CN105448798A - 双驱式xy运动平台 - Google Patents

双驱式xy运动平台 Download PDF

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CN105448798A
CN105448798A CN201510942710.0A CN201510942710A CN105448798A CN 105448798 A CN105448798 A CN 105448798A CN 201510942710 A CN201510942710 A CN 201510942710A CN 105448798 A CN105448798 A CN 105448798A
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linear motor
guide rail
slide block
portal frame
double
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郝艳鹏
崔海龙
马生生
王彩萍
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CETC 2 Research Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors

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Abstract

本发明公开了一种双驱式XY运动平台，解决了XY移动平台移动对位精度低的问题。包括底座（1）和工业控制机，在Y向右导轨（2）的外侧设置有Y向右直线电机定子（4），在Y向左导轨（3）的外侧设置有Y向左直线电机定子（5），在Y向左直线电机动子（6）与Y向右直线电机动子（7）之间设置有龙门架（8），在龙门架（8）的顶梁上设置有X向导轨（9），在X向导轨（9）一侧的龙门架（8）上设置有X向直线电机定子，在X向导轨（9）上设置有X向滑块（11），X向滑块（11）与X向直线电机动子连接在一起，工业控制机分别与Y向右直线电机、Y向左直线电机和X向直线电机电连接。实现了移动平台在水平X、Y两个方向上的精确移动。

Description

双驱式XY运动平台
技术领域
本发明涉及一种XY运动平台，特别涉及一种应用在全自动引线键合机上的XY运动平台。
背景技术
全自动引线键合机通过完成芯片和基板的吸附定位，劈刀与基板焊盘的精确对位，同时实现引线键合、基板加热、自动送丝、压力控制等功能，以实现芯片间的引线互联。而劈刀与基板焊盘的精确对位在引线键合中起着至关重要的作用，其对微位移平台的定位精度、运行速度、行程和自动化程度都提出了很高的要求。目前，引线键合机上的XY移动平台是设置在两个直线导轨上的，XY移动平台的直线驱动电机是设置在两个直线导轨中的一个导轨的外侧，当直线电机驱动XY移动平台移动时，由于装配误差，会造成XY移动平台两侧受力不均衡，导致XY移动平台的对位精度降低，造成平台所连接的焊接机头定位不准确，形成焊点扭曲，致使键合失效。
发明内容
本发明提供了一种双驱式XY运动平台，解决了XY移动平台移动对位精度低的技术问题。
本发明是通过以下技术方案解决以上技术问题的：
一种双驱式XY运动平台，包括底座和工业控制机，在底座上分别设置有Y向右导轨和Y向左导轨，在Y向右导轨的外侧设置有Y向右直线电机定子，在Y向左导轨的外侧设置有Y向左直线电机定子，在Y向左直线电机动子与Y向右直线电机动子之间设置有龙门架，在龙门架的顶梁上设置有X向导轨，在X向导轨一侧的龙门架上设置有X向直线电机定子，在X向导轨上设置有X向滑块，X向滑块与X向直线电机动子连接在一起，工业控制机分别与Y向右直线电机、Y向左直线电机和X向直线电机电连接在一起。
在X向滑块上分别设置有Z向导轨和Z向直线电机定子，在Z向导轨上设置有Z向滑块，Z向滑块与Z向直线电机动子连接在一起，在Z向滑块上设置有焊接机头，Z向直线电机与工业控制机电连接在一起。
本发明的移动平台能实现X、Y两个方向上的精确移动，由大理石的底座与X/Y运动平台组成，由于大理石材料的刚性大，阻尼系数大、热膨胀系数小，用来制作运动平台的工作面，可以提高整个平台的抗振性及热稳定性。平台在X、Y两个方向的结构安排采用下述方案，即Y方向的底座固定在大理石基座上，X方向的底座固定在Y方向的导轨滑块上。X向平台采用单电机驱动的形式，Y向采用双电机驱动形式，通过同步控制系统控制主从电机同步移动，即可实现劈刀与基板焊盘的精确定位。
附图说明
图1是本发明的结构示意图。
具体实施方式
下面结合附图对本发明进行详细说明：
一种双驱式XY运动平台，包括底座1和工业控制机，在底座1上分别设置有Y向右导轨2和Y向左导轨3，在Y向右导轨2的外侧设置有Y向右直线电机定子4，在Y向左导轨3的外侧设置有Y向左直线电机定子5，在Y向左直线电机动子6与Y向右直线电机动子7之间设置有龙门架8，在龙门架8的顶梁上设置有X向导轨9，在X向导轨9一侧的龙门架8上设置有X向直线电机定子，在X向导轨9上设置有X向滑块11，X向滑块11与X向直线电机动子连接在一起，工业控制机分别与Y向右直线电机、Y向左直线电机和X向直线电机电连接在一起。
在X向滑块11上分别设置有Z向导轨10和Z向直线电机定子，在Z向导轨10上设置有Z向滑块12，Z向滑块12与Z向直线电机动子连接在一起，在Z向滑块12上设置有焊接机头，Z向直线电机与工业控制机电连接在一起。
本发明的水平Y向运动是采用两个直线电机直接驱动的，以提高其精度性能，并按同一位移给定信号运动，其中一个伺服子系统为主动轴，另一个为从动轴，构成主-从驱动方式。当全自动引线键合机工作时，X轴直线电机驱动的Z轴座位置的变化，往往会导致Y轴直线电机等效惯量的改变，其中，从动电机由于不具有独立的定位控制，容易受到等效惯量的改变而影响输出，进而影响两个Y轴的输出同步。本发明在工控机中嵌入控制程序，通过采用负载动态补偿的方法，调整比例增益并给Y轴从动电机以控制补偿，使得系统能够保持同步运行，同步控制系统原理是通过模糊PID控制器为速度控制器，以实现对输入信号的快速精确响应；PI控制器对动态变形力补偿，防止高速运行下，过大的双轴同步误差对系统造成危害。当电机等效惯量增加的时候，它的电流输入与速度输出之间的传递函数将会产生变化，即由l/mb变为l/(mb+△m)。负载动态补偿的原理是利用一个权重调整电流输入与速度输出间的传递函数，使其保持W/mb=W'/(mb+△m)的恒定关系，则W'=(1+△m/mb)×W，即为负载动态调变增益（1个比值）。通过计算得到负载动态调变增益，对其进行同步控制补偿，即使从动电机等效惯量产生变化，其速度输出也不会因此受到影响，使系统仍维持良好的同步响应。从而保证了在Z向滑块12上设置的焊接机头劈刀与基板焊盘的精确定位，保证了键合的稳定。

Claims (2)

1.一种双驱式XY运动平台，包括底座（1）和工业控制机，在底座（1）上分别设置有Y向右导轨（2）和Y向左导轨（3），其特征在于，在Y向右导轨（2）的外侧设置有Y向右直线电机定子（4），在Y向左导轨（3）的外侧设置有Y向左直线电机定子（5），在Y向左直线电机动子（6）与Y向右直线电机动子（7）之间设置有龙门架（8），在龙门架（8）的顶梁上设置有X向导轨（9），在X向导轨（9）一侧的龙门架（8）上设置有X向直线电机定子，在X向导轨（9）上设置有X向滑块（11），X向滑块（11）与X向直线电机动子连接在一起，工业控制机分别与Y向右直线电机、Y向左直线电机和X向直线电机电连接在一起。
2.根据权利要求1所述的一种双驱式XY运动平台，其特征在于，在X向滑块（11）上分别设置有Z向导轨（10）和Z向直线电机定子，在Z向导轨（10）上设置有Z向滑块（12），Z向滑块（12）与Z向直线电机动子连接在一起，在Z向滑块（12）上设置有焊接机头，Z向直线电机与工业控制机电连接在一起。
CN201510942710.0A 2015-12-16 2015-12-16 双驱式xy运动平台 Pending CN105448798A (zh)

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Cited By (8)

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CN108022865A (zh) * 2017-11-16 2018-05-11 北京创昱科技有限公司 晶片定位及装载系统
CN108637490A (zh) * 2018-04-10 2018-10-12 上海柏楚电子科技股份有限公司 一种自动测量双驱激光切割机负载惯量与摩擦力矩的方法
CN109188642A (zh) * 2018-08-29 2019-01-11 宁波尚进自动化科技有限公司 可编程光路系统结构
CN110702709A (zh) * 2019-11-08 2020-01-17 丹东奥龙射线仪器集团有限公司 X射线ct装置
CN111085971A (zh) * 2019-12-31 2020-05-01 上海三佑科技发展有限公司 基于直线电机控制龙门双驱检测设备
CN112589476A (zh) * 2020-12-16 2021-04-02 横川机器人（深圳）有限公司 龙门双驱多轴运动平台
CN113488950A (zh) * 2021-07-12 2021-10-08 上海隐冠半导体技术有限公司 线缆台机构及移动装置
CN113829760A (zh) * 2020-06-24 2021-12-24 合肥欣奕华智能机器有限公司 一种基板作业平台

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108022865A (zh) * 2017-11-16 2018-05-11 北京创昱科技有限公司 晶片定位及装载系统
CN108022865B (zh) * 2017-11-16 2019-09-20 北京创昱科技有限公司 晶片定位及装载系统
CN108637490A (zh) * 2018-04-10 2018-10-12 上海柏楚电子科技股份有限公司 一种自动测量双驱激光切割机负载惯量与摩擦力矩的方法
CN108637490B (zh) * 2018-04-10 2020-05-29 上海柏楚电子科技股份有限公司 一种自动测量双驱激光切割机负载惯量与摩擦力矩的方法
CN109188642A (zh) * 2018-08-29 2019-01-11 宁波尚进自动化科技有限公司 可编程光路系统结构
CN110702709A (zh) * 2019-11-08 2020-01-17 丹东奥龙射线仪器集团有限公司 X射线ct装置
CN111085971A (zh) * 2019-12-31 2020-05-01 上海三佑科技发展有限公司 基于直线电机控制龙门双驱检测设备
CN113829760A (zh) * 2020-06-24 2021-12-24 合肥欣奕华智能机器有限公司 一种基板作业平台
CN112589476A (zh) * 2020-12-16 2021-04-02 横川机器人（深圳）有限公司 龙门双驱多轴运动平台
CN113488950A (zh) * 2021-07-12 2021-10-08 上海隐冠半导体技术有限公司 线缆台机构及移动装置

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Application publication date: 20160330