WO2020034885A1 - 一种单界面条带单元、单界面条带、模块和智能卡 - Google Patents

一种单界面条带单元、单界面条带、模块和智能卡 Download PDF

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Publication number
WO2020034885A1
WO2020034885A1 PCT/CN2019/099598 CN2019099598W WO2020034885A1 WO 2020034885 A1 WO2020034885 A1 WO 2020034885A1 CN 2019099598 W CN2019099598 W CN 2019099598W WO 2020034885 A1 WO2020034885 A1 WO 2020034885A1
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WO
WIPO (PCT)
Prior art keywords
pad
antenna
contact
welding
single interface
Prior art date
Application number
PCT/CN2019/099598
Other languages
English (en)
French (fr)
Inventor
严朝辉
刘渊
曹志新
Original Assignee
恒宝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 恒宝股份有限公司 filed Critical 恒宝股份有限公司
Publication of WO2020034885A1 publication Critical patent/WO2020034885A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier

Definitions

  • the present application relates to the field of smart card technology, and in particular, to a single interface strip unit, a single interface strip, a module, and a smart card.
  • Dual interface smart chip cards have contact and non-contact read and write operations.
  • Dual interface IC modules on the market are mainly packaged with special dual interface strips.
  • Dual interface strips contain two layers of copper foil. That is, the contact surface (hereinafter "front” can be used as a designation) copper foil is used for contact interface, and the welding surface (or pressure-welded surface, cover, and the following can be used as "weld surface” designation) copper foil for non-contact interface Therefore, it is necessary to manufacture two layers of positive and negative copper foil on the strip, and perform processes such as etching, nickel plating, and gold plating thereon. This results in higher prices for dual interface strips than for single interface strips.
  • the contacts and circuits of the soldering surface are formed in the strip production process.
  • the non-contact interface circuit of the chip and the antenna coil circuit embedded in the card are conducted, so that the non-contact function of the IC card can be realized.
  • a large module with 8 contacts is called an 8PIN module.
  • a small module with 6 contacts is called a 6PIN module.
  • the 8 contact interface solder joints of the 8pin module are marked with C1, C2, ..., C8 respectively according to ISO-7816. Among them, C4 and C8 are designed as reserved areas and have no practical use.
  • C6 was originally designed to supply power to the EEPROM. However, since the programming voltage required by the EEPROM is directly controlled by the chip, C6 is usually no longer used. used.
  • a single-interface strip unit of the present application includes a substrate, and one surface of the substrate is covered with copper foil. As a copper foil surface, a total of 8 C1-C8 are provided on the copper foil surface. Contacts, which are electrically isolated from each other by an insulating tape;
  • the areas where the first contact and the second contact are located respectively extend to adjacent contacts to form a first extension region and a second extension region; the substrates corresponding to the first extension region and the second extension region A first base hole and a second base hole are respectively provided on the area.
  • the side where the C5-C8 contact is located is set as the width of the single interface strip unit, and the side where C1 and C5 are located is the height of the single interface strip unit, and the single interface strip is
  • the center of the belt unit is the origin.
  • the coordinate axis is established.
  • the axis parallel to the width is the x-axis.
  • the axis parallel to the height is the y-axis.
  • the actual height of the single-interface strip unit is set to 1.
  • the reserved height is h
  • the widths of C2, C3, C6, and C7 are all a
  • the widths of C1, C4, C5, and C8 are all b.
  • the height of the insulating tape separating the two contacts is s;
  • the extension range of C8 on C6 and C7 is:
  • the extent of the extension on C5 is:
  • the extent of C6 on C5 is:
  • the extent of the extension on C7 is:
  • the range of extensions on C8 is:
  • the extent of C4 on C3 and C2 is:
  • the extent of C4 on C1 is:
  • the present application also provides a single interface strip using the single interface strip unit described above, wherein the single interface strip is composed of at least two of the single interface strip units.
  • the present application also provides a module using the single-interface stripe unit, wherein the module includes a single-interface stripe unit and a chip;
  • a surface opposite to the copper foil surface is a soldering surface, and the chip is disposed on the soldering surface;
  • a contact surface pad is provided on the welding surface at a position corresponding to the hole of the contact, and the hole electrically connects the contact with the corresponding contact surface pad;
  • the chip is provided with a chip LA pad, a chip LB pad, and a chip contact surface pad electrically connected to the contact surface pads of the C1, C2, C3, C5, and C7 contacts;
  • the contact surface pads of the first and second contacts be LA contact surface pads and LB contact surface pads, respectively;
  • the LA contact surface pad and the LB contact surface pad are electrically connected to the chip LA pad and the chip LB pad, respectively;
  • An antenna LA welding pad and an antenna LB welding pad are respectively provided on the positions of the first base hole and the second base hole on the welding surface of the single interface strip unit; The hole electrically connects the first contact and the second contact with the antenna LA welding pad and the antenna LB welding pad.
  • the present application also provides a smart card using the above module, which includes a card base, a module, and an antenna coil.
  • the antenna coil is disposed inside the card base, the card base is provided with a milling slot, and the module is embedded in the milling slot.
  • the antenna LA welding pad and the antenna LB welding pad are electrically connected to both ends of the antenna coil circuit, respectively.
  • an antenna LA pad and an antenna LB pad are provided on the card base, and the antenna LA pad and the antenna LB pad are respectively connected to both ends of the antenna coil circuit;
  • the antenna LA welding pad and the antenna LB welding pad are electrically connected to the antenna LA pad and the antenna LB pad, respectively.
  • the antenna LA pad and the antenna LB pad are respectively disposed at opposite ends of the milling slot on the card base, and the antenna LA welding pad and the antenna LB welding pad are respectively provided at A position corresponding to the antenna LA pad and the antenna LB pad.
  • the antenna LA welding pad and the antenna LB welding pad are connected to both ends of the antenna coil circuit by direct welding of an antenna enameled wire.
  • the antenna LA pad and the LB pad are connected to the antenna LA solder pad and the antenna LB solder pad by soldering or conductive adhesive connection.
  • the present application also provides a single-interface strip unit, which includes a substrate, and one side of the substrate is covered with a copper foil as a copper foil surface.
  • the copper foil surface is provided with a central area and C1 and C2 are provided around the central area. , C3, C5, C6, C7, a total of 6 contacts, wherein the copper foil area of the C5 contact surrounds the central area; the contacts are electrically isolated from each other by an insulating tape;
  • a third contact is provided between the C1 contact and a C5 contact, and a fourth contact is provided between the C3 and C7 contacts; the third contact, the fourth contact, and other contacts are electrically isolated from each other through insulation and charging. ;
  • Holes are provided on the base material area corresponding to the third contact, the fourth contact, and the C1, C2, C3, C5, C6, and C7 contacts;
  • the third contact point and the fourth contact point are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate region.
  • the edge where C5-C7 is located is set to the width of the single interface strip unit
  • the edge where C3, C7 is located is set to the height of the single interface strip unit
  • the coordinates of the single interface strip unit are used to establish the coordinates Axis, set the axis parallel to the width as the x-axis, the axis parallel to the height as the y-axis, set the actual height of the single interface strip unit to be l, the minimum remaining height of the contact to be p, and the width of C2 and C6 to be c, C1, C3, C5, and C7 have a width of d and a height of m.
  • the height of the insulating tape separating the two contacts be s.
  • the range of the third contact is:
  • the range of the fourth contact is: among them,
  • any one of the third contact or the fourth contact is replaced with an extension area where C6 and / or C6 extends to adjacent contacts.
  • the edges where C5, C6, and C7 are located are set to the width of the single interface strip unit
  • the edges where C3, C7 are located are set to the height of the single interface strip unit
  • the center of the single interface strip unit is used as the origin.
  • Establish the coordinate axis set the axis parallel to the width as the x-axis, the axis parallel to the height as the y-axis, set the actual height of the single interface strip unit to be l, the minimum reserved height of the module to be h, C1, C3, C5, and C7.
  • the width is d
  • the widths of C2 and C6 are c
  • the height of the insulation tape separating the two contacts is s;
  • the extent of the extension area of C6 in the C5 area is:
  • the present application also provides a single interface strip using the single interface strip unit described above, wherein the single interface strip is composed of at least two of the single interface strip units.
  • the present application also provides a module using the single-interface stripe unit, wherein the module includes a single-interface stripe unit and a chip;
  • a surface on the single interface strip unit opposite to the copper foil surface is a soldering surface, and the chip is disposed on the soldering surface;
  • a contact surface pad is provided on the welding surface at a position corresponding to the hole of the contact; the hole electrically connects the contact with the corresponding contact surface pad;
  • the chip is provided with a chip LA pad, a chip LB pad, and a chip contact surface pad electrically connected to the contact surface pads of the C1, C2, C3, C5, and C7 contacts;
  • the third contact point and the fourth contact point are respectively provided with a LA contact surface pad and an LB contact surface pad on the welding holes; the third contact point and the fourth contact point are connected to each other through corresponding holes.
  • the LA contact surface pad and the LB contact surface pad are electrically connected;
  • the LA contact surface pad and the LB contact surface pad are electrically connected to the chip LA pad and the chip LB pad, respectively;
  • Antenna LA welding pads and antenna LB welding pads are respectively provided on the positions of the third base hole and the fourth base hole on the welding surface of the single interface strip unit.
  • the base hole electrically conducts the third and fourth contacts with the antenna LA welding pad and the antenna LB welding pad.
  • the present application also provides a smart card using the above module, which includes a card base, a module, and an antenna coil.
  • the antenna coil is disposed inside the card base, the card base is provided with a milling slot, and the module is embedded in the milling slot.
  • the antenna LA welding pad and the antenna LB welding pad are electrically connected to both ends of the antenna coil circuit, respectively.
  • an antenna LA pad and an antenna LB pad are provided on the card base, and the antenna LA pad and the antenna LB pad are respectively connected to both ends of the antenna coil circuit;
  • the antenna LA welding pad and the antenna LB welding pad are electrically connected to the antenna LA pad and the antenna LB pad, respectively.
  • the antenna LA pad and the antenna LB pad are respectively disposed at opposite ends of the milling slot on the card base, and the antenna LA welding pad and the antenna LB welding pad are respectively provided at A position corresponding to the antenna LA pad and the antenna LB pad.
  • the antenna LA welding pad and the antenna LB welding pad are connected to both ends of the antenna coil circuit by direct welding of an antenna enameled wire.
  • the antenna LA pad and the LB pad are connected to the antenna LA solder pad and the antenna LB solder pad by soldering or conductive adhesive connection.
  • the present application also provides a single-interface strip unit, which includes a substrate, and one side of the substrate is covered with a copper foil as a copper foil surface.
  • the copper foil surface is provided with a central area and C1 and C2 are provided around the central area. , C3, C5, C6, C7 total 6 contacts; the contacts are electrically isolated from each other by an insulating tape;
  • a fifth contact is provided between the C1 contact and a C5 contact, and a sixth contact is provided between the C3 and C7 contacts; wherein the central area is surrounded by the extended copper foil area; the extended copper foil area is the fifth The extended copper foil area of the contact, the extended copper foil area of the sixth contact, or the combination of the fifth copper contact area and the extended copper foil area of the sixth contact;
  • the fifth contact point and the sixth contact point are separated by an insulating tape; the fifth contact point, the sixth contact point, and other contacts are electrically isolated from each other by an insulating tape;
  • Holes are provided on the substrate area corresponding to the fifth contact, the sixth contact, and the C1, C2, C3, C5, C6, and C7 contacts;
  • the fifth contact point and the sixth contact point are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate region.
  • all or part of the holes are disposed on the extended copper foil areas of the corresponding contacts.
  • the edge where C5-C7 is located is set to the width of the single interface strip unit
  • the edge where C3, C7 is located is set to the height of the single interface strip unit
  • the coordinates of the single interface strip unit are used to establish the coordinates Axis, set the axis parallel to the width as the x-axis, the axis parallel to the height as the y-axis, set the actual height of the single interface strip unit to be l, the minimum remaining height of the contact to be p, and the width of C2 and C6 to be c, C1, C3, C5, and C7 have a width of d and a height of m.
  • the height of the insulating tape separating the two contacts be s.
  • the range of the copper foil area of the sixth contact between C3 and C7 is: among them,
  • any one of the fifth contact point or the sixth contact point is replaced with an extension area where C6 and / or C6 extend to adjacent contacts.
  • the edges where C5, C6, and C7 are located are set to the width of the single interface strip unit
  • the edges where C3, C7 are located are set to the height of the single interface strip unit
  • the center of the single interface strip unit is used as the origin.
  • Establish the coordinate axis set the axis parallel to the width as the x-axis, the axis parallel to the height as the y-axis, set the actual height of the single interface strip unit to be l, the minimum reserved height of the module to be h, C1, C3, C5, and C7.
  • the width is d
  • the widths of C2 and C6 are c
  • the height of the insulation tape separating the two contacts is s;
  • the extent of the extension area of C6 in the C5 area is:
  • the present application also provides a single interface strip using the single interface strip unit described above, wherein the single interface strip is composed of at least two of the single interface strip units.
  • the present application also provides a module using the single-interface stripe unit, wherein the module includes a single-interface stripe unit and a chip;
  • a surface on the single interface strip unit opposite to the copper foil surface is a soldering surface, and the chip is disposed on the soldering surface;
  • a contact surface pad is provided on the welding surface at a position corresponding to the hole of the contact; the hole electrically connects the contact with the corresponding contact surface pad;
  • the chip is provided with a chip LA pad, a chip LB pad, and a chip contact surface pad electrically connected to the contact surface pads of the C1, C2, C3, C5, and C7 contacts;
  • the third contact point and the fourth contact point are respectively provided with a LA contact surface pad and an LB contact surface pad on the welding holes; the third contact point and the fourth contact point are connected to each other through corresponding holes.
  • the LA contact surface pad and the LB contact surface pad are electrically connected;
  • the LA contact surface pad and the LB contact surface pad are electrically connected to the chip LA pad and the chip LB pad, respectively;
  • Antenna LA welding pads and antenna LB welding pads are respectively provided on the positions of the third base hole and the fourth base hole on the welding surface of the single interface strip unit.
  • the base hole electrically conducts the third and fourth contacts with the antenna LA welding pad and the antenna LB welding pad.
  • the present application also provides a smart card using the above module, which includes a card base, a module, and an antenna coil.
  • the antenna coil is disposed inside the card base, the card base is provided with a milling slot, and the module is embedded in the milling slot.
  • the antenna LA welding pad and the antenna LB welding pad are electrically connected to both ends of the antenna coil circuit, respectively.
  • an antenna LA pad and an antenna LB pad are provided on the card base, and the antenna LA pad and the antenna LB pad are respectively connected to both ends of the antenna coil circuit;
  • the antenna LA welding pad and the antenna LB welding pad are electrically connected to the antenna LA pad and the antenna LB pad, respectively.
  • the antenna LA pad and the antenna LB pad are respectively disposed at opposite ends of the milling slot on the card base, and the antenna LA welding pad and the antenna LB welding pad are respectively provided at A position corresponding to the antenna LA pad and the antenna LB pad.
  • the antenna LA welding pad and the antenna LB welding pad are connected to both ends of the antenna coil circuit by direct welding of an antenna enameled wire.
  • the antenna LA pad and the LB pad are connected to the antenna LA solder pad and the antenna LB solder pad by soldering or conductive adhesive connection.
  • the present invention bridges the non-contact interface gold wire and card-based antenna of the module's soldering surface through the base material punching on the expansion area of the C4, C8, and C6 areas of the module, thereby omitting the copper foil manufacturing of the soldering surface, and the design is not limited In the existing C4, C8 or C6 area in the module, the position of the non-connected antenna pads is consistent with the existing design, and it has good compatibility in packaging and testing and card manufacturing processes, which improves the market promotion.
  • FIG. 1 is a schematic diagram of the overall structure of a dual interface smart card using a single interface strip in the prior art.
  • FIG. 2 is a location diagram of the antenna LA pad and the antenna LB pad on the milling slot in the first embodiment.
  • FIG. 3 is a structural diagram of an 8-pin module in Embodiment 1.
  • FIG. 3 is a structural diagram of an 8-pin module in Embodiment 1.
  • FIG. 4 is a structural diagram of a 6-pin module in Embodiment 2.
  • FIG. 4 is a structural diagram of a 6-pin module in Embodiment 2.
  • FIG. 5 is a structural diagram of a 6-pin module in Embodiment 3.
  • FIG. 5 is a structural diagram of a 6-pin module in Embodiment 3.
  • the single interface strip in the present application refers to a strip coated with copper foil on one side of a substrate, and a chip is provided on the other side of the substrate.
  • the single interface strip is a copper foil provided by providing antenna pad holes in the substrate. And the chip is electrically connected.
  • modules for smart cards There are two types of modules for smart cards: 8-pin modules and 6-pin modules. Their internal structures are shown in Figure 3 and Figure 4, respectively.
  • the smart card of the present application includes a card base 1, a module 2, and an antenna coil 3, and the antenna coil 3 is disposed inside the card base 1.
  • the card base 1 is provided with a milling groove 21 on the surface, and the module 2 is embedded in the milling groove 21;
  • the module 2 of the present application includes a single interface strip unit and a chip; the single interface strip unit is formed by cutting a single interface strip, that is, the single interface strip is composed of a plurality of single interface strip units.
  • the single interface strip unit includes a base material, one side of the base material is covered with copper foil, and 8 sides of C1-C8 are provided on the side where the copper foil is located, and the contacts are electrically isolated from each other by an insulating tape;
  • the substrate is a glass epoxy substrate.
  • the module of the smart card includes a single interface strip unit and a chip 4, and the chip 4 is disposed on the other side of the copper-clad surface of the substrate of the single interface strip; the overall structure of the dual interface smart card of the present invention is shown in Figs. 1 and 2. As shown, it includes the card base 1, the antenna coil 3 inside the card base 1, and the module 2 embedded in the milling slot 21 of the card base 1;
  • the positions and dimensions of the eight contacts of C1-C8 conform to the ISO7816 standard, and the corresponding contacts of the first contact, the second contact, C1, C2, C3, C5, and C7 Holes penetrating the substrate are provided on the substrate area; contact surface pads of each contact are provided at the positions of the corresponding holes, and the contact surface pads are provided on the opposite side of the side where the copper foil of the module is located; Set holes to make the contacts and their contact surface pads electrically conductive;
  • C6 was defined as the programming voltage contact point (Vpp) in the early days. It is no longer commonly used. In practice, it is only used in the SIM card for the SWP interface; while C4 and C8 are reserved and used in practice as the USB high-speed interface. , Or other special-shaped antenna interfaces, are not commonly used now.
  • Vpp programming voltage contact point
  • the side where C5-C8 on the module is set is the width of the module
  • the side where C1 and C5 are located is the height of the module.
  • the height of the module In order for the module to be read, the height of the module must be greater than a certain reserved height. That is, the extension range from C8 to C5, C6, and C7 needs to be set from the edge where C5-C8 on the module is located to the area less than a certain height from the edge.
  • the coordinate axis with the center of the module as the origin set the axis parallel to the width of the smart card module as the x-axis, the axis parallel to the height of the smart card module as the y-axis, and set the actual height of the module to l (including the insulation tape on both sides).
  • the minimum reserved height is h
  • the width of the insulation tape between the contacts is s
  • the width of C2, C3, C6, and C7 are all a (excluding the insulation tape on both sides)
  • the widths of C1, C4, C5, and C8 are all b (excluding the insulating tape on both sides);
  • the extension range of C8 on C6 and C7 is:
  • the extent of the extension on C5 is:
  • the extent of C6 on C5 is:
  • the extent of the extension on C7 is:
  • the range of extensions on C8 is:
  • the extent of C4 on C3 and C2 is:
  • the extent of C4 on C1 is:
  • the height of the module is 12.6mm. According to the definition of ISO / IEC7816-2, it can be obtained that the minimum reserved height for the module to be read by the reader is 9.62mm, of which two are electrically isolated The width of the insulating tape 24 of the contact is 0.15mm;
  • An antenna pad hole is provided on each of the epoxy glass substrates of the C4 and C8 modules that can be provided with extension regions.
  • the hole shape of the antenna pad is a circular track shape or an oval shape, and the size is 2.2 * 1mm; Let the copper-clad side of the module be the copper foil side of the module, and the copper-clad side on the module be the soldering side, then set the antenna LA soldering pad at the antenna pad hole on the soldering side of the module 6 And antenna LB soldering pad 7;
  • the chip 4 is provided with a chip LA pad 8, a chip LB pad 9, and a total of 5 chip contact surface pads 10 connected to the contact surface pads 5 of the C1, C2, C3, C5, and C7 contacts;
  • the antenna coil 3 is provided with an antenna LA pad 22 and an antenna LB pad 23 on both sides of the milling slot 21, and the antenna LA pad 22 and the antenna LB pad 23 are respectively connected to both ends of a loop of the antenna coil 3.
  • the antenna LA welding pad 6 and the antenna LB welding pad 7 on the module 2 are electrically connected to the antenna LA pad 8 and the antenna LB pad 9 on the antenna coil 3, respectively.
  • the contact surface pads of the contacts where the antenna LA soldering pad 6 and the antenna LB soldering pad 7 are located are electrically connected to the chip LA pad 8 and the chip LB pad 9, respectively;
  • the antenna LA pad 8 and the antenna LB pad 9 are respectively disposed at both ends of the milling slot 21, and the antenna LA and LB solder pads correspond in position to the antenna LA and LB pads.
  • the pads provided on the module 2 and the chip 4 conform to the ISO7816 standard.
  • the antenna LA soldering pad 6, the antenna LB soldering pad 7, and the contact surface pad 5 are formed by copper foil on the circuit to be naturally conductive, and bridge the chip 4 and the antenna coil 3.
  • the chip LA pads 8 are also gold wires. (Or other form) electrically connected to the contact pad of C8.
  • the LB pad 9 of the chip is also electrically connected to the C4 contact pad.
  • the chip 2 is covered with an encapsulant on the soldering surface of the module 2, the gold wires and the contact pads of the C1, C2, C3, C5, C6, C7, C4, and C8 are covered and cured, The remaining part includes the antenna LA soldering pad 6 and the antenna LB soldering pad 7 is exposed.
  • the module is now packaged and then tested.
  • the antenna LA soldering pad 6 and the antenna LB soldering pad 7 of the module 2 are electrically connected to the antenna LA pad 22 and the antenna LB pad 23 of the antenna coil 3 by welding or other methods, and then the module 2 is flatly embedded.
  • the groove 21 is fixed on the surface of the card base, and the antenna connection part is hidden.
  • any one of the C4 and C8 bridges in the above embodiment can be replaced by a C6 contact.
  • one of the chip's LA pad or LB pad is electrically connected by gold wire bonding or the like. To C6 contact pad.
  • a hole can be punched in the extension of the C6 contact or C6 to an adjacent contact to form a bridge.
  • connection between the antenna LA and LB pads and the antenna LA and LB solder pads on the module can be other methods than welding, such as conductive adhesive connection, or antenna enameled wire direct welding (omitting the antenna LA and LB pads) ).
  • the size is calculated separately for compatibility.
  • the dual-interface smart card in this embodiment uses a 6-pin module, and the 6-pin module described in this application includes a single-interface strip unit and a chip; the single-interface strip unit is formed by cutting a single-interface strip, that is, the single-interface A strip is composed of several single-interface strip units.
  • An independent metal contact 11 (ie, a third contact) is provided between C1 and C5;
  • An independent metal contact 12 (ie, a fourth contact) is provided between C3 and C7, and the third contact and the fourth contact are indicated by hatched parts in FIG. 4; the third contact 11 and the fourth The contact 12 is electrically isolated from other contacts by insulating tape.
  • the third contact 11 and the fourth contact 12, and the other six contacts are also provided with contact surface pads 5, respectively.
  • the bases of the third contacts 11 and the fourth contacts 12 are respectively provided with base holes, and antenna LA welding pads 6 and antenna LB welding pads 7 are respectively provided on the two base holes;
  • the contact surface pads 5 of C1, C2, C3, C5, and C7 are respectively electrically connected to corresponding chip contact surface pads 10 on the chip 4; the antenna LA soldering pad 6 and the antenna The contact surface pad 5 of the contact where the antenna LB solder pad 7 is located is electrically connected to the chip LA pad 8 and the chip LB pad 9 respectively;
  • the antenna LA welding pad 6 and the antenna LB welding pad 7 are electrically connected to the antenna LA pad 22 and the antenna LB pad 23, respectively.
  • the side where C5-C7 is located is the width of the single-interface stripe unit
  • the side where C3, C7 is located is the height of the single-interface stripe unit
  • the axis is established with the center of the single-interface stripe unit as the origin.
  • the axis parallel to the width is the x-axis
  • the axis parallel to the height is the y-axis.
  • the actual height of the single interface strip unit is set to l (including the insulating tape on both sides), and the minimum reserved height of the contacts is p, C2 and C6.
  • the width is c (excluding the insulating tape on both sides), the width of C1, C3, C5, and C7 is d (excluding the insulating tape on both sides) and the height is m (excluding the insulating tape on both sides).
  • the height of the insulation strip is s,
  • the range of the third contact is:
  • the range of the fourth contact is:
  • the minimum allowable height of each contact is 2.0mm and the minimum reserved height is 9.62mm.
  • the width of the three contacts 11 is the width of C1
  • the width of the fourth contact 12 is the width of C3.
  • the dimensions of the antenna LA and LB soldering pads are respectively set to an oval shape or a track ring shape with a length and width of 1.5 * 0.8 mm.
  • the method of welding gold wires of other contacts, the method of encapsulating the module, the setting of the antenna LA and LB pads on the card base, the connection method of the module and the card antenna, etc., are the same as the first embodiment of the 8-contact dual interface smart card .
  • any one of the two bridge areas thereof is replaced by a C6 bridge.
  • the corresponding antenna LA or LB solder pads are arranged on the reverse side of the C6 copper foil area.
  • C6 and its solder pads can also appropriately extend the area borrowed from C5 and C7.
  • the sides of C5, C6, and C7 on the dual interface smart card are set to the width of the module.
  • the side where C3 and C7 are located is the height of the module, the coordinate axis is established with the center of the module as the origin, the axis parallel to the width is the x-axis, the axis parallel to the height is the y-axis, the actual height of the module is set to l, the module
  • the minimum reserved height is h (refer to Figure 3 for the minimum reserved height).
  • the widths of C1, C3, C5, and C7 are all d (excluding the insulation tape on both sides), and the widths of C2 and C6 are both c (excluding the insulation on both sides). band);
  • the extent of the extension area of C6 in the C5 area is:
  • the size is calculated separately.
  • the dual-interface smart card in this embodiment uses a 6-pin module. As shown in FIG. 5, there are a total of 6 contacts of C1, C2, C3, C5, C6, and C7.
  • the copper foil surface of the 6-pin module is provided with a central area surrounding The central area is provided with 6 contacts C1, C2, C3, C5, C6, C7; the contacts are electrically isolated from each other by an insulating tape;
  • a fifth contact 27 is provided between the C1 contact and a C5 contact, and a sixth contact 28 is provided between the C3 and C7 contacts; wherein the central area is surrounded by the extended copper foil area 25; the extended copper foil area 25 may be the extended copper foil area of the fifth contact, or the extended copper foil area of the sixth contact, or a combination of the extended copper foil area of the fifth contact and the sixth contact;
  • the fifth contact point and the sixth contact point are electrically isolated by an insulating tape; the fifth contact point, the sixth contact point, and the other contact points are electrically isolated from each other by an insulating tape.
  • FIG. 5 Shown in FIG. 5 is a case where the extended copper foil region 25 surrounding the center region is all the copper foil region of the fifth contact 27, in which case the fifth contact 27, the sixth contact 28, and others Contact surface pads are provided on the six contact areas; base holes are respectively provided on the substrates corresponding to the fifth contact 27 and the sixth contact 28, and antenna LA and LB welding pads are respectively provided on the two base holes;
  • the hole where the contact surface pad of the fifth contact is located is located on the extended copper foil area, and all or part of the hole may be located on the extended copper of the corresponding contact.
  • the contact surface pads are all disposed within the encapsulation range 26, and the antenna LA and LB solder pads are disposed outside the encapsulation range 26.
  • the contact surface pads 5 of C1, C2, C3, C5, and C7 are respectively electrically connected to corresponding chip contact surface pads on the chip 4;
  • the contact pads of the points are electrically connected to the chip LA and LB pads, respectively;
  • the antenna LA and LB solder pads are electrically connected to the antenna LA and LB pads, respectively.
  • the side where C5-C7 is located is the width of the single-interface stripe unit
  • the side where C3, C7 is located is the height of the single-interface stripe unit
  • the axis is established with the center of the single-interface stripe unit as the origin.
  • the axis parallel to the width is the x-axis
  • the axis parallel to the height is the y-axis.
  • the actual height of the single interface strip unit is set to l (including both sides of the insulation band), and the minimum reserved height of the contact is p (excluding both sides).
  • the width of C2 and C6 is c (excluding the insulation tape on both sides), the width of C1, C3, C5, and C7 is d (excluding the insulation tape on both sides) and the height is m (excluding the insulation tape on both sides) ), Let the height of the insulation tape separating the two contacts be s,
  • the range of the sixth contact between C3 and C7 is: among them,
  • the method of welding the gold wires of other contacts, the method of encapsulating the module, the setting of the antenna LA and LB pads on the card base, and the method of connecting the module and the card antenna are the same as those in the second embodiment.
  • any one of the two bridge areas thereof is replaced by a C6 bridge.
  • the corresponding antenna LA or LB solder pads are arranged on the reverse side of the C6 copper foil area.
  • C6 and its solder pads can also be extended to the copper foil areas of C5 and C7 as appropriate.
  • the specific extension range is the same as that of the second embodiment.
  • the size is calculated separately.

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Abstract

一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，在所述铜箔面上设置有C1-C8共8个触点，触点之间通过绝缘带（24）相互电隔离；将C4、C6和C8中的任两个触点作为第一触点和第二触点；在与第一触点、第二触点、C1、C2、C3、C5和C7触点对应的基材区域上都设置有孔洞；所述第一触点和第二触点所在的区域分别向相邻的触点进行延伸，形成第一延伸区和第二延伸区；所述第一延伸区和第二延伸区对应的基材区域上分别设置有第一基孔和第二基孔。一种使用该单界面条带的单元的条带和模块（2），以及应用所述模块（2）的智能卡。该单界面条带单元、使用该单界面条带的单元的条带和模块（2）、以及应用所述模块（2）的智能卡兼容性较好，推广灵活性较高。

Description

一种单界面条带单元、单界面条带、模块和智能卡 技术领域
本申请涉及智能卡技术领域，尤其涉及一种单界面条带单元、单界面条带、模块和智能卡。
背景技术
现有双界面智能芯片卡(IC卡)拥有接触式与非接触式读写操作功能，市场上双界面IC模块主要使用专门的双界面条带封装，双界面条带含有两层铜箔，也即接触面(以下可使用“正面”代指)铜箔用于接触式界面，和焊接面(或压焊面、包封面，以下可使用“焊接面”代指)铜箔用于非接触界面，因此需要在条带上制造正反两层铜箔，并在其上进行刻蚀、镀镍、镀金等工艺。这就导致双界面条带价格高于单界面条带。
焊接面的触点和电路在条带生产工艺中形成，经过模块封装制程后，导通了芯片的非接触界面电路，以及卡片内嵌的天线线圈回路，使得IC卡非接触功能得以实现。行业上按照ISO标准，把有8个触点的大模块称为8PIN模块。而有6个触点的小模块称为6PIN模块。8pin模块的8个接触界面焊点按照ISO-7816分别以C1、C2、…、C8标识。其中，C4和C8设计为保留区，不具有实际用处，而C6原来设计为对EEPROM供电，但因后来EEPROM所需的程序电压(Programming Voltage)由芯片内直接控制，所以C6通常也就不再使用了。
基于以上，现有技术中已提出利用单界面条带来封装双界面模块， 如专利号201710245152.1的发明申请，其原理是利用8pin的模块上保留和不被使用的C4、C8、C6区通过基材冲孔来桥接模块焊接面的非接触界面的金线和卡基天线，从而省略焊接面的铜箔制造。但这种设计局限8pin模块上已有的C4、C8或C6区域，使得其非接天线焊盘位置与现有的设计不符、因此在封测、制卡工艺上兼容性较差，使双界面模块在市场上的进一步推广不够灵活。
发明内容
为解决上述问题，本申请一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，在所述铜箔面上设置有C1-C8共8个触点，触点之间通过绝缘带相互电隔离；
将C4、C6和C8中的任两个触点作为第一触点和第二触点；在与第一触点、第二触点、C1、C2、C3、C5和C7触点对应的基材区域上都设置有孔洞；
所述第一触点和第二触点所在的区域分别向相邻的触点进行延伸，形成第一延伸区和第二延伸区；所述第一延伸区和第二延伸区对应的基材区域上分别设置有第一基孔和第二基孔。
优选的，其中，将C5-C8触点所在的边设置为所述单界面条带单元的宽度，C1、C5所在的边设置为所述单界面条带单元的高度，以所述单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置所述单界面条带单元的实际高度为l，单界面条带单元的最小保留高度为h，C2、C3、C6、C7的宽度都为a，C1、C4、C5、C8的宽度都为b，设隔离两个触点之间的绝缘带的高度为s；
则可得到：
C8在C6、C7上的延伸区范围为：
Figure PCTCN2019099598-appb-000001
在C5上的延伸区范围为：
Figure PCTCN2019099598-appb-000002
C6在C5上的延伸区范围为：
Figure PCTCN2019099598-appb-000003
在C7上的延伸区范围为：
Figure PCTCN2019099598-appb-000004
在C8上的延伸区范围为：
Figure PCTCN2019099598-appb-000005
C4在C3、C2上的延伸区范围为：
Figure PCTCN2019099598-appb-000006
C4在C1上的延伸区范围为：
Figure PCTCN2019099598-appb-000007
本申请还提供一种使用上述单界面条带单元的单界面条带，其中，所述单界面条带由至少两个所述单界面条带单元构成。
本申请还提供一种使用上述单界面条带单元的模块，其中，所述模块包括单界面条带单元和芯片；
其中，所述单界面条带单元上，与所述铜箔面相对的面为焊接面，所述芯片设置在所述焊接面上；
所述焊接面上，在触点对应的孔洞的位置设置接触面焊盘，所述孔洞使所述触点与相应的接触面焊盘电导通；
所述芯片上设置有芯片LA焊盘、芯片LB焊盘，以及与C1、C2、C3、C5和C7触点的接触面焊盘对应电连接的芯片接触面焊盘；
设所述第一触点和第二触点的接触面焊盘分别为LA接触面焊盘和LB接触面焊盘；
所述LA接触面焊盘和LB接触面焊盘分别与所述芯片LA焊盘和所述芯片LB焊盘电连接；
所述单界面条带单元的焊接面上，所述第一基孔和第二基孔的位置 上分别设置天线LA焊接焊盘和天线LB焊接焊盘；所述第一基孔和第二基孔使第一触点和第二触点与天线LA焊接焊盘和天线LB焊接焊盘电导通。
本申请还提供一种使用上述模块的智能卡，包括卡基、模块和天线线圈，所述天线线圈设置在所述卡基内部，所述卡基表面设置有铣槽，所述模块镶嵌在铣槽内；
所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线线圈回路的两端电连接。
优选的，其中，所述卡基上设置天线LA焊盘和天线LB焊盘，所述天线LA焊盘和天线LB焊盘分别连接所述天线线圈回路的两端；
所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线LA焊盘和所述天线LB焊盘电连接。
优选的，其中，所述天线LA焊盘和天线LB焊盘分别设置在所述卡基上铣槽的相对两端，所述天线LA焊接焊盘和所述天线LB焊接焊盘分别设置在与所述天线LA焊盘和所述天线LB焊盘对应的位置。
优选的，其中，所述天线LA焊接焊盘和所述天线LB焊接焊盘与所述天线线圈回路的两端采取天线漆包线直焊的方法连接。
优选的，其中，所述天线LA焊盘和所述LB焊盘与所述天线LA焊接焊盘和所述天线LB焊接焊盘的连接方式为焊接或导电胶连接。
本申请还提供一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，所述铜箔面设置有中心区，围绕中心区设置有C1、C2、C3、C5、C6、C7共6个触点，其中，C5触点的铜箔区包围所述中心区；触点之间通过绝缘带相互电隔离；
在C1触点和C5触点之间设置第三触点，在C3和C7之间设置第四触点；所述第三触点、第四触点和其他触点之间分别通过绝缘带电隔离；
所述第三触点、第四触点、C1、C2、C3、C5、C6、C7触点对应的基 材区域上都设置有孔洞；
所述第三触点和第四触点在对应基材区域的位置上分别设置有第三基孔和第四基孔。
优选的，其中，将C5-C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元的实际高度为l，触点的最小保留高度为p，C2和C6的宽度为c，C1、C3、C5、C7的宽度为d、高度为m，设隔离两个触点之间的绝缘带的高度为s，
则有第三触点的范围为：
Figure PCTCN2019099598-appb-000008
其中，
Figure PCTCN2019099598-appb-000009
第四触点的范围为：
Figure PCTCN2019099598-appb-000010
其中，
Figure PCTCN2019099598-appb-000011
优选的，其中，用C6和/或C6向相邻触点延伸的延伸区代替第三触点或第四触点中的任一个。
优选的，其中，将C5、C6、C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元实际高度为l，模块的最小保留高度为h，C1、C3、C5、C7的宽度都为d，C2、C6的宽度都为c，隔离两个触点之间的绝缘带的高度为s；
则C6在C5区域延伸的延伸区范围为：
Figure PCTCN2019099598-appb-000012
则C6在C7区域延伸的延伸区范围为：
Figure PCTCN2019099598-appb-000013
本申请还提供一种使用上述单界面条带单元的单界面条带，其中，所述单界面条带由至少两个所述单界面条带单元构成。
本申请还提供一种使用上述单界面条带单元的模块，其中，所述模块包括单界面条带单元和芯片；
其中，单界面条带单元上与所述铜箔面相对的面为焊接面，所述芯片设置在所述焊接面上；
所述焊接面上，在触点对应的孔洞的位置设置接触面焊盘；所述孔洞使所述触点与相应的接触面焊盘电导通；
所述芯片上设置有芯片LA焊盘、芯片LB焊盘以及与C1、C2、C3、C5和C7触点的接触面焊盘对应电连接的芯片接触面焊盘；
所述第三触点、第四触点在焊接面上对应的孔洞位置分别设置有LA接触面焊盘和LB接触面焊盘；所述第三触点、第四触点通过对应的孔洞与所述LA接触面焊盘和LB接触面焊盘电导通；
所述LA接触面焊盘和LB接触面焊盘分别与所述芯片LA焊盘和所述芯片LB焊盘电连接；
所述单界面条带单元的焊接面上，所述第三基孔和第四基孔的位置上分别设置有天线LA焊接焊盘和天线LB焊接焊盘，所述第三基孔和第四基孔使第三触点和第四触点与天线LA焊接焊盘和天线LB焊接焊盘电导通。
本申请还提供一种使用上述模块的智能卡，包括卡基、模块和天线线圈，所述天线线圈设置在所述卡基内部，所述卡基表面设置有铣槽，所述模块镶嵌在铣槽内；
所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线线圈回路的两端电连接。
优选的，其中，所述卡基上设置天线LA焊盘和天线LB焊盘，所述天线LA焊盘和天线LB焊盘分别连接所述天线线圈回路的两端；
所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线LA焊盘和所述天线LB焊盘电连接。
优选的，其中，所述天线LA焊盘和天线LB焊盘分别设置在所述卡基上铣槽的相对两端，所述天线LA焊接焊盘和所述天线LB焊接焊盘分别设置在与所述天线LA焊盘和所述天线LB焊盘对应的位置。
优选的，其中，所述天线LA焊接焊盘和所述天线LB焊接焊盘与所述天线线圈回路的两端采取天线漆包线直焊的方法连接。
优选的，其中，所述天线LA焊盘和所述LB焊盘与所述天线LA焊接焊盘和所述天线LB焊接焊盘的连接方式为焊接或导电胶连接。
本申请还提供一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，所述铜箔面设置有中心区，围绕中心区设置有C1、C2、C3、C5、C6、C7共6个触点；触点之间通过绝缘带相互电隔离；
在C1触点和C5触点之间设置第五触点，在C3和C7之间设置第六触点；其中，所述中心区被延伸铜箔区包围；所述延伸铜箔区为第五触点的延伸铜箔区、第六触点的延伸铜箔区或第五触点和第六触点的延伸铜箔区的结合；
所述第五触点、第六触点之间通过绝缘带隔离；第五触点、第六触点和其他触点之间分别通过绝缘带电隔离；
所述第五触点、第六触点、C1、C2、C3、C5、C6、C7触点对应的基材区域上都设置有孔洞；
所述第五触点和第六触点在对应基材区域的位置上分别设置有第 三基孔和第四基孔。
优选的，其中，所述孔洞的全部或部分设置在相应触点的延伸铜箔区上。
优选的，其中，将C5-C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元的实际高度为l，触点的最小保留高度为p，C2和C6的宽度为c，C1、C3、C5、C7的宽度为d、高度为m，设隔离两个触点之间的绝缘带的高度为s，
则有第五触点在C1和C5之间设置的铜箔区的范围为：
Figure PCTCN2019099598-appb-000014
其中，
Figure PCTCN2019099598-appb-000015
第六触点在C3和C7之间设置的铜箔区的范围为：
Figure PCTCN2019099598-appb-000016
其中，
Figure PCTCN2019099598-appb-000017
优选的，其中，用C6和/或C6向相邻触点延伸的延伸区代替第五触点或第六触点中的任一个。
优选的，其中，将C5、C6、C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元实际高度为l，模块的最小保留高度为h，C1、C3、C5、C7的宽度都为d，C2、C6的宽度都为c，隔离两个触点之间的绝缘带的高度为s；
则C6在C5区域延伸的延伸区范围为：
Figure PCTCN2019099598-appb-000018
则C6在C7区域延伸的延伸区范围为：
Figure PCTCN2019099598-appb-000019
本申请还提供一种使用上述单界面条带单元的单界面条带，其中，所述单界面条带由至少两个所述单界面条带单元构成。
本申请还提供一种使用上述单界面条带单元的模块，其中，所述模块包括单界面条带单元和芯片；
其中，单界面条带单元上与所述铜箔面相对的面为焊接面，所述芯片设置在所述焊接面上；
所述焊接面上，在触点对应的孔洞的位置设置接触面焊盘；所述孔洞使所述触点与相应的接触面焊盘电导通；
所述芯片上设置有芯片LA焊盘、芯片LB焊盘以及与C1、C2、C3、C5和C7触点的接触面焊盘对应电连接的芯片接触面焊盘；
所述第三触点、第四触点在焊接面上对应的孔洞位置分别设置有LA接触面焊盘和LB接触面焊盘；所述第三触点、第四触点通过对应的孔洞与所述LA接触面焊盘和LB接触面焊盘电导通；
所述LA接触面焊盘和LB接触面焊盘分别与所述芯片LA焊盘和所述芯片LB焊盘电连接；
所述单界面条带单元的焊接面上，所述第三基孔和第四基孔的位置上分别设置有天线LA焊接焊盘和天线LB焊接焊盘，所述第三基孔和第四基孔使第三触点和第四触点与天线LA焊接焊盘和天线LB焊接焊盘电导通。
本申请还提供一种使用上述模块的智能卡，包括卡基、模块和天线线圈，所述天线线圈设置在所述卡基内部，所述卡基表面设置有铣槽，所述模块镶嵌在铣槽内；
所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线线圈回路的两端电连接。
优选的，其中，所述卡基上设置天线LA焊盘和天线LB焊盘，所述天线LA焊盘和天线LB焊盘分别连接所述天线线圈回路的两端；
所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线LA焊盘和所述天线LB焊盘电连接。
优选的，其中，所述天线LA焊盘和天线LB焊盘分别设置在所述卡基上铣槽的相对两端，所述天线LA焊接焊盘和所述天线LB焊接焊盘分别设置在与所述天线LA焊盘和所述天线LB焊盘对应的位置。
优选的，其中，所述天线LA焊接焊盘和所述天线LB焊接焊盘与所述天线线圈回路的两端采取天线漆包线直焊的方法连接。
优选的，其中，所述天线LA焊盘和所述LB焊盘与所述天线LA焊接焊盘和所述天线LB焊接焊盘的连接方式为焊接或导电胶连接。
本发明在模块的C4、C8、C6区的扩展区上通过基材冲孔来桥接模块焊接面的非接触界面的金线和卡基天线，从而省略焊接面的铜箔制造，本设计不局限于模块中已有的C4、C8或C6区域，使得其非接天线焊盘位置与现有的设计相符、在封测、制卡工艺上具有良好的兼容性，提高了市场推广度。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域技术人员来讲，还可以根据这些附图获得其他的附图。
图1为现有技术中采用单界面条带的双界面智能卡的整体结构示意图。
图2为本实施例1中天线LA焊盘和天线LB焊盘在铣槽上的位置图。
图3为实施例1中8pin模块的结构图。
图4为实施例2中6pin模块的结构图。
图5为实施例3中6pin模块的结构图。
附图标记：
1卡基 2模块 3天线线圈 4芯片
5接触面焊盘 6天线LA焊接焊盘 7天线LB焊接焊盘
8芯片LA焊盘 9芯片LB焊盘 10芯片接触面焊盘
11第三触点 12第四触点
21铣槽 22天线LA焊盘 23天线LB焊盘 24绝缘带
25延伸铜箔区 26包封胶范围 27第五触点 28第六触点。
具体实施方式
下面结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的单界面条带是指在基材的一面覆有铜箔的条带，在基材的另一面设置芯片，单界面条带是通过在基材上设置天线焊盘孔洞使铜箔和芯片电导通。
用于智能卡的模块分为8pin模块和6pin模块两种，其内部结构分别如图3和图4所示。
实施例一
本实施例中提供一种8触点模块的智能卡，如图1所示，本申请智能卡包括卡基1、模块2和天线线圈3，所述天线线圈3设置在所述卡 基1的内部，所述卡基1表面设置有铣槽21，所述模块2镶嵌在铣槽21上；
本申请模块2包括单界面条带单元和芯片；所述单界面条带单元是由单界面条带切割形成，也就是说所述单界面条带是由若干个单界面条带单元构成。
所述单界面条带单元包括基材，所述基材的一面覆有铜箔，在铜箔所在的面设置有C1-C8共8个触点，触点之间通过绝缘带相互电隔离；本实施例中，所述基材为环氧玻璃基材。
所述智能卡的模块包括单界面条带单元和芯片4，所述芯片4设置在单界面条带的基材的覆铜面的另一面；本发明双界面智能卡整体结构如图1、图2所示，包括卡基1、卡基1内部的天线线圈3以及镶嵌在卡基1的铣槽21上的模块2；
其中，如图3所示，C1-C8共8个触点的其位置和尺寸符合ISO7816标准，在与第一触点、第二触点、C1、C2、C3、C5和C7触点对应的基材区域上都设置有贯穿基材的孔洞；在相应的孔洞的位置上设置有每个触点的接触面焊盘，所述接触面焊盘设置在模块的铜箔所在面的反面；通过设置孔洞，使触点与其接触面焊盘电导通；
在现有技术中，C6早期定义为编程电压接触点(Vpp)，现在已经不常用，实践中只在SIM卡中用于SWP接口；而C4和C8被保留，实践中被用于USB高速接口，或其它异形天线接口，现在也不常用。
因此，我们将C4向C3、C2和C1的外侧区域进行延伸；将C8向C7、C6和C5的外侧区域进行延伸，形成两个延伸区；
其中，将模块上C5-C8所在的边设置为模块的宽度，C1、C5所在的边设置为模块的高度，为使该模块能被读取，所述模块的高度必须大于一定的保留高度，也就是C8向C5、C6、C7的延伸区范围需设置为由模 块上C5-C8所在的边到距离该边小于一定高度的区域。
其中，以模块的中心为原点建立坐标轴，设与智能卡模块宽度平行的轴为x轴，与智能卡模块高度平行的轴为y轴，设置模块实际高度为l(包括两侧绝缘带)，模块的最小保留高度为h，触点之间绝缘带的宽度为s，C2、C3、C6、C7的宽度都为a(不包括两侧绝缘带)，C1、C4、C5、C8的宽度都为b(不包括两侧绝缘带)；
则可得到：
C8在C6、C7上的延伸区范围为：
Figure PCTCN2019099598-appb-000020
在C5上的延伸区范围为：
Figure PCTCN2019099598-appb-000021
C6在C5上的延伸区范围为：
Figure PCTCN2019099598-appb-000022
在C7上的延伸区范围为：
Figure PCTCN2019099598-appb-000023
在C8上的延伸区范围为：
Figure PCTCN2019099598-appb-000024
C4在C3、C2上的延伸区范围为：
Figure PCTCN2019099598-appb-000025
C4在C1上的延伸区范围为：
Figure PCTCN2019099598-appb-000026
本实施例中，模块的高度为12.6mm，根据ISO/IEC7816-2定义的内容，可得到为了能让该模块被读卡器读取，其最小保留高度为9.62mm，其中，电隔离两个触点的绝缘带24宽度为0.15mm；
则可得到C8能够向C5、C6、C7设置的延伸区的最大高度为(12.6-9.62)/2-0.15＝1.34mm；
同理，C4在C1、C2、C3触点上可以设置延伸区的最大高度为：(12.6-9.62)/2-0.15＝1.34mm；
在上述C4和C8可设置延伸区的模块的环氧玻璃基材上各设置一个 天线焊盘孔洞，本实施例中，所述天线焊盘孔洞形状为环形跑道形或椭圆形，尺寸为2.2*1mm；设模块上的覆铜箔的一面为模块的铜箔面，模块上的覆铜箔的一面为焊接面，则在模块的焊接面上的天线焊盘孔洞处设置天线LA焊接焊盘6和天线LB焊接焊盘7；
所述芯片4上设置有芯片LA焊盘8、芯片LB焊盘9以及与C1、C2、C3、C5、C7触点的接触面焊盘5连接的共5个芯片接触面焊盘10；
天线线圈3在铣槽21两侧上设置有天线LA焊盘22和天线LB焊盘23，所述天线LA焊盘22和天线LB焊盘23分别连接天线线圈3的回路的两端。
所述模块2上的天线LA焊接焊盘6和所述天线LB焊接焊盘7分别与天线线圈3上的所述天线LA焊盘8和所述天线LB焊盘9电连接。
所述天线LA焊接焊盘6和所述天线LB焊接焊盘7所在的触点的接触面焊盘分别与所述芯片LA焊盘8和所述芯片LB焊盘9电连接；
所述天线LA焊盘8和天线LB焊盘9分别设置在铣槽21的两端，所述天线LA、LB焊接焊盘在位置上与所述天线LA、LB焊盘对应。
其中，模块2与芯片4上开设的焊盘符合ISO7816标准。
对C8做与C4同样的设计改动，在模块的高度大于最小保留高度的情况下，向C7、C6、C5触点区域进行延伸，形成延伸区，在延伸区上冲孔，在模块的焊接面冲孔的位置设置天线LB焊接焊盘，形成另一路桥接。
通过上述设置，将天线LA焊接焊盘6、天线LB焊接焊盘7和接触面焊盘5在电路上由铜箔形成自然导通，并桥接芯片4和天线线圈3。
在模块封装的过程中，除了将C1、C2、C3、C5、C7的接触面焊盘与对应的芯片接触面焊盘之间通过金线压焊以外，还将芯片LA焊盘8用金线(或其它形式)电连接至C8的接触面焊盘。同样将芯片的LB焊盘 9电连接至C4接触面焊盘。
在包封工序中，在模块2的焊接面用包封胶覆盖芯片、将各金线以及C1、C2、C3、C5、C6、C7和C4、C8接触面焊盘封胶覆盖并固化，而将其余部位包括天线LA焊接焊盘6，天线LB焊接焊盘7暴露。模块至此封装完毕，再经测试工序。
最后将模块2的天线LA焊接焊盘6，天线LB焊接焊盘7分别与天线线圈3的天线LA焊盘22和天线LB焊盘23使用焊接或其它方法电连接，再将模块2平整的嵌入在铣槽21上并粘合固定于卡基表面，天线连接部件则被隐藏。
作为一个可选的实施例，上述实施例的C4、C8两路桥接中任意一路可以用C6触点来代替，此时芯片LA焊盘或LB焊盘之一通过金丝压焊等方法电连接到C6的接触面焊盘。
使用C6触点作为替代时，在模块的高度大于最小保留高度的情况下，可以在C6触点或C6向相邻触点的延伸区上冲孔，形成桥接。
所述天线LA、LB焊盘和模块上的天线LA、LB焊接焊盘的连接可以采取焊接以外的其它方法，如导电胶连接，或采取天线漆包线直焊的方法(省略天线LA、LB焊盘)。
如果设计尺寸上还需兼顾卡片必须遵循的其它行业标准，则尺寸另行计算取其兼容。
实施例二：
本实施例中的双界面智能卡采用6pin模块，本申请所述6pin模块包括单界面条带单元和芯片；所述单界面条带单元是由单界面条带切割形成，也就是说所述单界面条带是由若干个单界面条带单元构成。
在6pin模块使用的单界面条带单元的中心设置有中心区，围绕中心区设置有C1、C2、C3、C5、C6、C7共6个触点，其中，C5触点的铜箔区包 围所述中心区；触点之间通过绝缘带相互电隔离；
在C1和C5之间设置一个独立的金属触点11(即第三触点)；
在C3和C7之间设置一个独立的金属触点12(即第四触点)，第三触点和第四触点在图4中由阴影部分表示；所述第三触点11和第四触点12与其他触点通过绝缘带电隔离。
所述第三触点11和第四触点12，以及其它6个触点上也分别设置接触面焊盘5；
第三触点11和第四触点12的基材上分别设置基孔，在两个基孔上分别设置天线LA焊接焊盘6和天线LB焊接焊盘7；
与实施例一同理，C1、C2、C3、C5、C7的接触面焊盘5分别与所述芯片4上对应的芯片接触面焊盘10电连接；所述天线LA焊接焊盘6和所述天线LB焊接焊盘7所在的触点的接触面焊盘5分别与所述芯片LA焊盘8和所述芯片LB焊盘9电连接；
所述天线LA焊接焊盘6和所述天线LB焊接焊盘7分别与所述天线LA焊盘22和所述天线LB焊盘23电连接。
其中，将C5-C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元的实际高度为l(包括两侧绝缘带)，触点的最小保留高度为p，C2和C6的宽度为c(不包括两侧绝缘带)，C1、C3、C5、C7的宽度为d(不包括两侧绝缘带)、高度为m(不包括两侧绝缘带)，设隔离两个触点之间的绝缘带的高度为s，
则有第三触点的范围为：
Figure PCTCN2019099598-appb-000027
其中，
Figure PCTCN2019099598-appb-000028
第四触点的范围为：
Figure PCTCN2019099598-appb-000029
其中，
Figure PCTCN2019099598-appb-000030
根据ISO/IEC 7816-2定义的各触点的最小允许高度2.0mm，最小保留高度为9.62mm，可以计算出第三触点11和第四触点12的最大高度为9.62-2*2-2*0.15＝5.32mm，在C1和C5之间设置的第三触点11将C1和C5均匀等分；在C3和C7之间设置的第四触点12将C3和C7均匀等分，第三触点11的宽度为C1的宽度，第四触点12的宽度为C3的宽度。
天线LA、LB焊接焊盘的尺寸分别设为长宽为1.5*0.8mm的椭圆形或跑道环形。
其它触点的金线焊接的方法，模块的包封方法，卡基上天线LA、LB焊盘的设置，模块和卡片天线的连接方法等等，和8触点双界面智能卡的实施例一相同。
在上述方法中，作为另一个可选的实施例，如果其两路桥接区中任意一路以C6的桥接来代替，也可行。此时其相应的天线LA或LB焊接焊盘设置在C6铜箔区的反面。
而此种情况下如有必要，C6及其焊接焊盘也可适当延伸借用C5，C7的面积，和实施例一类似，将双界面智能卡上C5、C6、C7所在的边设置为模块的宽度，C3、C7所在的边设置为模块的高度，以模块的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置模块实际高度为l，模块的最小保留高度为h(最小保留高度参考图3)，C1、C3、C5、C7的宽度都为d(不包括两侧绝缘带)，C2、C6的宽度都为c(不包括两侧绝缘带)；
则C6在C5区域延伸的延伸区范围为：
Figure PCTCN2019099598-appb-000031
则C6在C7区域延伸的延伸区范围为：
Figure PCTCN2019099598-appb-000032
如果桥接区设计尺寸上还需兼顾其它行业标准，则尺寸另行计算。
实施例三：
本实施例中的双界面智能卡采用6pin模块，如图5所示，有C1、C2、C3、C5、C6、C7总共6个触点，6pin模块的所述铜箔面设置有中心区，围绕中心区设置有C1、C2、C3、C5、C6、C7共6个触点；触点之间通过绝缘带相互电隔离；
在C1触点和C5触点之间设置第五触点27，在C3和C7之间设置第六触点28；其中，所述中心区被延伸铜箔区25包围；所述延伸铜箔区25可以是第五触点的延伸铜箔区、也可以是第六触点的延伸铜箔区，或者是第五触点和第六触点的延伸铜箔区的结合；
所述第五触点、第六触点之间通过绝缘带电隔离；第五触点、第六触点和其他触点之间分别通过绝缘带电隔离。
图5中显示的是围绕中心区的延伸铜箔区25全部为第五触点27的铜箔区的情况，在该情况下，所述第五触点27、第六触点28，以及其它6个触点区上分别设置接触面焊盘；第五触点27和第六触点28对应的基材上分别设置基孔，在两个基孔上分别设置天线LA、LB焊接焊盘；
根据图5我们可以看到，所述第五触点的接触面焊盘所在的孔设置在延伸铜箔区上，也可以将所述孔洞的全部或孔洞的一部分设置在相应触点的延伸铜箔区上，在本实施例中，为了封装方便，所述接触面焊盘都设置在包封胶范围26内，所述天线LA、LB焊接焊盘设置在包封胶范围26以外。
同理实施例二，C1、C2、C3、C5、C7的接触面焊盘5分别与所述芯片 4上对应的芯片接触面焊盘电连接；所述天线LA、LB焊接焊盘所在的触点的接触面焊盘分别与所述芯片LA、LB焊盘电连接；
所述天线LA、LB焊接焊盘分别与所述天线LA、LB焊盘电连接。
其中，将C5-C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元的实际高度为l(包括两侧绝缘带)，触点的最小保留高度为p(不包括两侧绝缘带)，C2和C6的宽度为c(不包括两侧绝缘带)，C1、C3、C5、C7的宽度为d(不包括两侧绝缘带)、高度为m(不包括两侧绝缘带)，设隔离两个触点之间的绝缘带的高度为s，
则有第五触点在C1和C5之间的范围为：
Figure PCTCN2019099598-appb-000033
其中，
Figure PCTCN2019099598-appb-000034
第六触点在C3和C7之间的范围为：
Figure PCTCN2019099598-appb-000035
其中，
Figure PCTCN2019099598-appb-000036
其它触点的金线焊接的方法，模块的包封方法，卡基上天线LA、LB焊盘的设置，模块和卡片天线的连接方法等等，和实施例二相同。
在上述方法中，作为另一个可选的实施例，如果其两路桥接区中任意一路以C6的桥接来代替，也可行。此时其相应的天线LA或LB焊接焊盘设置在C6铜箔区的反面。
而此种情况下如有必要，C6及其焊接焊盘也可适当延伸到C5，C7的铜箔区，具体可以延伸的范围与实施例二相同。
如果桥接区设计尺寸上还需兼顾其它行业标准，则尺寸另行计算。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。
所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (32)

  1. 一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，在所述铜箔面上设置有C1-C8共8个触点，触点之间通过绝缘带相互电隔离；
    将C4、C6和C8中的任两个触点作为第一触点和第二触点；在与第一触点、第二触点、C1、C2、C3、C5和C7触点对应的基材区域上都设置有孔洞；
    所述第一触点和第二触点所在的区域分别向相邻的触点进行延伸，形成第一延伸区和第二延伸区；所述第一延伸区和第二延伸区对应的基材区域上分别设置有第一基孔和第二基孔。
  2. 根据权利要求1所述的单界面条带单元，其中，将C5-C8触点所在的边设置为所述单界面条带单元的宽度，C1、C5所在的边设置为所述单界面条带单元的高度，以所述单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置所述单界面条带单元的实际高度为l，单界面条带单元的最小保留高度为h，C2、C3、C6、C7的宽度都为a，C1、C4、C5、C8的宽度都为b，设隔离两个触点之间的绝缘带的高度为s；
    则可得到：
    C8在C6、C7上的延伸区范围为：
    Figure PCTCN2019099598-appb-100001
    在C5上的延伸区范围为：
    Figure PCTCN2019099598-appb-100002
    C6在C5上的延伸区范围为：
    Figure PCTCN2019099598-appb-100003
    在C7上的延伸区范围为：
    Figure PCTCN2019099598-appb-100004
    在C8上的延伸区范围为：
    Figure PCTCN2019099598-appb-100005
    C4在C3、C2上的延伸区范围为：
    Figure PCTCN2019099598-appb-100006
    C4在C1上的延伸区范围为：
    Figure PCTCN2019099598-appb-100007
  3. 一种使用如权利要求1或2所述的单界面条带单元的单界面条带，其中，所述单界面条带由至少两个所述单界面条带单元构成。
  4. 一种使用如权利要求1或2所述的单界面条带单元的模块，其中，所述模块包括单界面条带单元和芯片；
    其中，所述单界面条带单元上，与所述铜箔面相对的面为焊接面，所述芯片设置在所述焊接面上；
    所述焊接面上，在触点对应的孔洞的位置设置接触面焊盘，所述孔洞使所述触点与相应的接触面焊盘电导通；
    所述芯片上设置有芯片LA焊盘、芯片LB焊盘，以及与C1、C2、C3、C5和C7触点的接触面焊盘对应电连接的芯片接触面焊盘；
    设所述第一触点和第二触点的接触面焊盘分别为LA接触面焊盘和LB接触面焊盘；
    所述LA接触面焊盘和LB接触面焊盘分别与所述芯片LA焊盘和所述芯片LB焊盘电连接；
    所述单界面条带单元的焊接面上，所述第一基孔和第二基孔的位置上分别设置天线LA焊接焊盘和天线LB焊接焊盘；所述第一基孔和第二基孔使第一触点和第二触点与天线LA焊接焊盘和天线LB焊接焊盘电导通。
  5. 一种使用如权利要求4所述的模块的智能卡，包括卡基、模块和天线线圈，所述天线线圈设置在所述卡基内部，所述卡基表面设置有铣槽，所述模块镶嵌在铣槽内；
    所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线线圈回 路的两端电连接。
  6. 根据权利要求5所述的智能卡，其中，所述卡基上设置天线LA焊盘和天线LB焊盘，所述天线LA焊盘和天线LB焊盘分别连接所述天线线圈回路的两端；
    所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线LA焊盘和所述天线LB焊盘电连接。
  7. 根据权利要求6所述的智能卡，其中，所述天线LA焊盘和天线LB焊盘分别设置在所述卡基上铣槽的相对两端，所述天线LA焊接焊盘和所述天线LB焊接焊盘分别设置在与所述天线LA焊盘和所述天线LB焊盘对应的位置。
  8. 根据权利要求5所述的智能卡，其中，所述天线LA焊接焊盘和所述天线LB焊接焊盘与所述天线线圈回路的两端采取天线漆包线直焊的方法连接。
  9. 根据权利要求6所述的智能卡，其中，所述天线LA焊盘和所述LB焊盘与所述天线LA焊接焊盘和所述天线LB焊接焊盘的连接方式为焊接或导电胶连接。
  10. 一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，所述铜箔面设置有中心区，围绕中心区设置有C1、C2、C3、C5、C6、C7共6个触点，其中，C5触点的铜箔区包围所述中心区；触点之间通过绝缘带相互电隔离；
    在C1触点和C5触点之间设置第三触点，在C3和C7之间设置第四触点；所述第三触点、第四触点和其他触点之间分别通过绝缘带电隔离；
    所述第三触点、第四触点、C1、C2、C3、C5、C7触点对应的基材区域上都设置有孔洞；
    所述第三触点和第四触点在对应基材区域的位置上分别设置有第 三基孔和第四基孔。
  11. 根据权利要求10所述的单界面条带单元，其中，将C5-C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元的实际高度为l，触点的最小保留高度为p，C2和C6的宽度为c，C1、C3、C5、C7的宽度为d、高度为m，设隔离两个触点之间的绝缘带的高度为s，
    则有第三触点的范围为：
    Figure PCTCN2019099598-appb-100008
    其中，
    Figure PCTCN2019099598-appb-100009
    第四触点的范围为：
    Figure PCTCN2019099598-appb-100010
    其中，
    Figure PCTCN2019099598-appb-100011
  12. 根据权利要求10所述的单界面条带单元，其中，用C6和/或C6向相邻触点延伸的延伸区代替第三触点或第四触点中的任一个。
  13. 根据权利要求12所述的单界面条带单元，其中，将C5、C6、C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元实际高度为l，模块的最小保留高度为h，C1、C3、C5、C7的宽度都为d，C2、C6的宽度都为c，隔离两个触点之间的绝缘带的高度为s；
    则C6在C5区域延伸的延伸区范围为：
    Figure PCTCN2019099598-appb-100012
    则C6在C7区域延伸的延伸区范围为：
    Figure PCTCN2019099598-appb-100013
  14. 一种使用如权利要求10-13任一项所述的单界面条带单元的单界面条带，其中，所述单界面条带由至少两个所述单界面条带单元构成。
  15. 一种使用如权利要求10-13任一项所述的单界面条带单元的模块，其中，所述模块包括单界面条带单元和芯片；
    其中，单界面条带单元上与所述铜箔面相对的面为焊接面，所述芯片设置在所述焊接面上；
    所述焊接面上，在触点对应的孔洞的位置设置接触面焊盘；所述孔洞使所述触点与相应的接触面焊盘电导通；
    所述芯片上设置有芯片LA焊盘、芯片LB焊盘以及与C1、C2、C3、C5和C7触点的接触面焊盘对应电连接的芯片接触面焊盘；
    所述第三触点、第四触点在焊接面上对应的孔洞位置分别设置有LA接触面焊盘和LB接触面焊盘；所述第三触点、第四触点通过对应的孔洞与所述LA接触面焊盘和LB接触面焊盘电导通；
    所述LA接触面焊盘和LB接触面焊盘分别与所述芯片LA焊盘和所述芯片LB焊盘电连接；
    所述单界面条带单元的焊接面上，所述第三基孔和第四基孔的位置上分别设置有天线LA焊接焊盘和天线LB焊接焊盘，所述第三基孔和第四基孔使第三触点和第四触点与天线LA焊接焊盘和天线LB焊接焊盘电导通。
  16. 一种使用如权利要求15所述的模块的智能卡，包括卡基、模块和天线线圈，所述天线线圈设置在所述卡基内部，所述卡基表面设置有铣槽，所述模块镶嵌在铣槽内；
    所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线线圈回路的两端电连接。
  17. 根据权利要求16所述的智能卡，其中，所述卡基上设置天线LA焊盘和天线LB焊盘，所述天线LA焊盘和天线LB焊盘分别连接所述天线线圈回路的两端；
    所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线LA焊盘和所述天线LB焊盘电连接。
  18. 根据权利要求17所述的智能卡，其中，所述天线LA焊盘和天线LB焊盘分别设置在所述卡基上铣槽的相对两端，所述天线LA焊接焊盘和所述天线LB焊接焊盘分别设置在与所述天线LA焊盘和所述天线LB焊盘对应的位置。
  19. 根据权利要求16所述的智能卡，其中，所述天线LA焊接焊盘和所述天线LB焊接焊盘与所述天线线圈回路的两端采取天线漆包线直焊的方法连接。
  20. 根据权利要求17所述的智能卡，其中，所述天线LA焊盘和所述LB焊盘与所述天线LA焊接焊盘和所述天线LB焊接焊盘的连接方式为焊接或导电胶连接。
  21. 一种单界面条带单元，包括基材，所述基材的一面覆有铜箔，作为铜箔面，所述铜箔面设置有中心区，围绕中心区设置有C1、C2、C3、C5、C6、C7共6个触点；触点之间通过绝缘带相互电隔离；
    在C1触点和C5触点之间设置第五触点，在C3和C7之间设置第六触点；其中，所述中心区被延伸铜箔区包围；所述延伸铜箔区为第五触点的延伸铜箔区、第六触点的延伸铜箔区或第五触点和第六触点的延伸铜箔区的结合；
    所述第五触点、第六触点之间通过绝缘带隔离；第五触点、第六触点和其他触点之间分别通过绝缘带电隔离；
    所述第五触点、第六触点、C1、C2、C3、C5、C6、C7触点对应的基 材区域上都设置有孔洞；
    所述第五触点和第六触点在对应基材区域的位置上分别设置有第三基孔和第四基孔。
  22. 根据权利要求21所述的单界面条带单元，其中，所述孔洞的全部或部分设置在相应触点的延伸铜箔区上。
  23. 根据权利要求21所述的单界面条带单元，其中，将C5-C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元的实际高度为l，触点的最小保留高度为p，C2和C6的宽度为c，C1、C3、C5、C7的宽度为d、高度为m，设隔离两个触点之间的绝缘带的高度为s，
    则有第五触点在C1和C5之间设置的铜箔区的范围为：
    Figure PCTCN2019099598-appb-100014
    其中，
    Figure PCTCN2019099598-appb-100015
    第六触点在C3和C7之间设置的铜箔区的范围为：
    Figure PCTCN2019099598-appb-100016
    其中，
    Figure PCTCN2019099598-appb-100017
  24. 根据权利要求21所述的单界面条带单元，其中，用C6和/或C6向相邻触点延伸的延伸区代替第五触点或第六触点中的任一个。
  25. 根据权利要求24所述的单界面条带单元，其中，将C5、C6、C7所在的边设置为单界面条带单元的宽度，C3、C7所在的边设置为单界面条带单元的高度，以单界面条带单元的中心为原点建立坐标轴，设与宽度平行的轴为x轴，与高度平行的轴为y轴，设置单界面条带单元实际高度为l，模块的最小保留高度为h，C1、C3、C5、C7的宽度都为d，C2、C6的宽度 都为c，隔离两个触点之间的绝缘带的高度为s；
    则C6在C5区域延伸的延伸区范围为：
    Figure PCTCN2019099598-appb-100018
    则C6在C7区域延伸的延伸区范围为：
    Figure PCTCN2019099598-appb-100019
  26. 一种使用如权利要求22-25任一项所述的单界面条带单元的单界面条带，其中，所述单界面条带由至少两个所述单界面条带单元构成。
  27. 一种使用如权利要求22-25任一项所述的单界面条带单元的模块，其中，所述模块包括单界面条带单元和芯片；
    其中，单界面条带单元上与所述铜箔面相对的面为焊接面，所述芯片设置在所述焊接面上；
    所述焊接面上，在触点对应的孔洞的位置设置接触面焊盘；所述孔洞使所述触点与相应的接触面焊盘电导通；
    所述芯片上设置有芯片LA焊盘、芯片LB焊盘以及与C1、C2、C3、C5和C7触点的接触面焊盘对应电连接的芯片接触面焊盘；
    所述第三触点、第四触点在焊接面上对应的孔洞位置分别设置有LA接触面焊盘和LB接触面焊盘；所述第三触点、第四触点通过对应的孔洞与所述LA接触面焊盘和LB接触面焊盘电导通；
    所述LA接触面焊盘和LB接触面焊盘分别与所述芯片LA焊盘和所述芯片LB焊盘电连接；
    所述单界面条带单元的焊接面上，所述第三基孔和第四基孔的位置上分别设置有天线LA焊接焊盘和天线LB焊接焊盘，所述第三基孔和第四基孔使第三触点和第四触点与天线LA焊接焊盘和天线LB焊接焊盘电导通。
  28. 一种使用如权利要求27所述的模块的智能卡，包括卡基、模块和 天线线圈，所述天线线圈设置在所述卡基内部，所述卡基表面设置有铣槽，所述模块镶嵌在铣槽内；
    所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线线圈回路的两端电连接。
  29. 根据权利要求28所述的智能卡，其中，所述卡基上设置天线LA焊盘和天线LB焊盘，所述天线LA焊盘和天线LB焊盘分别连接所述天线线圈回路的两端；
    所述天线LA焊接焊盘和所述天线LB焊接焊盘分别与所述天线LA焊盘和所述天线LB焊盘电连接。
  30. 根据权利要求29所述的智能卡，其中，所述天线LA焊盘和天线LB焊盘分别设置在所述卡基上铣槽的相对两端，所述天线LA焊接焊盘和所述天线LB焊接焊盘分别设置在与所述天线LA焊盘和所述天线LB焊盘对应的位置。
  31. 根据权利要求28所述的智能卡，其中，所述天线LA焊接焊盘和所述天线LB焊接焊盘与所述天线线圈回路的两端采取天线漆包线直焊的方法连接。
  32. 根据权利要求29所述的智能卡，其中，所述天线LA焊盘和所述LB焊盘与所述天线LA焊接焊盘和所述天线LB焊接焊盘的连接方式为焊接或导电胶连接。
PCT/CN2019/099598 2018-08-17 2019-08-07 一种单界面条带单元、单界面条带、模块和智能卡 WO2020034885A1 (zh)

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