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  • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
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  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
  • C07D307/77—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems
  • C07D307/87—Benzo [c] furans; Hydrogenated benzo [c] furans
  • C07D307/89—Benzo [c] furans; Hydrogenated benzo [c] furans with two oxygen atoms directly attached in positions 1 and 3
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  • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
  • C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
  • C07F5/02—Boron compounds
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  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/30—Low-molecular-weight compounds
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  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/30—Low-molecular-weight compounds
  • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
  • C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
  • C08G18/3821—Carboxylic acids; Esters thereof with monohydroxyl compounds
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
  • C08G59/4014—Nitrogen containing compounds
  • C08G59/4042—Imines; Imides
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
  • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
  • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
  • C08G73/16—Polyester-imides
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
  • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
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  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/10—Esters; Ether-esters
  • C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
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  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/16—Nitrogen-containing compounds
  • C08K5/20—Carboxylic acid amides
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  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L101/00—Compositions of unspecified macromolecular compounds
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  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
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  • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
  • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
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  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
  • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
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  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
  • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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  • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
  • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
  • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Definitions

• the present invention relates to an active ester compound that can be used in a curable resin composition having excellent heat resistance and dielectric properties. Moreover, this invention relates to the curable resin composition containing this active ester compound, the adhesive agent, adhesive film, circuit board, interlayer insulation material, and multilayer printed wiring board which use this curable resin composition.
• Curable resins such as epoxy resins that have low shrinkage and are excellent in adhesion, insulation, and chemical resistance are used in many industrial products.
• a curable resin composition used for an interlayer insulating material of a printed wiring board requires dielectric characteristics such as a low dielectric constant and a low dielectric loss tangent.
• Patent Documents 1 and 2 disclose curable resin compositions containing a curable resin and a compound having a specific structure as a curing agent. ing.
• such a curable resin composition has a problem that it has a high viscosity or it is difficult to achieve both heat resistance after curing and dielectric properties.
• An object of this invention is to provide the active ester compound which can be used for the curable resin composition excellent in heat resistance and a dielectric characteristic. Moreover, this invention provides the curable resin composition containing this active ester compound, the adhesive agent, adhesive film, circuit board, interlayer insulation material, and multilayer printed wiring board which use this curable resin composition. For the purpose.
• the present invention is an active ester compound having a structure represented by the following formulas (1-1) to (1-3) or the following formulas (2-1) to (2-3).
• R 1 is an optionally substituted aromatic group.
• R 2 represents an alkyl group having 1 to 12 carbon atoms or an optionally substituted aromatic group.
• A is an aliphatic dicarboxylic acid residue.
• B is an aliphatic diamine residue.
• R 1 is an optionally substituted aromatic group.
• R 2 represents an alkyl group having 1 to 12 carbon atoms or an optionally substituted aromatic group.
• A is an aliphatic tricarboxylic acid residue.
• B is an aliphatic triamine residue.
• the present inventors have found that by using an active ester compound having a specific structure as a curing agent, a curable resin composition having excellent heat resistance and dielectric properties can be obtained, and the present invention has been completed. .
• the active ester compound of the present invention has a structure represented by the above formulas (1-1) to (1-3) or the above formulas (2-1) to (2-3).
• A is an aliphatic dicarboxylic acid residue.
• B is an aliphatic diamine residue.
• A is an aliphatic tricarboxylic acid residue.
• B is an aliphatic triamine residue.
• the curable resin composition is cured.
• the flexibility and processability of the curable resin composition before curing can be improved.
• the active ester compound of the present invention has a structure such as the above aliphatic dicarboxylic acid residue and has an active ester group, the cured product of the resulting curable resin composition has a low dielectric constant and a low dielectric loss tangent. The dielectric properties are excellent.
• the above “residue” means the structure of a portion other than the functional group subjected to bonding.
• the “aliphatic dicarboxylic acid residue” means a structure other than the carboxy group in the aliphatic dicarboxylic acid. Means the structure of the part.
• the above “active ester group” means one having an electron withdrawing group such as an aromatic ring on the oxygen atom side derived from a hydroxyl group in an ester bond.
• the preferable lower limit of the carbon number of the aliphatic dicarboxylic acid residue, the aliphatic diamine residue, the aliphatic tricarboxylic acid residue, and the aliphatic triamine residue is 4.
• the curable resin composition obtained by having four or more carbon atoms in the aliphatic dicarboxylic acid residue, the aliphatic diamine residue, the aliphatic tricarboxylic acid residue, and the aliphatic triamine residue It is excellent in flexibility and workability before curing, and dielectric properties after curing.
• the more preferable lower limit of the number of carbon atoms of the aliphatic dicarboxylic acid residue, the aliphatic diamine residue, the aliphatic tricarboxylic acid residue, and the aliphatic triamine residue is 5, and the more preferable lower limit is 6. Further, there is no particular upper limit for the number of carbon atoms of the aliphatic dicarboxylic acid residue, the aliphatic diamine residue, the aliphatic tricarboxylic acid residue, and the aliphatic triamine residue, but the substantial upper limit is 90 It is.
• Examples of the substituent when the aliphatic dicarboxylic acid residue, the aliphatic diamine residue, the aliphatic tricarboxylic acid residue, and the aliphatic triamine residue are substituted include, for example, a halogen atom, a linear chain And linear or branched alkyl groups, linear or branched alkenyl groups, alicyclic groups, aryl groups, alkoxy groups, nitro groups, cyano groups and the like.
• Examples of the aliphatic dicarboxylic acid from which the aliphatic dicarboxylic acid residue is derived include dimers of aliphatic acids having 10 to 30 carbon atoms, such as oleic acid, linoleic acid, linolenic acid, palmitoleic acid, and elaidic acid. And dimer acid and hydrogenated dimer acid thereof.
• Examples of the aliphatic diamine from which the aliphatic diamine residue is derived include, for example, an aliphatic diamine derived from dimer acid, a linear or branched aliphatic diamine, an aliphatic ether diamine, and an aliphatic alicyclic. Examples include diamines. Examples of the aliphatic diamine derived from the dimer acid include dimer acid which is a dimer of an aliphatic acid having 10 to 30 carbon atoms such as oleic acid, linoleic acid, linolenic acid, palmitoleic acid, elaidic acid, and the like. Examples thereof include dimer diamine to be derived and hydrogenated dimer diamine.
• linear or branched aliphatic diamine examples include 1,4-butanediamine, 1,6-hexanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1, 11-undecanediamine, 1,12-dodecanediamine, 1,14-tetradecanediamine, 1,16-hexadecanediamine, 1,18-octadecanediamine, 1,20-eicosanediamine, 2-methyl-1,8-octane Examples include diamine, 2-methyl-1,9-nonanediamine, and 2,7-dimethyl-1,8-octanediamine.
• Examples of the aliphatic ether diamine include 2,2′-oxybis (ethylamine), 3,3′-oxybis (propylamine), 1,2-bis (2-aminoethoxy) ethane, and the like.
• Examples of the aliphatic alicyclic diamine include 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, cyclohexanediamine, methylcyclohexanediamine, and isophoronediamine.
• the aliphatic diamine is preferably an aliphatic diamine derived from the dimer acid.
• Examples of the aliphatic tricarboxylic acid from which the aliphatic tricarboxylic acid residue is derived include, for example, a trimer of an aliphatic acid having 10 to 30 carbon atoms such as oleic acid, linoleic acid, linolenic acid, palmitoleic acid, and elaidic acid. And trimer acid and hydrogenated trimer acid thereof.
• the aliphatic tricarboxylic acid may be used in the form of a mixture with the aliphatic dicarboxylic acid.
• Examples of the aliphatic triamine from which the aliphatic triamine residue is derived include an aliphatic trimeric triamine derived from trimer acid and a linear or branched aliphatic triamine.
• Examples of the aliphatic trimer triamine derived from the trimer acid include trimer acid which is a trimer of an aliphatic acid having 10 to 30 carbon atoms such as oleic acid, linoleic acid, linolenic acid, palmitoleic acid, elaidic acid and the like. Trimer triamines derived from the above and hydrogenated trimmer triamines thereof.
• linear or branched aliphatic triamine examples include 3,3′-diamino-N-methyldipropylamine, 3,3′-diaminodipropylamine, diethylenetriamine, bis (hexamethylene) triamine, 2,2 Examples include '-bis (methylamino) -N-methyldiethylamine.
• the aliphatic triamine is preferably an aliphatic trimeric triamine derived from the trimer acid.
• the aliphatic triamine may be used in a mixture with the aliphatic diamine.
• Examples of commercially available aliphatic dicarboxylic acids and / or aliphatic tricarboxylic acids include aliphatic dicarboxylic acids and / or aliphatic tricarboxylic acids manufactured by Claude Japan.
• Examples of the aliphatic dicarboxylic acid and / or the aliphatic tricarboxylic acid manufactured by Claude Japan include, for example, Pripol 1009, 1006, 1010, 1013, 1025, 1017, 1040, 1004, and the like.
• Examples of commercially available aliphatic diamines and / or aliphatic triamines include, for example, aliphatic diamines and / or aliphatic triamines manufactured by BASF, aliphatic diamines and / or fats manufactured by CLODA JAPAN. Group triamines and the like.
• Examples of the aliphatic diamine and / or aliphatic triamine manufactured by BASF include Versamine 551 and Versamine 552.
• Examples of aliphatic diamines and / or aliphatic triamines manufactured by Claude Japan include preamine 1071, preamine 1073, preamine 1074, preamine 1075, and the like.
• R 1 in the above formulas (1-1) and (1-2) and the above formulas (2-1) and (2-2) are substituted aromatic groups
• examples thereof include a halogen atom, a linear or branched alkyl group, a linear or branched alkenyl group, an alicyclic group, an aryl group, an alkoxy group, a nitro group, and a cyano group.
• R 1 in the above formulas (1-1) and (1-2) and the above formulas (2-1) and (2-2) is an optionally substituted phenyl group or an optionally substituted naphthyl. It is preferably a group or an anthracenyl group which may be substituted, and more preferably a phenyl group or a naphthyl group.
• R 2 in the above formula (1-3) and the above formula (2-3) is a substituted aromatic group
• substituents in the case where R 2 in the above formula (1-3) and the above formula (2-3) is a substituted aromatic group include, for example, a halogen atom, a linear or branched alkyl group, Examples include linear or branched alkenyl groups, alicyclic groups, aryl groups, alkoxy groups, nitro groups, cyano groups, and the like.
• R 2 in the above formula (1-3) and the above formula (2-3) is preferably an optionally substituted phenyl group, and more preferably a phenyl group.
• the active ester compound of the present invention has an imide bond in the main chain from the viewpoint of improving the glass transition temperature of the cured product of the resulting curable resin composition and being excellent in mechanical strength and heat resistance.
• Compounds represented by formulas (1-2), (1-3), (2-2), and (2-3) are preferred.
• the active ester compound of the present invention has a structure represented by the above formulas (1-1) to (1-3) or the above formulas (2-1) to (2-3) at a part of the ends. It may be present at all terminals.
• the structures represented by the above formulas (1-1) to (1-3) or the above formulas (2-1) to (2-3) are present at all ends, the crosslinking density is increased, and the present invention
• the active ester compound is used as a curing agent in a curable resin composition, the cured product has a higher glass transition temperature.
• the active ester group equivalent is When the active ester compound of the present invention is used as a curing agent in a curable resin composition, the content of the active ester compound of the present invention in the curable resin composition can be increased. As a result, the obtained cured product is excellent in dielectric properties such as low dielectric constant and low dielectric loss tangent.
• a crosslinkable functional group other than the active ester group As said other crosslinkable functional group, an amino group, a carboxy group, an acid anhydride group, a phenolic hydroxyl group, an unsaturated group, a maleimide group etc. are mentioned, for example.
• the minimum with a preferable molecular weight of the active ester compound of this invention is 400, and a preferable upper limit is 3000.
• a cured product obtained when the active ester compound of the present invention is used as a curing agent in a curable resin composition is excellent in heat resistance and dielectric properties.
• the minimum with more preferable molecular weight of the active ester compound of this invention is 500, and a more preferable upper limit is 2000.
• the “molecular weight” is a molecular weight obtained from the structural formula for a compound whose molecular structure is specified, but for a compound having a wide distribution of polymerization degree and a compound whose modification site is unspecified, It may be expressed using the number average molecular weight.
• the above-mentioned “number average molecular weight” is a value determined by polystyrene conversion after measurement using gel permeation chromatography (GPC) with tetrahydrofuran as a solvent.
• Examples of the column used when measuring the number average molecular weight in terms of polystyrene by GPC include JAIGEL-2H-A (manufactured by Nippon Analytical Industrial Co., Ltd.). Moreover, when the active ester compound of this invention is what is contained in the active ester composition mentioned later, the number average molecular weight of the active ester compound of this invention means what was measured about this active ester composition.
• the melting point is preferably 100 ° C. or lower, more preferably 80 ° C. or lower, and 60 ° C. More preferably, it is as follows.
• the lower limit of the melting point of the active ester compound of the present invention is not particularly limited, but is preferably liquid at normal temperature.
• fusing point of the active ester compound of this invention means what was measured about this active ester composition.
• the active ester compound of the present invention is specifically an active ester compound represented by the following formulas (3-1) to (3-3) or the following formulas (4-1) to (4-3). Preferably there is.
• R 1 is an optionally substituted aromatic group
• R 1 in the formulas (3-1) and (3-2) is These may be the same or different.
• R 2 is an alkyl group having 1 to 12 carbon atoms or an optionally substituted aromatic group, and may be the same or different.
• A is the aliphatic dicarboxylic acid residue.
• B is the aliphatic diamine residue.
• R 1 is an optionally substituted aromatic group
• R 1 in each formula of formulas (4-1) and (4-2) is These may be the same or different.
• R 2 is an alkyl group having 1 to 12 carbon atoms or an optionally substituted aromatic group, and may be the same or different.
• A is the aliphatic tricarboxylic acid residue.
• B is the aliphatic triamine residue.
• examples of the method for producing an active ester compound having a structure represented by the above formula (1-1) and / or the above formula (2-1) include, for example, the above aliphatic dicarboxylic acids. And / or a method of reacting the aliphatic tricarboxylic acid with a compound having a group represented by R 1 and a hydroxyl group.
• Examples of the compound having a group represented by R 1 and a hydroxyl group include phenol, o-cresol, m-cresol, p-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,5- Dimethylphenol, 2,6-dimethylphenol, 2-ethylphenol, 3-ethylphenol, 4-ethylphenol, 4-tert-butylphenol, 1-naphthol, 2-naphthol, 2-methyl-1-naphthol, 3-methyl Examples include 1-naphthol, 4-methyl-1-naphthol, 1-anthracenol, 2-anthracenol, 3-anthracenol, 4-anthracenol and the like. Of these, phenol, 1-naphthol and 2-naphthol are preferable.
• a method for producing an active ester compound having a structure represented by the above formula (1-2) and / or the above formula (2-2) is not particularly limited.
• the method etc. are mentioned. That is, after reacting trimellitic anhydride with the aliphatic diamine and / or the aliphatic triamine, a method of further reacting the group represented by R 1 and the compound having a hydroxyl group can be used.
• each amine compound is dissolved in advance in a solvent in which an amic acid obtained by the reaction is soluble (for example, N-methylpyrrolidone or the like). Trimellitic anhydride is added to the obtained solution and reacted to obtain an amic acid solution. The obtained reaction solution is dropped into pure water, and the precipitate is collected by filtration. The obtained precipitate is heated at 230 ° C. for 2 hours to imidize to obtain an imide compound. Next, the imide compound is dissolved in a dehydrated solvent (for example, terahydrofuran or the like).
• a dehydrated solvent for example, terahydrofuran or the like.
• a method for producing an active ester compound having a structure represented by the above formula (1-3) and / or the above formula (2-3) is not particularly limited. Methods and the like. That is, after reacting 4-hydroxyphthalic anhydride with the aliphatic diamine and / or the aliphatic triamine, a carboxylic acid having a group represented by R 2 or a halide or anhydride thereof is further reacted. The method can be used.
• a method for producing an active ester compound having a structure represented by the above formula (1-3) and / or the above formula (2-3) is not particularly limited, but specific examples are shown below.
• a solvent for example, tetrahydrofuran or the like
• 4-Hydroxyphthalic acid is added to the resulting solution, and a dehydrating condensing agent (for example, N, N′-dicyclohexylcarbodiimide and the like) and a catalyst (for example, triethylamine) are added and reacted.
• the solvent is removed from the resulting solution by heating, decompression, etc., and then imidation is carried out by heating at 230 ° C. for 2 hours to obtain an imide compound.
• the imide compound is dissolved in a dehydrated solvent (for example, terahydrofuran or the like).
• a dehydrated solvent for example, terahydrofuran or the like.
• a carboxylic acid having a group represented by R 2 or a halide or anhydride thereof, a dehydration condensing agent (for example, N, N′-dicyclohexylcarbodiimide), a catalyst (for example, triethylamine), or the like is added to the obtained solution. To heat the esterification reaction.
• Examples of the carboxylic acid having a group represented by R 2 or a halide or anhydride thereof include, for example, benzoic acid, acetic acid, propionic acid, butyric acid, isobutyric acid, valeric acid, isovaleric acid, pivalic acid, and these Halides, anhydrides, and the like.
• the active ester compound of the present invention is obtained as contained in a mixture (active ester composition) of a plurality of types of active ester compounds and raw materials.
• the active ester composition contains an active ester compound having an imide bond
• the active ester composition has an imidization ratio of 70% or more, and therefore, mechanical strength at high temperature when used as a curing agent. Further, a cured product that is superior in long-term heat resistance can be obtained.
• a preferable lower limit of the imidation ratio of the active ester composition is 75%, and a more preferable lower limit is 80%. Further, there is no particular upper limit for the imidation ratio of the active ester composition, but the substantial upper limit is 98%.
• the “imidation ratio” is measured by a total reflection measurement method (ATR method) using a Fourier transform infrared spectrophotometer (FT-IR), and is 1660 cm ⁇ 1 derived from the carbonyl group of amic acid. It can derive
• a curable resin composition containing a curable resin and a curing agent containing the active ester compound of the present invention is also one aspect of the present invention.
• the curable resin composition of the present invention is excellent in heat resistance and dielectric properties by containing the active ester compound of the present invention.
• curing agent containing the active ester compound of this invention is 5 weight part, and a preferable upper limit is 80 weight part.
• the content of the active ester compound of the present invention is within this range, the resulting curable resin composition is more excellent in heat resistance and dielectric properties.
• the minimum with more preferable content of the active ester compound of this invention is 10 weight part, and a more preferable upper limit is 70 weight part.
• content of the active ester compound of this invention means content of this active ester composition.
• the curable resin composition of the present invention contains other curing agent in addition to the active ester compound of the present invention within a range not impairing the object of the present invention in order to improve processability in an uncured state. May be.
• the other curing agents include phenolic curing agents, thiol curing agents, amine curing agents, acid anhydride curing agents, cyanate curing agents, and other active ester compounds other than the active ester compound of the present invention.
• examples thereof include a curing agent.
• active ester-based curing agents and cyanate-based curing agents other than the active ester compound of the present invention are preferable.
• the curable resin composition of the present invention contains a curable resin.
• the curable resin include epoxy resin, cyanate resin, phenol resin, imide resin, maleimide resin, benzoxazine resin, silicone resin, acrylic resin, and fluorine resin.
• the curable resin preferably includes at least one selected from the group consisting of epoxy resins, cyanate resins, phenol resins, imide resins, maleimide resins, and benzoxazine resins, and includes epoxy resins. Is more preferable.
• the said curable resin may be used independently and 2 or more types may be used in combination.
• the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, 2,2′-diallyl bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin. , Propylene oxide-added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, naphthylene ether Type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, dicyclopentadiene novolak type epoxy resin, biff Nirunoborakku type epoxy resins, naphthalene phenol novolac-type epoxy resin, glycidyl amine type epoxy resin, alkyl polyol type epoxy resin, rubber-modified epoxy resins, glycidyl ester compounds.
• biphenyl novolac type epoxy resins are preferable because they have a high glass transition point after curing and a low dielectric loss tangent.
• the curable resin composition of the present invention preferably contains a curing accelerator.
• a curing accelerator By containing the said hardening accelerator, hardening time can be shortened and productivity can be improved.
• the curing accelerator examples include imidazole-based curing accelerators, tertiary amine-based curing accelerators, phosphine-based curing accelerators, photobase generators, sulfonium salt-based curing accelerators, and the like. Among these, from the viewpoint of storage stability and curability, imidazole-based curing accelerators and phosphine-based curing accelerators are preferable.
• the said hardening accelerator may be used independently and 2 or more types may be used in combination.
• the preferable lower limit of the content of the curing accelerator in the total of the curable resin, the curing agent, and the curing accelerator is 0.5% by weight.
• the minimum with more preferable content of the said hardening accelerator is 1 weight%.
• the preferable upper limit of the content of the curing accelerator is 10% by weight, and the more preferable upper limit is 6% by weight.
• the curable resin composition of the present invention preferably contains an inorganic filler.
• the curable resin composition of the present invention is superior in moisture absorption reflow resistance, plating resistance, and processability while maintaining excellent adhesiveness and long-term heat resistance.
• the inorganic filler is preferably at least one of silica and barium sulfate.
• the curable resin composition of the present invention is superior in moisture absorption reflow resistance, plating resistance, and processability.
• Examples of other inorganic fillers other than the silica and the barium sulfate include alumina, aluminum nitride, boron nitride, silicon nitride, glass powder, glass frit, glass fiber, carbon fiber, and an inorganic ion exchanger.
• the said inorganic filler may be used independently and 2 or more types may be used in combination.
• the preferable lower limit of the average particle diameter of the inorganic filler is 50 nm, and the preferable upper limit is 4 ⁇ m.
• the average particle diameter of the inorganic filler is within this range, the resulting curable resin composition is more excellent in applicability and workability.
• the minimum with a more preferable average particle diameter of the said inorganic filler is 100 nm, and a more preferable upper limit is 3 micrometers.
• a preferable minimum is 10 weight part and a preferable upper limit is 400 weight part with respect to a total of 100 weight part of curable resin compositions except this solvent.
• the content of the inorganic filler is within this range, the resulting curable resin composition is more excellent in moisture absorption reflow resistance, plating resistance, and workability.
• the minimum with more preferable content of the said inorganic filler is 20 weight part.
• the curable resin composition of the present invention may contain a flow regulator for the purpose of improving the wettability and shape retention of the adherend in a short time.
• a flow regulator for the purpose of improving the wettability and shape retention of the adherend in a short time.
• the flow regulator include fumed silica such as Aerosil, layered silicate, and the like.
• the said flow regulator may be used independently and 2 or more types may be used in combination.
• a thing with an average particle diameter of less than 100 nm is used suitably.
• the content of the flow modifier is based on 100 parts by weight of the total of the curable resin and the curing agent (in the case of containing the curing accelerator described above, the curable resin, the curing agent, and the curing accelerator).
• a preferred lower limit is 0.1 parts by weight and a preferred upper limit is 50 parts by weight.
• the minimum with more preferable content of the said flow regulator is 0.5 weight part, and a more preferable upper limit is 30 weight part.
• the curable resin composition of the present invention may contain an organic filler for the purpose of relaxing stress, imparting toughness, and the like.
• organic filler examples include silicone rubber particles, acrylic rubber particles, urethane rubber particles, polyamide particles, polyamideimide particles, polyimide particles, benzoguanamine particles, and core-shell particles thereof. Of these, polyamide particles, polyamideimide particles, and polyimide particles are preferable.
• the said organic filler may be used independently and 2 or more types may be used in combination.
• a preferable upper limit is 300 weight part with respect to a total of 100 weight part of curable resin compositions except this solvent.
• the content of the organic filler is within this range, the cured product of the obtained curable resin composition is excellent in toughness and the like while maintaining excellent adhesiveness and the like.
• the upper limit with more preferable content of the said organic filler is 200 weight part.
• the curable resin composition of the present invention may contain a flame retardant.
• the flame retardant include metal hydrates such as boehmite type aluminum hydroxide, aluminum hydroxide, and magnesium hydroxide, halogen compounds, phosphorus compounds, nitrogen compounds, and the like. Of these, boehmite type aluminum hydroxide is preferable.
• the said flame retardant may be used independently and 2 or more types may be used in combination.
• the content of the flame retardant is preferable with respect to a total of 100 parts by weight of the curable resin and the curing agent (when the above-described curing accelerator is included, the curable resin, the curing agent, and the curing accelerator).
• the lower limit is 5 parts by weight, and the preferred upper limit is 200 parts by weight.
• the content of the flame retardant is within this range, the obtained curable resin composition has excellent flame retardancy while maintaining excellent adhesiveness and the like.
• the minimum with more preferable content of the said flame retardant is 10 weight part, and a more preferable upper limit is 150 weight part.
• the curable resin composition of the present invention may contain a thermoplastic resin as long as the object of the present invention is not impaired.
• the curable resin composition of the present invention is superior in flow characteristics, more easily satisfies both filling property and leaching prevention property during thermocompression bonding, and bend resistance after curing. It becomes more excellent by the property.
• thermoplastic resin examples include polyimide resin, phenoxy resin, polyamide resin, polyamideimide resin, and polyvinyl acetal resin. Of these, polyimide resins and phenoxy resins are preferable from the viewpoint of heat resistance and handling properties.
• the said thermoplastic resin may be used independently and 2 or more types may be used in combination.
• the preferable lower limit of the number average molecular weight of the thermoplastic resin is 3000, and the preferable upper limit is 100,000.
• the number average molecular weight of the thermoplastic resin is in this range, the resulting curable resin composition is excellent in flow characteristics and bending resistance after curing.
• the minimum with a more preferable number average molecular weight of the said thermoplastic resin is 5000, and a more preferable upper limit is 50,000.
• the content of the thermoplastic resin is 100 parts by weight in total of the curable resin and the curing agent (in the case of containing the above-described curing accelerator, the curable resin, the curing agent, and the curing accelerator).
• a preferred lower limit is 2 parts by weight and a preferred upper limit is 60 parts by weight.
• the content of the thermoplastic resin is 2 parts by weight or more, the obtained curable resin composition is excellent in flow characteristics and bending resistance after curing.
• the content of the thermoplastic resin is 60 parts by weight or less, the resulting curable resin composition is more excellent in adhesiveness and heat resistance.
• the minimum with more preferable content of the said thermoplastic resin is 3 weight part, and a more preferable upper limit is 50 weight part.
• the curable resin composition of the present invention may contain a solvent from the viewpoint of coatability and the like.
• the solvent is preferably a nonpolar solvent having a boiling point of 160 ° C. or lower or an aprotic polar solvent having a boiling point of 160 ° C. or lower from the viewpoints of coating properties and storage stability.
• examples of the nonpolar solvent having a boiling point of 160 ° C. or lower or the aprotic polar solvent having a boiling point of 160 ° C. or lower include, for example, ketone solvents, ester solvents, hydrocarbon solvents, halogen solvents, ether solvents, nitrogen-containing solvents. System solvents and the like.
• Examples of the ketone solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone.
• Examples of the ester solvent include methyl acetate, ethyl acetate, and isobutyl acetate.
• Examples of the hydrocarbon solvent include benzene, toluene, normal hexane, isohexane, cyclohexane, methylcyclohexane, normal heptane, and the like.
• Examples of the halogen-based solvent include dichloromethane, chloroform, trichloroethylene, and the like.
• ether solvent examples include diethyl ether, tetrahydrofuran, 1,4-dioxane, 1,3-dioxolane and the like.
• nitrogen-containing solvent examples include acetonitrile.
• it comprises a ketone solvent having a boiling point of 60 ° C. or higher, an ester solvent having a boiling point of 60 ° C. or higher, and an ether solvent having a boiling point of 60 ° C. or higher. At least one selected from the group is preferred.
• solvents examples include methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl acetate, isobutyl acetate, 1,4-dioxane, 1,3-dioxolane, tetrahydrofuran and the like.
• boiling point means a value measured under the condition of 101 kPa or a value converted to 101 kPa in a boiling point conversion chart or the like.
• the minimum with preferable content of the said solvent in the curable resin composition of this invention is 15 weight%, and a preferable upper limit is 80 weight%.
• the content of the solvent is within this range, the curable resin composition of the present invention is more excellent in coatability and the like.
• a more preferable lower limit of the content of the solvent is 20% by weight, and a more preferable upper limit is 70% by weight.
• the curable resin composition of the present invention may contain a reactive diluent as long as the object of the present invention is not impaired.
• a reactive diluent a reactive diluent having two or more reactive functional groups in one molecule is preferable from the viewpoint of adhesion reliability.
• the curable resin composition of the present invention may further contain additives such as a coupling agent, a dispersant, a storage stabilizer, a bleed inhibitor, a flux agent, and a leveling agent.
• additives such as a coupling agent, a dispersant, a storage stabilizer, a bleed inhibitor, a flux agent, and a leveling agent.
• the curable resin composition of the present invention for example, using a mixer such as a homodisper, a universal mixer, a Banbury mixer, a kneader, the curable resin, the active ester compound of the present invention, and the necessary The method etc. which mix with the solvent etc. which are added according to it are mentioned.
• a mixer such as a homodisper, a universal mixer, a Banbury mixer, a kneader, the curable resin, the active ester compound of the present invention, and the necessary The method etc. which mix with the solvent etc. which are added according to it are mentioned.
• the curable resin composition of the present invention can be applied to a substrate film and dried to obtain a curable resin composition film comprising the curable resin composition of the present invention.
• a cured product can be obtained by curing the product film.
• the glass transition temperature before curing is preferably 0 ° C. or higher and lower than 50 ° C. When the glass transition temperature before curing is within this range, the curable resin composition of the present invention is more excellent in workability.
• the more preferable lower limit of the glass transition temperature before curing is 5 ° C, and the more preferable upper limit is 40 ° C.
• the “glass transition temperature before curing” refers to a curable resin composition (not including a solvent) at a rate of temperature increase of 10 ° C./min using a differential scanning calorimeter (DSC). It can obtain
• the glass transition temperature before curing is measured for the curable resin film having a thickness of 400 ⁇ m.
• cured material is 100 degreeC or more and less than 250 degreeC.
• the cured product of the present invention is superior in mechanical strength and long-term heat resistance.
• cured material is 120 degreeC, and a more preferable upper limit is 230 degreeC.
• the above-mentioned “glass transition temperature of the cured product” is from ⁇ 0 ° C. to 300 ° C. using a dynamic viscoelasticity measuring device at a temperature rising rate of 10 ° C./min, a frequency of 10 Hz, and a chuck distance of 24 mm.
• the cured product for measuring the glass transition temperature can be obtained by heating the curable resin composition film having a thickness of 400 ⁇ m at 190 ° C. for 30 minutes.
• cured material is 3.4 N / cm or more.
• the curable resin composition of the present invention can be suitably used as an adhesive for a coverlay of a flexible printed circuit board.
• the initial adhesive strength of the cured product to polyimide is more preferably 5 N / cm or more, and further preferably 6 N / cm or more.
• the initial adhesive force with respect to the said polyimide is measured as peeling strength at the time of T-shaped peeling at 25 ° C.
• the said initial adhesive force is Means a value measured within 24 hours after the preparation of the test piece.
• the curable resin composition film can be obtained by coating the curable resin composition on a base film and drying it.
• Kapton 200H manufactured by Toray DuPont, surface roughness 0.03 to 0.07 ⁇ m
• Examples of the tensile tester include UCT-500 (manufactured by ORIENTEC).
• the adhesive strength of the cured product to polyimide after storage at 200 ° C. for 100 hours is preferably 0.8 times or more than the initial adhesive strength.
• the curable resin composition of the present invention is suitable for a heat-resistant adhesive because the adhesive strength of the cured product after being stored at 200 ° C. for 100 hours is not less than 0.8 times the initial adhesive strength. Can be used.
• the adhesive strength of the cured product after being stored at 200 ° C. for 100 hours to the polyimide is more preferably 0.85 times or more, and further preferably 0.9 times or more than the initial adhesive strength.
• cured material after storing for 100 hours at the said 200 degreeC is 25 degreeC after storing the test piece produced like the measuring method of the initial stage adhesive force mentioned above for 100 hours at 200 degreeC. It means a value measured by the same method as the initial adhesive force within 24 hours after cooling.
• the preferable upper limit of dielectric loss tangent at 23 ° C. of the cured product is 0.0045.
• the curable resin composition of the present invention can be suitably used for an interlayer insulating material such as a multilayer printed wiring board.
• the upper limit of the dielectric loss tangent at 23 ° C. of the cured product is more preferably 0.0040, and still more preferably 0.0035.
• the “dielectric loss tangent” is a value measured under the condition of 1.0 GHz using a dielectric constant measuring device and a network analyzer.
• the cured product for measuring the “dielectric loss tangent” can be obtained by heating the curable resin composition film having a thickness of 40 to 200 ⁇ m at 190 ° C. for 90 minutes.
• the curable resin composition of the present invention can be used for a wide range of applications, it can be suitably used for applications for electronic materials that require particularly high heat resistance.
• it can be used for die attach agents in aviation, in-vehicle electric control unit (ECU) applications, power device applications using SiC, and GaN.
• ECU electric control unit
• power overlay package adhesives, printed wiring board adhesives, flexible printed circuit board coverlay adhesives, copper-clad laminates, semiconductor bonding adhesives, interlayer insulation materials, prepregs, LED sealing It can also be used for adhesives and adhesives for structural materials. Especially, it is used suitably for an adhesive agent use.
• An adhesive containing the curable resin composition of the present invention is also one aspect of the present invention.
• the curable resin film can be suitably used as an adhesive film.
• An adhesive film using the curable resin composition of the present invention is also one aspect of the present invention.
• a circuit board having a cured product of the curable resin composition is also one aspect of the present invention.
• the curable resin composition of the present invention can be suitably used for an interlayer insulating material such as a multilayer printed wiring board because the cured product has a low dielectric constant and a low dielectric loss tangent and is excellent in dielectric properties.
• An interlayer insulating material using the curable resin composition of the present invention is also one aspect of the present invention.
• it has a circuit board, a plurality of insulating layers disposed on the circuit board, and a metal layer disposed between the plurality of insulating layers, and the insulating layer is a cured product of the interlayer insulating material of the present invention.
• a multilayer printed wiring board comprising the above is also one aspect of the present invention.
• the active ester compound which can be used for the curable resin composition excellent in heat resistance and a dielectric characteristic can be provided.
• a curable resin composition containing the active ester compound, an adhesive using the curable resin composition, an adhesive film, a circuit board, an interlayer insulating material, and a multilayer printed wiring board. can be provided.
• the esterification reaction was allowed to proceed by adding and stirring at 25 ° C. for 12 hours. After the reaction, the precipitate was removed by filtration, and tetrahydrofuran was removed from the resulting solution with an evaporator. Further, after washing with pure water, vacuum drying was performed to obtain an active ester composition A.
• the active ester composition A is an active ester compound having a structure represented by the above formula (3-1) (R 1 is a phenyl group, A is Dimer acid residue). The number average molecular weight of the active ester composition A was 560.
• the active ester composition A was liquid at room temperature.
• the esterification reaction was allowed to proceed by adding and stirring at 25 ° C. for 12 hours. After the reaction, the precipitate was removed by filtration, and tetrahydrofuran was removed from the resulting solution with an evaporator. Further, after washing with pure water, vacuum drying was performed to obtain an active ester composition B.
• the active ester composition B is an active ester compound having a structure represented by the above formula (4-1) (R 1 is a phenyl group, A is It was confirmed that it contains a trimer acid residue. The number average molecular weight of the active ester composition B was 735.
• the active ester composition B was liquid at room temperature.
• the obtained precipitate was heated at 230 ° C. for 2 hours for imidization.
• 45.2 parts by weight of the imide compound obtained above was dissolved in 200 parts by weight of tetrahydrofuran (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.).
• 9.4 parts by weight of phenol manufactured by Tokyo Chemical Industry Co., Ltd.
• 20.6 parts by weight of dicyclohexylcarbodiimide manufactured by Tokyo Chemical Industry Co., Ltd.
• 1 part by weight of triethylamine manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.
• the esterification reaction was allowed to proceed by stirring at 25 ° C. for 12 hours.
• the active ester composition C is an active ester compound having a structure represented by the above formula (3-2) (R 1 is a phenyl group, B is It was confirmed to contain a dimer diamine residue). The number average molecular weight of the active ester composition C was 1070. The active ester composition C was semisolid at room temperature.
• the active ester composition D contains an active ester compound having a structure represented by the above formula (4-2) (R 1 is a phenyl group, and B is a trimmer triamine residue).
• the number average molecular weight of the active ester composition D was 1150.
• the active ester composition D was liquid at room temperature.
• the number average molecular weight of the active ester composition E was 1050.
• the active ester composition E was solid at room temperature.
• the melting point of the active ester composition E measured as a temperature of the endothermic peak when the temperature was raised at 10 ° C./min using a differential scanning calorimeter (“EXTEAR DSC6100” manufactured by SII Nano Technology) was 50 ° C. Met.
• the active ester composition H is an active ester compound having a structure represented by the above formula (3-3) (R 2 is a phenyl group, B is It was confirmed to contain a dimer diamine residue). The number average molecular weight of the active ester composition H was 1070. The active ester composition H was liquid at room temperature.
• the portion corresponding to R 1 in the above formula (3-1) was a phenyl group, and the portion corresponding to A was an isophthalic acid residue.
• the number average molecular weight of the active ester composition I was 320.
• the active ester composition I was solid at room temperature.
• the melting point of the active ester composition I measured in the same manner as in Synthesis Example 5 was 140 ° C.
• the portion corresponding to R 1 in the above formula (3-2) is a phenyl group, and the portion corresponding to B is 1,3-bis (4-aminophenoxy) benzene residue. It was a group.
• the number average molecular weight of the active ester composition J was 730.
• the active ester composition J was solid at room temperature.
• the melting point of the active ester composition J measured in the same manner as in Synthesis Example 5 was 120 ° C.
• the portion corresponding to R 2 in the above formula (3-3) is a phenyl group, and the portion corresponding to B is 1,3-bis (4-aminophenoxy) benzene residue. It was a group.
• the number average molecular weight of the active ester composition K was 730.
• the active ester composition K was solid at room temperature.
• the melting point of the active ester composition K measured in the same manner as in Synthesis Example 5 was 110 ° C.
• Examples 1 to 8, Comparative Examples 1 to 3 50 parts by weight of methyl ethyl ketone was added as a solvent to each material having the blending ratio shown in Table 1, and the mixture was stirred at 1200 rpm for 4 hours using a stirrer to obtain a curable resin composition.
• the composition of Table 1 it described about solid content except a solvent.
• the obtained curable resin composition was coated on the release-treated surface of a PET film (“XG284” manufactured by Toray Industries, Inc., thickness 25 ⁇ m). Thereafter, the curable resin composition film having a PET film and a curable resin composition layer having a thickness of 40 ⁇ m on the PET film by drying in a gear oven at 100 ° C. for 5 minutes and volatilizing the solvent.
• the base PET film was peeled from each curable resin composition film obtained in Examples and Comparative Examples, and a curable resin composition layer was laminated using a laminator to obtain an uncured product.
• the obtained uncured product has an endotherm when it is heated at a rate of 10 ° C./min in a temperature range of ⁇ 50 to 150 ° C. using a differential scanning calorimeter (“EXTEAR DSC6100” manufactured by SII Nano Technology).
• the inflection point was determined as the glass transition temperature of the uncured product.
• the glass transition temperature of the uncured product is less than 25 ° C., “ ⁇ ”, when it is less than 50 ° C. and 25 ° C. or more, “ ⁇ ”, and when it is 50 ° C. or more, “ ⁇ ”, uncured
• the glass transition temperature of the product was evaluated.
• the substrate PET film was peeled from each curable resin composition film obtained in Examples and Comparative Examples, and the curable resin composition layer was laminated using a laminator, and then cured by heating at 190 ° C. for 1 hour.
• a cured product having a thickness of 400 ⁇ m was obtained.
• the temperature increase rate was 10 degree-C / min, the frequency was 10 Hz, and the distance between chuck
• the glass transition temperature is 170 ° C. or higher, “ ⁇ ”, when less than 170 ° C. is 150 ° C. or higher,“ ⁇ ”, when less than 150 ° C. is 100 ° C. or higher,“ ⁇ ”, 100 ° C. When it was less than “x”, the glass transition temperature was evaluated.
• Each curable resin composition film obtained in the examples and comparative examples was cut into a size of 2 mm in width and 80 mm in length, and five sheets were stacked to obtain a laminate having a thickness of 200 ⁇ m.
• the obtained laminate was heated at 190 ° C. for 90 minutes to obtain a cured body.
• a cavity resonance perturbation method dielectric constant measuring device CP521 manufactured by Kanto Electronics Application Development Co., Ltd.
• a network analyzer N5224A PNA manufactured by Keysight Technology Co., Ltd.
• the dielectric loss tangent was measured at 0 GHz.
• the case where the dielectric loss tangent is 0.0035 or less is “ ⁇ ”, the case where it exceeds 0.0035 and 0.0040 or less is “ ⁇ ”, and the case where it exceeds 0.0040 and 0.0045 or less is “ ⁇ ”.
• the dielectric properties were evaluated with “ ⁇ ” when the value exceeded 0.0045.
• the active ester compound which can be used for the curable resin composition excellent in heat resistance and a dielectric characteristic can be provided.
• a curable resin composition containing the active ester compound, an adhesive using the curable resin composition, an adhesive film, a circuit board, an interlayer insulating material, and a multilayer printed wiring board. can be provided.

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