WO2019095694A1 - 晶片定位及装载系统 - Google Patents

晶片定位及装载系统 Download PDF

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Publication number
WO2019095694A1
WO2019095694A1 PCT/CN2018/092483 CN2018092483W WO2019095694A1 WO 2019095694 A1 WO2019095694 A1 WO 2019095694A1 CN 2018092483 W CN2018092483 W CN 2018092483W WO 2019095694 A1 WO2019095694 A1 WO 2019095694A1
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WIPO (PCT)
Prior art keywords
wafer
alignment
sub
robot
rail
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PCT/CN2018/092483
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English (en)
French (fr)
Inventor
申兵兵
魏民
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北京创昱科技有限公司
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Publication of WO2019095694A1 publication Critical patent/WO2019095694A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/023—Cartesian coordinate type
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18—Status alarms
    • G08B21/187—Machine fault alarms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to the field of semiconductor production technology, and in particular to a wafer positioning and loading system.
  • wafer loading is mostly done by a robot.
  • the robot first takes out the wafer from the wafer cassette, places it on the alignment platform, and adjusts the center position of the wafer.
  • the robot then sucks the wafer into the wet equipment or the designated container. Because a robot is used to complete the operations of grabbing, placing, transferring, etc., the entire process has a long takt time and low production efficiency, which cannot meet the requirements of mass production; if multiple robots and alignment platforms are used, higher cost.
  • the present invention provides a wafer positioning and loading system, comprising: a reclaiming mechanism, a visual positioning system, a feeding mechanism, and a positioning platform system including a plurality of sub-alignment platforms, wherein
  • the reclaiming mechanism includes an X-direction reclaiming robot and a YZ-direction conveying unit, and the X-direction reclaiming robot is provided with a plurality of first vacuum chucks spaced apart for sucking the wafer, and the plurality of the first vacuum chucks
  • the distribution of the plurality of sub-alignment platforms is in one-to-one correspondence, and the YZ-directed transport unit is coupled to the X-direction retracting robot for simultaneously transporting the wafers sucked by the plurality of the first vacuum chucks to the respective Corresponding to the sub-alignment platform;
  • the visual positioning system is mounted above the alignment platform system for acquiring a position of a wafer on each of the sub-alignment platforms;
  • Each of the sub-alignment platforms adjusts the wafer according to the position of each of the wafers acquired by the visual positioning system to coincide with a preset reference position;
  • the feeding mechanism is configured to transport the plurality of the wafers adjusted on the plurality of sub-alignment platforms to a destination position.
  • the YZ-direction conveying unit comprises a guide rail
  • the guide rail comprises a Y-direction section and a Z-direction section respectively connected to both ends of the Y-direction section, wherein the two Z-direction sections are located below the Y-direction section,
  • One end of the X-direction reclaiming robot is slidably coupled to the rail.
  • the YZ-direction conveying unit further comprises driving means for driving the X-direction reclaiming robot to slide in the guide rail.
  • the YZ-direction conveying unit comprises a guide rail, wherein the guide rail comprises a Y-direction guide rail and a Z-direction guide rail, wherein the Z-direction guide rail is slidably connected with the Y-direction guide rail, and one end of the X-direction reclaiming robot slides with the Z-direction guide rail connection.
  • the YZ-direction conveying unit further includes a first driving device for driving the X-direction reclaiming robot to slide on the Z-direction rail, and a driving device for driving the Z-direction rail to slide on the Y-direction rail Second drive device.
  • the plurality of sub-alignment platforms are arranged in a word.
  • an X-direction slide rail that is mounted above the alignment platform system, and the visual positioning system is slidably coupled to the X-direction slide rail.
  • the plurality of sub-alignment platforms are in an MXN array, wherein M ⁇ 2 and N ⁇ 2.
  • the method further includes an X-direction slide rail erected above the alignment platform system, the visual positioning system is slidably connected to the X-direction slide rail; and a Y-direction slide rail is disposed at a lower end of the X-direction slide rail.
  • the X-direction slide rail is slidably coupled to the Y-direction slide rail.
  • the sub-alignment platform is a UVW alignment platform.
  • the feeding mechanism comprises an X-direction feeding robot and a Y-direction feeding guide disposed above the alignment platform system, wherein the X-direction feeding robot is provided with a plurality of second vacuum chucks, and the plurality of the second The distribution of the vacuum chuck is in one-to-one correspondence with a plurality of the sub-alignment platforms, and the X-direction reclaiming robot is slidably coupled to the Y-direction rail, and the alignment platform system is capable of moving up and down in the Z direction.
  • the feeding mechanism further comprises an X-direction feeding robot and a feeding guide disposed above the alignment platform system, the feeding rail comprising a Y-direction section and a Z-direction section connected to the Y-direction section, the Z a segment portion below the Y-direction segment and corresponding to the alignment platform system, the Z-direction segment dividing the Y-direction segment into a first portion at a front portion and a second portion at a rear portion, One end of the X-direction reclaiming robot is slidably coupled to the feed rail.
  • the method further includes an alarm device, the alarm device includes a detecting unit and an alarm unit, wherein the detecting unit is configured to detect whether the first vacuum chuck has failed to suck the same wafer for a consecutive time, wherein A>2, when continuous is detected When the suction fails, an instruction is sent to the alarm unit, and the alarm unit issues an alarm.
  • the alarm device includes a detecting unit and an alarm unit, wherein the detecting unit is configured to detect whether the first vacuum chuck has failed to suck the same wafer for a consecutive time, wherein A>2, when continuous is detected When the suction fails, an instruction is sent to the alarm unit, and the alarm unit issues an alarm.
  • the first vacuum chuck is made of rubber or plastic; or the first vacuum chuck is made of metal, and a surface of the vacuum chuck is coated with a layer of flexible material.
  • the wafer positioning and loading system according to the present invention is capable of operating a plurality of wafers at the same time, reducing the time taken for the device to repeat the operation, thereby improving work efficiency and reducing costs.
  • the wafer positioning and loading system acquires the position of each wafer by photographing the positions of the plurality of wafers one by one by using a movable visual positioning system, instead of using multiple cameras to photograph the wafer positions one-to-one. , thus further reducing costs.
  • Figure 1 is a block diagram showing a preferred embodiment of a wafer positioning and loading system in accordance with the present invention.
  • FIG. 2 is a process flow diagram of a wafer positioning and loading system in accordance with the present invention.
  • FIG. 3 is a block diagram showing another preferred embodiment of a wafer positioning and loading system in accordance with the present invention.
  • 1 wafer
  • 2 reclaim mechanism
  • 3 visual positioning system
  • 4 alignment platform system
  • 5 feeding mechanism
  • 6 Y-direction sliding rail.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless explicitly stated and defined otherwise. Or in one piece; it may be a mechanical connection, or it may be an electrical connection or a communication with each other; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship between two elements. Unless otherwise expressly defined. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • Figure 1 shows a preferred embodiment of a wafer positioning and loading system in accordance with the present invention.
  • the wafer positioning and loading system includes a reclaim mechanism 2, a visual positioning system 3, a feed mechanism 5, and a aligning platform system 4 including a plurality of sub-alignment platforms.
  • the reclaiming mechanism 2 comprises an X-direction reclaiming robot and a YZ-direction conveying unit, and the X-feeding robot is provided with a plurality of first vacuum chucks spaced apart for sucking the wafer 1 so as to pass the X-feeding robot simultaneously Grab a plurality of wafers 1.
  • the first vacuum chuck is connected to the vacuum device through an exhaust pipe, and the first vacuum chuck is disposed downwardly at a bottom end of the X-direction reclaiming robot.
  • the distribution of the plurality of first vacuum chucks corresponds to a plurality of the sub-alignment platforms.
  • the YZ is coupled to the X-feeding robot for transporting the wafers 1 sucked by the plurality of first vacuum chucks to the respective sub-alignment platforms.
  • the visual positioning system 3 is mounted above the alignment platform system 4 for acquiring the position (preferably the center position) of the wafer 1 on each sub-alignment platform; each sub-alignment platform is obtained for each wafer 1 according to the visual positioning system 3. The position is adjusted to coincide with the preset reference position.
  • the feeding mechanism 5 is for conveying the plurality of wafers 1 adjusted on the plurality of sub-alignment platforms to a destination, such as a wet bar or a designated container.
  • the wafer positioning and loading system employs a plurality of spaced first vacuum chucks on an X-direction take-up robot to enable simultaneous capture of multiple wafers 1 and multiple sheets to the transport unit via YZ
  • the wafers 1 are simultaneously transported onto the respective sub-alignment platforms, and then the position of each wafer 1 placed on the plurality of sub-alignment platforms is acquired by the visual positioning system 3; and according to the visual positioning system 3 by each sub-alignment platform
  • the positions of the obtained wafers 1 are individually adjusted; finally, the plurality of wafers 1 adjusted on the plurality of sub-alignment platforms are transported to the destination by the feeding mechanism 5.
  • the wafer positioning and loading system according to the present invention is capable of simultaneously operating a plurality of wafers 1 to reduce the time taken for the device to repeat the operation, thereby improving work efficiency and reducing costs.
  • the YZ-direction conveying unit includes a guide rail including a Y-direction guide rail and a Z-direction guide rail, wherein the Z-direction guide rail is slidably connected to the Y-direction guide rail, and one end of the X-direction retracting robot is slidably connected to the Z-direction guide rail.
  • the YZ-direction conveying unit further comprises a first driving device for driving the X-direction retracting robot to slide on the Z-direction rail, and a second driving device for driving the Z-direction rail to slide on the Y-direction rail.
  • the X-direction reclaiming robot slides up along the Z-direction guide rail to the desired position, then stops, and then the Z-direction guide rail slides horizontally along the Y-direction guide rail, thereby driving the X-direction reclaiming with the Z-direction guide rail.
  • the robot slides horizontally along the Y-direction guide rail to a desired position (the position, the plurality of first vacuum suction cups of the X-direction reclaiming robot are in one-to-one correspondence with the plurality of sub-alignment platforms in the alignment platform system 4), and then, X
  • the wafer 1 is placed on the alignment platform system 4 by sliding down the Z-guide rail toward the take-up robot.
  • the plurality of first vacuum chucks on the X-feeding robot release the sucked wafers 1 onto the respective sub-alignment platforms, and then return to the original path to grasp the next batch of wafers 1.
  • the YZ to the transport unit may also adopt other structures as long as the X-direction retracting robot can be moved to the alignment platform system. 4 corresponds to the position (ie, the plurality of first vacuum chucks of the X-feeding robot can be in one-to-one correspondence with the plurality of sub-alignment platforms in the alignment platform system 4).
  • the YZ-direction conveying unit includes a guide rail including a Y-direction section and two Z-direction sections respectively connected to both ends of the Y-direction section, the two Z-direction sections being located below the Y-direction section (ie, the guide rail) In the inverted "U" shape), one end of the X-direction reclaiming robot is slidably coupled to the guide rail.
  • the YZ-direction conveying unit further comprises driving means for driving the X-feeding robot to slide in the guide rail, so as to drive the X-feeding robot to slide in the guide rail under the driving of the driving device, specifically, first along the guide rail
  • the Z-direction segment is advanced, then horizontally moved along the Y-direction segment, and finally descends along the other Z-direction segment to transport the wafer 1 sucked by the first vacuum chuck to the alignment platform system 4.
  • the number of sub-alignment platforms in the alignment platform system 4 is four in this embodiment, and the four sub-alignment platforms are in a shape, however, those skilled in the art should It is understood that in some other embodiments of the present invention, the number of sub-alignment platforms in the alignment platform system 4 may also be other values, such as two, five or eight, and the like.
  • the wafer positioning and loading system further includes an X-direction slide rail and a visual positioning system 3 mounted above the alignment platform system 4, the visual positioning system 3 being slidably coupled to the X-direction bracket To sequentially acquire the positions of the wafers 1 on the plurality of sub-alignment platforms by moving the visual positioning system 3.
  • the visual positioning system 3 moves to the position of the next wafer 1 after acquiring the position of one wafer 1 to detect another wafer 1.
  • the sub-alignment platform corresponding to the wafer 1 can adjust the wafer 1 by the position of the wafer 1 acquired by the root vision positioning system 3, thereby further improving work efficiency and reducing manufacturing cost.
  • a plurality of fixed visual positioning systems 3 may also be used, each of which corresponds to a sub-alignment platform, thereby Shoot one-on-one.
  • the sub-alignment platform adopts a UVW alignment platform.
  • the zero point of each sub-alignment platform acquires the reference position by a destination position such as a wet bar or a designated container.
  • a destination position such as a wet bar or a designated container.
  • the feeding mechanism 5 comprises an X-direction feeding robot and a Y-direction guide disposed above the alignment platform system 4, and a plurality of second vacuum suction cups are arranged on the X-direction feeding robot, and the X-direction retracting robot is slidably connected with the Y-direction rail,
  • the platform system 4 is capable of lifting up and down in the Z direction.
  • the alignment platform system 4 is mounted on a floor controlled by the jacking cylinder so that the alignment platform system 4 can be raised and lowered along the Z axis.
  • the sub-alignment platform is adjusted according to a preset reference position so that the center position of the wafer 1 coincides with the set position.
  • the plurality of second vacuum chucks are in one-to-one correspondence with the plurality of sub-alignment platforms in the alignment platform system 4 to simultaneously capture the wafers on the plurality of sub-alignment platforms. 1. Transfer the wafer 1 to the destination.
  • the alignment platform system 4 may also be maintained in the z direction, and the feeding mechanism 5 is pressed to make the second vacuum chuck. The wafer 1 on the alignment platform system 4 is sucked.
  • the feeding mechanism 5 further includes an X-direction feeding robot and a feeding guide disposed above the alignment platform system 4, the feeding rail including a Y-direction section and a Z-direction section connected to the Y-direction section, and the Z-direction section is located in the Y-direction section Below, the Z-direction segment divides the Y-direction segment into a first portion at the front portion and a second portion at the rear portion, and one end of the X-direction feed robot is slidably coupled to the feed rail, when each of the sub-alignment platforms is After the position of each of the wafers 1 acquired by the visual positioning system 3 is adjusted to the wafer 1, the X-feeding robot of the feeding mechanism 5 moves horizontally along the first portion of the Y-direction section of the feed rail to the Z-direction section.
  • the wafer 1 positioning and loading system further includes an alarm device including a detecting unit and an alarm unit, wherein the detecting unit is configured to detect whether the first vacuum chuck has failed to suck the same wafer 1 for A consecutive times, preferably A>2
  • the detecting unit is configured to detect whether the first vacuum chuck has failed to suck the same wafer 1 for A consecutive times, preferably A>2
  • an instruction is sent to the alarm unit, and the alarm unit issues an alarm. That is, it is judged by the degree of vacuum when the first vacuum chuck of the take-up mechanism 2 sucks the wafer 1, and no vacuum can be formed.
  • the attempt is repeated A times, it is proved that the wafer 1 is broken and the alarm processing is performed.
  • the vacuum chuck be made of rubber or plastic; in other embodiments of the invention, the vacuum chuck may also be made of metal, and when a metal material is used, it is preferably coated on the surface of the vacuum chuck. Covered with a layer of flexible material, such as a rubber layer or a plastic layer.
  • the workflow of the wafer positioning and loading system is as follows: as shown in FIG. 2, the wafer 1 placed in the container is placed on the platform at the designated position by the front end device, positioned and fixed; when the wafer 1 is placed in position, the reclaiming mechanism 2 Moving above the wafer 1, moving down to the wafer 1, the first vacuum chuck simultaneously picks up four wafers 1, the end is lifted, and moved over the alignment platform system 4, and finally the wafer is placed on the alignment platform system 4. After the wafer is placed in the alignment platform system 4, the visual positioning system 3 begins taking pictures one by one wafer 1 to determine the position of the wafer 1.
  • the alignment platform system 4 adjusts according to a preset reference position so that the position of the wafer 1 coincides with the set position.
  • the feeding mechanism 5 is moved to the alignment platform system 4, the jacking cylinder lifts the alignment platform system 4 by a certain height, and the second vacuum chuck at the end of the feeding mechanism 5 simultaneously sucks four wafers, and then moves forward.
  • the wafer is placed in a wet bar. Complete a loading process and then cycle through the actions.
  • the present embodiment is substantially the same as the first embodiment.
  • the same technical features as those of the first embodiment will not be described in the description of the present embodiment, and only the difference between the embodiment and the embodiment 1 will be described.
  • the plurality of sub-alignment platforms are arranged in a 4 ⁇ 2 matrix.
  • the X-direction retracting robot adopts a plate shape, and the plurality of first vacuum suction cups disposed thereon are also 4 ⁇ 2.
  • Matrix arrangement It should be noted that although the sub-alignment platform in the alignment platform system 4 is shown in a 4 ⁇ 2 matrix arrangement in this embodiment, those skilled in the art will appreciate that in other embodiments of the present invention, The sub-alignment platform in the alignment platform system 4 may also be other MXN matrix arrangements, where M ⁇ 2, N ⁇ 2, such as 3X3, or 5X3, and the like.
  • the wafer positioning and loading system further includes an X-direction slide rail and a visual positioning system 3 mounted above the alignment platform system 4, the visual positioning system 3 being slidably coupled to the X-direction bracket, and the X-direction bracket
  • the lower end is further provided with a Y-direction slide rail 6, and the X-direction bracket is slidably connected with the Y-direction slide rail 6 to sequentially acquire a plurality of wafers on the same X-direction sub-alignment platform by moving the X-ray bracket to the visual positioning system 3.
  • the position of 1 then moves the X-bracket along the Y-direction slide 6 so that the visual positioning system 3 sequentially acquires the position of the plurality of wafers 1 on the other X-up sub-alignment platform.
  • the sub-alignment platform corresponding to the wafer 1 can adjust the position of the wafer 1 obtained by the root vision positioning system 3, thereby further improving the working efficiency. And reduce manufacturing costs.
  • the plurality of sub-alignment platforms of the alignment platform system 4 are arranged in an MXN matrix.
  • the wafer positioning and loading system further includes an X-direction bracket mounted above the alignment platform system 4, and N Y-direction sub-slides disposed on the X-direction bracket, and N Y-direction sub-slides respectively One-to-one correspondence with the N columns of the plurality of sub-alignment platforms, and the number of the visual positioning systems 3 is also N, and each visual positioning system 3 is slidably connected with the corresponding Y-direction sub-slides, thereby passing through a visual positioning system.
  • the N visual positioning systems 3 can operate simultaneously to further improve work efficiency.

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Abstract

一种晶片定位及装载系统，其包括取料机构（2）、视觉定位系统（3）、送料机构（5）以及包括多个子对位平台的对位平台系统（4），取料机构（2）包括X向取料机械手和YZ向输送单元，在X向取料机械手上设置有多个间隔设置用于吸取晶片（1）的第一真空吸盘，多个第一真空吸盘的分布与多个子对位平台一一对应；视觉定位系统架设在对位平台系统上方，用于获取晶片（1）位置；每个子对位平台根据所获取的晶片（1）位置进行调整，使其与预先设定的基准位置重合；送料机构（5）用于将多个子对位平台上调整后的多个晶片（5）输送到目的位置。晶片定位及装载系统能够同时对多片晶片（1）进行操作，减少设备重复动作做占用的时间,因而提高了工作效率，并且降低了成本。

Description

晶片定位及装载系统
交叉引用
本申请引用于2017年11月16日提交的专利名称为“晶片定位及装载系统”的第2017111381104号中国专利申请，其通过引用被全部并入本申请。
技术领域
本发明涉及半导体生产技术领域，特别是涉及一种晶片定位及装载系统。
背景技术
在目前的太阳能电池和半导体晶片生产过程中，晶片的装载多是通过一个机械手来完成全部过程。机械手先从晶片盒内取出晶片，放在对位平台上拍照定位，调整晶片的中心位置之后，机械手再吸取晶片放入湿法设备或指定容器内。由于依靠一个机械手完成晶片的抓取、放置、转移等动作，因而导致整个工序的节拍时间长，生产效率低，不能满足大批量生产的需求；而如要使用多个机械手和对位平台，则成本较高。
发明内容
(一)要解决的技术问题
本发明的目的是提供一种晶片定位及装载系统，旨在至少解决现有技术或相关技术中存在的技术问题之一。
(二)技术方案
为了解决上述技术问题，本发明提供了一种晶片定位及装载系统，其特征在于，包括取料机构、视觉定位系统、送料机构以及包括多个子对位平台的对位平台系统，其中，
所述取料机构包括X向取料机械手和YZ向输送单元，在所述X向取料机械手上设置有多个间隔设置用于吸取晶片的第一真空吸盘，多个所述第一真空吸盘的分布与多个所述子对位平台一一对应，所述YZ向输送单元与所述X向取料机械手连接，用于将多个所述第一真空吸盘所吸取的晶 片同时输送到各自对应的所述子对位平台上；
所述视觉定位系统架设在所述对位平台系统上方，用于获取每个所述子对位平台上的晶片的位置；
每个所述子对位平台根据所述视觉定位系统所获取的所述每个晶片的位置对所述晶片进行调整，使其与预先设定的基准位置重合；
所述送料机构用于将多个所述子对位平台上调整后的多个所述晶片输送到目的位置。
其中，所述YZ向输送单元包括导轨，所述导轨包括Y向段以及分别与Y向段的两端连接的Z向段，两个所述Z向段均位于所述Y向段的下方，所述X向取料机械手的一端与所述导轨滑动连接。
其中，所述YZ向输送单元还包括用于驱动所述X向取料机械手在所述导轨内滑动的驱动装置。
其中，所述YZ向输送单元包括导轨，所述导轨包括Y向导轨和Z向导轨，其中Z向导轨与Y向导轨滑动连接，所述X向取料机械手的一端与所述Z向导轨滑动连接。
其中，所述YZ向输送单元还包括用于驱动所述X向取料机械手在所述Z向导轨滑动的第一驱动装置，以及用于驱动所述Z向导轨在所述Y向导轨滑动的第二驱动装置。
其中，多个所述子对位平台呈一字排列。
其中，还包括架设在所述对位平台系统上方的X向滑轨，所述视觉定位系统与所述X向滑轨滑动连接。
其中，多个所述子对位平台呈MXN阵列，其中M≥2，N≥2。
其中，还包括架设在所述对位平台系统上方的X向滑轨，所述视觉定位系统与所述X向滑轨滑动连接；所述X向滑轨的下端设置有Y向滑轨，所述X向滑轨与所述Y向滑轨滑动连接。
其中，所述子对位平台为UVW对位平台。
其中，所述送料机构包括X向送料机械手和设置在所述对位平台系统上方的Y向送料导轨，在所述X向送料机械手上设置有多个第二真空吸盘，多个所述第二真空吸盘的分布与多个所述子对位平台一一对应，所述X向取料机械手与所述Y向导轨滑动连接，所述对位平台系统能够沿Z 向升降。
其中，所述送料机构还包括X向送料机械手和设置在所述对位平台系统上方的送料导轨，所述送料导轨包括Y向段以及与所述Y向段连接的Z向段，所述Z向段位于所述Y向段的下方并与所述对位平台系统相对应，所述Z向段将所述Y向段分成位于前部的第一部分和位于后部的第二部分，所述X向取料机械手的一端与所述送料导轨滑动连接。
其中，还包括报警装置，所述报警装置包括检测单元和报警单元，所述检测单元用于检测所述第一真空吸盘是否连续A次吸取同一晶片失败，其中，A>2，当检测到连续吸取失败时，发送指令给所述报警单元，所述报警单元发出报警。
其中，所述第一真空吸盘采用橡胶或塑料制成；或者，所述第一真空吸盘采用金属制成，在所述真空吸盘的表面涂覆有柔性材料层。
(三)有益效果
根据本发明所提供的晶片定位及装载系统能够同时对多片晶片进行操作，减少设备重复动作做占用的时间,因而提高了工作效率，并且降低了成本。
进一步地，本发明所提供的晶片定位及装载系统通过采用可移动的视觉定位系统逐个拍摄多片晶片的位置来获取每片晶片的位置，而不是采用多个相机去一对一地拍摄晶片位置，因而进一步降低了成本。
附图说明
图1为根据本发明的一种晶片定位及装载系统的一个优选实施例的结构示意图。
图2为根据本发明的一种晶片定位及装载系统的工艺流程图。
图3为根据本发明的一种晶片定位及装载系统的另一个优选实施例的结构示意图。
图中，1：晶片；2：取料机构；3：视觉定位系统；4：对位平台系统；5：送料机构；6：Y向滑轨。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描 述。以下实例用于说明本发明，但不用来限制本发明的范围。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
实施例1
图1示出了根据本发明的一种晶片定位及装载系统的一个优选实施例。如图所示，该晶片定位及装载系统包括取料机构2、视觉定位系统3、送料机构5以及包含多个子对位平台的对位平台系统4。其中，取料机构2包括X向取料机械手和YZ向输送单元，在X向取料机械手上设置有多个间隔设置用于吸取晶片1的第一真空吸盘，以便通过X向取料机械手同时抓取多片晶片1。具体地，第一真空吸盘通过排气管与真空设备连接，第一真空吸盘吸面向下设置在X向取料机械手的底端。多个第一真空吸盘的分布与多个所述子对位平台一一对应。YZ向输送单元与X向取料机械手连接，用于将多个第一真空吸盘所吸取的晶片1同时输送到各自对应的 子对位平台上。视觉定位系统3架设在对位平台系统4上方，用于获取每个子对位平台上的晶片1的位置(优选中心位置)；每个子对位平台根据视觉定位系统3所获取的每个晶片1的位置对其进行调整，使其与预先设定的基准位置重合。送料机构5用于将多个子对位平台上调整后的多片晶片1输送到目的位置，例如湿法栏具或指定容器中。
根据本发明所提供的晶片定位及装载系统通过采用X向取料机械手上的多个间隔设置的第一真空吸盘，以使得能够同时抓取多片晶片1，并通过YZ向输送单元将多片晶片1同时输送到各自对应的子对位平台上，然后通过视觉定位系统3获取放置在多个子对位平台上的每片晶片1的位置；并通过每个子对位平台根据视觉定位系统3所获取的每片晶片1的位置分别进行调整；最后由送料机构5将多个子对位平台上调整后的多片晶片1输送到目的位置。根据本发明所提供的晶片定位及装载系统能够同时对多片晶片1进行操作，减少设备重复动作所占用的时间,因而提高了工作效率，并且降低了成本。
具体地，在该实施例，YZ向输送单元包括导轨，该导轨包括Y向导轨和Z向导轨，其中Z向导轨与Y向导轨滑动连接，X向取料机械手的一端与Z向导轨滑动连接。优选地，该YZ向输送单元还包括用于驱动X向取料机械手在Z向导轨滑动的第一驱动装置，以及用于驱动Z向导轨在Y向导轨上滑动的第二驱动装置。当YZ向输送单元工作时，首先X向取料机械手沿Z向导轨滑动上行到所需位置后停止，然后Z向导轨沿Y向导轨水平滑动，从而带动与Z向导轨连接的X向取料机械手沿Y向导轨水平滑动到所需位置(该位置，X向取料机械手的多个第一真空吸盘与对位平台系统4中的多个子对位平台一一对应)后停止，然后，X向取料机械手沿Z向导轨滑动下行，从而将晶片1放置在对位平台系统4上。此时，X向取料机械手上的多个第一真空吸盘将所吸取的晶片1释放到各自对应的子对位平台上，然后原路返回，以便抓取下一批晶片1。
需要说明的是，本领域的技术人员应当理解，在本发明的其它一些实施例中，YZ向输送单元也可以采用其它的结构，只要能够使得X向取料机械手能够移动到与对位平台系统4相对应的位置即可(即，能够将X向取料机械手的多个第一真空吸盘与对位平台系统4中的多个子对位平台一 一对应)。例如，该YZ向输送单元包括导轨，该导轨包括Y向段以及两个分别与Y向段的两端连接的Z向段，两个Z向段均位于Y向段的下方(即，该导轨呈倒立的“U”形)，X向取料机械手的一端与导轨滑动连接。优选地，YZ向输送单元还包括用于驱动X向取料机械手在导轨内滑动的驱动装置，以便在驱动装置的驱动下驱动X向取料机械手在导轨内滑动，具体地，首先沿导轨的Z向段上行，然后再沿Y向段水平移动，最后沿另一Z向段下行，以将第一真空吸盘所吸取的晶片1输送到对位平台系统4上。
需要说明的是，虽然在该实施例中示出了对位平台系统4中的子对位平台的数量为4个，且这4个子对位平台呈一字形，然而，本领域的技术人员应当理解，在本发明的其它一些实施例中，对位平台系统4中的子对位平台的数量也可以是其它数值，例如2个，5个或8个等。
在该实施例中，该晶片定位及装载系统还包括架设在所述对位平台系统4上方的X向滑轨和1个视觉定位系统3，该视觉定位系统3与所述X向支架滑动连接，以通过移动该视觉定位系统3依次获取多个子对位平台上的晶片1的位置。使用时，该视觉定位系统3在获取完一片晶片1的位置后，移到下一片晶片1的位置，以便对另一片晶片1进行检测，当视觉定位系统3对一片晶片1拍摄完成后，与该晶片1对应的子对位平台就可以根视觉定位系统3所获取的该晶片1的位置对晶片1进行调整，从而进一步提高工作效率，且降低了制造成本。
需要说明的是，本领域的技术人员应当理解，在本发明的某些实施例中，也可以使用多个固定的视觉定位系统3，每个视觉定位系统3与一个子对位平台对应，从而一对一地拍摄。
优选子对位平台采用UVW对位平台。进一步地，每个子对位平台的零点是以湿法栏具或指定容器等目的位置来获取基准位置。当晶片1的中心位置与子对位平台的设定值重合时，相当于也与湿法栏具或指定容器的中心位置重合，从而保证晶片1在湿法栏具或指定容器内的放置精度。
送料机构5包括X向送料机械手和设置在对位平台系统4上方的Y向导轨，在X向送料机械手上设置有多个第二真空吸盘，X向取料机械手与Y向导轨滑动连接，对位平台系统4能够沿Z向升降，具体地，对位平 台系统4被装在由顶升气缸控制的底板上，以使得对位平台系统4可以沿Z轴升降。当视觉定位系统3获取晶片1的中心位置后，子对位平台根据预先设定的基准位置进行调整，使晶片1的中心位置与设定位置重合。当X向送料机械手移动到对位平台系统4上方时，多个第二真空吸盘与对位平台系统4中的多个子对位平台一一对应，以便同时抓取多个子对位平台上的晶片1，并将晶片1输送到目的位置。
需要说明的是，本领域的技术人员应当理解，在本发明的其他一些实施例中，也可以采用对位平台系统4在z向保持不变，而送料机构5下压以便使得第二真空吸盘吸取对位平台系统4上的晶片1。具体地，送料机构5还包括X向送料机械手和设置在对位平台系统4上方的送料导轨，该送料导轨包括Y向段以及与Y向段连接的Z向段，Z向段位于Y向段的下方，所述Z向段将Y向段分成位于前部的第一部分和位于后部的第二部分，X向送料机械手的一端与送料导轨滑动连接，当每个所述子对位平台根据所述视觉定位系统3所获取的所述每个晶片1的位置对所述晶片1进行调整后，送料机构5的X向送料机械手沿送料导轨的Y向段的第一部分水平移动到Z向段时，多个第二真空吸盘的位置与多个子对位平台的上的晶片1的位置相对应，当X向送料机械手沿Z向段下行，并吸取对位平台系统4上的晶片1，然后再沿Z向段上行，并沿Y向段的第二部分将晶片1输送到湿法栏具或指定容器中，然后再沿Y向段返回。
进一步地，该晶片1定位及装载系统还包括报警装置，该报警装置包括检测单元和报警单元，其中，检测单元用于检测第一真空吸盘是否连续A次吸取同一晶片1失败，优选A>2，当检测到连续吸取失败时，发送指令给报警单元，报警单元发出报警。也就是说，通过取料机构2的第一真空吸盘在吸取晶片1时的真空度来判断，不能形成真空，重复尝试A次，则证明晶片1破裂，报警处理。
此外，为了防止损伤晶片1，优选真空吸盘采用橡胶或塑料制成；在本发明的其它一些实施例中，真空吸盘也可以采用金属制成，当采用金属材料时，优选在真空吸盘的表面涂覆有柔性材料层，例如橡胶层或塑料层。
该晶片定位及装载系统的工作流程如下：如图2所示，放置在容器内的晶片1通过前端设备放置在指定位置的平台上，定位并固定；当晶片1 放置到位后，取料机构2移动到晶片1上方，下移压到晶片1，第一真空吸盘同时吸取四片晶片1后，末端抬升，并移到对位平台系统4上方，最后将晶片放置在对位平台系统4上。当晶片被放到对位平台系统4后，视觉定位系统3开始逐一对晶片1进行拍照，确定晶片1的位置。当视觉定位系统3获取晶片的位置后，对位平台系统4根据预先设定的基准位置进行调整，使晶片1的位置与设定位置重合。调整过晶片1位置之后，送料机构5移动到对位平台系统4，顶升气缸将对位平台系统4顶升一定高度，送料机构5末端的第二真空吸盘同时吸取四片晶片，然后前移将晶片放入湿法栏具内。完成一次装载过程，然后循环动作。
实施例2
本实施例与实施例1基本相同，为了描述的简要，在本实施例的描述过程中，不再描述与实施例1相同的技术特征，仅说明本实施例与实施例1不同之处：
如图3所示，在该实施例中，多个子对位平台呈4X2矩阵排列，在这种情况下，X向取料机械手采用板状，其上设置的多个第一真空吸盘也呈4X2矩阵排列。需要说明的是，虽然在该实施例中示出了对位平台系统4中的子对位平台呈4X2矩阵排列，然而，本领域的技术人员应当理解，在本发明的其它一些实施例中，对位平台系统4中的子对位平台也可以是其它的MXN矩阵排列，其中，M≥2，N≥2，例如3X3，或者5X3等。
该晶片定位及装载系统还包括架设在所述对位平台系统4上方的X向滑轨和1个视觉定位系统3，该视觉定位系统3与所述X向支架滑动连接，而X向支架的下端还设置有Y向滑轨6，X向支架与Y向滑轨6滑动连接，以通过在X向支架移动该视觉定位系统3依次获取多个位于同一X向上的子对位平台上的晶片1的位置，然后将X向支架沿Y向滑轨6移动，以使得该视觉定位系统3依次获取多个位于另一X向上的子对位平台上的晶片1的位置。当视觉定位系统3对一片晶片1拍摄完成后，与该晶片1对应的子对位平台就可以根视觉定位系统3所获取的该晶片1的位置对晶片1进行调整，从而进一步提高工作效率，且降低了制造成本。
在本发明的其它一些实施例中，当对位平台系统4的多个子对位平台呈MXN矩阵排列。在这种情况下，该晶片定位及装载系统还包括架设在 对位平台系统4上方的X向支架，以及设置在X向支架的N个Y向子滑轨，N个Y向子滑轨分别与多个子对位平台的N列一一对应，且该视觉定位系统3的数量也为N个，每个视觉定位系统3与相应的Y向子滑轨滑动连接，从而通过1个视觉定位系统3对MXN矩阵排列中的相应一列子对位平台上的晶片1进行拍照，且N个视觉定位系统3可以同时操作，以便进一步提高工作效率。
以上仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (14)

  1. 一种晶片定位及装载系统，其特征在于，包括取料机构、视觉定位系统、送料机构以及包括多个子对位平台的对位平台系统，其中，
    所述取料机构包括X向取料机械手和YZ向输送单元，在所述X向取料机械手上设置有多个间隔设置用于吸取晶片的第一真空吸盘，多个所述第一真空吸盘的分布与多个所述子对位平台一一对应，所述YZ向输送单元与所述X向取料机械手连接，用于将多个所述第一真空吸盘所吸取的晶片同时输送到各自对应的所述子对位平台上；
    所述视觉定位系统架设在所述对位平台系统上方，用于获取每个所述子对位平台上的晶片的位置；
    每个所述子对位平台根据所述视觉定位系统所获取的所述每个晶片的位置对所述晶片进行调整，使其与预先设定的基准位置重合；
    所述送料机构用于将多个所述子对位平台上调整后的多个所述晶片输送到目的位置。
  2. 根据权利要求1所述的晶片定位及装载系统，其特征在于，所述YZ向输送单元包括导轨，所述导轨包括Y向段以及分别与Y向段的两端连接的Z向段，两个所述Z向段均位于所述Y向段的下方，所述X向取料机械手的一端与所述导轨滑动连接。
  3. 根据权利要求2所述的晶片定位及装载系统，其特征在于，所述YZ向输送单元还包括用于驱动所述X向取料机械手在所述导轨内滑动的驱动装置。
  4. 根据权利要求1所述的晶片定位及装载系统，其特征在于，所述YZ向输送单元包括导轨，所述导轨包括Y向导轨和Z向导轨，其中Z向导轨与Y向导轨滑动连接，所述X向取料机械手的一端与所述Z向导轨滑动连接。
  5. 根据权利要求4所述的晶片定位及装载系统，其特征在于，所述YZ向输送单元还包括用于驱动所述X向取料机械手在所述Z向导轨滑动的第一驱动装置，以及用于驱动所述Z向导轨在所述Y向导轨滑动的第二驱动装置。
  6. 根据权利要求1所述的晶片定位及装载系统，其特征在于，多个 所述子对位平台呈一字排列。
  7. 根据权利要求6所述的晶片定位及装载系统，其特征在于，还包括架设在所述对位平台系统上方的X向滑轨，所述视觉定位系统与所述X向滑轨滑动连接。
  8. 根据权利要求1所述的晶片定位及装载系统，其特征在于，多个所述子对位平台呈MXN阵列，其中M≥2，N≥2。
  9. 根据权利要求8所述的晶片定位及装载系统，其特征在于，还包括架设在所述对位平台系统上方的X向滑轨，所述视觉定位系统与所述X向滑轨滑动连接；所述X向滑轨的下端设置有Y向滑轨，所述X向滑轨与所述Y向滑轨滑动连接。
  10. 根据权利要求1所述的晶片定位及装载系统，其特征在于，所述子对位平台为UVW对位平台。
  11. 根据权利要求1所述的晶片定位及装载系统，其特征在于，所述送料机构包括X向送料机械手和设置在所述对位平台系统上方的Y向送料导轨，在所述X向送料机械手上设置有多个第二真空吸盘，多个所述第二真空吸盘的分布与多个所述子对位平台一一对应，所述X向取料机械手与所述Y向导轨滑动连接，所述对位平台系统能够沿Z向升降。
  12. 根据权利要求1所述的晶片定位及装载系统，其特征在于，所述送料机构还包括X向送料机械手和设置在所述对位平台系统上方的送料导轨，所述送料导轨包括Y向段以及与所述Y向段连接的Z向段，所述Z向段位于所述Y向段的下方并与所述对位平台系统相对应，所述Z向段将所述Y向段分成位于前部的第一部分和位于后部的第二部分，所述X向取料机械手的一端与所述送料导轨滑动连接。
  13. 根据权利要求1-12中任一项所述的晶片定位及装载系统，其特征在于，还包括报警装置，所述报警装置包括检测单元和报警单元，所述检测单元用于检测所述第一真空吸盘是否连续A次吸取同一晶片失败，其中，A>2，当检测到连续吸取失败时，发送指令给所述报警单元，所述报警单元发出报警。
  14. 根据权利要求1-12中任一项所述的晶片定位及装载系统，其特征在于，所述第一真空吸盘采用橡胶或塑料制成；或者，所述第一真空吸盘 采用金属制成，在所述真空吸盘的表面涂覆有柔性材料层。
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