WO2020055070A1 - Module de lumière et système de module d'ensemble de lumière - Google Patents

Module de lumière et système de module d'ensemble de lumière Download PDF

Info

Publication number
WO2020055070A1
WO2020055070A1 PCT/KR2019/011655 KR2019011655W WO2020055070A1 WO 2020055070 A1 WO2020055070 A1 WO 2020055070A1 KR 2019011655 W KR2019011655 W KR 2019011655W WO 2020055070 A1 WO2020055070 A1 WO 2020055070A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin layer
substrate
cover
light emitting
disposed
Prior art date
Application number
PCT/KR2019/011655
Other languages
English (en)
Korean (ko)
Inventor
이정주
박훈
한사름
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to US17/270,911 priority Critical patent/US20210193635A1/en
Priority to CN201980059552.0A priority patent/CN112703347B/zh
Priority to EP23215433.6A priority patent/EP4325587A3/fr
Priority to EP19860504.0A priority patent/EP3851735B1/fr
Priority to JP2021512876A priority patent/JP7432584B2/ja
Priority to CN202410024970.9A priority patent/CN117869824A/zh
Publication of WO2020055070A1 publication Critical patent/WO2020055070A1/fr
Priority to JP2024015830A priority patent/JP2024054205A/ja

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/66—Details of globes or covers forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/16—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F21S43/195—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/26—Refractors, transparent cover plates, light guides or filters not provided in groups F21S43/235 - F21S43/255
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/40—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the combination of reflectors and refractors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/04—Signs, boards or panels, illuminated from behind the insignia
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F21/00—Mobile visual advertising
    • G09F21/04—Mobile visual advertising by land vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/50—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by aesthetic components not otherwise provided for, e.g. decorative trim, partition walls or covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2103/00—Exterior vehicle lighting devices for signalling purposes
    • F21W2103/20—Direction indicator lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2103/00—Exterior vehicle lighting devices for signalling purposes
    • F21W2103/35—Brake lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • An embodiment of the invention relates to a lighting module and a lighting assembly having a light emitting device.
  • An embodiment of the invention relates to a lighting module and a lighting assembly providing a surface light source.
  • An embodiment of the invention relates to a light unit or a vehicle lamp having a lighting module or lighting assembly.
  • Typical lighting applications include backlights for displays and signs as well as vehicle lights.
  • the light emitting device for example, a light emitting diode (LED)
  • LED light emitting diode
  • the light emitting diode is applied to various display devices, various lighting devices such as indoor or outdoor lights.
  • a lamp employing a light emitting diode has been proposed. Compared to incandescent lamps, light emitting diodes are advantageous in that they consume less power.
  • the emission angle of the light emitted from the light emitting diode is small, when using the light emitting diode as a vehicle lamp, there is a need to increase the light emitting area of the lamp using the light emitting diode. Since the light emitting diode is small, it can increase the freedom of design of the lamp and is economical due to its semi-permanent life.
  • a resin layer is disposed on a plurality of light emitting elements and an illumination module emitting surface light can be provided.
  • An embodiment of the invention may provide an illumination module in which a plurality of resin layers are disposed on light emitting elements having a plurality of light exit surfaces.
  • An embodiment of the invention may provide an illumination module in which a wavelength conversion means is added to at least one of a plurality of resin layers on a substrate and a light emitting device.
  • An embodiment of the invention may provide an illumination module having ink particles on at least one of a plurality of resin layers disposed on a substrate and a light emitting device.
  • An embodiment of the invention may provide an illumination module having a wavelength conversion means in the resin layer spaced from the substrate and the light emitting element.
  • An embodiment of the invention may provide an illumination module having ink particles in a resin layer spaced apart from a substrate and a light emitting element.
  • An embodiment of the present invention may provide a lighting module in which phosphors and ink particles are added to at least one of a plurality of resin layers disposed on a substrate.
  • An embodiment of the invention may provide a lighting module in which ink particles are added to the uppermost layer among a plurality of resin layers disposed on a substrate and a light emitting device.
  • An embodiment of the present invention provides a flexible lighting module having a plurality of light emitting elements and a plurality of resin layers.
  • An embodiment of the present invention provides a lighting assembly capable of engaging a cover through an outer portion other than the light emitting area.
  • An embodiment of the present invention provides a lighting assembly including a first cover having an opening through which a resin layer protrudes, and a second cover below the substrate and the first cover.
  • An embodiment of the invention provides a lighting assembly having a coupling structure for coupling between the first and second covers.
  • An embodiment of the present invention provides a lighting module having improved light extraction efficiency and light distribution characteristics and a lighting assembly having the same.
  • a lighting assembly includes a substrate, a plurality of light emitting elements on the substrate, a first resin layer covering the plurality of light emitting elements, and at least one second resin layer on the first resin layer ; And a first cover disposed on the outer periphery of the substrate along the outer periphery of the substrate of the lighting module, wherein the second resin layer is disposed on the top and side surfaces of the first resin layer, and the second resin.
  • the layer includes at least one of phosphor and ink particles
  • the first cover includes an opening in which the second resin layer protrudes, a substrate cover portion disposed on an upper surface of the substrate around the opening portion, and the substrate cover portion. It includes a side cover portion extending lower than the side surface of the substrate, the upper surface of the substrate cover portion may be disposed lower than the top surface of the first resin layer.
  • a second cover including a substrate support under the substrate of the lighting module and a stepped coupling portion around the outer periphery of the substrate support, the coupling portion of the second cover is a side surface of the second cover
  • the cover portion can be combined.
  • the first and second covers may protrude from an area between the first and second covers, and may include a cable lead portion from which a power cable connected to the substrate is drawn.
  • the second cover includes a stepped groove in which a terminal of a lower surface of the substrate is exposed, and the stepped groove may be inclined in one side direction of the lighting module.
  • the distance between the side surface of the substrate and the side surface of the second resin layer may be 0.1 times or more the thickness of the lighting module.
  • the upper surface of the substrate and the upper surface of the second resin layer may include a convex curved surface.
  • the first cover may include a locking protrusion protruding in the direction of the substrate.
  • a plurality of openings are disposed in the first cover, and a plurality of lighting modules may respectively protrude from the opening.
  • a lighting assembly includes a substrate, a plurality of light emitting elements on the substrate, a first resin layer covering the plurality of light emitting elements, and at least one second resin layer on the first resin layer module; And a cover including a first cover disposed on the outer periphery of the substrate along the outer periphery of the substrate of the lighting module and a second cover supporting a lower portion of the lighting module, wherein the second resin layer comprises It is disposed on the surface of the first resin layer, and includes at least one of wavelength converting means and ink particles therein, and the first cover includes an opening in which the first and second resin layers protrude, and the substrate around the opening.
  • a substrate cover portion disposed on an upper surface of the substrate and a side cover portion extending from the substrate cover portion to a side surface of the substrate, wherein the cover is concave in the direction of the substrate from both sides adjacent to one end of the lighting module It may include a second coupling member.
  • the side surface of the second resin layer may include a convex curved surface.
  • the edge of the substrate may extend more outward than the lower circumference of the second resin layer.
  • the thickness of the lighting module may be 5.5 mm or less.
  • Each of the plurality of light emitting elements may be disposed on the substrate in a flip chip type.
  • the second resin layer includes a phosphor and ink particles in a resin material, and the content of the phosphor in the second resin layer is 23 wt% or less, and the content of the ink particles may range from 3 wt% to 13 wt%.
  • Lighting modules can be installed without the use of complex fixtures.
  • the lighting module can support and fix a portion other than the light emitting area.
  • FIG. 1 is a perspective view showing a lighting module according to a first embodiment.
  • FIG. 2 is a cross-sectional view taken along the line A-A of the lighting module of FIG. 1.
  • FIG. 3 is a view for explaining the curved portion of the second resin layer of FIG. 2.
  • FIG. 4 is a perspective view showing a curved portion of the first resin layer in the lighting module of FIG. 1.
  • FIG. 5 is a plan view illustrating a relationship according to a distance between the light emitting element and the first resin layer in FIG. 4.
  • FIG. 6 is a sectional view taken along line B-B in FIG. 4.
  • FIG. 7 is a view showing another example of the lighting module of FIG. 4.
  • FIG. 8 is a perspective view showing a lighting assembly having a lighting module according to a second embodiment.
  • FIG. 9 is a C-C cross-sectional view of the lighting assembly of FIG. 8.
  • FIG. 10 is a perspective view showing a lighting assembly having a lighting module according to a third embodiment.
  • FIG. 11 is a rear view of the lighting assembly of FIG. 11.
  • FIG. 12 is an exemplary view before combining the lighting assembly of FIG. 10 and the main frame.
  • FIG. 13 is a perspective view illustrating an example of a combination of the lighting assembly and the main frame of FIG. 12.
  • FIG. 14 is a side cross-sectional view showing the electrical contact structure of the lighting assembly in the coupling structure of FIG. 13.
  • FIG. 15 is a partially enlarged view of the coupling structure of FIG. 14.
  • 16 is a plan view of a lighting assembly according to a fourth embodiment.
  • FIG. 17 is an example of a cross-sectional side view of the lighting assembly of FIG. 16.
  • FIG. 18 is a perspective view of a lighting assembly and a main frame according to a fifth embodiment before combination.
  • FIG. 19 is a side view of the combination of the lighting assembly of FIG. 18 and the main frame.
  • FIG. 20 is a sectional view taken along line D-D in FIG. 19.
  • the terms used in the embodiments of the invention are for describing the embodiments and are not intended to limit the present invention.
  • a singular form may also include a plural form unless specifically stated in the phrase, and is combined with A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations.
  • terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term does not determine the essence, order, or order of the component.
  • the component when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also to the component It may also include a case of 'connected', 'coupled' or 'connected' due to another component between the other components.
  • the top (top) or bottom (bottom) when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other It also includes a case in which another component described above is formed or disposed between two components.
  • up (up) or down (down) it may include the meaning of the downward direction as well as the upward direction based on one component.
  • the lighting device according to the invention can be applied to various lamp devices that require lighting, such as a vehicle lamp, a home lighting device, or an industrial lighting device.
  • a vehicle lamp such as a vehicle lamp, a home lighting device, or an industrial lighting device.
  • vehicle lamps head lamps, car lights, side mirror lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, backup lamps It is applicable to back.
  • the lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields. In addition, it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or can be implemented according to future technological development.
  • FIG. 1 is a perspective view showing a lighting module according to a first embodiment
  • FIG. 2 is a cross-sectional view along the A-A side of the lighting module of FIG. 1
  • FIG. 3 is a view for explaining a curved portion of the second resin layer of FIG. 2.
  • the lighting module 100 may include a polyhedral shape, for example, a hexahedral shape.
  • the lighting module 100 may be formed in a structure capable of multi-faceted light emission. For example, light may be emitted from the top surface and the plurality of side surfaces of the lighting module 100. Although the lighting module 100 is illustrated as emitting light on five sides, it may be a six-sided light emitting module through which the light is emitted.
  • the lighting module 100 includes a substrate 110, a plurality of light emitting elements 120 disposed on the substrate 110, a first resin layer 130 disposed on the light emitting elements 120, and the agent.
  • the resin layer 130 may include one or a plurality of second resin layers 140.
  • the lighting module 100 can be applied to various lamp devices that require lighting, such as vehicle lamps, home lighting devices, and industrial lighting devices.
  • vehicle lamps such as vehicle lamps, home lighting devices, and industrial lighting devices.
  • a lighting module applied to a vehicle lamp a head lamp, a car width lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp ), Daytime running right, vehicle interior lighting, door scarf, rear combination lamp, backup lamp, etc.
  • the substrate 110 may include an insulating or conductive material.
  • the substrate 110 may be formed of a rigid or flexible material.
  • the substrate 110 may be formed of a transparent or opaque material.
  • the substrate 110 may include, for example, at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. .
  • the thickness of the substrate 110 may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the substrate 110 is provided thinly, the thickness of the lighting module may not be increased. Since the thickness of the substrate 110 is provided to 0.5 mm or less, it is possible to support a flexible module.
  • the thickness of the substrate 110 may be 0.1 times or less or a range of 0.1 times to 0.06 times the interval from the bottom surface of the substrate 110 to the top surface of the uppermost second resin layer 140.
  • a reflective layer (not shown) may be disposed on the substrate 110.
  • the reflective layer may be disposed between the substrate 110 and the first resin layer 130.
  • the reflective layer serves to guide light generated from the light emitting device 120 upward.
  • the reflective layer may include a white material.
  • the reflective layer may include a resin material.
  • the reflective layer may include a material of PMMA, silicon, or epoxy, and may include, for example, at least one of TiO 2 , SiO 2 , and Al 2 O 3 therein.
  • the distance from the lower surface of the substrate 110 to the upper surface of the uppermost second resin layer 140 may be a module thickness.
  • the thickness of the lighting module 100 may be 5.5 mm or less from the bottom of the substrate 110, or a range of 4.5 mm to 5.5 mm or a range of 4.5 mm to 5 mm.
  • the thickness of the lighting module 100 may be a straight line distance between the upper surface of the second resin layer 140 from the lower surface of the substrate 110.
  • the thickness of the lighting module 100 may be 220% or less, for example, 180% to 220% of the thickness of the first resin layer 130. Since the lighting module 100 has a thickness of 5.5 mm or less, it can be provided as a flexible and slim surface light source module.
  • the light emitted from the lighting module 100 having the above-described thickness may provide a surface light source with a uniform light distribution. That is, it is possible to reduce the hot spot of the surface light source and improve the light distribution.
  • the light emitting device 120 may be disposed on the substrate 110.
  • N number of light emitting elements 120 may be arranged in a first direction of the substrate 110, and M pieces may be arranged in a second direction orthogonal to the first direction.
  • the N, M may be 1 or more, or one of N or M may be 1 or more and the other may be 2 or more.
  • the light emitting devices 120 may be disposed at the same distance from each other in the first and second directions, or at least one may be arranged at different intervals. For example, the separation distance between the light emitting devices 120 may be arranged in the same way to effectively implement surface light.
  • the light emitting device 120 may be provided as an LED chip, and may emit blue, green, red, white, infrared, or ultraviolet light.
  • the light emitting device 120 may emit blue light in the range of 420 nm to 470 nm, for example.
  • the light emitting device 120 may be provided as a compound semiconductor.
  • the light emitting device 120 may be provided as, for example, a group 2-6 group or a group 3-5 compound semiconductor.
  • the light emitting device 120 includes at least two or more elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N). Can be.
  • the light emitting device 120 may include a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer.
  • the first and second conductivity-type semiconductor layers may be implemented as at least one of a group 3-5 group or a group 2-6 compound semiconductor.
  • the first and second conductivity-type semiconductor layers are, for example, semiconductors having a composition formula of In x Al y Ga 1 -x- y N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x + y ⁇ 1) It can be formed of a material.
  • the first and second conductivity-type semiconductor layers may include at least one selected from the group including GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, etc. .
  • the first conductivity-type semiconductor layer may be an n-type semiconductor layer doped with n-type dopants such as Si, Ge, Sn, Se, and Te.
  • the second conductivity type semiconductor layer may be a p-type semiconductor layer doped with p-type dopants such as Mg, Zn, Ca, Sr, and Ba.
  • the active layer may be implemented with a compound semiconductor.
  • the active layer may be embodied as at least one of a compound semiconductor of group 3-5 or 2-6.
  • the active layer may include a plurality of alternating well layers and a plurality of barrier layers, In x Al y Ga 1 -x- y N (0 ⁇ x ⁇ 1 , 0 ⁇ y ⁇ 1, 0 ⁇ x + y ⁇ 1).
  • the active layer is selected from the group comprising InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs It may include at least one.
  • the light emitting device 120 may emit light through the top surface and at least one side surface, and may emit light through, for example, the top surface and four side surfaces.
  • the light emitting device 120 includes a light-transmitting material substrate, and the light-transmitting material substrate may be disposed on the uppermost semiconductor layer.
  • the light emitting device 120 may be disposed on the substrate 110 in a flip chip type.
  • the first resin layer 130 may be disposed on the substrate 110 and the light emitting device 120.
  • the first resin layer 130 may be disposed on the top and side surfaces of the plurality of light emitting devices 120.
  • the first resin layer 130 may include an upper surface and a plurality of side surfaces.
  • the top surface of the first resin layer 130 may face the top surface of the plurality of light emitting elements 120, and a part of the side surface may face the side surfaces of the plurality of light emitting elements 120.
  • the side surface of the first resin layer 130 may be perpendicular to the upper surface of the substrate 110 or may include a curved surface. When the side surface of the first resin layer 130 faces the light emitting device 120, light emitted through the side surface of the first resin layer 130 may be lost without contributing to light distribution.
  • the side surface of the first resin layer 130 may include a curved surface, for example, a convex curved surface.
  • a boundary portion between an upper surface and a side surface may be a curved surface.
  • the curved surface portion may be continuously connected to the top and side surfaces of the first resin layer 130.
  • the curved portion may be an edge portion of an upper surface of the first resin layer 130 or an edge portion of side surfaces.
  • the first resin layer 130 may be made of a transparent resin material, for example, a resin material such as UV (Ultra violet) resin, silicone or epoxy.
  • a resin material such as UV (Ultra violet) resin, silicone or epoxy.
  • UV resin for example, a resin (oligomeric type) having a urethane acrylate oligomer as a main raw material may be used as the main material.
  • a urethane acrylate oligomer that is a synthetic oligomer can be used.
  • the main material may further include a monomer having a low-boiling-point dilution-type reactive monomer, such as isobornyl acrylate (IBA), hydroxybutyl acrylate (HBA), and hydroxy metaethyl acrylate (HEMA), and may include a photoinitiator (eg, 1-hydroxycyclohexyl) as an additive.
  • a photoinitiator eg, 1-hydroxycyclohexyl
  • Phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide), or an antioxidant may be mixed.
  • the UV resin may be formed of a composition comprising 10 to 21% oligomer, 30 to 63% monomer, and 1.5 to 6% additive.
  • the monomer may be composed of a mixture of IBOA (isobornyl Acrylate) 10-21%, HBA (Hydroxybutyl Acrylate) 10-21%, HEMA (Hydroxy Metaethyl Acrylate) 10-21%.
  • the additive may be added to 1 to 5% of a photoinitiator to perform a function of initiating photoreactivity, and may be formed of a mixture capable of improving yellowing by adding 0.5 to 1% of an antioxidant.
  • the first resin layer 130 forms a layer with a resin such as UV resin instead of a light guide plate, so that the refractive index and thickness can be adjusted, and at the same time, adhesion properties and reliability using the above-described composition And it can be made to meet both the mass production speed.
  • the first resin layer 130 may further include a beads or dispersing agent therein.
  • the diffusion agent may have a spherical shape, and its size may range from 4 ⁇ m to 6 ⁇ m. The shape and size of the diffusion agent is not limited thereto.
  • the content of the diffusion agent may be 5 wt% or less, for example, 2 wt% to 5 wt% in the first resin layer 130.
  • the diffusion agent is disposed in the first resin layer 130 at the content, thereby diffusing light to reduce hot spots without deteriorating light transmittance.
  • the diffusion agent of the first resin layer 130 may be removed.
  • the first resin layer 130 is formed as one layer, but is not limited thereto and may include two or more resin layers.
  • the first resin layer 130 may include a light-transmitting layer that does not contain impurities and a diffusion layer containing a diffusion agent on the light-transmitting layer. Alternatively, a diffusion layer can be formed under the light-transmitting layer.
  • the second resin layer 140 may be formed on the first resin layer 130.
  • the second resin layer 140 may include a transparent material or a transparent insulating material.
  • the second resin layer 140 may be molded on the surface of the first resin layer 130.
  • the second resin layer 140 may be made of a resin material such as epoxy or silicone.
  • the second resin layer 140 may be made of silicon, or may be made of silicon having different chemical bonds.
  • Silicone is a polymer in which inorganic silicon and organic carbon are combined, and has properties such as thermal stability, chemical stability, abrasion resistance, glossiness, and reactivity, solubility, elasticity, and processability of organic materials. Silicone may include general silicone and fluorine silicone having a high fluorine ratio.
  • the second resin layer 140 may include a wavelength conversion means that receives light emitted from the light emitting device 120 and provides wavelength-converted light.
  • the second resin layer 140 may include at least one selected from the group including phosphors, quantum dots, and the like.
  • the phosphor or quantum dot may emit blue, green, and red light.
  • the phosphor may be evenly disposed inside the second resin layer 140.
  • the phosphor may include a phosphor of a fluoride compound, and may include at least one of an MGF-based phosphor, a KSF-based phosphor, or a KTF-based phosphor.
  • the phosphor may emit different peak wavelengths and emit light emitted from the light emitting device 120 at different yellow and red or different red peak wavelengths.
  • the red phosphor may have a wavelength range from 610 nm to 650 nm, and the wavelength may have a width of less than 10 nm.
  • the red phosphor may include a fluoride-based phosphor.
  • the fluorite-based red phosphor may be coated with a fluoride that does not contain Mn, or an organic material coating on a surface of the phosphor or a fluoride coating that does not contain Mn, to improve reliability at high temperature / high humidity.
  • a fluoride that does not contain Mn or an organic material coating on a surface of the phosphor or a fluoride coating that does not contain Mn, to improve reliability at high temperature / high humidity.
  • a width of 10 nm or less can be realized, it can be utilized in a high resolution device.
  • the phosphor composition according to the embodiment should basically conform to stoichiometry, and each element can be replaced with another element in each group on the periodic table.
  • Sr can be substituted with alkaline earth (II) group Ba, Ca, Mg, and Y with lanthanide Tb, Lu, Sc, Gd, and the like.
  • II alkaline earth
  • Eu an active agent
  • Ce Ce, Tb, Pr, Er, Yb, etc. according to a desired energy level, and an activator alone or a sub-active agent may be additionally applied to modify properties.
  • the quantum dot may include a II-VI compound or a III-V compound semiconductor, and emit red light.
  • the quantum dots are, for example, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2 , CuInSe 2 and the like, and combinations thereof.
  • the second resin layer 140 may include ink particles therein.
  • the ink particles may include at least one of metal ink, UV ink, or curing ink.
  • the size of the ink particles may be smaller than the size of the phosphor.
  • the surface color of the ink particles may be any one of green, red, yellow, and blue.
  • the types of the ink are PVC (Poly vinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink, water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink, PS (Polystyrene) ink can be selectively applied.
  • the width or diameter of the ink particles may be 5 ⁇ m or less, for example, 0.05 ⁇ m to 1 ⁇ m. At least one of the ink particles may have a size smaller than the wavelength of light.
  • the color of the ink particles may include at least one of red, green, yellow, and blue.
  • the phosphor emits red wavelengths
  • the ink particles may include red.
  • the red color of the ink particles may be darker than that of the phosphor or light.
  • the ink particles may have a color different from the color of light emitted from the light emitting element.
  • the ink particles may have an effect of blocking or blocking incident light.
  • the second resin layer 140 may include at least two types of diffusion agents, ink particles, and phosphors.
  • the second resin layer 140 may include ink particles and phosphors without a diffusion agent.
  • the phosphor content may be added in the same amount as the resin material constituting the second resin layer 140.
  • the phosphor may be added in a ratio of 40% to 60% compared to 40% to 60% of the ratio of the second resin layer 140 with the resin material.
  • the resin material of the phosphor and the second resin layer 140 may be added in the same proportion to each other, for example, 50% to 50%.
  • the content of the phosphor may have a difference of 20% or less or 10% or less of the ratio of the second resin layer 140 with the resin material.
  • the content of the phosphor in the second resin layer 140 is added in a range of 40 wt% or more or 40 wt% to 60 wt%, so that the color on the surface of the second resin layer 140 is the color color of the phosphor It can be provided, it can improve the diffusion and wavelength conversion efficiency of the light.
  • wavelengths of light emitted from the light emitting device 120 through the second resin layer 140 for example, blue light can be reduced.
  • the light extracted through the second resin layer 140 may be provided as a surface light source according to the wavelength of the phosphor.
  • the second resin layer 140 may be provided with a thickness thinner than that of the first resin layer 130. When the thickness of the second resin layer 140 is thick, light transmittance may decrease, and when it is thin, wavelength conversion efficiency may decrease.
  • the thickness of the second resin layer 140 may be, for example, 0.3 mm to 0.5 mm.
  • the thickness of the second resin layer 140 may be 25% or less, for example, 16% to 25% of the thickness of the first resin layer 130.
  • the second resin layer 140 is a layer for wavelength conversion and external protection, and if it is thicker than the above range, the ductility of the module may deteriorate, and design freedom may decrease.
  • the phosphor or quantum dots added to the second resin layer 140 may include at least one or more of Amber light, Yellow light, Green light, Red light, or Blue light.
  • the second resin layer 140 is provided with a phosphor, so that an external color can be displayed as the color of the phosphor.
  • the surface of the second resin layer 140 or the surface of the lighting module may be provided as a red image when the light emitting device 120 is turned off, and when the light emitting device 120 is lit, having a predetermined brightness. If the red light is diffused, it may be provided as a red image of the light source.
  • the color coordinate of the surface color may have a different value within the color color of the phosphor depending on the case where the light emitting device 120 is turned on or off.
  • a phosphor and ink particles may be included in the second resin layer 140.
  • the emission wavelength of the phosphor and the ink particles may include the same color or the same colored color.
  • the color may be one of the colors of the phosphor.
  • the content of the phosphor in the second resin layer 140 is 23 wt% or less, for example, 12 wt% to 23 wt%, and the content of the ink particles may include 3 wt% or more, for example, 3 wt% to 13 wt%. . Since the weight of the ink particles is smaller than the weight of the phosphor, the ink particles may be distributed in an area adjacent to the surface of the second resin layer 140 than the phosphor. Accordingly, the color of the surface of the second resin layer 140 may be provided as the color of the ink particles. Light transmission can be suppressed by these ink particles, and hot spots can be lowered.
  • the second resin layer 140 may include a first layer to which a phosphor is added, and a second layer to which the ink particles are added, and the first layer may include the first resin layer 130 and the second layer. It can be arranged between layers. By separately stacking the second layer having the ink particles, the phosphor content of the first layer can be reduced.
  • the second resin layer 140 includes a first region 141 formed on the first resin layer 130 and a second region 143 disposed on a side surface of the first resin layer 130. ).
  • the first region 141 of the second resin layer 140 may overlap with some of the N light emitting devices 120 in a direction perpendicular to the substrate 110.
  • the first region 141 of the second resin layer 140 may be formed so as not to overlap with a portion of the at least one light emitting device 120 disposed on the outermost portion of the substrate 110.
  • the first region 141 of the second resin layer 140 may be disposed to be parallel to the top surface of the substrate 110.
  • the width of the first region 141 of the second resin layer 140 may be smaller than the width of the substrate 110 in the first and second directions.
  • the edge of the first region 141 of the second resin layer 140 may be disposed inside the side surface of the substrate 110.
  • the first region 141 of the second resin layer 140 may include a flat surface.
  • the second region 143 of the second resin layer 140 may extend from the edge of the first region 141 of the second resin layer 140 toward the substrate 110.
  • the second region 143 of the second resin layer 140 may include a curved surface.
  • the second region 143 of the second resin layer 140 may include a curved surface convex to the outside.
  • the second region 143 of the second resin layer 140 may be formed to overlap in a vertical direction between the light emitting device 120 and the substrate 110 disposed on the outermost portion of the substrate 110.
  • the first region 141 may be defined as a flat portion or an upper surface portion.
  • the second region 143 may be defined as a side portion or a curved portion.
  • the thickness of the first region 141 of the second resin layer 140 and the thickness of the second region 143 of the second resin layer 140 may be formed to correspond, but are not limited thereto.
  • the thickness of the first region 141 may be a thickness in a vertical direction or a vertical distance
  • the thickness of the second region 143 may be a second region 43 on the outer surface of the first resin layer 140.
  • the second resin layer 140 is formed so that the side surface has a curved surface, so that the distance between the edge region of the second resin layer 140 and the light emitting device 120 disposed on the outermost side of the substrate 100 is Can be reduced. Due to this, the second resin layer 140 can prevent the occurrence of dark lines at the interface between the first region 141 and the second region 143.
  • the arrangement structure of the light emitting element, the resin layer, and the layer having the phosphor or ink particles is mainly described, but in order to remove the dark rays and improve the uniformity of light, the distance between the light emitting element and the phosphor layer, the curvature of the second region of the phosphor layer The relationship between the radius, the thickness of the resin layer and the phosphor layer plays an important role.
  • the second region 143 of the second resin layer 140 may include a curved surface.
  • the second region 143 of the second resin layer 140 may include a first point P1, a second point P2, and a third point P3.
  • the first point P1, the second point P2, and the third point P3 may be points on the outer surface of the second region 143 of the second resin layer 140.
  • the plurality of light emitting elements 120 includes a first light emitting element 121, the first light emitting element 121 is disposed around the outer periphery of the first resin layer 120 among the plurality of light emitting elements It may be a light-emitting element adjacent to the side of the 1 resin layer 120.
  • the first point P1 is the second region 143 of the second resin layer 140 in the horizontal direction from the center C1 of the first light emitting element 121 closest to the side surface of the first resin layer 130. ).
  • the third point P3 may be a region that is in contact with the outer surface of the second region 143 of the second resin layer 140 and a straight line perpendicular to the center C1 of the first light emitting element 121.
  • the horizontal direction is a direction parallel or horizontal to the upper surface of the substrate 110, and the vertical direction may be a direction perpendicular to the upper surface of the substrate 110.
  • the second point P2 may be any area between the first point P1 and the third point P3 of the second area 143 of the second resin layer 140.
  • the first distance (L1) between the first point (P1) from the center (C1) of the first light emitting device 121, and the second point (P2) from the center (C1) of the first light emitting device 121 may be formed differently.
  • the third distance L3 from the center C1 of the first light emitting element 121 to the third point P3 is between the center C1 of the first light emitting element 121 and the first point P1. It may be formed larger than the first distance (L1) and the second distance (L2) from the center (C1) of the first light emitting element 121 to the second point (P2).
  • the second distance L2 between the center C1 of the first light emitting element 121 and the second point P2 is from the center C1 of the first light emitting element 121 to the first point P1. It may be formed larger than the first distance (L1).
  • the second distance L2 between the center C1 of the first light emitting element 121 and the second point P2 is between the center C1 of the first light emitting element 121 and the third point P3. Since the first distance (L2) between the third distance (L3) and the first point (P1) from the center (C1) of the first light-emitting element 121 is formed significantly, the dark line at the second point (P2) This occurred a problem.
  • the second region 143 of the second resin layer 140 is curved to reduce the second distance L2 between the center C1 of the first light emitting element 121 and the second point P2. By forming it so as to have, it is possible to prevent the generation of dark rays on the second resin layer 140.
  • the embodiment improves the light uniformity of the side surface of the second resin layer 140 by forming a curved surface such that there is little difference between the values of the first distance L1, the second distance L2, and the third distance L3. The light uniformity between the top surface and the side surface of the second resin layer 140 may be improved.
  • the distance values of the first distance L1, the second distance L2, and the third distance L3 are different, but the distance difference is very small as it goes toward the top and side surfaces of the second resin layer 140. Therefore, it is difficult to recognize the luminance difference when viewed from the outside.
  • the first distance L1 between the first point P1 from the center C1 of the first light emitting device 121 may be determined according to the distance between the light emitting devices 120.
  • the light emitting device 120 may be disposed such that a distance L4 between the first light emitting device 121 and a light emitting device adjacent thereto is 5.5 mm to 6.5 mm.
  • a hot spot may be generated in an area where the light emitting device 120 is disposed when viewed from the outside.
  • the first distance L1 between the first point P1 from the center C1 of the first light emitting device 121 is 44% to 55% of the fourth distance L4 between the light emitting devices 120.
  • the first light emitting element 121 may be disposed.
  • the first distance L1 between the center C1 of the first light emitting element 121 and the first point P1 may be determined to be around 3 mm.
  • the first distance L1 between the first point P1 from the center C1 of the first light emitting device 121 is less than 44% or 55% of the fourth distance L4 between the light emitting devices 120. If it exceeds, the light emitted through the second region 143 of the second resin layer 140 may appear excessively bright or dark, resulting in a problem that light uniformity is lowered.
  • the radius of curvature R of the second region 143 of the second resin layer 140 may be determined according to the thickness of the second resin layer 140 and the first resin layer 130.
  • the radius of curvature R of the second region 143 of the second resin layer 140 is the thickness t1 of the first resin layer 130 in the direction perpendicular to the substrate 110 and the second resin layer 140. It may be formed to be greater than or equal to the sum of the thicknesses t2 of the first region 141.
  • the radius of curvature R of the second region 143 of the second resin layer 140 is the thickness t1 of the first resin layer 130 in the direction perpendicular to the substrate 110 and the second resin layer ( It may be formed to be 100% to 110% of the sum of the thicknesses t2 of the first region 141 of 140).
  • the thickness t1 of the first resin layer 130 may be 3.5 mm to 5 mm
  • the thickness t2 of the first region 141 of the second resin layer 140 is 0.5 mm or less, for example 0.3 mm. It may be in the range of 0.5 mm.
  • the radius of curvature R of the second region 143 of the second resin layer 140 may be 5.5 mm to 6.0 mm.
  • the second resin layer 140 may include a fourth point P4 between the first region 141 and the second region 143.
  • the fourth point P4 may be disposed in an area of the outer surface of the second resin layer 140.
  • a fifth point P5 may be included on the substrate 110 having the shortest distance from the fourth point P4.
  • the distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is the first of the second region 143 of the second resin layer 140. It may be larger than the first distance L1 from the point P1 to the first light emitting element 121.
  • the distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is equal to that of the second region 143 of the second resin layer 140. It may be formed smaller than or equal to the radius of curvature R.
  • the second resin layer 140 may include a seventh point P7 where the second region 143 of the second resin layer 140 contacts the substrate 110.
  • the seventh point P7 may be an inner surface of the second resin layer 140 in contact with the second region 143 of the second resin layer 140 and the first resin layer 130.
  • the distance L7 between the seventh point P7 of the second region 143 of the second resin layer 140 and the side surface of the light emitting device 120 is greater than the distance L4 between the light emitting devices 120. It can be formed small.
  • the fifth point P5 formed on the substrate 110 may be disposed in an area greater than or equal to the distance from the seventh point P7 to the first light emitting element 121 and less than or equal to the radius of curvature R. have.
  • the radius of curvature R of the second region 143 of the second resin layer 140 may be determined through various conditions of the lighting module 100.
  • FIG. 4 is a perspective view showing a first resin layer in the lighting module of FIG. 2
  • FIG. 5 is a plan view for explaining a relationship according to a distance between the light emitting element and the first resin layer
  • FIG. 6 is a BB cross-sectional view of FIG. 5
  • the first resin layer 130 includes a flat top surface 131, a first side surface 133 bent from the top surface 131 toward the substrate 110, and the first side surface. It may include a second side 135 disposed adjacent to (133) and a corner region 137 disposed between the first side (133) and the second side (135).
  • the first side surface 133, the second side surface 135, and the corner area 137 may include a curved surface.
  • the upper surface 131 of the first resin layer 130 may contact the lower portion of the first region of the second resin layer.
  • the side surfaces 133 and 135 of the first resin layer 130 and the corner regions 137 may contact the second region of the second resin layer. That is, the upper surface 131, the side surfaces 133, 135, and the edge region 137 of the first resin layer 130 may be formed in a shape corresponding to the inner surface of the second resin layer.
  • the first resin layer 130 may include an eighth point P8 where the first side 133 and the edge region 137 of the first resin layer 130 contact the upper surface of the substrate 110. You can.
  • the first resin layer 130 may include a ninth point P9 where the second side surface 135 and the edge area 137 are in contact with the upper surface of the substrate 110.
  • the first resin layer 130 may include a tenth point P10 that is an outer surface of the edge region 137 in an area in contact with the upper surface of the substrate 110.
  • the area where the first resin layer 130 and the upper surface of the substrate 110 contact may include a straight line 133a.
  • the distance from the center C1 of the first light emitting element 121 adjacent to the edge region 137 to the first resin layer 130 to the tenth point P10 of the edge region 137 ( L10 may be formed to be the same as the distance L8 from the center C1 of the first light emitting element 121 to the eighth point P8 of the first resin layer 130.
  • the distance L10 from the center C1 of the first light emitting element 121 adjacent to the edge region 137 to the first resin layer 130 to the tenth point P10 of the edge region 137 is zero.
  • the distance L9 from the center C1 of the light emitting element 121 to the ninth point P9 of the first resin layer 130 may be formed. Due to this, the light emitted from the edge region 137 of the first resin layer 130 has the same luminance as the light emitted from the first side 133 and the second side 135 of the first resin layer 130. Can be released.
  • the outer side of the edge region 137 of the first resin layer 130 is the eleventh point P11 which is the shortest distance perpendicular to the substrate 110 from the center C1 of the first light emitting element 121. ). Accordingly, the line distance L11 from the center C1 of the first light emitting element 121 to the eleventh point P11 is from the center C1 of the first light emitting element 121 to the tenth point P10. It may be formed larger than the distance (L10). That is, the corner region 137 of the first resin layer 130 is the distance from the first light emitting element 121 toward the upper surface of the first resin layer 130, similar to the side surfaces of the first resin layer 130 Can be increased.
  • the lighting module of the first embodiment can prevent dark lines from being generated by forming a boundary area between the surface and the surface as a curved surface.
  • the side surface of the lighting module can have a curved surface, it can be seen that the light luminance of the lighting module is generally uniform.
  • the third region 145 of the second resin layer 140 may be vertically disposed between the second region 143 of the second resin layer 140 and the substrate 110.
  • One end of the third region 145 of the second resin layer 140 contacts the second region 143 of the second resin layer 140 and the other end of the third region 145 of the second resin layer 140.
  • the silver substrate 110 may be in contact with the upper surface.
  • the height h1 of the third region 145 of the second resin layer 140 may be formed smaller than the height h2 of the light emitting device 120.
  • the thickness of the first region 141 of the second resin layer 140 and the thickness of the second region 143 of the second resin layer 143 and the third region 145 of the second resin layer 140 May be formed to correspond.
  • the second region 143 of the second resin layer 140 may include a first point P1, a second point P2, and a third point P3.
  • the first point P1, the second point P2, and the third point P3 may be outer sides of the second region 143 of the second resin layer 140.
  • the first point P1 of the second resin layer 140 in the horizontal direction to the substrate 110 from the center C1 of the light emitting device 120 disposed closest to the side surface of the first resin layer 130. It may be an area in contact with the outer surface of the second area 143.
  • the first point P1 may be a region in contact with the second region 143 and the third region 145 of the second resin layer 140.
  • the second point P2 may be any one of the outer surfaces of the second region 143 of the second resin layer 140.
  • the third point P3 is a region perpendicular to the substrate 110 from the center C1 of the first light emitting element 121 and an area in contact with the outer surface of the second region 143 of the second resin layer 140.
  • the first distance (L1) between the first point (P1) from the center (C1) of the first light emitting device 121, and the second point (P2) from the center (C1) of the first light emitting device 121 may be formed differently.
  • the third distance L3 from the center C1 of the first light emitting element 121 to the third point P3 is between the center C1 of the first light emitting element 121 and the first point P1.
  • a first distance L1 and a second distance L2 from the center C1 of the first light emitting element 121 to the second point P2 may be formed.
  • the second distance L2 between the center C1 of the first light emitting element 121 and the second point P2 is from the center C1 of the first light emitting element 121 to the first point P1. It may be formed larger than the first distance (L1).
  • the second resin layer 140 may include a fourth point P4 between the first region 141 and the second region 143. The fourth point P4 may be disposed on the outer surface of the second resin layer 140.
  • a fifth point P5 may be included on the substrate 110 having the shortest distance from the fourth point P4.
  • the distance L5 between the fourth point P4 of the second resin layer 140 and the fifth point P5 of the substrate 110 is the first of the second region 143 of the second resin layer 140.
  • the third region 145 of the second resin layer 140 may include a sixth point P6.
  • the sixth point P6 may be an area in which the outer surface of the third area 145 of the second resin layer 140 is contacted with the upper surface of the substrate 110.
  • the distance L6 from the center C1 of the first light emitting element 121 to the sixth point P6 is the distance L1 from the center C1 of the first light emitting element 121 to the first point P1. ).
  • the lighting module according to the embodiment is provided with a second resin layer 140 having a straight line perpendicular to the top surface of the substrate 110 on the side of the first resin layer 130, so that the luminance of light emitted to the side is more uniform There is an effect that can be formed.
  • FIG. 8 is a perspective view of a lighting assembly having a lighting module according to a second embodiment
  • FIG. 9 is a C-C cross-sectional view of the lighting assembly of FIG. 8.
  • the lighting assembly includes a lighting module 100 disclosed above, a first cover having openings 215 through which the first and second resin layers 130 and 140 of the lighting module 100 protrude. 210, the first cover 210 and the second cover 220 supporting the lighting module 100.
  • the first cover 210 may be a sub bezel, or may be an upper or top cover
  • the second cover 220 may be a lower bezel, a lower or bottom cover.
  • the substrate 110, the first and second resin layers 130 and 140 may have a predetermined curvature and be coupled to the first and second covers 210 and 220.
  • the first and second covers 210 and 220 may support and fix an area other than the light emitting area of the lighting module 100.
  • the light emitting area may be the area of the first and second resin layers 130 and 140 on the light emitting device 120.
  • the upper surface area of the substrate 110 of the lighting module 100 may be larger than the lower surface area of the first resin layer 130.
  • the outer portion of the substrate 110 may extend further from each edge of the first resin layer 130.
  • the length D2 of the outer surface of the upper surface of the substrate 110 is a distance from the side surface of the second resin layer 130 to the edge of the substrate, and may be 0.1 times or more the thickness of the lighting module.
  • the length D2 of the outer portion may be 1 mm or less, for example, in the range of 0.3 mm to 1 mm, and if it is smaller than the range, there is no support effect, and when it is larger than the range, material loss or module size may increase.
  • the outer portion of the substrate 110 is a non-emissive region without a resin layer, and the first cover 210 and the second cover 220 are combined on the outer portion to facilitate assembly or use of the lighting module 100. Can provide
  • the first cover 210 may include a substrate cover part 211 having an opening 215 and a side cover part 213 outside the substrate cover part 211.
  • the size of the upper surface of the opening 215 may be larger than the size of the lower surface of the first resin layer 130, so that the second resin layer 140 may protrude through the opening 215.
  • the upper surface S1 and the side surface S2 of the second resin layer 140 may be curved or flat, and the corner portion S3 between the upper surface S1 and the side surface S2 may be curved.
  • the second resin layer 140 may be disposed on the top and side surfaces of the first resin layer 130.
  • the substrate cover part 211 is spaced apart from the second resin layer 140, thereby preventing the first resin layer 130 from being exposed. That is, the second resin layer 140 disposed on the side surface S2 of the first resin layer 140 may prevent the first resin layer 130 from being exposed from the substrate cover 211. have.
  • the substrate cover part 211 protects the upper surface of the substrate 110.
  • the substrate cover part 211 covers the outer upper surface of the substrate 110 and faces the side surface S2 of the second resin layer 140.
  • the upper surface of the substrate cover part 211 may be disposed lower than the upper surface S1 of the second resin layer 140, for example, less than 1/2 of the height of the upper surface of the second resin layer 140. Can be.
  • the upper surface of the substrate cover part 211 may be disposed lower than the upper surface of the first resin layer 130. Accordingly, it is possible to minimize the blocking of light by the substrate cover 211 for the side light emitted from the lighting module 100.
  • the side cover part 213 may be bent or extended in the direction of the second cover 220 through the substrate cover part 211.
  • the side cover part 213 covers the side surface of the substrate 110 and may protect the side surface of the substrate 110.
  • the side cover part 213 may protrude lower than the lower surface of the substrate 110.
  • At least one or both of the substrate cover part 211 and the side cover part 213 may include a coupling member (not shown) coupled to the substrate 110 and the second cover 220.
  • the coupling member may include a hook or a locking jaw structure.
  • the thickness of the second cover 220 has a thickness greater than that of the first cover 210 and supports the lighting module 100.
  • the second cover 220 may include a substrate support portion 221 under the substrate 110 and a coupling portion 223 under the substrate support portion 221.
  • the substrate support part 221 is disposed under the substrate 110 and may be adhered to the substrate 110.
  • the substrate support part 221 supports the substrate 110 having a top surface width or a top surface area that is wider than the bottom surface width D1 or the bottom surface area of the substrate 110.
  • the coupling portion 223 is provided in a stepped structure from the substrate support portion 221, and the side cover portion 213 is coupled.
  • the engaging portion 223 may have a hook or hook groove structure and be coupled to the side cover portion 213.
  • a support protrusion 235 may be disposed under the first cover 210, but is not limited thereto.
  • the support protrusion may be arranged in one or a plurality.
  • the material of the first and second covers 210 and 220 may be a plastic material, or may include a resin material having good moisture resistance.
  • at least one of the first and second covers 210 and 220 may include a metal material. Since the first and second covers 210 and 220 are provided as covers 210 and 220 for supporting the outer and lower portions of the lighting module 100 having a thickness of 5.5 mm or less, the lighting assembly having the lighting module 100 is used. Assembly or installation can be easy. In addition, when the lighting assembly is used, durability or reliability may be improved even when used for a long time.
  • the first and second covers 210 and 220 may include a curved shape or a straight shape along the outer shape of the lighting module 100.
  • the first and second covers 210 and 220 may include a cable drawing part 226 in which a power cable drawn out from the lighting module 100 is disposed.
  • the cable lead-out part 226 may protrude from an area between the first and second covers 210 and 220.
  • the power cable may be connected to the substrate 110 of the lighting module 100.
  • FIG. 10 is a perspective view showing a lighting assembly having a lighting module according to a third embodiment
  • FIG. 11 is a rear view of the lighting assembly of FIG. 11
  • FIG. 12 is an exemplary view before combining the lighting assembly and the main frame of FIG.
  • FIG. 13 is a perspective view showing an example of a combination of the lighting assembly and the main frame of FIG. 12
  • FIG. 14 is a side sectional view showing an electrical contact structure of the lighting assembly in the coupling structure of FIG. 13
  • FIG. 15 is a coupling structure of FIG. 14 It is a partially enlarged view.
  • the lighting assembly 200 includes a lighting module 100 disclosed above and a first cover having an opening 215 through which the second resin layer 140 of the lighting module 100 protrudes.
  • the first cover 210 may be a sub bezel, or may be an upper or top cover
  • the second cover 220 may be a lower bezel, a lower or bottom cover.
  • the first and second covers 210 and 220 may be coupled through a bonding member or an adhesive member, but is not limited thereto.
  • the first and second covers 210 and 220 may be defined as a cover 201.
  • the cover 201: 210, 220 may include first and second coupling members 241 and 243 spaced apart from the coupling front end 245, and the first and second coupling members 241 and 243 may include the lighting module 100.
  • the first and second coupling members 241 and 243 may be spaced apart by the same distance D3 from the coupling front end 245.
  • the first and second coupling members 241 and 243 may include concave locking grooves in the direction of the lighting module 100 from the side surfaces of the first and second covers 210 and 220.
  • the first and second coupling members may be provided as locking projections.
  • the coupling front end portion 245 may be one side of the cover or one side disposed in the coupling direction.
  • the first and second engaging members 241 and 243 of the locking grooves may be disposed at a depth D4 where the substrate 110 of the lighting module 100 is not exposed.
  • the depth D4 of the locking groove may be less than 1/2 of the width of the first cover 210, and when it is out of the depth, the substrate 110 may be exposed and the first cover 210 may be exposed. Stiffness may deteriorate.
  • the engaging groove may be provided with a structure with a narrow entrance and a wider interior, or a structure inclined in the direction of the coupling front end 245.
  • a plurality of terminal grooves 225 are disposed on the rear surface of the second cover 220 or the substrate support portion 213, and the terminal grooves 225 expose the rear surface of the substrate 110.
  • Terminals 251 of the substrate 110 may be exposed in the terminal grooves 225, respectively.
  • the terminal groove 225 may be disposed adjacent to the coupling front end portion 245.
  • the side surface of the terminal groove 225 may be inclined in any one side direction, for example, may include a surface inclined in the direction of the coupling front end in which the contact terminal is inserted.
  • the terminal groove 225 may be disposed closer to the first and second coupling members 241 and 243 based on the coupling front end portion 245 or may be disposed closer to one end of the lighting module.
  • the lighting assembly 200 may be coupled to the main case 300.
  • an insertion hole 310 and a coupling protrusion 341 are disposed outside the insertion hole 310, and a contact terminal 301 may be disposed at the bottom of the insertion hole 310.
  • Guide portions 342 and 343 for guiding around the inlet may be disposed in the insertion hole 301.
  • the coupling part 223 disposed at the front end of the lighting module 100 may be inserted into and coupled to the insertion hole 301.
  • the insertion hole 301 may provide an area where the upper portion is open so that the upper portion of the second resin layer 140 of the lighting module 100 may protrude.
  • the 12 has a coupling front end 245 corresponding to the insertion hole 310 of the main case 300, and is coupled as shown in FIG. 13.
  • the outer circumference of the lighting assembly 200 is inserted into the insertion port 210 and is inserted along the guide portions 342 and 343, and the first and second coupling members 241 and 243 of the lighting module 100 are inserted into the locking projections 341.
  • the terminal groove 225 is engaged.
  • the engaging projections 341 may protrude in opposite directions from both side walls of the insertion port 210.
  • a locking protrusion may be formed in the lighting module, and a locking groove may be disposed in the assembly.
  • a contact terminal 301 disposed at the bottom of the insertion hole 310 of the main case 300 is inserted into the terminal groove 225 of the second cover 220, and the contact The terminal 301 may contact the terminal 251 of the substrate 110 of the lighting module 100.
  • the contact terminal 301 may have a leaf spring shape and provide predetermined elasticity, so that the contact terminal 301 can be in close contact with the terminal 251 of the substrate 110.
  • the lighting assembly 200 is supported by the main case 300 through a coupling front end 245 and electrically connected to a contact terminal 301 through a stepped groove 225, thereby making it possible to Coupling of the lighting assembly 200 may be completed.
  • a part of the contact terminal 301 protrudes in the direction of the insertion hole 301 and may be a spring shape having an elastic repulsive force.
  • the lighting assembly 200 may be coupled to or detachable from the main case 300.
  • the lighting assembly 200 has been described as an example of exposing the terminal 251 of the substrate 110 to the lower portion of the second cover 220, but the terminal is a substrate 110 positioned at the coupling front end 245 ).
  • the above-mentioned lighting assembly 200 provides a connection of a power cable and a mechanical mounting structure, so that the assembly 200 having the lighting module 100 is coupled to the main case 300 without using separate fixtures. You can.
  • Such a lighting assembly may have improved assembly or detachability to the main case.
  • FIG. 16 is a plan view of a lighting assembly according to a fourth embodiment
  • FIG. 17 is an example of a side sectional view of the lighting assembly of FIG. 16
  • FIG. 19 is a side view of a combination of the lighting assembly of FIG. 18 and a main frame
  • FIG. 20 is FIG. It is a side sectional view of the DD line of 19.
  • the lighting assembly 400 includes a plurality of lighting modules 100A, 100B, and 100C, and a cover 410 in which the plurality of lighting modules 100A, 100B, and 100C are combined. You can.
  • the substrate cover portion 411 of the cover 410 is disposed on the substrate 110 of each lighting module 100A, 100B, 100C, and the side cover portion 413 is a substrate outside the side surface of the substrate 110 It may extend in the lower direction of (110).
  • the locking protrusion 430 of the cover 410 may protrude one or more below the substrate 110 of the lighting modules 100A, 100B, and 100C, and a locking jaw may be formed at the lower end.
  • the engaging protrusion 430 may be hung through the side surface of the substrate 110 or may be protruded through a hole in the substrate 110.
  • the cover 410 is to fix and support the substrate 110 of the lighting module (100A, 100B, 100C) by the locking projections 430, the other main case by protruding the locking projection 430 to the bottom It can be combined with.
  • the light-emitting regions of the plurality of lighting modules 100A, 100B, and 100C may have the same shape, or different sizes or different shapes, and be coupled to the cover 410.
  • the second resin layer 140 of the lighting modules 100A, 100B, and 100C may protrude through the opening 415 of the cover 410.
  • the substrate 110 of the lighting module 100 may be combined with the cover 410 through thermal fusion or fixed with an adhesive.
  • the lighting assemblies 400 and 400A may be inserted into the main case 450 and coupled to the main case 450.
  • the light emitting regions of the lighting assemblies 400 and 400A may be respectively inserted and protruded from the opening 451 of the main case 450.
  • the first lighting assembly 400 and the second lighting assembly 400A may be coupled to the main case 450 through the rear opening 470.
  • the first and second lighting assemblies 400 and 400A may be supported and fixed by the covers 451,452,461,462,463, and a light emitting area may be exposed.
  • the first and second lighting assemblies 400 and 400A may be second resin layers 140A and 140B to which phosphors having different second resin layers 140A and 140B are added.
  • the first and second lighting assemblies 140 and 140B may include second resin layers 140A and 140B having ink particles of different colors. At least one or both of the second resin layers 140A and 140B may include phosphor and ink particles. 18 and 19, since each substrate 110 of the lighting modules 100A, 100B, and 100C is exposed under the cover, power supply to the substrate 110 may be easy.
  • the above-described lighting assembly (400,400A) is coupled by having a plurality of lighting modules (100A, 100B, 100C), thereby coupling the assembly having the lighting modules (100A, 100B, 100C) to a main case without using separate fixtures. I can do it. Such a lighting assembly may have improved assembly or detachability to the main case.
  • the lighting modules of the lighting assembly disclosed in the above embodiment (s) may each include the lighting modules disclosed in the first embodiment.
  • the lighting assembly according to the above embodiment (s) may be coupled to a vehicle lamp, for example, when applied to a tail lamp, a brake lamp, or a turn signal lamp of a vehicle, it may be applied to a turn signal lamp of a vehicle.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Marketing (AREA)
  • Accounting & Taxation (AREA)
  • Business, Economics & Management (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention, selon un mode de réalisation, concerne un ensemble de lumière comprenant : un module de lumière qui comprend un substrat, une pluralité d'éléments électroluminescents situés sur le substrat, une première couche de résine recouvrant la pluralité d'éléments électroluminescents, et au moins une seconde couche de résine appliquée sur la première couche de résine ; et un premier couvercle qui est disposé sur la partie de bord extérieur du substrat du module de lumière le long du périmètre extérieur du substrat, la seconde couche de résine étant disposée au niveau de la surface supérieure et des surfaces latérales de la première couche de résine, et la seconde couche de résine comprenant une substance fluorescente et/ou des particules d'encre. Le premier couvercle comprend : une ouverture à travers laquelle fait saillie la seconde couche de résine ; une partie de couvercle de substrat disposée au niveau de la surface supérieure du substrat et autour du périmètre de l'ouverture ; et une partie de couvercle de surface latérale s'étendant de façon à venir plus bas que les surfaces latérales du substrat par rapport à la partie de couvercle de substrat. La surface supérieure de la partie de couvercle de substrat peut être disposée plus bas que la surface supérieure de la première couche de résine.
PCT/KR2019/011655 2018-09-11 2019-09-09 Module de lumière et système de module d'ensemble de lumière WO2020055070A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US17/270,911 US20210193635A1 (en) 2018-09-11 2019-09-09 Lighting module and lighting assembly including same
CN201980059552.0A CN112703347B (zh) 2018-09-11 2019-09-09 照明组件
EP23215433.6A EP4325587A3 (fr) 2018-09-11 2019-09-09 Module lumineux et ensemble lumineux le comprenant
EP19860504.0A EP3851735B1 (fr) 2018-09-11 2019-09-09 Module lumineux et ensemble émetteur de lumière le comprenant
JP2021512876A JP7432584B2 (ja) 2018-09-11 2019-09-09 照明モジュール及びこれを備えた照明アセンブリ
CN202410024970.9A CN117869824A (zh) 2018-09-11 2019-09-09 照明组件
JP2024015830A JP2024054205A (ja) 2018-09-11 2024-02-05 照明モジュール及びこれを備えた照明アセンブリ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0108489 2018-09-11
KR1020180108489A KR102664913B1 (ko) 2018-09-11 2018-09-11 조명 모듈 및 이를 구비한 조명 어셈블리

Publications (1)

Publication Number Publication Date
WO2020055070A1 true WO2020055070A1 (fr) 2020-03-19

Family

ID=69776696

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2019/011655 WO2020055070A1 (fr) 2018-09-11 2019-09-09 Module de lumière et système de module d'ensemble de lumière

Country Status (6)

Country Link
US (1) US20210193635A1 (fr)
EP (2) EP4325587A3 (fr)
JP (2) JP7432584B2 (fr)
KR (2) KR102664913B1 (fr)
CN (2) CN117869824A (fr)
WO (1) WO2020055070A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102646700B1 (ko) * 2018-08-16 2024-03-13 엘지이노텍 주식회사 조명 장치
TWI801122B (zh) * 2022-01-28 2023-05-01 友達光電股份有限公司 封裝結構及其製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080129206A1 (en) * 2000-03-20 2008-06-05 Stam Joseph S System for Controlling Vehicle Equipment
JP2014026977A (ja) * 2012-07-27 2014-02-06 Lg Innotek Co Ltd 照明装置
KR20170052203A (ko) * 2015-11-04 2017-05-12 엘지이노텍 주식회사 광학 플레이트, 조명 소자 및 광원 모듈
JP2017157319A (ja) * 2016-02-29 2017-09-07 東芝ライテック株式会社 車両用照明装置、および車両用灯具
KR20180092640A (ko) * 2017-02-10 2018-08-20 주식회사 송풍조명 조명 램프

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1187228A4 (fr) * 2000-02-09 2007-03-07 Nippon Leiz Corp Source lumineuse
CN100504146C (zh) * 2001-08-09 2009-06-24 松下电器产业株式会社 Led照明装置和led照明光源
JP2005044753A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Works Ltd 無電極放電灯点灯装置
JP2009123675A (ja) * 2007-10-25 2009-06-04 Panasonic Electric Works Co Ltd 照明装置
WO2011099288A1 (fr) * 2010-02-10 2011-08-18 パナソニック株式会社 Lampe à del et appareil d'éclairage
KR101690509B1 (ko) * 2010-07-05 2016-12-28 엘지이노텍 주식회사 발광소자 모듈 및 발광소자 모듈을 이용한 발광소자 시스템
KR101230620B1 (ko) * 2010-09-16 2013-02-06 서울반도체 주식회사 엘이디 조명장치
JP5049382B2 (ja) 2010-12-21 2012-10-17 パナソニック株式会社 発光装置及びそれを用いた照明装置
DE102011102350A1 (de) * 2011-05-24 2012-11-29 Osram Opto Semiconductors Gmbh Optisches Element, optoelektronisches Bauelement und Verfahren zur Herstellung dieser
EP2735786A4 (fr) * 2011-07-22 2015-03-11 Panasonic Corp Lampe
US9166120B2 (en) * 2011-08-16 2015-10-20 Samsung Electronics Co., Ltd. LED device having improved luminous efficacy
JP2013153739A (ja) 2012-01-30 2013-08-15 Sato Shokuhin Kogyo Kk 茶エキス入り粉末組成物
JP5351365B1 (ja) * 2012-04-11 2013-11-27 パナソニック株式会社 発光装置及びランプ
KR20140028768A (ko) * 2012-08-30 2014-03-10 현대모비스 주식회사 자동차의 조명장치 및 그것의 제조방법
CN105051443A (zh) * 2013-03-26 2015-11-11 皇家飞利浦有限公司 具有发光材料的密闭密封光照器件及其制造方法
JP5628378B1 (ja) 2013-05-20 2014-11-19 スタンレー電気株式会社 Ｌｅｄランプ
JP6191091B2 (ja) * 2013-12-20 2017-09-06 東芝ライテック株式会社 照明装置および灯具
JP6305086B2 (ja) * 2014-02-07 2018-04-04 三菱電機株式会社 照明装置
JP6554286B2 (ja) 2015-01-20 2019-07-31 株式会社東海理化電機製作所 車両用投射装置
JP6759556B2 (ja) 2015-10-30 2020-09-23 日亜化学工業株式会社 照明装置
US9500333B1 (en) * 2015-12-18 2016-11-22 Ford Global Technologies, Llc Phosphorescent lighting assembly
US10957825B2 (en) * 2017-09-25 2021-03-23 Lg Innotek Co., Ltd. Lighting module and lighting apparatus having thereof
KR102646700B1 (ko) * 2018-08-16 2024-03-13 엘지이노텍 주식회사 조명 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080129206A1 (en) * 2000-03-20 2008-06-05 Stam Joseph S System for Controlling Vehicle Equipment
JP2014026977A (ja) * 2012-07-27 2014-02-06 Lg Innotek Co Ltd 照明装置
KR20170052203A (ko) * 2015-11-04 2017-05-12 엘지이노텍 주식회사 광학 플레이트, 조명 소자 및 광원 모듈
JP2017157319A (ja) * 2016-02-29 2017-09-07 東芝ライテック株式会社 車両用照明装置、および車両用灯具
KR20180092640A (ko) * 2017-02-10 2018-08-20 주식회사 송풍조명 조명 램프

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3851735A4 *

Also Published As

Publication number Publication date
CN112703347A (zh) 2021-04-23
EP3851735A4 (fr) 2021-12-08
EP3851735B1 (fr) 2024-01-17
KR20200029900A (ko) 2020-03-19
JP7432584B2 (ja) 2024-02-16
KR102664913B1 (ko) 2024-05-14
JP2024054205A (ja) 2024-04-16
CN117869824A (zh) 2024-04-12
US20210193635A1 (en) 2021-06-24
JP2022500816A (ja) 2022-01-04
EP4325587A3 (fr) 2024-05-01
EP3851735A1 (fr) 2021-07-21
KR20240058829A (ko) 2024-05-03
EP4325587A2 (fr) 2024-02-21
CN112703347B (zh) 2024-01-26

Similar Documents

Publication Publication Date Title
CN109616468B (zh) 照明模块
WO2019245195A1 (fr) Module d'éclairage et dispositif d'éclairage le comprenant
WO2019221431A1 (fr) Module d'éclairage et dispositif d'éclairage le comprenant
WO2019225877A1 (fr) Module d'éclairage et appareil d'éclairage doté de celui-ci
EP4343865A2 (fr) Module d'éclairage
JP2024054205A (ja) 照明モジュール及びこれを備えた照明アセンブリ
WO2020153781A1 (fr) Dispositif d'éclairage et lampe de véhicule comprenant celui-ci
WO2020153778A1 (fr) Dispositif d'éclairage
WO2020036344A1 (fr) Dispositif d'éclairage
WO2019212194A1 (fr) Module d'éclairage et dispositif d'éclairage
WO2020071702A1 (fr) Dispositif d'éclairage
WO2020256335A1 (fr) Dispositif d'éclairage
KR20200037470A (ko) 면광원 모듈, 조명 장치 및 이를 포함하는 차량용 리어 램프
KR102600152B1 (ko) 조명 장치 및 이를 포함하는 리어 램프
WO2021054709A1 (fr) Module d'éclairage, appareil d'éclairage et lampe
KR20200035699A (ko) 조명 모듈 및 이를 구비한 조명 장치
KR20200037515A (ko) 조명 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19860504

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021512876

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2019860504

Country of ref document: EP

Effective date: 20210412