WO2019198154A1 - Substrat à composant incorporé et procédé de fabrication de substrat à composant incorporé - Google Patents

Substrat à composant incorporé et procédé de fabrication de substrat à composant incorporé Download PDF

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Publication number
WO2019198154A1
WO2019198154A1 PCT/JP2018/015098 JP2018015098W WO2019198154A1 WO 2019198154 A1 WO2019198154 A1 WO 2019198154A1 JP 2018015098 W JP2018015098 W JP 2018015098W WO 2019198154 A1 WO2019198154 A1 WO 2019198154A1
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WO
WIPO (PCT)
Prior art keywords
insulator
electronic component
adhesive portion
insulating adhesive
component
Prior art date
Application number
PCT/JP2018/015098
Other languages
English (en)
Japanese (ja)
Inventor
光昭 戸田
松本　徹
竜也 佐々木
小笠原　勝
Original Assignee
株式会社メイコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to JP2020512976A priority Critical patent/JPWO2019198154A1/ja
Priority to PCT/JP2018/015098 priority patent/WO2019198154A1/fr
Priority to TW108106603A priority patent/TW202002729A/zh
Publication of WO2019198154A1 publication Critical patent/WO2019198154A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a component-embedded substrate that incorporates an electronic component and a method for manufacturing the same.
  • Patent Document 1 discloses a component built-in substrate and a manufacturing method thereof.
  • Patent Document 1 a structure in which a plurality of electronic components having different thicknesses are embedded by prepreg is used.
  • a manufacturing method is performed in which each electronic component is mounted on a double-sided plate on which a laser via and a circuit pattern are formed and then integrated using a prepreg. ing.
  • the component-embedded substrate disclosed in Patent Document 1 is drawn from the mounting land to the outer layer wiring pattern via the laser via, so that a large wiring space is required and it is difficult to reduce the size of the component-embedded substrate itself.
  • a conductive connection material is used for electrical connection between the built-in electronic component and the mounting land, but the material cost of the conductive connection material is relatively high, which increases the cost of the component-embedded substrate itself.
  • the heat-resistant temperature of the conductive connecting material is lowered, it is difficult to ensure excellent connection reliability.
  • two electronic components mounted on one printed wiring board are only mounted with solder or the like, it is difficult to change the mounting positions of the electronic components so as to be different from each other. And when the height of the electronic component built in the center changes, it is necessary to change the dimension of the opening corresponding to the electronic component, and with the additional processing of the double-sided board located on the upper side, the component built-in substrate The cost of itself will increase.
  • the present invention has been made in view of such a problem, and an object of the present invention is to easily incorporate electronic components having different heights, to provide excellent connection reliability, and to reduce costs.
  • An object of the present invention is to provide a component-embedded substrate and a method for manufacturing the component-embedded substrate.
  • a component-embedded substrate of the present invention includes a first insulator, a first outer layer wiring pattern formed on a first surface of the first insulator, and the first insulator of the first insulator.
  • An inner layer wiring pattern formed on the second surface opposite to the first surface, a second insulator laminated on the first insulator while being in contact with the inner layer wiring pattern, and the second insulator A second outer layer wiring pattern formed on the surface opposite to the contact surface with the inner layer wiring pattern, an electronic component embedded in the second insulator, and the electronic component as a first of the first insulator.
  • the first wiring pattern is formed on the first surface of the first insulator, and the second wiring pattern is formed on the second surface.
  • the present invention it is possible to provide a component-embedded substrate that can easily incorporate electronic components of different heights, have excellent connection reliability, and can reduce costs, and a method for manufacturing the same.
  • FIG. 1 is a schematic sectional view of the component-embedded substrate according to the present embodiment.
  • the component-embedded substrate 10 in this embodiment includes a first insulator (first insulating layer) 11 and a second insulator (second insulating layer) 12. It has a laminated structure in which the second insulator 12 is laminated thereon.
  • first insulator first insulating layer
  • second insulator second insulating layer
  • the 1st insulator 11 and the 2nd insulator 12 are comprised, for example from the prepreg, it is possible to use the insulating resin material which is a structural member of a prepreg, the same or different.
  • the component-embedded substrate 10 has two outer layer wiring patterns (first outer layer wiring pattern 13 and second outer layer wiring pattern 14) and one inner layer wiring pattern 15. Specifically, the first outer layer wiring pattern 13 is formed on the first surface 11a of the first insulator 11, the second outer layer wiring pattern 14 is formed on the first surface 12a of the second insulator 12, and the first An inner wiring pattern 15 is formed between the first insulator 11 and the second insulator 12 (that is, on the second surface 11b of the first insulator 11). In this embodiment, all the wiring patterns are made of copper, but other metals (gold, silver) or the like may be used.
  • first electronic component 16 and a second electronic component (additional electronic component) 17 are embedded in the second insulator 12.
  • the first electronic component 16 is mounted so as to be fixed to the second surface 11 b side of the first insulator 11 by the first insulating adhesive portion 18.
  • the second electronic component 17 is mounted so as to be fixed to the second surface 11 b side of the first insulator 11 by the second insulating adhesive portion 19.
  • the first electronic component 16 and the second electronic component 17 have different dimensions, and the height of the first electronic component 16 (the dimension in the stacking direction of the insulator) is the second electronic component 17. It is smaller than the height.
  • the first electronic component 16 and the second electronic component 17 may be components having different functions or characteristics, but may be components having the same function and only different dimensions.
  • a first laser via 21 is connected to a connection terminal (not shown) of the first electronic component 16, and a second laser via 22 is connected to a connection terminal (not shown) of the second electronic component 17.
  • the first laser via 21 penetrates through the second insulator 12 and electrically connects the second outer layer wiring pattern 14 and the connection terminal of the first electronic component 16.
  • the second laser via 22 penetrates the first insulator 11 and the second insulating adhesive portion 19 and electrically connects the first outer layer wiring pattern 13 and the connection terminal of the second electronic component 17. .
  • each electronic component and each outer layer wiring pattern are electrically connected by each laser via, in the component-embedded substrate 10 according to the present embodiment, complicated wiring and connection structures are unnecessary, and the component is built-in.
  • the substrate 10 itself can be configured with high density. Further, the connection reliability is improved by the laser via, and the component-embedded substrate 10 according to this embodiment has high reliability.
  • the inner layer wiring pattern 15 includes a dummy wiring 15a that is disposed between the first insulator 11 and the first insulating adhesive portion 18 and is not electrically connected to the outside. That is, the first insulating bonding portion 18 is provided on the dummy wiring 15a and is also provided so as to fill a gap in the dummy wiring 15a. In other words, the first insulating adhesive portion 18 is provided so as to cover a part of the dummy wiring 15a and a part of the non-formation region of the dummy wiring 15a (the exposed region of the first insulator 11). For this reason, the 1st insulating adhesion part 18 is provided with the uneven
  • the first electronic component 16 Since the first insulating adhesive portion 18 is provided so as to be laminated on the dummy wiring 15a, the first electronic component 16 is provided to the first outer layer wiring pattern 13 by the thickness of the dummy wiring 15a. It will be mounted at such a position as to be separated from each other. That is, in this embodiment, the embedding position of the first electronic component 16 is adjusted not only by the thickness of the first insulating adhesive portion 18 but also by the thickness of the dummy wiring 15a. For this reason, the embedding position of the first electronic component 16 can be easily adapted to the desired optimum design only by changing the thickness of the dummy wiring 15a.
  • the size of the gap of the dummy wiring 15a it is possible to adjust the amount of the material of the first insulating adhesive portion 18 filled in the gap, and the position where the first electronic component 16 is embedded is adjusted. It becomes easy to adapt to the desired optimum design.
  • the component-embedded substrate 10 according to the present embodiment it is possible to easily incorporate electronic components having different heights.
  • the second insulating adhesive portion 19 is provided only on the second surface 11 b of the first insulator 11 exposed in the non-formation region of the inner layer wiring pattern 15. For this reason, unlike the first insulating adhesive portion 18, the second insulating adhesive portion 19 has a flat shape.
  • the thickness of the second insulating adhesive portion 19 is smaller than the thickness of the first insulating adhesive portion 18.
  • the thickness of the first insulating adhesive portion 18 when the thickness of the first insulating adhesive portion 18 is simply referred to, it means the maximum thickness of the first insulating adhesive portion 18, and specifically, the first laser via 21 penetrates. The thickness of the part.
  • the second electronic component 17 is compared with the first electronic component 16 due to the absence of the dummy wiring 15 a and the thickness of the second insulating adhesive portion 19. It is mounted at a position closer to the outer layer wiring pattern 13. In other words, the contact surface between the second electronic component 17 and the second laser via 22 is located closer to the first outer layer wiring pattern 13 than the contact surface between the first electronic component 16 and the first laser via 21. It will be.
  • the difference in the dimension depends on the thickness of the dummy wiring 15 a and the first insulating adhesive portion 18.
  • the thickness of the dummy wiring 15a and the first insulating adhesive portion 18 the surface opposite to the contact surface of the first electronic component 16 with respect to the first insulating adhesive portion 18 ( The upper surface) and the surface (upper surface) opposite to the contact surface of the second electronic component 17 with respect to the second insulating adhesive portion 19 are positioned at the same height with respect to the first outer layer wiring pattern 13. Yes.
  • FIGS. 2 to 6 are schematic cross-sectional views in each manufacturing process of the method for manufacturing a component-embedded substrate according to the present embodiment.
  • a first wiring pattern (first outer layer wiring pattern 13 when completed) is formed on the first surface 11a of the first insulator 11, and a second wiring pattern (inner layer wiring pattern 15 when completed) is formed on the second surface 11b. ) Is formed (FIG. 2: preparation step). Specifically, the substrate having the metal thin film formed on the front and back surfaces of the prepreg is patterned by etching to form the double-sided wiring board 31 on which each wiring pattern is formed. At this time, the dummy wiring 15a is formed in the region where the first insulating bonding portion 18 for mounting the first electronic component 16 is formed, and the dummy wiring 15a is formed in the region where the second insulating bonding portion 19 is formed. The wiring 15a is not formed.
  • the first insulating adhesive portion 18 and the second insulating adhesive portion 19 are formed on the second surface 11b side of the first insulator 11 (FIG. 3: adhesive portion forming step). Specifically, using a metal mask and a squeegee in which a desired opening is formed, an insulating adhesive serving as a material for the first insulating adhesive portion 18 and the second insulating adhesive portion 19 is applied. As a result, the first insulating bonding portion 18 is formed on the second surface 11b of the first insulator 11 exposed between the dummy wiring 15a and the dummy wiring 15a, and the position is different from the position where the first insulating bonding portion 18 is formed.
  • the second insulating adhesive portion 19 is formed only on the second surface 11 b of the first insulator 11.
  • the first insulating adhesive portion 18 is also formed so as to fill the space between the dummy wirings 15 a, the thickness of the first insulating adhesive portion 18 is larger than the thickness of the second insulating adhesive portion 19. It is getting bigger.
  • the insulating adhesive may be applied using a discharge device such as a dispenser.
  • the first electronic component 16 is mounted on the first insulating adhesive portion 18 and the second electronic component 17 is mounted on the second insulating adhesive portion 19 (FIG. 4: mounting process).
  • the mounting is performed using a known chip mounter.
  • the position of the upper surface of the first insulating adhesive portion 18 is set higher than the position of the upper surface of the second insulating adhesive portion 19 so that the dimensional difference of the electronic component can be offset. Therefore, the upper surface of the first electronic component 16 and the upper surface of the second electronic component 17 are flush with each other.
  • the first electronic component 16 and the second electronic component 17 are embedded in the second insulator 12 (FIGS. 5 and 6: an embedding process).
  • a laminate 32 in which a third wiring pattern (second outer layer wiring pattern 14 upon completion) is formed on the first surface 12a of the second insulator 12 made of a resin-free material such as a prepreg is prepared.
  • Lay-up is performed so that the second surface 12b of the second insulator 12 of the multilayer body 32 faces the first electronic component 16 and the second electronic component 17, and this is pressed while heating under vacuum.
  • This press is performed using, for example, a vacuum press machine.
  • a first laser via 21 that penetrates through the second insulator 12 and electrically connects the third wiring pattern to be the second outer layer wiring pattern 14 and the first electronic component 16, and the first insulator 11 and the first insulator (2)
  • a second laser via 22 penetrating through the insulating adhesive portion 19 and electrically connecting the first wiring pattern to be the first outer layer wiring pattern 13 and the second electronic component 17 is formed (FIG. 1: via forming step). .
  • a CO 2 laser via formation portions to remove members of the irradiated portion of the CO 2 laser, to form a desired opening.
  • the present invention is not limited to the CO 2 laser, and for example, a high frequency laser such as UV-YAG or excimer may be used.
  • a desmear process and to remove the resin remaining when the opening is formed it is preferable to perform a desmear process and to remove the resin remaining when the opening is formed. It is also preferable to perform a soft etching process to remove oxides and organic substances. Thereafter, a known plating process is performed on the opening, and a conductor made of copper is filled to complete the first laser via 21 and the second laser via 22.
  • the formation of the component-embedded substrate 10 as shown in FIG. 1 is completed.
  • the plurality of component-embedded substrates 10 are manufactured as one substrate, and after the formation of the plurality of component-embedded substrates 10, the one substrate is cut and finally A plurality of component built-in substrates 10 are manufactured simultaneously.
  • the first electronic component 16 and the second outer layer wiring pattern 14 are directly and connected by the first laser via 21, a large wiring space is not necessary, and the component-embedded substrate 10 itself is small. Can be easily achieved. Further, due to the electrical connection by the first laser via 21, it is possible to increase the density and reliability of the component-embedded substrate 10. Furthermore, since the built-in first electronic component 16 is mounted by the relatively inexpensive first insulating adhesive portion 18, the cost of the component-embedded substrate 10 itself can be reduced.
  • the 1st insulating adhesion part 18 can also ensure the outstanding connection reliability.
  • the embedded position (mounting height) of the first electronic component 16 can be adjusted by the dummy wiring 15a and the first insulating adhesive portion 18, it is possible to easily incorporate electronic components having different heights. become.
  • the manufacturing method in which the insulator must be processed is compared.
  • the manufacturing process is reduced. For this reason, the manufacturing cost and material cost related to the component-embedded substrate 10 can be reduced as compared with the related art.
  • the component-embedded substrate 10 in this embodiment can easily incorporate electronic components of different heights, and can have excellent connection reliability and cost reduction.
  • the second insulating adhesive portion 19 for mounting the second electronic component 17 having a large height dimension is the first insulator 11. Therefore, the upper surface of the first electronic component 16 and the upper surface of the second electronic component 17 can be mounted so as to be flush with each other. This makes it possible to improve the embedding characteristics of electronic components with a simple and inexpensive structure.
  • connection terminals are formed on one side of the electronic component.
  • connection terminals are formed on both sides of the electronic component, and the laser via is electrically connected to the connection terminal. May be formed.
  • a third laser via 41 may be formed for the first electronic component 16.
  • the third laser via 41 penetrates the first insulator 11 and the first insulative bonding portion 18 and electrically connects the connection terminals (not shown) of the first outer layer wiring 13 and the first electronic component 16. Connected.
  • the thickness of the dummy wiring 15a and the dimension of the gap between the dummy wirings 15a are designed in consideration of the formation of laser vias on the front and back surfaces of the first electronic component 16.
  • the components can be built in and electrically connected without reducing the connection reliability of the first laser via 21 or the third laser via 41.
  • the third laser via 41 penetrates the first insulating adhesive portion 18 in the region where the dummy wiring 15a is not formed. For this reason, since the third laser via 41 and the dummy wiring 15a do not come into contact with each other, the dummy wiring 15a is not electrically connected to the outside of the component-embedded substrate 10 via the third laser via 41. For this reason, no noise or the like occurs with respect to the supply of voltage, current, or signal to the first electronic component 16, and the operation and control of the first electronic component 16 can be performed with higher accuracy.
  • the component-embedded substrate 10 includes two electronic components, but may have a structure including only the first electronic component 16. Even in such a structure, since the first insulating bonding portion 18 is formed on the dummy wiring 15a, the same effects as those of the above-described embodiment can be obtained.
  • the first insulating adhesive portion 18 is also formed in the gap between the dummy wirings 15a, but the first insulating adhesive portion 18 is not in contact with the first insulator 11.
  • the dummy wiring 15a may be formed. That is, the wiring pattern of the dummy wiring 15a may be designed so that the first insulating bonding portion 18 is positioned on the dummy wiring 15a, or the formation position of the first insulating bonding portion 18 may be designed.
  • the component-embedded substrate according to the first embodiment of the present invention includes a first insulator, a first outer layer wiring pattern formed on a first surface of the first insulator, and the first insulator of the first insulator.
  • An inner layer wiring pattern formed on the second surface opposite to the surface; a second insulator stacked on the first insulator while being in contact with the inner layer wiring pattern; and the inner layer of the second insulator A second outer layer wiring pattern formed on the surface opposite to the contact surface with the wiring pattern; an electronic component embedded in the second insulator; and the electronic component as a second of the first insulator.
  • the electronic component and the first outer layer wiring pattern are directly and connected by the laser via, a large wiring space is not required, and the component-embedded substrate itself can be easily downsized. Further, the electrical connection by the laser via can increase the density and reliability of the component-embedded substrate. Furthermore, since the built-in electronic component is mounted by a relatively inexpensive insulating adhesive portion, the cost of the component-embedded substrate itself can be reduced. And since the heat-resistant temperature does not become low like an electroconductive connection material, an insulating adhesive part can also ensure the outstanding connection reliability. In addition, since the embedded position (mounting height) of the electronic component can be adjusted by the dummy wiring and the insulating adhesive portion, it is possible to easily incorporate electronic components having different heights.
  • the first embodiment it is possible to provide a component-embedded substrate that can easily incorporate electronic components of different heights, has excellent connection reliability, and can reduce costs.
  • the insulating adhesive portion is in contact with the first insulator in a region where the dummy wiring is not formed.
  • the component-embedded substrate according to the third embodiment of the present invention includes an additional electronic component embedded in the second insulator and having a size different from that of the electronic component in the first or second embodiment described above, An additional insulating adhesive portion for fixing an additional electronic component to the second surface side of the first insulator; and the first outer layer wiring pattern passing through the second insulator and the additional insulating adhesive portion; And an additional laser via that electrically connects the additional electronic component, wherein the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses.
  • the component-embedded substrate according to the fourth embodiment of the present invention is that, in the third embodiment described above, the additional insulating adhesive portion is provided only on the second surface of the first insulator. .
  • the component-embedded substrate according to the fifth embodiment of the present invention is the above-described fourth embodiment, wherein the height of the additional electronic component is greater than the height of the electronic component, and the thickness of the additional insulating adhesive portion. Is smaller than the thickness of the insulating adhesive portion.
  • a component-embedded substrate according to a sixth embodiment of the present invention is the above-described fifth embodiment, wherein the electronic component has a surface opposite to the contact surface of the electronic component with respect to the insulating adhesive portion and the additional insulating adhesive portion.
  • the surface opposite to the contact surface of the additional electronic component is located at the same height with respect to the first outer layer wiring pattern.
  • the double-sided wiring board in which the first wiring pattern is formed on the first surface of the first insulator and the second wiring pattern is formed on the second surface A preparatory step for preparing the first insulator, an adhesive forming step for forming an insulating adhesive portion on the second surface side of the first insulator, a mounting step for mounting an electronic component on the insulating adhesive portion, and a third wiring
  • An embedding step of embedding the electronic component in a second insulator having a pattern formed on the surface, and a laser via penetrating the second insulator and electrically connecting the third wiring pattern and the electronic component are formed. Forming a via, and forming the insulating adhesive portion on the second surface of the first insulator and on the second wiring pattern in the adhesive portion forming step. That is.
  • a component-embedded substrate that can easily incorporate electronic components of different heights, has excellent connection reliability, and can reduce costs is manufactured. Can do.
  • the component-embedded substrate manufacturing method is the seventh embodiment described above, wherein in the bonding portion forming step, additional insulating bonding is performed at a position different from the formation position of the insulating bonding portion. Forming an additional part, mounting an additional electronic component on the additional insulating adhesive part in the mounting step, and penetrating the first insulator and the additional insulating adhesive part in the via forming step, An additional laser via that electrically connects the first wiring pattern and the additional electronic component is formed, and the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses.
  • the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.
  • the component-embedded substrate manufacturing method is the above-described eighth embodiment, wherein in the bonding portion forming step, the additional insulating bonding portion is disposed on the second surface of the first insulator. It is only to form. Thereby, since the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.
  • the component-embedded substrate manufacturing method is the above-described ninth embodiment, wherein in the mounting step, a surface opposite to the contact surface of the electronic component with respect to the insulating adhesive portion; It is mounted so that the surface opposite to the contact surface of the additional electronic component with respect to the additional insulating adhesive portion is located at the same height with respect to the first wiring pattern. Thereby, the embedding property of the electronic component itself can be improved.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente invention comprend : un premier isolant (11) ; un premier motif de câblage de couche externe (13) formé sur une première surface du premier isolant ; un motif de câblage de couche interne (15) formé sur une seconde surface sur le côté opposé du premier isolant par rapport à la première surface ; un second isolant (12) stratifié sur le premier isolant et en contact avec le motif de câblage de couche interne ; un second motif de câblage externe (14) formé sur la surface positionnée sur le côté opposé du second isolant par rapport à la surface en contact avec le motif de câblage de couche interne ; un composant électronique (16) intégré dans le second isolant ; une partie adhésive isolante (18) qui fixe le composant électronique du côté seconde surface du premier isolant ; et un trou d'interconnexion laser qui passe à travers le second isolant et connecte électriquement le second motif de câblage de couche externe et le composant électronique, le motif de câblage de couche interne étant disposé entre le premier isolant et la partie adhésive isolante, et comprenant un fil factice qui est électriquement déconnecté de l'extérieur.
PCT/JP2018/015098 2018-04-10 2018-04-10 Substrat à composant incorporé et procédé de fabrication de substrat à composant incorporé WO2019198154A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020512976A JPWO2019198154A1 (ja) 2018-04-10 2018-04-10 部品内蔵基板、及び部品内蔵基板の製造方法
PCT/JP2018/015098 WO2019198154A1 (fr) 2018-04-10 2018-04-10 Substrat à composant incorporé et procédé de fabrication de substrat à composant incorporé
TW108106603A TW202002729A (zh) 2018-04-10 2019-02-27 構件內置基板以及構件內置基板的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/015098 WO2019198154A1 (fr) 2018-04-10 2018-04-10 Substrat à composant incorporé et procédé de fabrication de substrat à composant incorporé

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WO2019198154A1 true WO2019198154A1 (fr) 2019-10-17

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TW (1) TW202002729A (fr)
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246758A (ja) * 2000-12-15 2002-08-30 Ibiden Co Ltd プリント配線板
JP2005347359A (ja) * 2004-05-31 2005-12-15 Sanyo Electric Co Ltd 回路装置
JP2012212951A (ja) * 2012-08-10 2012-11-01 Taiyo Yuden Co Ltd 複合多層基板およびそれを用いたモジュール
JP2014027311A (ja) * 2013-11-05 2014-02-06 Tdk Corp 電子部品内蔵基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246758A (ja) * 2000-12-15 2002-08-30 Ibiden Co Ltd プリント配線板
JP2005347359A (ja) * 2004-05-31 2005-12-15 Sanyo Electric Co Ltd 回路装置
JP2012212951A (ja) * 2012-08-10 2012-11-01 Taiyo Yuden Co Ltd 複合多層基板およびそれを用いたモジュール
JP2014027311A (ja) * 2013-11-05 2014-02-06 Tdk Corp 電子部品内蔵基板の製造方法

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TW202002729A (zh) 2020-01-01

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