WO2019198215A1 - Dispositif laser et dispositif de traitement laser - Google Patents
Dispositif laser et dispositif de traitement laser Download PDFInfo
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- WO2019198215A1 WO2019198215A1 PCT/JP2018/015449 JP2018015449W WO2019198215A1 WO 2019198215 A1 WO2019198215 A1 WO 2019198215A1 JP 2018015449 W JP2018015449 W JP 2018015449W WO 2019198215 A1 WO2019198215 A1 WO 2019198215A1
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- laser
- unit
- module
- drive power
- laser module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
Definitions
- the present invention relates to a laser apparatus and a laser processing apparatus that can be expanded to enhance the output of laser light.
- the required intensity of the laser output varies depending on the material of the object to be processed, the processing speed, and the like. For this reason, if it is necessary to increase the laser output by changing the material of the workpiece after the introduction of the laser device, or if it is necessary to increase the processing speed by increasing the number of processing, the laser of the laser device Expansion that enhances output is required.
- Patent Document 1 discloses a technique for expanding an optical fiber amplifying apparatus that amplifies an optical signal by increasing the intensity of light by adding an optical amplifier in series.
- the present invention has been made in view of the above, and it is not necessary to use an excessively high performance optical component even in a state before the expansion for enhancing the intensity of the laser beam. It is an object of the present invention to obtain a laser device capable of using an optical component.
- a laser apparatus includes a laser module capable of oscillating laser light, a housing containing the laser module, a laser module provided in the housing, And an expansion unit capable of storing an additional laser module connected in parallel with the module.
- the laser apparatus according to the present invention does not need to use an excessively high performance optical component even before the expansion to increase the intensity of the laser beam, and can use an optical component that matches the required performance. There is an effect that it is possible.
- the figure which shows the structure of the laser apparatus concerning Embodiment 1 of this invention The figure which shows the connection relation of the component which the laser apparatus shown in FIG. 1 has.
- the figure which shows an example of a detailed structure of the laser unit shown in FIG. The figure which shows the structure of the laser processing apparatus concerning Embodiment 2 of this invention.
- FIG. 1 is a diagram showing a configuration of a laser apparatus 1 according to the first embodiment of the present invention.
- the laser device 1 includes a housing 10, laser modules 20-1, 20-2, and 20-3, drive power supplies 30-1, 30-2, and 30-3, a coupling unit 40, a transmission fiber 41,
- the control unit 50, the water cooling manifold 60, the first fixing portion 70, and the second fixing portion 71 are included. Further, it is possible to add a laser module 20-4 to the first fixed unit 70, and it is possible to add a drive power supply 30-4 to the second fixed unit 71.
- the housing 10 includes laser modules 20-1, 20-2, 20-3, drive power supplies 30-1, 30-2, 30-3, a coupling unit 40, a transmission fiber 41, a control unit 50, A water cooling manifold 60, a first fixing portion 70, and a second fixing portion 71 are incorporated.
- the laser modules 20-1, 20-2, 20-3, and 20-4 can oscillate laser light by supplying power and have a function of outputting the oscillated laser light.
- the laser modules 20-1, 20-2, and 20-3 are arranged inside the housing 10 when the laser device 1 is shipped.
- the laser module 20-4 is added after product shipment.
- the laser modules 20-1, 20-2, 20-3, and 20-4 are connected in parallel.
- a laser module 20 when it is not necessary to distinguish each of the laser modules 20-1, 20-2, 20-3, and 20-4, they are simply referred to as a laser module 20.
- the drive power supplies 30-1, 30-2, 30-3, 30-4 are provided in one-to-one correspondence with the laser modules 20-1, 20-2, 20-3, 20-4, respectively. Power for driving the laser module 20 is supplied.
- the drive power supplies 30-1, 30-2, and 30-3 are arranged inside the housing 10 at the product shipment stage of the laser device 1.
- the drive power supply 30-4 is added after product shipment.
- the drive power supply 30 when it is not necessary to distinguish each of the drive power supplies 30-1, 30-2, 30-3, and 30-4, they are simply referred to as the drive power supply 30.
- the coupling unit 40 combines the laser beams output from each of the plurality of laser modules 20 connected in parallel into one beam.
- the coupling unit 40 outputs the coupled laser light to the transmission fiber 41.
- the combining unit 40 spatially combines a plurality of light paths to form one light beam, a polarization combination that superimposes two lights whose polarization directions differ from each other by 90 degrees, and a plurality of lights that have different wavelengths from each other.
- a plurality of laser beams are coupled using a method such as wavelength coupling or fiber coupling that couples a plurality of optical fibers to one optical component.
- the coupling unit 40 can couple a plurality of laser beams using one or more of the above-described coupling methods. For example, when four laser beams are coupled, the coupling unit 40 couples two lights using polarization coupling, obtains two coupled lights, and then couples two beams using another coupling method, for example, fiber coupling. The combined light can be further combined to obtain one light beam.
- the coupling unit 40 includes three connection interfaces connected to the laser modules 20-1, 20-2, and 20-3 and an empty interface for expansion for connection to the additional laser module 20-4. Have.
- the coupling method used by the coupling unit 40 is not particularly limited, and various coupling methods can be selected and used according to the required performance. For example, when it is desired to expand the wavelength band to be used, it is conceivable to combine laser beams of a plurality of wavelengths using wavelength coupling. On the other hand, since there are many cases where expensive components are required for wavelength coupling, when there is no need to expand the wavelength band, spatial coupling may be used for cost reduction.
- the control unit 50 is connected to each of the plurality of drive power supplies 30, and can control the power supplied to the laser module 20 by controlling each of the plurality of drive power supplies 30.
- the control unit 50 can also perform various interlock controls.
- the control unit 50 has a plurality of connection interfaces with the drive power supply 30.
- the control unit 50 has three connection interfaces connected to the drive power supplies 30-1, 30-2, and 30-3, and an additional empty interface for connection to the drive power supply 30-4.
- the water cooling manifold 60 is a joint portion of a cooling pipe for cooling a heat generating portion in the laser device 1.
- the cooling pipe connected to the water cooling manifold 60 is provided around the laser module 20, the drive power supply 30, and the like, for example.
- the water cooling manifold 60 can switch a path through which cooling water flows through a cooling pipe provided in the laser device 1.
- the cooling pipe is provided not only around the laser modules 20-1, 20-2, and 20-3 previously arranged in the laser apparatus 1, but also around the laser module 20-4 to be added.
- the water cooling manifold 60 has an opening / closing part capable of individually switching the opening / closing of the cooling pipe for each laser module 20. Therefore, before installing the laser module 20-4, the open / close portion is closed so that the cooling water does not flow into the cooling pipe provided around the laser module 20-4, and the laser module 20-4 is installed. In this case, the opening / closing part may be opened so that the cooling water flows to the cooling pipe provided around the laser module 20-4. .
- the arrangement of the cooling pipe is the same as that of the laser module 20 around the drive power supply 30.
- the cooling pipe is provided not only around the drive power supplies 30-1, 30-2, 30-3 that are arranged in advance in the laser apparatus 1, but also around the drive power supply 30-4 to be added.
- the water cooling manifold 60 has an open / close section that can individually switch the open / close of the cooling pipe for each drive power supply 30. For this reason, before the drive power supply 30-4 is added, the open / close portion is closed so that the cooling water does not flow into the cooling pipe provided around the drive power supply 30-4, and the drive power supply 30-4 is turned off. When expanding, the opening / closing part may be opened so that the cooling water flows to the cooling pipe provided around the drive power source 30-4.
- the first fixing unit 70 fixes the plurality of laser modules 20 in the housing 10.
- the first fixing unit 70 is provided with a space for storing the additional laser module 20-4 inside the housing 10.
- the shape of the first fixing unit 70 may be any shape as long as it can fix the additional laser module 20-4, such as a frame, a fastener, a shelf, or the like.
- the second fixing unit 71 fixes the plurality of driving power supplies 30 in the housing 10.
- the second fixing portion 71 is provided with a space for storing the additional drive power supply 30-4 inside the housing 10.
- the shape of the second fixing portion 71 is only required to be able to fix the additional drive power supply 30-4, and is, for example, a frame, a fastener, a shelf or the like.
- FIG. 2 is a diagram showing the connection relationship of the constituent elements of the laser device 1 shown in FIG.
- the drive power supply 30 and the laser module 20 constitute a laser unit 80.
- the laser device 1 includes a laser unit 80-1 including a driving power source 30-1 and a laser module 20-1, a laser unit 80-2 including a driving power source 30-2 and a laser module 20-2, A laser unit 80-3 including a power supply 30-3 and a laser module 20-3.
- the laser device 1 includes an expansion unit 90 that is provided inside the housing 10 and can store an expansion drive power supply 30-4 and an expansion laser module 20-4.
- a laser unit 80-4 (not shown) is configured.
- one laser unit 80 includes one laser module 20 and one drive power supply 30 for driving the laser module 20.
- the laser unit 80 can oscillate laser light independently.
- the expansion unit 90 includes a space for storing the laser module 20-4 and the drive power source 30-4 in the housing 10, a portion of the first fixing unit 70 that fixes the laser module 20-4, a second A portion of the fixing portion 71 that fixes the drive power supply 30-4.
- the extension unit 90 can add the laser module 20 and the drive power supply 30 in units of the laser unit 80.
- the expansion unit 90 can store therein an expansion laser module 20-4 that is connected in parallel to the laser modules 20-1, 20-2, and 20-3 arranged in advance. Further, the extension unit 90 can store therein a drive power source 30-4 that supplies power to the extension laser module 20-4.
- the laser beams output from the laser units 80-1, 80-2, and 80-3 are combined by the combining unit 40 and output to the transmission fiber 41.
- the laser light output from the laser unit 80-4 configured by adding the laser module 20-4 and the drive power supply 30-4 to the expansion unit 90 is also coupled by the coupling unit 40 and output to the transmission fiber 41.
- FIG. 3 is a diagram showing an example of a detailed configuration of the laser unit 80 shown in FIG.
- the laser unit 80 includes a laser module 20 and a drive power supply 30 that supplies drive power to the laser module 20.
- the laser module 20 includes a total reflection mirror 21 and a partial reflection mirror 22, which are at least two reflection mirrors for reciprocating light, and a laser medium for stimulated emission of laser light between the total reflection mirror 21 and the partial reflection mirror 22.
- an excitation unit 23 that excites.
- the total reflection mirror 21 and the partial reflection mirror 22 are an example of a plurality of reflection surfaces constituting a resonator, and the present embodiment is not limited to such an example.
- You may comprise a resonator using three or more reflective surfaces.
- a reflection surface that changes the traveling direction of light may be included on the optical path between two reflection surfaces constituting the resonator, and the reflection surface is not limited to a mirror, but is a reflection function formed by coating. It may be a surface having
- the excitation unit 23 is a discharge unit in which power is applied to the laser gas.
- the excitation unit 23 is a YAG rod unit that is optically excited by doping a laser medium.
- the excitation unit 23 is a laser. It is an active layer doped with a medium and applied with electric power.
- the laser apparatus 1 includes the additional laser module 20-4 connected in parallel with the laser modules 20-1, 20-2, and 20-3. 10 is provided with an expansion unit 90 that can be stored inside. For this reason, it is possible to expand the laser light output intensity by increasing the number of laser modules 20-4.
- the plurality of laser modules 20 are connected in parallel, the light resistance required for the optical components constituting the laser module 20 does not change before and after the expansion for increasing the intensity of the laser light. Therefore, it is not necessary to use an excessively high performance optical component even in a state before the expansion for increasing the intensity of the laser beam, and it is possible to use an optical component that matches the required performance.
- the laser module 20 and the drive power supply 30 can be added in units of the laser unit 80 including the laser module 20 and the drive power supply 30.
- This laser unit 80 can oscillate laser light independently. For this reason, when performing expansion to enhance the output of the laser light, the output of the laser light can be enhanced even if other components already incorporated in the laser device 1 have deteriorated.
- the number of laser modules 20 built in the laser apparatus 1 in advance at the shipping stage is three, and the number of laser modules 20 that can be added after shipment is one.
- the form is not limited to such an example.
- the number of laser modules 20 built in the laser device 1 in advance may be an arbitrary number of 1 or more.
- a plurality of laser modules 20 may be added.
- FIG. FIG. 4 is a diagram showing the configuration of the laser processing apparatus 100 according to the second embodiment of the present invention.
- the laser processing device 100 includes a laser device 1, a processing head 2, a table 3, and a control device 4.
- Laser light output from the laser device 1 is input to the machining head 2 via the transmission fiber 41.
- the laser processing apparatus 100 irradiates the processing target W with laser light from the processing head 2 while changing the relative position between the processing head 2 and the processing target W placed on the table 3, thereby processing the processing target.
- An apparatus for laser processing W is provided.
- the control device 4 controls the operations of the laser device 1, the processing head 2, and the table 3 to perform laser processing on the workpiece W.
- the control device 4 can control the position of the machining head 2 and the position of the table 3 to change the relative position between the machining head 2 and the workpiece W on the table 3.
- the position of the table 3 may be fixed and only the position of the machining head 2 may be changed.
- the laser processing apparatus 100 includes the laser apparatus 1 described in the first embodiment. For this reason, by adding the laser module 20-4 to the laser apparatus 1, it becomes possible to enhance the output of the laser beam used when performing laser processing. At this time, since the plurality of laser modules 20 are connected in parallel, the light resistance required for the optical components constituting the laser module 20 does not change before and after the expansion for increasing the intensity of the laser light. Therefore, it is not necessary to use an excessively high performance optical component even in a state before the expansion for increasing the intensity of the laser beam, and it is possible to use an optical component that matches the required performance.
- the configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.
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- Optics & Photonics (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Abstract
L'invention concerne un dispositif laser (1) qui est caractérisé en ce qu'il comporte des modules laser (20-1, 20-2, 20-3) qui peuvent osciller des faisceaux laser ; un boîtier (10) dans lequel les modules laser (20-1, 20-2, 20-3) sont intégrés ; et une unité d'expansion qui est disposée à l'intérieur du boîtier (10) et qui est capable de stocker un module laser d'expansion (20-4) qui est connecté en parallèle avec les modules laser (20-1, 20-2, 20-3).
Priority Applications (2)
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JP2018549364A JPWO2019198215A1 (ja) | 2018-04-12 | 2018-04-12 | レーザ装置およびレーザ加工装置 |
PCT/JP2018/015449 WO2019198215A1 (fr) | 2018-04-12 | 2018-04-12 | Dispositif laser et dispositif de traitement laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2018/015449 WO2019198215A1 (fr) | 2018-04-12 | 2018-04-12 | Dispositif laser et dispositif de traitement laser |
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WO2019198215A1 true WO2019198215A1 (fr) | 2019-10-17 |
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PCT/JP2018/015449 WO2019198215A1 (fr) | 2018-04-12 | 2018-04-12 | Dispositif laser et dispositif de traitement laser |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007190566A (ja) * | 2006-01-17 | 2007-08-02 | Miyachi Technos Corp | ファイバレーザ加工装置 |
WO2012036664A1 (fr) * | 2010-09-13 | 2012-03-22 | Ipg Photonics Corporation | Système industriel laser à fibres de grande puissance avec ensemble de surveillance optique |
WO2014065360A1 (fr) * | 2012-10-26 | 2014-05-01 | コマツ産機株式会社 | Machine de traitement laser à fibre, procédé de connexion de fibre et oscillateur laser à fibre |
JP2016081993A (ja) * | 2014-10-14 | 2016-05-16 | 株式会社アマダホールディングス | レーザ共振器、レーザ加工装置及びレーザ共振器の除湿方法 |
JP6261810B1 (ja) * | 2016-10-25 | 2018-01-17 | 三菱電機株式会社 | レーザ加工機及びレーザ加工機の演算装置 |
Family Cites Families (2)
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JP2005324869A (ja) * | 2004-05-12 | 2005-11-24 | Mitsubishi Electric Corp | 油圧エレベータの油圧パワー装置 |
JP4940094B2 (ja) * | 2007-10-22 | 2012-05-30 | 三洋電機株式会社 | 電子機器冷却装置 |
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2018
- 2018-04-12 JP JP2018549364A patent/JPWO2019198215A1/ja active Pending
- 2018-04-12 WO PCT/JP2018/015449 patent/WO2019198215A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007190566A (ja) * | 2006-01-17 | 2007-08-02 | Miyachi Technos Corp | ファイバレーザ加工装置 |
WO2012036664A1 (fr) * | 2010-09-13 | 2012-03-22 | Ipg Photonics Corporation | Système industriel laser à fibres de grande puissance avec ensemble de surveillance optique |
WO2014065360A1 (fr) * | 2012-10-26 | 2014-05-01 | コマツ産機株式会社 | Machine de traitement laser à fibre, procédé de connexion de fibre et oscillateur laser à fibre |
JP2016081993A (ja) * | 2014-10-14 | 2016-05-16 | 株式会社アマダホールディングス | レーザ共振器、レーザ加工装置及びレーザ共振器の除湿方法 |
JP6261810B1 (ja) * | 2016-10-25 | 2018-01-17 | 三菱電機株式会社 | レーザ加工機及びレーザ加工機の演算装置 |
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