Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C33/00—Moulds or cores; Details thereof or accessories therefor
  • B29C33/70—Maintenance
  • B29C33/72—Cleaning
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
  • C08K5/098—Metal salts of carboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/20—Carboxylic acid amides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
  • C08L91/06—Waxes
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
  • C11D1/02—Anionic compounds
  • C11D1/04—Carboxylic acids or salts thereof
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
  • C11D1/38—Cationic compounds
  • C11D1/52—Carboxylic amides, alkylolamides or imides or their condensation products with alkylene oxides
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/16—Organic compounds
  • C11D3/18—Hydrocarbons
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
  • C11D3/16—Organic compounds
  • C11D3/37—Polymers
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/22—Organic compounds
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/22—Organic compounds
  • C11D7/24—Hydrocarbons
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/22—Organic compounds
  • C11D7/26—Organic compounds containing oxygen
• • C—CHEMISTRY; METALLURGY
  • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
  • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
  • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
  • C11D7/22—Organic compounds
  • C11D7/32—Organic compounds containing nitrogen

Definitions

• the present invention relates to a cleaning resin composition used for cleaning the inside of a resin material extruder or molding machine.
• Patent Documents 1 and 2 a cleaning resin composition containing an inorganic filler having a physical scraping effect as a cleaning component has been developed.
• a resin composition for cleaning containing an inorganic filler such as glass fiber or zeolite has been proposed (Patent Documents 1 and 2).
• a resin composition for cleaning in which the types of resin and additives are adjusted has been developed.
• a detergent for molding machines containing two types of thermoplastic resins having different melt flow rates (MFR) and an inorganic foaming agent has been proposed (Patent Document 3).
• a resin composition for cleaning containing a thermoplastic resin, a salt of a boric acid ester of a higher fatty acid monoglyceride, and a fatty acid amide has been proposed (Patent Document 4).
• JP 2008-201975 A JP-A-7-278359 JP 2005-231108 A JP-A-9-216976
• Patent Documents 1 and 2 Since the resin compositions proposed in Patent Documents 1 and 2 contain an inorganic filler having a scraping effect, the detergency was good to some extent. However, there has been a problem that components inside the apparatus are easily worn, and the inorganic filler tends to remain as impurities. Further, the cleaning agents and resin compositions proposed in Patent Documents 3 and 4 require a large amount of post-material resin to replace and remove the cleaning agent used for cleaning, and the cleaning property is still improved. There was room for
• the present invention has been made in view of such problems of the related art, and the subject thereof is that it has excellent cleaning properties, is easily replaced with a post-material resin, and An object of the present invention is to provide a cleaning resin composition that is easy to handle.
• thermoplastic resin having a melt flow rate of 1.0 g / 10 minutes or less and an additive containing at least two of a metal soap, a fatty acid amide, and a mineral oil. It has been found that the above-mentioned problems can be solved by compounding with an agent, and the present invention has been completed.
• a cleaning resin composition used for cleaning the inside of an extruder or a molding machine for a resin material comprising a base resin and an additive, wherein the additive is a metal soap; At least one of a fatty acid amide and a mineral oil (however, when the fatty acid amide is contained, the content of the fatty acid amide is 1.0% by mass or more based on the total mass of the cleaning resin composition.
• the base resin is a thermoplastic resin having a melt flow rate of 1.0 g / 10 minutes or less (provided that the content of the inorganic filler is 3 parts by mass or more based on 100 parts by mass of the thermoplastic resin)
• A) Resin composition for cleaning is provided.
• the cleaning resin composition of the present invention it is possible to provide a cleaning resin composition which is excellent in detergency, is easily replaced by a post-material resin, and is easy to handle.
• the cleaning resin composition of the present invention it is possible to reduce the cleaning time when cleaning the extruder and the molding machine, and also to reduce the amount of waste resin because the amount of the post-material resin can be reduced. Can be.
• the cleaning resin composition of the present invention has a sufficient cleaning effect even when the composition does not substantially contain an inorganic filler. For this reason, even if the cleaning resin composition of the present invention having a composition substantially free of an inorganic filler is used, parts inside the extruder and the molding machine are not worn out, and the inorganic filler as an impurity is used in the apparatus. Does not remain inside.
• the cleaning resin composition of the present invention is a resin composition used for cleaning the inside of an extruder or a molding machine for a resin material, and is selected from the group consisting of a base resin, metal soap, fatty acid amide, and mineral oil. And at least two additives.
• the base resin is a thermoplastic resin having a melt flow rate of 1.0 g / 10 minutes or less.
• the base resin is a thermoplastic resin having a melt flow rate of 1.0 g / 10 minutes or less.
• a thermoplastic resin having a melt flow rate of 1.0 g / 10 minutes or less as a base resin, a certain degree of viscosity is maintained even when the resin is heated and melted, and the internal viscosity of an apparatus such as an extruder or a molding machine is maintained. Excellent detergency is exhibited.
• the “melt flow rate (MFR)” of the resin in the present specification is a physical property value measured in accordance with a test method specified in ISO 1133 (230 ° C., 21.2 N).
• the melt flow rate of the thermoplastic resin used as the base resin is 1.0 g / 10 min or less, preferably 0.6 g / 10 min or less, more preferably 0.45 g / 10 min or less, particularly preferably 0.18 g. / 10 minutes or less.
• the lower limit of the melt flow rate of the thermoplastic resin is not particularly limited, but may be substantially 0.01 g / 10 min or more.
• thermoplastic resin a thermoplastic resin generally used in various molding methods such as an injection molding method and an extrusion molding method can be used.
• thermoplastic resin include a polyethylene resin, a polypropylene resin, a polystyrene resin, an acrylic resin, a polyolefin resin, an acrylonitrile-butadiene-styrene copolymer (ABS resin), a polyamide resin, and a polycarbonate resin. . These resins can be used alone or in combination of two or more.
• Examples of the polyethylene resin include an ethylene homopolymer, an ethylene-propylene copolymer, and an ethylene-vinyl acetate copolymer.
• Examples of the polypropylene resin include a propylene homopolymer and a propylene-butene copolymer.
• Examples of the polystyrene resin include a styrene homopolymer, an acrylonitrile-styrene copolymer, and a styrene-butadiene copolymer.
• Examples of the acrylic resin include an acrylate homopolymer, a methyl methacrylate homopolymer, and an ethylene-ethyl acrylate copolymer.
• Examples of the polyolefin resin include an ⁇ -olefin homopolymer and an ethylene- ⁇ -olefin copolymer.
• the additives include at least two selected from the group consisting of metal soaps, fatty acid amides, and mineral oil.
• a cleaning resin composition which is excellent in detergency and can be easily replaced by a post-material resin, even without substantially containing an inorganic filler. be able to.
• it shows sufficient cleaning properties even without containing an inorganic filler it does not wear parts inside the device, and there is no inorganic filler remaining inside the device. It can be a resin composition.
• the additive contains a metal soap and further contains at least one of a fatty acid amide and a mineral oil, since the washing property is further improved and the replacement with the post-material resin is further facilitated.
• Metal soaps are typically metal salts of long chain fatty acids (excluding sodium and potassium salts).
• the metal salt include metal behenate, metal montanate, metal laurate, metal stearate, metal palmitate and the like.
• the metal constituting the metal salt include lithium, magnesium, zinc, aluminum, calcium and the like.
• the content of the metal soap is preferably 0.5 to 6.0% by mass, more preferably 1.5 to 5.0% by mass, based on the total mass of the cleaning resin composition.
• fatty acid amide examples include lauric amide, palmitic amide, stearic amide, hydroxystearic amide, oleic amide, erucic amide, N-stearyl stearic amide, N-stearyl oleic amide, N-oleyl stearic amide Amide, N-stearyl erucic acid amide, methylol stearic acid amide, methylene bis stearic acid amide, ethylene biscapric acid amide, ethylene bis lauric acid amide, ethylene bis stearic acid amide, ethylene bis hydroxystearic acid amide, ethylene bis behenic acid amide, Hexamethylenebisstearic acid amide, hexamethylenebisbehenic acid amide, hexamethylenebishydroxystearic acid amide, N, N'- Distearyl adipic acid amide, ethylene bis oleic acid amide, hexam
• the melting point (mp) of the fatty acid amide is preferably from 50 to 250 ° C, more preferably from 100 to 250 ° C, and particularly preferably from 130 to 250 ° C.
• the content of the fatty acid amide is 1.0% by mass or more, preferably 1.0 to 6.0% by mass, based on the total mass of the cleaning resin composition. Preferably it is 1.5 to 5.0% by mass.
• the fatty acid amide is used as an additive, if the content of the fatty acid amide is less than 1.0% by mass, the detergency becomes insufficient, and it is necessary to use a larger amount of the resin composition for cleaning, and it is necessary for cleaning. Time cannot be reduced. By setting the content of the fatty acid amide within the above range, the washing property is improved, and the replacement with the post-material resin is facilitated.
• paraffinic mineral oil either a paraffinic mineral oil or a naphthenic mineral oil can be used.
• the paraffinic mineral oil include paraffin wax and liquid paraffin. Among them, it is preferable to use paraffinic mineral oil.
• the content of the mineral oil is preferably 1.0 to 6.0% by mass, more preferably 1.5 to 5.0% by mass, based on the total mass of the cleaning resin composition.
• the cleaning resin composition may contain other components other than the above components.
• other components for example, an antioxidant, an inorganic filler and the like can be mentioned.
• the antioxidant include a phenolic antioxidant, a phosphorus antioxidant, a hindered phenolic antioxidant, and the like.
• examples of the phenolic antioxidant include 3,5-di-t-butyl-4-hydroxytoluene.
• examples of the phosphorus antioxidant include triphenyl phosphite, trilauryl phosphite, trisnonylphenyl phosphite, tris (2,4-di-t-butylphenyl) phosphite and the like.
• Hindered phenolic antioxidants include tetrakis [methylene-3- (3 ', 5'-di-t-butyl-4'-hydroxyphenyl) -propionate] methane.
• the inorganic filler may be contained in a range in which parts inside the apparatus such as an extruder and a molding machine do not wear out and do not remain as impurities inside the apparatus.
• examples of the inorganic filler include silica, alumina, zeolite, glass fiber, and natural minerals.
• the cleaning resin composition of the present invention can be produced by a conventionally known method. For example, it can be manufactured by mixing the aforementioned base resin and various additives using a stirring and mixing device.
• a stirring and mixing device a normal stirring and mixing device used when producing a resin composition or the like may be used.
• the resin composition obtained using an extruder may be melt-kneaded at an appropriate temperature, extruded, and formed into pellets.
• the extruder a single-screw extruder, a twin-screw extruder, or the like can be used. By cutting the strand extruded from the extruder underwater or in the air, a cleaning resin composition in the form of pellets can be obtained.
• the inside of an apparatus such as an extruder or a molding machine for a resin material can be cleaned.
• the cleaning resin composition may be charged into the apparatus, and the apparatus may be operated almost as usual.
• the washing resin composition is usually heated to a molten state.
• the heating temperature is not particularly limited, and may be set in consideration of the melting points and the like of various components contained in the cleaning resin composition.
• Examples 2 to 10, Comparative Examples 1 to 3 A pellet-shaped cleaning resin composition was obtained in the same manner as in Example 1 except that each component was used so as to have the composition (unit: parts) shown in Table 1.
• a cleaning resin composition was prepared using components other than the fatty acid amide (ethylene biscapric acid amide), and the amount of the fatty acid amide (ethylene biscapric acid amide) shown in Table 1 was used for cleaning. Was added.
• ⁇ Washability evaluation> The cleaning properties of each cleaning resin composition were comprehensively evaluated according to the following evaluation criteria. Table 2 shows the results. A: The cleaning time is within 6 minutes and the replacement time is within 2 minutes. B: The cleaning time exceeds 6 minutes and within 8 minutes, or the replacement time exceeds 2 minutes and within 4 minutes. C: The cleaning time exceeds 8 minutes, and the replacement time exceeds 4 minutes.
• the cleaning resin composition of the present invention is useful as a cleaning resin composition used for cleaning the inside of an extruder or a molding machine for a resin material.

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• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Organic Chemistry (AREA)
• Oil, Petroleum & Natural Gas (AREA)
• Engineering & Computer Science (AREA)
• Wood Science & Technology (AREA)
• Life Sciences & Earth Sciences (AREA)
• Health & Medical Sciences (AREA)
• Polymers & Plastics (AREA)
• Medicinal Chemistry (AREA)
• Emergency Medicine (AREA)
• Mechanical Engineering (AREA)
• Detergent Compositions (AREA)
• Extrusion Moulding Of Plastics Or The Like (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)
• Compositions Of Macromolecular Compounds (AREA)

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• 2018
  • 2018-07-19 JP JP2018135538A patent/JP6476336B1/ja active Active
• 2019
  • 2019-03-05 SG SG11202012307VA patent/SG11202012307VA/en unknown
  • 2019-03-05 CN CN201980046986.7A patent/CN112423958B/zh active Active
  • 2019-03-05 WO PCT/JP2019/008519 patent/WO2020017087A1/ja active Application Filing
  • 2019-03-05 MY MYPI2020006632A patent/MY186218A/en unknown
  • 2019-04-09 TW TW108112354A patent/TWI782202B/zh active
• 2021
  • 2021-01-12 PH PH12021550072A patent/PH12021550072A1/en unknown

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