WO2019150956A1 - 半導体背面密着フィルム及びダイシングテープ一体型半導体背面密着フィルム - Google Patents

半導体背面密着フィルム及びダイシングテープ一体型半導体背面密着フィルム Download PDF

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Publication number
WO2019150956A1
WO2019150956A1 PCT/JP2019/001134 JP2019001134W WO2019150956A1 WO 2019150956 A1 WO2019150956 A1 WO 2019150956A1 JP 2019001134 W JP2019001134 W JP 2019001134W WO 2019150956 A1 WO2019150956 A1 WO 2019150956A1
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WIPO (PCT)
Prior art keywords
contact film
back contact
dicing tape
adhesive layer
sensitive adhesive
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PCT/JP2019/001134
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English (en)
French (fr)
Japanese (ja)
Inventor
佐藤慧
志賀豪士
高本尚英
Original Assignee
日東電工株式会社
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Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201980010799.3A priority Critical patent/CN111656492A/zh
Priority to KR1020207024588A priority patent/KR20200112941A/ko
Publication of WO2019150956A1 publication Critical patent/WO2019150956A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a semiconductor back contact film and a dicing tape integrated semiconductor back contact film. More specifically, the present invention relates to a semiconductor back contact film and a dicing tape integrated semiconductor back contact film that can be used in the process of manufacturing a semiconductor device.
  • a semiconductor back contact film may be used as a film for forming a protective film on a so-called back surface of the chip.
  • a semiconductor back surface adhesion film may be provided with the form integrated with the dicing tape (refer patent document 1, 2).
  • a semiconductor back contact film is usually formed by a roll-to-roll method on a long separator on a plurality of substantially back-shaped semiconductor back contact films cut into the same shape as a semiconductor wafer. Manufactured in an arranged state.
  • the semiconductor back contact film produced in this way is, in use, conveyed from the separator to the semiconductor back contact film by curving the separator to the side opposite to the semiconductor back contact film while being transported in the longitudinal direction by a transport roll. It is used by lifting the edge and peeling it from here.
  • a semiconductor device called a so-called fan-out type panel level package (PLP) is sometimes employed.
  • PLP fan-out type panel level package
  • a larger-sized and rectangular semiconductor back contact film corresponding to the size and shape of the fan-out type PLP substrate is used.
  • the semiconductor back contact film having such a shape is peeled off from the long separator, the floating tip is caught and wrinkles may occur.
  • a dicing tape-integrated semiconductor back contact film when peeling from a state in which a plurality of rectangular dicing tape-integrated semiconductor back contact films are arranged on a long separator, Sometimes entered.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor back contact film capable of making it difficult for wrinkles to be formed when peeling from a separator.
  • the inventors of the present invention have a planar projection area of 22500 mm 2 or more, and the planar projection shape has at least one round portion having a curvature radius R1 of 0.5 to 10 mm. It has been found that when a non-circular semiconductor back contact film is used, wrinkles can be made difficult to occur during peeling from the separator. The present invention has been completed based on these findings.
  • the present invention provides a semiconductor back contact film having a planar projection area of 22,500 mm 2 or more and a planar projection shape having a non-circular shape having at least one rounded portion having a radius of curvature R1 of 0.5 to 10 mm. provide.
  • the semiconductor back contact film having such a configuration can be used in the process of manufacturing a semiconductor device.
  • the semiconductor back contact film of the present invention has a planar projection area of 22,500 mm 2 or more.
  • the planar projection shape is non-circular and has at least one rounded portion having a radius of curvature R1 of 0.5 to 10 mm.
  • the semiconductor back contact film of the present invention having such a structure is relatively larger than the conventional one corresponding to a circular semiconductor wafer having a maximum of 12 inches or less, and is non-circular, and from the separator. It is possible to make wrinkles difficult to remove at the time of peeling. For example, by arranging the semiconductor back contact film so that the rounded portion having the radius of curvature R1 of 0.5 to 10 mm is in the traveling direction during the transport of the long separator, it is difficult to wrinkle when peeling from the separator. can do.
  • the planar projection shape is a shape in which at least one corner of a quadrangle having a minor axis to major axis ratio [major axis / minor axis] of 1 to 10 is processed into the rounded portion. Is preferred.
  • the semiconductor back surface adhesion film of this invention has such a structure, it is hard to generate
  • the present invention also includes a dicing tape having a laminated structure including a base material and an adhesive layer, and the semiconductor back contact film that is peelably adhered to the adhesive layer in the dicing tape.
  • the tape provides a dicing tape-integrated semiconductor back contact film having a planar projection area larger than that of the semiconductor back contact film and a planar projection shape having a rounded portion.
  • the dicing tape-integrated semiconductor back contact film having such a configuration can be used in the process of manufacturing a semiconductor device.
  • the dicing tape-integrated semiconductor back contact film of the present invention has a dicing tape having a laminated structure including a base material and an adhesive layer, and is detachably adhered to the adhesive layer in the dicing tape.
  • the dicing tape has a planar projection area larger than that of the semiconductor back adhesion film, and the planar projection shape has a rounded portion.
  • the dicing tape-integrated semiconductor back contact film having such a structure can attach a frame for dicing to the surface of the pressure-sensitive adhesive layer during dicing, and is less likely to wrinkle when peeled from the separator. .
  • the planar projection shape in which the rounded portion is not formed in the dicing tape is similar to the planar projection shape in which the rounded portion is not formed in the semiconductor back contact film, and the similarity ratio [the former / the latter] in the similar shape is 1.01 or more. It is preferable that When the dicing tape-integrated semiconductor back contact film of the present invention has such a configuration, a dicing frame can be attached to the adhesive layer of the dicing tape and used as it is for dicing.
  • the ratio [R2 / R1] of the curvature radius R2 of the rounded portion and the curvature radius R1 in the dicing tape is preferably 0.5 to 100.
  • the semiconductor back contact film of the present invention and the dicing tape-integrated semiconductor back contact film of the present invention are relatively large and non-circular, but are less likely to wrinkle when peeled from the separator.
  • the semiconductor back contact film so that the rounded portion where the radius of curvature R1 is within a specific range is in the traveling direction during conveyance of the long separator, wrinkles are less likely to occur when peeling from the separator. be able to.
  • FIG. 1 is a schematic top view (plan view) showing one embodiment of a semiconductor back contact film of the present invention. It is front sectional drawing of the semiconductor back surface adhesion film of this invention shown in FIG. 1 is a schematic top view (plan view) showing an embodiment of a dicing tape-integrated semiconductor back contact film of the present invention.
  • FIG. FIG. 4 is a top view (plan view) of the dicing tape-integrated semiconductor back contact film of the present invention shown in FIG. 3 viewed from the semiconductor back contact film side. It is front sectional drawing of the dicing tape integrated semiconductor back contact film of this invention shown in FIG. It is the schematic (front sectional drawing) which shows one Embodiment of an affixing process.
  • the semiconductor back contact film of the present invention (sometimes simply referred to as “back contact film”) has a planar projection area of 22500 mm 2 or more, and a planar projection shape having a radius of curvature R1 of 0.5 to 10 mm. Is a non-circular shape having at least one.
  • the “surface” of the semiconductor (work) means a surface on which bumps for flip chip mounting of the work are formed, and the “back” means the opposite side of the surface, that is, bumps are formed. It shall mean the surface that is not.
  • the “back contact film” refers to a film used in close contact with the back surface of the semiconductor, and includes a film (semiconductor back surface protection film) for forming a protective film on the back surface (so-called back surface) of the semiconductor chip.
  • the rounded portion having the radius of curvature R1 of 0.5 to 10 mm may be referred to as “rounded portion X”.
  • the planar projection shape of the back contact film of the present invention is a non-circular shape having at least one round portion X.
  • a planar projection shape for example, a shape in which at least one corner of a polygon (for example, a triangle, a quadrangle such as a square or a rectangle, a hexagon, an octagon, etc.) is processed into a round portion X
  • Non-circular shapes such as a shape in which the corners of the end portions of the straight portions of the shape having an extending straight portion in the advancing direction (for example, a semicircle, a fan shape, etc.) are processed into the rounded portion X can be mentioned.
  • At least one corner (especially all corners) of the polygon has been processed into the rounded portion X from the viewpoint of being able to cope with a relatively large substrate and minimizing the waste portion after use.
  • the shape is preferable, and more preferable is a shape in which at least one corner (particularly, all corners) of a quadrangle (particularly a square) is processed into the rounded portion X.
  • FIG. 1 is a top view (plan view) showing an embodiment of the back contact film of the present invention.
  • a plurality of back contact films 10 of the present invention are arranged in one direction F on a long separator (long release liner) 30.
  • the shape (planar projection shape) seen from the upper surface of the back contact film 10 of the present invention shown in FIG. 1 is a shape in which all corners of a square are processed into 10a, 10b, 10c, and 10d that are round portions X. is there.
  • the long separator 30 When the back contact film 10 of the present invention is peeled from the long separator 30, for example, the long separator 30 is conveyed in one direction F and from the end of the back contact film 10 of the present invention in the one direction F side.
  • the long separator 30 is warped to the side opposite to the side of the back contact film 10 of the present invention so as to be peeled, thereby peeling the back contact film 10 of the present invention from the end portion.
  • the back contact film 10 of the present invention shown in FIG. 1 is arranged so that the rounded portions 10a and 10c are end portions in one direction F, and when peeling from the long separator 30, the one direction F is the traveling direction. Then, it is conveyed by the long separator 30.
  • the back contact film 10 of the present invention has a size that is slightly larger than the work so as to correspond to a substrate or the like on which a semiconductor chip as a work to be bonded is rearranged.
  • Planar projection area of the back contact film of the present invention is 22500Mm 2 or more, preferably 23225Mm 2 or more, more preferably 32400Mm 2 or more.
  • the planar projection area is 22,500 mm 2 or more, it can accommodate a relatively large substrate.
  • the conventional back contact film has a plane projected area of 22,500 mm 2 or more, wrinkles are particularly likely to occur during peeling.
  • the back contact film of the present invention generates wrinkles when peeled even if the plane projection area is 2500 mm 2 or more. Can be difficult.
  • the planar projected area is, for example, 400000 mm 2 or less, preferably 360000 mm 2 or less.
  • the said plane projection area is an area of the back contact
  • the radius of curvature R1 of the rounded portion X is 0.5 to 10 mm, preferably 0.55 to 9.5 mm, more preferably 0.6 to 9.0 mm.
  • the curvature radius R1 is 0.5 mm or more, it is possible to make it difficult to generate wrinkles during peeling even if the planar projection area is relatively large. Further, when the radius of curvature R1 is 10 mm or less, the discarded portion after use can be minimized.
  • the back contact film of the present invention has a plurality of rounded portions, at least one rounded portion may be the rounded portion X, and the radius of curvature of the rounded portion in the case of having another rounded portion is the curvature radius R1. It may be out of range.
  • the planar projection shape of the back contact film of the present invention is a shape in which at least one corner of a quadrangle is processed into a rounded portion
  • the planar projection shape has a ratio of a short side to a long side [long side / short side. ] Is preferably a shape in which at least one corner of a square of 1 to 10 (particularly a rectangle or a square) is processed into the rounded portion.
  • the ratio is preferably 1 to 6, more preferably 1 to 3. When the ratio is within the above range, wrinkles during peeling from the separator are less likely to occur.
  • the back contact film of the present invention includes at least an adhesive layer having a surface attached to the back surface of the work.
  • the adhesive layer may have thermosetting properties so that the adhesive layer can be adhered and protected to the back surface of the workpiece by thermosetting after being adhered to the back surface of the workpiece.
  • the adhesive layer is non-thermosetting and does not have thermosetting properties, the adhesive layer is protected by adhering to the back surface of the workpiece by adhesion (wetability) or chemical bonding at the interface due to pressure sensitivity or the like. It is possible.
  • the adhesive layer may have a single layer structure or a multilayer structure.
  • the adhesive layer and the adhesive composition (resin composition) for forming the adhesive layer preferably contain a thermoplastic resin.
  • the adhesive composition that forms the adhesive layer and the adhesive layer may contain a thermosetting resin and a thermoplastic resin, or may react with the curing agent. And a thermoplastic resin having a thermosetting functional group capable of forming a bond.
  • the resin composition does not need to include a thermosetting resin (such as an epoxy resin).
  • the thermoplastic resin in the adhesive layer has a binder function, for example.
  • the thermoplastic resin include acrylic resin, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin.
  • the said thermoplastic resin may use only 1 type, and may use 2 or more types.
  • an acrylic resin is preferable from a viewpoint that there are few ionic impurities and heat resistance is high.
  • the acrylic resin is a polymer containing a structural unit derived from an acrylic monomer (a monomer component having a (meth) acryloyl group in the molecule) as a structural unit of the polymer. It is preferable that the acrylic resin is a polymer containing the largest amount of structural units derived from (meth) acrylic acid esters by mass ratio. In addition, an acrylic resin may use only 1 type and may use 2 or more types. Moreover, in this specification, "(meth) acryl” represents “acryl” and / or "methacryl” (any one or both of "acryl” and “methacryl”), and others are the same. .
  • Examples of the (meth) acrylic acid ester include a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group.
  • Examples of the hydrocarbon group-containing (meth) acrylic acid ester include (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, and (meth) acrylic acid aryl ester.
  • Examples of the (meth) acrylic acid alkyl ester include (meth) acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, Isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester (lauryl ester), tridecyl ester, tetradecyl ester , Hexadecyl ester, octadecyl ester, eicosyl ester and the like.
  • Examples of the (meth) acrylic acid cycloalkyl ester include cyclopentyl ester and cyclohexyl ester of (meth) acrylic acid.
  • Examples of the (meth) acrylic acid aryl ester include phenyl ester and benzyl ester of (meth) acrylic acid.
  • Examples of the hydrocarbon group-containing (meth) acrylic acid ester having an alkoxy group include those obtained by substituting one or more hydrogen atoms in the hydrocarbon group in the hydrocarbon group-containing (meth) acrylic acid ester with an alkoxy group, Examples thereof include 2-methoxymethyl ester, 2-methoxyethyl ester, 2-methoxybutyl ester of (meth) acrylic acid.
  • the hydrocarbon group-containing (meth) acrylic acid ester that may have an alkoxy group may be used alone or in combination of two or more.
  • the acrylic resin is derived from other monomer components copolymerizable with a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group for the purpose of modifying cohesive force, heat resistance, etc. Units may be included.
  • the other monomer components include, for example, carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphate group-containing monomers, acrylamide, acrylonitrile, and other functional groups. And monomers.
  • carboxy group-containing monomer examples include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
  • acid anhydride monomer examples include maleic anhydride and itaconic anhydride.
  • Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, Examples thereof include 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl (meth) acrylate, and the like.
  • Examples of the glycidyl group-containing monomer include glycidyl (meth) acrylate, methyl glycidyl (meth) acrylate, and the like.
  • Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) ) Acrylyloxynaphthalene sulfonic acid and the like.
  • Examples of the phosphate group-containing monomer include 2-hydroxyethylacryloyl phosphate. Only one kind of the other monomer components may be used, or two or more kinds may be used.
  • the acrylic resin that can be contained in the adhesive layer is appropriately selected from butyl acrylate, ethyl acrylate, acrylonitrile, and acrylic acid from the viewpoint that the adhesive layer achieves both adhesion to the workpiece and good cleaving during dicing.
  • a copolymer of the selected monomers is preferred.
  • thermosetting resin examples include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, and a thermosetting resin.
  • a polyimide resin etc. are mentioned. Only 1 type may be used for the said thermosetting resin, and 2 or more types may be used for it.
  • An epoxy resin is preferable as the thermosetting resin because it tends to have a low content of ionic impurities or the like that can cause corrosion of the semiconductor chip.
  • a phenol resin is preferable.
  • epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, and biphenyl type.
  • a polyfunctional epoxy resin is mentioned.
  • the said epoxy resin may use only 1 type, and may use 2 or more types.
  • phenolic novolac type epoxy resins are highly reactive with phenol resins as curing agents and have excellent heat resistance.
  • a roll ethane type epoxy resin is preferred.
  • examples of the phenol resin include resol type phenol resins and polyoxystyrenes such as polyparaoxystyrene. Only 1 type may be used for the said phenol resin, and 2 or more types may be used for it.
  • the phenol resin preferably has a hydroxyl group in the phenol resin per equivalent of the epoxy group in the epoxy resin component. 5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.
  • the content ratio of the thermosetting resin is 5 to 60% by mass with respect to the total mass of the adhesive layer from the viewpoint of appropriately curing the adhesive layer. Preferably, it is 10 to 50% by mass.
  • thermosetting functional group-containing acrylic resin can be used as the thermoplastic resin.
  • the acrylic resin in this thermosetting functional group-containing acrylic resin preferably contains the structural unit derived from the hydrocarbon group-containing (meth) acrylic ester as the structural unit having the largest mass ratio.
  • hydrocarbon group-containing (meth) acrylate ester include those exemplified as a hydrocarbon group-containing (meth) acrylate ester that forms an acrylic resin as a thermoplastic resin that can be included in the above-described adhesive layer. Is mentioned.
  • thermosetting functional group in the thermosetting functional group-containing acrylic resin examples include a glycidyl group, a carboxy group, a hydroxy group, and an isocyanate group.
  • a glycidyl group and a carboxy group are preferable. That is, as the thermosetting functional group-containing acrylic resin, a glycidyl group-containing acrylic resin and a carboxy group-containing acrylic resin are particularly preferable.
  • the curing agent include a crosslinking agent that can be included in a radiation-curable pressure-sensitive adhesive for forming a pressure-sensitive adhesive layer described below. Things.
  • the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a polyphenol compound as the curing agent, and for example, the above-described various phenol resins can be used.
  • the adhesive layer contains a thermosetting catalyst (thermosetting accelerator).
  • thermosetting catalyst thermosetting accelerator
  • the curing reaction of the resin component can be sufficiently advanced in curing the adhesive layer, and the curing reaction rate can be increased.
  • thermosetting catalyst include imidazole compounds, triphenylphosphine compounds, amine compounds, and trihalogen borane compounds.
  • imidazole compound examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl- 4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazo Lithium trimellitate, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ')]-Ethyl-s-triazine, 2,4-diamidine
  • triphenylphosphine compounds include triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, diphenyltolylphosphine, tetraphenylphosphonium bromide, methyltriphenylphosphonium, methyltriphenyl. Examples thereof include phosphonium chloride, methoxymethyltriphenylphosphonium, and benzyltriphenylphosphonium chloride.
  • the triphenylphosphine compound includes a compound having both a triphenylphosphine structure and a triphenylborane structure.
  • thermosetting catalyst examples include tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetra-p-triborate, benzyltriphenylphosphonium tetraphenylborate, triphenylphosphine triphenylborane, and the like.
  • amine compound examples include monoethanolamine trifluoroborate and dicyandiamide.
  • trihalogen borane compound examples include trichloroborane.
  • the said thermosetting catalyst may contain only 1 type and may contain 2 or more types.
  • the adhesive layer may contain a filler.
  • the filler By including the filler, it is easy to adjust the physical properties such as the elastic modulus, yield strength, and elongation at break of the adhesive layer.
  • the filler include inorganic fillers and organic fillers.
  • As a constituent material of the inorganic filler for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, nitriding Examples thereof include silicon, boron nitride, crystalline silica, and amorphous silica.
  • Examples of the constituent material of the inorganic filler include simple metals such as aluminum, gold, silver, copper, and nickel, alloys, amorphous carbon, and graphite.
  • Examples of the constituent material of the organic filler include polymethyl methacrylate (PMMA), polyimide, polyamide imide, polyether ether ketone, polyether imide, and polyester imide.
  • PMMA polymethyl methacrylate
  • the said filler may contain only 1 type and may contain 2 or more types.
  • the filler may have various shapes such as a spherical shape, a needle shape, and a flake shape.
  • the average particle size of the filler is preferably 30 to 500 nm, more preferably 40 to 400 nm, and more preferably 50 to 300 nm. That is, the adhesive layer preferably contains a nanofiller. When a nanofiller having such a particle size is contained as the filler, the rear adhesive film to be fragmented is more excellent in cleaving properties.
  • the average particle size of the filler can be determined using, for example, a photometric particle size distribution meter (trade name “LA-910”, manufactured by Horiba, Ltd.).
  • 10 mass% or more is preferable, as for the content rate of the said filler in case an adhesive bond layer contains a filler, More preferably, it is 15 mass% or more, More preferably, it is 20 mass% or more.
  • the content is preferably 50% by mass or less, more preferably 47% by mass or less, and more preferably 45% by mass or less.
  • the adhesive layer may contain a colorant.
  • a coloring agent in an adhesive bond layer what was illustrated as a coloring agent which the below-mentioned laser mark layer can contain is mentioned, for example.
  • the colorant is black-based coloring. It is preferable that it is an agent. Only 1 type may be used for the said coloring agent, and 2 or more types may be used for it.
  • the content ratio of the colorant in the adhesive layer is preferably 0.5% by mass or more, more preferably 1% by mass or more, and further preferably. Is 2% by mass or more. The content is preferably 10% by mass or less, more preferably 8% by mass or less, and still more preferably 5% by mass or less.
  • the adhesive layer may contain other components as necessary.
  • a flame retardant such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, composite metal hydroxide, phosphazene compounds, antimony trioxide, pentoxide
  • examples thereof include antimony oxide and brominated epoxy resin.
  • silane coupling agent examples include ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, and the like.
  • ion trapping agent examples include hydrotalcites, bismuth hydroxide, hydrous antimony (for example, “IXE-300” manufactured by Toa Gosei Co., Ltd.), zirconium phosphate having a specific structure (for example, manufactured by Toa Gosei Co., Ltd.).
  • a compound capable of forming a complex with a metal ion can also be used as an ion trapping agent.
  • examples of such compounds include triazole compounds, tetrazole compounds, and bipyridyl compounds. Among these, a triazole compound is preferable from the viewpoint of the stability of a complex formed with a metal ion.
  • triazole compounds examples include 1,2,3-benzotriazole, 1- ⁇ N, N-bis (2-ethylhexyl) aminomethyl ⁇ benzotriazole, carboxybenzotriazole, 2- (2-hydroxy- 5-methylphenyl) benzotriazole, 2- (2-hydroxy-3,5-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3-tert-butyl-5-methylphenyl) ) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-t-amylphenyl) benzotriazole, 2- (2-hydroxy-5-t-octylphenyl) benzotriazole, 6- (2 -Benzotriazolyl) -4-t-octyl-6'-t-butyl-4'-methyl-2,2'-methylenebi Phenol, 1- (2 ′, 3′-hydroxypropyl) benzotriazole, 1- (1,
  • a predetermined hydroxyl group-containing compound such as a quinol compound, a hydroxyanthraquinone compound, or a polyphenol compound can also be used as an ion trapping agent.
  • a hydroxyl group-containing compound include 1,2-benzenediol, alizarin, anthralphine, tannin, gallic acid, methyl gallate, and pyrogallol.
  • the other components only one kind may be used, or two or more kinds may be used.
  • the tensile storage modulus (before curing) of the adhesive layer at 23 ° C. is not particularly limited, but is preferably 0.5 GPa or more, more preferably 0.75 GPa or more, and further preferably 1 GPa or more. If the tensile storage elastic modulus is 0.5 GPa or more, it can be prevented from adhering to the transport carrier tape.
  • the upper limit of the tensile storage modulus at 23 ° C. is, for example, 50 GPa.
  • the tensile storage elastic modulus can be adjusted by the type and content of the resin component, the type and content of the filler, and the like.
  • the thickness of the adhesive layer is, for example, 2 to 200 ⁇ m, preferably 4 to 160 ⁇ m, more preferably 6 to 100 ⁇ m, and further preferably 10 to 80 ⁇ m.
  • the back contact film of the present invention may have a single-layer structure composed of the above-mentioned adhesive layer or a multilayer structure.
  • the back contact film of the present invention having a multilayer structure has a laminated structure including, for example, the above-mentioned adhesive layer and a laser mark layer capable of providing engraving information by laser marking.
  • the back contact film having such a multilayer structure has a laminated structure in which the adhesive layer is thermally cured by heat treatment at 120 ° C. for 2 hours, while the laser mark layer is not substantially thermally cured. be able to.
  • the layer that is not substantially thermoset by heat treatment at 120 ° C. for 2 hours includes a thermosetting layer that has already been cured.
  • FIG. 2 shows an embodiment in which the back contact film of the present invention has a multilayer structure including an adhesive layer and a laser marking layer.
  • 2 corresponds to a front sectional view of the back contact film of the present invention shown in FIG.
  • a plurality of back contact films 10 are arranged in one direction F on the long separator 30.
  • the back contact film 10 has a multilayer structure including an adhesive layer 11 and a laser mark layer 12, and the laser mark layer 12 is in close contact with the long separator 30 in a peelable manner.
  • the adhesive layer 11 and the laser mark layer 12 may have an opposite positional relationship (that is, an aspect in which the adhesive layer 11 is in close contact with the long separator 30 in a peelable manner).
  • the back contact film 10 can be attached to the work back surface and thermally cured for use.
  • the positional relationship between the adhesive layer 11 and the laser mark layer 12 is opposite to that shown in FIG. 2, it can be preferably used for producing a dicing tape-integrated back contact film described later.
  • the surface of the back contact film 10 shown in FIG. 1 is the adhesive layer 11, the surface may be the laser mark layer 12 in the same manner.
  • the back contact film of the present invention has a multilayer structure having an adhesive layer and a laser mark layer
  • laser marking is performed on the surface of the laser mark layer in the manufacturing process of the semiconductor device.
  • the laser mark layer is preferably located on the dicing tape side in the back contact film and is in close contact with the dicing tape and the pressure-sensitive adhesive layer.
  • the laser mark layer is preferably a thermosetting layer (thermoset layer) obtained by thermosetting the thermosetting component.
  • the laser mark layer is formed by curing a thermosetting resin composition layer formed from the resin composition forming the laser mark layer.
  • the laser mark layer and the resin composition for forming the laser mark layer preferably contain a thermoplastic resin.
  • the resin composition for forming the laser mark layer or the laser mark layer includes a thermosetting resin and a thermoplastic resin. Or a thermoplastic resin having a thermosetting functional group that can react with a curing agent to form a bond.
  • the thermoplastic resin has a binder function in, for example, a laser mark layer, and examples of the thermoplastic resin include those exemplified as the thermoplastic resin that can be included in the adhesive layer.
  • the said thermoplastic resin may use only 1 type, and may use 2 or more types.
  • an acrylic resin is preferable from a viewpoint that there are few ionic impurities and heat resistance is high.
  • Acrylic resin that can be included in the laser mark layer and the resin composition is butyl acrylate, ethyl acrylate, acrylonitrile, from the viewpoint of achieving both the visibility of the marking information by laser marking and the good cleaving property during dicing, A copolymer of monomers appropriately selected from acrylic acid is preferable.
  • thermosetting resin When the thermosetting resin is included together with the thermoplastic resin, examples of the thermosetting resin include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, and a thermosetting polyimide resin. It is done. Only 1 type may be used for the said thermosetting resin, and 2 or more types may be used for it.
  • An epoxy resin is preferable as the thermosetting resin because it tends to have a low content of ionic impurities or the like that can cause corrosion of the semiconductor chip. Moreover, as a hardening
  • Examples of the epoxy resin include those exemplified as the epoxy resin that can be included in the adhesive layer.
  • the said epoxy resin may use only 1 type, and may use 2 or more types.
  • Examples of the phenol resin that can act as a curing agent for the epoxy resin include those exemplified as the phenol resin that can be included in the above-described adhesive layer. Only 1 type may be used for the said phenol resin, and 2 or more types may be used for it.
  • the phenol resin is a hydroxyl group in the phenol resin per equivalent of epoxy groups in the epoxy resin component. Is preferably contained in an amount of 0.5 to 2.0 equivalents, more preferably 0.8 to 1.2 equivalents.
  • the content of the thermosetting resin is preferably 5 to 60% by mass with respect to the total mass of the laser mark layer and the resin composition, More preferably, it is 10 to 50% by mass.
  • thermosetting functional group-containing acrylic resin that can be included in the adhesive layer. Things.
  • a curing agent is included together with the thermosetting functional group-containing acrylic resin, and examples of the curing agent include those exemplified as a crosslinking agent that can be included in a radiation-curable adhesive for forming an adhesive layer described later. Is mentioned.
  • thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group
  • the laser mark layer and the resin composition preferably contain a thermosetting catalyst (thermosetting accelerator).
  • a thermosetting catalyst thermosetting accelerator
  • the curing reaction of the resin component can be sufficiently advanced or the curing reaction rate can be increased in curing the resin composition.
  • thermosetting catalyst what was illustrated as a thermosetting catalyst which the above-mentioned adhesive bond layer can contain is mentioned.
  • the said thermosetting catalyst may contain only 1 type and may contain 2 or more types.
  • the laser mark layer and the resin composition may contain a filler.
  • a filler By including a filler, it is easy to adjust physical properties such as the elastic modulus, yield point strength, and elongation at break of the laser mark layer.
  • a filler what was illustrated as a filler which the above-mentioned adhesive bond layer can contain is mentioned.
  • the said filler may contain only 1 type and may contain 2 or more types.
  • the filler may have various shapes such as a spherical shape, a needle shape, and a flake shape.
  • the average particle size of the filler is preferably 30 to 500 nm, more preferably 40 to 400 nm, and more preferably 50 to 300 nm. That is, the laser mark layer and the resin composition preferably contain a nanofiller. When the nanofiller having such a particle size is contained as the filler, the rear adhesive film to be fragmented is more excellent in the splitting property and cleaving property. Further, when the laser mark layer or the resin composition contains a filler, the content of the filler is preferably 10% by mass or more, more preferably 15% by mass or more, and more preferably 20% by mass or more. The content is preferably 50% by mass or less, more preferably 47% by mass or less, and more preferably 45% by mass or less.
  • the laser mark layer and the resin composition may contain a colorant.
  • a colorant When a colorant is contained, excellent marking properties and appearance properties can be exhibited, and various types of information such as character information and graphic information can be imparted by laser marking. Further, by appropriately selecting the color of the colorant, information (character information, graphic information, etc.) given by marking can be made excellent visibility. Furthermore, it becomes possible to color-code according to a product by selection of a coloring agent.
  • the colorant may be a pigment or a dye.
  • the colorant include black colorants, cyan colorants, magenta colorants, yellow colorants, and the like. From the viewpoint of imprinting information on the laser mark layer by laser marking and improving the visibility of the information, a black colorant is preferable.
  • the said coloring agent may contain only 1 type, and may contain 2 or more types.
  • black colorants include azo pigments such as carbon black, carbon nanotubes, graphite (graphite), copper oxide, manganese dioxide, azomethine azo black, aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite. , Magnetite, chromium oxide, iron oxide, molybdenum disulfide, composite oxide black pigment, anthraquinone organic black dye, azo organic black dye, and the like.
  • carbon black include furnace black, channel black, acetylene black, thermal black, and lamp black.
  • black colorants include C.I. I. Solvent Black 3, 7, 22, 27, 29, 34, 43, 70; C.I. I.
  • cyan colorants examples include C.I. I. Solvent Blue 25, 36, 60, 70, 93, 95; I. Acid Blue 6, 45: C.I. I. Pigment Blue 1, 2, 3, 15, 15: 1, 15: 2, 15: 3, 15: 3, 15: 4, 15: 5, 15: 6, 16, 16, 17 17: 1, 18, 22, 25, 56, 60, 63, 65, 66; I. Bat Blue 4; 60, C.I. I. And CI Pigment Green 7.
  • magenta colorants examples include C.I. I. Solvent Red 1, 3, 8, 23, 24, 25, 27, 30, 30, 49, 52, 58, 63, 81, 82, 83, 84, the same 100, 109, 111, 121, 122; I. Disper thread 9; I. Solvent Violet 8, 13, 13, 21, and 27; C.I. I. Disperse violet 1; C.I. I. Basic Red 1, 2, 9, 9, 13, 14, 15, 17, 17, 18, 22, 23, 24, 27, 29, 32, 34, the same 35, 36, 37, 38, 39, 40; I. Basic Violet 1, 3, 7, 10, 14, 15, 21, 25, 26, 27, 28, and the like. Examples of magenta colorants include C.I. I.
  • yellow colorants examples include C.I. I. Solvent Yellow 19, 44, 77, 79, 81, 82, 93, 98, 103, 104, 112, 162; C.I. I. Pigment Orange 31 and 43; C.I. I.
  • the content ratio of the colorant is, for example, 0.5% by mass with respect to the total mass of the laser mark layer or the resin composition from the viewpoint of realizing high visibility of information stamped on the laser mark layer by laser marking. As mentioned above, Preferably it is 1 mass% or more, More preferably, it is 2 mass% or more.
  • the said content rate is 10 mass% or less, for example, Preferably it is 8 mass% or less, More preferably, it is 5 mass% or less.
  • the laser mark layer and the resin composition may contain other components as necessary.
  • the other components include flame retardants, silane coupling agents, ion trap agents, and the like exemplified as other components that can be included in the above-described adhesive layer.
  • the other components only one kind may be used, or two or more kinds may be used.
  • the tensile storage modulus (after curing) of the laser mark layer at 23 ° C. is not particularly limited, but is preferably 0.5 GPa or more, more preferably 0.75 GPa or more, and further preferably 1 GPa or more. If the tensile storage elastic modulus is 0.5 GPa or more, it can be prevented from adhering to the transport carrier tape. In addition, the back surface of the work can be more securely protected after thermosetting.
  • the upper limit of the tensile storage modulus at 23 ° C. is, for example, 50 GPa.
  • the tensile storage elastic modulus can be adjusted by the type and content of the resin component, the type and content of the filler, and the like.
  • the ratio of the thickness of the laser mark layer to the thickness of the adhesive layer is preferably 1 or more, more preferably 1. 5 or more, more preferably 2 or more.
  • the ratio is, for example, 8 or less.
  • the thickness of the laser mark layer is, for example, 2 to 180 ⁇ m, preferably 4 to 160 ⁇ m.
  • the thickness of the back contact film of the present invention is, for example, 2 to 200 ⁇ m, preferably 4 to 160 ⁇ m, more preferably 6 to 100 ⁇ m, and further preferably 10 to 80 ⁇ m.
  • the thickness is 2 ⁇ m or more, the back surface of the workpiece can be more securely protected.
  • the thickness is 200 ⁇ m or less, the work after back contact can be made thinner.
  • the peeling force (peeling angle 180 °, peeling rate 300 mm / min) of the back adhesive film of the present invention with respect to the release treatment surface of the separator is not particularly limited, but is preferably 0.4 N / 100 mm or less, more preferably. 0.35 N / 100 mm or less, more preferably 0.3 N / 100 mm or less.
  • the peeling force is 0.4 N / 100 mm or less, the back contact film of the present invention can be peeled from the separator more easily.
  • the said peeling force is so preferable that it is small, it is 0.01 N / 100mm or more, for example.
  • the back contact film of the present invention includes a dicing tape having a laminated structure including a base material and a pressure-sensitive adhesive layer, and the back contact film of the present invention which is peelably adhered to the pressure-sensitive adhesive layer in the dicing tape.
  • it may be used as a dicing tape integrated semiconductor back contact film (sometimes referred to as a “dicing tape integrated back contact film”).
  • the dicing tape-integrated back contact film may be referred to as “the dicing tape-integrated back contact film of the present invention”.
  • the dicing tape in the dicing tape-integrated back contact film preferably has a larger plane projection area than the back contact film of the present invention.
  • a frame for dicing can be attached to the surface of the pressure-sensitive adhesive layer during dicing.
  • the dicing tape has a rounded portion in the planar projection shape. In this case, the dicing tape-integrated back contact film of the present invention can be more easily peeled from the separator.
  • the radius of curvature R2 of the rounded portion is not particularly limited, but is preferably 0.5 to 50 mm, more preferably 0.7 to 40 mm, and still more preferably 0.8. 9 to 30 mm.
  • the curvature radius R2 is 0.5 mm or more, wrinkles are unlikely to occur during peeling even if the planar projection area is relatively large. Further, when the radius of curvature R2 is 50 mm or less, a discarded portion after use can be minimized.
  • the ratio [R2 / R1] of the curvature radius R2 and the curvature radius R1 is preferably 0.5 to 100, more preferably 0.8 to 50, and still more preferably 1 to 30. If the ratio is within the above range, the frame can be fixed without causing waste in the dicing tape, and even if there is a difference in the area of the dicing tape and the back contact film, the back contact film and the dicing tape are bonded together. It is difficult for wrinkles to enter the film, and it is difficult for wrinkles to occur during the bonding process between the dicing tape and the substrate or frame. Moreover, it is excellent in workability.
  • planar projection shape having the rounded portion of the dicing tape and the back contact film of the present invention is a shape in which at least one corner is rounded, before the at least one corner is rounded
  • This planar projection shape may be referred to as a “planar projection shape with no rounded portion”.
  • the planar projection shape in which the round part in the dicing tape is not formed is similar to the planar projection form in which the round part is not formed in the back contact film of the present invention. In this case, wrinkles during peeling from the separator are less likely to occur. Further, the discarded portion of the dicing tape after use can be minimized.
  • the planar projected shape in which the rounded portion is not formed is, for example, a polygon.
  • the similarity ratio [the former / the latter] in the similar shape is not particularly limited, but is preferably 1.01 or more, more preferably 1.03 or more. More preferably, it is 1.05 or more.
  • the dicing frame can be attached to the pressure-sensitive adhesive layer of the dicing tape and used as it is for dicing.
  • the similarity ratio is, for example, 2.0 or less, preferably 1.8 or less.
  • planar projection shape of the dicing tape has a rounded portion, and the planar projection shape with the rounded portion not formed is a similar shape, the rounded portion and the rounded portion X in the dicing tape are in a similar shape with the rounded portion not formed.
  • the corresponding corner is preferred.
  • the peeling force (peeling angle 180 °, peeling speed 300 mm / min, after curing) of the back adhesive film of the present invention is not particularly limited, but is 10 N / 20 mm or less. Preferably, it is 5 N / 20 mm or less. When the peeling force is 10 N / 20 mm or less, the chip can be easily picked up from the dicing tape at the time of picking up.
  • the peeling force is preferably 0.02 N / 20 mm or more, and more preferably 0.05 N / 20 mm or more. When the peeling force is 0.02 N / 20 mm or more, the back adhesive film after curing is difficult to peel from the dicing tape during dicing.
  • FIG. 3 is a top view (plan view) showing an embodiment of the dicing tape-integrated back contact film of the present invention.
  • FIG. 4 is a top view (plan view) of the dicing tape-integrated back contact film of the present invention shown in FIG. 3 as viewed from the back contact film side.
  • FIG. 5 is a front sectional view of the dicing tape-integrated back contact film 1 of the present invention shown in FIG. As shown in FIG. 3, a plurality of dicing tape-integrated back contact films 1 are arranged on a long separator 30 in one direction F. As shown in FIG.
  • the planar projection shape of the back contact film 10 in the dicing tape-integrated back contact film 1 is 10 a in which all corners of a square that is a flat projection shape with no rounded portion are rounded portions X, The shapes are processed into 10b, 10c, and 10d.
  • the planar projection shape of the dicing tape 20 in the dicing tape-integrated back contact film 1 is such that all corners of the square, which is a planar projection shape in which the rounded portion is not formed, are rounded portions 20a, 20b, 20c, and 20d. It is a processed shape.
  • the back contact film 10 and the dicing tape 20 have a similar shape in a planar projection shape in which a round portion is not formed.
  • the long separator 30 is conveyed in one direction F, and the dicing tape-integrated back contact film 1 of the present invention is used.
  • the long separator 30 is warped to the opposite side of the dicing tape-integrated back contact film 1 of the present invention so as to be peeled off from the end of the one-direction F side.
  • the integrated back contact film 1 is peeled off.
  • the base material in the dicing tape is an element that functions as a support in the dicing tape or the dicing tape-integrated back contact film.
  • a base material a plastic base material (especially plastic film) is mentioned, for example.
  • the base material may be a single layer or a laminate of the same or different base materials.
  • Examples of the resin constituting the plastic substrate include low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, and homopolypropylene.
  • Polybutene polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene- Polyolefin resins such as butene copolymer and ethylene-hexene copolymer; polyurethane; polyester such as polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT); polycarbonate; polyimide; Riete ether ketone; polyetherimides; aramid, polyamide such as wholly aromatic polyamide; polyphenyl sulfide; fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, and the like.
  • EVA ethylene-vinyl acetate copolymer
  • EVA ethylene-vinyl acetate copolymer
  • the base material preferably contains an ethylene-vinyl acetate copolymer or polyvinyl chloride as a main component.
  • the main component of the substrate is a component that occupies the largest mass ratio among the constituent components.
  • the said resin may use only 1 type and may use 2 or more types.
  • the substrate preferably has radiation transparency.
  • the plastic film When the substrate is a plastic film, the plastic film may be non-oriented or may be oriented in at least one direction (uniaxial direction, biaxial direction, etc.). When oriented in at least one direction, the plastic film can be thermally contracted in at least one direction. If it has heat shrinkability, even if wrinkles are generated when the substrates or frames are bonded together, the wrinkles can be reduced by heat shrinking in subsequent heat treatment.
  • the base material In order for the base material and the dicing tape to have isotropic heat shrinkability, the base material is preferably a biaxially oriented film.
  • the plastic film oriented in at least one direction can be obtained by stretching an unstretched plastic film in at least one direction (uniaxial stretching, biaxial stretching, etc.).
  • the base material and the dicing tape preferably have a heat shrinkage rate of 1 to 30%, more preferably 2 to 25%, and more preferably 2 to 25% in a heat treatment test performed at a heating temperature of 100 ° C. and a heating time treatment of 60 seconds. It is preferably 3 to 20%, particularly preferably 5 to 20%.
  • the heat shrinkage rate is preferably a heat shrinkage rate in at least one direction of the MD direction and the TD direction. The heat shrinkage rate is calculated by cutting a strip-shaped test piece having a length of 150 mm in the MD direction and a width of 25 mm from a dicing tape, and placing two marked lines at intervals of 100 mm in the test piece.
  • the distance between the previous marked lines is measured, and then, using a known tensile tester, the test piece is suspended from a cage, the test piece is heated at 100 ° C. for 60 seconds with a dryer, cooled, and An interval (distance between marked lines after heating) can be measured and determined as a distance (%) between marked lines after heating with respect to the distance between marked lines before heating.
  • the surface of the adhesive layer side of the substrate is used for the purpose of improving the adhesion and retention with the adhesive layer, for example, corona discharge treatment, plasma treatment, sand mat processing treatment, ozone exposure treatment, flame exposure treatment, high piezoelectric impact.
  • Physical treatment such as exposure treatment and ionizing radiation treatment; chemical treatment such as chromic acid treatment; surface treatment such as easy adhesion treatment with a coating agent (primer) may be applied.
  • a coating agent primer
  • the surface treatment for improving the adhesion is preferably performed on the entire surface of the base material on the pressure-sensitive adhesive layer side.
  • the thickness of the base material is preferably 40 ⁇ m or more, more preferably 50 ⁇ m or more, and still more preferably from the viewpoint of ensuring strength for the base material to function as a support in the dicing tape and dicing tape-integrated back contact film. Is 55 ⁇ m or more, particularly preferably 60 ⁇ m or more.
  • the thickness of the substrate is preferably 200 ⁇ m or less, more preferably 180 ⁇ m or less, and even more preferably 150 ⁇ m or less. is there.
  • the pressure-sensitive adhesive layer in the dicing tape is a pressure-sensitive adhesive layer (adhesive layer capable of reducing the pressure-sensitive adhesive force) that can intentionally reduce the pressure-sensitive adhesive force by an external action in the process of using the dicing tape-integrated back contact film. It may be a pressure-sensitive adhesive layer (non-adhesive pressure-reducing pressure-sensitive adhesive layer) in which the adhesive force is reduced little or not depending on the external action in the process of using the dicing tape-integrated back contact film, A dicing tape-integrated back contact film can be appropriately selected according to the method, conditions, and the like of the work to be singulated.
  • the pressure-sensitive adhesive layer may have a single layer structure or a multilayer structure.
  • the adhesive layer is a pressure-sensitive adhesive layer capable of reducing the pressure-sensitive adhesive strength
  • the adhesive layer has a relatively high pressure-sensitive adhesive strength and a relatively low pressure-sensitive adhesive strength in the manufacturing process and use process of the dicing tape-integrated back contact film. It becomes possible to use properly the state showing power.
  • the adhesive layer It is possible to suppress and prevent the back adhesive film from floating from the adhesive layer by utilizing a state exhibiting a high adhesive force, while the semiconductor chip is then removed from the dicing tape of the back adhesive film integrated with the dicing tape. In the pick-up process for picking up, the pick-up can be easily performed by reducing the adhesive strength of the pressure-sensitive adhesive layer.
  • Examples of the pressure-sensitive adhesive that forms such a pressure-reducing adhesive layer include a radiation-curable pressure-sensitive adhesive and a heat-foaming pressure-sensitive adhesive.
  • As the pressure-sensitive adhesive forming the pressure-reducible pressure-sensitive adhesive layer one type of pressure-sensitive adhesive or two or more types of pressure-sensitive adhesives may be used.
  • the radiation curable pressure-sensitive adhesive for example, a pressure-sensitive adhesive that is cured by irradiation with electron beams, ultraviolet rays, ⁇ rays, ⁇ rays, ⁇ rays, or X rays can be used.
  • An adhesive ultraviolet curable adhesive
  • An adhesive can be particularly preferably used.
  • the radiation curable pressure-sensitive adhesive examples include a base polymer such as an acrylic polymer and a radiation polymerizable monomer component or oligomer component having a functional group such as a radiation polymerizable carbon-carbon double bond.
  • a base polymer such as an acrylic polymer
  • a radiation polymerizable monomer component or oligomer component having a functional group such as a radiation polymerizable carbon-carbon double bond.
  • Type radiation curable pressure sensitive adhesive are examples of the radiation curable pressure-sensitive adhesive.
  • the acrylic polymer is a polymer including a structural unit derived from an acrylic monomer (a monomer component having a (meth) acryloyl group in the molecule) as a structural unit of the polymer. It is preferable that the acrylic polymer is a polymer containing the largest amount of structural units derived from (meth) acrylic acid esters by mass ratio. In addition, an acrylic polymer may use only 1 type and may use 2 or more types.
  • Examples of the (meth) acrylic acid ester include a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group.
  • a hydrocarbon which may have an alkoxy group exemplified as a structural unit of an acrylic resin that can be included in the above-mentioned adhesive layer Examples include group-containing (meth) acrylic acid esters.
  • the hydrocarbon group-containing (meth) acrylic acid ester that may have an alkoxy group may be used alone or in combination of two or more.
  • hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group
  • 2-ethylhexyl acrylate and lauryl acrylate are preferable. All monomer components for forming an acrylic polymer in order to properly develop basic properties such as tackiness by a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group in the pressure-sensitive adhesive layer
  • the proportion of the hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group is preferably 40% by mass or more, more preferably 60% by mass or more.
  • the acrylic polymer is derived from other monomer components copolymerizable with the hydrocarbon group-containing (meth) acrylic acid ester which may have the alkoxy group for the purpose of modifying cohesive force, heat resistance, etc.
  • the structural unit to be included may be included.
  • the other monomer illustrated as a structural unit of the acrylic resin which the above-mentioned adhesive bond layer can contain is mentioned. Only one kind of the other monomer components may be used, or two or more kinds may be used.
  • All monomer components for forming an acrylic polymer in order to properly develop basic properties such as tackiness by a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group in the pressure-sensitive adhesive layer The total proportion of the other monomer components in is preferably 60% by mass or less, more preferably 40% by mass or less.
  • the acrylic polymer may contain a structural unit derived from a polyfunctional monomer copolymerizable with the monomer component forming the acrylic polymer in order to form a crosslinked structure in the polymer skeleton.
  • the polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, penta Erythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate (for example, polyglycidyl (meth) acrylate), polyester Examples include monomers having a (meth) acryloyl group and other reactive functional
  • the said polyfunctional monomer may use only 1 type, and may use 2 or more types. All monomer components for forming an acrylic polymer in order to properly develop basic properties such as tackiness by a hydrocarbon group-containing (meth) acrylic acid ester which may have an alkoxy group in the pressure-sensitive adhesive layer
  • the proportion of the polyfunctional monomer in is preferably 40% by mass or less, more preferably 30% by mass or less.
  • the acrylic polymer can be obtained by subjecting one or more monomer components including an acrylic monomer to polymerization.
  • the polymerization method include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.
  • the acrylic polymer can be obtained by polymerizing raw material monomers for forming the acrylic polymer.
  • Examples of the polymerization technique include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.
  • the mass average molecular weight of the acrylic polymer is preferably 100,000 or more, more preferably 200,000 to 3,000,000. When the mass average molecular weight is 100,000 or more, there is a tendency that the low molecular weight substance in the pressure-sensitive adhesive layer is small, and contamination to the back contact film, the semiconductor wafer, and the like can be further suppressed.
  • the pressure-sensitive adhesive layer or the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer may contain a crosslinking agent.
  • a crosslinking agent for example, when an acrylic polymer is used as the base polymer, the acrylic polymer can be cross-linked to further reduce the low molecular weight substance in the pressure-sensitive adhesive layer. In addition, the mass average molecular weight of the acrylic polymer can be increased.
  • a crosslinking agent a polyisocyanate compound, an epoxy compound, a polyol compound (polyphenol type compound etc.), an aziridine compound, a melamine compound etc. are mentioned, for example.
  • the amount used is preferably about 5 parts by mass or less, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the base polymer.
  • Examples of the radiation-polymerizable monomer component include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta ( And (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, and the like.
  • the radiation polymerizable oligomer component examples include various oligomers such as urethane, polyether, polyester, polycarbonate, and polybutadiene, and those having a molecular weight of about 100 to 30000 are preferable.
  • the content of the radiation-polymerizable monomer component and oligomer component in the radiation-curable pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is, for example, 5 to 500 parts by mass, preferably 40 to 150 parts, per 100 parts by mass of the base polymer. About mass parts.
  • the additive type radiation curable pressure-sensitive adhesive those disclosed in, for example, JP-A-60-196956 may be used.
  • the radiation curable pressure-sensitive adhesive includes an internal radiation curing containing a base polymer having a functional group such as a radiation-polymerizable carbon-carbon double bond at the polymer side chain or at the polymer main chain terminal in the polymer main chain.
  • An adhesive may also be mentioned.
  • an acrylic polymer is preferable.
  • a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer for example, a raw material monomer containing a monomer component having a first functional group was polymerized (copolymerized) to obtain an acrylic polymer. Thereafter, the second functional group capable of reacting with the first functional group and the compound having a radiation-polymerizable carbon-carbon double bond are converted into an acrylic polymer while maintaining the radiation-polymerizable property of the carbon-carbon double bond. Examples of the method include a condensation reaction or an addition reaction.
  • Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, An isocyanate group, a hydroxy group, etc. are mentioned.
  • a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of easy reaction tracking.
  • the first functional group is A combination that is a hydroxy group and the second functional group is an isocyanate group is preferable.
  • the compound having an isocyanate group and a radiation-polymerizable carbon-carbon double bond that is, a radiation-polymerizable unsaturated functional group-containing isocyanate compound include, for example, methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- Examples include ⁇ , ⁇ -dimethylbenzyl isocyanate.
  • the acrylic polymer having a hydroxy group includes a structural unit derived from the above-mentioned hydroxy group-containing monomer and an ether compound such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, etc. Is mentioned.
  • the radiation curable pressure-sensitive adhesive preferably contains a photopolymerization initiator.
  • the photopolymerization initiator include ⁇ -ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, Examples include camphor quinone, halogenated ketone, acyl phosphinoxide, and acyl phosphonate.
  • Examples of the ⁇ -ketol compound include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ ′-dimethylacetophenone, 2-methyl-2-hydroxy.
  • Examples include propiophenone and 1-hydroxycyclohexyl phenyl ketone.
  • Examples of the acetophenone compound include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2 -Morpholinopropan-1-one and the like.
  • Examples of the benzoin ether compounds include benzoin ethyl ether, benzoin isopropyl ether, anisoin methyl ether, and the like.
  • Examples of the ketal compound include benzyldimethyl ketal.
  • aromatic sulfonyl chloride compounds examples include 2-naphthalenesulfonyl chloride.
  • examples of the photoactive oxime compound include 1-phenyl-1,2-propanedione-2- (O-ethoxycarbonyl) oxime.
  • examples of the benzophenone compounds include benzophenone, benzoylbenzoic acid, 3,3′-dimethyl-4-methoxybenzophenone, and the like.
  • thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropyl.
  • examples include thioxanthone.
  • the content of the photopolymerization initiator in the radiation curable pressure-sensitive adhesive is, for example, 0.05 to 20 parts by mass with respect to 100 parts by mass of the base polymer.
  • the above-mentioned heat-foaming pressure-sensitive adhesive is a pressure-sensitive adhesive containing a component (such as a foaming agent or a thermally expandable microsphere) that foams or expands when heated.
  • a component such as a foaming agent or a thermally expandable microsphere
  • foaming agent include various inorganic foaming agents and organic foaming agents.
  • the inorganic foaming agent include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, azides and the like.
  • organic foaming agent examples include chlorofluorinated alkanes such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; Hydrazine compounds such as sulfonyl hydrazide, diphenylsulfone-3,3′-disulfonyl hydrazide, 4,4′-oxybis (benzenesulfonyl hydrazide), allyl bis (sulfonyl hydrazide); p-toluylene sulfonyl semicarbazide, 4,4′- Semicarbazide compounds such as oxybis (benzenesulfonyl semicarbazide); Triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; N, N′-dinitrosopentamethylenetetramine,
  • thermally expandable microsphere examples include a microsphere having a configuration in which a substance that is easily gasified and expanded by heating is enclosed in a shell.
  • the substance that easily gasifies and expands by heating examples include isobutane, propane, pentane, and the like.
  • Thermally expandable microspheres can be produced by encapsulating a substance that expands easily by heating into a shell-forming substance by a coacervation method or an interfacial polymerization method.
  • the shell-forming substance a substance exhibiting heat melting property or a substance that can be ruptured by the action of thermal expansion of the encapsulated substance can be used.
  • Examples of such substances include vinylidene chloride / acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like.
  • the non-reducing adhesive layer examples include a pressure-sensitive adhesive layer.
  • the pressure-sensitive pressure-sensitive adhesive layer has a form having a certain pressure-sensitive adhesive force while pre-curing the pressure-sensitive adhesive layer formed from the above-described radiation-curable pressure-sensitive adhesive layer with respect to the pressure-sensitive adhesive layer.
  • An adhesive layer is included.
  • the pressure-sensitive adhesive forming the non-reducing adhesive layer one type of pressure-sensitive adhesive may be used, or two or more types of pressure-sensitive adhesives may be used. Further, the entire pressure-sensitive adhesive layer may be a non-adhesive pressure-reducing adhesive layer, or a part thereof may be a non-reducing pressure-sensitive adhesive layer.
  • the whole pressure-sensitive adhesive layer may be a non-adhesive pressure-sensitive adhesive layer, or a specific part of the pressure-sensitive adhesive layer (for example, a dicing frame application target)
  • the area that is outside the central area) is a non-reducing adhesive layer, and the other part (for example, a semiconductor wafer divided body or a central area that is a target area of the semiconductor wafer)
  • It may be a pressure-sensitive adhesive layer capable of reducing the adhesive strength.
  • the pressure-sensitive adhesive layer has a laminated structure
  • all the pressure-sensitive adhesive layers in the laminated structure may be non-adhesive pressure-sensitive adhesive layers, or some of the pressure-sensitive adhesive layers in the laminated structure are non-adhesive. It may be a reduced pressure-sensitive adhesive layer.
  • the pressure-sensitive adhesive layer (radiation-cured radiation-curable pressure-sensitive adhesive layer) in which the pressure-sensitive adhesive layer (radiation-unirradiated radiation-curable pressure-sensitive adhesive layer) formed from the radiation-curable pressure-sensitive adhesive is previously cured by radiation irradiation is radiation. Even if the adhesive strength is reduced by irradiation, it exhibits adhesiveness due to the polymer component contained and can exhibit the minimum adhesive strength required for the adhesive layer of the dicing tape in the dicing step or the like.
  • the entire pressure-sensitive adhesive layer may be a radiation-irradiated radiation-curable pressure-sensitive adhesive layer in the surface spreading direction of the pressure-sensitive adhesive layer.
  • the “radiation curable pressure-sensitive adhesive layer” refers to a pressure-sensitive adhesive layer formed from a radiation curable pressure-sensitive adhesive.
  • the radiation non-irradiated radiation curable pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer have radiation curable properties. Both the radiation-cured radiation-curing pressure-sensitive adhesive layer after the agent layer is cured by radiation irradiation are included.
  • the pressure-sensitive adhesive layer for forming the pressure-sensitive pressure-sensitive adhesive layer a known or common pressure-sensitive pressure-sensitive adhesive can be used, and an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive based on an acrylic polymer is preferably used. Can do.
  • the pressure-sensitive adhesive layer contains an acrylic polymer as a pressure-sensitive pressure-sensitive adhesive
  • the acrylic polymer may be a polymer containing a structural unit derived from (meth) acrylic acid ester as a structural unit having the largest mass ratio. preferable.
  • the acrylic polymer demonstrated as an acrylic polymer which can be contained in the above-mentioned addition type radiation-curable adhesive can be employ
  • the pressure-sensitive adhesive layer or the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is a known or conventional pressure-sensitive adhesive layer such as a crosslinking accelerator, a tackifier, an anti-aging agent, a colorant (pigment, dye, etc.) in addition to the above-mentioned components. Additives used in may be blended. Examples of the colorant include compounds that are colored by irradiation with radiation. When a compound that is colored by irradiation is contained, only the irradiated portion can be colored. The compound colored by irradiation with radiation is colorless or light-colored before irradiation, but becomes colored by irradiation with radiation, and examples thereof include leuco dyes. The usage-amount of the compound colored by the said radiation irradiation is not specifically limited, It can select suitably.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but when the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer formed from a radiation-curable pressure-sensitive adhesive, the adhesive strength of the pressure-sensitive adhesive layer before and after the radiation curing of the pressure-sensitive adhesive layer From the viewpoint of balancing, the thickness is preferably about 1 to 50 ⁇ m, more preferably 2 to 30 ⁇ m, and still more preferably 5 to 25 ⁇ m.
  • the dicing tape-integrated back contact film of the present invention preferably has a shape corresponding to a semiconductor wafer to be processed in the manufacturing process of a semiconductor device or an aggregate of semiconductor chips obtained by dividing the semiconductor wafer.
  • Planar projection area of the dicing tape-integrated back contact film of the present invention for example 22725Mm 2 or more, more preferably 23457Mm 2 or more, more preferably 32724Mm 2 or more.
  • the planar projected area is, for example, 800,000 mm 2 or less, preferably 720000 mm 2 or less.
  • the planar projection area of the dicing tape when the planar projection area of the dicing tape is the same as or larger than the planar projection area of the back contact film of the present invention, the planar projection of the dicing tape-integrated back contact film of the present invention The area is the same as the planar projection area of the dicing tape.
  • the back contact film of the present invention and the dicing tape-integrated back contact film of the present invention may have a separator on the back contact film surface.
  • a sheet-like form having a separator may be used, as shown in FIGS.
  • the separator may be long, and a plurality of back contact films or a plurality of dicing tape integrated back contact films may be disposed thereon, and the separator may be wound to form a roll.
  • the separator is an element for covering and protecting the back contact film of the present invention (in the embodiment shown in FIGS. 1, 2, 3, and 5 the surface of the back contact film 10).
  • the film When using this dicing tape-integrated back contact film, the film is peeled off from the sheet.
  • the separator include a polyethylene terephthalate (PET) film, a polyethylene film, a polypropylene film, a plastic film whose surface is coated with a release agent such as a fluorine-type release agent and a long-chain alkyl acrylate release agent, and papers.
  • the thickness of the separator is, for example, 10 to 200 ⁇ m, preferably 15 to 150 ⁇ m, more preferably 20 to 100 ⁇ m.
  • the thickness is 10 ⁇ m or more, it is difficult to break by cutting during processing of the separator.
  • the thickness is 200 ⁇ m or less, the dicing tape-integrated back contact film is more easily peeled off from the separator at the time of bonding to the substrate and the frame.
  • the back contact film 10 which is one embodiment of the back contact film of the present invention is manufactured as follows, for example.
  • the adhesive layer 11 and the laser mark layer 12 are individually produced.
  • the adhesive layer 11 is formed by applying a resin composition (adhesive composition) for forming the adhesive layer 11 on the separator to form a resin composition layer, and then removing the solvent and curing by heating. It can be produced by solidifying the material layer.
  • the heating temperature is, for example, 90 to 150 ° C.
  • the heating time is, for example, 1 to 2 minutes. Examples of the method for applying the resin composition include roll coating, screen coating, and gravure coating.
  • the laser mark layer 12 is formed by applying a resin composition for forming the laser mark layer 12 on a separator to form a resin composition layer, and then removing the solvent and curing by heating to solidify the resin composition layer. Can be produced.
  • the heating temperature is, for example, 90 to 160 ° C.
  • the heating time is, for example, 2 to 4 minutes.
  • the adhesive layer 11 and the laser mark layer 12 The back contact film 10 having the laminated structure is prepared.
  • the dicing tape-integrated back contact film 1 which is an embodiment of the dicing tape-integrated back contact film of the present invention is manufactured, for example, as follows.
  • the dicing tape 20 of the dicing tape-integrated back contact film 1 shown in FIGS. 3 to 5 can be manufactured by providing an adhesive layer 22 on a prepared base material 21.
  • the resin base material 21 can be obtained by film formation by a known or conventional film formation method.
  • the film forming method include a calendar film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a co-extrusion method, and a dry lamination method.
  • the base material 21 is subjected to a surface treatment as necessary.
  • the composition is applied onto the substrate 21 or the separator to form a pressure-sensitive adhesive composition.
  • a physical layer is formed.
  • the method for applying the pressure-sensitive adhesive composition include roll coating, screen coating, and gravure coating.
  • the solvent is removed as necessary by heating, and a crosslinking reaction is caused as necessary.
  • the heating temperature is, for example, 80 to 150 ° C.
  • the heating time is, for example, 0.5 to 5 minutes.
  • the pressure-sensitive adhesive layer 22 When the pressure-sensitive adhesive layer 22 is formed on the separator, the pressure-sensitive adhesive layer 22 with the separator is bonded to the base material 21, and then the target planar projection shape (for example, a shape similar to the back contact film 10) is obtained. Shape) and a planar projection area, punching is performed, and then the separator is peeled off. Thereby, the dicing tape 20 which has the laminated structure of the base material 21 and the adhesive layer 22 is produced.
  • the target planar projection shape for example, a shape similar to the back contact film 10.
  • the laser mark layer 12 side of the back contact film 10 obtained above is bonded to the pressure-sensitive adhesive layer 22 side of the dicing tape 20.
  • the bonding temperature is, for example, 30 to 50 ° C.
  • the bonding pressure linear pressure
  • the pressure-sensitive adhesive layer 22 may be irradiated with radiation such as ultraviolet rays before the bonding, or after the bonding, You may irradiate radiation, such as an ultraviolet-ray, with respect to the adhesive layer 22 from the side.
  • the pressure-sensitive adhesive layer 22 is radiation-cured in the use process of the dicing tape-integrated back contact film 1). Is possible).
  • the pressure-sensitive adhesive layer 22 is of an ultraviolet curable type, the amount of ultraviolet irradiation for curing the pressure-sensitive adhesive layer 22 is, for example, 50 to 500 mJ / cm 2 .
  • the region (irradiation region R) on which the adhesive layer 22 is irradiated as a measure for reducing the adhesive strength is applied, for example, as shown in FIG. It is an area
  • the back contact film 10 shown in FIGS. 1 and 2 and the dicing tape-integrated back contact film 1 shown in FIGS. 3 to 5 can be produced.
  • a semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention. Specifically, by cutting the object including the workpiece at least, the step of pasting the workpiece back on the back adhesion film side (particularly the adhesive layer side) of the dicing tape-integrated back adhesion film of the present invention.
  • a semiconductor device can be manufactured by a manufacturing method including a step (dicing step) of obtaining a separated semiconductor chip. 6 to 9 show steps in a method for manufacturing a semiconductor device using the dicing tape-integrated back contact film 1 shown in FIGS.
  • a sealing body in which the back surface and / or the side surface of each semiconductor chip is sealed with a resin can be used.
  • the sealing body 40 held on the wafer processing tape T1 is attached to the back contact film 10 (particularly, the adhesive layer 11) of the dicing tape-integrated back contact film 1.
  • the side surface of the semiconductor chip 41 is sealed with a sealing resin 42.
  • a substrate 43 provided with bumps 44 for flip chip mounting is connected to the surface of the sealing body 40.
  • the wafer processing tape T ⁇ b> 1 is peeled off from the sealing body 40.
  • thermosetting process When the back surface adhesion film of this invention has a thermosetting adhesive bond layer, it is preferable to have the process (thermosetting process) of thermosetting the adhesive bond layer in a back contact film after the said sticking process.
  • a heat treatment for thermosetting the adhesive layer 11 is performed.
  • the heating temperature is preferably 80 to 200 ° C, more preferably 100 to 150 ° C.
  • the heating time is preferably 0.5 to 5 hours, more preferably 1 to 3 hours. Specifically, the heat treatment is performed at 120 ° C. for 2 hours, for example.
  • the adhesive force between the back contact film 10 of the dicing tape integrated back contact film 1 and the sealing body 40 is increased by the thermosetting of the adhesive layer 11, and the dicing tape integrated back contact film 1 and the back surface thereof.
  • the sealing body fixing holding force of the adhesion film 10 is increased.
  • the back adhesive film of the present invention may be baked for several hours, for example, in the range of 50 to 100 ° C., thereby improving the wettability of the adhesive layer interface. And the sealing body fixing holding force increases.
  • the semiconductor device manufacturing method includes a step of performing laser marking by irradiating the laser mark layer with a laser from the substrate side of the dicing tape (laser marking step). It is preferable to have.
  • the laser marking step is preferably performed after the thermosetting step. Specifically, in the laser marking step, for example, laser marking is performed by irradiating the laser mark layer 12 with a laser from the base 21 side of the dicing tape 20. By this laser marking process, various information such as character information and graphic information can be engraved for each semiconductor chip.
  • the laser marking step it is possible to perform laser marking efficiently and collectively on a plurality of semiconductor chips in one laser marking process.
  • the laser used in the laser marking process include a gas laser and a solid laser.
  • the gas laser include a carbon dioxide laser (CO 2 laser) and an excimer laser.
  • An example of the solid laser is an Nd: YAG laser.
  • a frame (dicing frame) 51 for pressing and fixing the dicing tape on the pressure-sensitive adhesive layer in the dicing tape-integrated back contact film is attached to hold the dicing apparatus holder 52. Then, cutting is performed by a dicing blade provided in the dicing apparatus. In FIG. 7, the cutting location is schematically represented by a thick line.
  • the sealing body 40 is divided into pieces for each semiconductor chip 41, and the back contact film 10 of the dicing tape-integrated back contact film 1 is cut into small pieces of film 10 ′. Thereby, sealing body 40 'with film 10' for chip
  • the manufacturing method of the semiconductor device may include a step of irradiating the pressure-sensitive adhesive layer with radiation (radiation irradiation step) from the base material side.
  • radiation irradiation step a step of irradiating the pressure-sensitive adhesive layer with radiation
  • the pressure-sensitive adhesive layer of the dicing tape is a layer formed of a radiation-curable pressure-sensitive adhesive
  • you may irradiate radiation, such as an ultraviolet-ray, with respect to an adhesive layer from the base material side.
  • the irradiation amount is, for example, 50 to 500 mJ / cm 2 .
  • the region where the adhesive layer is irradiated as an adhesive force reduction measure is, for example, the peripheral edge in the back contact film bonding region in the adhesive layer. This is an area excluding the part.
  • the method for manufacturing a semiconductor device preferably includes a step of picking up a sealing body with a film (pickup step).
  • the pick-up process includes, for example, a cleaning process for cleaning the sealing body 40 ′ side of the dicing tape 20 with the sealing body 40 ′ with the film 10 ′ using a cleaning liquid such as water, and a sealing body 40 with the film 10 ′.
  • the expanding step for expanding the separation distance between the two may be performed after passing through as necessary. For example, as shown in FIG. 8, a sealing body 40 ′ with a film 10 ′ is picked up from the dicing tape 20.
  • the pin of the pickup mechanism is placed on the lower side of the dicing tape 20 in the figure with respect to the sealing body 40 ′ with the film 10 ′ to be picked up.
  • the member 53 is raised and pushed up through the dicing tape 20, it is sucked and held by the suction jig 54.
  • the push-up speed of the pin member 53 is, for example, 1 to 100 mm / second, and the push-up amount of the pin member 53 is, for example, 50 to 3000 ⁇ m.
  • the semiconductor device manufacturing method preferably includes a step of flip-chip mounting the film-sealed sealing body 40 ′ (flip chip step) after the pickup step.
  • the sealing body 40 ′ with the film 10 ′ is flip-chip mounted on the mounting substrate 61.
  • the mounting substrate 61 include a lead frame, a TAB (Tape Automated Bonding) film, and a wiring substrate.
  • the semiconductor chip 41 is electrically connected to the mounting substrate 61 via the bumps 44.
  • the substrate 43 (electrode pad) that the semiconductor chip 41 has on the circuit formation surface side and the terminal portion (not shown) that the mounting substrate 61 has are electrically connected via the bumps 44.
  • the bump 44 is, for example, a solder bump.
  • a thermosetting underfill agent 63 is interposed between the chip 41 and the mounting substrate 61.
  • a semiconductor device can be manufactured using the dicing tape-integrated back contact film of the present invention.
  • Example 1 Preparation of back adhesion film> (Laser mark layer) 100 parts by mass of acrylic resin (trade name “Taisan Resin SG-P3”, mass average molecular weight 850,000, glass transition temperature Tg 12 ° C., manufactured by Nagase ChemteX Corporation) and epoxy resin E 1 (trade name “KI-”) 3000-4 ", manufactured by Toto Kasei Co., Ltd.), 20 parts by mass of epoxy resin E 2 (trade name” JER YL980 ", manufactured by Mitsubishi Chemical Corporation), phenol resin (trade name” MEH7851-SS “, Meiwa Kasei Co., Ltd.) 75 parts by mass, filler (trade name “SO-25R”, silica, average particle size 0.5 ⁇ m, manufactured by Admatex Co., Ltd.) 175 parts by mass, black dye (trade name “OIL” "BLACK BS”, manufactured by Orient Chemical Co., Ltd.) 15 parts by mass, and thermosetting catalyst Z 1 (trade name "CURESOL 2PZ
  • the resin composition is applied by using an applicator on a silicone release treatment surface of a long PET separator (thickness 50 ⁇ m) having a surface subjected to a silicone release treatment. Formed. Next, this composition layer was heated at 130 ° C. for 2 minutes to remove the solvent and thermally cure, thereby producing a laser mark layer (thermocured layer) having a thickness of 18 ⁇ m on a long PET separator.
  • Adhesive layer 100 parts by mass of acrylic resin (trade name “Taisan Resin SG-P3”, manufactured by Nagase ChemteX Corporation) and 50 parts by mass of epoxy resin E 1 (trade name “KI-3000-4”, manufactured by Toto Kasei Co., Ltd.) 20 parts by mass of epoxy resin E 2 (trade name “JER YL980”, manufactured by Mitsubishi Chemical Corporation), 75 parts by mass of phenol resin (trade name “MEH7851-SS”, manufactured by Meiwa Kasei Co., Ltd.), and filler (trade name) 175 parts by weight of “SO-25R” (manufactured by Admatechs), 15 parts by weight of black dye (trade name “OIL BLACK BS”, manufactured by Orient Chemical Co., Ltd.), and thermosetting catalyst Z 2 (trade name “ 7 parts by mass of “Cureazole 2PHZ” (manufactured by Shikoku Kasei Kogyo Co., Ltd.) is added to methyl ethyl ketone
  • the resin composition is applied by using an applicator on a silicone release treatment surface of a long PET separator (thickness 50 ⁇ m) having a surface subjected to a silicone release treatment. Formed.
  • the composition layer was heated at 130 ° C. for 2 minutes to remove the solvent, and an adhesive layer (thermosetting adhesive layer) having a thickness of 7 ⁇ m was prepared on a long PET separator.
  • the laser mark layer on the long PET separator produced as described above and the adhesive layer on the long PET separator were bonded together using a laminator. Specifically, the exposed surfaces of the laser mark layer and the adhesive layer were bonded together under the conditions of a temperature of 100 ° C. and a pressure of 0.85 MPa to prepare a film.
  • the film obtained as described above is a round portion having a radius of curvature as shown in Table 1 when the planar projection shape is a square (ratio of short side to long side [long side / short side] is 1). Punching was performed so as to obtain a planar projected area that was processed into a shape.
  • the back contact film of Example 1 was produced as described above.
  • Examples 2-4 A back contact film was produced in the same manner as in Example 1 except that the planar projection shape was a shape in which all corners of the square were processed into rounded portions having the radius of curvature shown in Table 1.
  • Example 5 The planar projection shape was the same as in Example 1 except that all the corners in the rectangle having [long side / short side] of 10 were processed into rounded portions having the curvature radii shown in Table 1. A back contact film was prepared.
  • Comparative Example 1 A back contact film was produced in the same manner as in Example 1 except that the planar projection shape was not processed into a rounded corner.
  • Example 6 ⁇ Production of dicing tape>
  • 100 parts by mass of 2-ethylhexyl acrylate, 19 parts by mass of 2-hydroxyethyl acrylate, and a polymerization initiator 100 parts by mass of 2-ethylhexyl acrylate, 19 parts by mass of 2-hydroxyethyl acrylate, and a polymerization initiator.
  • a mixture containing 0.4 parts by mass of benzoyl oxide and 80 parts by mass of toluene as a polymerization solvent was stirred at 60 ° C. for 10 hours in a nitrogen atmosphere (polymerization reaction).
  • a polymer solution containing the acrylic polymer P 1 was obtained.
  • a polyisocyanate compound (trade name “Coronate L”, manufactured by Tosoh Corporation) and 2 parts by mass of a photopolymerization initiator (100 parts by mass) are added to the polymer solution with respect to 100 parts by mass of the acrylic polymer P 2.
  • Trade name “Irgacure 369” (manufactured by BASF) and toluene were added and mixed to obtain an adhesive composition having a solid content concentration of 28 mass%.
  • the pressure-sensitive adhesive composition layer was formed by applying the pressure-sensitive adhesive composition onto the silicone release-treated surface of the PET separator (thickness 50 ⁇ m) having the surface subjected to the silicone release treatment by using an applicator. .
  • this composition layer was desolvated by heating at 120 ° C. for 2 minutes to form an adhesive layer having a thickness of 30 ⁇ m on the PET separator.
  • a polypropylene film (trade name “SC040PP1-BL”, thickness 40 ⁇ m, manufactured by Kurashiki Boseki Co., Ltd.) as a base material was bonded to the exposed surface of this pressure-sensitive adhesive layer at room temperature. The bonded body was then stored at 23 ° C. for 72 hours. A dicing tape was produced as described above.
  • a back contact film was produced in the same manner as in Example 1 except that punching was performed so that the rounded portion of the radius of curvature and the planar projected area shown in Table 2 were obtained.
  • the pressure-sensitive adhesive layer exposed in the dicing tape was bonded using a laminator.
  • Examples 7 to 9, Reference Example 1, and Comparative Examples 2 to 3 About the back contact film and the dicing tape, respectively, except that the planar projection shape is a shape processed into a rounded portion where all corners in the square have the radius of curvature shown in Table 2, A back contact film and a dicing tape integrated back contact film were prepared. In addition, about the back contact film of the comparative examples 2 and 3, and the dicing tape of Example 9 and the comparative example 2, it was set as the planar projection shape which does not have a round part. Further, the back contact film and the dicing tape in the dicing tape-integrated back contact film have a similar planar projection shape (square) with no rounded portion, and the similarity ratios are as shown in Table 2, respectively.
  • Example 10 Regarding the planar projection shape of the dicing tape, all the corners of a rectangle having a diameter 1.01 times shorter and 1.1 times longer than the flat projected shape (square) of the back portion in the back contact film.
  • a dicing tape-integrated back contact film was produced in the same manner as in Example 6 except that the shape was processed into a rounded portion having a radius of curvature shown in Table 2.
  • peeling evaluation 1 (Discarded part of back contact film) About the back contact film obtained in Examples 1 to 5 and Comparative Example 1, the back contact film including the long PET separator and the rounded portion having the radius of curvature R1 shown in Table 1 is left, and the back contact film in the peripheral portion And when the separator located on the opposite side of the long PET separator is peeled off and removed through the back contact film, the back contact film including the rounded portion is lifted or peeled off from the long PET separator. As for the presence or absence of wrinkles, the case where wrinkles entered the back contact film was rated as x, and the case where wrinkles did not enter was marked as ⁇ . The results are shown in the column of “Peeling Evaluation 1” in Table 1.
  • peeling evaluation 2 (back contact film) About having the back surface adhesion film containing the said round part provided with the elongate PET separator obtained by the said peeling evaluation 1, one side of the said back surface adhesion film was partially peeled from the elongate PET separator. At this time, the case where the back contact film was wrinkled was indicated as x, and the case where it did not enter was indicated as ⁇ . The results are shown in the column of “Peeling evaluation 2” in Table 1.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
PCT/JP2019/001134 2018-01-30 2019-01-16 半導体背面密着フィルム及びダイシングテープ一体型半導体背面密着フィルム WO2019150956A1 (ja)

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CN111656492A (zh) 2020-09-11
TWI820080B (zh) 2023-11-01

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