WO2019119511A1 - 一种基于水平传感器定位晶体的定向加工方法 - Google Patents

一种基于水平传感器定位晶体的定向加工方法 Download PDF

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Publication number
WO2019119511A1
WO2019119511A1 PCT/CN2017/119754 CN2017119754W WO2019119511A1 WO 2019119511 A1 WO2019119511 A1 WO 2019119511A1 CN 2017119754 W CN2017119754 W CN 2017119754W WO 2019119511 A1 WO2019119511 A1 WO 2019119511A1
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WO
WIPO (PCT)
Prior art keywords
crystal
orientation
horizontal
angle
plane
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Application number
PCT/CN2017/119754
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English (en)
French (fr)
Chinese (zh)
Inventor
张伟明
徐秋峰
沈浩
张寒贫
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天通控股股份有限公司
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Application filed by 天通控股股份有限公司 filed Critical 天通控股股份有限公司
Priority to JP2020554338A priority Critical patent/JP6986166B2/ja
Publication of WO2019119511A1 publication Critical patent/WO2019119511A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools

Definitions

  • the invention relates to the technical field of crystal slicing and directional processing, in particular to a directional processing method for locating a crystal based on a horizontal sensor.
  • the conventional processing method is to use a material plate to fix the crystal, first place the crystal and the material plate on the X-ray directional instrument, and adjust the crystal position to reach the desired crystal orientation angle, and adjust according to the X and Y directions. After being in place, glue with glue. After the glue is solidified, the material plate is placed on the cutting device for cutting or grinding. This method utilizes the mechanical cooperation of the fixture material plate and belongs to mechanical positioning. After passing the cutting, the measurement is performed with a dedicated orientation instrument and verified.
  • the prior Chinese patent document discloses a crystal automatic X-ray directional sticking machine, which comprises a vertically rotating driving motor rotating in a vertical direction, a horizontally rotating driving motor rotating in a horizontal direction, and a vertical rotating motor.
  • the invention adjusts the vertical and horizontal rotation of the crystal by the motor, and uses the encoder to detect the angle of rotation until the desired orientation angle is reached, and then the glue is used to bond the crystal to the material plate, and the glue is solidified.
  • the panel and crystal are mounted on a cutting device for cutting.
  • the principle is basically the same as the traditional processing method, but the action of manually adjusting the crystal angle is changed to the electric control, and the adjustment is realized by the rotation of the two motors. It only uses the encoder feedback adjustment angle to improve the adjustment accuracy to a certain extent, but the invention still has the shortcomings in the traditional processing method, but only improves the degree of automation, and there is no substantial breakthrough.
  • the invention aims at the disadvantages and problems existing in the prior art, and proposes an orientation processing method based on a horizontal sensor positioning crystal, which is simple, ensures precision and improves operation convenience.
  • the present invention adopts the following technical solutions:
  • An orientation processing method based on a horizontal sensor positioning crystal characterized in that it comprises the following steps:
  • the orientation is performed at the required crystal diffraction angle to find the relative positional relationship between the atomic plane and the horizontal plane of the desired crystal, and the crystal measured by the level sensor is obtained.
  • the crystal is placed on the cutting device, and the angle of the crystal on the processing device is compensated according to the relative angular deviation value to obtain a new spatial position. In this position state, processing is performed to obtain a crystal appearance surface of a desired orientation angle;
  • the relative angular deviation value is referenced to the plane of the X-ray directional instrument table, and the relative angular deviation value of the processing surface of the cutting device and the plane of the orientation table is measured by using the horizontal plane as the intermediate link or transition, and is recorded as ⁇ x, ⁇ y.
  • the determining of the relative angular deviation value comprises the following steps:
  • the above-mentioned crystal with a level sensor is placed on the cutting device, and according to the recorded ⁇ x1, ⁇ y1, the position of the crystal atomic plane in the horizontal direction of the space is adjusted to the value, and the spatial horizontal position at the time of orientation is restored, and the test is performed.
  • the cut crystal is placed on the X-ray directional instrument with the reference test plane, and the processed surface of the crystal is pressed against the reference plane of the X-ray directional apparatus for orientation; the crystal is measured in the X-axis direction.
  • the orientation angle of the crystal in the X-axis direction is denoted by ⁇ x
  • the orientation angle in the Y-axis direction is denoted as ⁇ y
  • the horizontal sensor is connected to the display, and the angle of the crystal in the horizontal direction in the space is digitally displayed in the display by the data of the two directions of the X-axis and the Y-axis of the horizontal sensor.
  • the level sensor is also called a tilt sensor, and is often called a level or inclinometer in engineering.
  • the sensor used in the present invention is a two-axis level sensor capable of measuring horizontal angles in two directions, and thus the level of the entire measured surface can be determined.
  • the two vertical directions are defined as X direction and Y. direction.
  • the invention makes a relative relationship between the crystal internal crystal orientation angle, the crystal atomic plane, the processing surface of the cutting device, the measuring surface of the X-ray directional instrument, and the spatial horizontal plane by the horizontal sensor and reasonable steps, by first converting the data between the relations. Determining the machining angle has the following beneficial effects:
  • the method of the present invention does not use an adhesive such as glue, which greatly shortens the waiting time and saves the time and difficulty of removing the glue, and reduces the damage to the crystal. Since the process of crystal bonding and the complicated adjustment mechanism are omitted, the operation process is simplified, and the efficiency is greatly improved.
  • the horizontal position information of the crystal is digitized, so that the crystal angle can be monitored in real time during the production process, and the real-time observation is straightforward.
  • the application of the processing method of the invention greatly simplifies the complexity of the directional processing process, improves the precision of the crystal directional cutting, saves time, labor, and high precision control directional processing precision.
  • FIG. 1 is a schematic diagram of a first process of measuring an angular difference value according to the present invention.
  • FIG. 2 is a schematic diagram of a second process of measuring an angle difference in the present invention.
  • FIG. 3 is a schematic diagram of a third process of measuring an angular difference value according to the present invention.
  • Figure 4 is a schematic view showing the process of crystal processing of the present invention.
  • the working principle of the invention is:
  • the present invention focuses on the relationship between the spatial level, the measuring surface of the directional measuring device, and the cutting surface of the cutting device, and the reference system.
  • the coordinate correspondence law, etc. for the purpose of simplifying the operation and improving the machining accuracy, the present invention can realize the compensation amount by means of the horizontal sensor, and the three planes can be almost completely parallel, so that the error is zero or close to Zero is a possibility and easy to operate.
  • the deviation value is obtained by the following method:
  • the X-ray directional instrument 1 is adjusted to adjust the orientation angle of the orientation, that is, two angles of ⁇ are adjusted to prepare the directional measurement.
  • the crystal 3 to which the level sensor 2 is fixed is placed on the X-ray orientation directional stage 11, and the level sensor 2 is connected to the display 20 through the data line 21 to start directional measurement.
  • the crystal position is adjusted by the horizontal left and right direction.
  • the X-ray receiving tube receives the strongest signal, and at this time, the orientation position of the crystal is found.
  • the spatial angular position of the crystal 3 with respect to the horizontal plane in the X-axis direction is determined, and then the crystal 3 is rotated by 90 degrees.
  • the spatial angular position of the crystal 3 with respect to the horizontal plane in the Y-axis direction is found in the same manner.
  • the spatial position of the lower crystal 3 in the space with respect to the horizontal plane is determined, and the angle value with respect to the horizontal plane displayed by the display screen of the horizontal sensor display 20 in the two directions is recorded, that is, the angle value of the crystal atomic plane in the horizontal direction of the space, Do ⁇ x1, ⁇ y1.
  • the above-described oriented crystal 3 is placed on the crystal processing apparatus 4.
  • the crystal 3 As shown in part (2) of Fig. 2, by adjusting the front and rear, left and right positions of the crystal 3 in the horizontal direction, and observing the data of the display screen of the horizontal angle sensor display 20, the crystal 3 is restored to the spatial horizontal position at the previous orientation. That is, the display screen of the level sensor display 20 displays the recorded spatial angle values of ⁇ x1, ⁇ y1.
  • the grinding wheel 41 of the cutting device is moved to the left and right to machine the plane of the crystal 3, that is, the appearance crystal face 31 is machined.
  • the X-ray directional instrument 5 adjusts the angle of the crystal orientation to the desired orientation, i.e., adjusts the two angles of ⁇ to prepare the directional measurement.
  • the processed surface 31 of the processed crystal 3 is placed against the reference plane 50 of the X-ray directional instrument 5 for orientation.
  • the crystal orientation angles ⁇ x, ⁇ y of the processed crystal 3 in the X-axis direction and the Y-axis direction are measured.
  • connection block 6 is fixed to the crystal 3 by glue, and the level sensor 2 is fixed to the connection block 4.
  • the crystal 3 used above and the crystal 100 to be processed may be the same or different crystals.
  • the crystal 100 to which the level sensor 2 is fixed is placed on the directional table 11 of the X-ray directional apparatus 1, and the level sensor 2 is connected to the display 20 through the data line 21 for directional measurement.
  • the X-ray receiving tube receives the strongest signal.
  • the orientation position of the crystal 100 is found, and the space of the crystal X-axis direction relative to the horizontal plane is determined.
  • the angle value is recorded as ⁇ x, and then the crystal is rotated by 90 degrees.
  • the same method is used to find the spatial angle value of the crystal in the Y-axis direction with respect to the horizontal plane, and y is determined.
  • the crystal 100 is determined in space relative to the horizontal plane. Spatial location.
  • the crystal 100 to which the level sensor is fixed is placed on the processing equipment table, and the spatial angle value ⁇ x, ⁇ y, minus of the obtained crystal 100 in space with respect to the horizontal plane is reduced.
  • the deviation values ⁇ x and ⁇ y obtained in the two directions at the time of calibration are adjusted to the position of the crystal 100, and the grinding wheel 41 of the cutting device is moved to the left and right to process the plane of the crystal, that is, the crystal appearance of the crystal. That is, the processing is completed, as shown in part (3) of Figure 4.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
PCT/CN2017/119754 2017-12-20 2017-12-29 一种基于水平传感器定位晶体的定向加工方法 WO2019119511A1 (zh)

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JP2020554338A JP6986166B2 (ja) 2017-12-20 2017-12-29 レベルセンサーのポジショニングに基づく結晶体の方向調整加工法

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CN201711381171.3 2017-12-20
CN201711381171.3A CN108312370B (zh) 2017-12-20 2017-12-20 一种基于水平传感器定位晶体的定向加工方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113702409A (zh) * 2021-07-28 2021-11-26 威科赛乐微电子股份有限公司 一种晶体定向方法
CN114571619A (zh) * 2022-03-04 2022-06-03 中国科学院上海应用物理研究所 一种单色器晶体定向方法

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CN111300192B (zh) * 2020-03-24 2021-12-24 广州南砂晶圆半导体技术有限公司 一种应用于单晶的定向加工方法
CN111906953B (zh) * 2020-08-04 2022-03-25 西安奕斯伟材料科技有限公司 一种切割装置
CN113733376B (zh) * 2021-09-03 2023-08-01 东莞市中镓半导体科技有限公司 一种半导体晶圆集成加工装置及其方法
CN114311350B (zh) * 2022-03-15 2022-06-28 天通控股股份有限公司 一种钽酸锂晶体头尾切割方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113702409A (zh) * 2021-07-28 2021-11-26 威科赛乐微电子股份有限公司 一种晶体定向方法
CN114571619A (zh) * 2022-03-04 2022-06-03 中国科学院上海应用物理研究所 一种单色器晶体定向方法

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JP6986166B2 (ja) 2021-12-22
JP2021508374A (ja) 2021-03-04
CN108312370B (zh) 2020-05-01
CN108312370A (zh) 2018-07-24

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