WO2019213789A1 - Matériau en alliage de cuivre et son utilisation - Google Patents

Matériau en alliage de cuivre et son utilisation Download PDF

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WO2019213789A1
WO2019213789A1 PCT/CN2018/000211 CN2018000211W WO2019213789A1 WO 2019213789 A1 WO2019213789 A1 WO 2019213789A1 CN 2018000211 W CN2018000211 W CN 2018000211W WO 2019213789 A1 WO2019213789 A1 WO 2019213789A1
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copper alloy
alloy
alloy material
bending
strength
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PCT/CN2018/000211
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English (en)
Chinese (zh)
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杨朝勇
李建刚
杨泰胜
赵红彬
周耀华
周银银
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宁波博威合金材料股份有限公司
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Publication of WO2019213789A1 publication Critical patent/WO2019213789A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the invention relates to the technical field of copper alloys, in particular to a copper alloy material with excellent yield strength, electrical conductivity and stress relaxation resistance and good bending processing performance, and can be applied to connectors, relays, switches, sockets, lead frames and the like.
  • terminal consumer electronic devices have been developed to be smaller, thinner, and lighter, and components such as terminals and connectors used are smaller and have smaller electrode spacing. Due to such miniaturization, the materials used are also made thinner, but the connection force required for the connection is not lowered from the viewpoint of connection reliability, which is a property of material strength, electrical conductivity, and stress relaxation resistance. And bending processing performance put forward higher requirements.
  • the material cost, and the conductivity of phosphor bronze is low, only 20% IACS or less, can not match the demand for high conductivity, and has certain limitations on the application of phosphor bronze.
  • Bronze bronze is prone to highly toxic substances in the production process and is expensive. Therefore, it is generally only used in some military fields where elasticity and strength are required.
  • copper-nickel-silicon alloy is developed to replace beryllium bronze, but its cost is much higher than that of phosphor bronze. It is usually used in the field of high-end connectors requiring strength ⁇ 650 MPa and conductivity ⁇ 40% IACS.
  • the present invention uses Cu-Zn-Sn as a matrix, and adds elements such as Ni, Si, and P, and combines solid solution strengthening and age strengthening to achieve a low cost and a yield strength of ⁇ 600 MPa. Copper alloy material with conductivity ⁇ 30% IACS and stress relaxation resistance and good bending performance.
  • the technical problem to be solved by the present invention is to provide a low-cost copper alloy material and an application thereof according to the deficiencies of the prior art, the copper alloy material has a yield strength of ⁇ 600 MPa, a conductivity of ⁇ 30% IACS, and excellent bending workability. (R/t ⁇ 1 in the GW direction, R/t ⁇ 2 in the BW direction), excellent stress relaxation resistance (1000 hours at 150 ° C, residual stress ⁇ 70%), and can simultaneously satisfy connectors and relays.
  • the demand for copper alloy materials in many industries such as switches, sockets, and lead frames.
  • a copper alloy material the weight percentage composition of the copper alloy comprises: 5.01 to 15.0 wt% of Zn, 0.1 to 3.0 wt% of Ni, 0.1 to 2.0 wt% Sn, 0.01 to 0.5 wt% of Si, 0.01 to 0.25 wt% of P, 0 to 0.2 wt% of Mg, 0 to 0.3 wt% of Fe, and the balance being Cu and unavoidable impurities.
  • the copper alloy material of the present invention is added with 5.01 to 15.0% by weight of Zn.
  • Zn has an effect of improving the strength and elasticity of the material, and Zn also has a remarkable effect on improving the casting properties, the weldability, the peeling resistance of the plating layer, and the Sn adhesion.
  • the Zn content is more than 15.0% by weight, the adverse effect on the conductivity of the material is greatly enhanced.
  • the Zn content is less than 5.01% by weight, the promotion effect on the work hardening of the alloy is not good. Therefore, the present invention controls the content of Zn to be 5.01 to 15.0% by weight.
  • the copper alloy material of the invention is added with a certain amount of Ni, Ni can enhance the strength of the matrix by solid solution strengthening, but the more important role of Ni in the copper alloy of the invention is to form the Ni-Si phase and the Ni-P phase simultaneously with Si and P, By utilizing the mutual synergy of the Ni-Si phase and the Ni-P phase, the yield strength and bending processability of the material are improved under the condition of ensuring the conductivity of the material. Therefore, in order to sufficiently form Ni, Si, and P to form a desired compound, the amount of Ni added should not be less than 0.1% by weight, and when the Ni content is more than 3.0% by weight, the alloy may be bulky during the casting process.
  • the present invention controls the content of Ni to be 0.1 to 3.0% by weight.
  • Sn makes the copper alloy of the invention have better work hardening effect in the subsequent processing, and the work hardening increases the energy storage in the deformed copper alloy, and is favorable for forming more Ni-Si, Ni in the aging process. a nucleation point precipitated by a compound such as -P, thereby achieving an effect of improving the uniform distribution of the compound.
  • Sn can also increase the thermal stability of the alloy and further improve the stress relaxation resistance of the alloy.
  • Sn can also increase the corrosion resistance of the alloy and improve the reliability of downstream products such as connectors prepared in wet and corrosive media.
  • the present invention controls the content of Sn to be 0.1 to 2.0% by weight.
  • the addition of Si to the copper alloy material of the invention is used to improve the casting fluidity of the alloy, reduce the oxidation of the copper liquid during the casting process, and improve the molding performance; on the other hand, Si can form a Ni-Si precipitate phase with Ni, thereby Dislocations act as pinning, slowing the recrystallization process of the grains, refining the grains, and increasing the strength of the copper alloy.
  • the addition amount of Si is less than 0.01% by weight, an effective Ni-Si precipitate phase cannot be formed, and when the addition amount of Si exceeds 0.5% by weight, the adverse effect on the conductivity of the alloy is increased, and therefore, the present invention controls the content of Si. It is 0.01 to 0.5% by weight.
  • the P added to the copper alloy material of the present invention is used as a deaerator and a deoxidizer on the one hand, and forms a complex Ni-P precipitate phase with Ni on the other hand, and utilizes the characteristics of the precipitated phase particles to have high thermal stability and is less likely to be decomposed. Dislocation motion and migration of grain boundaries enhance the alloy.
  • the amount of P added is less than 0.01% by weight, an effective compound cannot be formed, and the addition amount exceeds 0.25 wt%, which not only increases the adverse effect on conductivity, but also tends to cause hot rolling cracking and increase casting difficulty, so the content of P is increased.
  • the control is in the range of 0.01 to 0.25 wt%.
  • Mg has the effects of deoxidation, desulfurization and improving the stress relaxation resistance of the alloy, and has little effect on the electrical conductivity of the alloy. It can also improve the work hardening effect of the alloy to a certain extent, and the work hardening effect when the alloy is aged. The improvement is beneficial to increase the energy storage in the material and improve the nucleation point when the compound is precipitated. However, if the Mg content is too large, the casting property and the bending workability of the alloy are liable to be lowered. Therefore, the present invention controls the Mg content in the alloy to be 0.2 wt% or less.
  • Fe has the effect of refining the copper alloy grains and increasing the high temperature strength of the copper alloy, and at the same time forms a Fe-P precipitation phase with P.
  • the Fe content is more than 0.3% by weight, the adverse effect on the electrical conductivity of the material is increased, so that the Fe content in the alloy is controlled to 0.3 wt% or less.
  • the weight percentage of Ni, Si, and P satisfies: 3 ⁇ Ni / (P + Si) ⁇ 7, and the weight percentage of Si and P satisfies: 0.1 ⁇ Si / P ⁇ 10.
  • the present invention simultaneously adds elements such as Ni, Si, Sn, and P to a Cu-Zn-Sn substrate, and generates a Ni-Si precipitate phase and a Ni-P precipitate phase by controlling a distribution ratio between Ni, Si, and P, and It is dispersed in the material, and the synergistic action of the Ni-Si phase and the Ni-P phase improves the strength and bending performance of the material without reducing the conductivity of the material.
  • the present invention selects Cu-Zn- The Sn matrix can reduce the material cost while meeting the performance requirements, and because it contains elements such as Sn, Ni, Si, etc., it also provides more advantages for the recycling of other copper alloy scrap.
  • the present invention simultaneously utilizes the synergistic effect between the Ni-Si precipitate phase and the Ni-P precipitate phase.
  • the synergistic effect is mainly due to the difference in precipitation thermodynamics and kinetic factors between the Ni-Si precipitated phase and the Ni-P precipitated phase, that is, the Ni-P precipitated phase tends to have a good precipitation effect at a temperature of 420 ° C, while Ni- The Si precipitated phase tends to have a better precipitation effect above 440 ° C, so that the precipitated Ni-P precipitated phase occupies a precipitation point with high energy storage and vacancy, so that the alloy is formed separately from the Ni-Si phase alone.
  • the invention can suppress the precipitation segregation of the Ni-Si precipitate phase, improve the distribution uniformity of the Ni-Si precipitate phase, and play an important role in improving the yield strength and bending workability of the alloy, and simultaneously forming Ni-Si or Ni- separately.
  • the synergistic effect of the present invention enables the alloy of the present invention to achieve high strength through a smaller processing rate in the subsequent processing, thereby overcoming the increase in the strength of the conventional alloy while increasing the strength.
  • the stress relaxation resistance of the downstream products such as the connector therefore, the alloy of the present invention using the two strengthening components at the same time can be used without loss compared to the conventional alloy in which the Ni-Si precipitate phase or the Ni-P precipitate phase is separately added. Higher strength and bending performance are achieved with conductivity.
  • the inventors have found through a large number of implementations that when the weight percentage of Ni, Si, and P satisfies 3 ⁇ Ni / (P + Si) ⁇ 7, and the weight percentage of Si and P satisfies 0.1 ⁇ Si / P ⁇ 10, Ni-Si
  • the synergistic effect of the precipitated phase or the Ni-P precipitated phase is optimal, and the excellent comprehensive properties including the strength, electrical conductivity, stress relaxation resistance and bending processability can be fully realized when Ni/(P+Si) is low.
  • the strength of the copper alloy material is not only related to the solid solution strengthening and precipitation strengthening of the material, but also the cold working deformation is one of the key means for improving the strength of the copper alloy of the present invention.
  • Increasing the strength by increasing the cold working rate is a commonly used method by those skilled in the art, but as the strength of the alloy increases, the bending processability of the material deteriorates significantly and cannot meet the requirements for subsequent use.
  • the inventors In order to achieve a balance between the bending processability and the yield strength of the material, the inventors have found that the orientation of the crystal face of the alloy has an important influence on the balance between the two, and the crystal faces affecting the bending processability and the yield strength of the alloy of the present invention are mainly ⁇ 200 ⁇ , ⁇ 220 ⁇ , and ⁇ 311 ⁇ , by controlling their crystal plane orientation in the alloy, good yield strength and bending properties can be obtained.
  • the inventors conducted experiments through different processes and analyzed the results. It was found that the ⁇ 220 ⁇ crystal has an important influence on the yield strength of the material. As the cold working deformation rate increases, the diffraction intensity of the ⁇ 220 ⁇ crystal plane increases.
  • the yield strength also increases significantly, but the increase of ⁇ 200 ⁇ crystal plane is unfavorable for the bending performance of the material; ⁇ 200 ⁇ crystal has an important influence on the bending performance of the material, and the diffraction intensity of the crystal surface is enhanced after solid solution.
  • the bending performance is good, but the increase of ⁇ 200 ⁇ crystal plane is not conducive to the increase of the yield strength of the material; the ⁇ 311 ⁇ crystal plane is similar to the ⁇ 200 ⁇ crystal plane. After the solution treatment, the diffraction peak of the crystal plane is enhanced, and the material is folded.
  • the bending performance is good, but as the cold working deformation rate increases, the ⁇ 220 ⁇ crystal plane increases, the ⁇ 311 ⁇ crystal plane and the ⁇ 200 ⁇ crystal plane gradually decrease, and the bending property of the material also decreases.
  • Controlling the crystal plane orientation of ⁇ 200 ⁇ , ⁇ 220 ⁇ , and ⁇ 311 ⁇ has the desired bending workability (the value of the GW direction R/t ⁇ 1, the value of the BW direction R/t ⁇ 2, and the yield strength ⁇ 600 MPa)
  • the important role of the crystal orientation of the copper alloy of the present invention is: 1 ⁇ I ⁇ 220 ⁇ / (I ⁇ 200 ⁇ + I ⁇ 311 ⁇ ) ⁇ 8, wherein I ⁇ 220 ⁇ is the X-ray diffraction of the ⁇ 220 ⁇ crystal plane
  • the intensity, I ⁇ 200 ⁇ is the X-ray diffraction intensity of the ⁇ 200 ⁇ crystal plane, and I ⁇ 311 ⁇ is the X-ray diffraction intensity of the
  • the present invention limits I ⁇ 200 ⁇ , I ⁇ 220 ⁇ , and I ⁇ 311 ⁇ to 1 ⁇ I ⁇ 220 ⁇ / (I ⁇ 200 ⁇ +I ⁇ 311 ⁇ ) ⁇ 8.
  • Ni may be completely substituted by Co, and the sum of the contents of Ni and Co satisfies: 0.1 wt% ⁇ Ni + Co ⁇ 3 wt%; or, Ni is partially substituted by Co, and the content of Co is 0.1 to 3.0 wt%.
  • Co can be precipitated separately to improve the heat resistance of the copper alloy, and Co and Si and P can form a CoSi and CoP phase, and the strength of the alloy can be enhanced by the precipitation strengthening phase without lowering the conductivity.
  • the weight percentage composition of the copper alloy of the present invention may further include a total amount of 0.005 to 1.0% by weight of at least one element selected from the group consisting of Al, Mn, Cr, Ti, Zr, and Ag.
  • the addition of at least one of Al, Mn, Cr, Ti, Zr and Ag is advantageous for enhancing the strength and heat resistance of the copper alloy. If the content of these elements is excessively added, the electrical conductivity of the copper alloy is lowered, so that the total addition amount of at least one of Al, Mn, Cr, Ti, Zr, and Ag is controlled to be 0.005 to 1.0% by weight.
  • the present invention uses Cu-Zn-Sn as a matrix, and by adding elements such as Ni, Si, and P, by solid solution strengthening and age strengthening, providing a low cost, while satisfying the yield strength ⁇ 600 MPa, conductivity ⁇ Excellent 30% IACS, excellent bending performance (value R/t ⁇ 1 in the GW direction, R/t ⁇ 2 in the BW direction), excellent stress relaxation resistance (1000 hours at 150 ° C, residual stress ⁇ 70%)
  • the copper alloy material can meet the needs of copper alloy materials in many industries such as connectors, relays, switches, sockets, and lead frames.
  • the copper alloy of the invention can be processed into strips, bars, wires and the like according to different application requirements. Taking the strip and strip as an example, the preparation process of the copper alloy of the present invention is as follows:
  • Hot rolling In order to ensure that the coarse precipitated phase existing in the ingot is solid-dissolved to the matrix again, the hot rolling temperature of the alloy is controlled at 750-900 ° C, and the holding time is 3-6 h, and the alloy can be homogenized under this process. In order to minimize the precipitation of phase particles after hot rolling, the final rolling temperature of the alloy is controlled to be above 650 ° C, and is cooled by on-line water after hot rolling. The rolling rate is 85% or more.
  • Milling surface The surface oxide scale is thicker after hot rolling. To ensure the surface quality of the strip at the later stage, the lower milling surface of the hot rolled sheet is 0.5 to 1.0 mm.
  • the total rolling ratio of the first cold rolling is required to be equal to or greater than 30%. However, if the rolling ratio of the first cold rolling is too high, the bendability of the finally produced copper alloy sheet may be deteriorated. Therefore, the total rolling ratio of the first cold rolling is preferably in the range of 30 to 95%, more preferably in the range of 70 to 90%.
  • Solution treatment / aging treatment According to the configuration and requirements of different equipment, the method and process of solution treatment or aging treatment can be selected.
  • the solution treatment is a heat treatment for re-forming a solute element solid solution in a matrix and performing recrystallization.
  • the solution treatment of the copper alloy of the invention After the solution treatment of the copper alloy of the invention, the relative diffraction peak intensity along the ⁇ 111 ⁇ , ⁇ 200 ⁇ , ⁇ 311 ⁇ crystal planes of the rolling surface is increased, which is beneficial to improve the shaping of the alloy and facilitate the later cold working.
  • the solution treatment is preferably carried out at a temperature of 700 to 980 ° C for 1 min to 1 h, more preferably for 10 min to 50 min.
  • the solution treatment temperature is too low, the recrystallization is incomplete, which is not conducive to the control of the relative diffraction peak intensity of the ⁇ 111 ⁇ , ⁇ 200 ⁇ , and ⁇ 311 ⁇ crystal faces, affecting the subsequent processing, and the redissolution of the solute elements in the solid solution. Not enough. Further, if the solution treatment temperature is too high, the crystal grains become coarse, and the bendability of the material is liable to be deteriorated.
  • the aging treatment mainly achieves the purpose of second phase precipitation and tissue softening.
  • the relative diffraction peak intensity of the alloy along the rolling plane ⁇ 111 ⁇ , ⁇ 200 ⁇ , ⁇ 311 ⁇ crystal plane increases after aging, and the plasticity of the alloy increases.
  • the aging temperature is controlled at 350 to 600 ° C
  • the holding time is 6 to 12 h, more preferably, the temperature is controlled at 400 to 550 ° C, and the holding time is 4 to 10 h, so that Ni forms a compound with P and Si, and has a minute shape in the copper matrix. Dispersion and precipitation can have both high strength and excellent bending workability.
  • the aging temperature is too high and the time is long, the precipitates are coarsened, and the best combination of strength and grain size cannot be obtained. Conversely, if the temperature is low The time is short, the precipitation cannot be sufficiently performed, and the bending workability and strength are not sufficiently obtained.
  • the deformation of the secondary cold rolling is controlled to be more than 60%, the deformation amount is too small, the uniform dispersion of the precipitated phase is poor, and the precipitation amount is small, and it is not conducive to the completion of the complete recrystallization of the post-aging microstructure, and the final strip
  • the bending process is unfavorable.
  • Aging treatment the key process for the precipitation strengthening of the alloy, the aging temperature is controlled at 350-550 ° C, the holding time is 6-12 h, and the preferred aging temperature is controlled at 400-500 ° C for 4-10 h.
  • the high temperature is conducive to the complete recrystallization of the tissue and the precipitation of the second phase, but too high is prone to precipitate aggregation and overaging problems.
  • Low temperature aging is not conducive to the recrystallization of the strip or the precipitation of the second phase.
  • the intensity of the diffraction peaks along the ⁇ 111 ⁇ , ⁇ 200 ⁇ , and ⁇ 311 ⁇ planes along the rolling surface is low, which has a great influence on the bending process of the strip.
  • Three cold rolling applying cold deformation to the alloy after aging is beneficial to the further improvement of the strength of the strip, but the deformation amount should not be too large, too large and easy to form obvious anisotropy, which is not conducive to the BW direction strip.
  • Bending processing energy As the processing rate increases, the intensity of the diffraction peaks on the ⁇ 111 ⁇ , ⁇ 200 ⁇ , and ⁇ 311 ⁇ planes along the rolling plane decreases, and the intensity of the diffraction peak on the ⁇ 220 ⁇ plane increases.
  • the strength of the alloy increases with the amount of cold work deformation, but the distribution of ⁇ 111 ⁇ faces decreases along the rolling direction ⁇ 111 ⁇ , ⁇ 200 ⁇ , ⁇ 311 ⁇ , and the deformation coordination of the crystals deteriorates.
  • the bending properties of the alloy deteriorate.
  • the deterioration of the BW direction is more obvious. Therefore, the amount of deformation is controlled to be 60% or less.
  • Low-temperature annealing For copper alloys with high zinc content, low-temperature annealing after cold deformation is beneficial to the improvement of yield strength and bendability, and a small amount of compound precipitation can improve the electrical conductivity of the alloy. Residual stress. Therefore, the copper alloy sheet after the third cold rolling is subjected to low temperature annealing, and the low temperature annealing temperature is controlled between 200 and 250 °C. When the temperature is too high, the copper alloy sheet softens in a short time, and the strength characteristics of the alloy are lowered, which is disadvantageous for use. If the temperature is too low, the effect of improving the above characteristics cannot be sufficiently obtained.
  • the present invention simultaneously adds elements such as Ni, Si, Sn, and P to a Cu-Zn-Sn substrate, and simultaneously forms a Ni-Si precipitate phase and a Ni-P precipitate phase, and controls the weight ratios of Ni, Si, and P to satisfy :3 ⁇ Ni/(P+Si) ⁇ 7, and the weight ratio of Si to P satisfies 0.1 ⁇ Si/P ⁇ 10, which fully realizes the mutual synergy between Ni-Si phase and Ni-P phase without reducing the conductivity of the material. At the same time, the strength and bending performance of the material are improved.
  • the Cu-Zn-Sn matrix is selected in the invention, which can reduce the material cost while satisfying the performance requirement, and because it contains elements such as Sn, Ni, Si, etc.
  • the recycling of alloy scrap also provides more advantages;
  • the present invention defines the degree of integration of ⁇ 220 ⁇ , ⁇ 200 ⁇ , ⁇ 311 ⁇ crystal orientation, which is represented by an X-ray representing an integrated ratio
  • the diffraction intensity is determined.
  • the X-ray diffraction intensity of the crystal face of the copper alloy of the invention satisfies: 1 ⁇ I ⁇ 220 ⁇ / (I ⁇ 200 ⁇ + I ⁇ 311 ⁇ ) ⁇ 8, so that the material realizes the realization of the copper alloy including the yield strength and conductivity.
  • the copper alloy of the present invention can achieve a yield strength of ⁇ 600 MPa and a conductivity of ⁇ 30% IACS; the 90° bending workability of the produced strip is: the value of the GW direction R/t ⁇ 1, and the value of the BW direction R/ T ⁇ 2; holding at 150 ° C for 1000 hours, residual stress of 70% or more, excellent stress relaxation resistance;
  • the alloy of the present invention can solve various utilization problems of waste materials such as brass scrap, nickel-plated scrap for connectors such as personal computers and mobile phones, tin-plated scrap for automotive-oriented connectors, and plating for automotive use. Tin brass scrap, etc., is conducive to energy saving, reducing alloy preparation costs, and promoting recycling of waste materials;
  • the alloy of the invention can be processed into rods, strips and the like, and is widely used in connectors, relays, switches, sockets, and lead frame industries.
  • the copper alloy in which the components shown in Table 1 were combined was melted at 1,150 ° C to produce an ingot having a size of 170 mm ⁇ 320 mm.
  • the above ingot was kept at 850 ° C for 5 hours, it was hot rolled to a thickness of 16.5 mm; then, the milled surface was made to have a thickness of 15 mm, and then cold rolled into a plate having a thickness of 2 mm; then, after cold rolling
  • the plate is heated to 440 ° C, held for 8 h, for the first aging; the aging material is subjected to a second cold rolling, cold rolling to 0.035 mm, and then subjected to a second aging treatment at 400 ° C for 8 h;
  • the cold-rolling was performed, and the target thickness of the rolling was 0.2 mm; after the cold-rolling, the steel was kept at 210 ° C for 4 hours for low-temperature annealing to obtain a strip sample.
  • the room temperature tensile test is carried out in accordance with GB/T 228.1-2010 Metallic Material Tensile Test Part 1: Room Temperature Test Method on an electronic universal performance test machine, using a lead sample with a width of 12.5 mm and a tensile speed of 5 mm/ Min.
  • the stress relaxation resistance test is based on the JCBA T309:2004 copper and copper alloy thin strip bending stress relaxation test method, sampled parallel to the rolling direction, the sample width is 10mm, the length is 100mm, and the initial loading stress value is 0.2% yield strength. %, test temperature is 150 ° C, time is 1000h.
  • the bending performance test was carried out on the bending test machine according to GBT 232-2010 Metal Material Bending Test Method, and the sample width was 5 mm and the length was 50 mm.
  • the X-ray diffraction intensities I ⁇ 220 ⁇ , I ⁇ 200 ⁇ , and I ⁇ 311 ⁇ of the ⁇ 220 ⁇ , ⁇ 200 ⁇ , and ⁇ 311 ⁇ faces of each sample surface were measured to find I ⁇ 220 ⁇ /(I ⁇ 200 ⁇ The value of +I ⁇ 311 ⁇ ).
  • the copper alloy of the present invention achieves a yield strength of ⁇ 600 MPa, a conductivity of ⁇ 30% IACS, excellent bending workability, that is, a value of GW direction R/t ⁇ 1, a value of BW direction R/t ⁇ 2, and stress resistance.
  • Relaxation performance material properties maintained at 150 ° C for 1000 hours with residual stress ⁇ 70%.
  • Example 1 and Example 21 it can be found from the comparison between Example 1 and Example 21 that the same performance as the complete addition of Ni can be achieved by replacing part of Ni with Co; by comparing Example 1 and Examples 22 to 25, it is found that the addition of Fe can improve the material strength.
  • Mg promotes the improvement of stress relaxation resistance.
  • Comparative Examples 1 to 10 that when the amount of element addition is insufficient or exceeds the specified range, the properties of the material are degraded to varying degrees, and the desired material properties cannot be achieved. It can be seen from Comparative Examples 11 to 14 that when Ni, Si When the ratio of P is different, 3 ⁇ Ni / (P + Si) ⁇ 7 and 0.1 ⁇ Si / P ⁇ 10, it can not meet the material properties we need.

Abstract

L'invention concerne un matériau en alliage de cuivre, dont la composition comprend, en pourcentages en poids : 5,01 à 15,0 % en poids de Zn, 0,1 à 3,0 % en poids de Ni, 0,1 à 2,0 % en poids de Sn, 0,01 à 0,5 % en poids de Si, 0,01 à 0,25 % en poids de P, 0 à 0,2 % en poids de Mg et 0 à 0,3 % en poids de Fe, le reste étant du Cu et des impuretés inévitables. L'alliage de cuivre a une limite conventionnelle d'élasticité ≥ 600 MPa, une conductivité électrique ≥ 30 % IACS, une valeur de R/t dans une direction GW ≤ 1, une valeur de R/t dans une direction BW ≤ 2 et une contrainte résiduelle ≥ 70 % après avoir été maintenu à une température de 150°C pendant 1000 heures ; et le matériau en alliage de cuivre peut être transformé en produits tels que des fils en forme de barre et des tôles en bande et satisfait aux exigences pour des matériaux en alliage de cuivre dans un certain nombre d'industries telles que celles des connecteurs, des relais, des commutateurs, des prises et des grilles de connexion.
PCT/CN2018/000211 2018-05-07 2018-06-06 Matériau en alliage de cuivre et son utilisation WO2019213789A1 (fr)

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CN110379470A (zh) * 2019-04-10 2019-10-25 西北工业大学 单晶高温合金的组织和缺陷的模拟方法
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