WO2020034293A1 - 一种显示面板及绑定方法 - Google Patents

一种显示面板及绑定方法 Download PDF

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Publication number
WO2020034293A1
WO2020034293A1 PCT/CN2018/105632 CN2018105632W WO2020034293A1 WO 2020034293 A1 WO2020034293 A1 WO 2020034293A1 CN 2018105632 W CN2018105632 W CN 2018105632W WO 2020034293 A1 WO2020034293 A1 WO 2020034293A1
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WO
WIPO (PCT)
Prior art keywords
area
region
binding
adhesive layer
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/105632
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English (en)
French (fr)
Inventor
吴建军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/339,367 priority Critical patent/US11038006B1/en
Publication of WO2020034293A1 publication Critical patent/WO2020034293A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/324—Die-attach connectors having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present application relates to the technical field of display panel manufacturing, and in particular, to a display panel and a binding method.
  • the mobile phone is used in a variety of environments. Some high-humidity and high-temperature environments are more corrosive to mobile phone screens, so the requirements for the screen's corrosion resistance are becoming higher and higher.
  • the module section is mainly in flexible circuits. On film (COF) and display panel bonding area of the wiring (wire on array (WOA) area of the circuit waterproof and anti-corrosion.
  • COF On film
  • WOA wire on array
  • the traditional method for anticorrosion of the WOA circuit in the LCD process is to apply waterproof adhesive on the front of the WOA circuit and the back position where the COF and WOA are bound.
  • the WOA trace 104 laid out on the display panel 101 in a non-display area and connected to the internal signal line of the display panel 101 and the flexible circuit board 103 are bonded by the conductive adhesive 102, and the WOA trace 104 corresponds to
  • the exposed portions outside the conductive adhesive 102 and the COF traces 105 of the flexible circuit board 103 for bonding are exposed to the exposed portions outside the corresponding conductive adhesive 102, which are extremely susceptible to corrosion.
  • the existing countermeasure is to apply a layer of waterproof glue to the corrosive area to isolate the air and moisture to meet the anti-corrosion requirements.
  • the exposed part of the COF trace 105, and the OLED industry needs to peel the glass substrate 108.
  • the back waterproof adhesive 107 and the glass substrate 108 are stuck, which is not conducive to peeling.
  • the second is that the glass substrate 108 is peeled.
  • the height of the back waterproof adhesive 107 exceeds that of the OLED layer 109, which affects subsequent processes.
  • the industry currently cannot adopt the back waterproof adhesive 107 because it cannot overcome the problem. In the long run, the quality of the back waterproof adhesive 107 is greater.
  • the present application provides a display panel and a binding method, which can realize the design of anticorrosion of signal wiring without providing a waterproof adhesive on the back side, thereby improving product quality stability.
  • the display panel includes a display area and a non-display area on one side of the display area. At least two signal lines are arranged in the non-display area. The non-display area A binding area is set therein, and one end of the signal trace extends to the binding area;
  • the non-display area and the binding area have overlapping areas and non-overlapping areas.
  • the non-overlapping area on one side of the binding area is a first area, and the non-overlapping area on the other side is a third area.
  • a waterproof adhesive layer is provided in the first region, and a conductive adhesive layer is provided in the binding region; wherein the conductive adhesive layer includes a conductive particle-doped region, and a side of the conductive particle-doped region A first insulating adhesive material region, the first insulating adhesive material region being located between the conductive particle doped region and the second region.
  • a second insulating rubber material region is provided on the other side of the conductive particle doped region, and the second insulating rubber material region extends to the first region and stops at the binding.
  • One side edge of the region, the first insulating rubber material region extending toward the second region and ending at the other side edge of the binding region.
  • the signal wiring is prepared with the waterproof adhesive layer and the conductive adhesive layer.
  • the display panel is connected to a flexible circuit board, and the flexible circuit board is provided with connection terminals, and the connection terminals are correspondingly located in the binding area.
  • the waterproof adhesive layer extends to at least one surface of the flexible circuit board.
  • the present application also provides a method for binding a display panel, which includes the following steps:
  • a display panel is provided.
  • a surface of the display panel is defined with a display area, a non-display area located at one end of the display area, and a binding area located in the non-display area; the non-display area and the binding area A region has an overlapping region and a non-overlapping region, the non-overlapping region on one side of the binding region is defined as a first region, and the non-overlapping region on the other side is defined as a second region;
  • Step S20 preparing a conductive adhesive layer in the binding area
  • step S30 an end of the flexible circuit board provided with the connection terminals is attached to the conductive adhesive layer, and then the flexible circuit board is bonded to the binding area using a hot pressing device;
  • the conductive adhesive layer includes a conductive particle doped region and a first insulating rubber material region located at one end of the conductive particle doped region.
  • the first insulating rubber material region is located between the conductive particle doped region and the conductive particle doped region. Said between the second regions.
  • the conductive adhesive layer further includes a second insulating adhesive material region located at the other end of the conductive particle doped region, and the second insulating adhesive material region faces the first The area extends to the edge of the binding area.
  • connection terminals provided on the flexible circuit board are correspondingly located in the binding region.
  • step S30 the method further includes the following steps:
  • step S40 a waterproof adhesive layer is prepared in the first region, so that a non-display region is formed with a sealant layer combining the waterproof adhesive layer and the conductive adhesive layer.
  • the present application further provides a display panel.
  • the display panel includes a display area and a non-display area on one side of the display area. At least two signal traces are arranged in the non-display area. A binding area is set in the non-display area, and one end of the signal trace extends to the binding area;
  • a thin film transistor is arranged in the array in the display area, and the other end of the signal trace is correspondingly connected to the thin film transistor;
  • the non-display area and the binding area have overlapping areas and non-overlapping areas.
  • the non-overlapping area on one side of the binding area is a first area, and the non-overlapping area on the other side is a third area.
  • a waterproof adhesive layer is provided in the first region, and a conductive adhesive layer is provided in the binding region; wherein the conductive adhesive layer includes a conductive particle-doped region, and a side of the conductive particle-doped region A first insulating adhesive material region, the first insulating adhesive material region being located between the conductive particle doped region and the second region.
  • a second insulating rubber material region is provided on the other side of the conductive particle doped region, and the second insulating rubber material region extends to the first region and stops at the binding.
  • One side edge of the region, the first insulating rubber material region extending toward the second region and ending at the other side edge of the binding region.
  • the signal wiring is prepared with the waterproof adhesive layer and the conductive adhesive layer.
  • the display panel is connected to a flexible circuit board, and the flexible circuit board is provided with connection terminals, and the connection terminals are correspondingly located in the binding area.
  • the waterproof adhesive layer extends to at least one surface of the flexible circuit board.
  • the beneficial effect of the present application is that in the display panel and the binding method of the present application, in the COF binding process, the conductive adhesive layer is added by adding an insulating adhesive layer on one or both sides of the conductive particle doped region of the conductive adhesive layer.
  • the signal traces outside the display area can be completely covered to form a sealed waterproof area.
  • the back of the OLED product cannot be coated with waterproof adhesive after the COF binding is resolved Layers cause risk of corrosion.
  • This solution does not require a backside coating of a waterproof adhesive layer, which facilitates the subsequent separation of the glass substrate and the OLED flexible product without affecting the subsequent processes.
  • FIG. 1A ⁇ 1B are schematic structural diagrams of a display panel in the prior art
  • FIG. 2A is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • 2B is a top view of a display panel provided by an embodiment of the present application.
  • 2C is a side view of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another display panel according to an embodiment of the present application.
  • FIG. 4 is a flowchart of a method for binding a display panel according to an embodiment of the present application.
  • the present application is directed to a display panel of the prior art. Since the back coated waterproof adhesive on the back of the flexible circuit board bound to the signal traces of the display panel is adhered to the glass substrate, it is not conducive to peeling. The height exceeds the OLED layer, which affects the technical problems of subsequent processes. This embodiment can solve this defect.
  • FIG. 2A is a schematic structural diagram of a display panel according to an embodiment of the present application.
  • the display panel includes a display area 201 and a non-display area 202 on one side of the display area 201.
  • a plurality of signal traces are arranged in the non-display area 202.
  • the non-display area A binding area 203 is provided in 202; the non-display area 202 and the binding area 203 have overlapping areas and non-overlapping areas, and the non-overlapping area on the side of the binding area 203 is a first area 205
  • the second region 204 is the non-overlapping region on the opposite side.
  • the binding region 203 includes a conductive particle doped region and an insulating adhesive material region located at an end of the conductive particle doped region away from the display region 201.
  • the binding region 203 may also extend away from the display region 201 to a position corresponding to the boundary of the display panel, but in order to prevent the adhesive material in the insulating adhesive material region from overflowing to the side of the display panel However, it affects the peeling of the glass substrate during the manufacturing process.
  • the binding region 203 is at a certain distance from the display panel boundary.
  • FIG. 2B a top view of a display panel according to an embodiment of the present application.
  • a thin film transistor (not labeled) and a pixel unit (not labeled) are arranged in an array in the display region 201, and one end of a signal trace 211 arranged in the non-display region is correspondingly connected to the thin film transistor, and the signal trace The other end of 211 extends to the binding area.
  • a conductive adhesive layer 209 is disposed in the binding region, and the conductive adhesive layer 209 includes a conductive particle doped region 207 and a first insulating adhesive material region 208 on one side of the conductive particle doped region 207.
  • a first insulating adhesive material region 208 is located between the conductive particle doped region 207 and the second region to completely cover the signal exposed on the conductive particle doped region 207 away from the display region 201 side.
  • the flexible circuit board 210 is bound to an edge position of the display panel by the conductive adhesive layer 209, wherein the flexible circuit board 210 is provided with a connection terminal, and the connection terminal is correspondingly located in the binding area.
  • the connection terminal is electrically connected to the signal trace 211 through the conductive particle doped region 207.
  • a waterproof adhesive layer 206 is provided in the first region.
  • the waterproof adhesive layer 206 and the conductive adhesive layer 209 completely cover the signal traces 211 and the connection terminals on the flexible circuit board 210, so that the signal traces 211 and the periphery of the connection terminals form a seal. Structure to prevent water and gas from entering the interior, to solve the problem of anti-corrosion design of the waterproof layer on the back when COF is bound in the OLED manufacturing process, and to improve product quality stability.
  • FIG. 2C a side view of a display panel according to an embodiment of the present application.
  • the display panel includes a glass substrate 212 and an OLED layer 213 prepared on the glass substrate 212; a polarizing plate 214 disposed on the OLED layer 213; the flexible circuit board 210 is adhered to the conductive adhesive layer On 209, it is bound to the display panel after being pressed by the hot pressing device 215.
  • the first insulating adhesive material region 208 located on the conductive particle doped region 207 side extends toward the second region (the side of the edge of the display panel) to completely cover the conductive particles.
  • the doped region 207 goes to the signal trace on the side of the edge of the display panel and the corresponding portion of the connection terminal.
  • the waterproof adhesive layer 206 is prepared in the first region between the conductive adhesive layer 209 and the polarizing plate 214.
  • a width of the conductive particle doped region 207 is larger than a width of the first insulating rubber material region 208.
  • the waterproof adhesive layer 206 extends to at least one side surface of the flexible circuit board 210.
  • FIG. 3 it is a schematic structural diagram of another display panel according to an embodiment of the present application.
  • This solution is a preferred solution of the present application.
  • the display panel includes a glass substrate 301, and an OLED layer 302 and a polarizing plate 303 which are sequentially prepared on the glass substrate 301.
  • the display panel further includes a conductive adhesive layer 309 bound to the display panel. ⁇ ⁇ Flexible circuit board 305.
  • a second insulating rubber material region 308 is provided on the other side of the conductive particle doped region 307 of the conductive adhesive layer 309; wherein the first insulating rubber material region 306 extends toward the second region and stops at one edge of the binding region, and the second insulating rubber material region 308 extends toward the first region and stops at the other edge of the binding region.
  • the heat-pressing device 304 is used for the pressing process.
  • the adhesive material corresponding to the conductive particle doped region 307 is different from the adhesive material corresponding to the first insulating adhesive material region 306 and the second insulating adhesive material region 308, and the fusion degree of the two adhesive materials is low. Preventing the adhesive material of the conductive particle-doped region 307 from penetrating into the first insulating adhesive material region 306 and the second insulating adhesive material region 308 during the lamination process can avoid poor pressing accuracy.
  • the first insulating rubber material region 306 and the second insulating rubber material region 308 have the same width.
  • the signal traces and the connection terminals of the non-display area are covered by the conductive adhesive layer 309 and the waterproof adhesive layer 310, so as to achieve the effect of preventing corrosion.
  • since it is not necessary to design a waterproof adhesive layer on the back side subsequent peeling of the glass substrate 301 and the OLED layer 302 is facilitated.
  • This application also provides a method for binding a display panel. As shown in FIG. 4, the method includes the following steps:
  • a display panel is provided.
  • a surface of the display panel defines a display area, a non-display area located at one end of the display area, and a binding area located in the non-display area; the non-display area and the binding area.
  • a region has an overlapping region and a non-overlapping region, the non-overlapping region on one side of the binding region is defined as a first region, and the non-overlapping region on the other side is defined as a second region;
  • a plurality of signal traces are arranged in the non-display area, and a binding area is disposed in the non-display area; a thin film transistor is arranged in an array in the display area, and one end of the signal trace extends to The binding region is correspondingly connected to the thin film transistor with respect to the other end.
  • the conductive adhesive layer includes a conductive particle doped region and a first insulating rubber material region located at one end of the conductive particle doped region.
  • the first insulating rubber material region is located between the conductive particle doped region and the conductive particle doped region. Said between the second regions.
  • connection terminals provided on the side where the flexible circuit board and the conductive adhesive layer are adhered are correspondingly located in the binding area.
  • step S40 a waterproof adhesive layer is prepared in the first region, so that a non-display region is formed with a sealant layer combining the waterproof adhesive layer and the conductive adhesive layer.
  • the waterproof adhesive layer is extended to at least one surface of the flexible circuit board to ensure that the connection terminals of the flexible circuit board are not invaded by external moisture.
  • the conductive adhesive layer in the above method further includes a second insulating adhesive material region located at the other end of the conductive particle doped region, and the second insulating adhesive material region extends to the first region. And stops at the edge of the binding area; the first insulating glue material area extends to the second area and stops at the other side edge of the binding area.
  • the adhesive material in the conductive particle doped region may be the same as or different from the adhesive material in the first insulating adhesive material region and the second insulating adhesive material region, which is not limited herein.
  • the width of the conductive adhesive layer is increased by adding an insulating adhesive layer on one or both sides of the conductive particle doped region of the conductive adhesive layer, and the front is waterproofed at the same time.
  • the adhesive layer allows the signal traces outside the display area to be completely covered, forming a sealed waterproof area. Without adding additional equipment investment costs, it solves the risk of corrosion due to the failure to apply a waterproof adhesive layer on the back of the OLED product after COF binding. This solution does not require a backside coating of a waterproof adhesive layer, which facilitates the subsequent separation of the glass substrate and the OLED flexible product without affecting the subsequent processes.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供一种显示面板及绑定方法，所述显示面板显示区域的信号走线延伸至非显示区域内的绑定区域；所述绑定区域设置有导电胶层，位于所述绑定区域靠近所述显示区域一侧的所述非显示区域内设置有防水胶层，所述导电胶层包括导电粒子掺杂区域以及位于所述导电粒子掺杂区域远离所述显示区域一侧的第一绝缘胶材区域。

Description

一种显示面板及绑定方法 技术领域
本申请涉及显示面板制造技术领域，尤其涉及一种显示面板及绑定方法。
 背景技术
手机使用环境多样化，部分高湿高温环境对手机屏幕的的腐蚀性较大，故对屏幕的耐腐蚀性要求越来越高，其中模组段主要在于柔性电路（Chip On Film，COF）与显示面板的绑定（bonding）区域的阵列外布线（wire on array，WOA）区线路的防水防腐蚀。传统的LCD制程的WOA线路防腐方法是在WOA线路正面及COF和WOA绑定的背面位置涂防水胶进行防腐。
如图1A~1B所示，显示面板101在非显示区域布设的连接该显示面板101内部信号线的WOA走线104与柔性电路板103通过导电胶102绑定后，所述WOA走线104对应导电胶102之外的裸露部分以及该柔性电路板103的用于绑定的COF走线105在对应导电胶102之外的裸露部分极易受到腐蚀。而现有对策是在易腐蚀区域涂一层防水胶，隔绝空气和水分，达到防腐要求，如图1B所示，通过正面防水胶106遮盖WOA走线104的裸露部分，通过背面防水胶107遮盖COF走线105的裸露部分，而OLED行业由于需要将玻璃基板108剥离，会有两问题存在，一是该背面防水胶107和玻璃基板108粘连，不利于剥离；二是玻璃基板108剥离后该背面防水胶107的高度超过OLED层109，影响后续制程，而业界目前因无法克服该问题，目前采用不涂所述背面防水胶107，其品质长久来看，存在较大风险。
因此，有必要提供一种显示面板及绑定方法，以解决现有技术所存在的问题。
 技术问题
本申请提供一种显示面板及绑定方法，能够在不设置背面防水胶的基础上，实现对信号走线防腐的设计，从而改善产品品质稳定性。
 技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，所述显示面板包括显示区域，以及位于所述显示区域一侧的非显示区域，所述非显示区域内排布有至少两条信号走线，所述非显示区域内设置有绑定区域，所述信号走线的一端延伸至所述绑定区域；
所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域为第一区域，相对另一侧的所述非重叠区域为第二区域；
所述第一区域内设置有防水胶层，所述绑定区域内设置有导电胶层；其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一侧的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
在本申请的显示面板中，所述导电粒子掺杂区域的另一侧设置有第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域一侧边缘，所述第一绝缘胶材区域向所述第二区域延伸且止于所述绑定区域另一侧边缘。
在本申请的显示面板中，所述信号走线上制备有所述防水胶层以及所述导电胶层。
在本申请的显示面板中，所述显示面板连接有柔性电路板，所述柔性电路板上设置有连接端子，所述连接端子对应位于所述绑定区域内。
在本申请的显示面板中，所述防水胶层至少延伸至所述柔性电路板的一侧表面。
为解决上述问题，本申请还提供一种显示面板的绑定方法，所述方法包括以下步骤：
步骤S10，提供显示面板，所述显示面板表面定义有显示区域、位于所述显示区域一端的非显示区域以及位于所述非显示区域内的绑定区域；所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域定义为第一区域，相对另一侧的所述非重叠区域定义为第二区域；
步骤S20，在所述绑定区域制备导电胶层；
步骤S30，将柔性电路板设置有连接端子的一端与所述导电胶层相贴合，然后使用热压设备将所述柔性电路板与所述绑定区域粘合；
其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一端的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
在本申请的显示面板的绑定方法中，所述导电胶层还包括位于所述导电粒子掺杂区域另一端的第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域边缘。
在本申请的显示面板的绑定方法中，所述柔性电路板上设置的所述连接端子对应位于所述绑定区域内。
在本申请的显示面板的绑定方法中，所述步骤S30之后还包括以下步骤：
步骤S40，在所述第一区域内制备一层防水胶层，使得所述非显示区域形成有所述防水胶层与所述导电胶层相结合的密封胶层。
为解决上述问题，本申请还提供一种显示面板，所述显示面板包括显示区域，以及位于所述显示区域一侧的非显示区域，所述非显示区域内排布有至少两条信号走线，所述非显示区域内设置有绑定区域，所述信号走线的一端延伸至所述绑定区域；
所述显示区域内阵列设置有薄膜晶体管，所述信号走线的相对另一端对应连接所述薄膜晶体管；
所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域为第一区域，相对另一侧的所述非重叠区域为第二区域；
所述第一区域内设置有防水胶层，所述绑定区域内设置有导电胶层；其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一侧的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
在本申请的显示面板中，所述导电粒子掺杂区域的另一侧设置有第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域一侧边缘，所述第一绝缘胶材区域向所述第二区域延伸且止于所述绑定区域另一侧边缘。
在本申请的显示面板中，所述信号走线上制备有所述防水胶层以及所述导电胶层。
在本申请的显示面板中，所述显示面板连接有柔性电路板，所述柔性电路板上设置有连接端子，所述连接端子对应位于所述绑定区域内。
在本申请的显示面板中，所述防水胶层至少延伸至所述柔性电路板的一侧表面。
 有益效果
本申请的有益效果为：本申请的显示面板及绑定方法，在COF绑定制程中，通过在导电胶层的导电粒子掺杂区域一侧或两侧增设绝缘胶材层来增加导电胶层的宽度，同时结合正面防水胶层使显示区域外的信号走线能被完全覆盖，形成一段密封的防水区域，在不增加额外设备投资成本下，解决COF绑定后OLED产品背部无法涂防水胶层导致腐蚀的风险。本方案无需进行背面涂布防水胶层，便于后续的玻璃基板和OLED柔性产品分离，且不影响后续制程；同时由于双侧的绝缘胶材层的支撑，使得在压着制程中导电粒子掺杂区域的胶材左右两侧流动性一致，利于提升压着精度，可改善后续因绑定区域尺寸缩小导致的精度问题。本方案既可保证导电粒子掺杂区域的导电性能不受影响，也可确保非显示区域的信号走线不与空气接触，避免线路腐蚀，同时能节省一次涂胶制程，进而提高产品稳定性，改善产品极限使用环境的耐腐蚀性。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A~1B为现有技术的显示面板的结构示意图；
图2A为本申请实施例提供的显示面板结构示意图；
图2B为本申请实施例提供的显示面板俯视图；
图2C为本申请实施例提供的显示面板侧视图；
图3为本申请实施例提供的另一种显示面板结构示意图；
图4为本申请实施例提供的显示面板的绑定方法流程图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有技术的显示面板，由于柔性电路板与显示面板的信号走线绑定的背面涂布的背面防水胶和玻璃基板粘连，不利于剥离，以及玻璃基板剥离后该背面防水胶的高度超过OLED层，影响后续制程的技术问题，本实施例能够解决该缺陷。
参阅图2A~2C，图2A为本申请实施例提供的显示面板结构示意图。如图2A所示，该显示面板包括显示区域201，以及位于所述显示区域201一侧的非显示区域202，所述非显示区域202内排布有多条信号走线，所述非显示区域202内设置有绑定区域203；所述非显示区域202与所述绑定区域203具有重叠区域与非重叠区域，位于所述绑定区域203一侧的所述非重叠区域为第一区域205，相对另一侧的所述非重叠区域为第二区域204。所述绑定区域203包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域远离所述显示区域201一端的绝缘胶材区域。
当然，所述绑定区域203也可向远离所述显示区域201一侧延伸至对应所述显示面板的边界位置，但是为了避免所述绝缘胶材区域的胶材溢出至所述显示面板的侧面而影响制程中玻璃基板的剥离，优选的，所述绑定区域203与所述显示面板边界距离一定位置。
如图2B所示，为本申请实施例提供的显示面板俯视图。所述显示区域201内阵列设置有薄膜晶体管（未标示）以及像素单元（未标示），所述非显示区域内排布的信号走线211的一端对应连接所述薄膜晶体管，所述信号走线211的另一端延伸至所述绑定区域。所述绑定区域内设置有导电胶层209，所述导电胶层209包括导电粒子掺杂区域207，以及位于所述导电粒子掺杂区域207一侧的第一绝缘胶材区域208，所述第一绝缘胶材区域208位于所述导电粒子掺杂区域207与所述第二区域之间，以完全掩盖所述导电粒子掺杂区域207远离所述显示区域201一侧裸露出的所述信号走线211。柔性电路板210通过所述导电胶层209绑定在所述显示面板的边缘位置，其中，所述柔性电路板210上设置有连接端子，所述连接端子对应位于所述绑定区域内。所述连接端子通过所述导电粒子掺杂区域207与所述信号走线211电性连接。所述柔性电路板210与所述显示面板绑定后，在所述第一区域内设置防水胶层206。所述防水胶层206与所述导电胶层209完全掩盖所述信号走线211及所述柔性电路板210上的所述连接端子，使得所述信号走线211及所述连接端子外围形成密封结构，从而防止水气进入其内部，解决OLED制程中COF绑定时无法进行背面防水胶层防腐设计，改善产品品质稳定性。
如图2C所示，为本申请实施例提供的显示面板侧视图。所述显示面板包括玻璃基板212，以及制备于所述玻璃基板212上的OLED层213；设置于所述OLED层213上的偏光板214；所述柔性电路板210粘合于所述导电胶层209上，经热压设备215压合后绑定于所述显示面板上。在该压合制程中，位于所述导电粒子掺杂区域207一侧的所述第一绝缘胶材区域208向所述第二区域（显示面板边缘一侧）延伸，以完全覆盖所述导电粒子掺杂区域207向所述显示面板边缘一侧的所述信号走线及所述连接端子相应部分。绑定工艺完成后，在所述导电胶层209与所述偏光板214之间的所述第一区域制备所述防水胶层206。
优选的，所述导电粒子掺杂区域207的宽度大于所述第一绝缘胶材区域208的宽度。优选的，所述防水胶层206至少延伸至所述柔性电路板210的一侧表面。
参阅图3，为本申请实施例提供的另一种显示面板结构示意图。本方案作为本申请的一优选方案，显示面板包括：玻璃基板301，以及依次制备于所述玻璃基板301上的OLED层302、偏光板303；还包括通过导电胶层309与所述显示面板绑定的柔性电路板305。相较于图2A~2C的区别技术在于：本方案在所述导电胶层309的导电粒子掺杂区域307的另一侧设置有第二绝缘胶材区域308；其中，第一绝缘胶材区域306向所述第二区域延伸且止于所述绑定区域一侧边缘，所述第二绝缘胶材区域308向所述第一区域延伸且止于所述绑定区域另一侧边缘。其中，在所述柔性电路板305设置有连接端子的一端面向所述导电胶层309贴合后，采用热压设备304进行压合制程，由于所述第一绝缘胶材区域306以及所述第二绝缘胶材区域308的胶材支撑，使得所述导电粒子掺杂区域307的胶材左右两侧流动性一致，利于提升压着精度。或者所述导电粒子掺杂区域307相应的胶材与所述第一绝缘胶材区域306以及所述第二绝缘胶材区域308所对应的胶材不同，且两种胶材的融合度低，防止在压合制程中所述导电粒子掺杂区域307的胶材向所述第一绝缘胶材区域306以及所述第二绝缘胶材区域308渗透，可避免压着精度不良。优选的，所述第一绝缘胶材区域306与所述第二绝缘胶材区域308的宽度相同。通过所述导电胶层309以及防水胶层310将所述非显示区域的所述信号走线以及所述连接端子掩盖，从而达到防腐蚀的效果。此外，由于无需进行背面防水胶层的设计，便于后续的所述玻璃基板301与所述OLED层302的剥离。
本申请还提供一种显示面板的绑定方法，如图4所示，所述方法包括以下步骤：
S10，提供一显示面板，所述显示面板表面定义有显示区域、位于所述显示区域一端的非显示区域以及位于所述非显示区域内的绑定区域；所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域定义为第一区域，相对另一侧的所述非重叠区域定义为第二区域；
其中，所述非显示区域内排布有多条信号走线，所述非显示区域内设置有绑定区域；所述显示区域内阵列设置有薄膜晶体管，所述信号走线的一端延伸至所述绑定区域，相对另一端对应连接所述薄膜晶体管。
S20，在所述绑定区域制备导电胶层；
其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一端的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
S30，将柔性电路板设置有连接端子的一端与所述导电胶层相贴合，然后使用热压设备将所述柔性电路板与所述绑定区域粘合；
其中，所述柔性电路板与所述导电胶层相粘合的一面设置的所述连接端子对应位于所述绑定区域内。
步骤S40，在所述第一区域内制备一层防水胶层，使得所述非显示区域形成有所述防水胶层与所述导电胶层相结合的密封胶层。
其中，将所述防水胶层至少延伸至所述柔性电路板的一侧表面，以保证所述柔性电路板的所述连接端子不受外界水汽的侵入。
在一优选方案中，上述方法中的所述导电胶层还包括位于所述导电粒子掺杂区域另一端的第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域边缘；所述第一绝缘胶材区域向所述第二区域延伸且止于所述绑定区域另一侧边缘。
此外，所述导电粒子掺杂区域的胶材与所述第一绝缘胶材区域及所述第二绝缘胶材区域的胶材可以相同，也可以不同，此处不做限制。
本申请的显示面板及绑定方法，在COF绑定制程中，通过在导电胶层的导电粒子掺杂区域一侧或两侧增设绝缘胶材层来增加导电胶层的宽度，同时结合正面防水胶层使显示区域外的信号走线能被完全覆盖，形成一段密封的防水区域，在不增加额外设备投资成本下，解决COF绑定后OLED产品背部无法涂防水胶层导致腐蚀的风险。本方案无需进行背面涂布防水胶层，便于后续的玻璃基板和OLED柔性产品分离，且不影响后续制程；同时由于双侧的绝缘胶材层的支撑，使得在压着制程中导电粒子掺杂区域的胶材左右两侧流动性一致，利于提升压着精度，可改善后续因绑定区域尺寸缩小导致的精度问题。本方案既可保证导电粒子掺杂区域的导电性能不受影响，也可确保非显示区域的信号走线不与空气接触，避免线路腐蚀，同时能节省一次涂胶制程，进而提高产品稳定性，改善产品极限使用环境的耐腐蚀性。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (14)

  1. 一种显示面板，其中，所述显示面板包括显示区域，以及位于所述显示区域一侧的非显示区域，所述非显示区域内排布有至少两条信号走线，所述非显示区域内设置有绑定区域，所述信号走线的一端延伸至所述绑定区域；
    所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域为第一区域，相对另一侧的所述非重叠区域为第二区域；
    所述第一区域内设置有防水胶层，所述绑定区域内设置有导电胶层；其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一侧的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
  2. 根据权利要求1所述的显示面板，其中，所述导电粒子掺杂区域的另一侧设置有第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域一侧边缘，所述第一绝缘胶材区域向所述第二区域延伸且止于所述绑定区域另一侧边缘。
  3. 根据权利要求2所述的显示面板，其中，所述信号走线上制备有所述防水胶层以及所述导电胶层。
  4. 根据权利要求1所述的显示面板，其中，所述显示面板连接有柔性电路板，所述柔性电路板上设置有连接端子，所述连接端子对应位于所述绑定区域内。
  5. 根据权利要求4所述的显示面板，其中，所述防水胶层至少延伸至所述柔性电路板的一侧表面。
  6. 一种显示面板的绑定方法，其中，所述方法包括以下步骤：
    步骤S10，提供一显示面板，所述显示面板表面定义有显示区域、位于所述显示区域一端的非显示区域以及位于所述非显示区域内的绑定区域；所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域定义为第一区域，相对另一侧的所述非重叠区域定义为第二区域；
    步骤S20，在所述绑定区域制备导电胶层；
    步骤S30，将柔性电路板设置有连接端子的一端与所述导电胶层相贴合，然后使用热压设备将所述柔性电路板与所述绑定区域粘合；
    其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一端的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
  7. 根据权利要求6所述的绑定方法，其中，所述导电胶层还包括位于所述导电粒子掺杂区域另一端的第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域边缘。
  8. 根据权利要求6所述的绑定方法，其中，所述柔性电路板上设置的所述连接端子对应位于所述绑定区域内。
  9. 根据权利要求6所述的绑定方法，其中，所述步骤S30之后还包括以下步骤：
    步骤S40，在所述第一区域内制备一层防水胶层，使得所述非显示区域形成有所述防水胶层与所述导电胶层相结合的密封胶层。
  10. 一种显示面板，其中，所述显示面板包括显示区域，以及位于所述显示区域一侧的非显示区域，所述非显示区域内排布有至少两条信号走线，所述非显示区域内设置有绑定区域，所述信号走线的一端延伸至所述绑定区域；
    所述显示区域内阵列设置有薄膜晶体管，所述信号走线的相对另一端对应连接所述薄膜晶体管；
    所述非显示区域与所述绑定区域具有重叠区域与非重叠区域，位于所述绑定区域一侧的所述非重叠区域为第一区域，相对另一侧的所述非重叠区域为第二区域；
    所述第一区域内设置有防水胶层，所述绑定区域内设置有导电胶层；其中，所述导电胶层包括导电粒子掺杂区域，以及位于所述导电粒子掺杂区域一侧的第一绝缘胶材区域，所述第一绝缘胶材区域位于所述导电粒子掺杂区域与所述第二区域之间。
  11. 根据权利要求10所述的显示面板，其中，所述导电粒子掺杂区域的另一侧设置有第二绝缘胶材区域，所述第二绝缘胶材区域向所述第一区域延伸且止于所述绑定区域一侧边缘，所述第一绝缘胶材区域向所述第二区域延伸且止于所述绑定区域另一侧边缘。
  12. 根据权利要求11所述的显示面板，其中，所述信号走线上制备有所述防水胶层以及所述导电胶层。
  13. 根据权利要求10所述的显示面板，其中，所述显示面板连接有柔性电路板，所述柔性电路板上设置有连接端子，所述连接端子对应位于所述绑定区域内。
  14. 根据权利要求13所述的显示面板，其中，所述防水胶层至少延伸至所述柔性电路板的一侧表面。
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