WO2019095772A1 - 显示基板及其制作方法、显示装置 - Google Patents

显示基板及其制作方法、显示装置 Download PDF

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WO2019095772A1
WO2019095772A1 PCT/CN2018/102562 CN2018102562W WO2019095772A1 WO 2019095772 A1 WO2019095772 A1 WO 2019095772A1 CN 2018102562 W CN2018102562 W CN 2018102562W WO 2019095772 A1 WO2019095772 A1 WO 2019095772A1
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pixel
substrate
pixel defining
side portion
long side
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PCT/CN2018/102562
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English (en)
French (fr)
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罗程远
代青
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京东方科技集团股份有限公司
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Priority to EP18859975.7A priority Critical patent/EP3712947B1/en
Priority to US16/339,180 priority patent/US11437448B2/en
Publication of WO2019095772A1 publication Critical patent/WO2019095772A1/zh
Priority to US17/851,123 priority patent/US11917865B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display substrate, a method of fabricating the same, and a display device.
  • OLED Organic Light-Emitting Diode
  • the ink jet printing technology since the ink jet printing technology has high material utilization rate, it is considered to be an important way to achieve large size and mass production.
  • the uniformity of film formation by inkjet printing needs to be improved.
  • At least one embodiment of the present disclosure provides a display substrate including a substrate and a plurality of pixel and pixel defining layers on the substrate, wherein:
  • the pixel includes a long side and a short side
  • the pixel defining layer includes a long side portion adjacent to the long side, and a short side portion adjacent to the short side, the height of the long side portion being larger than the height of the short side portion.
  • the height of the long side portion is 1 ⁇ m to 5 ⁇ m
  • the height of the short side portion is 0.5 ⁇ m to 2.5 ⁇ m.
  • the pixel defining layer faces the wall surface of the pixel as a slope.
  • the slope of the pixel defining layer toward the long side of the pixel is equal to the slope angle of the pixel defining layer toward the short side of the pixel.
  • the pixel defining layer includes a layer of lyophilic material and a layer of lyophobic material located on a side of the lyophilic material layer away from the substrate.
  • the thickness s1 of the lyophobic material layer of the long side portion and the thickness s2 of the lyophilic material layer satisfy: s1 ⁇ 1/2 s2.
  • At least one embodiment of the present disclosure also provides a display device including the display substrate as described above.
  • At least one embodiment of the present disclosure further provides a method for fabricating a display substrate, including the following steps:
  • the pixel defining layer including a long side portion adjacent to a long side of the pixel, and a short side portion adjacent to the short side, a height of the long side portion Greater than the height of the short side.
  • the forming a pixel defining layer on the substrate includes:
  • a portion of the pixel defining layer film adjacent to the short side of the pixel is subjected to a thinning process.
  • the forming a pixel defining layer on the substrate includes:
  • a plurality of open regions are formed on the pixel defining layer film, and each of the open regions corresponds to one pixel.
  • the forming a pixel defining layer film on the substrate comprises:
  • a layer of lyophobic material is formed on a side of the lyophilic material layer away from the substrate.
  • the manufacturing method provided by the embodiment of the present disclosure further includes the step of forming an organic light emitting layer in the open region by a solution process.
  • FIG. 1 is a schematic structural view of a display substrate according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view of the A-A of FIG. 1 according to an embodiment of the present disclosure
  • FIG. 3 is a cross-sectional view of the B-B of FIG. 1 according to an embodiment of the present disclosure
  • FIG. 4 is a cross-sectional view taken along line C-C of FIG. 1 according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic flow chart of a method for fabricating a display substrate according to an embodiment of the present disclosure
  • FIG. 7 is a schematic flow chart of a method for fabricating a display substrate according to another embodiment of the present disclosure.
  • the embodiment of the present disclosure provides a display substrate, a manufacturing method thereof, and a display device.
  • the present disclosure will be further described in detail in the following examples for the purpose of the present disclosure.
  • a display substrate provided by an embodiment of the present disclosure includes a substrate 1 and a plurality of pixels 7 and a pixel defining layer 8 on the substrate 1 , wherein:
  • the pixel 7 includes a long side 6 and a short side 5;
  • the pixel defining layer 8 includes a long side portion 2 adjacent to the long side 6 and a short side portion 3 adjacent to the short side 5, and the height of the long side portion 2 is larger than the height of the short side portion 3.
  • the specific type of the display substrate is not limited, and may be, for example, an OLED display substrate or a quantum dot display substrate.
  • This paper describes an OLED display substrate as an example. Since the OLED display substrate includes a pixel defining layer on the substrate and a pixel formed in a pixel opening region defined by the pixel defining layer (that is, a region defined by the pixel defining layer long side portion and the short side portion), the pixel defining The long side portion and the short side portion of the layer correspond to the long side and the short side of the pixel, respectively.
  • the solution process such as inkjet printing technology and screen printing technology, has a high material utilization rate, it is considered to be an important way to achieve large size and mass production.
  • This article describes inkjet printing as an example.
  • the height of the long side portion 2 of the pixel defining layer 8 is set higher than the height of the short side portion 3, and the organic light emitting layer is formed on the pixel defining layer by inkjet printing.
  • the solvent in the ink is removed by vacuum pumping, drying, etc., and the solute in the ink is dried to form a film, so that the airflow in the long side 6 direction of the pixel 7 can be quickly lost.
  • the airflow loss in the 5 direction on the short side of the pixel 7 is slow, so that the influence of the micro force and the migration distance of the ink during the drying process can be effectively offset, and the redistribution process of the equilibrium solute in the pixel opening region is achieved, reaching the pixel.
  • a film layer having a uniform thickness is formed in the opening region, thereby improving the display effect of the display device and prolonging the service life.
  • the height of the long side portion 2 may be 1 ⁇ m to 5 ⁇ m, and the height of the short side portion 3 may be 0.5 ⁇ m to 2.5 ⁇ m.
  • the specific height of the long side portion 2 and the short side portion 3 of the pixel defining layer 8 is not limited, the height of the long side portion 2 of the pixel defining layer 8, the height of the short side portion 3, and the length of the long side 6 of the pixel opening region,
  • the specific proportional relationship between the lengths of the short sides 5 is not limited, and the selection of a proper proportional relationship is advantageous for balancing the influence of the micro-force and the migration distance of the ink during the drying process, thereby forming a film layer in the pixel opening region.
  • the pixel defining layer 8 faces the wall surface of the pixel 7 as the slope 4 , and the specific angle value of the pixel defining layer 8 facing the slope 4 of the pixel 7 is not limited.
  • the slope of the slope 4 of the pixel defining layer 8 toward the long side 6 of the pixel 7 is equal to the slope of the slope 4 toward the short side 5, it can be effective in the film forming process of the pixel opening region. The decrease in the film thickness due to the difference in the slope angles of the long side portion 2 and the short side portion 3 during the drying of the ink.
  • the pixel defining layer 8 may be a photosensitive resin-based organic material and may be patterned by a photolithography process.
  • the pixel defining layer 8 includes a layer of lyophilic material and a layer of lyophobic material on the side of the layer of lyophilic material remote from the substrate 1.
  • the thickness s1 of the lyophobic material layer of the long side portion and the thickness s2 of the lyophilic material layer can satisfy: s1 ⁇ 1/2 s2.
  • the pixel defining layer 8 is provided as a combination of a lyophilic material layer and a lyophobic material layer, and the lyophilic material layer is disposed on a side close to the substrate 1, in the process of performing inkjet printing on the pixels 7 of the substrate 1. It can effectively prevent the serious climbing phenomenon at the edge of the pixel 7, thereby improving the uniformity of the film thickness of the pixel 7.
  • an embodiment of the present disclosure further provides a display device 9, including the display substrate of the foregoing solution.
  • a film layer having a uniform thickness can be formed in the pixel opening region of the display substrate, which can improve the quality of the display panel, thereby effectively improving the display effect of the display device 9 and prolonging the service life.
  • the specific type of display device is not limited, and may be, for example, a mobile phone, a tablet, a display screen, an on-board computer, or the like.
  • the embodiment of the present disclosure further provides a method for manufacturing a display substrate, including the following steps:
  • a pixel defining layer is formed on the substrate, the pixel defining layer including a long side portion adjacent to a long side of the pixel, and a short side portion adjacent to the short side, the height of the long side portion being greater than the height of the short side portion.
  • forming a pixel defining layer on a substrate includes:
  • Step 101 forming a pixel defining layer film on the substrate
  • Step 102 forming a plurality of open areas on the pixel defining layer film, each open area corresponding to one pixel;
  • Step 103 Perform a thinning process on a portion of the pixel defining layer film adjacent to the short side of the pixel.
  • forming a pixel defining layer on a substrate includes:
  • Step 201 forming a pixel defining layer film on the substrate
  • Step 202 Perform a thinning process on a portion of the pixel defining layer film adjacent to a short side of the pixel;
  • Step 203 forming a plurality of open areas on the pixel defining layer film, each open area corresponding to one pixel.
  • the pattern of each film layer on the substrate is usually formed by a patterning process, and the first patterning process usually includes film forming, photoresist coating, exposure, development, etching, photoresist stripping, etc.; physical vapor deposition is usually used for the metal layer.
  • a film is formed by a method (for example, magnetron sputtering), a pattern is formed by wet etching, and a film is formed by chemical vapor deposition for a non-metal layer, and a pattern is formed by dry etching.
  • step 102 and step 103 may be completed in the same patterning process, and may be implemented by using a halftone mask. Alternatively, step 102 and step 103 may be performed in different patterning processes. Similarly, steps are performed. 202. Step 203 may be completed in the same patterning process, or may be completed in different patterning processes.
  • step 101 or step 201 forms a pixel defining layer film on the substrate, specifically comprising: forming a lyophilic material layer on the substrate; forming a lyophobic material layer on a side of the lyophilic material layer away from the substrate.
  • the method for fabricating a display substrate provided by the embodiment of the present disclosure may further include the step of forming an organic light-emitting layer in the open region by a solution method.
  • the organic light-emitting layer in the OLED display device is formed therein by, for example, inkjet printing, screen printing, or the like, which is advantageous for forming an organic light-emitting layer having a uniform thickness.
  • the method for manufacturing the display substrate according to the embodiment of the present disclosure sets the height of the long side portion of the pixel defining layer to be higher than the height of the short side portion, and can remove the solvent in the ink by vacuum pumping after the inkjet printing is completed, so that the ink is made.
  • the solute is dried to form a film
  • the airflow in the long side direction of the pixel is quickly lost, and the airflow in the short side direction of the pixel is relatively slow, so that the micro force and migration distance of the ink during the drying process can be effectively offset.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

本公开涉及显示技术领域，公开了一种显示基板及其制作方法、显示装置，用以提高显示基板上薄膜厚度的均一性，从而提高显示装置的显示效果，延长使用寿命。显示基板包括，基板（1）以及位于基板上的多个像素（7）和像素界定层（8），其中：像素包括长边侧（6）和短边侧（5）；像素界定层包括与长边侧相邻的长边部（2），以及与短边侧相邻的短边部（3），长边部的高度大于短边部的高度。

Description

显示基板及其制作方法、显示装置
本申请要求在2017年11月17日提交中国专利局、申请号为201711147209.0、公开名称为“一种显示基板及其制作方法、显示装置”的中国专利申请的优先权，该申请的全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，特别是涉及一种显示基板及其制作方法、显示装置。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二极管，简称OLED)显示装置由于具有薄、轻、宽视角、主动发光、发光颜色连续可调、成本低、响应速度快、能耗小、驱动电压低、工作温度范围宽、生产工艺简单、发光效率高及可柔性显示等优点，已被列为极具发展前景的下一代显示技术。
OLED显示基板的成膜工艺中，由于喷墨打印技术具有较高的材料利用率，因此被认为是实现大尺寸、量产化的重要方式。喷墨打印方式成膜的均匀性有待提高。
发明内容
本公开至少一实施例提供了一种显示基板，包括基板以及位于基板上的多个像素和像素界定层，其中：
所述像素包括长边侧和短边侧；
所述像素界定层包括与所述长边侧相邻的长边部，以及与所述短边侧相邻的短边部，所述长边部的高度大于所述短边部的高度。
例如，所述长边侧的长度a、所述短边侧的长度b、所述长边部的高度h1和所述短边部的高度h2满足：h1/h2＝(1/3～3/4)a/b。
例如，所述长边部的高度为1μm～5μm，所述短边部的高度为0.5μm～2.5μm。
例如，所述像素界定层朝向所述像素的壁面为坡面。
例如，所述像素界定层朝向所述像素的长边侧的坡面坡角，等于所述像素界定层朝向所述像素的短边侧的坡面坡角。
例如，所述像素界定层包括亲液性材料层以及位于所述亲液性材料层远离所述基板一侧的疏液性材料层。
例如，所述长边部的所述疏液性材料层的厚度s1，与所述亲液性材料层的厚度s2之间满足：s1≥1/2s2。
本公开至少一实施例还提供了一种显示装置，包括如前所述的显示基板。
本公开至少一实施例还提供了一种显示基板的制作方法，包括以下步骤：
在基板上形成像素界定层，所述像素界定层包括与所述像素的长边侧相邻的长边部，以及与所述短边侧相邻的短边部，所述长边部的高度大于所述短边部的高度。
例如，所述在基板上形成像素界定层，包括：
在基板上形成像素界定层薄膜；
在所述像素界定层薄膜上形成多个开口区，每个开口区与一个像素对应；
对所述像素界定层薄膜的与所述像素的短边侧相邻的部分进行减薄处理。
例如，所述在基板上形成像素界定层，包括：
在基板上形成像素界定层薄膜；
对所述像素界定层薄膜的与所述像素的短边侧相邻的部分进行减薄处理；
在所述像素界定层薄膜上形成多个开口区，每个开口区与一个像素对应。
例如，所述在基板上形成像素界定层薄膜，包括：
在基板上形成亲液性材料层；
在所述亲液性材料层远离基板的一侧形成疏液性材料层。
例如，本公开实施例提供的制作方法还包括以下步骤：通过溶液制程在所述开口区中形成有机发光层。
附图说明
图1为本公开实施例显示基板结构示意图；
图2为本公开实施例图1的A-A截面示意图；
图3为本公开实施例图1的B-B截面示意图；
图4为本公开实施例图1的C-C截面示意图；
图5为本公开实施例显示装置结构示意图；
图6为本公开一实施例显示基板的制作方法流程示意图；
图7为本公开另一实施例显示基板的制作方法流程示意图。
具体实施方式
为提高显示基板喷墨打印成膜的厚度的均一性，从而提高显示装置的显示效果，延长使用寿命，本公开实施例提供了一种显示基板及其制作方法、显示装置。为使本公开的目的、技术方案和优点更加清楚，以下举实施例对本公开作进一步详细说明。
如图1所示，本公开实施例提供的显示基板，包括基板1以及位于基板1上的多个像素7和像素界定层8，其中：
像素7包括长边侧6和短边侧5；
像素界定层8包括与长边侧6相邻的长边部2，以及与短边侧5相邻的短边部3，长边部2的高度大于短边部3的高度。
显示基板的具体类型不限，例如可以为OLED显示基板或者量子点显示基板。本文以OLED显示基板为例进行说明。由于OLED显示基板包括位于基板上的像素界定层以及形成于像素界定层界定的像素开口区(也即是所述像素界定层长边部和短边部限定的区域)内的像素，则像素界定层的长边部、短边部分别对应像素的长边侧、短边侧。
OLED显示基板的成膜工艺中，由于溶液制程，如喷墨打印技术、丝网印刷技术具有较高的材料利用率，因此被认为是实现大尺寸、量产化的重要方式。本文以喷墨打印为例进行说明。OLED显示基板的制作过程中，将像素界定层8的长边部2的高度设置为高于短边部3的高度，在喷墨打印(即通过喷墨打印将有机发光层形成于像素限定层8的开口区内)完成之后，通过真空抽气、干燥等手段去除墨水中的溶剂，使墨水中的溶质干燥形成薄膜的过程中，可以使像素7长边侧6方向上的气流流失较快，像素7短边侧5方向上的气流流失较慢，从而能够有效的抵消墨水在干燥过程中的微作用力以及迁移距离的影响，平衡溶质在像素开口区内的再分布过程，达到在像素开口区内形成厚度均匀的膜层，进而提高显示装置的显示效果，延长使用寿命。
继续参照图1，在本公开可选的实施例中，长边侧6的长度a、短边侧5的长度b、长边部2的高度h1和短边部3的高度h2满足：h1/h2＝(1/3～3/4)a/b。其中，长边部2的高度可以为1μm～5μm，短边部3的高度可以为0.5μm～2.5μm。像素界定层8的长边部2与短边部3的具体高度不限，像素界定层8的长边部2的高度、短边部3的高度与像素开口区的长边侧6的长度、短边侧5的长度之间的具体比例关系不限，选择合适的比例关系有利于平衡墨水在干燥过程中所受到的微作用力以及迁移距离的影响，从而实现在像素开口区内形成膜层厚度均匀的薄膜。
如图1至图4所示，在本公开可选的实施例中，像素界定层8朝向像素7的壁面为坡面4，像素界定层8朝向像素7的坡面4的具体角度值不限，可选的，当像素界定层8朝向像素7的长边侧6的坡面4坡角与朝向短边侧5的坡面4坡角相等时，可以在像素开口区成膜过程中，有效的减小由于长边部2和短边部3的坡面度角不同对墨水干燥过程中成膜厚度的影响。
在本公开可选的实施例中，像素界定层8可以采用感光型树脂类有机材料，并可以通过光刻工艺进行构图。
在本公开可选的实施例中，像素界定层8包括亲液性材料层以及位于亲 液性材料层远离基板1一侧的疏液性材料层。其中，长边部的疏液性材料层的厚度s1，与亲液性材料层的厚度s2之间可以满足：s1≥1/2s2。将像素界定层8设置成亲液性材料层和疏液性材料层的组合，且亲液性材料层设置在靠近基板1的一侧，在对基板1的像素7进行喷墨打印的过程中，可以有效的防止像素7边缘出现严重的攀爬现象，从而提高像素7膜层厚度的均匀性。
如图5所示，本公开实施例还提供一种显示装置9，包括前述方案的显示基板。
采用本方案可以在显示基板的像素开口区内形成厚度均匀的膜层，可以提高显示面板的质量，进而有效的提高显示装置9的显示效果，延长使用寿命。
显示装置的具体类型不限，例如，可以为手机、平板电脑、展示屏、车载电脑等等。
本公开实施例还提供一种显示基板的制作方法，包括以下步骤：
在基板上形成像素界定层，像素界定层包括与像素的长边侧相邻的长边部，以及与短边侧相邻的短边部，长边部的高度大于短边部的高度。
如图6所示，在本公开可选的实施例中，在基板上形成像素界定层，包括：
步骤101：在基板上形成像素界定层薄膜；
步骤102：在像素界定层薄膜上形成多个开口区，每个开口区与一个像素对应；
步骤103：对像素界定层薄膜的与像素的短边侧相邻的部分进行减薄处理。
如图7所示，在本公开另一可选的实施例中，在基板上形成像素界定层，包括：
步骤201：在基板上形成像素界定层薄膜；
步骤202：对所述像素界定层薄膜的与所述像素的短边侧相邻的部分进行减薄处理；
步骤203：在所述像素界定层薄膜上形成多个开口区，每个开口区与一个像素对应。
基板上各膜层的图形通常采用构图工艺制作形成，一次构图工艺通常包括成膜、光刻胶涂覆、曝光、显影、刻蚀、光刻胶剥离等工序；对于金属层通常采用物理气相沉积方式(例如磁控溅射法)成膜，通过湿法刻蚀形成图形，而对于非金属层通常采用化学气相沉积方式成膜，通过干法刻蚀形成图形。
需要说明的是，步骤102、步骤103可以在同一次构图工艺中完成，具体可以采用半色调掩膜板实现，或者，步骤102、步骤103也可以在不同的构图工艺中完成；同理，步骤202、步骤203可以在同一次构图工艺中完成，也可以在不同的构图工艺中完成。
可选的，步骤101或步骤201在基板上形成像素界定层薄膜，具体包括：在基板上形成亲液性材料层；在亲液性材料层远离基板的一侧形成疏液性材料层。
可选的，本公开实施例提供的显示基板制作方法，还可以包括以下步骤：通过溶液法在所述开口区中形成有机发光层。例如通过喷墨打印，丝网印刷等方式，将OLED显示器件中的有机发光层形成于其中，有利于形成厚度均匀的有机发光层。
采用本公开实施例显示基板的制作方法将像素界定层的长边部的高度设置为高于短边部的高度，可以在喷墨打印完成之后，通过真空抽气去除墨水中的溶剂，使墨水中的溶质干燥形成薄膜时，使像素长边侧方向上的气流流失较快，像素短边侧方向上的气流流失较慢，从而能够有效的抵消墨水在干燥过程中的微作用力以及迁移距离的影响，平衡溶质在像素开口区内的再分布过程，达到在像素开口区内形成厚度均匀的膜层，进而提高显示装置的显示效果，延长使用寿命。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要 求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (12)

  1. 一种显示基板，包括基板以及位于基板上的多个像素和像素界定层，其中：
    所述像素包括长边侧和短边侧；
    所述像素界定层包括与所述长边侧相邻的长边部，以及与所述短边侧相邻的短边部，所述长边部的高度大于所述短边部的高度。
  2. 如权利要求1所述的显示基板，其中，所述长边侧的长度a、所述短边侧的长度b、所述长边部的高度h1和所述短边部的高度h2满足：h1/h2＝(1/3～3/4)a/b。
  3. 如权利要求1所述的显示基板，其中，所述长边部的高度为1μm～5μm，所述短边部的高度为0.5μm～2.5μm。
  4. 如权利要求1所述的显示基板，其中，所述像素界定层朝向所述像素的壁面为坡面。
  5. 如权利要求4所述的显示基板，其中，所述像素界定层朝向所述像素的长边侧的所述坡面的坡角，等于所述像素界定层朝向所述像素的短边侧的所述坡面的坡角。
  6. 如权利要求1所述的显示基板，其中，所述像素界定层包括亲液性材料层以及位于所述亲液性材料层远离所述基板一侧的疏液性材料层。
  7. 如权利要求6所述的显示基板，其中，所述长边部的所述疏液性材料层的厚度s1，与所述亲液性材料层的厚度s2之间满足：s1≥1/2s2。
  8. 一种显示装置，包括如权利要求1～7任一项所述的显示基板。
  9. 一种显示基板的制作方法，包括以下步骤：
    在基板上形成像素界定层，所述像素界定层包括与所述像素的长边侧相邻的长边部，以及与所述短边侧相邻的短边部，所述长边部的高度大于所述短边部的高度。
  10. 如权利要求9所述的制作方法，其中，所述在基板上形成像素界定 层，包括以下步骤：
    在基板上形成像素界定层薄膜；
    在所述像素界定层薄膜上形成多个开口区，每个开口区与一个像素对应；
    对所述像素界定层薄膜与所述像素的短边侧相邻的部分进行减薄处理。
  11. 如权利要求9所述的制作方法，其中，所述在基板上形成像素界定层薄膜，包括：
    在基板上形成亲液性材料层；
    在所述亲液性材料层远离基板的一侧形成疏液性材料层。
  12. 如权利要求10所述的制作方法，其中，还包括以下步骤：通过溶液制程在所述开口区中形成有机发光层。
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Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN111293151A (zh) * 2020-02-20 2020-06-16 深圳市华星光电半导体显示技术有限公司 像素bank制备方法、像素bank结构、像素结构和显示面板
CN111370451B (zh) * 2020-03-12 2023-12-01 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN111584605B (zh) * 2020-05-29 2023-04-07 京东方科技集团股份有限公司 阵列基板、制备方法、显示面板及显示装置
CN115528063A (zh) * 2021-06-24 2022-12-27 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102832353A (zh) * 2011-06-16 2012-12-19 三星显示有限公司 有机发光结构及形成方法、有机发光显示装置及制造方法
CN104409647A (zh) * 2014-11-14 2015-03-11 京东方科技集团股份有限公司 一种像素单元及其制作方法、发光器件、显示装置
CN105448957A (zh) * 2016-01-04 2016-03-30 京东方科技集团股份有限公司 有机电致发光显示基板及其制作方法、显示装置
CN106067478A (zh) * 2016-08-08 2016-11-02 深圳市华星光电技术有限公司 像素界定层的制作方法与oled器件的制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007188862A (ja) * 2005-12-13 2007-07-26 Canon Inc 有機ｅｌ発光装置およびその製造方法
JP2007234232A (ja) * 2006-02-27 2007-09-13 Hitachi Displays Ltd 画像表示装置
KR101951029B1 (ko) * 2012-06-13 2019-04-26 삼성디스플레이 주식회사 증착용 마스크 및 이를 이용한 유기 발광 표시장치의 제조방법
CN104465671B (zh) * 2014-12-26 2016-08-31 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN104752490B (zh) * 2015-04-16 2016-04-06 京东方科技集团股份有限公司 一种有机发光二极管显示面板及其制作方法、显示装置
KR102457536B1 (ko) 2015-06-30 2022-10-21 엘지디스플레이 주식회사 유기전계발광표시장치
CN105774279B (zh) 2016-03-23 2019-01-15 京东方科技集团股份有限公司 一种喷墨打印方法及oled显示装置的制作方法
CN108074950B (zh) * 2016-11-11 2021-11-23 乐金显示有限公司 电致发光显示设备及其制造方法
CN107591432B (zh) * 2017-09-27 2020-05-26 京东方科技集团股份有限公司 像素界定层、显示基板及制造方法、显示装置
CN108010946B (zh) 2017-11-27 2022-02-25 京东方科技集团股份有限公司 一种像素界定层、阵列基板及显示装置
CN108110035B (zh) * 2017-12-14 2020-11-27 京东方科技集团股份有限公司 一种有机发光二极管基板及其制备方法、显示面板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102832353A (zh) * 2011-06-16 2012-12-19 三星显示有限公司 有机发光结构及形成方法、有机发光显示装置及制造方法
CN104409647A (zh) * 2014-11-14 2015-03-11 京东方科技集团股份有限公司 一种像素单元及其制作方法、发光器件、显示装置
CN105448957A (zh) * 2016-01-04 2016-03-30 京东方科技集团股份有限公司 有机电致发光显示基板及其制作方法、显示装置
CN106067478A (zh) * 2016-08-08 2016-11-02 深圳市华星光电技术有限公司 像素界定层的制作方法与oled器件的制作方法

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