WO2020000901A1 - 导电层叠结构及其制备方法、触控显示装置 - Google Patents

导电层叠结构及其制备方法、触控显示装置 Download PDF

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Publication number
WO2020000901A1
WO2020000901A1 PCT/CN2018/119003 CN2018119003W WO2020000901A1 WO 2020000901 A1 WO2020000901 A1 WO 2020000901A1 CN 2018119003 W CN2018119003 W CN 2018119003W WO 2020000901 A1 WO2020000901 A1 WO 2020000901A1
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Prior art keywords
layer
conductive layer
conductive
opening
laminated structure
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PCT/CN2018/119003
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English (en)
French (fr)
Inventor
李维国
朱盛祖
乔贵洲
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Priority to US16/713,024 priority Critical patent/US11287921B2/en
Publication of WO2020000901A1 publication Critical patent/WO2020000901A1/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present application relates to the technical field of manufacturing touch display devices, and in particular, to a conductive laminated structure, a method for manufacturing the same, and a touch display device.
  • a material of a touch electrode of a conventional touch display device is usually indium tin oxide (ITO).
  • Nano metal wires have excellent electrical conductivity, and at the same time, due to their nano-scale size effects, they have excellent light transmission and flex resistance. Therefore, they can be used as a material to replace ITO as a touch electrode. Touch display device.
  • the purpose of this application is to provide a conductive laminated structure, a preparation method thereof, and a touch display device, so that the nano metal wire-based touch display device can simultaneously satisfy the requirements of adhesion and conductivity.
  • an embodiment of the present application provides a conductive laminated structure, including:
  • a conductive layer including a nano metal wire conductive layer and a tackifier layer, the tackifier layer being at least partially embedded with the nano metal wire conductive layer in a thickness direction thereof;
  • a signal connection layer is located on the conductive layer, an opening is formed in the conductive layer, and the signal connection layer is at least partially embedded in the opening in a thickness direction thereof.
  • the size of the side of the longitudinal section of the opening near the signal connection layer is larger than the size of the side of the longitudinal section of the opening remote from the signal connection layer.
  • the shape of the longitudinal section of the opening is trapezoidal.
  • the shape of the longitudinal section of the opening is rectangular.
  • the number of the openings is multiple, and the multiple openings are evenly distributed in the conductive layer.
  • the multiple openings are distributed in multiple rows or columns.
  • the depth of the opening is less than or equal to the thickness of the conductive layer.
  • the nano metal wire conductive layer includes:
  • a plurality of nano metal wires are embedded in the matrix; the plurality of nano metal wires are overlapped with each other to form a conductive network.
  • the material of the adhesion-promoting layer is at least one of a polymer, a resin, a transparent optical adhesive, an oxide, and a photoresist-like material.
  • the material of the signal connection layer is at least one of silver, gold, indium tin oxide, metal mesh, or graphene.
  • the material of the nano-metal wire is gold, silver, platinum, copper, cobalt, or palladium.
  • the embodiment of the present application further provides a method for preparing a conductive laminated structure, and the method for preparing the conductive laminated structure includes:
  • the conductive layer including a nano metal wire conductive layer and a tackifier layer, the tackifier layer being at least partially embedded with the nano metal wire conductive layer in a thickness direction thereof;
  • a signal connection layer is formed on the conductive layer, and the signal connection layer is at least partially embedded in the opening in a thickness direction thereof.
  • the step of forming the nano metal wire conductive layer includes:
  • the nano metal wire solution applied on the substrate is cured to form the nano metal wire conductive layer.
  • the step of forming the adhesion-promoting layer includes:
  • the transparent optical glue solution is heated and dried to be cured to form the adhesion-promoting layer.
  • a method for forming an opening in the conductive layer includes at least one of dry etching, wet etching, or laser etching.
  • the signal connection layer is formed on the conductive layer by a printing process.
  • An embodiment of the present application further provides a touch display device, including:
  • a conductive layer including a nano metal wire conductive layer and a tackifier layer, the tackifier layer being at least partially embedded with the nano metal wire conductive layer in a thickness direction thereof;
  • a signal connection layer is located on the conductive layer, an opening is formed in the conductive layer, and the signal connection layer is at least partially embedded in the opening in a thickness direction thereof.
  • the substrate includes a visible area and a frame area surrounding the visible area, and the signal connection layer and the opening are both located in the frame area.
  • the signal connection layer and the opening are further located in the visible area.
  • the touch display device further includes a cover plate and an adhesive layer, and the adhesive layer is located between the conductive laminated structure and the cover plate, so as to connect the conductive laminated structure and the cover plate. fit.
  • the conductive layer is formed on a substrate, an opening is formed in the conductive layer, so that the nano metal wire in the nano metal wire conductive layer can have more
  • the surface of the adhesion-promoting layer is exposed and is in contact with the signal connection layer; and, the signal connection layer is at least partially embedded in the opening in a thickness direction of the signal connection layer, increasing the adhesion while ensuring adhesion
  • the overlapping area of the signal connection layer and the nano metal wire conductive layer further reduces the impedance and increases the continuity. The increase in the continuity can further reduce the response time.
  • the effective overlap area of the signal connection layer in the frame area and the nano metal wire conductive layer can be increased, thereby reducing the area of the frame area while ensuring the conductivity
  • the total area ratio meets the design requirements of narrow bezels.
  • FIG. 1 is a flowchart of a method for manufacturing a conductive laminated structure according to an embodiment of the present application
  • FIG. 2 is a schematic cross-sectional view of a conductive layer formed on a substrate according to an embodiment of the present application
  • FIG. 3 is a schematic cross-sectional view of a frame region for forming an opening according to an embodiment of the present application
  • FIG. 4 is a schematic cross-sectional view of a frame region of a conductive laminated structure according to an embodiment of the present application
  • FIG. 5 is a schematic cross-sectional view of a frame region of a conductive laminated structure according to an embodiment of the present application
  • FIG. 6 is a schematic cross-sectional view of a conductive laminated structure according to an embodiment of the present application.
  • FIG. 7 is another schematic cross-sectional view of a conductive laminated structure according to an embodiment of the present application.
  • 1-substrate 11-frame area, 12-viewable area, 2-conductive layer, 21-nano metal wire conductive layer, 22-tackifier layer, 3-opening, 4-signal connection layer.
  • a nano metal wire solution is usually directly coated on a substrate to form a nano metal wire conductive layer.
  • the nano metal wire conductive layer needs to be coated with a tackifier layer to protect it, so that the nano metal wire conductive layer and the substrate are closely adhered.
  • the adhesion-promoting layer is applied, only some of the nano-metal wires can leak out of the adhesion-promoting layer and overlap with the signal connection layer, resulting in a small overlap area of the nano-metal wire and the signal connection layer. Therefore, in order to ensure the continuity, it is necessary to increase the overlap width of the nano metal wire conductive layer and the signal connection layer when designing the conductive laminated structure, that is, to increase the proportion of the overall width of the frame.
  • the embodiment of the present application proposes a method for preparing a conductive laminated structure. After the conductive layer is formed on a substrate, openings are formed in the conductive layer, so that more nano metal wires in the nano metal wire conductive layer can be formed. The surface of the adhesion-promoting layer is exposed and is in contact with the signal connection layer; and the signal connection layer is at least partially embedded in the opening in the thickness direction, which increases the signal while ensuring adhesion The overlapping area of the connection layer and the nano-metal wire conductive layer further reduces the resistance and increases the conductivity, and the increase in the conductivity can further reduce the response time.
  • the effective overlap area of the signal connection layer in the frame area and the nano metal wire conductive layer can be increased, thereby reducing the area of the frame area while ensuring continuity.
  • the overall area ratio takes into account the design requirements of the narrow bezel.
  • FIG. 7 is a schematic diagram of a conductive laminated structure provided by this embodiment.
  • the conductive laminated structure includes a conductive layer 2 and a signal connection layer 4;
  • the conductive layer 2 includes a nano-metal wire conductive layer 21 and a tackifier layer 22, and the tackifier layer 22 It is at least partially embedded with the nano metal wire conductive layer 21 in its thickness direction;
  • the signal connection layer 4 is located on the conductive layer 2, and an opening 3 is formed in the conductive layer 2, and the signal connection layer 4 It is at least partially embedded in the opening 3 in its thickness direction.
  • the conductive laminated structure is located on a substrate 1, and the substrate 1 includes a visible region 12 and a frame region 11.
  • the visible area 12 of the substrate 1 is generally used for light-transmissive display, and the frame area 11 is generally opaque to highlight the display content of the visible area 12 and cover components such as wiring.
  • the conductive layer 2 covers the substrate 1.
  • the conductive layer 2 includes a nano metal wire conductive layer 21 and an adhesion-promoting layer 22.
  • the nano metal wire conductive layer 21 includes a substrate and a plurality of substrates embedded in the substrate. Nano metal wires, the plurality of nano metal wires are overlapped with each other to form a conductive network.
  • the adhesion-promoting layer 22 is at least partially embedded in the nano metal wire conductive layer 21, so that the adhesion between the nano metal wire conductive layer 21 and the substrate 1 is increased.
  • an acrylate oligomer is coated on the surface of the nano-metal wire conductive layer 21, and the adhesion-promoting layer 22 is formed after curing.
  • the opening 3 may be located in the frame area 11 or the visible area 12, or both of the frame area 11 and the visible area 12
  • the opening 3 is used for more electrically connecting the nano metal wire in the nano metal wire conductive layer 21 with the signal connection layer 4.
  • the signal connection layer 4 is at least partially embedded in the opening 3 in the thickness direction, which increases the overlap area of the nano metal wire conductive layer 21 and the signal connection layer 4, thereby increasing the conductivity. .
  • the conductive layer 2 in the frame region 11 has an opening 3 therein, so that the nano metal wires in the nano metal wire conductive layer 21 are not only from the surface of the adhesion-promoting layer 22. Exposed, also exposed through the opening 3.
  • the signal connection layer 4 covers the conductive layer 2 of the frame region 11 and overlaps with the nano-metal wire exposed from the surface of the adhesion-promoting layer 22; and the signal connection layer 4 has a thickness It is at least partially embedded in the opening 3 in the direction, and overlaps with the nano metal wire exposed from the opening 3. Due to the existence of the opening 3, the overlapping area of the signal connection layer 4 and the nano metal wire conductive layer 21 is increased, thereby reducing the impedance and increasing the conductivity.
  • the longitudinal cross-sectional shape of the opening 3 may be rectangular, that is, the size of the top and bottom of the opening 3 is the same, and the process of forming the rectangular opening 3 is relatively simple and easy to control.
  • the vertical section of the opening 3 refers to a section along a plane perpendicular to the plane where the conductive layer 2 is located.
  • the vertical cross-sectional shape of the opening 3 may also be trapezoidal, that is, the size of the top of the opening 3 is larger than the size of the bottom, so that the nano-metal wires more from the opening 3 It is exposed, thereby ensuring that the overlapping area of the nano-metal wire and the signal connection layer 4 is larger.
  • the shape of the opening 3 may also be cylindrical, tapered, or other shapes, which are not limited in the present application.
  • the vertical cross-sectional shape referred to herein is a cross-sectional shape of the opening 3 after being cut in a direction perpendicular to the substrate 1, that is, the shape shown in FIGS. 4-5.
  • the opening 3 does not penetrate the conductive layer 2, that is, the depth of the opening 3 is smaller than the thickness of the conductive layer 2.
  • the openings 3 may also penetrate the conductive layer 2, that is, the depth of the openings 3 may also be equal to the thickness of the conductive layer 2, and no further examples are given here.
  • the substrate 1 has a rectangular shape
  • the frame region 11 is located in an edge region of the substrate 1 and has a "back" shape
  • the openings 3 can be evenly distributed in the "back" shape frame area
  • the signal connection layer 4 and the nano metal wire conductive layer 21 are uniformly overlapped.
  • the openings 3 may also be randomly distributed in the conductive layer 2 of the frame region 11.
  • the openings 3 may be one or multiple, and a plurality of the openings 3 may be distributed in multiple rows or columns.
  • FIG. 1 to FIG. 7 are a flowchart of a method for manufacturing the conductive laminated structure and a schematic cross-sectional view of the conductive laminated structure provided in this embodiment.
  • the method for preparing the conductive laminated structure includes:
  • S1 forming a conductive layer 2 including a nano metal wire conductive layer 21 and a tackifier layer 22, the tackifier layer 22 being at least partially embedded with the nano metal wire conductive layer 21 in a thickness direction thereof;
  • a signal connection layer 4 is formed on the conductive layer 2, and the signal connection layer 4 is at least partially embedded in the opening 3 in a thickness direction thereof.
  • a substrate 1 is first provided, and the substrate 1 provides support for the entire conductive laminated structure.
  • the substrate 1 may be a rigid substrate formed of glass, metal, or ceramic materials, or a substrate such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES),
  • PI polyimide
  • PC polycarbonate
  • PES polyethersulfone
  • the flexible substrate formed of any suitable insulating material such as polyethylene terephthalate (PBT), polystyrene (PS), or glass fiber reinforced plastic is not limited in this application.
  • a nano metal wire solution is coated on the substrate 1, and the nano metal wire solution is a suspension solution formed by dissolving the nano metal wire in a specific solvent.
  • the solvent may be water, an aqueous solution, an ionic solution, a saline solution, a supercritical fluid, an oil, or a mixture thereof, and the solvent may further contain, for example, a dispersant, a surfactant, a crosslinking agent, a stabilizer, a wetting agent, and the like. Or additives such as thickeners.
  • the nano metal wire solution is coated on the substrate 1, and is heated and dried to cure the nano metal wire solution coated on the substrate 1 to form the nano metal wire conductive layer 21.
  • the nano metal wire conductive layer 21 includes a matrix and nano metal wires embedded in the matrix.
  • the nano metal wires are overlapped by a molecular force to form a conductive network.
  • the matrix is used to protect the nano metal wires from Corrosion, abrasion and other environmental influences.
  • the nano metal wire 22 may be a nano wire such as gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd), or the like. Because silver has the characteristics of good electrical conductivity and light transmission, the nano metal wire is preferably a silver nano wire (namely, a nano silver wire).
  • an adhesion-promoting layer 22 is formed on the nano-metal wire conductive layer 21.
  • the nano metal wire conductive layer 21 and the adhesion-promoting layer 22 together constitute the conductive layer 2.
  • the material of the adhesion-promoting layer 3 may be one or more of materials such as a polymer, a resin, a transparent optical glue, an oxide, and a photoresist.
  • the material of the adhesion-promoting layer 22 is transparent optical glue.
  • the step of forming the adhesion-promoting layer 22 in this embodiment may be: applying a transparent optical glue solution on the nano-metal wire conductive layer 21 by using a spraying process or a printing process; and then applying the nano-metal wire conductive layer 21 to the nano-metal wire conductive layer 21.
  • the transparent optical glue solution is heated and dried, and is cured to form the adhesion-promoting layer 22.
  • the transparent optical glue solution has fluidity, and the nano metal wire conductive layer 21 is in a network shape, before the transparent optical solution is not cured, the transparent optical glue solution will penetrate into the nano metal wire to conduct electricity.
  • the adhesion-promoting layer 22 formed after curing is at least partially embedded in the nano-metal wire conductive layer 21 in the thickness direction. Therefore, the nano-metal wire conductive layer 21 is better adhered to the substrate 1, and the nano-metal wires are less likely to migrate and the overlap is more firm.
  • the opening 3 is formed in the conductive layer 2 by using at least one of a dry etching process, a wet etching process, or a laser etching process.
  • the conductive layer 2 of the frame region 11 is etched by a dry etching process to form the opening 3.
  • the etching parameters of the dry etching process may be adjusted according to the requirements of the actual conductive laminated structure, so as to change the shape and depth of the opening 3, so that the conductive performance of the conductive laminated structure is better. It can be understood that the opening 3 may also be formed in the conductive layer 2 of the visible region 12.
  • a signal connection layer 4 is formed on the conductive layer 2 by a printing process.
  • the signal connection layer 4 is formed on the conductive layer 2 in the frame region 11.
  • the material of the signal connection layer 4 may be one or more of silver, gold, indium tin oxide, metal mesh, or graphene.
  • a conductive silver paste is printed on the conductive layer 2 of the frame region 11 to form the signal connection layer 4.
  • the conductive silver paste Since the conductive silver paste has fluidity during printing, it flows into the opening 3, and the formed signal connection layer 4 is at least partially embedded in the opening 3 in the thickness direction, increasing The effective contact area of the nano metal wire conductive layer 21 and the signal connection layer 4 can also ensure the continuity and achieve the design requirements of a narrow frame when the overall area ratio of the frame area is reduced.
  • a laser etching process is also used to etch the signal connection layer 4 to form the nano metal wire conductive layer 2 on the frame region 11. Forming a plurality of signal connecting lines; then covering the frame area 11 and etching the conductive layer 2 of the visible area 12 to form a touch electrode in the visible area 12; The signal connection line is overlapped with the touch electrode.
  • this embodiment further provides a touch display device.
  • the touch display device includes a substrate 1 and the conductive laminated structure.
  • the conductive laminated structure includes a conductive layer including a nano metal wire conductive layer and a tackifier layer, and the tackifier layer is at least partially embedded with the nano metal wire conductive layer in a thickness direction thereof;
  • the touch display device further includes a cover plate and an adhesive layer, and the adhesive layer is located between the conductive laminated structure and the cover plate to attach the conductive laminated structure to the cover plate.
  • An opaque decorative material may be coated on the cover plate of the frame area 11 to highlight the graphics displayed in the visible area 12.
  • the signal connection layer 4 and the opening 3 can both be located in the frame area 11
  • the signal connection layer of the frame area and the nano metal wire conductive layer can be increased
  • the effective overlap area can further ensure that the touch display device reduces the overall area ratio of the frame area 11 while ensuring the continuity, and meets the design requirements of a narrow frame.
  • the touch display device provided in the embodiments of the present application, after the conductive layer is formed on a substrate, an opening is formed in the conductive layer to make the nano metal wire conductive.
  • the nano-metal wires in the layer can more expose the surface of the adhesion-promoting layer to contact the signal connection layer, and the signal connection layer is at least partially embedded in the opening in the thickness direction to ensure adhesion While increasing the overlap area of the signal connection layer and the nano metal wire conductive layer, thereby reducing the impedance and increasing the continuity, the increase in continuity can further reduce the response time ; In the case of reducing the proportion of the total area of the border area, it can also ensure continuity and meet the design requirements of narrow borders.

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Abstract

一种导电层叠结构及其制备方法、触控显示装置，在基板（1）上形成导电层（2）之后，在导电层（2）中形成开口（3），使得纳米金属线导电层（21）中的纳米金属线可以更多的露出增粘层（22）的表面且与信号连接层（4）接触；并且，信号连接层（4）在其厚度方向上至少部分嵌入所述开口（3）中，在保证粘附性的同时增大了所述信号连接层（4）与所述纳米金属线导电层（21）的搭接面积，进而减小了阻抗并增大了导通性，导通性的增大也可以进一步减少响应的时间；在缩小边框区（11）总体面积占比的情况下，也能保证导通性，满足窄边框的设计需求。

Description

导电层叠结构及其制备方法、触控显示装置 技术领域
本申请涉及触控显示装置制备的技术领域，尤其涉及一种导电层叠结构及其制备方法、触控显示装置。
背景技术
传统的触控显示装置的触控电极的材料通常为氧化铟锡(ITO)。
纳米金属线具有优良的导电性，同时由于其纳米级别的尺寸效应，使得其具有优异的透光性与耐曲挠性，因此可用作替代ITO作为触控电极的材料，实现基于纳米金属线的触控显示装置。但发明人发现，目前基于纳米金属线的触控显示装置无法同时满足粘附性及导通性的要求。
发明内容
本申请的目的在于提供一种导电层叠结构及其制备方法、触控显示装置，使基于纳米金属线的触控显示装置能够同时满足粘附性及导通性的要求。
为了达到上述目的，本申请的实施例提供了一种导电层叠结构，包括：
导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；以及
信号连接层，位于所述导电层上，所述导电层中形成有开口，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
可选的，所述开口的纵截面的靠近所述信号连接层的一侧的尺寸大于所述开口的纵截面的远离所述信号连接层的一侧的尺寸。
可选的，所述开口的纵截面形状为梯形。
可选的，所述开口的纵截面形状为矩形。
可选的，所述开口的数量为多个，多个所述开口均匀的分布在所述导电层中。
可选的，多个所述开口呈多行或多列分布。
可选的，所述开口的深度小于或等于所述导电层的厚度。
可选的，所述纳米金属线导电层包括：
基质；
多条纳米金属线，嵌入所述基质中；所述多条纳米金属线相互搭接以形成导电网络。
可选的，所述增粘层的材料为高分子聚合物、树脂、透明光学胶、氧化物、类光阻等材料中的至少一种。
可选的，所述信号连接层的材料为银、金、氧化铟锡、金属筛网或石墨烯中的至少一种。
可选的，所述纳米金属线的材料为金、银、铂、铜、钴或钯。
本申请的实施例还提供了一种导电层叠结构的制备方法，所述导电层叠结构的制备方法包括：
形成导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；
在所述导电层中形成开口，以及
在所述导电层上形成信号连接层，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
可选的，形成所述纳米金属线导电层的步骤包括：
在一基板上涂布纳米金属线溶液；以及
对所述基板上涂布的纳米金属线溶液进行固化，形成所述纳米金属线导电层。
可选的，形成所述增粘层的步骤包括：
将透明光学胶溶液采用喷涂工艺或印刷工艺涂布在所述纳米金属线导电层上；
对所述透明光学胶溶液进行加热烘干，固化形成所述增粘层。
可选的，在所述导电层中形成开口方法包括干法刻蚀、湿法刻蚀或激光刻蚀中的至少一种。
可选的，采用印刷工艺在所述导电层上形成所述信号连接层。
本申请的实施例还提供了一种触控显示装置，包括：
基板；
导电层叠结构，所述导电层叠结构位于所述基板上；其中，所述导电层叠结构包括：
导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；以及
信号连接层，位于所述导电层上，所述导电层中形成有开口，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
可选的，所述基板包括可视区及围绕所述可视区的边框区，所述信号连接层及所述开口均位于所述边框区中。
可选的，所述信号连接层及所述开口还位于所述可视区中。
可选的，所述触控显示装置还包括盖板及贴合层，所述贴合层位于所述导电层叠结构及所述盖板之间，以将所述导电层叠结构与所述盖板贴合。
在本申请的实施例提供的导电层叠结构制备方法中，在基板上形成所述导电层之后，在所述导电层中形成开口，使得所述纳米金属线导电层中的纳米金属线可以更多的露出所述增粘层的表面且与所述信号连接层接触；并且，所述信号连接层在其厚度方向上至少部分嵌入所述开口中，在保证粘附性的同时增大了所述信号连接层与所述纳米金属线导电层的搭接面积，进而减小了阻抗并增大了导通性，导通性的增大也可以进一步减少响应的时间。
进一步，当所述开口位于基板上的边框区时，可以增大边框区的信号连接层与所述纳米金属线导电层的有效搭接面积，进而可以在保证导通性的同时缩小边框区的总体面积占比，满足窄边框的设计需求。
附图说明
图1为本申请实施例提供的导电层叠结构的制备方法的流程图；
图2为本申请实施例提供的在基板上形成导电层后的剖面示意图
图3为本申请实施例提供的形成开口的边框区的剖面示意图；
图4为本申请实施例提供的导电层叠结构的边框区的一种剖面示意图；
图5为本申请实施例提供的导电层叠结构的边框区的又一种剖面示意图；
图6为本申请实施例提供的导电层叠结构的剖面示意图；
图7为本申请实施例提供的导电层叠结构的又一剖面示意图；
其中，1-基板，11-边框区，12-可视区，2-导电层，21-纳米金属线导电层，22-增粘层，3-开口，4-信号连接层。
具体实施方式
目前触控显示装置中纳米金属线的制备工艺，通常是将纳米金属线溶液直接涂布在基板上以形成纳米金属线导电层。但是，纳米金属线导电层因其材料及其工艺的特性，需涂覆增粘层加以保护，以使得纳米金属线导电层与基板紧密粘附。然而，在涂覆增粘层之后，只有一些纳米金属线能够漏出增粘层并与信号连接层搭接，导致所述纳米金属线与所述信号连接层搭接的面积较小。因此，为保证导通性，目前在设计导电层叠结构时就需要增加所述纳米金属线导电层与所述信号连接层搭接宽度，即增大边框的总体宽度占比。
本申请的实施例提出一种导电层叠结构制备方法，在基板上形成所述导电层之后，在所述导电层中形成开口，使得所述纳米金属线导电层中的纳米金属线可以更多的露出所述增粘层的表面且与所述信号连接层接触；并且，所述信号连接层在其厚度方向上至少部分嵌入所述开口中，在保证粘附性的同时增大了所述信号连接层与所述纳米金属线导电层的搭接面积，进而减小了阻抗并增大了导通性，导通性的增大也可以进一步减少响应的时间。
进一步，当所述开口位于基板上的边框区时，可以增大边框区的信号连接层与所述纳米金属线导电层的有效搭接面积，进而可以在保证导通性的同时缩小边框区的总体面积占比，兼顾了窄边框的设计需求。
下面将结合示意图对本申请的具体实施方式进行更详细的描述。根据下列描述和权利要求书，本申请的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本申请实施例的目的。
图7为本实施例提供的导电层叠结构的示意图。如图6所示及图3所示，所述导电层叠结构包括导电层2以及信号连接层4；所述导电层2包括纳米金属线导电层21及增粘层22，所述增粘层22在其厚度方向上至少部分与所述纳米 金属线导电层21相互嵌入；所述信号连接层4位于所述导电层2上，所述导电层2中形成有开口3，所述信号连接层4在其厚度方向上至少部分嵌入所述开口3中。
具体的，所述导电层叠结构位于一基板1上，所述基板1包括可视区12以及边框区11。其中，所述基板1的可视区12通常用于透光显示，所述边框区11通常不透光以突出所述可视区12的显示内容及遮盖走线等部件。所述导电层2覆盖所述基板1，进一步，所述导电层2包括纳米金属线导电层21及增粘层22，所述纳米金属线导电层21包括基质及嵌入所述基质中的多条纳米金属线，所述多条纳米金属线相互搭接形成导电网络。所述增粘层22至少部分嵌入所述纳米金属线导电层21中，以使所述纳米金属线导电层21与所述基板1之间的粘附力增加。本实施例中，在纳米金属线导电层21表面涂布丙烯酸酯低聚物，固化后形成所述增粘层22。
请继续参阅图7及图3，所述开口3既可以位于所述边框区11中，也可以位于所述可视区12中，或者所述边框区11及所述可视区12中皆有所述开口3，该开口3用于更多地将所述纳米金属线导电层21中的纳米金属线与所述信号连接层4电连接。所述信号连接层4在其厚度方向上至少部分嵌入所述开口3中，增大了所述纳米金属线导电层21及所述信号连接层4的搭接面积，进而增大了导通性。
进一步，本文将以所述开口3位于所述边框区11中为例进行详述。
请参阅图6所示及图3所示，所述边框区11的导电层2中具有开口3，使所述纳米金属线导电层21中的纳米金属线不仅从所述增粘层22的表面露出，也从所述开口3中露出。具体地，所述信号连接层4覆盖所述边框区11的导电层2，其与从所述增粘层22的表面露出的纳米金属线搭接；并且，所述信号连接层4在其厚度方向上至少部分嵌入所述开口3中，其与从所述开口3中露出的纳米金属线搭接。由于所述开口3的存在，增大了所述信号连接层4与所述纳米金属线导电层21的搭接面积，进而减小了阻抗并增大了导通性。
进一步，如图3及图4所示，所述开口3的纵截面形状可以是矩形，即所述开口3顶部及底部的尺寸相同，形成矩形状的开口3的工艺也比较简单，易于控制。其中，所述开口3的纵截面是指沿垂直于导电层2所在平面的截面。 如图3及图5所示，所述开口3的纵截面形状还可以是梯形，即所述开口3顶部的尺寸大于底部的尺寸，使得所述纳米金属线更多地从所述开口3中露出，从而保证纳米金属线与所述信号连接层4的搭接面积更大。当然，所述开口3的形状还可以是圆柱形、锥形或其他的形状，本申请不作限制。本文中所指的纵截面形状是以垂直于所述基板1的方向进行剖切后，所看到的开口3的截面形状，即图4-5所示的形状。本实施例中，所述开口3不贯穿导电层2，即，所述开口3的深度小于所述导电层2的厚度。在其他实施例中，所述开口3也可以贯穿导电层2，即，所述开口3的深度也可以等于所述导电层2的厚度，这里不再一一举例。
可选的，所述基板1呈矩形状，所述边框区11位于所述基板1的边缘区域并且呈“回”字形，所述开口3可以均匀的分布在所述“回”字形的边框区11的导电层2中，以使所述信号连接层4与所述纳米金属线导电层21均匀的搭接。当然，所述开口3也可以随机的分布在边框区11的导电层2中。在所述边框区11的一侧边区域的宽度方向上，所述开口3可以是一个，也可以是多个，若干个所述开口3呈多行或者多列分布。
请参阅图1-图7，其为本实施例提供的导电层叠结构的制备方法的流程图以及导电层叠结构的剖面示意图。其中，所述导电层叠结构的制备方法包括：
S1：形成导电层2，所述导电层2包括纳米金属线导电层21及增粘层22，所述增粘层22在其厚度方向上至少部分与所述纳米金属线导电层21相互嵌入；
S2：在所述导电层2中形成开口3；
S3：在所述导电层2上形成信号连接层4，所述信号连接层4在其厚度方向上至少部分嵌入所述开口3中。
具体的，请参阅图2，首先提供基板1，所述基板1为整个所述导电层叠结构提供支撑。可选的，所述基板1可以采用如玻璃、金属、或陶瓷材料形成的刚性基板，也可以是采用如聚酰亚胺(PI)、聚碳酸酯(PC)、聚醚砜(PES)、聚对苯二甲酸乙二醇酯(PBT)、聚苯乙烯(PS)、或玻璃纤维增强塑料等任意合适的绝缘材料形成的柔性基板，本申请不作限制。
接下来，在所述基板1上涂布纳米金属线溶液，所述纳米金属线溶液为纳米金属线溶在特定的溶剂里而形成的悬浮溶液。该溶剂可以是水、水溶液、离 子溶液、含盐溶液、超临界流体、油或其混合物等，所述溶剂中还可以含有如分散剂、表面活性剂、交联剂、稳定剂、润湿剂或增稠剂等添加剂。在所述基板1上涂布好纳米金属线溶液，进行加热烘干，以对所述基板1上涂布的纳米金属线溶液进行固化，形成所述纳米金属线导电层21。所述纳米金属线导电层21包括基质及嵌入所述基质中的纳米金属线，所述纳米金属线之间通过分子力搭接以形成导电网络，所述基质用于保护所述纳米金属线不被腐蚀、磨损等外界环境的影响。
所述纳米金属线22可以是金(Au)、银(Ag)、铂(Pt)、铜(Cu)、钴(Co)、钯(Pd)等的纳米线。由于银具有导电性和透光性好等特点，所述纳米金属线优选为银纳米线(即纳米银线)。
进一步，在所述纳米金属线导电层21上形成增粘层22。其中，所述纳米金属线导电层21与所述增粘层22共同构成所述导电层2。可选的，所述增粘层3的材料可以是如高分子聚合物、树脂、透明光学胶、氧化物、类光阻等材料中的一种或多种。本实施例中，所述增粘层22的材料为透明光学胶。本实施例中形成所述增粘层22的步骤可以是：将透明光学胶溶液采用喷涂工艺或印刷工艺涂布在所述纳米金属线导电层21上；再对所述纳米金属线导电层21上的透明光学胶溶液进行加热烘干，固化形成所述增粘层22。进一步，由于所述透明光学胶溶液具有流动性，而所述纳米金属线导电层21呈网状，因此，透明光学溶液在未固化前，所述透明光学胶溶液会渗入所述纳米金属线导电层21中，使得固化后形成的增粘层22在其厚度方向上至少部分会嵌入所述纳米金属线导电层21中。因此，所述纳米金属线导电层21更好的附着在所述基板1上，并且所述纳米金属线之间不易发生游移，搭接更加牢固。
接下来，请参阅图3，采用干法刻蚀工艺、湿法刻蚀工艺或激光刻蚀工艺中的至少一种在所述导电层2中形成所述开口3。本实施例中，采用干法刻蚀工艺刻蚀所述边框区11的导电层2，以形成所述开口3。进一步，可以根据实际导电层叠结构的需求，调整所述干法刻蚀工艺的刻蚀参数，以改变所述开口3的形状及深度，使所述导电层叠结构的导电性能更好。可以理解的是，所述开口3也可以形成在所述可视区12的导电层2中。
接着，如图4或图5所示，采用印刷工艺在所述导电层2上形成信号连接 层4。本实施例中，在所述边框区11的导电层2上形成所述信号连接层4。所述信号连接层4的材料可以是银、金、氧化铟锡、金属筛网或石墨烯中的一种或多种。本实施例中，将导电银浆印刷在所述边框区11的导电层2上，以形成所述信号连接层4。由于在印刷时，所述导电银浆具有流动性，会流进所述开口3中，所形成的所述信号连接层4其厚度方向上至少部分会嵌入到所述开口3中，增大了所述纳米金属线导电层21与所述信号连接层4的有效接触面积，在缩小边框区总体面积占比的情况下，也能保证导通性，实现窄边框的设计需求。
可选的，本实施例在形成所述信号连接层4后，还采用了激光刻蚀工艺对所述信号连接层4进行刻蚀，以在所述边框区11的纳米金属线导电层2上形成多条信号连接线；然后将所述边框区11遮盖，刻蚀所述可视区12的导电层2，以在所述可视区12中形成触控电极，通过后续的工艺将多条所述信号连接线与所述触控电极搭接。
有鉴于此，请参阅图7，本实施例还提供了一种触控显示装置，所述触控显示装置包括基板1以及所述导电层叠结构。其中，所述导电层叠结构包括：导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；以及信号连接层，位于所述导电层上，所述导电层中形成有开口，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
需要说明的是，未在本实施例中详细描述的导电层叠结构的结构细节，请参照图1至图6所示实施例的描述，在此不再赘述。
可选的，所述触控显示装置还包括盖板及贴合层，所述贴合层位于所述导电层叠结构及所述盖板之间以将所述导电层叠结构与所述盖板贴合。所述边框区11的盖板上可以涂覆不透光的装饰材料，以突出所述可视区12显示的图形。
可选的，如图6所示，当所述信号连接层4及所述开口3可以均位于所述边框区11中，可以增大边框区的信号连接层与所述纳米金属线导电层的有效搭接面积，进而可以保证所述触控显示装置在保证导通性的同时缩小边框区11的总体面积占比，满足窄边框的设计需求。
综上，在本申请实施例提供的导电层叠结构及其制备方法、触控显示装置 中，在基板上形成所述导电层之后，在所述导电层中形成开口，使得所述纳米金属线导电层中的纳米金属线可以更多的露出所述增粘层的表面与所述信号连接层接触，并且，所述信号连接层在其厚度方向上至少部分嵌入所述开口中，在保证粘附性的同时增大了所述信号连接层与所述纳米金属线导电层的搭接面积，进而减小了阻抗并增大了导通性，导通性的增大也可以进一步减少响应的时间；在缩小边框区总体面积占比的情况下，也能保证导通性，满足窄边框的设计需求。
上述仅为本申请的优选实施例而已，并不对本申请起到任何限制作用。任何所属技术领域的技术人员，在不脱离本申请的技术方案的范围内，对本申请揭露的技术方案和技术内容做任何形式的等同替换或修改等变动，均属未脱离本申请的技术方案的内容，仍属于本申请的保护范围之内。

Claims (20)

  1. 一种导电层叠结构，包括：
    导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；以及
    信号连接层，位于所述导电层上，所述导电层中形成有开口，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
  2. 如权利要求1所述的导电层叠结构，其中，所述开口的纵截面的靠近所述信号连接层的一侧的尺寸大于所述开口的纵截面的远离所述信号连接层的一侧的尺寸。
  3. 如权利要求2所述的导电层叠结构，其中，所述开口的纵截面形状为梯形。
  4. 如权利要求1所述的导电层叠结构，其中，所述开口的纵截面形状为矩形。
  5. 如权利要求1所述的导电层叠结构，其中，所述开口的数量为多个，多个所述开口均匀的分布在所述导电层中。
  6. 如权利要求5所述的导电层叠结构，其中，多个所述开口呈多行或多列分布。
  7. 如权利要求1所述的导电层叠结构，其中，所述开口的深度小于或等于所述导电层的厚度。
  8. 如权利要求1所述的导电层叠结构，其中，所述纳米金属线导电层包括：
    基质；
    多条纳米金属线，嵌入所述基质中；所述多条纳米金属线相互搭接以形成导电网络。
  9. 如权利要求1所述的导电层叠结构，其中，所述增粘层的材料为高分子聚合物、树脂、透明光学胶、氧化物、类光阻等材料中的至少一种。
  10. 如权利要求1所述的导电层叠结构，其中，所述信号连接层的材料为银、金、氧化铟锡、金属筛网或石墨烯中的至少一种。
  11. 如权利要求9所述的导电层叠结构，其中，所述纳米金属线的材料为金、银、铂、铜、钴或钯。
  12. 一种导电层叠结构的制备方法，包括：
    形成导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；
    在所述导电层中形成开口，以及
    在所述导电层上形成信号连接层，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
  13. 如权利要求12所述的导电层叠结构的制备方法，其中，形成所述纳米金属线导电层的步骤包括：
    在一基板上涂布纳米金属线溶液；以及
    对所述纳米金属线溶液进行固化，形成所述纳米金属线导电层。
  14. 如权利要求12所述的导电层叠结构的制备方法，其中，形成所述增粘层的步骤包括：
    将透明光学胶溶液采用喷涂工艺或印刷工艺涂布在所述纳米金属线导电层上；
    对所述透明光学胶溶液进行加热烘干，固化形成所述增粘层。
  15. 如权利要求12所述的导电层叠结构的制备方法，其中，在所述导电层中形成开口方法包括干法刻蚀、湿法刻蚀或激光刻蚀中的至少一种。
  16. 如权利要求12所述的导电层叠结构的制备方法，其中，采用印刷工艺在所述导电层上形成所述信号连接层。
  17. 一种触控显示装置，包括：
    基板；
    导电层叠结构，所述导电层叠结构位于所述基板上；其中，所述导电层叠结构包括：
    导电层，所述导电层包括纳米金属线导电层及增粘层，所述增粘层在其厚度方向上至少部分与所述纳米金属线导电层相互嵌入；以及
    信号连接层，位于所述导电层上，所述导电层中形成有开口，所述信号连接层在其厚度方向上至少部分嵌入所述开口中。
  18. 如权利要求17所述的触控显示装置，其中，所述基板包括可视区及围绕所述可视区的边框区，所述信号连接层及所述开口均位于所述边框区中。
  19. 如权利要求18所述的触控显示装置，其中，所述信号连接层及所述开口还位于所述可视区中。
  20. 如权利要求17所述的触控显示装置，还包括盖板及贴合层，所述贴合层位于所述导电层叠结构及所述盖板之间，以将所述导电层叠结构与所述盖板贴合。
PCT/CN2018/119003 2018-06-30 2018-12-03 导电层叠结构及其制备方法、触控显示装置 Ceased WO2020000901A1 (zh)

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