WO2020019862A1 - 产线激光划线设备及其使用方法 - Google Patents

产线激光划线设备及其使用方法 Download PDF

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Publication number
WO2020019862A1
WO2020019862A1 PCT/CN2019/088904 CN2019088904W WO2020019862A1 WO 2020019862 A1 WO2020019862 A1 WO 2020019862A1 CN 2019088904 W CN2019088904 W CN 2019088904W WO 2020019862 A1 WO2020019862 A1 WO 2020019862A1
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Prior art keywords
cavity
laser
component
production line
gate
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PCT/CN2019/088904
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English (en)
French (fr)
Inventor
颜步一
姚冀众
王兰杰
胡汤珑
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杭州纤纳光电科技有限公司
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Publication of WO2020019862A1 publication Critical patent/WO2020019862A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Definitions

  • the invention belongs to the technical field of solar cell production equipment, and relates to a production line laser scribing equipment and a method for using the same.
  • perovskite absorption layer in perovskite solar cells is very sensitive to the humidity in the external environment, most of the preparation of perovskite solar cells is currently done in glove boxes.
  • the final completion of the preparation of the battery module requires the use of laser scribing to divide the battery into tiny sub-battery cells.
  • the laser scribing of the perovskite solar cell substrate is performed in the air, so that the perovskite absorption layer is inevitably exposed to the outside air, and the water vapor in the air makes the perovskite absorb The characteristics of the layer are deteriorated, which significantly reduces the photoelectric conversion efficiency of the perovskite solar cell. Therefore, how to solve this problem is the focus of attention.
  • the technical problem to be solved by the present invention is to provide a production line laser scribing device and a method for using the same, which solves the problem of low performance of conventional perovskite solar cells in contact with air during the laser scribing process, and significantly improves the performance.
  • the photoelectric conversion efficiency of the perovskite solar cell is described.
  • the present invention is achieved in this way, and provides a production line laser scribing device, which includes a laser processing device with a laser head, and further includes a cavity.
  • the laser head is disposed on the top of the cavity, and the cavity is disposed on the production line.
  • a gate is opened and closed. When the gate is closed, the cavity becomes a closed space; a stage is set in the cavity, and components to be processed by the laser are placed. On the stage, a visible glass window is provided on the top surface of the cavity.
  • the cavity Before the component is processed by the laser, the cavity is filled with an inert gas or evacuated in advance; in the laser, The side of the head is provided with a CCD image recognition device, and a component conveying device is provided in the cavity.
  • the component to be laser processed enters the cavity from the opened gate through the component conveying device, and is conveyed to the stage for laser. It is processed and then transported out of the cavity through the opened gate.
  • an XY-axis table is provided at the bottom of the stage, and a Z-axis platform for lifting is provided at the bottom of the XY-axis table, the laser processing equipment, CCD image recognition device, and component transport The device, the XY axis table and the Z axis platform are controlled by a lower computer, respectively.
  • the XY-axis table includes an X-axis platform and a Y-axis platform, the Y-axis platform is disposed on the X-axis platform, the Y-axis platform and the X-axis platform are perpendicular to each other, and the stage is disposed on the Y On the axis platform, the X-axis platform is arranged corresponding to the left and right production lines, and drives the Y-axis platform to move left and right, and the Y-axis platform drives the stage to move back and forth.
  • the gates are respectively arranged on the left and right sides of the cavity to adapt to the left and right production lines.
  • the components to be laser processed are placed on the component conveying plate and entered into the cavity from the opened left gate through the component conveying device, and It is transported to the stage for laser processing, and then transported out of the cavity through the opened right gate.
  • a plasma etching and dust removing device is further provided in the cavity.
  • the plasma etching and dust removing device includes a negative electrode and a positive electrode, the negative electrode is disposed on the top of the cavity, and the positive electrode is correspondingly disposed in the cavity.
  • a plasma power source and a switch are provided between the negative electrode and the positive electrode at the bottom.
  • the component conveying device includes a stepper motor, a sprocket and a chain, and a component conveying plate.
  • the stepper motor drives the sprocket to rotate, the sprocket drives the chain, and the chain drives the component conveying plate to move, waiting for laser
  • the processed components are placed on a component conveying plate for transportation.
  • the cavity is also provided with a vent hole for exhaust and intake.
  • vent holes are provided at the bottom of the cavity, one of which is an air intake hole for intake air and the other is an exhaust hole for exhaust gas.
  • the material of the visible glass window is any one of ordinary glass, quartz glass, and zinc sulfide glass.
  • the present invention is implemented in this way, and also provides a method for using a production line laser scribing device as described above, including the following steps:
  • the component to be processed by the laser is entered into the cavity from the gate opened by the production line on one side through the component conveying device, and the side gate is closed, and the component is transferred to the stage;
  • the second step is to find the fiducial mark on the component through the CCD image recognition device, adjust the position between the component and the laser head, turn on the laser processing equipment to perform laser scribing processing on the component; before the component is processed by laser,
  • the cavity is filled with an inert gas or evacuated in advance;
  • the gate on the other side of the cavity is opened, and the component conveying device transfers the laser-processed component to the production line on the other side, and the gate on the side is closed.
  • the production line laser scribing device of the present invention and the use method thereof propose a laser scribing for a perovskite solar cell in a protected atmosphere (including both an inert gas atmosphere and a vacuum environment).
  • Equipment and method which reduces the chance of contact with air during the continuous production of perovskite solar cells, avoids the diffusion of organic particles in the air during the laser scribing process, and solves the problem
  • the laser-etched material reattaches to the surface of the window glass, causing the window glass to become dirty, which affects the problem of laser focusing.
  • FIG. 1 is a schematic plan view of a preferred embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a cavity and a production line in FIG. 1.
  • the invention designs a device and method for laser scribing of perovskite solar cells in an inert gas or in a vacuum state, and the perovskite solar cells based on the device and method will not affect its photoelectric performance due to contact with air.
  • a preferred embodiment of a laser scribing device for a production line of the present invention includes a laser processing device with a laser head 1 and a cavity 3.
  • the laser head 1 is disposed on the top of the cavity 3.
  • the cavity 3 is disposed in a production line.
  • a gate 4 capable of automatically opening and closing is provided at the joint between the cavity 3 and the production line. When the gate 4 is closed, the cavity 3 becomes a closed space.
  • the gate 4 of this embodiment adopts a lifting method to realize opening and closing. Of course, the gate 4 can also adopt two-side movement to realize opening and closing.
  • a stage 5 is set in the cavity 3, and the component A to be laser processed is placed on the stage 5 through a positioning jig.
  • the module A may be a substrate of a perovskite solar cell, or may be another semiconductor substrate requiring laser processing.
  • a visible glass window 8 is provided on the top surface of the cavity 3. After the laser light emitted from the laser head 1 passes through the visible glass window 8, the component A placed on the stage 5 is subjected to laser processing. Before the component A is processed by laser, the cavity 3 is filled with an inert gas or evacuated in advance.
  • a CCD image recognition device 9 is provided on the side of the laser head 1.
  • a component conveying device 7 is set in the cavity 3, and the component A to be laser-processed is placed on the component conveying plate, and the component conveying device 7 enters the cavity 3 from the opened gate 4 and is conveyed to the stage. 5 is laser processed, and then conveyed out of the cavity 3 through the opened gate 4.
  • the component conveying device 7 includes a stepping motor 71, a sprocket 72 and a chain 73, and a component conveying plate (not shown in the figure).
  • the stepper motor 71 drives a sprocket 72 to rotate, and the sprocket 72 drives a chain 73 which drives a component conveying plate to move, and the component A to be laser processed is placed on the component conveying plate for conveyance.
  • An XY-axis table 6 is provided on the bottom of the stage 5.
  • a Z-axis platform 12 for lifting is also provided at the bottom of the XY-axis table 6.
  • the Z-axis platform 12 is used to control the lifting of the XY-axis table 6, which is convenient for adjusting the height between the stage 5 and the laser head 1. Focus the laser beam of the laser head 1 on the processing part of the component A, or adjust the height between the stage 5 and the production line to facilitate the transmission of the component A.
  • the laser processing equipment, the CCD image recognition device 9, the component conveying device 7, the XY-axis table 6, and the Z-axis platform 12 are controlled by a lower computer 10, respectively.
  • the XY-axis table 6 includes an X-axis platform and a Y-axis platform.
  • the Y-axis platform is disposed on the X-axis platform.
  • the Y-axis platform and the X-axis platform are perpendicular to each other.
  • the stage 5 is disposed on the Y-axis. on the platform. The relative position between the stage 5 and the laser head 1 can be adjusted by operating the Y-axis stage and the X-axis stage.
  • the CCD image recognition device 9 is used to image the component A and automatically recognize the fiducial mark set on the component A, and automatically control the movement of the Y-axis platform and the X-axis platform according to the reference mark by the lower computer 10, so that the stage The processing position of component A on 5 is aligned with the laser head 1, and then the laser processing equipment is automatically started to perform laser scribing processing on component A.
  • the gates 4 are respectively disposed on the left and right sides of the cavity 3 to accommodate the left and right production lines B, and the component A to be laser-processed is placed on the component conveying plate to pass the component.
  • the conveying device 7 enters the cavity 3 from the opened left gate 4 and is conveyed to the stage 5 for laser processing, and then is conveyed out of the cavity 3 through the opened right gate 4.
  • the X-axis platform is arranged corresponding to the left and right production lines B, and drives the Y-axis platform to move left and right.
  • the Y-axis platform drives the stage 5 to move forward and backward.
  • the height of the component A to be laser-processed on the stage 5 corresponds to the height of the left and right production lines B.
  • the component A to be laser-processed in the positioning jig of the component conveying plate passes through the left-side production line B
  • the object track C is automatically transferred to the stage 5. After the laser head 1 has laser-processed the component A, the component conveying plate and the laser-processed component A are automatically transferred from the stage 5.
  • the ground is transferred to the load track C on the right production line B.
  • a plasma etching and dust removing device 2 is also provided in the cavity 3.
  • the plasma etching and dust removing device 2 includes a negative electrode 21 and a positive electrode 22.
  • the negative electrode 21 is disposed on the top of the cavity 3, and the positive electrode 22 is correspondingly disposed on the bottom of the cavity 3.
  • a plasma power source 23 and a switch 24 are provided between the negative electrode 21 and the positive electrode 22.
  • the negative electrode 21 is a steel plate, and is arranged in two pieces on the left and right sides of the visible glass window 8 respectively.
  • the plasma etching and dust removing device 2 is generated by a plasma power source 23 under a certain pressure to generate a disordered plasma, and then reacts or collides with organic pollutants and micro-particle pollutants on the visible glass window 8 to form a volatile substance.
  • the gas flow in the body 3 and the vacuum pump remove these volatile substances. In this way, organic matter or metal particles stuck to the visible glass window 8 during the laser scribing process can be removed.
  • the cavity 3 is also provided with a vent hole 11 for exhaust and intake.
  • two vent holes 11 are provided at the bottom of the cavity 3, one of which is used for air intake, and the other is used for exhaust.
  • the vent hole 11 is convenient for filling the cavity 3 with an inert gas or sucking the inside of the cavity 3 into a vacuum state.
  • the inert gas in the cavity 3 is one of nitrogen, argon, and helium.
  • Laser processing is performed in the cavity 3 filled with inert gas to ensure that the component A is always in an inert gas atmosphere during transmission and laser scribing to prevent contact with air.
  • the laser processing is also performed in a vacuum state to prevent the component A from coming into contact with the air, and to avoid the adverse effects of components such as water vapor and oxygen in the air on the component A.
  • the material of the visible glass window 8 is any one of ordinary glass, quartz glass, and zinc sulfide glass. Use ordinary glass for green lasers, quartz glass for ultraviolet lasers, and zinc sulfide glass for infrared lasers. Either type of laser can be used for laser scribing of the component A through the visible glass window 8.
  • the invention also discloses a method for using the laser scribing equipment of the production line as described above, including the following steps:
  • the component A to be laser-processed is placed in a positioning jig on the component conveying plate, and is transferred from the loading track C of the production line B on one side to the front of the cavity 3, and the cavity 3 corresponds to a gate on one side 4 is opened, the component A enters the cavity 3 from the opened gate 4 through the component conveying device 7, and the side gate 4 is closed, and the component A is transferred to the stage 5.
  • the CCD image recognition device 9 is used to find the reference mark on the component A, and the position between the component A and the laser head 1 is adjusted by the XY axis table 6, and the laser processing equipment is turned on to perform laser scribing on the component A. Line processing.
  • the cavity 3 is filled with an inert gas or evacuated in advance.
  • the shutter 4 on the other side of the cavity 3 is opened, and the component conveying device 7 transfers the laser-processed component A to the load track of the production line B on the other side On C, the gate 4 on that side is closed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种产线激光划线设备，包括有激光头(1)的激光加工设备和腔体(3)，激光头设置在腔体的顶部，腔体设置在产线中，腔体与产线的联接处设置了开闭的闸门(4)；在腔体内设置了载物台(5)，待激光加工的组件(A)放置在载物台上。在腔体的顶面设置可视玻璃窗(8)，在组件被激光加工前，在激光头的侧部设置了CCD图像识别装置(9)。在腔体内设置了组件输送装置(7)，组件通过组件输送装置从开启的闸门进入到腔体内，并被输送到载物台上进行激光加工，然后再从腔体内被输送出来。该激光划线设备解决了常规钙钛矿太阳能电池在激光划线过程中与空气接触导致其性能低下的问题，提高了钙钛矿太阳能电池的光电转换效率。还涉及一种产线激光划线设备的使用方法。

Description

产线激光划线设备及其使用方法 技术领域
本发明属于太阳能电池生产设备技术领域，涉及一种产线激光划线设备及其使用方法。
 背景技术
因为钙钛矿太阳能电池中的钙钛矿吸收层对外界环境中的湿度非常敏感，所以目前绝大多数钙钛矿太阳能电池的制备都是在手套箱中完成的。但是，在规模化钙钛矿太阳能电池的制造过程中，除了大面积成膜的各道工序外，最终完成电池组件的制备需要使用激光划线将电池分割成微小的子电池单元。一般情况下，钙钛矿太阳能电池基片的激光划线是在空气中进行的，这样钙钛矿吸收层就不可避免地被暴露在外界空气中，空气中的水气等使得钙钛矿吸收层的特性变劣，显著地降低了钙钛矿太阳能电池的光电转换效率。因此，如何解决这一问题是目前大家关注的热点。
 技术问题
本发明所要解决的技术问题在于，提供一种产线激光划线设备及其使用方法，解决了常规钙钛矿太阳能电池在激光划线过程中与空气接触导致其性能低下的问题，显著地提高了钙钛矿太阳能电池的光电转换效率。
 技术解决方案
本发明是这样实现的，提供一种产线激光划线设备，包括有激光头的激光加工设备，还包括腔体，所述激光头设置在腔体的顶部，所述腔体设置在产线中，所述腔体与产线的联接处设置了开闭的闸门，所述闸门闭合时，所述腔体成为密闭空间；在所述腔体内设置了载物台，待激光加工的组件放置在载物台上，在所述腔体的顶面设置可视玻璃窗，在所述组件被激光加工前，所述腔体内事先被充满惰性气体或事先被抽成真空状态；在所述激光头的侧部设置了CCD图像识别装置，在所述腔体内设置了组件输送装置，待激光加工的组件通过组件输送装置从开启的闸门进入到腔体内，并被输送到载物台上进行激光加工，然后再通过开启的闸门从腔体内被输送出来。
进一步地，在所述载物台的底部设置了XY轴工作台，在所述XY轴工作台的底部还设置了升降用的Z轴平台，所述激光加工设备、CCD图像识别装置、组件输送装置、XY轴工作台、Z轴平台分别通过下位机控制。
进一步地，所述XY轴工作台包括X轴平台和Y轴平台，所述Y轴平台设置在X轴平台上，所述Y轴平台与X轴平台相互垂直，所述载物台设置在Y轴平台上，所述X轴平台与左右产线对应设置，且带动Y轴平台左右移动，所述Y轴平台带动载物台前后移动。
进一步地，所述闸门分别设置在腔体的左右两侧以适应左右设置的产线，待激光加工的组件放置在组件输送板上通过组件输送装置从开启的左侧闸门进入到腔体内，并被输送到载物台上进行激光加工，然后再通过开启的右侧闸门从腔体内被输送出来。
进一步地，在所述腔体内还设置了等离子蚀刻除尘装置，所述等离子蚀刻除尘装置包括负极电极和正极电极，所述负极电极设置在腔体的顶部，所述正极电极对应地设置在腔体的底部，在所述负极电极和正极电极之间设置了等离子电源及开关。
进一步地，所述组件输送装置包括步进电机、链轮和链条、组件输送板，所述步进电机驱动链轮转动，所述链轮带动链条，所述链条带动组件输送板移动，待激光加工的组件放置在组件输送板进行输送。
进一步地，在所述腔体上还设置了用于排气和进气的通气孔。
进一步地，所述腔体的底部设置了两个通气孔，其中一个用于进气的进气孔，另一个用于排气的排气孔。
进一步地，可视玻璃窗的材料为普通玻璃、石英玻璃、硫化锌玻璃中的任意一种。
本发明是这样实现的，还提供一种如前所述的产线激光划线设备的使用方法，包括如下步骤：
第一步，将待激光加工的组件通过组件输送装置从一侧产线开启的闸门进入到腔体内，关闭该侧闸门，组件被传送到载物台上；
第二步，通过CCD图像识别装置寻找组件上的基准标记，调整组件与激光头之间的位置，开启所述激光加工设备对组件进行激光划线加工；在所述组件被激光加工前，所述腔体内事先被充满惰性气体或事先被抽成真空状态；
第三步，激光划线加工结束后，所述腔体另一侧的闸门打开，所述组件输送装置将已激光加工完的组件传送至另一侧产线上，该侧的闸门关闭。
 有益效果
与现有技术相比，本发明的产线激光划线设备及其使用方法，提出一种针对钙钛矿太阳能电池在受保护氛围（既包括惰性气体氛围也包括真空环境）中进行激光划线的设备和方法，该设备和方法减少了钙钛矿太阳能电池在规模化连续生产的过程中与空气接触的机会，避免了激光划线过程中出现的有机物颗粒扩散在空气中，也解决了在受保护腔体中进行激光划线时，被激光刻蚀的材料重新附着在视窗玻璃表面造成视窗玻璃变脏，影响激光对焦的问题。
 附图说明
图1为本发明一较佳实施例的平面示意图；
图2为图1中腔体及产线的示意图。
 本发明的最佳实施方式
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
现在大家都致力于解决激光划线过程中的技术问题，但没有涉及到激光划线过程中器件与空气接触的情况。本发明设计了一种针对钙钛矿太阳能电池在惰性气体中或真空状态下激光划线的设备和方法，基于此设备和方法的钙钛矿太阳能电池不会因接触空气而影响其光电性能。
请参照图1所示，本发明产线激光划线设备的较佳实施例，包括有激光头1的激光加工设备和腔体3。所述激光头1设置在腔体3的顶部。所述腔体3设置在产线中。所述腔体3与产线的联接处设置了能够自动开闭的闸门4。所述闸门4闭合时，所述腔体3成为密闭空间。本实施例的闸门4采用升降方式来实现开启和闭合，当然闸门4也可以采取两边移动的方式来实现开启和闭合。
在所述腔体3内设置了载物台5，待激光加工的组件A通过定位夹具放置在载物台5上。组件A可以是钙钛矿太阳能电池的基片，也可以是其他需要激光加工的半导体基片。在所述腔体3的顶面设置可视玻璃窗8。所述激光头1发射的激光穿过可视玻璃窗8后对放置在载物台5上的组件A进行激光加工。在所述组件A被激光加工前，所述腔体3内事先被充满惰性气体或事先被抽成真空状态。在所述激光头1侧部设置了CCD图像识别装置9。
在所述腔体3内设置了组件输送装置7，待激光加工的组件A放置在组件输送板上通过组件输送装置7从开启的闸门4进入到腔体3内，并被输送到载物台5上进行激光加工，然后再通过开启的闸门4从腔体3内被输送出来。
所述组件输送装置7包括步进电机71、链轮72和链条73、组件输送板（图中未示出）。所述步进电机71驱动链轮72转动，所述链轮72带动链条73，所述链条73带动组件输送板移动，待激光加工的组件A放置在组件输送板进行输送。
在所述载物台5的底部设置了XY轴工作台6。在所述XY轴工作台6的底部还设置了升降用的Z轴平台12，Z轴平台12用于控制XY轴工作台6的升降，便于调节载物台5与激光头1之间的高度使得激光头1的激光束在组件A的加工部位聚焦，或者调节载物台5与产线之间的高度便于传输组件A。所述激光加工设备、CCD图像识别装置9、组件输送装置7、XY轴工作台6、Z轴平台12分别通过下位机10控制。
所述XY轴工作台6包括X轴平台和Y轴平台，所述Y轴平台设置在X轴平台上，所述Y轴平台与X轴平台相互垂直，所述载物台5设置在Y轴平台上。操作Y轴平台与X轴平台可以调整载物台5与激光头1之间的相对位置。
所述CCD图像识别装置9用于对组件A进行成像并自动识别设置在组件A上的基准标记，并通过下位机10根据该基准标记自动控制Y轴平台和X轴平台移动，使得载物台5上的组件A的加工位置与激光头1对正，再自动启动激光加工设备对组件A进行激光划线加工。
请参照图2所示，在本实施例中，所述闸门4分别设置在腔体3的左右两侧以适应左右设置的产线B，待激光加工的组件A放置在组件输送板上通过组件输送装置7从开启的左侧闸门4进入到腔体3内，并被输送到载物台5上进行激光加工，然后再通过开启的右侧闸门4从腔体3内被输送出来。
所述X轴平台与左右产线B对应设置，且带动Y轴平台左右移动。所述Y轴平台带动载物台5前后移动。所述载物台5上的待激光加工的组件A的高度正好对应于左右产线B的高度，在所述组件输送板的定位夹具中的待激光加工的组件A通过左侧产线B上的载物轨道C自动传输到载物台5上，所述激光头1对组件A进行激光加工完后，所述组件输送板及已激光加工后的组件A再从所述载物台5自动地传输到右侧产线B上的载物轨道C上。
在所述腔体3内还设置了等离子蚀刻除尘装置2。所述等离子蚀刻除尘装置2包括负极电极21和正极电极22，所述负极电极21设置在腔体3的顶部，所述正极电极22对应地设置在腔体3的底部。在所述负极电极21和正极电极22之间设置了等离子电源23及开关24。所述负极电极21为钢板，分两块分别设置在可视玻璃窗8的左右两侧。等离子蚀刻除尘装置2通过等离子电源23在一定压力情况下起辉产生无序等离子体，然后与可视玻璃窗8上的有机污染物及微颗粒污染物反应或碰撞形成挥发性物质，最后被腔体3内的气体流及真空泵将这些挥发性物质清除出去。这样，可以将在激光划线过程中粘浮在可视玻璃窗8上的有机物或金属颗粒清除干净。
在所述腔体3上还设置了用于排气和进气的通气孔11。在本实施例中，所述腔体3的底部设置了两个通气孔11，其中一个用于进气的进气孔，另一个用于排气的排气孔。所述通气孔11便于给腔体3内充满惰性气体，或者将腔体3内部抽吸成真空状态。所述腔体3内的惰性气体为氮气、氩气、氦气等中的一种。激光加工在充满惰性气体的腔体3内进行，保证组件A在传输与激光划线的过程中始终处于惰性气体的氛围中，杜绝与空气进行接触。激光加工在真空状态下进行也是为了防止组件A与空气进行接触，免受空气中的水气和氧气等物质对组件A产生的不良影响。
可视玻璃窗8的材料为普通玻璃、石英玻璃、硫化锌玻璃中的任意一种。对于绿色激光使用普通玻璃，对于紫外激光采用石英玻璃，对于红外激光采用硫化锌玻璃。无论哪种激光都可以透过可视玻璃窗8对组件A进行激光划线加工。
本发明还公开了一种如前所述的产线激光划线设备的使用方法，包括如下步骤：
第一步，将待激光加工的组件A放置在组件输送板上的定位夹具中，从一侧产线B的载物轨道C传送至腔体3前，所述腔体3对应一侧的闸门4打开，组件A通过组件输送装置7从开启的闸门4进入到腔体3内，关闭该侧闸门4，组件A被传送到载物台5上。
第二步，通过CCD图像识别装置9寻找组件A上的基准标记，并通过XY轴工作台6来调整组件A与激光头1之间的位置，开启所述激光加工设备对组件A进行激光划线加工。所述组件A被激光加工前，所述腔体3内事先被充满惰性气体或事先被抽成真空状态。
第三步，激光划线加工结束后，所述腔体3另一侧的闸门4打开，所述组件输送装置7将已激光加工完的组件A传送至另一侧产线B的载物轨道C上，该侧的闸门4关闭。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。
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Claims (10)

  1. 一种产线激光划线设备，包括有激光头的激光加工设备，其特征在于，还包括腔体，所述激光头设置在腔体的顶部，所述腔体设置在产线中，所述腔体与产线的联接处设置了开闭的闸门，所述闸门闭合时，所述腔体成为密闭空间；在所述腔体内设置了载物台，待激光加工的组件放置在载物台上，在所述腔体的顶面设置可视玻璃窗，在所述组件被激光加工前，所述腔体内事先被充满惰性气体或事先被抽成真空状态；在所述激光头的侧部设置了CCD图像识别装置，在所述腔体内设置了组件输送装置，待激光加工的组件通过组件输送装置从开启的闸门进入到腔体内，并被输送到载物台上进行激光加工，然后再通过开启的闸门从腔体内被输送出来。
  2. 如权利要求1所述的产线激光划线设备，其特征在于，在所述载物台的底部设置了XY轴工作台，在所述XY轴工作台的底部还设置了升降用的Z轴平台，所述激光加工设备、CCD图像识别装置、组件输送装置、XY轴工作台、Z轴平台分别通过下位机控制。
  3. 如权利要求2所述的产线激光划线设备，其特征在于，所述XY轴工作台包括X轴平台和Y轴平台，所述Y轴平台设置在X轴平台上，所述Y轴平台与X轴平台相互垂直，所述载物台设置在Y轴平台上，所述X轴平台与左右产线对应设置，且带动Y轴平台左右移动，所述Y轴平台带动载物台前后移动。
  4. 如权利要求1所述的产线激光划线设备，其特征在于，所述闸门分别设置在腔体的左右两侧以适应左右设置的产线，待激光加工的组件放置在组件输送板上通过组件输送装置从开启的左侧闸门进入到腔体内，并被输送到载物台上进行激光加工，然后再通过开启的右侧闸门从腔体内被输送出来。
  5. 如权利要求1所述的产线激光划线设备，其特征在于，在所述腔体内还设置了等离子蚀刻除尘装置，所述等离子蚀刻除尘装置包括负极电极和正极电极，所述负极电极设置在腔体的顶部，所述正极电极对应地设置在腔体的底部，在所述负极电极和正极电极之间设置了等离子电源及开关。
  6. 如权利要求1所述的产线激光划线设备，其特征在于，所述组件输送装置包括步进电机、链轮和链条、组件输送板，所述步进电机驱动链轮转动，所述链轮带动链条，所述链条带动组件输送板移动，待激光加工的组件放置在组件输送板进行输送。
  7. 如权利要求1所述的产线激光划线设备，其特征在于，在所述腔体上还设置了用于排气和进气的通气孔。
  8. 如权利要求7所述的产线激光划线设备，其特征在于，所述腔体的底部设置了两个通气孔，其中一个用于进气的进气孔，另一个用于排气的排气孔。
  9. 如权利要求1所述的产线激光划线设备，其特征在于，可视玻璃窗的材料为普通玻璃、石英玻璃、硫化锌玻璃中的任意一种。
  10. 一种如权利要求1至9中任意一项所述的产线激光划线设备的使用方法，其特征在于，包括如下步骤：
    第一步，将待激光加工的组件通过组件输送装置从一侧产线开启的闸门进入到腔体内，关闭该侧闸门，组件被传送到载物台上；
    第二步，通过CCD图像识别装置寻找组件上的基准标记，调整组件与激光头之间的位置，开启所述激光加工设备对组件进行激光划线加工；在所述组件被激光加工前，所述腔体内事先被充满惰性气体或事先被抽成真空状态；
    第三步，激光划线加工结束后，所述腔体另一侧的闸门打开，所述组件输送装置将已激光加工完的组件传送至另一侧产线上，该侧的闸门关闭。
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