WO2019119737A1 - 冷板的审查方法、系统、计算机可读存储介质及设备 - Google Patents

冷板的审查方法、系统、计算机可读存储介质及设备 Download PDF

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WO2019119737A1
WO2019119737A1 PCT/CN2018/090383 CN2018090383W WO2019119737A1 WO 2019119737 A1 WO2019119737 A1 WO 2019119737A1 CN 2018090383 W CN2018090383 W CN 2018090383W WO 2019119737 A1 WO2019119737 A1 WO 2019119737A1
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Prior art keywords
cold plate
review
vector information
circuit board
printed circuit
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PCT/CN2018/090383
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English (en)
French (fr)
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钱胜杰
刘久轩
瞿永建
刘丰收
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上海望友信息科技有限公司
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Publication of WO2019119737A1 publication Critical patent/WO2019119737A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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  • the invention belongs to the technical field of circuit board detection, and relates to a review method and system, in particular to a method, system and computer readable storage medium and device for reviewing a cold plate.
  • the process requirement is to install the cold plate first and then install the plug-in components.
  • the cold plate is a metal plate with uniform thickness, which needs to be fixed close to the PCB; the DIP plug body that needs heat dissipation is mounted close to the cold plate, which is equivalent to the DIP type plug-in component mounted on the cold strip. of.
  • the mounting position of the cold plate to the component will be hollowed out so that it can be installed normally, which is equivalent to the installation without the cold plate.
  • the existing method has two types of cold plate generation for the above DIP plug-in components:
  • the area is manually drawn by the designer according to the position of the component that needs to dissipate heat: if the component areas are hollowed out, which are metal plates, and which plug-in hole areas are to be hollowed out;
  • Cold plate graphics generated by the above two methods may bring problems in actual production, such as components and various pads on the PCB, which may cause collision, interference, and maintenance after actual assembly. Other issues. At present, these problems are detected in the industry by engineers comparing the cold plate map and the PCB board to check the problems that may cause problems, or when they are actually assembled. Such a review method is not only inefficient, but also has low accuracy, and many problems cannot be discovered by the above methods.
  • an object of the present invention is to provide a method, system, computer readable storage medium and device for reviewing a cold plate, which are used for solving the prior art by artificially comparing cold plate diagrams and PCB boards by engineers. Checking, resulting in inefficiency and low accuracy.
  • an aspect of the present invention provides a method for reviewing a cold plate, comprising: Step 1: extracting at least one object from design information of an input printed circuit board, and acquiring vector information of the cold plate Step 2: According to the pre-created review condition data structure, the correspondence between the object and the cold plate vector information is reviewed to generate a review level report.
  • the object includes a component, a hole, a pad, a solder resist, and/or a silk screen text; and the vector information of the cold plate includes a metal area of the cold plate and a pattern size of the hollowed out area.
  • the pre-created review condition data structure includes: a review name; a subtype of the review name; a description of the review item; whether the review is effective; and a correspondence between the object and the cold plate vector information The recommended value; the screening condition of the object in the design information of the printed circuit board; the screening condition of the vector information of the cold plate.
  • the correspondence between the object and the vector information of the cold plate includes a distance between the two, and a degree of collision between the two;
  • the second step includes: according to the design information of the printed circuit board Filtering conditions of the object and filtering conditions of the cold plate vector information, screening out the vector information of the object and the cold plate in the design information of the printed circuit board; measuring the vector information of the object and the cold plate in the design information of the printed circuit board The distance between the two or the two covers the degree of collision; the measurement result between the object in the design information of the printed circuit board and the vector information of the cold plate is obtained.
  • the step 2 further includes: determining, according to the measurement result, a level report result screening value that matches the measurement result; the level report result screening value is used to indicate that the measurement result is unacceptable, warning or Acceptable.
  • the step of generating the review level report includes: the description of the review item, the object in the selected design information of the printed circuit board, the measurement result, and the correspondence between the object and the vector information of the cold plate.
  • the recommended value is edited into the report result.
  • the method for reviewing the cold plate further includes performing step 2 cyclically until the correspondence between the vector information of all objects and the cold plate is reviewed.
  • a cold plate review system including: an extraction module, configured to extract at least one object from design information of an input printed circuit board; and an acquisition module for acquiring vector information of the cold plate; And a module, configured to review, according to the pre-created review condition data structure, a correspondence between the object and the cold plate vector information to generate a review level report.
  • Yet another aspect of the present invention provides a computer readable storage medium having stored thereon a computer program that, when executed by a processor, implements the method of reviewing the cold plate.
  • a final aspect of the present invention provides an apparatus comprising: a processor and a memory; the memory for storing a computer program, the processor for executing the computer program of the memory storage, to cause the device to perform the cold plate Method of review.
  • the cold plate review method, system, computer readable storage medium and device of the present invention have the following beneficial effects:
  • the method, system, computer readable storage medium and equipment for reviewing the cold plate of the invention can shorten the time of manually checking the cold plate from the original one to three hours to several minutes, thereby avoiding the omission of manual inspection and improving The accuracy of the inspection; and the original manual sampling inspection into an all-in-one automatic inspection, so that engineers can find out the problems that may occur after the cold plate is installed on the PCB; help the electronics company improve manufacturing quality and efficiency, reduce production cost.
  • FIG. 1A is a flow chart showing the method for reviewing the cold plate of the present invention in an embodiment.
  • Fig. 1B is a flow chart showing the flow of S13 in the method for reviewing the cold plate of the present invention.
  • FIG. 2 is a schematic view showing an object of a PCB pattern of the present invention.
  • Figure 3 shows a top view of the cold plate installation of the present invention.
  • FIG. 4 is a schematic view showing the principle structure of the cold plate review system of the present invention in an embodiment.
  • This embodiment provides a method for reviewing a cold plate, including:
  • the correspondence between the object and the cold plate vector information is reviewed to generate a review level report.
  • FIG. 1A a schematic diagram of a process for reviewing a cold plate in an embodiment is shown. As shown in FIG. 1A, the method for reviewing the cold plate specifically includes the following steps:
  • the object includes components, holes, pads, solder masks, and/or silk screen characters, and the like, as shown in FIG.
  • the vector information of the cold plate includes a metal area of the cold plate and a pattern size of the hollowed out area.
  • determining the size of the pin of each of the heat dissipating components included, and the size of the component that does not require heat dissipation, and obtaining the size information based on the predetermined enlargement rule Corresponding amplification is performed to generate vector information corresponding to the cold plate based on the enlarged size information.
  • the hollowed out area required to generate the cold plate is determined.
  • the pre-created review condition data structure includes:
  • the first level reports the result screening value
  • the second level reports the result screening value
  • the tag ends.
  • the correspondence between the object and the vector information of the cold plate includes the distance between the two, and the degree of collision between the two.
  • the distance from the component to the cold plate, the distance from the hole to the cold plate, the distance from the pad to the cold plate, the distance from the solder to the cold plate, the distance from the silk screen to the cold plate, and the cold plate cover contains the colliding silk screen.
  • the degree of text, the extent to which the cold plate covers the bumper pad, the extent to which the cold plate covers the bumper hole, the extent to which the cold plate covers the component, and the length of the PCB after the DIP plug-in is attached (PCB thickness + cold plate)
  • the thickness is only applicable to the DIP plug-in installed on the cold plate body, the height of the relevant DIP plug-in after installation (component height + cold plate thickness).
  • FIG. 1B is shown as a flow chart of S13.
  • the S13 includes the following steps:
  • S134 Determine, according to the measurement result, a level report result screening value that matches the measurement result; the level report result screening value is used to indicate that the measurement result is unacceptable, warning or acceptable.
  • the first level report result screening value indicates that the measurement result is unacceptable
  • the second level report result screening value indicates the measurement result warning
  • the third level report result screening value indicates that the measurement result is acceptable.
  • CON2 LAYER_TYPE ⁇ COOLINGPLATE ⁇ ,FEATURE ⁇ Pad,Polygon ⁇
  • CompToFeature_Difflayer is the review name
  • Subcategory CompToCool is a subcategory of the review name
  • CheckItem is a description of the review project
  • CON1 LAYER_TYPE ⁇ component ⁇
  • the LAYER_TYPE ⁇ component ⁇ in comptype ⁇ represents all components of the component layer
  • the comptype ⁇ indicates that the type is not limited.
  • LAYER_TYPE ⁇ component ⁇ , comptype ⁇ means to filter out all components on the PCB.
  • CON2 LAYER_TYPE ⁇ COOLINGPLATE ⁇ , FEATURE ⁇ Pad, Polygon ⁇ .
  • LAYER_TYPE ⁇ COOLINGPLATE ⁇ represents the cold plate layer
  • FEATURE ⁇ Pad, Polygon ⁇ represents all the pads and polygon objects.
  • the above object names can be defined by themselves, which is convenient for flexible screening in the future.
  • Figure 3 shows a top view of the cold plate installation.
  • the objects selected by CON1 and CON2 calculate the distance between the component U1 and the cold plate.
  • the distance from the component to the cold plate metal is 0.8mm.
  • U1 is a DIP plugin.
  • CON2 LAYER_TYPE ⁇ COOLINGPLATE ⁇ ,FEATURE ⁇ Pad,Polygon ⁇
  • S14, S13 is executed cyclically until the correspondence between the vector information of all the objects and the cold plate is examined.
  • the embodiment further provides a computer readable storage medium having stored thereon a computer program, the program being implemented by the processor to implement the cold board review method.
  • a computer program can be stored in a computer readable storage medium.
  • the program when executed, performs the steps including the foregoing method embodiments; and the foregoing storage medium includes various media that can store program codes, such as a ROM, a RAM, a magnetic disk, or an optical disk.
  • the method for reviewing the cold plate according to the embodiment and the computer readable storage medium for realizing the method for reviewing the cold plate can shorten the time for manually checking the cold plate from the original one to three hours to several minutes, thereby avoiding The omission of manual inspection improves the accuracy of inspection; and the original manual inspection becomes an all-in-one automatic inspection, so that engineers can find out the problems that may occur after the cold plate is installed on the PCB; Quality and efficiency, reducing production costs.
  • This embodiment provides a cold plate review system, including:
  • An extraction module configured to extract at least one object from design information of the input printed circuit board
  • the review module is configured to review the correspondence between the object and the cold plate vector information according to the pre-created review condition data structure to generate a review level report.
  • each module of the above review system is only a division of logic functions, and the actual implementation may be integrated into one physical entity in whole or in part, or may be physically separated.
  • these modules can all be implemented by software in the form of processing component calls; or all of them can be implemented in hardware form; some modules can be realized by processing component calling software, and some modules are realized by hardware.
  • the x module may be a separately set processing element, or may be integrated in one of the above-mentioned devices, or may be stored in the memory of the above device in the form of program code, by a processing element of the above device. Call and execute the functions of the above x modules.
  • each step of the above method or each of the above modules may be completed by an integrated logic circuit of hardware in the processor element or an instruction in a form of software.
  • the above modules may be one or more integrated circuits configured to implement the above method, for example, one or more specific integrated circuits (ASICs), or one or more microprocessors (digitalsingnal processors, referred to as DSP), or one or more Field Programmable Gate Arrays (FPGAs).
  • ASICs application specific integrated circuits
  • DSP digital signal processors
  • FPGAs Field Programmable Gate Arrays
  • the processing component may be a general-purpose processor, such as a central processing unit (CPU) or other processor that can call the program code.
  • these modules can be integrated and implemented in the form of a system-on-a-chip (SOC).
  • SOC system-on-a-chip
  • the cold plate review system 4 includes an extraction module 41, an acquisition module 42, an review module 43, and a loop module 44.
  • the extraction module 41 is configured to extract at least one object from the design information of the input printed circuit board.
  • the object includes components, holes, pads, solder masks, and/or silk screen characters, and the like, as shown in FIG.
  • the acquisition module 42 coupled to the extraction module 41 is configured to acquire vector information of the cold plate.
  • the vector information of the cold plate includes a metal area of the cold plate and a pattern size of the hollowed out area.
  • the obtaining module 42 determines, according to design information of the printed circuit board, various pin sizes of the heat dissipating components included, and component sizes such as component sizes that do not need to be dissipated, and obtains the size information. And performing corresponding amplification based on the predetermined enlargement rule to generate vector information corresponding to the cold plate based on the enlarged size information.
  • the acquisition module 42 determines the hollowed out area required to generate the cold plate based on the enlarged size information.
  • the review module 43 coupled to the extraction module 41 and the acquisition module 42 is configured to review the correspondence between the object and the cold plate vector information according to the pre-created review condition data structure to generate a review level report.
  • the pre-created review condition data structure includes:
  • the first level reports the result screening value
  • the second level reports the result screening value
  • the tag ends.
  • the correspondence between the object and the vector information of the cold plate includes the distance between the two, and the degree of collision between the two.
  • the distance from the component to the cold plate, the distance from the hole to the cold plate, the distance from the pad to the cold plate, the distance from the solder to the cold plate, the distance from the silk screen to the cold plate, and the cold plate cover contains the colliding silk screen.
  • the degree of text, the extent to which the cold plate covers the bumper pad, the extent to which the cold plate covers the bumper hole, the extent to which the cold plate covers the component, and the length of the PCB after the DIP plug-in is attached (PCB thickness + cold plate)
  • the thickness is only applicable to the DIP plug-in installed on the cold plate body, the height of the relevant DIP plug-in after installation (component height + cold plate thickness).
  • the review module 43 is specifically configured to filter the vector information of the object and the cold plate in the design information of the printed circuit board according to the screening condition of the object in the design information of the printed circuit board and the screening condition of the vector information of the cold plate; The distance between the object in the design information of the printed circuit board and the vector information of the cold plate or the degree of collision between the two; the measurement between the object in the design information of the printed circuit board and the vector information of the cold plate a result; a ranking report result screening value matching the measurement result is determined according to the measurement result; the level report result screening value is used to indicate that the measurement result is unacceptable, warning or acceptable.
  • the first level report result screening value indicates that the measurement result is unacceptable
  • the second level report result screening value indicates the measurement result warning
  • the third level report result screening value indicates that the measurement result is acceptable
  • the loop module 44 coupled to the review module 43 is used to loop through the review module 43 until the correspondence of all objects to the vector information of the cold plate is reviewed.
  • the embodiment provides an apparatus, including: a processor, a memory, a transceiver, a communication interface, and a system bus; the memory and the communication interface are connected to the processor and the transceiver through the system bus, and complete communication with each other, and the memory is used to store the computer.
  • the program, communication interface is used to communicate with other devices, and the processor and transceiver are used to run a computer program to cause the x device to perform various steps of the cold plate review method as described in the first embodiment.
  • the system bus mentioned above may be a Peripheral Pomponent Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus.
  • PCI Peripheral Pomponent Interconnect
  • EISA Extended Industry Standard Architecture
  • the system bus can be divided into an address bus, a data bus, a control bus, and the like. For ease of representation, only one thick line is shown in the figure, but it does not mean that there is only one bus or one type of bus.
  • the communication interface is used to implement communication between the database access device and other devices such as clients, read-write libraries, and read-only libraries.
  • the memory may include random access memory (RAM), and may also include non-volatile memory, such as at least one disk storage.
  • the above processor may be a general-purpose processor, including a central processing unit (CPU), a network processor (Network Processor, NP for short), and the like; or a digital signal processor (DSP), an application specific integrated circuit (DSP). ApplicationSpecificIntegratedCircuit (ASIC), Field-Programmable Gate Array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
  • CPU central processing unit
  • NP Network Processor
  • DSP digital signal processor
  • DSP application specific integrated circuit
  • ASIC ApplicationSpecificIntegratedCircuit
  • FPGA Field-Programmable Gate Array
  • the method, system, and computer readable storage medium and device for reviewing the cold plate of the present invention can shorten the time for manually checking the cold plate from the original one to three hours to several minutes, thereby avoiding the manual.
  • the omission of the inspection improves the accuracy of the inspection; and the original manual sampling inspection becomes an all-in-one automatic inspection, so that the engineer can find out the problems that may occur after the cold plate is installed on the PCB; it helps the electronic enterprise to improve the manufacturing quality. And efficiency, reduce production costs. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

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Abstract

一种冷板的审查方法、系统（4）、计算机可读存储介质及设备，包括：步骤一，从已输入的印刷电路板的设计信息中提取至少一对象(S11)，并获取冷板的矢量信息(S12)；步骤二，根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告(S13)。该冷板的审查方法、系统、计算机可读存储介质及设备可以将现有通过人工检查冷板的时间由原来的1到3小时缩短至几分钟，避免了人工检查的遗漏，提高了检查的精度；且将原有的人工抽检变成全面无遗漏的自动检查，从而使工程师及时发现冷板安装到PCB后可能造成的问题；有助于电子企业提升制造品质及效率、降低生产成本。

Description

冷板的审查方法、系统、计算机可读存储介质及设备 技术领域
本发明属于电路板检测技术领域，涉及一种审查方法和系统，特别是涉及一种冷板的审查方法、系统、计算机可读存储介质及设备。
背景技术
电子行业的设计人员在设计PCB线路板时为了元件散热通常会设计一个冷板，其主要用于元件散热，以及支撑PCBA和增加强度的目的。目前行业内有面向DIP插件元件设计的冷板，和面向SMD表贴元件设计的冷板。
针对DIP插件元件设计的冷板，工艺要求是先安装冷板，再安装插件元件。而该冷板是一块整体厚度一致的金属板，其需要紧贴PCB板固定；对需要散热的DIP插件本体下面紧贴冷板安装，相当于DIP类的插件元件是骑在冷板条上安装的。对于无需散热的插件元件，例如插件电容，连接器等等，冷板对元件的安装位置会挖空，让其可以正常安装，相当于同没有冷板的安装是一样的。
现有方法针对以上DIP插件元件的冷板生成有两种：
1、由设计人员根据需要进行散热的元件位置手工进行区域绘制：如哪些元件区域挖空，哪些地方是金属板，哪些插件孔区域要挖空；
2、通过软件自动生成冷板图形。
对于以上两种方法产生的冷板图形都可能会带来实际生产中的问题，比如PCB板上有元器件和各种焊盘等，这些都有可能会在实际组装后造成碰撞、干涉、维修等方面的问题。而目前这些问题行业内是通过工程师人工对比冷板图与PCB板来检查可能造成问题的地方，或者在实际组装时才能发现。这样的审查方法不但效率低下、准确率低，而且还有很多问题通过上述方法无法被发现。
因此，如何提供一种冷板的审查方法、系统、计算机可读存储介质及设备，以解决现有技术通过工程师人工对比冷板图与PCB板进行检查，造成的效率低下，准确率低等种种缺陷，实已成为本领域技术人员亟待解决的技术问题。
发明内容
鉴于以上所述现有技术的缺点，本发明的目的在于提供一种冷板的审查方法、系统、计算机可读存储介质及设备，用于解决现有技术通过工程师人工对比冷板图与PCB板进行检查， 造成的效率低下，准确率低的问题。
为实现上述目的及其他相关目的，本发明一方面提供一种冷板的审查方法，包括：步骤一，从已输入的印刷电路板的设计信息中提取至少一对象，并获取冷板的矢量信息；步骤二，根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
于本发明的一实施例中，所述对象包括元器件、孔、焊盘、阻焊和/或丝印文字；所述冷板的矢量信息包括冷板的金属区域和挖空区域图形尺寸。
于本发明的一实施例中，所述预创建的审查条件数据结构包括：审查名；审查名的子类型；审查项目的说明；此项审查是否生效；对象与冷板的矢量信息的对应关系的推荐值；印刷电路板的设计信息中的对象的筛选条件；冷板的矢量信息的筛选条件。
于本发明的一实施例中，所述对象与冷板的矢量信息的对应关系包括两者间距离、两者间覆盖含碰撞的程度；所述步骤二包括：根据印刷电路板的设计信息中的对象的筛选条件和冷板的矢量信息的筛选条件，筛选出印刷电路板的设计信息中的对象和冷板的矢量信息；测量印刷电路板的设计信息中的对象和冷板的矢量信息两者间距离或两者间覆盖含碰撞的程度；获取印刷电路板的设计信息中的对象和冷板的矢量信息两者间的测量结果。
于本发明的一实施例中，所述步骤二还包括：根据测量结果，确定与该测量结果匹配的等级报告结果筛选值；所述等级报告结果筛选值用于表示测量结果不可接受，警告或可接受。
于本发明的一实施例中，生成审查等级报告的步骤包括：将审查项目的说明、筛选出的印刷电路板的设计信息中的对象、测量结果及对象与冷板的矢量信息的对应关系的推荐值编辑成报告结果。
于本发明的一实施例中，所述冷板的审查方法还包括循环执行步骤二，直至审查完所有对象与冷板的矢量信息的对应关系。
本发明另一方面提供一种冷板的审查系统，包括：提取模块，用于从已输入的印刷电路板的设计信息中提取至少一对象；获取模块，用于获取冷板的矢量信息；审查模块，用于根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
本发明又一方面提供一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现所述冷板的审查方法。
本发明最后一方面提供一种设备，包括：处理器及存储器；所述存储器用于存储计算机程序，所述处理器用于执行所述存储器存储的计算机程序，以使所述设备执行所述冷板的审 查方法。
如上所述，本发明的冷板的审查方法、系统、计算机可读存储介质及设备，具有以下有益效果：
本发明所述冷板的审查方法、系统、计算机可读存储介质及设备可以将现有通过人工检查冷板的时间由原来的1到3小时缩短至几分钟，避免了人工检查的遗漏，提高了检查的精度；且将原有的人工抽检变成全面无遗漏的自动检查，从而使工程师及时发现冷板安装到PCB后可能造成的问题；有助于电子企业提升制造品质及效率、降低生产成本。
附图说明
图1A显示为本发明的冷板的审查方法于一实施例中的流程示意图。
图1B显示为本发明的冷板的审查方法中S13的流程示意图。
图2显示为本发明的PCB图形的对象示意图。
图3显示为本发明的冷板安装俯视图。
图4显示为本发明的冷板的审查系统于一实施例中的原理结构示意图。
元件标号说明
4          冷板的审查系统
41         提取模块
42         获取模块
43         审查模块
44         循环模块
S11～S14   步骤
S131～135  步骤
具体实施方式
以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。本发明还可以通过另外不同的具体实施方式加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本发明的精神下进行各种修饰或改变。需说明的是，在不冲突的情况下，以下实施例及实施例中的特征可以相互组合。
需要说明的是，以下实施例中所提供的图示仅以示意方式说明本发明的基本构想，遂图 式中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
实施例一
本实施例提供一种冷板的审查方法，包括：
从已输入的印刷电路板的设计信息中提取至少一对象，并获取冷板的矢量信息；
根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
以下将结合图示对本实施例所提供的冷板的审查方法进行详细描述。请参阅图1A，显示为冷板的审查方法于一实施例中的流程示意图。如图1A所示，所述冷板的审查方法具体包括以下步骤：
S11，从已输入的印刷电路板的设计信息中提取至少一对象。在本实施例中，所述对象包括元器件、孔、焊盘、阻焊和/或丝印文字等等，如图2所示PCB图形的对象示意图。
S12，获取冷板的矢量信息。在本实施例中，所述冷板的矢量信息包括冷板的金属区域和挖空区域图形尺寸。
具体地，基于所述印刷电路板的设计信息，确定所包含的各个散热元件的引脚尺寸，以及不需散热的元件尺寸等各项尺寸信息，并对所获得的尺寸信息，基于预定放大规则进行相应的放大，以基于放大后的各项尺寸信息来生成与冷板对应的矢量信息。
例如，基于该放大后的各项尺寸信息，确定生成冷板需要的挖空区域。
S13，根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
在本实施例中，所述预创建的审查条件数据结构包括：
审查名；
标记开始；
审查名的子类型；
审查项目的说明；
此项审查是否生效；
对象与冷板的矢量信息的对应关系的推荐值；
印刷电路板的设计信息中的对象的筛选条件；
冷板的矢量信息的筛选条件；
第一等级报告结果筛选值；
第二等级报告结果筛选值；
第三等级报告结果筛选值；
输出审查等级报告；
标记结束。
在本实施例中，所述对象与冷板的矢量信息的对应关系包括两者间距离、两者间覆盖含碰撞的程度。
例如，元器件到冷板的距离，孔到冷板的距离，焊盘到冷板的距离，阻焊开窗到冷板的距离，丝印文字到冷板的距离，冷板覆盖含包含碰撞丝印文字的程度，冷板覆盖包含碰撞焊盘的程度，冷板覆盖包含碰撞孔的程度，冷板覆盖包含元器件的程度，相关DIP插件安装后的引脚伸出PCB长度(PCB厚度+冷板厚度，仅适用于安装在冷板实体上的DIP插件)，相关DIP插件安装后的高度(元器件高度+冷板厚度)等。
请参阅图1B，显示为S13的流程示意图。如图1B所示，所述S13包括以下步骤：
S131，根据印刷电路板的设计信息中的对象的筛选条件和冷板的矢量信息的筛选条件，筛选出印刷电路板的设计信息中的对象和冷板的矢量信息。
S132，测量印刷电路板的设计信息中的对象和冷板的矢量信息两者间距离或两者间覆盖含碰撞的程度。
S133，获取印刷电路板的设计信息中的对象和冷板的矢量信息两者间的测量结果。
S134，根据测量结果，确定与该测量结果匹配的等级报告结果筛选值；所述等级报告结果筛选值用于表示测量结果不可接受，警告或可接受。在本实施例中，第一等级报告结果筛选值表示测量结果不可接受，第二等级报告结果筛选值表示测量结果警告，第三等级报告结果筛选值表示测量结果可接受。
S135，将审查项目的说明、筛选出的印刷电路板的设计信息中的对象、测量结果及对象与冷板的矢量信息的对应关系的推荐值编辑成报告结果。
以下以元器件到冷板距离的审查为例的预创建的审查条件数据结构：
[CompToFeature_Difflayer]
:STR
Subcategory＝CompToCool
CheckItem＝检查元件到冷板距离
Check＝True
RECValue＝<1.0mm(40mil)
CON1＝LAYER_TYPE{component},comptype{}
CON2＝LAYER_TYPE{COOLINGPLATE},FEATURE{Pad,Polygon}
COL1＝(0～1.0)
COL2＝
COL3＝
OUT1＝COMPTYPE{DIP,Fiducial,TP}
:END。
CompToFeature_Difflayer为审查名；
:STR为标记开始；
Subcategory＝CompToCool为审查名的子类别；
CheckItem为审查项目的说明；
Check为True说明需要检查，为False说明可以直接跳过此项的审查。
CON1＝LAYER_TYPE{component},comptype{}中LAYER_TYPE{component}表示元器件层所有元器件，comptype{}表示类型不限定。LAYER_TYPE{component},comptype{}表示筛选出PCB上所有元器件。
CON2＝LAYER_TYPE{COOLINGPLATE},FEATURE{Pad,Polygon}。LAYER_TYPE{COOLINGPLATE}表示冷板层，FEATURE{Pad，Polygon}表示所有焊盘和多边形的对象。以上对象名可以自行定义好，方便以后灵活筛选。
请参阅图3，显示为冷板安装俯视图。如图3所示，将CON1和CON2筛选出来的对象计算元器件U1到冷板间的距离。比如元器件到冷板金属距离D为0.8mm。
元器件到冷板金属距离D为0.8mm属于第一等级报告结果筛选值COL1＝(0～1.0)。
在本实施例中，报告条件再次要求OUT1＝COMPTYPE{DIP,Fiducial,TP}：包含插件，光学点，测试点的需要报告输出。U1为DIP插件。
将CheckItem＝检查元件到冷板距离，元件＝U1，测量结果＝0.8，推荐值＝<1.0mm(40mil)编辑成报告结果。
以下以冷板覆盖含碰撞焊盘的审查为例的预创建的审查条件数据结构：
[FeatureTouchFeature]
:STR
Subcategory＝CoolCoverFootprint
CheckItem＝冷板覆盖焊盘
Check＝True
RECValue＝<1.0mm(40mil)
CON1＝LAYER_TYPE{pads},FEATURE{pad},usage{pin}
CON2＝LAYER_TYPE{COOLINGPLATE},FEATURE{Pad,Polygon}
COL1＝True
COL2＝
COL3＝
OUT1＝
:END
S14，循环执行S13，直至审查完所有对象与冷板的矢量信息的对应关系。
本实施例还提供一种计算机可读存储介质，其上存储有计算机程序，该程序被处理器执行时实现所述冷板的审查方法。本领域普通技术人员可以理解：实现上述各方法实施例的全部或部分步骤可以通过计算机程序相关的硬件来完成。前述的计算机程序可以存储于一计算机可读存储介质中。该程序在执行时，执行包括上述各方法实施例的步骤；而前述的存储介质包括：ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质。
本实施例所述冷板的审查方法及实现所述冷板的审查方法的计算机可读存储介质可以将现有通过人工检查冷板的时间由原来的1到3小时缩短至几分钟，避免了人工检查的遗漏，提高了检查的精度；且将原有的人工抽检变成全面无遗漏的自动检查，从而使工程师及时发现冷板安装到PCB后可能造成的问题；有助于电子企业提升制造品质及效率、降低生产成本。
实施例二
本实施例提供一种冷板的审查系统，包括：
提取模块，用于从已输入的印刷电路板的设计信息中提取至少一对象；
获取模块，用于获取冷板的矢量信息；
审查模块，用于根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
以下将结合图示对本实施例所提供的冷板的审查系统进行详细描述。需要说明的是，应理解以上审查系统的各个模块的划分仅仅是一种逻辑功能的划分，实际实现时可以全部或部分集成到一个物理实体上，也可以物理上分开。且这些模块可以全部以软件通过处理元件调用的形式实现；也可以全部以硬件的形式实现；还可以部分模块通过处理元件调用软件的形式实现，部分模块通过硬件的形式实现。例如，x模块可以为单独设立的处理元件，也可以集成在上述装置的某一个芯片中实现，此外，也可以以程序代码的形式存储于上述装置的存储器中，由上述装置的某一个处理元件调用并执行以上x模块的功能。其它模块的实现与之类似。此外这些模块全部或部分可以集成在一起，也可以独立实现。这里所述的处理元件可 以是一种集成电路，具有信号的处理能力。在实现过程中，上述方法的各步骤或以上各个模块可以通过处理器元件中的硬件的集成逻辑电路或者软件形式的指令完成。
例如，以上这些模块可以是被配置成实施以上方法的一个或多个集成电路，例如：一个或多个特定集成电路(ApplicationSpecificIntegratedCircuit，简称ASIC)，或，一个或多个微处理器(digitalsingnalprocessor，简称DSP)，或，一个或者多个现场可编程门阵列(FieldProgrammableGateArray，简称FPGA)等。再如，当以上某个模块通过处理元件调用程序代码的形式实现时，该处理元件可以是通用处理器，例如中央处理器(CentralProcessingUnit，简称CPU)或其它可以调用程序代码的处理器。再如，这些模块可以集成在一起，以片上系统(system-on-a-chip，简称SOC)的形式实现。
请参阅图4，显示为冷板的审查系统于一实施例中的原理结构示意图。如图4所示，所述冷板的审查系统4包括：提取模块41、获取模块42、审查模块43及循环模块44。
所述提取模块41用于从已输入的印刷电路板的设计信息中提取至少一对象。在本实施例中，所述对象包括元器件、孔、焊盘、阻焊和/或丝印文字等等，如图2所示PCB图形的对象示意图。
与所述提取模块41耦合的获取模块42用于获取冷板的矢量信息。在本实施例中，所述冷板的矢量信息包括冷板的金属区域和挖空区域图形尺寸。
具体地，所述获取模块42基于所述印刷电路板的设计信息，确定所包含的各个散热元件的引脚尺寸，以及不需散热的元件尺寸等各项尺寸信息，并对所获得的尺寸信息，基于预定放大规则进行相应的放大，以基于放大后的各项尺寸信息来生成与冷板对应的矢量信息。
例如，所述获取模块42基于该放大后的各项尺寸信息，确定生成冷板需要的挖空区域。
与所述提取模块41和获取模块42耦合的审查模块43用于根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
在本实施例中，所述预创建的审查条件数据结构包括：
审查名；
标记开始；
审查名的子类型；
审查项目的说明；
此项审查是否生效；
对象与冷板的矢量信息的对应关系的推荐值；
印刷电路板的设计信息中的对象的筛选条件；
冷板的矢量信息的筛选条件；
第一等级报告结果筛选值；
第二等级报告结果筛选值；
第三等级报告结果筛选值；
输出审查等级报告；
标记结束。
在本实施例中，所述对象与冷板的矢量信息的对应关系包括两者间距离、两者间覆盖含碰撞的程度。
例如，元器件到冷板的距离，孔到冷板的距离，焊盘到冷板的距离，阻焊开窗到冷板的距离，丝印文字到冷板的距离，冷板覆盖含包含碰撞丝印文字的程度，冷板覆盖包含碰撞焊盘的程度，冷板覆盖包含碰撞孔的程度，冷板覆盖包含元器件的程度，相关DIP插件安装后的引脚伸出PCB长度(PCB厚度+冷板厚度，仅适用于安装在冷板实体上的DIP插件)，相关DIP插件安装后的高度(元器件高度+冷板厚度)等。
所述审查模块43具体用于根据印刷电路板的设计信息中的对象的筛选条件和冷板的矢量信息的筛选条件，筛选出印刷电路板的设计信息中的对象和冷板的矢量信息；测量印刷电路板的设计信息中的对象和冷板的矢量信息两者间距离或两者间覆盖含碰撞的程度；获取印刷电路板的设计信息中的对象和冷板的矢量信息两者间的测量结果；根据测量结果，确定与该测量结果匹配的等级报告结果筛选值；所述等级报告结果筛选值用于表示测量结果不可接受，警告或可接受。在本实施例中，第一等级报告结果筛选值表示测量结果不可接受，第二等级报告结果筛选值表示测量结果警告，第三等级报告结果筛选值表示测量结果可接受；将审查项目的说明、筛选出的印刷电路板的设计信息中的对象、测量结果及对象与冷板的矢量信息的对应关系的推荐值编辑成报告结果。
与所述审查模块43耦合的循环模块44用于循环调用审查模块43，直至审查完所有对象与冷板的矢量信息的对应关系。
实施例三
本实施例提供一种设备，包括：处理器、存储器、收发器、通信接口和系统总线；存储器和通信接口通过系统总线与处理器和收发器连接并完成相互间的通信，存储器用于存储计算机程序，通信接口用于和其他设备进行通信，处理器和收发器用于运行计算机程序，使x装置执行如实施例一所述冷板的审查方法的各个步骤。
上述提到的系统总线可以是外设部件互连标准(PeripheralPomponentInterconnect，简称 PCI)总线或扩展工业标准结构(ExtendedIndustryStandardArchitecture，简称EISA)总线等。该系统总线可以分为地址总线、数据总线、控制总线等。为便于表示，图中仅用一条粗线表示，但并不表示仅有一根总线或一种类型的总线。通信接口用于实现数据库访问装置与其他设备(例如客户端、读写库和只读库)之间的通信。存储器可能包含随机存取存储器(RandomAccessMemory，简称RAM)，也可能还包括非易失性存储器(non-volatilememory)，例如至少一个磁盘存储器。
上述的处理器可以是通用处理器，包括中央处理器(CentralProcessingUnit，简称CPU)、网络处理器(NetworkProcessor，简称NP)等；还可以是数字信号处理器(DigitalSignalProcessing，简称DSP)、专用集成电路(ApplicationSpecificIntegratedCircuit，简称ASIC)、现场可编程门阵列(Field－ProgrammableGateArray，简称FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。
综上所述，本发明所述冷板的审查方法、系统、计算机可读存储介质及设备可以将现有通过人工检查冷板的时间由原来的1到3小时缩短至几分钟，避免了人工检查的遗漏，提高了检查的精度；且将原有的人工抽检变成全面无遗漏的自动检查，从而使工程师及时发现冷板安装到PCB后可能造成的问题；有助于电子企业提升制造品质及效率、降低生产成本。所以，本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (10)

  1. 一种冷板的审查方法，其特征在于，包括：
    步骤一，从已输入的印刷电路板的设计信息中提取至少一对象，并获取冷板的矢量信息；
    步骤二，根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
  2. 根据权利要求1所述的冷板的审查方法，其特征在于，
    所述对象包括元器件、孔、焊盘、阻焊和/或丝印文字；
    所述冷板的矢量信息包括冷板的金属区域和挖空区域图形尺寸。
  3. 根据权利要求1所述的冷板的审查方法，其特征在于，所述预创建的审查条件数据结构包括：
    审查名；
    审查名的子类型；
    审查项目的说明；
    此项审查是否生效；
    对象与冷板的矢量信息的对应关系的推荐值；
    印刷电路板的设计信息中的对象的筛选条件；
    冷板的矢量信息的筛选条件。
  4. 根据权利要求3所述的冷板的审查方法，其特征在于，所述对象与冷板的矢量信息的对应关系包括两者间距离、两者间覆盖含碰撞的程度；
    所述步骤二包括：
    根据印刷电路板的设计信息中的对象的筛选条件和冷板的矢量信息的筛选条件，筛选出印刷电路板的设计信息中的对象和冷板的矢量信息；
    测量印刷电路板的设计信息中的对象和冷板的矢量信息两者间距离或两者间覆盖含碰撞的程度；
    获取印刷电路板的设计信息中的对象和冷板的矢量信息两者间的测量结果。
  5. 根据权利要求4所述的冷板的审查方法，其特征在于，所述步骤二还包括：
    根据测量结果，确定与该测量结果匹配的等级报告结果筛选值；所述等级报告结果筛 选值用于表示测量结果不可接受，警告或可接受。
  6. 根据权利要求4所述的冷板的审查方法，其特征在于，
    生成审查等级报告的步骤包括：将审查项目的说明、筛选出的印刷电路板的设计信息中的对象、测量结果及对象与冷板的矢量信息的对应关系的推荐值编辑成报告结果。
  7. 根据权利要求1所述的冷板的审查方法，其特征在于，所述冷板的审查方法还包括循环执行步骤二，直至审查完所有对象与冷板的矢量信息的对应关系。
  8. 一种冷板的审查系统，其特征在于，包括：
    提取模块，用于从已输入的印刷电路板的设计信息中提取至少一对象；
    获取模块，用于获取冷板的矢量信息；
    审查模块，用于根据预创建的审查条件数据结构，对所述对象与冷板的矢量信息的对应关系进行审查，以生成审查等级报告。
  9. 一种计算机可读存储介质，其上存储有计算机程序，其特征在于，该程序被处理器执行时实现权利要求1至7中任一项所述冷板的审查方法。
  10. 一种设备，其特征在于，包括：处理器及存储器；
    所述存储器用于存储计算机程序，所述处理器用于执行所述存储器存储的计算机程序，以使所述设备执行如权利要求1至7中任一项所述冷板的审查方法。
PCT/CN2018/090383 2017-12-20 2018-06-08 冷板的审查方法、系统、计算机可读存储介质及设备 WO2019119737A1 (zh)

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