WO2024009831A1 - Composition de résine, pré-imprégné, film comprenant de la résine, feuille métallique comprenant de la résine, stratifié à revêtement métallique, et tableau de connexions - Google Patents

Composition de résine, pré-imprégné, film comprenant de la résine, feuille métallique comprenant de la résine, stratifié à revêtement métallique, et tableau de connexions Download PDF

Info

Publication number
WO2024009831A1
WO2024009831A1 PCT/JP2023/023669 JP2023023669W WO2024009831A1 WO 2024009831 A1 WO2024009831 A1 WO 2024009831A1 JP 2023023669 W JP2023023669 W JP 2023023669W WO 2024009831 A1 WO2024009831 A1 WO 2024009831A1
Authority
WO
WIPO (PCT)
Prior art keywords
compound
resin composition
resin
group
composition according
Prior art date
Application number
PCT/JP2023/023669
Other languages
English (en)
Japanese (ja)
Inventor
一 大塚
宏典 齋藤
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Publication of WO2024009831A1 publication Critical patent/WO2024009831A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to a resin composition, a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a wiring board.
  • Patent Document 1 describes a thermosetting resin composition used to form an insulating layer in a printed wiring board, which includes a maleimide compound having a predetermined structure, a benzoxazine compound, and an inorganic filler. A resin composition for wiring boards is described. Patent Document 1 discloses that it is possible to provide a resin composition for a printed wiring board that can realize a printed wiring board that has fine circuit dimensions and has excellent insulation reliability under high temperature and high humidity conditions. .
  • Patent Document 2 describes a resin composition containing a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group. According to Patent Document 2, it is possible to provide a resin composition that has excellent high frequency properties (low dielectric constant, low dielectric loss tangent), and also has high levels of adhesion to conductors, heat resistance, and low moisture absorption. This is disclosed.
  • the present invention was made in view of the above circumstances, and an object thereof is to provide a resin composition from which a cured product having a low dielectric constant and a low dielectric loss tangent and having excellent adhesion to metal foil can be obtained. shall be.
  • Another object of the present invention is to provide a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a wiring board, which are obtained using the resin composition.
  • One aspect of the present invention is a resin composition containing an imide compound (A) having a structure represented by the following formula (1) in its molecule and a radically polymerizable compound (B).
  • X 1 represents a tetravalent tetracarboxylic acid residue
  • X 2 represents a divalent aliphatic diamine residue
  • X 3 represents a divalent aromatic diamine residue.
  • X 4 and X 5 each independently represent a hydrocarbon group or an acid anhydride group, at least one of X 4 and X 5 represents an acid anhydride group
  • m represents 1 to 50
  • n represents 0 to 49
  • the sum of m and n represents 1 to 50.
  • FIG. 1 is a schematic cross-sectional view showing an example of a prepreg according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing an example of a metal-clad laminate according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view showing an example of a wiring board according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing an example of a resin-coated metal foil according to an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing an example of a resin-coated film according to an embodiment of the present invention.
  • Metal-clad laminates and resin-coated metal foils used in manufacturing wiring boards and the like include not only an insulating layer but also a metal foil on the insulating layer. Further, the wiring board is also provided with wiring not only on the insulating layer but also on the insulating layer. Examples of the wiring include wiring derived from metal foil provided in the metal-clad laminate or the like.
  • a cured resin composition that has a lower relative dielectric constant and dielectric loss tangent than the resin compositions described in Patent Document 1 and Patent Document 2, and has excellent adhesion to metal foil. It is required that things be obtained.
  • a resin composition according to an embodiment of the present invention is a resin composition containing an imide compound (A) having a structure represented by the following formula (1) in the molecule and a radically polymerizable compound (B). be.
  • a cured product having a low dielectric constant and a low dielectric loss tangent and excellent adhesion to metal foil can be obtained.
  • X 1 represents a tetravalent tetracarboxylic acid residue.
  • X 2 represents a divalent aliphatic diamine residue.
  • X 3 represents a divalent aromatic diamine residue.
  • X 4 and X 5 are each independent. That is, X 4 and X 5 may be the same group or different groups.
  • X 4 and X 5 represent a hydrocarbon group or an acid anhydride group, and at least one of X 4 and X 5 represents an acid anhydride group.
  • m represents 1 to 50
  • n represents 0 to 49
  • the sum of m and n represents 1 to 50.
  • the imide compound (A) is not particularly limited as long as it is an imide compound having the structure represented by the formula (1) in its molecule. As shown in the formula (1), the imide compound (A) includes the aliphatic diamine residue in the molecule, and may also include the aromatic diamine residue in the molecule. Further, the imide compound (A) may be a random copolymer in which repeating units containing the aliphatic diamine residue and repeating units containing the aromatic diamine residue are randomly present.
  • the tetracarboxylic acid residue is not particularly limited as long as it is a tetravalent group derived from tetracarboxylic acid or tetracarboxylic dianhydride.
  • examples of the tetracarboxylic acid residue include a residue obtained by removing four carboxyl groups from a tetracarboxylic acid, or a residue obtained by removing an acid dianhydride structure from a tetracarboxylic dianhydride.
  • Examples of the tetracarboxylic acid residue include tetravalent tetracarboxylic acid residues having 2 to 40 carbon atoms.
  • the aliphatic diamine residue is not particularly limited as long as it is a divalent group derived from an aliphatic diamine compound.
  • Examples of the aliphatic diamine residue include residues obtained by removing two amino groups from an aliphatic diamine compound.
  • the aromatic diamine residue is not particularly limited as long as it is a divalent group derived from an aromatic diamine compound.
  • Examples of the aromatic diamine residue include residues obtained by removing two amino groups from an aromatic diamine compound.
  • the imide compound (A) includes the aliphatic diamine residue in the molecule, and may also include the aromatic diamine residue in the molecule.
  • the imide compound (A) is a compound having at least one acid anhydride group at the end of the molecule. That is, in the imide compound (A), in the structure represented by the formula (1), X 4 and X 5 each independently represent a hydrocarbon group or an acid anhydride group, and X 4 and X 5 At least one of them is a compound exhibiting an acid anhydride group.
  • the acid anhydride group is not particularly limited.
  • Examples of the acid anhydride group include acid anhydride groups contained in the tetracarboxylic dianhydride (which is the raw material for the imide compound (A)) before forming the tetracarboxylic acid residue.
  • the hydrocarbon group is not particularly limited, and includes, for example, a hydrocarbon group having 1 to 20 carbon atoms.
  • m and n are average values of the number of repeating units (degree of polymerization), and for example, the sum of m and n may be the number of repeating units that gives the following acid value or the following weight average molecular weight. Further, the sum of m and n is preferably 1 to 50, for example. Further, the ratio of m to the sum of m and n [m/(m+n)] is preferably 0 or more and 0.98 or less [0 ⁇ m/(m+n) ⁇ 0.98], and 0 or more and 0.98 or less [0 ⁇ m/(m+n) ⁇ 0.98].
  • the ratio of m to the sum of m and n [m/(m+n)] indicates the proportion of the aliphatic amine residue in the total of the aliphatic diamine residue and the aromatic diamine residue. .
  • the acid value of the imide compound (A) is preferably 5 to 50 mgKOH/g, more preferably 10 to 35 mgKOH/g. If the acid value is too low, the adhesiveness with metal foil such as copper foil tends to decrease, and the copper foil peel strength tends to decrease. Furthermore, if the acid value is too high, the resulting cured product tends to have a lower glass temperature and a higher coefficient of thermal expansion. Therefore, it is preferable for the acid value of the imide compound (A) to be within the above range in terms of achieving both adhesion to metal foil such as copper foil and a low coefficient of thermal expansion.
  • the acid value here represents the acid value per 1 g of the imide compound (A). Further, the acid value can be measured by potentiometric titration according to DIN EN ISO 2114.
  • the weight average molecular weight of the imide compound (A) is preferably 10,000 to 30,000, more preferably 10,000 to 20,000. If the weight average molecular weight is too low, the resin viscosity tends to decrease and resin flow during press molding tends to become too large. Furthermore, if the weight average molecular weight is too high, the resin viscosity tends to increase, the resin flow during press molding becomes too small, and the compatibility with the radically polymerizable compound (B) tends to decrease. If the resin flow becomes too small, for example, circuit filling properties tend to deteriorate.
  • the weight average molecular weight of the imide compound (A) is within the above range.
  • the weight average molecular weight here may be one measured by a general molecular weight measurement method, and specifically, a value measured using gel permeation chromatography (GPC), etc. can be mentioned.
  • the imide compound (A) preferably contains 2 to 4 mmol/g of imide groups. If the amount of the imide group is too small, the resulting cured product tends to have a lower glass transition temperature and a lower coefficient of thermal expansion. Moreover, if the amount of the imide group is too large, the compatibility with the radically polymerizable compound (B) will decrease, and the imide compound (A) and radically polymerizable compound (B) in the cured product will become incompatible. It tends to be uniform. Therefore, it is preferable that the amount of the imide group is within the above range, since a uniform cured product can be produced and the resin composition can provide a cured product with a low coefficient of thermal expansion.
  • the imide compound (A) may contain other imide compounds as long as it contains an imide compound having the structure represented by the formula (1) in its molecule.
  • Other imide compounds include, for example, imide compounds that have a structure represented by the above formula (1) and do not have an acid anhydride group at the end of the molecule (a structure represented by the above formula (1), Examples include imide compounds having a hydrocarbon group instead of an acid anhydride group at the end of the molecule.
  • the radically polymerizable compound (B) is not particularly limited as long as it is a radically polymerizable compound.
  • the radically polymerizable compound (B) include a maleimide compound (B-1), an oxazine compound (B-2) having an alkenyl group in the molecule, and a reactive carbon-carbon unsaturated group in the molecule.
  • Examples include compound (B-3), hydrocarbon compound (B-4) having a benzene ring to which an alkenyl group is bonded in the molecule.
  • the radically polymerizable compound (B) these may be used alone or in combination of two or more.
  • the radically polymerizable compound (B) includes at least one selected from the group consisting of the maleimide compound (B-1), the oxazine compound (B-2), and the compound (B-3). is preferred. Further, the radically polymerizable compound (B) includes the maleimide compound (B-1) and the oxazine compound (B-2), that is, the maleimide compound (B-1) and the oxazine compound (B-2). -2) is more preferably used in combination.
  • the maleimide compound (B-1) is not particularly limited as long as it is a compound having a maleimide group in the molecule.
  • the maleimide compound (B-1) include monofunctional maleimide compounds having one maleimide group in the molecule, polyfunctional maleimide compounds having two or more maleimide groups in the molecule, and modified maleimide compounds.
  • the modified maleimide compound include a modified maleimide compound in which part of the molecule is modified with an amine compound, a modified maleimide compound in which part of the molecule is modified with a silicone compound, and a modified maleimide compound in which part of the molecule is modified with an amine compound. and modified maleimide compounds modified with silicone compounds.
  • examples of the maleimide compound (B-1) include maleimide compounds that are solid at 25°C.
  • examples of the maleimide compound (B-1) include radically polymerizable compounds that have a benzene ring to which an alkenyl group is bonded in the molecule and have a weight average molecular weight of 1,000 or less.
  • examples of the alkenyl group include an allyl group, a vinyl group, and a propenyl group.
  • the maleimide compound (B-1) examples include a maleimide compound (B-1-1) that has a benzene ring in the molecule and has a maleimide equivalent of 500 g/mol or less. Further, the maleimide compound (B-1) preferably contains the maleimide compound (B-1-1).
  • the maleimide equivalent of the maleimide compound (B-1) is preferably 500 g/mol or less, more preferably 200 to 450 g/mol. If the maleimide equivalent is too low, the compatibility with the imide compound (A) will decrease, and there will be a tendency for it to separate easily from the resin composition during varnish production.
  • the maleimide equivalent is the mass per 1 mol of maleimide groups, and can be calculated, for example, by dividing the molecular weight of the maleimide compound by the number of maleimide groups.
  • Examples of the maleimide compound (B-1) include maleimide compounds having an arylene structure oriented and bonded at the meta position in the molecule.
  • Examples of the arylene structure oriented and bonded to the meta position include an arylene structure in which a structure containing a maleimide group is bonded to the meta position (arylene structure in which a structure containing a maleimide group is substituted at the meta position), etc. Can be mentioned.
  • the arylene structure oriented and bonded to the meta position is an arylene group oriented and bonded to the meta position, such as a group represented by the following formula (2).
  • Examples of the arylene structure oriented and bonded at the meta position include m-arylene groups such as m-phenylene group and m-naphthylene group, and more specifically, the following formula (2) Examples include groups represented by:
  • maleimide compound (B-1) examples include a maleimide compound (B-1-2) represented by the following formula (3), and more specifically, a maleimide compound (B-1-2) represented by the following formula (4). Examples include maleimide compound (B-1-3).
  • Ar represents an arylene group oriented and bonded at the meta position.
  • R A , R B , R C , and R D are each independent. That is, R A , R B , R C , and R D may be the same group or different groups.
  • R A , R B , R C , and R D represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and preferably a hydrogen atom.
  • R E and R F are each independent. That is, R E and R F may be the same group or different groups.
  • R E and R F represent an aliphatic hydrocarbon group. s represents 1 to 5.
  • the arylene group is not particularly limited as long as it is oriented and bonded at the meta position, and examples thereof include m-arylene groups such as m-phenylene group and m-naphthylene group, and more. Specifically, a group represented by the above formula (2) can be mentioned.
  • alkyl group having 1 to 5 carbon atoms examples include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, pentyl group, and neopentyl group. etc.
  • the aliphatic hydrocarbon group is a divalent group, and may be acyclic or cyclic.
  • Examples of the aliphatic hydrocarbon group include an alkylene group, and more specifically, a methylene group, a methylmethylene group, a dimethylmethylene group, and the like. Among these, dimethylmethylene group is preferred.
  • the repeating number s is preferably 1 to 5. This s is the average value of the number of repetitions (degree of polymerization).
  • s represents 1 to 5. This s is the same as s in formula (3), and is the average value of the number of repetitions (degree of polymerization).
  • the maleimide compound (B-1-2) represented by the above formula (3) and the maleimide compound (B-1-3) represented by the above formula (4) are the average value of the repeating number (degree of polymerization). If s is 1 to 5, it may include a monofunctional body in which s is 0, and polyfunctional bodies such as heptafunctional bodies and octafunctional bodies in which s is 6 or more. May contain.
  • maleimide compound (B-1) a commercially available product may be used, for example, the solid content in MIR-5000-60T manufactured by Nippon Kayaku Co., Ltd. may be used.
  • the exemplified maleimide compounds may be used alone, two or more of the exemplified maleimide compounds may be used in combination, or the exemplified maleimide compounds and other maleimide compounds may be used. You may use it in combination.
  • the maleimide compound (B-1-2) represented by formula (3) may be used alone as the maleimide compound (B-1), or the maleimide compound (B-1-2) represented by formula (3) may be used alone. 1-2) may be used in combination of two or more.
  • maleimide compound (B-1-2) represented by formula (3) for example, a maleimide compound (B-1-3) other than the maleimide compound represented by formula (4) ( Examples include the combined use of the maleimide compound (B-1-2) represented by 3) and the maleimide compound (B-1-3) represented by formula (4).
  • the oxazine compound (B-2) is not particularly limited as long as it has an alkenyl group in the molecule. Note that the oxazine compound (B-2) has an oxazine group in the molecule.
  • Examples of the oxazine compound (B-2) include benzoxazine compounds (B-2-1) having a benzoxazine group in the molecule.
  • Examples of the benzoxazine group include a benzoxazine group represented by the following formula (5) and a benzoxazine group represented by the following formula (6).
  • benzoxazine compound (B-2-1) a benzoxazine compound (B-2-2) having a benzoxazine group represented by the following formula (5) in the molecule
  • a benzoxazine compound (B-2-2) having a benzoxazine group represented by the following formula (6)
  • a benzoxazine compound (B-2-3) having a benzoxazine group represented by the following formula (5) in its molecule
  • a benzoxazine group represented by the following formula (5) and a benzoxazine group represented by the following formula (6) examples include benzoxazine compounds (B-2-4) contained in the molecule.
  • R 1 represents an allyl group
  • p represents 1 to 4.
  • p is the average value of the degree of substitution of R 1 and is 1 to 4, preferably 1.
  • R 2 represents an allyl group.
  • the oxazine compound (B-2) includes a benzoxazine compound (B-2-5) represented by the following formula (7), etc. Can be mentioned.
  • the benzoxazine compound (B-2) preferably includes the benzoxazine compound (B-2-5).
  • R 3 and R 4 represent an allyl group
  • X 6 represents an alkylene group
  • q and r each independently represent 1 to 4. That is, q and r may be the same or different, and each represents 1 to 4.
  • the alkylene group is not particularly limited, and examples thereof include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octane group, an icosane group, and a hexatriacontane group.
  • methylene group is preferred.
  • q is the average value of the degree of substitution of R 3 and is 1 to 4, preferably 1.
  • r is the average value of the degree of substitution of R 4 and is 1 to 4, preferably 1.
  • the benzoxazine compound (B-2-2) (such as the benzoxazine compound (B-2-5)), It may contain an oxazine compound (another oxazine compound) other than the benzoxazine compound (B-2-3) and the benzoxazine compound (B-2-4).
  • oxazine compounds examples include benzoxazine compounds having a phenolphthalein structure in the molecule (phenolphthalein type benzoxazine compounds), bisphenol F type benzoxazine compounds, and diaminodiphenylmethane (DDM) type benzoxazine compounds. can be mentioned.
  • the other oxazine compounds include 3,3'-(methylene-1,4-diphenylene)bis(3,4-dihydro-2H-1,3-benzoxazine) (Pd type benzoxazine compound), and 2,2-bis(3,4-dihydro-2H-3-phenyl-1,3-benzoxazine)methane (Fa-type benzoxazine compound).
  • oxazine compound (B-2) a commercially available product may be used, for example, ALPd manufactured by Shikoku Kasei Kogyo Co., Ltd. or the like may be used.
  • the above-exemplified benzoxazine compounds may be used alone, or two or more thereof may be used in combination.
  • a benzoxazine compound (B-2-2) having a benzoxazine group represented by formula (5) in the molecule a benzoxazine group represented by the following formula (6)
  • a benzoxazine compound (B-2-3) having in its molecule and a benzoxazine having in its molecule a benzoxazine group represented by the following formula (5) and a benzoxazine group represented by the following formula (6)
  • Each of the compounds (B-2-4) may be used alone, or two or more thereof may be used in combination.
  • polyphenylene ether compound (B-3-1) examples include polyphenylene ether compounds having a carbon-carbon unsaturated double bond at the end, and more specifically, a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the end.
  • Polyphenylene ether compounds having a substituent having a carbon-carbon unsaturated double bond at the end of the molecule such as a modified polyphenylene ether compound which is terminally modified with a substituent having a carbon-carbon unsaturated double bond.
  • substituent having a carbon-carbon unsaturated double bond examples include a vinylbenzyl group (ethenylbenzyl group), an acryloyl group, and a methacryloyl group.
  • the hydrocarbon compound (B-4) is not particularly limited as long as it has a benzene ring to which an alkenyl group is bonded in the molecule.
  • Examples of the hydrocarbon compound (B-4) include divinylbenzene such as o-divinylbenzene, m-divinylbenzene, and p-divinylbenzene, a hydrocarbon compound represented by the following formula (8), and Examples include hydrocarbon compounds represented by the following formula (10).
  • Y represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group and an aliphatic cyclic group.
  • a represents 1 to 10.
  • the aromatic cyclic group is not particularly limited, but includes, for example, a phenylene group, a xylylene group, a naphthylene group, a tolylene group, a biphenylene group, and the like.
  • the aliphatic cyclic group is not particularly limited, but includes, for example, a group containing an indane structure and a group containing a cycloolefin structure.
  • Y is preferably the aromatic cyclic group described above, and more preferably a xylylene group.
  • the number of carbon atoms in the hydrocarbon group is not particularly limited as long as it is 6 or more, but it is preferably 6 to 20 carbon atoms.
  • the hydrocarbon compound (B-4) [the hydrocarbon compound represented by the formula (8) above] includes a hydrocarbon compound represented by the following formula (9). It will be done. Further, the hydrocarbon compound (B-4) preferably includes a hydrocarbon compound represented by the following formula (9).
  • a 1 to 10.
  • b 0 to 20.
  • the compound represented by the above formula (10) includes a compound represented by the above formula (10) where b is 1 [bis-(4-vinylphenyl)methane (BVPM)], the above formula The compound represented by formula (10), where b is 2 [1,2-bis(vinylphenyl)ethane (BVPE)], and the compound represented by formula (10), where b is 6 [1,6- bis(4-vinylphenyl)hexane (BVPH)] and the like.
  • BVPM bis-(4-vinylphenyl)methane
  • BVPE 1,2-bis(vinylphenyl)ethane
  • BVPH 1,6- bis(4-vinylphenyl)hexane
  • the radically polymerizable compound (B) may be used alone, or two or more of them may be used in combination.
  • the resin composition may contain an inorganic filler, if necessary, within a range that does not impair the effects of the present invention. Further, it is preferable to contain the inorganic filler from the viewpoint of improving the heat resistance and the like of the cured product of the resin composition.
  • the inorganic filler is not particularly limited as long as it can be used as an inorganic filler contained in a resin composition. Examples of the inorganic filler include silica, alumina, titanium oxide, metal oxides such as magnesium oxide and mica, metal hydroxides such as magnesium hydroxide and aluminum hydroxide, talc, aluminum borate, barium sulfate, and nitride.
  • Examples include aluminum, boron nitride, barium titanate, strontium titanate, calcium titanate, aluminum titanate, magnesium carbonate such as anhydrous magnesium carbonate, and calcium carbonate.
  • silica metal hydroxides such as magnesium hydroxide and aluminum hydroxide, aluminum oxide, boron nitride, strontium titanate, calcium titanate, etc. are preferred, and silica is more preferred.
  • the silica is not particularly limited, and examples include crushed silica, spherical silica, and silica particles, with spherical silica being preferred.
  • the inorganic filler may be a surface-treated inorganic filler or may be a non-surface-treated inorganic filler.
  • examples of the surface treatment include treatment with a silane coupling agent.
  • the silane coupling agent is not particularly limited, and includes, for example, a vinyl group, a styryl group, a methacryloyl group, an acryloyl group, a phenylamino group, an isocyanurate group, a ureido group, a mercapto group, an isocyanate group, an epoxy group, and an acid anhydride group.
  • Examples include silane coupling agents having at least one functional group selected from the group consisting of chemical groups.
  • this silane coupling agent contains a vinyl group, a styryl group, a methacryloyl group, an acryloyl group, a phenylamino group, an isocyanurate group, a ureido group, a mercapto group, an isocyanate group, an epoxy group, and an acid anhydride group as reactive functional groups.
  • Examples include compounds having at least one of the chemical groups and further having a hydrolyzable group such as a methoxy group or an ethoxy group.
  • Examples of the silane coupling agent having a vinyl group include vinyltriethoxysilane and vinyltrimethoxysilane.
  • Examples of the silane coupling agent having a styryl group include p-styryltrimethoxysilane and p-styryltriethoxysilane.
  • Examples of the silane coupling agent having a methacryloyl group include 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-methacryloxypropylmethyl. Examples include diethoxysilane and 3-methacryloxypropylethyldiethoxysilane.
  • silane coupling agent having an acryloyl group examples include 3-acryloxypropyltrimethoxysilane and 3-acryloxypropyltriethoxysilane.
  • silane coupling agent having a phenylamino group examples include N-phenyl-3-aminopropyltrimethoxysilane and N-phenyl-3-aminopropyltriethoxysilane.
  • the average particle diameter of the inorganic filler is not particularly limited, and is preferably, for example, 0.05 to 10 ⁇ m, more preferably 0.1 to 8 ⁇ m. Note that the average particle size herein refers to the volume average particle size.
  • the volume average particle diameter can be measured, for example, by a laser diffraction method.
  • the content of the imide compound (A) is preferably 5 to 40 parts by mass, and preferably 10 to 35 parts by mass, based on a total of 100 parts by mass of the imide compound (A) and the radically polymerizable compound (B). It is more preferable that it is part.
  • a resin composition that becomes a cured product with low dielectric constant and dielectric loss tangent and excellent adhesion to metal foil can be obtained more suitably. This means that when the content of the imide compound (A) is within the above range, the effect produced by containing the imide compound (A) and the effect produced by containing the radically polymerizable compound (B). This is thought to be due to the ability to fully demonstrate each of the following.
  • the resin composition may contain the maleimide compound (B-1) and the oxazine compound (B-2) as the radically polymerizable compound (B).
  • the maleimide compound (B-1) and the oxazine compound (B-2) are included, the respective contents of the maleimide compound (B-1) and the oxazine compound (B-2) are within the following ranges. It is preferable that there be.
  • the content of the maleimide compound (B-1) is 30 to 70 parts by mass based on a total of 100 parts by mass of the imide compound (A), the maleimide compound (B-1), and the oxazine compound (B-2). It is preferably 35 to 65 parts by weight, more preferably 35 to 65 parts by weight.
  • the content of the oxazine compound (B-2) is 5 to 40 parts by mass based on a total of 100 parts by mass of the imide compound (A), the maleimide compound (B-1), and the oxazine compound (B-2). It is preferably 10 to 30 parts by weight, more preferably 10 to 30 parts by weight.
  • the styrenic copolymer may be a random copolymer or a block copolymer, as long as it has a structure derived from the styrene monomer in its molecule.
  • the block copolymer includes a binary copolymer of a structure (repeat unit) derived from the styrenic monomer and the other copolymerizable monomer (repeat unit), and a binary copolymer of the styrenic monomer (repeat unit), A terpolymer of the structure (repeat unit) derived from the styrenic monomer, the other copolymerizable monomer (repeat unit), and the structure (repeat unit) derived from the styrenic monomer, and A random copolymerization block (repeat unit) containing the other copolymerizable monomer and the styrenic monomer, and a structure (repeat unit) derived
  • the styrenic polymer may be a hydrogenated styrenic copolymer obtained by hydrogenating at least a portion of the styrenic copolymer. More specifically, the styrenic polymers include methylstyrene (ethylene/butylene) methylstyrene block copolymer, methylstyrene (ethylene-ethylene/propylene) methylstyrene block copolymer, and styrene isoprene block copolymer.
  • the epoxy compound is a compound having an epoxy group in the molecule, and specifically includes bisphenol-type epoxy compounds such as bisphenol A-type epoxy compounds, phenol novolac-type epoxy compounds, cresol novolak-type epoxy compounds, and dicyclopentadiene-type epoxy compounds. Examples include bisphenol A novolac type epoxy compounds, biphenylaralkyl type epoxy compounds, polybutadiene compounds having an epoxy group in the molecule, and naphthalene ring-containing epoxy compounds.
  • the epoxy compound also includes epoxy resins that are polymers of the epoxy compounds described above.
  • the methacrylate compound is a compound having a methacryloyl group in the molecule, and includes, for example, a monofunctional methacrylate compound having one methacryloyl group in the molecule, and a polyfunctional methacrylate compound having two or more methacryloyl groups in the molecule. It will be done.
  • the monofunctional methacrylate compound include methyl methacrylate, ethyl methacrylate, propyl methacrylate, and butyl methacrylate.
  • Examples of the polyfunctional methacrylate compound include dimethacrylate compounds such as tricyclodecane dimethanol dimethacrylate (DCP).
  • the acrylate compound is a compound having an acryloyl group in the molecule, and includes, for example, a monofunctional acrylate compound having one acryloyl group in the molecule, and a polyfunctional acrylate compound having two or more acryloyl groups in the molecule. It will be done.
  • the monofunctional acrylate compound include methyl acrylate, ethyl acrylate, propyl acrylate, and butyl acrylate.
  • Examples of the polyfunctional acrylate compound include diacrylate compounds such as tricyclodecane dimethanol diacrylate.
  • the vinyl compound is a compound having a vinyl group in the molecule, such as a monofunctional vinyl compound (monovinyl compound) having one vinyl group in the molecule, and a polyfunctional vinyl compound having two or more vinyl groups in the molecule. Examples include compounds.
  • polyfunctional vinyl compound examples include divinylbenzene, a curable polybutadiene having a carbon-carbon unsaturated double bond in the molecule, a butadiene-styrene copolymer other than the styrene polymer, and a vinylbenzyl group at the end ( Examples include polyphenylene ether compounds having an ethenylbenzyl group) and modified polyphenylene ethers in which the terminal hydroxyl group of polyphenylene ether is modified with a methacryl group.
  • butadiene-styrene copolymers other than the styrene-based polymers include curable butadiene-styrene copolymers having carbon-carbon unsaturated double bonds in the molecule that are liquid at 25°C; Curable butadiene-styrene random copolymers with unsaturated double bonds in the molecule, and curable butadiene-styrene random copolymers with carbon-carbon unsaturated double bonds in the molecule that are liquid at 25°C. Can be mentioned.
  • the cyanate ester compound is a compound having a cyanato group in the molecule, and examples thereof include 2,2-bis(4-cyanatophenyl)propane, bis(3,5-dimethyl-4-cyanatophenyl)methane, and 2-bis(4-cyanatophenyl)propane. , 2-bis(4-cyanatophenyl)ethane and the like.
  • the active ester compound is a compound having a highly reactive ester group in its molecule, such as benzenecarboxylic acid active ester, benzenedicarboxylic acid active ester, benzenetricarboxylic acid active ester, benzenetetracarboxylic acid active ester, naphthalenecarboxylic acid active ester, etc.
  • Acid activated ester naphthalene dicarboxylic acid active ester, naphthalene tricarboxylic acid active ester, naphthalene tetracarboxylic acid active ester, fluorene carboxylic acid active ester, fluorene tricarboxylic acid active ester, fluorene tricarboxylic acid active ester, and fluorene tetracarboxylic acid active ester, etc. Can be mentioned.
  • the allyl compound is a compound having an allyl group in the molecule, and includes, for example, triallyl isocyanurate compounds such as triallyl isocyanurate (TAIC), diallyl bisphenol compounds, and diallyl phthalate (DAP).
  • triallyl isocyanurate compounds such as triallyl isocyanurate (TAIC), diallyl bisphenol compounds, and diallyl phthalate (DAP).
  • the organic components may be used alone or in combination of two or more.
  • the weight average molecular weight of the organic component is not particularly limited, and is preferably, for example, 100 to 5,000, more preferably 100 to 4,000, and even more preferably 100 to 3,000. If the weight average molecular weight of the organic component is too low, the organic component may easily volatilize from the component system of the resin composition. Furthermore, if the weight average molecular weight of the organic component is too high, the viscosity of the varnish of the resin composition and the melt viscosity during heat molding will become too high, leading to a risk of deterioration of appearance and moldability when B-staged. be. Therefore, when the weight average molecular weight of the organic component is within such a range, a resin composition with excellent heat resistance and moldability of the cured product can be obtained.
  • the resin composition can be suitably cured.
  • the weight average molecular weight here may be one measured by a general molecular weight measurement method, and specifically, a value measured using gel permeation chromatography (GPC), etc. can be mentioned.
  • the organic component has an average number of functional groups per molecule of the organic component (number of functional groups) that contributes to the reaction during curing of the resin composition, which varies depending on the weight average molecular weight of the organic component.
  • the number is preferably 20 to 20, more preferably 2 to 18. If the number of functional groups is too small, it tends to be difficult to obtain a cured product with sufficient heat resistance. Furthermore, if the number of functional groups is too large, the reactivity becomes too high, which may cause problems such as a decrease in the storage stability of the resin composition or a decrease in fluidity of the resin composition.
  • the resin composition may contain components (other components) other than the imide compound (A) and the radically polymerizable compound (B) within a range that does not impair the effects of the present invention.
  • the resin composition may contain the styrene polymer, the inorganic filler, and the organic component as the other components.
  • the other components other than the styrene polymer, the inorganic filler, and the organic component include flame retardants, reaction initiators, curing accelerators, catalysts, polymerization retarders, polymerization inhibitors, and dispersants. , leveling agents, coupling agents, antifoaming agents, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, dyes and pigments, and additives such as lubricants.
  • the resin composition according to this embodiment may contain a flame retardant, as described above.
  • a flame retardant By containing a flame retardant, the flame retardancy of the cured product of the resin composition can be improved.
  • the flame retardant is not particularly limited. Specifically, in fields where halogenated flame retardants such as brominated flame retardants are used, for example, ethylene dipentabromobenzene, ethylene bistetrabromoimide, decabromodiphenyl oxide, and tetradecabromoimide, which have a melting point of 300°C or higher, are used. Preferred are phenoxybenzene and a bromostyrene compound that reacts with the polymerizable compound.
  • halogen-based flame retardant desorption of halogen at high temperatures can be suppressed, and a decrease in heat resistance can be suppressed. Furthermore, in fields where halogen-free products are required, flame retardants containing phosphorus (phosphorus-based flame retardants) are sometimes used.
  • the phosphorus flame retardant is not particularly limited, but includes, for example, phosphate ester flame retardants, phosphazene flame retardants, bisdiphenylphosphine oxide flame retardants, and 9,10-dihydro-9-oxa-10-phosphaphenanthrene. -10-oxide (DOPO) type flame retardants and phosphinate type flame retardants.
  • a specific example of the phosphoric acid ester flame retardant includes a condensed phosphoric acid ester of dixylenyl phosphate.
  • a specific example of the phosphazene flame retardant is phenoxyphosphazene.
  • a specific example of the bisdiphenylphosphine oxide flame retardant is xylylene bisdiphenylphosphine oxide.
  • DOPO-based flame retardants include hydrocarbons having two DOPO groups in the molecule (DOPO derivative compounds), DOPO having reactive functional groups, and the like.
  • Specific examples of phosphinate-based flame retardants include phosphinate metal salts of dialkyl phosphinate aluminum salts.
  • each of the exemplified flame retardants may be used alone, or two or more types may be used in combination.
  • the resin composition according to the present embodiment may contain a reaction initiator.
  • the reaction initiator is not particularly limited as long as it can promote the curing reaction of the resin composition, and examples thereof include peroxides and organic azo compounds.
  • the peroxide include ⁇ , ⁇ '-di(t-butylperoxy)diisopropylbenzene (PBP), 2,5-dimethyl-2,5-di(t-butylperoxy)-3-hexyne , and benzoyl peroxide.
  • examples of the organic azo compound include azobisisobutyronitrile and the like.
  • carboxylic acid metal salts and the like can be used in combination, if necessary.
  • ⁇ , ⁇ '-di(t-butylperoxy)diisopropylbenzene is preferably used. Since ⁇ , ⁇ '-di(t-butylperoxy)diisopropylbenzene has a relatively high reaction initiation temperature, it is possible to suppress the acceleration of the curing reaction at times when curing is not necessary, such as during prepreg drying. , it is possible to suppress a decrease in the storage stability of the resin composition. Further, since ⁇ , ⁇ '-di(t-butylperoxy)diisopropylbenzene has low volatility, it does not volatilize during prepreg drying or storage, and has good stability. Further, the reaction initiator may be used alone or in combination of two or more types.
  • the resin composition according to this embodiment may contain a curing accelerator.
  • the curing accelerator is not particularly limited as long as it can promote the curing reaction of the resin composition.
  • the curing accelerator includes imidazoles and derivatives thereof, organic phosphorus compounds, amines such as secondary amines and tertiary amines, quaternary ammonium salts, organic boron compounds, and metal soap.
  • the imidazoles include 2-ethyl-4-methylimidazole (2E4MZ), 2-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenylimidazole, and 1-benzyl-2-methylimidazole. Can be mentioned.
  • examples of the organic phosphorus compounds include triphenylphosphine, diphenylphosphine, phenylphosphine, tributylphosphine, and trimethylphosphine.
  • examples of the amines include dimethylbenzylamine, triethylenediamine, triethanolamine, and 1,8-diaza-bicyclo(5,4,0)undecene-7 (DBU).
  • examples of the quaternary ammonium salt include tetrabutylammonium bromide and the like.
  • organic boron compounds examples include tetraphenylboron salts such as 2-ethyl-4-methylimidazole and tetraphenylborate, and tetra-substituted phosphonium and tetra-substituted borates such as tetraphenylphosphonium and ethyltriphenylborate.
  • the metal soap refers to a fatty acid metal salt, and may be a linear fatty acid metal salt or a cyclic fatty acid metal salt. Specific examples of the metal soap include linear aliphatic metal salts and cyclic aliphatic metal salts having 6 to 10 carbon atoms.
  • linear fatty acids such as stearic acid, lauric acid, ricinoleic acid, and octylic acid
  • cyclic fatty acids such as naphthenic acid
  • aliphatic metal salts consisting of metals.
  • zinc octylate and the like can be mentioned.
  • the curing accelerator may be used alone or in combination of two or more types.
  • the resin composition according to this embodiment may contain a silane coupling agent.
  • the silane coupling agent may be contained in the resin composition, or may be contained in the inorganic filler contained in the resin composition as a silane coupling agent that has been previously surface-treated.
  • the silane coupling agent is preferably contained as a silane coupling agent whose surface has been previously treated on the inorganic filler.
  • the resin composition also contains a silane coupling agent.
  • the prepreg may contain a silane coupling agent that has been previously surface-treated on the fibrous base material. Examples of the silane coupling agent include those similar to the silane coupling agents described above that are used when surface treating the inorganic filler.
  • the resin composition according to the present embodiment has a low dielectric constant and a low dielectric loss tangent, and is a resin composition from which a cured product with excellent adhesion to metal foil can be obtained.
  • the resin composition is used when manufacturing prepreg, as described below. Further, the resin composition is used when forming a resin layer included in a resin-coated metal foil and a resin-coated film, and an insulating layer included in a metal-clad laminate and a wiring board.
  • the method for producing the resin composition is not particularly limited, and for example, the imide compound (A), the radically polymerizable compound (B), and if necessary, the imide compound (A) and the radical polymerizable Examples include a method of mixing components other than the sexual compound (B) to a predetermined content.
  • the method described below may be used.
  • prepregs, metal-clad laminates, wiring boards, resin-coated metal foils, and resin-coated films can be obtained as follows.
  • FIG. 1 is a schematic cross-sectional view showing an example of a prepreg 1 according to an embodiment of the present invention.
  • the prepreg 1 includes the resin composition or a semi-cured product 2 of the resin composition, and a fibrous base material 3.
  • This prepreg 1 includes the resin composition or a semi-cured product 2 of the resin composition, and a fibrous base material 3 present in the resin composition or the semi-cured product 2 of the resin composition.
  • the semi-cured product is a state in which the resin composition is partially cured to the extent that it can be further cured. That is, the semi-cured product is a semi-cured (B-staged) resin composition.
  • the semi-cured product is a semi-cured (B-staged) resin composition.
  • semi-curing includes a state between when the viscosity begins to rise and before it is completely cured.
  • the resin composition 2 is often prepared in the form of a varnish and used in order to impregnate the fibrous base material 3, which is the base material for forming the prepreg. That is, the resin composition 2 is usually a resin varnish prepared in the form of a varnish.
  • a varnish-like resin composition (resin varnish) is prepared, for example, as follows.
  • the fibrous base material include glass cloth, aramid cloth, polyester cloth, glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, and linter paper.
  • the flattening process includes, for example, a method in which a glass cloth is continuously pressed with a press roll at an appropriate pressure to compress the yarn into a flat shape.
  • the thickness of the commonly used fibrous base material is, for example, 0.01 mm or more and 0.3 mm or less.
  • the glass fibers constituting the glass cloth are not particularly limited, but examples thereof include Q glass, NE glass, E glass, S glass, T glass, L glass, and L2 glass.
  • the surface of the fibrous base material may be surface-treated with a silane coupling agent.
  • the silane coupling agent is not particularly limited, but for example, a silane coupling agent having in its molecule at least one member selected from the group consisting of a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, an amino group, and an epoxy group. agents, etc.
  • the method for manufacturing the prepreg is not particularly limited as long as the prepreg can be manufactured. Specifically, when manufacturing the prepreg, the resin composition according to the present embodiment described above is often prepared in the form of a varnish and used as a resin varnish, as described above.
  • a method for manufacturing the prepreg 1 includes a method of impregnating the fibrous base material 3 with the resin composition 2, for example, the resin composition 2 prepared in the form of a varnish, and then drying the impregnated resin composition 2. .
  • the resin composition 2 is impregnated into the fibrous base material 3 by dipping, coating, or the like. It is also possible to repeat the impregnation multiple times if necessary. Further, at this time, by repeating impregnation using a plurality of resin compositions having different compositions and concentrations, it is possible to finally adjust the desired composition and impregnation amount.
  • the fibrous base material 3 impregnated with the resin composition (resin varnish) 2 is heated under desired heating conditions, for example, at 40° C. or higher and 180° C. or lower for 1 minute or more and 10 minutes or less.
  • desired heating conditions for example, at 40° C. or higher and 180° C. or lower for 1 minute or more and 10 minutes or less.
  • prepreg 1 in a pre-cured (A stage) or semi-cured state (B stage) is obtained.
  • the organic solvent can be volatilized from the resin varnish, and the organic solvent can be reduced or removed.
  • the resin composition according to the present embodiment has a low dielectric constant and a low dielectric loss tangent, and is a resin composition that becomes a cured product with excellent adhesion to metal foil. That is, when the resin composition is cured, it becomes a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Therefore, a prepreg comprising this resin composition or a semi-cured product of this resin composition is a prepreg that has a low dielectric constant and a low dielectric loss tangent, and provides a cured product that has excellent adhesion to metal foil.
  • the cured product of the prepreg preferably has a dielectric constant of less than 3 at a frequency of 10 GHz, more preferably 2.95 or less. Further, the cured product of the prepreg preferably has a dielectric loss tangent of less than 0.004 at a frequency of 10 GHz, more preferably 0.0038 or less.
  • the relative permittivity and dielectric loss tangent here are the relative permittivity and dielectric loss tangent of a cured prepreg at a frequency of 10 GHz, and for example, the ratio of the cured prepreg at a frequency of 10 GHz measured by the cavity resonator perturbation method. Examples include dielectric constant and dielectric loss tangent.
  • the cured product of the prepreg has a strength (copper foil peel strength) of more than 0.4 N/mm when the metal foil (copper foil) attached to the surface of the metal clad laminate including the cured product is peeled off. It is preferably 0.6 N/mm or more. Therefore, a prepreg comprising this resin composition or a semi-cured product of this resin composition is a prepreg that has a low dielectric constant and a low dielectric loss tangent, and provides a cured product that has excellent adhesion to metal foil. Therefore, this prepreg can suitably manufacture a wiring board including an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent and has excellent adhesion to metal foil.
  • FIG. 2 is a schematic cross-sectional view showing an example of the metal-clad laminate 11 according to the embodiment of the present invention.
  • the thickness of the metal foil 13 can be appropriately set depending on the desired purpose, and is preferably 0.2 to 70 ⁇ m, for example. Further, examples of the metal foil 13 include copper foil and aluminum foil, and when the metal foil is thin, it may be a carrier-attached copper foil provided with a release layer and a carrier to improve handling properties. Good too.
  • the conditions for heating and pressing can be appropriately set depending on the thickness of the metal-clad laminate 11, the type of resin composition contained in the prepreg 1, and the like.
  • the temperature can be 170 to 230°C
  • the pressure can be 2 to 4 MPa
  • the time can be 60 to 150 minutes.
  • the metal-clad laminate may be manufactured without using prepreg.
  • a method may be used in which a varnish-like resin composition is applied onto a metal foil, a layer containing the resin composition is formed on the metal foil, and then heated and pressed.
  • the resin composition according to the present embodiment has a low dielectric constant and a low dielectric loss tangent, and is a resin composition that becomes a cured product with excellent adhesion to metal foil. That is, when the resin composition is cured, it becomes a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Therefore, a metal-clad laminate including an insulating layer containing a cured product of this resin composition is provided with an insulating layer containing a cured product that has a low relative permittivity and dielectric loss tangent and has excellent adhesion to metal foil. It is a metal-clad laminate. This metal-clad laminate can suitably produce a wiring board including an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent and has excellent adhesion to metal foil.
  • FIG. 3 is a schematic cross-sectional view showing an example of the wiring board 21 according to the embodiment of the present invention.
  • the wiring board 21 includes an insulating layer 12 containing a cured product of the resin composition, and wiring 14 provided on the insulating layer 12.
  • the wiring board 21 is, for example, an insulating layer 12 used by curing the prepreg 1 shown in FIG. 1, and a wiring formed by laminating both the insulating layer 12 and partially removing the metal foil 13. 14, and the like.
  • the insulating layer 12 may be made of a cured product of the resin composition, or may be made of a cured product of the prepreg.
  • the method for manufacturing the wiring board 21 is not particularly limited as long as the wiring board 21 can be manufactured. Specifically, a method of producing the wiring board 21 using the prepreg 1 may be mentioned. In this method, for example, wiring is formed on the surface of the insulating layer 12 as a circuit by etching the metal foil 13 on the surface of the metal-clad laminate 11 produced as described above. Examples include a method of manufacturing the provided wiring board 21. That is, the wiring board 21 is obtained by partially removing the metal foil 13 on the surface of the metal-clad laminate 11 to form a circuit. In addition to the above-mentioned methods, methods for forming the circuit include, for example, semi-additive process (SAP) and modified semi-additive process (MSAP).
  • SAP semi-additive process
  • MSAP modified semi-additive process
  • the resin composition according to the present embodiment has a low dielectric constant and a low dielectric loss tangent, and is a resin composition that becomes a cured product with excellent adhesion to metal foil. That is, when the resin composition is cured, it becomes a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Therefore, a wiring board including an insulating layer containing a cured product of this resin composition is a wiring board including an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. It is.
  • the metal-clad laminate and the wiring board are provided with the insulating layer.
  • the insulating layer (the insulating layer provided on the metal-clad laminate and the insulating layer provided on the wiring board) is preferably an insulating layer as described below.
  • the dielectric constant of the insulating layer at a frequency of 10 GHz is preferably less than 3, more preferably 2.95 or less.
  • the dielectric loss tangent of the insulating layer at a frequency of 10 GHz is preferably less than 0.004, more preferably 0.0038 or less.
  • the relative permittivity and dielectric loss tangent are the relative permittivity and dielectric loss tangent of the insulating layer at a frequency of 10 GHz, and for example, the relative permittivity and dielectric constant of the insulating layer at a frequency of 10 GHz measured by the cavity resonator perturbation method. Examples include tangent.
  • the insulating layer preferably has a strength (copper foil peel strength) when peeling off a metal foil (copper foil) of more than 0.4 N/mm, and preferably has a strength of more than 0.6 N/mm. It is preferable that it is above.
  • the strength when peeling the wiring is preferably more than 0.4 N/mm, and preferably 0.6 N/mm or more.
  • FIG. 4 is a schematic cross-sectional view showing an example of the resin-coated metal foil 31 according to the present embodiment.
  • the resin-coated metal foil 31 includes a resin layer 32 containing the resin composition or a semi-cured product of the resin composition, and a metal foil 13.
  • This resin-coated metal foil 31 has a metal foil 13 on the surface of the resin layer 32. That is, this resin-coated metal foil 31 includes the resin layer 32 and the metal foil 13 laminated together with the resin layer 32. Further, the resin-coated metal foil 31 may include another layer between the resin layer 32 and the metal foil 13.
  • the resin layer 32 may include a semi-cured product of the resin composition as described above, or may include an uncured resin composition. That is, the resin-coated metal foil 31 may include a resin layer containing a semi-cured product of the resin composition (the B-stage resin composition) and a metal foil, or may include a resin layer containing the resin composition before curing.
  • the resin-coated metal foil may include a resin layer containing a composition (the A-stage resin composition) and a metal foil. Further, the resin layer only needs to contain the resin composition or a semi-cured product of the resin composition, and may or may not contain a fibrous base material. Further, the resin composition or the semi-cured product of the resin composition may be one obtained by drying or heating drying the resin composition. Further, as the fibrous base material, the same fibrous base material as the prepreg can be used.
  • metal foils used for metal-clad laminates and resin-coated metal foils can be used without limitation.
  • examples of the metal foil include copper foil and aluminum foil.
  • the resin-coated metal foil 31 may be provided with a cover film or the like, if necessary.
  • a cover film By providing a cover film, it is possible to prevent foreign matter from entering.
  • the cover film is not particularly limited, but includes, for example, a polyolefin film, a polyester film, a polymethylpentene film, and a film formed by providing a release agent layer on these films.
  • the method for manufacturing the resin-coated metal foil 31 is not particularly limited as long as the resin-coated metal foil 31 can be manufactured.
  • Examples of the method for manufacturing the resin-coated metal foil 31 include a method in which the varnish-like resin composition (resin varnish) is applied onto the metal foil 13 and heated.
  • the varnish-like resin composition is applied onto the metal foil 13 using, for example, a bar coater.
  • the applied resin composition is heated under conditions of, for example, 40° C. or more and 180° C. or less and 0.1 minutes or more and 10 minutes or less.
  • the heated resin composition is formed on the metal foil 13 as an uncured resin layer 32 .
  • the organic solvent can be volatilized from the resin varnish, and the organic solvent can be reduced or removed.
  • the resin composition according to the present embodiment has a low dielectric constant and a low dielectric loss tangent, and is a resin composition that becomes a cured product with excellent adhesion to metal foil. That is, when the resin composition is cured, it becomes a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Therefore, a resin-coated metal foil having a resin layer containing this resin composition or a semi-cured product of this resin composition is a cured product that has a low relative dielectric constant and a dielectric loss tangent, and has excellent adhesion to the metal foil. This is a resin-coated metal foil including a resin layer that provides an insulating layer containing .
  • This resin-coated metal foil can be used when manufacturing a wiring board that includes an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent and has excellent adhesion to the metal foil.
  • a multilayer wiring board can be manufactured by laminating it on a wiring board.
  • a wiring board obtained using such a resin-coated metal foil includes an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent and has excellent adhesion to the metal foil.
  • FIG. 5 is a schematic cross-sectional view showing an example of the resin-coated film 41 according to the present embodiment.
  • the resin-coated film 41 includes a resin layer 42 containing the resin composition or a semi-cured product of the resin composition, and a support film 43.
  • This resin-coated film 41 includes the resin layer 42 and a support film 43 laminated together with the resin layer 42. Further, the resin-coated film 41 may include another layer between the resin layer 42 and the support film 43.
  • the resin layer 42 may include a semi-cured product of the resin composition as described above, or may include an uncured resin composition. That is, the resin-coated film 41 may include a resin layer containing a semi-cured product of the resin composition (the B-stage resin composition) and a support film, or may include a support film containing the resin composition before curing.
  • the resin-coated film may include a resin layer containing a substance (the resin composition at A stage) and a support film. Further, the resin layer only needs to contain the resin composition or a semi-cured product of the resin composition, and may or may not contain a fibrous base material. Further, the resin composition or the semi-cured product of the resin composition may be one obtained by drying or heating drying the resin composition. Further, as the fibrous base material, the same fibrous base material as the prepreg can be used.
  • any support film used for resin-coated films can be used without limitation.
  • the support film include electrically insulating films such as polyester film, polyethylene terephthalate (PET) film, polyimide film, polyparabanic acid film, polyether ether ketone film, polyphenylene sulfide film, polyamide film, polycarbonate film, and polyarylate film. Examples include films.
  • the resin-coated film 41 may include a cover film or the like, if necessary. By providing a cover film, it is possible to prevent foreign matter from entering.
  • the cover film is not particularly limited, and examples thereof include polyolefin film, polyester film, and polymethylpentene film.
  • the support film and the cover film may be subjected to surface treatments such as matte treatment, corona treatment, mold release treatment, and roughening treatment, as necessary.
  • the resin composition according to this embodiment is a resin composition from which a cured product can be obtained that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. That is, when the resin composition is cured, it becomes a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Therefore, a resin-coated film including a resin layer containing this resin composition or a semi-cured product of this resin composition has a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil.
  • This is a resin-coated film including a resin layer from which an insulating layer containing the resin layer is obtained.
  • This resin-coated film can be suitably used in manufacturing a wiring board that includes an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent and has excellent adhesion to metal foil.
  • a multilayer wiring board can be manufactured by laminating it on a wiring board and then peeling off the support film, or by peeling off the support film and then laminating it on the wiring board.
  • a wiring board obtained using such a resin-coated film has an insulating layer containing a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. .
  • the resin composition according to the first aspect is a resin composition containing an imide compound (A) having a structure represented by the following formula (1) in the molecule and a radically polymerizable compound (B).
  • X 1 represents a tetravalent tetracarboxylic acid residue
  • X 2 represents a divalent aliphatic diamine residue
  • X 3 represents a divalent aromatic diamine residue.
  • X 4 and X 5 each independently represent a hydrocarbon group or an acid anhydride group, at least one of X 4 and X 5 represents an acid anhydride group
  • m represents 1 to 50
  • n represents 0 to 49
  • the sum of m and n represents 1 to 50.
  • the resin composition according to the second aspect is the resin composition according to the first aspect, in which the imide compound (A) has an acid value of 5 to 50 mgKOH/g.
  • the resin composition according to the third aspect is the resin composition according to the first or second aspect, wherein the imide compound (A) has a weight average molecular weight of 10,000 to 30,000. be.
  • the content of the imide compound (A) is equal to or less than the content of the imide compound (A) and the radically polymerizable
  • the resin composition contains 5 to 40 parts by weight based on a total of 100 parts by weight of compound (B).
  • the resin composition according to a fifth aspect is the resin composition according to any one of the first to fourth aspects, wherein the radically polymerizable compound (B) is a maleimide compound (B-1), an oxazine compound (B-1), or a maleimide compound (B-1). -2), and a compound (B-3) having a reactive carbon-carbon unsaturated group in the molecule.
  • the radically polymerizable compound (B) is a maleimide compound (B-1), an oxazine compound (B-1), or a maleimide compound (B-1). -2), and a compound (B-3) having a reactive carbon-carbon unsaturated group in the molecule.
  • the resin composition according to a sixth aspect is the resin composition according to the fifth aspect, in which the radically polymerizable compound (B) is composed of the maleimide compound (B-1) and the oxazine compound (B-2). It is a resin composition containing.
  • the resin composition according to a seventh aspect is the resin composition according to the fifth or sixth aspect, wherein the radically polymerizable compound (B) includes the maleimide compound (B-1), and the maleimide compound (B-1) contains the maleimide compound (B-1).
  • B-1) is a resin composition containing a maleimide compound (B-1-1) having a benzene ring in the molecule and having a maleimide equivalent of 500 g/mol or less.
  • the resin composition according to an eighth aspect is the resin composition according to any one of the fifth to seventh aspects, wherein the radically polymerizable compound (B) contains the maleimide compound (B-1), and the The content of the maleimide compound (B-1) is 30 to 70 parts by mass based on a total of 100 parts by mass of the imide compound (A), the maleimide compound (B-1), and the oxazine compound (B-2). It is a resin composition that is the radically polymerizable compound (B) contains the maleimide compound (B-1), and the The content of the maleimide compound (B-1) is 30 to 70 parts by mass based on a total of 100 parts by mass of the imide compound (A), the maleimide compound (B-1), and the oxazine compound (B-2). It is a resin composition that is
  • the resin composition according to a ninth aspect is the resin composition according to any one of the fifth to eighth aspects, wherein the radically polymerizable compound (B) contains the oxazine compound (B-2), and the The content of the oxazine compound (B-2) is 5 to 40 parts by mass based on a total of 100 parts by mass of the imide compound (A), the maleimide compound (B-1), and the oxazine compound (B-2). It is a resin composition that is
  • the resin composition according to the tenth aspect is the resin composition according to any one of the first to ninth aspects, which further contains an inorganic filler.
  • the prepreg according to the eleventh aspect is a prepreg comprising the resin composition according to any one of the first to tenth aspects or a semi-cured product of the resin composition, and a fibrous base material.
  • a resin-coated film according to a twelfth aspect is a resin-coated film comprising a resin layer containing the resin composition according to any one of the first to tenth aspects or a semi-cured product of the resin composition, and a support film. be.
  • a resin-coated metal foil according to a thirteenth aspect is a resin-coated metal comprising a resin layer containing the resin composition according to any one of the first to tenth aspects or a semi-cured product of the resin composition, and a metal foil. It's foil.
  • the metal-clad laminate according to the fourteenth aspect is a metal-clad laminate comprising an insulating layer containing a cured product of the resin composition according to any one of the first to tenth aspects, and metal foil.
  • the metal-clad laminate according to the fifteenth aspect is a metal-clad laminate comprising an insulating layer containing a cured product of the prepreg according to the eleventh aspect, and metal foil.
  • a wiring board according to a sixteenth aspect is a wiring board comprising an insulating layer containing a cured product of the resin composition according to any one of the first to tenth aspects, and wiring.
  • a wiring board according to a seventeenth aspect is a wiring board including an insulating layer containing a cured product of the prepreg according to the eleventh aspect, and wiring.
  • the present invention it is possible to provide a resin composition that yields a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Further, according to the present invention, it is possible to provide prepregs, resin-coated films, resin-coated metal foils, metal-clad laminates, and wiring boards obtained using the resin composition.
  • Maleimide compound A maleimide compound having an arylene structure oriented and bonded at the meta position in the molecule (maleimide compound represented by the above formula (4), MIR-5000-60T (maleimide compound) manufactured by Nippon Kayaku Co., Ltd. Solid content in toluene solution)
  • Benzoxazine compound a benzoxazine compound having an allyl group in the molecule (represented by the following formula (7), where X 6 is a methylene group, and q and r are 1, manufactured by Shikoku Kasei Kogyo Co., Ltd.) ALPd)
  • metal-clad laminate (copper foil-clad laminate) was obtained as follows.
  • a prepreg was produced by impregnating a fibrous base material (glass cloth: #1067NE type manufactured by Asahi Kasei Corporation) with the obtained varnish and then heating and drying it at 130° C. for 3 minutes. At that time, the content (resin content) of the components constituting the resin through the curing reaction in the prepreg was adjusted to the values (mass%) shown in Table 1, and the thickness after curing was 76 ⁇ m. Then, metal foil (copper foil: 18FL 1.5 manufactured by Mitsui Kinzoku Mining Co., Ltd., 1.5 ⁇ m thick copper foil with 18 ⁇ m thick carrier foil) was superimposed on both sides of the obtained prepreg. An evaluation substrate (metal-clad laminate) was obtained by heating to a temperature of 220° C. at a temperature rate of 6° C./min, and heating and pressing at 220° C. for 120 minutes at a pressure of 2 MPa.
  • the evaluation substrate metal-clad laminate prepared as described above was evaluated by the method shown below.
  • the copper foil was removed from the evaluation board (metal-clad laminate) by etching.
  • the substrate thus obtained was used as a test piece, and the dielectric constant and dielectric loss tangent at 10 GHz were measured by the cavity resonator perturbation method.
  • the dielectric constant (Dk) and dielectric loss tangent (Df) of the test piece at 10 GHz were measured using a network analyzer (N5230A manufactured by Keysight Technologies, Inc.). If the measured dielectric constant was less than 3, it was judged as "passing”. Moreover, if the dielectric loss tangent obtained by measurement was less than 0.004, it was judged as "passing”.
  • the carrier foil of the copper foil on the evaluation board was peeled off, and the copper foil was subjected to plating treatment (electrolytic plating treatment after electroless plating treatment) to make the thickness of the copper foil 35 ⁇ m.
  • the film was peeled off, and the peel strength at that time was measured in accordance with JIS C 6481 (1996).
  • the evaluation board in which the copper foil had a thickness of 35 ⁇ m by performing the plating process, was cut into a piece having a width of 10 mm and a length of 100 mm.
  • a resin composition that yields a cured product that has a low dielectric constant and a low dielectric loss tangent, and has excellent adhesion to metal foil. Further, according to the present invention, there are provided prepregs, resin-coated films, resin-coated metal foils, metal-clad laminates, and wiring boards obtained using the resin composition.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Un aspect de la présente invention concerne une composition de résine contenant : un composé imide (A) présentant, dans une molécule, une structure de formule (1) ; et un composé polymérisable par voie radicalaire (B). Dans la formule (1), X1 représente un résidu d'acide tétracarboxylique tétravalent, X2 représente un résidu de diamine aliphatique divalent, X3 représente un résidu de diamine aromatique divalent, X4 et X5 représentent chacun indépendamment un groupe hydrocarbure ou un groupe anhydride d'acide, au moins un des X4 et X5 représente un groupe anhydride d'acide, m représente un nombre compris entre 1 et 50, n représente un nombre compris entre 0 et 49, et la somme totale de m et n est un nombre compris entre 1 et 50.
PCT/JP2023/023669 2022-07-04 2023-06-26 Composition de résine, pré-imprégné, film comprenant de la résine, feuille métallique comprenant de la résine, stratifié à revêtement métallique, et tableau de connexions WO2024009831A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022107977 2022-07-04
JP2022-107977 2022-07-04

Publications (1)

Publication Number Publication Date
WO2024009831A1 true WO2024009831A1 (fr) 2024-01-11

Family

ID=89453403

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/023669 WO2024009831A1 (fr) 2022-07-04 2023-06-26 Composition de résine, pré-imprégné, film comprenant de la résine, feuille métallique comprenant de la résine, stratifié à revêtement métallique, et tableau de connexions

Country Status (1)

Country Link
WO (1) WO2024009831A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009068003A (ja) * 2007-08-20 2009-04-02 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着剤シート及びそれを用いた半導体装置
JP2010059387A (ja) * 2008-08-04 2010-03-18 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置
WO2020045408A1 (fr) * 2018-08-27 2020-03-05 積水化学工業株式会社 Matériau à base de résine, structure stratifiée et circuit imprimé multicouche
JP2020158705A (ja) * 2019-03-27 2020-10-01 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP2022054337A (ja) * 2020-09-25 2022-04-06 東洋インキＳｃホールディングス株式会社 熱硬化性組成物、熱硬化性シート、硬化物、硬化シートおよびプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009068003A (ja) * 2007-08-20 2009-04-02 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着剤シート及びそれを用いた半導体装置
JP2010059387A (ja) * 2008-08-04 2010-03-18 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置
WO2020045408A1 (fr) * 2018-08-27 2020-03-05 積水化学工業株式会社 Matériau à base de résine, structure stratifiée et circuit imprimé multicouche
JP2020158705A (ja) * 2019-03-27 2020-10-01 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP2022054337A (ja) * 2020-09-25 2022-04-06 東洋インキＳｃホールディングス株式会社 熱硬化性組成物、熱硬化性シート、硬化物、硬化シートおよびプリント配線板

Similar Documents

Publication Publication Date Title
US20240182614A1 (en) Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
US20230323000A1 (en) Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
KR20220024148A (ko) 수지 조성물, 프리프레그, 수지 부가 필름, 수지 부가 금속박, 금속 클래드 적층판, 및 배선판
US20230331957A1 (en) Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
US20230399511A1 (en) Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
WO2024009831A1 (fr) Composition de résine, pré-imprégné, film comprenant de la résine, feuille métallique comprenant de la résine, stratifié à revêtement métallique, et tableau de connexions
WO2022244725A1 (fr) Composition de résine, préimprégné utilisant ladite composition de résine, film pourvu de résine, feuille métallique pourvue de résine, panneau stratifié revêtu de métal et panneau de câblage
US20240190112A1 (en) Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
JPH0579686B2 (fr)
WO2023171215A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, stratifié revêtu de métal et carte de câblage
TW202311433A (zh) 樹脂組成物以及使用其之預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線基板
WO2024009830A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, stratifié revêtu de métal et carte de câblage
US20230323104A1 (en) Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
WO2024018945A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, stratifié revêtu de métal et carte de câblage
WO2024127869A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, stratifié revêtu de métal et carte de câblage
WO2024018946A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, stratifié revêtu de métal et carte de câblage
WO2022210227A1 (fr) Composition de résine, préimprégné, film revêtu de résine, feuille métallique revêtue de résine, stratifié à revêtement métallique et carte de câblage
WO2024043084A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, stratifié revêtu de métal et carte de câblage
WO2024043083A1 (fr) Composition de résine, préimprégné, film avec résine, feuille métallique avec résine, plaque stratifiée plaquée de métal et carte de câblage
TWI838030B (zh) 樹脂組合物及其製品
JP2024070465A (ja) 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
TWI839034B (zh) 樹脂組合物及其製品
WO2024009861A1 (fr) Stratifié recouvert de cuivre, carte nue et boîtier à semi-conducteurs
JP2024070466A (ja) 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2022202347A1 (fr) Composition de résine, préimprégné, film revêtu de résine, feuille métallique revêtue de résine, stratifié à revêtement métallique et carte de câblage

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23835364

Country of ref document: EP

Kind code of ref document: A1