CN115668407A - 有机绝缘体及布线基板 - Google Patents
有机绝缘体及布线基板 Download PDFInfo
- Publication number
- CN115668407A CN115668407A CN202180036197.2A CN202180036197A CN115668407A CN 115668407 A CN115668407 A CN 115668407A CN 202180036197 A CN202180036197 A CN 202180036197A CN 115668407 A CN115668407 A CN 115668407A
- Authority
- CN
- China
- Prior art keywords
- cured product
- organic insulator
- cpm
- insulating layer
- cyclic olefin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 title claims abstract description 20
- 238000005259 measurement Methods 0.000 claims abstract description 20
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 19
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims abstract description 19
- 238000004020 luminiscence type Methods 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 230000009477 glass transition Effects 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 230000001186 cumulative effect Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- -1 cyclic olefin Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ORECYURYFJYPKY-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine;2,4,6-trichloro-1,3,5-triazine;2,4,4-trimethylpentan-2-amine Chemical compound CC(C)(C)CC(C)(C)N.ClC1=NC(Cl)=NC(Cl)=N1.C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 ORECYURYFJYPKY-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D145/00—Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Coating compositions based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/448—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from other vinyl compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
Abstract
有机绝缘体是以环状烯烃共聚物作为主要成分的树脂的固化物,利用化学发光测定求出的累计发光量为3.7×105cpm以下。固化物的玻璃化转变温度为134℃以上且140℃以下。累计发光量为2.8×105cpm以上且3.2×105cpm以下。布线基板具备绝缘层和配置于该绝缘层的表面的导体层,绝缘层为上述的有机绝缘体。
Description
技术领域
本发明涉及有机绝缘体及布线基板。
背景技术
近年来,LSI的高速化、高集成化、存储器的大容量化等不断进步,与之相伴,各种电子部件的小型化、轻量化、薄型化等在急速地推进。以往,在此种电子部件的领域中使用的布线基板等中,使用例如像专利文献1中记载的那样的环状烯烃共聚物作为绝缘材料。此种绝缘材料例如在其表面粘接铜箔后作为高频用的布线基板使用。
现有技术文献
专利文献
专利文献1:日本特开2010-100843号公报
发明内容
本发明的有机绝缘体是以环状烯烃共聚物作为主要成分的树脂的固化物,利用化学发光测定求出的累计发光量为3.7×105cpm以下。此外,本发明的布线基板具备绝缘层和配置于绝缘层的表面的导体层,其中绝缘层为上述的有机绝缘体。
附图说明
图1是绘制表1中的累计发光量与Dk变化率的关系而得的图。
具体实施方式
在有机绝缘体的表面粘接铜箔等金属箔后作为高频用的布线基板应用的情况下,通常要求介电特性的经时的稳定性及耐热性。本发明的有机绝缘体是以环状烯烃共聚物作为主要成分的树脂的固化物。以下有时将以环状烯烃共聚物作为主要成分的树脂的固化物表述为固化物。该固化物的利用化学发光测定求出的累计发光量为3.7×105cpm以下。
此处,单位“cpm”为“count/min”,相当于每单位时间(1分钟)产生的光子的数量。由此可以减小固化物所显示出的介电特性的经时的变化率。例如,可以在将上述固化物在100℃以上的温度的环境下长时间放置时减小介质损耗角正切的变化率。该情况下,所谓100℃以上的温度,是110℃以上且130℃以下的范围的温度。
具体而言,将固化物在一定的温度放置于高温的状态下时的介电常数(Dk)的变化率(ΔDk)为1%以内,介质损耗角正切(Df)的变化率(ΔDf)为80%以内。此时的高温放置的条件例如为,温度为125℃、放置时间为1000小时。
对于介电常数(Dk)的变化率(ΔDk)而言,在将高温放置前的固化物的介电常数设为Dk0、将高温放置后的固化物的介电常数设为Dk1时,利用下述的式(I)算出。ΔDk使用所算出的值的绝对值。
ΔDk(%)=(Dk1-Dk0)×100/Dk0 (I)
对于介质损耗角正切(Df)的变化率(ΔDf)而言,在将高温放置前的固化物的介质损耗角正切设为Df0、将高温放置后的固化物的介质损耗角正切设为Df1时,利用下述的式(II)算出。ADf使用所算出的值的绝对值。
ΔDf(%)=(Df1-Df0)×100/Df0 (II)
所谓固化物,是通过加热使生的树脂组合物、即未固化状态的树脂组合物固化而得的物质。该情况下,所谓加热,是指还包括与加热同时进行加压的工序。在固化物中,可以包含环状烯烃共聚物以外的成分。以下有时将环状烯烃共聚物以外的成分记作添加剂。作为添加剂的比例,作为目标较好是40体积%以下。根据上述分析,所谓以环状烯烃共聚物作为主要成分,是指来自于环状烯烃共聚物的树脂成分在树脂的固化物中所占的比例为60体积%以上的情况。作为添加剂,为二氧化硅、氧化铝等无机填料,阻燃剂等。也可以包含固化引发剂、抗氧化剂。
对于添加剂的比例,例如在利用具备分析装置的扫描型电子显微镜分析有机绝缘体的剖面时,在该剖面的任意的场所指定给定的面积。根据该区域中的将无机填料及阻燃剂的面积相加的比例求出。该情况下,从进行分析的区域中除去无机填料及阻燃剂的面积的部分后的部分是作为主要成分的环状烯烃共聚物所占的区域。该情况下,可以将求出的面积比例以体积比例的形式表示。
在固化物包含固化引发剂、抗氧化剂的情况下,可以将它们包含于以环状烯烃共聚物作为主要成分的树脂中。环状烯烃共聚物可以包含在分子内具有苯环的过氧化物。环状烯烃共聚物可以包含单体。作为环状烯烃共聚物,例如可以将三井化学(株)制的LCOC-5作为合适的例子例示。
对于固化物的利用化学发光测定求出的累计发光量为3.7×105cpm以下的状态,可以视为在进行化学发光测定前的阶段中固化物的氧化没有太多推进的状态。在实施方式的固化物中,认为存在有如下所示的称作初期的氧化的状态。以下,有时将初期的氧化表述为1次氧化。该情况下,1次氧化是在使以环状烯烃共聚物作为主要成分的生(或未固化)的树脂固化后发生的氧化。对于固化物的一部分氧化的现象,认为是在使以环状烯烃共聚物作为主要成分的生的树脂聚合而形成固化物后,将该固化物从加压加热装置中取出,将固化物暴露于空气中时发生。固化物中发生氧化的部分是环状烯烃共聚物的未反应的部分、聚合后分解的部分中的至少一者。
所制作出的固化物的利用动态粘弹性测定求出的储能模量较好是8×107Pa以上。该情况下,上述储能模量是130℃以下的温度区域中的值。
固化物的玻璃化转变温度较好是134℃以上且140℃以下。若固化物的玻璃化转变温度为134℃以上且140℃以下,则可以使固化物的介电常数(Dk)的变化率(ΔDk)为0.83%以内。此外,可以使固化物的介质损耗角正切(Df)的变化率(ΔDf)为72%以内。
实施方式的固化物如上所述地能够使固化物的介电常数(Dk)的变化率(ΔDk)、固化物的介质损耗角正切(Df)的变化率(ΔDf)变小是因为,使固化物所显示出的1次氧化的状态具有限制。表示固化物所显示出的1次氧化的状态的指标是化学发光测定的累计发光量。该情况下,作为固化物的累计发光量,较好是2.8×105cpm以上且3.2×105cpm以下。若固化物的累计发光量为2.8×105cpm以上且3.2×105cpm以下,则可以使固化物的介电常数(Dk)的变化率(ΔDk)为0.72%以内。此外,可以使固化物的介质损耗角正切(Df)的变化率(ΔDf)为70%以内。
包含上述固化物的有机绝缘体是适合于构成布线基板的绝缘层的材料。实施方式的布线基板具备绝缘层和配置于该绝缘层的表面的导体层。该情况下,绝缘层较好是由上述的固化物形成的有机绝缘体。若构成布线基板的绝缘层为由上述固化物形成的有机绝缘体,则能够获得对于伴随着长期的高温放置的条件具有高可靠性的布线基板。
实施例
以下,举出实施例对本发明的实施方式进行具体的说明,然而本发明的实施方式并不限定于这些实施例。
实施例1~8中使用的成分如下所述。相对于耐热环状烯烃共聚物(耐热COC(包含自由基聚合官能团)、三井化学(株)制)100质量份,以1质量份的比例添加固化引发剂(Percumyl D、日油(株)制),以0.3质量份的比例添加抗氧化剂(Chimassorb944、BASF公司制)。将所得的混合物40质量%和溶剂60质量%混合,得到树脂清漆。使用将甲苯与环己烷以1∶1的质量比混合而得的混合溶剂作为溶剂。
然后,使用棒涂机,将所得的树脂清漆成形为片状。将所得的片状的成形体在30℃干燥48小时后,在140℃、2分钟的条件下干燥,得到具有27μm的厚度的有机树脂膜。然后,将所得的有机树脂膜切割为小片并重叠12片地层叠。在所得的层叠体的两面层叠具有18μm的厚度的铜箔(表面粗糙度(Ra)=1.7μm),制作出未固化状态的覆铜箔层压板。
然后,将所制作出的未固化状态的覆铜箔层压板在4MPa的加压下、在表1所示的温度条件下进行加压加热处理,得到厚度约为0.3mm的覆铜箔层压板。表1中,对进行加压加热处理时的以下的条件,将固化温度表述为最高温度。将在最高温度保持的时间表述为保持时间。
然后,加工所制作出的有机绝缘体并进行以下的评价。化学发光测定中使用的试样是对进行加压加热处理而制作出的覆铜箔层压板进行切割而得的有机绝缘体(固化物)的部分。试样是投入高温放置试验(125℃、1000小时)前的阶段的试样。尺寸为40mm×40mm×0.3mm。化学发光测定在以下的条件下进行。使用Multi-Luminescence-SpectrometerMLA-GOALS(东北电子产业(株)制)作为测定装置。测定方法采用总发光量的经时变化测定。激发方法采用热激发法。测定温度设为125℃。试样台使用不锈钢制的皿。气氛使用氮气。氮气的流量设为50mL/min.。化学发光测定的测定时间设为30分钟。测定数设为各试样1个。表1中所示的累计发光量的值以E标记来表示指数部。高温放置试验采用将温度设定为125℃、放置1000小时的条件。
然后,从所得的覆铜箔层压板剥离铜箔,利用平衡型圆盘谐振器法测定室温(25℃)、79GHz时的介电常数(Dk)及介质损耗角正切(Df)。对于介电常数(Dk)及介质损耗角正切(Df)的测定,对各试样在进行1000小时的高温放置试验前和试验后进行测定。测定数设为各试样1个。
表1中,将进行高温放置试验前表述为初期,将进行高温放置试验后表述为125℃、1000小时后。对于介电常数(Dk)的变化率(ΔDk),利用上述的式(I)算出。对于介质损耗角正切(Df)的变化率(ΔDf),利用上述的式(II)算出。
对于玻璃化转变温度(Tg),将动态粘弹性测定的数据中的损耗角正切的峰的温度作为玻璃化转变温度(Tg)表示。测定数设为各试样1个。将结果表示于表1中。将绘制表1中的累计发光量与Dk变化率的关系而得的图表示于图1中。
[表1]
从表1及图1可以清楚地知道,对于利用化学发光测定求出的累计发光量为3.7×105cpm以下的试样(试样No.1~7)而言,介电常数(Dk)的变化率(ADk)为0.87%以内,介质损耗角正切(Df)的变化率(ΔDf)为78.05%以内。这些试样的固化温度均为180℃以下。
与之不同,对于将固化温度设为230℃的试样No.8而言,利用化学发光测定求出的累计发光量为4.3×105cpm,介电常数(Dk)的变化率(ΔDk)为2.95%,介质损耗角正切(Df)的变化率(ΔDf)为283.33%。
对于玻璃化转变温度(Tg)为134℃以上且140℃以下的试样(试样No.2~7)而言,介电常数(Dk)的变化率(ADk)为0.83%以内,介质损耗角正切(Df)的变化率(ΔDf)为71.76%以内。
对于累计发光量为2.8×105cpm以上且3.2×105cpm以下的试样(试样No.3~7)而言,介电常数(Dk)的变化率(ΔDk)为0.72%以内,介质损耗角正切(Df)的变化率(ΔDf)为69.19%以内。
Claims (4)
1.一种有机绝缘体,
是以环状烯烃共聚物作为主要成分的树脂的固化物,利用化学发光测定求出的累计发光量为3.7×105cpm以下。
2.根据权利要求1所述的有机绝缘体,其中,
所述固化物的玻璃化转变温度为134℃以上且140℃以下。
3.根据权利要求1或2所述的有机绝缘体,其中,
所述累计发光量为2.8×105cpm以上且3.2×105cpm以下。
4.一种布线基板,其具备绝缘层和配置于该绝缘层的表面的导体层,所述绝缘层为权利要求1~3中任一项所述的有机绝缘体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-092426 | 2020-05-27 | ||
JP2020092426 | 2020-05-27 | ||
PCT/JP2021/019496 WO2021241469A1 (ja) | 2020-05-27 | 2021-05-24 | 有機絶縁体および配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115668407A true CN115668407A (zh) | 2023-01-31 |
Family
ID=78744521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180036197.2A Pending CN115668407A (zh) | 2020-05-27 | 2021-05-24 | 有机绝缘体及布线基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230209708A1 (zh) |
EP (1) | EP4159809A1 (zh) |
JP (1) | JPWO2021241469A1 (zh) |
CN (1) | CN115668407A (zh) |
WO (1) | WO2021241469A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11596066B1 (en) | 2022-03-22 | 2023-02-28 | Thintronics. Inc. | Materials for printed circuit boards |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003202680A (ja) * | 2002-01-09 | 2003-07-18 | Canon Inc | 電子写真感光体、プロセスカートリッジ及び電子写真装置 |
JP2008269798A (ja) * | 2007-04-16 | 2008-11-06 | Canon Inc | 有機エレクトロルミネッセンス用基板及び有機エレクトロルミネッセンス表示装置 |
CN103579440A (zh) * | 2012-08-01 | 2014-02-12 | 晶元光电股份有限公司 | 发光二极管结构 |
CN108699302A (zh) * | 2016-02-29 | 2018-10-23 | 三井化学株式会社 | 环状烯烃共聚物组合物及其交联体 |
CN109417115A (zh) * | 2016-07-14 | 2019-03-01 | 日本瑞翁株式会社 | 红外发光led |
WO2019142570A1 (ja) * | 2018-01-17 | 2019-07-25 | 京セラ株式会社 | 有機絶縁体、金属張積層板および配線基板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010100843A (ja) | 2008-09-29 | 2010-05-06 | Mitsui Chemicals Inc | 環状オレフィン共重合体およびその架橋体 |
JP2015206743A (ja) * | 2014-04-23 | 2015-11-19 | 住友ゴム工業株式会社 | 架橋ゴム材料の耐劣化性能の評価方法 |
JP6884207B2 (ja) * | 2017-06-27 | 2021-06-09 | 京セラ株式会社 | 有機絶縁体、金属張積層板および配線基板 |
JP2021004347A (ja) * | 2019-06-27 | 2021-01-14 | 住友化学株式会社 | 組成物 |
-
2021
- 2021-05-24 JP JP2022527009A patent/JPWO2021241469A1/ja active Pending
- 2021-05-24 WO PCT/JP2021/019496 patent/WO2021241469A1/ja unknown
- 2021-05-24 EP EP21811907.1A patent/EP4159809A1/en active Pending
- 2021-05-24 CN CN202180036197.2A patent/CN115668407A/zh active Pending
- 2021-05-24 US US17/927,479 patent/US20230209708A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003202680A (ja) * | 2002-01-09 | 2003-07-18 | Canon Inc | 電子写真感光体、プロセスカートリッジ及び電子写真装置 |
JP2008269798A (ja) * | 2007-04-16 | 2008-11-06 | Canon Inc | 有機エレクトロルミネッセンス用基板及び有機エレクトロルミネッセンス表示装置 |
CN103579440A (zh) * | 2012-08-01 | 2014-02-12 | 晶元光电股份有限公司 | 发光二极管结构 |
CN108699302A (zh) * | 2016-02-29 | 2018-10-23 | 三井化学株式会社 | 环状烯烃共聚物组合物及其交联体 |
CN109417115A (zh) * | 2016-07-14 | 2019-03-01 | 日本瑞翁株式会社 | 红外发光led |
WO2019142570A1 (ja) * | 2018-01-17 | 2019-07-25 | 京セラ株式会社 | 有機絶縁体、金属張積層板および配線基板 |
Also Published As
Publication number | Publication date |
---|---|
US20230209708A1 (en) | 2023-06-29 |
JPWO2021241469A1 (zh) | 2021-12-02 |
EP4159809A1 (en) | 2023-04-05 |
WO2021241469A1 (ja) | 2021-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101331679B1 (ko) | 전기 전도성 감압 접착제 | |
KR20180124915A (ko) | 세라믹 수지 복합체 | |
KR102347588B1 (ko) | 고내열 저유전 폴리이미드 필름 및 이의 제조방법 | |
JP2015114114A (ja) | 薄板状材料の機械特性評価方法及びこれによる薄板状材料の選別方法、選別された薄板状材料 | |
CN115668407A (zh) | 有机绝缘体及布线基板 | |
CN103443866A (zh) | 用于电子设备中的可烧结的银薄片粘合剂 | |
KR20200124214A (ko) | 절연 방열 시트 | |
KR20230045027A (ko) | 유전체 기판 및 이를 형성하는 방법 | |
JP7155595B2 (ja) | 樹脂組成物、樹脂フィルム、金属張積層板、プリント配線板及び半導体パッケージ | |
KR102342147B1 (ko) | 열경화성 접착필름 및 이를 포함하는 커버레이 필름 | |
WO2003088315A2 (en) | Thermally conductive coating compositions, methods of production and uses thereof | |
KR101681732B1 (ko) | 내열성 비실리콘 이형필름 | |
JP4192871B2 (ja) | 積層板および配線板 | |
TW202305057A (zh) | 樹脂組合物及其製品 | |
TWI633136B (zh) | 薄膜與其形成方法及銅箔基板 | |
CN111808413A (zh) | 热固性树脂组合物及包含其的印刷电路板 | |
JP2009158382A (ja) | 銅箔 | |
JP2011124078A (ja) | 絶縁シート、積層構造体及び積層構造体の製造方法 | |
KR101738968B1 (ko) | 에폭시용 경화제 및 이의 제조방법 | |
JP2007161797A (ja) | プリプレグの特性試験方法 | |
Pfeiffenberger et al. | Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards | |
JP2020180216A (ja) | 樹脂組成物および電子部品構造体 | |
EP4223831A1 (en) | Fluororesin film | |
KR102447652B1 (ko) | 유전특성이 개선된 폴리이미드 필름 및 그 제조방법 | |
JP7507274B2 (ja) | 樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |