WO2019198760A1 - 光吸収素子、光吸収体、及び光吸収素子の製造方法 - Google Patents

光吸収素子、光吸収体、及び光吸収素子の製造方法 Download PDF

Info

Publication number
WO2019198760A1
WO2019198760A1 PCT/JP2019/015644 JP2019015644W WO2019198760A1 WO 2019198760 A1 WO2019198760 A1 WO 2019198760A1 JP 2019015644 W JP2019015644 W JP 2019015644W WO 2019198760 A1 WO2019198760 A1 WO 2019198760A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
spiral
metal layer
layer
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/015644
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
拓男 田中
レニルクマール ムダチャティ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIKEN
Original Assignee
RIKEN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIKEN filed Critical RIKEN
Priority to JP2020513431A priority Critical patent/JP7325122B2/ja
Publication of WO2019198760A1 publication Critical patent/WO2019198760A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters

Definitions

  • the present invention relates to a light absorbing element that absorbs light in a wide wavelength range. More specifically, the present invention relates to a light absorbing element having an ultrafine metal structure that absorbs light in a wide wavelength range (for example, a visible wavelength range and a near infrared wavelength range).
  • Black coating that absorbs light in a wide wavelength range is indispensable for optical technology for the purpose of suppressing light reflection and stray light, for example.
  • it is extremely difficult to actually make a truly black one In particular, it was almost impossible to achieve black color on a flat surface.
  • a black and white structure is realized by forming a concavo-convex structure or a fuzzy structure on the surface and capturing light inside the structure. Therefore, the thickness of the layer necessary for obtaining black is increased.
  • Patent Document 1 Japanese Patent Document 1 below, for example.
  • Patent Document 1 does not disclose an ultrafine metal structure that absorbs light in a wide wavelength range. Therefore, an ultrafine metal structure that absorbs light in a wide wavelength range is desired. For example, it is desired to realize a black surface of an optical device using such an ultrafine metal structure.
  • an object of the present invention is to provide a technique for an ultrafine metal structure capable of absorbing light in a wide wavelength range.
  • the light absorption element according to the present invention comprises a spiral structure formed of a metal material,
  • the spiral structure includes a base portion and a linear portion extending from the base portion,
  • An axis passing through the base point is a reference axis, and a direction extending radially from the reference axis is a radial direction
  • the linear portion extends spirally from the base point while rotating around the reference axis and moving from the base point to the outside in the radial direction.
  • a light absorber according to the present invention has the above-described light absorption element and an element support surface that supports the light absorption element, and a large number of the light absorption elements are arranged on the element support surface.
  • the manufacturing method according to the present invention is a manufacturing method of a light absorbing element, wherein the light absorbing element includes a spiral structure formed of a metal material,
  • the spiral structure includes a base portion and a linear portion extending from the base portion,
  • An axis passing through the base point is a reference axis, and a direction extending radially from the reference axis is a radial direction
  • the linear part extends spirally from the base point part while turning around the reference axis and moving from the base part to the outside in the radial direction
  • a spiral metal layer formed of a metal material and having a spiral pattern is formed on the surface of the object to be processed.
  • the spiral metal layer includes a base point layer portion corresponding to the base point portion and a line corresponding to the linear portion. Including a layered portion.
  • a very fine metal structure capable of absorbing light in a wide wavelength range can be realized.
  • the structure of the light absorption element by 1st Embodiment of this invention is shown. It is a 1B-1B arrow line view of FIG. 1A. It is a flowchart which shows the manufacturing method by 1st Embodiment. It is explanatory drawing of the manufacturing method by 1st Embodiment.
  • the SEM image of the light absorption element manufactured with the manufacturing method by 1st Embodiment is shown. 3 shows a structure of a light absorption element according to a second embodiment of the present invention. It is a 5B-5B arrow line view of FIG. 5A. It is a flowchart which shows the manufacturing method by 2nd Embodiment. It is explanatory drawing of the manufacturing method by 2nd Embodiment.
  • the SEM image of the light absorption element manufactured with the manufacturing method by 2nd Embodiment is shown.
  • the structure of the light absorber by embodiment of this invention is shown. It is a 9B-9B arrow line view of FIG. 9A. It is an experimental result regarding the optical characteristic of the light absorber manufactured according to the manufacturing method of 1st Embodiment. It is an experimental result regarding the optical characteristic of the light absorber manufactured according to the manufacturing method of 2nd Embodiment.
  • FIG. 1A shows a structure of a light absorption element 10 according to the first embodiment of the present invention.
  • 1B is a view taken in the direction of arrows 1B-1B in FIG. 1A.
  • the light absorbing element 10 absorbs light in a wide wavelength range.
  • the wide wavelength range may include all or a part or some part of the range from visible light (approximately 380 nm wavelength) to far infrared light (approximately 1 mm wavelength).
  • the wide wavelength range may include a part or all of the visible wavelength range (ie, 380 nm to 810 nm).
  • the wide wavelength range includes an infrared wavelength range (810 nm to 1 mm) in addition to a part or all of the visible wavelength range or instead of part or all of the visible wavelength range.
  • a part may be further included.
  • a part of the infrared wavelength range may include a near-infrared wavelength range (a wavelength range of 0.76 ⁇ m to 2.5 ⁇ m).
  • the light absorbing element 10 includes a spiral structure 3 that is an extremely fine metal structure having an overall size of, for example, several thousand micrometers or less.
  • the spiral structure 3 is made of a metal material.
  • the spiral structure 3 includes a base portion 3a and a linear portion 3b extending from the base portion 3a in a spiral shape.
  • an axis passing through the base point portion 3a is defined as a reference axis C
  • a direction parallel to the reference axis C is defined as an axial direction
  • a direction perpendicular to the reference axis C and radially extending from the reference axis C is defined as a radial direction.
  • the linear portion 3b spirals from the base point portion 3a while rotating around the reference axis C and moving from the base point portion 3a to the outside in the radial direction and the axial direction. It extends in a shape.
  • the entire linear portion 3b may be located on a plane including the base point portion 3a. That is, the linear portion 3b extends spirally from the base point portion 3a while turning around the reference axis C and moving from the base point portion 3a to the outside in the radial direction while being positioned on the plane including the base point portion 3a. Also good.
  • the metal material forming the spiral structure 3 is, for example, Au, Ag, or Cu, but may be other materials (Ni or the like). In addition, although each metal material or each metal mentioned below is also Au, Ag, or Cu, for example, another material may be sufficient.
  • the radial dimension of the base portion 3a is larger than the radial thickness of the linear portion 3b.
  • the radial dimension of the base point portion 3a may be larger than the radial thickness of the linear portion 3b.
  • the radial thickness of the linear portion 3b means the radial dimension of each portion of the linear portion 3b that is spaced apart from each other in the radial direction.
  • the diameter of the linear portion 3b in the radial direction is, for example, 50 nm or more and 150 nm or less (for example, about 100 nm).
  • the radial interval (gap) between the portions adjacent to each other in the radial direction in the linear portion 3b may be the same as the radial thickness of the linear portion 3b. That is, in one example, the radial interval is 50 nm or more and 150 nm or less (for example, about 100 nm).
  • the radial dimension of the spiral structure 3 may be, for example, 500 nm or more and 2000 nm or less, but is not limited to this range.
  • the linear portion 3b extends from the base point portion 3a and goes around the reference axis C at least twice.
  • the present invention is not limited to this, and the linear portion 3b may, for example, rotate around the reference axis C for less than two turns, or may turn around the reference axis C for more than three turns.
  • the linear portion 3b extends in a curved shape as shown in FIG. 1B when viewed from the axial direction.
  • the reference axis C is oriented in a direction perpendicular to a surface 5a of the support 5 described later, as shown in FIG. 1A.
  • the linear portion 3b formed of a metal material continuously extends from the coupling position with the base point portion 3a to the tip.
  • the light absorbing element 10 includes a support 5 that supports the spiral structure 3.
  • the support 5 has a surface 5a that is axially spaced from the linear portion 3b, and a protruding portion 5b that protrudes from the surface 5a and is coupled to the base point portion 3a.
  • the protrusion 5b may be formed of a non-metallic material (for example, a transparent material such as glass).
  • the support 5 includes a substrate 5A having a surface 5a.
  • the entire surface 5a of the support 5 is formed of a non-metallic material (for example, a transparent material such as glass), and a metal layer 7 is formed on a part of the surface 5a.
  • a metal layer 7 is formed on a part of the surface 5a.
  • FIG. 1A only the metal layer 7 is illustrated as a cross section by a plane parallel to the reference axis C, and the plane is a surface in the vicinity of the reference axis C.
  • the metal layer 7 includes a spiral metal layer portion 7a and a peripheral metal surface portion 7b.
  • a broken line indicates a virtual boundary line between the spiral metal layer portion 7a and the peripheral metal surface portion 7b.
  • the spiral metal layer portion 7a When viewed from a direction perpendicular to the surface 5a, the spiral metal layer portion 7a is located between the portions adjacent to each other in the radial direction in the linear portion 3b, and extends spirally along the linear portion 3b. Yes. Light absorption due to the interaction between the metal layer 7 and the spiral structure 3 is expected.
  • the metal layer 7 may be omitted.
  • the light absorbing element 10 includes a protective layer 8 formed so that the spiral structure 3 is embedded therein.
  • the protective layer 8 is bonded to the surface 5a (via the metal layer 7 in FIG. 1A).
  • the protective layer 8 is formed of a transparent material (for example, a polymer). The protective layer 8 protects the spiral structure 3 and prevents its damage.
  • FIG. 2 is a flowchart showing a method for manufacturing the light absorbing element 10 according to the first embodiment of the present invention.
  • 3A to 3J are explanatory views of the manufacturing method according to the first embodiment.
  • step S1 an object 5A is prepared as shown in FIG. 3A.
  • the entire surface 5a of the object to be processed 5A is formed of a nonmetallic material.
  • the target object 5A is a substrate formed of silicon as a non-metallic material. Note that the target object 5A may be formed of a non-metallic material other than silicon.
  • step S2 a spiral metal layer 15 having a spiral pattern (hereinafter also simply referred to as a spiral pattern) is formed on the surface 5a of the object 5A as shown in FIGS. 3E and 3F described later.
  • the spiral metal layer 15 is made of a metal material.
  • step S2 includes steps S21 to S25.
  • the resist layer 11 is formed on the surface 5a of the workpiece 5A.
  • the resist layer 11 is formed of a material that is sensitive to electron beams.
  • the material is, for example, polymethyl methacrylate (PMMA).
  • PMMA polymethyl methacrylate
  • a resist layer 11 made of PMMA is formed on the surface 5a by applying a PMMA film to the surface 5a.
  • step S22 as shown in FIG. 3B, the surface of the resist layer 11 is irradiated with an electron beam in a spiral pattern.
  • step S23 the portion of the spiral pattern irradiated with the electron beam in the resist layer 11 is dissolved by immersing the object to be processed 5A in the developer.
  • the spiral groove 13 is formed by removing the spiral pattern portion in the resist layer 11.
  • the bottom surface of the spiral groove 13 becomes the exposed surface 5a of the workpiece 5A.
  • the spiral groove 13 has a central groove portion 13a corresponding to the base point portion 3a and a linear groove portion 13b corresponding to the linear portion 3b.
  • the linear groove 13b extends spirally from the central groove 13a.
  • the size of the central groove 13a is larger than the thickness of the linear groove 13b.
  • the thickness of the linear groove part 13b means the dimension of each part spaced apart from each other in the direction away from the central groove part 13 in the linear groove part 13b.
  • step S24 a metal material is deposited on the bottom surface 5a of the spiral groove 13 and the surface of the remaining resist layer 11 by a vacuum deposition method or a sputtering method, thereby forming a metal layer on the surface of the resist layer 11 as shown in FIG. 3D. 16 and the spiral metal layer 15 is formed on the bottom surface of the spiral groove 13.
  • step S25 lift-off processing is performed.
  • the resist layer 11 remaining on the object to be processed 5A is completely dissolved in an appropriate solvent (organic solvent), whereby the metal layer 16 is removed from the object to be processed 5A and the surface 5a of the object to be processed 5A is removed.
  • the directly formed spiral metal layer 15 is left.
  • FIGS. 3E and 3F the spiral metal layer 15 is formed on the surface 5a of the workpiece 5A.
  • FIG. 3F is a view taken in the direction of the arrow 3F-3F in FIG. 3E.
  • the spiral metal layer 15 includes a base point layer portion 15a corresponding to the base point portion 3a, and a linear layer portion 15b corresponding to the linear portion 3b and extending spirally from the base point layer portion 15a.
  • a broken line is a virtual boundary line between the base layer portion 15a and the linear layer portion 15b.
  • an etching process for isotropically removing the exposed surface of the surface 5a of the object 5A is performed.
  • This etching process may be, for example, a process by inductively coupled plasma reactive ion etching (ICP-RIE: Inductively Coupled Plasma Reactive Ion Etching).
  • ICP-RIE Inductively Coupled Plasma Reactive Ion Etching
  • an etching gas is turned into plasma by applying a high frequency to the etching gas in a vacuum reaction chamber, and the exposed surface of the surface 5 of the object to be processed 5A is exposed by a chemical reaction caused by the plasmatized gas.
  • Etching isotropically.
  • a bias voltage may not be applied to the object to be processed 5A.
  • step S3 By the etching process in step S3, in the object 5A, as shown in FIG. 3G, a new surface 5a that is axially spaced from the linear layer portion 15b and a base portion 3a that protrudes from the surface 5a and is coupled to the base portion 3a.
  • the protruding portion 5b is formed.
  • the etching process is finished.
  • 5 A of to-be-processed objects after an etching process comprise the above-mentioned support body 5.
  • a metal layer 7 is further formed on the target object 5A and the spiral metal layer 15 as shown in FIG. 3H by vacuum deposition or sputtering.
  • the metal layer 7 on the workpiece 5A has the above-described spiral metal layer portion 7a and the peripheral metal surface portion 7b.
  • the base layer 15a and the metal layer 7 on the base layer 15a constitute the above-described base 3a, and the linear layer 15b and the metal layer 7 on the linear layer 15b are linear.
  • the shape portion 3b is formed.
  • step S4 at the position corresponding to the back of the spiral metal layer 15, the spiral metal layer 15 becomes an obstacle to the deposited metal material, so that the above-described spiral metal layer portion 7a is formed. Moreover, since the metal layer 7 is further formed in the spiral metal layer 15 by step S4, the thickness of the spiral structure 3 can be increased correspondingly.
  • FIG. 3I the linear portion 3b extends spirally while moving downward in the axial direction (downward in this figure) due to gravity or stress.
  • FIG. 3G, and FIG. 3H are cross-sectional views taken along a plane that includes the base layer 15a and is parallel to the paper surface of the drawing.
  • FIG. 3I and FIG. The cross section in the position away from the spiral structure 3 is shown.
  • a protective layer 8 made of a transparent material is formed so as to embed the spiral structure 3 therein.
  • a film of a transparent material solution is formed on the surface 5a of the workpiece 5A (in FIG. 3J, via the metal layer 7 on the surface 5a), and the protective layer 8 is formed by drying the solution.
  • the transparent material is a polymer and the protective layer 8 is a polymer layer.
  • step S4 described above may be omitted.
  • step S5 is performed after step S3. Further, step S4 and step S5 may be omitted.
  • FIG. 4 is an SEM (Scanning Electron Microscope) image of the light absorbing element 10 manufactured in the example of the manufacturing method according to the first embodiment.
  • the dimension in the range indicated by the double arrow is 500 nm.
  • the light absorption element 10 can absorb light in a wide wavelength region by having the spiral structure 3 that is the above-described three-dimensional ultrafine metal structure.
  • the light absorbing element 10 described above can absorb infrared light having a wide wavelength range.
  • the light absorbing element 10 can absorb both light having a wide wavelength range in the visible light range and light having a wide wavelength range of infrared rays (for example, a wide wavelength range of near infrared rays).
  • the light absorbing element 10 can absorb both light having a wide wavelength range in the visible light range and light having a wide wavelength range of infrared rays (for example, a wide wavelength range of near infrared rays).
  • FIG. 5A shows the structure of the light absorption element 10 according to the first embodiment of the present invention.
  • FIG. 5B is a view taken along arrow 5B-5B in FIG. 1A.
  • the light absorbing element 10 according to the second embodiment is the same as the light absorbing element 10 according to the first embodiment in the points not described below.
  • the configuration of the support 5 is different from that of the first embodiment.
  • the whole surface 5a of the support body 5 is formed with the metal material, and the above-mentioned metal layer 7 is formed in this surface 5a.
  • the support 5 has a non-metal layer (substrate) 19 formed of a non-metal material and a metal layer 21 formed on the non-metal layer 19.
  • FIG. 5A only the metal layer 7 is shown as a cross section by a plane parallel to the reference axis C, and the plane is a plane in the vicinity of the reference axis C.
  • FIG. 6 is a flowchart showing a method for manufacturing the light absorbing element 10 according to the second embodiment of the present invention.
  • 7A to 7K are explanatory views of the manufacturing method according to the second embodiment.
  • step S100 the object 5B is prepared.
  • step S100 includes steps S111 to S113.
  • a substrate 19 is prepared as shown in FIG. 7A.
  • the material of the substrate 19 may be a metal or a non-metal, and may be transparent or opaque.
  • the metal layer 21 is formed on the entire surface of the substrate 19 by vacuum deposition or sputtering.
  • the sacrificial tank 23 is formed on the metal layer 21 as shown in FIG. 7C by an appropriate method such as a CVD (Chemical Vapor Deposition) method.
  • the sacrificial tank 23 may be a layer formed of, for example, silicon nitride.
  • the object 5B is obtained by sequentially stacking the metal layer 21 and the sacrificial layer 23 on the substrate 19 in this manner, and the sacrificial layer 23 forms the surface 5a of the object 5B.
  • step S200 the spiral metal layer 15 having a spiral pattern as shown in FIG. 7G described later is formed on the surface 5a of the workpiece 5B.
  • the spiral metal layer 15 is made of a metal material.
  • step S200 includes, for example, steps S211 to S215.
  • the resist layer 11 is formed on the surface of the sacrificial tank 23 as shown in FIG. 7D.
  • the resist layer 11 is formed of a material that is sensitive to electron beams.
  • the material is, for example, polymethyl methacrylate (PMMA).
  • step S212 the surface of the resist layer 11 is irradiated with an electron beam in a spiral pattern.
  • step S213 the object 5B is immersed in the developer to dissolve the spiral pattern portion irradiated with the electron beam in the resist layer 11.
  • the spiral groove 13 is formed in the resist layer 11 by removing the spiral pattern portion.
  • the bottom surface of the spiral groove 13 becomes the exposed surface 5 a of the sacrificial layer 23.
  • the structure of the spiral groove 13 is the same as that in the first embodiment.
  • step S214 a metal material is deposited on the bottom surface 5a of the spiral groove 13 and the surface of the remaining resist layer 11 by a vacuum deposition method or a sputtering method, so that a metal layer is formed on the surface of the resist layer 11 as shown in FIG. 7F. 16 and the spiral metal layer 15 is formed on the bottom surface of the spiral groove 13.
  • step S215 lift-off processing is performed.
  • the metal layer 16 is removed from the target object 5B by dissolving the resist layer 11 remaining on the substrate with an appropriate solvent, and the spiral metal layer 15 formed directly on the surface 5a of the sacrificial layer 23. Leave. Thereby, as shown in FIG. 7G, the spiral metal layer 15 is formed on the surface 5a of the object to be processed 5B (sacrificial layer 23).
  • the structure of the spiral metal layer 15 is the same as that in the first embodiment.
  • step S300 an etching process for isotropically removing the exposed surface of the surface of the sacrificial layer 23 as the surface 5a of the object 5B is performed. This etching process is the same as that in the first embodiment.
  • the to-be-processed object 5B after an etching process comprises the above-mentioned support body 5.
  • FIG. 7H a new surface 5a that is axially spaced from the linear layer portion 15b and a base portion 3a that protrudes from the surface 5a and is coupled to the base point portion 3a.
  • the protruding portion 5b is formed.
  • the surface 5a is the surface of the metal layer 21 in FIG. 7H, but may be the surface of the remaining portion of the sacrificial layer 23, unlike FIG. 7H.
  • the protruding portion 5 b is a remaining portion of the sacrificial layer 23.
  • the to-be-processed object 5B after an etching process comprises the above-mentioned support body 5.
  • FIG. 7H a new surface 5a that is axially spaced from the linear layer portion 15b and a base portion 3a that protrudes from the surface 5a and is coupled to the base point portion 3a.
  • step S400 the metal layer 7 is further formed on the target object 5B and the spiral metal layer 15 as shown in FIG. 7I by vacuum deposition or sputtering.
  • the metal layer 7 on the workpiece 5A has the above-described spiral metal layer portion 7a and the peripheral metal surface portion 7b.
  • the base layer 15a and the metal layer 7 on the base layer 15a form the above-described base 3a, and the linear layer 15b and the metal layer 7 on the linear layer 15b are described above.
  • the linear portion 3b is formed.
  • the linear portion 3b may extend spirally while moving downward in the axial direction (downward in this figure) due to gravity or stress.
  • the light absorption element 10 described above is formed.
  • 7G to 7I are cross-sectional views taken along a plane including the base layer 15a and parallel to the paper surface of the drawing.
  • FIG. 7J and FIG. 7K to be described later show the spiral structure 3 in a direction perpendicular to the paper surface of the drawing. The cross section in the position away from is shown.
  • step S500 as shown in FIG. 7K, a transparent material protective layer 8 is formed so as to embed the spiral structure 3 in the same manner as in the first embodiment.
  • step S400 described above may be omitted.
  • step S500 is performed after step S300. Further, step S400 and step S500 may be omitted.
  • FIG. 8 is an SEM image of the light absorbing element 10 manufactured in the example of the manufacturing method based on the second embodiment.
  • the dimension in the range indicated by the double arrow is 500 nm.
  • the light absorbing element 10 according to the second embodiment can obtain the same effects as the light absorbing element 10 according to the first embodiment.
  • FIG. 9A shows a configuration of the light absorber 20 according to the embodiment of the present invention.
  • FIG. 9B is a view taken along arrow 9B-9B in FIG. 9A.
  • the light absorber 20 has a large number of light absorption elements 10 and an element support surface 5 a that supports these light absorption elements 10.
  • the element support surface 5 a is the surface of the support 5 of each light absorbing element 10. That is, the surface 5a of the support body 5 in many light absorption elements 10 constitutes one element support surface 5a. Therefore, the support 5 is shared by many light absorption elements 10.
  • Such a support 5 includes an element support surface 5a, a number of protrusions 5b protruding from the element support surface 5a, and a base portion 5c having the element support surface 5a.
  • the protective layer 8 is shared by many light absorbing elements 10. That is, one protective layer 8 is formed on the element support surface 5a (for example, through the metal layer 7 which is not shown), and a large number of light absorbing elements 10 are embedded in the protective layer 8. .
  • a large number of light absorbing elements 10 are arranged on the element support surface 5a.
  • a large number of light absorbing elements 10 may be regularly arranged densely on the element support surface 5a.
  • the multiple light absorbing elements 10 may be densely arranged on the element support surface 5a at random.
  • the light absorption rate by the light absorber 20 increases as the density of the many light absorption elements 10 increases.
  • the interval between adjacent light absorption elements 10 on the element support surface 5a (that is, the dimension of the gap between the light absorption elements 10) is P
  • P When the radial dimension of the spiral structure 3 of the light absorbing element 10 is Q, P may be smaller than Q (for example, P is less than half of Q).
  • the relationship between P and Q is a relationship in the first direction (the left-right direction in FIG. 9B) along the element support surface 5a, but is perpendicular to the first direction and in the second direction along the element support surface 5a ( The same applies to the vertical direction in FIG. 9B.
  • R is smaller than S.
  • Good for example, R is less than half of S.
  • Q and S may be 500 nm or more and 1500 nm or less
  • P and R may be 500 nm or less (for example, 500 nm).
  • the light absorber 20 absorbs light in a continuous wide wavelength range (for example, with an absorption rate of 80% or more).
  • the width of the wide wavelength region is A or more and B or less.
  • A is 100 nm, 200 nm, 500 nm, 1000 nm, 1500 nm, 2000 nm, or 2500 nm, and for each value of A, B may be 6000 nm, 5000 nm, 4000 nm, or 3000 nm.
  • A can be 100 nm, 200 nm, or 500 nm, and for each value of A, B can be 2000 nm or 1000 nm.
  • the width of the wide wavelength range is not limited to the above examples.
  • the light absorber 20 a large number of light absorbing elements 10 absorb light in a wide wavelength range. Since each light absorption element 10 has an ultrafine structure, the light absorption elements 10 can be arranged densely. Therefore, the element support surface 5a of the light absorber 20 can be made black that is close to true black.
  • Such a light absorber 20 may form a black surface for suppressing reflection of light or stray light in an optical apparatus.
  • the light absorber 20 is provided on the target surface 30 a for suppressing reflection or stray light in the optical device 30.
  • the optical apparatus is, for example, a camera, an astronomical telescope, or an optical measurement device (for example, a spectrophotometer), but is not limited thereto.
  • the target surface 30a is, for example, the inner surface of a camera barrel and the back surface of a reflection surface (for example, the back surface of the reflection mirror) in the optical apparatus, but is not limited thereto.
  • the base portion 5c is formed in a sheet shape.
  • the light absorber 20 is also formed in a sheet shape as a whole. Therefore, after manufacturing the sheet-like light absorber 20, the light absorber 20 can be attached to the target surface 30 a of the optical device 30.
  • the light absorber 20 can be manufactured as follows. A large number of spiral structures 3 are simultaneously formed on the common base portion 5c by the manufacturing method according to the first embodiment or the second embodiment described above.
  • the base portion 5c is prepared as the object to be processed 5A, and the above-described steps for each of the multiple spiral structures 3 with respect to the object to be processed 5A. S2 to S5 are performed.
  • the base portion 5c is prepared as the target object 5B, and a large number of spiral structures 3 are formed on the target object 5B. The above-described steps S200 to S500 are performed for each.
  • FIG. 10A shows the experimental results regarding the optical characteristics of the light absorber 20 manufactured according to the manufacturing method of the first embodiment.
  • FIG. 10B is an experimental result regarding the optical characteristics of the light absorber 20 manufactured according to the manufacturing method of the second embodiment.
  • the horizontal axis indicates the wavelength ( ⁇ m)
  • the vertical axis indicates the reflectance of the light incident on the light absorber 20.
  • a wavelength range where the reflectance is low indicates that the light absorptance is high.
  • FIG. 10A and FIG. 10B show the case where a large number of spiral structures 3 are arranged at equal intervals with the interval between adjacent spiral structures 3 (intervals P and R in FIG. 9B) being 500 nm.
  • a light absorption rate of about 80% or more is obtained in the wavelength range of 1.5 ⁇ m to 4 ⁇ m.
  • an optical absorptance of about 80% or more is obtained in the wavelength range of 1.5 ⁇ m to 2 ⁇ m and the wavelength range of 3.2 ⁇ m to 4.3 ⁇ m.
  • the present invention is not limited to the above-described embodiments, and various changes can be made within the scope of the technical idea of the present invention.
  • the effects described above do not necessarily limit the present invention.
  • the present invention may exhibit any of the effects shown in the present specification or other effects that can be grasped from the present specification.
  • any one of the following modification examples 1 to 9 may be adopted alone, or two or more of the modification examples 1 to 9 may be arbitrarily combined and employed. In this case, the points not described below are the same as described above.
  • 11A and 11B are schematic views showing other forms of the spiral structure 3.
  • 11A and 11B are views of the light absorbing element 10 as viewed from the direction of the reference axis C.
  • the linear portion 3b when viewed from the direction of the reference axis C, the linear portion 3b may extend from the base point portion 3a so as to form a substantially N-gonal shape every time the reference axis C is rotated once.
  • N is an integer of 3 or more, 3 in the case of FIG. 11A and 4 in the case of FIG. 11B, but may be 5 or more.
  • the linear portion 3b in the process of extending from the base point portion 3a, the linear portion 3b may be bent so as to be bent N times each time the reference axis C is rotated once, and may extend linearly except at the bent portion. In this case, the first turn may be bent (N + 1) as shown in FIG. 11B.
  • FIG. 11C is a schematic diagram showing another form of the spiral structure 3.
  • FIG. 11C is a diagram of the light absorption element 10 as viewed from the direction of the reference axis C.
  • the linear portion 3b may not be continuous from the coupling position with the base point portion 3a to the tip, and as shown in FIG. 11C, the linear portion 3b is discontinuously from the coupling position with the base point portion 3a to the tip. It may extend. That is, the discontinuous part 41 may exist in the linear part 3b.
  • the discontinuous linear portion 3b may be formed as follows in accordance with the manufacturing method of the first embodiment.
  • a spiral transparent layer made of a transparent material having the same shape and dimensions as the spiral metal layer 15 is formed on the surface of the object 5A.
  • a resist layer is formed on the surface of the object to be processed 5A and the spiral transparent layer, and only the resist layer on the spiral transparent layer is irradiated with an electron beam in a discontinuous spiral pattern.
  • a resist layer having a spiral pattern is melted and removed.
  • a metal layer is formed and a lift-off process is performed, so that a spiral metal layer extending discontinuously on the spiral transparent layer is formed.
  • step S3 described above the spiral transparent layer and the spiral metal layer thereon are separated from the new surface 5a of the workpiece 5A.
  • step S4 described above is not performed, but step S5 described above may be performed.
  • discontinuous linear portion 3b can be formed following the manufacturing method of the second embodiment.
  • the incident angle of the linearly polarized light on the element support surface 5a (the surface 5a of the support 5) is changed, and the light absorber 20 is changed while changing the polarization direction of the linearly polarized light.
  • the light absorption rate of was measured. According to the measurement results, the light absorptance was constant at each wavelength of the incident light regardless of the incident angle and polarization direction of the light.
  • the direction of the protrusion 5b (reference axis C) of each light absorbing element 10 of the light absorber 20 does not affect the light absorption characteristics. Therefore, the protrusion 5b of each light absorbing element 10 may extend from the surface 5a of the support 5 in a direction perpendicular to the surface 5a, or in an oblique direction with respect to the perpendicular direction. Also good.
  • the reference axis C of the spiral structure 3 is oriented in a direction perpendicular to the surface 5a of the support 5, but may be oriented in a direction inclined from the direction perpendicular to the surface 5a.
  • FIG. 12 is a diagram showing another form of the light absorber 20.
  • the support body 5 and a large number of light absorption elements 10 arranged on the element support surface 5a of the support body 5 have a set of light absorption configurations.
  • the light absorber 20 may be formed by stacking a plurality of sets of light absorption structures as shown in FIG.
  • the base portion 5c may be made of a transparent material.
  • the light absorption rate of the light absorber 20 can be further increased by laminating a plurality of sets (for example, many sets).
  • Such a light absorber 20 can be manufactured as follows, for example.
  • a base portion 5c having a second light absorption structure is formed on the protective layer 8 having the first light absorption structure, and the second light absorption structure is laminated on the first light absorption structure.
  • the third and subsequent sets of light absorption structures may be laminated in the same manner.
  • the peripheral metal layer portion 7a may not extend over the entire surface 5a, and may exist only in the vicinity of the spiral structure 3.
  • the metal layer 21 may not extend over the entire surface of the substrate 19, and may exist only in the vicinity of the spiral structure 3.
  • the linear portion 3b gradually approaches the surface 5a of the support 5 while rotating around the reference axis C in the process of extending from the base point portion 3a.
  • the present invention is not limited to this.
  • the linear portion 3b may gradually move away from the surface 5a of the support 5 while rotating around the reference axis C in the process of extending from the base point portion 3a.
  • step S3 or S300 by performing step S3 or S300 in a state where the surface 5a of the object 5A or 5B is directed vertically downward, the linear portion 3b is moved in the process of extending from the base point portion 3a due to gravity. While turning, it gradually moves away from the surface 5a.
  • the spiral structure 3 of each light absorbing element 10 has the same radial dimension. However, there may be a plurality of types of radial dimensions of the multiple spiral structures 3 arranged on the element support surface 5a. With this configuration, it is expected that light in a wider wavelength range can be absorbed.
  • the base point portion 3a and the linear portion 3b of the light absorbing element 10 may be in a state of being coupled to the object to be processed 5A (support 5).
  • steps S3 to S5 may be omitted, and the structure shown in FIGS. 3E and 3F may be the light absorbing element according to the present invention.
  • the spiral metal layer 15 forms a spiral structure of the light absorption element according to the present invention. That is, the base layer portion 15a of the spiral metal layer 15 forms a base portion of the spiral structure, and the linear layer portion 15b of the spiral metal layer 15 forms a linear portion of the spiral structure.
  • the light absorber of the present invention may be formed by forming a large number of the spiral metal layers 15 of FIGS. 3E and 3F on the surface 5a of the single support 5.
  • the light absorption rate of this light absorber was measured.
  • the measurement results are shown in the graph of FIG. In FIG. 13, the horizontal axis indicates the wavelength ( ⁇ m) of incident light to the light absorber, and the vertical axis indicates the light absorption rate of the light absorber.
  • the solid line in FIG. 13 shows the case of the light absorber using the spiral metal layer 15 in FIGS. 3E and 3F obtained by omitting steps S3 to S5.
  • the broken line in FIG. 13 indicates the case of the above-described light absorber 20 obtained by performing the above-described steps S1 to S5.
  • the interval between adjacent spiral structures (intervals corresponding to the intervals P and R in FIG. 9B). was set to about several hundred nanometers.
  • the light absorptivity of the light absorber by the spiral metal layer 15 is the light absorptivity of the light absorber 20 obtained by performing steps S1 to S5 (FIG. 13). Is about 60% or more in the wavelength range of 1.5 ⁇ m to 4 ⁇ m.
  • the processes of steps S300 to S500 may be omitted.
  • the structure shown in FIG. 7G may be a light absorption element according to the present invention.
  • the spiral metal layer 15 forms a spiral structure of the light absorption element according to the present invention. That is, the base layer portion 15a of the spiral metal layer 15 forms a base portion of the spiral structure, and the linear layer portion 15b of the spiral metal layer 15 forms a linear portion of the spiral structure.
  • step S113 for forming the sacrificial layer 23 may be omitted, and the spiral metal layer 15 may be formed on the metal layer 21 in step S200.
  • the light absorber of the present invention may be formed by forming a large number of spiral metal layers 15 shown in FIG. 7G on the surface 5a of one support 5. Also in this case, the sacrificial layer 23 may be omitted as described above.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Filters (AREA)
  • Laminated Bodies (AREA)
PCT/JP2019/015644 2018-04-12 2019-04-10 光吸収素子、光吸収体、及び光吸収素子の製造方法 Ceased WO2019198760A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020513431A JP7325122B2 (ja) 2018-04-12 2019-04-10 光吸収素子、光吸収体、及び光吸収素子の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018076915 2018-04-12
JP2018-076915 2018-04-12

Publications (1)

Publication Number Publication Date
WO2019198760A1 true WO2019198760A1 (ja) 2019-10-17

Family

ID=68163214

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/015644 Ceased WO2019198760A1 (ja) 2018-04-12 2019-04-10 光吸収素子、光吸収体、及び光吸収素子の製造方法

Country Status (2)

Country Link
JP (1) JP7325122B2 (https=)
WO (1) WO2019198760A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023175657A1 (ja) * 2022-03-14 2023-09-21 ソニーグループ株式会社 電磁波吸収体、電磁波遮蔽部材、シールド材、電磁波吸収シート、センサ、受信及び／又は送信を行う装置、並びに受光及び／又は発光を行う装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102778708A (zh) * 2012-07-20 2012-11-14 华中科技大学 一种光波段吸波器
CN103582402A (zh) * 2012-08-03 2014-02-12 深圳光启创新技术有限公司 一种吸波材料
US20150138009A1 (en) * 2012-07-31 2015-05-21 Kuang-Chi Innovative Technology Ltd. Wide-frequency wave-absorbing metamaterial, electronic device and method for obtaining wide-frequency wave-absorbing metamaterial
JP2017532589A (ja) * 2014-08-18 2017-11-02 テヒニッシュ・ウニベルズィテート・ウイーンＴｅｃｈｎｉｓｃｈｅ Ｕｎｉｖｅｒｓｉｔａｔ Ｗｉｅｎ 光ダイオード
CN107479215A (zh) * 2017-07-13 2017-12-15 华中科技大学 一种太赫兹超材料调制方法及其产品
CN109509986A (zh) * 2018-12-20 2019-03-22 厦门大学 基于金属螺旋微结构的石墨烯太赫兹多频吸波器
JP2019066633A (ja) * 2017-09-29 2019-04-25 出光興産株式会社 円偏光吸収フィルタ、並びに該円偏光吸収フィルタを備える光学素子及び該円偏光吸収フィルタを備える有機ｅｌ素子

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102778708A (zh) * 2012-07-20 2012-11-14 华中科技大学 一种光波段吸波器
US20150138009A1 (en) * 2012-07-31 2015-05-21 Kuang-Chi Innovative Technology Ltd. Wide-frequency wave-absorbing metamaterial, electronic device and method for obtaining wide-frequency wave-absorbing metamaterial
CN103582402A (zh) * 2012-08-03 2014-02-12 深圳光启创新技术有限公司 一种吸波材料
JP2017532589A (ja) * 2014-08-18 2017-11-02 テヒニッシュ・ウニベルズィテート・ウイーンＴｅｃｈｎｉｓｃｈｅ Ｕｎｉｖｅｒｓｉｔａｔ Ｗｉｅｎ 光ダイオード
CN107479215A (zh) * 2017-07-13 2017-12-15 华中科技大学 一种太赫兹超材料调制方法及其产品
JP2019066633A (ja) * 2017-09-29 2019-04-25 出光興産株式会社 円偏光吸収フィルタ、並びに該円偏光吸収フィルタを備える光学素子及び該円偏光吸収フィルタを備える有機ｅｌ素子
CN109509986A (zh) * 2018-12-20 2019-03-22 厦门大学 基于金属螺旋微结构的石墨烯太赫兹多频吸波器

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
FANYAEU, I. ET AL.: "Realisation of 3D metamaterial perfect absorber structures by direct laser writing", PROCEEDING OF SPIE, vol. 10115, 20 February 2017 (2017-02-20), XP060085705, DOI: 10.1117/12.2250449 *
HUANG, XIAOJUN ET AL.: "Triple-band polarization-insensitive wide-angle ultra-thin planar spiral metamaterial absorber", JOURNAL OF APPLIED PHYSICS, vol. 113, 7 June 2013 (2013-06-07), pages 213516-1 - 213516-5, XP012174257 *
KAN, TETSUO ET AL.: "Enantiomeric switching of chiral metamaterial for terahertz polarization modulation employing vertically deformable MEMS spirals", NATURE COMMUNICATIONS, vol. 6, no. 8422, 1 October 2015 (2015-10-01), pages 1 - 7, XP055642456 *
KAN, TETSUO ET AL.: "Spiral metamaterial for active tuning of optical activity", APPLIED PHYSICS LETTERS, vol. 102, 5 June 2013 (2013-06-05), pages 221906-1 - 221906-4, XP055642460 *
WANG, WENJIE ET AL.: "Ultra-thin quadri-band metamaterial absorber based on spiral structure", APPLIED PHYSICS A MATERIALS SCIENCE & PROCESSING, vol. 118, no. 2, 13 September 2014 (2014-09-13), pages 443 - 447, XP035431872, DOI: 10.1007/s00339-014-8766-8 *
YU , DINGWANG ET AL.: "A sextuple-band ultra-thin metamaterial absorber with perfect absorption", OPTICS COMMUNICATIONS, 16 March 2017 (2017-03-16), pages 28 - 35, XP029976594 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023175657A1 (ja) * 2022-03-14 2023-09-21 ソニーグループ株式会社 電磁波吸収体、電磁波遮蔽部材、シールド材、電磁波吸収シート、センサ、受信及び／又は送信を行う装置、並びに受光及び／又は発光を行う装置

Also Published As

Publication number Publication date
JPWO2019198760A1 (ja) 2021-04-22
JP7325122B2 (ja) 2023-08-14

Similar Documents

Publication Publication Date Title
Li et al. Parallel laser micro/nano‐processing for functional device fabrication
JP6006718B2 (ja) 光学フィルタ、光学機器、電子機器及び反射防止複合体
JP2020522009A (ja) 分散設計型の誘電性メタ表面による広帯域アクロマティック平坦光学コンポーネント
US7250620B2 (en) EUV lithography filter
Gao et al. Nanoimprinting techniques for large-area three-dimensional negative index metamaterials with operation in the visible and telecom bands
US20150146180A1 (en) Method for fabricating nanoantenna array, nanoantenna array chip and structure for lithography
TWI769137B (zh) 一種用於紫外、極紫外和軟ｘ射線光學元件的塗層及其製備方法
CN106443845A (zh) 一种同心环型拓扑超透镜及其结构获取方法、制作方法
WO2015181818A1 (en) Near-field imaging devices
US20130003180A1 (en) Filter having metamaterial structure and manufacturing method thereof
Wu et al. Tunable multiband metasurfaces by moire nanosphere lithography
Lewicka et al. Nanorings and nanocrescents formed via shaped nanosphere lithography: a route toward large areas of infrared metamaterials
JP2009204900A (ja) 光学素子の反射防止構造、その反射防止構造を備えた光学素子および反射防止構造の加工方法
WO2019198760A1 (ja) 光吸収素子、光吸収体、及び光吸収素子の製造方法
CN106842399A (zh) 一种振幅型分形螺旋波带片
US7332416B2 (en) Methods to manufacture contaminant-gettering materials in the surface of EUV optics
JPWO2019203024A1 (ja) 透明部材及び透明部材の製造方法
JP2006342384A (ja) 全面フィルタ膜付き球レンズの製造方法，製造装置及び全面フィルタ膜付き球レンズ並びに光モジュール
JP7447074B2 (ja) 極紫外線マスクブランクの欠陥の低減
Tong et al. Realization of desired plasmonic structures via a direct laser writing technique
KR101839903B1 (ko) 메타물질을 갖는 마스크 형성 방법
JPWO2019198760A5 (https=)
Brodehl et al. Fabrication of tailored nanoantennas on large areas for plasmonic devices
EP3472669B1 (fr) Systeme et methode de realisation d'un masque pour micro-texturation de surface, installation et methode de micro-texturation de surface
CN111180328A (zh) 用于制造掩模的基底蚀刻方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19785518

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020513431

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19785518

Country of ref document: EP

Kind code of ref document: A1