KR20200121208A - Manufacturing method of embedded printed circuit board using unclad - Google Patents

Abstract

The purpose of the present invention is to provide a method for manufacturing a printed circuit board, which simplifies a process compared to a technique of manufacturing a printed circuit board embedded with various other chips and reduces read time by using an unclad plate unlike various embedded techniques used in the conventional art, mounting a chip in the unclad plate and embedding the same in a copper clad lamination (CCL) plate, and allowing the rest of the process to proceed according to a conventional process. To achieve the purpose, a method for manufacturing an embedded printed circuit board by using unclad according to the present invention comprises the following steps of: preparing an unclad plate formed of cured resin including copper on one surface and sequentially including an adhesive film and a carrier film on the other surface; preparing a copper lamination plate in which a hole and a circuit are formed; removing the carrier film from the unclad plate and then embedding a chip in a position corresponding to the hole of the copper lamination plate on the adhesive film; laminating copper and prepreg on one surface of the copper lamination plate, and laminating the unclad plate in which the chip is embedded on the other surface of the copper lamination plate; and processing a via hole for interlayer connection with respect to a lamination formed by the laminating step, and forming a circuit.

Description

Manufacturing method of embedded printed circuit board using unclad

The present invention relates to a method of manufacturing an embedded printed circuit board, and more particularly, to a method of manufacturing an embedded printed circuit board using an unclad.

Recently, with the spread of portable terminals and notebook computers, electronic devices requiring high-speed operation are widely used, and accordingly, a printed circuit board capable of high-speed operation is required. For such high-speed operation, it is necessary to increase the density of wiring and electronic components in a printed circuit board.

As a means for achieving such high density, a build up method is known. The build-up method is, for example, coated with a photosensitive resin on the surface of a core substrate made of double-sided copper-clad glass epoxy on which wiring is formed by copper foil etching, etc., followed by exposure development and via hole ( via hole)

After that, electroless copper plating is applied to the surface. Then, a via hole conductor and a wiring circuit layer are formed by applying this to a resist, etching, and removing the resist.

And after repeating the process of forming the insulating layer by the photosensitive resin and forming the via hole conductor and wiring circuit layer, a through hole is formed by a drill or the like, and a plating layer is formed in the through hole to form an interlayer wiring circuit layer. To connect.

In the conventional printed circuit board, copper foil is laminated on the surface of a flat plate containing an organic resin called a prepreg, and then a fine circuit is formed and laminated after etching this. Here, after punching the through hole using a micro-drill, metal is attached to the inside of the hole by plating to form a through-hole conductor, thereby electrically connecting each layer. In addition, a wiring board in which a via hole conductor is formed by filling a via hole formed in an insulating layer with metal powder, and then stacked with another insulating layer and multi-layered is also proposed.

As described above, the method of forming the via hole conductor by filling the metal powder is advantageous in that the via hole conductor can be miniaturized and the via hole can be formed at an arbitrary position. In addition, high-density wiring is possible with a printed circuit board formed by the build-up method.

However, in the case of mounting various electric devices on a printed circuit board, there is a limit to the miniaturization of the board because it has no choice but to mount it on the surface of the board. In order to solve such a problem, recently, the board is embedded in an insulator or the like. How to do it is being proposed. That is, after forming a hole in which the electronic device is embedded in the insulator, the electronic device is positioned and fixed using a filler or the like. According to such an embedding process, since the electric device is not mounted on the surface of the substrate (SMT: SurfaceMount Technology), but is embedded inside the substrate, it is possible to reduce the size and density of the substrate as well as increase the performance of the substrate.

The present invention uses an unclad plate, unlike various embedded technologies that have been used in the prior art, and mounts a chip on the unclad plate to provide a copper clad laminate (CCL; hereinafter, referred to as'CCL substrate') Its main purpose is to provide a printed circuit board manufacturing method that embeds and allows other parts to proceed with the existing process, so that the process is simplified and lead time is shortened compared to other chip-embedded printed circuit board manufacturing technologies.

On the other hand, it should be noted that the present invention was created with the above main objects in mind, but is not necessarily limited thereto, and does not exclude new objects and effects created or predictable from the configuration of the present invention described later.

An embedded printed circuit board manufacturing method using an unclad according to the present invention for achieving the above object is an unclad made of a cured resin sequentially including copper foil on one side and an adhesive film and a carrier film on the other side. Preparing a plate; Preparing a copper clad laminate having holes and circuits; Removing the carrier film from the unclad plate and mounting a chip in a position corresponding to the hole of the copper clad laminate on the adhesive film; Laminating a copper foil and a prepreg on one surface of the copper clad laminate, and laminating an unclad plate on which the chip is mounted on the other surface of the copper clad laminate; And processing a via hole for interlayer connection with respect to the laminate formed by the laminating step and forming a circuit.

Here, depending on the application, the step of forming an additional outer layer outside the laminate on which the circuit is formed may be further included after the circuit forming step.

In addition, the copper clad laminate is preferably formed to have the same height as the height of the chip. In addition, the unclad plate is preferably formed of cured resin in a C-stage state.

In addition, the step of processing the via hole for interlayer connection and forming a circuit includes a drilling, laser processing, and plating process, and the copper foil formed on the copper clad laminate by lamination among the adhesive films formed on the other surface of the unclad plate and mutually

It is preferable that the overlapping portion is removed by the laser processing.

Meanwhile, an embedded printed circuit board using an unclad according to another embodiment of the present invention for achieving the above object is electrically connected through a cured resin layer, a circuit formed under the resin layer, and the circuit and vias. An unclad layer comprising a circuit formed on the upper surface and an adhesive film formed in connection with the circuit formed on the upper surface; It is laminated on the unclad layer and embedded in a state adhered to the adhesive film of the unclad layer. A copper clad laminate layer (CCL layer) including a chip and a circuit formed on an upper surface thereof; And free laminated on the copper clad laminate layer.

A prepreg, a plurality of vias formed inside the prepreg to be electrically connected to the chip and circuit of the copper clad laminate layer, and a circuit formed on the upper surface of the prepreg, including a prepreg layer .

Here, it may further include an inner via hole (IVH) penetrating the unclad layer, a copper clad laminate layer stacked on the unclad layer, and a prepreg layer stacked on the copper clad laminate layer.

In addition, it is preferable that the cured resin layer is a cured resin in a C-stage state. Further, the connection between the circuit formed on the upper surface of the unclad layer and the adhesive film is made of the copper foil by lamination among the adhesive films. It is more preferable that the copper foil formed on the laminate and the overlapping portions are removed by laser processing.

Through the above process, since the existing surface mounting process is eliminated by embedding the chip in the copper clad laminate layer, it is possible to reduce the cost and reduce the area of the set.

In addition, as in the present invention, the chip is mounted on it using an unclad plate, and at the same time, the chip is embedded inside the copper-clad laminate layer, and the other part proceeds with the existing process, so the process is simpler than other embedded technologies and lead time This shortening can be expected.

1 is a cross-sectional view showing the structure of a printed circuit board manufactured by a method of manufacturing a printed circuit board according to the present invention.
2 is a cross-sectional view of a printed circuit board configured to further include an outer layer in the structure of the printed circuit board according to FIG. 1;
3 is a cross-sectional view of an unclad plate used in the present invention.
4 to 4 are cross-sectional views of the processed copper clad laminate used in the present invention.
5 is a cross-sectional view of a state in which a chip is mounted on an adhesive layer after the carrier layer is removed from the unclad plate according to FIG. 3.
6 and 6 are cross-sectional views of a processed copper clad laminate, an unclad plate according to FIG. 3 and a copper foil/prepreg laminated.
7 to 7 are cross-sectional views of a state in which drill/laser/plating/circuit forming processing is performed on the laminate according to FIG. 6.
8 is a cross-sectional view of a state in which an outer layer is further included in the structure of the printed circuit board according to FIG. 7.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. It should be noted that, as used throughout this specification,'substantial

Terms such as'enemy' and'approximately' are not only in the case of a configuration that is exactly the same as the configuration disclosed in the present invention, but also when there is a difference in wording in the dictionary meaning, if it is possible to perform modifications to the extent that substantially the same effect is obtained It was used to mean that it is included in the technical scope of the present invention. In addition, although it is a technology corresponding to the present invention, a description of the technical content that is widely known and used in the art will be omitted. In the drawings, the thickness is enlarged to clearly express various layers and regions. The same reference numerals are used for similar parts throughout the specification.

Now, a printed circuit board and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the related drawings.

Embedded printed circuit board using unclad

First, FIG. 1 is a cross-sectional view showing the structure of a printed circuit board manufactured by a method of manufacturing a printed circuit board according to an embodiment of the present invention.

The embedded printed circuit board using the unclad according to the present invention, as shown in Figure 1, largely, an unclad layer (10), a copper clad laminate layer (CCL layer) 20, and a prepreg layer ( It consists of a prepreg layer; 30).

First, one of the greatest features of the present invention, the unclad layer 10 is a cured resin layer 11, a circuit 12' formed on the lower surface of the resin layer 11, and the circuit 12 ') and a circuit 22' formed on the upper surface to be electrically connected through the via 13, and

And an adhesive film 14 formed by connecting the circuit 22 ′ formed on the upper surface in a plane shape.

Here, the resin layer 11 is composed of a cured resin (resiin) in a C-stage state indicating that the cured state.

And, as the adhesive film 14, for example, a double-sided tape may be used, such a double-sided tape has adhesiveness at high temperature and does not deform, and it is preferable not to leave a residue on the surface after being removed, such as The silly

And polyimide-based tapes using cone adhesive components.

A copper clad laminate layer 20 is stacked on the unclad layer 10.

The copper clad laminate layer 20 is mounted in the chip mounting hole formed in the copper clad laminate core 21 and the copper clad laminate core 21, and adhered to the adhesive film 14 of the unclad layer 10 The embedded chip 40 mounted in the

It is composed of a circuit 23' formed on the upper surface of the copper clad laminate core 21.

In addition, a prepreg rare 30 is stacked on the copper plate laminate layer 20.

The prepreg layer 30 includes a prepreg 31 laminated on the copper clad laminate layer 20 in a gel state, and a chip 40 of the copper clad laminate layer 20 inside the prepreg 31 A plurality of vias 33 formed to be electrically connected to the circuit 23 ′, and a circuit 32 ′ formed on the upper surface of the prepreg and electrically connected to the circuit 23 ′ formed on the copper clad laminate layer. Is composed.

The prepreg 31 refers to a sheet-like material obtained by impregnating a thermosetting resin in a base material such as a glass cloth and curing it up to the B-stage, and the B-stage refers to a semi-cured state of the resin. In general, high viscosity epoxy resin is used for prepreg.

On the other hand, the electric device as an embedded chip may be not only active devices such as CPU and IC but also passive devices such as resistors and capacitors.

In addition to this basic configuration, the printed circuit board according to the present invention may be configured to further include an IVH (Inner Via Hole) 50, and the IVH 50 is laminated on the unclad layer 10 and the unclad layer. Laminated copper foil

The plate layer 20 and the circuit formed on the prepreg layer 30 stacked on the copper clad laminate layer are electrically connected to each other.

In addition, in addition to the structure of the printed circuit board according to the embodiment of the present invention shown in FIG. 1, it may be configured to further include an outer layer 60 as shown in FIG. 2 using an existing process.

Manufacturing method of embedded printed circuit board using unclad

Hereinafter, with reference to FIGS. 3 to 8, a method for manufacturing an embedded printed circuit board using an unclad plate according to the present invention is described.

First, FIG. 3 is a cross-sectional view of an unclad plate used in the present invention. As shown in FIG. 3, a cured resin 11 and a copper foil 12 formed only on one surface of the resin 11 And an unclad plate composed of an adhesive film 14 and a carrier film 15 sequentially stacked on the other side thereof. That is, since the unclad plate used in the present invention is in a state in which copper foil is formed only on one side and no copper foil is formed on the other side, it is named as an unclad plate.

You can understand.

Here, as described above, the unclad plate is preferably formed of a resin such as a cured epoxy in a C-stage state, which is a criterion indicating a degree of curing.

Next, as shown in FIGS. 4a to 4c, a copper clad laminate (CCL) that is commonly used is prepared. 4A to 4C show cross-sectional views of the processed copper clad laminate used in the present invention, and as shown in the drawing,

The layer plate (CCL) is composed of copper foils 22 and 23 formed on both sides of the CCL core 21 and the CCL core 21, and since such a copper clad laminate corresponds to a configuration widely used in the art, a detailed description is omitted, The copper-clad laminate is the chip and thread to be mounted.

It is desirable to be formed to have the same height qualitatively. This makes it possible to omit the filling process in the prior art, thereby simplifying the process and shortening the lead time.

After processing the chip mounting hole 24 by a drilling process or the like as shown in FIG. 4B so that the chip 40 to be described later can be embedded in the prepared copper clad laminate, as shown in FIG. 4C, it is formed on both sides of the copper clad laminate. Copper foil (22, 23)

By processing, predetermined circuit patterns 22' and 23' are formed, respectively.

The chip mounting hole 24 is perforated by punching or routing at a predetermined position of the copper clad laminate. The size of the chip mounting hole 24 is processed to be substantially the same as the size of an electric device chip embedded therein. Such

The chip mounting hole 24 may be drilled after the circuit pattern is formed in the copper clad laminate, but it is also possible to form a circuit pattern after the chip mounting hole 24 is first drilled in the copper clad laminate.

In addition, after forming the chip mounting hole 24 in the copper clad laminate, a black oxide process may be performed on the copper foils 22 and 23 of the copper clad laminate to facilitate a subsequent lamination process. This blackening process is performed on both sides of the copper clad laminate.

By oxidizing the surface of the laminated copper foil, the surface of the copper foil becomes rough, thereby making lamination easier.

Then, a cured resin 11 and a copper foil 12 formed only on one side of the resin 11, and an adhesive film 14 and a carrier film 15 sequentially stacked on the other side thereof. The carrier film 15 is removed from the unclad plate.

That is, as shown in FIG. 5, after removing the carrier film 15 from the unclad plate in order to embed the chip 40 on the printed circuit board, the chip 40 on the adhesive film 14 By mounting the chip 40 can be maintained in a fixed state inside the substrate.

It becomes. The chip 40 is mounted at a position corresponding to the hole 24 processed in the copper clad laminate on the adhesive layer 14.

Then, as shown in Figures 6a and 6b, while stacking the copper foil 32 and the prepreg 31 on one side (top) of the copper clad laminate, the chip on the other side (bottom) of the copper clad laminate (40) Laminate the mounted unclad plate.

Then, for the laminate formed by such a lamination step, as shown in FIG. 7A, micro via holes (MVH) for interlayer connection are formed by drilling and CO2 laser processing.

Here, of the adhesive film 14 formed on the other surface (upper surface) of the unclad plate, the portion overlapping with the circuit 22 ′ formed on the copper clad laminate by lamination may be removed by the laser processing, As a result, the circuit 22 ′ and the adhesive film 14 formed on the upper surface of the unclad plate are formed to be connected to each other on the same horizontal plane.

Finally, as shown in FIGS. 7B and 7C, predetermined vias 13 and 33 and circuits 12' and 32' are formed outside the stacked body by plating and circuit formation processes.

Such a circuit pattern is manufactured by a general method of forming a printed circuit, and a conductive metal such as copper is plated or charged inside the via hole to electrically connect the circuit pattern and the electrode. These plating and circuit formation processes

Since it will be said to be the same as the process generally performed in the art, a detailed description thereof will be omitted. Of course, the laminate may be processed to further include an IVH (Inner Via Hole), and this IVH 50 is the unclad layer

(10) The copper clad laminate layer 20 stacked on the unclad layer and the circuit formed on the prepreg layer 30 stacked on the copper clad laminate layer are electrically connected to each other.

In addition, it may be processed to further include an additional outer layer 60 as shown in FIG. 8 using an existing process in addition to the processes described above.

In the end, through the above process, since the existing surface mounting process is eliminated by embedding the chip in the copper clad laminate layer, it is possible to reduce the cost and also the effect of reducing the area of the set can be expected.

In addition, as in the present invention, the chip is mounted on the unclad plate using an unclad plate, and the chip is embedded inside the copper-clad laminate layer and proceeds to the existing process for other parts.

You can expect the advantages of conciseness and short lead times.

[0055] Although the preferred embodiment of the present invention has been described in detail above, those of ordinary skill in the art will appreciate that various modifications and other equivalent embodiments are possible therefrom. Therefore, the present invention

The scope of the rights is not limited to the disclosed embodiments, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims also belong to the scope of the present invention.

10: unclad layer 20: copper clad laminate layer
30: prepreg layer 40: 50: IVH (Inner Via Hole) 60: outer layer

Claims (9)

Preparing an unclad plate made of a cured resin including copper foil on one side and sequentially including an adhesive film and a carrier film on the other side;
Preparing a copper clad laminate having holes and circuits;
Removing the carrier film from the unclad plate and mounting a chip in a position corresponding to the hole of the copper clad laminate on the adhesive film;
Laminating a copper foil and a prepreg on one surface of the copper clad laminate, and laminating an unclad plate on which the chip is mounted on the other surface of the copper clad laminate; And
A method of manufacturing an embedded printed circuit board using an unclad comprising the step of forming a circuit and processing via holes for interlayer connection with respect to the laminate formed by the laminating step. The method of claim 1, further comprising forming an additional outer layer on the outside of the laminate on which the circuit is formed after the step of forming the circuit. The method of claim 1, wherein the copper clad laminate is formed to have the same height as that of the chip. The method of claim 1, wherein the unclad plate is formed of cured resin in a C-stage state. The method of claim 1, wherein the processing of the via hole for interlayer connection and forming a circuit comprises a drilling, laser processing, and plating process, and the copper clad laminate is applied to the copper clad laminate by lamination among adhesive films formed on the other surface of the unclad plate Formed copper foil and each other
The method of manufacturing an embedded printed circuit board using an unclad, characterized in that the overlapping portion is removed by the laser processing. In the embedded printed circuit board using an unclad, a cured resin layer, a circuit formed on a lower surface of the resin layer, and an upper surface to be electrically connected through the circuit and vias.
An unclad layer including a circuit formed in the upper surface and an adhesive film formed in connection with the circuit formed on the upper surface;
A copper-clad laminate comprising a copper clad laminate having a chip seating hole stacked on the unclad layer, a chip embedded in the chip seating hole while adhered to the adhesive film of the unclad layer, and a circuit formed on the upper surface A layer (CCLlayer); And
Prepreg laminated on the copper clad laminate layer, a plurality of vias formed to be electrically connected to the chip and circuit of the copper clad laminate layer inside the prepreg, and a circuit formed on the upper surface of the prepreg. Embedded printed circuit board using an unclad that includes a prepreg layer. The method of claim 6, further comprising an IVH (Inner Via Hole) penetrating the unclad layer, a copper clad laminate layer laminated on the unclad layer, and a prepreg layer laminated on the copper clad laminate layer. Embedded printed circuit board using unclad. The embedded printed circuit board according to claim 6, wherein the cured resin layer is a cured resin in a C-stage state. The method of claim 6, wherein the connection between the circuit formed on the upper surface of the unclad layer and the adhesive film is formed by removing a portion of the adhesive film overlapping with the copper foil formed on the copper clad laminate by lamination by laser processing. Embedded printed circuit board using unclad.

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