WO2020071490A1 - Matériau d'emballage pour dispositifs de stockage d'électricité, dispositif de stockage d'électricité, procédés de production dudit matériau d'emballage pour dispositifs de stockage d'électricité, et procédé de fabrication dudit dispositif de stockage d'électricité - Google Patents
Matériau d'emballage pour dispositifs de stockage d'électricité, dispositif de stockage d'électricité, procédés de production dudit matériau d'emballage pour dispositifs de stockage d'électricité, et procédé de fabrication dudit dispositif de stockage d'électricitéInfo
- Publication number
- WO2020071490A1 WO2020071490A1 PCT/JP2019/039142 JP2019039142W WO2020071490A1 WO 2020071490 A1 WO2020071490 A1 WO 2020071490A1 JP 2019039142 W JP2019039142 W JP 2019039142W WO 2020071490 A1 WO2020071490 A1 WO 2020071490A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- storage device
- adhesive layer
- power storage
- image
- Prior art date
Links
- 238000003860 storage Methods 0.000 title claims abstract description 211
- 239000005022 packaging material Substances 0.000 title claims abstract description 138
- 230000005611 electricity Effects 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000010410 layer Substances 0.000 claims abstract description 443
- 239000012790 adhesive layer Substances 0.000 claims abstract description 193
- 239000000463 material Substances 0.000 claims abstract description 156
- 230000004888 barrier function Effects 0.000 claims abstract description 143
- 229920005989 resin Polymers 0.000 claims abstract description 134
- 239000011347 resin Substances 0.000 claims abstract description 134
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims description 71
- 150000001875 compounds Chemical class 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 36
- 230000001070 adhesive effect Effects 0.000 claims description 35
- 229910052797 bismuth Inorganic materials 0.000 claims description 20
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 19
- 230000001678 irradiating effect Effects 0.000 claims description 17
- 239000000049 pigment Substances 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 14
- 239000003792 electrolyte Substances 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 6
- 230000004308 accommodation Effects 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 16
- 239000002585 base Substances 0.000 description 136
- -1 fluororesin Polymers 0.000 description 82
- 239000010408 film Substances 0.000 description 68
- 238000011282 treatment Methods 0.000 description 58
- 229920000098 polyolefin Polymers 0.000 description 54
- 239000011888 foil Substances 0.000 description 35
- 238000007639 printing Methods 0.000 description 33
- 238000005260 corrosion Methods 0.000 description 28
- 230000007797 corrosion Effects 0.000 description 28
- 239000003795 chemical substances by application Substances 0.000 description 27
- 238000000576 coating method Methods 0.000 description 27
- 239000002345 surface coating layer Substances 0.000 description 27
- 239000000314 lubricant Substances 0.000 description 25
- 229910000838 Al alloy Inorganic materials 0.000 description 23
- 239000004743 Polypropylene Substances 0.000 description 23
- 229920001155 polypropylene Polymers 0.000 description 23
- 239000011342 resin composition Substances 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 21
- 150000001408 amides Chemical class 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 229920000642 polymer Polymers 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- 239000002253 acid Substances 0.000 description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 16
- 239000004952 Polyamide Substances 0.000 description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 16
- 239000003822 epoxy resin Substances 0.000 description 16
- 229910052757 nitrogen Inorganic materials 0.000 description 16
- 229920002647 polyamide Polymers 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- 125000004122 cyclic group Chemical group 0.000 description 15
- 239000000654 additive Substances 0.000 description 14
- 230000001965 increasing effect Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 13
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 230000000996 additive effect Effects 0.000 description 11
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 11
- 229920006284 nylon film Polymers 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 230000006870 function Effects 0.000 description 9
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 9
- 229920000728 polyester Polymers 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- 238000004566 IR spectroscopy Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 8
- 229920005672 polyolefin resin Polymers 0.000 description 8
- 150000004671 saturated fatty acids Chemical class 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 8
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 7
- 238000005238 degreasing Methods 0.000 description 7
- 238000009820 dry lamination Methods 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 239000010445 mica Substances 0.000 description 7
- 229910052618 mica group Inorganic materials 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 7
- 239000010452 phosphate Substances 0.000 description 7
- 229920006267 polyester film Polymers 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 229910000416 bismuth oxide Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 229910001416 lithium ion Inorganic materials 0.000 description 6
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229920002725 thermoplastic elastomer Polymers 0.000 description 6
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 6
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229920006318 anionic polymer Polymers 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 229920006317 cationic polymer Polymers 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000001747 exhibiting effect Effects 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 4
- 150000002484 inorganic compounds Chemical class 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 150000001622 bismuth compounds Chemical class 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 229910021563 chromium fluoride Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000010559 graft polymerization reaction Methods 0.000 description 3
- 238000007756 gravure coating Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000007649 pad printing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005604 random copolymer Polymers 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- CPUBMKFFRRFXIP-YPAXQUSRSA-N (9z,33z)-dotetraconta-9,33-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O CPUBMKFFRRFXIP-YPAXQUSRSA-N 0.000 description 2
- KVPQFVHBQUTWLQ-CVBJKYQLSA-N (z)-docos-13-enamide;ethene Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O KVPQFVHBQUTWLQ-CVBJKYQLSA-N 0.000 description 2
- FUSNPOOETKRESL-ZPHPHTNESA-N (z)-n-octadecyldocos-13-enamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCC\C=C/CCCCCCCC FUSNPOOETKRESL-ZPHPHTNESA-N 0.000 description 2
- VKLNMSFSTCXMSB-UHFFFAOYSA-N 1,1-diisocyanatopentane Chemical compound CCCCC(N=C=O)N=C=O VKLNMSFSTCXMSB-UHFFFAOYSA-N 0.000 description 2
- FYGFTTWEWBXNMP-UHFFFAOYSA-N 10-amino-10-oxodecanoic acid Chemical compound NC(=O)CCCCCCCCC(O)=O FYGFTTWEWBXNMP-UHFFFAOYSA-N 0.000 description 2
- XHSVWKJCURCWFU-UHFFFAOYSA-N 19-[3-(19-amino-19-oxononadecyl)phenyl]nonadecanamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCC1=CC=CC(CCCCCCCCCCCCCCCCCCC(N)=O)=C1 XHSVWKJCURCWFU-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- VYWRBUBXZALATG-UHFFFAOYSA-N 2-hydroxyoctadecanamide Chemical compound CCCCCCCCCCCCCCCCC(O)C(N)=O VYWRBUBXZALATG-UHFFFAOYSA-N 0.000 description 2
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 2
- 229910000014 Bismuth subcarbonate Inorganic materials 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 2
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 229920002873 Polyethylenimine Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229940049676 bismuth hydroxide Drugs 0.000 description 2
- MGLUJXPJRXTKJM-UHFFFAOYSA-L bismuth subcarbonate Chemical compound O=[Bi]OC(=O)O[Bi]=O MGLUJXPJRXTKJM-UHFFFAOYSA-L 0.000 description 2
- 229940036358 bismuth subcarbonate Drugs 0.000 description 2
- TZSXPYWRDWEXHG-UHFFFAOYSA-K bismuth;trihydroxide Chemical compound [OH-].[OH-].[OH-].[Bi+3] TZSXPYWRDWEXHG-UHFFFAOYSA-K 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 2
- 150000001718 carbodiimides Chemical class 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- PHFQLYPOURZARY-UHFFFAOYSA-N chromium trinitrate Chemical compound [Cr+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PHFQLYPOURZARY-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 150000001880 copper compounds Chemical class 0.000 description 2
- 238000005536 corrosion prevention Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- WMYWOWFOOVUPFY-UHFFFAOYSA-L dihydroxy(dioxo)chromium;phosphoric acid Chemical compound OP(O)(O)=O.O[Cr](O)(=O)=O WMYWOWFOOVUPFY-UHFFFAOYSA-L 0.000 description 2
- QXYJCZRRLLQGCR-UHFFFAOYSA-N dioxomolybdenum Chemical compound O=[Mo]=O QXYJCZRRLLQGCR-UHFFFAOYSA-N 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004146 energy storage Methods 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- SWSBIGKFUOXRNJ-CVBJKYQLSA-N ethene;(z)-octadec-9-enamide Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCC(N)=O SWSBIGKFUOXRNJ-CVBJKYQLSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- RKVQXYMNVZNJHZ-UHFFFAOYSA-N hexacosanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCC(N)=O RKVQXYMNVZNJHZ-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- BHIXMQGGBKDGTH-UHFFFAOYSA-N hexatetracontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O BHIXMQGGBKDGTH-UHFFFAOYSA-N 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 description 2
- 229910052809 inorganic oxide Inorganic materials 0.000 description 2
- 150000002500 ions Chemical group 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 2
- QIJSQGXDFAYEAF-UHFFFAOYSA-N n,n'-dioctadecylhexanediamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCC(=O)NCCCCCCCCCCCCCCCCCC QIJSQGXDFAYEAF-UHFFFAOYSA-N 0.000 description 2
- JHOKTNSTUVKGJC-UHFFFAOYSA-N n-(hydroxymethyl)octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCO JHOKTNSTUVKGJC-UHFFFAOYSA-N 0.000 description 2
- VMRGZRVLZQSNHC-ZCXUNETKSA-N n-[(z)-octadec-9-enyl]hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC VMRGZRVLZQSNHC-ZCXUNETKSA-N 0.000 description 2
- PECBPCUKEFYARY-ZPHPHTNESA-N n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC PECBPCUKEFYARY-ZPHPHTNESA-N 0.000 description 2
- KYMPOPAPQCIHEG-UHFFFAOYSA-N n-[2-(decanoylamino)ethyl]decanamide Chemical compound CCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCC KYMPOPAPQCIHEG-UHFFFAOYSA-N 0.000 description 2
- DJWFNQUDPJTSAD-UHFFFAOYSA-N n-octadecyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCCCCCCCC DJWFNQUDPJTSAD-UHFFFAOYSA-N 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- WGOROJDSDNILMB-UHFFFAOYSA-N octatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WGOROJDSDNILMB-UHFFFAOYSA-N 0.000 description 2
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- WOQDVIVTFCTQCE-UHFFFAOYSA-N pentacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WOQDVIVTFCTQCE-UHFFFAOYSA-N 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 229920005629 polypropylene homopolymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000009823 thermal lamination Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- QYIGOGBGVKONDY-UHFFFAOYSA-N 1-(2-bromo-5-chlorophenyl)-3-methylpyrazole Chemical compound N1=C(C)C=CN1C1=CC(Cl)=CC=C1Br QYIGOGBGVKONDY-UHFFFAOYSA-N 0.000 description 1
- 125000004066 1-hydroxyethyl group Chemical group [H]OC([H])([*])C([H])([H])[H] 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KKMOSYLWYLMHAL-UHFFFAOYSA-N 2-bromo-6-nitroaniline Chemical compound NC1=C(Br)C=CC=C1[N+]([O-])=O KKMOSYLWYLMHAL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- LZFNKJKBRGFWDU-UHFFFAOYSA-N 3,6-dioxabicyclo[6.3.1]dodeca-1(12),8,10-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=CC1=C2 LZFNKJKBRGFWDU-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- KSMVBYPXNKCPAJ-UHFFFAOYSA-N 4-Methylcyclohexylamine Chemical compound CC1CCC(N)CC1 KSMVBYPXNKCPAJ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NHRDBIJMWUQOGS-UHFFFAOYSA-L [Cr](=O)(=O)(O)OC(C)=O Chemical compound [Cr](=O)(=O)(O)OC(C)=O NHRDBIJMWUQOGS-UHFFFAOYSA-L 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- UHHXUPJJDHEMGX-UHFFFAOYSA-K azanium;manganese(3+);phosphonato phosphate Chemical compound [NH4+].[Mn+3].[O-]P([O-])(=O)OP([O-])([O-])=O UHHXUPJJDHEMGX-UHFFFAOYSA-K 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 1
- 229940036359 bismuth oxide Drugs 0.000 description 1
- 229940073609 bismuth oxychloride Drugs 0.000 description 1
- 229910000380 bismuth sulfate Inorganic materials 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 239000004301 calcium benzoate Substances 0.000 description 1
- 235000010237 calcium benzoate Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- QXDMQSPYEZFLGF-UHFFFAOYSA-L calcium oxalate Chemical compound [Ca+2].[O-]C(=O)C([O-])=O QXDMQSPYEZFLGF-UHFFFAOYSA-L 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- HZQXCUSDXIKLGS-UHFFFAOYSA-L calcium;dibenzoate;trihydrate Chemical compound O.O.O.[Ca+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 HZQXCUSDXIKLGS-UHFFFAOYSA-L 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 150000001785 cerium compounds Chemical class 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- OIDPCXKPHYRNKH-UHFFFAOYSA-J chrome alum Chemical compound [K]OS(=O)(=O)O[Cr]1OS(=O)(=O)O1 OIDPCXKPHYRNKH-UHFFFAOYSA-J 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- UBFMILMLANTYEU-UHFFFAOYSA-H chromium(3+);oxalate Chemical compound [Cr+3].[Cr+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O UBFMILMLANTYEU-UHFFFAOYSA-H 0.000 description 1
- WYYQVWLEPYFFLP-UHFFFAOYSA-K chromium(3+);triacetate Chemical compound [Cr+3].CC([O-])=O.CC([O-])=O.CC([O-])=O WYYQVWLEPYFFLP-UHFFFAOYSA-K 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- 229910000152 cobalt phosphate Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- BEQZMQXCOWIHRY-UHFFFAOYSA-H dibismuth;trisulfate Chemical compound [Bi+3].[Bi+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BEQZMQXCOWIHRY-UHFFFAOYSA-H 0.000 description 1
- PPNKDDZCLDMRHS-UHFFFAOYSA-N dinitrooxybismuthanyl nitrate Chemical class [Bi+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PPNKDDZCLDMRHS-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- VVTXSHLLIKXMPY-UHFFFAOYSA-L disodium;2-sulfobenzene-1,3-dicarboxylate Chemical compound [Na+].[Na+].OS(=O)(=O)C1=C(C([O-])=O)C=CC=C1C([O-])=O VVTXSHLLIKXMPY-UHFFFAOYSA-L 0.000 description 1
- GZCKIUIIYCBICZ-UHFFFAOYSA-L disodium;benzene-1,3-dicarboxylate Chemical compound [Na+].[Na+].[O-]C(=O)C1=CC=CC(C([O-])=O)=C1 GZCKIUIIYCBICZ-UHFFFAOYSA-L 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229910000734 martensite Inorganic materials 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- PDKHNCYLMVRIFV-UHFFFAOYSA-H molybdenum;hexachloride Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Mo] PDKHNCYLMVRIFV-UHFFFAOYSA-H 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- BWOROQSFKKODDR-UHFFFAOYSA-N oxobismuth;hydrochloride Chemical compound Cl.[Bi]=O BWOROQSFKKODDR-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- FTBATIJJKIIOTP-UHFFFAOYSA-K trifluorochromium Chemical compound F[Cr](F)F FTBATIJJKIIOTP-UHFFFAOYSA-K 0.000 description 1
- QWVYNEUUYROOSZ-UHFFFAOYSA-N trioxido(oxo)vanadium;yttrium(3+) Chemical compound [Y+3].[O-][V]([O-])([O-])=O QWVYNEUUYROOSZ-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 150000003658 tungsten compounds Chemical class 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/24—Distinguishing marks, e.g. colour coding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/14—Primary casings; Jackets or wrappings for protecting against damage caused by external factors
- H01M50/141—Primary casings; Jackets or wrappings for protecting against damage caused by external factors for protecting against humidity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the present invention relates to a packaging material for a power storage device, a power storage device, and a method for manufacturing these.
- a packaging material is an indispensable member for sealing power storage device elements such as electrodes and electrolytes.
- metal packaging materials have been frequently used as packaging for power storage devices.
- a packaging material for an electricity storage device that can be easily processed into various shapes and can be made thinner and lighter
- a base material layer on the outer layer side, a barrier layer, and a heat-fusible resin layer on the inner layer side have been developed.
- are sequentially laminated see, for example, Patent Document 1).
- a concave portion is formed by cold molding, and an electric storage device element such as an electrode or an electrolytic solution is arranged in a space formed by the concave portion.
- ink is printed on the surface of the base material layer to form barcodes, patterns, characters, etc., and is adhered on the base material layer on the printed side.
- a method of printing on a packaging material by a method of laminating an agent and a barrier layer (generally called back printing) has been widely adopted.
- back printing a method of laminating an agent and a barrier layer
- the adhesion between the base layer and the barrier layer is reduced, and delamination is likely to occur between the layers.
- the power storage device to which the power storage device packaging material is applied is required to have high security, such a method of printing by back printing is avoided in the power storage device packaging material. Therefore, conventionally, when forming a print such as a bar code on the packaging material for an electric storage device, a method of attaching a seal formed with the print to the surface of the outer layer is generally adopted.
- Pad printing is the following printing method. First, ink is poured into a concave portion of a flat plate on which a pattern to be printed is etched. Next, a silicon pad is pressed from above the concave portion to transfer the ink to the silicon pad. Next, the ink transferred to the surface of the silicon pad is transferred to a printing target to form a print on the printing target.
- the ink is transferred to the printing object using an elastic silicon pad or the like, so that it is easy to print on the surface of the formed power storage device packaging material, and the power storage device element is used for the power storage device.
- the power storage device element is used for the power storage device.
- a material that enables image formation on the power storage device packaging material by laser light irradiation between the outer layer and the barrier layer is included.
- the printing layer contains a material capable of forming an image, and is a thinly formed layer. Since the content of the binder resin is small and the adhesiveness is poor, the printing layer is formed between the base layer and the barrier layer. The adhesiveness is reduced by providing. Further, for example, when an adhesive layer is provided between the printing layer and the barrier layer in order to solve the problem of a decrease in adhesion due to the provision of the printing layer, the number of manufacturing steps of the power storage device packaging material and the power storage device increases. There is a problem of doing.
- the present invention between the base layer and the barrier layer, despite the fact that a layer containing a material capable of forming an image is provided, between the base layer and the barrier layer Since it has high adhesiveness and does not need to increase the output of laser light (the minimum output of laser light capable of forming an image properly can be reduced), the base by image formation using laser light is used.
- a main object is to provide a packaging material for an electric storage device in which deterioration of a material layer is suppressed.
- another object of the present invention is to provide a method for manufacturing the packaging material for a power storage device, a power storage device using the packaging material for a power storage device, and a method for manufacturing the power storage device.
- the present inventors have conducted intensive studies to solve the above-mentioned problems.
- at least a base layer, an adhesive layer, a barrier layer, and a laminate having a heat-fusible resin layer in this order the adhesive layer is in contact with the barrier layer, the adhesive
- the packaging material for an electricity storage device whose layer contains a material capable of forming an image by irradiation with laser light has a structure in which a layer containing a material capable of forming an image is provided between a base layer and a barrier layer.
- the high adhesion between the substrate layer and the barrier layer, and it is not necessary to increase the output of the laser light, so that the deterioration of the substrate layer due to the image formation using the laser light is suppressed. was found.
- the present invention has been completed by further study based on these findings.
- the present invention provides a packaging material for a power storage device and a power storage device according to the following aspects.
- Item 1 At least a positive electrode, a negative electrode, and a power storage device element including an electrolyte are housed in a package made of a power storage device packaging material, a power storage device,
- the packaging material for the electricity storage device is at least composed of a laminate including a base layer, an adhesive layer, a barrier layer, and a heat-fusible resin layer in this order, The adhesive layer is in contact with the barrier layer,
- Item 2. The adhesive layer includes a material that can form an image by irradiation with a laser beam.
- the electricity storage device has a content of the material capable of forming an image by laser light irradiation of 0.1 to 50% by mass.
- Item 3. Item 3. The power storage device according to Item 1 or 2, wherein the material capable of forming an image by irradiation with a laser beam includes a bismuth-based compound.
- Item 4. Item 4. The power storage device according to any one of Items 1 to 3, wherein the material capable of forming an image by irradiation with a laser beam includes a black pigment.
- Item 6. Item 6.
- the power storage device according to any one of Items 1 to 5, wherein an adhesive strength between the base layer and the barrier layer is 3 N / 15 mm or more.
- Item 7. The power storage device according to any one of Items 1 to 6, wherein an image is formed on the adhesive layer.
- Item 7. The power storage device according to any one of Items 1 to 6, wherein an image visible from the outside is formed.
- Item 9. At least, a base layer, an adhesive layer, a barrier layer, and a heat-fusible resin layer, which is composed of a laminate including in this order, The adhesive layer is in contact with the barrier layer,
- the adhesive layer includes a material that enables image formation by irradiation with laser light
- a method for producing a packaging material for a power storage device Item 11.
- a method for manufacturing a power storage device comprising: Item 12.
- the present invention high adhesion between the base material layer and the barrier layer is achieved despite the fact that a layer containing a material capable of forming an image is provided between the base material layer and the barrier layer. Since there is no need to increase the output of the laser light, it is possible to provide a packaging material for an electric storage device in which deterioration of the base layer due to image formation using laser light is suppressed. Further, according to the present invention, it is possible to provide a method for manufacturing the power storage device packaging material, a power storage device using the power storage device packaging material, and a method for manufacturing the power storage device.
- FIG. 1 It is a schematic diagram which shows an example of the cross-section of the packaging material for electrical storage devices of this invention. It is a schematic diagram which shows an example of the cross-section of the packaging material for electrical storage devices of this invention. It is a schematic diagram which shows an example of the cross-section of the packaging material for electrical storage devices of this invention. It is a schematic diagram which shows an example of the cross-section of the packaging material for electrical storage devices of this invention. SEM image (scanning electron microscope) of a cross section (a portion irradiated with laser) of the base material layer (biaxially stretched iron film) / adhesive layer / barrier layer (aluminum alloy foil) in the packaging material for an electric storage device of Example 1. Is an image obtained by observing the cross section.
- SEM image scanning electron microscope
- the packaging material for an electricity storage device of the present invention includes at least a substrate layer, an adhesive layer, a barrier layer, and a laminate including a heat-fusible resin layer in this order, and the adhesive layer includes a barrier layer and The adhesive layers are in contact with each other, and include a material capable of forming an image by irradiation with a laser beam.
- a packaging material for a power storage device a method for manufacturing the packaging material for a power storage device, a power storage device using the packaging material for a power storage device, and a method for manufacturing a power storage device of the present invention will be described in detail.
- the numerical range indicated by “to” means “more than” and “less than or equal to”.
- the notation of 2 to 15 mm means 2 mm or more and 15 mm or less.
- the energy storage device packaging material of the present invention comprises at least a base material layer 1, an adhesive layer 2, a barrier layer 3, and a heat-fusible resin. It consists of a laminate having layers 4 in this order.
- the base material layer 1 is on the outermost layer side
- the heat-fusible resin layer 4 is on the innermost layer. That is, at the time of assembling the power storage device, the heat-fusible resin layers 4 located on the periphery of the power storage device element are heat-sealed to seal the power storage device element, whereby the power storage device element is sealed.
- the adhesive layer 2 is in contact with the barrier layer 3.
- the adhesive layer 2 may or may not be in contact with the base material layer 1.
- an adhesive layer containing no material capable of forming an image may exist between the base material layer 1 and the adhesive layer 2. Deterioration of the base material layer 1 due to image formation using laser light without improving the adhesion between the base material layer 1 and the barrier layer 3 via the adhesive layer 2 and without increasing the output of laser light. It is preferable that the adhesive layer 2 is in contact with the base material layer 1 from the viewpoint of suppressing the above.
- the packaging material for an electric storage device of the present invention is bonded between a barrier layer 3 and a heat-fusible resin layer 4 as necessary for the purpose of enhancing their adhesiveness.
- a layer 5 may be provided.
- a surface coating layer 6 may be provided outside the base material layer 1 (on the side opposite to the heat-fusible resin layer 4) as necessary.
- the thickness of the laminate constituting the packaging device 10 for a power storage device of the present invention is not particularly limited, but from the viewpoint of reducing the thickness of the packaging material for a power storage device and increasing the energy density of the power storage device, for example, 180 ⁇ m
- the thickness is preferably 150 ⁇ m or less, more preferably about 60 to 180 ⁇ m, and still more preferably about 60 to 150 ⁇ m.
- each layer forming the packaging material for a power storage device [base layer 1]
- the base material layer 1 is a layer provided for the purpose of, for example, exhibiting a function as a base material of a packaging material for an electricity storage device.
- the base material layer 1 is located on the outer layer side of the packaging material for a power storage device.
- the material for forming the base material layer 1 is not particularly limited as long as it has a function as a base material, that is, at least an insulating property.
- the base layer 1 can be formed using, for example, a resin, and the resin may include an additive described below.
- the base layer 1 may be, for example, a resin film formed of a resin, or may be formed by applying a resin.
- the resin film may be an unstretched film or a stretched film.
- the stretched film include a uniaxially stretched film and a biaxially stretched film, and a biaxially stretched film is preferable.
- Examples of a stretching method for forming a biaxially stretched film include a sequential biaxial stretching method, an inflation method, and a simultaneous biaxial stretching method.
- the method for applying the resin include a roll coating method, a gravure coating method, and an extrusion coating method.
- Examples of the resin forming the base layer 1 include resins such as polyester, polyamide, polyolefin, epoxy resin, acrylic resin, fluororesin, polyurethane, silicon resin, and phenol resin, and modified products of these resins.
- the resin forming the base material layer 1 may be a copolymer of these resins or a modified product of the copolymer. Further, a mixture of these resins may be used.
- polyester and polyamide are preferable.
- polyester examples include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polyethylene isophthalate, and copolymerized polyester.
- copolymerized polyester examples include a copolymerized polyester mainly composed of ethylene terephthalate as a repeating unit.
- a copolymer polyester (hereinafter abbreviated to polyethylene (terephthalate / isophthalate)) which is polymerized with ethylene isophthalate with ethylene terephthalate as a main repeating unit, polyethylene (terephthalate / adipate), polyethylene (terephthalate / Sodium sulfoisophthalate), polyethylene (terephthalate / sodium isophthalate), polyethylene (terephthalate / phenyl-dicarboxylate), polyethylene (terephthalate / decanedicarboxylate) and the like.
- These polyesters may be used alone or in a combination of two or more.
- polyamide examples include aliphatic polyamides such as nylon 6, nylon 66, nylon 610, nylon 12, nylon 46, and a copolymer of nylon 6 and nylon 66; terephthalic acid and / or isophthalic acid.
- Hexamethylenediamine-isophthalic acid-terephthalic acid copolymerized polyamide such as nylon 6I, nylon 6T, nylon 6IT, and nylon 6I6T (I represents isophthalic acid and T represents terephthalic acid) containing a structural unit derived therefrom, polyamide MXD6 (polymethacrylate) Polyamide containing an aromatic compound such as silylene adipamide; alicyclic polyamide such as polyamide PACM6 (polybis (4-aminocyclohexyl) methane adipamide); and a lactam component or an isocyanate component such as 4,4'-diphenylmethane-diisocyanate.
- Polyamides obtained by copolymerizing, copolymerized polyamide and polyester or polyalkylene polyester amide copolymer is a copolymer of a polyether glycol and a polyether ester amide copolymers, polyamides such as a copolymer thereof. These polyamides may be used alone or in a combination of two or more.
- the base material layer 1 preferably includes at least one of a polyester film, a polyamide film, and a polyolefin film, and preferably includes at least one of a stretched polyester film, a stretched polyamide film, and a stretched polyolefin film, It is more preferable to include at least one of a stretched polyethylene terephthalate film, a stretched polybutylene terephthalate film, a stretched nylon film, and a stretched polypropylene film. It is further preferable that at least one of the biaxially stretched polypropylene films is included.
- the base material layer 1 may be a single layer or may be composed of two or more layers.
- the base material layer 1 may be a laminate in which a resin film is laminated with an adhesive or the like, or may be co-extruded with a resin to form two or more layers. It may be a laminated body of a resin film obtained.
- a laminate of resin films in which two or more layers are formed by co-extrusion of a resin may be used as the base material layer 1 without stretching, or may be used as the base material layer 1 by uniaxial stretching or biaxial stretching.
- a laminate of two or more resin films include a laminate of a polyester film and a nylon film, a laminate of two or more nylon films, and a laminate of two or more polyester films.
- Preferred are a laminate of a stretched nylon film and a stretched polyester film, a laminate of two or more stretched nylon films, and a laminate of two or more stretched polyester films.
- the base material layer 1 is a laminate of a two-layer resin film, a laminate of a polyester resin film and a polyester resin film, a laminate of a polyamide resin film and a polyamide resin film, or a laminate of a polyester resin film and a polyamide resin film.
- a laminate is preferable, and a laminate of a polyethylene terephthalate film and a polyethylene terephthalate film, a laminate of a nylon film and a nylon film, or a laminate of a polyethylene terephthalate film and a nylon film is more preferable.
- the base material layer 1 is a laminate of two or more resin films, for example, the polyester resin is hardly discolored when the electrolytic solution adheres to the surface. It is preferably located on the outermost layer.
- the two or more resin films may be laminated via an adhesive.
- Preferred adhesives include those similar to the adhesive exemplified in the adhesive layer 2 described later.
- the method for laminating two or more resin films is not particularly limited, and a known method can be employed. Examples thereof include a dry lamination method, a sandwich lamination method, an extrusion lamination method, and a thermal lamination method. A lamination method may be used.
- a polyurethane adhesive it is preferable to use a polyurethane adhesive as the adhesive.
- the thickness of the adhesive is, for example, about 2 to 5 ⁇ m.
- an anchor coat layer may be formed on the resin film and laminated.
- the anchor coat layer may be the same as the adhesive exemplified in the adhesive layer 2 described later. At this time, the thickness of the anchor coat layer is, for example, about 0.01 to 1.0 ⁇ m.
- additives such as a lubricant, a flame retardant, an antiblocking agent, an antioxidant, a light stabilizer, a tackifier, and an antistatic agent are present on at least one of the surface and the inside of the base material layer 1. Good. Only one type of additive may be used, or two or more types may be mixed and used.
- a lubricant is present on the surface of the base material layer 1 from the viewpoint of enhancing the moldability of the packaging material for an electric storage device.
- the lubricant is not particularly limited, but preferably includes an amide-based lubricant.
- Specific examples of the amide-based lubricant include, for example, saturated fatty acid amide, unsaturated fatty acid amide, substituted amide, methylolamide, saturated fatty acid bisamide, unsaturated fatty acid bisamide, fatty acid ester amide, aromatic bisamide and the like.
- saturated fatty acid amide examples include lauric amide, palmitic amide, stearic amide, behenic amide, and hydroxystearic amide.
- unsaturated fatty acid amide examples include oleic acid amide and erucic acid amide.
- substituted amide examples include N-oleyl palmitic amide, N-stearyl stearamide, N-stearyl oleamide, N-oleyl stearamide, N-stearyl erucamide, and the like.
- methylolamide examples include methylol stearamide.
- saturated fatty acid bisamide examples include methylene bisstearic acid amide, ethylenebiscapric acid amide, ethylenebislauric acid amide, ethylenebisstearic acid amide, ethylenebishydroxystearic acid amide, ethylenebisbehenic acid amide, hexamethylenebisstearin Acid amide, hexamethylenebisbehenamide, hexamethylenehydroxystearic acid amide, N, N'-distearyladipamide, N, N'-distearylsebacic amide and the like.
- unsaturated fatty acid bisamides include ethylene bisoleic acid amide, ethylene biserucic acid amide, hexamethylene bis oleic acid amide, N, N'-dioleyl adipamide, N, N'-dioleyl sebacic amide And the like.
- Specific examples of the fatty acid ester amide include stearoamidoethyl stearate.
- Specific examples of the aromatic bisamide include m-xylylenebisstearic acid amide, m-xylylenebishydroxystearic acid amide, N, N'-distearylisophthalic acid amide, and the like.
- One type of lubricant may be used alone, or two or more types may be used in combination.
- the amount thereof is not particularly limited, but is preferably about 3 mg / m 2 or more, more preferably about 4 to 15 mg / m 2 , and still more preferably 5 to 14 mg / m 2. / M 2 .
- the lubricant present on the surface of the base material layer 1 may be obtained by oozing out the lubricant contained in the resin constituting the base material layer 1 or by applying the lubricant to the surface of the base material layer 1. You may.
- the thickness of the substrate layer 1 is not particularly limited as long as it functions as a substrate, and is, for example, about 3 to 50 ⁇ m, preferably about 10 to 35 ⁇ m.
- the thickness of the resin film constituting each layer is preferably about 2 to 25 ⁇ m, respectively.
- the substrate layer 1 it is preferable to select a substrate through which the wavelength of the laser beam is easily transmitted as the substrate layer 1.
- the laser light used for image formation is, for example, a laser light having a wavelength of 1067 nm
- the base material layer 1 having a light transmittance of 1067 nm of 80% or more.
- a base material layer 1 a polyamide film, a polyester film, or the like is preferable.
- the light transmittance of the base material layer 1 can be measured by, for example, an ultraviolet-visible spectrophotometer (UV-1900) manufactured by Shimadzu Corporation.
- the adhesive layer 2 is a layer that firmly adheres the base layer 1 and the barrier layer 3 and that can form an image by irradiating the adhesive layer 2 with laser light. is there.
- the adhesive layer 2 is provided between the base material layer 1 and the barrier layer 3 and is in contact with the barrier layer 3.
- the adhesive layer 2 may or may not be in contact with the base material layer 1.
- an adhesive layer containing no material capable of forming an image may exist between the base material layer 1 and the adhesive layer 2.
- the adhesion between the base material layer 1 and the barrier layer 3 via the adhesive layer 2 is improved, and the deterioration of the base material layer 1 due to image formation using laser light is not required without increasing the output of laser light. From the viewpoint of suppression, it is preferable that the surface is in contact with the base material layer 1.
- the adhesive layer 2 is a layer on which an image can be formed by irradiating a laser beam, and may be in a state where an image is formed on the adhesive layer 2, A state in which no image is formed on the layer 2 may be employed. Even when an image is not formed on the adhesive layer 2 of the power storage device packaging material 10, an image can be formed on the adhesive layer 2 by irradiating the adhesive layer 2 with laser light.
- the color or brightness of the portion irradiated with the laser light changes due to the laser light irradiation, and it is visually recognized that an image is formed. That is, in the power storage device, the image formed outside is visually confirmed.
- the adhesive layer 2 is formed of an adhesive containing a material capable of forming an image on the power storage device packaging material 10 by irradiation with a laser beam, and an adhesive component capable of adhering the base layer 1 and the barrier layer 3. You.
- a material that can form an image by irradiation with laser light a conventionally known material can be used, and examples thereof include a bismuth compound and a black pigment.
- a coloring material that is colored by irradiation with laser light it is preferable to use, as the material, a coloring material that is colored by irradiation with laser light.
- a bismuth-based compound is preferably used as a color-forming material for suitably forming a color by irradiation with a laser beam.
- the bismuth-based compound is not particularly limited, and examples thereof include an organic salt of bismuth and / or an inorganic salt of bismuth.
- bismuth oxide; bismuth nitrate compounds such as bismuth nitrate and bismuth oxynitrate; bismuth halide compounds such as bismuth chloride; bismuth oxychloride, bismuth sulfate, bismuth acetate, bismuth citrate, bismuth hydroxide , Bismuth titanate, bismuth subcarbonate, and the like are preferable as a coloring material that is colored by a low-output laser beam.
- bismuth hydroxide, bismuth oxide, bismuth subcarbonate, and bismuth nitrate are particularly preferably used.
- the bismuth-based compound only one kind may be used, or two or more kinds may be used in combination.
- the content of the bismuth-based compound contained in the adhesive layer 2 is not particularly limited, but the adhesive layer 2 contains a material capable of forming an image. Nevertheless, high adhesion between the base material layer 1 and the barrier layer 3 via the adhesive layer 2 is exhibited, and furthermore, deterioration of each layer such as the base material layer 1 due to laser light irradiation is minimized.
- the lower limit is preferably about 0.1% by mass or more, more preferably about 1% by mass or more, further preferably about 2% by mass or more, and the upper limit is preferably about 50% by mass or less.
- the preferable range is about 0.1 to 50% by mass, about 0.1 to 30% by mass, 0.1 to 25% by mass.
- about 1% to 50% The amount% of about 1 to 30 wt%, about 1 to 25 wt%, about 2 to 50 wt%, about 2 to 30 wt%, about 2 to 25% by weight thereof.
- a black pigment such as carbon black in combination with a bismuth-based compound as a material capable of forming an image by irradiation with laser light.
- a bismuth-based compound and a black pigment together, it is possible to form an image on the adhesive layer 2 by irradiating a laser beam, so that the deterioration of the base layer 1 due to the image formation using the laser beam is suppressed. It can be suitably suppressed, and the adhesion between the base material layer and the barrier layer can be increased.
- a black pigment it is possible to form an image of another color (for example, white) by irradiating the adhesive layer 2 colored with a black color with laser light.
- the total content of the material capable of forming an image by irradiating a laser beam is not particularly limited, but includes a material capable of forming an image of the adhesive layer 2. Nevertheless, a high adhesion between the base material layer 1 and the barrier layer 3 is exhibited, the adhesive layer 2 is made black, and furthermore, the deterioration of each layer such as the base material layer due to the irradiation of the laser beam is suppressed.
- the lower limit is preferably about 0.1% by weight or more, more preferably about 1% by weight or more, further preferably about 2% by weight or more, and the upper limit is preferably about 50% by weight.
- % Or less more preferably about 30% by weight or less, further preferably about 25% by weight or less, and the preferable range is about 0.1 to 50% by weight, about 0.1 to 30% by weight, 0.1 to About 25% by mass, 1 About 50 wt%, about 1 to 30 wt%, about 1 to 25 wt%, about 2 to 50 wt%, about 2 to 30 wt%, about 2 to 25% by weight thereof.
- the material capable of forming an image by irradiation of laser light may include only a bismuth-based compound (particularly, bismuth oxide) of 4 to 4. Those containing about 30% by mass are exemplified. In the case where an image of another color (for example, white) is formed by irradiating a laser beam to the adhesive layer 2 colored black, it is possible to form an image by irradiating the laser beam.
- the material to be used include a material containing about 1 to 10% by mass of a bismuth-based compound (particularly, bismuth oxide) and about 10 to 20% by mass of a black pigment (particularly, carbon black).
- the mass ratio of the bismuth compound to the black pigment contained in the agent layer 2 is preferably about 1: 0.5 to 15, more preferably about 1: 0.8 to 15, More preferably, the ratio is about 1: 1 to 8.
- Coloring agents such as dyes and pigments, clays, and the like can be used as other materials capable of forming an image by laser beam irradiation.
- the total content of the material capable of forming an image by irradiation with a laser beam in the adhesive layer 2 is not particularly limited. From the viewpoint of exhibiting high adhesion between the base material layer 1 and the barrier layer 3 via the agent layer 2 and further minimizing the deterioration of each layer such as the base material layer 1 due to laser light irradiation,
- the lower limit is preferably about 0.1% by weight or more, more preferably about 1% by weight or more, and still more preferably about 2% by weight or more, and the upper limit is preferably about 50% by weight or less, more preferably about 50% by weight or less.
- the adhesive layer 2 may also include one or more inorganic compounds for improving the coloring efficiency.
- inorganic compounds include metal oxides such as titanium oxide, magnesium oxide, zinc oxide, aluminum oxide, silicon oxide, nickel oxide, tin oxide, neodymium oxide, mica, zeolite, kaolinite, copper compounds, and molybdenum. System compounds, copper / molybdenum composite oxides, copper / tungsten compounds, metal salts and the like.
- copper compound for example, copper oxide, copper halide, formic acid, citric acid, salicylic acid, lauric acid, oxalic acid, organic acid copper such as maleic acid, copper phosphate, and inorganic copper such as copper hydroxyphosphate are preferable. Can be used.
- molybdenum-based compound molybdenum, molybdenum dioxide, molybdenum trioxide, molybdenum chloride, and molybdate metal (metals: K, Zn, Ca, Ni, bismuth, Mg, etc.) can be preferably used.
- a salt of an acid such as sulfuric acid, nitric acid, oxalic acid, or carbonic acid and a metal such as barium, cobalt, magnesium, nickel, or iron can be used.
- the content of the inorganic compound in the adhesive layer 2 is preferably about 5 to 65% by mass.
- the adhesive component contained in the adhesive forming the adhesive layer 2 may be a two-component curing type or a one-component curing type.
- the bonding mechanism of the bonding component is not particularly limited, and may be any of a chemical reaction type, a solvent volatilization type, a hot-melt type, and a hot-pressure type.
- One of these adhesive components may be used alone, or two or more thereof may be used in combination.
- the content of the adhesive component in the adhesive layer 2 is not particularly limited, the base layer 1 with the adhesive layer 2 interposed therebetween despite the fact that the adhesive layer 2 contains a material capable of forming an image.
- the lower limit is set. Is preferably about 50% by weight or more, more preferably about 60% by weight or more, further preferably about 65% by weight or more, further preferably about 70% by weight or more, and still more preferably about 75% by weight or more.
- the preferred ranges are about 50 to 99.9% by mass, 50 to 99% by mass.
- the content of the adhesive component in the adhesive layer 2 may be determined by observing the cross-section of the adhesive layer 2 (for example, by observing a cross-section with a scanning electron microscope, energy dispersive X-ray analysis, or infrared absorption spectroscopy). Analysis method).
- the content of the material capable of forming an image by irradiating a laser beam in the adhesive layer 2 can be similarly measured by various known analysis methods.
- the adhesive strength between the base material layer 1 and the barrier layer 3 is preferably 3 N / 15 mm or more, more preferably 4 N / 15 mm or more, and further preferably 5 N / 15 mm or more. No.
- the upper limit of the adhesive strength is, for example, 6 N / 15 mm or less.
- the method for measuring the adhesive strength is as follows.
- a test sample is prepared by cutting out a packaging material for an electricity storage device (not irradiated with laser light) into a size of 100 mm in length and 15 mm in width. Next, using a tensile tester (for example, an autograph manufactured by Shimadzu Corporation), at a tensile speed of 200 mm / min, a peel angle of 180 °, and a distance between chucks of 50 mm, the base layer and the barrier layer of each test sample were tested. The space is peeled in the length direction, and the peel strength (N / 15 mm) is measured.
- the size is measured with a measurable size, and the adhesive strength is calculated by converting it to a width of 15 mm.
- the thickness of the adhesive layer 2 is high between the base layer 1 and the barrier layer 3 via the adhesive layer 2 even though the adhesive layer 2 includes a material capable of forming an image.
- the lower limit is preferably about 1 ⁇ m or more, from the viewpoint of demonstrating the adhesiveness and increasing the output of the laser light without the necessity of increasing the output of the laser light, and suppressing the deterioration of the base material layer 1 due to the image formation using the laser light. It is preferably about 2 ⁇ m or more, and the upper limit is preferably about 10 ⁇ m or less, more preferably about 5 ⁇ m or less, and the preferred range is about 1 to 10 ⁇ m, about 1 to 5 ⁇ m, about 2 to 10 ⁇ m, About 5 ⁇ m.
- YAG yttrium
- Al aluminum
- These lasers have a property of transmitting through a transparent body, and by utilizing the property, generation of smoke and the like at the time of image formation can be suppressed, and color development density and influence on each layer can be adjusted. As a result, even when an image is formed by a laser beam, an extremely clear image without holes or the like
- the power storage device packaging material of the present invention or the power storage device of the present invention described later by irradiating these laser beams from the base material layer 1 side, the deterioration of each layer such as the base material layer can be achieved at a low output.
- An image can be suitably formed on the adhesive layer 2 while minimizing it.
- the pulse condition of the laser beam is, for example, a pulse speed of 300 to 4000 mm / s, more preferably 1500 to 4000 mm / s, using a fiber laser machine (for example, Panasonic LPX-250, manufactured by SUNX Co., Ltd., wavelength 1060 nm). Conditions are used. By performing image formation under these conditions, high-speed image formation is possible and a clear image can be obtained.
- a fiber laser machine for example, Panasonic LPX-250, manufactured by SUNX Co., Ltd., wavelength 1060 nm.
- the image includes characters, numbers, symbols, designs, barcodes, patterns, logos, and the like, and the shape of the image is not limited to these.
- a clear image for example, a clear character can be formed even if the average output of the laser is set low or the scan speed is set high.
- the diameter of the discoloration area formed by laser beam spot irradiation is desirably about 40 ⁇ m to 1 mm, more preferably about 200 to 700 ⁇ m. A clear image is obtained in this discolored area. If the diameter of the discoloration area is smaller than this, loss of the image or thinning of the line width occurs, resulting in a lack of visibility. On the other hand, if it is larger than this, the image is undesirably destroyed.
- the diameter of the dots formed by the laser beam spot irradiation is, for example, about 80 to 500 ⁇ m.
- the barrier layer 3 is a layer that suppresses at least ingress of moisture.
- Examples of the barrier layer 3 include a metal foil having a barrier property, a vapor-deposited film, and a resin layer.
- Examples of the deposited film include a metal deposited film, an inorganic oxide deposited film, and a carbon-containing inorganic oxide deposited film, and examples of the resin layer include polyvinylidene chloride.
- Examples of the barrier layer 3 include a resin film provided with at least one of these deposited films and resin layers.
- a plurality of barrier layers 3 may be provided.
- the barrier layer 3 preferably includes a layer made of a metal material. Specific examples of the metal material forming the barrier layer 3 include an aluminum alloy, stainless steel, and titanium steel. When the metal material is used as the metal foil, it may include at least one of an aluminum alloy foil and a stainless steel foil. preferable.
- the aluminum alloy foil is more preferably a soft aluminum alloy foil made of, for example, an annealed aluminum alloy from the viewpoint of improving the formability of the packaging material for an electric storage device, and further improving the formability. Therefore, it is preferable to use an aluminum alloy foil containing iron.
- the iron content is preferably 0.1 to 9.0% by mass, and more preferably 0.5 to 2.0% by mass. When the iron content is 0.1% by mass or more, a packaging material for an electric storage device having more excellent moldability can be obtained. When the iron content is 9.0% by mass or less, a packaging material for an electric storage device having more excellent flexibility can be obtained.
- soft aluminum alloy foil examples include, for example, an aluminum alloy having a composition specified by JIS H4160: 1994 A8021HO, JIS H4160: 1994 A8079HO, JIS H4000: 2014 A8021PO, or JIS H4000: 2014 A8079PO. Foil.
- the stainless steel foil examples include austenitic, ferritic, austenitic / ferritic, martensitic, and precipitation hardening stainless steel foils. Further, from the viewpoint of providing a packaging material for an electricity storage device having excellent moldability, the stainless steel foil is preferably made of austenitic stainless steel.
- austenitic stainless steel constituting the stainless steel foil include SUS304, SUS301, SUS316L and the like, among which SUS304 is particularly preferred.
- the thickness of the barrier layer 3 may be at least a function as a barrier layer that suppresses intrusion of moisture, and is, for example, about 9 to 200 ⁇ m.
- the thickness of the barrier layer 3 is, for example, preferably about 85 ⁇ m or less, more preferably about 50 ⁇ m or less, still more preferably about 40 ⁇ m or less, particularly preferably about 35 ⁇ m or less, and the lower limit is preferably about 10 ⁇ m or more, more preferably about 20 ⁇ m or more, and more preferably about 25 ⁇ m or more.
- a preferable range of the thickness is about 10 to 85 ⁇ m, about 10 to 50 ⁇ m, about 10 to 40 ⁇ m, about 10 to 35 ⁇ m, or about 20 to About 85 ⁇ m, about 20 to 50 ⁇ m, about 20 to 40 ⁇ m, about 20 to 35 ⁇ m, about 25 to 85 ⁇ m, about 25 to 50 ⁇ m, about 25 to 40 ⁇ m, about 25 to 35 ⁇ m.
- the barrier layer 3 is made of an aluminum alloy foil, the above range is particularly preferable.
- the upper limit of the thickness of the stainless steel foil is preferably about 60 ⁇ m or less, more preferably about 50 ⁇ m or less, and still more preferably about 40 ⁇ m or less.
- the thickness is about 30 ⁇ m or less, particularly preferably about 25 ⁇ m or less, and the lower limit is preferably about 10 ⁇ m or more, more preferably about 15 ⁇ m or more, and the preferred thickness range is about 10 to 60 ⁇ m.
- the thickness is about 30 ⁇ m or less, particularly preferably about 25 ⁇ m or less, and the lower limit is preferably about 10 ⁇ m or more, more preferably about 15 ⁇ m or more, and the preferred thickness range is about 10 to 60 ⁇ m.
- the barrier layer 3 is a metal foil
- the barrier layer 3 may have a corrosion resistant film on both sides.
- the corrosion-resistant coating is, for example, a hot-water conversion treatment such as a boehmite treatment, a chemical conversion treatment, an anodic oxidation treatment, and a corrosion prevention treatment of applying a coating agent on the surface of the barrier layer.
- a thin film having properties eg, acid resistance, alkali resistance, etc.
- the corrosion-resistant coating specifically means a coating that improves the acid resistance of the barrier layer (acid-resistant coating), a coating that improves the alkali resistance of the barrier layer (alkali-resistant coating), and the like.
- the treatment for forming the corrosion resistant film one kind may be performed, or two or more kinds may be combined.
- the hydrothermal alteration treatment and the anodic oxidation treatment are treatments in which the surface of the metal foil is dissolved by a treating agent to form a metal compound having excellent corrosion resistance. Note that these processes may be included in the definition of the chemical conversion process.
- the barrier layer 3 has a corrosion-resistant film
- the barrier layer 3 includes the corrosion-resistant film.
- the corrosion-resistant film formed by the chemical conversion treatment various types are known, and at least one of a phosphate, a chromate, a fluoride, a triazine thiol compound, and a rare earth oxide is mainly used. And a corrosion-resistant film containing.
- a rare earth oxide a cerium compound is preferable, and among them, cerium oxide is preferable.
- Examples of the chemical conversion treatment using phosphate or chromate include chromate chromate treatment, phosphoric acid chromate treatment, phosphoric acid-chromate treatment, chromate treatment, and the like.
- Examples of the compound include chromium nitrate, chromium fluoride, chromium sulfate, chromium acetate, chromium oxalate, chromium biphosphate, acetyl chromate, chromium chloride, potassium chromium sulfate, and the like.
- Examples of the phosphorus compound used for these treatments include sodium phosphate, potassium phosphate, ammonium phosphate, and polyphosphoric acid.
- Examples of the chromate treatment include an etching chromate treatment, an electrolytic chromate treatment, and a coating type chromate treatment, and a coating type chromate treatment is preferable.
- a barrier layer for example, an aluminum alloy foil
- a known method such as an alkali immersion method, an electrolytic cleaning method, an acid cleaning method, an electrolytic acid cleaning method, and an acid activation method.
- a degreasing treatment is performed by a treatment method, and then a phosphate metal such as a Cr (chromium) salt, a Ti (titanium) phosphate, a Zr (zirconium) phosphate, or a Zn (zinc) salt is formed on the degreasing surface.
- the resin component used at this time include water-soluble polymers such as phenol and polyacrylic acid.
- An aminated phenol polymer having a repeating unit represented by the following general formulas (1) to (4) is used. Chromate treatment. In the aminated phenol polymer, the repeating units represented by the following general formulas (1) to (4) may be contained alone or in any combination of two or more. Is also good.
- X represents a hydrogen atom, a hydroxy group, an alkyl group, a hydroxyalkyl group, an allyl group or a benzyl group.
- R 1 and R 2 are the same or different and each represents a hydroxy group, an alkyl group, or a hydroxyalkyl group.
- examples of the alkyl group represented by X, R 1 and R 2 include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, A straight-chain or branched alkyl group having 1 to 4 carbon atoms such as a tert-butyl group is exemplified.
- Examples of the hydroxyalkyl group represented by X, R 1 and R 2 include a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group, a 1-hydroxypropyl group, a 2-hydroxypropyl group, A straight or branched chain having 1 to 4 carbon atoms, in which one hydroxy group such as hydroxypropyl group, 1-hydroxybutyl group, 2-hydroxybutyl group, 3-hydroxybutyl group and 4-hydroxybutyl group is substituted And an alkyl group.
- the alkyl group and the hydroxyalkyl group represented by X, R 1 and R 2 may be the same or different.
- X is preferably a hydrogen atom, a hydroxy group or a hydroxyalkyl group.
- the number average molecular weight of the aminated phenol polymer having the repeating units represented by the general formulas (1) to (4) is preferably, for example, about 500 to 1,000,000, and is preferably about 1,000 to 20,000. More preferred.
- the aminated phenol polymer is produced, for example, by subjecting a phenol compound or a naphthol compound to formaldehyde to polycondensation to produce a polymer comprising a repeating unit represented by the above general formula (I) or (III), And an amine (R 1 R 2 NH) to introduce a water-soluble functional group (—CH 2 NR 1 R 2 ) into the polymer obtained above.
- the aminated phenolic polymer is used alone or in combination of two or more.
- the corrosion-resistant film prevents delamination between a barrier layer (for example, an aluminum alloy foil) and a base material layer during molding of a packaging material for an electricity storage device, and is formed by hydrogen fluoride generated by a reaction between an electrolyte and moisture. , Dissolution and corrosion of the barrier layer surface, especially when the barrier layer is an aluminum alloy foil, to prevent aluminum oxide present on the barrier layer surface from dissolving and corroding, and adhesion (wetting) of the barrier layer surface And the effect of preventing delamination between the base layer and the barrier layer during heat sealing and preventing delamination between the base layer and the barrier layer during molding.
- a barrier layer for example, an aluminum alloy foil
- the corrosion resistant film is formed by a coating type corrosion prevention treatment in which a coating agent containing at least one selected from the group consisting of a rare earth oxide sol, an anionic polymer and a cationic polymer is applied. Thin film to be formed.
- the coating agent may further contain a phosphoric acid or a phosphate, and a crosslinking agent for crosslinking the polymer.
- fine particles of the rare earth oxide for example, particles having an average particle diameter of 100 nm or less
- the rare earth element oxide include cerium oxide, yttrium oxide, neodymium oxide, and lanthanum oxide.
- Cerium oxide is preferable from the viewpoint of further improving the adhesion.
- the rare earth element oxides contained in the corrosion resistant film can be used alone or in combination of two or more.
- various solvents such as water, an alcohol solvent, a hydrocarbon solvent, a ketone solvent, an ester solvent, and an ether solvent can be used, and water is preferable.
- the cationic polymer include polyethyleneimine, an ionic polymer complex composed of a polymer having polyethyleneimine and a carboxylic acid, a primary amine-grafted acrylic resin in which a primary amine is graft-polymerized on an acrylic main skeleton, polyallylamine or a derivative thereof.
- the anionic polymer is preferably a poly (meth) acrylic acid or a salt thereof, or a copolymer containing (meth) acrylic acid or a salt thereof as a main component.
- the crosslinking agent is at least one selected from the group consisting of a compound having any functional group of an isocyanate group, a glycidyl group, a carboxyl group, and an oxazoline group, and a silane coupling agent.
- the phosphoric acid or phosphate is preferably condensed phosphoric acid or condensed phosphate.
- a dispersion of metal oxides such as aluminum oxide, titanium oxide, cerium oxide, and tin oxide or fine particles of barium sulfate in phosphoric acid is applied to the surface of the barrier layer.
- metal oxides such as aluminum oxide, titanium oxide, cerium oxide, and tin oxide or fine particles of barium sulfate in phosphoric acid.
- the corrosion-resistant film may have a laminated structure in which at least one of a cationic polymer and an anionic polymer is further laminated, if necessary.
- a cationic polymer and an anionic polymer include those described above.
- composition of the corrosion-resistant coating can be performed, for example, using a time-of-flight secondary ion mass spectrometry.
- the amount of the corrosion-resistant film formed on the surface of the barrier layer 3 in the chemical conversion treatment is not particularly limited.
- a chromic acid compound per 1 m 2 of the surface of the barrier layer 3 is used.
- the phosphorus compound is, for example, about 0.5 to 50 mg, preferably about 1.0 to 40 mg, in terms of phosphorus
- the thickness of the corrosion-resistant coating is not particularly limited, but is preferably about 1 nm to 20 ⁇ m, more preferably 1 nm to 100 nm, from the viewpoint of the cohesion of the coating and the adhesion to the barrier layer and the heat-fusible resin layer. And more preferably about 1 nm to 50 nm.
- the thickness of the corrosion resistant film can be measured by observation with a transmission electron microscope or a combination of observation with a transmission electron microscope and energy dispersive X-ray spectroscopy or electron beam energy loss spectroscopy.
- the time-of-flight secondary ion mass spectrometry analysis of the composition of the corrosion resistant coating using, for example, secondary ion consisting Ce and P and O (e.g., Ce 2 PO 4 +, CePO 4 - at least 1, such as species) or, for example, secondary ion of Cr and P and O (e.g., CrPO 2 +, CrPO 4 - peak derived from at least one), such as is detected.
- secondary ion consisting Ce and P and O e.g., Ce 2 PO 4 +, CePO 4 - at least 1, such as species
- secondary ion of Cr and P and O e.g., CrPO 2 +, CrPO 4 - peak derived from at least one
- the chemical conversion treatment involves applying a solution containing a compound used for forming a corrosion-resistant film to the surface of the barrier layer by a bar coating method, a roll coating method, a gravure coating method, an immersion method, and the like. By heating to about 70 to 200 ° C.
- the barrier layer Before the chemical conversion treatment is performed on the barrier layer, the barrier layer may be subjected to a degreasing treatment by an alkali immersion method, an electrolytic cleaning method, an acid cleaning method, an electrolytic acid cleaning method, or the like in advance. By performing the degreasing treatment in this manner, it is possible to more efficiently perform the chemical conversion treatment on the surface of the barrier layer.
- heat-fusible resin layer 4 In the packaging material for an electricity storage device of the present invention, the heat-fusible resin layer 4 corresponds to the innermost layer, and the heat-fusible resin layers are heat-sealed with each other during assembly of the electricity storage device to seal the electricity storage device element. It is.
- the resin component used in the heat-fusible resin layer 4 is not particularly limited as long as it is heat-fusible, and examples thereof include polyolefin, cyclic polyolefin, acid-modified polyolefin, and acid-modified cyclic polyolefin. That is, the resin constituting the heat-fusible resin layer 4 may or may not contain a polyolefin skeleton, and preferably contains a polyolefin skeleton. The fact that the resin constituting the heat-fusible resin layer 4 contains a polyolefin skeleton can be analyzed by, for example, infrared spectroscopy or gas chromatography / mass spectrometry, and the analysis method is not particularly limited.
- a peak derived from maleic acid is detected in the vicinity of the wave number of 1760 cm -1 and near the wave number 1780 cm -1.
- the peak may be too small to be detected. In that case, it can be analyzed by nuclear magnetic resonance spectroscopy.
- polystyrene resin examples include polyethylene such as low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene; homopolypropylene, block copolymers of polypropylene (for example, block copolymers of propylene and ethylene), and polypropylene.
- Polypropylene eg, a random copolymer of propylene and ethylene
- terpolymer of ethylene-butene-propylene and the like.
- polyethylene and polypropylene are preferred.
- the cyclic polyolefin is a copolymer of an olefin and a cyclic monomer.
- the olefin constituting the cyclic polyolefin include ethylene, propylene, 4-methyl-1-pentene, styrene, butadiene, isoprene, and the like. Is mentioned.
- the cyclic monomer that is a constituent monomer of the cyclic polyolefin include a cyclic alkene such as norbornene; specifically, a cyclic diene such as cyclopentadiene, dicyclopentadiene, cyclohexadiene, and norbornadiene.
- a cyclic alkene is preferable, and norbornene is more preferable.
- the acid-modified polyolefin is a polymer obtained by modifying the polyolefin by block polymerization or graft polymerization with an acid component.
- the acid component used for the modification include carboxylic acids such as maleic acid, acrylic acid, itaconic acid, crotonic acid, maleic anhydride, and itaconic anhydride.
- the acid-modified cyclic polyolefin is obtained by copolymerizing a part of the monomers constituting the cyclic polyolefin in place of ⁇ , ⁇ -unsaturated carboxylic acid or its anhydride, or by adding ⁇ , ⁇ - to the cyclic polyolefin. It is a polymer obtained by subjecting an unsaturated carboxylic acid or its anhydride to block polymerization or graft polymerization.
- the cyclic polyolefin to be acid-modified is the same as described above.
- the acid component used for modification is the same as that used for modifying the polyolefin.
- acid-modified polyolefins preferred are acid-modified polypropylene.
- the heat-fusible resin layer 4 may be formed of one type of resin component alone, or may be formed of a blend polymer in which two or more types of resin components are combined. Further, the heat-fusible resin layer 4 may be formed of only one layer, or may be formed of two or more layers of the same or different resin components.
- a lubricant is preferably present on the surface of the heat-fusible resin layer 4 from the viewpoint of enhancing the moldability of the packaging material for an electric storage device. Since the lubricant is present on the surface of the heat-fusible resin layer 4 and the lubricant layer is formed, curl due to molding of the power storage device packaging material is suppressed, and the formability of the power storage device packaging material is improved. Can be.
- the lubricant is not particularly limited, and a known lubricant can be used. A lubricant may be used alone or in combination of two or more.
- the lubricant is not particularly limited, but preferably includes an amide lubricant.
- Specific examples of the lubricant include saturated fatty acid amide, unsaturated fatty acid amide, substituted amide, methylolamide, saturated fatty acid bisamide, unsaturated fatty acid bisamide and the like.
- Specific examples of the saturated fatty acid amide include lauric amide, palmitic amide, stearic amide, behenic amide, and hydroxystearic amide.
- Specific examples of the unsaturated fatty acid amide include oleic acid amide and erucic acid amide.
- substituted amide examples include N-oleyl palmitic amide, N-stearyl stearamide, N-stearyl oleamide, N-oleyl stearamide, N-stearyl erucamide, and the like.
- methylolamide examples include methylol stearamide.
- saturated fatty acid bisamide examples include methylene bisstearic acid amide, ethylenebiscapric acid amide, ethylenebislauric acid amide, ethylenebisstearic acid amide, ethylenebishydroxystearic acid amide, ethylenebisbehenic acid amide, hexamethylenebisstearin Acid amide, hexamethylenebisbehenamide, hexamethylenehydroxystearic acid amide, N, N'-distearyladipamide, N, N'-distearylsebacic amide and the like.
- unsaturated fatty acid bisamides include ethylene bisoleic acid amide, ethylene biserucic acid amide, hexamethylene bis oleic acid amide, N, N'-dioleyl adipamide, N, N'-dioleyl sebacic amide And the like.
- Specific examples of the fatty acid ester amide include stearoamidoethyl stearate.
- Specific examples of the aromatic bisamide include m-xylylenebisstearic acid amide, m-xylylenebishydroxystearic acid amide, N, N'-distearylisophthalic acid amide, and the like.
- One type of lubricant may be used alone, or two or more types may be used in combination.
- the amount of the lubricant present on the surface of the heat-fusible resin layer 4 is not particularly limited. From the viewpoint of improving the moldability of the packaging material for an electric storage device, it is preferably 10 in an environment at a temperature of 24 ° C. and a relative humidity of 60%. About 50 mg / m 2 , more preferably about 15 to 40 mg / m 2 .
- the heat-fusible resin layer 4 may contain a lubricant.
- the lubricant present on the surface of the heat-fusible resin layer 4 may be formed by exuding the lubricant contained in the resin constituting the heat-fusible resin layer 4, or may be formed by leaching the heat-fusible resin layer.
- the surface of No. 4 may be coated with a lubricant.
- the thickness of the heat-fusible resin layer 4 can be set according to the presence or absence of the adhesive layer 5, the thickness of the adhesive layer 5, and the like.
- the upper limit is, for example, about 100 ⁇ m or less, preferably about 85 ⁇ m or less, more preferably 60 ⁇ m or less
- the lower limit is, for example, about 15 ⁇ m or more, preferably 20 ⁇ m or more.
- the upper limit of the thickness of the heat-fusible resin layer 4 is preferably about 85 ⁇ m or less, more preferably about 60 ⁇ m or less.
- the lower limit is, for example, about 15 ⁇ m or more, preferably 20 ⁇ m or more, and the preferable range is about 15 to 85 ⁇ m, about 15 to 60 ⁇ m, about 20 to 85 ⁇ m, or about 20 to 60 ⁇ m.
- the thickness of the heat-fusible resin layer 4 is preferably about 20 ⁇ m or more, more preferably About 35 to 85 ⁇ m.
- the adhesive layer 5 is a layer provided as necessary between the barrier layer 3 and the heat-fusible resin layer 4 in order to firmly adhere them.
- the adhesive layer 5 is formed of a resin capable of bonding the barrier layer 3 and the heat-fusible resin layer 4.
- resin used for forming the adhesive layer 5 polyolefin resins such as the polyolefin, cyclic polyolefin, acid-modified polyolefin, and acid-modified cyclic polyolefin exemplified in the heat-fusible resin layer 4 described above can be suitably used.
- polyolefin resin polypropylene resins such as polypropylene, cyclic polypropylene, acid-modified polypropylene, and acid-modified cyclic polypropylene can be preferably used.
- the heat-fusible resin layer 4 and the adhesive layer 5 can be suitably formed by extrusion.
- the same resin as the adhesive exemplified in the adhesive layer 2 can be used.
- the polyolefin resin is preferably a polyolefin or an acid-modified polyolefin, and particularly preferably a polypropylene or an acid-modified polypropylene. That is, the resin constituting the adhesive layer 5 may or may not contain a polyolefin skeleton, and preferably contains a polyolefin skeleton.
- the fact that the resin constituting the adhesive layer 5 contains a polyolefin skeleton can be analyzed by, for example, infrared spectroscopy or gas chromatography / mass spectrometry, and the analysis method is not particularly limited.
- a peak derived from maleic acid is detected in the vicinity of the wave number of 1760 cm -1 and near the wave number 1780 cm -1.
- the peak may be too small to be detected. In that case, it can be analyzed by nuclear magnetic resonance spectroscopy.
- the adhesive layer 5 preferably contains an acid-modified polyolefin.
- the acid-modified polyolefin is a polymer obtained by modifying a polyolefin by block polymerization or graft polymerization with an acid component such as carboxylic acid.
- the acid component used for the modification include carboxylic acids such as maleic acid, acrylic acid, itaconic acid, crotonic acid, maleic anhydride, and itaconic anhydride, and anhydrides thereof.
- polystyrene resin examples include polyethylenes such as low-density polyethylene, medium-density polyethylene, high-density polyethylene, and linear low-density polyethylene; homopolypropylene, block copolymers of polypropylene (for example, block copolymers of propylene and ethylene), and polypropylenes.
- Polypropylene such as a random copolymer (for example, a random copolymer of propylene and ethylene); and a terpolymer of ethylene-butene-propylene.
- polyethylene and polypropylene are preferred.
- a maleic anhydride-modified polyolefin particularly, a maleic anhydride-modified polypropylene is preferable.
- the adhesive layer 5 is a resin composition containing an acid-modified polyolefin and a curing agent. More preferably, the cured product is Preferred examples of the acid-modified polyolefin include those described above.
- the adhesive layer 5 is a cured product of a resin composition containing an acid-modified polyolefin and at least one selected from the group consisting of a compound having an isocyanate group, a compound having an oxazoline group, and a compound having an epoxy group.
- the cured product is a cured product of a resin composition containing an acid-modified polyolefin and at least one selected from the group consisting of a compound having an isocyanate group and a compound having an epoxy group.
- the adhesive layer 5 preferably includes at least one selected from the group consisting of a urethane resin, an ester resin, and an epoxy resin, and more preferably includes a urethane resin and an epoxy resin.
- an amide ester resin is preferable.
- the amide ester resin is generally formed by a reaction between a carboxyl group and an oxazoline group.
- the adhesive layer 5 is more preferably a cured product of a resin composition containing at least one of these resins and the acid-modified polyolefin.
- an unreacted product of a compound having an isocyanate group, a compound having an oxazoline group, and a curing agent such as an epoxy resin remains in the adhesive layer 5, the presence of the unreacted product is determined by, for example, infrared spectroscopy. It can be confirmed by a method selected from Raman spectroscopy, time-of-flight secondary ion mass spectrometry (TOF-SIMS), and the like.
- the curing agent having a heterocyclic ring include a curing agent having an oxazoline group and a curing agent having an epoxy group.
- the curing agent having a C—O—C bond examples include a curing agent having an oxazoline group, a curing agent having an epoxy group, and a urethane resin.
- the fact that the adhesive layer 5 is a cured product of the resin composition containing these curing agents may be determined, for example, by gas chromatography mass spectrometry (GCMS), infrared spectroscopy (IR), time-of-flight secondary ion mass spectrometry (TOF) SIMS) and X-ray photoelectron spectroscopy (XPS).
- GCMS gas chromatography mass spectrometry
- IR infrared spectroscopy
- TOF time-of-flight secondary ion mass spectrometry
- XPS X-ray photoelectron spectroscopy
- the compound having an isocyanate group is not particularly limited, but from the viewpoint of effectively increasing the adhesion between the barrier layer 3 (or the corrosion resistant film) and the adhesive layer 5, a polyfunctional isocyanate compound is preferably used.
- the polyfunctional isocyanate compound is not particularly limited as long as it is a compound having two or more isocyanate groups.
- polyfunctional isocyanate-based curing agents include pentane diisocyanate (PDI), isophorone diisocyanate (IPDI), hexamethylene diisocyanate (HDI), tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), And a mixture thereof, a copolymer with another polymer, and the like.
- the content of the compound having an isocyanate group in the adhesive layer 5 is preferably in the range of 0.1 to 50% by mass, more preferably 0.5 to 40% by mass in the resin composition constituting the adhesive layer 5. More preferably, it is within the range.
- the compound having an oxazoline group is not particularly limited as long as it has a oxazoline skeleton.
- Specific examples of the compound having an oxazoline group include those having a polystyrene main chain and those having an acrylic main chain. Examples of commercially available products include Epocross series manufactured by Nippon Shokubai Co., Ltd.
- the proportion of the compound having an oxazoline group in the adhesive layer 5 is preferably in the range of 0.1 to 50% by mass, more preferably in the range of 0.5 to 40% by mass in the resin composition constituting the adhesive layer 5. Is more preferable. Thereby, the adhesion between the barrier layer 3 (or the corrosion resistant film) and the adhesive layer 5 can be effectively increased.
- the epoxy resin is not particularly limited as long as it is a resin capable of forming a crosslinked structure by an epoxy group present in the molecule, and a known epoxy resin can be used.
- the weight average molecular weight of the epoxy resin is preferably about 50 to 2,000, more preferably about 100 to 1,000, and further preferably about 200 to 800.
- the weight average molecular weight of the epoxy resin is a value measured by gel permeation chromatography (GPC) under the condition using polystyrene as a standard sample.
- epoxy resin examples include glycidyl ether derivatives of trimethylolpropane, bisphenol A diglycidyl ether, modified bisphenol A diglycidyl ether, novolak glycidyl ether, glycerin polyglycidyl ether, and polyglycerin polyglycidyl ether.
- One type of epoxy resin may be used alone, or two or more types may be used in combination.
- the proportion of the epoxy resin in the adhesive layer 5 is preferably in the range of 0.1 to 50% by mass, and more preferably in the range of 0.5 to 40% by mass in the resin composition constituting the adhesive layer 5. Is more preferred. Thereby, the adhesion between the barrier layer 3 (or the corrosion resistant film) and the adhesive layer 5 can be effectively increased.
- the adhesive layer 5 is a resin composition containing at least one selected from the group consisting of a compound having an isocyanate group, a compound having an oxazoline group, and an epoxy resin, and the acid-modified polyolefin.
- the acid-modified polyolefin functions as a main agent, and the compound having an isocyanate group, the compound having an oxazoline group, and the epoxy resin each function as a curing agent.
- the thickness of the adhesive layer 5 is preferably about 30 ⁇ m or less, more preferably about 20 ⁇ m or less, more preferably about 5 ⁇ m or less, and the lower limit is about 0.1 ⁇ m or more, about 0.5 ⁇ m or more, The thickness is preferably about 0.1 to 30 ⁇ m, about 0.1 to 20 ⁇ m, about 0.1 to 5 ⁇ m, about 0.5 to 30 ⁇ m, about 0.5 to 20 ⁇ m, and about 0.5 to about 20 ⁇ m. About 5 ⁇ m.
- a polycarbodiimide compound having at least two or more carbodiimide groups is preferable.
- the curing agent may be composed of two or more compounds.
- the content of the curing agent in the resin composition forming the adhesive layer 5 is preferably in the range of about 0.1 to 50% by mass, more preferably in the range of about 0.1 to 30% by mass. More preferably, it is in the range of about 0.1 to 10% by mass.
- the adhesive layer 5 can be suitably formed using, for example, an adhesive.
- the adhesive include a non-crystalline polyolefin resin (A) having a carboxyl group, a polyfunctional isocyanate compound (B), and a tertiary amine having no functional group that reacts with the polyfunctional isocyanate compound (B) ( C) and the polyfunctional isocyanate compound (B) in an amount of 0.3 to 10 mol based on 1 mol of the carboxyl group, based on 1 mol of the carboxyl group.
- those formed from an adhesive composition containing the tertiary amine (C) in a range of 1 to 10 mol are examples of the adhesive.
- the adhesive contains a styrene-based thermoplastic elastomer (A), a tackifier (B), and a polyisocyanate (C), and contains a styrene-based thermoplastic elastomer (A) and a tackifier (B). ),
- the styrene-based thermoplastic elastomer (A) is contained in an amount of 20 to 90% by weight, and the tackifier (B) is contained in an amount of 10 to 80% by weight in 100% by weight of the styrene-based thermoplastic elastomer (A).
- the tackifier (B) based on 1 mol of the active hydrogen derived from the styrene thermoplastic elastomer (A).
- the active hydrogen derived from the functional group is 0 to 15 mol
- the polyisocyanate (C) is composed of the active hydrogen derived from the styrene-based thermoplastic elastomer (A) and the active hydrogen derived from the tackifier (B).
- the total one mole of the sexual hydrogen may also be mentioned such as those isocyanate groups is formed by three-adhesive composition consisting of those that are included in a range of 150 mol.
- about the thickness of the adhesive layer 5 about a lower limit, Preferably about 2 micrometers or more, about 10 micrometers or more, about 13 micrometers or more, about 15 micrometers or more, about 20 micrometers or more are mentioned, About an upper limit, about 50 micrometers or less, about 45 micrometers or less.
- the preferred range is about 2 to 50 ⁇ m, about 10 to 50 ⁇ m, about 13 to 50 ⁇ m, about 15 to 50 ⁇ m, about 20 to 50 ⁇ m, about 2 to 45 ⁇ m, about 10 to 45 ⁇ m, about 13 to 45 ⁇ m, about 15 to 45 ⁇ m.
- the adhesive layer 5 it is preferable to use a polyolefin resin such as the polyolefin resin exemplified in the heat-fusible resin layer 4 and the acid-modified polyolefin resin.
- the lower limit of the thickness of the adhesive layer is about The thickness is preferably 10 ⁇ m or more and about 20 ⁇ m or more, and the upper limit is particularly preferably about 50 ⁇ m or less.
- the adhesive exemplified for the adhesive layer 2 can be used. In this case, the thickness of the adhesive layer is preferably about 2 to 10 ⁇ m and about 2 to 5 ⁇ m.
- the thickness is preferably about 30 ⁇ m or less, more preferably about 0.1 to 20 ⁇ m, and still more preferably about 0.5 to 5 ⁇ m.
- the thickness after drying and curing is about 1 to 30 g / m 2 .
- the base material layer 1 (the barrier layer of the base material layer 1) may be provided for the purpose of improving design, electrolytic solution resistance, abrasion resistance, and moldability.
- a surface coating layer 6 may be provided as necessary. The surface coating layer 6 is the outermost layer when the electric storage device is assembled.
- the surface coating layer 6 can be formed of, for example, polyvinylidene chloride, polyester resin, urethane resin, acrylic resin, epoxy resin, or the like. Among these, the surface coating layer 6 is preferably formed of a two-component curable resin. Examples of the two-component curable resin forming the surface coating layer 6 include a two-component curable urethane resin, a two-component curable polyester resin, and a two-component curable epoxy resin.
- the surface coating layer 6 may contain an additive.
- the additive to be added may function, for example, as a matting agent, and the surface coating layer may function as a mat layer.
- the surface coating layer is a mat layer
- An image is formed by the irradiation of light, so that a clear image can be formed.
- Examples of the additive include fine particles having a particle size of 0.5 nm to 5 ⁇ m.
- the material of the additive is not particularly limited, and examples thereof include metals, metal oxides, inorganic substances, and organic substances.
- the shape of the additive is not particularly limited, and examples thereof include a sphere, a fiber, a plate, an irregular shape, and a balloon.
- talc silica, graphite, kaolin, montmorilloid, montmorillonite, synthetic mica, hydrotalcite, silica gel, zeolite, aluminum hydroxide, magnesium hydroxide, zinc oxide, magnesium oxide, aluminum oxide, Neodymium oxide, antimony oxide, titanium oxide, cerium oxide, calcium sulfate, barium sulfate, calcium carbonate, calcium silicate, lithium carbonate, calcium benzoate, calcium oxalate, magnesium stearate, alumina, carbon black, carbon nanotubes, high Melting point nylon, crosslinked acrylic, crosslinked styrene, crosslinked polyethylene, benzoguanamine, gold, aluminum, copper, nickel and the like can be mentioned.
- additives may be used alone or in combination of two or more.
- silica, barium sulfate and titanium oxide are preferable from the viewpoint of dispersion stability and cost.
- various surface treatments such as an insulation treatment and a high dispersibility treatment may be applied to the surface of the additive.
- the method for forming the surface coating layer 6 is not particularly limited, and includes, for example, a method of applying a two-component curable resin for forming the surface coating layer 6 to one surface of the base material layer 1.
- the additive may be added to the two-component curable resin, mixed, and then applied.
- the surface coating layer 6 is transparent or translucent enough to transmit the laser light. It is preferred that the transparent and translucent include colored transparent and colored translucent.
- the thickness of the surface coating layer 6 is not particularly limited as long as the above-mentioned function as the surface coating layer 6 is exhibited, and is, for example, about 0.5 to 10 ⁇ m, preferably about 1 to 5 ⁇ m.
- the manufacturing method of packaging material for power storage device of the present invention at least the base layer 1, the adhesive layer 2, the barrier layer 3, and the heat-fusible resin layer 4 are in this order. Is provided. As described above, the adhesive layer 2 is laminated so as to be in contact with the barrier layer 3. Further, the adhesive layer 2 includes a material capable of forming an image by irradiating a laser beam. The details of the base material layer 1, the adhesive layer 2, the barrier layer 3, and the heat-fusible resin layer 4 are as described above. In the method for manufacturing a packaging material for an electric storage device of the present invention, the above-described adhesive layer 5 and surface coating layer 6 can be laminated as necessary.
- the adhesive layer 2 is irradiated with laser light from the base material layer 1 side of the electric storage device packaging material to form an image on the adhesive layer 2.
- a base material layer 1, an adhesive layer 2, a barrier layer 3, an adhesive layer 5 provided as needed, and a heat-fusible resin layer 4 are laminated to produce a packaging material for an electricity storage device.
- a laminate of the base material layer 1, the adhesive layer 2, and the barrier layer 3 is formed, and the adhesive layer 2 is irradiated with laser light from the base material layer 1 side of the laminate, and After forming an image, the adhesive layer 5 and the heat-fusible resin layer 4 provided as necessary may be laminated on the barrier layer 3 of the laminate to manufacture a packaging material for an electric storage device. Details of the laser light used for image formation and the irradiation conditions are as described above.
- a laminate in which the base material layer 1, the adhesive layer 2, and the barrier layer 3 are sequentially laminated (hereinafter, sometimes referred to as “laminate A”) is formed.
- the laminate A is formed by applying the adhesive used for forming the adhesive layer 2 to the base material layer 1 or the barrier layer 3 whose surface is subjected to a chemical conversion treatment, if necessary, by a gravure coating method or a roll method.
- a coating method such as a coating method
- the coating can be performed by a dry lamination method in which the barrier layer 3 or the base material layer 1 is laminated and the adhesive layer 2 is cured.
- the adhesive layer 5 and the heat-fusible resin layer 4 are laminated on the barrier layer 3 of the laminate A in this order.
- the laminate A and the heat-fusible resin layer 4 are Ri fit method (sandwich lamination method).
- the surface coating layer 6 When the surface coating layer 6 is provided, the surface coating layer 6 is laminated on the surface of the base material layer 1 on the side opposite to the barrier layer 3.
- the surface coating layer 6 can be formed, for example, by applying the above-described resin forming the surface coating layer 6 to the surface of the base material layer 1.
- the order of the step of laminating the barrier layer 3 on the surface of the substrate layer 1 and the step of laminating the surface coating layer 6 on the surface of the substrate layer 1 are not particularly limited.
- the barrier layer 3 may be formed on the surface of the base material layer 1 opposite to the surface coating layer 6.
- surface coating layer 6 / base layer 1 / adhesive layer 2 / barrier layer 3 whose surface has been subjected to chemical conversion treatment if necessary / adhesive layer 5 / heat-fusible resin provided as required A laminate composed of the layer 4 is formed.
- further heating such as a hot roll contact type, a hot air type, a near infrared type or a far infrared type is performed. It may be subjected to processing.
- the conditions of such a heat treatment include, for example, a temperature of 150 to 250 ° C. for 1 minute to 5 minutes.
- each layer constituting the laminate improves or stabilizes film forming properties, lamination processing, and suitability for secondary processing of final products (pouching, embossing) as required.
- a surface activation treatment such as a corona treatment, a blast treatment, an oxidation treatment, and an ozone treatment may be performed.
- the packaging material for power storage device of the present invention is used for a package for hermetically containing a power storage device element such as a positive electrode, a negative electrode, and an electrolyte. That is, a power storage device element including at least a positive electrode, a negative electrode, and an electrolyte is housed in a package formed of the power storage device packaging material of the present invention, and can be a power storage device of the present invention.
- a power storage device element including at least a positive electrode, a negative electrode, and an electrolyte is housed in a package formed of the power storage device packaging material of the present invention, and can be a power storage device of the present invention.
- an image may be formed on the adhesive layer 2 or an image may not be formed.
- the packaging material for a power storage device of the present invention in which an image is not formed on the adhesive layer 2 an image can be formed on the adhesive layer 2 after the power storage device containing the power storage device element is formed. For this reason, the packaging material for an electric storage device of the present invention in which an image is not formed on the adhesive layer 2 becomes an image forming body of the electric storage device.
- the heat-sealable resin layers of the flange portion are sealed by heat-sealing.
- the heat-fusible resin portion of the power storage device packaging material of the present invention is located inside (the surface in contact with the power storage device element). ) To form a package.
- the method for manufacturing a power storage device of the present invention includes: a housing step of housing a power storage device element having at least a positive electrode, a negative electrode, and an electrolyte in a package made of a power storage device packaging material; and any one of before and after the housing step.
- a step of irradiating the adhesive layer 2 with a laser beam to form an image may be provided. Thereby, an electricity storage device having an image formed on the adhesive layer 2 is obtained. Details of the laser beam used for image formation are as described above.
- the packaging material for an electricity storage device of the present invention may be used for any of a primary battery and a secondary battery.
- the type of the secondary battery is not particularly limited.
- a lithium ion battery, a lithium ion polymer battery, an all solid state battery, a lead storage battery, a nickel hydrogen storage battery, a nickel cadmium storage battery, a nickel iron storage battery, and a nickel zinc storage battery Silver oxide / zinc storage batteries, metal-air batteries, polyvalent cation batteries, capacitors, capacitors and the like.
- suitable applications of the packaging material for an electricity storage device of the present invention include lithium ion batteries, lithium ion polymer batteries, and all solid state batteries.
- a packaging material having a laminated structure in which a base material layer, a barrier layer, a heat-fusible resin layer, and the like are laminated is preferable.
- the packaging material for an electric storage device of the present invention can also be suitably used for these batteries.
- friction occurs on the surface of the outer layer during expansion and contraction and pressure restraint, and is easily peeled off by conventional printing. Therefore, the packaging material for an electric storage device of the present invention can be suitably used.
- Example 1-10 and Comparative Example 1-2 ⁇ Manufacture of packaging materials for power storage devices> A biaxially stretched nylon film (15 ⁇ m in thickness, light transmittance at 1067 nm of 80% or more) as a base layer and an aluminum alloy foil (35 ⁇ m in thickness) as a barrier layer were prepared.
- a resin composition having a composition shown in Table 1 was prepared as a resin composition for forming an adhesive layer for bonding them.
- a two-component urethane adhesive (a polyol compound and an aromatic isocyanate compound) was used as the resin composition, and a bismuth-based compound (bismuth oxide) and carbon black were used as materials capable of forming an image by laser light irradiation.
- a resin composition for forming an adhesive layer (thickness: 3 ⁇ m) is applied to one surface of the barrier layer by a dry lamination method, and a base layer is laminated on the resin composition by a dry lamination method.
- a laminate of the base material layer / adhesive layer / barrier layer was produced.
- a chemical conversion treatment was applied to both surfaces of the aluminum alloy foil.
- the chemical conversion treatment of the aluminum alloy foil is performed by a roll coating method using a treatment solution comprising a phenol resin, a chromium fluoride compound, and phosphoric acid so that the applied amount of chromium is 10 mg / m 2 (dry mass). And baking.
- a maleic anhydride-modified polypropylene (disposed on the barrier layer side, thickness: 15 ⁇ m) as an adhesive layer, and a random polypropylene (disposed on the innermost layer side) as a heat-fusible resin layer,
- the adhesive layer and the heat-fusible resin layer are respectively laminated on the barrier layer, and the base layer / adhesive layer / barrier layer / adhesive layer / heat-fusible resin layer is formed.
- a packaging material for a power storage device laminated in order was obtained.
- the adhesive layer is irradiated with laser light from the base layer side of each of the above-mentioned packaging materials for an electric storage device so that the laser beam has the optimum output (W (2000 mmsec)) in Table 1.
- a laser light irradiation device a fiber laser machine (LP-Z250, manufactured by Panasonic Device SUNX Co., Ltd., wavelength 1060 nm) was used, scan speed 2000 mm / sec, pulse period 40 ⁇ s, character size length 1
- An image was formed under the following conditions: 0.5 mm, 1.5 mm in width, 1.1 mm in character width, 0.3 mm in character line width, and character content "BEFMOQRWXUVYI1346890 +-".
- a test sample was prepared by cutting each of the packaging materials for the storage device (not irradiated with laser light) obtained by the above-mentioned “Production of packaging material for storage device” into a size of 100 mm in length and 15 mm in width. Next, using a tensile tester (Autograph manufactured by Shimadzu Corporation), the distance between the base material layer and the barrier layer of each test sample was set at a tensile speed of 200 mm / min, a peel angle of 180 °, and a distance between chucks of 50 mm. Peeling was performed in the length direction, and peel strength (N / 15 mm) was measured. Table 1 shows the results.
- the peel strength (N / 15 mm) of the packaging material for an electric storage device manufactured in the same manner as in Example 2 except that the chemical conversion treatment was not performed on both surfaces of the aluminum alloy foil was measured. .92 N / 15 mm. From this result, it can be seen that by subjecting the surface of the aluminum alloy foil to the chemical conversion treatment, the peel strength between the base material layer and the barrier layer is further improved.
- the packaging materials for power storage devices of Examples 1 to 10 are each composed of a laminate having a base layer, an adhesive layer, a barrier layer, and a heat-fusible resin layer in this order, and the adhesive layer is formed of a barrier layer and The adhesive layer includes a material that can form an image by irradiation with a laser beam.
- the adhesive layer is formed of a barrier layer and The adhesive layer includes a material that can form an image by irradiation with a laser beam.
- laser light is applied to the adhesive layer.
- the adhesive layer does not include a material that enables image formation by irradiation with laser light, and the minimum output of laser light capable of appropriately forming an image is too large.
- the substrate layer was significantly deteriorated.
- the output was half of the minimum output of Comparative Example 1, so that the deterioration of the base material layer was suppressed, but an appropriate image could not be formed.
- FIG. 4 shows an SEM image (section irradiated with laser) of a cross section of a base layer (biaxially stretched iron film) / adhesive layer / barrier layer (aluminum alloy foil) in the packaging material for an electric storage device of Example 1.
- 2 shows an image obtained by observing a cross section with a scanning electron microscope.
- the upper white layer is an aluminum foil
- the thin black layer immediately below is an adhesive layer
- the layer immediately below is a biaxially stretched nylon film. It can be seen that carbon black sublimes at the portion of the adhesive layer irradiated with the laser beam, whereby the interlayer is raised.
- a resin composition for forming an adhesive layer (thickness: 3 ⁇ m) is applied to one surface of the barrier layer by a dry lamination method, and the printed layer side of the base material layer is dried on the resin composition by a dry lamination method.
- the substrate was subjected to an aging treatment to produce a laminate of a base material layer / printing layer / adhesive layer / barrier layer.
- a chemical conversion treatment was applied to both surfaces of the aluminum alloy foil.
- the chemical conversion treatment of the aluminum alloy foil is performed by a roll coating method using a treatment solution comprising a phenol resin, a chromium fluoride compound, and phosphoric acid so that the applied amount of chromium is 10 mg / m 2 (dry mass). And baking.
- a maleic anhydride-modified polypropylene (disposed on the barrier layer side, thickness: 15 ⁇ m) as an adhesive layer, and a random polypropylene (disposed on the innermost layer side) as a heat-fusible resin layer, (Thickness: 20 ⁇ m)
- the adhesive layer and the heat-fusible resin layer are respectively laminated on the barrier layer
- the substrate layer / print layer / adhesive layer / barrier layer / adhesive layer / heat-fusible A packaging material for an electricity storage device in which resin layers were sequentially laminated was obtained.
- the peel strength of the obtained packaging material for an electric storage device was measured in the same manner as in Example 1-10 and Comparative Example 1-2. As a result, it was 2.15 N / 15 mm.
- the movement width was 100 mm
- the load 300 g
- the sample size was 250 mm (MD) ⁇ 2.5 mm (TD).
- the packaging for the electricity storage device produced in the same manner as in Comparative Example 3
- the printed layer was peeled off, and it was confirmed that the material was not suitable for application to an all-solid-state battery.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
Abstract
La présente invention concerne un matériau d'emballage pour dispositifs de stockage d'électricité, qui présente une adhérence élevée entre une couche de matériau de base et une couche barrière même si une couche contenant un matériau qui permet la formation d'une image est disposée entre la couche de matériau de base et la couche barrière, et qui ne nécessite pas d'amélioration de la sortie de lumière laser et donc supprime la détérioration de la couche de matériau de base 1 due à l'irradiation de la lumière laser. Ce matériau d'emballage pour dispositifs de stockage d'électricité est constitué d'un corps multicouche qui est pourvu séquentiellement d'au moins une couche de matériau de base, d'une couche adhésive, d'une couche barrière et d'une couche de résine thermofusible dans cet ordre ; la couche adhésive étant en contact surfacique avec la couche barrière ; et la couche adhésive contenant un matériau qui permet la formation d'une image au moyen d'une irradiation de lumière laser.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020513348A JP6769581B2 (ja) | 2018-10-03 | 2019-10-03 | 蓄電デバイス用包装材料、蓄電デバイス、及びこれらの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-188057 | 2018-10-03 | ||
JP2018188057 | 2018-10-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020071490A1 true WO2020071490A1 (fr) | 2020-04-09 |
Family
ID=70055201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/039142 WO2020071490A1 (fr) | 2018-10-03 | 2019-10-03 | Matériau d'emballage pour dispositifs de stockage d'électricité, dispositif de stockage d'électricité, procédés de production dudit matériau d'emballage pour dispositifs de stockage d'électricité, et procédé de fabrication dudit dispositif de stockage d'électricité |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP6769581B2 (fr) |
WO (1) | WO2020071490A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021172004A1 (fr) * | 2020-02-25 | 2021-09-02 | 凸版印刷株式会社 | Matériau d'emballage externe pour batteries tout solide, et batterie tout solide l'utilisant |
WO2022153965A1 (fr) * | 2021-01-18 | 2022-07-21 | 東洋紡株式会社 | Corps d'emballage imprimé au laser |
WO2022196397A1 (fr) * | 2021-03-17 | 2022-09-22 | 東洋紡株式会社 | Corps d'affichage stratifié imprimé au laser |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013505536A (ja) * | 2009-09-18 | 2013-02-14 | ヨウル チョン ケミカル カンパニー, リミテッド | セル用包装材およびその製造方法 |
JP2016122619A (ja) * | 2014-12-25 | 2016-07-07 | 藤森工業株式会社 | 非水系電池外装用積層体 |
JP2017130445A (ja) * | 2016-01-15 | 2017-07-27 | Fdk株式会社 | ラミネート型蓄電素子、カード型電子機器 |
JP2017157369A (ja) * | 2016-03-01 | 2017-09-07 | 大日本印刷株式会社 | 電池用包装材料の製造方法及び電池用包装材料の巻取体 |
WO2018074480A1 (fr) * | 2016-10-18 | 2018-04-26 | 三菱瓦斯化学株式会社 | Composition de résine ainsi que feuille de résine pour carte contenant celle-ci, et feuille multicouche |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4899317B2 (ja) | 2005-02-21 | 2012-03-21 | 大日本印刷株式会社 | 電池用包装材 |
JP5481765B2 (ja) | 2005-02-28 | 2014-04-23 | 大日本印刷株式会社 | 電池用包装材 |
JP5988695B2 (ja) | 2011-05-31 | 2016-09-07 | 藤森工業株式会社 | 電池外装用積層体 |
JP6513359B2 (ja) | 2014-09-29 | 2019-05-15 | 昭和電工パッケージング株式会社 | ラミネート外装材の製造方法 |
JP6738206B2 (ja) | 2016-06-06 | 2020-08-12 | 昭和電工パッケージング株式会社 | ラミネート材の製造方法 |
JP6738205B2 (ja) | 2016-06-06 | 2020-08-12 | 昭和電工パッケージング株式会社 | ラミネート材 |
JP6420424B2 (ja) | 2017-07-25 | 2018-11-07 | 藤森工業株式会社 | 電池外装用積層体 |
-
2019
- 2019-10-03 WO PCT/JP2019/039142 patent/WO2020071490A1/fr active Application Filing
- 2019-10-03 JP JP2020513348A patent/JP6769581B2/ja active Active
-
2020
- 2020-09-24 JP JP2020160132A patent/JP7459742B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013505536A (ja) * | 2009-09-18 | 2013-02-14 | ヨウル チョン ケミカル カンパニー, リミテッド | セル用包装材およびその製造方法 |
JP2016122619A (ja) * | 2014-12-25 | 2016-07-07 | 藤森工業株式会社 | 非水系電池外装用積層体 |
JP2017130445A (ja) * | 2016-01-15 | 2017-07-27 | Fdk株式会社 | ラミネート型蓄電素子、カード型電子機器 |
JP2017157369A (ja) * | 2016-03-01 | 2017-09-07 | 大日本印刷株式会社 | 電池用包装材料の製造方法及び電池用包装材料の巻取体 |
WO2018074480A1 (fr) * | 2016-10-18 | 2018-04-26 | 三菱瓦斯化学株式会社 | Composition de résine ainsi que feuille de résine pour carte contenant celle-ci, et feuille multicouche |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021172004A1 (fr) * | 2020-02-25 | 2021-09-02 | 凸版印刷株式会社 | Matériau d'emballage externe pour batteries tout solide, et batterie tout solide l'utilisant |
WO2022153965A1 (fr) * | 2021-01-18 | 2022-07-21 | 東洋紡株式会社 | Corps d'emballage imprimé au laser |
WO2022196397A1 (fr) * | 2021-03-17 | 2022-09-22 | 東洋紡株式会社 | Corps d'affichage stratifié imprimé au laser |
Also Published As
Publication number | Publication date |
---|---|
JP7459742B2 (ja) | 2024-04-02 |
JP6769581B2 (ja) | 2020-10-14 |
JP2021012880A (ja) | 2021-02-04 |
JPWO2020071490A1 (ja) | 2021-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7244206B2 (ja) | 包装材料及び電池 | |
WO2016158797A1 (fr) | Matériau d'emballage pour batteries, et batterie | |
JP7459742B2 (ja) | 蓄電デバイス用包装材料、蓄電デバイス、及びこれらの製造方法 | |
JP6724483B2 (ja) | 電池用包装材料を成形するための金型 | |
JP6519715B2 (ja) | 電池用包装材料、その製造方法、電池及びその製造方法 | |
WO2017209218A1 (fr) | Matériau d'emballage pour batterie ainsi que procédé de fabrication de celui-ci, batterie, et film polyester | |
JP7238403B2 (ja) | 電池用包装材料、その製造方法、及び電池 | |
WO2020235534A1 (fr) | Matériau extérieur pour dispositif de stockage d'énergie, procédé de fabrication associé, dispositif de stockage d'énergie et film de polyamide | |
JP2020155364A (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス | |
JP2023075950A (ja) | 電池用包装材料、その製造方法、電池用包装材料の巻取体、電池 | |
JP2020129543A (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス | |
WO2020085462A1 (fr) | Matériau de boîtier pour dispositif de stockage d'énergie, son procédé de production et dispositif de stockage d'énergie | |
WO2020085464A1 (fr) | Matériau de conditionnement pour dispositif de stockage d'énergie, son procédé de production et dispositif de stockage d'énergie | |
JP7234794B2 (ja) | 蓄電デバイス用外装材、その製造方法、蓄電デバイス、及びポリアミドフィルム | |
JP7414004B2 (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス | |
JP6662498B2 (ja) | 電池用包装材料、その製造方法、及び電池 | |
JP2023012724A (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス | |
WO2020075731A1 (fr) | Élément de soupape de batterie, procédé de fabrication dudit élément de soupape de batterie et batterie | |
JP7118038B2 (ja) | 蓄電デバイス用外装材、蓄電デバイス、及びこれらの製造方法 | |
WO2022210750A1 (fr) | Matériau extérieur pour dispositif de stockage d'énergie, dispositif de stockage d'énergie et son procédé de fabrication | |
JP7447797B2 (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス | |
WO2023022086A1 (fr) | Matériau d'emballage externe pour dispositifs de stockage d'énergie, son procédé de production et dispositif de stockage d'énergie | |
JP7435471B2 (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス | |
WO2021215538A1 (fr) | Matériau extérieur pour dispositif de stockage d'énergie, son procédé de fabrication et dispositif de stockage d'énergie | |
JP7332072B1 (ja) | 蓄電デバイス用外装材、その製造方法、及び蓄電デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2020513348 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19869793 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19869793 Country of ref document: EP Kind code of ref document: A1 |