WO2019142570A1 - Isolant organique, feuille stratifiée plaquée de métal, et carte de câblage - Google Patents

Isolant organique, feuille stratifiée plaquée de métal, et carte de câblage Download PDF

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Publication number
WO2019142570A1
WO2019142570A1 PCT/JP2018/046333 JP2018046333W WO2019142570A1 WO 2019142570 A1 WO2019142570 A1 WO 2019142570A1 JP 2018046333 W JP2018046333 W JP 2018046333W WO 2019142570 A1 WO2019142570 A1 WO 2019142570A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic insulator
metal
group
clad laminate
cyclic olefin
Prior art date
Application number
PCT/JP2018/046333
Other languages
English (en)
Japanese (ja)
Inventor
梶田　智
長澤　忠
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2019565772A priority Critical patent/JP7181231B2/ja
Publication of WO2019142570A1 publication Critical patent/WO2019142570A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

L'invention concerne un isolant organique 3 qui est formé d'un matériau de résine comprenant, en tant que composant principal, un copolymère d'oléfine cyclique. Lorsque le matériau de résine est analysé par spectrométrie de masse à ions secondaires à temps de vol, un pic d'un composé hydrocarboné est détecté dans une région de 340 à 350 poids moléculaire. Dans cet isolant organique 3, le composé hydrocarboné a au moins un groupe fonctionnel choisi parmi le groupe acryle, le groupe méthacryle, le groupe vinyle, le groupe amino et le groupe époxy. Le matériau de résine comprend en outre un peroxyde ayant un cycle benzénique. La feuille stratifiée plaquée de métal comprend l'isolant organique 3 et une feuille métallique 5 stratifiée sur au moins une surface de l'isolant organique 3. La carte de câblage 10 comprend de multiples couches isolantes 11 et des couches conductrices 13 disposées entre les couches isolantes 11. Les couches isolantes 11 sont formées de l'isolant organique 3.
PCT/JP2018/046333 2018-01-17 2018-12-17 Isolant organique, feuille stratifiée plaquée de métal, et carte de câblage WO2019142570A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019565772A JP7181231B2 (ja) 2018-01-17 2018-12-17 有機絶縁体、金属張積層板および配線基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018005726 2018-01-17
JP2018-005726 2018-01-17

Publications (1)

Publication Number Publication Date
WO2019142570A1 true WO2019142570A1 (fr) 2019-07-25

Family

ID=67302128

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/046333 WO2019142570A1 (fr) 2018-01-17 2018-12-17 Isolant organique, feuille stratifiée plaquée de métal, et carte de câblage

Country Status (2)

Country Link
JP (1) JP7181231B2 (fr)
WO (1) WO2019142570A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018016527A1 (ja) * 2016-07-22 2019-06-13 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
CN115668407A (zh) * 2020-05-27 2023-01-31 京瓷株式会社 有机绝缘体及布线基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004067601A1 (fr) * 2003-01-31 2004-08-12 Zeon Corporation Composition polymerisable, composition de resine thermoplastique, resine reticulee, et materiaux composites a base de resine reticulee
JP2006286352A (ja) * 2005-03-31 2006-10-19 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
JP2007103683A (ja) * 2005-10-05 2007-04-19 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
WO2008123253A1 (fr) * 2007-03-26 2008-10-16 Zeon Corporation Procédé de fabrication d'un corps composite
JP2012214602A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 金属張積層板の製造方法
JP2015143303A (ja) * 2014-01-31 2015-08-06 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004067601A1 (fr) * 2003-01-31 2004-08-12 Zeon Corporation Composition polymerisable, composition de resine thermoplastique, resine reticulee, et materiaux composites a base de resine reticulee
JP2006286352A (ja) * 2005-03-31 2006-10-19 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
JP2007103683A (ja) * 2005-10-05 2007-04-19 Sumitomo Bakelite Co Ltd 樹脂組成物、積層体、配線板および配線板の製造方法
WO2008123253A1 (fr) * 2007-03-26 2008-10-16 Zeon Corporation Procédé de fabrication d'un corps composite
JP2012214602A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 金属張積層板の製造方法
JP2015143303A (ja) * 2014-01-31 2015-08-06 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018016527A1 (ja) * 2016-07-22 2019-06-13 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
CN115668407A (zh) * 2020-05-27 2023-01-31 京瓷株式会社 有机绝缘体及布线基板

Also Published As

Publication number Publication date
JP7181231B2 (ja) 2022-11-30
JPWO2019142570A1 (ja) 2021-01-28

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