WO2020019863A1 - 感光组件及其制作方法 - Google Patents

感光组件及其制作方法 Download PDF

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Publication number
WO2020019863A1
WO2020019863A1 PCT/CN2019/088953 CN2019088953W WO2020019863A1 WO 2020019863 A1 WO2020019863 A1 WO 2020019863A1 CN 2019088953 W CN2019088953 W CN 2019088953W WO 2020019863 A1 WO2020019863 A1 WO 2020019863A1
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WIPO (PCT)
Prior art keywords
photosensitive
layer
molding
conductive
component
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PCT/CN2019/088953
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English (en)
French (fr)
Inventor
王文杰
王明珠
陈振宇
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宁波舜宇光电信息有限公司
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Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN201980036373.5A priority Critical patent/CN112236863A/zh
Priority to EP19840529.2A priority patent/EP3813117A4/en
Priority to US17/261,776 priority patent/US20210296389A1/en
Priority to KR1020207037409A priority patent/KR102525788B1/ko
Publication of WO2020019863A1 publication Critical patent/WO2020019863A1/zh

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Definitions

  • the present application relates to the field of optical technology, and in particular, the present application relates to a photosensitive component and a manufacturing method thereof.
  • the camera module industry is increasingly miniaturized to meet the requirements of integration and miniaturization of current smart terminals.
  • one of the important obstacles to the miniaturization of the camera module is the printed circuit board. With the current technology of the printed circuit board, it is close to the limit it can reach, and it can no longer meet the demand for more miniaturization.
  • the applicant proposed a solution for electrically connecting the photosensitive chip of the camera module and the electronic components through a fan-out package technology (fan-out package).
  • This solution replaces the circuit board in the conventional camera module with a fan-out package, thereby further promoting the miniaturization of the camera module.
  • the current camera module usually needs to connect the camera module to the mobile terminal through a flexible connection band and a connector, so a region needs to be provided on the fan-out package for electrically connecting with the flexible connection.
  • the top or bottom layer of the photosensitive module of the fan-out packaged camera module must be an RDL layer, thereby extending solder joints for the flexible connection and electrical connection. This also causes a certain limitation on the structural design of the fan-out package, and a certain avoidance design must be generated while the flexible connection tape is electrically connected.
  • this is also contrary to the miniaturization of the industry.
  • the existing mobile terminals are also becoming highly centralized, resulting in a smaller area for the camera module in the mobile terminal.
  • the flexible connection belt may need to be bent to connect to the mobile terminal, which also makes the camera module's reliability requirements for the flexible connection belt increasingly increasing. It is large enough to meet the requirement that the flexible connecting tape will not be damaged due to repeated bending. Therefore, the current connection method of the conventional flexible connection belt has not satisfied the current industry development, and even created certain obstacles.
  • the present application aims to provide a solution capable of overcoming at least one of the aforementioned shortcomings of the prior art.
  • a photosensitive component including: a photosensitive chip having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region and a non-photosensitive region, The photosensitive chip also has a pad disposed on the non-photosensitive area; an electronic component is arranged around the photosensitive chip; a molding part is formed by a molding process and the electronic component and the photosensitive chip are packaged in Together, the molding portion has a third surface flush with the first surface; and a first rewiring layer is formed on a non-photosensitive region of the first surface and the third surface, and the The pad is electrically connected to the electronic component through the first rewiring layer; wherein a side or bottom surface of the photosensitive component has a conductive region, and the conductive region is electrically connected to the first rewiring layer.
  • the molding part is a molding layer, and the molding layer covers the second surface to form a fourth surface facing away from the third surface;
  • the photosensitive component further includes: a conductive core disposed around the photosensitive chip; and a second rewiring layer formed on the fourth surface; wherein the molding layer is formed by a molding process and The conductive core, the electronic component and the photosensitive chip are fixed together, the conductive core electrically connects the first rewiring layer and the second rewiring layer, and the pad passes through the The first rewiring layer is electrically connected to the conductive core, and the conductive core is electrically connected to the electronic component through the second rewiring layer.
  • a side surface of the molding part has a conductive region, and the conductive region is electrically connected to the first rewiring layer; and the conductive region is also electrically connected to the second rewiring layer.
  • the conductive region is formed by cutting conductive pillars disposed on a boundary line between two adjacent photosensitive components.
  • the conductive region is formed on the lower surface of the second redistribution layer through a solder ball array or a conductive pillar array.
  • the redistribution wiring of the first redistribution layer extends to an edge of the first redistribution layer and is exposed on a side surface of the first redistribution layer; the conductive region passes through a side surface of the molding part.
  • a metal plating layer is formed on a side surface of the first rewiring layer.
  • the redistribution wiring of the second redistribution layer extends to an edge of the second redistribution layer and is exposed on a side of the second redistribution layer; the conductive region passes through the side of the molding layer.
  • a metal plating layer is formed on a side surface of the second rewiring layer.
  • another photosensitive component including: a photosensitive chip having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region and a non- A photosensitive area, the photosensitive chip further has a pad disposed on the non-photosensitive area; an electronic component is arranged around the photosensitive chip; a molding layer is formed by a molding process and the electronic component and the photosensitive The chips are fixed together, the molding layer has a third surface flush with the first surface, and the molding layer covers the second surface to form a fourth surface facing away from the third surface; A first rewiring layer formed on the non-photosensitive region of the first surface and the third surface, and the pad is electrically connected to the electronic component through the first rewiring layer; and a conductive core , The conductive core penetrates the molding layer, and one end of the conductive core is electrically connected to the electronic component and the pad through the first rewiring layer, and the other end is on the fourth surface Exposed to form conductive
  • a method for manufacturing a photosensitive component including: 1) manufacturing a photosensitive component puzzle, the photosensitive component puzzle is composed of at least two photosensitive component units, and the photosensitive component unit includes: A photosensitive chip having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region and a non-photosensitive region, and the photosensitive chip further having a pad disposed on the non-photosensitive region An electronic component arranged around the photosensitive chip; a molding layer formed by a molding process and packaging the electronic component and the photosensitive chip together, the molding layer having a level with the first surface A third surface; and a first rewiring layer formed on the non-photosensitive area of the first surface and the third surface, and the pad is electrically connected to the electronic component through the first rewiring layer.
  • the molding layers of two adjacent photosensitive component units are connected to form a whole, and a conductive pillar is provided at a position of a boundary line of the adjacent two photosensitive component units, and the conductive Being wrapped in the molding layer that is integrally formed; and 2) cutting the photosensitive component panel at the boundary line, so that the conductive pillar is cut, so that the molded photosensitive component obtained by the cutting is molded.
  • the side of the layer has the conductive region.
  • the step 1) includes: 11) forming a first rewiring layer corresponding to at least two photosensitive chips on a carrier board; 12) providing at least two photosensitive chips and corresponding ones on the first rewiring layer An electronic component and a conductive pillar located between two adjacent photosensitive chips, wherein the electronic component and the conductive pillar are both electrically connected to a pad of the photosensitive chip through the first rewiring layer; and 13)
  • the first rewiring layer, the at least two photosensitive chips, the electronic components, and the conductive pillars are fixed together by a molding process, thereby forming the photosensitive component puzzle.
  • the first rewiring layer has a through-hole forming area corresponding to the photosensitive area, and the through-hole forming area is not wired; the method for manufacturing a photosensitive component further includes a step : 3) removing the through-hole forming region from the first rewiring layer.
  • step 3) is performed after step 2); or between step 13) and step 2); or between step 11) and step 12).
  • the conductive pillar is in contact with a plant ball disposed at an interface between the first redistribution layer and the molding layer.
  • the step 12) further includes disposing a conductive core on the first rewiring layer; the step 13) further includes disposing the conductive core and the first rewiring layer, the photosensitive chip, and The electronic components are molded together; the step 1) further includes sub-steps: 14) forming a second rewiring layer on the surface of the molding layer formed in step 13) facing away from the carrier board to form the Photosensitive component puzzle.
  • another method for manufacturing a photosensitive component including: 1) manufacturing the photosensitive component according to any one of claims 2-3, wherein the rewiring layer of the photosensitive component Part of the redistribution wiring extends to the edge of the redistribution layer and is exposed on the side of the redistribution layer, wherein the redistribution layer is the first redistribution layer or the second redistribution layer; and 2 ) Forming the conductive region by plating a metal layer on a side surface of the molding layer and a side surface of the rewiring layer.
  • the step 1) includes the following sub-steps: 11) forming a first rewiring layer corresponding to the photosensitive chip on the carrier board; 12) providing a photosensitive chip and corresponding electronic components on the first rewiring layer, The electronic component is electrically connected to the pad of the photosensitive chip through the first redistribution layer; and 13) the first redistribution layer, the photosensitive chip, and the electronic component are fixed by a molding process.
  • the carrier board has a blank area corresponding to the photosensitive area of the photosensitive chip, and the blank area is not covered by the first rewiring layer.
  • the first rewiring layer has a through-hole forming area corresponding to the photosensitive area of the photosensitive chip, and the through-hole forming area is not wired; the photosensitive component
  • the manufacturing method further includes the steps of: 3) removing the through-hole forming region.
  • a part of the redistribution wiring of the first redistribution layer extends to an edge of the first redistribution layer and is exposed on a side surface of the first redistribution layer; the step 2 ), The conductive region is formed by plating a metal layer on a side surface of the molding layer and a side surface of the first rewiring layer.
  • the step 12) further includes disposing a conductive core on the first rewiring layer; the step 13) further includes disposing the conductive core and the first rewiring layer, the photosensitive chip, and The electronic components are molded together; the step 1) further includes sub-steps: 14) forming a second rewiring layer on the surface of the molding layer formed in step 13) facing away from the carrier board.
  • a part of the redistribution wiring of the second redistribution layer extends to an edge of the second redistribution layer and is exposed on a side surface of the second redistribution layer; the step 2 ), The conductive region is formed by plating a metal layer on a side surface of the molding layer and a side surface of the second rewiring layer.
  • the step 1) includes: packaging at least two of the photosensitive chips, the electronic components, and the conductive pillars arranged on a carrier board in a predetermined position by a molding process, and then A rewiring layer is arranged on the surface of the package body formed after molding to obtain the photosensitive component puzzle.
  • the step 1) includes: 11) arranging at least two photosensitive chips, electronic components and the conductive pillars on a carrier board; 12) arranging the at least two photosensitive chips, electronic components by a molding process And the conductive pillars are fixed together to form a package; 13) a first rewiring layer is provided on the package so that the electronic component and the conductive pillars are connected to The pads of the photosensitive chip are electrically connected to obtain the photosensitive component puzzle.
  • the conductive pillar is in contact with a plant ball disposed at an interface between the first redistribution layer and the molding layer.
  • the first rewiring layer has a through-hole forming area corresponding to the photosensitive area, and the through-hole forming area is not wired; the method for manufacturing a photosensitive component further includes a step : 3) removing the light-passing hole forming region.
  • the step 3) is performed between the step 13) and the step 2), or is performed after the step 2).
  • This application can adopt a connectionless belt structure, which reduces the design restrictions of the fan-out packaged light-sensitive components and makes the design more flexible.
  • the present application can realize contact-type electrical connection on the side of the photosensitive component, making the camera module more compact.
  • an electrical connection area can be provided on the side of the base of the camera module, which is integrated with the base and is not easily damaged.
  • the present application can use a contact-type electrical connection on the side of the base to make the connection between the camera module and the mobile terminal simpler and more convenient, and it is easy to replace the camera module, which makes the camera module more modular.
  • FIG. 1 is a schematic cross-sectional view of a photosensitive component 10 in an embodiment of the present application
  • FIG. 2 is a schematic side view of the photosensitive component 10 shown in FIG. 1;
  • FIG. 3 is a schematic cross-sectional view of a photosensitive member 10 according to another embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a photosensitive member 10 in another embodiment of the present application.
  • FIG. 5a shows a schematic bottom view of the photosensitive assembly 10 shown in FIG. 4;
  • FIG. 5b is a schematic bottom view of a photosensitive component according to another embodiment of the present application.
  • 6a to 6g illustrate a manufacturing process of the photosensitive component 10 in an embodiment of the present application
  • FIG. 7a to 7g illustrate a manufacturing process of a photosensitive component 10 according to another embodiment of the present application
  • FIG. 8a to FIG. 8e illustrate a manufacturing process of the photosensitive component 10 in another embodiment of the present application.
  • the expressions of the first, second, etc. are only used to distinguish one feature from another feature, and do not indicate any limitation on the feature. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.
  • FIG. 1 is a schematic cross-sectional view of a photosensitive component 10 in an embodiment of the present application.
  • the photosensitive assembly 10 includes a photosensitive chip 1, an electronic component 2, a molding layer 3, and a first rewiring layer 4.
  • the photosensitive chip 1 has a first surface 11 and a second surface 12 facing away from the first surface 11.
  • the first surface 11 has a photosensitive region 13 and a non-photosensitive region 14.
  • the pad 15 (for example, a solder joint) of the non-photosensitive region 14 is described.
  • the electronic component 2 is arranged around the photosensitive chip 1.
  • a molding layer 3 is formed by a molding process and fixes the electronic component 2 and the photosensitive chip 1 together.
  • the molding layer 3 has a third surface 31 that is flush with the first surface 11.
  • FIG. 2 is a schematic side view of the photosensitive assembly 10 shown in FIG. 1. As shown in FIG. 2, a side surface of the molding layer 3 has a conductive region 5, and the conductive region 5 is electrically connected to the first redistribution layer 4.
  • FIG. 3 shows a schematic cross-sectional view of a photosensitive component 10 according to another embodiment of the present application.
  • the molding layer 3 covers the second surface 12 to form a fourth surface 32 facing away from the third surface 31.
  • the photosensitive assembly 10 further includes a conductive core 7 and a second redistribution layer 6.
  • the conductive core 7 is arranged around the photosensitive chip 1, and a second rewiring layer 6 is formed on the fourth surface 32.
  • the molding layer 3 is formed by a molding process and fixes the conductive core body 7, the electronic component 2 and the photosensitive chip 1 together, and the conductive core body 7 rewires the first Layer 4 and the second rewiring layer 6 are electrically connected, the pad 15 is electrically connected to the conductive core 7 through the first rewiring layer 4, and the conductive core 7 is connected through the second rewiring layer 7
  • the wiring layer 6 is electrically connected to the electronic component 2.
  • the conductive region 5 is electrically connected to the first redistribution layer 4 through the second redistribution layer 6 and the conductive core 7.
  • the conductive region 5 is formed by cutting conductive pillars 51 disposed on a boundary between two adjacent photosensitive elements 10.
  • the redistribution lines of the first redistribution layer 4 extend to the edge of the first redistribution layer 4 and are exposed on the side of the first redistribution layer 4; the conductive region 5 It is formed by plating a metal layer on a side surface of the molding layer 3 and a side surface of the first rewiring layer 4.
  • the redistribution lines of the second redistribution layer 6 extend to the edges of the second redistribution layer 6 and are exposed on the side of the second redistribution layer 6; the conductive region 5 It is formed by plating a metal layer on a side surface of the molding layer 3 and a side surface of the second rewiring layer 6.
  • the circuit of the photosensitive component can be extended through the redistribution layer (RDL), which can facilitate the electrical connection between the camera module and the mobile terminal, but the interval between the opposite conductive areas needs to be set to prevent mutual Interference.
  • RDL redistribution layer
  • conductive areas can be distributed around the camera module base (the photosensitive component can be regarded as the base of the camera module).
  • the photosensitive component can be regarded as the base of the camera module.
  • the embodiments may be arranged on the same side so as to reduce the circuit arrangement in the mobile terminal.
  • FIG. 4 shows a schematic cross-sectional view of a photosensitive component 10 in another embodiment of the present application.
  • the conductive region 5 of the photosensitive member 10 is disposed at the bottom.
  • the photosensitive assembly 10 includes a photosensitive chip 1, an electronic component 2, a molding layer 3, a first rewiring layer 4, and a conductive core 7.
  • the photosensitive chip 1 has a first surface 11 and a second surface 12 facing away from the first surface 11.
  • the first surface 11 has a photosensitive region 13 and a non-photosensitive region 14.
  • the pad 15 of the non-photosensitive region 14 is described.
  • the electronic component 2 is arranged around the photosensitive chip 1.
  • a molding layer 3 is formed by a molding process and fixes the electronic component 2 and the photosensitive chip 1 together.
  • the molding layer 3 has a third surface 31 that is flush with the first surface 11, and The molding layer 3 covers the second surface 12 to form a fourth surface 32 facing away from the third surface 31.
  • a first redistribution layer 4 is formed on the non-photosensitive region 14 and the third surface 31 of the first surface 11, and the pad 15 is electrically connected to the electronic component 2 through the first redistribution layer 4. connection.
  • a conductive core 7 penetrates the molding layer 3, and one end of the conductive core 7 is electrically connected to the electronic component 2 and the pad 15 through the first redistribution layer 4, and the other end is in the The fourth surface 32 is exposed to form the conductive region 5.
  • FIG. 5 a shows a schematic bottom view of the photosensitive assembly 10 shown in FIG. 4. As can be seen from FIG. 5 a, in this embodiment, the conductive region 5 of the photosensitive component 10 is distributed on the fourth surface 32 located at the bottom. In this embodiment, the conductive pillars 51 are all disposed inside the module.
  • FIG. 5b shows a schematic bottom view of a photosensitive component according to another embodiment of the present application.
  • the schematic cross-sectional view of the photosensitive component is consistent with FIG. 3.
  • the conductive regions 5 are distributed on the lower surface of the second redistribution layer 6 at the bottom.
  • the conductive region 5 may be formed by an exposed solder ball array or a conductive pillar array.
  • a contact-type electrical connection with other components of a terminal device (such as a motherboard) can be realized on the bottom surface of the photosensitive component.
  • the photosensitive component can be used for an AF-type camera module or an FF-type camera module.
  • the camera module can be a common single camera, which can be expanded and used in a dual camera or an array module.
  • the conductive region may be a conductive pillar or a conductive layer.
  • FIGS. 6 a to 6 g illustrate a manufacturing process of the photosensitive assembly 10 in an embodiment of the present application.
  • the method for manufacturing the photosensitive component 10 in this embodiment includes steps 100-200:
  • FIG. 6f illustrates an example of a completed photo sensor assembly according to an embodiment of the present application.
  • the light-sensitive component puzzle is composed of at least two light-sensitive component units 10 ′, wherein the molding layers 3 of two adjacent light-sensitive component units 10 ′ are integrated into one, and A conductive pillar 51 is provided at the boundary line, and the conductive pillar 51 is wrapped in the molding layer 3 that is integrated.
  • step 100 includes sub-steps:
  • a first rewiring layer 4 corresponding to at least two photosensitive chips 1 is formed on the carrier board 8.
  • the first rewiring layer 4 has a through-hole forming region 41 corresponding to the photosensitive region 13, and the through-hole forming region 41 is not wired.
  • FIG. 6 a shows an example of forming a first rewiring layer 4 corresponding to two photosensitive chips on a carrier board 8 in an embodiment of the present application.
  • step 102 at least two photosensitive chips 1 and corresponding electronic components 2 and a conductive pillar 51 located between two adjacent photosensitive chips 1 are disposed on the first redistribution layer 4, wherein the electronic components 2 and The conductive pillars 51 are all electrically connected to the pads 15 of the photosensitive chip 1 through the first redistribution layer 4.
  • the conductive pillar 51 is in contact with a plant ball disposed at an interface between the first redistribution layer 4 and the molding layer 3.
  • FIG. 6b shows an embodiment of the present application in which at least two photosensitive chips 1 and corresponding electronic components 2 are disposed on the first rewiring layer 4 and conductive pillars 51 located between two adjacent photosensitive chips 1 Examples.
  • the first rewiring layer 4, the at least two photosensitive chips 1, the electronic component 2 and the conductive pillar 51 are fixed together by a molding process.
  • FIG. 6c shows an example of fixing the first rewiring layer 4, the at least two photosensitive chips 1, the electronic component 2 and the conductive pillar 51 together by a molding process in an embodiment of the present application.
  • the molding layer 3 may be ground so that the conductive pillar 51 is exposed and the molding layer 3 is thinned.
  • the height of the thinned molding layer 3 is equal to or greater than that of the electronic component 2. Height (Generally, the height of the electronic component 2 is higher than the height of the photosensitive chip 1).
  • FIG. 6c shows an example of fixing the first rewiring layer 4, the at least two photosensitive chips 1, the electronic component 2 and the conductive pillar 51 together by a molding process in an embodiment of the present application.
  • the molding layer 3 may be ground so that the conductive pillar 51 is exposed and the molding layer 3 is thinned.
  • FIG. 6d shows an example of grinding the molding layer 3 in an embodiment of the present application. Further, the carrier plate 8 can be peeled to obtain a photosensitive component panel.
  • FIG. 6e shows an example of a photosensitive component puzzle after the carrier plate 8 is peeled off in an embodiment of the present application. Further, in one embodiment, the through-hole forming region 41 of the first redistribution layer 4 can also be removed.
  • FIG. 6f shows an example of a light-sensitive component jigsaw after removing the through-hole forming area 41 of the first redistribution layer 4 in an embodiment of the present application.
  • Step 200 Cut the photosensitive component puzzle at the boundary line, so that the conductive pillar 51 is cut, so that the side of the molded layer 3 of the photosensitive component 10 obtained by the cutting has the conductive region 5.
  • Fig. 6g shows an example of the photosensitive component 10 obtained by cutting the photosensitive component panel in an embodiment of the present application.
  • removing the through-hole forming region 41 of the first rewiring layer 4 may also be performed after step 200. That is, after obtaining the photosensitive component puzzle shown in FIG. 6e, step 200 is directly performed. Then, the step of removing the through-hole forming region 41 of the first rewiring layer 4 is performed.
  • the step of removing the through-hole forming region 41 of the first rewiring layer 4 may also be performed between step 101 and step 102, so that the first rewiring layer 4 does not completely cover all Mentioned carrier board 8. That is, after removing the through-hole formation area 41, there is a blank area on the carrier board 8, the blank area corresponding to the photosensitive area 13 of the photosensitive chip 1 and the blank area is not covered by the first rewiring layer 4.
  • a longer conductive region 5 may be provided between the RDL layer and the molding layer 3 between the two photosensitive chips 1 to facilitate the After cutting, the exposed conductive area 5 can still be obtained on the side of the camera module, and the conductive area 5 and the RDL layer can still be electrically connected.
  • the carrier board 8 may not be removed in step 103, but the carrier board 8 may be removed after step 200 is completed.
  • the first rewiring layer 4 has a through-hole forming region 41 corresponding to the photosensitive region 13, and the through-hole forming region 41 is not wired.
  • the method for manufacturing the photosensitive component 10 further includes:
  • Step 300 Remove the through-hole forming region 41 of the first rewiring layer 4.
  • Step 300 may be performed after step 200, or may be performed after step 103 and before step 200.
  • the first rewiring layer 4 does not completely cover the carrier board 8.
  • the carrier board 8 has a blank area corresponding to the photosensitive area 13 of the photosensitive chip 1 and the blank area is not covered by the first rewiring layer 4.
  • FIGS. 7 a to 7 g illustrate a manufacturing process of the photosensitive assembly 10 according to another embodiment of the present application.
  • the at least two photosensitive chips 1, the electronic components 2 and the conductive pillars 51 may be molded together, and then packaged in the obtained package.
  • a redistribution layer (for example, the first redistribution layer 4) is formed on the surface of the body.
  • the method for manufacturing the photosensitive component 10 in this embodiment includes steps:
  • Step 110 According to a preset position, at least two photosensitive chips 1, electronic components 2 and conductive posts 51 are arranged on the carrier board 8.
  • FIG. 7 a illustrates an example in which two photosensitive chips 1, an electronic component 2, and the conductive pillar 51 are arranged on a carrier board 8 in an embodiment of the present application.
  • at least two photosensitive chips 1, electronic components 2 and conductive pillars 51 arranged on the carrier board 8 correspond to at least two photosensitive component units.
  • a conductive pillar 51 is provided at a position of a boundary line between the two adjacent photosensitive component units.
  • Step 120 Fix the at least two photosensitive chips 1, the electronic component 2 and the conductive pillar 51 together by a molding process to form a package.
  • FIG. 7 b shows an example in which two photosensitive chips 1, electronic components 2 and the conductive pillars 51 are arranged on a carrier board 8 in an embodiment of the present application.
  • the package has a molding layer 3 therein.
  • Step 130 grinding the mold layer 3 of the package to expose the conductive pillars 51 and thin the mold layer 3.
  • FIG. 7c illustrates an example of a package after grinding in an embodiment of the present application.
  • Step 140 Remove the carrier board 8.
  • FIG. 7d shows an example of the package body after the carrier board 8 is removed in an embodiment of the present application. After the carrier board 8 is removed in FIG. 7 d, the package is turned over so that the photosensitive region 13 of the photosensitive chip 1 is placed upward.
  • Step 150 forming a first redistribution layer 4 on the upper surface of the package, so that both the electronic component 2 and the conductive pillar 51 pass through the first redistribution layer 4 and the substrate of the photosensitive chip 1.
  • the pad 15 is electrically connected.
  • the conductive pillar 51 is in contact with a plant ball disposed at an interface between the first redistribution layer 4 and the molding layer 3.
  • FIG. 7e shows an example of forming the first redistribution layer 4 on the surface of the package in one embodiment of the present application.
  • the first rewiring layer 4 has a through-hole forming region 41 corresponding to the photosensitive region 13, and the through-hole forming region 41 is not wired.
  • Step 160 Remove the through-hole formation region 41 of the first rewiring layer 4 so that the photosensitive region 13 is exposed.
  • FIG. 7f illustrates an example of a photosensitive component jigsaw after removing the through-hole forming area 41 in an embodiment of the present application.
  • Step 170 Cut the light-sensitive element puzzle to obtain a single light-sensitive element 10.
  • FIG. 7g illustrates an example of a single photosensitive member 10 in an embodiment of the present application. Among them, the conductive pillars 51 at the boundary line positions of the two photosensitive component units are cut to form conductive areas 5 on the side of the single photosensitive component 10. In another embodiment, the execution order of steps 160 and 170 may be interchanged.
  • FIGS. 8a to 8e illustrate a manufacturing process of the photosensitive member 10 in another embodiment of the present application.
  • the method for manufacturing the photosensitive component 10 in this embodiment includes steps 1000-2000:
  • a photosensitive device 10 is fabricated, wherein a part of the redistribution layer of the redistribution layer of the photosensitive device 10 extends to the edge of the redistribution layer, and is exposed on the side of the redistribution layer, wherein the redistribution layer is exposed. It may be the first redistribution layer 4 or the second redistribution layer 6.
  • a conductive layer 5 is formed by plating a metal layer on a side surface of the molding layer 3 and a side surface of the rewiring layer to obtain a finished photosensitive component 10.
  • step 1000 includes the following sub-steps 1001-1005:
  • a first rewiring layer 4 corresponding to the photosensitive chip 1 is formed on the carrier board 8.
  • FIG. 8a shows an example of forming a first rewiring layer 4 corresponding to a photosensitive chip on a carrier board 8 in an embodiment of the present application.
  • the first rewiring layer 4 has a through-hole forming region 41 corresponding to the photosensitive region 13, and the through-hole forming region 41 is not wired.
  • a part of the redistribution wiring of the first redistribution layer 4 extends to an edge of the first redistribution layer 4 and is exposed on a side surface of the first redistribution layer 4.
  • step 1002 a photosensitive chip 1 and a corresponding electronic component 2 are disposed on the first rewiring layer 4.
  • FIG. 8b shows an example in which a photosensitive chip 1 and a corresponding electronic component 2 are provided on the first redistribution layer 4 in an embodiment of the present application.
  • the electronic component 2 is electrically connected to the pad 15 of the photosensitive chip 1 through the first redistribution layer 4.
  • step 1003 the first rewiring layer 4, the photosensitive chip 1, and the electronic component 2 are fixed together by a molding process.
  • FIG. 8c shows an example of fixing the first rewiring layer 4, the photosensitive chip 1, and the electronic component 2 together by a molding process in an embodiment of the present application.
  • step 1004 the carrier board 8 is removed.
  • FIG. 8d shows an example of removing the carrier board 8 in an embodiment of the present application.
  • step 1005 the through-hole forming region 41 of the first rewiring layer 4 is removed to expose the photosensitive region 13 of the photosensitive chip 1.
  • step 2000 is performed, that is, a conductive region 5 is formed by plating a metal layer on a side surface of the molding layer 3 and a side surface of the rewiring layer to obtain a finished photosensitive member 10.
  • FIG. 8e shows an example of a finished product of the photosensitive member 10 in an embodiment of the present application.
  • step 1000 may further include a sub-step 1003a: forming a second rewiring layer on the upper surface of the molding layer 3 formed in step 1003. Part of the redistribution wiring of the second redistribution layer extends to an edge of the second redistribution layer, and is exposed on a side surface of the second redistribution layer.
  • the redistribution layer may be a first redistribution layer or a second redistribution layer.
  • the redistribution layer when a part of the redistribution wiring of the first redistribution layer is exposed on a side surface of the first redistribution layer, the redistribution layer is a first redistribution layer.
  • the redistribution layer is a second redistribution layer.
  • the conventional fan-out process is performed first, but the difference is that the circuit of the RDL layer needs to be exposed on the side, so that the conductive layer can be electrically connected to the RDL layer when the conductive layer is plated later.
  • the advantage of this solution is that the shape of the conductive area can be arbitrarily set to meet different customer needs.
  • the carrier may be removed after step 1003 is completed and before step 2000 is performed. In another embodiment, the carrier can also be removed after completing step 2000.
  • step 1005 (that is, the step of removing the through-hole forming region of the first redistribution layer 4) may also be performed after step 2000.
  • step 1005 may be performed between steps 1001 and 1002.
  • the first rewiring layer does not completely cover the carrier board.
  • the carrier board has a blank area corresponding to the photosensitive area of the photosensitive chip and the blank area is not covered by the first rewiring layer.

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Abstract

本申请提供了一种感光组件，其包括：感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域；电子元件，布置于所述感光芯片周围；模制部，通过模制工艺形成并将所述电子元件和所述感光芯片封装在一起，所述模制部具有与所述第一表面齐平的第三表面；以及第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且感光芯片的衬垫通过所述第一再布线层与所述电子元件电连接；其中，所述感光组件的侧面或底面具有导电区域且该导电区域与所述第一再布线层电连接。本申请还提供了相应的感光组件制作方法。本申请可以使感光组件设计上的限制减少；使移动终端中的摄像模组更加模块化且易于更换。

Description

感光组件及其制作方法
交叉引用
本申请要求于2018年07月23日向中国专利局提交的、发明名称为“感光组件及其制作方法”的第201810812766.8号发明专利申请的优先权，上述专利申请的全部内容通过引用并入本文。
技术领域
本申请涉及光学技术领域，具体地说，本申请涉及感光组件及其制作方法。
背景技术
目前摄像模组行业越来越向小型化发展，以满足现在智能终端的集成化和小型化的要求。而目前对摄像模组小型化重要阻碍之一就是印刷电路板，以目前印刷线路板的技术来说已经接近其所能达到的极限，不能再满足更加小型化的需求。
为了满足目前行业内小型化的需求，本申请人提出了通过扇出型封装技术(fan-out封装)将摄像模组的感光芯片与电子元器件电连接在一起的解决方案。这种方案通过扇出型封装代替了常规摄像模组中的线路板，从而进一步地推动摄像模组小型化。
然而，目前的摄像模组通常需要通过柔性连接带和连接器将摄像模组与移动终端连接，所以需要在扇出型封装上设置一区域用于与柔性连接带电连接。但是如需要连接柔性连接带，就必须使扇出型封装的摄像模组的感光组件的顶层或底层为RDL层，从而延伸出焊点供柔性连接带电连接。这也就对扇出型封装的结构设计造成了一定的限制，并且在电连接柔性连接带的同时必定会产生一定的避让设计。另外，为了设置柔性连接带而使摄像模组体积变大，这也就与行业发展的小型化发展相违背。
另一方面，现有移动终端也在往高集中化发展，导致移动终端中为摄像模组设置的区域更加狭小。摄像模组通过柔性连接带设置到移动终端上时，该柔性连接带可能需要进行较大弯折才能连接到移动终端上，这也就使得摄像模组对柔性连接带的可靠性要求也日益加大以满足柔性连接带不会因为多次弯折而导致损坏。所以目前常规的柔性连接带的连接方式已经不满足现在的行业发展，甚至产生了一定的阻碍。
因此，当前迫切需要能够克服上述缺陷的解决方案。
发明内容
本申请旨在提供一种能够克服现有技术的上述至少一个缺陷的解决方案。
根据本申请的一个方面，提供了一种感光组件，包括：感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域和非感光区域，所述感光芯片还具有设置于所述非感光区域的衬垫；电子元件，布置于所述感光芯片周围；模制部，通过模制工艺形成并将所述电子元件和所述感光芯片封装在一起，所述模制部具有与所述第一表面齐平的第三表面；以及第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且所述衬垫通过所述第一再布线层与所述电子元件电连接；其中，所述感光组件的侧面或底面具有导电区域且该导电区域与所述第一再布线层电连接。
其中，所述模制部为模塑层，所述模塑层覆盖所述第二表面，形成背对所述第三表面的第四表面；
其中，所述感光组件还包括：导电芯体，布置于所述感光芯片周围；以及第二再布线层，形成在所述第四表面上；其中，所述模塑层通过模塑工艺形成并将所述导电芯体、所述电子元件和所述感光芯片固定在一起，所述导电芯体将所述第一再布线层和所述第二再布线层电连接，所述衬垫通过所述第一再布线层电连接至所述导电芯体，所述导电芯体通过所述第二再布线层电连接至所述电子元件。
其中，所述模制部的侧面具有导电区域且该导电区域与所述第一再布线层电连接；以及所述导电区域还与所述第二再布线层电连接。
其中，所述导电区域通过切割设置在两个相邻感光组件分界线上的导电柱形成。
其中，所述导电区域通过焊球阵列或者导电柱阵列形成于所述第二再布线层的下表面。
其中，所述第一再布线层的再布线线路延伸至所述第一再布线层的边缘并且在所述第一再布线层的侧面裸露；所述导电区域通过在所述模制部的侧面和所述第一再布线层的侧面镀金属层形成。
其中，所述第二再布线层的再布线线路延伸至所述第二再布线层的边缘并且在所述第二再布线层的侧面裸露；所述导电区域通过在所述模塑层的侧面和所述第二再布线层的侧面镀金属层形成。
根据本申请的另一方面，还提供了另一种感光组件，包括：感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域和非感光区域，所述感光芯片还具有设置于所述非感光区域的衬垫；电子元件，布置于所述感光芯片周围；模塑层，通过模塑工艺形成并将所述电子元件和所述感光芯片固定在一起，所述模塑层具有与所述第一表面齐平的第三表面，并且所述模塑层覆盖所述第二表面，形成背对所述第三表面的第四表面；第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且所述衬垫通过所述第一再布线层与所述电子元件电连接；以及导电芯体，所述导电芯体贯穿所述模塑层，并且所述导电芯体的一端通过所述第一再布线层与所述电子元件和所述衬垫电连接，另一端在所述第四表面裸露以形成导电区域。
根据本申请的另一方面，还提供了一种感光组件制作方法，包括：1)制作感光组件拼板，所述感光组件拼板由至少两个感光组件单元组成，所述感光组件单元包括：感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域和非感光区域，所述感光芯片还具有设置于所述非感光区域的衬垫；电子元件，布置于 所述感光芯片周围；模塑层，通过模塑工艺形成并将所述电子元件和所述感光芯片封装在一起，所述模塑层具有与所述第一表面齐平的第三表面；以及第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且所述衬垫通过所述第一再布线层与所述电子元件电连接；其中，相邻的两个所述感光组件单元的模塑层连接形成一体，并且在所述的相邻的两个感光组件单元的分界线位置设置有导电柱，该导电柱被包裹在形成一体的所述模塑层中；以及2)在所述分界线切割所述感光组件拼板，使得所述导电柱被切开，以使切割得到的所述感光组件的模塑层的侧面具有所述导电区域。
其中，所述步骤1)包括：11)在载板上形成对应于至少两个感光芯片的第一再布线层；12)在所述第一再布线层上设置至少两个感光芯片和相应的电子元件，以及位于相邻两个感光芯片之间的导电柱，其中所述电子元件和所述导电柱均通过所述第一再布线层与所述感光芯片的衬垫电连接；以及13)通过模塑工艺将所述第一再布线层、所述至少两个感光芯片、所述电子元件以及所述导电柱固定在一起，进而形成所述的感光组件拼板。
其中，所述步骤11)中，所述第一再布线层具有对应于所述感光区域的通光孔形成区，所述通光孔形成区不进行布线；所述感光组件制作方法还包括步骤：3)从所述第一再布线层去除所述通光孔形成区。
其中，所述步骤3)在所述步骤2)之后执行；或者在所述步骤13)与所述步骤2)之间执行；或者在所述步骤11)与所述步骤12)之间执行。
其中，所述步骤12)中，所述导电柱与设置于所述第一再布线层与所述模塑层界面的植球接触。
其中，所述步骤12)还包括在所述第一再布线层上设置导电芯体；所述步骤13)还包括在所述导电芯体与所述第一再布线层、所述感光芯片以及所述电子元件模塑在一起；所述步骤1)还包括子步骤：14)在步骤13)所形成的模塑层的背离所述载板的表面形成第二再布线层，形成所述的感光组件拼板。
根据本申请的另一方面，还提供了另一种感光组件制作方法，包 括：1)制作如权利要求2-3中任意一项所述的感光组件，其中所述感光组件的再布线层的部分再布线线路延伸至所述再布线层的边缘，并且在所述再布线层的侧面裸露，其中所述再布线层为所述第一再布线层或所述第二再布线层；以及2)通过在所述模塑层的侧面和所述再布线层的侧面镀金属层形成所述导电区域。
其中，所述步骤1)包括下列子步骤：11)在载板上形成对应于感光芯片的第一再布线层；12)在所述第一再布线层上设置感光芯片和相应的电子元件，其中所述电子元件通过所述第一再布线层与所述感光芯片的衬垫电连接；以及13)通过模塑工艺将所述第一再布线层、所述感光芯片以及所述电子元件固定在一起。
其中，所述步骤11)中，所述载板上具有对应于所述感光芯片的所述感光区域的空白区域，该空白区域不被所述第一再布线层覆盖。
其中，所述步骤11)中，所述第一再布线层具有对应于所述感光芯片的所述感光区域的通光孔形成区，所述通光孔形成区不进行布线；所述感光组件制作方法还包括步骤：3)去除所述通光孔形成区。
其中，所述步骤11)中，所述第一再布线层的部分再布线线路延伸至所述第一再布线层的边缘，并且在所述第一再布线层的侧面裸露；所述步骤2)中，通过在所述模塑层的侧面和所述第一再布线层的侧面镀金属层形成所述导电区域。
其中，所述步骤12)还包括在所述第一再布线层上设置导电芯体；所述步骤13)还包括在所述导电芯体与所述第一再布线层、所述感光芯片以及所述电子元件模塑在一起；所述步骤1)还包括子步骤：14)在步骤13)所形成的模塑层的背离所述载板的表面形成第二再布线层。
其中，所述步骤14)中，所述第二再布线层的部分再布线线路延伸至所述第二再布线层的边缘，并且在所述第二再布线层的侧面裸露；所述步骤2)中，通过在所述模塑层的侧面和所述第二再布线层的侧面镀金属层形成所述导电区域。
其中，所述步骤1)包括：通过模塑工艺，将按预设位置布置在载板上的至少两个所述感光芯片、所述电子元件以及所述导电柱封装在一起，然后再在模塑后形成的封装体表面布置再布线层，得到所述 感光组件拼板。
其中，所述步骤1)包括：11)将至少两个感光芯片、电子元件以及所述导电柱布置在载板上；12)通过模塑工艺，将所述的至少两个感光芯片、电子元件以及所述导电柱固定在一起，形成一个封装体；13)在所述封装体上设置第一再布线层，使得所述电子元件和所述导电柱均通过所述第一再布线层与所述感光芯片的衬垫电连接，以得到所述感光组件拼板。
其中，所述步骤13)中，所述导电柱与设置于所述第一再布线层与所述模塑层界面的植球接触。
其中，所述步骤13)中，所述第一再布线层具有对应于所述感光区域的通光孔形成区，所述通光孔形成区不进行布线；所述感光组件制作方法还包括步骤：3)去除所述通光孔形成区。
其中，所述步骤3)在所述步骤13)和所述步骤2)之间执行，或者在所述步骤2)之后执行。
与现有技术相比，本申请具有下列至少一个技术效果：
1、本申请可以采用无连接带式的结构，使得扇出型封装的感光组件，设计上的限制减少，使得设计更加灵活。
2、本申请可以在感光组件的侧面实现接触式电连接，使得摄像模组更加小型化。
3、本申请可以在摄像模组的基座侧面设置电连接区域，其与基座形成一体，不易损坏。
4、本申请可以通过基座侧面的接触式电连接，使得摄像模组与移动终端的连接更加简单方便，且易于对摄像模组进行更换，也就使得摄像模组变得更加模块化。
附图说明
在参考附图中示出示例性实施例。本文中公开的实施例和附图应被视作说明性的，而非限制性的。
图1示出了本申请一个实施例中的感光组件10的剖面示意图；
图2示出了图1所示的感光组件10的侧视示意图；
图3示出了本申请另一个实施例的感光组件10的剖面示意图；
图4示出了本申请又一个实施例中的感光组件10的剖面示意图；
图5a示出了图4所示感光组件10的仰视示意图；
图5b示出了本申请另一个实施例的感光组件的仰视示意图；
图6a至图6g示出了本申请一个实施例中的感光组件10制作流程；
图7a至图7g示出了本申请另一个实施例的感光组件10制作流程；
图8a至图8e示出了本申请又一实施例中的感光组件10制作流程。
具体实施方式
为了更好地理解本申请，将参考附图对本申请的各个方面做出更详细的说明。应理解，这些详细说明只是对本申请的示例性实施方式的描述，而非以任何方式限制本申请的范围。在说明书全文中，相同的附图标号指代相同的元件。表述“和/或”包括相关联的所列项目中的一个或多个的任何和全部组合。
应注意，在本说明书中，第一、第二等的表述仅用于将一个特征与另一个特征区分开来，而不表示对特征的任何限制。因此，在不背离本申请的教导的情况下，下文中讨论的第一主体也可被称作第二主体。
在附图中，为了便于说明，已稍微夸大了物体的厚度、尺寸和形状。附图仅为示例而并非严格按比例绘制。
还应理解的是，用语“包括”、“包括有”、“具有”、“包含”和/或“包含有”，当在本说明书中使用时表示存在所陈述的特征、整体、步骤、操作、元件和/或部件，但不排除存在或附加有一个或多个其它特征、整体、步骤、操作、元件、部件和/或它们的组合。此外，当诸如“...中的至少一个”的表述出现在所列特征的列表之后时，修饰整个所列特征，而不是修饰列表中的单独元件。此外，当描述本申请的实施方式时，使用“可以”表示“本申请的一个或多个实施方式”。并且，用语“示例性的”旨在指代示例或举例说明。
如在本文中使用的，用语“基本上”、“大约”以及类似的用语用作 表近似的用语，而不用作表程度的用语，并且旨在说明将由本领域普通技术人员认识到的、测量值或计算值中的固有偏差。
除非另外限定，否则本文中使用的所有用语(包括技术用语和科学用语)均具有与本申请所属领域普通技术人员的通常理解相同的含义。还应理解的是，用语(例如在常用词典中定义的用语)应被解释为具有与它们在相关技术的上下文中的含义一致的含义，并且将不被以理想化或过度正式意义解释，除非本文中明确如此限定。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
图1示出了本申请一个实施例中的感光组件10的剖面示意图。参考图1，该感光组件10包括：感光芯片1、电子元件2、模塑层3和第一再布线层4。其中感光芯片1具有第一表面11和背对所述第一表面11的第二表面12，所述第一表面11具有感光区域13和非感光区域14，所述感光芯片1还具有设置于所述非感光区域14的衬垫15(例如焊点)。电子元件2布置于所述感光芯片1周围。模塑层3通过模塑工艺形成并将所述电子元件2和所述感光芯片1固定在一起，所述模塑层3具有与所述第一表面11齐平的第三表面31。第一再布线层4形成在所述第一表面11的非感光区域14和所述第三表面31上，并且所述衬垫15通过所述第一再布线层4与所述电子元件2电连接。图2示出了图1所示的感光组件10的侧视示意图。如图2所示，所述模塑层3的侧面具有导电区域5且该导电区域5与所述第一再布线层4电连接。
进一步地，图3示出了本申请另一个实施例的感光组件10的剖面示意图。参考图3，本实施例中，所述模塑层3覆盖所述第二表面12，形成背对所述第三表面31的第四表面32。所述感光组件10还包括导电芯体7和第二再布线层6。该导电芯体7布置于所述感光芯片1周围，第二再布线层6形成在所述第四表面32上。其中，所述模塑层3通过模塑工艺形成并将所述导电芯体7、所述电子元件2和所述感光 芯片1固定在一起，所述导电芯体7将所述第一再布线层4和所述第二再布线层6电连接，所述衬垫15通过所述第一再布线层4电连接至所述导电芯体7，所述导电芯体7通过所述第二再布线层6电连接至所述电子元件2。所述导电区域5通过所述第二再布线层6和所述导电芯体7与所述第一再布线层4电连接。
在一个实施例中，所述导电区域5通过切割设置在两个相邻感光组件10分界线上的导电柱51形成。
在另一个实施例中，所述第一再布线层4的再布线线路延伸至所述第一再布线层4的边缘并且在所述第一再布线层4的侧面裸露；所述导电区域5通过在所述模塑层3的侧面和所述第一再布线层4的侧面镀金属层形成。
在另一个实施例中，所述第二再布线层6的再布线线路延伸至所述第二再布线层6的边缘并且在所述第二再布线层6的侧面裸露；所述导电区域5通过在所述模塑层3的侧面和所述第二再布线层6的侧面镀金属层形成。
上述实施例都能通过再布线层(RDL)对感光组件的电路进行扩展，从而能便于摄像模组与移动终端电连接，但相对的各个导电区域之间的间隔需要进行一定的设置，防止相互之间的干扰。
并且上述实施例中，摄像模组基座(感光组件可视为摄像模组的基座)的四周都可以分布导电区域，在所需的导电区域(或者感光组件所需的输入输出端子)太多而不能设置在同一侧面时，将导电区域设置在摄像模组基座的两个或两个以上的侧面是合适的。当然，实施方式可为为设置在同一侧面，以便减少在移动终端的电路设置。
进一步地，图4示出了本申请又一个实施例中的感光组件10的剖面示意图。在本实施例中，所述感光组件10的导电区域5设置在底部。参考图4，该感光组件10包括：感光芯片1、电子元件2、模塑层3、第一再布线层4和导电芯体7。其中感光芯片1具有第一表面11和背对所述第一表面11的第二表面12，所述第一表面11具有感光区域13和非感光区域14，所述感光芯片1还具有设置于所述非感光区域14 的衬垫15。电子元件2布置于所述感光芯片1周围。模塑层3通过模塑工艺形成并将所述电子元件2和所述感光芯片1固定在一起，所述模塑层3具有与所述第一表面11齐平的第三表面31，并且所述模塑层3覆盖所述第二表面12，形成背对所述第三表面31的第四表面32。第一再布线层4形成在所述第一表面11的非感光区域14和所述第三表面31上，并且所述衬垫15通过所述第一再布线层4与所述电子元件2电连接。导电芯体7贯穿所述模塑层3，并且所述导电芯体7的一端通过所述第一再布线层4与所述电子元件2和所述衬垫15电连接，另一端在所述第四表面32裸露以形成导电区域5。图5a示出了图4所示感光组件10的仰视示意图。从图5a可以看出，本实施例中，感光组件10的导电区域5分布在位于底部的第四表面32。该实施例中，导电柱51都设置在模组内部。
进一步地，图5b示出了本申请另一个实施例的感光组件的仰视示意图。本实施例中，感光组件的剖面示意图与图3一致。参考图5b，本实施例中，导电区域5分布在位于底部的第二再布线层6的下表面。导电区域5可以由露出的焊球阵列或导电柱阵列形成。本实施例可以在感光组件的底面实现与终端设备其它部件(例如主板)的接触式电连接。
上述实施例中，所述感光组件即可用于AF类的摄像模组，也可用于FF类的摄像模组。且摄像模组可以为普通单摄，可扩充用在双摄或者阵列模组中。所述导电区域可以为导电柱，也可以是导电层。
进一步地，图6a～g示出了本申请一个实施例中的感光组件10制作流程。参考图6a～g，本实施例的感光组件10制作方法包括步骤100-200：
步骤100，制作感光组件拼板。图6f示出了本申请一个实施例中制作完成的感光组件拼板的一个示例。所述感光组件拼板由至少两个感光组件单元10’组成，其中相邻的两个感光组件单元10’的模塑层3形成一体，并且在所述的相邻的两个感光组件单元的分界线位置设置 有导电柱51，该导电柱51被包裹在形成一体的所述模塑层3中。
在一个实施例中，步骤100包括子步骤：
步骤101，在载板8上形成对应于至少两个感光芯片1的第一再布线层4。在一个例子中，第一再布线层4具有对应于所述感光区域13的通光孔形成区41，所述通光孔形成区41不进行布线。图6a示出了本申请一个实施例中在载板8上形成对应于两个感光芯片的第一再布线层4的示例。
步骤102，在所述第一再布线层4上设置至少两个感光芯片1和相应的电子元件2，以及位于相邻两个感光芯片1之间的导电柱51，其中所述电子元件2和所述导电柱51均通过所述第一再布线层4与所述感光芯片1的衬垫15电连接。其中，所述导电柱51与设置于所述第一再布线层4与所述模塑层3界面的植球接触。图6b示出了本申请一个实施例中在所述第一再布线层4上设置至少两个感光芯片1和相应的电子元件2以及位于相邻两个感光芯片1之间的导电柱51的示例。
步骤103，通过模塑工艺将所述第一再布线层4、所述至少两个感光芯片1、所述电子元件2以及所述导电柱51固定在一起。图6c示出了本申请一个实施例中通过模塑工艺将所述第一再布线层4、所述至少两个感光芯片1、所述电子元件2以及所述导电柱51固定在一起的示例。在一个实施例中，模塑完成后可以对模塑层3进行研磨，使得导电柱51暴露，并使模塑层3减薄，减薄的模塑层3的高度等于或大于电子元件2的高度(一般电子元件2高度要高于感光芯片1的高度)。图6d示出了本申请一个实施例中对模塑层3进行研磨的一个示例。进一步地，可将载板8剥离得到感光组件拼板。图6e示出了本申请一个实施例中载板8剥离后的感光组件拼板的一个示例。进一步地，在一个实施例中，还可以将所述第一再布线层4的通光孔形成区41去除。图6f示出了本申请一个实施例中所述第一再布线层4的通光孔形成区41去除后的感光组件拼板的一个示例。
步骤200，在所述分界线切割所述感光组件拼板，使得所述导电柱51被切开，以使切割得到的所述感光组件10的模塑层3的侧面具有所述导电区域5。图6g示出了本申请一个实施例中切割感光组件拼 板得到感光组件10的一个示例。
进一步地，在一个实施例中，去除所述第一再布线层4的通光孔形成区41也可以在步骤200之后执行。即得到图6e所示的感光组件拼板后，直接执行步骤200。然后再执行去除所述第一再布线层4的通光孔形成区41的步骤。当然，在另一个实施例中，去除所述第一再布线层4的通光孔形成区41的步骤也可以在步骤101和步骤102之间执行，使得第一再布线层4不完全覆盖所述载板8。也就是说，在去除通光孔形成区41后，载板8上具有空白区域，该空白区域对应于所述感光芯片1的感光区域13且该空白区域不被第一再布线层4覆盖。
上述步骤100-200所对应的实施例适合整拼版的工艺流程，在实施例中，可以在两两感光芯片1之间的RDL层和模塑层3设置较长的导电区域5，以便于在切割后，仍能够在摄像模组的侧面获得裸露的导电区域5，并且导电区域5与RDL层仍能够电连接。在另一个实施例中，步骤103中也可以不去除载板8，而是在完成步骤200之后去除载板8。
在另一个例子中，所述步骤101中，第一再布线层4具有对应于所述感光区域13的通光孔形成区41，所述通光孔形成区41不进行布线。
所述感光组件10制作方法还包括：
步骤300：去除所述第一再布线层4的通光孔形成区41。步骤300可在步骤200之后执行，也可以在步骤103之后，步骤200之前执行。第一再布线层4不完全覆盖所述载板8。载板8上具有空白区域，该空白区域对应于所述感光芯片1的感光区域13且该空白区域不被第一再布线层4覆盖。
进一步地，图7a～g示出了本申请另一个实施例的感光组件10制作流程。本实施例中，制作感光组件拼板时，可以先进行模塑，将所述至少两个感光芯片1、所述电子元件2以及所述导电柱51封装在一起，然后再在所得到的封装体的表面上形成再布线层(例如第一再布线层4)。本实施例的感光组件10制作方法包括步骤：
步骤110：按预设的位置，将至少两个感光芯片1、电子元件2以 及导电柱51布置在载板8上。图7a示出了本申请一个实施例中将两个感光芯片1、电子元件2以及所述导电柱51布置在载板8上的一个示例。本实施例中，在载板8上布置的至少两个感光芯片1、电子元件2以及导电柱51对应于至少两个感光组件单元。并且在所述的相邻的两个感光组件单元的分界线位置设置有导电柱51。
步骤120：通过模塑工艺，将所述的至少两个感光芯片1、电子元件2以及所述导电柱51固定在一起，形成一个封装体。图7b示出了本申请一个实施例中将两个感光芯片1、电子元件2以及所述导电柱51布置在载板8上的一个示例。该封装体中具有模塑层3。
步骤130：对封装体的模塑层3进行研磨，使得导电柱51暴露，并使模塑层3减薄。图7c示出了本申请一个实施例中研磨后的封装体的一个示例。
步骤140：去除载板8。图7d示出了本申请一个实施例中去除载板8后的封装体的一个示例。图7d中载板8去除后还将封装体翻转使感光芯片1的感光区域13朝上放置。
步骤150：在所述封装体的上表面上形成第一再布线层4，使得所述电子元件2和所述导电柱51均通过所述第一再布线层4与所述感光芯片1的衬垫15电连接。其中，所述导电柱51与设置于所述第一再布线层4与所述模塑层3界面的植球接触。图7e示出了本申请一个实施例中的在封装体表面形成第一再布线层4的一个示例。第一再布线层4具有对应于所述感光区域13的通光孔形成区41，所述通光孔形成区41不进行布线。
步骤160：去除第一再布线层4的通光孔形成区41，以便暴露出感光区域13。图7f示出了本申请一个实施例中的去除通光孔形成区41后的感光组件拼板的一个示例。
步骤170：切割感光组件拼板，得到单体的感光组件10。图7g示出了本申请一个实施例中的单体的感光组件10的一个示例。其中，两个感光组件单元的分界线位置的导电柱51被切开，形成位于单体的感光组件10的侧面的导电区域5。在另一个实施例中，步骤160和步骤170的执行顺序可以互换。
进一步地，图8a～e示出了本申请又一实施例中的感光组件10制作流程。参考图8a～e，本实施例的感光组件10制作方法包括步骤1000-2000：
步骤1000，制作感光组件10，其中所述感光组件10的再布线层的部分再布线线路延伸至所述再布线层的边缘，并且在所述再布线层的侧面裸露，其中所述再布线层可以是所述第一再布线层4或所述第二再布线层6。
步骤2000，通过在所述模塑层3的侧面和所述再布线层的侧面镀金属层形成导电区域5，得到感光组件10成品。
在一个实施例中，步骤1000包括下列子步骤1001-1005：
步骤1001，在载板8上形成对应于感光芯片1的第一再布线层4。图8a示出了本申请一个实施例中在载板8上形成对应于感光芯片的第一再布线层4的一个示例。其中第一再布线层4具有对应于所述感光区域13的通光孔形成区41，所述通光孔形成区41不进行布线。其中，所述第一再布线层4的部分再布线线路延伸至所述第一再布线层4的边缘，并且在所述第一再布线层4的侧面裸露。
步骤1002，在所述第一再布线层4上设置感光芯片1和相应的电子元件2。图8b示出了本申请一个实施例中在所述第一再布线层4上设置感光芯片1和相应的电子元件2的一个示例。其中所述电子元件2通过所述第一再布线层4与所述感光芯片1的衬垫15电连接。
步骤1003，通过模塑工艺将所述第一再布线层4、所述感光芯片1以及所述电子元件2固定在一起。图8c示出了本申请一个实施例中通过模塑工艺将所述第一再布线层4、所述感光芯片1以及所述电子元件2固定在一起的一个示例。
步骤1004，去除载板8。图8d示出了本申请一个实施例中去除载板8的一个示例。
步骤1005，去除第一再布线层4的通光孔形成区41，以将所述感光芯片1的感光区域13暴露出来。
进一步地，执行所述步骤2000，即通过在所述模塑层3的侧面和 所述再布线层的侧面镀金属层形成导电区域5，得到感光组件10成品。图8e示出了本申请一个实施例中的感光组件10成品的一个示例。
进一步地，在另一个实施例中，步骤1000还可以包括子步骤1003a：在步骤1003所形成的模塑层3的上表面形成第二再布线层。所述第二再布线层的部分再布线线路延伸至所述第二再布线层的边缘，并且在所述第二再布线层的侧面裸露。
步骤2000中，所述再布线层可以是第一再布线层或者第二再布线层。其中，当所述第一再布线层的部分再布线线路在所述第一再布线层的侧面裸露时，所述再布线层为第一再布线层。当所述第二再布线层的部分再布线线路在所述第二再布线层的侧面裸露时，所述再布线层为第二再布线层。
步骤1000-2000中，先进行常规的fan-out工艺，但区别点在于需要将RDL层的电路在侧面进行裸露，从而便于在之后的镀导电层的时候能够使得导电层与RDL层电连接，同时本方案的优点在于能够任意设置导电区域的形状，从而满足不同的客户需求。在一个实施例中，可在步骤1003完成后，执行步骤2000之前去除载板。在另一个实施例中，也可在完成步骤2000之后去除载板。
进一步地，在另一实施例中，步骤1005(即去除所述第一再布线层4的通光孔形成区的步骤)也可在步骤2000之后执行。在又一实施例中，步骤1005还可以在步骤1001与步骤1002之间执行，此时第一再布线层不完全覆盖所述载板。载板上具有空白区域，该空白区域对应于所述感光芯片的感光区域且该空白区域不被第一再布线层覆盖。
以上描述仅为本申请的较佳实施方式以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (26)

  1. 一种感光组件，其特征在于，包括：
    感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域和非感光区域，所述感光芯片还具有设置于所述非感光区域的衬垫；
    电子元件，布置于所述感光芯片周围；
    模制部，通过模制工艺形成并将所述电子元件和所述感光芯片封装在一起，所述模制部具有与所述第一表面齐平的第三表面；以及
    第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且所述衬垫通过所述第一再布线层与所述电子元件电连接；
    其中，所述感光组件的侧面或底面具有导电区域且该导电区域与所述第一再布线层电连接。
  2. 根据权利要求1所述的感光组件，其特征在于，所述模制部为模塑层，所述模塑层覆盖所述第二表面，形成背对所述第三表面的第四表面；
    所述感光组件还包括：
    导电芯体，布置于所述感光芯片周围；以及
    第二再布线层，形成在所述第四表面上；
    其中，所述模塑层通过模塑工艺形成并将所述导电芯体、所述电子元件和所述感光芯片固定在一起，所述导电芯体将所述第一再布线层和所述第二再布线层电连接，所述衬垫通过所述第一再布线层电连接至所述导电芯体，所述导电芯体通过所述第二再布线层电连接至所述电子元件。
  3. 根据权利要求2所述的感光组件，其特征在于，所述模制部的侧面具有导电区域且该导电区域与所述第一再布线层电连接；以及所述导电区域还与所述第二再布线层电连接。
  4. 根据权利要求2-3中任意一项所述的感光组件，其特征在于，所述导电区域通过切割设置在两个相邻感光组件分界线上的导电柱形成。
  5. 根据权利要求2所述的感光组件，其特征在于，所述导电区域通过焊球阵列或者导电柱阵列形成于所述第二再布线层的下表面。
  6. 根据权利要求1所述的感光组件，其特征在于，所述第一再布线层的再布线线路延伸至所述第一再布线层的边缘并且在所述第一再布线层的侧面裸露；所述导电区域通过在所述模制部的侧面和所述第一再布线层的侧面镀金属层形成。
  7. 根据权利要求3所述的感光组件，其特征在于，所述第二再布线层的再布线线路延伸至所述第二再布线层的边缘并且在所述第二再布线层的侧面裸露；所述导电区域通过在所述模塑层的侧面和所述第二再布线层的侧面镀金属层形成。
  8. 一种感光组件，其特征在于，包括：
    感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域和非感光区域，所述感光芯片还具有设置于所述非感光区域的衬垫；
    电子元件，布置于所述感光芯片周围；
    模塑层，通过模塑工艺形成并将所述电子元件和所述感光芯片固定在一起，所述模塑层具有与所述第一表面齐平的第三表面，并且所述模塑层覆盖所述第二表面，形成背对所述第三表面的第四表面；
    第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且所述衬垫通过所述第一再布线层与所述电子元件电连接；以及
    导电芯体，所述导电芯体贯穿所述模塑层，并且所述导电芯体的一端通过所述第一再布线层与所述电子元件和所述衬垫电连接，另一 端在所述第四表面裸露以形成导电区域。
  9. 一种感光组件制作方法，包括：
    1)制作感光组件拼板，所述感光组件拼板由至少两个感光组件单元组成，所述感光组件单元包括：
    感光芯片，其具有第一表面和背对所述第一表面的第二表面，所述第一表面具有感光区域和非感光区域，所述感光芯片还具有设置于所述非感光区域的衬垫；
    电子元件，布置于所述感光芯片周围；
    模塑层，通过模塑工艺形成并将所述电子元件和所述感光芯片封装在一起，所述模塑层具有与所述第一表面齐平的第三表面；以及
    第一再布线层，形成在所述第一表面的非感光区域和所述第三表面上，并且所述衬垫通过所述第一再布线层与所述电子元件电连接；
    其中，相邻的两个所述感光组件单元的模塑层连接形成一体，并且在所述的相邻的两个感光组件单元的分界线位置设置有导电柱，该导电柱被包裹在形成一体的所述模塑层中；以及
    2)在所述分界线切割所述感光组件拼板，使得所述导电柱被切开，以使切割得到的所述感光组件的模塑层的侧面具有所述导电区域。
  10. 根据权利要求8所述的感光组件制作方法，其特征在于，所述步骤1)包括：
    11)在载板上形成对应于至少两个感光芯片的第一再布线层；
    12)在所述第一再布线层上设置至少两个感光芯片和相应的电子元件，以及位于相邻两个感光芯片之间的导电柱，其中所述电子元件和所述导电柱均通过所述第一再布线层与所述感光芯片的衬垫电连接；以及
    13)通过模塑工艺将所述第一再布线层、所述至少两个感光芯片、所述电子元件以及所述导电柱固定在一起，进而形成所述的感光组件 拼板。
  11. 根据权利要求10所述的感光组件制作方法，其特征在于，所述步骤11)中，所述第一再布线层具有对应于所述感光区域的通光孔形成区，所述通光孔形成区不进行布线；
    所述感光组件制作方法还包括步骤：
    3)从所述第一再布线层去除所述通光孔形成区。
  12. 根据权利要求11所述的感光组件制作方法，其特征在于，所述步骤3)在所述步骤2)之后执行；或者在所述步骤13)与所述步骤2)之间执行；或者在所述步骤11)与所述步骤12)之间执行。
  13. 根据权利要求10所述的感光组件制作方法，其特征在于，所述步骤12)中，所述导电柱与设置于所述第一再布线层与所述模塑层界面的植球接触。
  14. 根据权利要求10所述的感光组件制作方法，其特征在于，
    所述步骤12)还包括在所述第一再布线层上设置导电芯体；
    所述步骤13)还包括在所述导电芯体与所述第一再布线层、所述感光芯片以及所述电子元件模塑在一起；
    所述步骤1)还包括子步骤：
    14)在步骤13)所形成的模塑层的背离所述载板的表面形成第二再布线层，形成所述的感光组件拼板。
  15. 一种感光组件制作方法，包括：
    1)制作如权利要求2-3中任意一项所述的感光组件，其中所述感光组件的再布线层的部分再布线线路延伸至所述再布线层的边缘，并且在所述再布线层的侧面裸露，其中所述再布线层为所述第一再布线层或所述第二再布线层；以及
    2)通过在所述模塑层的侧面和所述再布线层的侧面镀金属层形成 所述导电区域。
  16. 根据权利要求15所述的感光组件制作方法，其特征在于，所述步骤1)包括下列子步骤：
    11)在载板上形成对应于感光芯片的第一再布线层；
    12)在所述第一再布线层上设置感光芯片和相应的电子元件，其中所述电子元件通过所述第一再布线层与所述感光芯片的衬垫电连接；以及
    13)通过模塑工艺将所述第一再布线层、所述感光芯片以及所述电子元件固定在一起。
  17. 根据权利要求16所述的感光组件制作方法，其特征在于，所述步骤11)中，所述载板上具有对应于所述感光芯片的所述感光区域的空白区域，该空白区域不被所述第一再布线层覆盖。
  18. 根据权利要求16所述的感光组件制作方法，其特征在于，所述步骤11)中，所述第一再布线层具有对应于所述感光芯片的所述感光区域的通光孔形成区，所述通光孔形成区不进行布线；
    所述感光组件制作方法还包括步骤：
    3)去除所述通光孔形成区。
  19. 根据权利要求16所述的感光组件制作方法，其特征在于，所述步骤11)中，所述第一再布线层的部分再布线线路延伸至所述第一再布线层的边缘，并且在所述第一再布线层的侧面裸露；
    所述步骤2)中，通过在所述模塑层的侧面和所述第一再布线层的侧面镀金属层形成所述导电区域。
  20. 根据权利要求16所述的感光组件制作方法，其特征在于，
    所述步骤12)还包括在所述第一再布线层上设置导电芯体；
    所述步骤13)还包括在所述导电芯体与所述第一再布线层、所述 感光芯片以及所述电子元件模塑在一起；
    所述步骤1)还包括子步骤：
    14)在步骤13)所形成的模塑层的背离所述载板的表面形成第二再布线层。
  21. 根据权利要求20所述的感光组件制作方法，其特征在于，
    所述步骤14)中，所述第二再布线层的部分再布线线路延伸至所述第二再布线层的边缘，并且在所述第二再布线层的侧面裸露；
    所述步骤2)中，通过在所述模塑层的侧面和所述第二再布线层的侧面镀金属层形成所述导电区域。
  22. 根据权利要求9所述的感光组件制作方法，其特征在于，所述步骤1)包括：通过模塑工艺，将按预设位置布置在载板上的至少两个所述感光芯片、所述电子元件以及所述导电柱封装在一起，然后再在模塑后形成的封装体表面布置再布线层，得到所述感光组件拼板。
  23. 根据权利要求9所述的感光组件制作方法，其特征在于，所述步骤1)包括：
    11)将至少两个感光芯片、电子元件以及所述导电柱布置在载板上；
    12)通过模塑工艺，将所述的至少两个感光芯片、电子元件以及所述导电柱固定在一起，形成一个封装体；
    13)在所述封装体上设置第一再布线层，使得所述电子元件和所述导电柱均通过所述第一再布线层与所述感光芯片的衬垫电连接，以得到所述感光组件拼板。
  24. 根据权利要求23所述的感光组件制作方法，其特征在于，所述步骤13)中，所述导电柱与设置于所述第一再布线层与所述模塑层界面的植球接触。
  25. 根据权利要求23所述的感光组件制作方法，其特征在于，所述步骤13)中，所述第一再布线层具有对应于所述感光区域的通光孔形成区，所述通光孔形成区不进行布线；
    所述感光组件制作方法还包括步骤：
    3)去除所述通光孔形成区。
  26. 根据权利要求25所述的感光组件制作方法，其特征在于，
    所述步骤3)在所述步骤13)和所述步骤2)之间执行，或者在所述步骤2)之后执行。
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