WO2019198154A1

WO2019198154A1 - Substrate with built-in component and method for manufacturing substrate with built-in component

Info

Publication number: WO2019198154A1
Application number: PCT/JP2018/015098
Authority: WO
Inventors: 光昭戸田; 松本　徹; 竜也佐々木; 小笠原　勝
Original assignee: 株式会社メイコー
Priority date: 2018-04-10
Filing date: 2018-04-10
Publication date: 2019-10-17
Also published as: TW202002729A; JPWO2019198154A1

Abstract

The present invention has: a first insulator (11); a first outer layer wiring pattern (13) formed on a first surface of the first insulator; an inner layer wiring pattern (15) formed on a second surface on the opposite side of the first insulator from the first surface; a second insulator (12) laminated on the first insulator and contacting the inner layer wiring pattern; a second outer wiring pattern (14) formed on the surface positioned on the opposite side of the second insulator from the surface contacting the inner layer wiring pattern; an electronic component (16) embedded in the second insulator; an insulating adhesive part (18) that fixes the electronic component to the second surface side of the first insulator; and a laser via that passes through the second insulator and electrically connects the second outer layer wiring pattern and the electronic component, wherein the inner layer wiring pattern is arranged between the first insulator and the insulating adhesive part, and includes a dummy wire that is electrically disconnected from the outside.

Description

Component built-in substrate and method for manufacturing component built-in substrate

The present invention relates to a component-embedded substrate that incorporates an electronic component and a method for manufacturing the same.

Conventionally, research and development has been conducted to reduce the size, thickness, weight, and functionality of various electrical and electronic devices. In particular, consumer products such as mobile phones, notebook computers, and digital cameras are strongly required to be smaller, thinner, and lighter while being multi-functional. Further, in various electric / electronic devices, transmission signals have been increased in frequency and speed, and it is also required to prevent an increase in signal noise associated therewith.

In order to realize such a requirement, various types of electrical / electronic components (hereinafter simply referred to as electronic components) that have been conventionally mounted on the substrate surface are used as circuit boards to be incorporated in electrical / electronic devices. Research and development and manufacture of a component-embedded substrate having a structure built in an insulating base material and a component-embedded multilayer circuit substrate obtained by stacking the component-embedded substrates have been conventionally performed. For example, Patent Document 1 discloses a component built-in substrate and a manufacturing method thereof.

In the component-embedded substrate disclosed in Patent Document 1, a structure in which a plurality of electronic components having different thicknesses are embedded by prepreg is used. In particular, in Patent Document 1, for each electronic component, a manufacturing method is performed in which each electronic component is mounted on a double-sided plate on which a laser via and a circuit pattern are formed and then integrated using a prepreg. ing.

JP 2005-142178 A

However, the component-embedded substrate disclosed in Patent Document 1 is drawn from the mounting land to the outer layer wiring pattern via the laser via, so that a large wiring space is required and it is difficult to reduce the size of the component-embedded substrate itself. In addition, a conductive connection material is used for electrical connection between the built-in electronic component and the mounting land, but the material cost of the conductive connection material is relatively high, which increases the cost of the component-embedded substrate itself. Furthermore, since the heat-resistant temperature of the conductive connecting material is lowered, it is difficult to ensure excellent connection reliability. Furthermore, since two electronic components mounted on one printed wiring board are only mounted with solder or the like, it is difficult to change the mounting positions of the electronic components so as to be different from each other. And when the height of the electronic component built in the center changes, it is necessary to change the dimension of the opening corresponding to the electronic component, and with the additional processing of the double-sided board located on the upper side, the component built-in substrate The cost of itself will increase.

The present invention has been made in view of such a problem, and an object of the present invention is to easily incorporate electronic components having different heights, to provide excellent connection reliability, and to reduce costs. An object of the present invention is to provide a component-embedded substrate and a method for manufacturing the component-embedded substrate.

In order to achieve the above object, a component-embedded substrate of the present invention includes a first insulator, a first outer layer wiring pattern formed on a first surface of the first insulator, and the first insulator of the first insulator. An inner layer wiring pattern formed on the second surface opposite to the first surface, a second insulator laminated on the first insulator while being in contact with the inner layer wiring pattern, and the second insulator A second outer layer wiring pattern formed on the surface opposite to the contact surface with the inner layer wiring pattern, an electronic component embedded in the second insulator, and the electronic component as a first of the first insulator. 2 having an insulating adhesive portion fixed to the surface side, and a laser via that penetrates the second insulator and electrically connects the second outer layer wiring pattern and the electronic component, and the inner layer wiring pattern is , Disposed between the first insulator and the insulating adhesive portion. And includes dummy wiring comprising an external electrically disconnected.

In order to achieve the above object, according to the method for manufacturing a component-embedded substrate of the present invention, the first wiring pattern is formed on the first surface of the first insulator, and the second wiring pattern is formed on the second surface. A preparation step of preparing a double-sided wiring board, an adhesive portion forming step of forming an insulating adhesive portion on the second surface side of the first insulator, and a mounting step of mounting an electronic component on the insulating adhesive portion; An embedding step of embedding the electronic component in a second insulator having a third wiring pattern formed on the surface, and electrically connecting the third wiring pattern and the electronic component through the second insulator. Forming a laser via, and forming the insulating adhesive portion on the second surface of the first insulator and on the second wiring pattern in the adhesive portion forming step. .

According to the present invention, it is possible to provide a component-embedded substrate that can easily incorporate electronic components of different heights, have excellent connection reliability, and can reduce costs, and a method for manufacturing the same.

It is a schematic sectional drawing of the component built-in board | substrate which concerns on the Example of this invention. It is a schematic sectional drawing in each manufacturing process of the manufacturing method of the component built-in board based on the Example of this invention. It is a schematic sectional drawing in each manufacturing process of the manufacturing method of the component built-in board based on the Example of this invention. It is a schematic sectional drawing in each manufacturing process of the manufacturing method of the component built-in board based on the Example of this invention. It is a schematic sectional drawing in each manufacturing process of the manufacturing method of the component built-in board based on the Example of this invention. It is a schematic sectional drawing in each manufacturing process of the manufacturing method of the component built-in board based on the Example of this invention. It is a schematic sectional drawing of the component built-in board | substrate which concerns on the modification different from the Example of this invention.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in detail based on examples. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. The drawings used to describe the embodiments schematically show the component-embedded substrate and its constituent members according to the present invention, and are partially emphasized, enlarged, reduced, or omitted to deepen the understanding. In some cases, the scale does not accurately represent the scale and shape of the component-embedded substrate and its constituent members. Furthermore, the various numerical values used in the embodiments are only examples, and can be variously changed as necessary.

<Example>
First, a component built-in substrate according to an embodiment of the present invention will be described in detail with reference to FIG. Here, FIG. 1 is a schematic sectional view of the component-embedded substrate according to the present embodiment.

As shown in FIG. 1, the component-embedded substrate 10 in this embodiment includes a first insulator (first insulating layer) 11 and a second insulator (second insulating layer) 12. It has a laminated structure in which the second insulator 12 is laminated thereon. Although the 1st insulator 11 and the 2nd insulator 12 are comprised, for example from the prepreg, it is possible to use the insulating resin material which is a structural member of a prepreg, the same or different.

The component-embedded substrate 10 has two outer layer wiring patterns (first outer layer wiring pattern 13 and second outer layer wiring pattern 14) and one inner layer wiring pattern 15. Specifically, the first outer layer wiring pattern 13 is formed on the first surface 11a of the first insulator 11, the second outer layer wiring pattern 14 is formed on the first surface 12a of the second insulator 12, and the first An inner wiring pattern 15 is formed between the first insulator 11 and the second insulator 12 (that is, on the second surface 11b of the first insulator 11). In this embodiment, all the wiring patterns are made of copper, but other metals (gold, silver) or the like may be used.

Furthermore, a first electronic component 16 and a second electronic component (additional electronic component) 17 are embedded in the second insulator 12. Here, the first electronic component 16 is mounted so as to be fixed to the second surface 11 b side of the first insulator 11 by the first insulating adhesive portion 18. On the other hand, the second electronic component 17 is mounted so as to be fixed to the second surface 11 b side of the first insulator 11 by the second insulating adhesive portion 19.

In the present embodiment, the first electronic component 16 and the second electronic component 17 have different dimensions, and the height of the first electronic component 16 (the dimension in the stacking direction of the insulator) is the second electronic component 17. It is smaller than the height. The first electronic component 16 and the second electronic component 17 may be components having different functions or characteristics, but may be components having the same function and only different dimensions.

A first laser via 21 is connected to a connection terminal (not shown) of the first electronic component 16, and a second laser via 22 is connected to a connection terminal (not shown) of the second electronic component 17. Has been. Here, the first laser via 21 penetrates through the second insulator 12 and electrically connects the second outer layer wiring pattern 14 and the connection terminal of the first electronic component 16. Similarly, the second laser via 22 penetrates the first insulator 11 and the second insulating adhesive portion 19 and electrically connects the first outer layer wiring pattern 13 and the connection terminal of the second electronic component 17. .

As described above, since each electronic component and each outer layer wiring pattern are electrically connected by each laser via, in the component-embedded substrate 10 according to the present embodiment, complicated wiring and connection structures are unnecessary, and the component is built-in. The substrate 10 itself can be configured with high density. Further, the connection reliability is improved by the laser via, and the component-embedded substrate 10 according to this embodiment has high reliability.

In the present embodiment, the inner layer wiring pattern 15 includes a dummy wiring 15a that is disposed between the first insulator 11 and the first insulating adhesive portion 18 and is not electrically connected to the outside. That is, the first insulating bonding portion 18 is provided on the dummy wiring 15a and is also provided so as to fill a gap in the dummy wiring 15a. In other words, the first insulating adhesive portion 18 is provided so as to cover a part of the dummy wiring 15a and a part of the non-formation region of the dummy wiring 15a (the exposed region of the first insulator 11). For this reason, the 1st insulating adhesion part 18 is provided with the uneven | corrugated shape.

Since the first insulating adhesive portion 18 is provided so as to be laminated on the dummy wiring 15a, the first electronic component 16 is provided to the first outer layer wiring pattern 13 by the thickness of the dummy wiring 15a. It will be mounted at such a position as to be separated from each other. That is, in this embodiment, the embedding position of the first electronic component 16 is adjusted not only by the thickness of the first insulating adhesive portion 18 but also by the thickness of the dummy wiring 15a. For this reason, the embedding position of the first electronic component 16 can be easily adapted to the desired optimum design only by changing the thickness of the dummy wiring 15a. Further, by adjusting the size of the gap of the dummy wiring 15a, it is possible to adjust the amount of the material of the first insulating adhesive portion 18 filled in the gap, and the position where the first electronic component 16 is embedded is adjusted. It becomes easy to adapt to the desired optimum design. In other words, in the component-embedded substrate 10 according to the present embodiment, it is possible to easily incorporate electronic components having different heights.

Furthermore, in this embodiment, the second insulating adhesive portion 19 is provided only on the second surface 11 b of the first insulator 11 exposed in the non-formation region of the inner layer wiring pattern 15. For this reason, unlike the first insulating adhesive portion 18, the second insulating adhesive portion 19 has a flat shape. Here, the thickness of the second insulating adhesive portion 19 is smaller than the thickness of the first insulating adhesive portion 18. In the present embodiment, when the thickness of the first insulating adhesive portion 18 is simply referred to, it means the maximum thickness of the first insulating adhesive portion 18, and specifically, the first laser via 21 penetrates. The thickness of the part.

Under the second electronic component 17, the second electronic component 17 is compared with the first electronic component 16 due to the absence of the dummy wiring 15 a and the thickness of the second insulating adhesive portion 19. It is mounted at a position closer to the outer layer wiring pattern 13. In other words, the contact surface between the second electronic component 17 and the second laser via 22 is located closer to the first outer layer wiring pattern 13 than the contact surface between the first electronic component 16 and the first laser via 21. It will be.

For this reason, even if the height dimension of the first electronic component 16 is smaller than the height dimension of the second electronic component 17, the difference in the dimension depends on the thickness of the dummy wiring 15 a and the first insulating adhesive portion 18. Can be offset. Therefore, in this embodiment, by adjusting the thickness of the dummy wiring 15a and the first insulating adhesive portion 18, the surface opposite to the contact surface of the first electronic component 16 with respect to the first insulating adhesive portion 18 ( The upper surface) and the surface (upper surface) opposite to the contact surface of the second electronic component 17 with respect to the second insulating adhesive portion 19 are positioned at the same height with respect to the first outer layer wiring pattern 13. Yes. By aligning the positions of the upper surfaces of such electronic components, the embedding property of the electronic components themselves can be improved. Note that it is particularly preferable that the position of the upper surface completely coincides, but even if there is a slight misalignment, the embedding property can be improved.

Next, a method for manufacturing a component-embedded substrate according to an embodiment of the present invention will be described in detail with reference to FIGS. 2 to 6 are schematic cross-sectional views in each manufacturing process of the method for manufacturing a component-embedded substrate according to the present embodiment.

First, a first wiring pattern (first outer layer wiring pattern 13 when completed) is formed on the first surface 11a of the first insulator 11, and a second wiring pattern (inner layer wiring pattern 15 when completed) is formed on the second surface 11b. ) Is formed (FIG. 2: preparation step). Specifically, the substrate having the metal thin film formed on the front and back surfaces of the prepreg is patterned by etching to form the double-sided wiring board 31 on which each wiring pattern is formed. At this time, the dummy wiring 15a is formed in the region where the first insulating bonding portion 18 for mounting the first electronic component 16 is formed, and the dummy wiring 15a is formed in the region where the second insulating bonding portion 19 is formed. The wiring 15a is not formed.

Next, the first insulating adhesive portion 18 and the second insulating adhesive portion 19 are formed on the second surface 11b side of the first insulator 11 (FIG. 3: adhesive portion forming step). Specifically, using a metal mask and a squeegee in which a desired opening is formed, an insulating adhesive serving as a material for the first insulating adhesive portion 18 and the second insulating adhesive portion 19 is applied. As a result, the first insulating bonding portion 18 is formed on the second surface 11b of the first insulator 11 exposed between the dummy wiring 15a and the dummy wiring 15a, and the position is different from the position where the first insulating bonding portion 18 is formed. Thus, the second insulating adhesive portion 19 is formed only on the second surface 11 b of the first insulator 11. Here, since the first insulating adhesive portion 18 is also formed so as to fill the space between the dummy wirings 15 a, the thickness of the first insulating adhesive portion 18 is larger than the thickness of the second insulating adhesive portion 19. It is getting bigger. Note that the insulating adhesive may be applied using a discharge device such as a dispenser.

Next, the first electronic component 16 is mounted on the first insulating adhesive portion 18 and the second electronic component 17 is mounted on the second insulating adhesive portion 19 (FIG. 4: mounting process). The mounting is performed using a known chip mounter. Then, as shown in FIG. 3, the position of the upper surface of the first insulating adhesive portion 18 is set higher than the position of the upper surface of the second insulating adhesive portion 19 so that the dimensional difference of the electronic component can be offset. Therefore, the upper surface of the first electronic component 16 and the upper surface of the second electronic component 17 are flush with each other.

Next, the first electronic component 16 and the second electronic component 17 are embedded in the second insulator 12 (FIGS. 5 and 6: an embedding process). Specifically, a laminate 32 in which a third wiring pattern (second outer layer wiring pattern 14 upon completion) is formed on the first surface 12a of the second insulator 12 made of a resin-free material such as a prepreg is prepared. Lay-up is performed so that the second surface 12b of the second insulator 12 of the multilayer body 32 faces the first electronic component 16 and the second electronic component 17, and this is pressed while heating under vacuum. This press is performed using, for example, a vacuum press machine.

Next, a first laser via 21 that penetrates through the second insulator 12 and electrically connects the third wiring pattern to be the second outer layer wiring pattern 14 and the first electronic component 16, and the first insulator 11 and the first insulator (2) A second laser via 22 penetrating through the insulating adhesive portion 19 and electrically connecting the first wiring pattern to be the first outer layer wiring pattern 13 and the second electronic component 17 is formed (FIG. 1: via forming step). . Specifically, by irradiating a CO ₂ laser via formation portions, to remove members of the irradiated portion of the CO ₂ laser, to form a desired opening. Note that the present invention is not limited to the CO ₂ laser, and for example, a high frequency laser such as UV-YAG or excimer may be used. Then, it is preferable to perform a desmear process and to remove the resin remaining when the opening is formed. It is also preferable to perform a soft etching process to remove oxides and organic substances. Thereafter, a known plating process is performed on the opening, and a conductor made of copper is filled to complete the first laser via 21 and the second laser via 22.

Subsequently, desired etching is performed on the third wiring pattern to form a pattern of the second outer layer wiring pattern 14. In addition, you may perform the said pattern formation before the via | veer formation process mentioned above.

Through the manufacturing process as described above, the formation of the component-embedded substrate 10 as shown in FIG. 1 is completed. In the actual production of the component-embedded substrate 10, the plurality of component-embedded substrates 10 are manufactured as one substrate, and after the formation of the plurality of component-embedded substrates 10, the one substrate is cut and finally A plurality of component built-in substrates 10 are manufactured simultaneously.

In the above-described embodiment, since the first electronic component 16 and the second outer layer wiring pattern 14 are directly and connected by the first laser via 21, a large wiring space is not necessary, and the component-embedded substrate 10 itself is small. Can be easily achieved. Further, due to the electrical connection by the first laser via 21, it is possible to increase the density and reliability of the component-embedded substrate 10. Furthermore, since the built-in first electronic component 16 is mounted by the relatively inexpensive first insulating adhesive portion 18, the cost of the component-embedded substrate 10 itself can be reduced.

And since the heat-resistant temperature does not become low like the electroconductive connection material, the 1st insulating adhesion part 18 can also ensure the outstanding connection reliability. In addition, since the embedded position (mounting height) of the first electronic component 16 can be adjusted by the dummy wiring 15a and the first insulating adhesive portion 18, it is possible to easily incorporate electronic components having different heights. become.

Further, in this embodiment, since it is not necessary to delete either the first insulator 11 or the second insulator 12 when incorporating the electronic component, the manufacturing method in which the insulator must be processed is compared. The manufacturing process is reduced. For this reason, the manufacturing cost and material cost related to the component-embedded substrate 10 can be reduced as compared with the related art.

From the above, the component-embedded substrate 10 in this embodiment can easily incorporate electronic components of different heights, and can have excellent connection reliability and cost reduction.

In the present embodiment, in addition to the first electronic component mounting structure described above, the second insulating adhesive portion 19 for mounting the second electronic component 17 having a large height dimension is the first insulator 11. Therefore, the upper surface of the first electronic component 16 and the upper surface of the second electronic component 17 can be mounted so as to be flush with each other. This makes it possible to improve the embedding characteristics of electronic components with a simple and inexpensive structure.
<Modification>

In the above-described embodiments, it is assumed that the connection terminals are formed on one side of the electronic component. However, the connection terminals are formed on both sides of the electronic component, and the laser via is electrically connected to the connection terminal. May be formed. Specifically, as shown in FIG. 7, a third laser via 41 may be formed for the first electronic component 16. In such a case, the third laser via 41 penetrates the first insulator 11 and the first insulative bonding portion 18 and electrically connects the connection terminals (not shown) of the first outer layer wiring 13 and the first electronic component 16. Connected.

In particular, in the modification shown in FIG. 7, the thickness of the dummy wiring 15a and the dimension of the gap between the dummy wirings 15a are designed in consideration of the formation of laser vias on the front and back surfaces of the first electronic component 16. As a result, the components can be built in and electrically connected without reducing the connection reliability of the first laser via 21 or the third laser via 41.

Further, in the present modification, the third laser via 41 penetrates the first insulating adhesive portion 18 in the region where the dummy wiring 15a is not formed. For this reason, since the third laser via 41 and the dummy wiring 15a do not come into contact with each other, the dummy wiring 15a is not electrically connected to the outside of the component-embedded substrate 10 via the third laser via 41. For this reason, no noise or the like occurs with respect to the supply of voltage, current, or signal to the first electronic component 16, and the operation and control of the first electronic component 16 can be performed with higher accuracy.

Furthermore, in the above-described embodiment, the component-embedded substrate 10 includes two electronic components, but may have a structure including only the first electronic component 16. Even in such a structure, since the first insulating bonding portion 18 is formed on the dummy wiring 15a, the same effects as those of the above-described embodiment can be obtained.

In the above-described embodiment, the first insulating adhesive portion 18 is also formed in the gap between the dummy wirings 15a, but the first insulating adhesive portion 18 is not in contact with the first insulator 11. The dummy wiring 15a may be formed. That is, the wiring pattern of the dummy wiring 15a may be designed so that the first insulating bonding portion 18 is positioned on the dummy wiring 15a, or the formation position of the first insulating bonding portion 18 may be designed.

<Embodiment of the present invention>
The component-embedded substrate according to the first embodiment of the present invention includes a first insulator, a first outer layer wiring pattern formed on a first surface of the first insulator, and the first insulator of the first insulator. An inner layer wiring pattern formed on the second surface opposite to the surface; a second insulator stacked on the first insulator while being in contact with the inner layer wiring pattern; and the inner layer of the second insulator A second outer layer wiring pattern formed on the surface opposite to the contact surface with the wiring pattern; an electronic component embedded in the second insulator; and the electronic component as a second of the first insulator. An insulating adhesive portion fixed to the surface side; and a laser via that penetrates the second insulator and electrically connects the second outer layer wiring pattern and the electronic component, and the inner layer wiring pattern includes: Disposed between the first insulator and the insulating adhesive, and Including parts and electrically dummy interconnection serving as disconnected.

In the first embodiment, since the electronic component and the first outer layer wiring pattern are directly and connected by the laser via, a large wiring space is not required, and the component-embedded substrate itself can be easily downsized. Further, the electrical connection by the laser via can increase the density and reliability of the component-embedded substrate. Furthermore, since the built-in electronic component is mounted by a relatively inexpensive insulating adhesive portion, the cost of the component-embedded substrate itself can be reduced. And since the heat-resistant temperature does not become low like an electroconductive connection material, an insulating adhesive part can also ensure the outstanding connection reliability. In addition, since the embedded position (mounting height) of the electronic component can be adjusted by the dummy wiring and the insulating adhesive portion, it is possible to easily incorporate electronic components having different heights.

From the above, in the first embodiment, it is possible to provide a component-embedded substrate that can easily incorporate electronic components of different heights, has excellent connection reliability, and can reduce costs. .

In the component-embedded substrate according to the second embodiment of the present invention, in the first embodiment described above, the insulating adhesive portion is in contact with the first insulator in a region where the dummy wiring is not formed. As a result, by adjusting the size of the gap between the dummy wirings, it is possible to adjust the amount of the material of the insulating adhesive portion that fills the gap, and the embedded position of the electronic component conforms to the desired optimum design. It becomes easy to make.

The component-embedded substrate according to the third embodiment of the present invention includes an additional electronic component embedded in the second insulator and having a size different from that of the electronic component in the first or second embodiment described above, An additional insulating adhesive portion for fixing an additional electronic component to the second surface side of the first insulator; and the first outer layer wiring pattern passing through the second insulator and the additional insulating adhesive portion; And an additional laser via that electrically connects the additional electronic component, wherein the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses. Thereby, since the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.

The component-embedded substrate according to the fourth embodiment of the present invention is that, in the third embodiment described above, the additional insulating adhesive portion is provided only on the second surface of the first insulator. . Thereby, since the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.

The component-embedded substrate according to the fifth embodiment of the present invention is the above-described fourth embodiment, wherein the height of the additional electronic component is greater than the height of the electronic component, and the thickness of the additional insulating adhesive portion. Is smaller than the thickness of the insulating adhesive portion. Thereby, since the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.

A component-embedded substrate according to a sixth embodiment of the present invention is the above-described fifth embodiment, wherein the electronic component has a surface opposite to the contact surface of the electronic component with respect to the insulating adhesive portion and the additional insulating adhesive portion. The surface opposite to the contact surface of the additional electronic component is located at the same height with respect to the first outer layer wiring pattern. Thereby, the embedding property of the electronic component itself can be improved.

In the method for manufacturing a component-embedded substrate according to the seventh embodiment of the present invention, the double-sided wiring board in which the first wiring pattern is formed on the first surface of the first insulator and the second wiring pattern is formed on the second surface. A preparatory step for preparing the first insulator, an adhesive forming step for forming an insulating adhesive portion on the second surface side of the first insulator, a mounting step for mounting an electronic component on the insulating adhesive portion, and a third wiring An embedding step of embedding the electronic component in a second insulator having a pattern formed on the surface, and a laser via penetrating the second insulator and electrically connecting the third wiring pattern and the electronic component are formed. Forming a via, and forming the insulating adhesive portion on the second surface of the first insulator and on the second wiring pattern in the adhesive portion forming step.
That is.

In the seventh embodiment, as in the first embodiment, a component-embedded substrate that can easily incorporate electronic components of different heights, has excellent connection reliability, and can reduce costs is manufactured. Can do.

The component-embedded substrate manufacturing method according to the eighth embodiment of the present invention is the seventh embodiment described above, wherein in the bonding portion forming step, additional insulating bonding is performed at a position different from the formation position of the insulating bonding portion. Forming an additional part, mounting an additional electronic component on the additional insulating adhesive part in the mounting step, and penetrating the first insulator and the additional insulating adhesive part in the via forming step, An additional laser via that electrically connects the first wiring pattern and the additional electronic component is formed, and the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses. Thereby, since the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.

The component-embedded substrate manufacturing method according to the ninth embodiment of the present invention is the above-described eighth embodiment, wherein in the bonding portion forming step, the additional insulating bonding portion is disposed on the second surface of the first insulator. It is only to form. Thereby, since the embedment position (mounting height) of each electronic component can be easily adjusted according to the dimensions of the electronic component, the cost of the component-embedded substrate itself can be reduced.

The component-embedded substrate manufacturing method according to the tenth embodiment of the present invention is the above-described ninth embodiment, wherein in the mounting step, a surface opposite to the contact surface of the electronic component with respect to the insulating adhesive portion; It is mounted so that the surface opposite to the contact surface of the additional electronic component with respect to the additional insulating adhesive portion is located at the same height with respect to the first wiring pattern. Thereby, the embedding property of the electronic component itself can be improved.

DESCRIPTION OF SYMBOLS 10 Component built-in board 11 1st insulator 11a 1st surface 11b 2nd surface 12 2nd insulator 12a 1st surface 12b 2nd surface 13 1st outer layer wiring pattern 14 2nd outer layer wiring pattern 15 Inner layer wiring pattern 15a Dummy wiring 16 First electronic component (electronic component)
17 Second electronic component (additional electronic component)
18 First Insulating Adhesive (Insulating Adhesive)
19 Second insulating adhesive part (additional insulating adhesive part)
21 First laser via (laser via)
22 Second laser via (additional laser via)
31 Double-sided wiring board 32 Laminate 41 Third laser via

Claims

A first insulator;
A first outer layer wiring pattern formed on the first surface of the first insulator;
An inner layer wiring pattern formed on a second surface opposite to the first surface of the first insulator;
A second insulator laminated to the first insulator while in contact with the inner layer wiring pattern;
A second outer layer wiring pattern formed on a surface opposite to the contact surface of the second insulator with the inner layer wiring pattern;
An electronic component embedded in the second insulator;
An insulative adhesive portion for fixing the electronic component to the second surface side of the first insulator;
A laser via that penetrates through the second insulator and electrically connects the second outer layer wiring pattern and the electronic component;
The inner layer wiring pattern is a component-embedded substrate including a dummy wiring that is disposed between the first insulator and the insulating adhesive portion and is electrically disconnected from the outside.
2. The component-embedded substrate according to claim 1, wherein the insulating adhesive portion contacts the first insulator in a region where the dummy wiring is not formed.
An additional electronic component embedded in the second insulator and having dimensions different from the electronic component;
An additional insulating adhesive portion for fixing the additional electronic component to the second surface side of the first insulator; and the first outer layer wiring pattern penetrating through the second insulator and the additional insulating adhesive portion. And an additional laser via for electrically connecting the additional electronic component, and
The component-embedded substrate according to claim 1, wherein the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses.
4. The component built-in board according to claim 3, wherein the additional insulating adhesive portion is provided only on the second surface of the first insulator.
The height of the additional electronic component is greater than the height of the electronic component,
5. The component-embedded substrate according to claim 3, wherein a thickness of the additional insulating adhesive portion is smaller than a thickness of the insulating adhesive portion.
The surface opposite to the contact surface of the electronic component with respect to the insulating adhesive portion and the surface opposite to the contact surface of the additional electronic component with respect to the additional insulating adhesive portion are the first outer layer wiring. The component-embedded substrate according to claim 5, wherein the component-embedded substrate is located at the same height with respect to the pattern.
A preparation step of preparing a double-sided wiring board in which a first wiring pattern is formed on a first surface of a first insulator and a second wiring pattern is formed on a second surface;
An adhesive portion forming step of forming an insulating adhesive portion on the second surface side of the first insulator;
A mounting step of mounting an electronic component on the insulating adhesive portion;
An embedding step of embedding the electronic component in a second insulator having a third wiring pattern formed on the surface;
Forming a laser via that penetrates through the second insulator and electrically connects the third wiring pattern and the electronic component; and
In the bonding portion forming step, the insulating bonding portion is formed on the second surface of the first insulator and on the second wiring pattern.
In the bonding portion forming step, an additional insulating bonding portion is formed at a position different from the formation position of the insulating bonding portion,
In the mounting step, an additional electronic component is mounted on the additional insulating adhesive portion,
In the via formation step, an additional laser via that penetrates the first insulator and the additional insulating adhesive portion and electrically connects the first wiring pattern and the additional electronic component is formed;
The method for manufacturing a component-embedded board according to claim 7, wherein the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses.
The method for manufacturing a component-embedded board according to claim 8, wherein, in the bonding portion forming step, the additional insulating bonding portion is formed only on the second surface of the first insulator.
In the mounting step, a surface opposite to the contact surface of the electronic component with respect to the insulating adhesive portion, and a surface opposite to the contact surface of the additional electronic component with respect to the additional insulating adhesive portion, The method for manufacturing a component-embedded board according to claim 9, wherein the mounting is performed so that the first wiring pattern is positioned at the same height.