2所述的显示装置，其中，
    所述导体单元还包括：
    覆盖所述导电连接线的导电胶，所述导电胶与所述金属骨架和所述导电连接线连接。
  4. 根据权利要求3所述的显示装置，其中，
    所述上基板设置有黑矩阵，所述黑矩阵至少一部分位于所述封框胶靠近所述金属骨架一侧，所述导电胶与所述黑矩阵位于所述封框胶靠近所述金属骨架一侧的一部分接触。
  5. 根据权利要求2所述的显示装置，还包括：
    与所述下基板绑定设置的印刷线路板，其中，所述导电单元位于所述下基板远离所述印刷线路板的一侧。
  6. 根据权利要求1所述的显示装置，其中，
    所述金属骨架通过双向二极管连接地线。
  7. 根据权利要求1所述的显示装置，其中，所述金属骨架位于所述显示面板和所述外壳之间。
  8. 根据权利要求1所述的显示装置，其中，
    所述下基板设置有公共电极线和覆盖所述公共电极线的绝缘层，所述绝缘层包括位于所述封框胶远离所述显示区域一侧的过孔；
    所述导体单元包括：通过所述过孔与所述公共电极线连接的导电连接线。
  9. 根据权利要求8所述的显示装置，其中，
    所述导体单元还包括：
    覆盖所述导电连接线的导电胶，所述导电胶与所述金属骨架和所述导电连接线连接。
  10. 根据权利要求9所述的显示装置，其中，
    所述上基板设置有黑矩阵，所述黑矩阵至少一部分位于所述封框胶远离所述显示区域一侧，所述导电胶与所述黑矩阵位于所述封框胶远离所述显示区域一侧的一部分接触。
  11. 根据权利要求8所述的显示装置，其中，所述绝缘层中的过孔在所述下基板上的正投影与所述公共电极线在所述下基板上的正投影至少部分重叠。
  12. 根据权利要求8所述的显示装置，其中，所述导电连接线伸入所述绝缘层中的过孔，与所述公共电极线直接接触。
  13. 根据权利要求10所述的显示装置，其中，所述黑矩阵在所述下基板上的正投影与所述导电连接线在所述下基板上的正投影至少部分重叠。
  14. 一种显示装置的制作方法，包括制作显示面板的步骤和使用外壳封框所述显示面板的步骤，其中，
    使用外壳封框所述显示面板的步骤，包括：
    在所述外壳内部设置金属骨架，以支撑所述外壳，并将所述金属骨架连接地线；
    所述制作方法还包括：
    在所述显示面板的封框胶远离显示区域一侧设置导体单元的步骤，所述导体单元与所述显示面板的上基板和下基板中的至少一个连接，并与所述金属骨架连接。
  15. 根据权利要求14所述的制作方法，其中，
    制作显示面板的步骤包括：
    在下基板上设置公共电极线和覆盖所述公共电极线的绝缘层，所述绝缘 层包括位于封框胶远离所述显示区域一侧的过孔；
    在所述显示面板的封框胶外侧的设置导体单元的步骤，包括：
    在所述下基板上形成导电连接线，所述导电连接线通过所述过孔与所述公共电极线连接。
  16. 根据权利要求15所述的制作方法，其中，
    在所述显示面板的封框胶远离所述显示区域一侧设置导体单元的步骤，还包括：
    形成覆盖所述导电连接线的导电胶，所述导电胶与所述金属骨架连接。
  17. 根据权利要求16所述的制作方法，其中，
    制作显示面板的步骤还包括：
    在上基板设置黑矩阵，所述黑矩阵至少一部分位于所述封框胶远离所述显示区域一侧；
    其中，所述导电胶与所述黑矩阵位于所述封框胶远离所述显示区域一侧的一部分接触。
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