TW202002729A - Substrate with built-in component and method for manufacturing substrate with built-in component - Google Patents

Abstract

The present invention has: a first insulator (11); a first outer layer wiring pattern (13) formed on a first surface of the first insulator; an inner layer wiring pattern (15) formed on a second surface on the opposite side of the first insulator from the first surface; a second insulator (12) laminated on the first insulator and contacting the inner layer wiring pattern; a second outer wiring pattern (14) formed on the surface positioned on the opposite side of the second insulator from the surface contacting the inner layer wiring pattern; an electronic component (16) embedded in the second insulator; an insulating adhesive part (18) that fixes the electronic component to the second surface side of the first insulator; and a laser via that passes through the second insulator and electrically connects the second outer layer wiring pattern and the electronic component, wherein the inner layer wiring pattern is arranged between the first insulator and the insulating adhesive part, and includes a dummy wire that is electrically disconnected from the outside.

Description

Component-embedded substrate and method for manufacturing component-embedded substrate

[0001] The present invention relates to a component-embedded substrate incorporating electronic components and a method of manufacturing the component-embedded substrate.

[0002] Conventionally, research and development for miniaturization, thinning, weight reduction, and multi-functionalization of various electrical devices and electronic devices have been continuously carried out. In particular, in household appliances such as mobile phones, notebook computers, digital cameras, etc., while seeking multi-functionalization, there is also a strong demand for miniaturization, thinness, and weight reduction. In addition, in various electrical equipment and electronic equipment, the transmission signal is required to be higher in frequency and higher in speed, and it is also required to prevent the accompanying increase in signal noise. [0003] In order to achieve the above requirements, research and development and manufacturing of component-embedded substrates and component-embedded multilayer circuit substrates have been carried out as circuit boards incorporating electrical devices and electronic devices. A structure in which various electrical components and electronic components (hereinafter also referred to as electronic components) are built into an insulating base material belonging to an insulating layer of a substrate, and a multilayer circuit board with built-in components is formed by laminating the built-in substrates of the components. For example, Patent Document 1 discloses a component-embedded substrate and a method of manufacturing the component-embedded substrate. [0004] In the component-embedded substrate disclosed in Patent Document 1, a structure in which a plurality of electronic components with different thicknesses are embedded by a prepreg is adopted. In particular, in Patent Document 1, a manufacturing method is carried out in which each electronic component is mounted on each panel formed with a laser via and a circuit pattern for each electronic component , And then integrated using prepreg. [Prior Technical Literature] [Patent Literature] [0005] Patent Document 1: Japanese Patent Laid-Open No. 2005-142178.

(Problems to be solved by the invention) [0006] However, in the component-embedded substrate disclosed in Patent Document 1, in order to lead from the mounting land to the outer layer wiring pattern via the laser dielectric layer, a large wiring space is required, making the component-embedded substrate itself small Become difficult. In addition, although a conductive connection material is used for the electrical connection between the built-in electronic component and the mounting area, since the material cost of the conductive connection material is relatively high, the cost of the component-embedded substrate itself increases, and due to the conductivity Since the heat resistance temperature of the connection material becomes low, it is difficult to ensure excellent connection stability. Further, since the two electronic components mounted on one printed wiring board are only mounted by solder or the like, it is difficult to change the mounting positions of the electronic components differently from each other. Then, when the height of the electronic component embedded in the center changes, it is necessary to change the size of the opening corresponding to the electronic component. As additional processing is performed on the upper two panels, the cost of the component-embedded substrate itself increases. [0007] The present invention was developed in view of the above problems, and aims to provide a component-embedded substrate and a method for manufacturing the component-embedded substrate, which can easily embed electronic components of different heights, have excellent connection stability, and can reduce costs . (Means to solve the problem) [0008] In order to achieve the above object, the component-embedded substrate of the present invention includes: a first insulator; a first outer layer wiring pattern formed on the first surface of the first insulator; an inner layer wiring pattern formed on the first A second surface of an insulator, the second surface of the first insulator is opposite to the first surface of the first insulator; the second insulator is in contact with the inner layer wiring pattern and is laminated on the first insulator A second outer layer wiring pattern is formed on the surface of the second insulator, the surface of the second insulator is located on the opposite side of the contact surface between the second insulator and the inner layer wiring pattern; the electronic component is buried in The second insulator; the insulative adhesive portion, which fixes the electronic component on the second surface side of the first insulator; and the laser dielectric layer, which penetrates the second insulator and connects the second outer layer wiring pattern with The electronic component is electrically connected; the inner layer wiring pattern includes a dummy wiring, which is disposed between the first insulator and the insulating adhesive portion and electrically disconnected from the outside. [0009] In addition, in order to achieve the above object, the method for manufacturing a component-embedded substrate of the present invention includes: a preparation step for preparing a double-sided wiring board formed on a first surface of a first insulator with a first wiring pattern And a second wiring pattern is formed on the second surface of the first insulator; the next part forming step is to form an insulating adhesive part on the second surface side of the first insulator; the mounting step is to install on the aforementioned insulating adhesive part The electronic component; the embedding step is to embed the electronic component in the second insulator with the third wiring pattern formed on the surface; and the via formation step is to penetrate the second insulator and form the third wiring pattern and the A laser dielectric layer electrically connected to the electronic component; in the step of forming the bonding portion, the insulating bonding portion is formed on the second surface of the first insulator and the second wiring pattern. (Effect of invention) [0010] The present invention can provide a component-embedded substrate and a method for manufacturing the component-embedded substrate, which can easily embed electronic components of different heights, have excellent connection stability, and can reduce costs.

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings and based on the embodiments. In addition, the present invention is not limited to the contents described below, and can be arbitrarily changed and implemented without changing the gist of the present invention. In addition, the drawings used in the description of the embodiments are schematic diagrams showing the component-embedded substrate and the component-embedded components of the present invention, and are partially emphasized, expanded, reduced, or omitted in order to deepen understanding. There may be cases where the scale and shape of the component-embedded substrate and the component parts of the component-embedded substrate are not accurately represented. Further, the various numerical values used in the embodiments are merely examples, and various changes can be made according to needs. [0013] <Examples> First, the component-embedded substrate according to an example of the present invention will be described in detail with reference to FIG. Here, FIG. 1 is a schematic cross-sectional view of the component-embedded substrate of this embodiment. [0014] As shown in FIG. 1, the component-embedded substrate 10 of the present embodiment includes a first insulator (first insulating layer) 11 and a second insulator (second insulating layer) 12, and has a layer stacked on the first insulator 11 The laminated structure of the second insulator 12. Although the first insulator 11 and the second insulator 12 are composed of, for example, a prepreg, materials that are the same as or different from the insulating resin material of the constituent members of the prepreg can be used. [0015] In addition, the component-embedded substrate 10 includes two outer layer wiring patterns (a first outer layer wiring pattern 13 and a second outer layer wiring pattern 14) and one inner layer wiring pattern 15. Specifically, the first outer layer wiring pattern 13 is formed on the first surface 11 a of the first insulator 11, and the second outer layer wiring pattern 14 is formed on the first surface 12 a of the second insulator 12. The first insulator 11 and the second An interlayer wiring pattern 15 is formed between the insulators 12 (that is, on the second surface 11b of the first insulator 11). In this embodiment, although any wiring pattern is composed of copper, other metals (gold, silver), etc. may also be used. [0016] Further, the first electronic member 16 and the second electronic member (additional electronic member) 17 are embedded in the second insulator 12. Here, the first electronic component 16 is mounted so as to be fixed to the second surface 11 b side of the first insulator 11 by the first insulating adhesive portion 18. On the other hand, the second electronic member 17 is mounted so as to be fixed to the second surface 11 b side of the first insulator 11 by the second insulating adhesive portion 19. In this embodiment, the first electronic component 16 and the second electronic component 17 have different sizes, and the height of the first electronic component 16 (the size in the stacking direction of the insulator) is higher than that of the second electronic component 17 Still small. In addition, although the first electronic component 16 and the second electronic component 17 may be components having different functions or characteristics, they may be the same functional component but only different in size. [0018] Then, the first laser dielectric layer 21 is connected to the connection terminal (not shown) of the first electronic member 16, and the second laser is connected to the connection terminal (not shown) of the second electronic member 17射介层22。 22 shot medium layer. Here, the first laser dielectric layer 21 penetrates the second insulator 12, and the second outer wiring pattern 14 and the connection terminal of the first electronic member 16 are electrically connected. Similarly, the second laser dielectric layer 22 penetrates the first insulator 11 and the second insulating adhesive portion 19, and the first outer wiring pattern 13 and the connection terminal of the second electronic member 17 are electrically connected. [0019] As described above, since the electrical connection between each electronic component and each outer layer wiring pattern is achieved by each laser dielectric layer, the component built-in substrate 10 of this embodiment does not require complicated wiring and connection structure It is possible to construct the component-embedded substrate 10 itself with high density. In addition, it is possible to improve the connection stability by the laser interposer, and the component-embedded substrate 10 of this embodiment has high stability. [0020] In this embodiment, the inner layer wiring pattern 15 is disposed between the first insulator 11 and the first insulating adhesive portion 18, and includes a dummy wiring 15a that is not electrically connected to the outside. That is, the first insulating adhesive portion 18 is provided on the dummy wiring 15a and is also provided so as to fill the gap of the dummy wiring 15a. In other words, the first insulating adhesive portion 18 is provided so as to cover a part of the dummy wiring 15a and a part of the non-formation region (the exposed region of the first insulator 11) of the dummy wiring 15a. Therefore, the first insulating adhesive portion 18 has a concave-convex shape. [0021] Since the first insulating adhesive portion 18 is provided so as to be stacked on the dummy wiring 15a, the first electronic member 16 is mounted away from the first outer wiring pattern 13 to a thickness of the dummy wiring 15a The location of the component. That is, in this embodiment, the buried position of the first electronic member 16 is adjusted not only by the thickness of the first insulating adhesive portion 18 but also by the thickness of the dummy wiring 15a. Therefore, as long as the thickness of the dummy wiring 15a is changed, it is possible to easily perform an optimal design in which the embedding position of the first electronic member 16 is suitable for the desired. In addition, by adjusting the size of the gap of the dummy wiring 15a, it becomes possible to adjust the amount of material of the first insulating adhesive portion 18 filled in the gap, so that the embedding position of the first electronic member 16 is suitable for the desired optimum Design becomes easy. In other words, in the component-embedded substrate 10 of this embodiment, electronic components of different heights can be easily embedded. [0022] Further, in this embodiment, the second insulating adhesive portion 19 is provided only on the exposed second surface 11b of the first insulator 11 in the non-formation region of the inner layer wiring pattern 15. Therefore, the second insulating adhesive portion 19 has a flat shape different from the first insulating adhesive portion 18. Here, the thickness of the second insulating adhesive portion 19 is smaller than the thickness of the first insulating adhesive portion 18. In addition, in this embodiment, in the case where it is only referred to as the thickness of the first insulating bonding portion 18, it refers to the maximum thickness of the first insulating bonding portion 18, specifically, the first laser dielectric layer 21 The thickness of the through part. [0023] Below the second electronic member 17, the dummy wiring 15a does not exist and the thickness of the second insulating bonding portion 19 causes the second electronic member 17 to be compared to the first electronic member 16. It is mounted closer to the first outer wiring pattern 13. In other words, the contact surface between the second electronic component 17 and the second laser dielectric layer 22 is located closer to the first outer wiring pattern 13 than the contact surface between the first electronic component 16 and the first laser dielectric layer 21. [0024] Therefore, even in the case where the height dimension of the first electronic component 16 is smaller than the height dimension of the second electronic component 17, the difference in size can still be determined by the dummy wiring 15a and the first insulating bonding portion 18 Thickness offset. In this way, in this embodiment, by adjusting the thickness of the dummy wiring 15a and the first insulating adhesive portion 18, the contact surface of the first electronic member 16 with the first insulating adhesive portion 18 is the surface on the opposite side (upper The surface) and the surface (upper surface) of the second electronic member 17 on the opposite side to the contact surface of the second insulating adhesive portion 19 are located at the same height relative to the first outer layer wiring pattern 13. By matching the positions of the upper surfaces of the electronic components, the embeddability of the electronic components themselves can be improved. In addition, although it is preferable that the positions of the upper surface are completely the same, even if there is a slight positional deviation, it is possible to improve the embeddability. [0025] Next, a method for manufacturing a component-embedded substrate according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 6. 2 to 6 are schematic cross-sectional views at each manufacturing step of the manufacturing method of the component-embedded substrate of this embodiment. [0026] First, a double-sided wiring board 31 is prepared (FIG. 2: Preparatory step), and the double-sided wiring board 31 is formed on the first surface 11a of the first insulator 11 with a first wiring pattern (first outer layer wiring pattern 13 when completed) In addition, a second wiring pattern (inner layer wiring pattern 15 when completed) is formed on the second surface 11b of the first insulator 11. Specifically, the substrate on which the metal thin film is formed on the front and back surfaces of the prepreg is patterned to form a double-sided wiring board 31 by etching, and each wiring pattern is formed on the double-sided wiring board 31. At this time, the following method is adopted: the dummy wiring 15a is formed in the area where the first insulating adhesive portion 18 is formed for mounting the first electronic component 16, and is not formed in the area where the second insulating adhesive portion 19 is formed Dummy wiring 15a. [0027] Next, a first insulating adhesive portion 18 and a second insulating adhesive portion 19 are formed on the second surface 11b side of the first insulator 11 (FIG. 3: adhesive portion forming step). Specifically, using a metal mask and a squeegee in which a desired opening is formed, an insulating adhesive that becomes the material of the first insulating adhesive portion 18 and the second insulating adhesive portion 19 is applied. Thereby, the first insulating adhesive portion 18 is formed on the dummy wiring 15a and the second surface 11b of the first insulator 11 exposed between the dummy wiring 15a only at a position different from the formation position of the first insulating adhesive portion 18 Furthermore, a second insulating adhesive portion 19 is formed for the second surface 11b of the first insulator 11. Here, since the first insulating adhesive portion 18 is also formed so as to fill the space between the dummy wires 15a, the thickness of the first insulating adhesive portion 18 is larger than the thickness of the second insulating adhesive portion 19. In addition, the application of the insulating adhesive can also be performed using a discharge device such as a dispenser. [0028] Next, the first electronic component 16 is mounted on the first insulating adhesive portion 18 and the second electronic component 17 is mounted on the second insulating adhesive portion 19 (FIG. 4: mounting step). This mounting is performed using a conventional chip mounter. Then, as shown in FIG. 3, the position of the upper surface of the first insulating adhesive portion 18 is set higher than the position of the upper surface of the second insulating adhesive portion 19 in such a way as to offset the difference in size of the electronic component Therefore, the upper surface of the first electronic component 16 and the upper surface of the second electronic component 17 have the same height. [0029] Next, the first electronic member 16 and the second electronic member 17 are buried in the second insulator 12 (FIG. 5, FIG. 6: embedding step). Specifically, a laminated body 32 in which a third wiring pattern (second outer wiring pattern 14 when completed) is formed on the first surface 12 a of the second insulator 12 made of an insulating resin material such as a prepreg is prepared. Lay-up the second surface 12b of the second insulator 12 of the laminate 32 so as to face the first electronic member 16 and the second electronic member 17, and heat the laminate 32 under vacuum while Press. This pressing is performed using, for example, a vacuum press type pressing machine. [0030] Next, a first laser dielectric layer 21 and a second laser dielectric layer 22 are formed (FIG. 1: dielectric layer formation step), the first laser dielectric layer 21 penetrates the second insulator 12 and becomes the second The third wiring pattern of the outer layer wiring pattern 14 is electrically connected to the first electronic component 16; the second laser dielectric layer 22 penetrates the first insulator 11 and the second insulating bonding portion 19 to become the first outer layer wiring pattern 13 The first wiring pattern is electrically connected to the second electronic component 17. Specifically, by irradiating the CO ₂ laser to the mesa formation portion, the parts of the CO ₂ laser irradiated portion are removed to form a desired opening. In addition, it is not limited to CO ₂ laser, and high-frequency laser such as UV-YAG (Ultra Violet Yttrium Aluminum Garnet; ultraviolet-yttrium aluminum garnet) or excimer can also be used. After that, desmear processing is preferably performed to remove the resin remaining when the opening is formed. In addition, it is also preferable to perform a soft etching process to remove oxides and organic substances. After that, a conventional plating process is performed on the above-mentioned opening to fill a conductor made of copper to complete the first laser dielectric layer 21 and the second laser dielectric layer 22. [0031] Next, desired etching is performed on the third wiring pattern to pattern the second outer layer wiring pattern 14. In addition, the pattern formation may be performed before the above-mentioned via formation step. [0032] After the above manufacturing steps, the formation of the component-embedded substrate 10 shown in FIG. 1 is completed. In addition, in the actual manufacturing of the component-embedded substrate 10, a plurality of component-embedded substrates 10 are manufactured as one substrate, and after the formation of the plurality of component-embedded substrates 10 is completed, the one substrate is cut, and eventually the plurality is manufactured simultaneously. Pieces built-in substrate 10. [0033] As described above, in the above embodiment, since the first electronic member 16 and the second outer wiring pattern 14 are directly contacted and connected by the first laser dielectric layer 21, there is no need for a large wiring space. It is easy to reduce the size of the component-embedded substrate 10 itself. In addition, the electrical connection by the first laser dielectric layer 21 can also achieve high density and high stability of the component-embedded substrate 10. Furthermore, since the built-in first electronic component 16 is mounted via the relatively low-cost first insulating adhesive portion 18, the cost of the component-embedded substrate 10 itself can be reduced. [0034] Then, since the first insulating adhesive portion 18 does not have a reduction in the heat resistance temperature like the conductive connection material, excellent connection stability can be ensured. In addition, since the buried position (mounting height) of the first electronic component 16 can be adjusted by the dummy wiring 15a and the first insulating adhesive portion 18, it is possible to easily incorporate electronic components of different heights. [0035] In addition, in this embodiment, since it is not necessary to remove any of the first insulator 11 and the second insulator 12 when the electronic component is built in, it is possible to reduce the number of manufacturing steps compared to the manufacturing method in which the insulator must be processed . Therefore, the manufacturing cost and material cost of the component-embedded substrate 10 can be reduced more than before. [0036] As can be seen from the above, the component-embedded substrate 10 in this embodiment can easily embed electronic components of different heights, has excellent connection stability, and can reduce costs. [0037] In addition, in this embodiment, in addition to the mounting structure of the first electronic component described above, only the second surface 11b of the first insulator 11 is formed to mount the second electronic component 17 having a large height dimension The second insulating adhesive portion 19 can be mounted so that the upper surface of the first electronic component 16 and the upper surface of the second electronic component 17 have the same height. With this, the embedding characteristics of the electronic component can be improved by a simple and low-cost structure. [0038] <Modifications> In the above embodiment, although it is envisaged that the connection terminal is formed on one side of the electronic component, the connection terminal may be formed on both sides of the electronic component, and the connection terminal may be formed. Sexually connected laser interposer. Specifically, as shown in FIG. 7, a third laser dielectric layer 41 may be formed on the first electronic member 16. In the above case, the third laser dielectric layer 41 penetrates the first insulator 11 and the first insulating adhesive portion 18, and electrically connects the connection terminals (not shown) of the first outer layer wiring 13 and the first electronic member 16 connection. In particular, in the modification shown in FIG. 7, the thickness of the dummy wiring 15a and the size of the gap between the dummy wiring 15a are designed in consideration of forming a laser dielectric layer on the front and back surfaces of the first electronic member 16. Thereby, the connection stability of the first laser dielectric layer 21 or the third laser dielectric layer 41 is not reduced, and the built-in components and the electrical connection can be realized. [0040] In this modification, the third laser dielectric layer 41 penetrates the first insulating adhesive portion 18 in the non-formation region of the dummy wiring 15a. Therefore, since the third laser dielectric layer 41 is not in contact with the dummy wiring 15a, the dummy wiring 15a is not electrically connected to the outside of the component built-in substrate 10 via the third laser dielectric layer 41. Therefore, no noise or the like is generated due to the supply of voltage, current, signal, etc. to the first electronic component 16, and the operation and control of the first electronic component 16 can be performed with higher accuracy. [0041] Further, in the above-described embodiment, although the component-embedded substrate 10 incorporates two electronic components, it may have a structure in which only the first electronic component 16 is incorporated. Even in the above structure, since the first insulating bonding portion 18 is still formed on the dummy wiring 15a, the same effect as the above embodiment can be achieved. [0042] Then, in the above embodiment, although the first insulating adhesive portion 18 is also formed in the gap of the dummy wiring 15a, the dummy wiring may be formed in such a manner that the first insulating adhesive portion 18 does not contact the first insulator 11 15a. That is, the wiring pattern of the dummy wiring 15a or the formation position of the first insulating adhesive portion 18 can be designed so that the first insulating adhesive portion 18 is positioned on the dummy wiring 15a. [0043] <Embodiment of the present invention> The component-embedded substrate of the first embodiment of the present invention has: a first insulator; a first outer layer wiring pattern formed on the first surface of the first insulator; The layer wiring pattern is formed on the second surface of the first insulator, the second surface of the first insulator is opposite to the first surface of the first insulator; the second insulator is connected to the inner layer wiring The pattern is in contact with and laminated on the first insulator; the second outer wiring pattern is formed on the surface of the second insulator, and the surface of the second insulator is located on the contact surface between the second insulator and the inner wiring pattern The opposite side; the electronic component, which is embedded in the second insulator; the insulating adhesive portion, which fixes the electronic component on the second surface side of the first insulator; and the laser dielectric layer, which penetrates the second insulator, And the second outer layer wiring pattern is electrically connected to the electronic component; the inner layer wiring pattern includes: dummy wiring, which is disposed between the first insulator and the insulating adhesive portion and becomes electrically non-connected to the outside . [0044] In the first embodiment, the electronic component and the first outer layer wiring pattern are directly contacted and connected by the laser dielectric layer, so that a large wiring space is not required, and the component built-in substrate itself can also be easily sought miniaturization. In addition, by electrically connecting through the laser interposer, it is possible to increase the density and stability of the substrate with built-in components. Furthermore, the built-in electronic component is mounted by a relatively low-cost insulating bonding part, so the cost of the component-embedded substrate itself can be reduced. Then, the insulating adhesive portion does not become lower in heat resistance temperature than the conductive connecting material, so excellent connection stability can be ensured. In addition, the embedding position (mounting height) of the electronic component can be adjusted by the dummy wiring and the insulating adhesive portion, so that electronic components of different heights can be easily embedded. As can be seen from the above, in the first embodiment, a component-embedded substrate can be provided, which can easily embed electronic components of different heights, has excellent connection stability, and can reduce costs. [0046] In the second embodiment of the present invention, the component-embedded substrate is in the first embodiment described above, and the insulating adhesive portion is in contact with the first insulator in the non-formation region of the dummy wiring. In this way, by adjusting the size of the gap of the dummy wiring, the amount of material of the insulating adhesive portion filled in the gap can be adjusted, making it easy to adapt the embedded position of the electronic component to the desired optimal design. [0047] The component-embedded substrate of the third embodiment of the present invention is in the above-mentioned first or second embodiment, and includes: an additional electronic component embedded in the second insulator and having Different sizes; an additional insulating adhesive part, which fixes the additional electronic component on the second surface side of the first insulator; and an additional laser interposer, which penetrates the second insulator and the additional insulating adhesive part, The first outer layer wiring pattern is electrically connected to the additional electronic component; the insulating adhesive portion and the additional insulating adhesive portion have different thicknesses. With this, the embedding position (mounting height) of each electronic component can be easily adjusted according to the size of the electronic component, so that the cost of the component-embedded substrate itself can be reduced. [0048] The component-embedded substrate of the fourth embodiment of the present invention is the above-described third embodiment, and the additional insulating adhesive portion is provided only on the second surface of the first insulator. With this, the embedding position (mounting height) of each electronic component can be easily adjusted according to the size of the electronic component, so that the cost of the component-embedded substrate itself can be reduced. [0049] In the fifth embodiment of the present invention, the component-embedded substrate is in the fourth embodiment described above, wherein the height of the additional electronic component is greater than the height of the electronic component; the thickness of the additional insulating adhesive portion is It is smaller than the thickness of the insulating junction. With this, the embedding position (mounting height) of each electronic component can be easily adjusted according to the size of the electronic component, so that the cost of the component-embedded substrate itself can be reduced. [0050] The component-embedded substrate of the sixth embodiment of the present invention is the fifth embodiment, the surface of the electronic component opposite to the contact surface of the insulating adhesive portion and the additional electronic component The surface on the opposite side of the contact surface of the insulating adhesive portion is located at the same height relative to the first outer layer wiring pattern. With this, the embeddability of the electronic component itself can be improved. [0051] A method for manufacturing a component-embedded substrate according to a seventh embodiment of the present invention includes: a preparation step for preparing a double-sided wiring board formed on a first surface of a first insulator with a first wiring pattern and The second wiring pattern is formed on the second surface; the next portion forming step is to form an insulating adhesive portion on the second surface side of the first insulator; the mounting step is to install the electronic component on the insulating insulating portion; The step is to embed the electronic component in the second insulator with the third wiring pattern formed on the surface; and the via formation step to penetrate the second insulator and form an electrical connection between the third wiring pattern and the electronic component In the step of forming the bonding portion, the insulating bonding portion is formed on the second surface of the first insulator and the second wiring pattern. [0052] In the seventh embodiment, similar to the first embodiment, a component-embedded substrate can be manufactured, which can easily embed electronic components of different heights, has excellent connection stability, and can reduce costs. [0053] The method for manufacturing a component-embedded substrate according to an eighth embodiment of the present invention is the seventh embodiment described above, and is formed at a position different from the formation position of the insulating bonding portion in the bonding portion forming step An additional insulating adhesive portion; in the mounting step, an additional electronic component is mounted on the additional insulating adhesive portion; in the interlayer forming step, the first insulator and the additional insulating adhesive portion are penetrated, and the The first wiring pattern and the additional laser dielectric layer electrically connected to the additional electronic component; the thickness of the insulating adhesive portion and the additional insulating adhesive portion are different. With this, the embedding position (mounting height) of each electronic component can be easily adjusted according to the size of the electronic component, so that the cost of the component-embedded substrate itself can be reduced. [0054] The method for manufacturing a component-embedded substrate according to the ninth embodiment of the present invention is the eighth embodiment described above. In the bonding portion forming step, the addition is formed only on the second surface of the first insulator Insulation bonding part. With this, the embedding position (mounting height) of each electronic component can be easily adjusted according to the size of the electronic component, so that the cost of the component-embedded substrate itself can be reduced. [0055] A manufacturing method of a component-embedded substrate according to a tenth embodiment of the present invention is described in the ninth embodiment. In the mounting step, the electronic component is opposite to the contact surface of the insulating adhesive portion. The surface and the surface of the additional electronic component opposite to the contact surface of the additional insulating adhesive portion are mounted at the same height relative to the first wiring pattern. With this, the embeddability of the electronic component itself can be improved.

[0056] 10‧‧‧Built-in substrate 11‧‧‧First insulator 11a‧‧‧First surface 11b‧‧‧Second surface 12‧‧‧Second insulator 12a‧‧‧First surface 12b‧‧‧Second surface 13‧‧‧The first outer wiring pattern 14‧‧‧Second outer wiring pattern 15‧‧‧Inner layer wiring pattern 15a‧‧‧Dummy wiring 16‧‧‧First electronic component (electronic component) 17‧‧‧Second electronic component (additional electronic component) 18‧‧‧The first insulating bonding part (insulating bonding part) 19‧‧‧Second insulative bonding part (additional insulative bonding part) 21‧‧‧First laser interposer (laser interposer) 22‧‧‧Second laser interposer (additional laser interposer) 31‧‧‧Two-sided wiring board 32‧‧‧Layered body 41‧‧‧third laser interposer

[0011] FIG. 1 is a schematic cross-sectional view of a component-embedded substrate according to an embodiment of the present invention. 2 is a schematic cross-sectional view of each manufacturing step of the method for manufacturing a component-embedded substrate according to an embodiment of the present invention. 3 is a schematic cross-sectional view at each manufacturing step of the method for manufacturing a component-embedded substrate according to an embodiment of the present invention. 4 is a schematic cross-sectional view in each manufacturing step of the manufacturing method of a component-embedded substrate according to an embodiment of the present invention. 5 is a schematic cross-sectional view at each manufacturing step of the method for manufacturing a component-embedded substrate according to an embodiment of the present invention. 6 is a schematic cross-sectional view at each manufacturing step of the method for manufacturing a component-embedded substrate according to an embodiment of the present invention. 7 is a schematic cross-sectional view of a component-embedded substrate in a modified example different from the embodiment of the present invention.

10‧‧‧Built-in substrate

11‧‧‧First insulator

11a‧‧‧First surface

11b‧‧‧Second surface

12‧‧‧Second insulator

12a‧‧‧First surface

13‧‧‧The first outer wiring pattern

14‧‧‧Second outer wiring pattern

15‧‧‧Inner layer wiring pattern

15a‧‧‧Dummy wiring

16‧‧‧First electronic component (electronic component)

17‧‧‧Second electronic component (additional electronic component)

18‧‧‧The first insulating bonding part (insulating bonding part)

19‧‧‧Second insulative bonding part (additional insulative bonding part)

21‧‧‧First laser interposer (laser interposer)

22‧‧‧Second laser interposer (additional laser interposer)

Claims (10)

A component built-in substrate, which is equipped with: First insulator The first outer layer wiring pattern is formed on the first surface of the aforementioned first insulator; The inner layer wiring pattern is formed on the second surface of the first insulator, and the second surface of the first insulator is opposite to the first surface of the first insulator; The second insulator is in contact with the inner layer wiring pattern and is laminated on the first insulator; The second outer layer wiring pattern is formed on the surface of the second insulator, and the surface of the second insulator is located on the opposite side of the contact surface between the second insulator and the inner layer wiring pattern; The electronic component is embedded in the aforementioned second insulator; An insulative adhesive part for fixing the electronic component on the second surface side of the first insulator; and The laser dielectric layer penetrates the second insulator and electrically connects the second outer wiring pattern to the electronic component; The inner layer wiring pattern includes a dummy wiring, which is disposed between the first insulator and the insulating adhesive portion and electrically disconnected from the outside. The component-embedded substrate according to claim 1, wherein the insulating adhesive portion is in contact with the first insulator in a non-formation area of the dummy wiring. The built-in substrate as described in claim 1 or 2, which has: An additional electronic component is embedded in the second insulator and has a different size from the electronic component; An additional insulative adhesive part, which fixes the additional electronic component on the second surface side of the first insulator; and The additional laser dielectric layer penetrates the second insulator and the additional insulating adhesive portion, and electrically connects the first outer layer wiring pattern and the additional electronic component; The insulating adhesive portion and the additional insulating adhesive portion have different thicknesses. The component-embedded substrate according to claim 3, wherein the additional insulating adhesive portion is provided only on the second surface of the first insulator. The component-embedded substrate described in claim 3, wherein the height of the additional electronic component is greater than the height of the electronic component; The thickness of the additional insulating adhesive portion is smaller than the thickness of the insulating adhesive portion. The component-embedded substrate according to claim 5, wherein the surface of the electronic component opposite to the contact surface of the insulating adhesive portion and the surface of the additional electronic component opposite to the contact surface of the additional insulating adhesive portion are It is located at the same height with respect to the aforementioned first outer layer wiring pattern. A method for manufacturing a substrate with a built-in component, including: In the preparation step, a two-sided wiring board is prepared. The two-sided wiring board is formed with a first wiring pattern formed on the first surface of the first insulator and a second wiring pattern formed on the second surface; In the subsequent portion forming step, an insulating adhesive portion is formed on the second surface side of the first insulator; The installation step is to install the electronic component on the aforementioned insulating adhesive part; The embedding step is to embed the aforementioned electronic component in the second insulator having the third wiring pattern formed on the surface; and The step of forming a via layer is to penetrate the second insulator and form a laser dielectric layer electrically connecting the third wiring pattern and the electronic component; In the bonding portion forming step, the insulating bonding portion is formed on the second surface of the first insulator and the second wiring pattern. The method for manufacturing a component-embedded substrate according to claim 7, wherein in the step of forming the adhesive portion, an additional insulating adhesive portion is formed at a position different from the formation position of the insulating adhesive portion; In the installation step, an additional electronic component is mounted on the additional insulating adhesive portion; In the step of forming the via layer, penetrating the first insulator and the additional insulating adhesive portion, and forming an additional laser dielectric layer electrically connecting the first wiring pattern and the additional electronic component; The insulating adhesive portion and the additional insulating adhesive portion have different thicknesses. The method for manufacturing a component-embedded substrate according to claim 8, wherein in the bonding portion forming step, the additional insulating bonding portion is formed only on the second surface of the first insulator. The method for manufacturing a component-embedded substrate according to claim 9, wherein in the mounting step, the surface of the electronic component opposite to the contact surface of the insulating adhesive portion and the additional electronic component are associated with the additional insulating adhesive portion The surface on the opposite side of the contact surface is mounted at the same height with respect to the first wiring pattern.

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