WO2019165792A1 - 柔性基板及其制作方法、显示装置 - Google Patents

柔性基板及其制作方法、显示装置 Download PDF

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Publication number
WO2019165792A1
WO2019165792A1 PCT/CN2018/112388 CN2018112388W WO2019165792A1 WO 2019165792 A1 WO2019165792 A1 WO 2019165792A1 CN 2018112388 W CN2018112388 W CN 2018112388W WO 2019165792 A1 WO2019165792 A1 WO 2019165792A1
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WO
WIPO (PCT)
Prior art keywords
transition
region
back film
flexible substrate
bent
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PCT/CN2018/112388
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English (en)
French (fr)
Inventor
王伟
詹志锋
石佳凡
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/337,731 priority Critical patent/US11367842B2/en
Publication of WO2019165792A1 publication Critical patent/WO2019165792A1/zh
Priority to US17/749,918 priority patent/US11871647B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a flexible substrate, a method for fabricating the same, and a display device.
  • one side of the display area of the display substrate is provided with a binding electrode for transmitting an electrical signal of the driving circuit to the display area.
  • the flexible circuit board is electrically connected to the bonding electrode, it is bent to the side of the display substrate facing away from the display.
  • manufacturers began to gradually adopt a flexible display panel and directly bend the flexible substrate therein to bend the binding area to the back of the flexible substrate to reduce the bending radius.
  • the starting position of the bending region is prone to breakage of the signal line.
  • the present disclosure provides a flexible substrate, wherein the flexible substrate is divided into: a display area, a binding area on a side of the display area, and a to-be-bent area between the display area and the binding area Two transition zones between the to-be-bent zone and the display zone and between the to-be-bent zone and the binding zone, respectively; the transition zone includes a plurality of rows arranged along the first direction a transition sub-region, the first direction being a direction from the display region to the binding region; the flexible substrate comprising a flexible substrate and a back film disposed on the flexible substrate, the back film A portion is located in the transition zone; and in any one of the transition zones, the amount of distribution of the unit area of the backing film in each transition sub-zone gradually decreases along a direction gradually approaching the to-be-bent zone.
  • the thickness of the backing film in any one of the transition regions gradually decreases in a direction gradually approaching the to-be-folded region.
  • the thickness of the backing film in any one of the transition sub-regions remains unchanged or gradually decreases in a direction gradually approaching the to-be-folded region.
  • the coverage of the backing film in each transition sub-region gradually decreases along a direction gradually approaching the to-be-folded region.
  • the portion of the back film located in the transition region includes a plurality of transition pattern portions, the plurality of transition pattern portions being aligned in a second direction perpendicular to the first direction; and from the transition pattern The portion of the transition pattern portion in the second direction gradually decreases in size from a side of the portion to be bent to a side close to the portion to be bent.
  • a portion of the back film located outside the transition region is disposed in the display region and the binding region, and a thickness of the back film in the display region and the binding region is Greater than or equal to the thickness of the backing film in the transition zone.
  • an adhesive layer is disposed between the back film and the flexible substrate, and the adhesive layer covers the entire flexible substrate.
  • the present disclosure further provides a manufacturing method of a flexible substrate, which is divided into: a display area, a binding area on a side of the display area, and between the display area and the binding area.
  • the transition zone to be bent is respectively located between the to-be-bent zone and the display zone and two transition zones between the to-be-bent zone and the binding zone; the transition zone includes along the first a plurality of transition sub-regions arranged in a direction, the first direction being a direction from the display region to the binding region; the manufacturing method comprising: providing a flexible substrate; forming a back film on the flexible substrate Wherein a portion of the backing film is located in the transition zone, and in any one of the transition zones, the backing film is in each transition sub-zone in a direction that gradually approaches the to-be-bent zone The amount of distribution per unit area gradually decreases.
  • the step of forming a back film on the flexible substrate comprises: forming an initial back film; and laser etching the initial back film to form the back film.
  • the step of laser etching the initial back film comprises: performing a first etching process on a portion of the initial back film located in the transition region, such that in a direction gradually approaching the to-be-bent region, The thickness of the backing film in any one of the transition zones is gradually reduced.
  • the thickness of the backing film in any one of the transition sub-regions remains unchanged or gradually decreases in a direction gradually approaching the to-be-folded region.
  • the first etching process includes: etching the initial back film at least once in each transition sub-area, and in a direction gradually approaching the to-be-bent area, in each transition piece The number of etchings performed in the zone is gradually increasing.
  • the step of laser etching the initial back film comprises: performing a second etching process on a portion of the initial back film located in the transition region, so that any one of the transition regions is gradually approaching the In the direction of the bending zone, the coverage of the backing film in each transition sub-zone gradually decreases.
  • the portion of the back film located in the transition region includes a plurality of transition pattern portions, the plurality of transition pattern portions being aligned in a second direction perpendicular to the first direction; and from the transition pattern The portion of the transition pattern portion in the second direction gradually decreases in size from a side of the portion to be bent to a side close to the portion to be bent.
  • a portion of the back film located outside the transition region is disposed in the display region and the binding region, and a thickness of the back film in the display region and the binding region is Greater than or equal to the thickness of the backing film in the transition zone.
  • the step of forming a back film on the flexible substrate further comprises: forming a bonding layer on the flexible substrate, the back film being located at a side of the bonding layer facing away from the flexible substrate side.
  • the present disclosure further provides a display device including a display substrate obtained by bending the flexible substrate along a region to be bent.
  • FIG. 1 is a schematic view of a flexible substrate in the related art
  • Figure 2 is a schematic view of the flexible substrate of Figure 1 after being bent
  • FIG. 3 is a plan view of a flexible substrate in an embodiment of the present disclosure.
  • Figure 4 is a first cross-sectional view taken along line BB of Figure 3;
  • Figure 5 is a second cross-sectional view taken along line BB of Figure 3;
  • Figure 6 is a third cross-sectional view taken along line BB of Figure 3;
  • FIG. 7 is a schematic view showing a state after a flexible substrate is bent in the present disclosure.
  • FIG. 8 is a plan view of a flexible substrate in an embodiment of the present disclosure.
  • Figure 9 is a first cross-sectional view taken along line CC of Figure 8.
  • Figure 10 is a second cross-sectional view taken along line CC of Figure 8.
  • FIG. 11 is a plan view of a flexible substrate in an embodiment of the present disclosure.
  • FIG. 12 is a flow chart of a method for fabricating a flexible substrate provided by the present disclosure.
  • 13a to 13d are flow charts of a first etching process in a method of fabricating a flexible substrate.
  • FIG. 1 is a schematic view of a flexible substrate including a flexible substrate 11 having opposing first and second surfaces, and a first surface of the flexible substrate 11 provided with a display device (not Shown), the back surface film 12 is provided on the second surface of the flexible substrate 11.
  • the flexible substrate is divided into a display area AA, a binding area BO, and a space area M therebetween.
  • the display area AA is provided with a signal end
  • the binding area BO is provided with a binding electrode
  • the signal end and the binding electrode are connected by a signal line.
  • the binding area BO needs to be bent to the back of the display area AA.
  • the back film of the space M needs to be removed, and then the space is bent, thereby obtaining the structure of FIG.
  • the flexible substrate 11 is abruptly changed from the flat state to the curved state, and the thickness of the back film 12 is also abruptly changed.
  • the starting position causes stress concentration, and the thickness of the flexible substrate 11 is usually very thin, which tends to cause breakage of the signal line on the flexible substrate 11; especially when the bending shape is adjusted, the display area is displayed.
  • the AA and the binding area BO are relatively moved in the left-right direction of FIG. 2, which makes it easier for the flexible substrate 11 to be subjected to a large force at the position a and the position b, resulting in breakage of the signal line.
  • the embodiment of the present disclosure provides a flexible substrate.
  • the flexible substrate includes a flexible substrate 11 and a back film 12 disposed on the flexible substrate 11.
  • the flexible substrate is divided into: a display area AA, a binding area BO on the display area AA side, a to-be-bent area BE between the display area AA and the binding area BO, respectively located in the to-be-bent area BE
  • the transition zone TA includes a plurality of transition sub-areas TA' arranged in a first direction, which is a direction from the display area AA to the binding area BO (i.e., a left-to-right direction in Fig. 3). A portion of the backing film 12 is located in the transition zone TA. In any one of the transition zones TA, the amount of distribution per unit area of the back film 12 in each transition sub-region TA' gradually decreases in a direction gradually approaching the region to be bent BE.
  • the unit area distribution amount refers to the volume per unit area.
  • the unit area distribution amount of the back film 12 in any of the transition sub-regions TA' means the ratio of the volume of the back film 12 in the transition sub-region TA' to the area of the transition sub-region TA'.
  • the amount of distribution of the unit area of the back film 12 in each transition sub-region TA' gradually decreases along the direction gradually approaching the boundary to be bent BE, that is, the closer the transition sub-region TA' is to the bend-before-be-obtained area BE,
  • the amount of unit area distribution of the back film 12 in the transition sub-region TA' is smaller than that of the other transition sub-regions farther away from the bend region BE (the smaller the average volume per unit area) .
  • the flexible substrate in the present disclosure since the amount of the back film 12 is not directly changed from a large amount to a non-transition in the transition region TA, but has a gradually decreasing transition process, When the bending zone BE is bent, the problem of stress concentration does not occur, and the phenomenon that the signal line on the flexible substrate 11 is broken due to a large stress is reduced. For example, as shown in FIG. 7, the portion of the flexible substrate 11 located in the transition zone TA smoothly transitions into an arc shape, so that the back film 12 will no longer change significantly at the starting position of the bending, and thus no stress will occur. Concentrated issues. Similarly, as shown in FIG.
  • the back film 12 is formed into a specific pattern in the transition zone TA such that the amount of distribution of the unit area of the back film in the transition sub-region TA' near the BE to be bent BE is farther than The amount of distribution per unit area of the back film in the other transition sub-region TA' of the bend region BE is reduced. Therefore, the stress of the back film 12 at the initial position of the bending does not change significantly, and the problem of stress concentration does not occur.
  • the area of the transition zone TA may be 0.5 to 2 times the area of the BE to be bent.
  • the change in the amount of distribution per unit area of the backing film in each transition sub-region TA' can be achieved by the change in the thickness of the back film 12.
  • the thickness of the back film 12 in any one of the transition regions TA gradually decreases in a direction gradually approaching the portion to be bent BE.
  • “gradual reduction” can be continuously reduced or intermittently reduced.
  • the thickness of the backing film 12 may remain constant in a portion of the transition zone TA.
  • the thickness of the back film 12 may be uniformly distributed or may be gradually changed. Specifically, as shown in FIG. 4, the thickness of the back film 12 in any one of the transition sub-regions TA' remains unchanged in the direction gradually approaching the to-be-bent region BE, so that the thickness of the back film 12 is throughout the transition region. There is a stepwise change in the TA. Alternatively, as shown in FIGS. 5 and 6, the thickness of the back film 12 in any one of the transition sub-regions TA' gradually decreases in a direction gradually approaching the region to be bent BE, so that the back film 12 is in the entire transition region TA. The middle is inclined (as shown in Figure 6), the convex surface or the concave surface (as shown in Figure 5).
  • the back film 12 can completely cover the transition zone TA.
  • the change in the distribution amount per unit area of the back film 12 in each transition sub-region TA' can be achieved by the change in the coverage of the back film 12 in each transition sub-region TA'.
  • the coverage of the back film 12 in each of the transition sub-regions TA' gradually decreases in a direction gradually approaching the to-be-bent region BE. It should be noted that the coverage of the back film 12 in any transition sub-region TA' is the ratio of the coverage area of the back film 12 in the transition sub-region TA' to the area of the transition sub-region TA'.
  • the force distribution at each position in the same transition sub-region TA' is more uniform, and further specifically, as shown in FIGS. 8 and 11, the back film 12 is located in the transition region TA.
  • a plurality of transition pattern portions 12a are included, and the plurality of transition pattern portions 12a are arranged in a second direction perpendicular to the first direction.
  • the first direction is the left and right direction
  • the second direction is the up and down direction.
  • the transition pattern portion 12a is in the second direction.
  • the size of the tape is gradually reduced.
  • the orthographic shape of each transition pattern portion 12a on the flexible substrate 11 may be a triangle (as shown in FIG. 8), or a part of an ellipse (as shown in FIG. 9), or may be other shapes.
  • the thickness of each position may be the same in the same transition pattern portion 12a.
  • various embodiments may be combined such that when the flexible substrate 11 is bent, the closer the flexible substrate 11 is to the position to be bent BE, the smaller the force is, thereby facilitating the reduction of the bending. radius.
  • the thickness of the transition pattern portion 12a in the transition portion TA gradually decreases in a direction gradually approaching the portion to be bent BE, and the transition pattern The portion 12a has the same thickness in the same transition sub-region TA'.
  • the thickness of the transition pattern portion 12a gradually decreases in a direction gradually approaching the portion to be bent BE.
  • the back film 12 of the to-be-bent area BE is formed by the extrusion when the bending is performed, so that the signal line is located to be bent.
  • the portion of the fold BE breaks or causes other defects.
  • the portion of the back film 12 that is outside the transition zone TA is disposed in the display area AA and the binding area BO, and the backing film is not provided in the to-be-bent area BE.
  • the thickness of the back film 12 in the display area AA and the binding area BO is greater than or equal to the thickness of the back film 12 in the transition zone TA.
  • an adhesive layer 13 may be disposed between the back film 12 and the flexible substrate 11, and the adhesive layer 13 covers the entire flexible substrate 11.
  • the adhesive layer 13 is used to bond the back film 12 to the flexible substrate 13, and in addition, the adhesive layer 13 can prevent the flexible substrate 11 from being damaged when the back film 11 to be bent BE is removed.
  • the present disclosure further provides a manufacturing method of a flexible substrate.
  • the flexible substrate is divided into: a display area AA, a binding area on the side of the display area AA, and a display.
  • the transition zone BE between the zone AA and the binding zone BO is respectively located between the to-be-bent zone BE and the display zone AA and the two transition zones TA between the to-be-bent zone BE and the binding zone BO.
  • the area TA includes a plurality of transition sub-areas TA' arranged in a first direction, the first direction being a direction from the display area AA to the binding area BO.
  • the manufacturing method includes:
  • a flexible substrate is provided.
  • the portion of the substrate located in the transition zone is smoothed when bent along the region to be bent.
  • the ground gradually transitions into an arc shape, so that the back film will not change significantly at the starting position of the bending, so there is no problem of stress concentration, thereby reducing the signal line on the substrate at the starting position of the bending.
  • the phenomenon of fracture due to large stress is not directly mutated from a large amount to no in the transition zone, but has a gradually decreasing transition process.
  • the method for fabricating the flexible substrate of the present disclosure will be specifically described below with reference to FIG. 12, which is divided into the above display area, binding area, to be bent area and transition area.
  • the manufacturing method includes the following steps S10 to S30:
  • the back film is located on a side of the adhesive layer facing away from the flexible substrate, a part of the back film is located in the transition zone, and another part is located in the display area and the binding area; the back film is in the display area And the thickness in the binding zone is greater than or equal to the thickness of the backing film in the transition zone. Moreover, in any one of the transition regions, the amount of distribution of the unit area of the back film in each transition sub-region gradually decreases along the direction gradually approaching the region to be bent.
  • the step S30 specifically includes:
  • the initial backing film can cover the entire flexible substrate, and the material thereof can be polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • step S32 may specifically include:
  • the thickness of the backing film in any one of the transition sub-zones may remain constant or gradually decrease in a direction gradually approaching the region to be bent.
  • the first etching process includes: etching the initial back film at least once in each transition sub-area, and from a side of the transition area away from the to-be-bent area BE to a side close to the bending area
  • the number of etchings performed in each transition sub-region is gradually increased.
  • the etching depth of each etching may be the same, so that the closer to the transition sub-region to be bent, the more the thickness of the initial back film is etched away.
  • the first etching in all transition sub-regions may be the same laser etching process, and the second etching in a portion of the transition sub-regions is the same laser etching process.
  • FIG. 13a to FIG. 13d are schematic flow diagrams of the first etching process. After the adhesive layer 13 and the initial back film 121 are formed on the flexible substrate 11 (as shown in FIG. 13a), the initial back film of each transition sub-region TA' and the region to be bent BE is subjected to a first laser etching process. 121 is etched, and the etching result is as shown in FIG.
  • the first etching process may also be such that the etching depth in each transition sub-region is gradually changed by controlling the laser energy or by controlling the etching time.
  • the initial back film in the transition region ie, each transition sub-region
  • step S32a is to gradually change the amount of distribution of the unit area of the back film in each transition sub-region by controlling the thickness.
  • step S32 may include:
  • a portion of the back film located in the transition region includes a plurality of transition pattern portions arranged in a second direction perpendicular to the first direction; away from the transition pattern portion The side of the to-be-bent area is close to the side of the to-be-bent area, and the size of the transition pattern portion in the second direction is gradually reduced.
  • step S32 may include only one of the steps S32a and S32b, and may also include both.
  • step S32 includes the steps S32a and S32b, the order of the steps S32a and S32b is not limited.
  • the present disclosure further provides a display device including a display substrate, wherein the display substrate is obtained by bending the flexible substrate along a region to be bent. After bending, the binding zone is located on the opposite side of the display zone, and the to-be-bent zone and at least a portion of each transition zone together form an arcuate structure.

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Abstract

本公开提供一种柔性基板，所述柔性基板被划分为：显示区、位于该显示区一侧的绑定区、位于所述显示区与所述绑定区之间的待弯折区、分别位于所述待弯折区与所述显示区之间以及所述待弯折区与所述绑定区之间的两个过渡区；所述过渡区包括沿第一方向排列的多个过渡子区，所述第一方向为从所述显示区指向所述绑定区的方向；所述柔性基板包括柔性衬底和设置在该柔性衬底上的背膜，所述背膜的一部分位于所述过渡区中；在任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各个过渡子区中的单位面积分布量逐渐减小。相应地，本公开还提供一种柔性基板的制作方法和显示装置。

Description

柔性基板及其制作方法、显示装置
相关申请的交叉引用
本申请要求于2018年2月27日提交至中国知识产权局，发明名称为“柔性基板及其制作方法、显示装置”的中国专利申请NO.201810162327.7的优先权，其所公开的内容以引用的方式合并于此。
技术领域
本公开涉及显示技术领域，具体涉及一种柔性基板及其制作方法、显示装置。
背景技术
在显示装置中，显示基板的显示区的一侧设置有绑定电极，该绑定电极用于将驱动电路的电信号传输至显示区。传统技术中，柔性线路板与绑定电极电连接后，弯折至显示基板背离显示的一侧。为了减小显示装置的边框宽度，厂商开始逐渐采用柔性显示面板，并直接对其中的柔性基板弯折，以将绑定区弯折至柔性基板背后，以减小弯曲半径。但是目前在对柔性基板进行弯折后，弯折区域的起始位置容易出现信号线断裂的现象。
公开内容
本公开提供一种柔性基板，其中，所述柔性基板被划分为：显示区、位于该显示区一侧的绑定区、位于所述显示区与所述绑定区之间的待弯折区、分别位于所述待弯折区与所述显示区之间以及所述待弯折区与所述绑定区之间的两个过渡区；所述过渡区包括沿第一方向排列的多个过渡子区，所述第一方向为从所述显示区指向所述绑定区的方向；所述柔性基板包括柔性衬底和设置在所述柔性衬底上的背膜，所述背膜的一部分位于所述过渡区中；以及在任意一个所述过渡 区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各个过渡子区中的单位面积分布量逐渐减小。
可选地，沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡区中的厚度逐渐减小。
可选地，沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡子区中的厚度保持不变或逐渐减小。
可选地，在任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各过渡子区中的覆盖率逐渐减小。
可选地，所述背膜的位于所述过渡区的部分包括多个过渡图形部，所述多个过渡图形部沿与所述第一方向垂直的第二方向排列；并且从所述过渡图形部远离所述待弯折区的一侧到靠近所述待弯折区的一侧，所述过渡图形部在所述第二方向上的尺寸逐渐减小。
可选地，所述背膜的位于所述过渡区之外的部分设置在所述显示区和所述绑定区，所述背膜在所述显示区和所述绑定区中的厚度均大于或等于所述背膜在所述过渡区中的厚度。
可选地，所述背膜与所述柔性衬底之间还设置有粘结层，所述粘结层覆盖整个所述柔性衬底。
相应地，本公开还提供一种柔性基板的制作方法，所述柔性基板被划分为：显示区、位于该显示区一侧的绑定区、位于所述显示区与所述绑定区之间的待弯折区、分别位于所述待弯折区与所述显示区之间以及所述待弯折区与所述绑定区之间的两个过渡区；所述过渡区包括沿第一方向排列的多个过渡子区，所述第一方向为从所述显示区指向所述绑定区的方向；所述制作方法包括：提供柔性衬底；在所述柔性衬底上形成背膜；其中，所述背膜的一部分位于所述过渡区中，并且，在任意一个所述过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各个过渡子区中的单位面积分布量逐渐减小。
可选地，在所述柔性衬底上形成背膜的步骤包括：形成初始背膜；对所述初始背膜进行激光刻蚀，以形成所述背膜。
可选地，对所述初始背膜进行激光刻蚀的步骤包括：对所述初始背膜的位于过渡区的部分进行第一刻蚀过程，使得沿逐渐靠近所述 待弯折区的方向，所述背膜在任意一个过渡区中的厚度逐渐减小。
可选地，沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡子区中的厚度保持不变或逐渐减小。
可选地，所述第一刻蚀过程包括：在每个过渡子区均对所述初始背膜进行至少一次刻蚀，并且，沿逐渐靠近所述待弯折区的方向，在各过渡子区内进行的刻蚀次数逐渐增多。
可选地，对所述初始背膜进行激光刻蚀的步骤包括：对所述初始背膜的位于过渡区的部分进行第二刻蚀过程，使得任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各过渡子区内的覆盖率逐渐减小。
可选地，所述背膜的位于所述过渡区的部分包括多个过渡图形部，所述多个过渡图形部沿与所述第一方向垂直的第二方向排列；并且从所述过渡图形部远离所述待弯折区的一侧到靠近所述待弯折区的一侧，所述过渡图形部在所述第二方向上的尺寸逐渐减小。
可选地，所述背膜的位于所述过渡区之外的部分设置在所述显示区和所述绑定区，所述背膜在所述显示区和所述绑定区中的厚度均大于或等于所述背膜在所述过渡区中的厚度。
可选地，在所述柔性衬底上形成背膜的步骤之前还包括：在所述柔性衬底上形成粘结层，所述背膜位于所述粘结层背离所述柔性衬底的一侧。
相应地，本公开还提供一种显示装置，包括显示基板，所述显示基板由上述柔性基板沿其待弯折区进行弯折后得到。
附图说明
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1是相关技术中的柔性基板的示意图；
图2是图1的柔性基板弯折后的示意图；
图3是本公开中一实施方式中的柔性基板的俯视图；
图4是沿图3中BB线的第一种剖视图；
图5是沿图3中BB线的第二种剖视图；
图6是沿图3中BB线的第三种剖视图；
图7是本公开中的柔性基板弯折后的状态示意图；
图8是本公开中一实施方式中的柔性基板的俯视图；
图9是沿图8中CC线的第一种剖视图；
图10是沿图8中CC线的第二种剖视图；
图11是本公开中一实施方式中的柔性基板的俯视图；
图12是本公开提供的柔性基板的制作方法流程图；
图13a至图13d是柔性基板制作方法中的第一刻蚀过程的流程图。
具体实施方式
以下结合附图对本公开的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本公开，并不用于限制本公开。
图1为相关技术中的柔性基板的示意图，柔性基板包括柔性衬底11，柔性衬底11具有相对的第一表面和第二表面，柔性衬底11的第一表面上设置有显示器件(未示出)，柔性衬底11的第二表面上设置有背膜12。柔性基板被划分为显示区AA、绑定区BO和位于二者之间的间隔区M。显示区AA设置有信号端，绑定区BO设置有绑定电极，信号端和绑定电极通过信号线相连。为减小显示产品的边框，需要将绑定区BO弯折至显示区AA背后。而由于背膜12的硬度相对较大，因此，为了达到所需的弯折半径，需要将间隔区M的背膜去除，之后再对间隔区进行弯折，从而得到图2的结构。在图2中，在弯折的起始位置(位置a和位置b)，柔性衬底11从平整状态到弧形状态之间发生突变，且背膜12厚度也发生突变，因此，在弯折的起始位置会产生应力集中现象，而柔性衬底11的厚度通常很薄，从而容易导致柔性衬底11上的信号线发生断裂；尤其是在对弯折形状进行调整时，会将显示区AA和绑定区BO沿图2的左右方向 进行相对移动，这就更容易造成柔性衬底11在位置a和位置b处受到较大的作用力，而导致信号线断裂。
为了减少柔性基板在弯折时发生的信号线断裂现象，本公开实施例提供一种柔性基板。结合图3至图6所示，柔性基板包括柔性衬底11和设置在该柔性衬底11上的背膜12。所述柔性基板被划分为：显示区AA、位于该显示区AA一侧的绑定区BO、位于显示区AA与绑定区BO之间的待弯折区BE、分别位于待弯折区BE与显示区AA之间以及待弯折区BE与绑定区BO之间的两个过渡区TA。过渡区TA包括沿第一方向排列的多个过渡子区TA’，所述第一方向为从显示区AA指向绑定区BO的方向(即，图3中从左到右的方向)。背膜12的一部分位于过渡区TA中。在任意一个过渡区TA中，沿逐渐靠近待弯折区BE的方向，背膜12在各过渡子区TA’中的单位面积分布量逐渐减小。
需要说明的是，单位面积分布量是指单位面积上所具有的体积。背膜12在任一过渡子区TA’中的单位面积分布量是指：背膜12在该过渡子区TA’中的体积与该过渡子区TA’的面积之比。因此，“沿逐渐靠近待弯折区BE的方向，背膜12在各过渡子区TA’中的单位面积分布量逐渐减小”即：过渡子区TA’距离待弯折区BE越近，则相比于距离待弯折区BE较远的其它过渡子区而言，背膜12在该过渡子区TA’中的单位面积分布量更少(单位面积上所具有的平均体积越小)。
与相关技术相比，在本公开中柔性基板中，由于背膜12的量在过渡区TA并不是直接从较大量突变为无的，而是有一个逐渐减小的过渡过程，因此，沿待弯折区BE进行弯折时，不会出现应力集中的问题，进而减少柔性衬底11上的信号线因受较大应力而发生断裂的现象。例如图7所示，柔性衬底11位于过渡区TA的部分平滑地逐渐过渡为弧形，从而使得背膜12在弯折的起始位置将不再有明显变化，因此也就不会出现应力集中的问题。同样地，例如图8所示，在过渡区TA中将背膜12形成为特定的图案，使得靠近待弯折区BE的过渡子区TA’中的背膜的单位面积分布量相比于远离待弯折区BE的其它过渡子区TA’中的背膜的单位面积分布量而言减小。因此，背 膜12在弯折的起始位置应力也不会明显变化，不会出现应力集中的问题。
其中，过渡区TA的面积可以为待弯折区BE面积的0.5倍～2倍。
在本公开的一种具体实施方式中，可以通过背膜12厚度的变化实现背膜在各过渡子区TA’内的单位面积分布量变化。具体地，沿逐渐靠近待弯折区BE的方向，背膜12在任意一个过渡区TA中的厚度逐渐减小。此处“逐渐减小”可以连续地减小或者间断地减小。比如，背膜12的厚度可以在一部分过渡区TA中保持不变。
进一步，在一个过渡区TA的同一个过渡子区TA’中，背膜12的厚度可以分布均匀，也可以逐渐变化。具体地，如图4所示，沿逐渐靠近待弯折区BE的方向，背膜12在任意一个过渡子区TA’中的厚度保持不变，从而使得背膜12的厚度在一整个过渡区TA内呈阶梯式变化。或者，如图5和图6所示，沿逐渐靠近待弯折区BE的方向，背膜12在任意一个过渡子区TA’中的厚度逐渐减小，从而使得背膜12在整个过渡区TA中呈斜平面(如图6所示)、上凸的曲面或下凹的曲面(如图5所示)。
其中，如图3所示，在一种实施方式中，背膜12可以完全覆盖过渡区TA。
在本公开的一种具体实施方式中，可以通过背膜12在各过渡子区TA’中覆盖率的变化，来实现背膜12在各过渡子区TA’中单位面积分布量的变化。具体地，在任意一个过渡区TA中，沿逐渐靠近待弯折区BE的方向，背膜12在各过渡子区TA’中的覆盖率逐渐减小。需要说明的是，背膜12在任一过渡子区TA’中的覆盖率为：背膜12在过渡子区TA’中的覆盖面积与该过渡子区TA’的面积之比。
为了使得柔性衬底11在弯折时，同一个过渡子区TA’中的各位置受力分布更均匀，进一步具体地，如图8和图11所示，背膜12位于过渡区TA的部分包括多个过渡图形部12a，多个过渡图形部12a沿与所述第一方向垂直的第二方向排列。在图8和11中，第一方向是左右方向，而第二方向是上下方向。并且，从过渡图形部12a远离待弯折区BE的一侧(图中左侧)到靠近待弯折区BE的一侧(图中 右侧)，过渡图形部12a在所述第二方向上的尺寸逐渐减小。其中，每个过渡图形部12a在柔性衬底11上的正投影形状可以为三角形(如图8所示)，或者为椭圆形的一部分(如图9所示)，也可以为其他形状。
在一种具体实施方式中，同一个过渡图形部12a中，各位置的厚度可以相同。而为了实现窄边框，可以将多种实施方式结合，以使得柔性衬底11在弯折时，柔性衬底11越靠近待弯折区BE的位置受力越小，从而有利于减小弯折半径。具体地，结合图8和图9所示，对于任意一个过渡图形部12a，沿逐渐靠近待弯折区BE的方向，过渡图形部12a在过渡区TA内的厚度逐渐减小，并且，过渡图形部12a在同一个过渡子区TA’内的厚度相同。或者，结合图8和图10所示，对于任意一个过渡图形部12a，沿逐渐靠近待弯折区BE的方向，过渡图形部12a的厚度逐渐减小。
考虑到如果背膜12在待弯折区BE也留有一定的厚度，那么在弯折时，待弯折区BE的背膜12因挤压而形成凸起，从而使信号线的位于待弯折区BE的部分发生断裂或引起其他不良。为此，在本公开中，背膜12的位于过渡区TA之外的部分设置在显示区AA和绑定区BO，而待弯折区BE没有设置背膜。另外，背膜12在显示区AA和绑定区BO中的厚度均大于或等于背膜12在过渡区TA中的厚度。
进一步地，背膜12与柔性衬底11之间还可以设置有粘结层13，粘结层13覆盖整个柔性衬底11。粘性层13用于将背膜12与柔性衬底13粘合，另外，在去除待弯折区BE的背膜11时，粘结层13可以防止柔性衬底11受到损伤。
相应地，本公开还提供一种柔性基板的制作方法，如图3至图6所示，所述柔性基板被划分为：显示区AA、位于该显示区AA一侧的绑定区、位于显示区AA与绑定区BO之间的待弯折区BE、分别位于待弯折区BE与显示区AA之间以及待弯折区BE与绑定区BO之间的两个过渡区TA，过渡区TA包括沿第一方向排列的多个过渡子区TA’，所述第一方向为从显示区AA指向绑定区BO的方向。所述制作 方法包括：
提供柔性衬底。
在所述柔性衬底上形成背膜；其中，所述背膜的一部分位于所述过渡区中，并且，在任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各过渡子区中的单位面积分布量逐渐减小。
由于背膜的量在过渡区并不是直接从较大量突变为无的，而是有一个逐渐减小的过渡过程，因此，沿待弯折区进行弯折时，衬底位于过渡区的部分平滑地逐渐过渡为弧形，从而使得背膜在弯折的起始位置将不再有明显变化，因此也就不会出现应力集中的问题，进而减少衬底上的信号线在弯折起始位置因受较大应力而发生断裂的现象。
下面结合图12对本公开的柔性基板的制作方法进行具体介绍，所述柔性基板被划分为上述显示区、绑定区、待弯折区和过渡区。所述制作方法包括以下步骤S10～S30：
S10、提供柔性衬底。
S20、在柔性衬底上形成粘结层。
S30、在柔性衬底上形成背膜，背膜位于粘结层背离柔性衬底的一侧，背膜的一部分位于过渡区中，另一部分位于显示区和绑定区中；背膜在显示区和绑定区中的厚度均大于或等于背膜在过渡区中的厚度。并且，在任意一个过渡区中，沿逐渐靠近待弯折区的方向，背膜在各过渡子区中的单位面积分布量逐渐减小。
其中，步骤S30具体包括：
S31、形成初始背膜。初始背膜可以覆盖整个柔性衬底，其材料可以为聚对苯二甲酸乙二醇酯(PET)。
S32、对所述初始背膜进行激光刻蚀，以形成所述背膜。具体地，对所述初始背膜的位于待弯折区和过渡区的部分进行激光刻蚀，以形成所述背膜。
其中，可以通过控制厚度来使得背膜在各过渡子区内的单位面积分布量逐渐变化。这时，步骤S32具体可以包括：
S32a、对所述初始背膜的位于待弯折区和过渡区的部分进行第一刻蚀过程，使得沿逐渐靠近待弯折区的方向，背膜在任意一个过渡 区中的厚度逐渐减小。可选地，沿逐渐靠近待弯折区的方向，背膜在任意一个过渡子区中的厚度可以保持不变或逐渐减小。
可选地，第一刻蚀过程包括：在每个过渡子区均对初始背膜进行至少一次刻蚀，并且，从过渡区远离待弯折区BE的一侧到靠近弯折区的一侧，在各过渡子区内进行的刻蚀次数逐渐增多。其中，每一次刻蚀的刻蚀深度可以相同，以使得越靠近待弯折区的过渡子区中，初始背膜被刻蚀掉的厚度越多。采用这种多次刻蚀的方式，可以防止一次性刻蚀较大深度而产生较多的热量，从而防止初始背膜局部热量过高，进而在刻蚀形成的背膜中，各位置的材料性质相近，更有利于弯折。
实际生产中，在所有过渡子区的第一次刻蚀可以为同一次激光刻蚀工艺，对一部分过渡子区的第二次刻蚀为同一次激光刻蚀工艺。以待过渡区两侧均设置两个过渡子区为例，图13a至图13d示意出了所述第一刻蚀过程的流程示意图。在柔性衬底11上形成粘结层13和初始背膜121(如图13a所示)后，通过第一次激光刻蚀工艺对各个过渡子区TA’和待弯折区BE的初始背膜121进行刻蚀，刻蚀结果如图13b所示；之后，通过第二次激光刻蚀工艺对待弯折区BE及其相邻两个过渡子区TA’的初始背膜121进行刻蚀，刻蚀结果如图13c所示；最后，再通过第三次激光刻蚀工艺对待弯折区BE的初始背膜121进行刻蚀，刻蚀结果如图13d所示。同理，当待弯折区BE两侧分别设置其他数量(例如三个)的过渡子区TA’时，将前一次刻蚀所形成的区域分别从其两侧朝向待弯折区BE各减少一个过渡子区TA’后，所剩的区域即为下一次进行刻蚀的区域。
当然，第一刻蚀过程也可以为：通过控制激光能量或通过控制刻蚀时间的方式，使得各过渡子区内的刻蚀深度逐渐变化。可选地，通过第一刻蚀过程对过渡区(即各个过渡子区)中的初始背膜全部刻蚀。
上述步骤S32a是通过控制厚度来使得背膜在各过渡子区内的单位面积分布量逐渐变化。另外，也可以通过控制覆盖率来使得背膜在各过渡子区内的单位面积分布量逐渐变化。此时，步骤S32可以包 括：
S32b、对所述初始背膜的位于过渡区的部分进行第二刻蚀过程，使得任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各过渡子区内的覆盖率逐渐减小。具体地，所述背膜的位于所述过渡区的部分包括多个过渡图形部，所述多个过渡图形部沿与所述第一方向垂直的第二方向排列；从所述过渡图形部远离所述待弯折区的一侧到靠近所述待弯折区的一侧，所述过渡图形部在所述第二方向上的尺寸逐渐减小。
需要说明的是，上述步骤S32可以仅包括步骤S32a和S32b中的一者，也可以包括二者，当步骤S32包括步骤S32a和S32b时，步骤S32a和S32b的先后顺序不做限定。
相应地，本公开还提供一种显示装置，包括显示基板，其中，所述显示基板由上述柔性基板沿其待弯折区进行弯折后得到。弯折后，绑定区位于显示区的相对侧，待弯折区和每个过渡区的至少一部分共同形成弧形结构。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (17)

  1. 一种柔性基板，其中，所述柔性基板被划分为：显示区、位于该显示区一侧的绑定区、位于所述显示区与所述绑定区之间的待弯折区、分别位于所述待弯折区与所述显示区之间以及所述待弯折区与所述绑定区之间的两个过渡区；
    所述过渡区包括沿第一方向排列的多个过渡子区，所述第一方向为从所述显示区指向所述绑定区的方向；
    所述柔性基板包括柔性衬底和设置在所述柔性衬底上的背膜，所述背膜的一部分位于所述过渡区中；以及
    在任意一个所述过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各个过渡子区中的单位面积分布量逐渐减小。
  2. 根据权利要求1所述的柔性基板，其中，沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡区中的厚度逐渐减小。
  3. 根据权利要求2所述的柔性基板，其中，沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡子区中的厚度保持不变或逐渐减小。
  4. 根据权利要求1至3中任意一项所述的柔性基板，其中，在任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各过渡子区中的覆盖率逐渐减小。
  5. 根据权利要求4所述的柔性基板，其中，所述背膜的位于所述过渡区的部分包括多个过渡图形部，所述多个过渡图形部沿与所述第一方向垂直的第二方向排列；并且
    从所述过渡图形部远离所述待弯折区的一侧到靠近所述待弯折区的一侧，所述过渡图形部在所述第二方向上的尺寸逐渐减小。
  6. 根据权利要求1至5中任意一项所述的柔性基板，其中，所述背膜的位于所述过渡区之外的部分设置在所述显示区和所述绑定区，所述背膜在所述显示区和所述绑定区中的厚度均大于或等于所述背膜在所述过渡区中的厚度。
  7. 根据权利要求1至3中任意一项所述的柔性基板，其中，所述背膜与所述柔性衬底之间还设置有粘结层，所述粘结层覆盖整个所述柔性衬底。
  8. 一种柔性基板的制作方法，所述柔性基板被划分为：显示区、位于该显示区一侧的绑定区、位于所述显示区与所述绑定区之间的待弯折区、分别位于所述待弯折区与所述显示区之间以及所述待弯折区与所述绑定区之间的两个过渡区；所述过渡区包括沿第一方向排列的多个过渡子区，所述第一方向为从所述显示区指向所述绑定区的方向；所述制作方法包括：
    提供柔性衬底；
    在所述柔性衬底上形成背膜；其中，所述背膜的一部分位于所述过渡区中，并且，在任意一个所述过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各个过渡子区中的单位面积分布量逐渐减小。
  9. 根据权利要求8所述的制作方法，其中，在所述柔性衬底上形成背膜的步骤包括：
    形成初始背膜；
    对所述初始背膜进行激光刻蚀，以形成所述背膜。
  10. 根据权利要求9所述的制作方法，其中，对所述初始背膜进行激光刻蚀的步骤包括：
    对所述初始背膜的位于过渡区的部分进行第一刻蚀过程，使得沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡区中的厚度逐渐减小。
  11. 根据权利要求10所述的制作方法，其中，沿逐渐靠近所述待弯折区的方向，所述背膜在任意一个过渡子区中的厚度保持不变或逐渐减小。
  12. 根据权利要求10所述的制作方法，其中，所述第一刻蚀过程包括：在每个过渡子区均对所述初始背膜进行至少一次刻蚀，并且，沿逐渐靠近所述待弯折区的方向，在各过渡子区内进行的刻蚀次数逐渐增多。
  13. 根据权利要求9至12中任意一项所述的制作方法，其中，对所述初始背膜进行激光刻蚀的步骤包括：对所述初始背膜的位于过渡区的部分进行第二刻蚀过程，使得任意一个过渡区中，沿逐渐靠近所述待弯折区的方向，所述背膜在各过渡子区内的覆盖率逐渐减小。
  14. 根据权利要求13所述的制作方法，其中，所述背膜的位于所述过渡区的部分包括多个过渡图形部，所述多个过渡图形部沿与所述第一方向垂直的第二方向排列；并且
    从所述过渡图形部远离所述待弯折区的一侧到靠近所述待弯折区的一侧，所述过渡图形部在所述第二方向上的尺寸逐渐减小。
  15. 根据权利要求8至14中任意一项所述的制作方法，其中，所述背膜的位于所述过渡区之外的部分设置在所述显示区和所述绑定区，所述背膜在所述显示区和所述绑定区中的厚度均大于或等于所述背膜在所述过渡区中的厚度。
  16. 根据权利要求8至12中任意一项所述的制作方法，其中，在所述柔性衬底上形成背膜的步骤之前还包括：
    在所述柔性衬底上形成粘结层，所述背膜位于所述粘结层背离所述柔性衬底的一侧。
  17. 一种显示装置，包括显示基板，所述显示基板由权利要求1至7中任一项所述的柔性基板沿其待弯折区进行弯折后得到。
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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108305880B (zh) 2018-02-27 2021-05-07 京东方科技集团股份有限公司 柔性基板及其制作方法、显示装置
CN108962031B (zh) * 2018-07-24 2022-02-08 上海天马微电子有限公司 一种显示面板及显示装置
CN109064892B (zh) * 2018-08-02 2023-01-10 京东方科技集团股份有限公司 柔性显示基板和柔性显示装置
CN109285461B (zh) 2018-11-30 2020-07-17 云谷（固安）科技有限公司 一种显示面板和显示装置
CN109616021A (zh) * 2019-01-30 2019-04-12 武汉华星光电半导体显示技术有限公司 显示装置
CN110047881B (zh) * 2019-03-29 2021-03-16 武汉华星光电半导体显示技术有限公司 显示面板和显示面板制作方法
CN111756889A (zh) * 2019-03-29 2020-10-09 华为技术有限公司 一种盖板及移动终端
CN110189636B (zh) * 2019-05-31 2021-06-22 武汉华星光电半导体显示技术有限公司 显示面板以及显示装置
US11165030B2 (en) 2019-05-31 2021-11-02 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and display device
CN110197620B (zh) * 2019-06-26 2021-06-29 云谷（固安）科技有限公司 一种柔性显示模组及柔性显示装置
CN110491882B (zh) * 2019-08-08 2022-04-05 武汉天马微电子有限公司 柔性电路板、显示面板及显示装置
CN110718563B (zh) * 2019-11-19 2021-11-09 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示装置
CN111402735A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 显示装置
CN111584743A (zh) * 2020-05-13 2020-08-25 武汉华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN111710760B (zh) * 2020-06-28 2022-06-03 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
CN113947994B (zh) * 2020-07-15 2023-01-10 京东方科技集团股份有限公司 显示面板和显示装置
CN112289186B (zh) * 2020-10-26 2022-05-31 武汉华星光电半导体显示技术有限公司 显示装置
CN112581867B (zh) * 2020-12-10 2022-05-03 深圳市华星光电半导体显示技术有限公司 一种显示面板及显示装置
CN113534516A (zh) * 2021-06-16 2021-10-22 北海惠科光电技术有限公司 阵列基板、显示装置及显示装置的制作方法
CN113421495A (zh) * 2021-06-28 2021-09-21 武汉华星光电半导体显示技术有限公司 可折叠显示模组及可折叠显示模组的制作方法
CN114241911A (zh) * 2021-12-17 2022-03-25 昆山国显光电有限公司 显示面板及显示面板制作方法
CN115206189A (zh) * 2022-07-11 2022-10-18 武汉华星光电半导体显示技术有限公司 一种显示装置及显示终端

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031499A (ja) * 2014-07-30 2016-03-07 株式会社ジャパンディスプレイ 表示装置
CN106449695A (zh) * 2015-08-06 2017-02-22 三星显示有限公司 柔性显示装置
CN106847870A (zh) * 2017-03-10 2017-06-13 上海天马微电子有限公司 柔性显示装置
CN108305880A (zh) * 2018-02-27 2018-07-20 京东方科技集团股份有限公司 柔性基板及其制作方法、显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170021431A (ko) * 2015-08-17 2017-02-28 삼성디스플레이 주식회사 플렉서블 표시 장치
CN107845643B (zh) * 2017-09-25 2020-09-08 上海天马微电子有限公司 一种显示面板及显示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031499A (ja) * 2014-07-30 2016-03-07 株式会社ジャパンディスプレイ 表示装置
CN106449695A (zh) * 2015-08-06 2017-02-22 三星显示有限公司 柔性显示装置
CN106847870A (zh) * 2017-03-10 2017-06-13 上海天马微电子有限公司 柔性显示装置
CN108305880A (zh) * 2018-02-27 2018-07-20 京东方科技集团股份有限公司 柔性基板及其制作方法、显示装置

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