WO2020024859A1 - 反应腔室以及等离子体设备 - Google Patents
反应腔室以及等离子体设备 Download PDFInfo
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- WO2020024859A1 WO2020024859A1 PCT/CN2019/097547 CN2019097547W WO2020024859A1 WO 2020024859 A1 WO2020024859 A1 WO 2020024859A1 CN 2019097547 W CN2019097547 W CN 2019097547W WO 2020024859 A1 WO2020024859 A1 WO 2020024859A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3341—Reactive etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3343—Problems associated with etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
Abstract
Description
Claims (10)
- 一种反应腔室,其特征在于,包括:腔室本体、内衬和升降驱动装置;所述内衬设置在所述腔室本体内,所述腔室本体的侧壁上形成有传片口;所述内衬包括:第一内衬和第二内衬;所述第一内衬与所述腔室本体连接,所述第二内衬同轴外套或内套于所述第一内衬上,且所述第一内衬与所述第二内衬在水平方向上具有间隙;所述升降驱动装置与所述第二内衬连接,用于在对晶圆进行工艺处理时,驱动所述第二内衬移动至预设的第一位置,使所述第二内衬遮挡所述传片口,并且使所述第一内衬和所述第二内衬部分重叠,其中,重叠部分的长度为预定长度,所述第一内衬和所述第二内衬围成用于对所述晶圆进行工艺处理的工艺区域。
- 如权利要求1所述的反应腔室,其特征在于,所述升降驱动装置包括:可伸缩的升降波纹管;所述升降波纹管与所述第二内衬连接,所述升降驱动装置通过驱动所述升降波纹管伸缩带动所述第二内衬升降。
- 如权利要求2所述的反应腔室,其特征在于,所述升降驱动装置还包括:气缸组件;所述气缸组件用于驱动所述升降波纹管伸缩。
- 如权利要求3所述的反应腔室,其特征在于,所述气缸组件包括:气缸、连接件;所述升降波纹管包括:设置在所述升降波纹管中的活动轴;所述气缸的缸体固定在所述腔室本体上,所述气缸的气缸轴通过所述连 接件与所述活动轴的上端相连,与所述升降波纹管的上端与所述腔室本体连接,所述升降波纹管的下端与所述活动轴的下端相连;所述第二内衬与所述升降波纹管、所述活动轴连接。
- 如权利要求4所述的反应腔室,其特征在于,还包括:内衬安装件,所述第二内衬通过所述内衬安装件与所述升降波纹管、所述活动轴的下端连接。
- 如权利要求1至5中任意一项所述的反应腔室,其特征在于,所述第二内衬包括底衬和竖直衬,所述竖直衬与所述腔室本体的内壁相对设置,所述底衬设置在所述竖直衬的底部,且所述底衬朝向所述腔室本体的中部延伸,在所述底衬上设置有多个沿厚度方向贯穿所述底衬的排气孔,以使得所述工艺区域内产生的刻蚀副产物通过所述排气孔排出。
- 如权利要求1至5中任意一项所述的反应腔室,其特征在于,所述间隙的宽度在1mm至2mm之间;所述预定长度与所述间隙的宽度的比值大于7:1。
- 如权利要求1至5中任意一项所述的反应腔室,其特征在于,所述反应腔室还包括用于支撑晶圆的支撑组件,所述支撑组件设置在所述腔室本体内。
- 如权利要求1至5中任意一项所述的反应腔室,其特征在于,在进料或取料时,所述升降驱动装置驱动所述第二内衬移动至预设的第二位置,使所述第二内衬位于所述传片口的上方。
- 一种等离子体设备,包括反应腔室,其特征在于,所述反应腔室采 用如权利要求1至9任一项所述的反应腔室。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/258,706 US11715627B2 (en) | 2018-08-01 | 2019-07-24 | Reaction chamber and plasma apparatus |
KR1020217000668A KR102469302B1 (ko) | 2018-08-01 | 2019-07-24 | 반응 챔버 및 플라즈마 디바이스 |
JP2021505350A JP7093464B2 (ja) | 2018-08-01 | 2019-07-24 | 反応チャンバおよびプラズマ装置 |
Applications Claiming Priority (4)
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CN201821231497.8 | 2018-08-01 | ||
CN201810864893.2A CN108987237A (zh) | 2018-08-01 | 2018-08-01 | 反应腔室以及等离子体设备 |
CN201821231497.8U CN208478281U (zh) | 2018-08-01 | 2018-08-01 | 反应腔室以及等离子体设备 |
CN201810864893.2 | 2018-08-01 |
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WO2020024859A1 true WO2020024859A1 (zh) | 2020-02-06 |
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PCT/CN2019/097547 WO2020024859A1 (zh) | 2018-08-01 | 2019-07-24 | 反应腔室以及等离子体设备 |
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US (1) | US11715627B2 (zh) |
JP (1) | JP7093464B2 (zh) |
KR (1) | KR102469302B1 (zh) |
WO (1) | WO2020024859A1 (zh) |
Citations (4)
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CN106298417A (zh) * | 2015-05-14 | 2017-01-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔室及半导体加工设备 |
CN107578977A (zh) * | 2017-09-27 | 2018-01-12 | 北京北方华创微电子装备有限公司 | 反应腔室以及电容耦合等离子体设备 |
CN108987237A (zh) * | 2018-08-01 | 2018-12-11 | 北京北方华创微电子装备有限公司 | 反应腔室以及等离子体设备 |
CN208478281U (zh) * | 2018-08-01 | 2019-02-05 | 北京北方华创微电子装备有限公司 | 反应腔室以及等离子体设备 |
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KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 pecvd 시스템에서의 소스 가스 흐름 경로 제어 |
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JP6104823B2 (ja) * | 2011-03-01 | 2017-03-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 薄型加熱基板支持体 |
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JP6040685B2 (ja) | 2012-09-28 | 2016-12-07 | Tdk株式会社 | 成膜処理装置、成膜処理物の製造方法及び成膜処理方法 |
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KR101909478B1 (ko) | 2016-10-31 | 2018-10-18 | 세메스 주식회사 | 기판 처리 장치 |
CN207320060U (zh) | 2017-09-27 | 2018-05-04 | 北京北方华创微电子装备有限公司 | 反应腔室以及电容耦合等离子体设备 |
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2019
- 2019-07-24 JP JP2021505350A patent/JP7093464B2/ja active Active
- 2019-07-24 KR KR1020217000668A patent/KR102469302B1/ko active IP Right Grant
- 2019-07-24 US US17/258,706 patent/US11715627B2/en active Active
- 2019-07-24 WO PCT/CN2019/097547 patent/WO2020024859A1/zh active Application Filing
Patent Citations (4)
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CN106298417A (zh) * | 2015-05-14 | 2017-01-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔室及半导体加工设备 |
CN107578977A (zh) * | 2017-09-27 | 2018-01-12 | 北京北方华创微电子装备有限公司 | 反应腔室以及电容耦合等离子体设备 |
CN108987237A (zh) * | 2018-08-01 | 2018-12-11 | 北京北方华创微电子装备有限公司 | 反应腔室以及等离子体设备 |
CN208478281U (zh) * | 2018-08-01 | 2019-02-05 | 北京北方华创微电子装备有限公司 | 反应腔室以及等离子体设备 |
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Publication number | Publication date |
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KR20210016046A (ko) | 2021-02-10 |
JP2021532599A (ja) | 2021-11-25 |
JP7093464B2 (ja) | 2022-06-29 |
US11715627B2 (en) | 2023-08-01 |
US20210272778A1 (en) | 2021-09-02 |
KR102469302B1 (ko) | 2022-11-22 |
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